Air knife, substrate processing apparatus and attachment for air knife

Abstract

To provide a technology that can quickly eliminate static electricity generated by gas being blown from an air knife.SOLUTION: An air knife 51 blowing gas at an object, comprises a body 72 having a flow channel 74 through which gas flows and a discharge port 73 from which gas is discharged and an ionizer 71 which is provided on a second tip face 723b of the body 72 that forms an obtuse angle to the direction Q of gas discharge from the discharge port 73, and generates ions.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present application relates to an air knife, a substrate processing apparatus, and an attachment for an air knife. [Background technology]

[0002] 2. Description of the Related Art Substrate processing apparatuses that perform various processes on substrates are sometimes provided with an air knife that blows a gas such as air onto the substrate to remove deposits such as droplets and particles. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 5-73939 Summary of the Invention [Problem to be solved by the invention]

[0004] When air or other gas is blown onto a substrate from an air knife, friction with the blown gas may generate static electricity on the substrate. If the substrate becomes charged with static electricity, particles in the air may be attracted to and adhere to the substrate. If the substrate becomes charged and the potential increases, various problems may occur (for example, electricity may flow through the wiring pattern formed on the substrate, causing damage to the wiring pattern, or discharge may occur between the substrate and a member nearby), which may result in a decrease in yield.

[0005] Therefore, for example, Patent Document 1 describes a method in which an air knife is provided on the substrate transport path and an ionizer is provided in the vicinity thereof, and static electricity generated on the substrate by gas being blown from the air knife is neutralized by ions generated by the ionizer.

[0006] In such a configuration, it is important to shorten the time (ion supply time lag) between when gas is sprayed from the air knife to each position on the main surface of the substrate (i.e., when static electricity is generated) and when ions are supplied to the position. As described above, static electricity can cause particle adhesion, damage to wiring patterns, discharge, etc., and the shorter the ion supply time lag, the lower the risk of these events occurring.

[0007] The present application has been made in view of the above problems, and has an object to provide a technique capable of quickly removing static electricity generated when gas is sprayed from an air knife. [Means for solving the problem]

[0008] The first aspect is an air knife for spraying gas onto a target object, comprising a main body having a flow path through which the gas flows and an outlet through which the gas is discharged, and an ionizer for generating ions provided on a surface of the main body that forms an obtuse angle with respect to the direction in which the gas is discharged from the outlet.

[0009] A second aspect is an air knife according to the first aspect, wherein the main body has a first part and a second part formed of different materials, the flow path and the discharge port are provided in the first part, and the ionizer is provided in the second part.

[0010] A third aspect is the air knife according to the second aspect, wherein the first portion is formed from metal.

[0011] A fourth aspect is the air knife according to the second or third aspect, wherein the second portion is formed of an insulating material.

[0012] A fifth aspect is the air knife according to the fourth aspect, wherein the second portion is provided with a recess for accommodating the ionizer.

[0013] A sixth aspect is an air knife according to the first aspect, wherein the main body is formed of metal, a recess is provided in the surface, and the ionizer is housed within the recess with a gap provided between the ionizer and a peripheral wall of the recess.

[0014] A seventh aspect is a substrate processing apparatus comprising: a substrate transport device that transports a substrate along a transport path; and an air knife that blows gas onto the substrate transported along the transport path, wherein the air knife comprises a main body having a flow path through which the gas flows and an outlet through which the gas is discharged, and an ionizer that generates ions provided on a surface of the main body that forms an obtuse angle with respect to the direction in which the gas is discharged from the outlet, the surface being positioned opposite the transport path, and the outlet being positioned upstream of the ionizer in the transport direction of the substrate.

[0015] An eighth aspect is an air knife attachment that is attached to an air knife that blows gas onto a target object, comprising: an attachment main body that is attached to the air knife; and an ionizer that generates ions and is provided on a specified surface of the attachment main body, wherein when the attachment main body is attached to the air knife, the specified surface forms an obtuse angle with respect to the direction of gas ejection from an outlet in the air knife through which the gas is ejected. Effect of the Invention

[0016] According to the first aspect, since the ionizer is provided in the main body portion where the discharge port is provided, the distance between the ionizer and the discharge port can be made small, and therefore static electricity generated by the gas being blown from the air knife can be quickly removed.

[0017] According to the second aspect, the material for forming the first portion and the material for forming the second portion can be selected separately, so that, for example, it is possible to easily achieve both the rigidity required for the first portion in which the flow path and the discharge port are provided and the insulating property required for the second portion in which the ionizer is provided.

[0018] According to the third aspect, the first portion can be made rigid.

[0019] According to the fourth aspect, the second portion can be provided with insulating properties.

[0020] According to the fifth aspect, when the ionizer is housed in the recess, an insulator is present around the ionizer, which effectively prevents the ions generated by the ionizer from being attracted to a nearby conductive member.

[0021] According to the sixth aspect, when the ionizer is housed in the recess, air, which is an insulator, is present around the ionizer, so that it is possible to effectively prevent the ions generated by the ionizer from being attracted to a conductive member present nearby.

[0022] According to the seventh aspect, since the ionizer is provided in the main body portion where the discharge port is provided, the distance between the ionizer and the discharge port can be made small, and therefore static electricity generated by the gas being blown from the air knife can be quickly removed.

[0023] According to the eighth aspect, an air knife with an attachment can be obtained by attaching an air knife attachment to the air knife. With this air knife with an attachment, an ionizer is provided on the attachment body that is attached to the air knife, so that the distance between the ionizer and the outlet provided on the air knife can be reduced. Therefore, static electricity generated by the gas being sprayed from the air knife can be quickly removed. [Brief description of the drawings]

[0024] [Figure 1] 1 is a plan view illustrating a schematic configuration of a substrate processing system. [Diagram 2] FIG. 2 is a diagram illustrating a configuration example of a developing device. [Diagram 3] FIG. 2 is a perspective view showing a substrate transport device. [Figure 4] FIG. 2 shows an air knife. [Diagram 5] FIG. 2 shows an air knife. [Figure 6] FIG. 13 is a diagram showing an air knife disposed in a conveying path. [Figure 7] FIG. 2 illustrates a substrate being transported and an air knife. [Figure 8] 10A and 10B are schematic diagrams for explaining transitions in potential in a case where ions are supplied with a relatively short time lag after static electricity is generated, and in a case where ions are supplied with a relatively long time lag after static electricity is generated. [Figure 9] FIG. 2 shows an air knife, an attachment for the air knife, and an air knife with an attachment. [Figure 10] FIG. 13 is a diagram showing an air knife according to a modified example. [Figure 11] FIG. 1 illustrates a conventional configuration in which an air knife and an ionizer are provided. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, an embodiment will be described with reference to the accompanying drawings. Note that the components described in the embodiment are merely examples, and are not intended to limit the scope of the present disclosure. In addition, in the drawings, the dimensions or numbers of each part may be exaggerated or simplified as necessary for ease of understanding.

[0026] Expressions showing relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only strictly express the positional relationship, but also express a state in which the relative angle or distance is displaced within a range in which a tolerance or similar function is obtained, unless otherwise specified. Expressions showing an equal state (e.g., "same," "equal," "homogeneous," etc.) not only strictly express a quantitatively equal state, but also express a state in which a difference exists in which a tolerance or similar function is obtained, unless otherwise specified. Expressions showing a shape (e.g., "circular," "square," "cylindrical," etc.) not only strictly express the shape geometrically, but also express a shape within a range in which a similar effect is obtained, and may have, for example, unevenness or chamfering. Expressions such as "comprise," "include," "include," "have," etc. of components are not exclusive expressions that exclude the presence of other components. In addition, the expression "at least one of A, B, and C" includes "A only," "B only," "C only," "any two of A, B, and C," and "all of A, B, and C."

[0027] <1. Overall configuration of the substrate processing system> The configuration of the substrate processing system 100 will be described with reference to Fig. 1. Fig. 1 is a plan view showing a schematic example of the configuration of the substrate processing system 100.

[0028] The substrate processing system 100 illustrated here is a system (coater developer system) that performs a coating process of a resist liquid and a developing process on a substrate 9. The substrate 9 to be processed in the substrate processing system 100 is, for example, a rectangular glass substrate used in a liquid crystal display device.

[0029] The substrate processing system 100 has a configuration in which a plurality of substrate processing apparatuses (cleaning apparatus 101, dehydration bake apparatus 102, coating-related apparatus 103, pre-bake apparatus 104, developing apparatus 105, and post-bake apparatus 106) are arranged between an indexer unit ID and an interface unit IF. On a forward line from the indexer unit ID to the interface unit IF, for example, the cleaning apparatus 101, dehydration bake apparatus 102, coating-related apparatus 103, and pre-bake apparatus 104 are arranged in this order. On the other hand, on a return line from the interface unit IF to the indexer unit ID, for example, the developing apparatus 105 and post-bake apparatus 106 are arranged in this order. In addition, the substrate processing system 100 is connected to an exposure apparatus E via the interface unit IF.

[0030] In the indexer part ID, a substrate transport robot (indexer robot) takes out substrates 9 one by one from a container (cassette) that holds a plurality of substrates 9, and sends the taken out substrates 9 to a cleaning apparatus 101.

[0031] In the cleaning apparatus 101, for example, a cleaning liquid is supplied to the substrate 9 to remove particles, organic contaminants, metal contaminants, oils and fats, natural oxide films, and the like adhering to the surface of the substrate 9 (cleaning process). The substrate 9 that has been subjected to the cleaning process is sent to a dehydration bake apparatus 102.

[0032] In the dehydration bake unit 102, the substrate 9 is heated and dehydrated (dehydration bake process). The substrate 9 that has been subjected to the dehydration bake process is sent to a coating-related device 103.

[0033] In the coating-related apparatus 103, a resist liquid is coated onto the substrate 9, and the coated resist liquid is dried, for example, by reduced pressure drying, thereby forming a resist film on the surface of the substrate 9 (coating-related process). The substrate 9 that has been subjected to the coating-related process is sent to a pre-baking apparatus 104.

[0034] In the pre-baking unit 104, the resist film provided on the substrate 9 is heated (pre-baking process) for the purpose of solidifying the resist film, etc. The substrate 9 that has been subjected to the pre-baking process is sent to an interface unit IF.

[0035] In the interface section IF, a substrate transport robot (interface robot) delivers the substrate 9 sent from the pre-bake apparatus 104 to the exposure apparatus E.

[0036] In the exposure device E, the substrate 9 is irradiated with light through a photomask, so that the pattern on the photomask is transferred to a resist film provided on the substrate 9 (exposure process). After the exposure process, the substrate 9 is returned to the interface unit IF.

[0037] In the interface unit IF, the interface robot delivers the substrate 9 that has returned from the exposure apparatus E to the developing apparatus 105.

[0038] In the developing device 105, first, a developer is supplied (applied) to the substrate 9. This causes the development of the resist film to proceed, and a pattern is formed on the substrate 9 (developing process). Next, the substrate 9 is rinsed with a rinse liquid (rinsing process). This stops the development process. Next, the rinse liquid adhering to the substrate 9 is removed (drained) (draining process). The substrate 9 that has undergone the draining process is sent to a post-bake device 106.

[0039] In the post-bake unit 106, the substrate 9 is heated (post-bake process) for the purpose of improving the film quality of the resist after development, etc. The substrate 9 that has been subjected to the post-bake process is sent to the indexer part ID.

[0040] In the indexer part ID, the indexer robot, for example, stores the substrate 9 sent from the post-bake unit 106 in a cassette.

[0041] The substrate processing system 100 includes a control unit 107 that controls each unit (cleaning device 101, dehydration bake device 102, coating-related device 103, pre-bake device 104, developing device 105, post-bake device 106, indexer unit ID, and interface unit IF) included in the substrate processing system 100. A series of operations performed in the substrate processing system 100 are performed under the control of the control unit 107. The control unit 107 is configured, for example, by a general computer having an electric circuit. As an example, the control unit 107 includes a CPU (Central Processor Unit) as a central processing unit responsible for data processing, a ROM (Read Only Memory) in which basic programs and the like are stored, a RAM (Random Access Memory) used as a working area when the CPU performs a predetermined process (data processing), a storage device (for example, a storage device configured by a non-volatile storage device such as a flash memory or a hard disk device), and a bus line connecting these devices to each other. For example, a program that specifies the process to be executed by the control unit 107 is stored in the storage device, and the CPU executes the program, thereby allowing the control unit 107 to execute the process specified by the program. However, some or all of the processing executed by control unit 107 may be executed by hardware such as a dedicated logic circuit.

[0042] <2. Flat flow processing equipment> The substrate processing system 100 includes a plurality of substrate processing apparatuses (cleaning apparatus 101, dehydration bake apparatus 102, coating-related apparatus 103, pre-bake apparatus 104, developing apparatus 105, and post-bake apparatus 106) that transport substrates 9 in one direction and process each substrate 9 one by one (flat flow processing apparatus). For example, cleaning apparatus 101 and developing apparatus 105 correspond to this type of processing apparatus. The configuration of the flat flow processing apparatus will be described below with reference to FIGS. 2 and 3, taking developing apparatus 105 as an example. FIG. 2 is a diagram that shows a schematic configuration example of developing apparatus 105. FIG. 3 is a perspective view that shows a schematic configuration of substrate transport apparatus 1.

[0043] The developing apparatus 105 includes a substrate transport device 1 that transports a substrate 9. The developing apparatus 105 also includes a substrate introduction section 2, a development processing section 3, a rinsing processing section 4, a draining section 5, and a substrate discharge section 6, which are provided in this order from the upstream side of the transport direction D along a transport path formed by the substrate transport device 1. These sections 2, 3, 4, 5, and 6 are provided with processing tanks 2h, 3h, 4h, 5h, and 6h, respectively, and the interiors of adjacent processing tanks 2h, 3h, 4h, 5h, and 6h communicate with each other through a transfer port for passing the substrate 9 therethrough.

[0044] (Substrate transport device 1) The substrate transport device 1 is, for example, a mechanism (roller transport mechanism) that transports the substrate 9 by a roller method, and includes a plurality of roller units 11. Each roller unit 11 includes a long, rod-shaped roller shaft 111 and a roller (transport roller) 112 supported by the roller shaft 111. The roller 112 includes, for example, a cylindrical peripheral surface and a circular main surface provided at both ends in the width direction of the peripheral surface. As an example, the roller shaft 111 is provided to penetrate the center of the main surface of the roller 112 in the normal direction of the main surface, thereby supporting the roller 112 on the roller shaft 111. Here, the roller 112 is fixed to the roller shaft 111 so as not to rotate. Also, here, the plurality of rollers 112 are arranged and supported at intervals (typically at equal intervals) along the extension direction of the roller shaft 111.

[0045] The multiple roller units 11 are arranged in a row with the roller shafts 111 extending parallel to each other and spaced apart from each other along a direction perpendicular to the extension direction of the roller shafts 111. Specifically, for example, the roller shafts 111 of the multiple roller units 11 are installed between a pair of support plates 113 with the roller shafts 111 extending perpendicular to the extension direction of the support plates 113, and are arranged in a row with spaces between them along the extension direction of the pair of support plates 113, 113.

[0046] The substrate conveying device 1 includes a plurality of driving units 12. Each driving unit 12 includes, for example, a motor and rotates the roller shaft 111 around its axis. The roller shaft 111 is arranged coaxially with the rotation axis Lc, and as the roller shaft 111 rotates around its axis, each roller 112 fixed to the roller shaft 111 so as not to rotate rotates around the rotation axis Lc. The roller 112 rotates around the rotation axis Lc while in contact with the substrate 9, so that the substrate 9 is conveyed in the rotation direction of the roller 112. As each roller shaft 111 of the plurality of roller units 11 arranged in a row is rotated in the same direction around the rotation axis Lc, the substrate 9 is conveyed in the arrangement direction of the plurality of roller units 11 along a conveying path defined by the arrangement surface of the plurality of roller units 11.

[0047] Here, for example, a predetermined number of adjacent roller units 11 are grouped to form one roller unit group 11g, and a drive unit 12 is provided for each roller unit group 11g. That is, each roller shaft 111 of a predetermined number of roller units 11 belonging to the same group is driven by the same drive unit 12. The drive unit 12 rotates each roller shaft 111 of the predetermined number of roller units 11 to be driven in the same direction and at the same rotational speed around the rotation axis Lc (synchronous rotation).

[0048] (Substrate introduction section 2) The substrate introduction section 2 is a speed switching section that switches (changes) the transport speed of the substrate 9. For example, in order to improve the throughput, the transport speed in a path section where the substrate 9 is not processed (simply transported) may be set to be faster than the transport speed in a path section where the substrate 9 is processed (for example, a path section from the development processing section 3 to the draining section 5). In this case, the transport speed of the substrate 9 is switched in a speed switching section provided between these two path sections. That is, the substrate introduction section 2 is disposed on the upstream side of the development processing section 3 in the transport direction D, and the speed of the substrate 9 transported at a relatively high speed from the interface section IF is reduced here. Specifically, for example, in the substrate introduction section 2, the rotation speed of the roller unit group 11g on the downstream side of the transport direction D is set to be smaller than the rotation speed of the roller unit group 11g on the upstream side of the transport direction D. As a result, the transport speed of the substrate 9 is switched from high speed to low speed, and the substrate 9 is sent out at a low speed.

[0049] (Development Processing Unit 3) The developing processing section 3 includes a developing nozzle 31 that supplies a developing solution to the upper surface of the substrate 9 transported by the substrate transport device 1. The developing nozzle 31 is, for example, a nozzle having a long discharge port (a so-called slit nozzle) and is disposed in a position such that the extension direction of the discharge port intersects (for example, is perpendicular to) the transport direction D. The developing nozzle 31 is disposed in an inclined position such that the discharge direction is inclined from the vertical downward direction to the downstream side of the transport direction D.

[0050] The developing nozzle 31 is connected to a developer storage section 313 via, for example, a supply pipe 312 having an on-off valve 311 interposed therein. When the on-off valve 311 is opened, the developer is supplied from the developer storage section 313 to the developing nozzle 31 through the supply pipe 312, and the developer is discharged from the discharge port. That is, the developer is discharged in a curtain shape (a curtain shape across the entire width direction (direction perpendicular to the transport direction D) of the substrate 9) along a discharge direction that inclines from a vertical downward direction to the downstream side of the transport direction D. As a result, the developer is supplied to the upper surface of the substrate 9 being transported, and a liquid layer of the developer is formed on the upper surface. The formation of the liquid layer of the developer progresses the development of the resist film, and a pattern is formed on the substrate 9.

[0051] The developing section 3 includes an air knife 32 that ejects gas (here, for example, air) toward the transported substrate 9. The air knife 32 is disposed downstream of the developing nozzle 31 in the transport direction D. The air knife 32 is, for example, a nozzle having a long ejection port, and is disposed in a position such that the extension direction of the ejection port intersects with the transport direction D. The air knife 32 is disposed, for example, in a vertical position such that the ejection direction is vertically downward.

[0052] The air knife 32 is connected to the compressed air supply source Q via, for example, a supply pipe 322 in which an on-off valve 321 is interposed. When the on-off valve 321 is opened, compressed air is supplied from the compressed air supply source Q to the air knife 32 through the supply pipe 322, and the air is discharged at high pressure from the discharge port. That is, the air is discharged at high pressure in a curtain shape (a curtain shape across the entire width direction of the substrate 9) along the vertically downward discharge direction. The air blown vertically downward onto the transported substrate 9 acts as a barrier to prevent the developer on the upper surface of the substrate 9 from moving downstream in the transport direction D together with the substrate 9. The developer that cannot move together with the substrate 9 is swept away upstream in the transport direction D or in a direction intersecting the transport direction D, and flows down from the substrate 9, and is removed from the substrate 9. However, the air knife 32 does not completely remove the developer on the substrate 9, and leaves a small amount of developer on the substrate 9 to the extent that the substrate 9 does not dry out.

[0053] (Rinse processing section 4) The rinse processing unit 4 includes two types of rinse nozzles (a first rinse nozzle 41a and a second rinse nozzle 41b) that supply a rinse liquid to the upper surface of the substrate 9 being transported. The first rinse nozzle 41a is, for example, a nozzle having a long discharge port, and is disposed in a position in which the extension direction of the discharge port intersects with the transport direction D. The first rinse nozzle 41a is, for example, disposed in an inclined position in which the discharge direction inclines from a vertical downward direction to the downstream side of the transport direction D. The second rinse nozzle 41b is disposed downstream of the first rinse nozzle 41a with respect to the transport direction D. The second rinse nozzle 41b is, for example, a nozzle in which a plurality of discharge ports are provided in a long cylindrical body along its extension direction, and is disposed in a position in which the extension direction of the cylindrical body intersects with the transport direction D. A plurality of second rinse nozzles 41b may be provided along the transport direction D.

[0054] The first rinse nozzle 41a and the second rinse nozzle 41b are connected to a rinse liquid storage section 413, for example, via a supply pipe 412 in which an on-off valve 411 is interposed. When the on-off valve 411 is opened, a rinse liquid (for example, pure water as a rinse liquid) is supplied to each rinse nozzle 41a, 41b from the rinse liquid storage section 413 through the supply pipe 412, and the rinse liquid is discharged from the discharge port of each rinse nozzle 41a, 41b. That is, the rinse liquid is discharged in a curtain shape (a curtain shape covering the entire width direction of the substrate 9) from the discharge port of the first rinse nozzle 41a along a discharge direction inclined from a vertical downward direction to the downstream side of the transport direction D. In addition, the rinse liquid is discharged, for example, in a spray shape from each discharge port of the second rinse nozzle 41b. As a result, the rinse liquid is supplied to the upper surface of the substrate 9 being transported, and the developing liquid remaining on the upper surface is replaced with the rinse liquid. That is, the substrate 9 is rinsed with the rinsing liquid.

[0055] (Draining part 5) The liquid drainer 5 includes an air knife 51 that blows gas (here, for example, air) onto the substrate 9 being transported. Here, air knives 51 are provided on both the upper and lower sides of the transport path. Each air knife 51 is, for example, a nozzle having a long discharge port, and is disposed in a position in which the extension direction of the discharge port intersects with the transport direction D. The air knife 51 disposed on the upper side of the transport path is disposed in an inclined position in which the discharge direction is inclined from the vertical downward direction to the upstream side of the transport direction D. Meanwhile, the air knife 51 disposed on the lower side of the transport path is disposed in an inclined position in which the discharge direction is inclined from the vertical upward direction to the upstream side of the transport direction D.

[0056] Each air knife 51 is connected to a compressed air supply source Q via, for example, a supply pipe 512 in which an on-off valve 511 is interposed. When the on-off valve 511 is opened, compressed air is supplied from the compressed air supply source Q to each air knife 51 through the supply pipe 512, and air is discharged at high pressure from the discharge port. That is, air is discharged at high pressure from the discharge port of the air knife 51 arranged on the upper side of the transport path in a curtain shape (a curtain shape covering the entire width direction of the substrate 9) along a discharge direction that inclines from a vertical downward direction to the upstream side of the transport direction D. As a result, liquid adhering to the upper surface of the substrate 9 being transported is blown off to the upstream side of the transport direction D and removed (drained) from the upper surface. On the other hand, air is discharged at high pressure from the discharge port of the air knife 51 arranged on the lower side of the transport path in a curtain shape (a curtain shape covering the entire width direction of the substrate 9) along a discharge direction that inclines from a vertical upward direction to the upstream side of the transport direction D. As a result, the liquid adhering to the lower surface of the transported substrate 9 is blown off to the upstream side in the transport direction D and removed from the lower surface.

[0057] (Board lead-out section 6) Like the substrate introduction section 2, the substrate discharge section 6 is a speed switching section that switches the transport speed of the substrate 9. The substrate discharge section 6 is disposed downstream of the draining section 5 in the transport direction D, and here, for example, the speed of the substrate 9 transported from the draining section 5 at a relatively low speed is accelerated. Specifically, for example, in the substrate discharge section 6, the rotation speed of the roller unit group 11g on the downstream side of the transport direction D is made higher than the rotation speed of the roller unit group 11g on the upstream side of the transport direction D. This switches the transport speed of the substrate 9 from a low speed to a high speed, and the substrate 9 is sent out at high speed.

[0058] <3. Air knife> Next, a detailed description will be given of the air knife 51. The air knife 51 is a device that blows gas onto an object (here, the transported substrate 9), and is provided, for example, in the liquid drainer 5 of the developing device 105 as described above.

[0059] <3-1. Configuration> The configuration of air knife 51 will be described with reference to Figures 4 and 5. Figure 4 is a cross-sectional view of air knife 51 cut along a plane perpendicular to the longitudinal direction. Figure 5 is a view of air knife 51 as viewed from the side of second tip surface 723b.

[0060] The air knife 51 includes an ionizer 71 and a main body portion 72 .

[0061] (Ionizer 71) The ionizer 71 is a device that neutralizes (neutralizes) static electricity by ionizing the surrounding air and generating ions (such devices are also called static eliminators, static electricity removers, etc.). The ionizer 71 is, for example, a long thin plate. Specifically, the ionizer 71 includes, for example, a long thin plate-like base material and an electrode provided along the base material, and generates ions in a planar manner from approximately the entire one main surface (ion generating surface) of the base material by supplying power (for example, high-frequency power) to the electrode to cause discharge. As a commercially available product of such an ionizer 71, for example, there is the Ion Blade (registered trademark) F2 series (catalog URL: https: / / www.fisa.co.jp / product / dynac / ionblade_F2.html) by Fisa Co., Ltd.

[0062] (Main body portion 72) The main body 72 is a long member and has a pair of parallel side surfaces (first side surface 721 and second side surface 722) extending in the long direction, a tip surface 723 connected to one end side of the pair of side surfaces 721, 722 in the short direction, a rear end surface 724 connected to the other end side of the pair of side surfaces 721, 722 in the short direction, and end surfaces 725 connected to each end portion of the pair of side surfaces 721, 722 in the long direction.

[0063] The tip surface 723 is provided with a long discharge port 73 extending along its longitudinal direction. A portion (first tip surface) 723a on one side of the discharge port 73 and a portion (second tip surface) 723b on the other side of the tip surface 723 form a predetermined angle θ smaller than 180 degrees (preferably smaller than 90 degrees). That is, the tip surface 723 has a mountain shape that tapers toward the discharge port 73.

[0064] A flow path 74 communicating with the discharge port 73 is provided inside the main body 72. For example, a pair of inner wall surfaces (first inner wall surface 726 and second inner wall surface 727) extending parallel to a pair of side surfaces 721, 722 are provided inside the main body 72, and a gap provided between the pair of inner wall surfaces 726, 727 becomes the flow path 74. The discharge direction Q of the gas from the discharge port 73 is determined, for example, by the extension direction of the flow path 74. Here, the positional relationship between the flow path 74 (specifically, for example, the inner wall surfaces 726, 727) and the second tip surface 723b is determined so that the discharge direction Q and the second tip surface 723b form a predetermined obtuse angle θq (90 degrees<θq<180 degrees) (that is, so that the flow path 74 and the second tip surface 723b form an acute angle).

[0065] Ionizer 71 is provided on second tip surface 723b. Ionizer 71 is provided on second tip surface 723b so that an ion generating surface is exposed. Ionizer 71 is provided on second tip surface 723b in a position extending parallel to outlet 73 while providing a predetermined gap F between ionizer 71 and outlet 73. The longitudinal dimension of ionizer 71 provided on second tip surface 723b is approximately the same as the longitudinal dimension of outlet 73.

[0066] The second tip surface 723b may be provided with a recess (accommodating recess) 75 for accommodating the ionizer 71. In this case, the ionizer 71 is accommodated in the accommodating recess 75 in such a direction that the ion generating surface is disposed on the opening side of the accommodating recess 75. It is preferable that the depth of the accommodating recess 75 is determined so that the ion generating surface exposed from the accommodating recess 75 is disposed substantially flush with the second tip surface 723b when the ionizer 71 is accommodated in the accommodating recess 75. In other words, it is preferable that the depth of the accommodating recess 75 is approximately the same as the thickness of the ionizer 71. Needless to say, the dimension of the accommodating recess 75 in the extension direction and the dimension in the width direction perpendicular to the extension direction may be approximately equal to or greater than the dimension in the long dimension direction and the dimension in the short dimension direction of the ionizer 71 provided on the second tip surface 723b.

[0067] When the accommodating recess 75 is provided, a locking portion 751 that protrudes inwardly from the opening may be provided on the entire or part of the periphery of the opening. When the locking portion 751 is provided, when ionizer 71 is arranged in accommodating recess 75, first, locking portion 751 is elastically deformed to retract to the outside of the opening, and in this state, ionizer 71 is pushed from the opening into accommodating recess 75. When ionizer 71 is arranged in accommodating recess 75, locking portion 751 is elastically restored to the state protruding inwardly from the opening. This brings ionizer 71 into a state locked in accommodating recess 75 by locking portion 751. However, instead of (or in addition to) locking by locking portion 751, ionizer 71 may be held in accommodating recess 75 by adhesive, double-sided tape, screws, or the like.

[0068] The main body 72 has a configuration in which a first portion M1 formed of a first material and a second portion M2 formed of a second material different from the first material are integrated together. The first portion M1 and the second portion M2 may be integrated together in any manner. For example, the first portion M1 and the second portion M2 may be integrated together by being fixed to each other using a locking structure, an adhesive, a double-sided tape, a screw, or the like.

[0069] The first portion M1 is a portion including the discharge port 73 and the flow path 74. That is, the discharge port 73 and the flow path 74 are provided in the first portion M1. High-pressure gas (e.g., compressed air) flows through the discharge port 73 and the flow path 74. For this reason, the first portion M1 is required to have a rigidity that does not deform even when subjected to the gas pressure. Therefore, a material that can realize the rigidity required for the first portion M1 is selected as the first material. As an example, the first material is a metal (e.g., stainless steel).

[0070] The second portion M2 includes a portion where the ionizer 71 is provided. That is, the ionizer 71 is provided in the second portion M2. For example, an insulator (insulating material) is selected as the second material forming the second portion M2. As an example, the second material is a resin having insulating properties. By providing the ionizer 71 in the second portion M2 formed of an insulator, it is possible to prevent a situation in which ions generated by the ionizer 71 are attracted to a nearby conductive member (for example, the first portion M1 formed of a metal).

[0071] When the accommodating recess 75 for accommodating the ionizer 71 is provided, the accommodating recess 75 is provided in the second portion M2. That is, the accommodating recess 75 may be provided in the second portion M2. When the accommodating recess 75 is provided in the second portion M2 formed of an insulator, the insulator is present around the ionizer 71 in a state where the ionizer 71 is accommodated in the accommodating recess 75. This effectively prevents the ions generated by the ionizer 71 from being attracted to a conductive member present nearby.

[0072] As described above, the discharge port 73 is provided in the first portion M1, and the ionizer 71 is provided in the second portion M2. Therefore, the boundary M between the first portion M1 and the second portion M2 appears between the discharge port 73 and the ionizer 71 on the second tip surface 723b. The distance F between the ionizer 71 and the discharge port 73 is the sum of the distance between the discharge port 73 and the boundary M, that is, the thickness (first thickness) F1 of the first portion M1 as viewed from the second tip surface 723b, and the distance between the ionizer 71 and the boundary M, that is, the thickness (second thickness) F2 of the second portion M2 as viewed from the second tip surface 723b. It is preferable that the distance F between the ionizer 71 and the discharge port 73 is small, and for this purpose, it is preferable to keep the first thickness F1 and the second thickness F2 small. However, as the first thickness F1 becomes smaller, the rigidity of the first portion M1 may decrease. Therefore, it is preferable that the first thickness F1 be as small as possible (for example, about several millimeters) within a range in which the rigidity required for the first portion M1 is ensured. Furthermore, when the first portion M1 is made of a conductive material such as a metal, as the second thickness F2 becomes smaller, the ions generated by the ionizer 71 become more likely to be attracted to the first portion M1. When the ions are attracted to the first portion M1, the number of ions that can reach the substrate 9 decreases. Therefore, it is preferable that the second thickness F2 be as small as possible (for example, about several millimeters) within a range in which the ions can be sufficiently prevented from being attracted to the first portion M1.

[0073] <3-2. Installation mode> The arrangement of air knife 51 will be described with reference to Figures 6 and 7. Figure 6 is a diagram of air knife 51 arranged in a transfer path formed by substrate transfer apparatus 1, viewed from a direction perpendicular to the main surface of substrate 9 to be transferred. Figure 7 is a diagram of substrate 9 to be transferred and air knife 51, viewed from the extension direction of air knife 51.

[0074] The air knife 51 is disposed above or below (above in the illustrated example) the transport path formed by the substrate transport apparatus 1. The air knife 51 is disposed in a position such that the extension direction of the discharge port 73 intersects (for example, non-orthogonally intersects) the transport direction D (arrangement direction of the roller shafts 111).

[0075] The air knife 51 is disposed in such a direction that the discharge port 73 is disposed upstream of the ionizer 71 in the transport direction D. The air knife 51 is also disposed in such a position that the second tip surface 723b, which is the surface on which the ionizer 71 is provided, is disposed facing the transport path. As described above, the second tip surface 723b and the gas discharge direction Q from the discharge port 73 form a predetermined obtuse angle θq. Therefore, when the air knife 51 is disposed in such a direction and position, the discharge direction Q becomes a direction that inclines toward the upstream side of the transport direction D as it approaches the transport path.

[0076] <3-3. Operation> The operation of air knife 51 will now be described with continued reference to FIGS.

[0077] A supply pipe 512 is connected to the air knife 51, and when an opening / closing valve 511 inserted therein is opened, a gas (e.g., compressed air) is supplied to the air knife 51 (FIG. 2). The gas supplied to the air knife 51 flows through a flow path 74 and is discharged from a discharge port 73. In addition, a wiring (not shown) for supplying power to the ionizer 71 is connected to the air knife 51, and when power is supplied to the ionizer 71 through the wiring, ions are generated in a planar shape from the ion generating surface.

[0078] Now, attention is focused on an arbitrary position on the main surface of the substrate 9 being transported by the substrate transport apparatus 1. When the position of interest approaches the air knife 51 as the substrate 9 is transported, first, gas discharged from the discharge port 73 is sprayed onto the position of interest. As described above, the discharge direction Q of the gas from the air knife 51 is a direction that inclines toward the upstream side of the transport direction D as it approaches the transport path. By spraying the gas from such a direction, the liquid adhering to the position of interest is blown away toward the upstream side of the transport direction D and removed from the position of interest.

[0079] When gas is sprayed onto a target position, static electricity may be generated at the target position due to friction with the sprayed gas. However, in this embodiment, ionizer 71 is provided on main body 72 of air knife 51. Therefore, after gas is sprayed onto the target position, ions generated by ionizer 71 are supplied to the target position. The static electricity generated at the target position is eliminated by the ions.

[0080] According to the air knife 51, the time from when static electricity is generated at a target position (specifically, when gas is blown from the air knife 51 to the target position) until ions are supplied to the target position (ion supply time lag) can be shortened. To explain this point, a comparative example is assumed in which an air knife 90 and an ionizer (for example, an ionizer that generates ions in a cone shape from the tip of a needle-shaped electrode) 900 are provided in the transport path (FIG. 11). Here, too, the air knife 90 is disposed in an inclined position (in such a position that the gas discharge direction Q from the discharge port 91 is inclined toward the upstream side of the transport direction D as it approaches the transport path) in order to blow off the liquid adhering to the substrate 9 to the upstream side of the transport direction D. When the air knife 90 is inclined in this direction, the position of the end P on the downstream side of the transport direction D of the air knife 90 shifts downstream. Since the ionizer 900 is disposed further downstream than the downstream end P of the air knife 90, the distance between the ionizer 900 and the discharge port 91 becomes large in the transport direction D. For this reason, the time lag in ion supply becomes relatively long.

[0081] In contrast, in the air knife 51, the ionizer 71 is provided on the second tip surface 723b arranged opposite the transport path in the main body 72 (FIG. 7). That is, in the air knife 51, the ionizer 71 is arranged by utilizing the dead space generated between the transport path and the air knife 90 arranged in an inclined posture in the comparative example. Therefore, the ionizer 71 can be arranged upstream of the end P on the downstream side of the transport direction D of the main body 72, and the interval F between the ionizer 71 and the discharge port 73 can be reduced. Therefore, the time lag of ion supply can be shortened. In addition, when gas is discharged from the discharge port 73, the space between the air knife 51 and the substrate 9 transported on the transport path becomes negative pressure (Venturi effect), and air is sucked in K toward the upstream side of the transport direction D into the space. Here, in the air knife 51, the ionizer 71 is disposed in the dead space that was generated between the air knife 90 and the transport path in the comparative example, so that the space between the air knife 51 and the transport path is narrower than in the comparative example. The narrower this space is, the stronger the air suction K that occurs here. And the stronger the air suction K is, the more ions generated by the ionizer 71 flow upstream in the transport direction D. Therefore, after the gas discharged from the discharge port 73 is sprayed to the target position, ions start to be supplied to the target position before the target position reaches a position opposite the ionizer 71. Therefore, the time lag of ion supply can be further shortened.

[0082] The shorter the time lag of ion supply, the more preferable. FIG. 8 shows a schematic diagram of a transition V1 of the potential at the position of interest when ions are supplied with a relatively short time lag T1, and a transition V2 of the potential at the position of interest when ions are supplied with a relatively long time lag T2. As shown here, if the time lag of ion supply is sufficiently short, the charge is removed at the timing when the potential at the position of interest is rising, so that the maximum potential (peak value of potential) at the position of interest is kept low and the duration of the state of being charged with static electricity (charged state) is kept short. As a result, the risk of particles in the air being attracted to and attached to the position of interest is reduced. In addition, various inconveniences caused by an increase in potential (for example, damage to the wiring pattern due to electricity flowing through the pattern (wiring pattern) formed on the substrate 9, discharge between the substrate 9 and a member nearby, etc.) are sufficiently avoided. Furthermore, the amount of ions required for charge removal can be kept small (i.e., static electricity can be removed with a relatively small amount of ions).

[0083] <3-4.Effects> The air knife 51 according to the embodiment includes a main body 72 having a flow path 74 through which gas flows and an outlet 73 through which the gas is discharged, and an ionizer 71 that generates ions and is provided on a surface (second tip surface) 723b of the main body 72 that forms a predetermined angle θq that is an obtuse angle with respect to the discharge direction Q of the gas from the outlet 73. According to this configuration, the ionizer 71 is provided on the main body 72 in which the outlet 73 is provided, so that the distance F between the ionizer 71 and the outlet 73 can be reduced. Therefore, the time lag in supplying ions can be shortened. That is, static electricity generated by the gas being blown from the air knife 51 can be quickly neutralized.

[0084] Moreover, the air knife 51 has a main body 72 including a first portion M1 and a second portion M2 formed of different materials, the flow path 74 and the discharge port 73 are provided in the first portion M1, and the ionizer 71 is provided in the second portion M2. With this configuration, the material for forming the first portion M1 and the material for forming the second portion M2 can be selected separately. Therefore, for example, the rigidity required for the first portion M1 in which the flow path 74 and the discharge port 73 are provided and the insulating property required for the second portion M2 in which the ionizer 71 is provided can be easily achieved. For example, the first portion M1 can be formed of a metal to provide rigidity to the first portion M1. Also, for example, the second portion M2 can be formed of an insulator to provide insulating property to the second portion M2.

[0085] Moreover, in air knife 51, second portion M2 made of an insulator is provided with a recess (accommodating recess) 75 for accommodating ionizer 71. With this configuration, when ionizer 71 is accommodated in accommodating recess 75, an insulator is present around ionizer 71, and this effectively prevents ions generated by ionizer 71 from being attracted to a nearby conductive member.

[0086] Moreover, the ionizer 71 generates ions in a planar shape. In this type of ionizer 71, the potential of the electrode is less likely to increase compared to the ionizer 900 (FIG. 11) that generates ions from a needle-shaped electrode. If the potential of the electrode is less likely to increase, the risk of particles in the air being attracted to and attached to the electrode is reduced. In turn, the risk of particles attached to the electrode being attached to the substrate 9 is reduced. Therefore, it is permissible to place the ionizer 71 close to the substrate 9. Furthermore, if the potential of the electrode is less likely to increase, discharge is less likely to occur, so it is permissible to place the ionizer 71 close to the substrate 9 (for example, at a distance of about several millimeters) (for example, in the case of the ionizer 900 that generates ions from a needle-shaped electrode, it is necessary to provide a large distance of, for example, about 50 mm to 300 mm between the ionizer 71 and surrounding members to prevent discharge). Furthermore, if ionizer 71 generates ions in a planar shape, even if it is placed close to substrate 9, it is possible to ensure a wide area within the main surface of substrate 9 to which ions are supplied (for example, in ionizer 900 that generates ions from a needle-shaped electrode, ions are generated in a cone shape from the tip of the electrode, so in order to ensure a wide area within the main surface of substrate 9 to which ions are supplied, ionizer 900 must be disposed at a position sufficiently distant from substrate 9). By placing ionizer 71 close to substrate 9, it is possible to make a large number of ions reach substrate 9 even without a gas flow (transport gas flow) for making the ions reach substrate 9. That is, piping, nozzles, etc. for forming a transport gas flow are not required.

[0087] <4. Air knife attachment> Next, an air knife 51a according to another embodiment will be described. The air knife 51a is obtained by attaching an air knife attachment 8 to an air knife 90. This air knife (air knife with attachment) 51a is provided in, for example, the liquid drainer 5 of the developing device 105, similar to the air knife 51 according to the above embodiment.

[0088] <4-1. Configuration> The configurations of air knife attachment 8 and air knife with attachment 51a will be described with reference to Fig. 9. Fig. 9 is a cross-sectional view of air knife attachment 8 and air knife with attachment 51a cut along a plane perpendicular to the longitudinal direction.

[0089] The air knife 90 to which the air knife attachment 8 is attached is, for example, a long member, and includes a pair of side surfaces (first side surface 901 and second side surface 902) extending in the long direction and parallel to each other, a front end surface 903 connected to one end side of the pair of side surfaces 901, 902 in the short direction, a rear end surface 904 connected to the other end side of the pair of side surfaces 901, 902 in the short direction, and end surfaces connected to each end of the pair of side surfaces 901, 902 in the long direction. The front end surface 903 is provided with a long discharge port 91 extending along its long direction. A portion (first front end surface) 903a on one side of the discharge port 91 and a portion (second front end surface) 903b on the other side of the front end surface 903 form a predetermined angle θ smaller than 180 degrees (preferably smaller than 90 degrees). Furthermore, a flow path 92 communicating with the discharge port 91 is provided inside the air knife 90. For example, a pair of inner wall surfaces (first inner wall surface 905 and second inner wall surface 906) extending parallel to a pair of side surfaces 901, 902 are provided inside air knife 90, and a gap provided between the pair of inner wall surfaces 905, 906 forms flow path 92. Discharge direction Q of gas from discharge port 91 is determined by, for example, the extension direction of flow path 92.

[0090] The air knife attachment 8 includes an ionizer 81 and an attachment main body 82.

[0091] (Ionizer 81) The ionizer 81 is similar to the ionizer 71 according to the above embodiment.

[0092] (Attachment body 82) The attachment body 82 is a long member. The dimension of the attachment body 82 in the long direction is approximately the same as the dimension of the air knife 90 in the long direction. The attachment body 82 includes a pair of side surfaces (a first side surface 821 and a second side surface 822) extending in the long direction and parallel to each other, a first tip surface 823 connected to one end side of the first side surface 821 in the short direction, a second tip surface 824 connected to one end side of the second side surface 822 in the short direction, a rear end surface 825 connected to the other end side of the pair of side surfaces 821, 822 in the short direction, and end surfaces connected to each end of the pair of side surfaces 821, 822 in the long direction. The attachment body 82 is formed, for example, from an insulator (for example, a resin having insulating properties).

[0093] Attachment body 82 is attached to air knife 90. Specifically, for example, attachment body 82 is attached to air knife 90 in a position such that first side surface 821 faces (preferably faces and makes surface contact with) second side surface 902 of air knife 90 and first tip surface 823 faces (preferably faces and makes surface contact with) second tip surface 903b of air knife 90. Attachment body 82 may be attached to air knife 90 in any manner. For example, attachment body 82 may be attached to air knife 90 by being fixed to air knife 90 using a locking structure, adhesive, double-sided tape, screws, or the like.

[0094] In a state where the attachment main body 82 is attached to the air knife 90 (attached state), the discharge direction Q of the gas from the discharge port 91 and the second tip surface 824 form a predetermined obtuse angle θq (90 degrees<θq<180 degrees) (that is, the flow path 92 and the second tip surface 824 form an acute angle). In other words, the angle between the first tip surface 823 and the second tip surface 824 and the like are specified so that such a positional relationship is formed in the attached state.

[0095] The ionizer 81 is provided on the second end surface 824. The ionizer 81 is provided on the second end surface 824 so that the ion generating surface is exposed. The ionizer 81 is provided on the second end surface 824 in such a manner that the ionizer 81 extends parallel to the discharge port 91 while providing a predetermined gap F between the ionizer 81 and the discharge port 91 in the attached state. The dimension of the ionizer 81 in the longitudinal direction provided on the second end surface 824 is approximately the same as the dimension of the discharge port 91 in the longitudinal direction. The second end surface 824 may be provided with a recess (accommodation recess) 83 for accommodating the ionizer 81. When the accommodation recess 83 is provided, a locking portion 831 that protrudes inward from the opening may be provided on the entire or part of the periphery of the opening. The configurations of the accommodation recess 83 and the locking portion 831 are the same as the configurations of the accommodation recess 75 and the locking portion 751 according to the above embodiment.

[0096] <4-2. Installation mode> The arrangement of the air knife 51a with the attachment is the same as that of the air knife 51 according to the embodiment described above (see FIG. 6 and FIG. 7). That is, the air knife 51a with the attachment is arranged above or below the transport path formed by the substrate transport device 1 in such a manner that the extension direction of the discharge port 91 intersects with the transport direction D. The air knife 51a with the attachment is arranged in such a direction that the discharge port 91 is located upstream of the ionizer 81 in the transport direction D. The air knife 51a with the attachment is arranged in such a manner that the second tip surface 824, which is the surface on which the ionizer 81 is provided, faces the transport path. As described above, the second tip surface 824 and the gas discharge direction Q from the discharge port 91 form a predetermined angle θq, which is an obtuse angle. Therefore, when the air knife 51a with the attachment is arranged in such a direction and manner, the discharge direction Q becomes a direction that inclines toward the upstream side of the transport direction D as it approaches the transport path.

[0097] <4-3. Operation> The operation of the air knife with attachment 51a is similar to that of the air knife 51 according to the above embodiment (see FIGS. 6 and 7).

[0098] <4-4.Effects> The air knife attachment 8 according to the above embodiment is an air knife attachment attached to an air knife 90, and includes an attachment body 82 attached to the air knife 90, and an ionizer 81 that generates ions and is provided on a predetermined surface (second tip surface) 824 of the attachment body 82. In addition, when the attachment body 82 is attached to the air knife 90, the second tip surface 824 forms a predetermined angle θq that is an obtuse angle with respect to the gas discharge direction Q from the discharge port 91 in the air knife 90 through which the gas is discharged. According to this configuration, an air knife with attachment 51a can be obtained by attaching the air knife attachment 8 to the air knife 90. According to this air knife with attachment 51a, the ionizer 81 is provided on the attachment body 82 attached to the air knife 90, so that the interval F between the ionizer 81 and the discharge port 91 provided in the air knife 90 can be reduced. Therefore, the time lag in ion supply can be shortened. That is, static electricity generated by the gas blown from the air knife 90 can be quickly removed.

[0099] <5. Modifications> In air knife 51 according to the above embodiment, the boundary between first portion M1 and second portion M2 can be defined as appropriate, so long as first portion M1 includes discharge port 73 and flow path 74, and second portion M2 includes accommodating recess 75. For example, the boundary between first portion M1 and second portion M2 may be a surface extending parallel to second inner wall surface 727.

[0100] In the air knife 51 according to the embodiment described above, the main body 72 has a configuration in which the first portion M1 formed of a first material and the second portion M2 formed of a second material different from the first material are integrated together, but such a configuration is not essential. For example, as in the air knife 51b shown in FIG. 10, the entire main body 72b may be formed of a metal (e.g., stainless steel). In this case, however, it is preferable that a storage recess 75b having a size slightly larger than the ionizer 71 is provided in the second tip surface 723b of the main body 72b when viewed along the normal line thereof, and the ionizer 71 is stored in the storage recess 75b while providing a gap G between the ionizer 71 and the peripheral wall 751b of the storage recess 75b. According to this air knife 51b, when the ionizer 71 is accommodated in the accommodation recess 75b, air, which is an insulator, is present around the ionizer 71, thereby effectively preventing the ions generated by the ionizer 71 from being attracted to a nearby conductive member (for example, the main body portion 72b made of metal).

[0101] In the air knives 51, 51a according to each of the above embodiments, the longitudinal dimension of the ionizers 71, 81 provided on the second tip surfaces 723b, 824 is approximately the same as the longitudinal dimension of the outlets 73, 91. However, ionizers 71, 81 shorter than the longitudinal dimension of the outlets 73, 91 may be arranged side by side without any gaps in an area having a length approximately the same as the longitudinal dimension of the outlets 73, 91.

[0102] In the air knife 51, 51a according to each of the above-mentioned embodiments, the second tip surface 723b, 824 is disposed to face the transport path. Here, it is also preferable that the second tip surface 723b, 824 is disposed in a plane parallel to the transport path (and thus the main surface of the substrate 9 being transported).

[0103] The gas supplied to the air knives 51, 51a according to each of the above embodiments may be dry air, clean air, etc. However, the gas supplied to the air knives 51, 51a is not necessarily limited to air, and may be, for example, an inert gas (e.g., nitrogen gas). In addition, a pump or the like for pressurizing the gas flowing therethrough may be inserted in the supply pipe 512 connected to the air knives 51, 51a.

[0104] The air knives 51, 51a according to each of the above-mentioned embodiments may be provided above the conveying path or below the conveying path, as described above. A pair of air knives 51, 51 (51a, 51a) may be disposed opposite each other across the conveying path at the same position in the conveying direction D (FIG. 2), or the air knives 51, 51a may be provided above and below the conveying path at different positions in the conveying direction D.

[0105] The substrate conveying apparatus 1 according to the above embodiment may convey the substrate 9 in an inclined position (a position in which the main surface is inclined in the width direction). That is, the air knives 51, 51a may be provided in a conveying path along which the substrate 9 is conveyed in an inclined position. Naturally, in this case, it is preferable that the air knives 51, 51a are also in an inclined position (a position inclined in the longitudinal direction). In order to convey the substrate 9 in an inclined position, for example, a mechanism (elevating mechanism) for raising and lowering one of the pair of support plates 113, 113 on which the roller shaft 111 is installed may be provided. In such a configuration, when the elevating mechanism raises and lowers one of the support plates 113, 113, the pair of support plates 113, 113 are disposed at different heights from each other, and each roller unit 11 installed between the pair of support plates 113, 113 is in an inclined position. As a result, the substrate 9 is conveyed in an inclined position.

[0106] In the above-described embodiments, the air knife 51, 51a is provided in the developing device 105, but the air knife 51, 51a may be provided in various substrate processing apparatuses other than the developing device 105. For example, the air knife 51, 51a may be provided in the cleaning device 101. As an example, when the cleaning device 101 includes a substrate transport device that transports the substrate 9 by a roller method, a processing unit group (e.g., a cleaning processing unit that supplies a cleaning liquid to the substrate 9 to clean the substrate 9, and a liquid draining unit that removes the cleaning liquid adhering to the substrate 9) provided along a transport path formed by the substrate transport device, a speed switching unit (substrate introduction unit) provided upstream of the processing unit group in the transport direction D, and a speed switching unit (substrate discharge unit) provided downstream of the processing unit group in the transport direction D, the air knife 51, 51a may be provided in the liquid draining unit.

[0107] The air knives 51, 51a according to each of the above-described embodiments may be used to remove liquid adhering to the substrate 9 (to dry the substrate 9), or may be used to remove particles and the like adhering to the substrate 9. In other words, the adhering matter removed by the air knives 51, 51a may be either a liquid or a solid.

[0108] The substrate 9 to be processed in the substrate processing system 100 according to the above embodiment (i.e., the substrate 9 onto which the gas is blown by the air knives 51, 51a) may be any of various glass substrates (e.g., a glass substrate for a liquid crystal display (LCD), a glass substrate for a plasma display (PDP), a glass substrate for an organic light emitting diode (OLED), a glass substrate for a field emission display (FED), a glass substrate for a solar cell panel, a glass substrate for an optical disk, a glass substrate for a magnetic disk, a glass substrate for a photomask, etc.), any of various ceramic substrates (e.g., a ceramic substrate for a magnetic / optical disk), a semiconductor substrate (semiconductor wafer), an electronic device substrate, a printing plate for printing, etc.

[0109] The air knives 51, 51a according to the above embodiments may be mounted on various types of apparatus other than the substrate processing apparatus. That is, the object onto which the gas is blown by the air knives 51, 51a does not necessarily have to be the substrate 9.

[0110] As described above, the air knife, the substrate processing apparatus, and the air knife attachment have been described in detail, but the above description is merely illustrative in all respects, and the air knife, the substrate processing apparatus, and the air knife attachment are not limited thereto. It is understood that countless variations not illustrated can be envisioned without departing from the scope of this disclosure. The configurations described in the above embodiments and the above variations can be appropriately combined or omitted as long as they are not mutually contradictory. [Explanation of symbols]

[0111] 1. Substrate transport device 11 Roller unit 111 Roller shaft 112 Lola 12 Drive unit 5. Liquid draining section 51 Air Knife 71 Ionizer 72 Main body 723b 2nd tip surface 73 Discharge port 74 Flow Path 75 Storage recess M1 1st part M2 2nd part 51a Air knife (air knife with attachment) 8 Air knife attachment 81 Ionizer 82 Attachment body 824 2nd tip surface 83 Storage recess Q Discharge direction 101 Cleaning equipment (substrate processing equipment) 105 Developing device (substrate processing device)

Claims

1. An air knife that blows gas onto an object, a main body portion provided with a flow path through which the gas flows and a discharge port through which the gas is discharged; an ionizer that generates ions and is provided on a surface of the main body that forms an obtuse angle with respect to the discharge direction of the gas from the discharge port; An air knife comprising:

2. 2. The air knife of claim 1, The body portion includes a first portion and a second portion formed of different materials, the flow path and the discharge port are provided in the first portion, The ionizer is provided in the second portion. Air knife.

3. 3. The air knife of claim 2, The first portion is formed of a metal; Air knife.

4. 4. An air knife according to claim 2 or 3, The second portion is formed of an insulating material. Air knife.

5. 5. The air knife of claim 4, The second portion is provided with a recess for accommodating the ionizer. Air knife.

6. 2. The air knife of claim 1, The body portion is formed of a metal, The surface is provided with a recess, The ionizer is accommodated in the recess with a gap provided between the ionizer and a peripheral wall of the recess. Air knife.

7. a substrate transport device that transports the substrate along a transport path; an air knife that blows gas onto the substrate transported along the transport path; Equipped with The air knife is a main body portion provided with a flow path through which the gas flows and a discharge port through which the gas is discharged; an ionizer that generates ions and is provided on a surface of the main body that forms an obtuse angle with respect to the discharge direction of the gas from the discharge port; Equipped with the surface is disposed opposite the transport path, and the discharge port is disposed upstream of the ionizer in a transport direction of the substrate; Substrate processing equipment.

8. An air knife attachment that is attached to an air knife that blows gas onto an object, an attachment body portion attached to the air knife; An ionizer that generates ions and is provided on a predetermined surface of the attachment main body; Equipped with when the attachment body is attached to the air knife, the predetermined surface forms an obtuse angle with respect to a discharge direction of the gas from a discharge port of the air knife through which the gas is discharged. Air knife attachment.

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