IC chip-equipped device and method for equipping IC chip

Abstract

To improve the productivity in a manufacturing process of an inlay.SOLUTION: The IC chip-equipped device includes: a conveyance unit for conveying an antenna continuous body on a predetermined conveyance surface, the antenna continuous body including antennas for an inlay continuously formed on a base material; an IC chip arrangement unit for arranging an IC chip on a photo-curing adhesive provided in a predetermined reference position of each antenna of the antenna continuous body; and a light beam radiation unit in which the IC chip is arranged, the light beam radiation unit radiating a light beam to the adhesive on each antenna of the antenna continuous body conveyed by the conveyance unit. The light beam radiation unit radiates the light beam while pressing the IC chip on the adhesive toward the antennas.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to an IC chip mounting device and an IC chip mounting method. [Background technology]

[0002] With the spread of RFID tags, the number of antennas and IC chips electrically connected to the antennas has increased. The production of sheet inlays with a base is expanding. An antenna formed on a substrate that serves as a reference for mounting an IC chip Adhesive is applied to the predetermined reference position above, and an IC chip is placed at the reference position. The adhesive is then cured to fix the IC chip in place. For example, in the adhesive curing method described in Patent Document 1, four adhesives arranged on a substrate are The four crimping tools are pressed against the parts while irradiating light to harden the light-curing adhesive. It is described that the [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-206278 A Summary of the Invention [Problem to be solved by the invention]

[0004] Conventionally, when fixing components such as IC chips by hardening the adhesive, the conveyance of the components to be bonded is stopped. This makes it difficult to improve productivity. Therefore, one aspect of the present invention is to improve productivity in the inlay manufacturing process. The purpose is. [Means for solving the problem]

[0005] In one aspect of the present invention, a plurality of antennas for inlays are continuously formed on a substrate. A conveying section that conveys the antenna continuum on a predetermined conveying surface, and each antenna of the antenna continuum An IC chip is placed on a light-curing adhesive provided at a predetermined reference position. a placement unit, and the antenna continuum on which an IC chip is placed and which is transported by the transport unit. a light irradiating unit that irradiates light onto the adhesive on each of the antennas, The IC chip placed on the adhesive is pressed against the antenna, and the light is irradiated. It is a device equipped with an IC chip that performs the above functions. Effect of the Invention

[0006] According to one aspect of the present invention, it is possible to improve productivity in the manufacturing process of an inlay. Cut. [Brief description of the drawings]

[0007] [Figure 1] 1A and 1B are a plan view and a partially enlarged view of an antenna according to an embodiment of the present invention, respectively, before and after mounting an IC chip thereon. [Diagram 2] FIG. 2 is a diagram showing an antenna sheet and a roll body around which the antenna sheet is wound. [Diagram 3] 4A to 4C are diagrams showing a portion of the IC chip mounting device according to the embodiment corresponding to an IC chip placement step. [Figure 4] FIG. 2 shows a chip-containing tape and its enlarged cross section. [Diagram 5] FIG. 2 is a side view of a rotary mounter in the IC chip mounting device of the embodiment. [Figure 6] 1 is a diagram for explaining the relationship between a rotary mounter and an antenna sheet. FIG. [Figure 7] 11 is a perspective view showing a state in which the chip-including tape is separated by a separation roller. FIG. [Figure 8]13A to 13C are diagrams illustrating the operation of supplying IC chips from the chip-containing tape to the nozzle unit. [Figure 9] 5A to 5C are diagrams showing a portion of the IC chip mounting device according to the embodiment that corresponds to a curing step. [Figure 10] 10 is a diagram showing a part of the pressing unit and an ultraviolet irradiator as viewed from an arrow J in FIG. 9. [Figure 11] 3A and 3B are a front view and a side view of a pressing unit included in the curing device of the embodiment. [Figure 12] FIG. 2 is a plan view of a pressing unit circulation mechanism included in the curing device of the embodiment. [Figure 13] 13A and 13B are views showing cross sections BB and CC of FIG. 12. [Figure 14] 11A and 11B are diagrams illustrating the positional relationship of the pressing unit with respect to the rail in a tensioned state and a pressed state in the pressing unit circulation mechanism. [Figure 15] 13A and 13B are diagrams illustrating a sending-out operation of the pressing unit. [Figure 16] 4 is a functional block diagram of a control unit that controls the curing device. FIG. [Figure 17] 1A to 1C are diagrams illustrating a method of conveying an antenna sheet according to an embodiment. [Figure 18] 1A to 1C are diagrams illustrating an IC chip placement process according to an embodiment. [Figure 19] FIG. 2 is a diagram illustrating a curing process according to an embodiment. [Figure 20] FIG. 20 is a diagram illustrating a configuration example of an ultraviolet curing unit in FIG. 19. [Figure 21] FIG. 2 is a diagram illustrating a curing process according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] The IC chip mounting device and the IC chip mounting method according to the embodiment will be described below with reference to the drawings. Please refer to the following for explanation. The IC chip mounting device 1 according to the embodiment is an inlay for non-contact communication such as an RFID inlay. This is a device that mounts IC chips onto thin-film antennas when manufacturing semiconductor devices. In FIG. 1, an exemplary antenna AN having a predetermined antenna pattern is shown. The antenna pattern is not intended to be limiting. FIG. 1 also shows an IC chip C The figures show an enlarged view of part E before and after the antenna is mounted. The IC chip C is mounted at a predetermined reference position Pref that is determined in advance based on the line. The IC chip C is extremely small, for example, with a length and width of several hundred μm. It is required that an IC chip C of a certain size be mounted accurately at a reference position Pref.

[0009] To mount the IC chip C on the antenna AN, the antenna AN is aligned to the reference position Pref. an IC chip placement step of applying adhesive to the IC chip C and placing the IC chip C on the adhesive; A curing process is required to harden the adhesive and strengthen the connection between the antenna AN and the IC chip C. .

[0010] In the IC chip placement process described later, as shown in FIG. 2, multiple antennas AN are arranged at a constant pitch. The strip-shaped antenna sheet AS (an example of an antenna continuum) formed on the substrate BM is wound with a The roll body PR is then set in place. The antenna sheet AS is continuously pulled from the roll body PR. Then, the parts are sent to the line for the IC chip placement process. The material of the substrate BM is not particularly limited, but may be, for example, fine paper, coated paper, art paper, etc. Paper substrates such as paper, PET (polyethylene terephthalate), PE (polyethylene), Synthetic resin films made of PP (polypropylene) and PS (polystyrene), as well as the above A composite sheet made of a combination of multiple synthetic resins, a composite sheet made of a synthetic resin film and paper can also be used. The antenna AN is formed by, for example, attaching a metal foil to the substrate BM, or by applying a conductive material to the substrate BM. The film is formed by screen printing or vapor deposition in a predetermined pattern.

[0011] In the following description, the XYZ coordinate system is defined as shown in FIG. When referring to a diagram of the state in which the product is arranged at each process, the diagram viewed on the YZ plane is called a front view, A view seen on the XY plane is called a plan view, and a view seen on the XZ plane is called a side view. The X direction is the direction in which the antenna sheet AS unwound from the roll body PR passes through each process described below. The Y direction is the direction in which the sheet is conveyed during the conveying process, and is also referred to as the conveying direction D1. The Z direction is the width direction of the antenna sheet AS, and is also referred to as the width direction D2 as appropriate. This is the direction perpendicular to the AS.

[0012] (1) IC chip placement process The IC chip arrangement process will be described below with reference to FIGS. FIG. 1 is a diagram showing a portion of the IC chip mounting device 1 corresponding to an IC chip placement step. FIG. 4 shows a plan view of the chip-containing tape CT and an enlarged view of its cross section taken along line AA. In the IC chip placement process, the IC chip mounting device 1 mounts each antenna on the antenna sheet AS. The extremely small IC chip is precisely aligned with the reference position Pref (see Figure 1) of the antenna AN. It is possible to arrange it easily.

[0013] As shown in FIG. 3, in the IC chip placement process, the IC chip mounting device 1 moves the conveyor 8 1, a dispenser 2, a rotary mounter 3, an ultraviolet irradiator 41, and an imaging device CA 1 to CA3, a tape feeder 71, a tape body take-up reel 72, and a film take-up It includes a reel 73 and a separation roller 74 .

[0014] The conveyor 81 (an example of a conveying section) is an antenna pulled out from a roll body PR (see FIG. 2). The sheet AS is conveyed downstream of the process at a predetermined conveying speed. This corresponds to the conveying surface. The dispenser 2 dispenses a fixed amount of anisotropic radiation toward the reference position Pref of each of the conveyed antennas AN. Anisotropic Conductive Paste (ACP) This conductive paste is an example of an ultraviolet-curing adhesive. The dispenser 2 accurately positions the ejection position relative to the reference position Pref of each antenna AN. In order to achieve this, the ejection position is configured to be adjustable in the width direction.

[0015] The image pickup device CA1 is provided upstream of the dispenser 2 and is positioned to dispense the conductive paste. In order to determine the position of each antenna AN, an image of the portion near the reference position Pref is captured. The imaging device CA2 is provided downstream of the dispenser 2 and is induced in the respective antennas AN. Inspects whether the conductive paste is applied and whether the conductive paste is accurately placed at the reference position Pref. In order to check whether the coating has been applied to the area including the reference position Pref of each antenna AN, An image of the adjacent area is captured.

[0016] The rotary mounter 3 (an example of an IC chip placement unit) is used to This is a chip mounter that places IC chips on the conductive paste. It rotates counterclockwise as shown in Figure 3. The rotary mounter 3 is attached to a suspension plate 86, which is supported by a support base 85. In other words, the rotary mounter 3 is suspended from the support base 85. It has become. As will be described later, the rotary mounter 3 picks up IC chips from the chip-containing tape and The IC chip is then attached to the antenna sheet AS toward the reference position Pref of each antenna AN on the antenna sheet AS. At this time, the IC chip is precisely aligned to the reference position of the antenna AN. The position and orientation of the adsorbed IC chip are corrected in order to place it on the position Pref. When mounting the IC chip on the antenna AN, the imaging device CA3 determines the position of the IC chip. In addition, in order to carry out the correction process to correct the orientation, the IC chip is held by the nozzle (described later). Take a picture of the top.

[0017] The tape feeder 71 is loaded with a tape including an IC chip wound thereon. The chip-containing tape is then loaded in the direction of the arrow in Figure 3 at a speed synchronized with the rotary mounter 3. The device is configured to extract a loop. Now, with reference to FIG. 4, an example of the chip-containing tape will be described. As shown in FIG. 4, the chip-containing tape CT has a constant recess Td that contains the IC chip C. The tape body T is formed at an interval of 10 mm, and the tape body T is attached to the tape body T so as to close the recess Td. The recesses Td are, for example, embossed on the tape body T. The IC chip C is formed along the extending direction of the chip-containing tape CT. The chips are contained in each recess Td. The attachment holes H are formed in the separation roller 74. The attachment holes H are formed in the separation roller 74 so as to allow accurate positioning with respect to the peripheral surface of the separation roller 74. When the chip-containing tape CT is conveyed to the separation roller 74, When the sheet is conveyed, it is inserted into a protrusion 74p (described later) provided on the separation roller 74.

[0018] As shown in FIG. 4, the bottom surface of the recess Td and the back surface of the tape body T (where the covering film CF is adhered) are Between the surface (opposite the surface being covered) and the surface being covered, suction holes Ts are formed. In order to prevent the IC chip C from falling out of the recess Td when the cover film CF is peeled off, The IC chip C is attached by suction using a roller 74 .

[0019] Referring again to FIG. 3, at the separation roller 74, one or more tape feeders 71 are fed. The covering film CF is peeled off from the chip-containing tape CT, which is fed through an auxiliary roller. The tape body T and the covering film CF are separated. The covering film CF is peeled off and exposed. The IC chips C are successively sucked by the nozzles provided on the rotary mounter 3 . The chip-containing tape CT is separated into the tape body T and the covering film CF by the separation roller 74. After being released, the tape body T is wound around the tape body take-up reel 7 via one or more auxiliary rollers. 2, and the covering film CF is wound on the film winding ring via one or more auxiliary rollers. It is wound onto coil 73.

[0020] Next, the rotary mounter 3 will be described with reference to FIGS. FIG. 5 is a side view of the rotary mounter 3 in the IC chip mounting device 1 of the embodiment. FIG. 6A is a plan view of the nozzle unit mounted on the rotary mounter 3. FIG. 6 is a side view of the rotary mounter 3 and the antenna system. FIG. 1 is a diagram for explaining the relationship between the UE and the UE AS.

[0021] As shown in FIG. 5, the rotary mounter 3 has multiple radiating heads 3H. A number (12 in the illustrated example) of nozzle units 30-1 to 30-12 are provided. In the description, when referring to matters common to the nozzle units 30-1 to 30-12, are collectively referred to as nozzle unit 30. Although the rotary head 3H is not shown in detail, the nozzle unit is arranged counterclockwise in FIG. A rotary drive motor for rotating the nozzles 30-1 to 30-12, and an IC chip for the nozzle unit 30 A vacuum pump for adsorbing the chip and a nozzle unit for ejecting the IC chip from the nozzle unit 30. The blower is connected to the.

[0022] Referring to FIG. 6, the rotary head 3H is rotated counterclockwise by a rotation drive motor (not shown). 3H of each nozzle unit 30. In other words, the position of a particular nozzle unit 30 in the rotary head is changed over in sequence. In response to the rotation of the handle 3H, the conveyor moves along a circular track on a plane perpendicular to the conveying surface from the position PA. Each of the 12 positions PA to PL on the circumference of the rotary head 3H in a counterclockwise direction up to position PL The positions of the 100 and 110 are determined in order.

[0023] Here, the position PA is the position where the nozzle unit 30 picks up a new IC chip from the chip-containing tape CT. The position PE is a position where the nozzle C is attracted to the nozzle of the nozzle unit 30. This is the position where the image of the IC chip C is captured by the imaging device CA3. The position PK is the conductive paste applied to the antenna AN on the conveyed antenna sheet AS. At position PK, the nozzle tip is The moving direction coincides with the conveying direction D1 of the antenna sheet AS. At the position PK, the IC chip C Air is discharged from the nozzle of the nozzle unit 30 to release the At position PL, since the IC chip C has already been discharged at position PK, the nozzle unit 30 The IC chip C is not being held by suction. At position PL, dust that may adhere to the nozzle is removed. Air may be emitted from the nozzle to collect the dust that may be emitted from the nozzle. An example is shown in which a dirt collection tray TR is positioned at position PL for collection.

[0024] For example, the nozzle unit 30-1 at the position PA in FIG. Then, while still holding IC chip C, it rotates counterclockwise and reaches position PK. When the IC chip C is released, it returns to position PA and picks up a new IC chip C again. In this IC chip mounting method, the conveyance of the antenna sheet AS is not stopped. This allows IC chips to be placed on each antenna AN in a quick and continuous manner, resulting in high productivity.

[0025] The nozzle unit 30 which reaches the position PK in sequence receives the antenna sheet A The rotor is set so that the IC chip C is emitted toward the reference position Pref of each antenna AN of S. The angular velocity of the read head 3H and the transport speed of the antenna sheet AS are set or controlled. In order to reliably place the IC chip C, the speed of the tip of the nozzle unit 30 in the vicinity of the position PK is It is preferable to provide a section in which the conveying speed of the antenna sheet AS and the conveying speed of the antenna sheet AS are constant.

[0026] In this embodiment, twelve nozzle units 30 are arranged on the rotary head 3H. The nozzles arranged on the rotary head 3H are as follows, but are not limited to the above. The number of units 30 can be set arbitrarily.

[0027] Next, referring to FIG. 7 and FIG. 8, the IC chip C is sucked by the nozzle unit 30. The following describes the operations that can be performed. FIG. 7 is a perspective view showing a state in which the chip-containing tape CT is separated by a separation roller 74. FIG. 8 is a side view of the vicinity of the separation roller 74, showing the nozzles from the chip-containing tape CT. 8 is a diagram illustrating an operation of supplying an IC chip C to the module unit 30. In order to clarify the state of the containing tape CT, only the chip containing tape CT is shown in cross section.

[0028] As shown in FIG. 7, the mounting holes of the chip-containing tape CT supplied from the tape feeder 71 The protrusion 74p of the separation roller 74 is inserted into the gap H, so that the width of the chip-containing tape CT is After the positioning is completed, the chip-containing tape CT is transported. The covering film CF of the chip-containing tape CT is peeled off and wound onto the film take-up reel 7. On the other hand, the tape body T of the chip-containing tape CT is wound on the tape body take-up reel 7 Head to 2.

[0029] As shown in FIG. 8, the IC chip C is exposed after the covering film CF is peeled off. At this time, the IC chip C is exposed and then the nozzle unit 30 In order to prevent the IC chip C from falling off during the short time it takes for the IC chip C to be attracted by the knit 30, The separation roller 74 has a mechanism for sucking the IC chip C toward the center of rotation of the separation roller 74. A suction passage (not shown) is provided. This suction passage and the suction holes T provided in the tape body T The IC chip C is sucked through s (see FIG. 4).

[0030] (2) Curing process Next, the curing step will be described with reference to FIGS. In the curing process, the conductive paste applied to each antenna that has gone through the IC chip placement process described above is cured. This hardens the paste to strengthen the physical connection between the antenna and the IC chip, Ensures electrical continuity between the tenna and the IC chip.

[0031] FIG. 9 is a diagram showing a portion of the IC chip mounting device 1 according to the embodiment that corresponds to a curing step. FIG. 10 shows a part of the pressing unit 6 and the ultraviolet irradiator 42 as viewed from the arrow J in FIG. 11 is a diagram showing a pressing unit 6 included in the curing device 4 of the embodiment. FIG. 12 is a plan view of the pressing unit circulation mechanism 5 included in the curing device 4 of the embodiment. In FIG. 12, a lower rail 51L, which will be described later, is omitted.

[0032] As shown in FIG. 9, in the curing process, the IC chip mounting device 1 has a conveyor 82 and a curing The imaging device includes a camera 4 and an imaging device CA4. The conveyor 82 conveys the antenna sheet AS conveyed from the upstream IC chip placement process. The upper surface of the conveyor 82 corresponds to the conveying surface. The imaging device CA4 is located at the most upstream side in the curing process (i.e., the most upstream side in the IC chip placement process). It is placed above the antenna sheet AS on the downstream side of the IC chip placement process. The image capturing device CA4 captures images of each antenna AN being transported from the IC chip placement process. This is provided to check whether the IC chip is properly placed in the do.

[0033] As shown in FIG. 9, the curing device 4 includes a pressing unit circulating mechanism as a pressing unit moving mechanism. 9 and 12, the device includes a mechanism 5 and an ultraviolet irradiator 42 (an example of a light irradiating unit). The pressing unit circulation mechanism 5 is a circulation rail consisting of an upper rail 51U and a lower rail 51L. A roller 51, a main belt 52, gears 521 and 522, an auxiliary belt 53, and a feed A gear 54 and a pressing unit 6 . The pressing unit circulation mechanism 5 circulates the pressing units 6 along a predetermined circular track. The pressing unit 6 moves up and down in a direction perpendicular to the conveying surface, and presses the conductive paste of the antenna AN. The IC chips placed on the antennas are pressed while the antennas are irradiated with ultraviolet light. The number of pressing units 6 provided in the pressing unit circulation mechanism 5 is not limited, but the number may be increased in consideration of productivity and cost. From this viewpoint, it is preferable that the number can be set to any number equal to or greater than two. The ultraviolet irradiator 42 is disposed along the conveying direction D1. It is possible to irradiate many antennae AN on S with ultraviolet light simultaneously.

[0034] In the IC chip mounting device 1 of this embodiment, the dispenser 2 is used to mount the IC chip on the antenna AN. A thermosetting adhesive such as an epoxy resin is applied, and a thermosetting device is used instead of the ultraviolet irradiator 42. It may be provided.

[0035] As shown in FIG. 9, preferably, a plurality of (eight in the illustrated example) pressing units 6 are arranged to The IC is placed on the conductive paste of multiple (eight in the illustrated example) antennas AN. At this time, the conveyor 82 conveys the antenna sheet AS. A plurality of pressing units 6 for pressing the antennas AN without stopping the pressing While moving at a constant speed in the conveying direction D1, the ultraviolet ray irradiator 42 irradiates each antenna AN. Therefore, when fixing the IC chip to the antenna AN, It has the advantage of being extremely reliable.

[0036] Referring to FIG. 10, ultraviolet rays are irradiated to each antenna AN by an ultraviolet irradiator 42. The status to be displayed is shown. The ultraviolet irradiator 42 has a light source 42e such as an LED (Light Emitting Device). The light source 42e irradiates ultraviolet light toward the antenna AN from a direction inclined obliquely with respect to the conveyance plane. The optical fiber is configured to irradiate the optical fiber. A side surface of the pressing portion 61 of the pressing unit 6 (i.e., a surface on the side where the ultraviolet irradiator 42 is disposed) The glass plate 61p constituting the pressing surface of the pressing portion 61 is made of glass that transmits ultraviolet light. It is formed by lath.

[0037] Next, the configuration of the pressing unit 6 will be described with reference to FIG. As shown in FIG. 11, the pressing unit 6 includes a pressing portion 61, a housing 62, a shaft 63, and a The housing 62 has a roller holder 66 and a roller support 67. A pair of lower rollers 64L and a pair of lateral rollers 65 are attached to the rollers. A pair of upper rollers 64U that rotate on the upper rail 51U is attached to the roller holding portion 66. The lower roller 64L and the upper roller 64U are adapted to rotate on a horizontal plane. The transverse rollers 65 are rollers adapted to rotate in a vertical plane.

[0038] One end of the shaft 63 is connected to the pressing portion 61, and the other end of the shaft 63 is connected to the roller holding portion 66. The shaft 63 is movable in the vertical direction in FIG. It is Noh. A spring (not shown) is installed inside the housing 62. The roller holder 61, the shaft 63, and the roller holder 66 are free to move without any external force being applied. The solid line shows the tension state, and the virtual line shows the tension state (when an external force is applied). When the external force is released, the spring's restoring force causes the structure to return to its free state. Although a coil spring may be used as the spring, it is preferable to use a magnetic spring. Since the pressing force is constant regardless of the stroke amount, damage to the IC chip is unlikely to occur. Another advantage is that the deterioration of characteristics after long-term use is extremely small.

[0039] A pair of V-shaped grooves 62g are formed in the housing 62. The number of the V-shaped grooves 62g is not limited. Although not shown, each groove is shaped to mate with the main belt 52 and the delivery gear 54. It is. It is preferable that a permanent magnet is embedded in the housing 62. As a result, as described later, the pressing units 6 are attracted to each other by magnetic force in the waiting area. Since the pressing units 6 can be overlapped with each other by pressing the pressing units 6 at the correct timing, Can be sent out.

[0040] The pressing portion 61 has a gap 61h formed on the side where the V-shaped groove portion 62g is formed, and the bottom A glass plate 61p that transmits ultraviolet light is attached to the When irradiation by the ultraviolet irradiator 42 is being performed, the bottom surface of the glass plate 61p The C chip is pressed. A glass plate 61p that transmits ultraviolet light is provided at the bottom of the glass plate 61p. This allows the IC chip to be pressed while being irradiated with ultraviolet light.

[0041] Referring to FIG. 12, in the pressing unit circulation mechanism 5, gears 521 and 522 rotate counterclockwise. A main belt drive motor M41 (not shown in FIG. 12) drives the main belt M41 so that the main belt M41 rotates at a constant angular velocity. The main belt 521 and the main belt 522 are driven by the gears 521 and 522. 2 moves circulating around the gears 521 and 522 at a constant speed along the orbit of the pressing unit 6. do. The auxiliary belt 53 is, for example, a flat belt or a V-belt, and is driven by an auxiliary belt driving motor M42 ( The auxiliary vehicle is driven at a constant speed in a clockwise direction in FIG. The bolt 53 engages with the V-groove portion 62g of the pressing unit 6 to hold the pressing unit 6 in place. Its role is to accelerate the vehicle along the course.

[0042] The feed gear 54 is configured to mesh with the V-groove portion 62g of the pressing unit 6. The gear is driven by the feed belt drive motor M43 (not shown in FIG. 12). The sending gear 54 rotates counterclockwise around the conveying position. The feed gear 5 is provided to feed the antenna toward the antenna sheet AS. The timing of operation of the feed roller 4 is controlled by the control unit 200, which will be described later. Instead of the gear 54, a delivery belt having a V-groove on the outside may be used.

[0043] Next, the operation of the pressing unit circulation mechanism 5 will be described with reference to FIGS. 13 is a view showing a cross section BB and a cross section CC of FIG. In the ball circulation mechanism 5, the pressure unit 6 is in a tension state and a pressure state with respect to the circulation rail 51. 15 is a diagram for explaining the positional relationship between the pressing unit 6 and the pressing unit 6. It is.

[0044] For the convenience of the following description, in FIG. 12, the circulation path of the pressing unit 6 is designated as a section S1 to S We will divide it into 5 sections and explain each section in order. As shown in FIG. 13, when the pressing unit 6 circulates on the circulation rail 51, A pair of upper rollers 64U of the roller set 6 rotates while contacting the upper surface 511 of the upper rail 51U. Therefore, the pair of lower rollers 64L of the pressing unit 6 does not come into contact with the bottom surface 512 of the lower rail 51L. It rotates while rotating.

[0045] Here, the height of the bottom surface 512 of the lower rail 51L based on the conveying surface of the conveyor 82 is It is constant around the entire circumference of the lower rail 51L. On the other hand, the height of the upper surface 511 of the upper rail 51U based on the conveying surface of the conveyor 82 is Specifically, the height of the upper surface 511 of the upper rail 51U varies in one revolution. The height of the upper surface 511 of the upper rail 51U is the lowest in the section S1 and the highest in the sections S3 and S4. In section S2, the height gradually increases as one moves counterclockwise in FIG. 12, and in section S5, becomes gradually lower as one moves counterclockwise in FIG. When the pressing unit 6 is located in the section S1, the upper surface 511 of the upper rail 51U The pressing unit 6 is in a pressing state close to a free state, and the pressing portion 61 is in a full rotation. In this state, the antenna is pressed against the board. The positions of the top surface 511 of the upper rail 51U and the bottom surface 512 of the lower rail 51L are set. There are.

[0046] As shown in FIG. 12, in the section S1, each pressing unit 6 conveys the antenna sheet AS. The antenna moves directly above each antenna of the antenna sheet AS along the direction D1. The V-shaped grooves 62g of the pressing units 6 engage with the main belt 52. Each pressing unit 6 moves according to the speed. As described above, in section S1, the upper surface 511 of the upper rail 51U is the lowest in the entire circumference. As shown in FIG. 14, each pressing unit 6 is in a pressing state close to a free state. 61 protrudes downward. As shown in FIG. 9, when the pressing unit 6 is in the pressing state, The repulsive force of a spring built into the pressing unit 6 presses the corresponding antenna of the antenna sheet AS. The IC chip placed on the conductive paste on the antenna is pressed.

[0047] In the section S2, as described above, the height of the upper surface 511 of the upper rail 51U is As the shaft moves clockwise, it gradually becomes higher. Therefore, the shaft 6 3 is gradually lifted (pulled) and at the end of section S2, it reaches the tension state shown in FIG. In the section S2, the V-shaped grooves 62g of each pressing unit 6 engage with the main belt 52. Each pressing unit 6 moves according to the speed of the rotation belt 52 . In section S2, the upper surface 511 of the upper rail 51U is gradually higher than that of section S1. Therefore, the roller holding portion 66 of each pressing unit 6 is pulled upward against the restoring force of the spring. , whereby the pressing portion 61 moves upward.

[0048] When the start position of the section S3 is reached, the pressing unit 6 is disengaged from the main belt 52. That is, as can be seen by comparing the BB section and the CC section in FIG. In S3 and S4 (see the CC section), the final position of section S2 and the start position of section S5 ( For both, refer to the BB cross section. The pair of pressing units 6 are offset outwardly (the offset amount ofs in FIG. 13). The lateral roller 65 rotates following the inner surface 513 of the lower rail 51L. The V-groove portion 62g of the knit 6 is separated from the main belt 52. In the section S3, after the pressing unit 6 is no longer in contact with the main belt 52, the state shown in FIG. The auxiliary belt 53 rotating counterclockwise comes into contact with the V-groove portion 62g on the outer side of the pressing unit 6 and is pressed strongly. Pushing out, whereby the pressing unit 6 accelerates counterclockwise along the circulating rail 51 The pressing unit 6 is accelerated in the section S3 because the pressing unit 6 is in a standby state. This is to avoid a situation in which the number of pressing units 6 is insufficient in S4. In the section S3 and the section S4 described later, the upper surface 511 of the upper rail 51U is As shown in FIG. 14, each pressing unit 6 is in a tensioned state.

[0049] In the section S4, the pressing units 6, which are accelerated in sequence in the section S3, are fed out. This is the waiting section (an example of a waiting position) where the pressing unit waits until the pressing unit is The housing 62 of the magnet 6 preferably contains a permanent magnet, so that the magnet 6 is As a result, the pressing units 6 are in close contact with each other and wait in an overlapping state. In the section S4, the sending gear 54 is the first of the multiple pressing units 6 waiting. The V-shaped groove 62g of the pressing unit 6 is engaged with the V-shaped groove 62g of the pressing unit 6. At the timing determined by 0, the sending gear 54 rotates clockwise in FIG. , whereby the pressing unit 6 located at the front is sent out. The units 6 overlap each other by magnetic force, so the pressing units The robots 6 can be sent out one by one from the waiting section S4.

[0050] The pushing operation of the pressing unit 6 will be further described with reference to FIG. , the pressing unit 6 in the vicinity of the delivery gear 54 is connected to the V-groove portion 62g and the main belt 5 2 and a delivery gear 54 in meshing state. As shown in FIG. 15, among the multiple pressing units 6-1, 6-2, ... in the waiting section S4, The V-groove portion 62g on the side is not engaged with the main belt 52, but the pressing unit 62a located at the front In the case of the gear 6-1, the outer V-groove portion 62g is in mesh with the delivery gear 54. In this state, the sending gear 54 rotates clockwise based on a command from the control unit 200, which will be described later. Then, the pressing unit 6-1 moves to the left side in FIG. A pair of lateral rollers 65 of the knit 6 moves along a path shown by a phantom line (i.e., also shown in FIG. 13). The lower rail 51L moves toward the main belt 52 by the offset amount ofs shown in FIG. Therefore, the pushed-out pressing unit 6-1 is directed toward the main belt 52. At the start position of the section S5, the inner V-groove portion 62g is in contact with the main belt 5 After the inner V-groove portion 62g engages with the main belt 52, the section In S5, the pressing unit 6-1 operates in accordance with the movement of the main belt 52.

[0051] That is, in the section S5, the V-groove portion 62g of each pressing unit 6 engages with the main belt 52. Each pressing unit 6 moves according to the speed of the main belt 52. As described above, the height of the upper surface 511 of the upper rail 51U changes as the rail 51 moves counterclockwise in FIG. As the spring moves, the shaft 63 gradually lowers. At the end of section S5, the pressing state shown in FIG. The pressing portion 61 of the mat 6 is at the lowest position in one revolution and presses each of the antennas that are conveyed. In this state, each pressing unit 6 advances to section S1, and each conveyed ampere The IC chip placed on the conductive paste of the tena is pressed.

[0052] As described above, each pressing unit 6 is arranged along the track of the circulating rail 51 (sections S1 to S 5) while circulating, the conductive paper of the antenna AN is raised and lowered in a direction perpendicular to the conveying surface. The pressing unit 6 presses the IC chips placed on the board. The pressing unit 6 can be continuously used for pressing.

[0053] Next, referring to FIG. 16, the control performed by the control unit 200 that controls the curing device 4 will be described. 16 is a functional block diagram of the control unit 200. The control unit 200 is mounted on a circuit board (not shown), and controls the image pickup device CA4, the main bell, drive motor M41, auxiliary belt drive motor M42, feed belt drive motor M43, And, it is electrically connected to the ultraviolet irradiator 42 . The control unit 200 includes a microcomputer, a memory (RAM (Random Access Memory), Includes ROM (Read Only Memory), storage, and drive circuits. Microcomputer The program stored in the memory is read and executed, and the belt driving means 201, the feed The output timing determination means 203 and the hardening execution means 204 are realized.

[0054] The belt driving means 201 drives the main belt 52 and the auxiliary belt 53 at the same speed. The main belt drive motor M41 and the auxiliary belt drive motor M42 are driven by the The belt driving means 201 sends a control signal to the driving circuit. The drive circuit of the delivery belt drive motor M43 is set according to the delivery timing determined by , which causes the send-out gear 54 to rotate at the send-out timing. As a result, as shown in FIG. 15, the pressing unit 6 at the head of the waiting section is sent out. .

[0055] The sending timing determination means 203 determines whether or not the pressing unit circulating mechanism 5 is in a standby zone. The timing for sending out the first pressing unit 6 out of the plurality of pressing units 6 is determined. The timing of delivery is determined based on the speed of the main belt 52 and the speed of the conveyor 82. In other words, the conveying speed parameters of the conveying sections S4 and S5 are taken into consideration. Each pressing unit 6 is connected to the corresponding antenna AN passing through the imaging device CA4 and the section S1. The timing of each pressing unit 6 is adjusted based on each parameter so that they join at the start position. The routing is determined.

[0056] The hardening implementation means 204 performs a preset hardening process for each of the antennas AN being carried. A predetermined drive signal is applied to the ultraviolet irradiator 42 so that ultraviolet light is irradiated from the ultraviolet irradiator 42 with the integrated light amount. The projectile is then delivered to the launcher 42.

[0057] As described above, a plurality of antennas are formed on a substrate at a constant pitch in a strip shape. The antenna sheet is fed into the line, and goes through the IC chip placement process and hardening process, and then each antenna The IC chip mounting device of this embodiment performs an IC chip placement process. In the antenna, adhesive is applied toward the reference position and an IC chip is placed on the adhesive. The adhesive is then hardened in the curing process to strengthen the connection between the antenna and the IC chip. In particular, in the curing step of this embodiment, the antenna sheet on which the multiple antennas are formed is conveyed. Without stopping the feed, the IC chip placed on the conductive paste was pressed against the antenna. This makes it extremely difficult to attach the IC chip to the antenna. That is, the productivity can be improved in the inlay manufacturing process.

[0058] The embodiments of the IC chip mounting device and the IC chip mounting method have been described above. The present invention is not limited to the above-described embodiment. In addition, the above-described embodiment may be modified without departing from the spirit of the present invention. Various improvements and modifications are possible within the scope of the present invention.

[0059] For example, in the embodiment shown in FIG. 3, in the IC chip arrangement step, the antenna sheet A Although the case where S is transported in one direction on the conveyor 81 has been described, this is not the only possible case. In one embodiment, as shown in FIG. 17, in the IC chip placement process, a suction drum 92 , 94 and a number of conveying rollers (for example, conveying rollers 91, 93, 95 in FIG. 17) In FIG. 17, the antenna sheet AS is conveyed at the highest position of the suction drum 92. A conductive paste is dispensed by a dispenser 2 onto the reference position of an antenna AN on an antenna sheet AS. Also, at the highest position of the suction drum 94, an IC chip is placed on the conductive paste. In this case, at least the suction drums 92 and 94 suck the rear surface of the antenna sheet AS. It is preferable that the roller is a suction roller that adheres to the antenna sheet AS. (especially in the longitudinal direction) can be prevented, and the discharge of the conductive paste and the arrangement of the IC chip can be This can be done with high precision.

[0060] In one embodiment, the conductive layer applied to the antenna AN on the conveyed antenna sheet AS is Instead of releasing the IC chip onto the conductive paste, the IC chip is pressed against the conductive paste. The placement may also be achieved by placing Figure 18 shows a rotor in which the IC chip is placed by pressing it against the conductive paste. The operation of the rotary mounter 3 is shown in time sequence. Each nozzle unit 30 can be moved individually in the radial direction by a built-in driving device. It is composed of Noh. In the state ST1, the nozzle unit 30 picks up the IC chip C. When the C chip C is arranged, as shown in state ST2, the nozzle unit 30 is moved in the emitting direction. 2. The Z-direction in FIG. 2 is a reference position. ) and press the IC chip C onto the conductive paste applied to the antenna AN. After placing the IC chip C, it is sucked up. The nozzle unit 30 is released and returned to the position of state ST1. When the unit 30 reaches the position PK (see FIG. 6), the operation of the states ST1 to ST3 is performed. By this, the IC chip C is placed on the conductive paste applied to the antenna AN.

[0061] The curing process is not limited to using the curing device 4 that circulates the pressing units 6. The curing process of one embodiment is shown in Figure 19. Figure 19 shows the curing process of one embodiment. The curing device 4A has a plurality of ultraviolet curing units 43 mounted on a mounting plate 4. 4. The antenna AN adjacent to the antenna sheet AS is removably attached to the antenna sheet AS. A plurality of mounting plates 44 with different mounting positions are prepared according to the intervals. By replacing the mounting plate 44, it is possible to accommodate various antenna sheets AS. . The support shaft 45 supports the mounting plate 44 and is configured to be able to raise and lower the mounting plate 44. The antenna sheet AS conveyed from the chip placement process is conveyed by conveying rollers 96 to 98. The conveying roller 97 is configured to be movable up and down by a driving device (not shown). It is being done.

[0062] A configuration example of the ultraviolet curing unit 43 is shown in FIG. The unit 43 includes a light source 432 (e.g., an LED light source) for irradiating ultraviolet light into the housing 431. The light source 432 is connected to the UV curing unit 43 through a cable 43 provided from the outside. 19. The housing 431 is illuminated by a light source 432. A condenser lens for condensing the ultraviolet light irradiated may be provided. The ultraviolet light emitted from the light source 432 is incident on each of the antennas. The light is irradiated onto the conductive paste applied to the tena AN, hardening the conductive paste.

[0063] Referring again to FIG. 19, the conveying state is such that the antenna sheet AS is The antenna AN, which is coated with uncured conductive paste, is shown in purple. The conveyance of the antenna sheet AS stops when it is located directly under the external radiation curing unit 43. Then, when the conveyance of the antenna sheet AS is stopped (stopped state), The external radiation curing unit 43 is moved downward to press the antenna AN against the glass plate 435. While doing so, ultraviolet light is applied to harden the conductive paste.

[0064] Even when the machine is stopped, the antenna sheet AS is transported from the IC chip placement process. Therefore, while the ultraviolet rays are being irradiated, the conveying roller 97 descends under its own weight, and the conveyed The tena sheet AS is absorbed between the transport roller 96 and the transport roller 98. The irradiation of ultraviolet rays is completed. Then, the antennas AN, the number of which corresponds to the number of the ultraviolet curing units 43, are rapidly transported downstream. The uncured antenna AN is stopped so as to be positioned directly below the ultraviolet curing unit 43. In the curing step of one embodiment, the antenna sheet AS is conveyed and stopped (irradiated with ultraviolet light). When the antenna AN is rapidly transported, the transport roller 97 rises due to the tension applied to the antenna sheet AS.

[0065] In one embodiment, the curing step may be performed using a thermal curing device. When a thermosetting adhesive such as an epoxy resin is applied in step 2, the heat The adhesive is hardened by performing a curing process. FIG. 21 shows a state in which the antenna sheet AS is repeatedly conveyed and stopped, similarly to FIG. The curing device 4B is configured to be used in the curing process. Unlike the curing device 4A, the curing device 4B is The device includes a plurality of heat curing units 46. Each heat curing unit 46 is connected to a cable (not shown). When the antenna sheet AS is in a stopped state, a heat source is placed in the antenna sheet. The support shaft 45 is driven to move down, and each heat curing unit 46 is connected to the corresponding antenna A. The adhesive is heated and hardened while pressing N. When heating is completed, the support shaft 45 rises. At the same time, the antenna sheet AS is transported.

[0066] In FIG. 19, when the conductive paste is cured by ultraviolet light, Instead of the ultraviolet curing unit 43, a pressing unit that presses the antenna AN through a glass plate is provided. The conductive paste on the antenna AN is pressed in the stopped state. Alternatively, an ultraviolet ray irradiation device that irradiates ultraviolet rays from obliquely above may be provided. In one embodiment, the antenna sheet AS may be in a stopped state when irradiating ultraviolet light. 9, a plurality of ultraviolet curing units 43 are provided on the antenna sheet AS The antenna AN is pressed against the built-in light source while moving in a circular motion in tandem with the moving speed of the More ultraviolet light may be irradiated. Similarly, in one embodiment, when the conductive paste is thermally cured, a plurality of thermal curing units 4 6 is moved in a circular manner in conjunction with the moving speed of the antenna sheet AS, and the antenna AN is pressed. The heating may be performed while the heating is being performed. [Explanation of symbols]

[0067] 1...IC chip mounting device, 2...dispenser, 3...rotary mounter, 3H...rotor head, 4, 4A, 4B...hardening device, 5...pressure unit circulation mechanism, 6...pressure unit 30: nozzle unit; 41, 42: ultraviolet irradiator; 42e: light source; 43: ultraviolet curing unit, 44...mounting plate, 45...support shaft, 46...thermosetting unit, 51...circulation rail, 5 1L…Lower rail, 51U…Upper rail, 52…Main belt, 53…Auxiliary belt, 54 ... delivery gear, 61... pressing portion, 61h... gap, 61p... glass plate, 62... housing, 62g...V groove, 63...shaft, 64L...lower roller, 64U...upper roller, 65...side Direction roller, 66... ​​roller holding portion, 71... tape feeder, 72... tape main body take-up reel 73...film take-up reel, 74...separation roller, 74p...projection, 75...branching member, 81, 82... conveyor, 85... support stand, 86... suspension plate, 91, 93, 95~98... conveyor roller, 92, 94... suction drum, 200... control section, 201... belt driving means, 203... feeder Exit timing determination means, 204...hardening execution means, 511...upper surface, 512...bottom surface, 513... Inner surface, 521, 522... gear, AN... antenna, AS... antenna sheet, BM... substrate, C: IC chip, CA1-CA4: imaging device, CF: covering film, CT: chip-containing tape H...Mounting hole, M41...Main belt drive motor, M42...Auxiliary belt drive motor, M43: Feeding belt drive motor, PR: Roll body, T: Tape body, TR: Waste collection Tray, Td: recess, Ts: suction hole

Claims

1. A plurality of antennas for inlay are continuously formed on a substrate, and an antenna continuum is formed by a predetermined method. A conveying unit that conveys on a conveying surface of the conveying unit; A photocurable adhesive is applied to each antenna of the antenna continuum at a predetermined reference position. an IC chip placement unit for placing an IC chip; Each antenna of the antenna continuum, on which an IC chip is disposed and which is being transported by the transport unit, a light irradiating unit that irradiates the adhesive on the antenna with a light beam; Equipped with The light irradiating unit is in a state where the IC chip placed on the adhesive is pressed toward the antenna. The light beam is irradiated by Device equipped with IC chip.

2. The light irradiation unit is disposed on the conveying surface along the conveying direction of the antenna continuum. It has been said that 2. An IC chip mounting device according to claim 1.

3. The IC chip is placed on the adhesive by moving up and down in a direction perpendicular to the conveying surface. A pressing unit is provided to press the 3. An IC chip mounting device according to claim 1 or 2.

4. The pressing unit is sent from the standby position toward an antenna on the conveying surface, A pressing unit moving mechanism is provided that moves the pressing unit along a surface while circulating a predetermined circular orbit. Ta, 4. An IC chip mounting device according to claim 3.

5. A plurality of the pressing units are provided, The pressing unit moving mechanism moves each of the pressing units from the standby position to a predetermined Send it out at the right time.

5. An IC chip mounting device according to claim 4.

6. The pressing unit presses the IC chip placed on the adhesive and directs the light beam. A glass pressing surface is provided to allow light to pass through.

6. An IC chip mounting device according to claim 3.

7. The light irradiation unit is built into the pressing unit.

2. An IC chip mounting device according to claim 1.

8. A plurality of antennas for inlay are continuously formed on a substrate, and an antenna continuum is formed by a predetermined method. A conveying unit that conveys on a conveying surface of the conveying unit; A thermosetting adhesive is applied to each antenna of the antenna continuum at a predetermined reference position. an IC chip placement unit for placing an IC chip; Each antenna of the antenna continuum, on which an IC chip is disposed and which is being transported by the transport unit, a heat curing unit that applies heat to the adhesive on the antenna; Equipped with The heat curing section presses the IC chip placed on the adhesive toward the antenna. Heating is performed, Device equipped with IC chip.

9. A plurality of antennas for inlay are continuously formed on a substrate, and an antenna continuum is formed by a predetermined method. The material is conveyed on the conveying surface of A photocurable type is applied to a predetermined reference position of each antenna of the antenna series by a dispenser. An adhesive is discharged and an IC chip is placed on the discharged adhesive; The IC chip placed on the adhesive is pressed against the antenna and transported. irradiating the adhesive on each antenna of the antenna array with a light beam; IC chip mounting method.

10. The IC chip is pressed against the antenna by a pressing unit that is perpendicular to the conveying surface. This is done by lifting and lowering the 10. The IC chip mounting method according to claim 9.

11. The pressing unit is sent from the standby position toward an antenna on the conveying surface, While moving the object along the surface, the object is moved cyclically around a predetermined circular orbit.

11. The IC chip mounting method according to claim 10.

12. sending out each of the plurality of pressing units from the standby positions at a predetermined timing; 12. The IC chip mounting method according to claim 11.

Images