Flux transfer device, component mounting device, component mounting system, and component mounting method

Abstract

To provide a flux transfer device capable of adjusting the inclination between the stage and the transfer head.SOLUTION: The flux transfer device includes: a transfer head with multiple transfer pins for transferring flux to a workpiece on which the component to be mounted placed on a stage; a lifting mechanism that raises and lowers the transfer head; a height detection unit that detects the height of the transfer head lowered by the lifting mechanism; and a control unit configured to calculate the inclination of the transfer head based on the detection result of the height of the transfer heads at least at three or more points that are horizontally nonlinearly different.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a flux transfer device that transfers flux, a component mounting device, a component mounting system, and a component mounting method. [Background technology]

[0002] Conventionally, in component mounting devices that mount electronic components such as ICs on a substrate, flux is applied to remove oxides and dirt from the electrode parts on the workpiece where soldering will be performed before the components are soldered to the workpiece (substrate).

[0003] For example, Patent Document 1 describes that a transfer head has a plurality of transfer pins, and after flux is attached to the transfer pins, the transfer pins are pressed against the electrode portion of the workpiece at the transfer position to transfer the flux. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-35873 A Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, the number of bumps on parts to be joined to the workpiece has been increasing, and there is a demand for flux transfer devices that can transfer to more than 100 places in one transfer. Therefore, the transfer head may have more than 100 transfer pins. In addition, the area of ​​the electrode part of the workpiece is reduced due to the miniaturization and narrowing of the pitch of the bumps, and the amount of flux transferred is also reduced, so the diameter of the transfer pins is reduced.

[0006] If the transfer head and the workpiece to which the flux is to be transferred are not parallel, the flux may not be transferred properly to the workpiece. The operator checks whether the transfer head and the flux are not tilted relative to each other, but due to the above-mentioned situation, it is becoming more and more difficult to determine whether the flux is being transferred properly to the workpiece.

[0007] Therefore, an object of the present disclosure is to provide a flux transfer device, a component mounting device, a component mounting system, and a component mounting method that assist in adjusting the tilt of a transfer head. [Means for solving the problem]

[0008] The flux transfer device disclosed herein includes a transfer head having a plurality of transfer pins for transferring flux to a workpiece placed on a stage on which components are to be mounted, a lifting mechanism for raising and lowering the transfer head, a height detection unit for detecting the height of the transfer head lowered by the lifting mechanism, and a control unit for calculating the inclination of the transfer head based on the detection results of the heights of at least three or more different transfer head locations that are non-linearly different in the horizontal direction.

[0009] The component mounting apparatus of the present disclosure includes the above-described flux transfer device. Effect of the Invention

[0010] According to the present disclosure, it is possible to provide a flux transfer device, a component mounting device, a component mounting system, and a component mounting method that assist in adjusting the tilt of a transfer head. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a side view showing a schematic configuration of a component mounting device and a component mounting system including a flux transfer device according to an embodiment of the present disclosure. [Diagram 2] FIG. 1 is a side view of the component mounting device with the transfer head located at the retracted position. [Diagram 3] A side view of a component mounting device in which flux is being applied to a transfer pin. [Figure 4] FIG. 1 is a side view of the component mounting apparatus with the transfer head located at the mounting position. [Diagram 5] Schematic side view of the transfer head [Figure 6] Schematic top perspective view of the transfer head [Figure 7] Schematic side view of the transfer head and surrounding area [Figure 8] Schematic side view of the transfer head and surrounding area [Figure 9] FIG. 1 is a schematic side view of the transfer head and its surroundings in a state where the transfer head is in contact with a protrusion; [Figure 10] A side view of a component mounting device showing one process of detecting the inclination of a transfer head. [Figure 11] A side view of a component mounting device showing one process of detecting the inclination of a transfer head. [Figure 12] A side view of a component mounting device showing one process of detecting the inclination of a transfer head. [Figure 13] Block diagram showing the functional configuration of the control unit [Figure 14] Flowchart of transfer head tilt detection method DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] A flux transfer device according to a first aspect of the present disclosure includes a transfer head having a plurality of transfer pins for transferring flux to a workpiece placed on a stage on which components are to be mounted, a lifting mechanism for raising and lowering the transfer head, a height detection unit for detecting the height of the transfer head lowered by the lifting mechanism, and a control unit for calculating the inclination of the transfer head based on the detection results of the heights of at least three or more different transfer head locations that are non-linearly different in the horizontal direction.

[0013] The height detection unit detects the height of the transfer head at at least three or more different positions that are positioned non-linearly in the horizontal direction, and the control unit calculates the inclination of the transfer head based on the detection results, thereby assisting in adjusting the inclination of the transfer head relative to the stage.

[0014] According to a second aspect of the present disclosure, the flux transfer device of the first aspect is provided with a contact portion that is provided on a stage and contacts the lowered transfer head, and a height detection unit detects the height of the transfer head when the transfer head is in contact with the contact portion.

[0015] According to a third aspect of the present disclosure, the flux transfer device of the second aspect further includes a stage moving unit that moves the stage in a horizontal direction. When the height detection unit detects the height of the transfer head at the first position, the control unit causes the lifting mechanism to lift the transfer head, causes the stage moving unit to move the stage horizontally from the first position to the second position, and causes the lifting mechanism to lower the transfer head so that the transfer head comes into contact with the contact unit. The height detection unit detects the height of the transfer head at the second position.

[0016] According to a fourth aspect of the present disclosure, in the flux transfer device of the second or third aspect, the transfer head has a base that supports the transfer pins, the base has an outer peripheral area from which a plurality of transfer pins protrude, and when the transfer head is lowered, the peripheral area of ​​the base comes into contact with the contact portion.

[0017] According to a fifth aspect of the present disclosure, in a flux transfer device of any of the second to fourth aspects, a contact portion is arranged at a position where the contact portion comes into contact with the transfer head when the transfer head is lowered in a state where the transfer head is positioned in a mounting position in the horizontal direction where a component is mounted on a workpiece.

[0018] According to a sixth aspect of the present disclosure, in a flux transfer device of any of the first to fifth aspects, a memory unit is provided that stores tolerance data regarding the allowable range of the tilt of the transfer head, and a control unit determines whether the tilt of the transfer head is appropriate based on the tolerance data stored in the memory unit and a calculation result regarding the tilt of the transfer head.

[0019] According to a seventh aspect of the present disclosure, in the flux transfer device of the sixth aspect, a head tilt adjustment unit is provided that adjusts the tilt of the transfer head, and when the control unit determines that the tilt of the transfer head is not appropriate, it calculates the amount of adjustment to be made by the head tilt adjustment unit.

[0020] According to an eighth aspect of the present disclosure, the flux transfer device of the seventh aspect further comprises a display unit that displays the adjustment amount.

[0021] According to a ninth aspect of the present disclosure, in the flux transfer device of the sixth aspect, a stage tilt adjustment unit is provided that adjusts the tilt of the stage, and when the control unit determines that the tilt of the transfer head is not appropriate, it calculates the amount of adjustment to be made by the stage tilt adjustment unit and drives and controls the stage tilt adjustment unit based on the adjustment amount.

[0022] According to a tenth aspect of the present disclosure, in the flux transfer device of any one of the second to fifth aspects, the contact portion has a convex and curved shape toward the descending transfer head.

[0023] A component mounting apparatus according to an eleventh aspect of the present disclosure includes the flux transfer apparatus according to any one of the first to tenth aspects.

[0024] A component mounting apparatus of a twelfth aspect of the present disclosure comprises a transfer head having a plurality of transfer pins for transferring flux to a workpiece placed on a stage on which components are to be mounted, a mounting head for mounting components received from a component supply unit onto the workpiece to which the flux has been transferred by the transfer head, a lifting mechanism for raising and lowering the transfer head, a height detection unit for detecting the height of the transfer head lowered by the lifting mechanism, and a control unit for calculating the inclination of the transfer head based on the detection results of the heights of at least three or more different transfer head locations that are non-linearly different in the horizontal direction.

[0025] A component mounting system of a thirteenth aspect of the present disclosure comprises a transfer head having a plurality of transfer pins for transferring flux to a workpiece placed on a stage on which components are to be mounted, a mounting head for mounting components received from a component supply unit onto the workpiece to which the flux has been transferred by the transfer head, a lifting mechanism for raising and lowering the transfer head, a height detection unit for detecting the height of the transfer head lowered by the lifting mechanism, and a control unit for calculating the inclination of the transfer head based on the detection results of the heights of at least three or more different transfer head locations that are non-linearly different in the horizontal direction.

[0026] A component mounting method according to a fourteenth aspect of the present disclosure includes a lowering step in which a transfer head having a plurality of transfer pins for transferring flux to a workpiece on which components are to be mounted is lowered by a lifting mechanism, the transfer head being placed on a stage, a height detection step in which a height of the transfer head lowered in the lowering step is detected, and a control step in which an inclination of the transfer head is calculated based on a detection result in the height detection step of the heights of the transfer head at least three or more points that differ non-linearly in the horizontal direction.

[0027] Hereinafter, exemplary embodiments of a flux transfer device, a component mounting device, a component mounting system, and a component mounting method according to the present disclosure will be described with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present disclosure.

[0028] [Embodiment Mode] (Overall composition) Hereinafter, a component mounting apparatus 50 and a component mounting system 150 according to an embodiment of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a side view showing a schematic configuration of a component mounting apparatus 50 and a component mounting system 150 including a flux transfer device 101 according to an embodiment of the present disclosure.

[0029] The component mounting apparatus 50 has a component supply unit 51, a mounting head 52, a stage 53, a control unit 56, and a flux transfer device 101. The component mounting apparatus 50 further has a base 4, a touch panel 5, a protrusion 63, a component supply unit movement unit 78, a pickup head 83, a stage movement unit 80, and a stage tilt adjustment unit 81. The touch panel 5, the stage 53, the stage movement unit 80, the stage tilt adjustment unit 81, and the control unit 56 are also components of the flux transfer device 101.

[0030] The component mounting apparatus 50 mounts components 61, such as semiconductor chips, on a substrate 62 serving as a workpiece. A component supply unit 51 and a stage 53 that holds the substrate 62 are arranged on the base 4 in the Y direction.

[0031] The component supply unit 51 supplies the components 61. The component supply unit 51 is provided on a component supply unit movement unit 78. The component supply unit movement unit 78 is controlled by the control unit 56, and moves the component supply unit 51 in the X direction and the Y direction. A plurality of components 61 are held on the upper part of the component supply unit 51. The components 61 are held on the upper part of the component supply unit 51 in a state in which they are placed on a tray or in a state in which they are attached on an adhesive sheet.

[0032] The stage 53 is provided above the stage moving unit 80. The stage moving unit 80 is controlled by the control unit 56 and moves the stage 53 in the X and Y directions. The stage 53 carries in the substrate 62, for example, by a transport rail, and positions and holds the substrate 62 at a position where the component 61 is to be mounted. The stage 53 also carries out the substrate 62 on which the component 61 is mounted, for example, by a transport rail.

[0033] Inside stage 53, there are provided a stage heating unit (not shown) that heats held substrate 62, and a thermometer (not shown) that measures the temperature of heated stage 53. The stage heating unit is controlled by control unit 56, and heats stage 53 to a specified temperature. The temperature measured by the thermometer inside stage 53 is transmitted to control unit 56.

[0034] The protrusion 63 is a protrusion for contacting the transfer head 1 that transfers the flux. The protrusion 63 is fixed onto the stage 53, and is moved together with the stage 53 by the stage moving part 80 in the X direction and the Y direction.

[0035] The stage tilt adjustment unit 81 is provided inside the stage movement unit 80, and can adjust the tilt with respect to the transfer head 1 by rotating the stage 53 about two axes (X-axis and Y-axis) that are perpendicular to the surface of the stage 53. The stage tilt adjustment unit 81 has, for example, a cam mechanism provided at each of the four corners of the stage 53, and has a mechanism in which a linear cam provided for each cam mechanism moves in the left-right direction to move the cam follower up and down, and each cam mechanism moves up and down independently.

[0036] The component 61 is held on the component supply unit 51 with the bumps formed on the back surface of the component 61 facing upward. A pick-up head 83 is disposed above the component supply unit 51. The pick-up head 83 picks up and removes the component 61 from the component supply unit 51. The pick-up head 83 rotates about the X-axis as the rotation axis by a pick-up head drive unit (not shown) controlled by the control unit 56, and further moves to a transfer position Pc, which will be described later. That is, the pick-up head 83 holds the component 61 at the transfer position Pc with the bumps facing downward.

[0037] The mounting head 52 is disposed above the pickup head 83 and the component supply unit 51. The mounting head 52 holds the supplied component 61 and mounts it on the board 62 supported by the stage 53. The mounting head 52 moves in the Y direction by a mounting head drive mechanism 86 controlled by the control unit 56. A tool 87 that adsorbs and holds the component 61 is provided at the lower end of the mounting head 52. The mounting head 52 receives the component 61 by adsorbing it from the pickup head 83 at the transfer position Pc, moves the component 61 to a mounting position on the board 62 held by the stage 53, and mounts the component 61 on the board 62.

[0038] The mounting head 52 is provided with a component heating unit 88 that heats the components 61 picked up by the tool 87, and a tool thermometer 88a that measures the temperature of the tool 87 heated by the component heating unit 88. The component heating unit 88 is controlled by the control unit 56, and heats the tool 87 to a specified temperature. The temperature of the tool 87 measured by the tool thermometer 88a is transmitted to the control unit 56.

[0039] The mounting head 52 is provided with a tool lifting mechanism 89 that raises and lowers the tool 87. The mounting head 52 is also provided with a pressure sensor 89a that measures the load with which the tool lifting mechanism 89 presses the tool 87, which holds the component 61, against the board 62. The tool lifting mechanism 89 is controlled by the control unit 56, and lowers the tool 87 so that the tool 87 mounts the component 61 on the board 62 with a specified load. The load measured by the pressure sensor 89a is transmitted to the control unit 56.

[0040] The mounting head 52 is provided with an ultrasonic oscillator 90 that ultrasonically vibrates the tool 87. The ultrasonic oscillator 90 is controlled by the control unit 56, and when mounting the component 61 on the board 62 by ultrasonic bonding, the ultrasonic oscillator 90 ultrasonically vibrates the tool 87 at designated ultrasonic power, amplitude, and frequency. The touch panel 5 that is communicably connected to the control unit 56 displays an operation menu and information on the operating status of the component mounting device 50 on its display unit, and data can be input to the control unit 56 and the component mounting device 50 can be operated using operation buttons displayed on the display unit. The touch panel 5 may be a portable terminal or may be a stationary terminal.

[0041] The component mounting system 150 includes a component mounting apparatus 50 and a control unit 151 that can access a control unit 56 of the component mounting apparatus 50. The component mounting system 150 may include a plurality of component mounting apparatuses 50, and the control unit 151 may be able to access a plurality of control units 56 as a part of the configuration of a management apparatus. The control unit 151 collects information on the mounting status of the component mounting apparatus 50 by accessing the control unit 56.

[0042] (Configuration of flux transfer device) The flux transfer device 101 transfers flux to an electrode portion on which a component 61 is mounted on a substrate 62 held on a stage 53. The flux transfer device 101 includes a transfer head 1 to which one ends of a plurality of transfer pins 12 are fixed, a head moving unit 54, a head lifting mechanism 58, a head tilt adjustment unit 59, a height detection unit 60, and a flux supply unit 55.

[0043] The transfer head 1 is a member that holds flux on the tips of transfer pins 12 (described later) and transfers the flux onto the surface of a substrate 62. In this specification, the term "flux" may include not only flux alone but also solder paste containing flux.

[0044] The head moving unit 54 moves the transfer head 1 in the horizontal direction to the mounting position Pa and the retracted position Pb.

[0045] The head lifting mechanism 58 raises and lowers the transfer head 1 relative to the stage 53 and the flux supply unit 55. Therefore, the head lifting mechanism 58 raises and lowers the transfer head 1 in the vertical direction at the mounting position Pa and the retreat position Pb. The head lifting mechanism 58 has a motor (not shown) that raises and lowers the transfer head 1, and an arm 58a that is moved in the vertical direction by the motor.

[0046] The head tilt adjustment unit 59 adjusts the tilt of the transfer head 1. The head tilt adjustment unit 59 is attached to the lower end of an arm 58a (see FIG. 4) of the head lifting mechanism 58. The transfer head 1 is attached to the arm 58a via the head tilt adjustment unit 59. By rotating the transfer head 1 about two axes that are perpendicular to each other, the tilt of the transfer head 1 can be adjusted independently in each of the two axial directions. Details will be described later.

[0047] The height detection unit 60 detects the height of the transfer head 1. The height detection unit 60 is composed of a head lifting mechanism 58 and a height calculation unit 70 of the control unit 56. The height calculation unit 70 will be described in detail later.

[0048] The flux supplying unit 55 supplies flux to the transfer head 1. The flux supplying unit 55 may be a container that contains the flux 57.

[0049] The control unit 56 is configured to control the component mounting device 50. The control unit 56 and the control unit 151 are circuits including semiconductor elements, and include general-purpose processors such as CPU, MPU, FPGA, DSP, and ASIC that realize predetermined functions by executing programs. The control unit 56 and the control unit 151 each have storage units 65 and 152 such as memory or SSD, and realize their functions by executing programs stored in the storage units 65 and 152, respectively. The control unit 56 may be provided as a dedicated unit for the flux transfer device 101, may be used together with the control unit of the component mounting device 50 as in the embodiment, or may be included in a management device connected by a network. Therefore, the flux transfer device 101 also includes a configuration as a flux transfer system using the control unit 56 included in another device.

[0050] Next, the movement of the transfer head 1 will be described with reference to Fig. 2 to Fig. 4. Fig. 2 is a side view of the component mounting apparatus in a state where the transfer head 1 is located at the retracted position Pb. Fig. 3 is a side view of the component mounting apparatus in a state where flux is being applied to the transfer pins 12. Fig. 4 is a side view of the component mounting apparatus in a state where the transfer head 1 is located at the mounting position Pa.

[0051] 2, the mounting head 52 is located at the mounting position Pa directly above the board 62 on the stage 53, and therefore the transfer head 1 is located at the retreat position Pb away from the mounting position Pa. Also, as shown in Fig. 3, even if the mounting head 52 is located at a position away from the mounting position Pa, before the component 61 is mounted on the board 62, the transfer head 1 is located at the retreat position Pb and an operation of applying flux to the transfer pins 12 of the transfer head 1 is performed.

[0052] 2 and 3, when the transfer head 1 is located at the retracted position Pb, the head lifting mechanism 58 lowers the transfer head 1 toward the flux supply unit 55. When the tip of the transfer pin 12 comes into contact with the flux 57 supplied by the flux supply unit 55, the flux adheres to the tip of the transfer pin 12.

[0053] 4, the head lifting mechanism 58 lifts the transfer head 1 holding the flux, and the head moving unit 54 moves it above the stage 53 at the mounting position Pa. At the mounting position Pa, the head lifting mechanism 58 lowers the transfer head 1 toward the substrate 62. When the transfer head 1 comes into contact with the substrate 62, the flux is transferred to the substrate 62.

[0054] (Transfer head configuration) The configuration of the transfer head 1 will be described with reference to Figures 5 and 6. Figure 5 is a schematic side view of the transfer head 1, and Figure 6 is a schematic top view of the transfer head 1. In each figure, the transfer pins 12 are shown enlarged and exaggerated for easy understanding.

[0055] As shown in FIG. 5, the transfer head 1 has a base 2 and a plurality of transfer pins 12. The base 2 supports the plurality of transfer pins 12 and is a block made of metal or resin. The base 2 may be a rectangular parallelepiped or a shape in which a part of a cylinder is cut out in a plane in the height direction. The base 2 is rotatable around the X-axis and the Y-axis by a head tilt adjustment unit 59, and is adjusted so as to be parallel to the stage 53. The plurality of transfer pins 12 each protrude downward from the lower surface 2a of the base 2 at the same predetermined angle, for example, protruding vertically.

[0056] The transfer pins 12 adhere flux to the bottom surfaces 12a of the transfer pins 12 and transfer the flux to predetermined electrode parts of the substrate 62. The transfer pins 12 have a columnar structure. The multiple transfer pins 12 are arranged in a predetermined pattern corresponding to the pattern of each electrode part where the components 61 are mounted on the substrate 62. In Fig. 5 and Fig. 6, the transfer pins 12 are arranged in a matrix of 3 rows and 5 columns as an example, and the transfer head 1 has 15 transfer pins 12, but the transfer head 1 may have, for example, 100 transfer pins 12 in 10 rows and 10 columns.

[0057] The shape of the bottom surface 12a of the transfer pin 12 is not limited to a circle, but may be an ellipse or a rectangle. The transfer pin 12 has a diameter and height of, for example, an order of 100 μm. The multiple transfer pins 12 may have the same structure as each other or different structures from each other. Specifically, the multiple transfer pins 12 may have the same diameter or different diameters. In addition, the intervals between the multiple transfer pins 12 may be equal or different. The transfer pins 12 are made of resin or metal.

[0058] The transfer pin 12 is disposed in the center of the lower surface 2a of the base 2. The base 2 has a peripheral region 2aa on the lower surface 2a outside the region where the transfer pin 12 protrudes from the base 2. Fig. 5 illustrates four contact points 2ca to 2cd in the peripheral region 2aa that come into contact with the protrusion 63 in sequence when the transfer head 1 descends.

[0059] Next, the configuration of the head tilt adjustment unit 59 will be described with reference to Fig. 7 and Fig. 8. Fig. 7 is a schematic side view of the transfer head and its periphery as viewed in the X-axis direction. Fig. 8 is a schematic side view of the transfer head and its periphery as viewed in the Y-axis direction.

[0060] The head tilt adjustment unit 59 includes a first tilt adjustment mechanism 111 and a second tilt adjustment mechanism 113. The first tilt adjustment mechanism 111 adjusts the tilt of the transfer head 1 in the X-axis direction, i.e., the tilt around the Y-axis. The second tilt adjustment mechanism 113 is supported by the first tilt adjustment mechanism 111, and the first tilt adjustment mechanism 111 rotates the second tilt adjustment mechanism 113 together with the transfer head 1 around the Y-axis.

[0061] As shown in FIG. 8, the first tilt adjustment mechanism 111 includes a plate 115, a micrometer head 117, and a pin 119.

[0062] Plate 115 supports micrometer head 117 and second tilt adjustment mechanism 113. Plate 115 has, for example, a U-shape, and an upper portion of plate 115 is biased toward arm 58a of head lifting mechanism 58 and fixed thereto. A gap 121 exists between the lower portion of plate 115 and arm 58a.

[0063] Micrometer head 117 is fixed to plate 115 by holder 123. Micrometer head 117 has a thimble 117a, a spindle 117b, and a sleeve 117c. When an operator rotates thimble 117a, the length of spindle 117b can be adjusted, and the length of spindle 117b can be read from the scale on sleeve 117c.

[0064] The pin 119 has, for example, a cylindrical shape and protrudes from the arm 58a in the negative direction of the Y axis. The tip of the spindle 117b of the micrometer head 117 abuts against the side of the pin 119. Since the plate 115 is biased toward the arm 58a, shortening the length of the spindle 117b causes the lower part of the plate 115 to tilt toward the arm 58a, and lengthening the length of the spindle 117b causes the lower part of the plate 115 to tilt away from the arm 58a. In this way, the tilt of the transfer head 1 around the Y axis can be adjusted.

[0065] As shown in FIG. 7, the second tilt adjustment mechanism 113 includes a case 125, a micrometer head 127, and a pin 129.

[0066] Case 125 supports micrometer head 127 and transfer head 1. Case 125 has, for example, a substantially rectangular parallelepiped shape, and an upper portion of case 125 is biased toward plate 115 of first tilt adjustment mechanism 111 and fixed thereto. A gap 131 exists between a lower portion of case 125 and a lower portion of plate 115.

[0067] Micrometer head 127 is fixed to case 125 by holder 133. Micrometer head 127 has a thimble 127a, a spindle 127b, and a sleeve 127c. When an operator rotates thimble 127a, the length of spindle 127b can be adjusted, and the length of spindle 127b can be read from the scale on sleeve 127c.

[0068] The pin 129 has, for example, a cylindrical shape and protrudes from the plate 115 in the negative direction of the X-axis. The tip of the spindle 127b of the micrometer head 127 abuts against the side of the pin 129. Since the case 125 is biased towards the plate 115 side, shortening the length of the spindle 127b causes the lower part of the case 125 to tilt towards the plate 115 side, and lengthening the length of the spindle 127b causes the lower part of the case 125 to tilt away from the plate 115 side. In this way, the tilt of the transfer head 1 around the X-axis can be adjusted.

[0069] A rod 135 that is fixed to the upper surface 2b of the base 2 of the transfer head 1 and supports the transfer head 1 is supported by the case 125. A head 135a of the rod 135 is, for example, T-shaped.

[0070] Case 125 accommodates therein a sliding member 137 and a photoelectric sensor 139. Slide member 137 supports rod 135 so as to be slidable in the up and down direction, and is, for example, a bearing.

[0071] Photoelectric sensor 139 detects that rod 135 has risen to a predetermined position within case 125. Photoelectric sensor 139 is, for example, a transmission type sensor, and has a light projecting portion 139a that emits light and a light receiving portion 139b that receives the emitted light. Note that photoelectric sensor 139 may be a reflection type sensor.

[0072] Due to the weight of the transfer head 1, the lower surface of the head 135a of the rod 135 is supported on the upper surface of the sliding member 137. In this state, the photoelectric sensor 139 is disposed above the sliding member 137 at a predetermined distance.

[0073] 9, when the transfer head 1 is lowered by the head lifting mechanism 58 and comes into contact with the protrusion 63, the descent of the transfer head 1 is stopped, but the arm 58a continues to descend, so that the rod 135 relatively rises within the case 125 and blocks the light emitted from the light projecting unit 139a. When the light receiving unit 139b detects that it is not receiving light, it transmits a detection signal to the control unit 56, and the control unit 56 recognizes that the transfer head 1 has come into contact with the protrusion 63.

[0074] (Transfer head tilt detection) Next, a method for detecting the inclination of the transfer head 1 will be described with reference to Figures 10 to 12. Figures 10 to 12 are side views of the component mounting apparatus 50 showing one step of detecting the inclination of the transfer head 1.

[0075] In order to detect the relative inclination between the transfer head 1 and the stage 53, when the operator instructs the control unit 56 via the touch panel 5 to activate a tilt detection mode for the transfer head 1, the control unit 56 retreats the mounting head 52 from the mounting position Pa to the transfer position Pc.

[0076] When the mounting head 52 retreats to the delivery position Pc, the control unit 56 drives and controls the head moving unit 54 to move the transfer head 1 to the mounting position Pa. When the transfer head 1 has finished moving to the mounting position Pa, the control unit 56 moves the stage 53 and the protrusions 63 to the first position by the stage moving unit 80, as shown in Fig. 10. Next, as shown in Fig. 11, the control unit 56 lowers the transfer head 1 from a predetermined initial height toward the stage 53 and the protrusions 63 by the head lifting mechanism 58.

[0077] When the contact point 2ca of the transfer head 1 comes into contact with the protrusion 63, a detection signal is sent from the photoelectric sensor 139 to the control unit 56, and the control unit 56 stops driving the head lifting mechanism 58 and stops the descent of the arm 58a. The height calculation unit 70 of the control unit 56 calculates the height of the transfer head 1 that has come into contact with the protrusion 63 at the first position based on the amount of drive of the motor from the initial height until the detection signal is received. Note that the amount of lift of the rod 135 from when the transfer head 1 comes into contact with the protrusion 63 until it is detected by the photoelectric sensor 139 is measured in advance, so the height of the transfer head 1 can be calculated by subtracting the amount of lift of the rod 135 from the amount of descent of the arm 58a.

[0078] Next, the control unit 56 causes the head lifting mechanism 58 to raise the transfer head 1 to a predetermined initial height, and causes the stage moving unit 80 to move the stage 53 and the protrusions 63 to a second position, as shown in Fig. 12. Next, the control unit 56 causes the head lifting mechanism 58 to lower the transfer head 1 from the predetermined initial height toward the stage 53 and the protrusions 63.

[0079] When the contact point 2cb of the transfer head 1 comes into contact with the protrusion 63, a detection signal is sent from the photoelectric sensor 139 to the control unit 56, and the control unit 56 stops driving the head lifting mechanism 58 and stops the descent of the arm 58a. The height calculation unit 70 of the control unit 56 calculates the height of the transfer head 1 that has come into contact with the protrusion 63 at the second position based on the amount of motor drive from the initial height until the detection signal is received.

[0080] Similarly, the control unit 56 moves the stage 53 and the protrusion 63 to a third position, brings the contact point 2cc of the transfer head 1 into contact with the protrusion 63, and calculates the height of the transfer head 1 at the third position. Furthermore, the control unit 56 moves the stage 53 and the protrusion 63 to a fourth position, brings the contact point 2cd of the transfer head 1 into contact with the protrusion 63, and calculates the height of the transfer head 1 at the fourth position.

[0081] As shown in Figure 6, the height of the transfer head 1 when it comes into contact with the protrusion 63 at contact point 2cb on the right side of the transfer head 1 is h(R), the height of the transfer head 1 when it comes into contact with the protrusion 63 at contact point 2ca on the left side of the transfer head 1 is h(L), and the movement distance of the stage 53 and the protrusion 63 between the first position and the second position is LY. The inclination SY of the transfer head 1 in the YZ plane can be calculated using the following equation. SY = (h(R)-h(L)) / LY (1)

[0082] Similarly, if the height of the transfer head 1 when it comes into contact with the protrusion 63 at the front contact point 2cc of the transfer head 1 is h(F), the height of the transfer head 1 when it comes into contact with the protrusion 63 at the rear contact point 2cd of the transfer head 1 is h(B), and the movement distance of the stage 53 and the protrusion 63 between the third position and the fourth position is LX, the inclination SX of the transfer head in the XZ plane can be calculated by the following equation. SX=(h(F)-h(B)) / LX···(2) formula

[0083] The tilt calculation unit 72 of the control unit 56 calculates the tilts SX and SY by the formulas (1) and (2), respectively. The tilt determination unit 71 of the control unit 56 determines whether the calculated tilts SX and SY are included in the allowable data 66 stored in the storage unit 65. The allowable data 66 is data related to the allowable range of the tilt of the transfer head 1, and is, for example, a threshold value that is the upper limit value of the tilt. If the calculated tilts SX and SY are not included in the allowable range, the control unit 56 displays information that the transfer head 1 is tilted on the touch panel 5 as a display unit. In addition, the tilt calculation unit 72 of the control unit 56 calculates the adjustment amounts converted into the scales of the micrometer heads 117 and 127 that correspond to -SX and -SY that offset these tilts. This adjustment amount is an amount that offsets the relative tilt angle between the transfer head 1 and the stage 53. The calculated adjustment amount is displayed on the touch panel 5. Based on the result of this calculation, the operator may manually adjust head tilt adjustment unit 59, or control unit 56 may drive stage tilt adjustment unit 81 to automatically adjust the tilt.

[0084] Furthermore, making the transfer head 1 parallel to the stage 53 is the same as correcting the inclination of the transfer pin 12 relative to the stage 53, and calculating and correcting the inclination of the transfer head 1 is the same as calculating and correcting the inclination of the transfer pin 12.

[0085] After manual or automatic tilt adjustment, the transfer head 1 may be brought into contact with the protrusion 63 again to detect the tilt state of the transfer head 1 relative to the stage 53, thereby checking whether the tilt has been appropriately corrected and parallelism has been maintained.

[0086] The control unit 56 will be described with reference to Fig. 13. The control unit 56 is communicatively connected to the touch panel 5, the component supply unit movement unit 78, the stage movement unit 80, the stage tilt adjustment unit 81, the mounting head drive mechanism 86, the component heating unit 88, the tool thermometer 88a, the tool lifting mechanism 89, the pressure sensor 89a, the ultrasonic oscillator 90, and the head lifting mechanism 58.

[0087] The control unit 56 includes a storage unit 65, a mounting control unit 69, a height calculation unit 70, a tilt determination unit 71, and a tilt calculation unit 72. The storage unit 65 stores tolerance data 66 relating to the tolerance range of the tilt of the transfer head 1, and a production program 67.

[0088] The mounting control unit 69 controls the operations of the component supply unit movement unit 78 , stage movement unit 80 , stage tilt adjustment unit 81 , mounting head drive mechanism 86 , and tool lifting mechanism 89 based on the production program 67 in the memory unit 65 .

[0089] The height calculation unit 70 calculates the height of the transfer head 1 that has come into contact with the protrusion 63 based on the amount of motor drive from the initial height at which the transfer head 1 begins to descend until the detection signal from the photoelectric sensor 139 is received.

[0090] The tilt determination unit 71 determines whether or not the transfer head 1 is tilted with respect to the stage 53 based on the allowable data 66 stored in the memory unit 65 and the tilts SX and SY of the transfer head 1 calculated by the tilt calculation unit 72.

[0091] The tilt calculation unit 72 calculates the tilts SX and SY of the transfer head 1 based on the detection results of the heights of the transfer head 1 at least three or more points located on a non-linear line in the horizontal direction. Furthermore, when the tilt determination unit 71 determines that the transfer head 1 is tilted, the tilt calculation unit 72 calculates the amount of adjustment for making the transfer head 1 parallel to the stage 53 based on the calculated tilts SX and SY of the transfer head 1.

[0092] (Transfer head tilt detection method) Next, a method of determining whether or not the transfer head 1 is inclined with respect to the stage 53 will be described with reference to Figures 10 to 12 and 14. Figure 14 is a flowchart of a method of detecting the inclination of the transfer head.

[0093] When the operator instructs the control unit 56 to activate the inclination detection mode for the transfer head 1, the control unit 56 moves the mounting head 52 to the delivery position Pc, as shown in FIG.

[0094] In step S1, the control unit 56 controls the driving of the stage moving unit 80 to move the protrusion 63 together with the stage 53 to a predetermined first position.

[0095] In step S2, the control unit 56 drives and controls the head moving unit 54 to move the transfer head 1 to the mounting position Pa, and drives and controls the head lifting mechanism 58 to lower the transfer head 1 toward the stage 53. As a result, the contact point 2ca of the base 2 of the transfer head 1 comes into contact with the protrusion 63 located at the first position.

[0096] In step S3, the photoelectric sensor 139 no longer detects light, thereby detecting contact between the transfer head 1 and the protrusion 63. The photoelectric sensor 139 sends a detection signal indicating that light is not being detected to the control unit 56, and the control unit 56 can recognize that the transfer head 1 and the protrusion 63 are in contact based on this detection signal.

[0097] In step S4, the height calculation unit 70 of the control unit 56 calculates the height of the transfer head 1 that has come into contact with the protrusion 63, and detects the height of the transfer head 1.

[0098] In step S5, the control unit 56 determines whether or not the detection of the height of the transfer head 1 has been completed at a predetermined number of positions. In this embodiment, the protrusion 63 is moved to four positions and the height of the transfer head 1 is detected at each position, but this is not limited to this. The number of positions at which the height of the transfer head 1 is detected may be three, or five or more.

[0099] When the control unit 56 determines that the detection of the height of the transfer head 1 has not been completed at a predetermined number of positions (No in step S5), the process returns to step S1 to detect the height of the transfer head 1 at the next position. When the control unit 56 determines that the detection of the height of the transfer head 1 has been completed at a predetermined number of positions (Yes in step S5), in step S6, the tilt calculation unit 72 of the control unit 56 calculates the amount of tilt of the transfer head 1 with respect to each of the X-axis and Y-axis directions of the stage 53.

[0100] In step S7, the tilt determination unit 71 of the control unit 56 compares the calculated tilt amount of the transfer head 1 with allowable data, which is a threshold value of the tilt amount in each of the X-axis direction and the Y-axis direction stored in advance in the storage unit 65, and when it is determined that the tilt amount in both the X-axis direction and the Y-axis direction is equal to or less than the threshold value, it determines that the transfer head 1 is not tilted (No in step S7). The control unit 56 notifies the operator that the transfer head 1 and the stage 53 are parallel by displaying this on the touch panel 5, and ends the tilt detection mode of the transfer head 1.

[0101] In step S7, if the tilt determination unit 71 determines that the calculated tilt amount is greater than a threshold value in at least either the X-axis direction or the Y-axis direction, it determines that the transfer head 1 is tilted (Yes in step S7), and in step S8, the tilt calculation unit 72 calculates the adjustment amount of the tilt of the transfer head 1.

[0102] In step S9, the operator adjusts the micrometer heads 117 and 127 according to the adjustment amount of the tilt of the transfer head 1 displayed on the touch panel, thereby correcting the tilt of the transfer head 1 and making the transfer head 1 parallel to the stage 53. In addition, the stage tilt adjustment unit 81 may automatically adjust the tilt of the stage 53 based on the tilt correction amount instructed by the tilt calculation unit 72, thereby correcting the stage 53 to be parallel to the transfer head 1 in accordance with the tilt of the transfer head 1. After this, the tilt detection mode of the transfer head 1 is terminated. Note that the tilt correction amount instructed by the tilt calculation unit 72 is a predetermined amount, and the tilt of the transfer head 1 may be corrected stepwise by performing tilt detection again from step S1.

[0103] (effect) As described above, the flux transfer device 101 of the embodiment includes the transfer head 1 having a plurality of transfer pins 12 for transferring flux 57 to a substrate 62 on which a component 61 is to be mounted, the transfer head 1 being placed on a stage 53, a head lifting mechanism 58 for raising and lowering the transfer head 1, a height detection unit 60 for detecting the height of the transfer head 1 lowered by the head lifting mechanism 58, and a control unit 56 for calculating the inclination of the transfer head 1 based on the detection results of the height of the transfer head 1 at least three or more points located on a non-linear line in the horizontal direction.

[0104] The height detection unit 60 detects the height of the transfer head 1 at least three or more points located on a non-straight line in the horizontal direction, and based on this detection result, the control unit 56 calculates the inclination of the transfer head 1, thereby assisting in adjusting the inclination between the transfer object with which the transfer pin 12 comes into contact and the transfer head 1.

[0105] The flux transfer device 101 is also provided with a protrusion 63 that is provided on the stage 53 and comes into contact with the lowered transfer head 1. The height detection unit 60 detects the height of the transfer head 1 when the transfer head 1 comes into contact with the protrusion 63. By bringing the transfer head 1 into contact with the protrusion 63 that is at the same distance from the stage 53, the inclination of the transfer head 1 with respect to the stage 53 can be detected with high accuracy.

[0106] In the above embodiment, the detection of contact between the transfer head 1 and the protrusion 63 is triggered by the photoelectric sensor 139 no longer detecting light, but this is not limited to the above. As with the tool lifting mechanism 89 of the mounting head 52, the head lifting mechanism 58 may be equipped with a pressure sensor to detect an increase in pressure caused by the transfer head 1 coming into contact with the protrusion 63, thereby detecting contact between the transfer head 1 and the protrusion 63.

[0107] The flux transfer device 101 also includes a stage moving unit 80 that moves the stage 53 in the horizontal direction. When the height detection unit 60 detects the height of the transfer head 1 at the first position, the control unit 56 causes the head lifting mechanism 58 to lift the transfer head 1, causes the stage moving unit 80 to move the stage 53 in the horizontal direction from the first position to the second position, and causes the head lifting mechanism 58 to lower the transfer head 1 so that the transfer head 1 comes into contact with the protrusion 63. The height detection unit 60 detects the height of the transfer head 1 at the second position.

[0108] With the transfer head 1 remaining positioned at the same position in the horizontal direction, the protrusion 63 provided on the stage 53 moves horizontally together with the stage 53, and the height detection unit detects the height of the transfer head at different points. This makes it possible to calculate the inclination of the transfer head 1 with greater accuracy.

[0109] The transfer head 1 also has a base 2 that supports the transfer pins 12, and the base 2 has an outer peripheral area 2aa from which multiple transfer pins 12 protrude. When the transfer head 1 descends, the peripheral area 2aa of the base 2 comes into contact with the protrusions 63. The contact between the peripheral area 2aa of the base 2 and the protrusions 63, rather than the transfer pins 12, can prevent the transfer pins 12 from being damaged.

[0110] In a state where the transfer head 1 is located at a mounting position in the horizontal direction where the component 61 is mounted on the board 62, the protrusion 63 is disposed at a position where the protrusion 63 comes into contact with the transfer head 1 when the transfer head 1 is lowered. Since the inclination of the transfer head 1 is calculated with the transfer head 1 located at the mounting position in the horizontal direction, it is possible to adjust the inclination of the transfer head 1 when actually transferring flux to the board 62.

[0111] The flux transfer device 101 also includes a storage unit 65 that stores tolerance data related to the tolerance range of the tilt of the transfer head 1. The control unit 56 judges whether the tilt of the transfer head 1 is appropriate or not based on the tolerance data stored in the storage unit 65 and the calculation result related to the tilt of the transfer head 1. This allows the control unit 56 to make an appropriate judgment even when it is difficult for the worker to judge whether the transfer head 1 is tilted or not, thereby supporting the worker.

[0112] The flux transfer device 101 also includes a head tilt adjustment unit 59 that adjusts the tilt of the transfer head 1. When the control unit 56 determines that the tilt of the transfer head 1 is not appropriate, it calculates the amount of adjustment by the head tilt adjustment unit 59. This makes it possible to easily obtain the amount of adjustment for adjusting the tilt of the transfer head 1, and does not require the operator to calculate it.

[0113] In addition, the flux transfer device 101 includes a touch panel 5 as a display unit that displays the adjustment amount. This allows the operator to know the adjustment amount for adjusting the tilt of the transfer head 1, and thus allows the operator to adjust the tilt of the transfer head 1 by operating the head tilt adjustment unit 59. This allows the stage 53 and the transfer head 1 to be appropriately parallel to each other.

[0114] Furthermore, the flux transfer device 101 includes a stage tilt adjustment unit 81 that adjusts the tilt of the stage 53. When the control unit 56 determines that the tilt of the transfer head 1 is not appropriate, it calculates the amount of adjustment by the stage tilt adjustment unit 81 and controls the driving of the stage tilt adjustment unit 81 based on the amount of adjustment. Instead of adjusting the tilt of the transfer head 1, the tilt of the stage 53 is adjusted so that the stage 53 is parallel to the tilt of the transfer head 1, thereby making it possible to transfer the flux appropriately.

[0115] The protrusion 63 has a convex and curved shape toward the descending transfer head 1. Because the protrusion 63 has a convex and curved shape, it can come into contact with the transfer head 1 at one point. This suppresses variation in the contact point, and allows the height of the transfer head 1 to be detected with high accuracy.

[0116] Furthermore, by being equipped with the flux transfer device 101, the component mounting apparatus 50 can determine whether the transfer head 1 is tilted with respect to the stage 53 while mounting of the component 61 on the substrate 62 is stopped, and can confirm whether the flux transfer is being performed properly.

[0117] The component mounting method of the embodiment includes a lowering step (S2) in which a transfer head 1 having a plurality of transfer pins 12 for transferring flux 57 to a substrate 62 on which a component 61 is to be mounted, which is placed on a stage 53, is lowered by a head elevating mechanism 58, a height detection step (S4) in which a height of the transfer head 1 lowered in the lowering step is detected, and a control step (S6) in which an inclination of the transfer head 1 is calculated based on a detection result in the height detection step of the heights of at least three or more different points of the transfer head 1 that are nonlinearly different in the horizontal direction. This makes it possible to assist in adjusting the inclination between the transfer head 1 and the transfer target object with which the transfer pins 12 come into contact.

[0118] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be apparent to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they deviate from the scope of the present disclosure. In addition, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0119] In the above-described embodiment, the control unit 56 included in the component mounting device 50 calculates the inclination of the transfer head 1 of the flux transfer device 101, but this is not limited to the above. The flux transfer device 101 may include a control unit other than the control unit 56, and this control unit may have an inclination determination unit 71 and an inclination calculation unit 72 to calculate the inclination of the transfer head 1. Also, the control unit 151 of the component mounting system 150 may have an inclination determination unit 71 and an inclination calculation unit 72 to calculate the inclination of the transfer head 1.

[0120] Any of the various embodiments and modifications described above may be appropriately combined to achieve the effects of each of them. [Industrial Applicability]

[0121] The flux transfer device, component mounting device, component mounting system, and component mounting method according to the present disclosure are applicable to a flux transfer device, component mounting device, component mounting system, and component mounting method that transfer flux to a board. [Explanation of symbols]

[0122] 1 Transfer head 2. Bass 2a Bottom side 2b Top side 2aa surrounding area 2ca, 2cb, 2cc, 2cd contact points 4 Foundation 5. Touch Panel 12 Transfer pin 12a Bottom 50 Component mounting equipment 51 Parts Supply Department 52 Mounting head 53 Stage 54 Head movement part 55 Flux Supply Unit 56 Control Unit 57 Flux 58 Head lift mechanism 58a Arm 59 Head tilt adjustment part 60 Height detection unit 61 parts 62 Substrate 63 Protrusion 65 Storage section 67 Production Program 69 Mounting control section 70 Height Calculation Unit 71 Inclination determination section 72 Tilt calculation section 78 Parts Supply Section Moving Section 80 Stage movement part 81 Stage tilt adjustment part 83 Pickup Head 86 Mounting head drive mechanism 87 Tools 88 Parts heating section 88a Tool Thermometer 89 Tool lifting mechanism 89a Pressure Sensor 90 Ultrasonic Oscillator 101 Flux transfer device 111 First tilt adjustment mechanism 113 Second tilt adjustment mechanism 115 Plate 117 Micrometer Head 117a Thimble 117b Spindle 117c Sleeve 119 Pin 121 Gap 123 Holder 125 cases 127 Micrometer Head 127a Thimble 127b Spindle 127c sleeve 129 pin 131 Gap 133 Holder 135 Rod 137 Sliding members 139 Photoelectric Sensor 139a Light projector 139b Light receiving section 150 Component Mounting System 151 Control section 152 Storage section Pa Mounting position Pb evacuation position PC delivery position

Claims

1. A transfer head having a plurality of transfer pins for transferring flux to a workpiece on which components are to be mounted, the workpiece being placed on a stage; a lifting mechanism for lifting and lowering the transfer head; a height detection unit that detects the height of the transfer head lowered by the lifting mechanism; a control unit that calculates an inclination of the transfer head based on detection results of heights of the transfer head at at least three or more points that differ nonlinearly in a horizontal direction, Flux transfer device.

2. a contact portion that is provided on the stage and that comes into contact with the lowered transfer head, the height detection unit detects the height of the transfer head in a state where the transfer head and the contact unit are in contact with each other. The flux transfer device according to claim 1 .

3. a stage moving unit that moves the stage in a horizontal direction, The control unit is When the height detection unit detects the height of the transfer head at a first position, The lifting mechanism lifts the transfer head; moving the stage on the stage moving unit in a horizontal direction from a first position to a second position; The lifting mechanism lowers the transfer head so that the transfer head comes into contact with the contact portion. The flux transfer device according to claim 2 .

4. The transfer head has a base that supports the transfer pins, the base has an outer peripheral region from which the plurality of transfer pins protrude; when the transfer head is lowered, the peripheral region of the base comes into contact with the contact portion; The flux transfer device according to claim 2 .

5. the contact portion is disposed at a position where the contact portion comes into contact with the transfer head when the transfer head is lowered in a state where the transfer head is positioned at a mounting position where the component is mounted on the workpiece in a horizontal direction, The flux transfer device according to claim 2 .

6. a storage unit that stores tolerance data relating to a tolerance range of the inclination of the transfer head; the control unit determines whether or not the inclination of the transfer head is appropriate based on the allowable data stored in the storage unit and a calculation result regarding the inclination of the transfer head. The flux transfer device according to claim 1 .

7. a head tilt adjustment unit that adjusts the tilt of the transfer head, When the control unit determines that the inclination of the transfer head is not appropriate, the control unit calculates an adjustment amount to be performed by the head inclination adjustment unit. The flux transfer device according to claim 6.

8. A display unit that displays the adjustment amount is provided. The flux transfer device according to claim 7.

9. A stage tilt adjustment unit that adjusts the tilt of the stage is provided, When the control unit determines that the inclination of the transfer head is not appropriate, the control unit calculates an amount of adjustment to be made by the stage inclination adjustment unit, and controls the driving of the stage inclination adjustment unit based on the amount of adjustment. The flux transfer device according to claim 6.

10. the contact portion has a convex and curved shape toward the descending transfer head; The flux transfer device according to claim 2 .

11. A component mounting apparatus comprising the flux transfer device according to any one of claims 1 to 10.

12. A transfer head having a plurality of transfer pins for transferring flux to a workpiece on which components are to be mounted, the workpiece being placed on a stage; a mounting head that mounts the components received from a component supply unit onto the workpiece to which the flux has been transferred by the transfer head; a lifting mechanism for lifting and lowering the transfer head; a height detection unit that detects the height of the transfer head lowered by the lifting mechanism; a control unit that calculates an inclination of the transfer head based on detection results of heights of the transfer head at at least three or more points that differ nonlinearly in a horizontal direction, Component mounting equipment.

13. A transfer head having a plurality of transfer pins for transferring flux to a workpiece on which components are to be mounted, the workpiece being placed on a stage; a mounting head that mounts the components received from a component supply unit onto the workpiece to which the flux has been transferred by the transfer head; a lifting mechanism for lifting and lowering the transfer head; a height detection unit that detects the height of the transfer head lowered by the lifting mechanism; a control unit that calculates an inclination of the transfer head based on detection results of heights of the transfer head at at least three or more points that differ nonlinearly in a horizontal direction, Component mounting system.

14. a lowering step of lowering a transfer head having a plurality of transfer pins for transferring flux onto a workpiece on which components are to be mounted, the transfer head being placed on a stage, by a lifting mechanism; a height detection step of detecting a height of the transfer head lowered in the lowering step; a control step of calculating an inclination of the transfer head based on a detection result in the height detection step of the heights of the transfer head at at least three or more points that are different in a non-linear manner in a horizontal direction, Component mounting method.

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