Burn-in device

Abstract

To provide a burn-in device with which it is possible to suppress an increase in the number of measured DUTs per occupied area of the device and in transmission losses of signals.SOLUTION: A burn-in device 1 comprises: a burn-in board 20; a burn-in chamber 11; a heat insulating chamber 30 partitioned from the burn-in chamber 11 by a wall 115a and partitioned from the ambient air by a wall 60; and a function board 50. The wall 115a includes a top board 40, and the burn-in board 20 and the top board 40 are electrically connected as a connector 23 and a connector 42 fit to each other. The function board 50 enters the inside of the heat insulating chamber 30 via an opening 61 formed in the wall 60, and the function board 50 and the top board 40 are electrically connected as a connector 52 and a connector 43 fit to each other.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a burn-in device. [Background technology]

[0002] 2. Description of the Related Art Burn-in devices that test DUTs (Device Under Test) in high-temperature or low-temperature environments for the purpose of removing electronic components with initial defects are known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-138609 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above burn-in equipment, the burn-in board and the driver board are connected by a relay board to insulate the heating layer that houses the burn-in board and heats the DUTs mounted on the burn-in board. In such burn-in equipment, the relay board increases the size of the equipment, limiting the number of DUTs that can be measured per unit area of ​​the equipment. In addition, there is a problem that signal transmission loss occurs between the burn-in board and the driver board because the signal passes through the relay board.

[0005] An object of the present invention is to provide a burn-in apparatus capable of increasing the number of DUTs measured per area occupied by the apparatus and suppressing signal transmission loss. [Means for solving the problem]

[0006] [1] A first aspect of the present invention is a burn-in device comprising: a burn-in board including a socket on which a DUT is attached, a first substrate on which the socket is mounted, and a first connector mounted on the first substrate; a chamber for accommodating the burn-in board; a heat-insulating chamber separated from the chamber by a first wall and from the outside air by a second wall; and a function board including a second substrate and a second connector mounted on the second substrate, wherein the first wall includes a top board including a third substrate, a third connector mounted on one main surface of the third substrate, and a fourth connector mounted on the other main surface of the third substrate, wherein the first connector and the third connector are engaged to electrically connect the burn-in board and the top board, and the function board enters the heat-insulating chamber through an opening formed in the second wall, and the second connector and the fourth connector are engaged to electrically connect the function board and the top board.

[0007] [2] A second aspect of the present invention may be the burn-in apparatus of the first aspect, further comprising a dry air supplying device that supplies dry air to the thermal insulation chamber.

[0008] [3] A third aspect of the present invention is the burn-in apparatus of the second aspect, which may further include a heating device for heating the dry air.

[0009] [4] A fourth aspect of the present invention is a burn-in apparatus according to the third aspect, which may further include a temperature sensor for measuring a temperature in the chamber, and a control device for controlling the heating device based on a measurement result of the temperature sensor.

[0010] [5] A fifth aspect of the present invention may be a burn-in apparatus according to the fourth aspect, wherein the control device controls the heating device to heat the dry air when the temperature in the chamber is below a predetermined temperature, and not to heat the dry air when the temperature in the chamber is equal to or higher than the predetermined temperature.

[0011] [6] A sixth aspect of the present invention may be the burn-in apparatus according to the fifth aspect, wherein the predetermined temperature is a temperature value of 0° C. or less.

[0012] [7] A seventh aspect of the present invention is a burn-in apparatus according to any one of the first to sixth aspects, wherein the burn-in apparatus is provided with a sealing member that seals the gap between the opening in the second wall and the function board.

[0013] [8] Aspect 8 of the present invention may be a burn-in apparatus according to any one of aspects 1 to 7, wherein the function board includes a first portion penetrating the interior of the insulated chamber through the opening and a second portion located outside the insulated chamber.

[0014] [9] A ninth aspect of the present invention is the burn-in apparatus of the eighth aspect, further comprising a fan that blows air to the second portion to cool the function board.

[0015]

[10] A tenth aspect of the present invention may be a burn-in apparatus according to any one of the first to ninth aspects, wherein the function board is mounted on the second substrate and includes a control circuit for inputting and outputting signals to the DUT. Effect of the Invention

[0016] In the present invention, the burn-in board and the top board are electrically connected via the first connector and the third connector, and the function board and the top board are electrically connected via the second connector and the fourth connector. Therefore, there is no need to use other members to connect the burn-in board and the function board, and the size of the burn-in equipment can be reduced to increase the number of DUTs measured per area occupied by the equipment. In addition, since the burn-in board and the function board are connected via the top board and the first to fourth connectors, and the communication path between the burn-in board and the function board is short, the signal transmission loss between the burn-in board and the function board can be reduced. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a front view showing a burn-in device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a side cross-sectional view of a burn-in apparatus according to an embodiment of the present invention. [Diagram 3] FIG. 3 is a view corresponding to the section III-III in FIG. [Figure 4] FIG. 4 is an enlarged view corresponding to part IV in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0019] The overall configuration of the burn-in apparatus 1 in this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a front view of the burn-in apparatus in this embodiment, Figure 2 is a side cross-sectional view of the burn-in apparatus in this embodiment, Figure 3 is a view corresponding to part III-III in Figure 2, and Figure 4 is an enlarged view corresponding to part IV in Figure 2.

[0020] The burn-in apparatus 1 in this embodiment is an apparatus for performing a burn-in test, which is a type of screening test for the purpose of detecting initial defects in an electronic device under test (DUT: Device Under Test) such as a semiconductor integrated circuit element, and removing the initial defective products.

[0021] As shown in Figs. 1 to 3, the burn-in apparatus 1 includes a burn-in chamber 11, a burn-in board 20, a function board 50, and a heat-insulating chamber 30. The burn-in board 20 is a wiring board having a plurality of sockets 22 arranged in a matrix on a substrate 21, and a DUT 100 can be detachably mounted thereon. The burn-in chamber 11 can accommodate a plurality of burn-in boards 20. The function board 50 is a wiring board that inputs voltages and signals to the DUT 100 mounted on the burn-in board 20. The heat-insulating chamber 30 insulates the burn-in chamber 11 from the outside air.

[0022] The burn-in apparatus 1 performs screening of the DUT 100 by applying a power supply voltage and a signal to the DUT 100 while applying a low-temperature thermal stress (e.g., about −55° C. to −10° C.) to the DUT 100 mounted on the burn-in board 20 housed in the burn-in chamber 11. The thermal stress applied to the DUT 100 may be a room temperature or high temperature thermal stress (e.g., about +25° C. to +180° C.).

[0023] 1, the burn-in chamber 11 is partitioned by a heat insulating wall or the like and has a temperature-controlled room 111 capable of housing the burn-in board 20, and a door 112 capable of opening and closing the temperature-controlled room 111. A plurality of slots 113 for holding the burn-in board 20 are provided in the temperature-controlled room 111. Each slot 113 has a pair of rails 114 supporting both the left and right ends of the burn-in board 20. The burn-in board 20 is carried into the temperature-controlled room 111 through the door 112 while sliding on the rails 114. Two rows of 24-level slots 113 are provided in the temperature-controlled room 111, making it possible to house a total of 48 burn-in boards 20.

[0024] In the figure, one of the doors (the door on the right side in the figure) is not shown, and the temperature-controlled room 111 is shown in an open state. In contrast, the other door 112 (the door on the left side in the figure) is shown in a closed state, and therefore the 24 rows of slots 113 on the left side in the figure are not shown. Note that the number and arrangement of the slots 113 (i.e., the number and positional relationship of the burn-in boards 20 accommodated in the temperature-controlled room 111) are not limited to the example shown in FIG. 1, and can be set arbitrarily in consideration of test efficiency, etc.

[0025] Furthermore, the burn-in chamber 11 is equipped with a temperature adjustment means consisting of an evaporator 116, a heater 117, and a fan 118, and this temperature adjustment means makes it possible to adjust the temperature inside the temperature-constant chamber 111. Specifically, the air inside the temperature-constant chamber 111 is cooled by the evaporator 116 and heated by the heater 117 while being circulated by being blown by the fan 118 in the direction of the arrow shown in FIG. 1, thereby adjusting the temperature inside the temperature-constant chamber 111.

[0026] 2, a temperature sensor 119 for measuring the temperature inside the temperature-constant chamber 111 is provided inside the temperature-constant chamber 111. The burn-in apparatus 1 also includes a control device 80 that controls the entire burn-in apparatus 1. The temperature sensor 119 is electrically connected to the control device 80, and a detection signal from the temperature sensor 119 is output to the control device 80. The operations of the evaporator 116, heater 117, and fan 118 are controlled by the control device 80 in accordance with the temperature inside the temperature-constant chamber 111 detected by the temperature sensor 119.

[0027] Of the walls 115 of the burn-in chamber 11 that divide the temperature-controlled room 111, the rear wall 115a includes a top board 40 that separates the heat-insulating room 30 from the burn-in chamber 11. The top board 40 is disposed at the back of each slot 113 when viewed from the front of the burn-in chamber 11. The top board 40 is a wiring board that includes a substrate 41 and a connector 42 provided on one main surface of the substrate 41, and this connector 42 can be fitted into the connector 23 of the burn-in board 20 inserted into the slot 113. The burn-in board 20 and the top board 40 are electrically connected by fitting the connector 23 into the connector 42.

[0028] In addition, a connector 43 is provided on the surface of the top board 40 opposite to the surface on which the connector 42 is provided. This connector 43 can be fitted into a connector 52 of a function board 50, which will be described later. By fitting the connector 43 into the connector 52, the top board 40 and the function board 50 are electrically connected.

[0029] As shown in FIG. 2 and FIG. 3, the heat insulation chamber 30 is a substantially rectangular parallelepiped space partitioned by the wall 115a of the burn-in chamber 11 and the wall 60. The heat insulation chamber 30 is partitioned from the temperature-controlled chamber 111 of the burn-in chamber 11 by the top board 40, and from the outside air by the wall 60. In this embodiment, a recess 115b recessed toward the inside of the temperature-controlled chamber 111 is formed in a part of the wall 115a. The bottom surface of the recess 115b is formed by the top board 40. The wall 60 is a plate-shaped member made of a metal material such as SUS, and is provided so as to face the top board 40 and be located inside the recess 115b. In this embodiment, the space partitioned by the recess 115b of the wall 115a and the wall 60 is used as the heat insulation chamber 30. Dry air is supplied to the heat insulation chamber 30 from a dry air supply device 70 described later.

[0030] In this embodiment, the wall 60 is located inside the recess 115b of the wall 115a, but is not particularly limited to this. For example, the main surface of the wall 60 may be larger than the opening of the recess 115b, and the wall 60 may be attached to the outside of the wall 115a of the burn-in chamber 11 so as to cover the recess 115b. In addition, the material constituting the wall 60 is not particularly limited to the above, and the wall 60 may be made of, for example, a resin material.

[0031] 4, openings 61 are formed in the wall 60, and the function boards 50 enter the inside of the thermal insulation chamber 30 through these openings 61. Although not particularly limited, the number of openings 61 is the same as the number of burn-in boards 20 and function boards 50.

[0032] The function board (tester board) 50 is a wiring board including a substrate 51, a connector 52, and a control circuit 53. The function board 50 inputs voltages and signals to the DUT 100 mounted on the burn-in board 20.

[0033] The function board 50 is a part of the first part P 1) enters the interior of the thermally insulated chamber 30 through an opening 61 in the wall 60, and a connector 52 of the function board 50 fits into a connector 43 of the top board 40. The function board 50 and the top board 40 are electrically connected by fitting the connector 52 into the connector 43. A control circuit 53 is mounted on the substrate 51, and controls the input of voltages and signals to the burn-in board 20. The control circuit 53 is electrically connected to the control device 80, and is controlled by the control device 80.

[0034] The wall 60 is provided with a sealing member 62 that seals the gap between the opening 61 and the function board 50. The material constituting the sealing member 62 is not particularly limited, but examples include a resin material such as silicone rubber. The provision of the sealing member 62 provides further insulation between the temperature-controlled room 111 and the outside air.

[0035] The burn-in device 1 includes a fan 90 for cooling the function board 50. Although not limited thereto, the fan 90 is provided in a housing 91 that is provided adjacent to the burn-in chamber 11 and supports a plurality of function boards 50 (see FIG. 2). The fan 90 is always in operation during the burn-in test, and the fan 90 is configured to cool the second portion P of the function board 50. 2 The fan 90 blows air onto the substrate 51 in the function board 50 to cool the function board 50. The position of the fan 90 is not particularly limited to this. For example, the fan 90 may be provided on the substrate 51 of the function board 50.

[0036] 2, the burn-in apparatus 1 further includes a dry air supplying device 70. The dry air supplying device 70 is connected to the heat-insulating chamber 30 via a supply path 71, and supplies dry air to the heat-insulating chamber 30 during the burn-in test.

[0037] The temperature of the dry air supplied by the dry air supplying device 70 is room temperature (25°C), although it is not particularly limited. During the burn-in test, a fixed amount of dry air is always supplied to the insulation chamber 30, although it is not particularly limited. By supplying dry air to the insulation chamber 30, the dew point inside the insulation chamber 30 can be lowered, and the occurrence of condensation inside the insulation chamber 30 and on the function board 50 can be suppressed. The dew point temperature of the dry air under atmospheric pressure is, although it is not particularly limited, -50°C or lower, and preferably -70°C or lower.

[0038] A heating device 72 is connected to the dry air supplying device 70 via a supply path 71. That is, the heating device 72 is provided on the supply path 71 that connects the dry air supplying device 70 and the heat-insulating chamber 30. By heating the dry air with this heating device 72, the temperature of the dry air supplied to the heat-insulating chamber 30 can be adjusted within a range from room temperature to 150°C. By supplying heated dry air to the heat-insulating chamber 30, the dew point within the heat-insulating chamber 30 is lowered and the function board 50 (particularly the first portion P that has entered the heat-insulating chamber 30) is heated. 1 ) can be heated. This makes it possible to suppress condensation inside the heat-insulating chamber 30 and on the function board 50 even if the temperature of the temperature-constant chamber 111 is low.

[0039] The dry air supplying device 70 and the heating device 72 are each electrically connected to and controlled by a control device 80. Although the dry air supplying device 70 and the heating device 72 are illustrated separately in Fig. 2, this is not particularly limited, and the dry air supplying device 70 and the heating device 72 may be integrated into one device.

[0040] The control device 80 is configured, for example, by a computer. Although not particularly shown, this computer is an electronic calculator equipped with a CPU (processor), a main memory device (RAM, etc.), an auxiliary memory device (hard disk, SSD, etc.), and an interface, etc. The control described below is functionally realized, for example, by the control device 80 executing a program. Note that the control device 80 may be configured by a circuit board instead of a computer.

[0041] In addition to controlling the voltage and signals applied to the DUT 100 and the temperature adjustment in the constant temperature chamber 111, the control device 80 determines that the DUT 100 with an abnormal reaction during the burn-in test is a defective product, stores the serial number of the DUT 100 (for example, the one corresponding to the number of the slot 113 and the position on the burn-in board 20), and feeds back the test result.

[0042] Further, the control device 80 controls the dry air supply device 70 and the heating device 72 as follows according to the temperature of the constant temperature chamber 111.

[0043] That is, when the temperature Tc in the constant temperature chamber 111 measured by the temperature sensor 119 is equal to or higher than a predetermined temperature T1 (Tc≧T1), the control device 80 determines that the temperature in the constant temperature chamber 111 is high, and controls the dry air supply device 70 and the heating device 72 so that normal temperature dry air is supplied to the heat insulation chamber 30. That is, in this case, the control device 80 supplies dry air from the dry air supply device 70 to the heat insulation chamber 40, but controls the dry air supply device 70 and the heating device 72 so as not to heat the dry air.

[0044] On the other hand, when the temperature Tc in the constant temperature chamber 111 measured by the temperature sensor 119 is less than the predetermined temperature T1 (Tc<T1), the control device 80 determines that the temperature in the constant temperature chamber 111 is low, and controls the dry air supply device 70 and the heating device 72 so that heated dry air is supplied to the heat insulation chamber 30. That is, in this case, the control device 80 supplies dry air from the dry air supply device 70 to the heat insulation chamber 40 while heating the dry air, and controls the dry air supply device 70 and the heating device 72.

[0045] The above-mentioned predetermined temperature T1 is not particularly limited, but is a temperature below 0° C. (T1≦0° C.), preferably below −5° C., and more preferably below −10° C. An example of the temperature T2 of the dry air after heating is, for example, 40° C. or higher (T2≧40° C.). The temperature T2 of the dry air after heating is not particularly limited as long as it is higher than room temperature, and is appropriately adjusted according to the temperature in the temperature-constant chamber 111. In this way, by supplying the dry air whose temperature is appropriately adjusted according to the temperature Tc in the temperature-constant chamber 111 to the heat-insulating chamber 30, the dew point in the heat-insulating chamber 30 can be controlled and the function board 50 can be heated, and the occurrence of condensation in the heat-insulating chamber 30 and on the function board 50 can be further suppressed.

[0046] Furthermore, when high-temperature thermal stress is applied to the DUT 100, cooled dry air may be supplied to the heat-insulating chamber 30. That is, when the temperature Tc in the thermostatic chamber 111 is 100° C. or higher (Tc≧100° C.), cooled dry air may be supplied to the heat-insulating chamber 30. An example of the temperature T3 of the cooled dry air is, for example, −10° C. or lower (T3≦−10° C.).

[0047] As described above, in the burn-in equipment 1 of this embodiment, no relay boards or relay cables are used to connect the burn-in board 20 and the function board 50, and the burn-in board 20 and the function board 50 are connected via the top board 40 and the connectors 23, 42, 43, and 52. Therefore, there is no need to provide space within the equipment to accommodate relay boards and relay cables, and the number of DUTs 100 that can be measured per area occupied by the burn-in equipment 1 can be increased.

[0048] Furthermore, in this embodiment, the burn-in board 20 and the function board 50 are electrically connected without using a relay board or relay cable, and the communication path between the burn-in board 20 and the function board 50 is shorter than in conventional burn-in devices equipped with a relay board or the like, thereby reducing signal transmission loss from the function board 50 to the burn-in board 20.

[0049] In this embodiment, the function board 50 is warmed by supplying heated dry air to the heat-insulating chamber 30, and the occurrence of condensation on the function board 50 can be further suppressed. For this reason, in this embodiment, no other member is used to relay the burn-in board 20 and the function board 50, and only a part of the function board 50 (P 1 ) enters the thermal insulation chamber 30, it is possible to suppress the occurrence of condensation on the function board 50. In this manner, in this embodiment, other members that relay the burn-in board 20 and the function board 50 are omitted, making it possible to reduce the size of the burn-in equipment 1 and suppress the occurrence of condensation on the function board 50.

[0050] The above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention. [Explanation of symbols]

[0051] 1. Burn-in equipment 11…Burn-in chamber 111…Thermostatic chamber 112…Door 113…Slots 114…Rail 115...Wall 116…Evaporator 117…Heater 118...Fan 119...Temperature sensor 20…Burn-in board 21...Substrate 22…Socket 23…Connector 30…Insulated room 40…Top board 41...Substrate 42,43…Connector 50…Function board 51... Circuit board 52…Connector 53...Control circuit 60…Wall 61...Aperture 62...Sealing member 70...Dry air supply device 71…Supply route 72...Heating device 80...Control device 90…Fan 91…Housing 100…DUT

Claims

1. a burn-in board including a socket for mounting a DUT thereon, a first substrate on which the socket is mounted, and a first connector mounted on the first substrate; a chamber for housing the burn-in board; an insulating chamber separated from the chamber by a first wall and separated from the outside air by a second wall; a function board including a second substrate and a second connector mounted on the second substrate; the first wall includes a top board including a third substrate, a third connector mounted on one main surface of the third substrate, and a fourth connector mounted on the other main surface of the third substrate; the first connector and the third connector are fitted together to electrically connect the burn-in board and the top board; The function board enters the interior of the insulation chamber through an opening formed in the second wall, The second connector and the fourth connector are fitted together, thereby electrically connecting the function board and the top board.

2. 2. The burn-in apparatus according to claim 1, The burn-in apparatus includes a dry air supply device that supplies dry air to the thermal insulation chamber.

3. 3. The burn-in apparatus according to claim 2, The burn-in apparatus includes a heating device for heating the dry air.

4. 4. The burn-in apparatus according to claim 3, The burn-in device comprises: a temperature sensor for measuring a temperature within the chamber; and a control device that controls the heating device based on a measurement result of the temperature sensor.

5. 5. The burn-in apparatus according to claim 4, The control device controls the heating device so as to heat the dry air when the temperature in the chamber is below a predetermined temperature, and not to heat the dry air when the temperature in the chamber is equal to or higher than the predetermined temperature.

6. 6. The burn-in apparatus according to claim 4, The predetermined temperature is a temperature value below 0° C.

7. 3. The burn-in apparatus according to claim 1, The burn-in apparatus includes a sealing member that seals between the opening in the second wall and the function board.

8. 3. The burn-in apparatus according to claim 1, The function board comprises: A first portion extending into the interior of the thermal insulation chamber through the opening; and a second portion located outside the thermal insulation chamber.

9. 9. The burn-in apparatus according to claim 8, The burn-in apparatus includes a fan that blows air to the second portion to cool the function board.

10. 3. The burn-in apparatus according to claim 1, The function board is mounted on the second substrate, and is a burn-in device including a control circuit for inputting and outputting signals to and from the DUT.

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