Electronic circuit device and circuit-integrated motor

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By incorporating a heat sink that protrudes into the substrate's penetrating hole and uses a heat dissipation material, the electronic circuit device achieves improved thermal management with reduced thermal resistance and part count.

JP2025014266APending Publication Date: 2025-01-30MIKUNI CORP

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Patent Information

Application Number: JP2023116696
Authority / Receiving Office: JP · JP
Patent Type: Applications
Current Assignee / Owner
Filing Date: 2023-07-18
Publication Date: 2025-01-30

AI Technical Summary

Technical Problem

Existing heat dissipation structures in electronic circuit devices face challenges such as insufficient heat dissipation performance due to limited sectional area of heat vias, high processing costs, and increased part count, which hinder effective thermal management.

Method used

The configuration involves a semiconductor device with a heat sink protruding into a penetrating hole of the substrate, utilizing a heat dissipation material between the semiconductor device and the heat sink's convex portion to reduce thermal resistance and improve heat dissipation.

Benefits of technology

This configuration enhances heat dissipation performance by reducing thermal resistance and simplifying the structure while minimizing the number of parts and processing costs.

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Abstract

To provide an electronic circuit device and a circuit-integrated motor that have a simple structure that reduces the number of parts and processing costs and that can improve heat dissipation performance.SOLUTION: An electronic circuit device 1 includes at least one semiconductor device 10, a substrate 20 on which the semiconductor device 10 is mounted and which has a through-hole 24 in a position facing a back surface 17 of the semiconductor device 10, a heat sink 30 that is located on the opposite side of the semiconductor device 10 across the substrate 20 and has at least one protrusion 32 that protrudes toward the back surface 17 of the semiconductor device 10 so as to penetrate the through hole 24 of the substrate 20, and a heat-dissipating material 40 that is provided between at least the back surface 17 of the semiconductor device 10 and a top surface 33 of the protrusion 32 of the heat sink 30.SELECTED DRAWING: Figure 1A

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Description

[Technical field]

[0001] The present disclosure relates to an electronic circuit device and a circuit-integrated motor. [Background technology]

[0002] 2. Description of the Related Art Conventionally, in electronic circuit devices in which semiconductor devices are mounted on a substrate, attempts have been made to promote heat dissipation from the semiconductor devices as heat generating elements.

[0003] For example, Patent Document 1 describes a heat dissipation structure for an on-vehicle electronic control device in which heat generated by a semiconductor is thermally conducted from a heat spreader to a base via heat vias. Patent document 2 describes an electronic device in which a heat dissipation member is inserted into a through hole provided in an insulating substrate, and a protruding portion of the heat dissipation member that protrudes on the side opposite the semiconductor across the insulating substrate is joined to a housing via a thermally conductive member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2015 / 072294 [Patent Document 2] Patent Publication No. 2013-123011 Summary of the Invention [Problem to be solved by the invention]

[0005] The heat dissipation structure described in Patent Document 1 has room for improvement because it is not possible to obtain sufficient heat dissipation performance when the cross-sectional area of the heat vias cannot be secured. In addition, the processing costs for forming the heat vias in the substrate are high. In the electronic device described in Patent Document 2, the number of components increases because a heat dissipation member is provided separately from the housing. In addition, the component bonding material provided between the heat sink on the back surface of the electronic component and the heat dissipation member, and the thermal conductive material provided between the heat dissipation member and the housing, create heat transfer resistance and hinder improvement of heat dissipation performance.

[0006] In view of the above circumstances, at least some embodiments of the present invention aim to provide an electronic circuit device and a circuit-integrated motor that can improve heat dissipation performance with a simple configuration that has a small number of parts and reduces processing costs. [Means for solving the problem]

[0007] In accordance with at least some embodiments of the present invention, an electronic circuit device includes: at least one semiconductor device; a substrate on which a semiconductor device is mounted and which has a through hole at a position facing a back surface of the semiconductor device; a heat sink located on the opposite side of the semiconductor device across the substrate and having at least one protrusion protruding toward a rear surface of the semiconductor device so as to enter the through hole of the substrate; a heat dissipation material provided at least between a rear surface of the semiconductor device and a top surface of the protrusion of the heat sink; Equipped with. Effect of the Invention

[0008] According to at least some embodiments of the present invention, by inserting the convex portion of the heat sink into the through hole of the substrate, the top surface of the convex portion, which is the heat receiving surface of the heat sink, comes close to the back surface of the semiconductor device. Therefore, with the simple configuration of inserting the convex portion of the heat sink into the through hole of the substrate, it is possible to reduce the heat transfer resistance in the heat transfer path from the semiconductor device to the heat sink and improve the heat dissipation performance. [Brief description of the drawings]

[0009] [Figure 1A] 1 is a schematic cross-sectional view of an electronic circuit device according to an embodiment. [Figure 1B] FIG. 11 is a schematic cross-sectional view of an electronic circuit device according to another embodiment. [Figure 2A] 1 is a perspective view showing an electronic circuit device according to an embodiment of the present invention; [Figure 2B] FIG. 13 is a perspective view illustrating an electronic circuit device according to another embodiment. [Figure 3A] 1 is a schematic plan view of an electronic circuit device according to an embodiment; [Figure 3B] FIG. 13 is a schematic plan view of an electronic circuit device according to another embodiment. [Figure 4A] 1C is a perspective view showing a specific example of a protrusion of the heat sink of the electronic circuit device shown in FIG. 1B. [Figure 4B] 1C is a perspective view showing another specific example of a protrusion of the heat sink of the electronic circuit device shown in FIG. 1B. [Diagram 5] 1 is a cross-sectional view showing a schematic overall configuration of a circuit-integrated motor according to an embodiment; [Figure 6] FIG. 2 is a perspective view showing a specific example of the configuration of the periphery of an electronic circuit device of a circuit-integrated motor. [Figure 7] 7 is a perspective view showing a specific example of the configuration of the periphery of an electronic circuit device of a circuit-integrated motor, in which the board is omitted from FIG. 6. FIG. [Figure 8] 1 is a schematic plan view of an electronic circuit device according to an embodiment; [Figure 9] FIG. 13 is a schematic plan view of an electronic circuit device according to another embodiment. [Figure 10] FIG. 13 is a schematic plan view of an electronic circuit device according to yet another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, some embodiments of the present invention will be described with reference to the accompanying drawings. However, the dimensions, materials, shapes, relative arrangements, etc. of components described as the embodiments or shown in the drawings are merely illustrative examples and are not intended to limit the scope of the present invention.

[0011] Hereinafter, electronic circuit devices according to several embodiments will be described with reference to the drawings. The electronic circuit devices described below may be electronic control devices for controlling motors for vehicles. Specific examples of motors for vehicles include a motor for driving a radiator fan and a motor for driving a vacuum pump.

[0012] FIG. 1A is a schematic cross-sectional view of an electronic circuit device according to an embodiment. FIG. 1B is a schematic cross-sectional view of an electronic circuit device according to another embodiment. FIG. 2A is a schematic perspective view of an electronic circuit device according to an embodiment. FIG. 2B is a schematic perspective view of an electronic circuit device according to another embodiment. In FIGS. 2A and 2B, a package of a semiconductor device is shown by imaginary lines. FIG. 3A is a schematic plan view of an electronic circuit device according to an embodiment. FIG. 3B is a schematic plan view of an electronic circuit device according to another embodiment. In FIGS. 3A and 3B, a heat dissipation material is omitted in order to show the relationship between a through hole, a protrusion, and a semiconductor device. FIGS. 4A and 4B are perspective views showing specific examples of protrusions of a heat sink of the electronic circuit device shown in FIG. 1B, respectively. In the following description, electronic circuit devices according to several embodiments, including at least one of the electronic circuit devices 1A to 1F illustrated in Figures 1A, 1B, 2A, 2B, 3A, and 3B, will be collectively referred to as electronic circuit device 1.

[0013] In some embodiments, as shown in Figures 1A to 3B, an electronic circuit device 1 includes at least one semiconductor device 10, a substrate 20 on which the semiconductor device 10 is mounted, and a heat sink 30 and a heat dissipation material 40 that form a path (heat dissipation path) for dissipating heat generated in the semiconductor device 10 to the outside.

[0014] The semiconductor device 10 includes a semiconductor chip 12 and a package 13 that covers the semiconductor chip 12 . The semiconductor device 10 has a package 13 in a form that corresponds to the manner in which it is mounted on the substrate 20. In some embodiments, as shown in Figures 1A to 3B, the package 13 is a surface mount technology (SMT) type package that includes terminals 14 that are electrically connected to electrodes 22 provided on the surface of the substrate 20. In other embodiments, the package 13 is an insertion mount technology (IMT) type package in which pins (leads) that are inserted into and joined to through holes provided in the substrate 20 protrude from the package 13.

[0015] The specific configuration of the package of the semiconductor device 10 is not particularly limited, but in order to effectively utilize the heat dissipation performance that utilizes the protrusions 32 of the heat sink 30 described later, it is desirable to adopt a configuration in which terminals are provided on the outer periphery (side surface) of the package 13 (DIP, SOP, SOJ, SON, QFP, QFJ, QFN, etc.) rather than a configuration in which a large number of terminals are arranged in a grid pattern on the back surface of the package 13 (PGA, LGA, BGA, etc.). In the exemplary embodiment shown in Figures 2A, 3A and 3B, the semiconductor device 10 of the electronic circuit device 1 (1C, 1E, 1F) is of a small outline nonlead (SON) type including terminals (pads) 14 provided on peripheral portions 11A, 11B of the package 13. In the exemplary embodiment shown in FIG. 2B, the semiconductor device 10 of the electronic circuit apparatus 1C includes terminals 14 that protrude from peripheral edges 11A, 11B of the package 13.

[0016] The semiconductor chip 12 includes, for example, a semiconductor element such as a transistor, a diode, a thyristor, etc. An example of the semiconductor chip 12 with a high heat density is a power semiconductor including a MOSFET or an IGBT as a semiconductor element. The semiconductor chip 12 may be an integrated circuit (IC) in which a plurality of semiconductor elements are integrated, or may be a discrete chip in which one semiconductor element is formed. Also, the semiconductor device 10 may have a modular structure in which a plurality of discrete chips (semiconductor chips 12) are provided in a package 13.

[0017] The semiconductor chip 12 is at least partially covered by the package 13. The semiconductor chip 12 may be embedded in the package 13. The constituent material of the package 13 is, for example, a resin or a ceramic.

[0018] In some embodiments, semiconductor device 10 includes a heat spreader 16 located on a back surface 17 of semiconductor device 10. In the embodiment shown in Figures 1A-3B, heat spreader 16 is disposed opposite the back surface of semiconductor chip 12. Heat spreader 16 is disposed in close proximity to semiconductor chip 12 and may be adjacent to semiconductor chip 12. The back surface 17 of the semiconductor device 10 on which the heat sink 16 is provided is the surface of the semiconductor device 10 that faces the substrate 20. The heat sink 16 is exposed at the back surface 17 of the semiconductor device 10 and faces the substrate 20.

[0019] The semiconductor device 10 includes a plurality of terminals 14 electrically connected to the semiconductor chip 12. The terminals 14 may be electrically connected to the semiconductor chip 12 via bonding wires 15 embedded inside the package 13. In the embodiment shown in FIGS. 1A to 3B, a plurality of terminals 14 are provided on a pair of side surfaces (peripheral portions 11A and 11B of the package 13) of a surface-mounted package 13. Specifically, the plurality of terminals 14 include a source electrode 14S, a gate electrode 14G, and a drain electrode 14D, where the source electrode 14S and the gate electrode 14G are provided on the peripheral portion 11A of the package, and the drain electrode 14D is provided on the peripheral portion 11B of the package. The drain electrode 14D also serves as the above-mentioned heat sink (heat spreader) 16. That is, a portion of the drain electrode 14D facing the semiconductor chip 12 functions as the heat sink 16, and a portion of the drain electrode 14D near the peripheral portion 11B of the package 13 functions as the terminal 14.

[0020] The semiconductor device 10 having the above configuration is mounted (mounted) on a substrate 20. Specifically, the semiconductor device 10 is mounted on the substrate 20 with the back surface 17 of the semiconductor device 10 facing the substrate 20, and the terminal 14 is electrically connected to the electrode 22 of the substrate 20. The electrode 22 is provided on the surface of the substrate 20 facing the semiconductor device 10. The electrical connection between the terminal 14 and the electrode 22 may be achieved by solder 23. The solder 23 is provided between the electrode 22 and the terminal 14, and joins the electrode 22 and the terminal 14. The substrate 20 is a printed wiring board in which a circuit including electrodes 22 is formed on an insulating substrate 21. The insulating substrate 21 is made of, for example, a composite material of glass fiber and resin.

[0021] The substrate 20 has a through hole 24 at a position facing the back surface 17 of the semiconductor device 10. The shape (contour) of the through hole 24 is not particularly limited, and may be a circle, an ellipse, a track shape, a polygon shape, or a shape similar thereto. In the exemplary embodiment shown in Figures 2A, 2B, and 3A, the through hole 24 has an outer shape in which the corners of a rectangle are curved. In the exemplary embodiment shown in Figure 3B, the through hole 24 has an elliptical contour.

[0022] 2A to 3B, in some embodiments, the through hole 24 is non-circular, and a dimension W1 of the through hole 24 along the first peripheral edge 11A and the second peripheral edge 11B of the package 13 in which the terminal 14 is provided is larger than a dimension W2 of the through hole 24 along a direction intersecting the first peripheral edge 11A and the second peripheral edge 11B (W1>W2). Here, W1 is the longitudinal dimension of the through hole 24, and W2 is the lateral dimension of the through hole 24. In the embodiment shown in Figures 2A to 3B, the through hole 24 extends, in a plan view, beyond the other peripheral portions 11C, 11D of the package 13 except for the first peripheral portion 11A and the second peripheral portion 11B of the package 13 to the outside of the package 13. In one embodiment, the through hole 24 overlaps with the semiconductor device 10 in an area of 50% or more of the occupation area of the semiconductor device 10 in a plan view. The size of the opening of the through hole 24 may be set so as to include all or most of the occupation area of the semiconductor chip 12 of the semiconductor device 10 (e.g., 80% or more of the occupation area of the semiconductor chip 12) in a plan view. In the exemplary embodiment shown in Figures 3A and 3B, the entire occupation area of the semiconductor chip 12 of the semiconductor device 10 is included in the opening area of the through hole 24 in a plan view.

[0023] A heat sink 30 is disposed on the opposite side of the substrate 20 from the semiconductor device 10. The heat sink 30 is made of metal, for example, copper, aluminum, or an alloy thereof. In some embodiments, the heat sink 30 has a substrate-facing surface 31 facing the substrate 20, and a protrusion 32 protruding from the substrate-facing surface 31 toward the substrate 20. The protrusion 32 of the heat sink 30 protrudes from the substrate-facing surface 31 toward the rear surface 17 of the semiconductor device 10 so as to enter the through-hole 24 of the substrate 20. In other words, the substrate 20 is fixed to the heat sink 30 with the protrusion 32 of the heat sink 30 inserted into the through-hole 24. 1A and 1B, the top surface 33 of the protrusion 32 facing the back surface 17 of the semiconductor device 10 is located inside the through hole 24. That is, the protrusion 32 penetrates halfway into the through hole 24 and stops just before the front surface of the substrate 20 on which the electrode 22 is formed. The dimensions of the protrusion 32 are smaller than the dimensions of the through hole 24. For this reason, a gap exists between the outer peripheral surface 34 of the protrusion 32 and the inner wall surface of the through hole 24.

[0024] In some embodiments, as shown in Fig. 1B, in order to increase the contact area between the heat dissipation material 40 described below and the protrusions 32, the outer surface of the protrusions 32 that contacts the heat dissipation material 40 has projections and recesses 35. In other embodiments, as shown in Fig. 1A, the outer surface of the protrusions 32 that contacts the heat dissipation material 40 does not have projections and recesses. In the embodiment shown in FIG. 1B, the top surface 33 of the protrusion 32 is provided with irregularities 35. In other embodiments, in addition to or instead of the top surface 33 of the protrusion 32, the outer peripheral surface 34 of the protrusion 32 is provided with irregularities 35. In the exemplary embodiment shown in FIG. 4A, the heat sink 30A has the protrusion 32 having lattice-shaped grooves 35A (irregularities 35) formed on the top surface 33. In the exemplary embodiment shown in FIG. 4B, the heat sink 30B has the protrusion 32 having wavy irregularities 35B (irregularities 35) formed on the top surface 33.

[0025] In some embodiments, the protrusion 32 is noncircular in shape corresponding to the shape of the through hole 24. Specifically, as shown in Figures 3A to 4B, the cross-sectional shape of the protrusion 32 along the in-plane direction of the substrate 20 has a longitudinal dimension L1 that is slightly smaller than the longitudinal dimension W1 of the through hole 24, and a lateral dimension L2 that is slightly smaller than the lateral dimension W2 of the through hole 24, and satisfies L1>L2. In the exemplary embodiment shown in Figures 3A to 3B, the convex portion 32 has a non-circular contour corresponding to the through hole 24, and in a planar view, the convex portion 32 extends beyond the other peripheral portions 11C, 11D of the package 13, except for the first peripheral portion 11A and the second peripheral portion 11B of the package 13, to the outside of the package 13. In one embodiment, the protrusion 32 overlaps with the semiconductor device 10 over an area that is 50% or more of the occupation area of the semiconductor device 10 in a plan view. The size of the protrusion 32 may be set so as to encompass all or most of the occupation area of the semiconductor chip 12 of the semiconductor device 10 (e.g., 80% or more of the occupation area of the semiconductor chip 12) in a plan view. In the exemplary embodiment shown in Figures 3A and 3B, the entire occupation area of the semiconductor chip 12 of the semiconductor device 10 is encompassed by the area of the top surface 33 of the protrusion 32 in a plan view.

[0026] The heat dissipation material 40 is provided at least between the back surface 17 of the semiconductor device 10 and the top surface 33 of the protrusion 32 of the heat sink 30. When the semiconductor device 10 has a heat sink 16 on the back surface 17, the heat dissipation material 40 is provided at least between the heat sink 16 and the top surface 33 of the protrusion 32. The heat dissipation material 40 is a TIM (thermal interface material) that fills the gap between the semiconductor device 10 and the heat sink 30 to reduce the heat transfer resistance in the heat conduction path from the semiconductor device 10 to the heat sink 30. For example, a thermally conductive grease, a thermally conductive sheet, a thermally conductive adhesive, etc. can be used as the heat dissipation material 40. It is desirable that the thermal conductivity of the heat dissipation material 40 is higher than that of the substrate 20. When the terminals 14 of the semiconductor device 10 also serve as the heat sink 16, the heat dissipation material 40 is made of an insulating material to electrically insulate the terminals 14 and the heat sink 30.

[0027] 1A and 1B , the heat dissipation material 40 includes a first portion 42 located between the top surface 33 of the protrusion 32 and the back surface 17 of the semiconductor device 10, and a second portion 44 at least partially covering the outer circumferential surface 34 of the protrusion 32. The second portion 44 of the heat dissipation material 40 is continuous with the outer circumferential edge of the first portion 42 and extends in the height direction of the protrusion 32 within the gap between the through hole 24 and the outer circumferential surface 34 of the protrusion 32, starting from the outer circumferential edge of the first portion 42.

[0028] 5 to 7, a circuit-integrated motor including the electronic circuit device 1 will be described. In this specification, the circuit-integrated motor is a device in which a motor and a control unit (control board) are integrated into one module. Fig. 5 is a cross-sectional view showing a schematic overall configuration of a circuit-integrated motor according to one embodiment. Fig. 6 is a perspective view showing a specific example of the configuration of the periphery of an electronic circuit device of a circuit-integrated motor. Fig. 7 is a perspective view showing a specific example of the configuration of the periphery of an electronic circuit device of a circuit-integrated motor, with the board omitted from Fig. 6.

[0029] 5, in some embodiments, a circuit-integrated motor 100 includes the above-mentioned electronic circuit device 1 and a motor 110. The electronic circuit device 1 controls the motor 110 by an inverter circuit including a semiconductor device 10 mounted on a substrate 20. In this case, the electronic circuit device 1 is a control device for the motor 110, and the semiconductor device 10 is a FET that constitutes the inverter circuit.

[0030] The electronic circuit device 1 includes a casing 50 that forms a substrate receiving chamber 51 for receiving the substrate 20, in addition to the semiconductor device 10, substrate 20, heat sink 30, and heat dissipation material 40 described above. The casing 50 includes a metal partition wall 52 for separating the substrate accommodating chamber 51 from an area in which the motor 110 is disposed, and a cover 54 for forming the substrate accommodating chamber 51 together with the partition wall 52. In one embodiment, the cover 54 is made of resin, and is attached to the partition wall 52 by fitting at a fitting portion (not shown).

[0031] As shown in FIG. 5, the partition wall 52 also serves as the heat sink 30 of the electronic circuit device 1. That is, the partition wall 52 as the heat sink 30 has a convex portion 32 protruding from the substrate facing surface 31, and a heat conduction path is formed from the semiconductor device 10 to the convex portion 32 via the heat dissipation material 40. The partition wall 52 may have heat dissipation fins 53 from the viewpoint of improving the heat dissipation performance of the heat sink 30. In the embodiment shown in FIG. 5, the heat dissipation fins 53 are provided on the surface of the partition wall 52 opposite to the substrate accommodation chamber 51 so as to face the arrangement space of the motor 110. In other embodiments, as shown in FIGS. 6 and 7, the heat dissipation fins 53 are provided on the side surface of the partition wall 52.

[0032] As shown in FIGS. 5 to 7, the partition wall 52 includes a substrate fixing portion 60 to which the substrate 20 is attached. The substrate fixing portion 60 is located in the substrate accommodation chamber 51 and has a function of fixing the substrate 20 at a predetermined position. The substrate fixing portion 60 has a contact surface 61 that abuts against the back surface of the substrate 20 and positions the substrate 20 in the height direction within the substrate accommodation chamber 51. The height position of the contact surface 61 from the substrate facing surface 31 is set such that the top surface 33 of the convex portion 32 is located within the through hole 24, as shown in FIGS. 1A, 1B, and 5. Specifically, the height h of the contact surface 61 from the substrate facing surface 31 is set to satisfy 0 < H - h < t, where t is the thickness of the substrate 20 and H is the height of the top surface 33 of the convex portion 32 from the substrate facing surface 31. In the embodiment shown in FIGS. 5 to 7, with the substrate 20 placed on the contact surface 61 of the substrate fixing portion 60, the substrate 20 is fixed to the substrate fixing portion 60 by screwing a screw 62 into a female screw provided in the substrate fixing portion 60. In other embodiments, instead of screwing using the screw 62, the substrate 20 is fixed to the substrate fixing portion 60 by caulking or press-fitting with a convex portion provided on the contact surface 61 of the substrate fixing portion 60. In the exemplary embodiments shown in FIGS. 6 and 7, the substrate fixing portions 60 are provided at the four corners of the substrate accommodation chamber 51.

[0033] In addition, the partition wall 52 has an attachment portion 56 that protrudes radially outward. The attachment portion 56 is used for installing the circuit-integrated motor 100. For example, when the circuit-integrated motor 100 is an in-vehicle motor, the circuit-integrated motor 100 may be attached to the vehicle body via the attachment portion 56.

[0034] 6 and 7, six protrusions 32 are provided on the heat sink 30 (partition wall 52) corresponding to six semiconductor devices 10 constituting an inverter circuit for controlling power supply to the motor 110. The partition wall 52 is provided with an opening 70 (see FIG. 7) through which a motor wire (an end of a stator coil 124 described later) of the motor 110 passes. The opening 70 has a gap around the motor wire sealed with a rubber material (not shown) to ensure airtightness of the substrate accommodating chamber 51. The substrate 20 is provided with six through holes 72 (see FIG. 6) through which the motor wire of the motor 110 is inserted. The inverter circuit including the semiconductor device 10 operates based on a PWM control command from a microcomputer 74 (see FIG. 6) mounted on the substrate 20, and controls the power supplied to the motor 110. A connector 76 for connecting the board 20 to an external device is provided on the partition wall 52. A terminal 77 of the connector 76 is inserted into a through hole provided in the board 20 and is electrically connected to the circuit of the board 20. An engagement protrusion 78 is provided on the outer surface of the side wall of the partition wall 52. The engagement protrusion 78 is used to fit the resin cover 54 shown in FIG.

[0035] 5, the motor 110 includes a stator 120 including a stator core 122, and a rotor 130 having a magnet 132 arranged to face the stator core 122 in the radial direction. A stator coil 124 is wound around the stator core 122. The stator coil 124 is electrically connected to a circuit formed on the substrate 20 of the electronic circuit device 1. When a current supplied from the substrate 20 flows through the stator coil 124, the rotor 130 rotates in the circumferential direction due to the interaction between the magnetic field generated by the stator coil 124 and the magnet 132. The power supplied to the stator coil 124 is controlled by an inverter circuit including the semiconductor device 10.

[0036] In the embodiment shown in FIG. 5, the circuit-integrated motor 100 is an outer rotor type motor in which the magnet 132 of the rotor 130 is located on the outer periphery of the stator core 122 of the stator 120. Specifically, as shown in FIG. 5, the stator 120 includes a stator core 122 around which a stator coil 124 is wound, a support shaft 126 that rotatably supports the rotor 130 via a bearing 134, and a base 128 that is attached to the rear surface of the heat sink 30 of the electronic circuit device 1. The base 128 is attached to the heat sink 30 (partition wall 52) using a fastening member (e.g., a bolt) not shown. The stator core 122 is located radially outside the support shaft 126 so as to surround the support shaft 126. The magnet 132 of the rotor 130 is disposed on the outer periphery side of the stator core 122. The rotor 130 has a double cylindrical structure including an outer periphery wall 136 and an inner periphery wall 137, and the outer periphery wall 136 and the inner periphery wall 137 are connected to each other via a bottom wall 138. The magnet 132 is attached to the inner periphery surface of the outer periphery wall 136. A vent hole 139 is formed between the rotor 130 and the heat sink 30 (partition wall 52). The vent hole 139 is formed by an axial gap between the outer peripheral wall 136 of the rotor 130 and the casing 50 (partition wall 52).

[0037] In another embodiment, the circuit-integrated motor 100 is an inner rotor type motor in which the rotor 130 is located on the inner circumference side of the stator 120. The inner rotor type circuit-integrated motor 100 has a basic configuration common to the example shown in FIG. 5, except for the positional relationship between the rotor 130 and the stator 120.

[0038] In the above-described embodiment, the heat sink 30 of the electronic circuit device 1 has the protrusions 32 provided corresponding to the respective semiconductor devices 10 serving as heat generating elements. However, the present invention is not limited to these examples, and a single protrusion 32 may be shared by a plurality of semiconductor devices 10.

[0039] Fig. 8 is a schematic plan view of an electronic circuit device according to one embodiment. Fig. 9 is a schematic plan view of an electronic circuit device according to another embodiment. Fig. 10 is a schematic plan view of an electronic circuit device according to still another embodiment. Heat dissipation material 40 is omitted in Figs. 8 to 10.

[0040] In some embodiments, as shown in Figures 8 to 10, the electronic circuit device 1 (1G to 1I) includes a common convex portion 300 (300A to 300F) corresponding to two or more semiconductor devices 10 among the multiple semiconductor devices 10 mounted on the substrate 20 as the convex portion 32 of the heat sink 30.

[0041] 8 to 10, the electronic circuit device 1 (1G to 1I) includes six semiconductor devices 10 as six FETs that configure an inverter circuit for controlling power supplied to a three-phase motor 110. The six semiconductor devices 10 include two semiconductor devices 10U corresponding to the U phase, two semiconductor devices 10V corresponding to the V phase, and two semiconductor devices 10W corresponding to the W phase. Each semiconductor device 10 extends beyond the common convex portion 300 (300A to 300F) from the first peripheral portion 11A to the second peripheral portion 11B of the package 13 on which the terminals 14 are provided. The electronic circuit devices 1G to 1I also have the relationship (W1>W2, L1>L2) between the through hole 24, the convex portion 32 (common convex portion 300), and the semiconductor device 10 described with reference to FIG. 3A. That is, in the electronic circuit devices 1G to 1I, the dimension W1 of the through hole along the first peripheral portions 11A and 11B of the package 13 on which the terminals 14 are provided and the dimension L1 of the convex portion 32 are larger than the dimension W2 of the through hole 24 along the direction intersecting the first peripheral portion 11A and the second peripheral portion 11B, respectively.

[0042] In the exemplary embodiment shown in FIG. 8, the electronic circuit device 1G includes two common convex portions 300A, 300B corresponding to two groups Gr1, Gr2 each of which combines one semiconductor device 10U, 10V, 10W corresponding to three phases. In the exemplary embodiment shown in FIG. 9, the electronic circuit device 1H includes three common convex portions 300C to 300E corresponding to three groups Gr3 to Gr5 each formed by pairs of semiconductor devices 10 (10U, 10V, 10W) corresponding to each phase. In the exemplary embodiment shown in FIG. 10, the electronic circuit device 1I includes one common convex portion 300F corresponding to all six semiconductor devices 10 (10U, 10V, 10W) corresponding to three phases.

[0043] The characteristic configurations of the electronic circuit device 1 and the circuit-integrated motor 100 according to the above-described several embodiments can be summarized as follows.

[0044] [1] At least some embodiments of the electronic circuit device 1 include: At least one semiconductor device (10); a substrate (20) on which a semiconductor device (10) is mounted and which has a through hole (24) at a position facing a back surface (17) of the semiconductor device (10); a heat sink (30) located on the opposite side of the semiconductor device (10) across the substrate (20), the heat sink having at least one protrusion (32) protruding toward a back surface (17) of the semiconductor device (10) so as to enter a through hole (24) of the substrate (20); a heat dissipation material (40) provided at least between the back surface (17) of the semiconductor device (10) and the top surface (33) of the protrusion (32) of the heat sink (30); Equipped with.

[0045] According to the configuration [1] above, by inserting the convex portion (32) of the heat sink (30) into the through hole (24) of the substrate (20), the top surface (33) of the convex portion (32), which is the heat receiving surface of the heat sink (30), approaches the back surface (17) of the semiconductor device (10). Therefore, with the simple configuration of inserting the convex portion (32) of the heat sink (30) into the through hole (24) of the substrate (20), it is possible to reduce the heat transfer resistance in the heat transfer path from the semiconductor device (10) to the heat sink (30) and improve the heat dissipation performance.

[0046] [2] In some embodiments, in the configuration of [1] above, The semiconductor device (10) includes a heat sink (16) located on a back surface (17) of the semiconductor device (10); The heat sink (40) is provided between the heat sink (16) of the semiconductor device (10) and the top surface (33) of the protrusion (32).

[0047] According to the above configuration [2], it is possible to increase the heat flux from the heat sink (16) provided on the back surface (17) of the semiconductor device (10) through the heat sink material (40) to the top surface (33) of the protrusion (32), thereby further improving the heat dissipation performance.

[0048] [3] In some embodiments, in the configuration of [1] or [2] above, The semiconductor device (10) comprises: A semiconductor chip (12); A package (13) that covers the semiconductor chip (12); First terminals (14S, 14G) provided on a first peripheral portion (11A) of the package (13); a second terminal (14D) provided on a second peripheral portion (11B) of the package (13) facing the first peripheral portion (11A); Including, In a plan view, a longitudinal dimension (W1) of the through hole (24) in a direction along the first peripheral portion (11A) and the second peripheral portion (11B) of the package (13) is larger than a transverse dimension (W2) of the through hole (24) in a direction intersecting the first peripheral portion (11A) and the second peripheral portion (11B).

[0049] According to the configuration [3] above, the dimension (W1) of the through hole (24) in the direction along the peripheral portion (11A, 11B) of the package (13) in which the terminal (14) is provided is relatively large, so that the dimension (L1) of the protrusion (32) in the same direction is sufficiently secured, and heat dissipation using the protrusion (32) can be promoted. In addition, the dimension (W2) of the through hole (24) in the direction intersecting the peripheral portion (11A, 11B) of the package (13) in which the terminal (14) is provided is relatively small, so that the bonding area between the terminal (14) provided on the peripheral portion (11A, 11B) of the package (13) and the electrode (22) of the substrate (20) can be secured.

[0050] [4] In some embodiments, in the configuration of [3] above, The through hole (24) extends, in a plan view, beyond the other peripheral portions (11C, 11D) of the package (13) except for the first peripheral portion (11A) and the second peripheral portion (11B) to the outside of the package (13).

[0051] According to the above configuration [4], a larger dimension (L1) of the protrusion (32) in the direction along the peripheral portion (11A, 11B) of the package (13) on which the terminal (14) is provided can be secured, thereby promoting heat dissipation utilizing the protrusion (32).

[0052] [5] In some embodiments, in any one of the configurations [1] to [4] above, The top surface (33) of the protrusion (32) is located within the through hole (24).

[0053] According to the configuration [5] above, when the substrate (20) is attached to the heat sink (30), the protrusion (32) is prevented from interfering with the semiconductor device (10), and the reliability of the electronic circuit device (1) is not impaired.

[0054] [6] In some embodiments, in any one of the configurations [1] to [5] above, The protrusion (32) has a non-circular cross-sectional shape along an in-plane direction of the substrate (20), The through hole (24) in the substrate (20) has a non-circular shape that corresponds to the protrusion (32).

[0055] According to the above configuration [6], when the substrate (20) is attached to the heat sink (30), the substrate (20) can be positioned by the protrusions (32) and the through holes (24).

[0056] [7] In some embodiments, in the configuration of [6] above, The non-circular convex portion (32) has an outer shape in which the corners of a rectangle are curved in a plan view.

[0057] According to the configuration [7] above, since the convex portion (32) has a curved corner portion, the stress acting on the heat dissipation material (40) in contact with the convex portion (32) can be alleviated, and deterioration of heat dissipation performance caused by cracking of the heat dissipation material (40) can be suppressed.

[0058] [8] In some embodiments, in the configuration of [6] above, The non-circular protrusion (32) has an elliptical outer shape in a plan view.

[0059] According to the configuration [8] above, since the contour of the convex portion (32) has a curved shape, for the same reason as in [7] above, it is possible to suppress a decrease in heat dissipation performance caused by cracks in the heat dissipation material (40).

[0060] [9] In some embodiments, in any one of the configurations [1] to [8] above, A plurality of protrusions (32) are provided corresponding to the plurality of semiconductor devices (10) mounted on the substrate (20), respectively.

[0061] According to the configuration [9] above, it is possible to obtain the heat dissipation effect using the protrusions (32) described in [1] above while maintaining the degree of freedom in arranging the semiconductor device (10).

[0062]

[10] In some embodiments, in any one of the configurations [1] to [8] above, At least one of the protruding portions (32) includes a common protruding portion (300) corresponding to two or more of the semiconductor devices (10) mounted on the substrate (20).

[0063] According to the above configuration

[10] , the heat capacity of the common protrusion (300) can be increased, and the heat dissipation performance can be improved.

[0064]

[11] In some embodiments, in any one of the configurations [1] to

[10] above, The heat dissipation material (40) is a first portion (42) located between a top surface (33) of the protrusion (32) and a back surface (17) of the semiconductor device (10); a second portion (44) that is continuous with the outer peripheral edge of the first portion (42) and at least partially covers the outer peripheral surface (34) of the protrusion (32); Includes.

[0065] According to the above configuration

[11] , not only the top surface (33) of the protrusion (32) but also the outer circumferential surface (34) of the protrusion (32) can be used as a heat input surface, thereby further improving the heat dissipation performance.

[0066]

[12] In some embodiments, in any one of the configurations [1] to

[11] above, The top surface (33) of the protrusion (32) has irregularities (35).

[0067] According to the above configuration

[12] , the contact area between the top surface (33) of the protrusion (32) and the heat dissipating material (40) is increased, and the heat dissipation performance is further improved.

[0068]

[13] At least some embodiments of the circuit-integrated motor (100) according to the present invention include: An electronic circuit device (1) having any one of the configurations [1] to

[12] above; A motor (110) configured to be controlled by an inverter circuit including a semiconductor device (10) of an electronic circuit device (1); Equipped with The heat sink (30) of the electronic circuit device (1) is a metal partition wall (52) for separating a board housing chamber (51) in which the board (20) is housed from an area in which the motor (110) is disposed.

[0069] According to the configuration

[13] above, the metal partition (52) for separating the substrate accommodating chamber (51) from the area in which the motor (110) is arranged is used as a heat sink (30) for the electronic circuit device (1), thereby making it possible to enjoy the excellent heat dissipation performance described in [1] above.

[0070] In this specification, the expressions "comprise," "include," or "have" a certain element are not exclusive expressions excluding the presence of other elements. [Explanation of symbols]

[0071] 1(1A~1I):Electronic circuit device 10 (10U, 10V, 10W): Semiconductor devices 11A: First peripheral portion 11B: Second peripheral portion 12: Semiconductor chips 13: Package 14: Terminal 16: Heat sink 17: Back side 20: Substrate 24:Through hole 30(30A, 30B): Heat sink 32: Convex 33:Top surface 34: Outer surface 35: Unevenness 40: Heat dissipation material 42 :1st part 44:Second part 51: Substrate storage room 52: Bulkhead 100: Circuit integrated motor 110: Motor 300(300A~300F): Common convex part

Claims

1. at least one semiconductor device; a substrate on which the semiconductor device is mounted and which has a through hole at a position facing a back surface of the semiconductor device; a heat sink located on the opposite side of the semiconductor device across the substrate, the heat sink having at least one protrusion protruding toward the back surface of the semiconductor device so as to enter the through hole of the substrate; a heat dissipation material provided at least between the back surface of the semiconductor device and a top surface of the protrusion of the heat sink; An electronic circuit device comprising:

2. the semiconductor device includes a heat sink located on the back surface of the semiconductor device; The heat dissipation material is provided between the heat dissipation plate of the semiconductor device and the top surface of the protrusion.

2. The electronic circuit device according to claim 1.

3. The semiconductor device is A semiconductor chip; a package covering the semiconductor chip; a first terminal provided on a first peripheral portion of the package; a second terminal provided on a second peripheral portion of the package opposite the first peripheral portion; Including, In a plan view, a longitudinal dimension of the through hole in a direction along the first peripheral portion and the second peripheral portion of the package is larger than a lateral dimension of the through hole in a direction intersecting the first peripheral portion and the second peripheral portion.