Flip chip packaging process

Abstract

To provide a flip chip packaging process which improves the cleaning effect of residue, effectively simplifies the flip chip packaging process, and greatly improves production efficiency.SOLUTION: A flip chip packaging process includes the steps of manufacturing a chip having a plurality of conductive bumps, manufacturing a circuit board including welding pads arranged corresponding to the respective conductive bump, applying flux to the surface of the pads using a 3D array nozzle printing device, flipping and aligning the chip, performing metal welding to manufacture a flip chip packaging structure, filling a liquid material to cover the material to be cleaned on the circuit board, heating the flip chip packaging structure to a predetermined temperature in an enclosed processing chamber, and generating a vacuum or boost / boost in the gas in the processing chamber using a boost / boost device or vacuum generator, and using the wave change of the gas to rub and wash the liquid material with back and forth friction, so that the material to be cleaned is separated from the circuit board.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the technical field of flip chip mounting process, and particularly to a flip chip mounting process that uses a 3D array nozzle printing device to properly control the coating range and coating amount of flux, minimize the amount of flux remaining after metal deposition, and combines the liquid material with intermittent increasing and decreasing airflow wave motion to drive the liquid material and generate friction or stirring effects, thereby improving the cleaning effect of residues, effectively simplifying the flip chip mounting process, and greatly improving production efficiency. [Background technology]

[0002] In the era of rapid technological advancement, new high-tech electronic technologies are constantly emerging, and electronic products with more human touch and better functions are constantly being developed, and are designed to be lighter, thinner, shorter, and smaller. To achieve these demands, electronic components need to meet the demands of high-speed processing, multi-function, integration, small size, light weight, and low price, and for this reason, integrated circuit packaging technology is also moving toward miniaturization and high density. In each packaging technology, flip chip package (F / C package) and other high-density stacked circuit packaging technologies that electrically connect with bumps or solder balls are becoming the mainstream of high-density packaging because they can shorten the wiring length and improve the signal transmission speed.

[0003] In general, adhesives are required for indirect bonding of materials in conventional flip chip mounting processes, and some adhesives usually have high acid content and corrosiveness in order to remove the close oxide layer formed on the bonding surface during metal bonding. However, the performance of microelectronic components is greatly affected by the corrosiveness of the adhesive. Therefore, a cleaning process must be further performed to remove the adhesive remaining on the bonding surface or the reaction residue between the adhesive and the metal oxide. Some adhesives leave some organic matter after use and leave an oily ester film on the bonding surface, and in order to avoid reliability problems for subsequent semiconductor devices, such oily esters must also be cleaned. However, when the wiring of the circuit board becomes denser, the protrusions used for bonding the circuit board become smaller, and the gap between the circuit board and the pad bonding becomes narrower, the residue becomes more difficult to clean. If the corrosive adhesive remaining on the circuit board or the bonding part is not completely removed, the reliability of the components will be greatly reduced. In addition, cleaning with cleaning solvents currently in common use has an impact on the environment if not properly handled, and improvement is required.

[0004] Therefore, in order to overcome the problems existing in the conventional flip chip mounting process, how to develop an ideal mounting process that is both practical and economical has become the goal and direction of active research and development breakthroughs of related businesses.

[0005] Therefore, based on the inventor's many years of experience in the manufacturing, development and design of related products, after detailed design and careful evaluation of the above-mentioned objectives, the inventor has been able to obtain the present invention which is indeed practical. Summary of the Invention [Problem to be solved by the invention]

[0006] In general, adhesives are required for indirect bonding of materials in conventional flip chip mounting processes, and some adhesives usually have high acid content and corrosiveness in order to remove the intimate oxide layer formed on the bonding surface during metal bonding. However, the performance of microelectronic components is greatly affected by the corrosiveness of the adhesive. Therefore, a cleaning process must be further performed to remove the adhesive or the reaction residue between the adhesive and the metal oxide remaining on the bonding surface. However, as the wiring of the circuit board becomes denser, the protrusions used for bonding the circuit board become smaller, and the gap between the circuit board and the pad bonding becomes narrower, the residue becomes more difficult to clean, and an improvement is required. [Means for solving the problem]

[0007] In order to improve the above problem, the present invention provides a flip chip mounting process, which includes the following steps: a) a chip manufacturing process, in which the chip is provided with an active side surface having a plurality of conductive bumps, the conductive bumps being at least one of Sn, Ag, Cu, Au, In, Pb, Bi, Zn, Ni, or other materials suitable for welding; and b) a circuit board manufacturing process, in which the circuit board is provided with a support surface, and weld pads are respectively arranged on the support surface corresponding to each of the conductive bumps.

[0008] c. Flux is applied to the surface of each of the pads using a 3D array nozzle printing device, and the 3D array nozzle printing device can appropriately control the application range and application amount of flux through program settings, thereby effectively avoiding application outside the area of ​​each of the pads.

[0009] d. Flip and align the chip, place the active surface of the chip toward the support surface of the circuit board, and bond each of the conductive bumps to each of the pads via flux, and perform a metal welding operation to electrically and structurally connect the chip to each of the pads of the circuit board through each of the conductive bumps, manufacture a flip chip package structure, and transmit signals between the circuit board and the chip.

[0010] e. Filling a liquid material between the circuit board and the chip to cover the material on the circuit board that has not yet been cleaned.

[0011] f. placing the flip chip package structure including the liquid material in a sealed processing chamber, and heating the processing chamber to a predetermined temperature, the predetermined temperature being between 25 and 200°C depending on the viscosity of the liquid material, to increase the fluidity of the liquid material.

[0012] g. The vacuum generator may be used to intermittently generate a vacuum in the gas in the processing chamber, the vacuum being a pulse of up to 1 atmosphere or less and up to 10 atmospheres or less. -5 A wavy airflow is generated that performs intermittent wavy motion in the range up to atmospheric pressure, and the wave change of the gas vacuum suction force causes a wave change in the liquid material, causing the liquid material in contact with the material to be cleaned to go back and forth and be massaged and washed with friction of even greater amplitude, so that the material to be cleaned that is attached to the circuit board can be more effectively separated from the circuit board, achieving an effect that was not possible with conventional solution cleaning.

[0013] The present invention provides another flip chip mounting process, which includes the following steps: a) a chip manufacturing process, in which the chip is provided with an active side surface having a plurality of conductive bumps, the conductive bumps being at least one of Sn, Ag, Cu, Au, In, Pb, Bi, Zn, Ni, or other materials suitable for welding; and b) a circuit board manufacturing process, in which the circuit board is provided with a support surface, and weld pads are respectively arranged on the support surface corresponding to each of the conductive bumps.

[0014] c. Flux is applied to the surface of each of the pads using a 3D array nozzle printing device, and the 3D array nozzle printing device can appropriately control the application range and amount of flux through program settings, thereby effectively avoiding application outside the area of ​​each of the pads.

[0015] d. Flip and align the chip, place the active surface of the chip toward the support surface of the circuit board, and bond each of the conductive bumps to each of the pads via flux, and perform a metal welding operation to electrically and structurally connect the chip to each of the pads of the circuit board through each of the conductive bumps, manufacture a flip chip package structure, and transmit signals between the circuit board and the chip.

[0016] e. Filling a liquid material between the circuit board and the chip to cover the material on the circuit board that has not yet been cleaned.

[0017] f. placing the flip chip package structure including the liquid material in a sealed processing chamber, and heating the processing chamber to a predetermined temperature, the predetermined temperature being between 25 and 200°C depending on the viscosity of the liquid material, to increase the fluidity of the liquid material.

[0018] g. For the gas in the processing chamber, the pressure increase / decrease device and the vacuum generator are used to intermittently generate pressure increase / decrease and vacuum, and the pressure increase / decrease and vacuum are used to generate a wave from high pressure to vacuum, with a maximum of 50 atmospheres and a minimum of 10 -5 A wavy airflow is generated that performs intermittent wavy motion in the range up to atmospheric pressure, and the wave change of the gas causes a wave change in the liquid material, which kneads and washes the liquid material that comes into contact with the substance to be cleaned by the back-and-forth friction, and the substance to be cleaned that is attached to the circuit board is more effectively separated from the circuit board, achieving an effect that was not possible with conventional solution cleaning.

[0019] The present invention provides another flip chip mounting process, which includes the following steps: a) a chip manufacturing process, in which the chip is provided with an active side surface having a plurality of conductive bumps, the conductive bumps being at least one of Sn, Ag, Cu, Au, In, Pb, Bi, Zn, Ni, or other materials suitable for welding; and b) a circuit board manufacturing process, in which the circuit board is provided with a support surface, and weld pads are respectively arranged on the support surface corresponding to each of the conductive bumps.

[0020] c. Flux is applied to the surface of each of the pads using a 3D array nozzle printing device, and the 3D array nozzle printing device can appropriately control the application range and amount of flux through program settings, thereby effectively avoiding application outside the area of ​​each of the pads.

[0021] d. Flip and align the chip, place the active surface of the chip toward the supporting surface of the circuit board, and bond each of the conductive bumps to each of the pads via flux, and perform a metal welding operation to electrically and structurally connect the chip to each of the pads of the circuit board through each of the conductive bumps, manufacture a flip chip package structure, and transmit signals between the circuit board and the chip.

[0022] e. Filling a liquid material between the circuit board and the chip to cover the material on the circuit board that has not yet been cleaned.

[0023] f. placing the flip chip package structure including the liquid material in a sealed processing chamber, and heating the processing chamber to a predetermined temperature, the predetermined temperature being between 25 and 200°C depending on the viscosity of the liquid material, to increase the fluidity of the liquid material.

[0024] g. By intermittently increasing and decreasing the pressure of the gas in the processing chamber using an intensifying and depressurizing device, a wavy airflow is generated that has a wave motion from high pressure to 1 atmosphere, with an intermittent wave motion ranging from a maximum of 50 atmospheres to a minimum of 1 atmosphere. The wave motion change of the gas causes a wave motion change in the liquid material, which kneads and washes the liquid material that comes into contact with the material to be cleaned by the back-and-forth friction, and the material to be cleaned that is attached to the circuit board can be more effectively separated from the circuit board, achieving an effect that was not possible with conventional solution cleaning.

[0025] In the above description, the flux used is a liquid flux, and the viscosity of the liquid flux ranges from 1 centipoise (cps) to 100 centipoise.

[0026] In the above, the material to be cleaned may be a flux, flux residue, oil ester, photoresist or a product of a manufacturing process.

[0027] In the above, the liquid material is an underfill, and hard particles are contained within the underfill. The hard particles roll back and forth according to the wave motion of the underfill, and the hard particles increase the rubbing effect of the friction and help wash away the material to be removed.

[0028] In the above, the underfill component is an epoxy resin doped with a filler such as silicon dioxide (SiO2) powder.

[0029] (Effects of the Invention) The flip chip mounting process of the present invention properly controls the coating range and coating amount of the flux by the 3D array nozzle printing device, makes the flux residue left after the metal welding work extremely small, controls the wave change of the liquid material due to the wave change of the gas in the processing chamber, generates a washing effect of reciprocating friction like washing, or accelerates the dissolution of the substance to be cleaned into the liquid material, and adds it to water like sugar and stirs it to accelerate the sugar dissolution effect, and the liquid material in contact with the substance to be cleaned is separated from the circuit board by reciprocating friction cleaning, improves the cleaning effect of the residue, effectively simplifies the flip chip mounting process, and greatly improves production efficiency. In addition, in the processing chamber, the chamber temperature is heated to 25 to 200 ° C, and the water vapor adsorbed in the oil ester film, some of the substance to be cleaned, or the inside of the circuit board is volatilized by heat to generate gas, and the wave change of the gas is caused by the wave change of the liquid material through the wave motion under vacuum, the wave motion from high pressure to 1 atmosphere, or the wave motion from high pressure to vacuum, and the gas can be discharged outside the liquid material.

[0030] The above-mentioned objectives, structure and features of the present invention can be more deeply and concretely understood after the technology, means and effects used by the present invention are described in detail with comparatively good examples and drawings. [Brief description of the drawings]

[0031] [Figure 1] 4 is a flow chart of a flip chip mounting process according to one embodiment of the present invention. [Diagram 2] 4 is a flow chart of a flip chip mounting process according to another embodiment of the present invention. [Diagram 3] 4 is a flow chart of a flip chip mounting process according to another embodiment of the present invention. [Figure 4A] 4 is a cross-sectional view showing the flip chip mounting process of FIGS. 1 to 3. FIG. [Figure 4B] 4 is a cross-sectional view showing the flip chip mounting process of FIGS. 1 to 3. FIG. [Figure 4C] 4 is a cross-sectional view showing the flip chip mounting process of FIGS. 1 to 3. FIG. [Figure 4D] 4 is a cross-sectional view showing the flip chip mounting process of FIGS. 1 to 3. FIG. [Figure 4E] 4 is a cross-sectional view showing the flip chip mounting process of FIGS. 1 to 3. FIG. [Figure 4F] 4 is a cross-sectional view showing the flip chip mounting process of FIGS. 1 to 3. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] 1 and 4A-4F, FIG. 1 is a flow chart of a flip chip mounting process according to an embodiment of the present invention, and FIGS. 4A-4F are schematic cross-sectional views of the flip chip mounting process of FIGS. 1-3. The present invention provides a flip chip mounting process, which includes the following steps: a. (Step 21a) Manufacturing a chip 310, in which an active side surface 311 is provided on the chip 310, and a plurality of conductive bumps 320 (shown in FIG. 4A) are provided on the active side surface 311, and the conductive bumps 320 are solder bumps manufactured by a general bumping process, and their components are at least one of Sn, Ag, Cu, Au, In, Pb, Bi, Pb, Ni, or other materials that are favorable for welding.

[0033] b. (Step 22a) A circuit board 330 is manufactured, in which a support surface 331 is provided on the circuit board 330, and pads 332 (shown in FIG. 4B) are disposed on the support surface 331 in correspondence with the conductive bumps 320, respectively.

[0034] c. (Step 23a) A 3D array nozzle printer 340 applies flux to the surface of each of the pads 332, and the 3D array nozzle printer 340 can appropriately control the application range and application amount of the flux through program settings, thereby effectively avoiding overflow of the flux applied to the surface of each of the pads 332. The flux is applied by predefining the coordinates of the multiple nozzles 350 and the appropriate positions and application range of each of the pads 332 on the circuit board 330, and the 3D array nozzle printer 340 depositing a flux coating layer 341 (shown in FIG. 4C) that imitates multiple 3D figures according to the design, layer by layer. Among them, the flux is a liquid flux, which removes oxides on the surfaces of the solder and the base metal to be welded, so that the welded surface reaches the required cleanliness, prevents re-oxidation of the surface during welding, reduces the surface tension of the liquid solder, and obviously improves the wetting performance.

[0035] d. (Step 24a) Flip and align the chip 310, place the active surface 311 of the chip 310 toward the support surface 331 of the circuit board 330, bond the conductive bumps 320 to the pads 332 (as shown in FIG. 4D) via flux, and perform a metal welding operation to electrically and structurally connect the chip 310 to the pads 332 on the circuit board 330 through the conductive bumps 320, manufacture a flip chip package structure 300, and transmit signals between the circuit board 330 and the chip 310. The metal welding (e.g., reflow) performed here metal-welds the aligned chip 310 and the circuit board 330, and the conductive bumps 320 and the pads 332, and couples the conductive bumps 320 in a heat-melted or semi-melted state to the pads 332 on the support surface 331 of the circuit board 330.

[0036] e. (Step 25a) A liquid material 410 is filled between the circuit board 330 and the chip 310, covering the pre-cleaned material (shown in FIG. 4E) on the circuit board.

[0037] f. (Step 26a) The flip chip package structure 300 containing the liquid material 410 is placed in a sealed processing chamber 510 (shown in FIG. 4F) and the processing chamber 510 is heated to a predetermined temperature, which is between 25°C and 200°C depending on the viscosity of the liquid material, in order to increase the fluidity of the liquid material.

[0038] g. (Step 27a) A vacuum is intermittently created in the gas within the processing chamber 510 by a vacuum generator (not shown) to generate a vacuum wave of up to 1 atmosphere or less to a minimum of 10 -5 A wavy airflow is generated that performs intermittent wavy motions in the range up to atmospheric pressure. The wavy motion of the gas vacuum suction force causes the wavy motion of the liquid material 410. In addition, the liquid material 410 present in the chip 310 and the circuit board 330 does not overflow even if the liquid material 410 generates a larger wave motion by being pulled by the capillary action between them and the surface tension of the liquid material 410, so that the liquid material 410 in contact with the material to be cleaned is rubbed and washed with friction of a larger amplitude by going back and forth, and the material to be cleaned attached to the circuit board 330 is more effectively separated from the circuit board 330, achieving an effect that cannot be achieved by conventional solution cleaning, and the liquid wave motion of the liquid material 410 is pulled by the gas wave motion, reducing the direct energy transmission and reducing the destruction of objects or spattering of the liquid material 410 caused by the wave motion being too large.

[0039] In the above configuration, the viscosity of the liquid flux ranges from 1 centipoise (cps) to 100 centipoise.

[0040] The resist may be a product of the manufacturing process.

[0041] In the above configuration, the liquid material 410 is an underfill, and hard particles are contained within the underfill. The hard particles roll back and forth according to the wave motion of the underfill, and the hard particles increase the rubbing effect of the friction, helping to wash away the material to be removed.

[0042] In the above configuration, the underfill component is an epoxy resin doped with a filler such as silicon dioxide (SiO2) powder.

[0043] 2 and 4A-4F, FIG. 2 is a flow chart of a flip chip mounting process according to another embodiment of the present invention, and FIG. 4A-4F are schematic cross-sectional views of the flip chip mounting process. The present invention provides a flip chip mounting process, which includes the following steps: a. (Step 21b) fabricate a chip 310, in which an active side surface 311 is provided on the chip 310, and a plurality of conductive bumps 320 (shown in FIG. 4A) are provided on the active side surface 311, and the conductive bumps 320 are solder bumps fabricated by a general bumping process, and their components are at least one of Sn, Ag, Cu, Au, In, Pb, Bi, Pb, Ni, or other materials that are favorable for welding.

[0044] b. (Step 22b) A circuit board 330 is manufactured, in which a support surface 331 is provided on the circuit board 330, and pads 332 (shown in FIG. 4B) are disposed on the support surface 331 in correspondence with the conductive bumps 320, respectively.

[0045] c. (Step 23b) A 3D array nozzle printer 340 applies flux to the surface of each of the pads 332, and the 3D array nozzle printer 340 can appropriately control the application range and application amount of the flux through program settings, thereby effectively avoiding overflow of the flux applied to the surface of each of the pads 332. The flux is applied by predefining the coordinates of the multiple nozzles 350 and the appropriate positions and application range of each of the pads 332 on the circuit board 330, and the 3D array nozzle printer 340 depositing a flux coating layer 341 (shown in FIG. 4C) that imitates multiple 3D figures according to the design, layer by layer. Among them, the flux is a liquid flux, which removes oxides on the surfaces of the solder and the base metal to be welded, so that the welded surface reaches the required cleanliness, prevents re-oxidation of the surface during welding, reduces the surface tension of the liquid solder, and obviously improves the wetting performance.

[0046] d. (Step 24b) Flip and align the chip 310, place the active surface 311 of the chip 310 toward the support surface 331 of the circuit board 330, bond the conductive bumps 320 to the pads 332 (as shown in FIG. 4D) via flux, and perform a metal welding operation to electrically and structurally connect the chip 310 to the pads 332 on the circuit board 330 through the conductive bumps 320, manufacture the flip chip package structure 300, and transmit signals between the circuit board 330 and the chip 310. The metal welding (e.g., reflow) performed here metallizes the aligned chip 310 and the circuit board 330, and the conductive bumps 320 and the pads 332, and couples the conductive bumps 320 in a heat-melted or semi-melted state to the pads 332 on the support surface 331 of the circuit board 330.

[0047] e. (Step 25b) A liquid material 410 is filled between the circuit board 330 and the chip 310, covering the pre-cleaned material (shown in FIG. 4E) on the circuit board.

[0048] f. (Step 26b) The flip chip package structure 300 containing the liquid material 410 is placed in a sealed processing chamber 510 (shown in FIG. 4F) and the processing chamber 510 is heated to a predetermined temperature, which is between 25°C and 200°C depending on the viscosity of the liquid material, in order to increase the fluidity of the liquid material.

[0049] g. (Step 27b) By intermittently generating pressure and vacuum for the gas in the processing chamber 510 using a pressure increase / decrease device (not shown) and a vacuum generator (not shown), a high pressure to vacuum wave is generated, ranging from a maximum of 50 atmospheres to a minimum of 10 -5 A wavy airflow is generated that performs intermittent wavy motions in the range up to atmospheric pressure. The wavy motion of the gas causes the wavy motion of the liquid material 410. In addition, the liquid material 410 present in the chip 310 and the circuit board 330 does not overflow even if a larger wave motion is generated because the capillary action between them and the surface tension of the liquid material 410 attracts the liquid material 410, so the liquid material 410 in contact with the material to be cleaned is rubbed and washed by reciprocating friction, and the material to be cleaned that is attached to the circuit board 330 is more effectively separated from the circuit board 330, achieving an effect that cannot be achieved by conventional solution cleaning, and the liquid wave motion of the liquid material 410 is attracted by the gas wave motion, reducing the direct energy transmission and reducing the destruction of objects or spattering of the liquid material 410 that occurs due to the wave motion being too large.

[0050] In the above configuration, the viscosity of the liquid flux ranges from 1 centipoise (cps) to 100 centipoise.

[0051] In the above configuration, the to-be-cleaned material is a flux, a flux residue, an oil ester, a photoresist, or a product of a manufacturing process.

[0052] In the above configuration, the liquid material 410 is an underfill, and hard particles are contained within the underfill. The hard particles roll back and forth according to the wave motion of the underfill, and the hard particles increase the rubbing effect of the friction, helping to wash away the material to be removed.

[0053] In the above configuration, the underfill component is an epoxy resin doped with a filler such as silicon dioxide (SiO2) powder.

[0054] 3 and 4A-4F, FIG. 3 is a flow chart of a flip chip mounting process according to another embodiment of the present invention, and FIG. 4A-4F are schematic cross-sectional views of the flip chip mounting process. The present invention provides a flip chip mounting process, which includes the following steps: a. (Step 21c) fabricate a chip 310, in which an active side surface 311 is provided on the chip 310, and a plurality of conductive bumps 320 (shown in FIG. 4A) are provided on the active side surface 311, and the conductive bumps 320 are solder bumps fabricated by a general bumping process, and their components are at least one of Sn, Ag, Cu, Au, In, Pb, Bi, Pb, Ni, or other materials that are favorable for welding.

[0055] b. (Step 22c) A circuit board 330 is manufactured, in which a support surface 331 is provided on the circuit board 330, and pads 332 (shown in FIG. 4B) are disposed on the support surface 331 in correspondence with the conductive bumps 320, respectively.

[0056] c. (Step 23c) A 3D array nozzle printing device 340 applies flux to the surface of each of the pads 332, and the 3D array nozzle printing device 340 can appropriately control the application range and application amount of the flux through program settings, thereby effectively avoiding overflow of the flux applied to the surface of each of the pads 332. The flux is applied by predefining the coordinates of the multiple nozzles 350 and the appropriate positions and application range of each of the pads 332 on the circuit board 330, and the 3D array nozzle printing device 340 depositing a flux coating layer 341 (shown in FIG. 4C) that imitates multiple 3D figures according to the design, layer by layer. Among them, the flux is a liquid flux, which removes oxides on the surfaces of the solder and the base metal to be welded, so that the welded surface reaches the required cleanliness, prevents re-oxidation of the surface during welding, reduces the surface tension of the liquid solder, and obviously improves the wetting performance.

[0057] d. (Step 24c) Flip and align the chip 310, place the active surface 311 of the chip 310 toward the support surface 331 of the circuit board 330, bond the conductive bumps 320 to the pads 332 (as shown in FIG. 4D) via flux, and perform a metal welding operation to electrically and structurally connect the chip 310 to the pads 332 on the circuit board 330 through the conductive bumps 320, manufacture the flip chip package structure 300, and transmit signals between the circuit board 330 and the chip 310. The metal welding (e.g., reflow) performed here metallizes the aligned chip 310 and the circuit board 330, and the conductive bumps 320 and the pads 332, and couples the conductive bumps 320 in a heat-melted or semi-melted state to the pads 332 on the support surface 331 of the circuit board 330.

[0058] e. (Step 25c) A liquid material 410 is filled between the circuit board 330 and the chip 310, covering the pre-cleaned material (shown in FIG. 4E) on the circuit board.

[0059] f. (Step 26c) The flip chip package structure 300 including the liquid material 410 is placed in a sealed processing chamber 510 (shown in FIG. 4F) and the processing chamber 510 is heated to a predetermined temperature, which is between 25°C and 200°C depending on the viscosity of the liquid material, in order to increase the fluidity of the liquid material.

[0060] g. (Step 27c) A pressure increase / decrease device (not shown) is used to intermittently increase / decrease the gas in the processing chamber 510, thereby generating a wavy airflow that performs intermittent wavy motion from high pressure to 1 atmosphere, with a maximum of 50 atmospheres and a minimum of 1 atmosphere. The wavy motion of the gas causes a wavy motion of the liquid material 410. In addition, the liquid material 410 present on the chip 310 and the circuit board 330 does not overflow even if a larger wave is generated by the capillary action between them and the surface tension of the liquid material 410, so that the liquid material 410 in contact with the material to be cleaned is rubbed and washed by reciprocating friction, and the material to be cleaned attached to the circuit board 330 is more effectively separated from the circuit board 330, achieving an effect that could not be achieved by conventional solution cleaning, and the liquid wave of the liquid material 410 is attracted by the gas wave, reducing the direct energy transmission and reducing the destruction of objects or spattering of the liquid material 410 caused by the wave being too large.

[0061] In the above configuration, the viscosity of the liquid flux ranges from 1 centipoise (cps) to 100 centipoise.

[0062] In the above configuration, the to-be-cleaned material is a flux, a flux residue, an oil ester, a photoresist, or a product of a manufacturing process.

[0063] In the above configuration, the liquid material 410 is an underfill, and hard particles are contained within the underfill. The hard particles roll back and forth according to the wave motion of the underfill, and the hard particles increase the rubbing effect of the friction, helping to wash away the material to be removed.

[0064] In the above configuration, the underfill component is an epoxy resin doped with a filler such as silicon dioxide (SiO2) powder.

[0065] The technical features of the present invention have been described above in detail with reference to the preferred embodiments of the present invention. However, those skilled in the art may make modifications and amendments to the present invention without departing from the spirit and principles of the present invention, and such modifications and amendments shall be within the scope defined in the following claims. [Explanation of symbols]

[0066] 21a-27a: Process 21b-27b: Process 21c-27c: Process 300: Flip chip package structure 310: Chip 311: Active surface 320: Conductive bump 330: Circuit board 331: Support surface 332: Pad 340: 3D array nozzle printing device 341: Flux coating layer 350: Nozzle 410: Liquid material 510: Processing chamber

Claims

1. a. a chip manufacturing process, comprising: manufacturing a chip having an active side and having a plurality of conductive bumps disposed on a surface of the active side; b. a circuit board manufacturing process, comprising: a support surface provided on the circuit board; and a welding pad disposed on the support surface in correspondence with each of the conductive bumps; c. Using a 3D array nozzle printing device, by setting a program of the 3D array nozzle printing device, a process of coating flux on the surface of each of the pads so that the coating range and coating amount of the flux can be appropriately controlled; d. flipping the chip, aligning the active surface of the chip to face the support surface of the circuit board, and bonding each of the conductive bumps to each of the pads via flux, and performing a metal welding operation to electrically and structurally connect the chip to each of the pads of the circuit board by each of the conductive bumps, thus fabricating a flip chip package structure; e. filling a liquid material between the circuit board and the chip so as to cover the material on the circuit board that has not yet been cleaned; f. placing the flip chip package structure containing the liquid material in an enclosed processing chamber and heating the processing chamber to a predetermined temperature, the predetermined temperature being between 25°C and 200°C depending on the viscosity of the liquid material; g. A vacuum generator is used to intermittently generate a vacuum on the gas in the processing chamber, thereby creating a vacuum wave having a maximum of 1 atmosphere or less and a minimum of 10 -５ a wave-like airflow is generated that performs intermittent wave motion in a range up to atmospheric pressure, and a wave change in the liquid material is caused by a wave change in the gas vacuum suction force, so that the liquid material in contact with the material to be cleaned is kneaded and washed with friction of even larger amplitude as it goes back and forth, thereby more effectively separating the material to be cleaned that is attached to the circuit board from the circuit board.

2. a. a chip manufacturing process, comprising: manufacturing a chip having an active side and having a plurality of conductive bumps disposed on a surface of the active side; b. a circuit board manufacturing process, comprising: a support surface provided on the circuit board; and a welding pad disposed on the support surface in correspondence with each of the conductive bumps; c. Using a 3D array nozzle printing device, by setting a program of the 3D array nozzle printing device, the flux is applied to the surface of each of the pads so that the application range and application amount of the flux can be appropriately controlled; d. flipping the chip, aligning the active surface of the chip to face the support surface of the circuit board, and bonding each of the conductive bumps to each of the pads via flux, and performing a metal welding operation to electrically and structurally connect the chip to each of the pads of the circuit board by each of the conductive bumps, thus fabricating a flip chip package structure; e. filling a liquid material between the circuit board and the chip so as to cover the material on the circuit board that has not yet been cleaned; f. placing the flip chip package structure containing the liquid material in an enclosed processing chamber and heating the processing chamber to a predetermined temperature, the predetermined temperature being between 25°C and 200°C depending on the viscosity of the liquid material; g. By intermittently generating pressure and vacuum for the gas in the processing chamber using a pressure increase / decrease device and a vacuum generator, a wave from high pressure to vacuum is generated, with a maximum of 50 atmospheres and a minimum of 10 -５ a wave-like airflow is generated that performs intermittent wave motion in a range up to atmospheric pressure, and the wave motion change of the gas causes a wave motion change of the liquid material, kneading and washing the liquid material that comes into contact with the substance to be cleaned by reciprocating friction, and more effectively separating the substance to be cleaned that is attached to the circuit board from the circuit board.

3. a. a chip manufacturing process, comprising: manufacturing a chip having an active side and having a plurality of conductive bumps disposed on a surface of the active side; b. a circuit board manufacturing process, comprising: a circuit board having a support surface on which weld pads are disposed in correspondence with the conductive bumps; c. Using a 3D array nozzle printing device, by setting a program of the 3D array nozzle printing device, a process of coating flux on the surface of each of the pads so that the coating range and coating amount of the flux can be appropriately controlled; d. flipping the chip, aligning the active surface of the chip to face the support surface of the circuit board, and bonding each of the conductive bumps to each of the pads via flux, and performing a metal welding operation to electrically and structurally connect the chip to each of the pads of the circuit board by each of the conductive bumps, thus fabricating a flip chip package structure; e. filling a liquid material between the circuit board and the chip so as to cover the material on the circuit board that has not yet been cleaned; f. placing the flip chip package structure containing the liquid material in an enclosed processing chamber and heating the processing chamber to a predetermined temperature, the predetermined temperature being between 25°C and 200°C depending on the viscosity of the liquid material; g. A flip chip mounting process including a step of intermittently generating pressure increase and decrease for the gas in the processing chamber using a pressure increase and decrease device to generate a wave-like airflow that performs intermittent wave motion from high pressure to 1 atmosphere, with a maximum of 50 atmospheres and a minimum of 1 atmosphere, the wave motion of the gas causing a wave motion change in the liquid material, kneading and washing the liquid material in contact with the material to be cleaned by back and forth friction, and more effectively separating the material to be cleaned adhering to the circuit board from the circuit board.

4. 4. The flip chip mounting process according to claim 1, 2 or 3, wherein the flux is a liquid flux, and the viscosity of the liquid flux is in the range of 1 centipoise (cps) to 100 centipoise.

5. 4. The flip chip mounting process of claim 1, 2 or 3, wherein the to-be-cleaned material is flux, flux residue, oil ester, photoresist or a by-product of manufacturing.

6. the liquid material is an underfill, The underfill contains hard particles; 4. The flip chip mounting process according to claim 1, 2 or 3, wherein the hard particles roll back and forth according to the wave motion of the underfill, and the hard particles increase the effect of rubbing and cleaning the surface.

7. 7. The flip chip mounting process according to claim 6, wherein the underfill component is an epoxy resin.

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