Method of manufacturing high-reliability light source module

Abstract

To provide a method of manufacturing a high-reliability light source module.SOLUTION: A method of manufacturing a high-reliability light source module includes the steps of: dividing a circuit board into a first sub circuit board and a second sub circuit board; fitting a plurality of light sources to the first sub circuit board and the second sub circuit board; arranging the first sub circuit board and the second sub circuit board on a profile; joining the first sub circuit board and the second sub circuit board to each other, and positioning a positive electrode pad and a negative electrode pad of the first sub circuit board and a positive electrode pad and a negative electrode pad of the second sub circuit board; welding one end of a first connection member to the positive electrode pad of the first sub circuit board; welding the other end of the first connection member to the positive electrode pad of the second sub circuit board; welding one end of a second connection member to the negative electrode pad of the first sub circuit board; and welding the other end of the second connection member to the negative electrode pad of the second sub circuit board.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a light source module, and more particularly to a method for manufacturing a highly reliable light source module. [Background technology]

[0002] The light source board used in traditional lighting fixtures is usually fixed on a profile, and the length of the light source board has various specifications (0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.). Traditional light source boards are divided into two types: rigid circuit boards (RPCBs) and flexible circuit boards (FPCBs). Flexible circuit boards are usually formed by dividing a large raw material board. However, the lengths of light source boards currently mainstream in the market are limited to 0.6 meters, 1.2 meters, and 1.5 meters, and light source boards of 1.8 meters and 2.4 meters require expensive large-scale equipment for customized manufacturing. In addition, most suppliers cannot manufacture light source boards of this length. Therefore, the manufacturing costs of light source boards of 1.8 meters and 2.4 meters will increase significantly, and the manufacturing costs of lighting fixtures will also increase. Summary of the Invention [Problem to be solved by the invention]

[0003] An object of the present invention is to provide a method for manufacturing a highly reliable light source module. [Means for solving the problem]

[0004] According to an embodiment of the present invention, there is provided a method for manufacturing a highly reliable light source module, the method including the steps of: dividing a circuit board into a first sub-circuit board and a second sub-circuit board; attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board; arranging the first sub-circuit board and the second sub-circuit board on a profile; bonding the first sub-circuit board and the second sub-circuit board together and aligning a positive electrode pad and a negative electrode pad of the first sub-circuit board with a positive electrode pad and a negative electrode pad of the second sub-circuit board; welding one end of a first connecting member to the positive electrode pad of the first sub-circuit board, welding the other end of the first connecting member to the positive electrode pad of the second sub-circuit board, welding one end of the second connecting member to the negative electrode pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative electrode pad of the second sub-circuit board.

[0005] In one embodiment, the method further includes bending the first connecting member to form a first bend region, the first bend region including a plurality of first bends. 2. The method for manufacturing a highly reliable light source module according to claim 1.

[0006] In one embodiment, the first bent portions are located above the positive pads of the first sub-circuit board or above the positive pads of the second sub-circuit board.

[0007] In one embodiment, the method further includes bending the second connecting member to form a second bend region, the second bend region including a plurality of second bends.

[0008] In one embodiment, the plurality of second bent portions are located above the negative electrode pad of the first sub-circuit board or above the negative electrode pad of the second sub-circuit board.

[0009] In one embodiment, the manufacturing method further includes bending the first connecting member to form a first protrusion and bending the second connecting member to form a second protrusion, wherein an upper end of the first protrusion faces an upper end of the second protrusion.

[0010] In one embodiment, the manufacturing method further includes cutting the circuit board to form the first groove and the second groove.

[0011] In one embodiment, the first groove is located between the first connecting member and the first side wall of the profile.

[0012] In one embodiment, the second groove is located between the second connecting member and the second side wall of the profile.

[0013] In one embodiment, the first connecting member and the second connecting member are a welding strip, a welding rod or a copper wire. Effect of the Invention

[0014] Based on the above, the manufacturing method of a high reliability light source module according to an embodiment of the present invention may have one or more of the following advantages. (1) In one embodiment of the present invention, a method for manufacturing a light source module includes the steps of dividing a circuit board into a first sub-circuit board and a second sub-circuit board; attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board; arranging the first sub-circuit board and the second sub-circuit board on a profile; bonding the first sub-circuit board and the second sub-circuit board to each other and aligning a positive electrode pad and a negative electrode pad of the first sub-circuit board with a positive electrode pad and a negative electrode pad of the second sub-circuit board; welding one end of a first connecting member to the positive electrode pad of the first sub-circuit board, welding the other end of the first connecting member to the positive electrode pad of the second sub-circuit board, welding one end of the second connecting member to the negative electrode pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative electrode pad of the second sub-circuit board. The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (such as 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thus greatly reducing the manufacturing cost of the lighting device to meet market demands. (2) In one embodiment of the present invention, the first connection member of the light source module has a first bending region of a plurality of first bending parts, and the plurality of first bending parts are stacked on each other. The second connection member of the light source module has a second bending region of a plurality of second bending parts, and the plurality of second bending parts are stacked on each other. With the above structural design, the first bending region and the second bending region can be used as a buffer structure, and damage to the first connection member and the second connection member caused by external stress or thermal expansion and contraction during transportation can be effectively prevented. Therefore, the reliability of the light source module can be greatly improved, and the service life of the lighting device can be extended. (3) In one embodiment of the present invention, the first connection member of the light source module has a first protrusion, and the second connection member of the light source module has a second protrusion, and the upper end of the first protrusion faces the upper end of the second protrusion. With the above structural design, the first protrusion and the second protrusion can be used as a buffer structure, and damage to the first connection member and the second connection member caused by external stress or thermal expansion and contraction during transportation can be effectively prevented. Therefore, the reliability of the light source module can be greatly improved, and the life of the lighting device can be extended. (4) In one embodiment of the present invention, the circuit board of the light source module has a first groove and a second groove. The first groove is between the first connecting member and the first side wall of the profile, and the second groove is between the second connecting member and the second side wall of the profile. Through the above structural design, the creepage distance between the multiple pads of the light source module and the profile can be effectively increased. Therefore, the quality of the light source module can be effectively improved to meet the needs of practical applications. (5) In one embodiment of the present invention, the light sources of the light source module can be evenly distributed on the sub-circuit boards. Therefore, through the above structural design, the light generated by the light source module can be made more uniform, so that the overall performance of the lighting device can be improved. Therefore, the lighting device can provide a better user experience. [Brief description of the drawings]

[0015] [Figure 1]FIG. 2 is a first explanatory diagram of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a second explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Diagram 3] FIG. 4 is a third explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 4] FIG. 4 is a fourth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Diagram 5] FIG. 5 is a fifth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 6] FIG. 6 is a sixth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 7] FIG. 7 is a seventh explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 8] FIG. 8 is an eighth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 9] FIG. 9 is a ninth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 10] 4 is a flowchart of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. [Figure 11] 11A to 11C are explanatory diagrams of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. [Figure 12] 4 is a flowchart of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. [Figure 13] 11 is an explanatory diagram of a first connecting member according to still another embodiment of the present invention. FIG. [Figure 14] 13 is an explanatory diagram of a second connecting member according to still another embodiment of the present invention. FIG. [Figure 15] 11 is a flowchart of a method for manufacturing a highly reliable light source module according to yet another embodiment of the present invention. [Figure 16] FIG. 11 is a first explanatory diagram of a method for manufacturing a highly reliable light source module according to still another embodiment of the present invention. [Figure 17]FIG. 11 is a second explanatory diagram of the method for manufacturing a highly reliable light source module according to still another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] In the following embodiments, detailed features and advantages of the present invention are described, the contents of which are sufficient to enable those skilled in the art to understand the technical contents of the present invention and implement them accordingly, and the disclosure contents, claims and drawings in this specification enable those skilled in the art to easily understand the objectives and advantages of the present invention.

[0017] Hereinafter, an embodiment of the manufacturing method of the highly reliable light source module of the present invention will be described with reference to the related drawings. For ease of understanding and ease of description in the drawings, the dimensions and ratios of each member in the drawings may be exaggerated or reduced. In the following description and / or claims, when a member is described as being "connected" or "coupled" to another member, it may be directly connected or coupled to the other member, or an intermediate member may be present. When a member is described as being "directly connected" or "directly coupled" to another member, there is no intermediate member, and other terms for describing the relationship between members or layers should be interpreted in the same manner. For ease of understanding, the same members in the following embodiments will be denoted and described with the same reference numerals.

[0018] 1 is a first explanatory diagram of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. As shown in the figure, first, a circuit board 1 is cut to form a first groove G1 and a second groove G2. In one embodiment, the circuit board 1 may be a flexible printed circuit board (FPCB). In another embodiment, the circuit board 1 may be a rigid printed circuit board (RPCB).

[0019] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0020] FIG. 2 is a second explanatory diagram of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. As shown in the figure, the circuit board 1 is divided into a first sub-circuit board 11 and a second sub-circuit board 12. Then, a plurality of light sources LD are attached to the first sub-circuit board 11 and the second sub-circuit board 12. In one embodiment, the plurality of light sources LD may be light-emitting diodes. In another embodiment, the plurality of light sources LD may be a light-emitting diode array. In one embodiment, the first sub-circuit board 11 and the second sub-circuit board 12 may have the same size. In another embodiment, the first sub-circuit board 11 and the second sub-circuit board 12 may have different sizes. In still another embodiment, the circuit board 1 may be divided into three or more sub-circuit boards.

[0021] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0022] 3 is a third explanatory diagram of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. As shown in the figure, the first sub-circuit board 11 and the second sub-circuit board 12 are placed on the profile MF. Then, the first sub-circuit board 11 and the second sub-circuit board 12 are bonded together, and the positive pad P1+ and the negative pad P1- of the first sub-circuit board 11 are aligned with the positive pad P2+ and the negative pad P2- of the second sub-circuit board 12 (the first sub-circuit board 11 and the second sub-circuit board 12 are fixed together by welding or other similar methods). The positive pad P1+ and the negative pad P1- of the first sub-circuit board 11 may be located between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the second sub-circuit board 12). Similarly, the positive pad P2+ and the negative pad P2- of the second sub-circuit board 12 can be located between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the first sub-circuit board 11). In this way, the first sub-circuit board 11 and the second sub-circuit board 12 can form a complete light source board.

[0023] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0024] 4 and 5 are fourth and fifth explanatory views of a manufacturing method of a highly reliable light source module according to an embodiment of the present invention. As shown in FIG. 4, one end of the first connection member C1 is welded to the positive electrode pad P1+ of the first sub-circuit board 11. Next, as shown in FIG. 5, the first connection member C1 is bent to form a first bending region B1. The first bending region B1 includes two first bending portions BP1, and the two first bending portions BP1 are stacked on each other to form an S-shape in the first bending region B1. In this manner, the first bending portions BP1 are located above the positive electrode pad P1+ of the first sub-circuit board 11. In another embodiment, the first bending portions BP1 may be located above the positive electrode pad P2+ of the second sub-circuit board 12. In another embodiment, the first bending region B1 includes three or more first bending portions BP1, and the first bending portions BP1 are stacked on each other. In this embodiment, the first connection member C1 is a welding strip. In another embodiment, the first connecting member C1 may be a welding rod, a copper wire, or other similar member.

[0025] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0026] 6 is a sixth explanatory diagram of the manufacturing method of the highly reliable light source module according to an embodiment of the present invention. As shown in the figure, the other end of the first connection member C1 is then welded to the positive electrode pad P2+ of the second sub-circuit board 12. In this manner, the first groove G1 is located between the first connection member C1 and the first side wall W1 of the profile MF.

[0027] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0028] 7 and 8 are a seventh and eighth explanatory diagrams of the manufacturing method of the highly reliable light source module according to an embodiment of the present invention. As shown in FIG. 7, one end of the second connection member C2 is similarly welded to the negative electrode pad P1- of the first sub-circuit board 11. As shown in FIG. 8, the second connection member C2 is bent to form a second bending region B2. The second bending region B2 includes two second bending portions BP2, and the two second bending portions BP2 are stacked on each other to form an S-shape in the second bending region B2. In this manner, the multiple second bending portions BP2 are located above the negative electrode pad P1- of the first sub-circuit board 11. In another embodiment, the multiple second bending portions BP2 may be located above the negative electrode pad P2- of the second sub-circuit board 12. In another embodiment, the second bending region B2 includes three or more second bending portions BP2, and the multiple second bending portions BP2 are stacked on each other. In this embodiment, the second connection member C1 is also a welding strip. In another embodiment, the second connecting member C2 may be a welding rod, a copper wire, or other similar member.

[0029] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0030] 9 is a ninth explanatory diagram of the manufacturing method of the highly reliable light source module according to one embodiment of the present invention. As shown in the figure, the other end of the second connection member C2 is then welded to the negative electrode pad P2- of the second sub-circuit board 12. In this manner, the second groove G2 is located between the second connection member C2 and the second side wall W2 of the profile MF.

[0031] Through the above manufacturing method, a complete light source module 2 can be manufactured. In the same way, three or more sub-circuit boards can be bonded together to increase the length of the light source board of the light source module 2. Then, the installation process of the power module, globe and lamp holder can be carried out.

[0032] The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (such as 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thus greatly reducing the manufacturing cost of the lighting device to meet market demands.

[0033] As described above, the first connection member C1 of the light source module 2 has a first bending region B1 of a plurality of first bending portions BP1, and the plurality of first bending portions BP1 are stacked on one another. The second connection member C2 of the light source module 2 has a second bending region B2 of a plurality of second bending portions BP2, and the plurality of second bending portions BP2 are stacked on one another. With the above structural design, the first bending region B1 and the second bending region B2 can be used as a buffer structure, and the first connection member C1 and the second connection member C2 can be effectively prevented from being damaged by external stress or thermal expansion and contraction during transportation. Therefore, the reliability of the light source module 2 is greatly improved, and the life of the lighting device can be extended.

[0034] In addition, the circuit board 1 of the light source module 2 has a first groove G1 and a second groove G2. The first groove G1 is located between the first connecting member C1 and the first side wall W1 of the profile MF, and the second groove G2 is located between the second connecting member C2 and the second side wall W2 of the profile MF. Through the above structural design, the creepage distance between the multiple pads of the light source module 2 and the profile can be effectively increased. Therefore, the quality of the light source module 2 can be effectively improved to meet the needs of practical applications.

[0035] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0036] 10 is a flow chart of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. As shown in the figure, the method for manufacturing a highly reliable light source module according to the present embodiment includes the following steps: Step S101: Divide the circuit board into a first sub-circuit board and a second sub-circuit board. Step S102: Attach a plurality of light sources to the first sub-circuit board and the second sub-circuit board. Step S103: Place the first sub-circuit board and the second sub-circuit board on the profile. Step S104: The first sub-circuit board and the second sub-circuit board are bonded together, and the positive and negative pads of the first sub-circuit board are aligned with the positive and negative pads of the second sub-circuit board. Step S105: One end of the first connection member is welded to the positive electrode pad of the first sub-circuit board, and the first connection member is bent to form a first bending region including a plurality of first bending portions. Step S106: The other end of the first connection member is welded to the positive electrode pad of the second sub-circuit board. Step S107: One end of the second connection member is welded to the negative electrode pad of the first sub-circuit board, and the second connection member is bent to form a second bending region including a plurality of second bent portions. Step S108: The other end of the second connection member is welded to the negative electrode pad of the second sub-circuit board.

[0037] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0038] Although the steps of the methods described herein are shown and described in a particular order, the order of operations of each method may be changed, some steps may be performed in reverse order or simultaneously with other steps, and in alternative embodiments, different steps may be performed intermittently and / or alternatingly.

[0039] In addition, the lengths of light source boards currently mainstream on the market are limited to 0.6 meters, 1.2 meters, and 1.5 meters. Light source boards of 1.8 meters and 2.4 meters require expensive large-scale equipment for customized manufacturing. In addition, most suppliers cannot manufacture light source boards of this length. Therefore, the manufacturing costs of light source boards of 1.8 meters and 2.4 meters will increase significantly, and the manufacturing costs of lighting fixtures will also increase. In contrast, according to an embodiment of the present invention, a manufacturing method for a light source module includes the steps of dividing a circuit board into a first sub-circuit board and a second sub-circuit board, attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board, arranging the first sub-circuit board and the second sub-circuit board on a profile, bonding the first sub-circuit board and the second sub-circuit board to each other and aligning the positive electrode pad and the negative electrode pad of the first sub-circuit board with the positive electrode pad and the negative electrode pad of the second sub-circuit board, welding one end of a first connecting member to the positive electrode pad of the first sub-circuit board, welding the other end of the first connecting member to the positive electrode pad of the second sub-circuit board, welding one end of the second connecting member to the negative electrode pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative electrode pad of the second sub-circuit board. The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (such as 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thus greatly reducing the manufacturing cost of the lighting device to meet market demands.

[0040] In addition, according to an embodiment of the present invention, the first connection member of the light source module has a first bending region of a plurality of first bending parts, and the plurality of first bending parts are stacked on each other. The second connection member of the light source module has a second bending region of a plurality of second bending parts, and the plurality of second bending parts are stacked on each other. With the above structural design, the first bending region and the second bending region can be used as a buffer structure, and damage to the first connection member and the second connection member caused by external stress or thermal expansion and contraction during transportation can be effectively prevented. Therefore, the reliability of the light source module can be greatly improved, and the service life of the lighting device can be extended.

[0041] In addition, according to an embodiment of the present invention, the circuit board of the light source module has a first groove and a second groove. The first groove is between the first connecting member and the first side wall of the profile, and the second groove is between the second connecting member and the second side wall of the profile. Through the above structural design, the creepage distance between the multiple pads of the light source module and the profile can be effectively increased. Therefore, the quality of the light source module can be effectively improved to meet the needs of practical applications.

[0042] Furthermore, according to an embodiment of the present invention, the light sources of the light source module can be evenly distributed on the sub-circuit boards. Therefore, through the above structural design, the light generated by the light source module can be made more uniform, so that the overall performance of the lighting device can be improved. Therefore, the lighting device can provide a better user experience.

[0043] 11 is an explanatory diagram of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. As shown in the figure, this embodiment differs from the previous embodiment in that the structures of the first connection member C1 and the second connection member C2 are changed.

[0044] After completing the steps of FIG. 1 to FIG. 3, one end of the first connection member C1 is welded to the positive electrode pad P1+ of the first sub-circuit board 11. Then, the first connection member C1 is bent to form a first protrusion T1. The distance between the first protrusion T1 and the positive electrode pad P1+ of the first sub-circuit board 11 may be approximately equal to the distance between the first protrusion T1 and the positive electrode pad P2+ of the second sub-circuit board 12. The first protrusion T1 may be triangular. In another embodiment, the first protrusion T1 may be semicircular or other shapes. The shape of the first protrusion T1 may be changed according to actual needs. In this embodiment, the first connection member C1 is a copper wire. Then, the other end of the first connection member C1 is welded to the positive electrode pad P2+ of the second sub-circuit board 12.

[0045] Similarly, one end of the second connection member C2 is welded to the negative electrode pad P1- of the first sub-circuit board 11. Then, the second connection member C2 is bent to form a second protrusion T2, and the upper end A1 of the first protrusion T1 and the upper end A2 of the second protrusion T2 are opposed to each other. The distance between the second protrusion T2 and the negative electrode pad P1- of the first sub-circuit board 11 may be approximately equal to the distance between the second protrusion T2 and the negative electrode pad P2- of the second sub-circuit board 12. The first protrusion T1 and the second protrusion T2 may have the same shape. The second protrusion T2 may be triangular. In another embodiment, the second protrusion T2 may be semicircular or other shapes. The shape of the second protrusion T2 may be changed according to actual needs. In this embodiment, the second connection member C2 is a copper wire. Then, the other end of the second connection member C2 is welded to the negative electrode pad P2- of the second sub-circuit board 12.

[0046] Through the above manufacturing method, a complete light source module 2 can be manufactured. Three or more sub-circuit boards can be bonded together in the same way to increase the length of the light source board of the light source module 2. Then, the installation process of the power module, globe and lamp holder can be proceeded.

[0047] The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thus greatly reducing the manufacturing cost of the lighting device to meet market demands.

[0048] As mentioned above, the first connection member C1 of the light source module 2 has a first protrusion T1, and the second connection member C2 of the light source module 2 has a second protrusion T2, and the upper end A1 of the first protrusion T1 faces the upper end A2 of the second protrusion T2. ​​With the above structural design, the first protrusion T1 and the second protrusion T2 can also be used as a buffer structure, which can effectively prevent the first connection member C1 and the second connection member C2 from being damaged due to external stress or thermal expansion and contraction during transportation. Therefore, the reliability of the light source module 2 is greatly improved, and the life of the lighting device can be extended.

[0049] Similarly, the circuit board 1 of the light source module 2 has a first groove G1 and a second groove G2. The first groove G1 is located between the first connecting member C1 and the first side wall W1 of the profile MF, and the second groove G2 is located between the second connecting member C2 and the second side wall W2 of the profile MF. Through the above structural design, the creepage distance between the multiple pads of the light source module 2 and the profile can be effectively increased. Therefore, the quality of the light source module 2 can be effectively improved to meet the needs of practical applications.

[0050] In addition, the structure design allows the upper end A1 of the first protrusion T1 to face the upper end A2 of the second protrusion T2, so that the first protrusion T1 extends in the direction of the first side wall W1 away from the profile, and the second protrusion T2 extends in the direction of the second side wall W2 away from the profile MF. Therefore, the above structure design can further increase the creepage distance between the two components. Therefore, the quality of the light source module can be further improved and the needs of practical applications can be met.

[0051] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0052] 12 is a flow chart of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. As shown in the figure, the method for manufacturing a highly reliable light source module according to this embodiment includes the following steps: Step S121: Divide the circuit board into a first sub-circuit board and a second sub-circuit board. Step S122: Attach a plurality of light sources to the first sub-circuit board and the second sub-circuit board. Step S123: The first sub-circuit board and the second sub-circuit board are placed on the profile. Step S124: The first sub-circuit board and the second sub-circuit board are bonded together, and the positive and negative pads of the first sub-circuit board are aligned with the positive and negative pads of the second sub-circuit board. Step S125: One end of the first connection member is welded to the positive electrode pad of the first sub-circuit board, and the first connection member is bent to form a first protrusion. Step S126: The other end of the first connection member is welded to the positive electrode pad of the second sub-circuit board. Step S127: One end of the second connecting member is welded to the negative pad of the first sub-circuit board, and the second connecting member is bent to form a plurality of second protrusions, and the upper ends of the first protrusions face the upper ends of the second protrusions. Step S128: The other end of the second connection member is welded to the negative electrode pad of the second sub-circuit board.

[0053] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0054] Although the steps of the methods described herein are shown and described in a particular order, the order of operations of each method may be changed, some steps may be performed in reverse order or simultaneously with other steps, and in alternative embodiments, different steps may be performed intermittently and / or alternatingly.

[0055] Please refer to Figures 13, 14 and 15. Figure 13 is an explanatory diagram of a first connection member according to still another embodiment of the present invention. Figure 14 is an explanatory diagram of a second connection member according to still another embodiment of the present invention. Figure 15 is a flowchart of a manufacturing method of a highly reliable light source module according to still another embodiment of the present invention. As shown in the figure, the difference from the above-mentioned embodiment is that the structures of the first connection member C1 and the second connection member C2 of this embodiment are changed.

[0056] After completing the steps of FIG. 1 to FIG. 3, the first connection member C1 is bent to form two first connection pins UP1 at both ends of the first connection member C1, and the angle between each of the first connection pins UP1 and the first connection member C1 is 90°. The positive electrode pad P1+ of the first sub-circuit board 11 has a first positive electrode pad hole K1+, and the positive electrode pad P2+ of the second sub-circuit board 12 has a second positive electrode pad hole K2+. The two first connection pins UP1 of the first connection member C1 are inserted into the first positive electrode pad hole K1+ and the second positive electrode pad hole K2+, respectively, and welded to connect the positive electrode pad P1+ of the first sub-circuit board 11 and the positive electrode pad P2+ of the second sub-circuit board 12 to the first connection member C1.

[0057] Similarly, the second connection member C2 can be bent to form two second connection pins UP2 at both ends of the second connection member C2, and the angle between each second connection pin UP2 and the second connection member C2 is 90°. The negative electrode pad P1- of the first sub-circuit board 11 has a first negative electrode pad hole K1-, and the negative electrode pad P2- of the second sub-circuit board 12 has a second negative electrode pad hole K2-. The two second connection pins UP2 of the second connection member C2 are inserted into the first negative electrode pad hole K1- and the second negative electrode pad hole K2-, respectively, and welded to connect the negative electrode pad P1- of the first sub-circuit board 11 and the negative electrode pad P2- of the second sub-circuit board 12 to the second connection member C2.

[0058] Through the above manufacturing method, a complete light source module 2 can be manufactured. Three or more sub-circuit boards can be bonded together in the same way to increase the length of the light source board of the light source module 2. Then, the installation process of the power module, globe and lamp holder can be proceeded.

[0059] The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thus greatly reducing the manufacturing cost of the lighting device to meet market demands.

[0060] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0061] 16 and 17 are first and second explanatory views of a manufacturing method for a highly reliable light source module according to yet another embodiment of the present invention. As shown in the drawings, this embodiment is different from the previous embodiment in that a silicone wire is used instead of the first connecting member C1 and the second connecting member C2. The first sub-circuit board 11 further has a pad P1x (the number of pads on the first sub-circuit board 11 exceeds two), and the second sub-circuit board 12 further has a pad P2x (the number of pads on the first sub-circuit board 11 exceeds two). The pad P1x has a pad hole K1x, and the pad P2x has a pad hole K2x.

[0062] After completing the steps of FIG. 1-FIG. 2, one end of the first silicone wire Wr1 can be welded to the first positive pad hole K1+ of the first sub-circuit board 11, and the other end of the first silicone wire Wr1 can be welded to the second positive pad hole K2+ of the second sub-circuit board 12. Then, one end of the two silicone wires Wr2 can be welded to the first negative pad hole K1- of the first sub-circuit board 11, and the other end of the second silicone wire Wr2 can be welded to the second negative pad hole K2- of the second sub-circuit board 12. Similarly, one end of the three silicone wires Wr3 can be welded to the pad hole K1x of the first sub-circuit board 11, and the other end of the third silicone wire Wr1 can be welded to the pad hole K2x of the second sub-circuit board 12.

[0063] The first sub-circuit board 11 and the second sub-circuit board 12 are placed on the profile MF. Next, the first sub-circuit board 11 and the second sub-circuit board 12 are joined together, and the positive pad P1+ and the negative pad P1- of the first sub-circuit board 11 are aligned with the positive pad P2+ and the negative pad P2- of the second sub-circuit board 12 (the first sub-circuit board 11 and the second sub-circuit board 12 can be fixed together by a method such as riveting). The positive pad P1+ and the negative pad P1- of the first sub-circuit board 11 can be positioned between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the second sub-circuit board 12). Similarly, the positive pad P2+ and the negative pad P2- of the second sub-circuit board 12 can be positioned between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the first sub-circuit board 11). In this way, the first sub-circuit board 11 and the second sub-circuit board 12 can form a complete light source board. By arranging the first silicone wire Wr1, the second silicone wire Wr2, and the third silicone wire Wr3 between the profile MF and the light source plate, the space between the profile MF and the light source board can be effectively utilized.

[0064] Through the above manufacturing method, a complete light source module 2 can be manufactured. In the same way, three or more sub-circuit boards can be bonded together to increase the length of the light source board of the light source module 2. Then, the installation process of the power module, globe, and lamp holder can be proceeded.

[0065] Since the number of pads on first sub-circuit board 11 is three or more, the number of pads on second sub-circuit board 12 may also be three or more. Therefore, when the structure of first connection member C1 and second connection member C2 is adopted, a short circuit phenomenon is likely to occur.

[0066] In contrast, the first silicone wire Wr1, the second silicone wire Wr2, and the third silicone wire Wr3 are elastic and bendable, so they can be placed between the profile MF and the light source substrate, preventing various problems caused by external stress and thermal expansion and contraction. The above structure not only makes effective use of the space between the profile MF and the light source substrate, but also prevents the occurrence of short circuits. The above configuration also effectively reduces costs.

[0067] In summary, according to an embodiment of the present invention, a manufacturing method for a light source module includes the steps of dividing a circuit board into a first sub-circuit board and a second sub-circuit board; attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board; arranging the first sub-circuit board and the second sub-circuit board on a profile; bonding the first sub-circuit board and the second sub-circuit board together and aligning the positive electrode pad and the negative electrode pad of the first sub-circuit board with the positive electrode pad and the negative electrode pad of the second sub-circuit board; welding one end of a first connecting member to the positive electrode pad of the first sub-circuit board, welding the other end of the first connecting member to the positive electrode pad of the second sub-circuit board, welding one end of the second connecting member to the negative electrode pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative electrode pad of the second sub-circuit board. The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (such as 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thus greatly reducing the manufacturing cost of the lighting device to meet market demands.

[0068] In addition, according to an embodiment of the present invention, the first connection member of the light source module has a first bending region of a plurality of first bending parts, and the plurality of first bending parts are stacked on each other. The second connection member of the light source module has a second bending region of a plurality of second bending parts, and the plurality of second bending parts are stacked on each other. With the above structural design, the first bending region and the second bending region can be used as a buffer structure, and damage to the first connection member and the second connection member caused by external stress or thermal expansion and contraction during transportation can be effectively prevented. Therefore, the reliability of the light source module can be greatly improved, and the service life of the lighting device can be extended.

[0069] In addition, according to an embodiment of the present invention, the first connection member of the light source module has a first protrusion, and the second connection member of the light source module has a second protrusion, and the upper end of the first protrusion faces the upper end of the second protrusion. With the above structural design, the first protrusion and the second protrusion can be used as a buffer structure, and damage to the first connection member and the second connection member caused by external stress or thermal expansion and contraction during transportation can be effectively prevented. Therefore, the reliability of the light source module can be greatly improved, and the life of the lighting device can be extended.

[0070] In addition, according to an embodiment of the present invention, the circuit board of the light source module has a first groove and a second groove. The first groove is between the first connecting member and the first side wall of the profile, and the second groove is between the second connecting member and the second side wall of the profile. Through the above structural design, the creepage distance between the multiple pads of the light source module and the profile can be effectively increased. Therefore, the quality of the light source module can be effectively improved to meet the needs of practical applications.

[0071] Furthermore, according to an embodiment of the present invention, the light sources of the light source module can be evenly distributed on the sub-circuit boards. Therefore, through the above structural design, the light generated by the light source module can be made more uniform, so that the overall performance of the lighting device can be improved. Therefore, the lighting device can provide a better user experience.

[0072] Although the above embodiments are described in this specification, it should be noted that they do not limit the scope of the claims of the present invention. Therefore, the changes and modifications to the embodiments described in this specification based on the innovative concept of the present invention, or the replacement of equivalent structures or equivalent processes made using the contents of the specification and drawings of the present invention, and the direct or indirect application of the above technical solutions to other related technical fields are all included in the scope of the claims of the present invention. [Explanation of symbols]

[0073] 1 Circuit Board 11 First sub-circuit board 12 Second sub-circuit board 2 Light Source Module LD light source MF Profile P1+ Positive pad of the first sub-circuit board K1+ 1st positive pad hole P1- Negative pad of the first sub-circuit board K1- 1st negative pad hole P1x Pad on the first sub-circuit board K1x Pad hole P2+ Positive pad of the second sub-circuit board K2+ 2nd positive pad hole P2- Negative pad of the second sub-circuit board K2- 1st negative pad hole P2x Second sub-circuit board pad K2x Pad hole C1 First connecting member UP1 First connecting pin C2 Second connecting member UP2 Second connection pin B1 First bending area B2 Second bending area BP1 1st bending part BP2 2nd bending part T1 1st protrusion A1 Top end of first protrusion T2 2nd protrusion A2 Top end of second protrusion Wr1 1st silicone wire Wr2 2nd silicone wire Wr3 3rd silicone wire W1 First side wall of the profile Second side wall of W2 profile G1 1st groove G2 2nd groove S101 Step S102 Step S103 Step S104 Step S105 Step S106 Step S107 Step S108 Step S121 Step S122 Step S123 Step S124 Step S125 Step S126 Step S127 Step S128 Step

Claims

1. Dividing the circuit board into a first sub-circuit board and a second sub-circuit board; mounting a plurality of light sources on the first sub-circuit board and the second sub-circuit board; placing the first sub-circuit board and the second sub-circuit board on a profile; bonding the first sub-circuit board and the second sub-circuit board together and aligning the positive and negative pads of the first sub-circuit board with the positive and negative pads of the second sub-circuit board; welding one end of a first connection member to a positive electrode pad of the first sub-circuit board; welding the other end of the first connection member to a positive electrode pad of the second sub-circuit board; welding one end of a second connection member to a negative electrode pad of the first sub-circuit board; welding the other end of the second connection member to the negative electrode pad of the second sub-circuit board; A method for manufacturing a highly reliable light source module comprising the steps of:

2. The method for manufacturing a highly reliable light source module according to claim 1 , further comprising the step of bending the first connection member to form a first bending region, the first bending region including a plurality of first bent portions.

3. 3. The method for manufacturing a highly reliable light source module according to claim 2, wherein the first bent portions are located above a positive electrode pad of the first sub-circuit board or above a positive electrode pad of the second sub-circuit board.

4. 2. The method of claim 1, further comprising bending the second connection member to form a second bending region, the second bending region including a plurality of second bends.

5. 5. The method for manufacturing a highly reliable light source module according to claim 4, wherein the second bent portions are located above the negative electrode pad of the first sub-circuit board or above the negative electrode pad of the second sub-circuit board.

6. bending the first connection member to form a first protrusion; bending the second connection member to form a second protrusion; 2. The method for manufacturing a highly reliable light source module according to claim 1, further comprising: a top end of the first protrusion facing a top end of the second protrusion.

7. 2. The method for manufacturing a highly reliable light source module according to claim 1, further comprising the step of cutting the circuit board to form a first groove and a second groove.

8. 8. The method for manufacturing a highly reliable light source module according to claim 7, wherein the first groove is located between the first connection member and a first side wall of the profile.

9. 8. The method for manufacturing a highly reliable light source module according to claim 7, wherein the second groove is located between the second connection member and a second side wall of the profile.

10. 2. The method for manufacturing a highly reliable light source module according to claim 1, wherein the first connecting member and the second connecting member are a welding ribbon, a welding rod, or a copper wire.

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