Method for controlling test handler

Abstract

To provide a method for controlling a test hander which can solve the issue that it is difficult to run a test on an electronic component with fine pitches in a case of an existing test handler.SOLUTION: The present invention relates to a method for controlling a handler which can perform distribution in the inside of a handler while an electronic component with a contact terminal of fine pitches is being in electric contact with the test handler. The present invention can secure the rapidness and efficiency of a test on an electronic component with a fine contact terminal and also can secure safety by preventing breakage of an electronic component die before packaging.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for controlling a test handler, and more particularly to a method for controlling a handler that tests and classifies electronic components having fine contact terminals.

Background Art

[0002] The background of the birth of HBM (High Bandwidth Memory) mainly started from the demand for an increase in memory bandwidth generated in high-performance application programs such as computers and graphic processing units.

[0003] Existing GDDR (Graphics Doule Data Rate) memory technology has been widely used in high-performance graphics cards and systems, but it has reached its limit due to the increasing bandwidth requirements. Therefore, memory manufacturers are required to develop new technologies that can provide higher bandwidth and process data more efficiently.

[0004] To meet such requirements, HBM adopted an innovative design that forms a memory chip stack. HBM uses vertically stacked memory chips to achieve high bandwidth, occupying less space and reducing power consumption. Such characteristics have made HBM attract attention as the importance of memory bandwidth and power efficiency increases in high-performance computing and graphic processing systems.

[0005] Such HBM needs to be tested in a die state before packaging. HBM dies are equipped with far more contacts than existing memories, and many contact terminals are provided with a fine pitch in a limited area. However, it has been difficult for conventional test handlers to precisely electrically contact a plurality of HBMs with a tester at the same time.

Prior Art Documents

Patent Documents

[0006] Patent Document 1 Specification of Korean Patent Application Publication No. 10-2021-0148743 Summary of the Invention Problems to be Solved by the Invention

[0007] An object of the present invention is to provide a control method for solving the problem that it is difficult to test electronic components having a fine pitch in the case of a conventional test handler. Means for Solving the Problems

[0008] As a means for solving the above problems, according to the present disclosure, a first loading step of transferring an electronic component from a user tray to a first shuttle, a second loading step of loading at least one electronic component loaded on the first shuttle onto a test tray provided with a pitch adjustment unit, a test step of testing the electronic component in a state where the electronic component is in electrical contact with the pitch adjustment unit, a first unloading step of transferring the tested electronic component from the test tray to a second shuttle, a second unloading step of loading at least one electronic component loaded on the second shuttle onto the user tray, and a step of cleaning at least a part of the empty test tray are included. A control method of a test handler is provided.

[0009] On the other hand, the test step may be performed by achieving an electrical contact extended from the minimum distance between the contact terminals of the electronic component.

[0010] On the other hand, the second loading step may be performed by bringing the contact terminal of the electronic component into contact with the electrical contact means of the pitch adjustment unit.

[0011] On the other hand, after the second loading step, a first transfer step of the test tray for transferring the test tray on which the electronic component is loaded from the loading site to the test site may be further included.

[0012] Further, the second loading stage may be performed while maintaining the state in which the contact terminals of the electronic component are in contact with the electrical contact means of the pitch adjustment unit.

[0013] On the other hand, the test stage may be performed in a state where the contact terminals of the electronic component and the electrical contact means of the tester are not in direct contact with each other.

[0014] On the other hand, the test stage may be performed in a state where electrical contact between the tester and the interposer block of the test tray is achieved.

[0015] On the other hand, the first loading stage may include a stage of picking up the electronic component from the first shuttle, a stage of transferring the electronic component above the socket of the test tray, a stage of aligning the horizontal position of the electronic component, a stage of bringing the contact terminals of the electronic component into contact with the contact means of the pitch adjustment unit, and a stage of fixing the electronic component to the test tray so that the contact terminals can maintain the state of being in contact with the contact means.

[0016] Here, the electronic component may be a High Bandwidth Memory.

[0017] On the other hand, the second loading stage may be performed using a PNP device, and the PNP device may be configured to include a stage of aligning the horizontal position so that the contact terminals of the high bandwidth memory and the contact pins of the pitch adjustment unit can be in contact with each other.

[0018] On the other hand, after the test, it may further include a second transfer stage of transferring the test tray to the unloading site.

[0019] On the other hand, after the first unloading stage, it may further include a third transfer stage of transferring the empty test tray to the cleaning site.

[0020] Further, after the cleaning stage, it may further include a fourth transfer stage of transferring the test tray from the cleaning site to the loading site.

[0021] On the other hand, the cleaning step may be performed by cleaning the contact means of the pitch adjuster provided on the test tray.

[0022] On the other hand, the cleaning step may be performed by cleaning the electrical contact means between the test tray and the tester.

Advantages of the Invention

[0023] The method for controlling a test handler according to the present invention can ensure the speed and efficiency of testing for electronic components having contact terminals with a fine pitch. In addition, since damage to the electronic component die before packaging can be prevented, stability can be ensured.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11a

Figure 11b

Figure 11c

Figure 12a

Figure 12b

Figure 12c

Figure 13a

Figure 13b

Mode for Carrying Out the Invention

[0025] Hereinafter, a method for controlling a test handler according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description of the following embodiments, the names of the respective components may be called by different names in the art. However, if there are functional similarities and identities, even if a modified embodiment is adopted, it can be regarded as an equivalent configuration. In addition, the reference numerals added to the respective components are described for convenience of explanation. However, the illustrated content on the drawings with these reference numerals does not limit the respective components within the scope of the drawings. Similarly, even if an embodiment in which the configuration on the drawing is partially modified is adopted, if there are functional similarities and identities, it can be regarded as an equivalent configuration. In addition, when it is recognized that a component should be naturally included in view of the general technical level in the technical field, the description thereof will be omitted.

[0026] FIG. 1 is a flowchart of a method for controlling a test handler according to an embodiment of the present disclosure.

[0027] As shown in FIG. 1, the method for controlling a test handler according to an embodiment of the present disclosure can be performed using a test tray capable of adjusting an electrical contact portion for testing.

[0028] The method for controlling a test handler according to an embodiment of the present disclosure may include a step (S100) of loading an electronic component onto a test tray, a step (S200) of testing the electronic component loaded on the test tray, a step (S300) of unloading the electronic component for which the test has been completed from the test tray, and a step (S400) of cleaning the contact pins of the unloaded test tray.

[0029] The step of loading the electronic component onto the test tray (S100) corresponds to the step of loading the electronic component to be tested from the user tray onto the test tray. In the present disclosure, the electronic component to be tested may be an electronic component having fine-pitch contact terminals. As an example, it may be a High Bandwidth Memory (HBM). The electronic component is supplied to the test handler in a state where it is loaded on the user tray as a so-called die before packaging.

[0030] In this step (S100), the electronic component is inserted into the insert module of the test handler. At this time, the contact terminals of the electronic component are fixed in contact with the contact pins of the insert module respectively to complete the loading. At this time, the positions of each of the plurality of electronic components can be precisely adjusted and controlled so that they can be loaded.

[0031] The step of testing the electronic component loaded on the test tray (S200) corresponds to the step of performing a test after making electrical contact between the test tray and the tester with the electronic component loaded on the test tray. In this step, the connection terminal of the electronic component and the electrical contact means of the tester do not directly touch each other. The contact terminals of the electronic component are maintained in contact with the first pins provided at the first pitch of the test tray. On the other hand, the second pins arranged at a second pitch larger than the first pitch of the test tray are in contact with the tester so that the test can be performed.

[0032] In this step (S200), the performance test of the electronic component can be configured to be executed according to desired conditions of the electronic component, for example, temperature conditions. For this purpose, the electronic component experiences various temperature changes during the test. However, since such a test process itself can be applied in various ways according to the electronic component, further detailed description is omitted.

[0033] The step of unloading the electronic components that have completed the test from the test tray (S300) corresponds to the step of assigning grades to the electronic components that have completed the test according to their performance, classifying them according to the grades, and discharging them. In this step, it may be performed by unloading the electronic components that have completed the test from the test tray and transferring them to the user tray. This step is performed after opening the insert module of the test tray and using a PNP (Pick up and placing) device or a device called a hand.

[0034] The step of cleaning the contact pins of the unloaded test tray (S400) corresponds to the step of completing the unloading and cleaning the empty test tray. In the present disclosure, the insert module provided in the test tray may be provided with first pins having a fine pitch. Since the first pins are configured with a fine size and provided at fine intervals, they are greatly affected by foreign matters. Therefore, in the present disclosure, the test tray that has completed the loading and unloading of the electronic components is cleaned before loading the electronic components again. In this step, cleaning of the first pins provided inside the test tray and / or the second pins outside can be performed.

[0035] On the other hand, the test tray that has completed the cleaning is transferred so as to be used in the step of loading again.

[0036] Through the above steps, the control method of the test handler according to the present disclosure can perform a test by contacting the test tray once with the electronic components having a fine pitch, transferring the test tray while maintaining the contact, and performing the test. Therefore, damage to the contact terminals of the fine electronic components can be prevented, and damage to the electronic components before packaging can be prevented.

[0037] In addition, according to the control method of the present disclosure, first, electronic components are finely aligned and fixed on a test tray for electrical contact during testing, and when testing, larger contact pins with a larger pitch are used to make electrical contact with a tester. Therefore, the preparation time for testing can be significantly reduced.

[0038] Hereinafter, with reference to FIGS. 2 to 5, the control method of the test handler according to the present disclosure will be described in detail.

[0039] FIG. 2 is a detailed flowchart of the loading stage in the present disclosure.

[0040] As shown in FIG. 2, in the present disclosure, the loading stage includes a first loading stage (S110) of transferring electronic components from a user tray to a first shuttle, a stage (S120) of picking up the electronic components from the first shuttle and aligning the horizontal position of the electronic components so that the contact terminals of the electronic components and the contact pins of the pitch adjustment unit can be in contact, a second loading stage (S130) of loading the electronic components on an insert by a PNP device and maintaining the contact between the contact terminals of the electronic components and the contact pins of the pitch adjustment unit, and a first transfer stage (S140) of transferring the test tray from a loading site to a test site.

[0041] The first loading stage (S110) of transferring electronic components from a user tray to a first shuttle corresponds to a stage of transferring electronic components from a user tray loaded and transferred in units of lots from the outside. In this stage, a predetermined number of a plurality of electronic components can be picked up from the user tray and loaded on the first shuttle. The first shuttle is provided with a plurality of grooves, and the electronic components are seated in each groove. The shuttle can move to a position adjacent to the user tray to shorten the reciprocating distance when the electronic components are transferred from the user tray.

[0042] In the first loading stage, the PNP device is controlled to pick up a plurality of electronic components, adjust the intervals, and then load them on the first shuttle.

[0043] The step (S120) of picking up an electronic component from the first shuttle and aligning the horizontal position of the electronic component so that the contact terminal of the electronic component and the contact pin of the pitch adjustment unit can come into contact can be performed using a PNP device equipped with a vision device. This step is performed after moving the first shuttle to the position (loading position) where the test tray waits for loading. The PNP device can be controlled to move to above the test tray after picking up the electronic component from the first shuttle. Then, after opening the insert module of the test tray (operation to enable insertion of the electronic component), the position of the PNP device is precisely adjusted. In this step, based on the image obtained by using means useful for precise alignment such as a vision module and a non-contact distance sensor provided in the PNP device, the horizontal position can be precisely adjusted so that the contact terminal of the electronic component can come into contact with the first pin of the insert module.

[0044] The second loading step (S130) of loading the electronic component onto the insert with the PNP device and maintaining the contact between the contact terminal of the electronic component and the contact pin of the pitch adjustment unit is a step of maintaining the insert module in a closed state. When the insert module closes, the electronic component can be fixed to the test tray at the same time. This step corresponds to the step of removing the external force acting on the insert module and fixing the electronic component by itself.

[0045] The first transfer step (S140) of transferring the test tray from the loading site to the test site is a step of operating the transfer unit to transfer the test tray to the test site. At this time, the test tray can be adjusted to a posture that is easy to load into the soak chamber before the test. The posture conversion of the test tray may be performed using means such as a flipper and a robot arm.

[0046] Figure 3 is a detailed flowchart of the test step in the present disclosure.

[0047] As shown in FIG. 3, the test stage (S200) includes a stage (S210) of aligning the test tray with the tester, a stage (S220) of electrically contacting the pitch adjustment unit and the tester while the electronic component is in electrical contact with the pitch adjustment unit, and a stage (S230) of performing a test according to temperature conditions.

[0048] The stage (S210) of aligning the test tray with the tester corresponds to the stage of determining a path for transferring the test tray to an empty tester when there are a plurality of testers and aligning a position for electrical contact with the tester. At this time, approximate position adjustment can be performed while moving the test tray along the guiding means.

[0049] The stage (S220) of electrically contacting the pitch adjustment unit and the tester while the electronic component is in electrical contact with the pitch adjustment unit is a stage of pressing the test tray toward the tester side to achieve electrical contact. At this stage, it is contacted with the pins of the tester in a state where the pitch of the electrical contact part is expanded at the rear side of the test tray. The electronic components loaded on the test tray can be indirectly electrically connected via the test tray without directly contacting the tester electrically. At this time, it can be electrically connected to the tester via electrical contact means having an average interval expanded from the average interval between the contact terminals of the electronic component.

[0050] The stage (S230) of performing a test according to temperature conditions corresponds to the stage of performing a performance test on a plurality of electronic components loaded on the test tray under preset conditions.

[0051] FIG. 4 is a detailed flowchart of the unloading stage in the present disclosure.

[0052] As shown in FIG. 4, the unloading stage (S300) may include a second transfer stage (S310) for transferring the test tray to the unloading site after the test, a first unloading stage (S320) for transferring the electronic components from the test tray to the second shuttle, and a second unloading stage (S330) for transferring the electronic components from the second shuttle to the user tray.

[0053] In the unloading stage (S300), the second transfer stage (S310) for transferring the test tray to the unloading site after the test corresponds to the stage of moving the test tray from the tester to the desoak chamber, converting the posture in the opposite direction to the first transfer stage, and moving it to the unloading position. In this stage, the test tray can also be transferred by using elements such as linear movement tray transfer means, vertical position adjustment means, and posture conversion means.

[0054] The first unloading stage (S320) for transferring the electronic components from the test tray to the second shuttle is performed as a preliminary operation for efficiently classifying and loading by assigning one of several grades as the performance of each electronic component as a result of the test. At the unloading position, the insert module is opened first. Thereafter, the PNP device can be used to pick up the electronic components and load them into the first shuttle by grade. At this time, the grades can be classified into states classified according to the test results of the electronic components, such as normal, defective, and retest required.

[0055] The second unloading stage (S330) for transferring the electronic components from the second shuttle to the user tray corresponds to the stage for unloading the electronic components to the outside according to the classified types. In this stage, it can be performed by transferring the electronic components of the same grade loaded on the first shuttle to the user tray. This stage is performed by using the PNP device, and the interval between the plurality of picked-up electronic components can be adjusted according to the socket interval of the user tray during the transfer process.

[0056] FIG. 5 is a detailed flowchart of the cleaning stage in the present disclosure.

[0057] As shown in FIG. 5, the cleaning stage is performed to clean the electrical contact means of the test tray that has completed unloading.

[0058] The cleaning stage (S400) may include a third transfer stage (S410) for transferring an empty test tray to the cleaning site, a stage (S420) for cleaning the insert of the test tray, and a fourth transfer stage (S430) for transferring the cleaned test tray to the loading site.

[0059] The third transfer stage (S410) for transferring an empty test tray to the cleaning site is a stage for transferring an empty tray for cleaning. The stage (S420) for cleaning the insert of the test tray is configured to be able to clean the contact means configured at a small pitch inside the insert module and / or the means for contacting the tester on the other side of the test tray. The main cleaning target in this stage is the pins provided at a small interval inside the insert module. Components with very small contact terminals and a small interval between contact terminals, such as high-bandwidth memories, are greatly affected by small foreign objects. Therefore, the insert module can be cleaned before the loading stage to ensure reliable contact with the electronic components.

[0060] In this stage (S420), cleaning may be performed by blowing air through a nozzle inside the insert module or by using a vacuum to suck it in. Alternatively, it may be performed using a cleaning material that directly contacts.

[0061] The fourth transfer stage (S430) for transferring the cleaned test tray to the loading site corresponds to the stage for transferring the test tray for the next test.

[0062] On the one hand, the operations of each of the foregoing elements can be performed by a control unit provided in the electronic component test handler. Also, a sub-control unit and a master control unit for controlling each drive element may be provided. Such a control unit can be provided in the electronic component test handler or can be provided in a space separated from the test handler for remote control.

[0063] Hereinafter, a control method of a test handler according to an embodiment of the present disclosure will be performed to describe an electronic component and a test tray that move on the test handler.

[0064] FIG. 6 is a conceptual diagram showing an electronic component and a test tray 1 that are controlled and transferred in an embodiment of the present disclosure, and FIG. 7 is a plan view showing an electronic component and a test tray 1 that are controlled and transferred in an embodiment of the present disclosure.

[0065] As shown in FIGS. 6 and 7, the space on the base where the main operations of the electronic component test handler are performed is divided into a loading site LS, an unloading site US, a test site TS, and a cleaning site CS.

[0066] As described above, the electronic component is loaded onto the first shuttle 21 in the first loading step (S110) at the loading position UP of the loading site LS. Thereafter, the electronic component 1000 is loaded onto the test tray 1 in the second loading step (S130). At this time, precise position alignment (S120) can be performed, and the test tray 1 and the electronic component can be maintained in a state where electrical contact is ensured.

[0067] After that, the test tray 1 is transferred to the test site TS by the first transfer step (S140), and a test (S200) is performed. After the test is completed, the test tray 1 is transferred to the unloading position UP by the second transfer step (S310). At the unloading site US, a first unloading step (S320) is performed in which the electronic components are sorted and loaded into the second shuttle 22 according to their grades according to the test results. Thereafter, the electronic components loaded on the second shuttle 22 can be loaded into the user tray C by the second unloading step (S330).

[0068] Thereafter, the test tray 1 is transferred to the cleaning site CS by the third loading step (S410). After the step of cleaning the insert (S420) is completed, the test tray 1 is transferred to the loading site LS by the fourth loading step (S430).

[0069] On the other hand, in the first loading step (S110), the second loading step (S130), the first unloading step (S320), and the second unloading step (S330), the transfer of the device can be performed while minimizing the stop time of the PNP device. On the other hand, the test tray 1 moves while circulating through the loading position LP, the test site TS, the unloading position UP, and the cleaning site CS. At this time, the transfer speed of the test tray 1 can be adjusted in the third transfer step (S410) and the fourth transfer step (S430) according to the presence or absence of the test tray 1 at the loading position and / or the unloading position. On the other hand, a buffer space may be provided for the test tray to wait for the temporal coordination of the transfer, loading, and unloading of the empty test tray.

[0070] FIG. 8 is a perspective view of a test tray applicable in one embodiment according to the present disclosure.

[0071] The test handler for electronic components according to an embodiment of the present disclosure is configured to be able to transfer a plurality of electronic components while they are loaded on the insert module 100. Further, it is configured to be able to execute a test with the electronic components loaded on the insert module 100. The test can be performed in a so-called "handler" equipment that performs a performance test under specific temperature conditions and classifies by grade.

[0072] The test tray 1 for electronic components according to an embodiment of the present disclosure may be configured to include a sub-tray 2, an interposer block, and a board.

[0073] The interposer block may be configured to be able to electrically connect the board and an external tester. A plurality of electrical connectors may be provided on one side of the interposer block. The interposer block may be configured to include a circuit in which each electronic component is electrically connected to a pin.

[0074] The board is configured to be able to make an electrical connection between the sub-tray 2 and the interposer block, and may be provided with a predetermined circuit that can function in electrical contact with the electronic components to be tested.

[0075] At least one sub-tray 2 may be provided on the upper side of the board. The sub-tray 2 may be configured to be detachable from the board. That is, a test can be performed with one or more sub-trays 2 coupled to the board as needed. Also, if necessary, the test tray 1 may wait at another location and only the sub-tray may be transferred to the position where the electronic components are loaded or unloaded. After the electronic components for the test are loaded, the sub-tray 2 may be coupled to the board or separated from the board to be transferred separately from the board in order to unload the electronic components for which the test has been completed. At this time, a well-known selective fastening element can be applied for the coupling and release between the sub-tray and the board.

[0076] The sub-tray 2 may include a first base frame and a second base frame in which spaces are formed in a predetermined pattern. The first base frame and the second base frame 12 are coupled in the vertical direction and configured such that a predetermined number of insert modules are coupled. Electronic components are loaded on each of the insert modules 100. The loaded electronic components can be in electrical contact with the insert module 100. Each of the insert modules 100 can be electrically connected to a board. Eventually, the electronic components can be electrically connected to the tester via the insert module 100, the board, and the interposer.

[0077] The insert module 100 is configured to securely fix the position of the electronic components during the transfer or testing of the test tray 1. At this time, when the electronic components are fixed to the insert module 100, the contact terminals of the electronic components can be respectively connected to the electrical contact means of the insert module 100.

[0078] Hereinafter, with reference to FIGS. 9 to 10b, the insert module applicable in the control method according to the present disclosure will be described.

[0079] FIG. 9 is a perspective view of an insert module applicable in an embodiment according to the present disclosure, and FIG. 10 is an exploded perspective view of an insert module applicable in an embodiment according to the present disclosure.

[0080] Referring to FIGS. 9 and 10, the insert modules 100 for electronic components in the present disclosure are each configured to load and selectively fix the electronic components.

[0081] When the contact terminals of the electronic components are finely arranged, it can be an excessive burden for alignment when contacting the tester. Also, the handler tests the electronic components simultaneously for efficient operation. At this time, precisely aligning and connecting a plurality of electronic components to the tester simultaneously takes a lot of time and increases the complexity of the equipment.

[0082] In the present disclosure, the insert module 100 may be provided with connection means extended to a pitch larger than the pitch of the contact terminals of the mounted electronic components. In the present disclosure, the insert module 100 can be arranged at wider intervals with the electronic components fixed, and the connection with the tester can be facilitated by arranging strong connection means.

[0083] In the present disclosure, the insert module 100 may include a fixing part 300 and a pitch adjustment part 200.

[0084] The fixing part 300 and the pitch adjustment part 200 are configured to be coupled in the vertical direction. The fixing part 300 and the pitch adjustment part 200 may be coupled to each other to form a socket. One electronic component can be loaded into the socket. The fixing part 300 may include a hole penetrating vertically in the central part, and the electronic component can be loaded or unloaded through the hole. Also, the pitch adjustment part 200 may be provided below the hole.

[0085] The fixing part 300 may include an upper block 310, a lower block 320, a latch link 330, and an elastic part 340. The upper block 310 and the lower block 320 may be coupled to be reciprocable in the vertical direction by a predetermined length.

[0086] The latch link 330 may be configured such that its pivot angle can be adjusted according to the interval between the upper block 310 and the lower block 320. The latch link 330 may be configured symmetrically about the left and right, and each end may be configured to be able to press the upper part of the device loaded in the socket.

[0087] The latch link 330 may include a latch portion 331 and a link 335. The latch portion 331 may be configured to include a connecting portion 332 and a pressing portion 333. The connecting portion 332 is configured to be coupled to the upper block 310 and the first connecting pin 336 on one side of the latch link 330. The pressing portion 333 is configured to press the upper portion of the electronic component on the other side of the latch link 330. A heat pad 334 may be provided on the pressing portion 333 so as to minimize the influence of heat when pressing the upper end portion of the electronic component.

[0088] One side of the link 335 is coupled to the lower block 320 by a connecting pin. The other side of the link 335 is coupled to the middle portion of the latch link 330 by a second connecting pin 337 so as to be rotatable.

[0089] On the other hand, the operation of the latch link 330 may be geometrically predetermined. In the present disclosure, when the upper block 310 descends to the position closest to the lower block 320, the fixing portion 300 of the latch portion 331 is configured to be rotatable upward by 90 degrees or more.

[0090] Conversely, when the external force is removed and the upper block 310 returns to a position far from the lower block 320, the latch link 330 is adjusted in angle in the opposite 90-degree direction to press the upper end of the electronic component.

[0091] On the other hand, the pair of pressing portions 333 provided on the latch link 330 may have concave portions formed on the portions facing each other in the closed position. The concave structure of the pressing portion 333 is for preventing interference with the PNP device when the PNP device closes the socket with the electronic component precisely aligned in the socket. The concave structure may be configured to have a size that does not contact the PNP device even when the latch portion 331 pivots.

[0092] The elastic portion 340 is configured to provide a restoring force to the latch. The elastic portion 340 is provided at a plurality of points between the upper block 310 and the lower block 320 and provides an upward restoring force to the upper block 310.

[0093] The pitch adjustment unit 200 is configured to be able to expand the electrical contact position with the electronic component fixed.

[0094] The pitch adjustment unit 200 may include a first pin 210, a pitch adjustment block, and a second pin fixing block 230. The pitch adjustment block may include a conductor 221, and the second pin fixing block 230 may include a second pin 231. The first pin 210, the conductor 221, and the second pin 231 can be electrically connected. When the second pin 231 is electrically connected to an external tester, the electronic component loaded on the socket can also be electrically connected.

[0095] The first pins 210 are arranged to have a contact cross-sectional area suitable for the fine pitch of the electronic component. As an example, the first pins 210 may be configured in a plate shape. However, this is only an example, and it can be implemented in various configurations capable of fine pitch.

[0096] FIG. 11a is a cross-sectional view showing the concept of loading an electronic component in the second loading stage according to an embodiment of the present disclosure, FIG. 11b is an enlarged cross-sectional view of portion I showing an enlarged view of the portion where the fine pitch contact terminal and the first pin of the insert module are in contact in the second loading stage according to an embodiment of the present disclosure, and FIG. 11c is an enlarged cross-sectional view of portion II showing the second pin having an expanded pitch exposed outside the test tray in the second loading stage according to an embodiment of the present disclosure.

[0097] As shown in FIGS. 11a, 11b, and 11c, the first pins 210 can be arranged on a plane so as to be in contact with the contact terminals of the electronic component respectively. At this time, the number of the first pins 210 is provided corresponding to the number of the contact terminals of the electronic component. Also, the first pins 210 may be arranged identically to the contact terminals arranged on the electronic component. That is, the pitch of the first pins 210 may be configured identically to the pitch of the electronic component. In other words, the upper ends of the contact terminals of the electronic component and the first pins may be formed in the same pattern. However, although the configuration in which the first pins 210 are arranged at the first pitch (P1) is described, this is only an example, and when the contact terminals of the electronic component are connected at various pitches, they can be arranged at various pitches accordingly.

[0098] On the other hand, in the present disclosure, the first interval (P1) between the first pins 210 may be 0.5 mm or less. In some cases, the first interval may be 0.2 mm or less. Also, the width of the first pins 210 may be 0.2 mm or less. Also, the width of the electrical contact portion of the first pins may be 0.05 mm or less.

[0099] The second block may be provided with a plurality of second pins 231. The plurality of second pins 231 may be arranged at a second interval (P2) wider than the first interval (P1). The second pins 231 are configured to be electrically connected to the electrical contact means of the board. The second pins 231 may be provided to penetrate the second pin fixing block 230 in the vertical direction. The second pins 231 are configured to minimize damage even when repeatedly contacting an external board and achieve reliable electrical contact. On the other hand, the second interval (P2) may be configured to be 0.3 to 3 mm. At this time, the thickness of the second pins 231 may be configured to be 0.1 to 3 mm.

[0100] On the other hand, the second interval (P2) may be configured to be expanded from the first interval (P1). As an example, the second interval can be expanded within 1.1 times to 20 times the first interval.

[0101] The second pin 231 may be composed of, for example, a pogo pin. The pogo pin is formed with a space inside, and is composed of a pair of pins with one side open and connected to each other in the longitudinal direction. When an elastic body is provided inside the pogo pin and a compressive force is generated in the vertical direction, the overall length becomes shorter accordingly. That is, the length can be adjusted by an external force, and the electrical connection is maintained even when the length changes. Therefore, even if the insert module 100 comes into intense contact with the board, the pogo pin can minimize the impact and maintain stability. In addition, since wear and the like can be prevented even when used repeatedly, the best performance can be exhibited for a long time.

[0102] The pitch adjustment block 220 is configured to be able to adjust the pitch between the first pin 210 and the second pin fixing block 230. The pitch adjustment block 220 may be provided with a plurality of conductors 221. At least a part of the conductors 221 may be arranged in an inclined path within the pitch adjustment block 220. The upper end of the conductor 221 may be exposed at the upper end of the pitch adjustment block 220, and the lower end may be exposed at the lower end of the pitch adjustment block 220. The upper end of the conductor 221 can be in electrical contact with the first pin 210. Also, the lower end of the conductor 221 can be in electrical contact with the second pin 231 of the second pin fixing block 230.

[0103] The conductors 221 may be three-dimensionally arranged within the pitch adjustment block 220. The conductors 221 are arranged at a wider pitch generally towards the lower side within the pitch adjustment block 220.

[0104] On the other hand, in the above-described embodiment, an example in which the first pins are arranged at the first interval is shown, but the minimum interval between adjacent first pins may be arranged as the first interval. Also, the first pins can be arranged at various intervals wider than the first interval as required. At this time, the minimum interval between adjacent second pins is arranged as the second interval, and in this case as well, the second interval can be configured to be larger than the first interval.

[0105] Figures 12a, 12b, and 12c are cross-sectional views showing a PNP module and an insert module that operate by executing a second loading stage according to an embodiment of the present disclosure.

[0106] As shown in FIG. 12a, the test tray 1 is transferred to the loading position and temporarily fixed. At this time, the picker (or hand) 400 picks up the electronic component 1000 from a user tray (not shown) and transfers it to the upper part of the test tray 1. The picker 400 is provided with an electronic component suction part 420 and a picker pusher 410. The suction part 420 may be configured to be able to move up and down independently of the picker pusher 410.

[0107] As shown in FIG. 12b, when the picker pusher 410 presses the upper block 310, the latch link 330 is completely released. On the other hand, the picker 400 may be provided with a vision system. The picker 400 can use the vision system to detect the relative position between the socket and the electronic component 1000, and can precisely align the horizontal position of the electronic component 1000.

[0108] As shown in FIG. 12c, when the position of the electronic component 1000 and the horizontal position of the first pin 210 are aligned, the suction part 420 descends to place the electronic component 1000 on the upper surface of the first pin 210.

[0109] Figures 13a and 13b are cross-sectional views showing the concept of performing a cleaning stage in an embodiment according to the present disclosure.

[0110] As shown in FIG. 13a, the insert module can be opened at the cleaning site. The cleaning device 500 may include a cleaning pusher 510 and a nozzle 520. The cleaning pusher 510 is configured to be able to open the insert module. The nozzle 520 is configured to enter the inside of the opened insert module and blow fluid toward the first pin to perform cleaning.

[0111] As shown in FIG. 13b, the cleaning device 500 may include a cleaning pusher 510 and a suction part 520'. The suction part 520' can enter the inside of the insert module, suck in foreign objects together, and clean the inside of the insert module.

[0112] However, different from the operations described in FIGS. 13a and 13b, the cleaning device 500 may omit the cleaning pusher 510. At this time, the cleaning means 520, 520' can be used to enter the inside of the insert module without contacting the latch link 330 for cleaning.

[0113] As described above, the control method of the test handler according to the present disclosure can prevent damage to the electronic component by accurately contacting the contact terminals with a fine pitch, and has the effect of epoch-making shortening of the Takt time of the electronic component test.

Explanation of Signs

[0114] US: Unloading Site LS: Loading Site TS: Test Site CS: Cleaning Site C: User Tray UP: Unloading Position LP: Loading Position 1: Test Tray 1000: Electronic Component

Claims

1. a first loading step of transferring electronic components from a user tray to a first shuttle; a second loading step of loading at least one of the electronic devices loaded on the first shuttle onto a test tray having a pitch adjustment unit; a testing step of testing the electronic component while the electronic component is in electrical contact with the pitch adjustment portion; a first unloading step of transferring the electronic devices for which the test has been completed from the test tray to a second shuttle; a second unloading step of loading at least one of the electronic components loaded on the second shuttle onto a user tray; and A method of controlling a test handler comprising the step of cleaning at least a portion of the empty test tray.

2. The testing step includes:

2. The method for controlling a test handler according to claim 1, wherein the method is carried out by achieving electrical contact that is wider than the minimum distance between the contact terminals of the electronic components.

3. The second loading step includes:

3. The method for controlling a test handler according to claim 2, wherein the method is carried out by bringing contact terminals of the electronic components into contact with electrical contact means of the pitch adjustment section.

4. 4. The method of claim 3, further comprising a first test tray transport step of transporting the test tray loaded with the electronic devices from a loading site to a test site after the second loading step.

5. 5. The method of claim 4, wherein the second loading step is performed while maintaining a state in which the contact terminals of the electronic components are in contact with the electrical contact means of the pitch adjustment unit.

6. The testing step includes:

6. The method for controlling a test handler according to claim 5, wherein the method is performed in a state where the contact terminals of the electronic components and the electrical contact means of the tester are not in direct contact with each other.

7. The testing step includes: The method for controlling a test handler according to claim 6, wherein the method is performed in a state where electrical contact is established between the tester and an interposer block of the test tray.

8. The first loading step includes: picking up the electronic component from the first shuttle; transferring the electronic device onto a socket of the test tray; aligning a horizontal position of the electronic component; bringing a contact terminal of the electronic component into contact with the contact means of the pitch adjustment part; 3. The method of claim 2, further comprising the step of fixing said electronic device to said test tray so that said contact terminals can be maintained in contact with said contact means.

9. 3. The method of claim 2, wherein the electronic component is a high bandwidth memory.

10. The second loading step is performed using a PNP device, 10. The method of claim 9, further comprising aligning horizontal positions of the PNP device so that contact terminals of the high bandwidth memory and contact pins of the pitch adjustment unit can come into contact with each other.

11. 5. The method of claim 4, further comprising a second transport step of transporting the test tray to an unloading site after the testing.

12. 12. The method of claim 11, further comprising a third transport step of transporting the empty test tray to a cleaning site after the first unloading step.

13. 13. The method of claim 12, further comprising a fourth transport step of transporting the test tray from the cleaning site to the loading site after the cleaning step.

14. The cleaning step comprises:

8. The method for controlling a test handler according to claim 7, wherein the method is carried out by cleaning the contact means of the pitch adjustment unit provided on the test tray.

15. The cleaning step comprises:

8. The method for controlling a test handler according to claim 7, further comprising cleaning an electrical contact means between said test tray and said tester.

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