Flux supply device and component mounting device

Abstract

To provide a flux supply device and a component mounting device for reducing the amount of flux rising upward.SOLUTION: A flux supply device includes a stage having a recess for storing flux, a flux storage unit having a through-hole penetrating in the vertical direction, an opening below the through-hole being closed by the stage for storing flux in the through-hole, and a drive unit that moves the stage and the flux storage unit relative to each other. The flux storage unit has a film forming unit at an end part of the opening side downward that levels the surface of the flux stored in the recess. The flux storage unit has a first protruding unit extending inward from the inner surface above the film forming unit and lower than half the height of the through-hole.SELECTED DRAWING: Figure 15

Description

[Technical field]

[0001] The present disclosure relates to a flux supplying device that supplies flux, a component mounting device including the flux supplying device, a flux supplying method, and a component mounting method. [Background technology]

[0002] Conventionally, in component mounting devices that mount electronic components such as ICs on a substrate, flux is applied to remove oxides and dirt from the lands on the workpiece (substrate) before the components are soldered to the workpiece.

[0003] For example, Patent Document 1 describes a flux reservoir device that stores flux to be transferred. Flux is supplied from a flux reservoir (flux spot) to a recess in a stage, and the bottom surface of the flux reservoir smoothes the surface of the flux. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2016 / 075982 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in Patent Document 1, when a highly viscous flux is used, the flux tends to rise along the wall of the flux reservoir that supplies the flux, which can cause gaps in the flux film stored in the recess of the stage. In this way, the flux is not uniformly formed in the recess of the stage, which can cause cases where the flux cannot be transferred to the workpiece by the transfer unit.

[0006] Therefore, an object of the present disclosure is to provide a flux supplying device and a component mounting device that reduce flux leakage. [Means for solving the problem]

[0007] The flux supply device of the present disclosure includes a stage having a recess for storing flux, a flux storage section having a through hole penetrating in the vertical direction, the lower opening of the through hole being closed by the stage, and storing flux in the through hole, and a drive section for relatively moving the stage and the flux storage section. The through hole is surrounded by the inner side surface of the flux storage section. When the drive section moves the flux storage section relative to the stage and positions the flux storage section above the recess, the flux in the flux storage section is supplied to the recess. The flux storage section has a film forming section at the lower opening side end for flattening the surface of the flux stored in the recess. The flux storage section has a first protrusion extending inward from the inner side surface above the film forming section and below half the height of the through hole.

[0008] The component mounting device of the present disclosure includes the above-mentioned flux supply device and a transfer unit that brings a held object into contact with the flattened flux. The transfer unit includes a mounting head that picks up a component as the object from the component supply unit and mounts the component in contact with the flux on a substrate, or a transfer head having a plurality of transfer pins as the object for transferring the flux to the substrate. Effect of the Invention

[0009] According to the present disclosure, it is possible to provide a flux supplying device and a component mounting device that reduce flux rise. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a side view showing a schematic configuration of a component mounting device including a flux transfer unit according to an embodiment of the present disclosure. [Diagram 2] A side view of the component mounting device in a state where the transfer head is located at the retracted position. [Diagram 3] Side view of the component mounting device with flux being applied to the transfer pin [Figure 4] A side view of the component mounting device with the transfer head located at the mounting position. [Diagram 5] Schematic side view of the transfer head [Figure 6] Schematic top perspective view of the transfer head [Figure 7] FIG. 2 is a plan view of the flux supplying device with the stage located at the access position; [Figure 8] Perspective view of the flux supply unit [Figure 9] Cross-sectional view of line IX-IX in Figure 8 [Figure 10] Cross-sectional view of line XX in FIG. [Figure 11] Cross section of line XI-XI in Figure 7 [Figure 12] FIG. 2 is a plan view of a flux supplying device showing one step of flux supplying; [Figure 13] FIG. 2 is a plan view of a flux supplying device showing one step of flux supplying; [Figure 14] Cross section of Cs-Cs line in Figure 12 [Figure 15] Cross section of Cs-Cs line in Figure 12 [Figure 16] Block diagram showing the functional configuration of the control unit [Figure 17] Flowchart of component mounting method [Figure 18] 1 is a cross-sectional view of a flux supply unit according to a first modified example. [Figure 19] 1 is a cross-sectional view of a flux supply unit according to a first modified example. [Figure 20] 1 is a plan view of a flux supply unit according to a first modified example; [Figure 21] 11 is a cross-sectional view of a flux supply unit according to a second modified example. [Figure 22] 3 is a cross-sectional view of a flux supply unit according to a third modified example. [Diagram 23] 11 is a cross-sectional view of a flux supply unit according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The flux supplying device according to the first aspect of the present disclosure includes a stage having a recess for storing flux, a flux storage section having a through hole penetrating in the vertical direction, the lower opening of the through hole being closed by the stage, and storing flux in the through hole, and a drive section for relatively moving the stage and the flux storage section. The through hole is surrounded by the inner side surface of the flux storage section. When the drive section moves the flux storage section relative to the stage and positions the flux storage section above the recess, the flux in the flux storage section is supplied to the recess. The flux storage section has a film forming section at the lower opening end for flattening the surface of the flux stored in the recess. The flux storage section has a first protrusion extending inward from the inner side surface above the film forming section and below half the height of the through hole.

[0012] Because the first protrusion extends inward from the inner surface below the through hole, the flux moving up the through hole along the inner surface hits the first protrusion, and is given a force that rotates it downward. This causes the flux to return toward the lower opening, and the flux is continuously supplied to the recess of the stage, preventing the flux in the recess from becoming smeared or having gaps.

[0013] According to a second aspect of the present disclosure, in the flux supplying device of the first aspect, the first protrusion extends in a direction along a moving direction in which the stage and the flux reservoir are moved relatively by the drive unit.

[0014] According to a third aspect of the present disclosure, in the flux supplying device of the first or second aspect, the first protrusion has an inclined surface extending inwardly from the inner side surface.

[0015] According to a fourth aspect of the present disclosure, in the flux supply device of the second aspect, the flux storage portion includes, as part of the inner surface, a pair of opposing side walls extending in a direction intersecting the movement direction and in the vertical direction, and a first protrusion portion is provided on each of the pair of opposing side walls.

[0016] According to a fifth aspect of the present disclosure, the flux supplying device of the second aspect includes an agitating portion that agitates the flux present in the recess, and the agitating portion is positioned so as to face the first protrusion portion in the through hole of the flux storage portion.

[0017] According to a sixth aspect of the present disclosure, in the flux supply device of the fifth aspect, the stirring part has a main body extending in a direction intersecting the direction of movement and in the vertical direction, and a second protrusion extending from the inner surface of the lower side of the main body of the stirring part toward the first protrusion above the film forming part and below half the height of the through hole.

[0018] According to a seventh aspect of the present disclosure, in the flux supply device of any of the first to third aspects, the drive unit moves the stage back and forth between a first position where the object is brought into contact with the flux and a second position different from the first position, and the first protrusion extends from the inner surface of the through hole in a direction opposite to the direction in which the stage moves from the second position to the first position.

[0019] A component mounting device according to an eighth aspect of the present disclosure includes the flux supplying device according to any one of the first to seventh aspects and a transfer unit that brings a held object into contact with the flattened flux. The transfer unit includes a mounting head that picks up a component as the object from the component supplying unit and mounts the component in contact with the flux onto a substrate, or a transfer head having a plurality of transfer pins as an object for transferring the flux onto the substrate.

[0020] Hereinafter, exemplary embodiments of the flux supplying device and the component mounting device according to the present disclosure will be described with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present disclosure.

[0021] [Embodiment Mode] (Overall composition) Hereinafter, a component mounting device 50 according to an embodiment of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a side view showing a schematic configuration of a component mounting device 50 including a flux transfer unit 60 according to an embodiment of the present disclosure.

[0022] The component mounting device 50 has a component supply unit 51, a mounting head 52, a stage 53, a control unit 56, and a flux transfer unit 60. The component mounting device 50 further has a base 4, a touch panel 5, a component supply unit movement unit 78, a pickup head 83, a stage movement unit 80, and a stage tilt adjustment unit 81. The touch panel 5, the stage 53, the stage movement unit 80, the stage tilt adjustment unit 81, and the control unit 56 are also components of the flux transfer unit 60.

[0023] The component mounting device 50 mounts components 61, such as semiconductor chips, on a substrate 62 serving as a workpiece. A component supply unit 51 and a stage 53 that holds the substrate 62 are arranged on the base 4 in the Y direction.

[0024] The component supply unit 51 supplies the components 61. The component supply unit 51 is provided on the component supply unit movement unit 78. The component supply unit movement unit 78 is controlled by the control unit 56, and moves the component supply unit 51 in the X direction and the Y direction. A plurality of components 61 are held on the upper part of the component supply unit 51. The components 61 are held on the upper part of the component supply unit 51 in a state in which they are placed on a tray or in a state in which they are attached on an adhesive sheet.

[0025] Stage 53 is provided above stage movement unit 80. Stage movement unit 80 is controlled by control unit 56 and moves stage 53 in the X and Y directions. Stage 53 carries in substrate 62, for example, by a transport rail, and positions and holds substrate 62 at a position where component 61 is to be mounted. Stage 53 also carries out substrate 62 on which component 61 is mounted, for example, by a transport rail.

[0026] Inside the stage 53, there are provided a stage heating unit 63 that heats the held substrate 62, and a thermometer (not shown) that measures the temperature of the heated stage 53. The stage heating unit 63 is controlled by the control unit 56, and heats the stage 53 to a specified temperature. The temperature measured by the thermometer inside the stage 53 is transmitted to the control unit 56.

[0027] The stage tilt adjustment unit 81 is provided inside the stage movement unit 80, and can adjust the tilt with respect to the transfer head 1 by rotating the stage 53 around two axes (X-axis and Y-axis) that are perpendicular to the surface of the stage 53.

[0028] The component 61 is held on the component supply unit 51 with the bumps formed on the back surface of the component 61 facing upward. A pick-up head 83 is disposed above the component supply unit 51. The pick-up head 83 picks up and removes the component 61 from the component supply unit 51. The pick-up head 83 rotates about the X-axis as the rotation axis by a pick-up head drive unit (not shown) controlled by the control unit 56, and further moves to a transfer position Pc, which will be described later. That is, the pick-up head 83 holds the component 61 at the transfer position Pc with the bumps facing downward.

[0029] A mounting head 52 is disposed above the pickup head 83 and the component supply unit 51. The mounting head 52 holds the supplied component 61 and mounts it on a substrate 62 supported by the stage 53. The mounting head 52 moves in the Y direction by a mounting head drive mechanism 86 controlled by the control unit 56. A tool 87 that adsorbs and holds the component 61 is provided at the lower end of the mounting head 52. The mounting head 52 receives the component 61 by adsorbing it from the pickup head 83 at the transfer position Pc, moves the component 61 to a mounting position on the substrate 62 held by the stage 53, and mounts the component 61 on the substrate 62.

[0030] The mounting head 52 is provided with a component heating unit 88 that heats the component 61 picked up by the tool 87, and a tool thermometer 88a that measures the temperature of the tool 87 heated by the component heating unit 88. The component heating unit 88 is controlled by the control unit 56, and heats the tool 87 to a specified temperature. The temperature of the tool 87 measured by the tool thermometer 88a is transmitted to the control unit 56.

[0031] The mounting head 52 is provided with a tool lifting mechanism 89 that raises and lowers the tool 87. The mounting head 52 is also provided with a pressure sensor 89a that measures the load with which the tool lifting mechanism 89 presses the tool 87 holding the component 61 against the substrate 62. The tool lifting mechanism 89 is controlled by the control unit 56, and lowers the tool 87 so that the tool 87 places the component 61 on the substrate 62 with a specified load. The load measured by the pressure sensor 89a is transmitted to the control unit 56.

[0032] The mounting head 52 is provided with an ultrasonic oscillator 90 that ultrasonically vibrates the tool 87. The ultrasonic oscillator 90 is controlled by the control unit 56, and when mounting the component 61 on the board 62 by ultrasonic bonding, the ultrasonic oscillator 90 ultrasonically vibrates the tool 87 with designated ultrasonic power, amplitude, and frequency. The touch panel 5 that is communicably connected to the control unit 56 displays an operation menu and information on the operating status of the component mounting device 50 on its display unit, and data can be input to the control unit 56 and the component mounting device 50 can be operated by using operation buttons displayed on the display unit. The touch panel 5 may be a portable terminal or may be a stationary terminal. The mounting head 52 may be provided with a component heating unit (not shown) that heats the component 61 that has been picked up by the tool 87 when the component 61 is mounted on the board 62.

[0033] (Configuration of flux transfer unit) The flux transfer unit 60 transfers flux to lands on which components 61 are mounted on a substrate 62 held on a stage 53. The flux transfer unit 60 includes a transfer head 1 to which one ends of a plurality of transfer pins 12 are fixed, a head moving unit 54, a head lifting mechanism 58, and a flux supply device 55.

[0034] The transfer head 1 is a member that holds flux on the tips of transfer pins 12 (described later) and transfers the flux onto the surface of a substrate 62. In this specification, the term "flux" may include not only flux alone but also solder paste containing flux.

[0035] The head moving unit 54 moves the transfer head 1 in the horizontal direction to the mounting position Pa and the retracted position Pb.

[0036] The head lifting mechanism 58 raises and lowers the transfer head 1 relative to the stage 53 and the flux supply device 55. Therefore, the head lifting mechanism 58 raises and lowers the transfer head 1 in the vertical direction at the mounting position Pa and the retreat position Pb. The head lifting mechanism 58 has a motor (not shown) that raises and lowers the transfer head 1, and an arm 58a that is moved in the vertical direction by the motor.

[0037] The flux supplying device 55 supplies flux to the transfer head 1. The flux supplying device 55 will be described in detail later.

[0038] The control unit 56 is configured to control the component mounting device 50. The control unit 56 is a circuit including a semiconductor element, and includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that executes a program to realize a predetermined function. The control unit 56 executes a program stored in a storage unit 65 such as a memory or SSD to realize its function. The control unit 56 may be provided as a dedicated unit for the flux transfer unit 60, may be used together with the control unit of the component mounting device 50 as in the embodiment, or may be included in a management device connected by a network. Therefore, the flux transfer unit 60 may be configured as a flux transfer system using the control unit 56 included in another device.

[0039] Next, the movement of the transfer head 1 will be described with reference to Fig. 2 to Fig. 4. Fig. 2 is a side view of the component mounting device in a state where the transfer head 1 is located at the retracted position Pb. Fig. 3 is a side view of the component mounting device in a state where flux is being applied to the transfer pins 12. Fig. 4 is a side view of the component mounting device in a state where the transfer head 1 is located at the mounting position Pa.

[0040] 2, the mounting head 52 is located at the mounting position Pa directly above the substrate 62 on the stage 53, and the transfer head 1 is located at the retreat position Pb away from the mounting position Pa. Also, as shown in FIG. 3, even if the mounting head 52 is located at a position away from the mounting position Pa, before the component 61 is mounted on the substrate 62, the transfer head 1 is located at the retreat position Pb and performs an operation of applying flux to the transfer pins 12 of the transfer head 1.

[0041] 2 and 3, when the transfer head 1 is located at the retracted position Pb, the head lifting mechanism 58 lowers the transfer head 1 toward the flux supply device 55. When the tip of the transfer pin 12 comes into contact with the flux 57 supplied by the flux supply device 55, the flux adheres to the tip of the transfer pin 12.

[0042] 4, the head lifting mechanism 58 lifts the transfer head 1 holding the flux, and the head moving unit 54 moves it above the stage 53 at the mounting position Pa. At the mounting position Pa, the head lifting mechanism 58 lowers the transfer head 1 toward the substrate 62. When the transfer head 1 comes into contact with the substrate 62, the flux is transferred to the substrate 62.

[0043] The configuration of the transfer head 1 will be described with reference to Figures 5 and 6. Figure 5 is a schematic side view of the transfer head 1, and Figure 6 is a schematic top view of the transfer head 1. In each figure, the transfer pins 12 are shown enlarged and exaggerated for easy understanding.

[0044] As shown in FIG. 5, the transfer head 1 has a base 2 and a plurality of transfer pins 12. The base 2 supports the plurality of transfer pins 12 and is a block made of metal or resin. The base 2 may be a rectangular parallelepiped or a shape in which a part of a cylinder is cut out in a plane in the height direction. The base 2 is rotatable around the X-axis and the Y-axis, and is adjusted so as to be parallel to the stage 53. The plurality of transfer pins 12 each protrude downward from the lower surface 2a of the base 2 at the same predetermined angle, for example, protrude vertically.

[0045] The transfer pins 12 adhere flux to the bottom surfaces 12a of the transfer pins 12 and transfer the flux to predetermined lands on the substrate 62. The transfer pins 12 have a columnar structure. The multiple transfer pins 12 are arranged in a predetermined pattern corresponding to the pattern of the lands on which the components 61 are mounted on the substrate 62. In Fig. 5 and Fig. 6, the transfer pins 12 are arranged in a matrix of 3 rows and 5 columns as an example, and the transfer head 1 has 15 transfer pins 12, but the transfer head 1 may have, for example, 100 transfer pins 12 in 10 rows and 10 columns.

[0046] The shape of the bottom surface 12a of the transfer pin 12 is not limited to a circle, but may be an ellipse or a rectangle. The transfer pin 12 has a diameter and height of, for example, an order of 100 μm. The multiple transfer pins 12 may have the same structure as each other or different structures from each other. Specifically, the multiple transfer pins 12 may have the same diameter or different diameters. In addition, the intervals between the multiple transfer pins 12 may be equal or different. The transfer pins 12 are made of resin or metal.

[0047] A transfer pin 12 is disposed in the center of a lower surface 2a of the base 2. The base 2 has a peripheral region 2aa on the lower surface 2a outside the region where the transfer pin 12 protrudes from the base 2.

[0048] (Configuration of flux supply device) Next, the flux supplying device 55 will be described with reference to Fig. 7. Fig. 7 is a plan view of the flux supplying device 55 with the stage located at the access position.

[0049] The flux supplying device 55 includes a stage 101 , a driving section 103 , a flux supplying unit 105 , a base 107 , and a pair of rails 109 .

[0050] A pair of rails 109 are disposed on a rectangular base 107. A stage 101 is disposed on the pair of rails 109 so as to be capable of sliding.

[0051] The stage 101 supplies flux to the transfer head 1. The stage 101 is, for example, a rectangular plate made of metal or resin, and has a recess 111 on one end side. The flux is stored in the recess 111. The depth of the recess 111 is, for example, 5 to 30 μm.

[0052] The driving unit 103 reciprocates the stage 101 between an access position Pd and a position Pf (see FIGS. 7 and 13). The driving unit 103 includes an actuator 113, a rod 115, and a fixed block 117.

[0053] The actuator 113 reciprocates the rod 115 and a fixed block 117 fixed to the tip of the rod 115. The fixed block 117 is fixed to the other end of the stage 101. Therefore, the stage 101 reciprocates together with the reciprocating movement of the rod 115.

[0054] The flux supply unit 105 will be described with reference to Fig. 7 to Fig. 11. Fig. 8 is a perspective view of the flux supply unit. Fig. 9 is a cross-sectional view taken along line IX-IX in Fig. 8. Fig. 10 is a cross-sectional view taken along line XX in Fig. 8. Fig. 11 is a cross-sectional view taken along line XI-XI in Fig. 7.

[0055] The flux supplying unit 105 supplies flux to the recessed portion 111 of the stage 101 and removes any transfer marks left in the recessed portion 111. The flux supplying unit 105 includes a flux storage portion 121, a film forming portion 123, a stirring portion 125, and a pair of arms 127.

[0056] The flux storage section 121 has a hollow cylindrical through-hole 121a and openings 121b, 121c at both the top and bottom. The flux storage section 121 stores flux therein. As shown in FIG. 11, one opening 121b of the flux storage section 121 is blocked by the top surface of the stage 101, so that the flux inside the flux storage section 121 does not leak out to the outside. The other opening 121c of the flux storage section 121 is open. A pair of arms 127 are connected to the flux storage section 121. The outer ends of the arms 127 are fixed to the base 107 (see FIG. 7).

[0057] The stirring part 125 is disposed inside the flux storage part 121. The stirring part 125 stirs the flux in the recess 111 of the stage 101 to remove the transfer marks. The stirring part 125 is, for example, a plate-like shape made of metal or resin. The stirring part 125 has a fastening part 129 fixed to the arm 127 against the elastic force of the coil spring 131. Therefore, the stirring part 125 is biased toward the stage 101 side and contacts the upper surface of the stage 101. In addition, since the stirring part 125 is biased toward the stage 101 side, the flux storage part 121 connected to the stirring part 125 via the arm 127 is also biased toward the stage 101 side, and the degree of adhesion between the lower end of the flux storage part 121 and the stage 101 can be increased. This can further reduce the leakage of flux from the flux storage part 121 to the stage 101.

[0058] 10 and 11, the lower end of the flux storage section 121 includes a film-forming section 123. The film-forming section 123 flattens the surface of the flux in the recess 111 of the stage 101. The film-forming section 123 is configured by connecting an inwardly inclined surface at the lower end of the outer surface of the side wall 121e of the flux storage section 121 and a flat surface at the lower end of the side wall 121e of the flux storage section 121, which has a flat shape.

[0059] A first protrusion 133 extending in a direction intersecting the direction in which the stage 101 reciprocates is disposed in the flux storage section 121. The first protrusion 133 prevents the flux 57 from ascending along the wall surface in the flux storage section 121. The first protrusion 133 has an inclined surface 133a extending inward from the inner side surface 121d, a surface 133b extending upward from the inclined surface 133a parallel to the inner side surface 121d, and a surface 133c extending outward from the through hole 121a perpendicular to the surface 133b. Note that the surface 133b may be omitted and the upper side of the inclined surface 133a may be directly connected to the inner side of the surface 133c.

[0060] The flux reservoir 121 includes, as a part of its inner surface, a pair of opposing side walls 121e extending in the vertical direction and in a direction intersecting the moving direction of the stage 101. The inclined surface 133a, the surface 133b, and the surface 133c extend in a direction intersecting the moving direction of the stage 101 of the side wall 121e, for example, in a vertical direction.

[0061] The height Hb from the lower end of the side wall 121e (the lower end of the through hole 121a) to the upper end of the inclined surface 133a is half or less of the height Hc of the side wall 121e (the height of the through hole 121a), and may be, for example, a quarter or less. The height Hb is, for example, 4 mm or less. Moreover, the height Ha of the upper end of the inclined surface 133a is, for example, 1 mm or more from the lower end of the side wall 121e (the lower end of the through hole 121a).

[0062] (Flux supply) Next, a method of supplying flux will be described with reference to Figures 7, 12, and 13. Figures 12 and 13 are plan views of a flux supplying device 55 showing one step of supplying flux.

[0063] As the transfer head 1 moves to the retracted position Pb to attach the flux to the transfer pins 12, the control unit 56 controls the drive unit 103 to protrude the rod 115 and move the stage 101 to the access position Pd. The transfer head 1 descends into the recessed portion 111 of the stage 101 at the access position Pd, and the flux in the recessed portion 111 adheres to the transfer pins 12. Thereafter, the transfer head 1 rises and moves to the mounting position Pa.

[0064] After contacting the transfer pin 12, the surface of the flux in the recess 111 is formed with an uneven shape in which the portion that contacted the transfer pin 12 is recessed. If the next transfer is performed in this state, the flux will not adhere properly to the transfer pin 12, which may cause a defective bond between the board 62 and the component 61.

[0065] After the transfer pin 12 comes into contact with the flux in the recess 111, the driving unit 103 moves the stage 101 back and forth once, whereby the flux supply unit 105 flattens the surface of the flux.

[0066] As shown in FIG. 7, when the actuator 113 retracts the rod 115, the stage 101 at the access position Pd moves toward the drive unit 103, and the recess 111 of the stage 101 moves toward the flux supply unit 105 (see FIG. 11).

[0067] 12, at a supply position Pe where the recess 111 of the stage 101 passes under the flux supply unit 105, the flux 57 in the flux storage part 121 is supplied into the recess 111 as shown in Fig. 14. Also, the stirring part 125 is pressed against the recess 111 by a biasing force along the shape of the recess 111, and thus stirs the flux 57 in the recess 111. This removes the transfer marks left on the flux 57 in the recess 111.

[0068] The width Wa of the agitating portion 125 is smaller than the width Wb of the recessed portion 111. Therefore, the flux 57 scraped out by the agitating portion 125 travels around the outside of the outer periphery of the agitating portion 125 and returns to the recessed portion 111.

[0069] Since the length of the flux reservoir 121 in the width direction is longer than the width Wb of the recess 111, a part of the wall of the flux reservoir 121 slides on the stage 101. Therefore, the flux reservoir 121 is supported by the stage 101 and does not enter the recess 111.

[0070] 13, the actuator 113 retracts the rod 115 to the maximum, and the stage 101 is positioned at a position Pf closest to the driving unit 103. At this time, the flux supply unit 105 is positioned closer to one end of the stage 101 than the recess 111.

[0071] Next, the actuator 113 again projects the rod 115 to move the stage 101 to the access position Pd via the supply position Pe. As shown in FIG. 12 and FIG. 15, at the supply position Pe, the flux is again supplied from the flux storage section 121 to the recess 111. While the stage 101 is moving from the position Pf to the access position Pd, the flux 57 in the through hole 121a rises upward along the inner surface 121d of the side wall 121e facing the stirring section 125, but since a force in a direction opposite to the moving direction is applied to the rising flux 57 by the inclined surface 133a, the flux 57 is given a rotational force toward the opening 121b of the through hole 121a by this force and gravity. Therefore, the flux 57 does not rise above the inclined surface 133a, and the flux 57 can be continuously supplied to the recess 111 of the stage 101.

[0072] The stirring unit 125 faces the film-forming unit 123 in the movement direction of the stage 101. As a result, after the flux in the recess 111 is stirred by the stirring unit 125, the film-forming unit 123 flattens the surface of the flux 57 in the recess 111, so that the flux 57 can be uniformly attached to the multiple transfer pins 12.

[0073] The control unit 56 will be described with reference to Fig. 16. The control unit 56 is communicatively connected to each of the touch panel 5, the head lifting mechanism 58, the component supply unit moving unit 78, the stage moving unit 80, the stage tilt adjusting unit 81, the mounting head driving mechanism 86, the component heating unit 88, the tool thermometer 88a, the tool lifting mechanism 89, the pressure sensor 89a, the ultrasonic oscillator 90, and the driving unit 103.

[0074] The control unit 56 includes a storage unit 65 and a mounting control unit 69. The storage unit 65 stores tolerance data 66 relating to the tolerance range of the tilt of the transfer head 1, and a production program 67.

[0075] Based on the production program 67 in the memory unit 65, the mounting control unit 69 controls the operation of each of the head lifting mechanism 58, the component supply unit movement unit 78, the stage movement unit 80, the stage inclination adjustment unit 81, the mounting head drive mechanism 86, the tool lifting mechanism 89, and the drive unit 103.

[0076] (Parts mounting method) 7, 12, 13, and 17, a method of supplying flux 57 and a method of mounting components 61 on a board 62 will be described. Fig. 17 is a flowchart of the method of mounting components 61 on a board 62.

[0077] When an operator instructs the control unit 56 to mount the component 61 on the substrate 62, the mounting control unit 69 controls the drive unit 103 so that the stage 101 of the flux supply device 55 moves from the position Pf shown in FIG. 13 to the supply position Pe shown in FIG. 12 and then to the access position Pd shown in FIG. 7.

[0078] In the supplying step of step S 1 , when the recess 111 of the stage 101 passes below the flux reservoir 121 of the flux supplying unit 105 , the flux 57 in the flux reservoir 121 is supplied into the recess 111 .

[0079] In the stirring step of step S2, when the recess 111 of the stage 101 passes below the flux reservoir 121 of the flux supply unit 105, the stirring part 125 moves along the shape of the recess 111 and stirs the flux 57 present in the recess 111.

[0080] In the planarization step S3, when the recess 111 of the stage 101 passes below the flux reservoir 121 of the flux supply unit 105, the film forming part 123 planarizes the surface of the flux in the recess 111.

[0081] These steps S1 to S3 are performed simultaneously by moving the stage 101, the flux storage section 121, the stirring section 125, and the film forming section 123 relative to each other, so that the operation time can be shortened.

[0082] When the stage 101 finishes moving to the access position Pd, the mounting control unit 69 controls the head moving unit 54. In the transfer step S4, as shown in FIG. 3, the flattened flux 57 is brought into contact with the multiple transfer pins 12 held by the transfer head 1 to transfer the flux 57 to the transfer pins 12.

[0083] In step S5, the mounting control unit 69 controls the head moving unit 54 to bring the transfer pins 12 into contact with predetermined positions on the substrate 62 to transfer the flux 57 to the substrate 62, as shown in Fig. 4. At this time, if the substrate 62 is heated, the transfer pins 12 are heated.

[0084] In step S6, the mounting control unit 69 controls the mounting head 52 to mount the components 61 on the substrate 62 to which the flux 57 has been transferred, as shown in FIG.

[0085] In step S7, the mounting control unit 69 judges whether or not to continue mounting the components 61 on the board 62 with reference to the production program 67. When the mounting control unit 69 judges that the mounting of the components 61 on the board 62 is completed (No in step S7), the component mounting is terminated. When the mounting control unit 69 judges that the mounting of the components 61 on the board 62 is to be continued, the process is repeated again from step S1. In this case, the transfer marks of the multiple transfer pins 12 remain on the flux 57 in the recessed portion 111 of the stage 101, but the transfer marks can be removed by performing step S2 again. Furthermore, by repeating steps S1 to S6, the heated transfer pins 12 increase the temperature of the flux 57 in the recessed portion 111, and even if the transfer marks are more likely to remain due to a change in viscosity caused by a temperature change, the transfer marks can be reliably removed by step S2.

[0086] (effect) As described above, the flux supplying device 55 of the embodiment includes the stage 101 having the recess 111 for storing the flux 57, the flux storage section 121 having the through hole 121a penetrating in the vertical direction and a lower opening 121b of the through hole 121a being closed by the stage 101, and storing the flux 57 in the through hole 121a, and the driving section 103 for relatively moving the stage 101 and the flux storage section 121. The periphery of the through hole 121a is surrounded by the inner side surface 121d of the flux storage section 121. When the driving section 103 moves the flux storage section 121 relative to the stage 101 and the flux storage section 121 is positioned above the recess 111, the flux 57 in the flux storage section 121 is supplied to the recess 111. The flux storage section 121 has a film-forming section 123 at its lower end on the opening 121b side for flattening the surface of the flux 57 stored in the recess 111. The flux storage section 121 has a first protrusion 133 extending inward from the inner side surface 121d above the film-forming section 123 and below half the height of the through-hole 121a.

[0087] Since the first protrusion 133 extends inward from the inner surface 121d below the through hole 121a, the flux 57 moving up the through hole 121a along the inner surface 121d hits the first protrusion 133 and is given a force to rotate downward. This causes the flux 57 to return toward the lower opening 121b, and the flux 57 is continuously supplied to the recess 111 of the stage 53, so that it is possible to prevent the flux 57 in the recess 111 from being smeared or having gaps.

[0088] Moreover, the first protrusion 133 extends in a direction parallel to the movement direction in which the stage 53 and the flux storage unit 121 are moved relatively by the driving unit 103. This makes it easier for the first protrusion 133 to apply a rotational force to the flux 57 by the movement by the driving unit 103.

[0089] Moreover, first protrusion 133 has inclined surface 133a extending inward from inner side surface 121d. Since first protrusion 133 includes inclined surface 133a, first protrusion 133 extends inwardly smoothly and continuously from inner side surface 121d of through hole 121a, and therefore resistance to flux 57 can be reduced.

[0090] The flux supplying unit 105 further includes an agitator 125 for agitating the flux 57 present in the recess 111. The agitator 125 is disposed in the through hole 121a of the flux reservoir 121 so as to face the first protruding portion 133.

[0091] In addition, the driving unit 103 reciprocates the stage 101 between an access position Pd where the transfer pin 12 contacts the flux 57 and a position Pf different from the access position Pd. The first protrusion 133 extends from the inner surface 121d in a direction opposite to the direction in which the stage 101 moves from the position Pf to the access position Pd.

[0092] In addition, the component mounting device 50 of the embodiment includes the above-mentioned flux supply device 55 and a transfer head 1 that brings the transfer pins 12 it holds into contact with the flattened flux 57, and the transfer head 1 has a plurality of transfer pins 12 for transferring the flux 57 to the substrate 62.

[0093] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be apparent to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they deviate from the scope of the present disclosure. In addition, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0094] (1) In the above-described embodiment, the flux supply unit 105 includes the stirring unit 125, but the stirring unit 125 may not be included. When the viscosity of the flux is low, the transfer trace of the flux can be removed by the reciprocating movement of the film forming unit 123. Also, as shown in FIGS. 16 to 18, the first protrusions 133 may be provided on each of the pair of opposing side walls 121e. This makes it possible to prevent the flux 57 from rising along the inner surface 121d when the stage 101 moves in either direction of the reciprocating movement.

[0095] (2) In the above-described embodiment, the agitation part 125 of the flux supply unit 105 is a plate, but is not limited thereto. As shown in FIG. 19, the agitation part 125B of the flux supply unit 105B may have a plate-shaped main body 125Ba extending in a direction intersecting the moving direction of the stage 101 and in the up-down direction, and a second protrusion 135 extending from a lower side surface 125Bb of the main body 125Ba of the agitation part 125B toward the first protrusion 133 above the film forming part 123 and below half the height of the through-hole 121a. Since the agitation part 125B has the second protrusion 135, it is possible to prevent the flux 57 from rising along the side surface 125Bb of the main body 125Ba of the agitation part 125B.

[0096] (3) In the above-described embodiment, the first protrusion 133 of the flux supply unit 105 has the inclined surface 133a, but this is not limited thereto. As shown in FIG. 22, the first protrusion 133C of the flux supply unit 105C has a rising surface 133d extending vertically inward from the inner side surface 121d instead of the inclined surface 133a. In this manner, the inner side surface 121d may have a step in the vertical direction. Also, as shown in FIG. 23, the inclined surface 133a may extend continuously from the film forming section 123 toward the inside of the through hole 121a and upward. Even with such a configuration, it is possible to prevent the flux 57 from rising along the inner side surface 121d.

[0097] (4) In the above-described embodiment, the agitation unit 125 is a plate, but this is not limited to this. The agitation unit 125 may be a gear or a roller that can rotate in a direction that moves the stage 101 and the agitation unit 125 relative to each other.

[0098] (5) In the above-described embodiment, the transfer pins 12 of the transfer head 1 are in contact with the flux 57 of the flux supply device 55, but this is not limited thereto. The components 61 held by the mounting head 52 may be directly brought into contact with the flux 57 of the flux supply device 55 and then mounted on the substrate 62. That is, the component mounting device 50 of the embodiment includes the above-described flux supply device 55 and the mounting head 52 that brings the held components 61 into contact with the flattened flux 57, and the mounting head 52 may take out the components 61 from the component supply unit and mount the components 61 in contact with the flux on the substrate 62. In the component mounting method, the holding head may be the mounting head 52 that holds the components 61 as the target object.

[0099] Any of the various embodiments and modifications described above may be appropriately combined to achieve the effects of each of them. [Industrial Applicability]

[0100] The flux supplying device and component mounting device according to the present disclosure are applicable to a flux supplying device that supplies flux for transferring flux to a substrate, and a component mounting device including the same. [Explanation of symbols]

[0101] 1 Transfer head 2. Bass 2a Bottom side 2b Top side 2aa surrounding area 2ca, 2cb, 2cc, 2cd contact points 4 Foundation 5. Touch Panel 12 Transfer pin 12a Bottom 50 Parts mounting device 51 Parts Supply Department 52 Mounting Head 53 Stage 54 Head movement part 55 Flux supply device 56 Control Unit 57 Flux 58 Head lift mechanism 58a Arm 60 Flux Transfer Unit 61 parts 62 Substrate 63 Stage heating section 65 Storage section 67 Production Program 69 On-board control unit 78 Parts Supply Section Moving Section 80 Stage movement part 81 Stage tilt adjustment part 83 Pickup Head 86 Mounting head drive mechanism 87 Tools 88 Parts heating section 88a Tool Thermometer 89 Tool lifting mechanism 89a Pressure Sensor 90 Ultrasonic Oscillator Stage 101 103 Drive unit 105, 105A, 105B Flux Supply Unit 107 Base 109 Rail 111 Recess 113 Actuator 115 Rod 117 Fixed Block 121 Flux storage section 121a Through hole 121b, 121c opening 121d inner surface 121e side wall 123 Film forming section 125 Stirring section 125Ba main unit 125Bb side 127 Arm 129 Fastening Part 131 Coil spring 133 First protrusion 133a Slope 133b, 133c plane 133d Erecting surface 135 Second protrusion Pa mounting position Pb evacuation position PC delivery position Pd Access Position Pe supply position Pf position

Claims

1. a stage having a recess for storing flux; a flux reservoir having a through hole penetrating in a vertical direction, a lower opening of the through hole being closed by the stage, and the flux is stored in the through hole; a drive unit that moves the stage and the flux reservoir relatively, The through hole is surrounded by an inner surface of the flux reservoir, when the drive unit moves the flux reservoir relative to the stage and the flux reservoir is positioned above the recess, the flux in the flux reservoir is supplied to the recess; the flux reservoir has a film forming section at a lower opening end thereof for flattening a surface of the flux stored in the recess, the flux reservoir has a first protrusion extending inward from an inner surface above the film-forming portion and below half the height of the through hole; Flux supply device.

2. the first protrusion extends in a direction along a moving direction in which the stage and the flux reservoir are moved relatively by the driving unit; The flux supply device according to claim 1 .

3. The first protrusion has an inclined surface extending inwardly from the inner surface. The flux supply device according to claim 1 .

4. the flux reservoir includes, as a part of the inner surface, a pair of opposing side walls extending in a direction intersecting the moving direction and in a vertical direction; The first protrusion is provided on each of the pair of opposing side walls. The flux supplying device according to claim 2 .

5. a stirring portion for stirring the flux present in the recess, the stirring portion is disposed in the through hole of the flux reservoir portion so as to face the first protruding portion; The flux supplying device according to claim 2 .

6. The stirring unit includes: A main body extending in a direction intersecting the moving direction and in a vertical direction; A second protrusion extending from a lower side surface of the main body of the stirring unit toward the first protrusion above the film forming unit and below half the height of the through hole. The flux supplying device according to claim 5.

7. the driving unit reciprocates the stage between a first position where the target object is brought into contact with the flux and a second position different from the first position; the first protrusion extends from the inner surface in a direction opposite to a direction in which the stage moves from the second position to the first position; The flux supply device according to claim 1 .

8. A flux supplying device according to any one of claims 1 to 7; a transfer unit that brings a held object into contact with the flattened flux, the transfer unit includes a mounting head that picks up a component as the target object from a component supply unit and mounts the component in contact with the flux on a substrate, or a transfer head having a plurality of transfer pins as the target object for transferring the flux to the substrate, Parts mounting device.

Images