Heat radiator of electrical element

Abstract

To provide a heat radiator of an electrical element, capable of improving a heat radiation performance while miniaturizing a size.SOLUTION: The present invention provides a heat radiator of an electrical element, containing: a non-vacuum state first chamber in which a print circuit board to which a heat generation element is mounted is arranged; an injection part that injects a coolant; a vacuum state second chamber in which a coolant supply part supplying the coolant to the injection part is arranged; and an evaporation part that is arranged between the first chamber and the second chamber. The injection part injects the coolant concentrated in the second chamber, which is supplied by the coolant supply part, into the second chamber. The evaporation part uses a sensible heat transferred to the evaporation part from the first chamber and a latent heat transferred to the second chamber from the evaporation part to evaporate the coolant injected into the second chamber by the injection part.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a cooling apparatus for electronic elements, and more particularly to a cooling apparatus for electronic elements for dissipating heat generated from a heat source such as an antenna element mounted on a printed circuit board. [Background technology]

[0002] Wireless communication technologies, such as Multiple Input Multiple Output (MIMO) technology, are technologies that dramatically increase data transmission capacity by using multiple antennas. The transmitter transmits different data through each transmitting antenna, and the receiver separates the transmitted data through appropriate signal processing. This is a spatial multiplexing technique.

[0003] Therefore, by simultaneously increasing the number of transmitting and receiving antennas, the channel capacity increases, making it possible to transmit more data. For example, if the number of antennas is increased to 10, the channel capacity is about 10 times that of the current single antenna system using the same frequency band.

[0004] 4G LTE-advanced uses up to 8 antennas, and currently, products equipped with 64 or 128 antennas are being developed in the pre-5G stage, and it is expected that 5G will use base station equipment with a much larger number of antennas, which is called Massive MIMO technology.Current cell operations are 2-Dimension, but the introduction of Massive MIMO technology will enable 3D-Beamforming, so it is also called FD-MIMO (Full Dimension).

[0005] In Massive MIMO technology, as the number of antennas increases, the number of transmitters and filters also increases. Despite this, RF components (antennas / filters / power amplifiers / transceivers, etc.) need to be made small, light, and inexpensive due to space restrictions and lease costs for installation sites, but Massive MIMO requires high output power to expand coverage, and the power consumption and heat generated by such high output power act as a negative factor in reducing weight and size.

[0006] In particular, when a MIMO antenna, in which modules that realize RF elements and digital elements are combined in a stacked structure, is installed in a limited space, there is a need to design the multiple layers that make up the MIMO antenna to be compact and miniaturized in order to maximize ease of installation and utilization of the space. In this case, a new heat dissipation structure design is required to dissipate heat generated by the communication components mounted on the multiple layers.

[0007] Korean Patent Publication No. 10-2019-0118979 (publication date: October 21, 2019) (hereinafter referred to as "prior art") discloses a "multiple input / output antenna device" that applies a heat dissipation structure for a compact and miniaturized design for multiple layers that make up a MIMO antenna.

[0008] The conventional technology includes a heat sink body having heat sink fins protruding therefrom, and a plurality of unit heat sinks provided on the heat sink body. One end of each of the unit heat sinks is provided to contact a heat generating element of an antenna substrate, and the other end of each unit heat sink is provided to discharge heat conducted from the heat generating element to the outside. A plurality of sub-heat dissipation fins are provided for dissipating heat.

[0009] However, in the conventional technology, the structure for dissipating heat from the heat generating element is only a mechanical structure, which is an air-cooled heat dissipation structure that exchanges heat with the outside air. This makes it difficult to dissipate heat quickly, and requires more mechanical heat dissipation structures to dissipate heat quickly, which results in a problem of large size. Summary of the Invention [Problem to be solved by the invention]

[0010] SUMMARY OF THE PRESENT EMBODIMENT It is an object of the present invention to provide a heat dissipation device for an electrical component that is minimised in size while improving heat dissipation performance.

[0011] Another technical object of the present invention is to provide a heat dissipation device for an electrical element that can inject a refrigerant into a space in which a heat-generating element is arranged, and quickly evaporate the injected refrigerant to quickly dissipate heat generated from the heat-generating element.

[0012] The technical problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0013] In order to achieve the above object, the heat dissipation device for an electrical element according to the present invention includes a first chamber, a second chamber, and an evaporation unit. A printed circuit board is disposed in the first chamber. A heat generating element is mounted on the printed circuit board. The first chamber is in a non-vacuum state. An injection unit and a refrigerant supply unit are disposed in the second chamber. The injection unit injects a refrigerant. The refrigerant supply unit supplies the refrigerant to the injection unit. The evaporation unit is disposed between the first chamber and the second chamber. The injection unit injects the condensed refrigerant in the second chamber supplied by the refrigerant supply unit into the second chamber. The evaporator evaporates the refrigerant injected into the second chamber by the injection unit using sensible heat transferred from the first chamber to the evaporation unit and latent heat transferred from the evaporation unit to the second chamber.

[0014] The evaporator is composed of a partition frame and a heat exchange member. The partition frame can partition the first chamber and the second chamber. The heat exchange member is coupled to the partition frame and disposed in the second chamber. The heat exchange member can evaporate the refrigerant injected into the second chamber by the injection unit using the sensible heat and the latent heat.

[0015] The heat dissipation device for an electrical component according to the present invention further comprises a radome and a heat dissipation cover. The radome is disposed on one side of the compartment frame. The heat dissipation cover is disposed on the other side of the compartment frame. The first chamber is formed between the compartment frame and the radome. The second chamber is formed between the compartment frame and the heat dissipation cover.

[0016] The heat exchange member includes a body and a plurality of heat exchange protrusions. The body is formed in a plate shape. The body is disposed in the partition frame. The plurality of heat exchange protrusions are formed on one surface of the body.

[0017] The heat exchange member includes a body and a plurality of heat exchange grooves. The body is formed in a plate shape. The body is disposed in the partition frame. The plurality of heat exchange grooves are formed on one surface of the body.

[0018] The partition frame has a body insertion groove into which the body is inserted.

[0019] The heat exchange member is formed of a porous sintered powder body.

[0020] The printed circuit board is composed of at least one printed circuit board, and the heat exchange member is arranged such that at least one heat exchange member is arranged on each printed circuit board.

[0021] The heat exchange protrusions are formed in a bar shape having a polygonal cross section.

[0022] The heat exchange protrusions are formed in a bar shape having a circular cross section.

[0023] The heat exchange groove is formed in a bar shape having a polygonal cross section debossed inside the body.

[0024] The heat exchange groove is formed in a bar shape having a circular cross section debossed inside the body.

[0025] A plurality of heat dissipating fins are protruded from an outer surface of the heat dissipating cover corresponding to the other surface of the partition frame.

[0026] The heat dissipation device for an electrical component according to the present invention further includes a condenser portion disposed outside the heat dissipation cover and formed in a tubular shape. The condenser portion can condense the evaporated refrigerant in the second chamber and supply it to the refrigerant supply portion.

[0027] The condenser portion is formed in a bellows shape.

[0028] The heat dissipation device for an electrical component according to the present invention further includes a mounting bracket, the mounting bracket having a through hole through which the condenser passes, the mounting bracket being disposed outside the heat dissipation cover.

[0029] An outlet portion is protrudingly formed at an upper portion of the heat dissipation cover. The evaporated refrigerant in the second chamber can flow out from the outlet portion. An inlet portion is protrudingly formed at a lower portion of the heat dissipation cover. The refrigerant condensed in the condenser can flow into the second chamber through the inlet portion. The condenser can connect the outlet portion and the inlet portion.

[0030] The heat dissipation device for an electrical component according to the present invention further comprises a vacuum gauge and a pressure gauge. The vacuum gauge can put the inside of the radome into a vacuum state. The pressure gauge can measure the pressure inside the radome.

[0031] The heat dissipation device for an electrical component according to the present invention further comprises a vacuum gauge and a pressure gauge. The vacuum gauge can put the inside of the second chamber into a vacuum state. The pressure gauge can measure the pressure inside the second chamber.

[0032] The injection section, the refrigerant supply section, the vacuum gauge and the pressure gauge are provided on the partition frame.

[0033] The heating element may include at least one of an antenna element and a radio signal processing unit (RU; Radio Unit). The antenna element is capable of transmitting and receiving radio signals. The radio signal processing unit can process the radio signal.

[0034] Other specific details of the embodiments are included in the detailed description and drawings. Effect of the Invention

[0035] In the heat dissipation device for an electrical element according to the present invention, the injection unit injects the condensed refrigerant in the second chamber supplied by the refrigerant supply unit into the second chamber which is in a vacuum state, and the evaporator unit evaporates the refrigerant injected by the injection unit into the second chamber using sensible heat transferred from the first chamber to the evaporator unit and latent heat transferred from the evaporator unit to the second chamber. This has the effect of quickly dissipating heat generated from a heat-generating element mounted on a printed circuit board arranged in the first chamber by a phase change of the refrigerant, and also has the effect of reducing the size since there is no need to install many mechanical air-cooled heat dissipation structures.

[0036] The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims. [Brief description of the drawings]

[0037] [Figure 1] 1 is a rear perspective view showing a heat dissipation device for an electrical component according to an embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view of FIG. [Diagram 3] 1 is a side view showing a heat dissipation device for an electrical component according to an embodiment of the present invention; [Figure 4] 1 is a cutaway perspective side view showing a heat dissipation device for an electrical component according to an embodiment of the present invention; [Diagram 5] FIG. 3 is a rear view showing the evaporation section shown in FIG. 2. [Figure 6] FIG. 6 is a perspective view showing the upper part of FIG. [Figure 7] FIG. 6 is a perspective view showing the lower part of FIG. [Figure 8] 6 is a diagram showing a state in which the heat exchange member is removed from the rear surface of the compartment frame shown in FIG. 5. FIG. [Figure 9] 9 is a cutaway perspective view showing a detailed configuration of a pump electric wire fastening portion shown in FIG. 8. [Figure 10] FIG. 6 is a perspective view showing an embodiment of the heat exchange member shown in FIG. 5. [Figure 11]6 is a perspective view showing another embodiment of the heat exchange member shown in FIG. 5. FIG. [Figure 12] FIG. 2 is a rear view of FIG. [Figure 13] FIG. 2 is a top view of FIG. [Figure 14] FIG. 2 is a bottom view of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0038] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a heat dissipation device for an electrical component according to an embodiment of the present invention will be described with reference to the drawings.

[0039] FIG. 1 is a rear perspective view showing a heat dissipation device for an electrical element according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of FIG. 1, FIG. 3 is a side view showing a heat dissipation device for an electrical element according to an embodiment of the present invention, FIG. 4 is a side cutaway perspective view showing a heat dissipation device for an electrical element according to an embodiment of the present invention, and FIG. 5 is a rear view showing the evaporator portion shown in FIG. 2.

[0040] 1 to 5, a heat dissipation device for an electrical component according to an embodiment of the present invention may include a first chamber C1, a second chamber C2, and an evaporation unit 100. As shown in FIG.

[0041] A printed circuit board (not shown) is disposed in the first chamber C1. A heating element (not shown) is mounted on the printed circuit board. The first chamber C1 may be in a non-vacuum state.

[0042] The second chamber C2 is provided with an ejection unit 30 and a coolant supply unit 40. The ejection unit 30 is capable of ejecting a coolant. The coolant supply unit 40 is capable of supplying the coolant to the ejection unit 30. can be done.

[0043] The evaporation unit 100 is disposed between the first chamber C1 and the second chamber C2. The injection unit 30 can inject the condensed refrigerant in the second chamber C2, which is supplied by the refrigerant supply unit 40, into the second chamber C2. The evaporation unit 100 can evaporate the refrigerant injected by the injection unit 30 into the second chamber C2 by using sensible heat transferred from the first chamber C1 to the evaporation unit 100 and latent heat transferred from the evaporation unit 100 to the second chamber C2.

[0044] The evaporation unit 100 is composed of a partition frame 70 and a heat exchange member 50. The partition frame 70 can partition a first chamber C1 and a second chamber C2. The heat exchange member 50 is coupled to the partition frame 70 and disposed in the second chamber C2. The heat exchange member 50 can evaporate the refrigerant injected by the injection unit 30 into the second chamber C2 using the sensible heat and the latent heat.

[0045] The heat dissipation device for an electrical component according to an embodiment of the present invention may further include a radome 10 and a heat dissipation cover 20. The radome 10 is disposed on one side of the compartment frame 70. The heat dissipation cover 20 is disposed on the other side of the compartment frame 70. A first chamber C1 is formed between the compartment frame 70 and the radome 10. A second chamber C2 is formed between the compartment frame 70 and the heat dissipation cover 20.

[0046] Here, one side of the compartment frame 70 may be the front side of the compartment frame 70 in the drawings, and the other side of the compartment frame 70 may be the rear side of the compartment frame 70 in the drawings. Hereinafter, one side of all components included in the heat dissipation device for an electrical component according to the embodiments of the present invention may be the front side in the drawings, and the other side may be the rear side in the drawings.

[0047] The radome 10 is formed in a rectangular plate shape. However, the shape of the radome 10 is not limited to the rectangular plate shape, and the radome 10 may be formed in a circular plate or a polygonal plate shape.

[0048] The compartment frame 70 may have a shape corresponding to the shape of the radome 10 and may have an internal space with an open front surface. The radome 10 may cover the open front surface of the compartment frame 70. Thus, a first chamber C1 is formed between the front surface of the compartment frame 70 and the radome 10.

[0049] The structure of the compartment frame 70 for forming the first chamber C1 between the front surface of the compartment frame 70 and the radome 10 and the structure of the radome 10 can be modified in various ways. For example, the radome 10 may be formed to have an internal space with an open rear surface. In this case, the compartment frame 70 may be formed in a plate shape that covers the open rear surface of the radome 10.

[0050] The compartment frame 70 and the heat dissipation cover 20 can be coupled to each other. The compartment frame 70 is disposed in front of the heat dissipation cover 20, and the heat dissipation cover 20 is disposed behind the compartment frame 70. A first flange 70A is formed on the periphery of the compartment frame 70. The first flange 70A can extend in an outward direction perpendicular to the side end of the main body of the compartment frame 70. A second flange 20A (see FIG. 12) is formed on the periphery of the heat dissipation cover 20. The second flange 20A can extend in an outward direction perpendicular to the side end of the main body of the heat dissipation cover 20. The first flange 70A and the second flange 20A can be butted against each other and then coupled to each other via a fastening member such as a bolt or a screw. However, the fastening method of the first flange 70A and the second flange 20A is not limited thereto.

[0051] The heat dissipation cover 20 has an internal space with an open front surface. When the first flange 0A and the second flange 20A are coupled together, a second chamber C2 is formed between the rear surface of the compartment frame 70 and the heat dissipation cover 20.

[0052] The structure of the partition frame 70 for forming the second chamber C2 between the rear surface of the partition frame 70 and the heat dissipation cover 20 and the structure of the heat dissipation cover 20 can be modified in various ways. For example, the partition frame 70 may be formed to have an internal space with an open rear surface, and in this case, the heat dissipation cover 20 may be formed in a plate shape that covers the open rear surface of the partition frame 70.

[0053] A heat generating element (not shown) is mounted on the printed circuit board. The heat generating element may include any electrical element mounted on the printed circuit board that generates heat. The heat generating element is mounted on at least one of the front and rear surfaces of the printed circuit board.

[0054] The heating element may include at least one of an antenna element and a radio signal processor (RU; Radio Unit). The antenna element may transmit and receive radio signals. The radio signal processor may process the radio signals. When the heating element is composed of the antenna element, the heat dissipation device of an electrical element according to an embodiment of the present invention may be a multiple input / output antenna device of a telecommunications carrier that installs a base station. Alternatively, when the heating element is composed of the radio signal processor, the heat dissipation device of an electrical element according to an embodiment of the present invention may be a radio signal processing device of a network equipment manufacturer that manufactures the base station.

[0055] The partition frame 70 is made of a material having excellent thermal conductivity so as to easily transfer the heat generated in the first chamber C1 by the heat generating element to the heat exchange member 50. For example, the partition frame 70 is made of an aluminum material.

[0056] The heat dissipation cover 20 can dissipate heat in the second chamber C2 to the outside. The heat dissipation cover 20 is made of a heat dissipation material having excellent heat dissipation performance. For example, the heat dissipation cover 20 is made of an aluminum material.

[0057] A plurality of heat dissipating fins 23 are formed to protrude from the outer surface of the heat dissipating cover 20. The plurality of heat dissipating fins 23 are formed to protrude from the rear surface of the heat dissipating cover 20, which corresponds to the rear surface of the partition frame 70.

[0058] The plurality of heat dissipating fins 23 can exchange heat in the second chamber C2 with the outside air. In addition, the plurality of heat dissipating fins 23 can also function to condense the refrigerant in the second chamber C2 that has evaporated in the evaporation unit 100.

[0059] The plurality of heat dissipating fins 23 are composed of a plurality of first heat dissipating fins 23A and a plurality of second heat dissipating fins 23B. The plurality of first heat dissipating fins 23A are disposed on one side based on the center of the rear surface, which is the outer surface of the heat dissipating cover 20. The plurality of second heat dissipating fins 23B are disposed on the other side based on the center of the rear surface, which is the outer surface of the heat dissipating cover 20.

[0060] The first fins 23A are formed with an inclination such that the height increases from one side of the rear surface of the heat dissipation cover 20 toward the center of the rear surface of the heat dissipation cover 20. The second fins 23B are formed with an inclination such that the height increases from the other side of the rear surface of the heat dissipation cover 20 toward the center of the rear surface of the heat dissipation cover 20.

[0061] Of course, the heat dissipation fins 23 may be formed as one unit without being divided into left and right sides, or may be divided into multiple stages. Also, the heat dissipation fins 23 may be formed so that they are taller toward the center, and may be formed horizontally or vertically.

[0062] The ejection unit 30 can eject the refrigerant into the second chamber C2. The refrigerant supply unit 40 can supply the refrigerant to the ejection unit 30. The ejection unit 30 can eject the refrigerant supplied from the refrigerant supply unit 40 into the second chamber C2. The ejection unit 30 and the refrigerant supply unit 40 will be described in detail later with reference to Figs. 6 to 8.

[0063] Meanwhile, on the upper surface of the partition frame 70, there are provided a vacuum gauge 1 for creating a vacuum state inside the second chamber C2, and a pressure gauge 2 for measuring the pressure inside the second chamber C2.

[0064] The vacuum gauge 1 and the pressure gauge 2 are disposed spaced apart from each other in the left-right direction. The vacuum gauge 1 is disposed to the left of the pressure gauge 2, and the pressure gauge 2 is disposed to the right of the vacuum gauge 1. Alternatively, the vacuum gauge 1 may be disposed to the right of the pressure gauge 2, and the pressure gauge 2 may be disposed to the left of the vacuum gauge 1.

[0065] The printed circuit board is provided with a control unit (not shown) for controlling the vacuum gauge 1. The control unit can control a pump 41, which will be described later, in response to the pressure of the second chamber C2 measured by the pressure gauge 2.

[0066] Meanwhile, the heat exchange member 50 is coupled to the rear surface of the partition frame 70. The heat exchange member 50 can evaporate the refrigerant in the second chamber C2 sprayed by the spray unit 30 by exchanging heat with the heat generated by the heating element. That is, the heat exchange member 50 is heated by the sensible heat generated by the heating element and transferred from the first chamber C1 to the partition frame 70, and the refrigerant sprayed by the spray unit 30 is adsorbed by the heated heat exchange member 50 and evaporated by the latent heat.

[0067] The heat exchange member 50 may include a plurality of heat exchange members 50 .

[0068] Specifically, the multiple heat exchange members 50 may include a multiple first heat exchange members 50A, a multiple second heat exchange members 50B, a multiple third heat exchange members 50C, a multiple fourth heat exchange members 50D, a multiple fifth heat exchange members 50E, a multiple sixth heat exchange members 50F, and a multiple seventh heat exchange members 50G.

[0069] The heat exchange members 50 are arranged spaced apart from one another in the vertical direction. That is, the first heat exchange members 50A, the second heat exchange members 50B, the third heat exchange members 50C, the fourth heat exchange members 50D, the fifth heat exchange members 50E, the sixth heat exchange members 50F, and the seventh heat exchange members 50G are arranged spaced apart from one another in the vertical direction.

[0070] Each of the plurality of first heat exchange members 50A, the plurality of second heat exchange members 50B, the plurality of third heat exchange members 50C, the plurality of fourth heat exchange members 50D, the plurality of fifth heat exchange members 50E, the plurality of sixth heat exchange members 50F and the plurality of seventh heat exchange members 50G may include five heat exchange members 50.

[0071] The multiple first heat exchange members 50A are disposed on the uppermost side of the heat exchange members 50. The multiple first heat exchange members 50A are disposed above the multiple second heat exchange members 50B.

[0072] The second heat exchange members 50B are disposed below the first heat exchange members 50A. The second heat exchange members 50B are disposed above the third heat exchange members 50C. The second heat exchange members 50B are disposed between the first heat exchange members 50A and the third heat exchange members 50C.

[0073] The plurality of third heat exchange members 50C are disposed below the plurality of second heat exchange members 50B. The plurality of third heat exchange members 50C are disposed above the plurality of fourth heat exchange members 50D. The plurality of third heat exchange members 50C are disposed between the plurality of second heat exchange members 50B and the plurality of fourth heat exchange members 50D.

[0074] The plurality of fourth heat exchange members 50D are disposed below the plurality of third heat exchange members 50C. The plurality of fourth heat exchange members 50D are disposed above the plurality of fifth heat exchange members 50E. The plurality of fourth heat exchange members 50D are disposed between the plurality of third heat exchange members 50C and the plurality of fifth heat exchange members 50E.

[0075] The plurality of fifth heat exchange members 50E are disposed below the plurality of fourth heat exchange members 50D. The plurality of fifth heat exchange members 50E are disposed above the plurality of sixth heat exchange members 50F. The plurality of fifth heat exchange members 50E are disposed between the plurality of fourth heat exchange members 50D and the plurality of sixth heat exchange members 50F.

[0076] The sixth heat exchange members 50F are disposed below the fifth heat exchange members 50E. The sixth heat exchange members 50F are disposed above the seventh heat exchange members 50G. The sixth heat exchange members 50F are disposed between the fifth heat exchange members 50E and the seventh heat exchange members 50G.

[0077] The multiple seventh heat exchange members 50G are disposed at the lowermost position of the heat exchange members 50. The multiple seventh heat exchange members 50G are disposed below the multiple sixth heat exchange members 50F.

[0078] The heat exchange members 50 are arranged in 7 rows in the vertical direction and 5 columns in the horizontal direction, for a total arrangement of 7 rows and 5 columns. Therefore, the total number of heat exchange members 50 is 35, but the number of heat exchange members 50 may vary depending on the number of rows and columns in which the heat exchange members 50 are arranged.

[0079] The detailed structure of the heat exchange member 50 will be described later with reference to Figs. 10 and 11. First, the detailed structures of the ejection portion 30 and the refrigerant supply portion 40 will be described.

[0080] 6 is a perspective view showing the upper part of FIG. 5, FIG. 7 is a perspective view showing the lower part of FIG. 5, and FIG. 8 is a diagram showing the state in which the heat exchange member has been removed from the rear surface of the compartment frame shown in FIG. 5.

[0081] 6 to 8, the injection part 30 has a plurality of injection holes (not shown) for injecting the refrigerant into the second chamber C2. The injection part 30 is provided in a partition frame .

[0082] In order to allow the refrigerant sprayed by the spray unit 30 to be easily adsorbed by the heat exchange member 50, the spray unit 30 is preferably disposed above the heat exchange member 50. Therefore, the spray unit 30 is disposed at the top of the partition frame 70 in the second chamber C2. In this case, the plurality of spray holes formed in the spray unit 30 are preferably formed below the spray unit 30.

[0083] The injection unit 30 is formed as a long tube extending in the left-right direction. The injection ports formed in the injection unit 30 are spaced apart from each other along the length of the injection unit 30.

[0084] Moreover, the injection part 30 may be disposed facing the heat exchange member 50. In this case, the plurality of injection ports are formed in a portion of the injection part 30 facing the heat exchange member 50.

[0085] In order to enable the plurality of injection ports to inject the refrigerant at the same pressure, The nozzle is formed so that the diameter becomes smaller the farther it is from the coolant supply unit 40 .

[0086] The injection unit 30 can spray the refrigerant supplied from the refrigerant supply unit 40 through the multiple injection ports, or can inject the refrigerant in an atomized state.

[0087] After the refrigerant sprayed by the spray unit 30 evaporates in the heat exchange member 50, the refrigerant supply unit 40 can supply the condensed refrigerant to the spray unit 30. The refrigerant evaporated in the heat exchange member 50 can be condensed and sink to the lower side in the second chamber C2. Therefore, in order to supply the refrigerant that has sunk to the lower side in the second chamber C2 to the spray unit 30, it is preferable that the refrigerant supply unit 40 is disposed at the lower side in the second chamber C2.

[0088] The coolant supply unit 40 may include a pump 41 provided in a lower portion of the second chamber C2, and a transfer pipe 42 for supplying the condensed coolant pumped by the pump 41 to the injection unit 30.

[0089] The pump 41 may include a Brushless Direct Current (BLDC) motor. The pump 41 is disposed in the second chamber C2 at a lower portion near the center in the left-right direction.

[0090] The transfer pipe 42 can connect the refrigerant discharge port of the pump 41 and the refrigerant inlet of the spray unit 30. That is, one end of the transfer pipe 42 is connected to the refrigerant discharge port of the pump 41, and the other end of the transfer pipe 42 is connected to the refrigerant inlet formed at one end of the spray unit 30.

[0091] The injection unit 30 may include a horizontal portion formed straight in the left-right direction and having a plurality of injection ports spaced apart from one another along its length, and a first vertical portion bent from the horizontal portion to extend downward and disposed vertically on one side of the partition frame 70.

[0092] The transfer pipe 42 may include an inclined portion extending from the refrigerant discharge port of the pump 41 to one side of the partition frame 70 and extending at an upward incline, and a second vertical portion extending straight upward from the inclined portion and arranged vertically on one side of the partition frame 70, with its upper end connected to the lower end of the first vertical portion of the injection portion 30.

[0093] Meanwhile, a sealer 71 for sealing the periphery of the internal space of the heat dissipation cover 20 is disposed on the rear surface of the partition frame 70. The sealer 71 can seal between the periphery of the internal space of the heat dissipation cover 20 and the rear surface of the partition frame 70.

[0094] In addition, the pump 41 includes an electric wire to which power for driving the pump 41 is input, and the electric wire of the pump 41 must be connected to a printed circuit board having the control unit for controlling the pump 41. To this end, the electric wire of the pump 41 is attached to the partition frame 70 by a pump electric wire fastening part 45 provided on the partition frame 70, and is connected to the control unit of the printed circuit board arranged in the first chamber C1.

[0095] The pump electric wire fastening portion 45 will be described in detail below with reference to FIG.

[0096] FIG. 9 is a cutaway perspective view showing a detailed configuration of the pump electric wire fastening portion shown in FIG.

[0097] 8 and 9, the pump electric wire fastening portion 45 may include an inner fastening member 45A and an outer fastening member 45B. The electric wire of the pump 41 passes through the inner fastening member 45A from front to back and is connected to the printed circuit board.

[0098] A fastening groove into which the outer fastening member 45B is inserted is formed on the rear surface of the partition frame 70. A plurality of first fastening protrusions formed in a sawtooth shape are formed on the inner peripheral surface of the fastening groove. In addition, a plurality of second fastening protrusions formed in a sawtooth shape are formed on the outer peripheral surface of the outer fastening member 45B, which are fastened to the plurality of first fastening protrusions. The inner fastening member 45A can penetrate the center of the outer fastening member 45B in the front-rear direction. In addition, the inner fastening member 45A can penetrate the front partition wall of the fastening groove. A plurality of third fastening protrusions formed in a sawtooth shape are formed on the inner peripheral surface of the outer fastening member 45B. In addition, a plurality of fourth fastening protrusions formed in a sawtooth shape are formed on the outer peripheral surface of the inner fastening member 45A, which are fastened to the plurality of third fastening protrusions.

[0099] The first and second fastening protrusions may be formed in a spiral shape so as to be fastened in the same manner as a bolt. Similarly, the third and fourth fastening protrusions may be formed in a spiral shape so as to be fastened in the same manner as a bolt.

[0100] FIG. 10 is a perspective view showing an embodiment of the heat exchange member shown in FIG.

[0101] 8 and 10, the heat exchange member 50 is made of a material having excellent thermal conductivity, for example, a copper material.

[0102] The heat exchange member 50 is composed of a body 51 and a plurality of heat exchange protrusions 52. However, the heat exchange member 50 may include a plurality of heat exchange grooves (not shown) instead of the plurality of heat exchange protrusions 52.

[0103] The body 51 is formed in a plate shape. In this embodiment, the body 51 is formed in a rectangular plate shape, but the body 51 may be formed in a circular plate shape or a polygonal plate shape.

[0104] The body 51 is coupled to the rear surface of the compartment frame 70 .

[0105] The heat exchange protrusions 52 are formed to protrude from one surface of the body 51. That is, the heat exchange protrusions 52 are formed to protrude rearward from the rear surface of the body 51.

[0106] The heat exchange protrusions 52 are formed in a bar shape having a rectangular cross section. However, the heat exchange protrusions 52 may be formed in a bar shape having a circular cross section or a bar shape having a polygonal cross section.

[0107] In addition, when the heat exchange groove is formed on the rear surface of the body 51 instead of the heat exchange protrusion 52, the heat exchange groove may be formed in a bar shape having a polygonal cross section embossed inside the body, or the heat exchange groove may be formed in a bar shape having a circular cross section embossed inside the body.

[0108] The heat exchange member 50 includes a plurality of heat exchange protrusions 52, which increases the overall surface area of ​​the heat exchange member 50. Therefore, a large amount of the refrigerant sprayed by the spray unit 30 can be adsorbed by the heat exchange member 50, and the heat exchange member 50 can quickly evaporate the refrigerant sprayed by the spray unit 30.

[0109] A body insertion groove 75 into which the body 51 is inserted is formed in the rear surface of the partition frame 70, which faces the second chamber C2. The body insertion groove 75 is formed in the same shape as the body 51. In this embodiment, since the body 51 is formed in a rectangular plate shape, the body insertion groove 75 is also formed in a rectangular plate shape.

[0110] The body insertion grooves 75 are formed in the same number as the heat exchange members 50 and are disposed at positions corresponding to the positions of the heat exchange members 50 .

[0111] That is, the body insertion groove 75 includes a plurality of first body insertion grooves 75A, a plurality of second body insertion grooves 75B, a plurality of third body insertion grooves 75C, a plurality of fourth body insertion grooves 75D, a plurality of fifth body insertion grooves 75E, a plurality of sixth body insertion grooves 75F, and a plurality of seventh body insertion grooves 75G.

[0112] The multiple first body insertion grooves 75A, the multiple second body insertion grooves 75B, the multiple third body insertion grooves 75C, the multiple fourth body insertion grooves 75D, the multiple fifth body insertion grooves 75E, the multiple sixth body insertion grooves 75F and the multiple seventh body insertion grooves 75G are each arranged spaced apart from each other in the vertical direction.

[0113] The bodies 51 formed in the first heat exchange members 50A are inserted into the first body insertion grooves 75A.

[0114] The plurality of first body insertion grooves 75A are disposed at the uppermost positions of the body insertion grooves 75. The plurality of first body insertion grooves 75A are disposed above the plurality of second body insertion grooves 75B.

[0115] The bodies 51 formed in the second heat exchange members 50B are inserted into the second body insertion grooves 75B.

[0116] The second body insertion grooves 75B are disposed below the first body insertion grooves 75A. The second body insertion grooves 75B are disposed above the third body insertion grooves 75C. The second body insertion grooves 75B are disposed between the first body insertion grooves 75A and the third body insertion grooves 75C.

[0117] The bodies 51 formed in the third heat exchange members 50C are inserted into the third body insertion grooves 75C.

[0118] The plurality of third body insertion grooves 75C are disposed below the plurality of second body insertion grooves 75B. The plurality of third body insertion grooves 75C are disposed above the plurality of fourth body insertion grooves 75D. The plurality of third body insertion grooves 75C are disposed between the plurality of second body insertion grooves 75B and the plurality of fourth body insertion grooves 75D.

[0119] The bodies 51 formed in the plurality of fourth heat exchange members 50D are inserted into the plurality of fourth body insertion grooves 75D.

[0120] The plurality of fourth body insertion grooves 75D are disposed below the plurality of third body insertion grooves 75C. The plurality of fourth body insertion grooves 75D are disposed above the plurality of fifth body insertion grooves 75E. The plurality of fourth body insertion grooves 75D are disposed between the plurality of third body insertion grooves 75C and the plurality of fifth body insertion grooves 75E.

[0121] The bodies 51 formed in the plurality of fifth heat exchange members 50E are inserted into the plurality of fifth body insertion grooves 75E.

[0122] The plurality of fifth body insertion grooves 75E are disposed below the plurality of fourth body insertion grooves 75D. The plurality of fifth body insertion grooves 75E are disposed above the plurality of sixth body insertion grooves 75F. The plurality of fifth body insertion grooves 75E are disposed between the plurality of fourth body insertion grooves 75D and the plurality of sixth body insertion grooves 75F.

[0123] The bodies 51 formed in the sixth heat exchange members 50F are inserted into the sixth body insertion grooves 75F.

[0124] The sixth body insertion grooves 75F are disposed below the fifth body insertion grooves 75E. The sixth body insertion grooves 75F are disposed above the seventh body insertion grooves 75G. The sixth body insertion grooves 75F are disposed between the fifth body insertion grooves 75E and the seventh body insertion grooves 75G.

[0125] The bodies 51 formed in the seventh heat exchange members 50G are inserted into the seventh body insertion grooves 75G.

[0126] The seventh body insertion grooves 75G are disposed at the lowermost position of the body insertion grooves 75. The seventh body insertion grooves 75G are disposed lower than the sixth body insertion grooves 75F.

[0127] FIG. 11 is a perspective view showing another embodiment of the heat exchange member shown in FIG.

[0128] Referring to FIG. 11, the heat exchange member 500 can include a body 510 and a plurality of heat exchange protrusions 520 .

[0129] The heat exchange member 500 is formed of a porous powder sintered body. That is, as shown in Fig. 10, a porous body is formed of copper powder on the surface of the heat exchange member 50 having a smooth surface, and then sintered to form the heat exchange member 500 having a porous structure as shown in Fig. 11. When the heat exchange member 500 is formed of a porous powder sintered body in this manner, not only does the surface area of ​​the heat exchange member 500 become larger, but the surface tension is increased by the porous structure, so that the refrigerant sprayed by the spray unit 30 can be easily adsorbed, thereby increasing the evaporation efficiency of the adsorbed refrigerant.

[0130] Meanwhile, in the above, a plurality of heat dissipation fins 23 are formed on the rear surface of the heat dissipation cover 20 in order to condense the refrigerant evaporated by the heat exchange member 50. However, the condensation structure for condensing the refrigerant evaporated by the heat exchange member 50 is not limited to the plurality of heat dissipation fins 23. That is, instead of the plurality of heat dissipation fins 23, a condensation section 60 described below may be included, or the condensation section 60 may be included together with the plurality of heat dissipation fins 23. The condensation section 60 will be described in detail below.

[0131] 12 is a rear view of FIG. 1, FIG. 13 is a top view of FIG. 1, and FIG. 14 is a bottom view of FIG.

[0132] 1 and 2 and 12 to 14, the heat dissipation device for an electrical component according to an embodiment of the present invention may further include a condenser portion 60. As shown in FIG.

[0133] The condensation unit 60 is disposed on the outside of the heat dissipation cover 20. The condensation unit 60 is disposed on the rear surface of the heat dissipation cover 20. The condensation unit 60 can condense the evaporated refrigerant in the second chamber C2 and supply it to the refrigerant supply unit 40. That is, the condensation unit 60 can condense the evaporated refrigerant in the second chamber C2 and supply it to the pump 41.

[0134] The condensation portion 60 is formed in a tubular shape. The refrigerant evaporated in the second chamber C2 flows into the condensation portion 60, and is condensed while passing through the condensation portion 60 and is supplied to the pump 41.

[0135] The condensation portion 60 is formed in a bellows shape. Therefore, since the condensation portion 60 has a plurality of wrinkles, the surface area in contact with the outside air is increased, and the condensation performance can be improved.

[0136] An outlet 28 is formed to protrude from an upper portion of the heat dissipation cover 20, and an inlet 29 is formed to protrude from a lower portion of the heat dissipation cover 20. The evaporated refrigerant in the second chamber C2 can flow out from the outlet 28. The refrigerant condensed in the condenser 60 can flow into the second chamber C2 from the inlet 29.

[0137] The refrigerant evaporated in the second chamber C2 becomes gaseous and moves upward in the second chamber C2, while the condensed refrigerant in the second chamber C2 becomes liquid and moves downward in the second chamber C2. Therefore, in order to allow the evaporated refrigerant in gaseous state to easily flow out of the second chamber C2 and the condensed refrigerant in liquid state to easily flow into the pump 41, the outlet 28 is preferably located at the upper part of the heat dissipation cover 20, and the inlet 29 is preferably located at the lower part of the heat dissipation cover 20.

[0138] The condenser 60 may connect the outlet 28 and the inlet 29. That is, the upper end of the condenser 60 is connected to the outlet 28, and the lower end of the condenser 60 is connected to the inlet 29. The upper end of the condenser 60 is welded to the lower end of the outlet 28, and the lower end of the condenser 60 is welded to the upper end of the inlet 29. Of course, the upper end of the condenser 60 may be bolted or mechanically connected to the outlet 28 without being welded. Also, the lower end of the condenser 60 may be bolted or mechanically connected to the upper end of the inlet 29 without being welded. Since the condenser 60 connects the outlet 28 and the inlet 29, the evaporated refrigerant in the second chamber C2 flowing out through the outlet 28 is condensed while passing through the condenser 60, and then supplied to the pump 41 through the inlet 29. The condenser 60 is made of stainless steel.

[0139] The outlet 28 is formed to protrude from the upper rear surface of the heat dissipation cover 20, and the inlet 29 is formed to protrude from the lower rear surface of the heat dissipation cover 20. The outlet 28 is formed of a separate structure from the heat dissipation cover 20, and is provided on the upper rear surface of the heat dissipation cover 20 via a fastening member so as to communicate with a hole formed on the upper rear surface of the heat dissipation cover 20. Similarly, the inlet 29 is formed of a separate structure from the heat dissipation cover 20, and is provided on the upper rear surface of the heat dissipation cover 20 via a fastening member so as to communicate with a hole formed on the lower rear surface of the heat dissipation cover 20. Of course, the outlet 28 and the inlet 29 may be welded to the rear surface of the heat dissipation cover 20 without being fastened to the rear surface of the heat dissipation cover 20 via a fastening member.

[0140] The outlet portion 28 and the inlet portion 29 are made of aluminum, which is the same material as the heat dissipation cover 20. Of course, the outlet portion 28 and the inlet portion 29 may be made of copper, but if the outlet portion 28 and the inlet portion 29 are made of copper, they will not be well welded to the condensation portion 60 made of stainless steel. Therefore, it is preferable that the outlet portion 28 and the inlet portion 29 are made of aluminum, which can be well welded to the condensation portion 60, which is made of stainless steel, and which also conducts heat well from the heat dissipation cover 20.

[0141] The outlet portion 28 is formed in a shape that protrudes rearward and is then bent downward, and the inlet portion 29 is formed in a shape that protrudes rearward and is then bent upward.

[0142] The condensation section 60, the outlet section 28, and the inlet section 29 are each formed in a plurality of pieces. The condensation section 60, the outlet section 28, and the inlet section 29 are each formed in the same number. The condensation section 60, the outlet section 28, and the inlet section 29 are each formed in a plurality of pieces spaced apart from each other in the left-right direction. When viewed from the rear side of the heat dissipation cover 20, the condensation section 60, the outlet section 28, and the inlet section 29 are arranged in a straight line.

[0143] In this embodiment, the condensation section 60 is configured by six condensation sections 60. However, the number of condensation sections 60 is not limited to this.

[0144] The multiple condensation sections 60 can include a first condensation section 60A, a second condensation section 60B, a third condensation section 60C, a fourth condensation section 60D, a fifth condensation section 60E, and a sixth condensation section 60F.

[0145] The first condensation section 60A, the second condensation section 60B, the third condensation section 60C, the fourth condensation section 60D, the fifth condensation section 60E and the sixth condensation section 60F can be spaced apart from one another in the left-right direction. Of course, the multiple condensation sections 60 are not limited to being spaced apart from one another in the left-right direction, and multiple condensation sections 60 may be arranged overlapping each other in the front-rear direction.

[0146] The first condenser section 60A is disposed on the rightmost side of the condenser section 60. The first condenser section 60A is disposed to the right of the second condenser section 60B.

[0147] The second condenser portion 60B is disposed on the left side of the first condenser portion 60A. The second condenser portion 60B is disposed on the right side of the third condenser portion 60C. The second condenser portion 60B is disposed between the first condenser portion 60A and the third condenser portion 60C.

[0148] The third condenser portion 60C is disposed to the left of the second condenser portion 60B. The third condenser portion 60C is disposed to the right of the fourth condenser portion 60D. The third condenser portion 60C is disposed between the second condenser portion 60B and the fourth condenser portion 60D.

[0149] The fourth condenser portion 60D is disposed on the left side of the third condenser portion 60C. The fourth condenser portion 60D is disposed on the right side of the fifth condenser portion 60E. The fourth condenser portion 60D is disposed between the third condenser portion 60C and the fifth condenser portion 60E.

[0150] The fifth condenser portion 60E is disposed to the left of the fourth condenser portion 60D. The fifth condenser portion 60E is disposed to the right of the sixth condenser portion 60F. The fifth condenser portion 60E is disposed between the fourth condenser portion 60D and the sixth condenser portion 60F.

[0151] The sixth condenser section 60F is disposed at the leftmost position of the condenser section 60. The sixth condenser section 60F is disposed to the left of the fifth condenser section 60E.

[0152] The outlet portion 28 can include a first outlet portion 28A, a second outlet portion 28B, a third outlet portion 28C, a fourth outlet portion 28D, a fifth outlet portion 28E, and a sixth outlet portion 28F.

[0153] The upper end of a first condenser section 60A is connected to the first outlet section 28A.

[0154] The first outlet portion 28A is disposed on the rightmost side of the outlet portion 28. The first outlet portion 28A is disposed to the right of the second outlet portion 28B.

[0155] The upper end of the second condenser section 60B is connected to the second outlet section 28B.

[0156] The second outlet portion 28B is disposed to the left of the first outlet portion 28A. The second outlet portion 28B is disposed to the right of the third outlet portion 28C. The second outlet portion 28B is disposed between the first outlet portion 28A and the third outlet portion 28C.

[0157] The upper end of the third condenser section 60C is connected to the third outlet section 28C.

[0158] The third outlet portion 28C is disposed to the left of the second outlet portion 28B. The third outlet portion 28C is disposed to the right of the fourth outlet portion 28D. The third outlet portion 28C is disposed between the second outlet portion 28B and the fourth outlet portion 28D.

[0159] The upper end of a fourth condenser section 60D is connected to the fourth outlet section 28D.

[0160] The fourth outlet portion 28D is disposed to the left of the third outlet portion 28C. The fourth outlet portion 28D is disposed to the right of the fifth outlet portion 28E. The fourth outlet portion 28D is disposed between the third outlet portion 28C and the fifth outlet portion 28E.

[0161] The upper end of a fifth condenser section 60E is connected to the fifth outlet section 28E.

[0162] The fifth outlet portion 28E is disposed to the left of the fourth outlet portion 28D. The fifth outlet portion 28E is disposed to the right of the sixth outlet portion 28F. The fifth outlet portion 28E is disposed between the fourth outlet portion 28D and the sixth outlet portion 28F.

[0163] The upper end of a sixth condenser section 60F is connected to the sixth outlet section 28F.

[0164] The sixth outlet portion 28F is disposed at the leftmost position of the outlet portion 28. The sixth outlet portion 28F is disposed to the left of the fifth outlet portion 28E.

[0165] The inlet portion 29 may include a first inlet portion 29A, a second inlet portion 29B, a third inlet portion 29C, a fourth inlet portion 29D, a fifth inlet portion 29E, and a sixth inlet portion 29F.

[0166] The lower end of a first condenser section 60A is connected to the first inlet section 29A.

[0167] The first inlet section 29A is disposed on the rightmost side of the inlet section 29. The first inlet section 29A is disposed to the right of the second inlet section 29B.

[0168] The lower end of the second condenser section 60B is connected to the second inlet section 29B.

[0169] The second inlet portion 29B is disposed to the left of the first inlet portion 29A. The second inlet portion 29B is disposed to the right of the third inlet portion 29C. The second inlet portion 29B is disposed between the first inlet portion 29A and the third inlet portion 29C.

[0170] The lower end of the third condenser section 60C is connected to the third inlet section 29C.

[0171] The third inlet portion 29C is disposed to the left of the second inlet portion 29B. The third inlet portion 29C is disposed to the right of the fourth inlet portion 29D. The third inlet portion 29C is disposed between the second inlet portion 29B and the fourth inlet portion 29D.

[0172] The lower end of a fourth condenser section 60D is connected to the fourth inlet section 29D.

[0173] The fourth inlet portion 29D is disposed to the left of the third inlet portion 29C. The fourth inlet portion 29D is disposed to the right of the fifth inlet portion 29E. The fourth inlet portion 29D is disposed between the third inlet portion 29C and the fifth inlet portion 29E.

[0174] The lower end of a fifth condenser section 60E is connected to the fifth inlet section 29E.

[0175] The fifth inlet portion 29E is disposed to the left of the fourth inlet portion 29D. The fifth inlet portion 29E is disposed to the right of the sixth inlet portion 29F. The fifth inlet portion 29E is disposed between the fourth inlet portion 29D and the sixth inlet portion 29F.

[0176] The lower end of a sixth condenser section 60F is connected to the sixth inlet section 29F.

[0177] The sixth inlet section 29F is disposed on the leftmost side of the inlet section 29. The sixth inlet section 29F is disposed to the left of the fifth inlet section 29E.

[0178] Meanwhile, a mounting bracket 80 is provided on the outside of the heat dissipation cover 20. The mounting bracket 80 is coupled to the rear surface of the heat dissipation cover 20 to support the condenser 60. If the condenser 60 is formed in a bellows shape, when the refrigerant vaporized in the second chamber C2 flows into the condenser 60 through the outlet 28, the condenser 60 may vibrate and bend to one side due to the pressure of the refrigerant. To prevent this, the mounting bracket 80 may support the condenser 60.

[0179] The mounting bracket 80 has a through hole through which the condenser 60 passes vertically. The mounting bracket 80 may include a plurality of mounting brackets 80 spaced apart from each other in the vertical direction.

[0180] The multiple mounting brackets 80 may include a first mounting bracket 80A, a second mounting bracket 80B, and a third mounting bracket 80C.

[0181] The first mounting bracket 80A is disposed at the uppermost position of the mounting bracket 80. The first mounting bracket 80A is disposed above the second mounting bracket 80B.

[0182] The second mounting bracket 80B is disposed below the first mounting bracket 80A. The second mounting bracket 80B is disposed above the third mounting bracket 80C. The second mounting bracket 80B is disposed between the first mounting bracket 80A and the third mounting bracket 80C.

[0183] The third mounting bracket 80C is disposed at the lowermost position of the mounting bracket 80. The third mounting bracket 80C is disposed lower than the second mounting bracket 80B.

[0184] Each of the first mounting bracket 80A, the second mounting bracket 80B, and the third mounting bracket 80C is formed by welding two members together. That is, one of the two members can form a part of the through hole, and the other can form the remainder of the through hole. After one of the members is first coupled to the rear surface of the heat dissipation cover 20, the condenser 60 is inserted into a part of the through hole, and the other is welded to the one of the members, so that the part of the through hole and the remainder of the through hole surround the condenser 60. Of course, the two members are not limited to being welded to each other, and may be bolted or mechanically coupled.

[0185] In the heat dissipation device for an electrical element according to an embodiment of the present invention configured as described above, the refrigerant supply unit 40 supplies the condensed refrigerant in the second chamber C2 to the spray unit 30, the spray unit 30 sprays the refrigerant supplied from the refrigerant supply unit 40 into the second chamber C2, and the heat exchange member 50 of the evaporator 100 evaporates the refrigerant sprayed by the spray unit 30.

[0186] The refrigerant evaporated in this manner in the second chamber C2 can be condensed in the multiple heat dissipation fins 23 and / or the condensation section 60, and then moved to the pump 41 of the refrigerant supply section 40, and the refrigerant supply section 40 can supply the condensed refrigerant again to the injection section 30.

[0187] By repeating this process, the heat generated from the heating element can be quickly dissipated.

[0188] As described above, in the heat dissipation device for an electrical element according to an embodiment of the present invention, the injection unit 30 injects the condensed refrigerant in the second chamber C2 supplied by the refrigerant supply unit 40 into the second chamber C2 in a vacuum state, and the evaporation unit 100 evaporates the refrigerant injected by the injection unit 30 into the second chamber C2 using sensible heat transferred from the first chamber C1 to the evaporation unit 100 and latent heat transferred from the evaporation unit 100 to the second chamber C2. Therefore, heat generated from a heat-generating element mounted on a printed circuit board arranged in the first chamber C1 can be quickly dissipated by a phase change of the refrigerant, and there is no need to install many mechanical air-cooled heat dissipation structures, resulting in a smaller size.

[0189] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical idea or essential features of the present invention. Therefore, the above-described embodiments should be understood to be illustrative and not limiting in all respects. The scope of the present invention is defined by the claims below rather than the above detailed description, and any modifications or variations derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. [Industrial Applicability]

[0190] The present invention provides a heat dissipation device for an electronic component that has improved heat dissipation performance while minimizing its size. [Explanation of symbols]

[0191] 1: Vacuum gauge 2: Pressure gauge 10: Radome 20: Heat dissipation cover 28:Outflow section 29:Inflow section 30: Injection part 40: Refrigerant supply part 50, 500: Heat exchange member 51, 510: Body 52, 520: Heat exchange protrusion 60: Condenser section 70: Compartment frame 75: Body insertion groove 80: Mounting bracket 100: Evaporation section C1: First chamber C2: Second chamber

Claims

1. a first chamber in a non-vacuum state in which a printed circuit board having a heating element mounted thereon is disposed; a second chamber in a vacuum state, the second chamber including an ejection unit that ejects a refrigerant and a refrigerant supply unit that supplies the refrigerant to the ejection unit; an evaporation section disposed between the first chamber and the second chamber; The injection unit injects the condensed refrigerant in the second chamber, which is supplied by the refrigerant supply unit, into the second chamber, The evaporator evaporates the refrigerant injected into the second chamber by the injection unit using sensible heat transferred from the first chamber to the evaporator and latent heat transferred from the evaporator to the second chamber.

2. The evaporation section includes: a partition frame that partitions the first chamber and the second chamber; 2. The heat dissipation device for an electrical element as described in claim 1, further comprising: a heat exchange member coupled to the partition frame and disposed within the second chamber, the heat exchange member using the sensible heat and the latent heat to evaporate the refrigerant sprayed by the spray portion into the second chamber.

3. A radome disposed on one surface of the compartment frame; A heat dissipation cover disposed on the other surface of the partition frame, the first chamber is formed between the compartment frame and the radome; The heat dissipation device for an electrical component according to claim 2 , wherein the second chamber is formed between the partition frame and the heat dissipation cover.

4. The heat exchange member is A plate-shaped body disposed in the partition frame; The heat dissipation device for an electrical component according to claim 2 , further comprising a plurality of heat exchange protrusions formed on one surface of the body.

5. The heat exchange member is A plate-shaped body disposed in the partition frame; The heat dissipation device for an electrical component according to claim 2 , further comprising a plurality of heat exchange grooves formed on one surface of the body.

6. 6. The heat dissipation device for an electrical component according to claim 4, wherein the partition frame is formed with a body insertion groove into which the body is inserted.

7. The heat dissipation device for an electrical component according to claim 2 , wherein the heat exchange member is formed of a porous sintered powder compact.

8. The printed circuit board includes at least one printed circuit board, The heat dissipation device for an electrical component according to claim 2 , wherein at least one heat exchange member is disposed on each of the printed circuit boards.

9. The heat dissipation device for an electrical component according to claim 4 , wherein the heat exchange protrusions are formed in a bar shape having a polygonal cross section.

10. The heat dissipation device for an electrical component according to claim 4 , wherein the heat exchange protrusions are formed in a bar shape having a circular cross section.

11. The heat dissipation device for an electrical component according to claim 5 , wherein the heat exchange groove is formed in a bar shape having a polygonal cross section debossed inside the body.

12. The heat dissipation device for an electrical component according to claim 5 , wherein the heat exchange groove is formed in a bar shape having a circular cross section in a debossed form inside the body.

13. The heat dissipation device for an electrical component according to claim 3 , wherein a plurality of heat dissipation fins are formed on an outer surface of the heat dissipation cover corresponding to the other surface of the partition frame.

14. 4. The heat dissipation device for an electrical component according to claim 3, further comprising a tubular condenser portion disposed outside the heat dissipation cover, for condensing the evaporated coolant in the second chamber and supplying the condensed coolant to the coolant supply portion.

15. The heat dissipation device for an electrical component according to claim 14 , wherein the condensation portion is formed in a bellows shape.

16. The heat dissipation device of claim 14 , further comprising a mounting bracket disposed on an outer side of the heat dissipation cover, the mounting bracket having a through hole through which the condenser portion passes.

17. an outlet portion through which the evaporated refrigerant in the second chamber flows out is protruded from an upper portion of the heat dissipation cover; an inlet portion protruding from a lower portion of the heat dissipation cover through which the refrigerant condensed in the condenser portion flows into the second chamber; The heat dissipation device for an electrical component according to claim 14 , wherein the condensation portion connects the outlet portion and the inlet portion.

18. a vacuum gauge for creating a vacuum inside the second chamber; The heat dissipation device for an electrical component according to claim 2 , further comprising: a pressure gauge for measuring a pressure inside the second chamber.

19. 2. The heat dissipation device for an electrical element according to claim 1, wherein the heat generating element includes at least one of an antenna element for transmitting and receiving a radio signal, and a radio signal processing unit (RU; Radio Unit) for processing the radio signal.

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