Electronic module and manufacturing method of the same

Abstract

To provide an electronic module in which joint strength between a conductive member and a conductive connection member can be improved.SOLUTION: An electronic module 1 includes an electronic component 25, a conductive member (for example, a second pad 19), and a conductive connection member 27. The conductive member includes an inclined surface 20 whose height is gradually reduced in a direction away from the electronic component 25. The conductive connection member 27 is connected to the electronic component 25 and bonded to the inclined surface 20.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to electronic modules and methods for manufacturing same. [Background technology]

[0002] Japanese Patent Application Laid-Open No. 2022-39128 (Patent Document 1) discloses an electronic component including a substrate, a first electrode, a second electrode, a first pad, a second pad, an element, and a bonding wire. The element is disposed on the first pad, and is, for example, a light-emitting diode. The bonding wire is bonded to the element and the second pad. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-39128 A [Summary]

[0004] An object of the present disclosure is to provide an electronic module capable of improving the bonding strength between a conductive member and a conductive connecting member.

[0005] The electronic module of the present disclosure includes an electronic component, a conductive member, and a conductive connecting member, the conductive member including a sloped surface that decreases in height away from the electronic component, the conductive connecting member being connected to the electronic component and bonded to the sloped surface. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic plan view of an electronic module according to an embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view of the electronic module according to the embodiment taken along the cross-sectional line II-II shown in FIG. [Diagram 3] FIG. 3 is a schematic enlarged partial cross-sectional view of a region III shown in FIG. 2 of the electronic module according to the embodiment. [Figure 4]FIG. 4 is a flowchart illustrating an example of a method for manufacturing an electronic module according to an embodiment. [Diagram 5] FIG. 5 is a flowchart showing a bonding process for a conductive connection member. [Figure 6] FIG. 6 is a schematic cross-sectional view showing a bonding process for a conductive connection member. [Figure 7] FIG. 7 is a schematic partial enlarged cross-sectional view of an area VII shown in FIG. 6 in a bonding step of the conductive connecting member. [Figure 8] FIG. 8 is a schematic partially enlarged cross-sectional view of an electronic module according to a first modified example of the embodiment. [Figure 9] 9 is a schematic partial enlarged cross-sectional view of an electronic module according to a second modified example of the embodiment.

[0007] The details of the embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are given the same reference numerals, and the description thereof will not be repeated. At least some of the configurations of the embodiments described below may be arbitrarily combined.

[0008] An electronic module 1 according to an embodiment of the present disclosure will be described with reference to Figures 1 to 3. The electronic module 1 mainly includes a substrate 10, a first electrode 16, a first pad 17, a second electrode 18, a second pad 19, an electronic component 25, a conductive connection member 27, and a sealing member 30.

[0009] The substrate 10 includes a first main surface 11, a second main surface 12 opposite to the first main surface 11, a side surface 13, and a side surface 14 opposite to the side surface 13. The first main surface 11 and the second main surface 12 are both end surfaces in the thickness direction (z direction) of the substrate 10. The first main surface 11 and the second main surface 12 each extend in a first direction (x direction) perpendicular to the thickness direction of the substrate 10 and a second direction (y direction) perpendicular to the thickness direction and the first direction of the substrate 10. For example, the first direction may be the longitudinal direction of the substrate 10, the second direction may be the lateral direction of the substrate 10, and the side surfaces 13 and 14 may be both end surfaces in the longitudinal direction of the substrate 10. The substrate 10 is formed of an insulating material. The substrate 10 is, for example, a glass epoxy substrate formed of glass cloth and epoxy resin impregnated into the glass cloth.

[0010] The first electrode 16 is disposed on the first main surface 11, the side surface 13, and the second main surface 12. A portion of the first electrode 16 is exposed from the sealing member 30. The first pad 17 is connected to the first electrode 16. The first pad 17 protrudes from the first electrode 16 toward the second electrode 18. The second electrode 18 is disposed on the first main surface 11, the side surface 14, and the second main surface 12. The second electrode 18 is spaced apart from the first electrode 16 in the first direction (x direction). A portion of the second electrode 18 is exposed from the sealing member 30. The second pad 19 is connected to the second electrode 18. The second pad 19 protrudes from the second electrode 18 toward the first electrode 16. The second pad 19 is spaced apart from the first pad 17 in the first direction (x direction).

[0011] The second pad 19 includes an inclined surface 20. The height of the inclined surface 20 gradually decreases as it moves away from the electronic component 25. Specifically, the inclined surface 20 includes a proximal end 21 relative to the electronic component 25 and a distal end 22 relative to the electronic component 25. The height of the inclined surface 20 gradually decreases from the proximal end 21 to the distal end 22. The inclined surface 20 and the conductive connection member 27 are similar in the direction of inclination with respect to the surface 19a of the second pad 19 when viewed from the junction between the second pad 19 and the conductive connection member 27. For example, in FIG. 2 and FIG. 3, the inclined surface 20 and the conductive connection member 27 are inclined in the upper left direction from the junction between the second pad 19 and the conductive connection member 27.

[0012] In a plan view of the surface 19a of the second pad 19, the inclined surface 20 is larger in area than the junction between the second pad 19 and the conductive connecting member 27. In a plan view of the surface 19a of the second pad 19, the junction between the second pad 19 and the conductive connecting member 27 is surrounded by the outer edge of the inclined surface 20. The inclined surface 20 is, for example, a bottom surface of a recess 23 provided in the surface 19a of the second pad 19. The inclined surface 20 and the recess 23 are formed, for example, by punching or etching a part of the second pad 19.

[0013] The inclined surface 20 may be an inclined plane. The bottom surface of the recess 23 may be an inclined plane. The inclination angle θ (see FIG. 3) of the inclined plane with respect to the surface 19a of the second pad 19 is, for example, 3° or more. The inclination angle θ of the inclined plane with respect to the surface 19a of the second pad 19 may be 5° or more, 10° or more, or 15° or more. The inclination angle θ of the inclined plane with respect to the surface 19a of the second pad 19 is, for example, 45° or less. The inclination angle θ of the inclined plane with respect to the surface 19a of the second pad 19 may be 30° or less, or 20° or less.

[0014] The first electrode 16, the second electrode 18, the first pad 17, and the second pad 19 are conductive members and are formed of a conductive material such as a metal. The first electrode 16, the second electrode 18, the first pad 17, and the second pad 19 are formed of, for example, copper (Cu) or aluminum (Al). The first electrode 16, the second electrode 18, the first pad 17, and the second pad 19 may be covered with a plating layer (not shown) such as a gold (Au) layer and a nickel (Ni) layer.

[0015] The electronic component 25 is mounted on the first pad 17. Specifically, the electronic component 25 is fixed to the first pad 17 using a bonding member 26 such as a conductive resin adhesive or solder. The electronic component 25 is electrically connected to the first pad 17 through the bonding member 26. The electronic component 25 is, for example, a chip component. The electronic component 25 is, for example, a light-emitting element such as a light-emitting diode (LED) or a laser diode (LD).

[0016] The conductive connection member 27 is connected to the electronic component 25 and the second pad 19. Specifically, a first end of the conductive connection member 27 is bonded to the electronic component 25. A second end (end 28) of the conductive connection member 27 is bonded to the inclined surface 20 of the second pad 19. The conductive connection member 27 is, for example, a conductive wire. The conductive connection member 27 may also be a conductive ribbon. The conductive connection member 27 is formed of a conductive material such as a metal. The conductive connection member 27 is, for example, formed of copper (Cu), gold (Au) or aluminum (Al).

[0017] End 28 of conductive connection member 27 is crushed by bonding tool 35 (FIGS. 6 and 7). End 28 of conductive connection member 27 includes a surface complementary to tip 36 and side 37 of bonding tool 35. End 28 of conductive connection member 27 has a smaller thickness than a portion of conductive connection member 27 excluding the first end and second end (end 28) (for example, a portion of conductive connection member 27 that is farthest from surface 19a in the normal direction of surface 19a).

[0018] The sealing member 30 seals the electronic component 25 and the conductive connection member 27. The sealing member 30 is formed of an insulating resin such as an epoxy resin or a silicone resin. When the electronic component 25 is an LED, fluorescent particles or a light diffusing agent may be added to the sealing member 30. The fluorescent particles convert the wavelength of the light emitted from the LED. The light diffusing agent diffuses the light emitted from the LED or the light emitted from the fluorescent particles. The light diffusing agent is, for example, a silicone filler.

[0019] An example of a manufacturing method for electronic module 1 of the present embodiment will be described with reference to Fig. 4 to Fig. 7. With reference to Fig. 4, the manufacturing method for electronic module 1 of the present embodiment includes a bonding step (S1) of electronic components 25, a bonding step (S2) of conductive connection members 27, a sealing step (S3), and a singulation step (S4).

[0020] In the bonding step (S1) of the electronic component 25, the electronic component 25 is bonded to the first pad 17 using a bonding member 26. The bonding member 26 is, for example, a conductive resin adhesive or solder.

[0021] In the step (S2) of bonding the conductive connection member 27, the conductive connection member 27 is bonded to the electronic component 25 and the second pad 19 using a bonding tool 35. When the conductive connection member 27 is a conductive wire, the step (S2) is a wire bonding step.

[0022] 5, the bonding step (S2) of the conductive connection member 27 includes connecting the conductive connection member 27 to the electronic component 25 (S21) and bonding the conductive connection member 27 to the inclined surface 20 of the second pad 19 using a bonding tool 35 (S22). The height of the inclined surface 20 gradually decreases with increasing distance from the electronic component 25. The inclined surface 20 is, for example, an inclined plane. The inclined surface 20 is, for example, the bottom surface of a recess 23 provided in the surface 19a of the second pad 19. Either step (S21) or step (S22) may be performed first.

[0023] In step (S21), for example, a bonding tool 35 is used to press a first end of the conductive connection member 27 against the electronic component 25. In this manner, the first end of the conductive connection member 27 is bonded to the electronic component 25.

[0024] 6 and 7, in step (S22), a bonding tool 35 is used to press a second end (end 28) of the conductive connection member 27 against the inclined surface 20 of the second pad 19, thereby bonding the conductive connection member 27 to the inclined surface 20 of the second pad 19. The bonding tool 35 includes a tip 36 and a side surface 37 connected to the tip 36. The end 28 of the conductive connection member 27 is crushed by the bonding tool 35. The end 28 of the conductive connection member 27 includes a surface complementary to the tip 36 and the side surface 37 of the bonding tool 35. The end 28 of the conductive connection member 27 has a smaller thickness than a portion of the conductive connection member 27 other than the first end and the second end (end 28) (for example, a portion of the conductive connection member 27 that is farthest from the surface 19a in the normal direction of the surface 19a).

[0025] The height of the inclined surface 20 gradually decreases with increasing distance from the electronic component 25. The inclined surface 20 and the conductive connection member 27 are similar in the direction of inclination with respect to the surface 19a of the second pad 19 when viewed from the junction between the second pad 19 and the conductive connection member 27. For example, in Figs. 6 and 7, the inclined surface 20 and the conductive connection member 27 are inclined in the upper left direction from the junction between the second pad 19 and the conductive connection member 27. The inclined surface 20 and the side 37 of the bonding tool 35 are similar in the direction of inclination with respect to the surface 19a of the second pad 19 when viewed from the junction between the second pad 19 and the conductive connection member 27. For example, in Figs. 6 and 7, the inclined surface 20 and the side 37 of the bonding tool 35 are inclined in the upper left direction. Therefore, when the conductive connection member 27 is bonded to the inclined surface 20, the conductive connection member 27 is pressed against the inclined surface 20 by both the tip 36 and the side 37 of the bonding tool 35. The conductive connection member 27 is pressed over a wider area by the bonding tool 35. The bonding strength between the conductive connection member 27 and the second pad 19 is improved.

[0026] 4, in the sealing step (S3), the sealing member 30 is provided on the substrate 10 by molding. For example, the substrate 10 on which the electronic components 25 are mounted is placed in a metal mold (not shown). A sealing resin is poured into the metal mold. The sealing resin is heated to harden the sealing resin. In this way, the sealing member 30 that seals the electronic components 25 and the conductive connection members 27 is provided on the substrate 10.

[0027] In the singulation step (S4), the substrate 10 on which the electronic components 25 are mounted and on which the sealing member 30 is provided is cut using a dicing saw or the like. In this manner, the electronic modules 1 are singulated.

[0028] An electronic module 1 according to a modified example of the present embodiment and a manufacturing method thereof will be described.

[0029] With reference to FIG. 8, the inclined surface 20 may be a concave curved surface. The bottom surface of the recess 23 may be a concave curved surface. With reference to FIG. 9, the inclined surface 20 may be, for example, a top surface of a protrusion 24 provided on the surface 19a of the second pad 19. The electronic component 25 is not limited to a light-emitting element, and may be, for example, a light-receiving element such as a photodiode, a voltage amplifier, a semiconductor switching element such as a transistor, a diode, an integrated circuit, a resistor, an inductor, a transformer, or a capacitor. The electronic module 1 may not include the substrate 10, and the conductive member (the first electrode 16, the second electrode 18, the first pad 17, and the second pad 19) may be a lead frame. The electronic module 1 may not include the sealing member 30.

[0030] The effects of the electronic module 1 and the manufacturing method thereof according to this embodiment will be described.

[0031] The electronic module 1 of this embodiment includes an electronic component 25, a conductive member (e.g., second pad 19), and a conductive connection member 27. The conductive member includes an inclined surface 20 that gradually decreases in height with increasing distance from the electronic component 25. The conductive connection member 27 is connected to the electronic component 25 and bonded to the inclined surface 20.

[0032] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0033] In the electronic module 1 of this embodiment, the inclined surface 20 is the bottom surface of a recess 23 provided in the surface 19a of a conductive member (for example, the second pad 19).

[0034] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, interference between the bonding tool 35 and the conductive member (for example, the second pad 19) can be avoided. This makes it easier to manufacture the electronic module 1.

[0035] In the electronic module 1 of this embodiment, the conductive connection members 27 are conductive wires or conductive ribbons.

[0036] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0037] In the electronic module 1 of this embodiment, the inclined surface 20 is an inclined plane.

[0038] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0039] In the electronic module 1 of this embodiment, the inclined surface 20 is a concave curved surface.

[0040] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over an even wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0041] In the electronic module 1 of this embodiment, the electronic component 25 is a light-emitting element, a light-receiving element, a voltage amplifier, a semiconductor switching element, a diode, an integrated circuit, a resistor, an inductor, a transformer, or a capacitor.

[0042] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0043] The manufacturing method of the electronic module 1 of the present embodiment includes connecting the conductive connection member 27 to the electronic component 25 (S21) and bonding the conductive connection member 27 to the inclined surface 20 of a conductive member (e.g., the second pad 19) using a bonding tool 35 (S22). The height of the inclined surface 20 gradually decreases with increasing distance from the electronic component 25. When bonding the conductive connection member 27 to the inclined surface 20, the conductive connection member 27 is pressed against the inclined surface 20 by the tip 36 of the bonding tool 35 and a side surface 37 connected to the tip 36.

[0044] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20, the conductive connection member 27 is pressed against the inclined surface 20 by both the tip 36 and the side surface 37 of the bonding tool 35. The conductive connection member 27 is pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0045] In the manufacturing method of the electronic module 1 of this embodiment, the inclined surface 20 is the bottom surface of a recess 23 provided in the surface 19a of a conductive member (for example, the second pad 19).

[0046] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, interference between the bonding tool 35 and the conductive member (for example, the second pad 19) can be avoided. This makes it easier to manufacture the electronic module 1.

[0047] In the method for manufacturing the electronic module 1 of this embodiment, the conductive connection members 27 are conductive wires or conductive ribbons.

[0048] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0049] In the manufacturing method of electronic module 1 of this embodiment, inclined surface 20 is an inclined plane.

[0050] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0051] In the manufacturing method of the electronic module 1 of this embodiment, the inclined surface 20 is a concave curved surface.

[0052] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over an even wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0053] In the method for manufacturing the electronic module 1 of this embodiment, the electronic component 25 is a light emitting element, a light receiving element, a voltage amplifier, a semiconductor switching element, a diode, an integrated circuit, a resistor, an inductor, a transformer, or a capacitor.

[0054] Therefore, when the conductive connection member 27 is bonded to the inclined surface 20 using the bonding tool 35, the conductive connection member 27 can be pressed over a wider area by the bonding tool 35. This improves the bonding strength between the conductive connection member 27 and the conductive member (e.g., the second pad 19).

[0055] Various aspects of the present disclosure are summarized below as appendices. (Appendix 1) Electronic components, a conductive member including a sloped surface that decreases in height with increasing distance from the electronic component; an electrically conductive connection member connected to the electronic component and bonded to the inclined surface. (Appendix 2) 2. The electronic module of claim 1, wherein the inclined surface is a bottom surface of a recess provided in the surface of the conductive member. (Appendix 3) 3. The electronic module of claim 1 or 2, wherein the conductive connection member is a conductive wire or a conductive ribbon. (Appendix 4) 4. The electronic module of claim 1, wherein the inclined surface is an inclined plane. (Appendix 5) 4. The electronic module of claim 1, wherein the inclined surface is a concave curved surface. (Appendix 6) 6. The electronic module according to any one of claims 1 to 5, wherein the electronic component is a light-emitting element, a light-receiving element, a voltage amplifier, a semiconductor switching element, a diode, an integrated circuit, a resistor, an inductor, a transformer, or a capacitor. (Appendix 7) Connecting the conductive connection member to an electronic component; and bonding the conductive connection member to the angled surface of the conductive member using a bonding tool; the height of the inclined surface gradually decreases with increasing distance from the electronic component; A method for manufacturing an electronic module, wherein when bonding the conductive connection member to the inclined surface, the conductive connection member is pressed against the inclined surface by a tip of the bonding tool and a side surface connected to the tip. (Appendix 8) The method for manufacturing an electronic module described in Appendix 7, wherein the inclined surface is a bottom surface of a recess provided in a surface of the conductive member. (Appendix 9) 9. The method for manufacturing an electronic module according to claim 7 or 8, wherein the conductive connection member is a conductive wire or a conductive ribbon. (Appendix 10) A method for manufacturing an electronic module described in any one of Appendix 7 to Appendix 9, wherein the inclined surface is an inclined plane. (Appendix 11) The method for manufacturing an electronic module according to any one of claims 7 to 9, wherein the inclined surface is a concave curved surface. (Appendix 12) The method for manufacturing an electronic module according to any one of claims 7 to 11, wherein the electronic component is a light-emitting element, a light-receiving element, a voltage amplifier, a semiconductor switching element, a diode, an integrated circuit, a resistor, an inductor, a transformer or a capacitor.

[0056] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0057] 1 electronic module, 10 substrate, 11 first main surface, 12 second main surface, 13, 14 side surface, 16 first electrode, 17 first pad, 18 second electrode, 19 second pad, 19a surface, 20 inclined surface, 21 proximal end, 22 distal end, 23 recess, 24 protrusion, 25 electronic component, 26 joining member, 27 conductive connection member, 28 end, 30 sealing member, 35 bonding tool, 36 tip, 37 side surface.

Claims

1. Electronic components, a conductive member including a sloped surface that decreases in height with increasing distance from the electronic component; an electrically conductive connection member connected to the electronic component and bonded to the inclined surface.

2. The electronic module according to claim 1 , wherein the inclined surface is a bottom surface of a recess provided in a surface of the conductive member.

3. The electronic module of claim 1 , wherein the conductive connecting members are conductive wires or conductive ribbons.

4. The electronic module of claim 1 , wherein the inclined surface is an inclined plane.

5. The electronic module of claim 1 , wherein the angled surface is a concave curved surface.

6. The electronic module according to claim 1 , wherein the electronic component is a light-emitting element, a light-receiving element, a voltage amplifier, a semiconductor switching element, a diode, an integrated circuit, a resistor, an inductor, a transformer, or a capacitor.

7. Connecting the conductive connection member to an electronic component; and bonding the conductive connection member to the angled surface of the conductive member using a bonding tool; the height of the inclined surface gradually decreases with increasing distance from the electronic component; A method for manufacturing an electronic module, wherein when bonding the conductive connection member to the inclined surface, the conductive connection member is pressed against the inclined surface by a tip of the bonding tool and a side surface connected to the tip.

8. The method for manufacturing an electronic module according to claim 7 , wherein the inclined surface is a bottom surface of a recess provided in the surface of the conductive member.

9. The method for manufacturing an electronic module according to claim 7 , wherein the conductive connecting member is a conductive wire or a conductive ribbon.

10. The method for manufacturing an electronic module according to claim 7 , wherein the inclined surface is an inclined plane.

11. The method for manufacturing an electronic module according to claim 7 , wherein the inclined surface is a concave curved surface.

12. The method for manufacturing an electronic module according to claim 7 , wherein the electronic component is a light-emitting element, a light-receiving element, a voltage amplifier, a semiconductor switching element, a diode, an integrated circuit, a resistor, an inductor, a transformer, or a capacitor.

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