Substrate processing apparatus, method for controlling substrate processing apparatus, article manufacturing method, and program

Abstract

To provide a technique advantageous for reducing the occurrence of a conveyance error.SOLUTION: A substrate processing apparatus comprises: a processing unit that processes a substrate; a measurement unit that measures positional deviation of the substrate; a driving unit that drives the substrate to correct the positional deviation; a conveying unit that conveys the substrate; and a control unit that controls the conveying unit. When a force of the conveying unit to hold the substrate is larger than a prescribed value, the control unit controls the conveying unit to convey the substrate to the processing unit, and when the holding force is smaller than the prescribed value, causes the conveying unit to move the substrate from the measurement unit and subsequently convey the substrate to the measurement unit to measure positional deviation of the substrate, and controls the conveying unit on the basis of the positional deviation.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus, a control method for the substrate processing apparatus, an article manufacturing method, and a program. [Background technology]

[0002] In an apparatus for manufacturing an article such as a semiconductor device or a liquid crystal display device, a substrate may be transported by a transport mechanism. If the holding force of the transport mechanism when holding and transporting the substrate by a holding part is insufficient, the transport of the substrate may be stopped and an operator may be prompted to retrieve the substrate. Examples of causes of the substrate holding force being insufficient include dirt on the back surface of the substrate, warping of the substrate, deterioration of the transport mechanism, and abnormal pressure for vacuum suction.

[0003] Patent Document 1 describes detecting the holding force of a holding section that holds a transported object, and selecting transport characteristics corresponding to the holding force. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-219390 A Summary of the Invention [Problem to be solved by the invention]

[0005] While the transport mechanism is transporting the substrate by holding it with the holding part, the substrate may move relative to the holding part. In such a case, the substrate cannot be transported accurately to the target position, and a transport error such as the substrate colliding with another member may occur.

[0006] An object of the present invention is to provide an advantageous technique for reducing the occurrence of transport errors. [Means for solving the problem]

[0007] One aspect of the present invention relates to a substrate processing apparatus for processing substrates, the substrate processing apparatus comprising an alignment unit that measures an alignment error of the substrate and aligns the substrate based on the measurement, a transport system that transports the substrate, and a control unit that executes an evaluation process in which the substrate after the alignment is performed in the alignment unit is transported through a predetermined path by the transport system and then the alignment unit remeasures the alignment error of the substrate, and the control unit controls the transport of the substrate by the transport system based on the alignment error obtained by the evaluation process. Effect of the Invention

[0008] According to the present invention, an advantageous technique is provided for reducing the occurrence of transport errors. [Brief description of the drawings]

[0009] [Figure 1] 1 is a plan view illustrating a configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] FIG. 2 is a diagram illustrating an example of the configuration of an exposure unit. [Diagram 3] FIG. 2 is a diagram illustrating a configuration of a transport mechanism. [Figure 4A] FIG. 4 is a schematic plan view of an alignment unit. [Figure 4B] FIG. 4 is a schematic side view of an alignment unit. [Figure 4C] FIG. 4 is a schematic plan view of an alignment unit. [Diagram 5] FIG. 2 is a perspective view illustrating an open cassette. [Figure 6] 3A to 3C are views exemplarily showing the operation (control method) of the substrate processing apparatus according to the first embodiment. [Figure 7] 10A to 10C are views exemplarily showing the operation (control method) of the substrate processing apparatus according to the second embodiment. [Figure 8] 13A to 13C are views exemplarily showing the operation (control method) of the substrate processing apparatus according to the third embodiment. [Figure 9] 13A to 13C are views exemplarily showing the operation (control method) of the substrate processing apparatus according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the attached drawings. Note that the following embodiment does not limit the invention according to the claims. Although the embodiment describes a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] In this specification and the accompanying drawings, directions are basically indicated by an XYZ position system in which the vertical direction is the Z axis, a horizontal plane perpendicular to the vertical direction is the XY plane, and each axis is orthogonal to each other.

[0012] FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to an embodiment. The substrate processing apparatus 1 may be configured as an exposure apparatus that forms a pattern (latent image) on a substrate by projecting a pattern of an original onto the substrate using a projection optical system. The exposure apparatus is an example of a pattern forming apparatus or lithography apparatus that forms or transfers a pattern onto a substrate, and the substrate processing apparatus 1 may be configured as another type of pattern forming apparatus or lithography apparatus. Examples of other types of pattern forming apparatus or lithography apparatus include a drawing apparatus that uses a charged particle beam and an imprinting apparatus. The drawing apparatus may draw a pattern on a substrate using a charged particle beam such as an electron beam or an ion beam. The imprinting apparatus may form a pattern on a substrate by forming an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 1 may be an ion implantation apparatus, a development apparatus, an etching apparatus, a film forming apparatus, an annealing apparatus, a sputtering apparatus, a deposition apparatus, or a planarization apparatus. Alternatively, the substrate processing apparatus 1 may be a transport apparatus that transports a substrate to a plurality of destinations.

[0013] The substrate processing apparatus 1 may include a chamber 2, and a pattern forming unit 4 and a transport system 3 housed in the chamber 2. The pattern forming unit 4 may include, for example, an exposure unit 20. The transport system 3 is configured to transport substrates to a plurality of destinations. The transport system 3 may include a supply mechanism 5 that supplies substrates, an alignment unit 6, a carrier port 7 on which an open cassette capable of housing a plurality of substrates is placed, a transport mechanism 8 that transports the substrates, a substrate carry-in unit 9 that carries in the substrates, and a substrate carry-out unit 10 that carries out the substrates.

[0014] The alignment unit 6 may be configured to measure an alignment error of a substrate on which a pattern is to be formed in the pattern forming unit 4 and align the substrate based on the measurement. The alignment unit 6 may be configured, for example, as a pre-aligner. The carrier port 7 may be configured to hold a closed carrier instead of an open cassette. The transport mechanism 8 and the supply mechanism 5 may include a holder such as a hand that holds the substrate, and a drive mechanism that moves the holder to transport the substrate. The transport mechanism 8 may be, for example, a horizontal articulated robot (scalar robot). The substrate loading unit 9 and the substrate unloading unit 10 may each have a support 91, 101 that supports the substrate from below.

[0015] The substrate processing apparatus 1 may further include a control unit 11. The control unit 11 may be configured to control the transfer system 3 and the pattern forming unit 4. The control unit 11 may include a first control unit that controls the transfer system 3 and a second control unit that controls the pattern forming unit 4. The control unit 11 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program embedded therein, or a combination of all or part of these.

[0016] 2 shows a schematic configuration example of the exposure unit 20. The exposure unit 20 may include a reticle (master) 21, a reticle stage (master stage) 24 that holds the reticle 21, an illumination device 23, a projection optical system 25, and a substrate stage 26 that holds the substrate 22. The exposure unit 20 may be configured to transfer the pattern of the reticle 21 to the substrate 22 by a step-and-repeat method or a step-and-scan method.

[0017] The illumination device 23 includes a light source and an illumination optical system (not shown), and illuminates the reticle 21. For example, a pulsed light source (laser) can be used as the light source. Usable lasers include an ArF excimer laser with a wavelength of about 193 nm and an F2 excimer laser with a wavelength of about 153 nm. However, the type of laser is not limited to an excimer laser, and for example, a YAG laser may be used, and the number of lasers is not limited. In addition, when a laser is used as the light source, a light beam shaping optical system that shapes a parallel light beam from the laser light source into a desired beam shape and an incoherent optical system that makes a coherent laser incoherent may be provided. Furthermore, the light source that can be used is not limited to a pulsed light source, and one or more continuous light sources such as mercury lamps and xenon lamps can also be used. The illumination optical system includes a lens, a mirror, a light integrator, an aperture, and the like.

[0018] The reticle 21 is an original plate made of, for example, quartz glass, and has a pattern (for example, a circuit pattern) to be transferred to a substrate. The reticle stage 24 is movable in the horizontal direction while holding the reticle 21. The projection optical system 25 projects and exposes the pattern of the reticle 21 illuminated with exposure light from the illumination device 23 onto the substrate 22 at a predetermined magnification (for example, 1 / 4 or 1 / 5). As the projection optical system 25, an optical system consisting of only a plurality of refractive lens elements, or an optical system consisting of a plurality of refractive lens elements and at least one concave mirror (catadioptric optical system) can be used. Alternatively, as the projection optical system 25, an optical system including a plurality of refractive lens elements and at least one diffractive optical element such as a kinoform, or an all-mirror type optical system can also be used.

[0019] The substrate 22 is a substrate having a surface coated with photoresist. The substrate stage 26 can be configured to be movable at least in the horizontal direction while holding the substrate 22. For example, when the step-and-scan method is employed, the reticle stage 24 and the substrate stage 26 move in the horizontal direction in synchronization with each other.

[0020] Next, the transportation of the substrate 22 will be described. First, the substrate 22 coated with resist is carried into the transport system 3. The carried-in substrate 22 can be placed on the support portion 91 protruding from the upper surface of the table of the substrate carrying-in portion 9. The transport mechanism 8 can transport the substrate 22 from the substrate carrying-in portion 9 to the alignment portion 6. The alignment portion 6 adjusts the horizontal and rotational positions of the substrate 22. The supply mechanism 5 can transport the substrate 22 aligned by the alignment portion 6 to the substrate stage 26 of the exposure portion 20. The substrate stage 26 can move along a plane in the horizontal direction, and can position the transported substrate 22 at a predetermined processing position. For example, a linear motor, an electromagnetic actuator, a pulse motor, or the like (not shown) can be used as a driving mechanism for the substrate stage 26. Here, an example in which the transport mechanism 8 and the supply mechanism 5 transport the substrate 22 has been described, but other transport mechanisms may be provided. In addition, the destination of the substrate 22 may include other destinations.

[0021] FIG. 3(a) is a plan view showing a schematic configuration example of the transport mechanism 8. FIG. 3(b) is a side view of the transport mechanism 8 that acquires the substrate 22 placed on the substrate loading section 9, seen from the α direction shown in FIG. 3(a). The transport mechanism 8 includes a hand (holding section) 85 that holds the substrate 22, and may be configured to transport the substrate 22 by driving the hand 85. The shape of the hand 85 may be any shape that can acquire the substrate 22, and is not limited to the shape shown in FIG. 3(a). A suction port 86 for vacuum-suctioning the substrate 22 may be provided on the upper surface of the hand 85. The suction port 86 may be connected to a reduced pressure source 88 such as a vacuum pump via an electromagnetic valve (not shown) or the like. The arrangement of the suction port 86 may be any arrangement that can hold the substrate 22, and is not limited to the arrangement shown in FIG. 3(a). For example, the suction port may be arranged over the entire upper surface of the hand 85, or a plurality of suction ports may be arranged.

[0022] A sensor 89 for detecting pressure may be provided in an exhaust flow path connecting the reduced pressure source 88 and the suction port 86. The exhaust flow path connecting the reduced pressure source 88 and the suction port 86 communicates with the space between the substrate 22 and the hand 85. Therefore, by detecting the pressure in the exhaust flow path, it is possible to detect the pressure in the space between the substrate 22 and the hand 85, in other words, the suction force or holding force acting on the substrate 22. It is sufficient for the sensor 89 to be able to detect the pressure in the space between the substrate 22 and the hand 85. Therefore, the sensor 89 may be disposed so as to directly detect the pressure in the space between the substrate 22 and the hand 85.

[0023] The transport mechanism 8 may include a plurality of drive mechanisms for driving the hand 85 about a plurality of axes, for example, four axes (X-axis, Y-axis, Z-axis, and θZ-axis). Here, the θZ-axis is rotation around the Z-axis. The transport mechanism 8 may include, for example, a drive mechanism 81 for driving in the horizontal direction, a drive mechanism 82 for driving in the vertical direction, and drive mechanisms 83 and 84 for driving in the rotational direction (θZ-axis). The drive mechanism 82 for driving in the vertical direction, the drive mechanisms 83 and 84 for driving in the rotational direction, and the hand 85 may each be connected by a drive shaft 87. Note that the configuration, number, combination, and the like of the drive mechanisms are not limited to this example.

[0024] The substrate 22 may be placed on a support portion 91 protruding from the upper surface of the platform of the substrate loading unit 9. Under the control of the control unit 11, the hand 85 may be driven upward after being inserted into the space below the substrate 22. The air in the space below the substrate 22 may be sucked through the suction port 86, so that the substrate 22 may be held by the hand 85 through vacuum suction. Thereafter, the support portion 91 is driven downward, so that the substrate 22 is transferred from the support portion 91 to the hand 85. The substrate 22 may be prevented from shifting in position during transportation, as the hand 85 holds the substrate 22 through vacuum suction. The substrate 22 comes into contact with the upper surface of the hand 85, so that the suction port 86 is blocked by the substrate 22. As a result, the pressure in the exhaust flow path changes from atmospheric pressure to the negative pressure side. The control unit 11 may detect that the substrate 22 has been held by the hand 85 through vacuum suction, by detecting the change in pressure in the exhaust flow path with the sensor 89. The pressure detected by the sensor 89 may be called suction pressure. Since the suction pressure correlates with the holding force with which the hand 85 holds the substrate 22, the holding force can be detected by detecting the suction pressure.

[0025] 4A and 4B are respectively a schematic plan view and a side view of the alignment unit 6. The alignment unit 6 may include, for example, a support unit 62 that supports the substrate 22, a drive unit 63 that drives the support unit 62, a plurality of sensors 64 to 66, and an alignment stage 67. The drive unit 63 may include, for example, a mechanism that rotates the support unit 62 around an axis parallel to the Z axis, and a mechanism that horizontally moves the support unit 62 in at least one direction (typically the X direction and the Y direction) in the XY plane. The drive unit 63 may also have a mechanism that moves the support unit 62 in a direction parallel to the Z axis, that is, a lifting mechanism. The support unit 62 and the drive unit 63 may constitute a movable stage mechanism in the alignment unit 6. The plurality of sensors 64 to 66 may be supported by a support structure (for example, a plate-shaped member) not shown in the figure so that the edge position of the substrate 22 can be detected from the upper side of the substrate 22.

[0026] The alignment unit 6 may include a plurality of light irradiating units 61. The plurality of light irradiating units 61 may be supported by an alignment stage 67, for example, so as to irradiate light toward the substrate 22. The plurality of light irradiating units 61 may be disposed so as to face the plurality of sensors 64 to 66 across the edge of the substrate 22. The plurality of sensors 64 to 66 may detect the edge position of the substrate 22 based on the boundary position between an area where the light from the light irradiating units 61 is blocked by the substrate 22 and an area where the light is not blocked, and may provide the result to the control unit 11 in a wired or wireless manner.

[0027] Of the multiple sensors 64-66, sensor 64 can detect the position of a notch or orientation flat provided in substrate 22, that is, the rotation angle (θ) around an axis (θZ axis) parallel to the Z axis of substrate 22, while drive unit 63 rotates substrate 22 once. Hereinafter, the rotation angle will refer to the rotation angle about the θZ axis. Drive unit 63 can detect the position of the notch or orientation flat with sensor 64 so that the notch or orientation flat is located below sensor 64, and can rotate substrate 22 based on the detection result so that the rotation angle of substrate 22 matches an appropriate rotation angle. The appropriate rotation angle can be a rotation angle preset by the user.

[0028] The notch is a mark formed by cutting a part of the substrate 22 into a V-shape as illustrated in FIG. 4A, and the rotation angle of the substrate 22 can be detected by detecting the position of the notch. On the other hand, the orientation flat is an abbreviation for orientation flat, and is a mark formed by cutting a part of the substrate 22 in a straight line. The rotation angle of the substrate 22 can be detected by detecting the position of the orientation flat. If a notch is provided when the substrate 22 has a small diameter, the size of the notch serving as a mark becomes relatively small according to the size of the substrate 22, and therefore the rotation angle cannot be detected accurately. Therefore, it is preferable to provide an orientation flat when the substrate 22 has a small diameter. On the other hand, if an orientation flat is provided when the substrate 22 has a large diameter, the area of ​​the substrate 22 that is cut as a mark becomes large. Therefore, it is preferable to provide a notch when the substrate 22 has a large diameter.

[0029] The sensors 65 and 66 are, for example, line sensors in which a plurality of photoelectric conversion elements are arranged in a line, and the position of the substrate 22 on the XY plane can be detected based on the outputs of these sensors. The sensors 65 and 66 are arranged so that the directions in which the plurality of photoelectric conversion elements are arranged (directions having resolution) are perpendicular to each other, and each sensor detects the distance from the edge of the substrate 22 to the center of the sensor (sensor center). When light is irradiated from the light irradiation unit 61 toward the substrate 22, the light is blocked by the substrate 22. The sensors 65 and 66 detect the distance from the edge of the substrate 22 to the sensor center. The arrows shown in FIG. 4A indicate the distance from the edge of the substrate 22 to the sensor center, and the distance from the edge detected by the sensor 65 to the sensor center is the same as the distance from the edge detected by the sensor 66 to the sensor center. On the other hand, in the example of FIG. 4C, the substrate 22 is shifted in the positive direction on the X axis, and the distance from the edge detected by the sensor 65 to the sensor center is greater than the distance from the edge detected by the sensor 66 to the sensor center.

[0030] The position (X) of substrate 22 in the X-axis direction can be detected based on the distance from the edge detected by sensor 65 to the sensor center and the distance from the edge detected by sensor 66 to the sensor center. As in the example of Fig. 4A, when the distance detected by sensor 65 is the same as the distance detected by sensor 66, substrate 22 is in a proper position in the X-axis direction. On the other hand, as in Fig. 4C, when the distance detected by sensor 65 is different from the distance detected by sensor 66, substrate 22 is not in a proper position in the X-axis direction.

[0031] When the substrate 22 is provided with an orientation flat, the position (Y) of the substrate 22 in the Y-axis direction can be detected based on the distance from the edge detected by the sensor 65 to the sensor center and the distance from the edge detected by the sensor 66 to the sensor center. If the distance from the edge detected by the sensor 65 to the sensor center and the distance from the edge detected by the sensor 66 to the sensor center are predetermined distances set by the user, respectively, the substrate 22 is in a proper position in the Y-axis direction. When the substrate 22 is provided with a notch, the position (Y) of the substrate 22 in the Y-axis direction can be detected by measuring the width of the V-shaped cut of the notch with the sensor 64. If the width of the notch at a predetermined position is a predetermined length set by the user, the substrate 22 is in a proper position in the Y-axis direction. In this way, the position of the substrate 22 on the XY plane (horizontal direction) can be detected using the multiple sensors 64 to 66.

[0032] The control unit 11 drives the drive unit 63 based on the results of detection by the multiple sensors 64-66, i.e., on the position information (X, Y, θ) of the substrate 22, to move the substrate 22 to an appropriate position. By having the substrate 22 in an appropriate position, the time required for alignment in the exposure unit 20 can be reduced. The multiple sensors 64-66 may be configured with line sensors or area sensors. As long as the position information (X, Y, θ) of the substrate 22 can be obtained, the type and number of sensors are not limited to a specific one.

[0033] The control unit 11 can obtain the amount of deviation (amount of deviation from a proper position) of the position (X, Y, θ) of the substrate 22 supported by the support unit 62, i.e., the alignment error, based on the results detected using the multiple sensors 64-66. Then, the control unit 11 performs an operation to match the position of the substrate 22 with the proper position, i.e., alignment, by having the drive unit 63 drive the support unit 62 so as to correct the amount of deviation of the position of the substrate 22. Here, the alignment error (amount of deviation from a proper position) detected using the multiple sensors 64-66 is synonymous with the amount of correction by which the position of the substrate 22 should be corrected.

[0034] FIG. 5 is a perspective view illustrating an open cassette 71 placed on the carrier port 7. The open cassette 71 may include a pair of side walls 710 extending in the vertical direction, a bottom wall 711 connected to the lower ends of the pair of side walls 710, and a ceiling wall 712 facing the bottom wall 711 and connected to the upper ends of the pair of side walls. A plurality of slots 710a for accommodating the substrate 22 are arranged at predetermined intervals in the side walls 710. A front opening 713 that allows the substrate 22 to be inserted and removed is provided on the front side of the open cassette 71, and a rear opening 714 is provided on the rear side opposite the front opening 713. The rear opening 714 has a narrower width in the left-right direction than the front opening 713 so as not to allow the substrate 22 to be inserted and removed. In other words, the rear opening 714 has a left-right width smaller than the outer diameter of the substrate 22.

[0035] Hereinafter, an operation (control method) of the substrate processing apparatus 1 of the first embodiment will be described by way of example with reference to FIG. 6. The operation shown in FIG. 6 is controlled by the control unit 11. In step S602, the substrate 22 is carried into the substrate carry-in unit 9. Next, in step S603, the holding force of the substrate 22 by the transfer system 3 is detected. The holding force of the substrate 22 by the transfer system 3 can be detected, for example, by the sensor 89 detecting the pressure while the substrate 22 is held by the hand 85 of the transfer mechanism 8. Alternatively, the holding force of the substrate 22 by the transfer system 3 may be detected by the sensor (not shown) detecting the pressure of a suction line (not shown) provided in the support unit 91 immediately after the substrate 22 is carried into the substrate carry-in unit 9.

[0036] Next, in step S604, the substrate 22 is transported to the alignment unit 6 by the transport mechanism 8. Next, in step S605, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement. Next, in step S606, the control unit 11 determines whether the holding force of the substrate 22 detected in step S603 is greater than a specified value. If the control unit 11 determines that the holding force of the substrate 22 is greater than the specified value, the process proceeds to step S607, and if the control unit 11 determines that the holding force of the substrate 22 is smaller than the specified value, the process proceeds to step S611. The holding force of the substrate 22 being greater than the specified value means that the substrate 22 can be transported to the pattern forming unit 4 by the supply mechanism 5, and the holding force of the substrate 22 being smaller than the specified value means that a malfunction may occur when the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5. For example, if the back surface of the substrate 22 is dirty or if the substrate 22 has a warp that exceeds an acceptable limit, the specified value can be preset to ensure that the holding force of the substrate 22 detected in step S603 is smaller than the specified value.

[0037] In step S607, the substrate 22 is transported by the supply mechanism 5 to the pattern forming unit 4, in step S608 the substrate 22 is exposed in the pattern forming unit 4, and in step S609 the substrate 22 is transported by the transport mechanism 8 to the substrate unloading unit .

[0038] In step S611, the substrate 22 is transported from the alignment unit 6 to a predetermined target position by the transport mechanism 8, and in step S612, the substrate 22 is transported from the predetermined target position to the alignment unit 6 by the transport mechanism. The predetermined target position can be, for example, a position immediately before the carrier port 7, which is the target position to which the substrate 22 is to be transported thereafter. Next, in step S613, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0039] Steps S611, S612, and S613 are an example of an evaluation process in which the substrate aligned by the alignment unit 6 is transported by the transport system 3 through a predetermined path, and then the alignment unit 6 remeasures the alignment error of the substrate. The alignment error detected in the evaluation process is a positional deviation of the substrate 22 that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) through a predetermined path. In other words, the alignment error obtained in the evaluation process can be regarded as an amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) to the open cassette 71 arranged in the carrier port 7 in step S615, which is performed later.

[0040] In step S614, the control unit 11 judges whether the alignment error detected in step S613 (the alignment error detected in the evaluation process) is smaller than the judgment criterion. If the alignment error detected in step S613 is smaller than the judgment criterion, it means that no problem will occur when the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in step S615, which is performed later. The judgment criterion can be determined according to such a purpose. In one example, the judgment criterion can be determined so as to ensure that the edge of the substrate 22 does not collide with the sidewall 710 when the substrate 22 is stored in the slot 710a of the open cassette 71.

[0041] When the control unit 11 determines that the alignment error detected in step S613 is smaller than the reference for judgment, the control unit 11 advances the process to step S615, and when the control unit 11 determines that the alignment error detected in step S613 is larger than the reference for judgment, the control unit 11 advances the process to step S616. In step S615, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to the open cassette 71 arranged in the carrier port 7, and is accommodated in the open cassette 71. The execution of step S616 means that when the substrate 22 is transported from the alignment unit 6 to the open cassette 71 by the transport mechanism 8, a malfunction such as the substrate 22 colliding with the side wall 710 of the open cassette 71 may occur. Therefore, in step S616, the occurrence of an error is notified. The occurrence of an error may be notified, for example, in a manner that prompts the operator to collect the substrate 22.

[0042] In the above example, the destination of the substrate 22 in step S615 is the open cassette 71, but the destination can be set arbitrarily. The destination may be selected from a plurality of candidate destinations. Destinations other than the open cassette 71 can include, for example, the pattern forming unit 4 (exposure unit 20) and the substrate unloading unit 10.

[0043] According to the first embodiment, even if a sufficient holding force for transporting the substrate cannot be obtained, the positional deviation of the substrate that may occur due to the transport can be evaluated, and if the substrate can be transported safely, the substrate can be transported to an alternative destination such as an open cassette. This makes it possible to reduce the frequency of errors that would stop the substrate processing apparatus 1, and improve the operating rate of the substrate processing apparatus 1.

[0044] In the above embodiment, the evaluation process of steps S611 to S613 is performed when it is determined that the holding force of the substrate is smaller than a specified value, but the evaluation process may be performed at any time. For example, when the alignment error obtained by the evaluation process is smaller than a first standard for transporting the substrate to the exposure section, the substrate may be transported to the exposure section. Also, when the alignment error obtained by the evaluation process is larger than the first standard for transporting to the exposure section but smaller than a second standard for transporting to another destination, the substrate may be transported to another destination.

[0045] Step S615 can be understood as an example of a step in which the control unit 11 determines whether or not the substrate can be transported to a predetermined destination based on the alignment error obtained by the evaluation process. Alternatively, step S615 can be understood as an example of a step in which the control unit 11 determines whether or not the substrate can be transported to a predetermined destination based on the magnitude of the alignment error obtained by the evaluation process.

[0046] In step S615, the control unit 11 may determine to which of the multiple destinations the substrate is to be transported based on the alignment error obtained by the evaluation process. Such multiple destinations may include an exposure unit, in other words, a pattern forming unit that forms a pattern on the substrate. The multiple destinations may include an open cassette, a substrate loading unit, and a substrate unloading unit. The control unit 11 may report the occurrence of an error when it is determined that the substrate cannot be transported to any of the multiple destinations.

[0047] Hereinafter, the operation (control method) of the substrate processing apparatus 1 of the second embodiment will be described by way of example with reference to FIG. 7. Matters not mentioned as the second embodiment may follow the first embodiment. In the second embodiment, when it is determined that the holding force for holding the substrate is smaller than a specified value, the transport speed of the substrate by the transport system may be reduced below a reference speed. Alternatively, in the second embodiment, when the alignment error obtained by the evaluation process is larger than a threshold value, the transport speed of the substrate by the transport system may be reduced below a reference speed.

[0048] The operation shown in FIG. 7 is controlled by the control unit 11. In step S802, the substrate 22 is carried into the substrate carry-in unit 9. Next, in step S803, the holding force of the substrate 22 by the transport system 3 is detected. Next, in step S804, the control unit 11 determines whether the holding force of the substrate 22 detected in step S803 is smaller than a specified value. If the control unit 11 determines that the holding force of the substrate 22 is smaller than the specified value, the process proceeds to step S805, and if the control unit 11 determines that the holding force of the substrate 22 is larger than the specified value, the process proceeds to step S806. The holding force of the substrate 22 being larger than the specified value means that the substrate 22 can be transported to the pattern forming unit 4 by the supply mechanism 5, and the holding force of the substrate 22 being smaller than the specified value means that a malfunction may occur when the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5.

[0049] In step S805, the control unit 11 sets the transport speed of the substrate 22 by the transport mechanism 8 to a speed slower than the reference speed. This reduces the possibility of the substrate 22 being misaligned during transport. In step S806, the substrate 22 is transported by the transport mechanism 8 to the alignment unit 6. Next, in step S807, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0050] Next, in step S808, the control unit 11 determines whether the transport speed of the substrate 22 by the transport mechanism 8 is set to a speed lower than the reference speed. If the transport speed of the substrate 22 by the transport mechanism 8 is set to a speed lower than the reference speed, the control unit 11 advances the process to step S813, otherwise, the control unit 11 advances the process to step S809. In step S809, the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5, in step S810, the substrate 22 is exposed in the pattern forming unit 4, and in step S811, the substrate 22 is transported to the substrate unloading unit 10 by the transport mechanism 8.

[0051] In step S813, the substrate 22 is transported from the alignment unit 6 to a predetermined target position by the transport mechanism 8, and in step S814, the substrate 22 is transported from the predetermined target position to the alignment unit 6 by the transport mechanism. The predetermined target position can be, for example, a position immediately before the carrier port 7, which is the target position to which the substrate 22 is to be transported thereafter. Next, in step S815, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0052] Steps S813, S814, and S815 are an example of an evaluation process in which the alignment unit 6 remeasures the alignment error of the substrate after the substrate, which has been aligned by the alignment unit 6, is transported by the transport system 3 through a predetermined path. In the evaluation process, it is possible to evaluate a positional deviation (alignment error) of the substrate 22 that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) through a predetermined path. In other words, the alignment error obtained in the evaluation process can be regarded as the amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) to the open cassette 71 arranged in the carrier port 7 in step S817, which is performed later.

[0053] In step S816, the control unit 11 judges whether the alignment error detected in step S815 (the alignment error detected in the evaluation process) is smaller than the judgment reference. If the alignment error detected in step S815 is smaller than the judgment reference, it means that no problem will occur even if the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in the subsequent step S817.

[0054] If the control unit 11 determines that the alignment error detected in step S816 is smaller than the reference value, the process proceeds to step S817, and if the control unit 11 determines that the alignment error detected in step S816 is larger than the reference value, the process proceeds to step S818. In step S817, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to the open cassette 71 arranged in the carrier port 7, and is stored in the open cassette 71.

[0055] In step S818, the control unit 11 determines whether the set substrate transport speed is the minimum speed or not, and if so, proceeds to step S820, and if not, proceeds to step S819.

[0056] Execution of step S820 means that when the substrate 22 is transported from the alignment unit 6 to the open cassette 71 by the transport mechanism 8, a malfunction such as the substrate 22 colliding with the side wall 710 of the open cassette 71 may occur. Therefore, in step S820, the occurrence of an error is notified. The occurrence of an error may be notified, for example, in a manner that prompts the operator to collect the substrate 22. In step S819, the control unit 11 changes the transport speed set as the transport speed at which the substrate 22 is transported by the transport mechanism 8 to a slower speed, and the process proceeds to the above-mentioned step S813.

[0057] In the second embodiment, the frequency of error occurrence can be reduced compared to the first embodiment.

[0058] Hereinafter, an exemplary operation (control method) of the substrate processing apparatus 1 of the third embodiment will be described with reference to Fig. 8. Matters not mentioned as the third embodiment may follow the first embodiment. In the third embodiment, the control unit 11 offsets the substrate in the alignment unit 6 based on the alignment error obtained by the evaluation process, and then causes the transfer system 3 (transfer mechanism 8) to transfer the substrate.

[0059] In the third embodiment shown in Fig. 8, step S616 in the first embodiment shown in Fig. 6 is replaced by steps S617 and S618. In step S614, the control unit 11 judges whether the alignment error detected in step S613 (the alignment error detected in the evaluation process) is smaller than the judgment reference. If the alignment error detected in step S613 is smaller than the judgment reference, this means that no problem will occur even if the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in step S615 which is performed later.

[0060] If the control unit 11 determines that the alignment error detected in step S613 is smaller than the reference value, the process proceeds to step S615, and if the control unit 11 determines that the alignment error detected in step S613 is larger than the reference value, the process proceeds to step S617. In step S615, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to an open cassette 71 arranged in the carrier port 7, and is stored in the open cassette 71.

[0061] In step S617, the alignment unit 6 aligns the substrate 22 based on the alignment error obtained in step S613. Next, in step S618, the control unit 11 controls the alignment unit 6 to offset the substrate 22 based on the alignment error obtained in step S613. For example, it can be assumed that the positional deviation that may occur when the substrate 22 is transported from the alignment unit 6 to the carrier port 7 by the transport mechanism 8 is equivalent to the alignment error obtained in step S613. In this case, if the alignment error obtained in step S613 is (ΔX, ΔY, Δθ), the offset can be (-ΔX, -ΔY, -Δθ). Then, in step S615, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to the open cassette 71 arranged in the carrier port 7, and is accommodated in the open cassette 71.

[0062] Hereinafter, an operation (control method) of the substrate processing apparatus 1 of the fourth embodiment will be described by way of example with reference to FIG. 9. Matters not mentioned as the fourth embodiment may follow the first embodiment. In the fourth embodiment, when it is determined that the holding force of the substrate 22 detected in step S603 is smaller than a specified value, the substrate is transported to a destination selected from a plurality of candidate destinations. In the fourth embodiment shown in FIG. 9, steps S818 to S621 are added to the first embodiment shown in FIG. 6.

[0063] In step S606, the control unit 11 determines whether the holding force of the substrate 22 detected in step S603 is greater than a specified value. If the control unit 11 determines that the holding force of the substrate 22 is greater than the specified value, the process proceeds to step S607, whereas if the control unit 11 determines that the holding force of the substrate 22 is less than the specified value, the process proceeds to step S618.

[0064] In step S618, the substrate 22 is transported from the alignment unit 6 to the first target position by the transport mechanism 8, and in step S619, the substrate 22 is transported from the first target position to the alignment unit 6 by the transport mechanism 8. The first target position can be, for example, a position immediately before the exposure unit 20. Next, in step S620, the alignment unit 6 measures an alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0065] Steps S618, S619, and S620 are an example of a first evaluation process in which the substrate aligned by the alignment unit 6 is transported by the transport system 3 through a predetermined path that passes through a first target position, and then the alignment unit 6 remeasures the alignment error of the substrate. In the first evaluation process, it is possible to evaluate a positional deviation (alignment error) of the substrate 22 that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) through the first predetermined path. In other words, the alignment error obtained in the first evaluation process can be regarded as an amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) in a process to be performed thereafter.

[0066] In step S621, the control unit 11 determines whether the alignment error detected in step S620 (the alignment error detected in the evaluation process) is smaller than a first criterion for determination. If the alignment error detected in step S620 is smaller than the first criterion for determination, this means that transport to the exposure unit 20 is possible. From another perspective, the first criterion can be a criterion that can guarantee safe transport to the exposure unit 20.

[0067] If the control unit 11 determines that the alignment error detected in step S620 is smaller than the first reference for judgment, it proceeds to step S607, and if it determines that the alignment error detected in step S620 is larger than the reference for judgment, it proceeds to step S611.

[0068] In step S607, the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5, in step S608, the substrate 22 is exposed in the pattern forming unit 4, and in step S609, the substrate 22 is transported to the substrate unloading unit 10 by the transport mechanism 8. Therefore, even if it is determined in step S606 that the holding force of the substrate 22 is smaller than the specified value, if it is determined that the alignment error detected in the evaluation process is smaller than the first standard, the substrate 22 is transported to the exposure unit 20 and exposed.

[0069] In step S611, the substrate 22 is transported from the alignment unit 6 to a second target position by the transport mechanism 8, and in step S612, the substrate 22 is transported from the second target position to the alignment unit 6 by the transport mechanism. The second target position can be, for example, a position immediately before the carrier port 7, which is the target position to which the substrate 22 is to be transported thereafter. Next, in step S613, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0070] Steps S611, S612, and S613 are an example of a second evaluation process in which the substrate aligned by the alignment unit 6 is transported by the transport system 3 through a second route that passes through a second target position, and then the alignment unit 6 remeasures the alignment error of the substrate. In the second evaluation process, it is possible to evaluate a positional deviation of the substrate 22 that may occur when the substrate 22 is transported through the second route by the transport system 3 (transport mechanism 8). In other words, the alignment error obtained in the second evaluation process can be regarded as an amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 to the open cassette 71 arranged in the carrier port 7 in step S615 that is performed later.

[0071] In step S614, the control unit 11 determines whether the alignment error detected in step S613 (the alignment error detected in the evaluation process) is smaller than a second criterion for determination. If the alignment error detected in step S613 is smaller than the second criterion for determination, this means that no problems will occur even if the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in step S615, which is performed subsequently. The second criterion for determination can be determined according to such a purpose.

[0072] The third embodiment can be understood as an example in which a substrate is transported to a destination selected from a plurality of destinations. The plurality of destinations may have a priority order, and the allowable amount of the alignment error obtained by the evaluation process (first criterion, second criterion) may be set smaller for the destination with a higher priority order.

[0073] When the output of the sensor 89 indicates that the holding force of the substrate is smaller than a specified value, the control unit 11 may control the evaluation process by setting the first route assigned to the first transport destination with the first priority as the predetermined route. When the alignment error obtained by the evaluation process using the first route satisfies a first criterion, the control unit 11 may control the transport system 3 to transport the substrate to the first transport destination. When the alignment error obtained by the evaluation process using the first route does not satisfy the first criterion, the control unit 11 may control the evaluation process by setting the second route assigned to the second transport destination with the second priority as the predetermined route. When the alignment error obtained by the evaluation process using the second route satisfies a second criterion, the control unit 11 may control the transport system 3 to transport the substrate to the second transport destination.

[0074] Hereinafter, a method for manufacturing an article using the substrate processing apparatus 1 as a pattern forming apparatus will be described. The method for manufacturing an article includes a step of forming a pattern on a substrate by controlling the substrate processing apparatus 1 according to the control method described above, and a step of obtaining an article by processing the substrate on which the pattern has been formed. The pattern can be formed in step S608 or S810. When the substrate processing apparatus 1 is configured as an exposure apparatus, a latent image can be formed as a pattern on a photoresist film of the substrate in step S608 or S810, and the latent image can be converted into a physical pattern through a development step. The step of processing the substrate on which the pattern has been formed may include a development step, or may include a step of processing (e.g., etching) the substrate that has been subjected to the development step.

[0075] The present disclosure includes disclosure of the following substrate processing apparatus, a method for controlling the substrate processing apparatus, a method for manufacturing an article, and a program. (Item 1) A substrate processing apparatus for processing a substrate, an alignment unit that measures an alignment error of the substrate and aligns the substrate based on the measurement; A transfer system for transferring the substrate; a control unit that executes an evaluation process of transporting the substrate, which has been aligned by the alignment unit, through a predetermined path by the transport system and then re-measuring an alignment error of the substrate by the alignment unit, the control unit controls the transport of the substrate by the transport system based on the alignment error obtained by the evaluation process. The substrate processing apparatus according to claim 1, (Item 2) a sensor for detecting a holding force of the substrate by the transfer system; the control unit executes the evaluation process when the output of the sensor indicates that the holding force of the substrate is smaller than a specified value. 2. The substrate processing apparatus according to item 1, (Item 3) the control unit determines whether or not the substrate can be transported to a predetermined destination based on the alignment error obtained by the evaluation process. 3. The substrate processing apparatus according to item 2, (Item 4) the control unit determines whether or not the substrate can be transported to a predetermined destination based on the magnitude of the alignment error obtained by the evaluation process. 3. The substrate processing apparatus according to item 2, (Item 5) the control unit determines to which of a plurality of destinations the substrate is to be transported based on the alignment error obtained by the evaluation process. 5. The substrate processing apparatus according to any one of items 2 to 4, (Item 6) The plurality of transfer destinations include a pattern forming unit that forms a pattern on the substrate. 6. The substrate processing apparatus according to item 5, (Item 7) The plurality of transport destinations further include an open cassette, a substrate loading section, and a substrate unloading section. 7. The substrate processing apparatus according to item 5 or 6, (Item 8) the control unit notifies the occurrence of an error when it is determined that the substrate cannot be transported to any of the plurality of transport destinations. 8. The substrate processing apparatus according to any one of items 5 to 7, (Item 9) the plurality of transport destinations have a priority order, and the allowable amount of the alignment error obtained by the evaluation process is smaller for a destination with a higher priority order; 9. The substrate processing apparatus according to any one of items 5 to 8, (Item 10) when an output of the sensor indicates that the holding force of the substrate is smaller than the specified value, the control unit executes the evaluation process with a first route assigned to a first transport destination having a first priority as the predetermined route; the control unit controls the transfer system to transfer the substrate to the first transfer destination when an alignment error obtained by the evaluation process using the first path satisfies a first criterion; when the alignment error obtained by the evaluation process using the first route does not satisfy the first criterion, the control unit executes the evaluation process using a second route assigned to a second destination having the second highest priority as the predetermined route; and when the alignment error obtained by the evaluation process using the second path satisfies a second criterion, the control unit controls the transfer system to transfer the substrate to the second transfer destination. 10. The substrate processing apparatus according to item 9, (Item 11) the control unit reduces a transport speed of the substrate by the transport system when the alignment error obtained by the evaluation process is greater than a reference value. 11. The substrate processing apparatus according to any one of items 1 to 10, (Item 12) the control unit offsets the substrate to the alignment unit based on the alignment error obtained by the evaluation process, and then causes the transfer system to transfer the substrate. 12. The substrate processing apparatus according to any one of items 1 to 11, (Item 13) A pattern forming unit that forms a pattern on the substrate, the control unit controls the transport system to transport the substrate, which has been aligned in the alignment unit, to the pattern formation unit when the output of the sensor indicates that the holding force of the substrate is greater than the specified value. 13. The substrate processing apparatus according to any one of items 2 to 12, (Item 14) 1. A method for controlling a substrate processing apparatus including an alignment unit that measures an alignment error of a substrate and aligns the substrate based on the measurement, and a transport system that transports the substrate, comprising: a first step of controlling the alignment unit to align the substrate; a second step of controlling the transport system so that the substrate is transported through a predetermined path after the first step; a third step of controlling the alignment unit so as to measure an alignment error of the substrate after the second step; and a fourth step of controlling the transportation of the substrate by the transportation system based on the alignment error obtained in the third step. A method for controlling a substrate processing apparatus comprising the steps of: (Item 15) When a holding force of the substrate by the transfer system is smaller than a specified value, the first step, the second step, the third step, and the fourth step are performed. 15. The method for controlling a substrate processing apparatus according to item 14, (Item 16) a fifth step of controlling the transport system so that the substrate is transported to a pattern forming unit when the holding force is greater than the specified value; 16. The method for controlling a substrate processing apparatus according to item 15, (Item 17) A sixth step of controlling the pattern forming unit to form a pattern on the substrate. 17. The method for controlling a substrate processing apparatus according to item 16, (Item 18) Forming a pattern on a substrate by processing the substrate according to the control method of the substrate processing apparatus according to item 17; processing the patterned substrate to obtain an article; A method for manufacturing an article, comprising: (Item 19) 18. A program for causing a control unit of a substrate processing apparatus to operate so as to execute the method for controlling a substrate processing apparatus according to any one of items 14 to 17.

[0076] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0077] 1: substrate processing apparatus, 3: transfer system, 4: pattern forming apparatus, 6: alignment section, 7: carrier port, 8: transfer mechanism, 9: substrate loading section, 10: substrate unloading section, 11: control section, 20: exposure section

Claims

1. A substrate processing apparatus for processing a substrate, an alignment unit that measures an alignment error of the substrate and aligns the substrate based on the measurement; A transfer system for transferring the substrate; a control unit that executes an evaluation process of transporting the substrate, which has been aligned by the alignment unit, through a predetermined path by the transport system and then re-measuring an alignment error of the substrate by the alignment unit, the control unit controls the transport of the substrate by the transport system based on the alignment error obtained by the evaluation process. The substrate processing apparatus according to claim 1,

2. a sensor for detecting a holding force of the substrate by the transfer system; the control unit executes the evaluation process when the output of the sensor indicates that the holding force of the substrate is smaller than a specified value. The substrate processing apparatus according to claim 1 .

3. the control unit determines whether or not the substrate can be transported to a predetermined destination based on the alignment error obtained by the evaluation process. The substrate processing apparatus according to claim 2 .

4. the control unit determines whether or not the substrate can be transported to a predetermined destination based on the magnitude of the alignment error obtained by the evaluation process. The substrate processing apparatus according to claim 2 .

5. the control unit determines to which of a plurality of destinations the substrate is to be transported based on the alignment error obtained by the evaluation process. The substrate processing apparatus according to claim 2 .

6. The plurality of transfer destinations include a pattern forming unit that forms a pattern on the substrate. The substrate processing apparatus according to claim 5 .

7. The plurality of transport destinations further include an open cassette, a substrate loading section, and a substrate unloading section. The substrate processing apparatus according to claim 6 .

8. the control unit notifies the occurrence of an error when it is determined that the substrate cannot be transported to any of the plurality of transport destinations. The substrate processing apparatus according to claim 5 .

9. the plurality of transport destinations have a priority order, and the allowable amount of the alignment error obtained by the evaluation process is smaller for a destination with a higher priority order; The substrate processing apparatus according to claim 5 .

10. when an output of the sensor indicates that the holding force of the substrate is smaller than the specified value, the control unit executes the evaluation process with a first route assigned to a first transport destination having the first priority as the predetermined route; the control unit controls the transfer system to transfer the substrate to the first transfer destination when an alignment error obtained by the evaluation process using the first path satisfies a first criterion; when the alignment error obtained by the evaluation process using the first route does not satisfy the first criterion, the control unit executes the evaluation process using the second route assigned to the second transport destination having the second highest priority as the predetermined route; the control unit controls the transfer system to transfer the substrate to the second transfer destination when the alignment error obtained by the evaluation process using the second path satisfies a second criterion. The substrate processing apparatus according to claim 9 .

11. the control unit reduces a transport speed of the substrate by the transport system when the alignment error obtained by the evaluation process is greater than a reference value. The substrate processing apparatus according to claim 1 .

12. the control unit offsets the substrate to the alignment unit based on the alignment error obtained by the evaluation process, and then causes the transfer system to transfer the substrate. The substrate processing apparatus according to claim 1 .

13. A pattern forming unit that forms a pattern on the substrate, the control unit controls the transport system to transport the substrate, which has been aligned in the alignment unit, to the pattern formation unit when the output of the sensor indicates that the holding force of the substrate is greater than the specified value. The substrate processing apparatus according to claim 2 .

14. 1. A method for controlling a substrate processing apparatus including an alignment unit that measures an alignment error of a substrate and aligns the substrate based on the measurement, and a transport system that transports the substrate, comprising: a first step of controlling the alignment unit to align the substrate; a second step of controlling the transport system so that the substrate is transported through a predetermined path after the first step; a third step of controlling the alignment unit so as to measure an alignment error of the substrate after the second step; and a fourth step of controlling transportation of the substrate by the transportation system based on the alignment error obtained in the third step. A method for controlling a substrate processing apparatus comprising the steps of:

15. When a holding force of the substrate by the transfer system is smaller than a specified value, the first step, the second step, the third step, and the fourth step are performed. The method for controlling a substrate processing apparatus according to claim 14 .

16. a fifth step of controlling the transport system so that the substrate is transported to a pattern forming unit when the holding force is greater than the specified value; The method for controlling a substrate processing apparatus according to claim 15 .

17. A sixth step of controlling the pattern forming unit to form a pattern on the substrate. The method for controlling a substrate processing apparatus according to claim 16 .

18. forming a pattern on a substrate by processing the substrate in accordance with the method for controlling a substrate processing apparatus according to claim 17; processing the patterned substrate to obtain an article; A method for manufacturing an article, comprising:

19. A program for causing a control unit of the substrate processing apparatus to operate so as to execute the method for controlling the substrate processing apparatus according to claim 14.

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