Grinding wheel

Abstract

To provide a grinding wheel capable of suppressing the increase of a machining load.SOLUTION: This grinding wheel is loaded on a lower-end mounter of a spindle, and rotates to grind a workpiece. The grinding wheel comprises: an annular wheel base; and a plurality of grindstones 10 fixed to the lower surface of the grinding wheel in a circumferential direction. In a front view from the outer circumference of the grinding wheel to the annular wheel base, an angle θ formed between a bottom surface 12 which is the grinding surface of each grindstone 10 and an outer surface 14 from the bottom surface 12 to the wheel base 2 is 70-87 degrees.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a grinding wheel. [Background technology]

[0002] Silicon wafers with multiple IC (Integrated Circuit) and LSI (Large Scale Integration) devices formed on their front surface are ground on the back surface by a grinding device to form the wafer into a specified thickness. The wafer is then divided into individual devices by a cutting device and used in electrical equipment such as mobile phones and personal computers.

[0003] In addition, substrates made of hard and brittle materials (difficult-to-cut materials) such as sapphire substrates and SiC substrates used in LEDs (Light-Emitting Diodes) and power devices are also formed to a specified thickness on the back side by a grinding device, and then separated into individual devices by a cutting device for use in electrical equipment, etc.

[0004] Here, the back surface of the hard and brittle material substrate is ground by attaching a grinding wheel to the tip of a spindle of a grinding device (see, for example, Patent Documents 1 and 2).

[0005] The grinding wheel is configured by arranging a plurality of grinding stone portions (segments) in an annular groove formed in the end face of an annular base. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2011-29331 A [Patent Document 2] JP 2011-40631 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, when grinding a hard and brittle material substrate with the grinding wheels shown in the above patent documents, it was found that the processing load and the wear rate of the grinding stone portion fluctuate when one grinding wheel is used.

[0008] In particular, it was found that as machining progresses, the machining load on the grinding wheel increases, while the wear rate of the grinding stone decreases.

[0009] As a result of intensive research by the inventors of the present invention, this is due to the amount of cutting edge exposure of the grinding wheel, and since the cutting edge exposure of the grinding wheel is long in the early stages of processing, when the grinding wheel comes into contact with the hard and brittle material substrate, the grinding wheel experiences large vibrations in the radial direction (direction intersecting with the circumferential direction) of the grinding wheel. If the vibration is large, the grinding wheel is prone to self-sharpening, so the amount of wear is large and the processing load is low.

[0010] On the other hand, the inventors of the present invention have hypothesized that as machining continues, the vibrations become smaller, the grinding wheel becomes less likely to self-sharpen, the amount of wear becomes smaller, and therefore the machining load increases.

[0011] An object of the present invention is to provide a grinding wheel capable of suppressing an increase in the processing load. [Means for solving the problem]

[0012] In order to solve the above-mentioned problems and achieve the objectives, the grinding wheel of the present invention is a grinding wheel that is attached to the tip of a spindle and grinds a workpiece by rotating the spindle, and is characterized in that it comprises an annular base and a plurality of grinding stone portions fixed in the circumferential direction of the base, and when viewed from the outer periphery of the grinding wheel to the front of the annular base, the angle between the grinding surface of the grinding stone portions and the side facing the base is 70 degrees or more and 87 degrees or less.

[0013] In the grinding wheel, the workpiece may be any one of an oxide-based substrate, a carbide-based substrate, and a nitride-based substrate. Effect of the Invention

[0014] The present invention has an effect of suppressing an increase in the processing load. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a perspective view showing a configuration example of a grinding device to which a grinding wheel according to a first embodiment is attached. [Diagram 2] FIG. 2 is a plan view showing a movement trajectory of a grinding stone part of a grinding wheel attached to a grinding unit of the grinding apparatus shown in FIG. 1 and a workpiece. [Diagram 3] FIG. 3 is a perspective view of the grinding wheel according to the first embodiment as viewed from below. [Figure 4] FIG. 4 is a perspective view of the grinding stone portion of the grinding wheel shown in FIG. [Diagram 5] FIG. 5 is a side view of the grinding stone portion of the grinding wheel shown in FIG. 3 as viewed from the outer periphery. [Figure 6] FIG. 6 is a side view showing a state in which the grinding stone portion of the grinding wheel shown in FIG. 3 grinds a workpiece, as viewed from the outer periphery. [Figure 7] FIG. 7 is a side view that typically illustrates a state in which the grinding wheel portion illustrated in FIG. 6 is worn. [Figure 8] FIG. 8 is a diagram showing the change in height and current value for the comparative example, present invention product 1, present invention product 2, present invention product 3, present invention product 4 and present invention product 5. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0017] [Embodiment 1] A grinding wheel according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a grinding device to which a grinding wheel according to the first embodiment is attached. Fig. 2 is a plan view showing a moving trajectory of a grinding stone part of a grinding wheel attached to a grinding unit of the grinding device shown in Fig. 1 and a workpiece.

[0018] (workpiece) A grinding wheel 1 according to the first embodiment shown in Fig. 1 is attached to a mounter 122 at a lower end of a spindle 121 of a grinding unit 120 of a grinding apparatus 100 shown in Fig. 1. The grinding apparatus 100 shown in Fig. 1 is a processing apparatus that grinds a workpiece 200, which is an object to be processed, to reduce the thickness of the workpiece 200 to a predetermined finishing thickness.

[0019] 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose substrate is silicon, sapphire, gallium arsenide, etc. In the first embodiment, the workpiece 200 has devices formed in each of a plurality of regions partitioned by a plurality of intersecting (orthogonal in the first embodiment) planned dividing lines on a surface 201 of the substrate.

[0020] The device may be, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems), various types of memories (semiconductor memory devices), an LED (Light Emitting Diode), or a power device.

[0021] The workpiece 200 has a surface protective tape 210 attached to a surface 201 side of a substrate, and the surface 201 side is suction-held on a holding table 110 of the grinding device 100 via the surface protective tape 210, and a back surface 202 (corresponding to a surface to be processed) on the back side of the surface 201 is ground. In the first embodiment, the substrate of the workpiece 200 is any one of an oxide-based substrate, a carbide-based substrate, and a nitride-based substrate, and is made of a so-called hard and brittle material that is harder and more brittle than a so-called silicon substrate made of silicon.

[0022] The oxide substrate is a sapphire substrate made of sapphire, a glass substrate made of glass, or a sintered ceramic substrate made of various sintered ceramics. The carbide substrate is a SiC substrate made of SiC. The nitride substrate is a GaN substrate made of GaN, a SiN substrate made of SiN, or an AlN substrate made of AlN.

[0023] (Grinding Equipment) The grinding apparatus 100 is a grinding apparatus that grinds the back surface 202 side of the substrate of the workpiece 200 to thin the workpiece 200 to a predetermined finishing thickness. As shown in FIG. 1, the grinding apparatus 100 includes an apparatus base 101, a holding table 110, a grinding unit 120, a processing feed unit 130, a grinding feed unit 140, and a control unit 150.

[0024] The holding table 110 holds the workpiece 200 by holding the front surface 201 side of the workpiece 200 by a flat holding surface 111 along the horizontal direction via a surface protective tape 210, with the back surface 202 of the workpiece 200 exposed. The holding table 110 is moved along the X-axis direction parallel to the horizontal direction by the processing feed unit 130. The holding table 110 is moved in the X-axis direction by the processing feed unit 130 between a carry-in / out position where the workpiece 200 is carried in to the holding surface 111 or carried out from the holding table 110, and a processing position where the workpiece 200 held by suction on the holding surface 111 is ground by the grinding unit 120.

[0025] The holding table 110 is connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to suck and hold the workpiece 200 placed on the holding surface 111. In the first embodiment, the holding table 110 is rotated around a rotation axis 112 passing through the center of the holding surface 111 by a rotation mechanism (not shown).

[0026] (Grinding unit) The grinding unit 120 is a processing unit that mounts a grinding wheel 1, which is a processing tool for grinding a back surface 202 of the workpiece 200 held by the holding table 110, on a mounter 122 at the lower end of a spindle 121, and grinds (corresponds to processing) the back surface 202 of the workpiece 200. The grinding unit 120 is supported by a standing wall 102 that stands from the end of the device base 101 in the X-axis direction via a grinding feed unit 140. As shown in FIG. 1, the grinding unit 120 has a spindle 121 with a disk-shaped mounter 122 at its lower end, a motor 123 (shown in FIG. 1) that rotates the spindle 121 around its axis, a spindle housing 124 that supports the spindle 121 rotatably around its axis 125, and a processing liquid supplying means (not shown) that supplies processing liquid to the workpiece 200 held on the holding surface 111 of the holding table 110.

[0027] An axis 125 of the spindle 121 is disposed along the Z-axis direction parallel to the vertical direction. The spindle 121 rotates the grinding wheel 1 about the axis 125 by mounting the grinding wheel 1 on a mounter 122 and rotating the grinding wheel 1 about the axis 125 by a motor 123.

[0028] In embodiment 1, as shown in FIG. 2, the grinding unit 120 has an axis 125 which is the center of rotation of the grinding wheel 1 and an axis 112 which is the center of rotation of the holding table 110 positioned at the processing position, which are arranged parallel to each other with a horizontal gap between them, and the grinding stone portion 10 of the grinding wheel 1 passes over the center of the back surface 202 of the workpiece 200 held on the holding table 110.

[0029] The processing feed unit 130 is installed on the device base 101 and moves the holding table 110 in the X-axis direction relative to the grinding unit 120. The processing feed unit 130 moves the holding table 110 away from the grinding unit 120 between a carry-in / out position where the workpiece 200 is carried in and out of the holding table 110 and a processing position below the grinding unit 120 where the workpiece 200 is ground by the grinding unit 120. In the first embodiment, the processing feed unit 130 is covered by a cover 131 provided on the outer periphery of the holding table 110 and an expandable bellows 132, one end of which is attached to both ends of the cover 131 in the X-axis direction and the other end of which is fixed to the device base 101.

[0030] The grinding feed unit 140 is attached to an upright wall 102 that stands on the device base 101, and moves the grinding unit 120 in the Z-axis direction, which is the incision feed direction perpendicular to the holding surface 111. The grinding feed unit 140 lowers the grinding unit 120 to bring the grinding stone section 10 closer to the workpiece 200 held on the holding table 110 at the processing position, and raises the grinding unit 120 to move the grinding stone section 10 away from the workpiece 200 held on the holding table 110 at the processing position.

[0031] The machining feed unit 130 and the grinding feed unit 140 are equipped with a well-known ball screw that is rotatable around its axis, a well-known pulse motor that rotates the ball screw around its axis, and a well-known guide rail that supports the holding table 110 or the grinding unit 120 so that it can move freely in the Y-axis or Z-axis direction.

[0032] The control unit 150 controls each of the above-mentioned components constituting the grinding apparatus 100. The control unit 150 causes the grinding apparatus 100 to execute a machining operation on the workpiece 200. The control unit 150 is a computer that has an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device, and is capable of executing a computer program.

[0033] The arithmetic processing device of the control unit 150 executes a computer program stored in the ROM on the RAM to generate control signals for controlling the grinding apparatus 100. The arithmetic processing device of the control unit 150 outputs the generated control signals to each component of the grinding apparatus 100 via the input / output interface device.

[0034] The control unit 150 is connected to a display unit such as a liquid crystal display device that displays the status and images of the machining operation, an input unit used by the operator to register machining conditions, and a notification unit that notifies the operator. The input unit is composed of at least one of a touch panel and a keyboard provided on the display unit. The notification unit notifies the operator by emitting at least one of sound, light, and a message on the touch panel.

[0035] (Grinding Wheel) Next, the grinding wheel 1 will be described. Fig. 3 is a perspective view of the grinding wheel according to embodiment 1 as seen from below. Fig. 4 is a perspective view of the grinding wheel part of the grinding wheel shown in Fig. 3, and Fig. 5 is a side view of the grinding wheel part of the grinding wheel shown in Fig. 3 as seen from the outer periphery.

[0036] The grinding wheel 1 is attached by bolts or the like to a mounter 122 (corresponding to a tip portion) at the lower end of a spindle 121 of a grinding unit 120, and grinds a back surface 202 of a workpiece 200 by rotating the spindle 121 about an axis 125. As shown in Fig. 3, the grinding wheel 1 includes an annular wheel base 2 (corresponding to a base) attached to the mounter 122 at the lower end of the spindle 121, and a plurality of grinding stone portions 10 arranged in an annular shape on the lower surface 3 of the wheel base 2.

[0037] That is, the grinding wheel 1 has a plurality of grindstone portions 10 fixed at equal intervals in the circumferential direction of the wheel base 2. In the first embodiment, the wheel base 2 has the grindstone portions 10 fixed to the lower surface 3 by an adhesive.

[0038] The grinding wheel part 10 is configured as a so-called segment grinding wheel formed into a lump by mixing abrasive grains such as diamond or CBN (Cubic Boron Nitride) with a binding material (also called a bond material) made of metal, ceramic, resin, etc. In the first embodiment, the grinding wheel part 10 is formed to have a constant thickness, and as shown in Fig. 4, includes a rectangular upper surface 11, a rectangular bottom surface 12, a pair of side surfaces 13 connected to the long sides of the upper surface 11 and the long sides of the bottom surface 12, and a pair of outer side surfaces 14 (corresponding to the side surfaces from the bottom surface 12 toward the wheel base 2) connected to the short sides of the upper surface 11 and the short sides of the bottom surface 12.

[0039] The bottom surface 12 is longer than the top surface 11 and is parallel to the top surface 11. The bottom surface 12 is a grinding surface that grinds the workpiece 200. The side surface 13 is formed in a trapezoidal shape as shown in FIG. 5. The top surface 11 of the grindstone part 10 is fixed to the bottom surface 3 of the wheel base 2 by adhesive. When the grindstone part 10 is fixed to the wheel base 2 and the grinding wheel 1 is mounted on the mounter 122, the bottom surface 12 becomes parallel to the horizontal direction and the side surface 13 becomes parallel to the tangent to the outer circumferential surface of the wheel base 2. In the present invention, fixing holes for inserting the upper end of the grindstone part 10 into the bottom surface 3 of the wheel base 2 may be provided at equal intervals in the circumferential direction, and the top surface 11 of the grindstone part 10 may be fixed to the wheel base 2 by adhesive in the fixing holes.

[0040] Moreover, the angle θ between the bottom surface 12 and the outer side surface 14 is 70 degrees or more and 87 degrees or less. Since the angle θ is 70 degrees or more and 87 degrees or less, when the side surface 13 of the grindstone portion 10 is seen from the outer periphery side of the grinding wheel 1 in a front view of the annular wheel base 2, the angle θ between the bottom surface 12 of the grindstone portion 10 and the outer side surface 14 extending from the bottom surface 12 toward the base is 70 degrees or more and 87 degrees or less.

[0041] In addition, in embodiment 1, the distance between the top surface 11 and the bottom surface 12 of the grinding stone portion 10 before grinding (i.e., the height 15 of the grinding stone portion 10 shown in Figures 4 and 5) is 12 mm, the length 16 of the bottom surface 12 of the grinding stone portion 10 before grinding (shown in Figures 4 and 5) is 20 mm, and the distance between the pair of side surfaces 13 of the grinding stone portion 10 before grinding (i.e., the thickness 17 of the grinding stone portion 10 shown in Figure 4) is 4 mm.

[0042] (Machining operation) Next, the grinding operation of the grinding device 100 shown in Fig. 1 for grinding the workpiece 200 will be described with reference to the drawings. Fig. 6 is a side view showing a state in which the grinding wheel shown in Fig. 3 grinds the workpiece from the outer periphery side. Fig. 7 is a side view showing a state in which the grinding wheel shown in Fig. 6 is worn.

[0043] In the grinding apparatus 100 having the above-mentioned configuration, the front surface 201 side of the workpiece 200 before grinding is placed on the holding surface 111 of the holding table 110 located at the carry-in / out position via the surface protection tape 210 by an operator or the like, and the control unit 150 receives the processing conditions input by the operator or the like. In the first embodiment, the workpiece 200 is a sapphire substrate having a diameter of 6 inches. When the control unit 150 receives a processing operation start instruction input by the operator, the grinding apparatus 100 starts the processing operation, and the control unit 150 drives the motor 123 to start the rotation of the spindle 121 and the grinding wheel 1 around the axis 125, etc.

[0044] In the first embodiment, in the processing operation, the control unit 150 of the grinding device 100 causes the vacuum suction source to suck the holding surface 111, and causes the holding surface 111 of the holding table 110 to suction-hold the front surface 201 side of the workpiece 200 via the surface protective tape 210, thereby exposing the back surface 202 of the workpiece 200 upward. In the first embodiment, in the processing operation, the control unit 150 of the grinding device 100 controls the processing feed unit 130 to transport the holding table 110, which has suction-held the workpiece 200, to the processing position.

[0045] In the first embodiment, in the processing operation, the control unit 150 of the grinding apparatus 100 controls the rotation mechanism to rotate the holding table 110 around the rotation axis 112 at the processing position, and also controls the grinding feed unit 140 to lower the grinding unit 120 in which the spindle 121 is rotating around the axis 125. In the first embodiment, in the processing operation, as shown in Fig. 6, the control unit 150 controls the grinding feed unit 140 to supply processing fluid while bringing the grindstone part 10 of the grinding wheel 1 into contact with the back surface 202 of the workpiece 200, and causes the grinding feed unit 140 to move the grinding unit 120 closer to the holding table 110 at a predetermined grinding feed speed to perform grinding.

[0046] In the first embodiment, in the processing operation, the control unit 150 of the grinding device 100 controls the grinding feed unit 140 to grind the back surface 202 of the workpiece 200 sucked and held by the grindstone section 10 on the holding surface 111 of the holding table 110, thereby thinning the workpiece 200 to the finishing thickness. In the first embodiment, in the processing operation, when the grinding device 100 thins the workpiece 200 to the finishing thickness, the control unit 150 controls the grinding feed unit 140 to raise the grinding unit 120 and stops the rotation of the holding table 110 around the rotation axis 112 by the rotation mechanism.

[0047] In the first embodiment, in the processing operation, the control unit 150 of the grinding device 100 controls the processing feed unit 130 to transport the holding table 110, which holds the ground workpiece 200 by suction, to the carry-in / out position. In the first embodiment, in the processing operation, the control unit 150 of the grinding device 100 controls the vacuum suction source at the carry-in / out position to stop the suction holding of the holding table 110, and ends the processing operation.

[0048] In the first embodiment, during the machining operation, the grinding device 100 rotates the holding table 110 around the rotation axis 112 at 750 rpm, and the grinding feed rate is 0.65 μm / s. Also, in the first embodiment, the diameter of the circle formed by the outer peripheral side surface 13 of the grinding stone portion 10 of the grinding wheel 1 is 300 mm.

[0049] In embodiment 1, when the grinding wheel 1 grinds the workpiece 200, the grinding wheel portion 10 wears from the bottom surface 12 side, which is the grinding surface, so that the bottom surface 12 gradually moves from the position shown by the dashed line in Figure 7 to the position shown by the solid line in Figure 7.

[0050] Generally, when grinding the workpiece 200, the grinding stone part of the grinding wheel vibrates in the radial direction of the wheel base 2, particularly at the bottom surface, which is the grinding surface that grinds the workpiece 200, and the amplitude of the vibration described above decreases as the grinding stone wears. Generally, when the amplitude of the vibration of the bottom surface in the radial direction of the wheel base increases, the grinding stone part of the grinding wheel is more likely to self-sharpen, so the amount of wear is large and the processing load is low, and on the other hand, as the amplitude of the vibration described above decreases, the grinding stone part becomes less likely to self-sharpen, so the amount of wear is small and the processing load is high.

[0051] For this reason, in a grinding wheel equipped with a conventional grinding stone portion in which the area of ​​the bottom surface (grinding surface) remains constant even when worn, the amplitude of the vibration described above decreases as the wheel wears down by grinding the workpiece 200, reducing the amount of wear and increasing the processing load.

[0052] In contrast to such grinding wheels equipped with a conventional grinding stone, the grinding wheel 1 according to the above-described embodiment 1 has the above-mentioned angle θ of the grinding stone 10 of 70 degrees or more and 87 degrees or less, so that the area of ​​the bottom surface 12, which is the grinding surface, gradually decreases as the grinding stone 10 wears when the workpiece 200 is ground. Therefore, in the grinding wheel 1 according to embodiment 1, the area of ​​the bottom surface 12, which is the grinding surface, gradually decreases as the grinding stone 10 wears, so that it is possible to suppress the decrease in the amount of wear and the increase in the processing load compared to grinding wheels equipped with a conventional grinding stone in which the area of ​​the bottom surface, which is the grinding surface, remains constant even when worn.

[0053] As a result, the grinding wheel 1 according to the first embodiment has an effect of suppressing an increase in the processing load during grinding and a decrease in the amount of wear of the grinding stone portion 10.

[0054] Next, the inventors of the present invention confirmed the grinding wheel 1 according to the first embodiment. The results are shown in Fig. 8. Fig. 8 is a diagram showing the changes in height and current value of the comparative example, the present invention 1, the present invention 2, the present invention 3, the present invention 4, and the present invention 5. In the confirmation, the changes in height 15 of the grinding wheel part 10 and the current value supplied to the motor 123 were measured when the workpiece 200 was ground with the grinding wheels 1 having the grinding wheel parts 10 of the comparative example, the present invention 1, the present invention 2, the present invention 3, the present invention 4, and the present invention 5.

[0055] 8 indicates the height 15 of the grinding wheel portion 10, and the vertical axis of Fig. 8 indicates the value of the current supplied to the motor 123. The value of the current supplied to the motor 123 increases as the processing load increases.

[0056] The comparative examples are conventionally used grinding stone parts in which the area of ​​the bottom surface, which is the grinding surface, remains constant even when worn. Product 1 of the present invention has a grinding stone part 10 with an angle θ of 87 degrees. Product 2 of the present invention has a grinding stone part 10 with an angle θ of 86 degrees. Product 3 of the present invention has a grinding stone part 10 with an angle θ of 82 degrees. Product 4 of the present invention has a grinding stone part 10 with an angle θ of 70 degrees. Product 5 of the present invention has a grinding stone part 10 with an angle θ of 45 degrees.

[0057] Moreover, the height 15 of the comparative example, invention product 1, invention product 2 and invention product 3 is 12 mm, the height 15 of invention product 4 is about 10 mm, and the height 15 of invention product 5 is 5 mm.

[0058] According to Fig. 8, in the comparative example, the current value, i.e., the processing load, increased as the grinding stone part was worn. In contrast to the comparative example, in present invention products 1 and 2, the current value, i.e., the processing load, hardly changed even when the grinding stone part 10 was worn. In addition, in present invention products 3, 4, and 5, the current value, i.e., the processing load, decreased as the grinding stone part 10 was worn.

[0059] Thus, according to FIG. 8, it is clear that by setting the angle θ to less than 90 degrees, an increase in the processing load during grinding can be suppressed.

[0060] Furthermore, according to FIG. 8, it is clear that the increase in the processing load during grinding can be suppressed by setting the angle θ to 70 degrees or more and 87 degrees or less, preferably, by setting the angle θ to 82 degrees or more and 87 degrees or less.

[0061] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0062] 1 Grinding wheel 2 Wheel base (base) 10 Grindstone Section 13 Side 14 External surface 121 Spindle 122 Mounter (tip) 200 Workpiece θ angle

Claims

1. A grinding wheel that is attached to a tip of a spindle and grinds a workpiece by rotating the spindle, The grinding tool has an annular base and a plurality of grinding stone portions fixed in a circumferential direction of the base, When viewed from the outer periphery of the grinding wheel toward the annular base, the angle between the grinding surface of the grinding wheel portion and the side surface facing the base is 70 degrees or more and 87 degrees or less. Grinding wheels.

2. The workpiece is any one of an oxide-based substrate, a carbide-based substrate, and a nitride-based substrate.

2. The grinding wheel of claim 1.

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