Component crimp device and component crimp method

Abstract

To provide a component crimp device which flexibly deals with components arranged on several kinds of curved lines to crimp the components at one time.SOLUTION: A component crimp device 100 includes: a holding device 110 which holds a substrate 200; a first crimp unit 121 and a second crimp unit 122 which crimp components 210 to the substrate 200; and a frame 130 attached with the first crimp unit 121 and the second crimp unit 122. The first crimp unit 121 includes a foundation member 141 and a crimp head 142 which may move relative to the foundation member 141 in a crimp direction. The first crimp unit 121 includes: first moving means 143 which holds the foundation member 141 in a manner that the foundation member 141 may move relative to the frame 130 along a first direction; second moving means 144 which holds the foundation member 141 in a manner that the foundation member 141 may move relative to the frame 130 along a second direction; and attitude change means 145 which changes an attitude of the crimp head 142 in a plane including the first direction and the second direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a component crimping device and a component crimping method. [Background technology]

[0002] Conventionally, there is known a component bonding device that crimps electronic components and other components onto a substrate. For example, Patent Document 1 describes a component crimping device that arranges components at predetermined intervals in a straight line on one edge of a display, which is a substrate, and crimps the components at once using multiple crimping tools that match the intervals between the components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-201188 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in recent years, boards with components arranged along curved edges, such as those used in free-form displays, have been emerging. For such boards, multiple heads arranged in a straight line cannot be used to bond them all at once. For this reason, a method is used in which the components arranged on a curve are bonded one by one while changing the relative positional relationship between the board and the tool. This results in a longer takt time for bonding all the components to the board, reducing productivity.

[0005] In view of the above, the present disclosure provides a component crimping device and a component crimping method that are capable of crimping components at once even onto a board on which the components are arranged along a curved edge. [Means for solving the problem]

[0006] A component crimping apparatus according to one aspect of the present disclosure comprises a holding device that holds a substrate on which components are crimped at each of a plurality of crimping locations, a first crimping unit and a second crimping unit that crimp the components onto the substrate, and a stand on which the first crimping unit and the second crimping unit are mounted, wherein the first crimping unit and the second crimping unit each comprise a base member and a crimping head that is movable relative to the base member in a crimping direction of the components, and at least one of the first crimping unit and the second crimping unit comprises first moving means that holds the base member movably relative to the stand along a first direction that is a direction toward and away from the holding device, second moving means that holds the base member movably relative to the stand along the crimping direction and a second direction intersecting the first direction, and posture changing means that changes the posture of the crimping head in a plane that includes the first direction and the second direction.

[0007] A component crimping method according to one aspect of the present disclosure includes using the first moving means to change at least one of the positions of the base member provided by the first crimping unit and the positions of the base member provided by the second crimping unit in accordance with a plurality of crimping sites of the substrate placed on the holding device, using the second moving means to change at least one of the positions of the base member provided by the first crimping unit and the positions of the base member provided by the second crimping unit in accordance with a plurality of crimping sites of the substrate placed on the holding device, and using the posture changing means to change at least one of the posture of the crimping head provided by the first crimping unit and the posture of the crimping head provided by the second crimping unit in accordance with a plurality of crimping sites of the substrate placed on the holding device, and crimping each of the components arranged at the crimping sites of the substrate at one time using the crimping head provided by the first crimping unit and the crimping head provided by the second crimping unit.

[0008] The above-mentioned comprehensive or specific aspects may be realized by a system, an apparatus, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable recording disk, or may be realized by any combination of the system, the apparatus, the method, the integrated circuit, the computer program, and the recording medium. The computer-readable recording medium includes, for example, a non-volatile recording medium such as a CD-ROM (Compact Disc-Read Only Memory). Effect of the Invention

[0009] According to the component crimping device and the like of the present disclosure, even if the components to be crimped are not arranged in a straight line, it is possible to crimp a plurality of components at once, thereby improving productivity. In addition, it is possible to flexibly handle components arranged in a variety of curved lines. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a perspective view showing the component pressure bonding device before a substrate is set. [Diagram 2] FIG. 4 is a perspective view showing the component pressure bonding device after the substrate has been set; [Diagram 3] FIG. 4 is a perspective view showing a first crimping unit. [Figure 4] FIG. 4 is a block diagram showing a control function of the component crimping device. [Diagram 5] FIG. 11 is a perspective view showing another example of the first crimping unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] A component bonding device in which multiple bonding units are arranged in a straight line cannot simultaneously bond components arranged in a curve. Also, a component bonding device equipped with multiple bonding units arranged to simultaneously bond components arranged in a curve cannot handle a wide variety of boards.

[0012] However, if multiple components cannot be pressure-bonded to multiple types of substrates at once, this will have a large negative impact on productivity. Therefore, the present inventor has invented a component pressure-bonding device that can pressure-bond components to multiple types of substrates at once, as described below.

[0013] For example, a first aspect of the component crimping apparatus of the present disclosure comprises a holding device that holds a substrate on which components are crimped at each of a plurality of crimping locations, a first crimping unit and a second crimping unit that crimp the components onto the substrate, and a stand on which the first crimping unit and the second crimping unit are mounted, wherein the first crimping unit and the second crimping unit each comprise a base member and a crimping head that is movable relative to the base member in a crimping direction of the components, and at least one of the first crimping unit and the second crimping unit comprises first moving means that holds the base member movably relative to the stand along a first direction that is a direction toward and away from the holding device, second moving means that holds the base member movably relative to the stand along the crimping direction and a second direction intersecting the first direction, and posture changing means that changes the posture of the crimping head in a plane that includes the first direction and the second direction. According to the first aspect described above, by changing the position and attitude of at least one of the first and second crimping units, it is possible to crimp components arranged on a curve in response to a variety of substrates at once.

[0014] A second aspect of the component crimping device of the present disclosure includes the first aspect, and the first crimping unit and the second crimping unit may each be attached to the base member so as to be positioned on the opposite side of the crimping head with respect to the substrate placed on the holding device, and may include a support member that supports the crimping portion.

[0015] According to the second aspect, when the posture of one of the first crimping unit and the second crimping unit is changed, the posture of the support member is also changed together with the crimping head, so that the relative positional relationship and the relative posture relationship between the support member and the crimping head can be maintained constant.

[0016] A third aspect of the component crimping device of the present disclosure includes the second aspect, and the posture changing means may change the posture of the crimping head and the support member by changing the posture of the base member within a plane that includes the first direction and the second direction.

[0017] According to the third aspect, the posture of the support member and the posture of the compression head are structurally constant, so that stable compression bonding of components to a wide variety of substrates can be achieved.

[0018] A fourth aspect of the component crimping device of the present disclosure includes the second aspect, and the attitude changing means may include a first attitude changing means attached to the base member and changing the attitude of the crimping head, and a second attitude changing means attached to the base member and changing the attitude of the support member.

[0019] According to the fourth aspect, since the electronic component can be crimped without changing the posture of anything other than the support member and the crimping head, the posture changing means can be made smaller.

[0020] A fifth aspect of the component crimping apparatus of the present disclosure includes any of the first to fourth aspects, and includes a control device capable of independently controlling the movement of the crimping head of the first crimping unit and the crimping head of the second crimping unit, and the control device may cause the crimping of the component by the crimping head of the first crimping unit and the crimping of the component by the crimping head of the second crimping unit to be performed simultaneously.

[0021] According to the fifth aspect, a plurality of components can be crimped at once, and conditions can be set for each component for crimping.

[0022] A sixth aspect of the component crimping method disclosed herein is a component crimping method using the component crimping device of any of the first to fifth aspects, comprising: changing at least one of a position of the base member provided by the first crimping unit and a position of the base member provided by the second crimping unit using the first moving means in accordance with a plurality of crimping sites of the substrate placed on the holding device; changing at least one of a position of the base member provided by the first crimping unit and a position of the base member provided by the second crimping unit using the second moving means in accordance with a plurality of crimping sites of the substrate placed on the holding device; changing at least one of a posture of the crimping head provided by the first crimping unit and a posture of the crimping head provided by the second crimping unit using the posture changing means in accordance with a plurality of crimping sites of the substrate placed on the holding device; and crimping each of the components arranged at the crimping sites of the substrate at one time using the crimping head provided by the first crimping unit and the crimping head provided by the second crimping unit.

[0023] According to the sixth aspect described above, by changing the position and attitude of at least one of the first and second crimping units, it is possible to crimp components arranged on a curve in response to a variety of substrates at once.

[0024] The above-mentioned comprehensive or specific aspects may be realized by a system, an apparatus, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable recording disk, or may be realized by any combination of the system, the apparatus, the method, the integrated circuit, the computer program, or the recording medium. The computer-readable recording medium includes, for example, a non-volatile recording medium such as a CD-ROM. The apparatus may be composed of one or more devices. When the apparatus is composed of two or more devices, the two or more devices may be arranged in one device, or may be arranged separately in two or more separate devices. In this specification and the claims, "apparatus" may mean not only one device, but also a system consisting of multiple devices.

[0025] Hereinafter, the component crimping device and the like according to the present disclosure will be described with reference to the drawings. Note that the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, components, arrangement positions of the components, connection forms, steps (processes), order of steps, and the like shown in the following embodiments are merely examples and are not intended to limit the present disclosure. For example, they can be appropriately changed according to the specifications of the component crimping device and the use environment. In addition, among the components in the following embodiments, components that are not described in the independent claims showing the highest concept are described as optional components. In addition, each figure is a schematic diagram and is not necessarily illustrated strictly. Furthermore, in each figure, substantially the same components are given the same reference numerals, and duplicated descriptions may be omitted or simplified.

[0026] A component pressure bonding apparatus 100 according to an embodiment will be described. FIG. 1 is a perspective view showing the component pressure bonding apparatus 100 before a substrate 200 is set. FIG. 2 is a perspective view showing the component pressure bonding apparatus 100 after the substrate 200 is set. As shown in FIGS. 1 and 2, the component pressure bonding apparatus 100 is an apparatus that pressure bonds a component 210 to a substrate 200, and includes a holding device 110, a pressure bonding unit 120, and a stand 130. In the case of the present embodiment, the component pressure bonding apparatus 100 fixes the component 210 to the substrate 200 by thermocompression bonding the component 210 attached via an adhesive member, thereby ensuring electrical connection between the substrate 200 and the electronic component.

[0027] The substrate 200 is a plate-like member in which components 210 are bonded to each of a plurality of bonding portions 201. The type of substrate 200 is not limited, and examples thereof include a liquid crystal panel and an organic or inorganic EL (Electroluminescence) panel. In the case of this embodiment, the substrate 200 has an edge 202 on at least one side that curves so as to bulge outward in a plan view (as viewed from the Z+ side to the Z− side in the figure), and has bonding portions 201 at a plurality of locations along the edge 202.

[0028] The component 210 is an electronic component, an electric component, or the like that is pressure-bonded to the substrate 200. The type of the component 210 is not limited, but may be, for example, an IC (Integrated Circuit) chip.

[0029] The component 210 is attached to the substrate 200 via an adhesive member. The adhesive member may be arranged on the substrate 200 as a tape or the like made of ACF (Anisotropic Conductive Film), or may be applied to the substrate 200 in a liquid or paste state as ACP (Anisotropic Conductive Paste). ACF is a conductive film formed by mixing conductive particles such as fine metal particles with thermosetting resin and molding it into a film shape. ACP is a paste formed by mixing conductive particles such as fine metal particles with thermosetting resin. Such an adhesive member is fluidized by applying pressure and heat, and then hardened. When the component 210 arranged on the adhesive member is pressed toward the substrate 200, the component 210 and the adhesive member are positioned and temporarily fixed to the substrate 200 by the adhesive force of the adhesive member, that is, temporarily pressure-bonded. The adhesive member does not need to contain conductive particles. In this case, the adhesive material may be placed on the substrate 200 as, for example, a tape made of NCF (Non Conductive Film), or may be applied to the substrate 200 in a liquid or paste state as NCP (Non Conductive Paste).

[0030] The base 130 is a basic structural member on which at least the crimping units 120 are attached. In the case of this embodiment, the base 130 has a plurality of crimping units 120 and a holding device 110 attached thereto.

[0031] The holding device 110 is a device that can hold the substrate 200 and move the held substrate 200 to a predetermined position. In the case of this embodiment, the holding device 110 holds the substrate 200 in a placed state. The holding device 110 can rotate the held substrate 200 around a vertical axis (Z-axis in the figure), and can move the substrate 200 in a direction toward the pressure bonding units 120 (X-axis direction in the figure) and in the arrangement direction of the pressure bonding units 120 (Y-axis direction in the figure).

[0032] The crimping unit 120 is an apparatus that crimps the component 210 placed on the crimping portion 201 onto the substrate 200, and includes at least a first crimping unit 121 and a second crimping unit 122. In the present embodiment, the component crimping apparatus 100 is an apparatus that can crimp six components 210 onto the substrate 200 at once, and includes a third crimping unit 123, a fourth crimping unit 124, a fifth crimping unit 125, and a sixth crimping unit 126. "Crimping at once" does not only mean that a plurality of components 210 are attached to one substrate 200 at exactly the same time, but also includes some deviation in the crimping time and the crimping timing according to the characteristics of the crimping unit 120.

[0033] 3 is a perspective view showing the first crimping unit 121. The first crimping unit 121 includes a base member 141, a crimping head 142, a first moving means 143, a second moving means 144, a position changing means 145, a pressing device 146, a driving device 147, and a support member 148. In the present embodiment, each of the second crimping unit 122 to the sixth crimping unit 126 has the same structure as the first crimping unit 121.

[0034] The base member 141 is a member that serves as the structural foundation of the first crimping unit 121. The shape of the base member 141 is not limited. In the present embodiment, the base member 141 is J-shaped in side view (as viewed from the Y-axis direction in the figure), and includes a first columnar portion 151 that slidably holds the crimping head 142, a second columnar portion 152 that fixedly holds the support member 148, and a connecting portion 153 that integrally connects the lower end of the first columnar portion 151 and the lower end of the second columnar portion 152.

[0035] The compression head 142 is attached to the base member 141 so as to be movable in the compression direction of the component 210 (the Z-axis direction in the figure), and is a member that presses and compresses the component 210 against the board 200 set on the support member 148. In the case of this embodiment, the compression head 142 is equipped with a heating unit (not shown) that can apply heat to the component 210 when pressing the component 210 against the board 200. In other words, the compression head 142 is capable of thermocompression bonding.

[0036] The support member 148 is attached to the base member 141 so as to be disposed on the opposite side of the crimping head 142 with respect to the substrate 200 placed on the holding device 110, and is a member that supports the crimping part 201 from below. The support member 148 is a member that is so-called a backup. The support member 148 may be provided with a heating unit (not shown) that can apply heat to the component 210 when the component 210 is pressed against the substrate 200.

[0037] The pressing device 146 is a device that applies a pressing force to the crimping head 142. The structure of the pressing device 146 is not limited. In the case of this embodiment, the pressing device 146 is fixed to the opposite side of the crimping head 142 with respect to the first columnar portion 151 of the base member 141, and includes a driving rod 154 that moves in the vertical direction by hydraulic pressure, pneumatic pressure, or the like, and a transmission part 155 that transmits the pressing force of the driving rod 154 to the upper end part of the crimping head 142.

[0038] The first moving means 143 is a member that holds the base member 141 relative to the frame 130 so as to be movable along a first direction (X-axis direction in the figure) that is a direction toward and away from the holding device 110. In the case of this embodiment, the first moving means 143 is provided on its underside with a first groove 156 that fits into a pair of first rails (not shown) that are provided on the upper surface of the second moving means 144 and extend in the first direction, and is capable of reciprocating in the first direction relative to the second moving means 144 by a motor provided in the driving device 147.

[0039] The second moving means 144 is a member that holds the base member 141 movably relative to the stand 130 along the crimping direction (Z-axis direction in the figure) and a second direction (Y-axis direction in the figure) intersecting the first direction (X-axis direction in the figure). In the case of this embodiment, the second moving means 144 is provided on its underside with a second groove 158 that fits into a pair of second rails 157 extending in the second direction provided on the upper surface of the stand 130, and can be reciprocated in the second direction relative to the stand 130 by a motor provided in the drive device 147. The second rails 157 extend from the first crimping unit 121 to the sixth crimping unit 126, and are used in common by all of the crimping units 120.

[0040] The position change means 145 is a member that changes the position of the crimping head 142 in a plane including the first direction and the second direction (in the XY plane in the figure). In the case of this embodiment, the position change means 145 changes the position of the crimping head 142 and the support member 148 by changing the position of the base member 141 in a plane including the first direction and the second direction. That is, the position change means 145 is disposed on the upper surface of the first moving means 143 and supports the base member 141. The position change means 145 changes the position of the crimping head 142 and the support member 148 in a plane including the first direction and the second direction via the base member 141 by rotating around a rotation axis extending in the crimping direction relative to the first moving means 143 by a motor provided in the driving device 147.

[0041] 4 is a block diagram showing the control functions of the component crimping apparatus 100. The control device 160 independently controls the movement of each of the crimping heads 142 provided in each of the first crimping unit 121 to the sixth crimping unit 126. The control device 160 is a computer including a processor such as a CPU (Central Processing Unit) and a DSP (Digital Signal Processor), and a memory. Some or all of the functions of the control device 160 are achieved by the processor executing a program.

[0042] In this embodiment, the pressing device 146 provided in each of the first crimping unit 121 to the sixth crimping unit 126 is connected to an adjustment device from a first adjustment device 161 to a sixth adjustment device 166, and each of the first adjustment device 161 to the sixth adjustment device 166 adjusts the protrusion amount (pressing force) of the drive rod 154 of each pressing device 146. The control device 160 controls the first adjustment device 161 to the sixth adjustment device 166, and thereby, for example, the crimping of the component 210 by the crimping head 142 of the first crimping unit 121, the crimping of the component 210 by the crimping head 142 of the second crimping unit 122, the crimping of the component 210 by the crimping head 142 of the third crimping unit 123, the crimping of the component 210 by the crimping head 142 of the fourth crimping unit 124, the crimping of the component 210 by the crimping head 142 of the fifth crimping unit 125, and the crimping of the component 210 by the crimping head 142 of the sixth crimping unit 126 can be performed at once. The control device 160 can also make the pressing force of each crimping head 142 different based on the history or the like.

[0043] The present disclosure is not limited to the above-mentioned embodiment. For example, the present disclosure may be realized by combining the components described in this specification in any way, or by excluding some of the components. In addition, the present disclosure also includes modifications obtained by applying various modifications that a person skilled in the art can think of to the above-mentioned embodiment without departing from the gist of the present disclosure, that is, the meaning of the words described in the claims.

[0044] For example, as shown in FIG. 5 , the posture changing means 145 may include a first posture changing means 171 that is attached to the base member 141 via a crimping moving portion 173 and changes the posture of the crimping head 142 relative to the crimping moving portion 173, and a second posture changing means 172 that is attached to the upper end surface of the second columnar portion 152 of the base member 141 and changes the posture of the support member 148.

[0045] In addition, although an embodiment has been described in which the first moving means 143, the second moving means 144, and the attitude changing means 145 are moved by a motor provided in the drive device 147, the first moving means 143, the second moving means 144, and the attitude changing means 145 may also be moved manually. [Industrial Applicability]

[0046] The present disclosure can be used in a crimping device that crimps a component onto a substrate. [Explanation of symbols]

[0047] 100 Component crimping device 110 Holding device 120 Crimping unit 121 First crimping unit 122 Second crimping unit 123 Third crimping unit 124 Fourth crimping unit 125 5th crimping unit 126 6th crimping unit 130 Mount 141 Foundation members 142 Crimping head 143 First means of transportation 144 Second means of transportation 145 Position change means 146 Pressing device 147 Drive Unit 148 Support member 151 First columnar part 152 Second columnar part 153 Connecting part 154 Drive rod 155 Transmission section 156 First groove 157 Second Rail 158 Second groove 160 Control device 161 First adjustment device 166 Sixth adjustment device 171 First position change means 172 Second posture change means 173 Crimping moving part 200 boards 201 Crimping area 202 Edge 210 parts

Claims

1. a holding device that holds a substrate on which components are to be crimped at each of a plurality of crimping sites; a first crimping unit and a second crimping unit for crimping the component onto the substrate; A stand on which the first crimping unit and the second crimping unit are mounted, The first crimping unit and the second crimping unit each include: A base member; a crimping head movable in a crimping direction of the component relative to the base member; Equipped with At least one of the first crimping unit and the second crimping unit, a first moving means for holding the base member so as to be movable relative to the frame along a first direction that is a direction toward and away from the holding device; a second moving means for holding the base member movably relative to the frame along the pressure bonding direction and a second direction intersecting the first direction; and a position changing means for changing the position of the crimping head in a plane including the first direction and the second direction. Component crimping device.

2. The first crimping unit and the second crimping unit each include: a support member attached to the base member so as to be disposed on the opposite side of the crimping head with respect to the substrate placed on the holding device, the support member supporting the crimping portion; The component crimping device according to claim 1 .

3. The attitude changing means is The posture of the base member is changed in a plane including the first direction and the second direction, thereby changing the postures of the crimping head and the support member. The component crimping device according to claim 2 .

4. The attitude changing means is a first position changing means attached to the base member and configured to change the position of the crimping head; a second position changing means attached to the base member and adapted to change the position of the support member; The component crimping device according to claim 2 .

5. A control device capable of independently controlling the movement of each of the crimping heads of the first crimping unit and the second crimping unit, The control device includes: The crimping of the component by the crimping head of the first crimping unit and the crimping of the component by the crimping head of the second crimping unit can be performed at the same time.

3. The component crimping device according to claim 1 or 2.

6. A component crimping method using the component crimping device according to claim 1 or 2, Using the first moving means, at least one of the position of the base member provided in the first pressure bonding unit and the position of the base member provided in the second pressure bonding unit is changed according to a plurality of pressure bonding sites of the substrate placed on the holding device; Using the second moving means, at least one of the position of the base member provided in the first pressure bonding unit and the position of the base member provided in the second pressure bonding unit is changed according to a plurality of pressure bonding sites of the substrate placed on the holding device; At least one of the posture of the crimping head of the first crimping unit and the posture of the crimping head of the second crimping unit is changed using the posture changing means according to a plurality of crimping sites of the substrate placed on the holding device; The components arranged on the crimping portions of the substrate are crimped at one time by the crimping head of the first crimping unit and the crimping head of the second crimping unit. Part crimping method.

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