Plug, package for storing electronic component including the same, and electronic module

Abstract

To provide a plug that can reduce the possibility of damage when making contact with a receptacle.SOLUTION: A plug includes a metal body, an insulator, and a conductor pin. The metal body has a first surface, a second surface opposite the first surface, and a first through-hole that penetrates from the first surface to the second surface. The insulator is located in the first through-hole. The insulator has a third surface located on the first surface side, a fourth surface opposite the third surface, and a second through-hole penetrating from the third surface to the fourth surface. The conductor pin is located in the second through-hole and protrudes at least from the third surface. The metal body further has a first groove located on a first surface. The first groove is located with a gap from the first outer edge of the metal body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a plug, and an electronic component storage package and an electronic module equipped with the plug. [Background technology]

[0002] A prior art coaxial connector is described, for example, in US Pat. No. 5,399,323. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2004-320067 A Summary of the Invention [Means for solving the problem]

[0004] In one embodiment (1), the plug includes a metal body, an insulator, and a conductive pin. The metal body has a first surface, a second surface opposite the first surface, and a first through hole penetrating from the first surface to the second surface. The insulator is located in the first through hole. The insulator has a third surface located on the first surface side, a fourth surface opposite the third surface, and a second through hole penetrating from the third surface to the fourth surface. The conductive pin is located in the second through hole and protrudes from at least the third surface. The metal body further has a first groove portion located in the first surface. The first groove portion is located with a space from a first outer edge of the metal body.

[0005] (2) The plug according to claim 1, wherein in the plug described in (1) above, the first groove portion is located along the first outer edge.

[0006] (3) In the plug described in (1) or (2) above, in plan view, a distance L1 from the insulator to a first outer edge of the metal body is greater than a distance L2 from the conductive pin to a second outer edge of the insulator.

[0007] (4) In the plug according to any one of (1) to (3) above, the first groove portion is ring-shaped in plan view.

[0008] (5) In the plug described above in (1) to (4), the metal body has a side surface and an inclined surface. The side surface connects the first surface and the second surface. The inclined surface is inclined from the second surface to the side surface.

[0009] (6) In the plug described in (1) to (5) above, when the direction in which the conductor pin extends is defined as a first direction, the dimension by which the conductor pin protrudes from the third surface in the first direction is equal to or greater than the dimension by which the conductor pin protrudes from the fourth surface in the first direction.

[0010] (7) In the plug described above in (1) to (6), the metal body is disk-shaped in a plan view.

[0011] (8) In the plug described above in (1) to (7), the width of the first groove portion decreases from the first surface toward the second surface in a cross-sectional view.

[0012] (9) In the plug described in any of (3) to (8) above, in a plan view, a distance L3 from the first groove to the first outer edge is smaller than a distance L4 from the second outer edge to the first groove.

[0013] (10) In the plug described above in (1) to (9), the third surface is recessed inwardly.

[0014] (11) In the plug described in (4) above, the metal body has one or more second grooves spaced apart from the first grooves.

[0015] (12) In one embodiment, an electronic component storage package includes the plug according to any one of (1) to (11) above, and a box. The box has a first recess in which the plug is located, and a third through hole connected to the first recess and through which the conductive pin passes. The first recess has a first bottom surface in contact with the second surface.

[0016] (13) In the electronic component storage package described in (12) above, the box further has a second recess located on the first bottom surface. The second recess is located with a gap between the second recess and the insulator. The diameter of the second recess is smaller than the diameter of the first recess and larger than the diameter of the insulator and the diameter of the third through hole.

[0017] (14) In the package for storing electronic components according to (12) or (13) above, the box further has a third recess that is continuous with the first recess and is located on the opposite side to the third through hole. The third recess has a second bottom surface where the first recess is located. The third recess is larger than the first recess. The first surface is located outward from the second bottom surface in a plan view.

[0018] (15) The electronic component storage package described in (14) above further includes a bonding material located between the box and the plug. The box further includes a step portion that connects the third recess and the first recess and is located on the second bottom surface. The bonding material is located from between the first recess and the plug to the step portion.

[0019] (16) The electronic component storage package according to any one of (12) to (15) above, further comprising a receptacle that engages with the conductive pin and contacts the first surface.

[0020] (17) In one embodiment, an electronic module includes the electronic component storage package according to any one of (12) to (16) above, an electronic component stored in a box, and a lid located on the box. [Brief description of the drawings]

[0021] [Figure 1] FIG. 2 is a perspective view of a plug according to one embodiment. [Diagram 2] FIG. 13 is a perspective view of the plug according to the embodiment, seen from another angle. [Diagram 3] 1 is an exploded perspective view of an electronic component storage package and an electronic module according to an embodiment; [Figure 4]FIG. 2 is a plan view of a plug and an electronic component storage package according to an embodiment. [Diagram 5] FIG. 5 is a diagram in which the plug is omitted from the diagram shown in FIG. 4. [Figure 6] 6 is a diagram of the electronic component mounting package shown in FIG. 4 cut along line VI-VI. [Figure 7] FIG. 7 is an enlarged view of a main part A shown in FIG. [Figure 8] FIG. 13 is a perspective view of a plug according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] In the invention described in Patent Document 1, in order to reduce impedance fluctuations, it is required to press the coaxial cable and the cylindrical fixing member (which may be collectively referred to as a receptacle) against the coaxial connector (also called a plug) to bring them into contact with each other, thereby reducing the gap between the coaxial connector. For this reason, even if pressed against the receptacle, there is a possibility of damage. There is a need for a plug that can reduce this possibility.

[0023] <Plug configuration> Hereinafter, some exemplary embodiments will be described with reference to the drawings. Although any direction of the plug may be the upper or lower direction, for convenience, a Cartesian coordinate system xyz is defined, and the positive side of the z direction is the upper direction. In addition, in this disclosure, the plan view is a concept including a planar perspective view.

[0024] 1 and 2, the plug 10 includes a metal body 1, an insulator 2, and a conductor pin 3. In this disclosure, the plug 10 may be referred to as, for example, a coaxial connector or a launcher, and refers to a part that is mated with a receptacle 6 described below.

[0025] The metal body 1 has a first surface 11s, a second surface 12s opposite to the first surface 11s, and a first through hole 1o penetrating from the first surface 11s to the second surface 12s. In a plan view, the metal body 1 may be rectangular or disk-shaped. Here, the first surface 11s can be defined as a surface that comes into contact with a receptacle 6 described below. The second surface 12s can be defined as a surface that faces a wall body 46 described below.

[0026] The disk shape referred to here may be any shape in which the first outer edge 11e is a circle, including an ellipse, and is not necessarily limited to a perfect circle. If the metal body 1 is circular, the metal body 1 can be easily manufactured, for example, by cutting. In addition, the receptacle 6 can press the metal body 1, thereby reducing the force applied to the metal body 1.

[0027] In one embodiment, the shape of the first through hole 1o is circular in a plan view, but the shape of the first through hole 1o may be polygonal, for example. When the shape of the first through hole 1o is circular, it is easy to manufacture the first through hole 1o by processing the metal body 1.

[0028] In one embodiment, the first through hole 1o may at least partially overlap with the central portion of the metal body 1. With this configuration, it is possible to easily manufacture the first through hole 1o by processing the metal body 1.

[0029] When the metal body 1 is disk-shaped, the diameter of the metal body 1 is, for example, 1.0 mm or more and 5.0 mm or less. The height of the metal body 1 (i.e., the dimension in the x direction) may be, for example, 0.5 mm or more and 3.0 mm or less. When the shape of the first through hole 1o is circular in a plan view, the diameter of the first through hole 1o is, for example, 0.25 mm or more and 1.5 mm or less.

[0030] Examples of the material of the metal body 1 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, or alloys containing these metal materials. The metal body 1 may be a single metal plate or a laminate of multiple metal plates. When the material of the metal body 1 is the above-mentioned metal material, a plating layer of nickel, gold, or the like may be formed on the surface of the metal body 1 by electroplating or electroless plating in order to reduce oxidation corrosion. The metal body 1 may be rephrased as a part generally called a flange.

[0031] The insulator 2 is located in the first through hole 1o. The insulator 2 has a third surface 23s located on the first surface 11s side, a fourth surface 24s opposite the third surface 23s, and a second through hole 2o penetrating from the third surface 23s to the fourth surface 24s. Here, the second through hole 2o may be formed by inserting a conductor pin 3, which will be described later, into the insulator 2 before curing.

[0032] The material of the insulator 2 may be, for example, silica glass containing silicon dioxide (SiO2) as a main component. Here, the term "main component" in this disclosure refers to at least the component with the highest content, for example, 50% or more in mass percent concentration. The insulator 2 may be so-called high-melting point glass or low-melting point glass. Specifically, low-melting point glass is amorphous or crystalline glass that softens, deforms, and flows at temperatures of 200°C to 600°C. Crystallizable glass refers to a composite of amorphous glass and crystalline material. Examples of low-melting point glass that can be used include borosilicate glass, barium borosilicate glass, zinc borate glass, barium borate glass, high silicic acid glass, aluminophosphate glass, phosphate glass, zinc phosphate glass, alkali glass, bismuth silicate glass, bismuth borosilicate glass, bismuth zinc borate glass, lead borosilicate glass, lead borate glass, potassium lead glass, and crystalline lead glass.

[0033] The conductor pin 3 is located in the second through hole 2o and protrudes from at least the third surface 23s. In other words, the conductor pin 3 does not necessarily have to protrude from the fourth surface 24s. When the conductor pin 3 does not protrude from the fourth surface 24s, the conductor pin 3 can be electrically connected to a circuit board 5 described below by a bonding wire or a brazing material. The conductor pin 3 may be located at the center of the first through hole 1o and the center of the second through hole 2o.

[0034] The material of the conductor pin 3 may be any material having electrical conductivity, such as metal materials such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or alloys containing these metal materials. The conductor pin 3 may also have a configuration in which the center portion is made of copper and the periphery is covered with another metal material (such as nickel).

[0035] When the conductive pin 3 has a circular shape in a plan view, the diameter of the conductive pin 3 may be, for example, not less than 0.1 mm and not more than 0.5 mm.

[0036] The metal body 1 further has a first groove portion 11K located on the first surface 11s. The first groove portion 11K is located with a space between it and the first outer edge 11e. With this configuration, when the metal body 1 is pressed by the receptacle 6, deformation of the metal body 1 in the portion outside the first groove portion 11K (i.e., in the direction toward the first outer edge 11e) is reduced, and the stress applied to the metal body 1 can be dispersed. This reduces the possibility that the plug 10 will be damaged. In one embodiment, the metal body 1 may have a plurality of first groove portions 11K.

[0037] Furthermore, with the above configuration, the bonding material 7 described below can be stored in the first groove portion 11K, so that the possibility that the bonding material 7 spreads more than necessary on the first surface 11s can be reduced.

[0038] 4, in the present disclosure, the distance L3 from the first groove portion 11K to the first outer edge 11e may be constant or may vary along the way. When the distance L3 from the first groove portion 11K to the first outer edge 11e is constant, the first groove portion 11K can be easily formed by cutting.

[0039] In a plan view, the width W of the first groove 11K may be constant. With this configuration, the stress applied to the metal body 1 can be dispersed relatively uniformly, further reducing the possibility of the plug 10 being damaged. The width W of the first groove 11K may be, for example, 0.05 mm or more and 0.3 mm or less. Also, the depth of the first groove 11K may be, for example, 0.01 mm or more and 0.25 mm or less. Here, the depth of the first groove 11K may be rephrased as the distance from the first surface 11s to the bottom of the first groove 11K in a cross-sectional view.

[0040] The first groove portion 11K may be located along the first outer edge 11e. The first groove portion 11K can be easily formed in the metal body 1 by cutting or the like. Moreover, with this configuration, the stress acting on the metal body 1 outside the first groove portion 11K can be dispersed relatively uniformly, thereby reducing the possibility of the metal body 1 being deformed.

[0041] In the present disclosure, the term "first groove portion 11K is located along the first outer edge 11e" may be rephrased as "the shape of first groove portion 11K is similar to the shape of first outer edge 11e." Furthermore, when the metal body 1 is circular, the term "first groove portion 11K is located along the first outer edge 11e" may be rephrased as "the distance L3 from the first groove portion 11K to the first outer edge 11e is constant."

[0042] As shown in FIG. 4, in a plan view, the distance L1 from the insulator 2 to the first outer edge 11e of the metal body 1 is greater than the distance L2 from the conductor pin 3 to the second outer edge 23e of the insulator 2. In other words, the thickness (dimension in the y or z direction) of the metal body 1 is greater than the thickness (dimension in the y or z direction) of the insulator 2. With this configuration, the area of ​​contact between the conductive part 62 of the receptacle 6 described below and the metal body 1 is increased, so that the stress applied to the entire metal body 1 can be alleviated compared to the case where the distance L1 from the insulator 2 to the first outer edge 11e of the metal body 1 is smaller than the distance L2 from the conductor pin 3 to the second outer edge 23e of the insulator 2. Therefore, the possibility of the metal body 1 being deformed can be reduced, and the possibility of the insulator 2 falling off from the metal body 1 can be reduced. In addition, the possibility of the insulator 2 and the conductor pin 3 being deformed or damaged due to the deformation of the metal body 1 can be reduced.

[0043] In a plan view, the first groove 11K may be ring-shaped. In other words, the first groove 11K may not be interrupted. When the plug 10 is joined to the wall body 46 using the joining material 7 described below, the possibility that the joining material 7 accumulates in the first groove 11K and spreads more than necessary on the first surface 11s can be reduced. Furthermore, with the above configuration, the stress applied to the metal body 1 can be distributed relatively uniformly, further reducing the possibility that the plug 10 will be damaged.

[0044] In a plan view, the distance L3 from the first groove 11K to the first outer edge 11e may be smaller than the distance L4 from the second outer edge 23e to the first groove 11K. In other words, the first groove 11K is located closer to the first outer edge 11e than the second outer edge 23e. The first groove 11K may be located closer to the first outer edge 11e than the contact point between the first surface 11s of the metal body 1 and the conductive portion 62. In other words, the first groove 11K does not have to be in contact with the conductive portion 62. With this configuration, it is possible to reduce the possibility that the bonding material 7 spreads on the first surface 11s to the contact point between the conductive portion 62 and the first surface 11s. Therefore, the receptacle 6 and the first surface 11s of the plug 10 can be stably contacted with each other. If the bonding material 7 spreads to the position where the conductive portion 62 of the receptacle 6 contacts the first surface 11s, a gap may be formed at the contact point between the receptacle 6 and the first surface 11s, which may cause impedance fluctuations, but with the above configuration, the conductive portion 62 of the receptacle 6 and the plug 10 can be fitted together with greater precision. Therefore, it is possible to reduce the possibility of impedance fluctuations occurring due to misalignment between the receptacle 6 and the plug 10.

[0045] More specifically, the distance L4 from the second outer edge 23e to the first groove portion 11K may be 1.2 to 3 times the distance L3 from the first groove portion 11K to the first outer edge 11e.

[0046] The metal body 1 may have a side surface 13s and an inclined surface 14s. Here, the side surface 13s connects the first surface 11s and the second surface 12s. The inclined surface 14s may be inclined from the second surface 12s to the side surface 13s. In other words, the metal body 1 may have a fillet shape on the second surface 12s side. With this configuration, when the metal body 1 is pressed by the receptacle 6, the metal body 1 may collide with a first recess 41 described below, which may reduce the possibility of damaging the metal body 1 and / or the wall 46. The side surface 13s is a protrusion. It can be defined as a surface that faces the inner wall surface of the first recess 41 when the lug 10 is positioned in the first recess 41 .

[0047] 7, the bonding material 7 can be accumulated between the first recess 41 and the inclined surface 14s, thereby improving the bonding strength between the plug 10 and the wall 46. Here, in one embodiment, the inclined surface 14s is a straight line in a cross-sectional view, but it may have a curved shape. More specifically, it may have a curved shape that is convex in a direction away from the insulator 2.

[0048] As shown in FIG. 1 and FIG. 2, when the direction in which the conductor pin 3 extends is defined as the first direction, the dimension Lx3 of the conductor pin 3 protruding from the third surface 23s in the first direction may be equal to or larger than the dimension Lx4 of the conductor pin 3 protruding from the fourth surface 24s in the first direction. Here, the first direction is, for example, the x-direction in the drawings. With the above-mentioned configuration, when the receptacle 6 is attached to the third surface 23s, the contact area that engages with the conductive portion 62 of the receptacle 6 increases, so that the possibility of the receptacle 6 and the plug 10 being detached can be reduced. Furthermore, the dimension Lx4 of the conductor pin 3 protruding from the fourth surface 24s in the first direction can be made shorter than the dimension Lx3 of the conductor pin 3 protruding from the third surface 23s in the first direction, so that the amount of protrusion of the conductor pin 3 into the box body 4 can be reduced. Therefore, the space for storing the electronic component 9 in the box body 4 can be expanded.

[0049] When the dimension Lx3 by which the conductor pin 3 protrudes from the third surface 23s in the first direction is equal to the dimension Lx4 by which the conductor pin 3 protrudes from the fourth surface 24s in the first direction, the amount of protrusion of the conductor pin 3 from the plug is equal, and the weight of the plug 10 can be balanced equally between the first surface 11s side and the second surface 12s side, thereby reducing the possibility of the plug 10 tilting when the plug 10 is positioned in the first recess 41 described below.

[0050] Moreover, by increasing the dimension Lx4 protruding from the fourth surface 24s, the area of ​​electrical connection between the conductive pin 3 and a wiring conductor 52 (described later) can be increased, and electrical continuity can be stabilized.

[0051] As shown in Fig. 7, in a cross-sectional view, the width W of the first groove portion 11K may become smaller from the first surface 11s toward the second surface 12s. In other words, in a cross-sectional view, the first groove portion 11K may have a tapered shape. With this configuration, when the metal body 1 is pressed by the receptacle 6, the stress applied to the metal body 1 can be efficiently dispersed. Note that, in a cross-sectional view, the shape of the first groove portion 11K is not limited to a triangular shape as shown in Fig. 7, and may be, for example, a shape in which one or two sides are curved.

[0052] Furthermore, the tip of the first groove 11K does not necessarily have to be sharp, and may be rounded or flat. In other words, the shape of the first groove 11K may be trapezoidal in cross-sectional view. Here, the "tip of the first groove 11K" refers to the portion closest to the second surface 12s.

[0053] As shown in FIG. 7, the third surface 23s may be recessed toward the inward side. With this configuration, the possibility that the third surface 23s will come into contact with the receptacle 6 can be reduced compared to when the third surface 23s protrudes toward the outward side. This allows the first surface 11s to come into contact with the receptacle 6 with high precision. Here, in the present disclosure, the inward side can be defined as the direction approaching the fourth surface 24s from the third surface 23s (for example, the negative direction of the x-axis in the drawings). The inward side can also be rephrased as the direction approaching the area surrounded by the box body 4 in the electronic component storage package 100 described below. On the other hand, the outer side can be defined as the direction approaching the third surface 23s from the fourth surface 24s (for example, the positive direction of the x-axis in the drawings). The outer side can also be rephrased as a direction away from the area surrounded by box body 4 in electronic component storage package 100 described below.

[0054] As shown in Fig. 8, the metal body 1 may have one or more second grooves 12K spaced apart from the first grooves 11K. This configuration can more effectively reduce the possibility that the bonding material 7 spreads over the first surface 11s. In addition, in a plan view, the second grooves 12K may be ring-shaped or may be partially interrupted. Also, there may be multiple second grooves 12K.

[0055] (Package for storing electronic components) As shown in FIG. 3, in one embodiment, an electronic component storage package 100 includes the above-mentioned plug 10 and a box 4.

[0056] 5, the box 4 has a first recess 41 in which the plug 10 is located, and a third through hole 4o that is connected to the first recess 41 and through which the conductor pin 3 passes. The first recess 41 has a first bottom surface 41b that contacts the second surface 12s. With this configuration, the plug 10 can be stably fixed to the box 4.

[0057] The first recess 41 may have a shape that follows the outer shape of the metal body 1 in a plan view. With this configuration, the metal body 1 can be stably positioned in the first recess 41.

[0058] The third through hole 4o extends to a spatial region surrounded by the box body 4. The third through hole 4o has a circular shape in a plan view, but may have, for example, a rectangular shape. When the third through hole 4o has a circular shape in a plan view and the conductor pin 3 has a cylindrical shape, the distance between the inner wall surface of the third through hole 4o and the conductor pin 3 can be made close to a constant, thereby reducing impedance fluctuations.

[0059] 3, in one embodiment, the box 4 may have a wall 46, a frame 45, a terminal portion 47, and a substrate 48. In this case, the wall 46 may have the first recess 41 and the third through hole 4o described above.

[0060] The material of the frame 45 may be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The material of the frame 45 may also be an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0061] The frame 45 may have a light-transmitting portion 45o penetrating the frame 45 from inside to outside. When the electronic component 9 is an optical semiconductor element such as a semiconductor laser (LD: Laser Diode) or a photodiode (PD: Photo Diode), light can be received and emitted through the light-transmitting portion 45o. The light-transmitting portion 45o may be located on a surface facing the wall 46 on which the plug 10 is located.

[0062] The material of the wall 46 may be the same as or different from the material of the frame 45. The material of the substrate 48 may be the same as or different from the materials of the frame 45 and the wall 46.

[0063] The terminal portion 47 serves to provide electrical continuity between the inside and outside of the box body 4. The terminal portion 47 may be, for example, a member in which a conductor is formed in ceramic.

[0064] A circuit board 5 may be located inside the box 4. The circuit board 5 may have an insulating substrate 51 and a wiring conductor 52 located on the insulating substrate 51. In this case, the conductor pin 3 protruding from the third through hole 4o may be electrically connected to the wiring conductor 52.

[0065] As shown in FIG. 7, the box 4 may further have a second recess 42 located on the first bottom surface 41b. The second recess 42 may be located with a gap between it and the insulator 2. The diameter of the second recess 42 may be smaller than the diameter of the first recess 41 and larger than the diameter of the insulator 2 and the diameter of the third through hole 4o. More specifically, the second recess 42 may not be in contact with the insulator 2. With this configuration, for example, even if the fourth surface 24s has a shape that protrudes inward due to a manufacturing error, the second surface 12s and the first bottom surface 41b can be stably in contact with each other, and the possibility that the plug 10 will tilt or shift can be reduced.

[0066] As shown in Figs. 5 to 7, the box 4 may further have a third recess 43 that is continuous with the first recess 41 and is located on the opposite side to the third through hole 4o. The third recess 43 may have a second bottom surface 43b where the first recess 41 is located. In addition, in a plan view, the third recess 43 may be larger than the first recess 41. The third recess 43 may be a space for holding a receptacle 6 described later. In this case, the third recess 43 and the case 61 of the receptacle 6 may have thread grooves that mesh with each other, and the receptacle 6 may be fitted into the third recess 43. Here, the third recess 43 being larger than the first recess 41 in a cross-sectional view means that it is spatially larger. More specifically, as shown in Fig. 5, when the third recess 43 is circular in a plan view, the diameter of the third recess 43 may be larger than the diameter of the first recess 41.

[0067] The first surface 11s may be located outward (in the x direction in the drawing) from the second bottom surface 43b in a cross-sectional view. This configuration allows the conductive portion 62 of the receptacle 6 to stably contact the first surface 11s. This reduces the possibility that the impedance value will deviate from a desired value.

[0068] The box 4 may further include a bonding material 7 located between the box 4 and the plug 10. The box 4 may further include a step portion 423 that connects the third recess 43 and the first recess 41 and is located on the second bottom surface 43b. The bonding material 7 may be located from between the first recess 41 and the plug 10 to the step portion 423. This configuration can increase the amount of bonding material 7 located between the metal body 1 and the box 4, thereby improving the bonding strength between the plug 10 and the box 4. In addition, as shown in FIG. 7, the bonding material 7 can be located from the step portion 423 to the first groove portion 11K, thereby further improving the bonding strength between the plug 10 and the box 4.

[0069] The material of the bonding material 7 may be any material that can hermetically seal the inside and outside of the box body 4, such as gold-tin, silver epoxy resin, solder, silver paste, etc. If the surface of the metal body 1 is gold plated, the bonding material 7 may be any material that has a melting point lower than that of gold. This configuration can reduce the possibility that the gold plating on the surface of the metal body 1 will melt.

[0070] 3, 6 and 7, electronic component storage package 100 further includes a receptacle 6 that engages with conductive pin 3 and contacts first surface 11s. Receptacle 6 may include a conductive portion 62 that engages with conductive pin 3, and a case 61 that is positioned to surround conductive portion 62.

[0071] (Electronic Module) As shown in FIG. 3, an electronic module 101 includes an electronic component storage package 100, an electronic component 9 housed in a box 4, and a lid 8 located on the box 4. The electronic component storage package 100 includes an electronic component 9 housed in a box 4, and a lid 8 located on the box 4.

[0072] The electronic component 9 may be a component that performs signal processing, such as converting a radio signal or an optical signal into an electrical signal, or converting an electrical signal into an optical signal or a radio signal. In one embodiment, the electronic component 9 may be located directly on the substrate 48, or indirectly on the substrate 48 via a heat dissipation member. The electronic component 9 may also be located on the circuit board 5 described above, for example.

[0073] Examples of the electronic component 9 include optical semiconductor elements such as a semiconductor laser (LD) or a photodiode (PD), a semiconductor integrated circuit element, a sensor element such as an optical sensor, and a power amplifier IC. The electronic component 9 can be formed of a semiconductor material such as gallium arsenide or gallium nitride. When the electronic component 9 is an optical semiconductor element, the electronic module 101 can be used as an optical communication module.

[0074] The lid body 8 is located on the frame body 45. The lid body 8 protects the electronic components 9 together with the frame body 45. Examples of the material for the lid body 8 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, and tungsten, and alloys of a combination of a plurality of these metal materials.

[0075] The electronic module 101 may further include a seal ring located between the cover 8 and the frame 45. The seal ring may be located on the frame 45 and surround the electronic components 9 in a plan view. When no seal ring is provided on the frame 45, the cover 8 may be joined onto the frame 45 via an adhesive such as solder, brazing material, glass, or a resin adhesive.

[0076] It should be noted that various combinations of the embodiments and modifications are not limited to the above-described embodiments, and combinations of the embodiments and modifications may also be possible. [Explanation of symbols]

[0077] 1 metal body 11s 1st page 11e First Outer Boundary 12s 2nd page 13s side 14s slope 1o 1st through hole 11K First Groove 12K 2nd groove 2. Insulator 23s 3rd page 24s 4th page 23e Second Outer Edge 2o 2nd through hole 3 Conductor pin 4 box body 41 First recess 41b 1st bottom 42 Second recess 43 Third recess 43b 2nd bottom 423 Step 4o 3rd through hole 45 Frame 45o transparent part 46 Wall 47 Terminal section 48 Substrate 5 Circuit Board 51 Insulating substrate 52 Wiring conductor 6 Receptacles 61 cases 62 Conductive part 7 Bonding material 8 Lid 9. Electronic Components 10 Plug 100 Electronic component storage packages 101 Electronic Module

Claims

1. a metal body having a first surface, a second surface opposite to the first surface, and a first through hole penetrating from the first surface to the second surface; an insulator having a third surface located at the first through hole and located on the first surface side, a fourth surface opposite to the third surface, and a second through hole penetrating from the third surface to the fourth surface; a conductive pin located in the second through hole and protruding from at least the third surface, The metal body further includes a first groove portion located on the first surface, The first groove portion is positioned in spaced relation to a first outer edge of the metal body.

2. The plug of claim 1 , wherein the first groove is located along the first outer edge.

3. 2. The plug according to claim 1, wherein in a plan view, a minimum distance L1 from the insulator to the first outer edge is greater than a minimum distance L2 from the conductive pin to a second outer edge of the insulator.

4. The plug according to claim 2 , wherein the first groove portion is ring-shaped in a plan view.

5. The plug according to claim 1 , wherein the metal body has a side surface connecting the first surface and the second surface, and has an inclined surface that slopes from the second surface to the side surface.

6. When a direction in which the conductive pin extends is defined as a first direction, 2. The plug according to claim 1, wherein a dimension by which the conductor pin protrudes from the third surface in the first direction is equal to or greater than a dimension by which the conductor pin protrudes from the fourth surface in the first direction.

7. The plug according to claim 6 , wherein the metal body is disk-shaped in a plan view.

8. 2. The plug according to claim 1, wherein in a cross-sectional view, a width of said first groove portion decreases from said first surface toward said second surface.

9. The plug according to claim 3 , wherein in a plan view, a minimum distance L3 from the first groove portion to the first outer edge is smaller than a minimum distance L4 from the second outer edge to the first groove portion.

10. The plug of claim 1 , wherein the third surface is inwardly concave.

11. The plug according to claim 4 , wherein the metal body has one or more second grooves spaced apart from the first grooves.

12. The plug according to claim 1 ; a box having a first recess in which the plug is located and a third through hole connected to the first recess and through which the conductor pin passes; The first recess has a first bottom surface in contact with the second surface.

13. The box further includes a second recess located on the first bottom surface, The second recess is located with a space between the insulator and the second recess.

13. The electronic component storing package according to claim 12, wherein a diameter of the second recess is smaller than a diameter of the first recess and is larger than a diameter of the insulator and a diameter of the third through hole.

14. the box body further includes a third recess that is continuous with the first recess and is located on an opposite side to the third through hole, the third recess has a second bottom surface on which the first recess is located and is larger than the first recess in a plan view; The electronic component storage package according to claim 10 , wherein the first surface is located outwardly of the second bottom surface in a cross-sectional view.

15. Further comprising a bonding material located between the box body and the plug, the box body further includes a step portion that connects the third recess and the first recess and is located on the second bottom surface, The electronic component housing package according to claim 14 , wherein the bonding material is positioned from between the first recess and the plug to the step portion.

16. The electronic component storage package according to claim 12 , further comprising a receptacle that engages with the conductive pin and contacts the first surface.

17. An electronic component storage package according to any one of claims 12 to 16, An electronic component housed in the box; and a lid positioned on the box.

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