Manufacturing method of mounting substrate unit, mounting substrate unit, and carrier tape

Abstract

To enable a manufacturing of a mounting substrate unit to which a metal structure for performing one of a transmission of an electromagnetic wave, a reception of the electromagnetic wave, blocking of the electromagnetic wave, a heat radiation, and a circuit protection from a physical shock such as an antenna and a shield case or the like is attached in low quality variation.SOLUTION: A cream solder print device coats a cream solder 24 onto a pad 2121 of a print substrate 21. Sequentially, a component mounting device sacks and picks up an antenna 22 from a pocket of a carrier tape 3 by a component suction nozzle 121, and is mounted onto the print substrate 21. As a result, in a state where a leg part of the antenna 22 is contacted to the cream solder 24 coated to the print substrate 21, the antenna 22 becomes a stand state on the print substrate 21. Sequentially, a reflow device heats the print substrate 21 onto which the antenna 22 is mounted. After that, the print substrate 21 is cooled. As a result, the antenna 22 is mounted to the print substrate 21 by a solder obtained by becoming solidified the cream solder 24 after welding.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a manufacturing technique for a mounting board unit. [Background technology]

[0002] When attaching metal structures such as antennas and shielding cases to printed circuit boards with solder to perform one or more of the following functions: transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting the circuit from physical impacts, a commonly used manufacturing method involves inserting the legs of the metal structure into through-holes provided in the printed circuit board, piling hot-melted solder around the legs so as to fill the gap between the through-holes and the legs of the metal structure, and then cooling and solidifying (soldering).

[0003] For example, Patent Document 1 describes a method for manufacturing a printed circuit board on which an antenna member is mounted by inserting one end of an antenna member into a through hole and soldering the antenna member to close the gap between the through hole and the antenna member. In the method described in Patent Document 1, the portion of the antenna member to be inserted into the through hole is bent into a loop shape with a diameter slightly larger than the diameter of the through hole, and the looped portion is inserted into the through hole. As a result, the looped portion of the antenna member comes into contact with the inner surface of the through hole so as to be pressed outward, and the antenna member can be soldered without rattling against the printed circuit board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-93144 A Summary of the Invention [Problem to be solved by the invention]

[0005] When soldering a metal structure such as an antenna or a shielding case to a printed circuit board, the amount of solder used, the connectivity between the metal structure and the printed circuit board through the solder, the mounting position and mounting angle of the metal structure to the printed circuit board, etc. vary depending on the size and shape of the metal structure, the skill of the worker performing the soldering, etc. As a result, there is a problem that the quality, such as the performance, of the printed circuit board on which the metal structure is mounted (hereinafter, in this application, a printed circuit board on which components are mounted is referred to as a "mounted circuit board unit") varies.

[0006] In view of the above-mentioned circumstances, the present invention provides a means for manufacturing a mounting board unit having a metal structure, such as an antenna or a shielding case, for performing one or more of the functions of transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting the circuit from physical impact, with less variation in quality compared to the conventional techniques. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention proposes a method for manufacturing a mounting board unit, comprising the steps of: applying cream solder to pads of wiring printed on a printed circuit board; picking up a metal structure to be attached to the printed circuit board from a housing member that houses metal structures for one or more of transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting the circuit from physical impacts, and placing the metal structure on the printed circuit board so that a predetermined area of ​​the metal structure contacts the pad via the cream solder applied in the applying step; and heating the printed circuit board on which the metal structure was placed in the placing step to melt the cream solder applied to the printed circuit board, and then cooling the printed circuit board.

[0008] The present invention also proposes a mounting board unit comprising a printed circuit board, solder formed by melting and then solidifying cream solder applied to a pad of wiring printed on the printed circuit board, and a metal structure attached to the printed circuit board by the solder for performing one or more of the functions of transmitting, receiving, shielding, dissipating heat, and protecting the circuit from physical impact.

[0009] The present invention also proposes a carrier tape that has a plurality of pockets, each of which houses a metal structure that is attached to a printed circuit board to perform one or more of the functions of transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting the circuit from physical impact, and is transported in a longitudinal direction, wherein each of the plurality of pockets has a first recess that houses a portion of the metal structure housed in the pocket that is sucked in when the metal structure is picked up from the pocket, and a second recess that is not shallower than the first recess and houses a portion of the metal structure that comes into contact with a pad of a wiring printed on the printed circuit board via cream solder when the metal structure is attached to the printed circuit board. Effect of the Invention

[0010] According to the present invention, a mounting board unit having metal structures, such as an antenna or a shielding case, attached thereto for performing one or more of the functions of transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting the circuit from physical impact can be obtained with less variation in quality compared to the prior art. [Brief description of the drawings]

[0011] [Figure 1] 1 is a diagram showing a mounting board unit manufactured by a manufacturing method according to an embodiment. [Diagram 2] FIG. 1 is a diagram showing the configuration of a reflow system for performing a manufacturing method according to an embodiment. [Diagram 3] 1A to 1C are diagrams illustrating a printed circuit board before and after printing solder paste, which is one step in a manufacturing method according to one embodiment. [Figure 4] 1 is a diagram showing a carrier tape used in a manufacturing method according to an embodiment and an antenna housed in the carrier tape; [Diagram 5] 5A to 5C are diagrams illustrating a state in which an antenna is mounted on a printed circuit board in one step of a manufacturing method according to one embodiment. [Figure 6]13A to 13C are diagrams showing a state in which a mounting board unit according to one modified example is manufactured. [Figure 7] FIG. 13 is a diagram showing an antenna according to a modified example. [Figure 8] 1A and 1B are diagrams illustrating an antenna according to an embodiment and an antenna according to a modified example, viewed in a direction perpendicular to a plane on which a printed circuit board extends. [Figure 9] FIG. 13 is a diagram illustrating an example of the shape of an antenna according to a modified example. [Figure 10] FIG. 13 is a diagram showing the shape of a pocket of a carrier tape according to a modified example. [Figure 11] FIG. 13 is a diagram showing the shape of a pocket of a carrier tape according to a modified example. [Figure 12] 13A and 13B are diagrams showing a state in which a shield case is mounted on a printed circuit board by a manufacturing method according to one modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] [Embodiment] Below, we will explain a manufacturing method for a mounting substrate unit according to one embodiment of the present invention (hereinafter referred to as "manufacturing method M"), a mounting substrate unit manufactured by this manufacturing method, and a carrier tape used in this manufacturing method.

[0013] 1 is a diagram showing a mounting board unit 2, which is an example of a mounting board unit manufactured by manufacturing method M. The mounting board unit 2 includes a printed board 21, an antenna 22 mounted on the surface of the printed board 21, and solder 23A and solder 23B that electrically connect the antenna 22 to pads 2121A and 2121B that are part of wiring 212 printed on a board 211 of the printed board 21, and that play a role of physically connecting the printed board 21 and the antenna 22. Hereinafter, when the pads 2121A and 2121B are not distinguished from each other, they are collectively referred to as pads 2121. When the solders 23A and 23B are not distinguished from each other, they are collectively referred to as solder 23.

[0014] The antenna 22 is a metal structure for transmitting or receiving radio waves (an example of electromagnetic waves) for data communication, etc. by an apparatus in which the mounting board unit 2 is used as a component, and is manufactured by bending a single elongated metal plate.

[0015] The antenna 22 is divided into a main body 221, which is a portion disposed so as to extend in a direction (Y-axis direction) along the surface of the printed circuit board 21 at a position separated from the printed circuit board 21, a leg 222A and a leg 222B, which are portions extending from the end of the main body 221 in a direction toward the printed circuit board 21 (Z-axis negative direction), and a foot 223A and a foot 223B, which are portions disposed so as to extend in a direction (Y-axis direction) along the surface of the printed circuit board 21 from the leg 222A and the leg 222B, respectively, and contact with the pad 2121 via the solder 23. Hereinafter, when the leg 222A and the leg 222B are not distinguished from each other, they are collectively referred to as the leg 222. When the foot 223A and the foot 223B are not distinguished from each other, they are collectively referred to as the foot 223.

[0016] The main body 221 and the legs 222 are parts for performing the role of transmitting or receiving radio waves, which is the role of the antenna 22. On the other hand, the foot 223 is a part provided for the role of standing on its own when placed on the position of the pad 2121 of the printed circuit board 21.

[0017] The antenna 22 may be made of metal only, or may have an additional material such as a resin coating that protects the surface from scratches.

[0018] Solder 23 is formed by applying cream solder (also called solder paste) onto pad 2121, melting it by reflow, and then cooling and solidifying. It electrically connects wiring 212 and antenna 22, and also serves to physically connect printed circuit board 21 and antenna 22.

[0019] In this embodiment, the manufacturing method M is performed by a group of known devices for reflow soldering (hereinafter, referred to as "reflow"). However, some of the steps performed by the devices in the following description may be performed by an operator.

[0020] 2 is a diagram showing an outline of the configuration of a reflow system 1, which is a group of devices that execute manufacturing method M. Reflow system 1 includes a solder paste printing device 11, a component mounting device 12, a reflow device 13, and a transport device (not shown) that transports components of a mounting board unit, intermediate products, and the like to these devices.

[0021] The solder paste printing device 11 is a device that applies solder paste to a designated area of ​​a printed circuit board. The application of solder paste to a printed circuit board by the solder paste printing device 11 is generally called printing.

[0022] Fig. 3 is a diagram showing the printed circuit board 21 before and after printing of cream solder by the cream solder printing device 11. The cream solder printing device 11 applies a predetermined thickness of cream solder 24A onto pad 2121A shown in Fig. 3(A), and applies a predetermined thickness of cream solder 24B onto pad 2121B, resulting in the state shown in Fig. 3(B). Hereinafter, when there is no need to distinguish between cream solder 24A and cream solder 24B, they will be collectively referred to as cream solder 24.

[0023] The pads 2121A and 2121B are portions of the wiring 212 printed on the substrate 211 of the printed circuit board 21 that are to be electrically connected to the antenna 22.

[0024] 4 is a diagram showing the carrier tape 3 (an example of a housing member) loaded in the component mounting device 12, and the antenna 22 housed in the carrier tape 3 before being mounted on the printed circuit board 21. Fig. 4(A) is a plan view (viewed in the negative direction of the Z axis) of the carrier tape 3 before the antenna 22 is housed. The carrier tape 3 has a plurality of pockets P, which are recesses, equally spaced apart in the X-axis direction of Fig. 4(A). An antenna 22 is housed in each of the pockets P.

[0025] Fig. 4(B) is a cross-sectional view of the carrier tape 3 cut in the Z-axis direction at the position of line DD shown in Fig. 4(A) as viewed in the X-axis direction. Fig. 4(C) is a cross-sectional view of the carrier tape 3 (and the antenna 22) in a state where the antenna 22 is housed in the pocket P.

[0026] Pocket P is divided into a recess Q1 (an example of a first recess) that mainly accommodates main body 221 of antenna 22, a recess Q2A (an example of a second recess) that mainly accommodates leg 222A and foot 223A, and a recess Q2B (an example of a second recess) that mainly accommodates leg 222B and foot 223B.

[0027] The recesses Q2A and Q2B are deeper than the recess Q1, where the depth refers to the length of the recess in the Z-axis direction.

[0028] The carrier tape 3, with an antenna 22 housed in each of the multiple pockets P, is wound around a reel and loaded into the component mounting device 12. The component mounting device 12 transports the carrier tape 3 while unwinding it from the reel in the X-axis direction (the longitudinal direction of the carrier tape 3) by engaging the teeth of a rotating sprocket with multiple holes H provided in the carrier tape 3. As a result, the antennas 22 are transported sequentially to positions directly below the component suction nozzles provided in the component mounting device 12.

[0029] FIG. 5 is a diagram showing how the antenna 22 is picked up from the pocket P of the carrier tape 3 by the component suction nozzle 121 of the component mounting device 12 and placed on the printed circuit board 21 on which the cream solder 24 has been applied.

[0030] The component mounting device 12 lowers the component suction nozzle 121 to a position where the tip of the component suction nozzle 121 is close to or in contact with the upper surface of the main body 221 of the antenna 22, and then sucks the antenna 22 with the component suction nozzle 121 (FIG. 5(A)). Then, the component mounting device 12 raises the component suction nozzle 121 that is suctioning the antenna 22, and moves it to a position directly above the printed circuit board 21 (FIG. 5(B)). Next, the component mounting device 12 lowers the component suction nozzle 121 to a position where the lower surface (an example of a predetermined area) of the foot 223 of the suctioned antenna 22 contacts the cream solder 24 on the pad 2121 of the printed circuit board 21, and then stops suction of the component suction nozzle 121, and then raises the component suction nozzle 121 (FIG. 5(C)). As a result, the antenna 22 is placed on the printed circuit board 21, and the mounting of one antenna 22 on one printed circuit board 21 is completed.

[0031] Antenna 22 stands on its own when placed on printed circuit board 21. In particular, antenna 22 has feet 223, so that antenna 22 can stably maintain a standing state on printed circuit board 21. That is, antenna 22 will not fall over even if it is subjected to vibrations while being transported to reflow device 13 together with printed circuit board 21 in a state where it is placed on printed circuit board 21.

[0032] The adhesiveness of the cream solder 24 also contributes to the stable self-supporting state of the antenna 22. However, since the antenna 22 has the legs 223, applying a small amount of the cream solder 24 prevents the antenna 22 from falling over.

[0033] The printed circuit board 21 on which the antenna 22 has been mounted by the component mounting device 12 as described above is transferred to the reflow device 13, where it is heated and then cooled. As a result, the cream solder 24 melts and then solidifies, electrically connecting the wiring 212 and the antenna 22, and physically connecting the printed circuit board 21 and the antenna 22. This completes the mounting board unit 2 (FIG. 1).

[0034] In the above description, the antenna 22 is the only component mounted on the printed circuit board 21, but in reality, many other components besides the antenna 22 are mounted on the printed circuit board 21 in the same manner as the antenna 22. That is, the cream solder printing device 11 applies cream solder 24 for the antenna 22 as well as cream solder for other components, and the component mounting device 12 mounts the antenna 22 and other components on the printed circuit board 21. The printed circuit board 21 on which these components are mounted is then heated by the reflow device 13 and then cooled. As a result, a mounting board unit on which many components are mounted in addition to the antenna 22 is manufactured.

[0035] According to the above-mentioned manufacturing method M, there is little variation in the amount of cream solder 24, the connectivity between antenna 22 and wiring 212 by solder 23 solidified from cream solder 24, and the mounting position and mounting angle of antenna 22 to printed circuit board 21. As a result, according to the manufacturing method M of this embodiment, a mounting board unit with less variation in quality is manufactured, compared to an implementation board unit according to the conventional technology in which a worker applies solder melted by heating with a soldering iron around the legs of the antenna.

[0036] [Variations] The above-described embodiment is a specific example of the present invention, and various modifications are possible within the scope of the technical concept of the present invention. Examples of such modifications are shown below. Note that two or more of the modifications shown below may be combined as appropriate.

[0037] (1) A hole for positioning antenna 22 may be provided in printed circuit board 21, and a positioning protrusion may be provided on antenna 22, so that when antenna 22 is mounted on printed circuit board 21, the protrusion of antenna 22 may be inserted into the hole in printed circuit board 21. Note that while the hole provided in printed circuit board 21 is often a through hole, the positioning hole here may be a recessed portion that does not pass through.

[0038] 6 is a diagram showing how mounting board unit 2 is manufactured in this modified example. In this modified example, holes IA and IB are provided in printed circuit board 21 as positioning holes for antenna 22 (FIG. 6(A)). These holes may be either through holes whose insides are solder-plated, or non-through holes whose insides are not solder-plated. Hereinafter, when there is no need to distinguish between holes IA and IB, they will be collectively referred to as hole I.

[0039] The solder paste printing device 11 applies the solder paste 24 onto the pads 2121A and 2121B in the same manner as in the above-described embodiment (FIG. 6(B)).

[0040] In this modification, antenna 22 has protrusions 224A and 224B protruding downward from legs 222A and 222B, respectively, in addition to foot 223 (FIG. 6(C)). Hereinafter, when protrusions 224A and 224B are not to be distinguished from each other, they will be collectively referred to as protrusions 224.

[0041] When component mounting device 12 mounts antenna 22 on printed circuit board 21, protrusion 224A is inserted into hole IA, and protrusion 224B is inserted into hole IB (FIGS. 6(C) and 6(D)). As a result, as shown in the cross-sectional view of FIG. 6(E), protrusion 224 is inserted into hole I, and antenna 22 is mounted at the correct position on printed circuit board 21, with foot 223 in contact with cream solder 24.

[0042] The printed circuit board 21 in the state shown in FIG. 6(E) is heated by the reflow device 13 and then cooled, whereby the mounting board unit 2 is completed.

[0043] In addition, in the manufacture of the mounting board unit 2 in the above-described embodiment, the required accuracy for the position of the antenna 22 when mounted on the printed board 21 and the shape of the antenna 22 can be lowered compared to the manufacture of the mounting board unit 2 in this modified example. On the other hand, according to the manufacture of the mounting board unit 2 in this modified example, high accuracy is guaranteed for the position of the antenna 22 in the completed mounting board unit 2. Therefore, which method to adopt may be determined depending on the positional accuracy of the antenna 22 required for the mounting board unit 2.

[0044] (2) The foot 223 of the antenna 22 may extend outward. Fig. 7 is a side view of the antenna 22 according to this modification. As shown in Fig. 7, in this modification, the foot 223A of the antenna 22 extends from the leg 222A in the opposite direction to the main body 221 (negative direction of the Y-axis), and the foot 223B extends from the leg 222B in the opposite direction to the main body 221 (positive direction of the Y-axis).

[0045] FIG. 8 is a view of a printed circuit board 21 (FIG. 8(A)) on which an antenna 22 according to the above-mentioned embodiment is mounted, and a printed circuit board 21 (FIG. 8(B)) on which an antenna 22 according to this modified example is mounted, viewed in a direction perpendicular to the surface on which the printed circuit board 21 extends (negative direction of the Z axis).

[0046] As shown in Fig. 8(A), in the antenna 22 according to the embodiment described above, when viewed in a direction perpendicular to the surface on which the printed circuit board 21 extends (Z-axis negative direction), the foot 223 does not protrude outward from the main body 221 and the leg 222. In Fig. 8(A), the stability for making the antenna stand on its own is reduced, but the antenna can be made longer, making it easier to obtain antenna gain. On the other hand, in Fig. 8(B), the antenna is shorter in length, making it harder to obtain antenna gain, but mounting stability is easier to obtain from the viewpoint of the antenna standing on its own during mounting, so an appropriate form may be selected according to the frequency used and the shape of the device.

[0047] (3) In the above-described embodiment, the antenna 22 is a single metal structure that cannot be disassembled, which is manufactured by processing a single metal material such as by bending it. However, the antenna 22 may be a disassembled metal structure that is manufactured by assembling multiple parts.

[0048] (4) The shape of antenna 22 shown in Fig. 1 and the like in the above-described embodiment is merely an example, and various shapes may be adopted as long as it has a flat portion that is picked up by component suction nozzle 121. Fig. 9 is a diagram illustrating an example of an antenna 22 shape different from that of the embodiment. Antenna 22 shown in Fig. 9 has main body 221 and leg 222 that are rod-shaped, and foot 223 that is disk-shaped. Furthermore, antenna 22 shown in Fig. 9 has disk-shaped suction target portion 225 that is located near the center of main body 221.

[0049] In addition, in the examples shown in Figure 1, there are two connection points to the board, but if the device can stand on its own by using an opening or the like, the number of solder connection points is not important as long as it is one or more.

[0050] (5) In the above-described embodiment, the shape of the pocket P of the carrier tape 3 shown in FIG. 4 and the like is merely an example and may be changed.

[0051] Fig. 10 is a diagram illustrating a pocket P having a different shape from the pocket P shown in the above-described embodiment. In the pocket P illustrated in Fig. 10, the recess Q2 becomes wider as it goes upward. In other words, the length of the recess Q2 in the X-axis direction and / or the Y-axis direction becomes larger toward the positive direction of the Z-axis.

[0052] In the example of FIG. 10, the length of the recess Q2 in the X-axis direction and / or Y-axis direction changes over the entire area in the Z-axis direction, but as shown in FIG. 11, it may change only in a part of the area in the Z-axis direction.

[0053] According to the carrier tape 3 having the pocket P having the shape according to this modified example, accurate positioning of the antenna 22 in the pocket P and smooth pick-up of the antenna 22 from the pocket P can both be achieved.

[0054] (6) In the above-described embodiment, the metal structure mounted on the printed circuit board 21 is an antenna 22 that transmits or receives radio waves. However, the type of metal structure mounted on the printed circuit board 21 is not limited to an antenna as long as the metal structure performs one or more of the following functions: transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting the circuit from physical impact.

[0055] 12 is a diagram showing a state in which a shield case 25, which is a metal structure that shields other components mounted on the printed circuit board 21 from external radio waves, is mounted on the printed circuit board 21 instead of the antenna 22. The shield case 25 shown in FIG. 12 is a box-shaped structure with an opening on the surface facing the printed circuit board 21 when placed on the printed circuit board 21. The shape of the shield case 25 is not limited to the one illustrated in FIG. 12 and can be changed in various ways. For example, the shield case 25 may have a portion for stable self-supporting similar to the foot 223 of the antenna 22, or a portion for accurate positioning similar to the protrusion 224 of the antenna 22.

[0056] (7) In the above-described embodiment, the antenna 22 mounted on the printed circuit board 21 is picked up from the carrier tape 3, but the components to be mounted on the printed circuit board may be supplied to the component mounting device 12 in a state where they are accommodated in a container other than the carrier tape. For example, the components such as the antenna 22 may be supplied to the component mounting device 12 in a state where they are accommodated in a tray. [Explanation of symbols]

[0057] 1...reflow system, 2...mounting board unit, 3...carrier tape, 11...cream solder printing device, 12...component mounting device, 13...reflow device, 21...printed board, 22...antenna, 23...solder, 24...cream solder, 25...shielding case, 121...component suction nozzle, 211...board, 212...wiring, 221...main body, 222...legs, 223...foot, 224...protrusion, 225...suctioned part, 2121...pad.

Claims

1. A step of applying cream solder to a pad of a wiring printed on a printed circuit board; picking up a metal structure to be attached to the printed circuit board from a housing member that houses metal structures for performing one or more of the functions of transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting circuits from physical impacts, and placing the metal structure on the printed circuit board so that a predetermined area of ​​the metal structure contacts the pad via the cream solder applied in the applying step; a step of heating the printed circuit board on which the metal structure is placed in the step of placing the printed circuit board, melting the cream solder applied to the printed circuit board, and then cooling the printed circuit board; A manufacturing method of a mounting board unit comprising:

2. The storage member is a carrier tape having a plurality of pockets, each of which stores a metal structure, and is transported in a longitudinal direction. A method for manufacturing the mounting board unit according to claim 1 .

3. The metal structure attached to the printed circuit board is self-supporting when placed on the printed circuit board. A method for manufacturing the mounting board unit according to claim 1 .

4. The metal structure attached to the printed circuit board has feet that serve to stand on their own when placed on the printed circuit board. A method for manufacturing the mounting board unit according to claim 3 .

5. When viewed in a direction perpendicular to the surface on which the printed circuit board extends, the foot does not have a portion protruding outward from a portion other than the foot. The method for manufacturing the mounting board unit according to claim 4 .

6. (has a protrusion for positioning) In the step of placing, the metal structure is placed on the printed circuit board so that a protrusion of the metal structure is inserted into a hole provided in the printed circuit board. A method for manufacturing the mounting board unit according to claim 1 .

7. The metal structure is an antenna having a main body portion which is a portion disposed so as to extend in a direction along the extending surface of the printed circuit board at a position separated from the printed circuit board in the placing step, a leg portion which is a portion extending from an end of the main body portion in a direction toward the printed circuit board, and a foot portion which is a portion disposed so as to extend from the leg portion in a direction along the extending surface of the printed circuit board. A method for manufacturing the mounting board unit according to claim 1 .

8. The metal structure is a box-shaped shielding case having an opening on a surface facing the printed circuit board when the metal structure is placed on the printed circuit board in the placing step. A method for manufacturing the mounting board unit according to claim 1 .

9. A printed circuit board; a solder paste applied to a pad of a wiring printed on the printed circuit board, the solder paste being melted and then solidified; a metal structure attached to the printed circuit board by the solder for performing one or more of transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting a circuit from physical impact; A mounting board unit comprising:

10. A carrier tape having a plurality of pockets, each of which contains a metal structure attached to a printed circuit board for performing one or more of the following functions: transmitting electromagnetic waves, receiving electromagnetic waves, shielding electromagnetic waves, dissipating heat, and protecting a circuit from physical impact; and transported in a longitudinal direction, the carrier tape comprising: Each of the plurality of pockets has a first recess for accommodating a portion of the metal structure housed in the pocket that is sucked in when the metal structure is picked up from the pocket, and a second recess that is not shallower than the first recess and that accommodates a portion of the metal structure that comes into contact with a pad of a wiring printed on a printed circuit board via cream solder when the metal structure is attached to the printed circuit board. Carrier tape.

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