Antistatic method for assembled board and assembled board

Abstract

To prevent static electricity from being charged on each circuit board without reducing manufacturing efficiency when manufacturing a mounting board by mounting electronic components on each circuit board in an assembled board with a plurality of circuit boards.SOLUTION: An assembled board 2 comprises: a plurality of circuit boards 21 to 28, each of which is composed of a substrate consisting of an insulating substrate and a conductive metal layer, and in which a wiring pattern of an electric circuit is formed by the metal layer; a discarded substrate 30 placed around a plurality of circuit boards; and connections 41-48, which connect them in a divisible manner. In connections, wiring patterns 61-68 for connection are formed to connect ground patterns 51-58 of each circuit board to a metal layer of the discarded substrate, and the discarded substrate has connection terminals 70 for connecting its metal layer to external devices as a common ground.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an aggregate substrate including a plurality of circuit boards and a method for preventing static electricity in the aggregate substrate. [Background technology]

[0002] For example, Patent Document 1 describes that when inspecting a mounted board having electronic components mounted thereon, the earth part of the circuit board is grounded by contacting an earth probe pin with an earth part such as an earth land on the surface of the circuit board or a pattern for mounting to a housing.

[0003] In other words, the inspection device described in Patent Document 1 uses an earth probe pin to ground the earth part of the circuit board, thereby preventing electrostatic breakdown of the mounting board due to unnecessary voltage and current caused by static electricity generated during inspection of the circuit board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-242064 Summary of the Invention [Problem to be solved by the invention]

[0005] The technology described in Patent Document 1 is a technology for preventing electrostatic breakdown of a mounting board when inspecting the mounting board, but electrostatic breakdown also occurs when mounting electronic components on a circuit board to manufacture the mounting board. Therefore, the technology described in Patent Document 1 can also be applied to manufacturing equipment for mounting boards.

[0006] Incidentally, a plurality of circuit boards may be simultaneously manufactured as an aggregate board using one board. In this case, in the manufacturing process for manufacturing the mounted board, electronic components are mounted on the plurality of circuit boards in the state of the aggregate board. Therefore, in order to prevent electrostatic breakdown using the technology described in Patent Document 1, it is necessary to ground each of the plurality of circuit boards constituting the aggregate board using a grounding probe pin. However, in this case, it is necessary to adjust the position of the grounding probe pin and the biasing force to the circuit board for each circuit board, and the adjustment work is troublesome. In particular, in the aggregate board, a plurality of manufacturing processes are set depending on the type of electronic components to be mounted on the circuit board and the mounting surface of the electronic components, and the adjustment work needs to be performed for each manufacturing process, which reduces the manufacturing efficiency of the mounted board.

[0007] One aspect of the present disclosure is to provide an aggregate board including multiple circuit boards, capable of preventing each circuit board from being charged with static electricity without reducing manufacturing efficiency when mounting electronic components on each circuit board to manufacture a mounted board. [Means for solving the problem]

[0008] An aggregate substrate (2) according to one aspect of the present disclosure is constituted by a single substrate having insulating substrates (4, 6, 8) and conductive metal layers (12, 14, 16, 18) laminated on the insulating substrates. The aggregate substrate also includes a plurality of circuit substrates (21-28) on which electrical circuit wiring patterns are formed by the metal layers, a sacrificial substrate (30) disposed around the plurality of circuit substrates, and connecting portions (41-48) that connect the plurality of circuit substrates and the sacrificial substrate in a separable manner.

[0009] A plurality of connection wiring patterns (61-68) are formed in the coupling portion. The plurality of connection wiring patterns are formed of a metal layer extending from a ground pattern (51-58) that serves as the ground potential of the electric circuit among the wiring patterns of the plurality of circuit boards. The plurality of connection wiring patterns connect the ground patterns of the plurality of circuit boards to the metal layer of the sacrificial board.

[0010] In addition, in the sacrificial board, a connection terminal portion (70) for connecting to an external device is provided on the metal layer connected to the ground wiring pattern as a common ground for the multiple circuit boards.

[0011] According to the aggregate board of the present disclosure configured in this manner, when electronic components are mounted on multiple circuit boards to manufacture multiple mounted boards, the ground patterns of the multiple circuit boards can be grounded simultaneously by connecting the earth electrode of the manufacturing equipment to the connection terminal portion of the waste board. Therefore, during the manufacture of the mounted boards, static electricity charged on the boards and circuits can be released to the manufacturing equipment side, and failure of the electronic components mounted on the multiple circuit boards can be suppressed.

[0012] Furthermore, even if the mounting board is manufactured through multiple processes, charging of each circuit board can be suppressed by simply connecting an earth electrode to the connection terminal in each manufacturing process. Therefore, there is no need to take measures against charging for each circuit board using an earth probe pin or the like, and multiple mounting boards can be manufactured efficiently. [Brief description of the drawings]

[0013] [Figure 1] 1 is an explanatory diagram illustrating a multilayer substrate constituting an aggregate substrate of an embodiment. [Diagram 2] FIG. 2 is a plan view showing a second layer substrate surface that serves as a solid ground for multiple circuit boards in an aggregate substrate. [Diagram 3] 4 is a cross-sectional view showing the configuration of a connection terminal portion provided on the collective substrate and a state in which a ground electrode is connected to the connection terminal portion. FIG. [Figure 4] 5A to 5C are explanatory diagrams illustrating an example of a manufacturing process for manufacturing a mounted board by mounting electronic components on the aggregate board of the embodiment. [Diagram 5] 5 is a plan view illustrating a second-layer substrate surface of a mounting substrate manufactured by the manufacturing process shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, embodiments of the present disclosure will be described. [Configuration of the embodiment] As shown in FIG. 1, the aggregate substrate 2 of this embodiment is composed of three insulating substrates 4, 6, 8 and conductive metal layers 12, 14, 16, 18 arranged between and on the top and bottom surfaces of each of the insulating substrates 4, 6, 8, which are stacked together to form a single substrate.

[0015] 2, the board surface of collective board 2 is separated into an area of ​​eight circuit boards 21, 22, 23, 24, 25, 26, 27, 28 and an area of ​​sacrificial board 30 arranged around these circuit boards 21-28 and between adjacent circuit boards 21-28. The circuit boards 21-28 and the sacrificial board 30 are connected to each other by connecting portions 41, 42, 43, 44, 45, 46, 47, 48 around the circuit boards 21-28.

[0016] Furthermore, wiring patterns of electric circuits are formed on the circuit boards 21-28 by etching the metal layers 12-18 or the like during the manufacture of the aggregate substrate 2 (that is, before the insulating substrates 4-8 are laminated together).

[0017] In addition, in the circuit boards 21 to 28, the second metal layer 14 from the top forms ground patterns 51, 52, 53, 54, 55, 56, 57, and 58, which are wiring patterns that serve as a reference potential, over the entire board surface of the circuit boards 21 to 28. That is, in the circuit boards 21 to 28, the metal layer 14 serves as a so-called solid ground.

[0018] 2, a large number of circles or ellipses are drawn on each of ground patterns 51 to 58, which are solid grounds on circuit boards 21 to 28. These represent inter-layer signal paths constituted by through-holes or the like provided in each of circuit boards 21 to 28.

[0019] The interlayer signal paths are intended to connect the wiring patterns formed in the metal layers 12-18 of the respective layers in the circuit boards 21-28, and to connect electronic components mounted on the front and back surfaces of the circuit boards 21-28 to the wiring patterns in the inner layers. In the circuit boards 21-28, the ground patterns 51-58 configured as solid ground in the second metal layer 14 are connected to the ground patterns formed in the other metal layers 12, 16, 18 via the through holes or the like.

[0020] Next, in the coupling portions 41 to 48, when the collective substrate 2 is manufactured, all of the metal layers 12 to 18 are removed by etching or the like, except for the connection wiring patterns 61, 62, 63, 64, 65, 66, 67, and 68 formed of the second metal layer 14.

[0021] Furthermore, the connecting portions 41 to 48 are provided with slits 41s, 42s, 43s, 44s, 45s, 46s, 47s, and 48s for separating the circuit boards 21 to 28 from the aggregate substrate 2. As shown by hatching in Fig. 2, the slits 41s to 48s are elongated along the length of the connecting portions 41 to 48, and are formed in plurality by appropriately dividing the connecting portions 41 to 48.

[0022] Therefore, by utilizing the slits 41s-48s, the collective substrate 2 can easily and neatly separate the circuit boards 21-28 from the adjacent discarded substrate 30 and the other circuit boards 21-28. By separating the circuit boards 21-28 from the collective substrate 2 in this manner, the circuit boards 21-28 each constitute an independent electric circuit.

[0023] Next, the connection wiring patterns 61-68 of the coupling portions 41-48 are formed by a metal layer 14 extending from part of the outer periphery of the ground patterns 51-58 of the circuit boards 21-28, and are connected to the same metal layer 14 on the sacrificial board 30.

[0024] In addition, the width of the connecting wiring patterns 61-68 is set to the minimum width that allows electrical continuity between the ground patterns 51-58 and the metal layer 14 of the throwaway substrate 30 so that they are at the same potential and are cut when the circuit boards 21-28 are separated from the aggregate substrate 2.

[0025] As a result, the ground patterns 51-58 of the circuit boards 21-28 are all at the same potential as the metal layer 14 of the sacrificial board 30, and by grounding a portion of the metal layer 14 of the sacrificial board 30, the ground patterns 51-58 of the circuit boards 21-28 can be grounded simultaneously.

[0026] In order to enable the circuit boards 21 to 28 to be grounded using the metal layer 14 of the sacrificial board 30 as a common ground 32, the sacrificial board 30 is provided with a connection terminal portion 70 for connecting a ground electrode for grounding.

[0027] As shown in FIG. 3A, the connection terminal portion 70 is provided in a positioning hole 80 for positioning the aggregate substrate 2 in a manufacturing device when electronic components are mounted on the front and back surfaces of the circuit boards 21-28 to fabricate a mounting board that constitutes an electric circuit.

[0028] Specifically, the connection terminal portion 70 is configured as a so-called through hole by applying metal plating to the inner wall of a positioning hole 80 provided at a corner portion on the outer periphery of the collective substrate 2. The connection terminal portion 70 is connected to the second metal layer 14 in the sacrificial substrate 30. Note that the connection terminal portion 70 may be connected to the other metal layers 12, 16, and 18.

[0029] Here, as shown in FIG. 3A, the multilayer substrate constituting the aggregate substrate 2 is integrated as a laminate of multiple substrates by providing adhesive layers 9, 9 made of an adhesive between insulating substrates 4 and 6 with metal layer 14 sandwiched therebetween, and between insulating substrates 6 and 8 with metal layer 16 sandwiched therebetween.

[0030] Also, resist 10 is provided on the front and back surfaces of collective substrate 2 to protect the front and back surfaces of collective substrate 2, except for the wiring patterns on the front and back surfaces of circuit boards 21-28 and the portions (i.e., pads or lands) where various components are soldered via through holes. Resist 10 is not provided on either end portion of positioning hole 80 of throwaway substrate 30. This is to enable an earth electrode to be electrically connected to connection terminal portion 70. [Effects of the embodiment] As described above, in aggregate board 2 of the present embodiment, ground patterns 51-58 of circuit boards 21-28 are connected to metal layer 14 of sacrificial board 30 via connecting wiring patterns 61-68. Also, sacrificial board 30 is provided with positioning hole 80, and positioning hole 80 is configured as a through-hole connected to metal layer 14 by having its inner wall metal-plated.

[0031] 3B, the ground patterns 51-58 of the circuit boards 21-28 can be grounded simultaneously by inserting a rod-shaped earth electrode 90 into the hole of the connection terminal portion 70. In addition, by using a metal positioning pin for the earth electrode 90 inserted into the hole of the connection terminal portion 70, the assembly board 2 can be positioned in the manufacturing device.

[0032] Therefore, when mounting electronic components on the circuit boards 21-28 of the collective substrate 2 to manufacture multiple independent mounted substrates, the earth electrode 90, which is a positioning pin of the manufacturing equipment, is inserted into the hole of the connection terminal portion 70, in other words, the positioning hole 80 of the collective substrate 2, to position the collective substrate 2.

[0033] Then, the ground patterns 51-58 of the circuit boards 21-28 all have the same potential and are grounded to the earth of the manufacturing equipment, so that static electricity generated on the circuit boards 21-28 during manufacturing can be released to the manufacturing equipment side. Therefore, during the manufacturing of the mounting board, it is possible to prevent the circuit boards 21-28 and the electronic components mounted on the circuit boards 21-28 from being charged with static electricity, which causes the electric circuit configured in the mounting board to break down.

[0034] In addition, since the manufacturing process for producing the circuit boards 21 to 28 of the aggregate substrate 2 as independent mounting substrates is divided into multiple steps P01 to P12 as illustrated in FIG. 4, antistatic measures for the circuit boards 21 to 28 must be implemented appropriately for each step.

[0035] In contrast, according to the collective substrate 2 of the present embodiment, simply by inserting a metal positioning pin connected to the earth of the manufacturing facility as an earth electrode 90 into the positioning hole 80 of the collective substrate 2, it is possible to prevent the circuit substrates 21 to 28 from becoming charged.

[0036] Therefore, according to the aggregate substrate 2 of this embodiment, even if the manufacturing process is divided into multiple steps, there is no need to take special antistatic measures for each step, and the circuit substrates 21 to 28 can be extremely easily prevented from becoming charged.

[0037] Here, the manufacturing process of the mounting board shown in FIG. 4 will be described. 4, first, in step P01, a chip mounter is used to mount an SMD (i.e., a Surface Mount Device), which is an electronic component for surface mounting, on a first surface, which is one side of each of the circuit boards 21 to 28. Then, in step P02, the SMD mounted on the first surface of each of the circuit boards 21 to 28 is soldered to a pad or a land on the first surface by reflow soldering.

[0038] Furthermore, in process P03, SMDs are mounted on the second surfaces, opposite the first surfaces, of the circuit boards 21-28 using a chip mounter, and in the subsequent process P04, the SMDs mounted on the second surfaces of the circuit boards 21-28 are soldered by reflow soldering.

[0039] Once the SMDs have been soldered to the first and second surfaces of the circuit boards 21-28 in this manner, in step P05, electronic components other than the SMDs, such as relays, are assembled onto the circuit boards 21-28, and in the subsequent step P06, local soldering of the assembled electronic components is performed.

[0040] Furthermore, in process P07, ID marking is performed to inscribe identification information such as the name and model number of the board on the circuit boards 21 to 28. Note that in processes P05 and P07, ionizers are installed to suppress the generation of static electricity.

[0041] Next, in process P08, an automatic appearance inspection is performed in which the appearances of the first and second sides of the circuit boards 21-28 are inspected by image processing using a dedicated inspection device. In addition, in process P09, data is written to the flash memories mounted on the circuit boards 21-28 using a specified jig. Then, in process P10, a drip-proof material is applied to the front and back surfaces of the collective board 2 and dried, thereby completing the collective board 2 in which electronic components are mounted on the circuit boards 21-28.

[0042] Next, in process P11, the assembly board 2 on which the electronic components are mounted as described above is divided into circuit boards 21-28 using a board divider to produce a plurality of single mounting boards 100 as shown in Fig. 5. Note that, also in process P11, an ionizer is installed to suppress the generation of static electricity.

[0043] Finally, in step P12, each of the mounting boards 100 divided into the circuit boards 21 to 28 in step P11 is packed in a predetermined packing material, completing the manufacturing process of the mounting board.

[0044] In the above manufacturing process, in steps P01 to P10 before dividing the substrate, electronic components are mounted on the plurality of circuit boards 21 to 28 in the state of the collective substrate 2, and a mounted substrate is produced for each of the circuit boards 21 to 28. Also, in steps P01 to P10, ionizers are appropriately installed to prevent the circuit boards 21 to 28 and the electronic components from becoming charged.

[0045] However, when producing multiple mounting boards from aggregate substrate 2 in the above-mentioned manufacturing process, it is difficult to prevent multiple circuit boards 21-28 from becoming charged with static electricity using only an ionizer, and some of multiple circuit boards 21-28 may become charged with static electricity, which may lead to circuit failure.

[0046] In contrast to this, in the aggregate substrate 2 of this embodiment, the positioning holes 80 of the disposable substrate 30 are made through-all, and thereby connection terminal portions 70 connected to the ground patterns 51-58 of the circuit substrates 21-28 are provided. Then, in each of the above-mentioned processes P01-P12, the circuit substrates 21-28 can be prevented from being charged by inserting the earth electrodes 90, which are positioning pins, into the holes of the connection terminal portions 70. Therefore, this method of preventing charging can be achieved extremely simply, since it is only necessary to insert the positioning pins of a manufacturing device into the holes of the connection terminal portions 70, i.e., the positioning holes 80, to position the aggregate substrate 2.

[0047] Furthermore, in the collective substrate 2 of the present embodiment, the connecting wiring patterns 61-68 are formed from the second metal layer 14 of the coupling portions 41-48. Therefore, compared to when the connecting wiring patterns 61-68 are formed from the metal layer 12 or 18 on the front or back surface of the collective substrate 2, it is possible to reduce metal waste generated when the collective substrate 2 is divided in step P11.

[0048] [Other embodiments] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments and can be implemented in various modified forms.

[0049] For example, in the above embodiment, the collective substrate 2 is described as being composed of a multilayer substrate in which insulating substrates and metal layers are alternately laminated. However, even if the collective substrate 2 is a double-sided substrate or a single-sided substrate in which metal layers are laminated on the front and back surfaces or one side of an insulating substrate, the same effects as those of the above embodiment can be obtained by applying the present disclosure.

[0050] In other words, the present disclosure can be applied in the same manner as in the above embodiment to an aggregate substrate formed by dividing the substrate surface of a printed circuit board into a plurality of circuit substrates and a waste substrate. Therefore, the number of insulating substrates or metal layers to be stacked when forming an aggregate substrate as a multilayer substrate, or the number of circuit substrates formed in the aggregate substrate, can be appropriately changed from those in the above embodiment.

[0051] In the above embodiment, the number of connection terminal portions 70 provided on the disposable substrate 30 has been described as one, but the number of connection terminal portions 70 may be multiple by providing positioning holes 80 configured as through holes by metal plating in multiple corners of the collective substrate 2. In addition, the connection terminal portions 70 do not necessarily need to be provided in the positioning holes 80 of the collective substrate 2, and may be provided in any position of the disposable substrate 30 as appropriate.

[0052] Furthermore, the present disclosure can be realized in various forms, such as the antistatic method for manufacturing the above-mentioned aggregate substrate 2 and mounting substrate, a mounting substrate constituted as a single unit by dividing the aggregate substrate 2, or an electric circuit device constituted using this mounting substrate. [Explanation of symbols]

[0053] 2...assembly board, 4-8...insulating board, 12-18...metal layer, 21-28...circuit board, 30...disposable board, 41-48...connection portion, 51-58...ground pattern, 61-68...connection wiring pattern, 70...connection terminal portion.

Claims

1. The device is constructed of a single substrate having an insulating substrate (4, 6, 8) and a conductive metal layer (12, 14, 16, 18) laminated on the insulating substrate, A plurality of circuit boards (21 to 28) on which wiring patterns of electric circuits are formed by the metal layer; a waste substrate (30) disposed around the plurality of circuit substrates; a connecting portion (41 to 48) for connecting the plurality of circuit boards and the waste board in a separable manner; An assembly substrate comprising: In the coupling portion, a plurality of connection wiring patterns (61 to 68) are formed, which connect the ground patterns of the plurality of circuit boards to the metal layer of the sacrificial board by the metal layer extending from a ground pattern (51 to 58) that serves as a ground potential of the electric circuit, among the wiring patterns of the plurality of circuit boards; In the disposable board, the metal layer connected to the ground wiring pattern is provided with a connection terminal portion (70) for connecting to an external device as a common ground for the multiple circuit boards, forming an aggregate board.

2. The assembly substrate according to claim 1 , The assembly substrate is composed of a multilayer substrate in which a plurality of the insulating substrates and the metal layers are alternately stacked, In the plurality of circuit boards, one of the metal layers laminated between the insulating substrates is a solid ground that serves as the ground pattern over the entire surface of the circuit board, An aggregate board, wherein the multiple connection wiring patterns are configured to connect the metal layer in the same layer as the solid ground in the throwaway board to the solid grounds of the multiple circuit boards, respectively.

3. The assembly substrate according to claim 2, the waste board is provided with a positioning hole (80) for positioning the aggregate board when manufacturing a plurality of mounted boards by mounting electronic components on each of the plurality of circuit boards, The inner wall of the positioning hole is metal-plated to form a through hole that constitutes the connection terminal portion.

4. A manufacturing process for manufacturing a plurality of mounted boards by mounting electronic components on each of the plurality of circuit boards constituting the aggregate board according to any one of claims 1 to 3, A method for preventing electrostatic charging of an aggregate substrate, comprising connecting an earth electrode (90) of a manufacturing device to the connection terminal portion of the aggregate substrate, and simultaneously grounding the ground patterns of the multiple circuit substrates, thereby preventing the multiple circuit substrates from being charged with static electricity.

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