Circuit structure and electric connection box

Abstract

To provide a circuit structure that can prevent movement and deformation of control terminals in molding a resin-made holding member.SOLUTION: A circuit structure comprises: a plurality of electronic components; a plurality of control terminals electrically connected with the plurality of electronic components; and a holding member that has insulating properties and holds the plurality of control terminals. The control terminals are insertion articles that are integral with the resin-made holding member. The control terminal has, in part thereof, an exposed face that is exposed from the holding member, a contact face that is a surface on the opposite side of the exposed face and in contact with the holding member, a first side face that is located between the exposed face and the contact face, and a second side face that is located between the exposed face and the contact face. A first space part is formed on the lateral side of the first side face, and a second space part is formed on the lateral side of the second side face.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a circuit assembly and an electrical junction box. [Background technology]

[0002] Patent Document 1 discloses a circuit assembly including a control board, a plurality of switching elements that operate based on signals from the control board, and a bus bar that constitutes a power circuit. The switching elements are connected to the bus bar by soldering. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-96769 A Summary of the Invention [Problem to be solved by the invention]

[0004] The circuit assembly further includes, as components of the power circuit, a plurality of control terminals in addition to the bus bars. The control terminals are electrically connected to electronic components such as switching elements, and signals from a control board are transmitted to the electronic components through the control terminals. The circuit assembly further includes a holding member having insulating properties and holding the control terminal. The holding member is made of a thermoplastic resin and is formed by injection molding. The control terminal may be placed as an insert in an injection molding die, and the holding member may be molded. FIG. 9 is a cross-sectional view showing a part of an injection molding die 90 and a control terminal 91.

[0005] By bringing a part of the control terminal 91 into surface contact with the mold 90, the control terminal 91 can be positioned relative to the mold 90. However, during injection molding, the injection pressure of the molten resin 99 may cause part of the resin 99 to flow between the mold 90 and the control terminal 91, which may cause the control terminal 91 to tilt or deform within the mold 90, as shown in Fig. 9. This may cause the control terminal 91 to come into contact with another conductor 92, such as a bus bar that is integrated with the holding member 95, causing a short circuit.

[0006] Therefore, an object of the present disclosure is to provide a circuit assembly that can prevent the control terminal from moving or deforming during molding of a resin holding member. [Means for solving the problem]

[0007] A circuit structure according to one embodiment of the present disclosure comprises a plurality of electronic components, a plurality of control terminals electrically connected to the plurality of electronic components, and an insulating retaining member for holding the plurality of control terminals, wherein the control terminal is an insert product that is integrated with the retaining member made of resin, and the control terminal has, at a part thereof, an exposed surface exposed from the retaining member, a contact surface opposite the exposed surface and in contact with the retaining member, a first side surface located between the exposed surface and the contact surface, and a second side surface located between the exposed surface and the contact surface, and a first space portion is formed on the side of the first side surface, and a second space portion is formed on the side of the second side surface.

[0008] An electrical junction box according to one aspect of the present disclosure includes the circuit assembly and a cover that covers the circuit assembly. Effect of the Invention

[0009] According to the present disclosure, it is possible to prevent the control terminal from moving or deforming due to the injection pressure of the molten resin when molding the holding member made of resin. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of an electrical junction box including a circuit assembly according to the present embodiment. [Diagram 2] FIG. 2 is a perspective view of the circuit assembly as viewed from the opposite side to that in FIG. [Diagram 3] FIG. 3 is an exploded view of the circuit assembly with the control board removed. [Figure 4] FIG. 4 is a cross-sectional view showing a control terminal and a part of a holding member. [Diagram 5] FIG. 5 is a perspective view showing a control terminal and a part of a holding member. [Figure 6] FIG. 6 is a cross-sectional view taken along the line V in FIG. [Figure 7] FIG. 7 is a cross-sectional view showing a part of a mold for molding a resin holding member. [Figure 8] FIG. 8 is a cross-sectional view showing how the holding member is molded using the control terminal as an insert component. [Figure 9] FIG. 9 is a cross-sectional view showing a part of a mold for injection molding and a control terminal. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] <Overview of the embodiment of the present disclosure> Below, an overview of the embodiments of the present disclosure will be listed and described. (1) The circuit structure of this embodiment comprises a plurality of electronic components, a plurality of control terminals electrically connected to the plurality of electronic components, and a retaining member having insulating properties and holding the plurality of control terminals, wherein the control terminal is an insert product that is integrated with the retaining member which is made of resin, and the control terminal has, in a part thereof, an exposed surface exposed from the retaining member, a contact surface opposite the exposed surface and in contact with the retaining member, a first side surface located between the exposed surface and the contact surface, and a second side surface located between the exposed surface and the contact surface, and a first space portion is formed on the side of the first side surface, and a second space portion is formed on the side of the second side surface.

[0012] In the circuit assembly of this embodiment, the control terminal is an insert part integrated with a resin holding member, and when the holding member is molded, molten resin is filled in the vicinity of the control terminal. A part of the contact surface of the control terminal is in contact with the holding member, and a part of the contact surface is integrated with the holding member. A part of the exposed surface of the control terminal is formed by contacting the molding die. In the mold, protrusions are provided on both sides of a portion of the control terminal, so that after molding, a first space is formed on the side of the first side surface and a second space is formed on the side of the second side surface. In this way, by providing protrusions on both sides of a portion of the control terminal in the mold, it becomes difficult for molten resin to penetrate between the exposed surface and the mold. Therefore, it is possible to prevent the control terminal from moving or deforming due to the injection pressure of the molten resin when molding the holding member.

[0013] (2) Preferably, the holding member has a thick portion in contact with the contact surface, a first thin film portion made of resin covering the first side surface, and a second thin film portion made of resin covering the second side surface, the side surface of the first thin film portion being exposed in the first space portion, and the side surface of the second thin film portion being exposed in the second space portion. With this configuration, the control terminal is joined to the holding member made of resin not only on the contact surface but also on the first and second side surfaces, making it difficult for the control terminal to peel off from the holding member.

[0014] In order to mold the holding member, a pair of the protrusions is provided on the mold, and a part of the control terminal is interposed between them. A manufacturing error is considered in a first dimension between the pair of protrusions and a second dimension between the first side surface and the second side surface of the control terminal. In order to interpose a part of the control terminal between the pair of protrusions, it is preferable to set the first dimension slightly larger than the second dimension. Then, a minute gap is formed between the protrusions and the control terminal, and the molten resin may flow into the minute gap. However, the minute gap is thin, and it is difficult for the molten resin to enter the minute gap. Therefore, the resin is difficult to penetrate between the mold and the control terminal through the minute gap. The molten resin that has entered the minute gap hardens to become a first thin film portion and a second thin film portion.

[0015] (3) Preferably, the circuit structure further includes a control board that outputs a signal to the electronic component through the control terminal, and the control terminal has: a first terminal body portion connected to the control board; a pad portion as the part electrically connected to the first terminal body portion, provided along the holding member, and having the exposed surface and the contact surface; and a second terminal body portion electrically connected to the pad portion and the electronic component. According to this configuration, before connecting the control board to the first terminal body of the control terminal, the probe of a tester for electrical testing is brought into contact with each pad, thereby making it possible to perform electrical testing on each of the multiple electronic components. Since the surface (contact surface) of the pad opposite to the exposed surface is in contact with the holding member, deformation of the pad is prevented even if the probe of the tester is brought into contact with the exposed surface.

[0016] (4) Preferably, the pad portion extends from a base of the first terminal body, and the holding member has a first embedded portion that embeds a boundary region between the first terminal body and the pad portion of the control terminal. In this case, the embedded portion can prevent the first terminal body from floating up from the holding member.

[0017] (5) Preferably, the pad portion extends from a base of the second terminal body, and the holding member has a second embedded portion that embeds a boundary region between the pad portion and the second terminal body, and the second embedded portion has a resin surface that is flush with the exposed surface of the pad portion. In this case, since the exposed surface of the pad portion and the resin surface of the second embedded portion are flush with each other, the portion of the holding member that covers the area between the pad portion and the second terminal body can be easily molded using a mold. Also, the mold configuration is simplified.

[0018] (6) Preferably, the second terminal body portion has a terminal surface exposed from the holding member and connected to the electronic component, and a second exposed surface opposite the terminal surface and exposed from the holding member. When the holding member is made of resin and is molded by injection molding using a mold, the metal member that will become the second terminal body may be partially contacted with the mold to be positioned, but the terminal surface and the second exposed surface are formed by contacting the metal member with the mold from both sides to sandwich the portion. By contacting the mold from both sides in this way, the positioning accuracy of the second terminal body, especially the terminal surface, is improved. As a result, poor connection between the terminal surface and the electronic component is suppressed.

[0019] (7) The electrical junction box of the present embodiment includes the circuit assembly according to any one of (1) to (6) above, and a cover that covers the circuit assembly. According to the electrical connection box of this embodiment, when the resin holding member is molded, it is possible to prevent the control terminal from moving or deforming due to the injection pressure of the molten resin.

[0020] <Details of the embodiment of the present disclosure> Hereinafter, the details of the embodiments of the present disclosure will be described with reference to the drawings. Note that at least some of the embodiments described below may be combined in any combination.

[0021] [Regarding the electrical junction box 10] FIG. 1 is a perspective view of an electric junction box 10 including a circuit assembly 11 according to the present embodiment. The electric junction box 10 can be mounted on various devices, but the electric junction box 10 of the present embodiment is mounted on an automobile. Specifically, the electric junction box 10 is disposed in the middle of a wiring path connecting a first vehicle-mounted device and a second vehicle-mounted device, not shown. The electric junction box 10 includes a circuit assembly 11 and a cover 12 that covers the circuit assembly 11. The cover 12 is made of, for example, metal (aluminum or aluminum alloy), and has a heat dissipation function that dissipates heat generated in the circuit assembly 11. The electric junction box 10 may further include another unit, not shown, that is attached to the circuit assembly 11 on the opposite side of the cover 12.

[0022] [Regarding the circuit configuration 11] Fig. 2 is a perspective view of the circuit assembly 11 as viewed from the opposite side to that of Fig. 1. Fig. 2 shows a state in which the cover 12 has been removed. In Figs. 1 and 2, the circuit assembly 11 includes a plurality of electronic components 15, a plurality of control terminals 16, one holding member 14, and one control board 13. Fig. 3 is an exploded view of the circuit assembly 11 with the control board 13 removed. The circuit assembly 11 further includes a plurality of conductive plates 17. The plurality of conductive plates 17 and the plurality of control terminals 16 form a power circuit of the circuit assembly 11.

[0023] In this embodiment, the circuit assembly 11 includes three conductive plates 17 (see FIG. 1) and eight control terminals 16 (see FIG. 3). The number of control terminals 16 is the same as the number of electronic components 15, and each control terminal 16 is connected to each electronic component 15 in a one-to-one relationship. The numbers of conductive plates 17, control terminals 16, electronic components 15, and control boards 13 are arbitrary and can be freely changed.

[0024] The electronic component 15 is, for example, a semiconductor relay such as a field effect transistor (FET). In the following description, a case will be described in which the electronic component 15 is a field effect transistor, and the field effect transistor will be referred to as "FET." The FET 15 has a plurality of terminals. As shown in the enlarged view of FIG. 1, the FET 15 has a source terminal (first terminal) 15a, a gate terminal (second terminal) 15b, and a drain terminal (third terminal) 15c as the plurality of terminals. Each terminal is mechanically and electrically connected to the conductive plate 17 or the control terminal 16 by soldering or the like.

[0025] The conductive plate 17 is manufactured by pressing a metal plate into a predetermined shape. The conductive plate 17 is a metal plate piece and is also called a bus bar. The conductive plate 17 is preferably a copper member such as pure copper or a copper alloy. The entire conductive plate 17 is a conductor, and a wiring pattern such as that found in a general printed circuit board is not formed on the conductive plate 17. As shown in FIG. 1, the circuit assembly 11 has a first conductive plate 17-1, a second conductive plate 17-2, and a third conductive plate 17-3.

[0026] The control terminal 16 is manufactured by pressing a metal wire into a predetermined shape. The control terminal 16 is a metal terminal. The control terminal 16 is preferably a copper member such as pure copper or a copper alloy. FIG. 4 is a cross-sectional view showing the control terminal 16 and a part of the holding member 14. The control terminal 16 has a bent shape, and has a first terminal body portion 31, a pad portion 33, and a second terminal body portion 32. Details of each portion of the control terminal 16 will be described later.

[0027] 2, control board 13 is a substantially rectangular insulating board, and has control circuit section 27 on its first surface 13a. Control circuit section 27 has a function of outputting a signal to FET 15 through control terminal 16. FET 15 operates based on the signal. Control circuit section 27 has an integrated circuit including a switching element, a diode, etc. as a second electronic component for functioning FET 15. Control circuit section 27 includes wiring pattern 29 for electrically connecting the second electronic component to control terminal 16.

[0028] A through hole 18 is formed in the control board 13, through which a part of the control terminal 16 passes (see FIG. 3). By filling the through hole 18 with a conductive material, the control circuit section 27 and a part of the first terminal body section 31 of the control terminal 16 are mechanically and electrically connected. Before the control board 13 is connected to the control terminal 16 (see FIG. 3), the multiple control terminals 16 are not electrically connected to each other (non-conductive state).

[0029] The holding member 14 is made of a thermoplastic resin and is formed by injection molding. In this embodiment, as will be described later, the holding member 14 is manufactured by insert molding in which the control terminal 16 and the conductive plate 17 are placed in an injection molding die 60 (see FIG. 7). As a result, a part of the control terminal 16 and a part of the conductive plate 17 are embedded in the holding member 14, and the control terminal 16, the conductive plate 17, and the holding member 14 are integrated. The control terminal 16 and the conductive plate 17 are insert parts that are integrated with the holding member 14, which is made of resin.

[0030] The holding member 14 is made of, for example, PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), nylon, PP (polypropylene), PE (polyethylene), etc., and has insulating properties. The holding member 14 holds eight control terminals 16 and three conductive plates 17, and functions as a case for the circuit assembly 11. As shown in FIG. 3, the holding member 14 has an accommodation space 30 that opens to the control board 13 side. A first terminal body portion 31 and a pad portion 33 of the control terminal 16 are provided in the accommodation space 30. The control board 13 is attached to the first terminal body portion 31 so as to close the accommodation space 30.

[0031] The holding member 14 has a plate-shaped central base portion 19 and a frame portion 20 surrounding the base portion 19. As shown in Fig. 1, the main body portion 22 of the conductive plate 17 on which the FET 15 is mounted is provided on the base portion 19. The main body portions 22 of the three conductive plates 17 are provided on the base portion 19 in a planar arrangement without overlapping. The three conductive plates 17 are provided separately from each other and are not in contact with each other. The three conductive plates 17 and the control terminal 16 are provided separately from each other and are not in contact with each other.

[0032] In this embodiment (see FIG. 1), the source terminal 15a of the FET 15 is connected to the third conductive plate 17-3 located in the center. The drain terminal 15c of the FET 15 is connected to the first conductive plate 17-1 or the second conductive plate 17-2. As shown in the enlarged view of FIG. 1, a through hole 28 is provided in the third conductive plate 17-3 located in the center, and a part of the second terminal body portion 32 of the control terminal 16 is exposed from the hole 28. The gate terminal 15b of the FET 15 is connected to a part of the second terminal body portion 32 exposed from the hole 28. As a result, the gate terminal 15b of the FET 15 and the control terminal 16 are electrically connected to each other.

[0033] Mounting holes 39 for fixing cover 12 are provided in frame portion 20. End portion 21A of first conductive plate 17-1 and end portion 21B of second conductive plate 17-2 are provided so as to protrude outward from frame portion 20. A cable (not shown) or the like is connected to ends 21A and 21B.

[0034] [Regarding control terminal 16] 5 is a perspective view showing the control terminal 16 and a part of the holding member 14. As described above, the control terminal 16 has a folded shape, and includes a first terminal body portion 31, a pad portion 33, and a second terminal body portion 32. In this embodiment, the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 are formed by folding the same metal member. In other words, the first terminal body portion 31 is formed of a part of a metal member having a long and narrow plate shape, the pad portion 33 is formed of another part of the metal member, and the second terminal body portion 32 is formed of a part of the metal member that is different from the part and the other part.

[0035] Each of the first terminal body 31, the pad portion 33, and the second terminal body 32 has a rectangular shape in cross section (see FIG. 6). FIG. 6 is a cross-sectional view taken along the line V in FIG. 5. As shown in FIG. 5, the first terminal body 31 has a straight line shape. The first terminal body 31 and the pad portion 33 are bent at a right angle. The pad portion 33 is provided extending from the base 31a of the first terminal body 31 and has a straight line shape. The second terminal body 32 and the pad portion 33 are bent at a right angle. The pad portion 33 is provided extending from the base 32a of the second terminal body 32 and has a straight line shape. The second terminal body 32 has a U-shape.

[0036] [First terminal body portion 31] The first terminal body portion 31 is connected to the control board 13 (see Figs. 2 and 3). The tip portion of the first terminal body portion 31 is inserted through the through hole 18 of the control board 13 and is electrically connected to the wiring pattern 29 provided on the control board 13. As described above, the control circuit portion 27 of the control board 13 outputs a signal to the FET 15 through the control terminal 16. A signal is output from the control board 13 to the first terminal body portion 31. The signal is provided to the gate terminal 15b of the FET 15 from the first terminal body portion 31 through the pad portion 33 and the second terminal body portion 32 (see Fig. 5).

[0037] The first terminal body 31 has a long and narrow plate shape. The first terminal body 31 protrudes from the first embedded portion 23, which is a part of the holding member 14. The part of the first terminal body 31 protruding from the first embedded portion 23 is exposed as a whole. That is, as shown in FIG. 5, the first terminal body 31 has a first surface 41 exposed from the holding member 14 on one side in the thickness direction, and a second surface 42 on the opposite side to the first surface 41 and exposed from the holding member 14. Furthermore, both side surfaces 43 located between the first surface 41 and the second surface 42 are also exposed surfaces. The first terminal body 31 is in a cantilever shape extending from the first embedded portion 23 before the control board 13 is connected.

[0038] [Pad section 33] The pad portion 33 extends from the base portion 31a of the first terminal body portion 31, and is integral with and electrically connected to the first terminal body portion 31. The pad portion 33 has a long and narrow plate shape. As shown in FIG. 5, the pad portion 33 is provided along the holding member 14 and is exposed from a part of the holding member 14. The pad portion 33 is provided along the thick portion 50 of the holding member 14.

[0039] As shown in FIG. 4 and FIG. 5, the pad portion 33 has a first exposed surface 34 exposed from the holding member 14 and a contact surface 35 opposite to the first exposed surface 34. The first exposed surface 34 has an elongated shape. Specifically, for example, the first exposed surface 34 is an elongated rectangle having a first side 34a and a second side 34b that is at least twice as long as the first side 34a. The contact surface 35 is in contact with the holding member 14 in its entirety and is a non-exposed surface that is not exposed from the holding member 14. As described above, the holding member 14 is manufactured by insert molding performed by placing the control terminal 16 in an injection mold 60 (see FIG. 7). Therefore, the pad portion 33 is in a state of being joined to a part of the holding member 14 at the contact surface 35.

[0040] 6, the pad portion 33 has a first side surface 36 and a second side surface 37 in addition to the first exposed surface 34 and the contact surface 35. The first side surface 36 is a surface located between the first exposed surface 34 and the contact surface 35. The second side surface 37 is a surface opposite to the first side surface 36 and is a surface located between the first exposed surface 34 and the contact surface 35.

[0041] In this embodiment, the first side surface 36 is covered by a first thin film portion 51 made of resin, and the second side surface 37 is covered by a second thin film portion 52 made of resin. The first thin film portion 51 and the second thin film portion 52 are each a part of the holding member 14. The first thin film portion 51 and the second thin film portion 52 are each a film-like resin portion, and are thinner than the thick portion 50 with which the contact surface 35 is in contact. A first space portion K1 is formed on the side of the first side surface 36 covered by the first thin film portion 51. A second space portion K2 is formed on the side of the second side surface 37 covered by the second thin film portion 52.

[0042] The side surface 51a of the first thin film portion 51 is exposed in the first space K1. The side surface 52a of the second thin film portion 52 is exposed in the second space K2. The holding member 14 has a first convex portion 57 protruding from the thick portion 50. The first convex portion 57 and the pad portion 33 are provided apart from each other. The space formed between the first convex portion 57 and the pad portion 33 (first thin portion 51) is the first space K1. The holding member 14 has a second convex portion 58 protruding from the thick portion 50. The second convex portion 58 and the pad portion 33 are provided apart from each other. The space formed between the second convex portion 58 and the pad portion 33 (second thin portion 52) is the second space K2.

[0043] [Second terminal body portion 32] As shown in FIG. 5, the second terminal body 32 is provided continuous with the pad portion 33. The second terminal body 32 has a shape (U-shape) obtained by bending a long and narrow plate. The base 32a of the second terminal body 32 is connected to the pad portion 33, and the second terminal body 32 is electrically connected to the pad portion 33. The second terminal body 32 has a first arm 46 continuous with the pad portion 33, a second arm 47 provided parallel to and spaced from the first arm 46, and an intermediate arm 48 connecting the first arm 46 and the second arm 47. The second arm 47 is exposed from the holding member 14, and the intermediate arm 48 has a surface exposed from the holding member 14.

[0044] The gate terminal 15b of the FET 15 is connected to the intermediate piece 48 by solder or the like. This mechanically and electrically connects the second terminal body 32 to the FET 15. The second terminal body 32 has, at the intermediate piece 48, a terminal surface 45 exposed from the holding member 14, and a second exposed surface 44 on the opposite side to the terminal surface 45 and exposed from the holding member 14. The FET 15 (gate terminal 15b) is connected to the terminal surface 45.

[0045] [Regarding the holding member 14] FIG. 7 is a cross-sectional view showing a part of a mold 60 for molding the holding member 14 made of resin. The cross-sectional structure of the circuit assembly 11 shown in FIG. 6 is obtained by the part of the mold 60 shown in FIG. 7. In the circuit assembly 11 of this embodiment, the control terminal 16 and the conductive plate 17 are an insert part integrated with the holding member 14 made of resin. When the holding member 14 is molded, a cavity 60a formed in the mold 60 is filled with molten resin. The molten resin is also filled in the vicinity of the control terminal 16. By this molding, the contact surface 35 of the pad portion 33 of the control terminal 16 is in contact with the holding member 14 (see FIG. 6), and the pad portion 33 is integrated with the holding member 14. In the cavity 60a, the molten resin is also filled in the vicinity of the conductive plate 17. As a result, the conductive plate 17 is in contact with the holding member 14 (see FIG. 6), and is integrated with the holding member 14.

[0046] As shown in Fig. 7, the exposed surface 34 of the pad portion 33 is in contact with the mold 60 during molding, and is formed by being separated from the mold 60 during demolding. In the mold 60, protrusions 61, 61 are provided on both sides of the pad portion 33. These protrusions 61, 61 form a first space K1 on the side of the first side surface 36 of the pad portion 33 and a second space K2 on the side of the second side surface 37 after molding (see Fig. 6). The protrusions 61 are a part that constitutes a part of the mold 60.

[0047] The cross-sectional shapes of the first space K1 and the second space K2 match the cross-sectional shapes of the protrusions 61, 61. In this way, in the mold 60, the protrusions 61 are provided on both sides of the pad portion 33, so that the molten resin is less likely to penetrate between the mold 60 and the portion that becomes the exposed surface 34. In other words, the molten resin flows and fills the cavity 60a, and at that time, the protrusions 61 function as a barrier that hides the pad portion 33, making it difficult for the flow of the resin to affect the pad portion 33.

[0048] This makes it possible to prevent the control terminal 16 including the pad portion 33 from moving or deforming in the cavity 60a due to the injection pressure of the molten resin when the holding member 14 is molded. As a result, it is possible to prevent the control terminal 16 (pad portion 33) and the conductive plate 17 from contacting (short-circuiting).

[0049] As shown in FIG. 6, after molding, the holding member 14 has a resin thick portion 50 that contacts the contact surface 35 of the pad portion 33, a resin first thin film portion 51 that covers the first side surface 36, and a resin second thin film portion 52 that covers the second side surface 37. The first thin film portion 51 and the second thin film portion 52 are sufficiently thin compared to the thick portion 50. The side surface 51a of the first thin film portion 51 is exposed in the first space portion K1. The side surface 52a of the second thin film portion 52 is exposed in the second space portion K2. The pad portion 33 is joined to the resin holding member 14 not only at the contact surface 35, but also at the first side surface 36 and the second side surface 37. As a result, the control terminal 16 including the pad portion 33 is unlikely to peel off from the holding member 14.

[0050] As described above (see FIG. 7), a pair of protrusions 61, 61 is provided on the mold 60 to mold the holding member 14. A part of the control terminal 16 (pad portion 33) is interposed between these protrusions 61, 61. A manufacturing error is considered in the first dimension L1 between the pair of protrusions 61 and the second dimension L2 between the first side surface 36 and the second side surface 37 of the control terminal 16. In order to interpose the pad portion 33 between the pair of protrusions 61, 61, it is preferable to set the first dimension L1 slightly larger than the second dimension L2. Then, a minute gap e is formed between the protrusion 61 and the pad portion 33. Molten resin may flow into the minute gap e.

[0051] However, the minute gap e is thin, and it is difficult for the molten resin to enter the minute gap e. Therefore, the molten resin is unlikely to penetrate between the mold 60 and the first exposed surface 34 of the pad portion 33 through the minute gap e. When the molten resin that has entered the minute gap e hardens, the hardened portion becomes the first thin film portion 51 and the second thin film portion 52.

[0052] The gap dimension of the minute gap e is preferably set to a value that makes it difficult for the molten resin to enter. As a result, in the pad portion 33, an edge 38 formed between the first exposed surface 34 and the first side surface 36 (or the second side surface 37) is exposed. It is preferable that the edge 38 is not covered by the first thin film portion 51 or the second thin film portion 52. When the thick portion 50 is used as a reference, the first thin film portion 51 and the second thin film portion 52 are each lower than the first exposed surface 34.

[0053] 4 and 5, the entire first bent portion 25 between the first terminal body portion 31 and the pad portion 33 is embedded in the first embedded portion 23 made of resin. The first embedded portion 23 is a part of the holding member 14. In other words, the holding member 14 has the first embedded portion 23 that embeds the first boundary region J1 between the first terminal body portion 31 and the pad portion 33 of the control terminal 16. Although a part of the pad portion 33 and most of the first terminal body portion 31 are exposed from the holding member 14, the first embedded portion 23 makes it possible to prevent the first terminal body portion 31 from floating up from the holding member 14.

[0054] The second bent portion 26 between the second terminal body portion 32 and the pad portion 33 is embedded in the second embedded portion 24 made of resin. The second embedded portion 24 is another part of the holding member 14. In other words, the holding member 14 has the second embedded portion 24 that embeds the second boundary region J2 between the pad portion 33 and the second terminal body portion 32 of the control terminal 16. The second embedded portion 24 makes it possible to prevent the second terminal body portion 32 and the pad portion 33 from floating up from the holding member 14.

[0055] In the direction perpendicular to the longitudinal direction of the pad portion 33, as described above (see FIG. 6), a first space K1 and a second space K2 are formed on both sides of the pad portion 33 via the first thin film portion 51 and the second thin film portion 52. In other words, the holding member 14 is missing on both sides of the pad portion 33. In contrast, as shown in FIG. 5, a first embedded portion 23 is provided on the first terminal body portion 31 side of the pad portion 33 in the longitudinal direction of the pad portion 33 and is embedded in resin. A second embedded portion 24 is provided on the second terminal body portion 32 side of the pad portion 33 in the longitudinal direction of the pad portion 33 and is embedded in resin.

[0056] The second bent portion 26 between the pad portion 33 and the second terminal body portion 32 is embedded in the second embedded portion 24. The second embedded portion 24 has a resin surface 54 that is flush (coplanar) with the first exposed surface 34 of the pad portion 33. Since the first exposed surface 34 of the pad portion 33 and the resin surface 54 of the second embedded portion 24 are flush with each other, the portion of the holding member 14 that covers the portion between the pad portion 33 and the second terminal body portion 32 (the base portion 32a) can be easily molded using a mold 60 (see FIG. 8). In addition, the configuration of the mold 60 is simplified.

[0057] Both surfaces of an intermediate piece 48, which is a middle portion of the second terminal body 32, are exposed from the holding member 14. That is, the second terminal body 32 has, in the intermediate piece 48, a terminal surface 45 that is exposed from the holding member 14 and connected to the FET 15, and a second exposed surface 44 that is the surface opposite to the terminal surface 45 and is exposed from the holding member 14.

[0058] FIG. 8 is a cross-sectional view showing a state in which the holding member 14 is molded using the control terminal 16 as an insert. FIG. 8 shows the second terminal body 32 and its periphery of the control terminal 16 together with a mold 60. As described above, the holding member 14 is made of resin and is molded by injection molding using the mold 60. The metal member that will become the second terminal body 32 may be positioned by partially contacting the mold 60. Therefore, as shown in FIG. 8, the mold 60 is brought into contact with a part 32b of the second terminal body 32 so as to sandwich the mold 60 from both sides. The terminal surface 45 and the second exposed surface 44 are formed in the part of the second terminal body 32 that the mold 60 contacts.

[0059] In this manner, by bringing the first portion 60b and the second portion 60c of the mold 60 into contact with the part 32b of the second terminal body 32 from both sides, the positioning accuracy of the second terminal body 32, particularly the terminal surface 45, is improved. As a result, poor connection between the terminal surface 45 and the FET 15 (gate terminal 15b) is suppressed.

[0060] [Electrical testing of electronic components (FET) 15] In the manufacturing process of the circuit assembly 11, an electrical test is performed to confirm that there are no connection defects in the FETs 15. In the case of the circuit assembly 11 of this embodiment, as shown in Fig. 3, each pad 33 of the control terminal 16 is accommodated in the accommodation space 30 of the holding member 14, but each pad 33 is exposed to the outside before the control board 13 is connected to the control terminal 16. Therefore, before the control board 13 is connected to the control terminal 16, an electrical test is performed on each of the multiple FETs 15 by contacting each pad 33 with a probe of a tester (not shown).

[0061] For this purpose, the control terminal 16 has a pad portion 33 and a second terminal body portion 32 electrically connected to the pad portion 33 and the FET 15. The pad portion 33 is provided along the resin holding member 14 and is exposed from a part of the holding member 14. By contacting each pad portion 33 with a tester probe, it is possible to perform an electrical test on each of the multiple FETs 15. For this reason, it is not necessary to provide a test circuit component 99 (see FIG. 9) as in the conventional case on the control board 13. Omission of the test circuit component 99 allows the cost of the circuit configuration 11 to be reduced, and also allows the control board 13 to be made smaller.

[0062] In this embodiment, the first terminal body portion 31 (see FIG. 4 ) has a first surface 41 exposed from the holding member 14, and a second surface 42 opposite to the first surface 41 and exposed from the holding member 14. The first terminal body portion 31 is a thin, elongated plate, and both the first surface 41 and the second surface 42 are exposed from the holding member 14. For this reason, if a tester probe is brought into contact with the first surface 41 or the second surface 42, the first terminal body portion 31 may be deformed. If the first terminal body portion 31 is deformed, a problem may occur in the connection with the control board 13.

[0063] In contrast, pad portion 33 has a first exposed surface 34 that is partially exposed from holding member 14, and a contact surface 35 that is the surface opposite to first exposed surface 34 and contacts holding member 14. Since the surface (contact surface 35) of pad portion 33 opposite to first exposed surface 34 contacts holding member 14, even if a tester probe is brought into contact with first exposed surface 34, the force due to the contact is supported by holding member 14, and deformation of pad portion 33 is prevented.

[0064] To prevent the probe of a tester from interfering with the first terminal body portion 31, the probe may be brought into contact with a target area Q (see FIG. 5) of the first exposed surface 34 of the pad portion 33 that is away from the first terminal body portion 31. The first exposed surface 34 of the pad portion 33 has an elongated shape that includes not only the target area Q but also a part of the target area Q. For example, the first exposed surface 34 of the pad portion 33 has a second side 34b that is three times longer than the first side 34a.

[0065] This is because the holding member 14 is made of resin and is molded by injection molding using a mold 60 as described with reference to Fig. 7, a part of the metal member that will become the pad portion 33 is brought into contact with the mold 60, and the contacting part becomes the first exposed surface 34. In other words, when the metal member is brought into contact with the mold 60, the longer the contacting part is, the more stably the metal member is positioned. In this way, if the first exposed surface 34 of the pad portion 33 is set to an elongated shape, the contact area of ​​the metal member with the mold 60 increases, the metal member becomes stable, and the occurrence of defective products is suppressed.

[0066] [Other configurations] In this embodiment, the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 of the control terminal 16 are formed by bending and forming the same metal member, and therefore there is no need to join the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32. Note that one or all of the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 may be separate members, and the control terminal 16 may be configured to join the respective portions by, for example, welding.

[0067] 4, the pad portion 33 is provided along the holding member 14, and the entire contact surface 35 thereof is in contact with the holding member 14. As an alternative configuration, a part of the contact surface 35 may be exposed from the holding member 14. Although the first exposed surface 34 of the pad portion 33 has an elongated rectangular shape in the above description, it may have other shapes such as a circle or an oval.

[0068] In this embodiment (see FIG. 6), the first side surface 36 of the pad portion 33 is covered with a resin first thin film portion 51, and the second side surface 37 is covered with a resin second thin film portion 52. As a modification, one or both of the first thin film portion 51 and the second thin film portion 52 may be omitted. The first space K1 and the second space K2 formed on the sides of the first side surface 36 and the second side surface 37 of the pad portion 33 may have a shape (cross-sectional shape) other than that shown in the drawing.

[0069] The electronic component 15 (first electronic component 15) may be a component other than a field effect transistor, for example, a mechanical relay. Even in this case, when the circuit assembly 11 is in a completed state, the electronic component 15 and the control board 13 are electrically connected, and a signal is given from the control board 13 to the electronic component 15 through the control terminal 16, causing the electronic component 15 to operate. Note that an electrical inspection is performed before the control board 13 is connected.

[0070] The above-described embodiment is illustrative in all respects and is not restrictive. The scope of the present invention is indicated by the claims rather than the above-described embodiment, and includes all modifications within the scope equivalent to the configurations described in the claims. [Explanation of symbols]

[0071] 10 Electrical junction box 11 Circuit structure 12 Cover 13 Control Board 13a Front page 14 Retaining member 15 Electronic Components 15a Source terminal 15c Drain terminal 15b Gate terminal 16 Control terminal 17 Conductive plate 17-1 First conductive plate 17-2 Second conductive plate 17-3 Third conductive plate 18 Through Hole 19 Base 20 Frame 21A end 21B End 22 Main body 23 First buried section 24 Second buried section 25 First bend 26 Second bend 27 Control circuit section 28 holes 29 Wiring Pattern 30 Containment Space 31 First terminal body 31a base 32 Second terminal body 32a base 32b part 33 Pad section 34 First exposed surface 34a First side 34b Second side 35 Contact surface 36 First aspect 37 Second aspect 38 corners 39 Mounting holes 41 Front page 42 Second side 43 Side 44 Second exposed surface 45 Terminal surface 46 First piece 47 Second piece 50 Thick part 51 First thin film part 51a side 52 Second thin film part 52a Side 54 Resin surface 57 First convex part 58 Second convex part 60 Mold 60a cavity 60b First part 60c second part 61 Protrusion J1 First boundary area J2 Second boundary area K1 First space K2 Second space L1 First dimension L2 Second dimension

Claims

1. a plurality of electronic components; a plurality of control terminals electrically connected to the plurality of electronic components; and a holding member having insulating properties and holding the plurality of control terminals; the control terminal is an insert part that is integrated with the holding member that is made of resin, The control terminal includes: an exposed surface exposed from the holding member; a contact surface that is a surface opposite to the exposed surface and that contacts the holding member; a first side located between the exposed surface and the contact surface; a second side located between the exposed surface and the contact surface; A first space is formed on a side of the first side surface, and a second space is formed on a side of the second side surface. circuit construct.

2. the holding member has a thick portion in contact with the contact surface, a first thin film portion made of resin covering the first side surface, and a second thin film portion made of resin covering the second side surface, a side surface of the first thin film portion is exposed in the first space portion, A side surface of the second thin film portion is exposed in the second space portion. The circuit assembly according to claim 1 .

3. a control board for outputting a signal to the electronic component through the control terminal; The control terminal is A first terminal body portion connected to the control board; a pad portion as the part, the pad portion being electrically connected to the first terminal body portion and provided along the holding member and having the exposed surface and the contact surface; a second terminal body portion electrically connected to the pad portion and the electronic component; having The circuit assembly according to claim 1 or 2.

4. The pad portion is provided extending from a base portion of the first terminal body portion, The holding member has a first embedded portion that embeds a boundary region between the first terminal body portion and the pad portion of the control terminal. The circuit assembly according to claim 3.

5. The pad portion is provided extending from a base portion of the second terminal body portion, the holding member has a second embedded portion that embeds a boundary region between the pad portion and the second terminal body portion, the second embedded portion has a resin surface that is flush with the exposed surface of the pad portion; The circuit assembly according to claim 3 or 4.

6. The second terminal body portion has a terminal surface exposed from the holding member and connected to the electronic component, and a second exposed surface opposite to the terminal surface and exposed from the holding member. The circuit assembly according to any one of claims 3 to 5.

7. A circuit assembly according to any one of claims 1 to 6; and a cover that covers the circuit assembly.

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