Light source, measurement device, and manufacturing method for light source

Abstract

To prevent a cathode of a surface light-emitting element from short-circuiting to a conductive member via a junction part.SOLUTION: A light source includes a light-emitting chip, a substrate, a conductive joint part, and a wire. The light-emitting chip has surface light-emitting elements arranged thereon. The light-emitting chip has a first surface electrically connected to a cathode of the surface light-emitting elements and a second surface electrically connected to an anode of the surface light-emitting elements. The substrate has a first conductive pattern and a second conductive pattern formed thereon. The conductive joint part connects the first surface of the light-emitting chip and the first conductive pattern. The wire electrically connects the second surface of the light-emitting chip and the second conductive pattern. The light source further includes a non-conductive protective part that is arranged on the outer circumferential side of the joint part and covers at least a portion of the outer circumferential surface of the joint part.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a light source, a measurement device, and a method for manufacturing a light source. [Background technology]

[0002] With the progress of AD (Autonomous Driving) and ADAS (Advanced Driver-Assistance Systems), research and development of LiDAR (Light Detection And Ranging) is being conducted as one of the measurement devices used for grasping the surrounding environment and estimating the vehicle's self-position while the vehicle is traveling. LiDAR includes a projector that projects (irradiates) laser light onto a measurement target, and a receiver that receives the reflected light that is returned from the measurement target after the laser light is reflected. LiDAR outputs information about the measurement target by measuring the distance to the measurement target based on the difference between the timing when the projector emits the laser light and the timing when the receiver receives the reflected light. The projector includes a light source and a projection lens through which the light emitted by the light source passes (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2021-105613 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present inventor has considered using a light source including a light-emitting chip on which a surface light-emitting element is arranged as a light source to be provided in a floodlight. This light source includes a light-emitting chip, a substrate, a conductive joint, and a wire. The light-emitting chip has a first surface electrically connected to the cathode of the surface light-emitting element and a second surface electrically connected to the anode of the surface light-emitting element. A first conductive pattern and a second conductive pattern are formed on the substrate. The joint joins the first surface of the light-emitting chip to the first conductive pattern. The wire electrically connects the second surface of the light-emitting chip to the second conductive pattern.

[0005] In such light sources, there is a risk that the cathode of the surface-emitting element may be shorted to a conductive member, such as a wire or the anode of the surface-emitting element, via a conductive joint.

[0006] This specification discloses a technique that can solve the above-mentioned problems. [Means for solving the problem]

[0007] The technology disclosed in this specification can be realized, for example, in the following forms.

[0008] (1) A light source disclosed in the present specification includes a light-emitting chip having a surface-emitting element disposed thereon, the light-emitting chip having a first surface electrically connected to a cathode of the surface-emitting element and a second surface electrically connected to an anode of the surface-emitting element, a substrate on which a first conductive pattern and a second conductive pattern are formed, a conductive joint that joins the first surface of the light-emitting chip to the first conductive pattern, and a wire that electrically connects the second surface of the light-emitting chip to the second conductive pattern, and the light source includes a non-conductive protective part that is disposed on the outer periphery of the joint and covers at least a portion of the outer periphery of the joint.

[0009] With this light source, compared to a configuration in which a protective portion is not arranged on the outer periphery of the conductive joint, it is possible to prevent the cathode of the surface-emitting element from shorting out to a conductive member, such as the anode of the surface-emitting element, via the joint.

[0010] (2) In the above light source, a connecting portion to which the wire is electrically connected may be provided on the peripheral portion of the second surface of the light emitting chip, and the protective portion may cover the outer peripheral surface of the joint portion on the side of the connecting portion. According to this light source, since the protective portion is interposed between the joint portion and the wire, it is possible to prevent the cathode of the surface light emitting element from being short-circuited to the wire via the joint portion.

[0011] (3) In the light source, the protective portion may cover an entire outer periphery of the joint portion. With this light source, it is possible to effectively prevent the cathode of the surface light emitting element from being short-circuited to the conductive member via the joint portion.

[0012] (4) In the above light source, at least a part of the outer peripheral surface of the joint is located inside the outer edge of the light emitting chip when viewed in a direction perpendicular to the light emitting chip, and the protective part may have a support part sandwiched between the light emitting chip and the substrate. In this light source, the support part of the protective part is interposed in a gap formed between the light emitting chip and the substrate due to the absence of the joint. Therefore, according to this light source, it is possible to suppress damage to the light emitting chip due to the application of a load to the light emitting chip, for example, compared to a configuration in which a support part is not interposed.

[0013] (5) In the above light source, the protective part may be in contact with an outer peripheral surface of the joint, and the area of ​​the exposed surface of the protective part may be larger than the contact area between the protective part and the joint. According to this light source, the protective part is in contact with the outer peripheral surface of the joint that functions as a conductive path. Also, the area of ​​the exposed surface of the protective part is larger than the contact area between the protective part and the joint. Therefore, heat generated at the joint can be effectively released via the protective part.

[0014] (6) A measuring device may be provided that includes a projector including the light source and a light receiver that receives light output from the projector and reflected by a measurement target. With this configuration, it is possible to prevent the cathode of the surface light emitting element from being short-circuited to a conductive member such as the anode of the surface light emitting element via the joint.

[0015] (7) The present specification discloses a method for manufacturing a light source comprising a light-emitting chip on which a surface-emitting element is arranged, the light-emitting chip having a first surface electrically connected to the cathode of the surface-emitting element and a second surface electrically connected to the anode of the surface-emitting element, and a substrate on which a first conductive pattern and a second conductive pattern are formed, the method comprising the steps of: applying a conductive first bonding material between the first surface of the light-emitting chip and the first conductive pattern of the substrate, applying a non-conductive second bonding material to at least a part of the periphery of the first bonding material, electrically connecting the second surface of the light-emitting chip and the second conductive pattern with a wire, and hardening the first bonding material and the second bonding material to form a conductive bonding part formed between the first surface of the light-emitting chip and the substrate, and a protective part covering at least a part of the outer circumferential surface of the bonding part. According to this manufacturing method, a light source can be manufactured while suppressing a short circuit of the cathode of the surface-emitting element to a conductive member such as the anode of the surface-emitting element through the bonding part.

[0016] (8) The light source disclosed in the present specification includes a light-emitting chip on which a surface-emitting element is arranged, the light-emitting chip having a first surface electrically connected to the cathode of the surface-emitting element and a second surface electrically connected to the anode of the surface-emitting element, a substrate on which a first conductive pattern and a second conductive pattern are formed, a conductive joint that joins the first surface of the light-emitting chip to the first conductive pattern, and a wire that electrically connects the second surface of the light-emitting chip to the second conductive pattern, wherein, as viewed in a first direction perpendicular to the light-emitting chip, at least a part of the outer circumferential surface of the joint is located inside the outer edge of the light-emitting chip, and a connection part between the wire and the second surface is located inside the outer circumferential surface of the joint. According to this light source, for example, compared to a configuration in which the joint part between the wire and the light-emitting chip is located outside the outer circumferential surface of the joint, it is possible to suppress damage to the light-emitting chip due to, for example, application of a load to the connection part of the light-emitting chip.

[0017] (9) In the above light source, when viewed in the first direction, the periphery of the light emitting region of the light emitting chip may be located inside the outer circumferential surface of the joint, and an imaginary line connecting the periphery of the light emitting region and the outer circumferential surface of the joint may be inclined at an angle of 45 degrees or more with respect to the first direction. With this light source, heat generated in the light emitting region can be effectively released to the outside by the joint.

[0018] The techniques disclosed in this specification can be realized in various forms, for example, in the form of a light source, a measuring device including the light source, a method for manufacturing a light source, and the like. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a block diagram showing a schematic configuration of a measurement device 10 according to a first embodiment. [Diagram 2] FIG. 1 is an explanatory diagram showing the top configuration of a light source 22. [Diagram 3] FIG. 3 is an explanatory diagram showing a cross-sectional configuration of the light source 22 taken along the line III-III in FIG. 2; [Figure 4]1 is a flowchart showing a part of a manufacturing process of the light source 22. [Diagram 5] FIG. 13 is an explanatory diagram showing a top view configuration of a light source 22a in the second embodiment. [Figure 6] FIG. 6 is an explanatory diagram showing a cross-sectional configuration of the light source 22 taken along the line VI-VI in FIG. 5; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] A. First embodiment: A-1. Configuration of the measuring device 10: FIG. 1 is a block diagram showing a schematic configuration of a measuring device 10 in the first embodiment. As shown in FIG. 1, the measuring device 10 includes a projector 20 that irradiates an emitted light L1 (e.g., a light beam (laser light)) onto a measuring object W, and a receiver 30 that receives reflected light L2 (return light) that is reflected from the measuring object W and returns from the measuring object W, and functions as a flash LiDAR. The measuring device 10 measures the difference between the timing at which the projector 20 emits the emitted light L1 and the timing at which the receiver 30 receives the reflected light L2 (time of flight of the laser light, hereinafter referred to as "TOF" (Time of Flight)) to acquire information about the measuring object W.

[0021] The measuring device 10 is mounted on, for example, a vehicle (not shown) equipped with AD or ADAS. For example, while the vehicle is traveling, the measuring device 10 assists in the detection of objects such as people and other vehicles, and provides various types of information to other devices and users that are useful for ensuring the safety of the driver of the vehicle and those around the vehicle, and for reducing damage to surrounding objects while the vehicle is being driven.

[0022] The light projector 20 includes a light source 22, a light projecting optical system 24, a light projecting control device 26, and a current source 28.

[0023] The light source 22 includes a light emitting source having one or more light emitting elements (not shown), or one or more light emitting element arrays (e.g., light emitting elements arranged in a line (one-dimensional) or planar (two-dimensional)). As described below, in this embodiment, the light emitting elements are planar light emitting elements 110. The configuration of the light source 22 will be described later.

[0024] The current source 28 supplies a current corresponding to a control signal input from the light projection control device 26 to the light emitting element constituting the light source 22. The current source 28 supplies, for example, a periodic square wave current to the light emitting element for turning on and off the current flowing through the light emitting element.

[0025] The light-projection control device 26 generates a control signal for the current source 28 and inputs it to the current source 28, thereby controlling the current (drive current) supplied from the current source 28 to the light-emitting element. The light-projection control device 26 inputs a signal indicating the timing at which the light-emitting element emits light (the timing at which the light-emitting element emits light; hereinafter, referred to as "light-projection timing") to the TOF measurement device 40. The light-projection control device 26 periodically and repeatedly controls the on-off of a current flowing through the light-emitting element, for example, thereby causing the light-emitting element to periodically and repeatedly emit light.

[0026] The light projection optical system 24 adjusts the light distribution of the emitted light L1, for example, by applying an optical effect (such as refraction, scattering, or diffraction) to the light emitted by the light source 22. The light projection optical system 24 is configured using optical components, for example, various lenses such as a collimator lens, a reflector (mirror), and the like.

[0027] The light receiver 30 includes a light receiving section 32 and a light receiving optical system 34 .

[0028] The light receiving optical system 34 collects reflected light L2, which is light emitted from the projector 20 and reflected by the measurement target W or the like and returns, onto the light receiving unit 32. The light receiving optical system 34 is configured using optical components, such as various lenses such as a collecting lens, various filters such as a wavelength filter, and a reflecting mirror (mirror).

[0029] The light receiving unit 32 is a receiving light source having one or more light receiving elements (not shown), or one or more light receiving element arrays (for example, light receiving elements arranged linearly (one-dimensionally) or planarly (two-dimensionally)). The light receiving elements are, for example, photodiodes, SPADs (Single Photon Avalanche Diodes), balanced photodetectors, etc. The light receiving unit 32 photoelectrically converts the reflected light L2 incident from the light receiving optical system 34 to generate a current (hereinafter referred to as a "received light current") according to the intensity of the reflected light L2. The light receiving unit 32 inputs to the TOF measurement device 40 a signal indicating the timing (hereinafter referred to as a "received light timing") at which the light receiving elements constituting the light receiving unit 32 receive the reflected light L2, and the received light current generated by the light receiving elements.

[0030] The measurement apparatus 10 further includes a TOF measurement device 40, a controller 42, and a communication I / F (Interface) 50.

[0031] The TOF measurement device 40 obtains the TOF based on a signal indicating the light projection timing input from the light projection control device 26 and a signal indicating the light reception timing input from the light receiving unit 32. The TOF measurement device 40 has, for example, a time measurement IC (Integrated Circuit) equipped with a TDC (Time to Digital Converter) circuit. The TOF measurement device 40 inputs the obtained TOF and the light reception current input from the light receiving unit 32 to the controller 42.

[0032] The controller 42 has a processor (such as a central processing unit (CPU), a micro processing unit (MPU), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), and a digital signal processor (DSP)). The controller 42 generates information used for various measurements such as detection and distance measurement of the measurement target W based on the light receiving current and TOF input from the TOF measurement device 40. The information is, for example, a histogram used in time correlated single photon counting, a distance to each point of the measurement target W, a point cloud (point cloud information), and the like. The controller 42 also controls the light projection control device 26 and the light receiving unit 32. The controller 42 controls, for example, the light projection timing and the light receiving timing so that the process for generating the histogram is accelerated or optimized by controlling the light projection control device 26 and the light receiving unit 32. The information generated by the controller 42 is provided (transmitted) via the communication I / F 50 to a device that uses the information (hereinafter, referred to as "various use devices 60").

[0033] The various utilization devices 60 perform, for example, creating an environmental map using a point cloud, self-position estimation (SLAM (Simultaneous Localization and Mapping)) using a scan matching algorithm (NDT (Normal Distributions Transform), ICP (Iterative Closest Point), etc.), and the like.

[0034] A-2. Configuration of light source 22: FIG. 2 is an explanatory diagram showing the top configuration of the light source 22, and FIG. 3 is an explanatory diagram showing the cross-sectional configuration of the light source 22 at the position of III-III in FIG. 2. FIG. 2 and FIG. 3 show mutually orthogonal XYZ axes for specifying directions. In this specification, for convenience, the positive direction of the Z axis is referred to as the upward direction, the negative direction of the Z axis is referred to as the downward direction, the positive direction of the X axis is referred to as the rightward direction, the negative direction of the X axis is referred to as the leftward direction, the positive direction of the Y axis is referred to as the forward direction, and the negative direction of the Y axis is referred to as the backward direction. The same applies to FIG. 5 and subsequent figures described later.

[0035] As shown in FIGS. 2 and 3, the light source 22 includes a light emitting chip 100, a substrate 200, a conductive joint 300, and a wire 250. The light emitting chip 100 includes a light emitting chip 100, a substrate 200, a conductive joint 300, and a wire 250.

[0036] The light-emitting chip 100 is a surface-emitting device array in which a plurality of surface-emitting devices 110 are two-dimensionally arranged on a substrate (such as a semiconductor substrate or a ceramic substrate). The surface-emitting device 110 is a surface-emitting type laser light-emitting device, such as a VCSEL (Vertical Cavity Surface Emitting Laser). In other words, the light-emitting chip 100 is a VCSEL array in which a plurality of VCSELs are arranged. By using the surface-emitting device array as the light source of the floodlight 20, it is possible to realize a floodlight 20 that is space-saving and capable of reliable high-speed beam scanning.

[0037] The upper surface 101 of the light-emitting chip 100 includes a light-emitting region 103 and a pair of connection regions 105. The upper surface 101 is an example of a second surface. The light-emitting region 103 is an area in which a plurality of surface light-emitting elements 110 are arranged, and is an area in which light is emitted by the plurality of surface light-emitting elements 110. The light-emitting region 103 is located in the center of the upper surface 101 in the left-right direction. The pair of connection regions 105 are arranged at both ends of the upper surface 101 in the left-right direction. Each connection region 105 is electrically connected to the anodes of the plurality of surface light-emitting elements 110. The lower surface 102 of the light-emitting chip 100 is electrically connected to the cathodes of the plurality of surface light-emitting elements 110. The lower surface 102 is an example of a first surface.

[0038] A first conductive pattern 210 and a pair of second conductive patterns 220 are formed on the substrate 200. The first conductive pattern 210 is disposed in the center of the substrate 200 in the left-right direction. The pair of second conductive patterns 220 are disposed at both ends of the substrate 200 in the left-right direction.

[0039] The joint 300 is a conductive joint and is made of a conductive material. The conductive material may be, for example, a metal (sintered silver, gold-tin (Au-Sn) solder, tin-silver-copper (Sn-Ag-Cu) solder, etc.) or a resin containing a metal (for example, silver) filler.

[0040] The bonding portion 300 bonds the light emitting chip 100 and the first conductive pattern 210 of the substrate 200, and electrically connects the lower surface 102 of the light emitting chip 100 and the first conductive pattern 210. Specifically, the upper surface of the bonding portion 300 is bonded to the lower surface 102 of the light emitting chip 100 in surface contact. The lower surface of the bonding portion 300 is bonded to the upper surface of the first conductive pattern 210 in surface contact. As a result, the cathodes of the multiple surface light emitting elements 110 are electrically connected to the first conductive pattern 210 via the bonding portion 300.

[0041] The wire 250 electrically connects the connection region 105 of the light emitting chip 100 and the second conductive pattern 220 on the substrate 200. One end of the wire 250 is joined to the connection region 105 of the light emitting chip 100, and the other end of the wire 250 is joined to the second conductive pattern 220. In this embodiment, the left connection region 105 and the left second conductive pattern 220 are electrically connected by a plurality of wires 250 arranged at intervals in the front-rear direction. In addition, the right connection region 105 and the right second conductive pattern 220 are electrically connected by a plurality of wires 250 arranged at intervals in the front-rear direction. The wire 250 is made of, for example, gold.

[0042] A-3. Structure for suppressing short circuit between the cathode of the surface light emitting element 110 and the conductive member: In this embodiment, the light source 22 has a configuration for suppressing the cathode of the surface light emitting element 110 from being short-circuited to the conductive member via the joint 300. The conductive member is, for example, the wire 250, the second conductive pattern 220, or another conductive member located around the light emitting chip 100.

[0043] Specifically, the light source 22 has a protective portion 310. The protective portion 310 is a joint having non-conductivity, and is made of a non-conductive material. The non-conductive material is, for example, a resin. In addition, the non-conductive material may be a material having a higher thermal conductivity than resin (for example, aluminum oxide (Al 2 O 3 Alternatively, a mixed material may be used in which a filler made of a ceramic material such as aluminum nitride (AlN) or the like is mixed with a resin.

[0044] The protective portion 310 covers the entire outer circumferential surface S1 of the joint portion 300. In other words, the entire outer circumferential surface S1 of the joint portion 300 is not exposed to the outside.

[0045] The protective portion 310 has a support portion 312 and a protrusion 314 .

[0046] The support portion 312 is a portion of the protective portion 310 that is sandwiched between the light emitting chip 100 and the first conductive pattern 210 (substrate 200). Specifically, in this embodiment, the contour line of the joint portion 300 is located inside the contour line of the light emitting chip 100 over the entire circumference when viewed in the up-down direction (see FIG. 2). Therefore, the peripheral portion of the lower surface 102 of the light emitting chip 100 is spaced apart from the first conductive pattern 210 in the up-down direction. The support portion 312 of the protective portion 310 is disposed in a gap between the peripheral portion of the lower surface 102 of the light emitting chip 100 and the first conductive pattern 210. The upper surface of the support portion 312 is in contact with the peripheral portion of the lower surface 102 of the light emitting chip 100, and the lower surface of the support portion 312 is in contact with the first conductive pattern 210. In this manner, the support portion 312 supports the peripheral portion of the lower surface 102 of the light emitting chip 100. The supporting portion 312 is disposed around the entire circumference of the joint portion 300. Moreover, the supporting portion 312 is in contact with the outer circumferential surface S1 of the joint portion 300 over the entire circumference. The vertical view is an example of a view in a direction perpendicular to the light emitting chip.

[0047] The protruding portion 314 is a portion of the protective portion 310 that protrudes outward beyond the light emitting chip 100 when viewed in the up-down direction. The area of ​​the exposed surface S2 of the protruding portion 314 is larger than the contact area (area of ​​the outer peripheral surface S1) between the joint portion 300 (support portion 312) and the joint portion 300. Specifically, the protruding portion 314 covers the entire outer peripheral surface S1 of the light emitting chip 100. Therefore, the peripheral portion of the light emitting chip 100 is protected by the protruding portion 314. The exposed surface S2 of the protruding portion 314 is a tapered surface that is inclined so as to widen toward the outer peripheral side as it approaches the substrate 200. In this manner, the exposed surface S2 of the protruding portion 314 is widely secured, and therefore the heat dissipation by the protective portion 310 is high.

[0048] A-4. Manufacturing method of light source 22: Fig. 4 is a flowchart showing a part of the manufacturing process of the light source 22. As shown in Fig. 4, a substrate 200 having a first conductive pattern 210 and a second conductive pattern 220 formed thereon is prepared (S110).

[0049] Next, a first bonding material is applied between the lower surface 102 of the light emitting chip 100 and the first conductive pattern 210 of the substrate 200, and a second bonding material is applied around the first bonding material (S120). The first bonding material is made of a bonding material having electrical conductivity (e.g., an adhesive resin paste containing a conductive material, or solder), and forms the bonding portion 300 when hardened. The second bonding material is made of a bonding material having no electrical conductivity (e.g., an adhesive resin paste not containing a conductive material), and forms the protective portion 310 when hardened.

[0050] For example, the light emitting chip 100 and the first conductive pattern 210 may be soldered with a first bonding material, which is solder, and then the second bonding material may be applied around the first bonding material. Alternatively, the first bonding material and the second bonding material having adhesive properties may be applied on the first conductive pattern 210, and then the light emitting chip 100 may be placed on the first bonding material and the second bonding material. The order of application of the first conductive pattern 210 may be either the first bonding material or the second bonding material. By disposing the second bonding material around the first bonding material, it is possible to prevent the first bonding material from protruding outward from the light emitting chip 100 or creeping up to the outer peripheral surface side of the light emitting chip 100.

[0051] Next, the first bonding material and the second bonding material are hardened to form a conductive bonding portion 300 between the lower surface 102 of the light-emitting chip 100 and the substrate 200 (first conductive pattern 210), and a protective portion 310 covering the outer peripheral surface S1 of the bonding portion 300 (S130).

[0052] Next, the upper surface 101 (connection region 105) of the light emitting chip 100 and the second conductive pattern 220 are electrically connected by the wire 250 (S140). If the second bonding material having non-conductivity (the protective portion 310 in the case of hardening) does not exist around the first bonding material having conductivity (the bonding portion 300 in the case of hardening), the wire 250 may come into contact with the first bonding material and short-circuit when the wire 250 is connected. However, in this embodiment, the second bonding material is disposed around the first bonding material, and the connection region 105 side of the outer peripheral surface S1 of the first bonding material is not exposed to the outside. Therefore, it is possible to suppress a short circuit between the wire 250 and the first bonding material when the wire 250 is connected. At least one of the first bonding material and the second bonding material may be hardened before the above-mentioned step S140, after the step S140, or during the step S140. Thereafter, a predetermined post-processing is performed, and the manufacturing of the light source 22 is completed.

[0053] A-5. Advantages of this embodiment: As described above, in the light source 22 of this embodiment, the non-conductive protective section 310 covers the outer peripheral surface S1 of the conductive joint 300 (see Figs. 2 and 3). Therefore, compared to a configuration in which the protective section 310 is not arranged on the outer peripheral side of the joint 300, it is possible to suppress the cathode of the surface light emitting element 110 from shorting to a conductive member, such as the anode of the surface light emitting element 110, via the joint 300. Moreover, in this embodiment, the protective section 310 covers the entire outer peripheral surface S1 of the joint 300. Therefore, it is possible to effectively suppress the cathode of the surface light emitting element 110 from shorting to a conductive member via the joint 300.

[0054] 3, if the support portion 312 is not present, the peripheral portion of the lower surface 102 of the light-emitting chip 100 is suspended in mid-air from the substrate 200. As a result, when a load is applied to the peripheral portion of the light-emitting chip 100, the light-emitting chip 100 is easily damaged. In contrast, in this embodiment, the protective portion 310 has the support portion 312 sandwiched between the light-emitting chip 100 and the first conductive pattern 210 (substrate 200). As a result, according to this embodiment, damage to the light-emitting chip 100 due to application of a load to the light-emitting chip 100 can be suppressed, for example, compared to a configuration in which the support portion 312 is not present.

[0055] In this embodiment, the protective part 310 is in contact with the outer peripheral surface S1 of the joint 300 which functions as a conductive path. The area of ​​the exposed surface S2 of the protruding part 314 is larger than the contact area between the joint 300 and the protective part 310 (the area of ​​the outer peripheral surface S1). As a result, according to this embodiment, heat generated at the joint 300 can be effectively released via the protective part 310.

[0056] B. Second embodiment: Fig. 5 is an explanatory diagram showing the top configuration of a light source 22a in the second embodiment, and Fig. 6 is an explanatory diagram showing the cross-sectional configuration of the light source 22 at the position VI-VI in Fig. 5. In the following, among the configurations of the measurement device 10 of the second embodiment, the description of the same configurations as those of the measurement device 10 of the above-mentioned first embodiment will be omitted as appropriate.

[0057] B-1. Structure for suppressing short circuit between the cathode of the surface light emitting element 110 and the conductive member: In the second embodiment, the light source 22a has a different configuration from the light source 22 in the first embodiment. Specifically, the light source 22a is different in that the light source 22 does not include a protective portion 310. However, in the second embodiment, the light source 22a also has a configuration for suppressing the cathode of the surface light emitting element 110 from being short-circuited to the conductive member via the joint portion 300.

[0058] The light source 22a further satisfies the following first condition. <First condition> When viewed from the top to bottom, the outer surface S1 of the joint 300 is located inside the outer edge of the light-emitting chip 100 (see Figure 5), and the connection portion 252 between the wire 250 and the upper surface 101 (connection area 105) of the light-emitting chip 100 is located inside the outer surface S1 of the joint 300. 6, a first distance D1 from the central axis C of the light-emitting chip 100 to the outer peripheral surface S1 of the joint portion 300 is shorter than a second distance D2 from the central axis C to the outer peripheral surface of the light-emitting chip 100. In addition, a third distance D3 from the central axis C to the connection portion 252 is shorter than the first distance D1.

[0059] The light source 22a further satisfies the following second condition. <Second condition> When viewed from the vertical direction, the periphery of the light-emitting region 103 of the light-emitting chip 100 is located inside the outer peripheral surface S1 of the joint 300, and the inclination angle θ of the virtual straight line L connecting the periphery of the light-emitting region 103 and the outer peripheral surface S1 of the joint 300 with respect to the vertical direction is 45 degrees or more. 6, a fourth distance D4 from the central axis C to the periphery of the light emitting area 103 is shorter than the first distance D1. The inclination angle θ of the virtual straight line L with respect to the central axis C is 45 degrees or more.

[0060] B-2. Effects of this embodiment: As described above, in the light source 22a of the present embodiment, the outer peripheral surface S1 of the joint 300 is located inside the outer edge of the light emitting chip 100 when viewed in the vertical direction (see FIG. 5, first condition). Therefore, compared to a configuration in which the joint 300 protrudes outside the light emitting chip 100, for example, it is possible to suppress a short circuit between the cathode of the surface light emitting element 110 and the conductive member via the joint 300. Moreover, in the present embodiment, the outer edge of the first conductive pattern 210 is also located inside the outer edge of the light emitting chip 100 when viewed in the vertical direction (see FIG. 6).

[0061] In this embodiment, the connection portion 252 between the wire 250 and the upper surface 101 of the light emitting chip 100 is located inside the outer circumferential surface S1 of the joint portion 300 (first condition). According to this embodiment, for example, compared to a configuration in which the connection portion 252 is located outside the outer circumferential surface S1 of the joint portion 300, it is possible to suppress damage to the light emitting chip 100 due to application of a load to the connection portion 252 of the light emitting chip 100.

[0062] In this embodiment, the periphery of the light-emitting region 103 of the light-emitting chip 100 is located inside the outer peripheral surface S1 of the joint 300, and the inclination angle θ of the virtual straight line L connecting the periphery of the light-emitting region 103 and the outer peripheral surface S1 of the joint 300 with respect to the up-down direction is 45 degrees or more (second condition). The radiation angle at which the heat generated in the light-emitting region 103 diffuses toward the lower surface 102 of the light-emitting chip 100 is 45 degrees or less with respect to the central axis C. Therefore, according to this embodiment, the heat generated in the light-emitting region 103 can be more effectively released to the outside by the joint 300 than in a configuration in which the inclination angle θ is less than 45 degrees, for example.

[0063] C. Variations: The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0064] The configurations of the measuring device 10 and the light sources 22, 22a in the above embodiment are merely examples and can be modified in various ways. For example, in the above embodiment, the light sources 22, 22a in which a plurality of surface light emitting elements 110 are arranged are exemplified as the light sources, but the light source may be configured to have one surface light emitting element.

[0065] In the above embodiment, a pair of connection regions 105 arranged on the left and right sides are arranged on the upper surface 101 of the light-emitting chip 100, but a configuration in which the connection region 105 is arranged on only one of the left and right sides may be used. In addition, in the above embodiment, a pair of second conductive patterns 220 are formed on the substrate 200, but a configuration in which only one of the pair of second conductive patterns 220 is arranged may be used. In the above embodiment, the connection region 105 and the second conductive pattern 220 are electrically connected by multiple wires 250, but the connection region 105 and the second conductive pattern 220 may be electrically connected by one wire 250.

[0066] In the first embodiment, the protective unit 310 has a bonding function for bonding the light emitting chip 100 and the substrate 200 (the first conductive pattern 210), but may not have the bonding function. For example, the protective unit 310 may be fixedly disposed on the substrate 200 and not bonded to the light emitting chip 100. In this configuration, the protective unit 310 is preferably in contact with the light emitting chip 100, but may be configured not to be in contact with the light emitting chip 100 and to cover only a lower portion of the outer circumferential surface S1 of the bonding unit 300. If the protective unit 310 covers even a part of the outer circumferential surface S1 of the bonding unit 300, it is possible to prevent the cathode of the surface light emitting element 110 from being short-circuited to a conductive member such as the wire 250 via the bonding unit 300.

[0067] In the above first embodiment, the protective part 310 covers the entire outer circumferential surface S1 of the joint part 300, but the protective part 310 may cover at least a part of the outer circumferential surface S1 of the joint part 300. For example, the protective part 310 may be configured to cover only the connection region 105 side of the outer circumferential surface S1 of the joint part 300. This makes it possible to effectively prevent the cathode of the surface light emitting element 110 from being short-circuited to the wire 250 via the joint part 300.

[0068] In the first embodiment, at least a part of the contour of the joint portion 300 may be located outside the contour of the light-emitting chip 100 when viewed in the up-down direction. In addition, in the first embodiment, the protection portion 310 may be configured to not have either the support portion 312 or the protrusion 314. In addition, at least one of the support portion 312 and the protrusion 314 may be disposed only in a part of the periphery of the joint portion 300.

[0069] In the first embodiment, the protective portion 310 may not be in contact with the joint 300. However, if the protective portion 310 is in contact with the joint 300, it is possible to improve the heat dissipation property of dissipating heat generated in the joint 300 by energization to the outside via the protective portion 310. In the first embodiment, the area of ​​the exposed surface S2 of the protruding portion 314 may be equal to or smaller than the contact area between the joint 300 and the joint 300. Moreover, the exposed surface S2 of the protruding portion 314 is not limited to a tapered surface, and may be a flat surface along the up-down direction or a curved surface.

[0070] In the second embodiment, either one of the first condition and the second condition may not be satisfied. In addition, the outer edge of the first conductive pattern 210 may be located outside the outer edge of the light emitting chip 100 when viewed in the up-down direction.

[0071] In the above embodiment, the materials used to form the components are merely examples, and the components may be formed from other materials. [Explanation of symbols]

[0072] 10: Measuring device 20: Light projector 22, 22a: Light source 24: Light projection optical system 26: Light projection control device 28: Current source 30: Light receiver 32: Light receiving section 34: Light receiving optical system 40: TOF measuring device 42: Controller 50: Communication I / F 60: Utilization device 100: Light emitting chip 101: Upper surface 102: Lower surface 103: Light emitting area 105: Connection area 110: Surface light emitting element 200: Substrate 210: First conductive pattern 220: Second conductive pattern 250: Wire 252: Connection section 300: Joint section 310: Protective section 312: Support section 314: Protrusion C: Central axis L1: Emitted light L2: Reflected light L: Virtual straight line S1: Outer periphery S2: Exposed surface W: Measurement object

Claims

1. a light-emitting chip on which a surface light-emitting element is disposed, the light-emitting chip having a first surface electrically connected to a cathode of the surface light-emitting element and a second surface electrically connected to an anode of the surface light-emitting element; a substrate on which a first conductive pattern and a second conductive pattern are formed; a conductive joint portion that joins the first surface of the light emitting chip and the first conductive pattern; a wire electrically connecting the second surface of the light emitting chip and the second conductive pattern, A light source comprising a non-conductive protective portion disposed on an outer circumferential side of the joint portion and covering at least a portion of the outer circumferential surface of the joint portion.

2. 2. The light source of claim 1, a connection portion to which the wire is electrically connected is provided on a peripheral portion of the second surface of the light emitting chip; The protective portion covers an outer peripheral surface of the joint portion on the connection portion side.

3. 2. The light source of claim 1, The protective portion covers the entire outer periphery of the joint portion.

4. A light source according to any one of claims 1 to 3, When viewed in a direction perpendicular to the light emitting chip, at least a part of an outer circumferential surface of the joint portion is located inside an outer edge of the light emitting chip, The protection portion has a support portion sandwiched between the light emitting chip and the substrate.

5. A light source according to any one of claims 1 to 3, A light source, wherein the protective portion is in contact with an outer peripheral surface of the joint portion, and an area of ​​an exposed surface of the protective portion is larger than an area of ​​contact between the protective portion and the joint portion.

6. A floodlight comprising the light source according to any one of claims 1 to 3; and a light receiver that receives the light output from the light projector and reflected by the object to be measured. Measuring equipment.

7. A method for manufacturing a light source comprising: a light-emitting chip having a surface light-emitting element disposed thereon, the light-emitting chip having a first surface electrically connected to a cathode of the surface light-emitting element and a second surface electrically connected to an anode of the surface light-emitting element; and a substrate on which a first conductive pattern and a second conductive pattern are formed, the method comprising the steps of: applying a conductive first bonding material between the first surface of the light emitting chip and the first conductive pattern of the substrate, and applying a non-conductive second bonding material to at least a portion of a periphery of the first bonding material; electrically connecting the second surface of the light emitting chip and the second conductive pattern by a wire; hardening the first bonding material and the second bonding material to form a conductive bonding portion between the first surface of the light emitting chip and the substrate, and a protective portion covering at least a part of an outer circumferential surface of the bonding portion; A method for manufacturing a light source comprising:

8. a light-emitting chip on which a surface light-emitting element is disposed, the light-emitting chip having a first surface electrically connected to a cathode of the surface light-emitting element and a second surface electrically connected to an anode of the surface light-emitting element; a substrate on which a first conductive pattern and a second conductive pattern are formed; a conductive joint portion that joins the first surface of the light emitting chip and the first conductive pattern; a wire electrically connecting the second surface of the light emitting chip and the second conductive pattern, When viewed in a first direction perpendicular to the light emitting chip, at least a part of an outer circumferential surface of the joint portion is located inside an outer edge of the light emitting chip, A light source, wherein a connection portion between the wire and the second surface is located inside an outer circumferential surface of the joint portion.

9. 9. The light source of claim 8, When viewed in the first direction, a periphery of a light emitting region of the light emitting chip is located inside an outer circumferential surface of the joint portion, A light source, wherein an imaginary line connecting a periphery of the light-emitting region and an outer peripheral surface of the joint is inclined at an angle of 45 degrees or more with respect to the first direction.

Images