Printed circuit board

Abstract

To provide a printed circuit board capable of preventing the occurrence of undercuts, for example, during etching processing when forming fine circuits.SOLUTION: The present invention relates to a printed circuit board including an insulating layer and a wiring pattern disposed on or within the insulating layer, and the wiring pattern includes a first metal layer, a second metal layer disposed on an upper surface of the first metal layer, and an inorganic oxide film disposed on the side of the second metal layer.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to printed circuit boards. [Background technology]

[0002] Due to the demand for producing high performance printed circuit boards, the realization of fine circuits is becoming more and more important. To realize fine circuits, it is necessary to secure uniform yet fine lines (L: line) and spaces (S: space). For example, in the case of high-end products such as 2.nD, L / S may each be required to be on the order of several microns. However, in the case of conventional fine circuit formation processes, undercuts can occur at the bottom of the fine circuit pattern when etching the seed layer, which can lead to poor circuit reliability. Summary of the Invention [Problem to be solved by the invention]

[0003] One of several objects of the present invention is to provide a printed circuit board capable of preventing the occurrence of undercuts, for example, during an etching process, when forming a fine circuit. [Means for solving the problem]

[0004] One of the solutions proposed in the present invention is to form a barrier layer, for example, an inorganic oxide film, on the circuit before seed etching using a thin film deposition method such as ALD (Atomic Layer Deposition) or MVD (Molecular Vapor Deposition), thereby minimizing the effect of etching on the lower end of the circuit and preventing the occurrence of undercut.

[0005] For example, one example of a printed circuit board may include an insulating layer and a wiring pattern disposed on or within the insulating layer, the wiring pattern including a first metal layer, a second metal layer disposed on an upper surface of the first metal layer, and an inorganic oxide film disposed on a side surface of the second metal layer.

[0006] For example, one example of a printed circuit board may include a substrate, a first metal layer disposed on the substrate, a second metal layer disposed on the first metal layer, and a barrier layer disposed to surround the second metal layer and having a protruding portion at its lower end that protrudes at least partially in a direction perpendicular to the stacking direction. Effect of the Invention

[0007] Among the various effects of the present invention, one effect is that a printed circuit board can be provided that can prevent the occurrence of undercuts, for example, during an etching process, when forming fine circuits. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a block diagram illustrating a schematic example of an electronic device system. [Diagram 2] FIG. 1 is a perspective view illustrating an example of an electronic device. [Diagram 3] FIG. 1 is a cross-sectional view illustrating an example of a printed circuit board. [Figure 4a] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Figure 4b] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Figure 4c] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Figure 4d] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Figure 4e] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Figure 4f] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Figure 4g] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Figure 4h] 4A to 4C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 3. [Diagram 5] FIG. 11 is a cross-sectional view illustrating another example of a printed circuit board. [Figure 6a] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6b] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6c] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6d] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6e] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6f] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6g] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6h] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 6i] 6A to 6C are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG. 5. [Figure 7] 1 is a cross-sectional view showing the effect of etching with or without an inorganic oxide film. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The present invention will now be described with reference to the accompanying drawings, in which the shapes and sizes of elements may be exaggerated or reduced for clarity.

[0010] electronic equipment FIG. 1 is a block diagram illustrating an example of an electronic device system.

[0011] Referring to the drawing, an electronic device 1000 accommodates a main board 1010. Chip-related components 1020, network-related components 1030, and other components 1040 are physically and / or electrically connected to the main board 1010. These are also connected to other electronic components described below to form various signal lines 1090.

[0012] The chip-related components 1020 include, but are not limited to, memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphic processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs). Needless to say, the chip-related components 1020 may include other types of chip-related electronic components. Needless to say, these chip-related components 1020 may be combined with each other. The chip-related components 1020 may be in the form of a package including the above-mentioned chips and electronic components.

[0013] The network-related components 1030 may include, but are not limited to, any other wireless and wired protocols designated as Wi-Fi (e.g., IEEE 802.11 family), WiMAX (e.g., IEEE 802.16 family), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and beyond, as well as any of a number of other different wireless or wired standards and protocols. It should be understood that the network-related components 1030 may also be combined with the chip-related components 1020 and with each other.

[0014] The other components 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic capacitors), etc. However, the other components 1040 are not limited to these, and may also include passive elements in the form of chip components used for various other different applications. It goes without saying that the other components 1040 may be combined with the chip-related components 1020 and / or the network-related components 1030.

[0015] Depending on the type of electronic device 1000, the electronic device 1000 may include other electronic components that may or may not be physically and / or electrically coupled to the main board 1010. Examples of other electronic components include, but are not limited to, a camera 1050, an antenna 1060, a display 1070, and a battery 1080. The other electronic components may include, but are not limited to, an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a compact disk (CD), a digital versatile disk (DVD), and the like. Needless to say, other electronic components used for various purposes may be included depending on the type of electronic device 1000.

[0016] The electronic device 1000 may be a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, an automotive, etc. However, the electronic device 1000 is not limited to these, and may be any other electronic device that processes data.

[0017] FIG. 2 is a perspective view that illustrates an example of an electronic device.

[0018] Referring to the drawings, the electronic device may be, for example, a smartphone 1100. A motherboard 1110 is housed inside the smartphone 1100, and various components 1120 are physically and / or electrically connected to the motherboard 1110. In addition, other components such as a camera module 1130 and / or a speaker 1140 that may or may not be physically and / or electrically connected to the motherboard 1110 are housed inside the smartphone 1100. Some of the components 1120 may be the above-mentioned chip-related components, for example, a component package 1121, but are not limited thereto. The component package 1121 may be in the form of a printed circuit board on which electronic components including active components and / or passive components are surface-mounted. Alternatively, the component package 1121 may be in the form of a printed circuit board in which active components and / or passive components are built-in. Meanwhile, it goes without saying that the electronic device is not necessarily limited to the smartphone 1100, and may be other electronic devices as described above.

[0019] Printed Circuit Board FIG. 3 is a cross-sectional view that illustrates an example of a printed circuit board.

[0020] Referring to the drawings, a printed circuit board 100A according to an example may include a first insulating layer 111, a first wiring pattern 121 disposed on an upper surface of the first insulating layer 111, and a second insulating layer 112 disposed on the upper surface of the first insulating layer 111 and covering at least a part of the first wiring pattern 121. The first wiring pattern 121 may be disposed on the first insulating layer 111 and may be disposed in the second insulating layer 112. The first wiring pattern 121 may include a first metal layer M1, a second metal layer M2 disposed on an upper surface of the first metal layer M1, and an inorganic oxide film A disposed on a side surface of the second metal layer M2. There may be a plurality of first wiring patterns 121, and the plurality of first wiring patterns 121 may be fine circuits with a line (L) / space (S) of less than 10 μm / 10 μm, for example, within 5 μm / 5 μm or within 2 μm / 2 μm. The inorganic oxide film A may be a thin film with a thickness of less than 100 nm. In this way, when forming the first wiring pattern 121, which is a fine circuit, by disposing the thin inorganic oxide film A, it is possible to prevent the occurrence of undercuts, as described below. Therefore, it is possible to easily ensure the circuit adhesion and circuit stability. Also, it is possible to more easily realize a fine pattern.

[0021] Meanwhile, the first and second metal layers M1 and M2 may be distinct layers formed separately from each other, and may have different average grain sizes, for example. In this case, the thickness t2 of the second metal layer M2 may be thicker than the thickness t1 of the first metal layer M1. Also, the thickness t1 of the first metal layer M1 may be thicker than the thickness t3 of the inorganic oxide film A. For example, the first metal layer M1 may be a seed layer formed by electroless plating or the like, and may include, for example, chemical copper. Also, the second metal layer M2 may be a plating layer formed by electrolytic plating or the like, and may include, for example, electric copper. Therefore, the thickness t2 of the second metal layer M2 may be thicker than the thickness t1 of the first metal layer M1. Also, the inorganic oxide film A may be formed very thin by a thin film deposition method. Therefore, the thickness t3 of the inorganic oxide film A may be thinner than the thickness t1 of the first metal layer M1. The inorganic oxide film A may include at least one of materials applicable to ALD, MVD, etc., such as, but not limited to, Al2O3, TiO2, ZnO, ZnO2, ZrO2, SnO, SnO2, HfO2, and SiO2. Meanwhile, when the inorganic oxide film A is formed by a thin film deposition method such as ALD or MVD, it may have better uniformity, step coverage, etc. than when a protective film is formed of other materials by plasma deposition, etc.

[0022] Meanwhile, at least a part of the side surface of the first metal layer M1 may be exposed from the inorganic oxide film A. For example, the inorganic oxide film A may be separated from the side surface of the first metal layer M1. Also, the inorganic oxide film A may be separated from the upper surface of the second metal layer M2. For example, the inorganic oxide film A may be disposed only on the side surface of the second metal layer M2, or may be disposed so as to surround the second metal layer M2. The inorganic oxide film A may be formed conformally to a substantially constant thickness on the side surface of the second metal layer M2. This arrangement can effectively prevent the occurrence of undercut during etching.

[0023] The components of the printed circuit board 100A according to an example will be described in more detail below with reference to the drawings.

[0024] Each of the first and second insulating layers 111 and 112 may include an insulating material. The insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including an inorganic filler, an organic filler, and / or a glass fiber (glass fiber, glass cloth, glass fabric) together with a resin. For example, the insulating material may be a non-photosensitive insulating material such as CCL (Copper Clad Laminate), ABF (Ajinomoto Build-up Film), PPG (Prepreg), etc., but is not limited thereto, and other polymer materials may be used. The insulating material may also be a photosensitive insulating material such as PID (Photo Imageable Dielectric). When the first and second insulating layers 111 and 112 include the same material, they may be integrated with each other to form a single insulating layer, but is not limited thereto, and the first and second insulating layers 111 and 112 may be layers separated from each other. The first insulating layer 111 may be a substrate in a broader sense, and the substrate may be made of various materials such as a glass substrate, a silicon substrate, a ceramic substrate, etc., in addition to the organic substrate described above.

[0025] The first wiring pattern 121 may include a metal material. For example, the first and second metal layers M1 and M2 may each include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the first and second metal layers M1 and M2 may each include copper (Cu), but are not limited thereto. The first wiring pattern 121 may be a signal pattern, and if necessary, a power pattern or a ground pattern may be further disposed on the same layer as the first wiring pattern 121. The first wiring pattern 121 may be a line pattern, and if necessary, a plane pattern or a pad pattern may be further disposed on the same layer as the first wiring pattern 121. The first wiring pattern 121 may be composed of multiple metal layers, and may include, for example, a first metal layer M1 which is an electroless plating layer (or chemical copper) and a second metal layer M2 which is an electrolytic plating layer (or electrolytic copper).

[0026] As described above, the inorganic oxide film A may be a thin film having a thickness of less than 100 nm, for example, about 1 nm to 10 nm. The inorganic oxide film A may contain at least one of materials to which ALD or MVD can be applied, such as Al2O3, TiO2, ZnO, ZnO2, ZrO2, SnO, SnO2, HfO2, and SiO2, preferably Al2O3, but is not limited thereto. The inorganic oxide film A may be used as a barrier layer to prevent undercut caused by etching, and may also be used as an adhesive layer to improve adhesion with the second insulating layer 112.

[0027] 4a to 4h are cross-sectional views illustrating steps of a manufacturing process for the printed circuit board of FIG.

[0028] Referring to FIG. 4a, a first metal layer M1 is formed on a first insulating layer 111 by electroless plating or the like. The first insulating layer 111 may be various types of substrates, such as an organic substrate, a glass substrate, a silicon substrate, a ceramic substrate, etc. The first metal layer M1 may include chemical copper. The first metal layer M1 may be a seed layer.

[0029] Referring to FIG. 4b, a resist layer 210 is formed on the first metal layer M1, and the resist layer 210 is exposed and developed in a photolithography process to form a patterned opening H that exposes the top surface of the first metal layer M1.

[0030] 4c, a second metal layer M2 is formed on the first metal layer M1 by electrolytic plating or the like to fill at least a portion of the patterned opening H. The second metal layer M2 may be a plating layer that is substantially a fine circuit.

[0031] 4d, remove the resist layer 210. The resist layer 210 can be chemically stripped using a stripping solution or physically stripped.

[0032] 4e, an inorganic oxide film A is formed on and covering the first and second metal layers M1 and M2. The inorganic oxide film A can be formed to a thin thickness using a thin film deposition method such as ALD or MVD.

[0033] Referring to Fig. 4f, the inorganic oxide film A disposed on the upper surfaces of the first and second metal layers M1 and M2 is removed by etching. For example, the inorganic oxide film A may remain only on the side surface of the second metal layer M2. The etching may be, but is not limited to, dry etching such as plasma etching.

[0034] Referring to FIG. 4g, unnecessary first metal layer M1 in areas other than the area where second metal layer M2 is formed is removed by etching. For example, first metal layer M1 may remain only under second metal layer M2. Wet etching such as flash etching may be used as the etching method, but is not limited thereto. In the etching process, inorganic oxide film A may prevent undercut from occurring at the lower end of the side of second metal layer M2. Through a series of processes, first wiring pattern 121, which is a fine circuit, may be formed.

[0035] 4h, a second insulating layer 112 is formed on the first insulating layer 111. The second insulating layer 112 may be formed by a lamination process. The first wiring pattern 121 may be embedded in the second insulating layer 112. The printed circuit board 100A according to the above-mentioned example may be manufactured through a series of processes, and other repeated descriptions will be omitted.

[0036] FIG. 5 is a cross-sectional view that illustrates a schematic diagram of another example of a printed circuit board.

[0037] Referring to the drawings, the printed circuit board 100B according to another example may be arranged with a second wiring pattern 122 instead of the first wiring pattern 121 in the printed circuit board 100A according to the above example. In the second wiring pattern 122, the width w1 of the first metal layer M1 may be wider than the width w2 of the second metal layer M2 on the cross section. For example, in the second wiring pattern 122, the side surface of the first metal layer M1 may protrude from the side surface of the second metal layer M2. In this case, the second wiring pattern 122 may have a protruding portion AP at the lower end of the inorganic oxide film A, at least a part of which protrudes in a direction perpendicular to the stacking direction, and the protruding portion AP may cover a part of the upper surface of the first metal layer M1 and be separated from the side surface. For example, the inorganic oxide film A of the second wiring pattern 122 may be arranged to extend over the protruding region of the first metal layer M1. In this case, the above-mentioned technical effects can be obtained, for example, by disposing a thin inorganic oxide film A when forming the second wiring pattern 122, which is a fine circuit, the occurrence of undercut can be prevented. Therefore, it is easier to ensure the circuit adhesion and circuit stability. Also, it is easier to realize a fine pattern. The other contents are substantially the same as those described in the printed circuit board according to the above-mentioned example, so a duplicated description will be omitted.

[0038] 6a to 6i are cross-sectional views illustrating an example of a manufacturing process for the printed circuit board of FIG.

[0039] 6a, a first metal layer M1 is formed on a first insulating layer 111 by electroless plating or the like. The first insulating layer 111 may be various types of substrates, such as an organic substrate, a glass substrate, a silicon substrate, a ceramic substrate, etc. The first metal layer M1 may include chemical copper. The first metal layer M1 may be a seed layer.

[0040] Referring to FIG. 6b, a resist layer 210 is formed on the first metal layer M1, and the resist layer 210 is exposed and developed in a photolithography process to form a patterned opening H that exposes the top surface of the first metal layer M1.

[0041] 6c, a second metal layer M2 is formed on the first metal layer M1 by electrolytic plating or the like to fill at least a portion of the patterned opening H. The second metal layer M2 may be a plating layer that is substantially a fine circuit.

[0042] 6d, a part of the resist layer 210 is removed by soft stripping. A stripping solution may be used for the soft stripping. A space G may be formed between the second metal layer M2 and the resist layer 210 by the soft stripping.

[0043] 6e, an inorganic oxide film A is formed on the first and second metal layers M1 and M2 and the resist layer 210 to cover them. The inorganic oxide film A may also be formed on the wall surface of the space G between the second metal layer M2 and the resist layer 210. The inorganic oxide film A may be formed to a thin thickness using a thin film deposition method such as ALD or MVD.

[0044] 6f, the inorganic oxide film A disposed on the upper surfaces of the second metal layer M2 and the resist layer 210 is removed by etching. For example, the inorganic oxide film A may remain only on the side surface of the second metal layer M2, on the wall surface of the space G between the second metal layer M2 and the resist layer 210, and on the upper surface of the first metal layer M1. Dry etching such as plasma etching may be used as the etching, but is not limited thereto.

[0045] 6g, the resist layer 210 is removed. The resist layer 210 can be chemically stripped using a stripping solution or physically stripped. After the resist layer 210 is stripped, a protrusion AP may remain at the lower end of the inorganic oxide film A, covering a part of the upper surface of the first metal layer M1.

[0046] Referring to FIG. 6h, the unnecessary first metal layer M1 in the other regions other than the region where the second metal layer M2 and the inorganic oxide film A are formed is removed by etching. For example, the first metal layer M1 may remain only under the second metal layer M2 and the inorganic oxide film A. The etching may be wet etching such as flash etching, but is not limited thereto. In the etching process, the inorganic oxide film A may prevent undercut from occurring at the lower end of the side of the second metal layer M2. Through a series of processes, the second wiring pattern 122, which is a fine circuit, may be formed.

[0047] Referring to Fig. 6i, a second insulating layer 112 is formed on the first insulating layer 111. The second insulating layer 112 may be formed by a lamination process. The second wiring pattern 122 may be embedded in the second insulating layer 112. Through a series of processes, the printed circuit board 100B according to the above-mentioned example may be manufactured, and further redundant description will be omitted.

[0048] FIG. 7 is a cross-sectional view showing the effect of etching with and without an inorganic oxide film.

[0049] Referring to the drawings, when there is no oxide film A as in (A), an undercut may occur at the lower end of the second metal layer M2 during the etching process for removing the first metal layer M1. On the other hand, when an inorganic oxide film A is formed as in (B), the inorganic oxide film A can prevent an undercut from occurring at the lower end of the second metal layer M2 during the etching process for removing the first metal layer M1. Therefore, it may be easier to ensure circuit adhesion and circuit stability. Also, it may be easier to realize a fine pattern.

[0050] In the present invention, the expression "cover" can include not only the case of covering entirely, but also the case of covering at least a part, and can also include not only the case of covering directly, but also the case of covering indirectly. The expression "fill" can include not only the case of filling completely, but also the case of filling at least a part, and can also include the case of filling almost entirely. For example, it can include the case where some gaps or voids are present. The expression "surround" can include not only the case of surrounding completely, but also the case of surrounding a part and the case of surrounding almost entirely. The expression "expose" can include not only the case of exposing completely, but also the case of exposing a part, and "exposure" can mean exposing from embedding the structure. For example, "the opening exposes the pad" can mean exposing the pad from the resist layer, and a surface treatment layer or the like can be further disposed on the exposed pad.

[0051] In the present invention, the term "substantially" can be determined by taking into account process errors, positional deviations, measurement errors, and the like that occur during the manufacturing process. For example, "substantially perpendicular" can include not only a case where the two are completely perpendicular, but also a case where the two are almost perpendicular. Furthermore, "substantially coplanar" can include not only a case where the two are completely on the same plane, but also a case where the two are almost on the same plane.

[0052] In the present invention, the term "same insulating material" refers not only to completely identical insulating materials, but also to insulating materials of the same type. Thus, although the compositions of the insulating materials are substantially the same, the specific composition ratios thereof may differ slightly.

[0053] In the present invention, the meaning of "on a cross section" can mean the cross-sectional shape when an object is cut vertically or the cross-sectional shape when the object is viewed from the side, and the meaning of "on a plane" can mean the planar shape when an object is cut horizontally or the planar shape when the object is viewed from the top or bottom.

[0054] In the present invention, for convenience, terms such as "lower side, lower part, lower surface" are used to mean a downward direction based on a cross section of a drawing, and terms such as "upper side, upper part, upper surface" are used to mean the opposite direction. However, these are merely definitions of directions for convenience of explanation, and the scope of the claims is not particularly limited by such directional descriptions, and the concepts of up / down can be changed at any time.

[0055] In the present invention, "connected" is a concept including not only direct connection but also indirect connection via an adhesive layer or the like. Also, "electrically connected" is a concept including both physical connection and no connection. Furthermore, expressions such as "first, second" are used to distinguish one component from another component, and do not limit the order and / or importance of the components. In some cases, the first component may be named the second component, and similarly, the second component may be named the first component, within the scope of the right.

[0056] The term "one example" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe unique features that are different from each other. However, the above-mentioned one example does not exclude that it is realized in combination with the features of another example. For example, even if the matter described in a specific example is not described in another example, it can be understood as a description related to the other example, unless there is a description in the other example that is opposite or contradictory to the matter.

[0057] The terms used in the present invention are merely used to describe an example and are not intended to limit the present invention. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0058] 1000:Electronic equipment 1010: Main board 1020: Chip related parts 1030: Network related parts 1040:Other parts 1050: Camera 1060:Antenna 1070:Display 1080: Battery 1090: Signal line 1100: Smartphone 1110: Motherboard 1120: Parts 1121: Parts package 1130: Camera module 1140: Speaker 100A, 100B: Printed circuit board 111, 112: insulating layer 121, 122: Wiring pattern M1, M2: Metal layer A: Inorganic oxide film AP:Protrusion 210: Resist layer H: Opening G: Space

Claims

1. An insulating layer; a wiring pattern disposed on or within the insulating layer; The wiring pattern includes a first metal layer, a second metal layer disposed on an upper surface of the first metal layer, and an inorganic oxide film disposed on a side surface of the second metal layer.

2. the second metal layer is thicker than the first metal layer; The printed circuit board of claim 1 , wherein the first metal layer is thicker than the inorganic oxide film.

3. The printed circuit board of claim 1 , wherein the inorganic oxide film has a thickness of less than 100 nm.

4. The inorganic oxide film is Al ２ O ３ , TiO ２ , ZnO, ZnO ２ , ZrO ２ , SnO, SnO ２ , HfO ２ and SiO ２ The printed circuit board of claim 1 , comprising at least one of:

5. The printed circuit board according to claim 1 , wherein at least a portion of a side surface of the first metal layer is exposed from the inorganic oxide film.

6. the inorganic oxide film is spaced apart from a side of the first metal layer; The printed circuit board of claim 5 , wherein the inorganic oxide film is spaced apart from an upper surface of the second metal layer.

7. a side surface of the first metal layer protrudes beyond a side surface of the second metal layer; The printed circuit board of claim 1 , wherein the inorganic oxide film is disposed to extend over the protruding region of the first metal layer.

8. The printed circuit board of claim 1 , wherein the first and second metal layers have different average grain sizes.

9. the first metal layer comprises chemical copper; The printed circuit board of claim 8 , wherein the second metal layer comprises electrolytic copper.

10. A plurality of the wiring patterns are arranged, The printed circuit board according to claim 1 , wherein the plurality of wiring patterns have a line (L) / space (S) of less than 10 μm / 10 μm.

11. the insulating layer includes a first and a second insulating layer; the wiring pattern is disposed on an upper surface of the first insulating layer; the second insulating layer is disposed on an upper surface of the first insulating layer; The printed circuit board according to claim 1 , wherein the second insulating layer covers at least a portion of the wiring pattern.

12. A substrate; a first metal layer disposed on the substrate; a second metal layer disposed on the first metal layer; a barrier layer disposed to surround the second metal layer and having a protruding portion at a lower end thereof, at least a portion of which protrudes in a direction perpendicular to the stacking direction.

13. The first metal layer has a width in cross section greater than that of the second metal layer, The printed circuit board according to claim 12 , wherein the protrusion covers a portion of an upper surface of the first metal layer and is spaced apart from a side surface.

14. the second metal layer is thicker than the first metal layer; The printed circuit board of claim 12 , wherein the first metal layer is thicker than the barrier layer.

15. 13. The printed circuit board of claim 12, wherein the barrier layer comprises an inorganic oxide film having a thickness of less than 100 nm.

16. The inorganic oxide film is Al ２ O ３ , TiO ２ , ZnO, ZnO ２ , ZrO ２ , SnO, SnO ２ , HfO ２ and SiO ２ 16. The printed circuit board of claim 15, comprising at least one of:

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