Dynamic setup optimization for mounting machine having multiple supply paths

Abstract

To enhance the performance of a mounting machine in the production of mounted products.SOLUTION: There is provided a method for manufacturing products (BP A, BP B) using a mounting machine having multiple supply paths, in which one type of materials (BM 1 to BM 7) can be supplied for production through one supply path. The method comprises the steps of: (a) manufacturing a first product (BP A), in which a first positive selection of materials supplied through a first positive selection of supply paths is used, and a first negative selection of materials assigned to a first negative selection of supply paths is not used; (b) changing, for the first negative selection of materials, an assignment between materials and supply paths from a first assignment to a second assignment in which the changing is performed during the manufacturing of the first product (BP A); and (c) manufacturing a second product (BP B), in which a second positive selection of materials supplied through a second positive selection of supply paths is used, and a second negative selection of materials assigned to a second negative selection of supply paths is not used. Furthermore, the mounting machine and a computer program for executing the method are described.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention generally relates to the technical field of mounting technology. In particular, the present invention relates to the allocation of mounting materials to the supply paths of a mounter, which is optimized in consideration of the length of the necessary movement path of the mounting head of the mounter. Specifically, the present invention relates to the following: (a) A method for manufacturing a mounted product by a mounter (b) A mounter for manufacturing a mounted product by automatically mounting (electronic) components on a component carrier (c) A computer program for manufacturing a mounted product by a mounter and relates to the subject matter of patent rights thereof.

Background Art

[0002] The mounting of electronic components on a component carrier is typically performed by a mounter. The mounter has a mounting head, which grasps an electronic component at the pick-up position of a component supply device, conveys it to the mounting area of the mounter where there is a component carrier to be mounted, and places the grasped component at a predetermined mounting position on the component carrier.

[0003] A mounter typically has a plurality of supply paths, and one component supply device may be installed in contact with each supply path. Thereby, one type of component can be supplied to the mounting process through each supply path.

[0004] The components to be mounted are mostly taken into a so-called component belt, which is wound around a winding body. During the mounting operation, the components are successively conveyed to the pick-up position by each component supply device through the regular movement of the component belt.

[0005] In some (latest) component supply devices, the hoisting body is integrated with the component belt within the internal space of the component supply device. Thereby, in the supply path, in a simple manner, for example, in an automated manner by a robot, when electronic components are used, new electronic components can be prepared, or if necessary, components of the first type can be replaced with components of the second type. In this specification, electronic components mean, in some cases, the entire associated component supply device and also the mounting materials.

[0006] In a general mounting machine, the supply path is on at least one side of a conveying device that conveys the component carrier to be mounted into the mounting area of the mounting machine and conveys out at least partially mounted component carriers from the mounting area of the mounting machine. The supply paths are spatially arranged successively along the conveying direction of the component carrier conveying device.

[0007] It is obvious that allocating mounting materials to the various supply paths affects the length of the necessary movement path of the mounting head. That is, for example, if all the electronic components required for a specific mounting product (including the component carrier with components mounted thereon) are supplied to the corresponding mounting process through adjacent supply paths, in at least one component supply area, that is, in a certain spatial area of the corresponding component supply device, the movement path of the mounting head required for taking in the corresponding components is minimized. This particularly applies to so-called multi-mounting heads that successively take in a plurality of various components. The taken-in components are then conveyed together to the mounting area, and the conveyed components can then be successively placed at predetermined mounting positions. Allocating mounting materials to the supply paths is generally also called the setup of the corresponding mounting materials.

[0008] The setup includes information on which mounting materials (component supply devices and components within the component belt on the winding body) are located in which supply paths. In the pre - manufacturing stage of the mounting product, considering the efficient mounting operation with high mounting capacity, it is necessary to optimize the setup so that the mounting materials required for each mounting product are placed in positions that enable the quickest possible intake into the supply path, thereby ensuring a quicker and more efficient overall mounting operation.

[0009] The setup related only to the single mounting product to be manufactured and preferably optimized for that mounting product is called a single setup. The setup related to a plurality of various mounting products, typically manufactured continuously and preferably having a certain similarity from the perspective of the mounting content, is called a family setup. In a family setup, an attempt is made to distribute the mounting materials to various supply paths so that the entire set of corresponding mounting products of the family can be mounted or manufactured as efficiently as possible.

[0010] In a family setup, after the manufacture of one mounting product, by using alternative components of the mounting materials in another supply path of the mounter for the subsequent mounting (manufacture of the next mounting product), the switching between various mounting products can be facilitated. For this purpose, no change to the hardware components of the mounter and the component supply devices is required. In particular, there is no need to change the allocation of the mounting materials to the supply paths. The mounting materials not used for the subsequent mounting product remain in the corresponding supply path. Therefore, within the scope of the family setup, the switching of the manufacture from one mounting product to another can be carried out particularly quickly without any intervention by the operator of the corresponding mounter. Summary of the Invention Problems to be Solved by the Invention

[0011] However, a disadvantage of manufacturing an implementation product using a family setup is that the setup for each implementation product of the corresponding family may not be optimal due to the partial non - use of the implementation materials in each supply path. This means that at least one implementation product is at least partially manufactured with implementation materials that, with respect to this implementation product, are not in a spatially optimal supply path or position considering the length of the movement path of the implementation head. Thereby, the movement path of the implementation head is extended and the implementation capacity is reduced.

Means for Solving the Problem

[0012] The present invention is based on the problem of improving the implementation capacity of a corresponding mounter with an appropriate setup in the manufacture of various implementation products.

[0013] This problem is solved by the subject matter of the independent claims. Advantageous embodiments of the present invention are described in the dependent claims.

[0014] According to a first aspect of the present invention, a method for manufacturing an implementation product by a mounter having a plurality of supply paths is described, wherein one type of implementation material can be supplied through each supply path for the manufacture of the implementation product. The method described is (A) The manufacture of a first implementation product, wherein (i) a first positive option of the implementation material supplied through a first positive option of the supply path for the manufacture of the first implementation product is used, and (ii) a first negative option of the implementation material assigned to a first negative option of the supply path (for the manufacture of the first implementation product) is not used, the manufacture and (B) A change in the assignment between the implementation material and the supply path from a first assignment to a second assignment for a first negative option of the implementation material, which is carried out during the manufacture of the first implementation product, the change and (C) The manufacture of a second implementation product, wherein (i) a second positive option of the mounting material supplied for the manufacture (of the second implementation product) through a second positive option of the supply path is used, and (ii) a second negative option of the mounting material assigned to a second negative option of the supply path (for the manufacture of the second implementation product) is not used, the manufacture and, has. According to the present invention, the second positive option of the supply path is different from the first positive option of the supply path, and the second assignment is different from the first assignment.

[0015] In this specification, the implementation product is understood as a specific type of implementation product, and in practice, typically includes a plurality of each implementation product of this type. The first implementation product described is a different type of implementation product from the second implementation product described. Typically, both implementation products differ in the implementation content, that is, in the number and / or type of (electronic) components mounted on the corresponding component carrier.

[0016] The manufacturing method of the described implementation product is based on the recognition that during the manufacture of the first implementation product, the assignment between (i) the unused mounting material (i.e., the first negative option of the mounting material) and (ii) the supply path not used at this time (i.e., the first negative option of the supply path) can be pre-changed so that the movement path of the mounting head of the mounter can be shortened, particularly in the take-up of the mounting material to be used hereafter (i.e., the second positive option of the mounting material) in the manufacture of the second implementation product. There, the degree of shortening naturally depends on the similarity of the types of both implementation products, particularly the types of components required for manufacture. The shortening of the movement path for the manufacture of the second implementation product advantageously leads to an improvement in the manufacturing speed (of the second implementation product), thereby leading to an improvement in the mounting capacity of the corresponding mounter as a whole. In this context, the concept of "mounting capacity" may be understood as the maximum number of components that can be mounted by the mounter within a certain time period.

[0017] Specifically expressed, in the described method, during the implementation operation of the (first implementation product), a dynamic new allocation is made between (i) the implementation materials not currently in use and (ii) the supply paths not currently in use. This new allocation is advantageously optimized taking into account the shortening of the movement path of the implementation head in the subsequent manufacture of the second implementation product. The described new allocation particularly means that the implementation materials not currently in use are spatially moved or placed in a new position. For this purpose, at least temporarily, the type of implementation material (not currently in use) is released or isolated from a specific (not currently in use) supply path, and subsequently, a second type of implementation material (not currently in use) is installed or allocated to this specific (not currently in use) supply path.

[0018] As already explained in the introduction, the implementation product includes a component carrier and the components mounted thereon. The concept of "component carrier" may be understood in this specification as any type of medium on which components can be implemented, in particular a substrate or a printed circuit board. The medium on which components can be implemented, in particular a printed circuit board, may be a rigid board or a flexible board. It may also have at least one first rigid region and at least one flexible region. The concept of "electronic component" or "component" may be understood in this specification as all elements that can be implemented, and such elements can be installed or assembled on the implementation carrier. The concept of "component" may include cased components, and in particular uncased components or chips. This includes SMT components with two or more poles, or other highly integrated planar, circular or other shaped components, such as ball grid arrays, bare dies, flip chips, or for example, semiconductor chips of semiconductor wafers that are further processed to complete the components, especially after the configuration and dicing of the wafer. The concept of "component" may also include in this specification elements that are not electrically active, such as for example implementable electrical plugs or connectors, cooling bodies, shield elements, casing parts.

[0019] According to one embodiment of the present invention, the mounting material includes components and in particular electronic components.

[0020] Components may be included in the mounting material as various types. Advantageously, the components are in the intake pockets of a component belt by a known method, and the belt is guided by a component supply device to a component pick-up position, from where the components can be successively picked up by the mounting head of a mounter. However, alternatively the components may also be included in the mounting material as bulk. In that case, the supply of the components is likewise effected by a known method by means of a bulk conveyor, in particular through vibration.

[0021] According to another embodiment of the present invention, the mounting material further includes a component supply device.

[0022] In this embodiment, one type of (not yet mounted) component of the mounting material is in or adjacent to the corresponding component supply device. Advantageously, the components are in a component belt wound around a take-up body by a known method. More advantageously, the take-up body, together with the component belt wound around it, is in a predefined spatial region inside (the casing of) the component supply device.

[0023] The change of the assignment between the mounting material and the supply path from the first assignment to the second assignment, as described, is in the embodiments described here effected for at least one supply path in that the corresponding component supply device is separated from this supply path with a specific type of component not yet used by the device, and another or a new component supply device is arranged on this supply path with another type of component associated with the device.

[0024] Advantageously, the corresponding component supply devices for the two supply paths and the replacement of the associated (not yet installed) components are carried out only once. The change in the assignment between the mounting material and the supply path from the first assignment described to the second assignment may also include a plurality of such replacement steps for the two component supply devices and the components associated therewith, respectively. Thereby, any new assignment between a larger number of mounting materials and a correspondingly larger number of supply paths can be "iteratively" achieved.

[0025] Using mounting materials that include not only the components to be mounted (optionally packed in a component belt) but also one component supply device each has the advantage that the change in the assignment from the first assignment described to the second assignment can be carried out in a particularly simple and reliable manner. This may be particularly because each mounting material can be handled particularly easily by an operator, for example, as a compact unit consisting of a component supply device and the associated (not yet installed) components.

[0026] According to another embodiment of the present invention, the change in the assignment between the mounting material and the supply path from the first assignment to the second assignment is carried out automatically without the need for manual intervention by the operator.

[0027] The automatic change of the assignment described can be carried out, for example, by a suitable robot that has been set up. In order to be able to introduce this robot to various locations, for example, various mounting machines on the mounting line, or various mounting lines each having at least one mounting machine, the robot may be moved across the floor of the hall where the corresponding mounting machine is installed by an automated guided vehicle (FTF, Automated Guided Vehicle in English, AGV). By means of such an automated guided vehicle, the mounting material can also be picked up from a central warehouse or an intermediate warehouse for mounting materials and brought to a pre-set supply path of the selected mounting machine. Furthermore, the mounting material that is no longer required can be transported (returned) to such a warehouse by the automated guided vehicle.

[0028] Using an unmanned transport vehicle has the advantage that, at least for any implementation product manufacturing system (such as an implementation line, an implementation machine, etc.) that has or uses such an unmanned transport vehicle, the technology described in this specification can be realized by a conventional implementation product manufacturing system through simple software adjustments that are easily achievable. Hardware changes are not necessarily required in any case.

[0029] It is pointed out that for the automatic change of the assignment between the implementation material and the supply path as described, not only robots but also, advantageously, robots arranged on the unmanned transport vehicle may be used. The automatic change of the assignment can basically be carried out by any handling system as long as the system can isolate the implementation material and, in particular, a component supply device containing components inside from one supply path and place it on another supply path. Examples of such handling systems include autonomous mobile robots (AMRs), as well as so-called overhead transport systems (OTS), and / or so-called rail guided vehicles (RGV), or handling devices that can move along the implementation machine together with the overhead transport system and / or the rail guided vehicle, but are not limited thereto.

[0030] According to another embodiment of the present invention, at least a part of the implementation material of the first negative option is at least a part of the second positive option. This has the advantage that at least one implementation material or one type of implementation material is used for the manufacture of the second implementation product. The implementation material is already in the supply area of the implementation machine within the time frame of the manufacture of the previous first implementation product, and there are already a plurality of supply paths as described in the supply area of the implementation machine. The product switch from the first implementation product to the second implementation product can thereby be carried out without interruption very quickly as long as it is not necessary to introduce another implementation material from the outside to at least one supply path.

[0031] According to another embodiment of the present invention, a first total comprising (i) the number of supply paths for the first positive option and (ii) the number of supply paths for the first negative option is the same as the total number of the plurality of supply paths. Alternatively, or in combination, a second total comprising (i) the number of supply paths for the second positive option and (ii) the number of supply paths for the second negative option is the same as the total number of the plurality of supply paths. This has the advantage that in the implementation of the described method, all supply paths present in the mounting machine participate, thereby maximizing the flexibility or the possibility in the implementation of the change of assignment from the first assignment described to the second assignment. Specifically expressed, in this change, all supply paths not used during the manufacture of the first mounted product can be used. Thereby, considering the shortening of the movement path of the mounting head in the picking of parts required for the second mounted product, the spatially optimal arrangement of the corresponding mounting material for the second mounted product can be achieved by the intentional rearrangement or rearrangement of the mounting material.

[0032] According to another embodiment of the present invention, during the manufacture of the first mounted product, for the first positive option of the mounting material, the assignment between the corresponding positively selected mounting material and the corresponding positively selected supply path remains unchanged. Alternatively, or in combination, during the manufacture of the second mounted product, for the second positive option of the mounting material, the assignment between the corresponding positively selected mounting material and the corresponding positively selected supply path remains unchanged

[0033] Specifically expressed, "remaining unchanged" as described in this embodiment means that during the manufacture of one implementation product (here, the first implementation product or the second implementation product), the implementation materials used for the implementation of the corresponding implementation product are not rearranged or reordered with respect to the supply path that exists (spatially fixed) in the mounter. The implementation operation of the corresponding implementation product can thereby be carried out with high efficiency and high implementation capacity without being disturbed at all. In any case, whether it is high efficiency or high implementation capacity, it will not be negatively affected by the spatial rearrangement or reordering of currently unnecessary implementation materials that may be carried out in some cases.

[0034] According to another embodiment of the present invention, during the manufacture of the first implementation product, for the first positive option of the implementation material, the assignment between the corresponding positively selected implementation material and the corresponding positively selected supply path is changed. Alternatively, or in combination, during the manufacture of the second implementation product, for the second positive option of the implementation material, the assignment between the corresponding positively selected implementation material and the corresponding positively selected supply path is changed.

[0035] Specifically expressed, "being changed" as described in this embodiment means that during the manufacture of one implementation product (here, the first implementation product or the second implementation product), the position or supply path where the implementation materials required for the corresponding implementation product are supplied to the implementation process is changed. In other words, the corresponding (positive option's) implementation materials are rearranged, repositioned, and / or newly arranged. Certainly, in that case, the process of the new arrangement may temporarily reduce the implementation capacity to some extent. However, after such a new arrangement is completed, more of the corresponding type of implementation product can be manufactured, and for this manufacture, especially in the picking of the corresponding parts, usually, as long as the new arrangement provides a time advantage, it will generally lead to an improvement in the overall implementation capacity.

[0036] Advantageously, for the process of the new arrangement, a specific time frame can be utilized, where for the manufacture of the current implemented product, at least one specific (positively selected) implementation material is not used. This can be, for example, when the implementation head has just received a part from another component supply device for the next head cycle, or when the component carrier has just been fully implemented and the implementation head has to wait for the next component carrier to enter the implementation area of the implementation machine. As long as such a time frame is utilized for the new arrangement of the implementation materials themselves required for the current implemented product, this new arrangement can also be implemented without affecting the capabilities with respect to the resulting implementation capabilities.

[0037] According to another embodiment of the present invention, the change of the assignment between the implementation material and the supply path from the first assignment to the second assignment includes exchanging the first implementation material of the first negative option with the second implementation material of the first negative option. Then, after the exchange, (i) the first implementation material is assigned to the supply path to which the second implementation material was previously assigned, and (ii) the second implementation material is assigned to the supply path to which the first implementation material was previously assigned. By the simple exchange of the two currently unused implementation materials described, the assignment between the implementation material and the supply path can be changed from the first assignment to the second assignment in a particularly simple way.

[0038] It is pointed out that the exchange of the implementation materials described here can also be carried out multiple times continuously by any implementation material of the first negative option. In this way, iteratively, for the first negative option, a spatial arrangement of the second positive option of the implementation materials can be achieved that is optimal for the manufacture of the second implemented product in time before the manufacture of the second implemented product.

[0039] According to another embodiment of the present invention, the change of the assignment between the implementation material and the supply path from the first assignment to the second assignment includes at least one other implementation material that is taken out from the warehouse for the implementation material and assigned to a pre-determined supply path in the implementation machine.

[0040] As described, the flexibility in preparing the mounting material for the second mounting product can be improved by taking in another mounting material from the warehouse. This applies in particular to the various types of mounting materials potentially available or the number of various types of (electronic) components. This other mounting material may come from a central warehouse or an intermediate warehouse for the mounting material. Such a warehouse may be provided, for example, inside a manufacturing plant where a plurality of mounting machines and, advantageously, rather, a plurality of manufacturing lines each having at least one mounting machine and typically a plurality of successively connected mounting machines are installed. The transport from such a warehouse may advantageously be carried out automatically by a robot on an automated guided vehicle (AGV).

[0041] According to another embodiment of the present invention, the change of the assignment between the mounting material and the supply path from the first assignment to the second assignment includes the removal of at least one mounting material of the first negative option of the mounting material.

[0042] The removal of at least one mounting material described results in at least one corresponding (previous) supply path being emptied. Thereby, the switching of the remaining mounting materials of the first negative option can be made technically easier to handle. That is, the operator or the robot only has to handle only one of the remaining mounting materials of the first negative option of the mounting material at a specific time for the change of the assignment from the first assignment to the second assignment described.

[0043] The removal described may advantageously be carried out to the central warehouse or the intermediate warehouse described above. This may also be carried out manually by an operator or, advantageously, automatically by a robot on an automated guided vehicle (AGV).

[0044] According to another embodiment of the present invention, the method is (A) a change of the assignment between the mounting material and the supply path from another first assignment to another second assignment for a second negative option of the mounting material, which is carried out during the manufacture of the second mounting product, the change and (B) The manufacture of a third implementation product, wherein (i) a third positive option of the mounting material supplied for the manufacture (of the third implementation product) through a third positive option of the supply path is used, and (ii) a second negative option of the mounting material (for the manufacture of the third implementation product), which is assigned to the third negative option of the supply path, is not used, and further includes the manufacture. Therein, the third positive option of the supply path is different from the second positive option of the supply path (and advantageously also different from the first positive option of the supply path). Further, another second assignment is different from another first assignment.

[0045] In the embodiments described herein, specifically stated, three implementation products are manufactured continuously instead of two implementation products. In the corresponding method, similar to the method involving only two implementation products described above, here (while) during the manufacture of the second implementation product, (i) the unused mounting material (i.e., the second negative option of the mounting material) and (ii) the supply path not currently in use (i.e., the second negative option of the supply path) can be pre-changed so that the movement path of the mounting head of the mounter during the picking of parts of the mounting material (i.e., the third positive option of the mounting material) to be used in particular for the manufacture of the third implementation product can be shortened. Shortening the movement path for the manufacture of the third implementation product also advantageously leads to an improvement in the manufacturing speed (of the third implementation product), thereby leading to an improvement in the mounting capacity of the corresponding mounter as a whole.

[0046] It is pointed out that the method involving three implementation products described herein can also be extended to the method for manufacturing four or more implementation products.

[0047] According to another aspect of the present invention, a mounter for the manufacture of an implementation product by automatically mounting (electronic) components on a component carrier is described. The mounter described is (A) a plurality of supply paths capable of supplying, through one supply path, each type of mounting material including each type of component for the manufacture of the implementation product, (B) (i) to grasp the supplied components, (ii) to convey the grasped components to the mounting area of the mounter where there is a component carrier to be mounted, and (iii) to place the grasped components at the respectively pre-set mounting positions on the component carrier, a mounting head configured for; (C) a data processing device configured to execute a method of the type described above; It has.

[0048] The described data processing device may be part of a mounter or a (central) control device of a higher-level mounting line of the mounter. The data processing device may be realized by software, hardware, or a combination of software and hardware.

[0049] According to another aspect of the present invention, a computer program for manufacturing a mounted product by a mounter having a plurality of supply paths is described, and one type of mounting material can be supplied for manufacturing the mounted product through each of the supply paths. The computer program is set to implement the method described above when the computer program is executed by a data processing device.

[0050] In the meaning of this specification, the name of such a computer program has the same meaning as the definition of a computer-readable medium having instructions for controlling a computer system for appropriately coordinating the working method of a mounter in order to achieve the effects associated with program elements, computer program products, and / or the method according to the present invention.

[0051] A computer program may be incorporated as computer-readable application code in any suitable programming language, such as JAVA (registered trademark), C++, C# etc. The computer program may be stored on a computer-readable storage medium (such as a CD-Rom, DVD, Blu-ray disc, removable drive, volatile memory or non-volatile memory, built-in memory / processor etc.). The application code can program a data processing device or other programmable device to perform the desired functions. Further, the computer program may be prepared in a network such as the Internet, from which the user can download it as needed.

[0052] The described method may also be implemented by a computer program, i.e., software, or by one or more special electronic circuits, i.e., in hardware form or any hybrid form, i.e., software components and hardware components.

[0053] It is pointed out that embodiments of the present invention have been described with respect to various invention objects. In particular, some embodiments of the present invention are described with method claims, and other embodiments of the present invention are described with apparatus claims. However, those skilled in the art will immediately understand, when reading this specification, that in addition to the combinations of features associated with the type of the invention object, any combination of features associated with various types of the invention object is also possible, unless otherwise specified.

[0054] In the following, for a better understanding of the present invention, specific implementation forms of the invention disclosed in this specification will be described. Here, first, a standard approach (I) regarding the implementation form of the present invention will be described. Then, two advantageous extensions (II) and (III) of the standard approach will be described.

[0055] (I) Standard approach The standard approach described here is conditional on the implementation product to be manufactured being part of an implementation product family. Additionally, based on the commonality of the implementation materials required for the various implementation products, a software planning tool calculates which implementation products can be meaningfully manufactured in the family setup described above.

[0056] In the standard approach, the implementation product family consists of at least two implementation products, implementation product BP A and implementation product BP B. These implementation products require two sets of implementation materials for manufacturing, implementation material set BM A and implementation material set BM B. Further, the standard approach described here is conditional on the quantity of implementation materials from implementation material set BM B, which determines the implementation capacity, not being included in implementation material set BM A. First, implementation product BP A is manufactured.

[0057] The standard approach described here may advantageously recommend the following steps.

[0058] 1. A software-supported production planning tool analyzes which implementation product to manufacture first. Here, it is implementation product BP B. For this, implementation material set BM B is required. 2. A software-supported optimization tool determines which supply path is the ideal spatial position for implementation material set BM B, considering the short movement path of the implementation head in the pick-up of the corresponding parts. Here, the current setup of implementation material set BM A within the family setup is considered. The optimization tool calculates the corresponding rearrangement plan. 3. Optional step: The optimization tool calculates in which order the implementation materials BM B should be rearranged or repositioned based on the cycle time for the manufacture of implementation product BP A. Rearrangement or repositioning that has the greatest impact on the implementation capacity of the corresponding implementation machine is carried out with high priority. 4. The rearrangement plan is sent to a control computer that controls the robot for handling and automatic repositioning of the implementation materials. 5. The robot performs the replacement of the corresponding mounting materials based on the replacement plan. Ideally, this is done in relation to the operation of the mounter or the upper mounting line, and is instructed to the robot without affecting other operations of the robot.

[0059] The replacement of the mounting material set BM B needs to be carried out and completed before the start of the production of the mounted product BP B, that is, during the production time of the mounted product BP A. Since the mounting material set BM B has not been used yet, the replacement of the mounting materials in the mounting material set BM B does not affect the mounting capacity of the corresponding mounter.

[0060] (II) Expansion 1 New arrangement of currently required mounting materials The steps described above can also be used for the replacement or new arrangement of the mounting materials currently used in the production of the currently mounted product within the family setup. In this case, the new arrangement of the currently required mounting materials may affect the capacity of the corresponding mounter. However, such a new arrangement will only be carried out in a meaningful way if the newly arranged position of the currently required mounting materials, or the new allocation between the currently required mounting materials and the supply path of the mounter, is more beneficial for the resulting mounting capacity than the loss of mounting capacity caused by the new arrangement.

[0061] For the new arrangement of the mounting materials themselves required for the current mounted product described here, in some cases, a time frame during which at least one specific mounting material is not used may be utilized. This can be, for example, when the mounting head has just received parts from another component feeder for the next head cycle, or when the component carrier has just been fully mounted and the mounting head has to wait for the next component carrier to enter the mounting area of the mounter. As long as such a time frame is utilized for the new arrangement of the mounting materials themselves required for the current mounted product, this new arrangement can also be carried out without affecting the capacity with respect to the resulting mounting capacity.

[0062] (III) Expansion 2 New arrangement of the mounting materials in the warehouse The steps described above may also be used to optimize the family setup that is not currently being used by the mounting machine, for example, in the warehouse. Such a warehouse may be an intermediate warehouse, especially near the corresponding mounting machine or near the corresponding mounting line.

[0063] That is, for example, for the production of the current mounting product, the mounting material set C1 of the family setup C may be used. Further, there may be a plurality of mounting materials of the family setup D (adjacent to each other) in the warehouse. Based on the production plan, after the mounting material set C1, the mounting material set D1 needs to be used for the production of the next mounting product. In this case, the method described above may be used for the optimization of the material set D1.

[0064] After the transition from the family setup C to the family setup D, the mounting machine equipped with the mounting material set D1 can manufacture the next mounting product with the maximum mounting capacity.

[0065] Further advantages and features of the present invention will become apparent from the following exemplary description of currently advantageous embodiments.

Brief Description of the Drawings

[0066]

Figure 1

Figure 2

Figure 3

Modes for Carrying Out the Invention

[0067] In the following detailed description, features or components of various embodiments that are the same as or at least functionally the same as corresponding features or components of other embodiments are provided with the same reference numerals, or reference numerals that have the same last two characters as the corresponding features or components that are the same or at least functionally the same. To avoid unnecessary repetition, features or components already described above with reference to the embodiments will not be described in detail hereinafter.

[0068] FIG. 1 shows a schematic view of a mounter 100 for mounting electronic components 192 on a component carrier or printed circuit board 190. The mounter 100 has a frame structure or chassis 102. In contact with the frame structure 102, two fixed carrier rails 132 and 133 are installed, and the carrier rails extend along the y direction, respectively. Both carrier rails 132 and 133 are components of the positioning system 130 and are referred to herein as fixed component 132 or another fixed component 133.

[0069] In contact with both fixed components 132 and 133, a movable carrier rail 140 is installed, and the movable carrier rail extends along a major axis 140a, and the major axis runs parallel to the x direction in the coordinate system used here. In the context of the technology described here, the movable carrier rail is referred to as the movable component 140. The movable component 140 is driven by a drive motor configured as a linear motor (not shown) and is movable along the y direction. The corresponding moving direction is identified as a double arrow "Y".

[0070] In contact with the movable component 140, an assembled component 134, which may be a carriage for example, is installed. The assembled component is held in contact with a linear guide (not shown) and may be moved along the x-direction by another linear motor (also not shown). The corresponding moving direction is identified by the double arrow "X". In contact with the assembled component 134, a mounting head 125 is installed in a known manner.

[0071] Both the fixed components 132, 133, the movable component 140 and the assembled component 134, together with a linear motor (not shown in FIG. 1) and a linear guide (also not shown), constitute a positioning system 130 by which the mounting head 125 can be moved or positioned within the xy plane.

[0072] The mounting of the component carrier 190 is carried out in the mounting area 110. Before mounting, the component carrier 190 to be mounted is conveyed into the mounting area 110 by a conveying device 112 such as a conveyor belt. After at least partially mounting the component 192, the component carrier 190 is carried out by the conveying device 112. The corresponding conveying directions are respectively identified by the arrows T in FIG. 1.

[0073] As already described, the mounting head 125 is attached to the assembled component 134. By appropriate control of a linear motor (not shown), the mounting head 125 can move between the component picking position 116 of the component supply system 114 and the mounting area 110. According to the embodiment shown here, the component supply system 114 has a total of 10 component supply devices 115, and each of the component supply devices conveys one type of the components 192 packed in the component belt continuously to each component picking position 116.

[0074] According to the embodiments illustrated herein, each of the component supply devices 115 has an internal space. In this internal space, the associated component 192 is packaged within a component belt (not shown), and the component belt is wound up on a winding body (not shown in FIG. 1 either). Each component supply device 115 thereby constitutes a unit that can be handled compactly together with the component 192 taken into it. As already described above, in this specification, the component supply device and the component 192 taken into it are referred to as the mounting material BM.

[0075] The data processing device 118 that controls the mounting process is communicatively connected through various linear motors and the mounting head 125 and data lines (not shown). In the mounting process, the mounting head 125 moves to the component pickup position 116, where the component 192 is taken in. Subsequently, the mounting head 125 moves into the interior of the mounting area 110 together with the taken-in component 192, where the component 192 is placed on the prepared component carrier 190. Thereafter, the mounting head 125 returns to the component supply system 114 "in an empty state", where a new component 192 is taken in.

[0076] As can be seen from FIG. 1, the mounter 100 further has two cameras. The first fixed camera 120 functions to measure the component 192 taken in by the mounting head 125. For this purpose, the mounting head 125 is positioned above the camera 120 so that the taken-in component 192 reaches within the capture range of the camera 120. In this component measurement, for example, the exact angular position of the taken-in or held component 192 may be measured. In the placement of the corresponding component 192, the deviation of the angular position may be adjusted in an appropriate manner by proper rotation of the component holding device by a known method, whereby the corresponding component 192 is placed on the component carrier 190 at the correct angular position.

[0077] The second camera 122 is configured to accurately measure markings installed on the surface of the component carrier 190 to be implemented. Thereby, the exact spatial position of the component carrier 190 within the implementation area 110 is recognized, and in positioning the implementation head 125, it can be considered that the components 192 are truly accurately placed at their respective determined target positions on the component carrier 190. According to the illustrated embodiment herein, the second camera 122 is installed in contact with the implementation head 125 and moves together with the implementation head 125 for measuring the markings on the component carrier 190.

[0078] The implementation material BM configured as an easy-to-handle unit, that is, the component supply device 115 and the associated components 192, are rearranged or repositioned by the technology of the robot 150 described herein during the manufacture of the current implementation product, that is, the component carrier 190 at least partially implemented by the components 192. This rearrangement or repositioning is carried out in consideration of the most efficient manufacture of the next implementation product to be manufactured after the completion of the current implementation product. Here, the implementation product is understood here as a certain type of implementation product, and typically in practice, it includes a plurality of each of this type of implementation product. According to the illustrated embodiment herein, in the mentioned rearrangement or repositioning, only the implementation material BM not used in the manufacture of the current implementation product is rearranged or newly positioned in the supply path of the mounter 100.

[0079] FIG. 2 illustrates the manufacture of two implementation products using a known fixed family setup. A mounter (not shown) exemplarily equipped with seven supply paths is shown, and each of the supply paths is connected to one component supply device. Of course, the technology described herein can also be implemented by a mounter with any other number of supply paths.

[0080] Again, the component supply device is located in the internal space, which is configured to contain the components to be mounted as described above. The corresponding mounting materials (component supply device + components) are denoted by reference signs BM 1, BM 2, BM 3, BM 4, BM 5, BM 6, and BM 7.

[0081] FIG. 2 shows the manufacture of a first mounting product BP A on the left side. Here, a first component carrier or a first printed circuit board 290a is mounted with components from the mounting materials BM 1, BM 2, and BM 3. For clarity, the mounting materials BM 1, BM 2, and BM 3 are shown in gray in FIG. 2 and are referred to as "BMactive" in the description of FIG. 2. The mounting materials BM 2, BM 4, BM 5, and BM 6 that are not used for the manufacture of the first mounting product BP A are shown in white in FIG. 2 and are referred to as "BMpassive" in the description of FIG. 2.

[0082] For mounting, the first component carrier 290a enters the elongated mounting area of the mounter by means of the transport device TP. This elongated mounting area extends along the entire extent of the seven mounting materials BM 1 to BM 7 along the transport direction of the transport device TP suggested by the arrow.

[0083] The mounting materials BM 1, BM 2, and BM 3 that are used or effective for the mounting of the first mounting product BP A are not arranged directly adjacent to each other, contrary to the manufacture using the single-stage setup described in the introduction of this specification, which is not shown. Therefore, the movement path of the mounting head of the mounter during the picking of the corresponding components is somewhat longer compared to the single-stage setup. The movement path can be somewhat shortened only if, during the manufacture of the first mounting product BP A, the first component carrier 290a to be mounted is moved by the transport device TP within the elongated mounting area to a location where the overall movement path between (i) on the one hand, the three mounting materials BM 1, BM 2, and BM 3 and (ii) on the other hand, the corresponding placement positions of the components on the first component carrier 290a is as short as possible.

[0084] After the production of the first implementation product BPA is completed, or more specifically, after the production of a predetermined quantity of the first implementation product BPA is completed, the manufacturing technology transfer from the first implementation product BPA to the second implementation product BPB is carried out. The production of the second implementation product BPB is shown on the right side of FIG. 2. The transfer from the first implementation product BPA to the second implementation product BPB is suggested by "Δ" in FIG. 2. The part supply system 114 or the setup of the mounter, and thus the allocation between each mounting material BM1 to BM7 and the supply path of the mounter, is not changed in correspondence with the family setup approach.

[0085] According to the embodiment illustrated here, for the production of the second implementation product BPB, the mounting materials BM1, BM4, and BM6 are used. The mounting materials BM2, BM3, BM5, and BM7 are not used for the production of the second implementation product BPB.

[0086] To keep the movement path of the mounting head for the production of the second implementation product BPB as short as possible, the second part carrier 290b used for the second implementation product BPB moves close to both mounting materials BM4 and BM6 for mounting within the mounting area.

[0087] FIG. 3 illustrates the production of two implementation products using dynamic setup optimization according to an embodiment of the present invention. The production starts with the production of the first implementation product BPA that mounts the first part carrier 290a. According to the embodiment illustrated here, for this purpose, three mounting materials BM1, BM3, and BM7 are used. These are also shown in gray in FIG. 3 and are called "BMactive" in the description. The mounting materials BM2, BM4, BM5, and BM6 that are not used for the production of the first implementation product BPA are shown in white or shaded in FIG. 3. Considering the short movement path of the mounting head, the first part carrier 290a is placed as close as possible to the effective mounting materials BM1, BM3, and BM7 by the transfer device TP for mounting.

[0088] According to the embodiments illustrated herein, both mounting materials BM 2 and BM 5 illustrated in white are also not used for the manufacture of the future second mounting product BP B. The mounting materials BM 4 and BM 6 illustrated with shading are required for the manufacture of the future second mounting product BP B. Therefore, they are referred to as "BMnext" in the description of FIG. 3.

[0089] Even during the manufacture of the first mounting product BP A, in advance, considering the manufacture of the upcoming mounting product BP B, rearrangement or repositioning of the mounting materials BM 2, BM 4, BM 5, and BM 6 that are not currently used in the component supply system 114 is performed. Thereby, the assignment between the mounting materials BM 2, BM 4, BM 5, and BM 6 and the corresponding supply paths of the mounter is changed. This repositioning of only the unused mounting materials BM 2, BM 4, BM 5, and BM 6 is suggested by "Δ1" in FIG. 3.

[0090] After the manufacture of the first mounting product BP A is completed, or more specifically, after the manufacture of a predetermined quantity of the first mounting product BP A is completed, a transition from the first mounting product BP A to the second mounting product BP B is performed. The manufacture of the second mounting product BP B is illustrated on the right side of FIG. 3. The manufacturing technology transition from the first mounting product BP A to the second mounting product BP B is suggested by "Δ2" in FIG. 3. The setup of the component supply system 114 or the mounter, and thereby the assignment between each of the mounting materials BM 1 to BM 7 (in FIG. 3, in order, BM 1, BM 3, BM 7, BM 4, BM 6, BM 2, and BM 5) is not changed during this transition "Δ2".

[0091] In order to minimize the movement path of the mounting head for manufacturing the second mounting product BP B, according to the embodiment illustrated herein, during the manufacture of the second mounting product BP B, the effective mounting materials BM 1, BM 4, and BM 6 in the component supply system 114 or in contact with the supply path of the mounter are rearranged or repositioned. Specifically, according to the embodiment illustrated herein, for example, both mounting materials BM 1 and BM 7 are swapped with each other. Thereby, the effective mounting material BM 1 approaches the other two effective mounting materials BM 4 and BM 6. This rearrangement is suggested by "Δ3" in FIG. 3.

[0092] According to the embodiment illustrated herein further, after this rearrangement "Δ3", the second component carrier 290b to be mounted is placed somewhat further rearward along the conveyance direction of the conveyance device TP inside the mounting area. Thereby, for manufacturing the second mounting product BP B, the movement path of the mounting head between the component supply system 114 and the mounting position on the second component carrier 290b can be shortened.

[0093] It should be noted that the concept of "comprising" does not exclude other elements, and "one" does not exclude a plurality. Also, the elements described in connection with various embodiments can be combined. And note that the reference signs in the claims should not be construed as limiting the scope of protection of the claims.

Description of Reference Signs

[0094] 100 Mounter 102 Frame Structure / Chassis 110 Mounting Range 112 Conveyance Device 114 Component Supply System 115 Component Supply Device 116 Component Take-off Position 118 Data Processing Device / Control Device 120 Fixed Camera / Component Camera 122 Mobile Camera / Printed Circuit Board Camera 125 Mounting Head 130 Positioning System 132 Fixed Component / Fixed Carrier Rail 133 Another Fixed Component / Another Fixed Carrier Rail 134 Assembled Component 140 Movable Component / Movable Carrier Arm 140a Long Axis 150 Robot 190 Component Carrier / Printed Circuit Board 192 Electronic Component BM Mounting Material T Conveying Direction 290a First Component Carrier / First Printed Circuit Board 290b Second Component Carrier / Second Printed Circuit Board BM 1 - BM 7 Mounting Materials (Component Feeding Device + Components) BMaktive Mounting Materials Used in the Manufacture of the Current Mounted Product BMpassive Mounting Materials Not Used in the Manufacture of the Current Mounted Product BMnext Mounting Materials Used in the Manufacture of the Next Mounted Product BP A First Mounted Product BP B Second Mounted Product TP Conveying Device Δ Transition from the First Mounted Product to the Second Mounted Product Using Different Mounting Materials (Not a Tooling Change) Δ1 Rearrangement of Ineffective Mounting Materials During the Manufacture of the First Mounted Product Δ2 Transition from the First Mounted Product to the Second Mounted Product Using Different Mounting Materials (Not a Tooling Change) Δ3 Rearrangement of Effective Mounting Materials During the Manufacture of the Second Mounted Product

Claims

1. A method for manufacturing a mounted product using a mounting machine having a plurality of supply paths, the method comprising the steps of: Manufacture of a first mounting product, comprising: (i) a first positive selection of packaging material is used that is supplied to the manufacturing through a first positive selection of supply channel; (ii) a manufacturing process in which a first negative selection of packaging materials assigned to a first negative selection of supply channels is not used; and changing an allocation between the mounting material and the supply lines from a first allocation to a second allocation for a first negative selection of the mounting material; A change implemented during manufacturing of the first packaging product; and Manufacture of a second mounting product, comprising: (i) a second positive selection of packaging material is used that is supplied to the manufacturing through a second positive selection of supply channel; (ii) a manufacturing step in which the second negative selection of the packaging material assigned to the second negative selection of the supply channel is not used; the second positive selection of the supply line is different from the first positive selection of the supply line; The method, wherein the second assignment is different from the first assignment.

2. The method of claim 1 , wherein the packaging material comprises components, and in particular electronic components.

3. The method of claim 2 , wherein the mounting material further comprises a component supply device.

4. 2. The method of claim 1, wherein the change in allocation between mounting materials and supply paths from the first allocation to the second allocation is performed in an automatic manner and without manual operator intervention.

5. The method of claim 1 , wherein at least a portion of the mounting material of the first negative choice is at least a portion of the mounting material of the second positive choice.

6. 2. The method of claim 1, wherein a first sum of (i) the number of feed paths of the first positive option and (ii) the number of feed paths of the first negative option is the same as a total number of the plurality of feed paths, and / or a second sum of (i) the number of feed paths of the second positive option and (ii) the number of feed paths of the second negative option is the same as a total number of the plurality of feed paths.

7. 2. The method of claim 1, wherein during manufacturing of the first mounting product, for a first positive choice of mounting material, an allocation between the relevant positive and selected mounting material and the corresponding positive and selected supply path remains unchanged, and / or during manufacturing of the second mounting product, for the second positive choice of mounting material, an allocation between the relevant positive and selected mounting material and the corresponding positive and selected supply path remains unchanged.

8. 2. The method of claim 1, wherein during manufacturing of the first mounting product, an allocation between the relevant positive and selected mounting material and the corresponding positive and selected supply path is changed for a first positive choice of mounting material, and / or during manufacturing of the second mounting product, an allocation between the relevant positive and selected mounting material and the corresponding positive and selected supply path is changed for a second positive choice of mounting material.

9. changing the allocation between mounting material and supply lines from the first allocation to the second allocation comprises replacing a first mounting material of the first negative selection by a second mounting material of the first negative selection, after the replacement: (i) the first mounting material is assigned to a supply path previously assigned to the second mounting material; (ii) the second mounting material is allocated to a supply path previously allocated to the first mounting material; The method of claim 1.

10. 2. The method of claim 1, wherein the change in allocation between mounting materials and supply paths from the first allocation to the second allocation includes at least one other mounting material being taken from a warehouse for mounting materials and allocated to a predefined supply path at the mounting machine.

11. 2. The method of claim 1, wherein the change in allocation between mounting material and supply lines from the first allocation to the second allocation includes removal of at least one mounting material of a first negative selection of the mounting material.

12. a change in another allocation between the packaging material and the supply lines from a different first allocation to a different second allocation for a second negative selection of the packaging material, the change being performed during manufacturing of the second packaging product; and Manufacture of a third mounting product, (i) a third positive selection of packaging material is used that is supplied to the manufacturing through a third positive selection of supply channel; (ii) a third negative selection of the packaging material allocated to the second negative selection of the supply channel is not used; and the third positive option of the supply line is different from the second positive option of the supply line; The method of claim 1 , wherein the different second assignment is different from the different first assignment.

13. A mounting machine for manufacturing a mounted product by automatically mounting components on a component carrier, comprising: a plurality of supply paths capable of supplying one type of mounting material, each containing one type of component, through one supply path for manufacturing the mounting product; (i) To grasp the supplied part; (ii) transporting the gripped component to a mounting area of ​​the mounter where the component carrier to be mounted is located; and (iii) placing the gripped components on the component carriers at their respective pre-defined mounting positions; A mounting head configured as A data processing apparatus configured to carry out the method of claim 1; A mounting machine having the above structure.

14. A computer program for manufacturing an assembly product using an assembly machine having multiple supply paths, each of which can supply one type of assembly material through one supply path for manufacturing the assembly product, the computer program being configured to perform the method of claim 1 when executed by a data processing device.

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