Substrate working device and substrate working method

Abstract

To provide a substrate working device that can be made compact.SOLUTION: A substrate working device 100 includes a substrate mounting unit 102 having a mount surface on which a substrate 3 is placed, a driving unit 103 for rotating the substrate mounting unit 102, a working unit 104L and a working unit 104R for performing first work which is work to be performed on the long sides of the substrate 3 when the substrate 3 is in a first positional state, and second work which is work to be performed on the short sides of the substrate 3 when the substrate is in a second positional state, a changing unit 105 for changing the distance between the working units 104L and 104R, and a control unit 101. After the first work and before the second work, the control unit 101 executes arrangement change processing for switching the state of the substrate 3 from the first positional state to the second positional state, and in the arrangement change processing, the control unit 101 causes the changing unit 105 to increase the gap between the working units 104L and 104R, and then causes the driving unit 103 to rotate the substrate mounting unit 102 on which the substrate 3 is mounted.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a substrate working device that performs operations for crimping components onto a substrate, and the like.

Background Art

[0002] Conventionally, a component crimping system has been provided for crimping electronic components (hereinafter, also simply referred to as "components") onto a substrate such as a liquid crystal panel. This component crimping system crimps the components to an end portion of the liquid crystal panel via an anisotropic conductive member, an ACF (Anisotropic Conductive Film). That is, the component crimping system includes a substrate working device that attaches an ACF to an end portion of the liquid crystal panel, and another substrate working device that mounts a component on a portion of the liquid crystal panel to which the ACF is attached and crimps it to the liquid crystal panel.

[0003] Patent Document 1 discloses a tape attaching device as a substrate working device for attaching an ACF to a substrate. This tape attaching device includes two attaching units for attaching an anisotropic conductive tape, which is an ACF, to the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the tape attaching device of Patent Document 1 described above has a problem in that the device may be enlarged.

[0006] Therefore, the present disclosure provides a substrate working device and the like that can be miniaturized.

Means for Solving the Problems

[0007] A substrate working apparatus according to one aspect of the present disclosure has a placement surface on which a substrate having a first side and a second side intersecting the first side is placed, and is rotatable about a rotation axis extending in the normal direction of the placement surface. A substrate placement unit, a drive unit that rotates the substrate placement unit, a first operation that is an operation performed on the first side when the substrate is in a first arrangement state, and a second operation that is an operation performed on the second side when the substrate is in a second arrangement state. Two working units for performing the above, a changing unit for changing the interval between the two working units, and a control unit for controlling the drive unit and the changing unit. The control unit executes an arrangement change process for switching the state of the substrate from the first arrangement state to the second arrangement state after the first operation and before the second operation. In the arrangement change process, after expanding the interval between the two working units by the changing unit, the drive unit rotates the substrate placement unit on which the substrate is placed.

[0008] These general or specific aspects may be implemented in a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or may be implemented in any combination of a system, method, integrated circuit, computer program, and recording medium. The recording medium may also be a non-transitory recording medium.

Advantages of the Invention

[0009] The substrate working apparatus of the present disclosure can reduce the size of the apparatus.

[0010] Further advantages and effects in one aspect of the present disclosure will be clarified from the specification and drawings. Such advantages and / or effects are provided by some embodiments and the features described in the specification and drawings, respectively, but it is not necessary to provide all of them in order to obtain one or more of the same features.

Brief Description of the Drawings

[0011]

Figure 1

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Embodiments for Carrying Out the Invention

[0012] The substrate working device according to the first aspect of the present disclosure has a placement surface on which a substrate having a first side and a second side intersecting the first side is placed, and a substrate placement portion rotatable about a rotation axis extending in the normal direction of the placement surface, a drive portion for rotating the substrate placement portion, two working portions for performing a first operation which is an operation performed on the first side when the substrate is in a first arrangement state and a second operation which is an operation performed on the second side when the substrate is in a second arrangement state, a changing portion for changing the interval between the two working portions, and a control portion for controlling the drive portion and the changing portion. The control portion executes an arrangement change process for switching the state of the substrate from the first arrangement state to the second arrangement state after the first operation and before the second operation. In the arrangement change process, after expanding the interval between the two working portions by the changing portion, the substrate placement portion on which the substrate is placed is rotated by the drive portion.

[0013] As a result, since the interval between the two working portions is expanded, a space can be provided between the two working portions into which at least a part of the rotating substrate can enter. Therefore, the length of the substrate working device in the depth direction can be shortened. The depth direction is a direction perpendicular to the direction in which the two working portions are arranged and parallel to the substrate. For example, when there is no such space, it is necessary to provide a gap between the two working portions and the rotating substrate in the depth direction so that the two working portions and the rotating substrate do not interfere with each other. However, in the first aspect described above, since there is the above-mentioned space, at least a part of the rotating substrate can be made to enter the space, and interference between the two working portions and the rotating substrate can be suppressed. Therefore, the distance from the two working portions in the above-mentioned depth direction to the rotating substrate can be shortened. As a result, the length of the substrate working device in the depth direction can be shortened. Thereby, miniaturization of the substrate working device can be achieved.

[0014] In addition, in the substrate working device according to the second aspect, the control unit switches the operation mode of the arrangement change process between a first operation mode and a second operation mode. In the first operation mode, after widening the interval between the two working units to the changing unit, the substrate placement unit on which the substrate is placed is rotated by the driving unit. In the second operation mode, the substrate placement unit on which the substrate is placed may be rotated by the driving unit without widening the interval between the two working units to the changing unit. Note that the second aspect may be subordinate to the first aspect.

[0015] Thereby, when the two working units and the rotating substrate do not interfere even without widening the interval between the two working units, the arrangement change process can be performed in the second operation mode, and the time required for the arrangement change process can be shortened.

[0016] In addition, in the substrate working device according to the third aspect, the control unit may switch the operation mode based on substrate information regarding the substrate. Note that the third aspect may be subordinate to the second aspect.

[0017] Thereby, the switching of the operation mode can be appropriately performed.

[0018] In addition, in the substrate working device according to the fourth aspect, the substrate information indicates the dimensions of the substrate and the position of the substrate on the placement surface. Based on the dimensions of the substrate and the position of the substrate indicated in the substrate information, when the arrangement change process is performed in the second operation mode, the control unit determines whether or not at least one of the two working units interferes with the rotating substrate. When it is determined that there is interference, the operation mode may be switched to the first operation mode, and when it is determined that there is no interference, the operation mode may be switched to the second operation mode. Note that the fourth aspect may be subordinate to the third aspect.

[0019] Thus, since the dimensions and position of the substrate are used to determine whether or not at least one of the two working units interferes with the rotating substrate, the determination can be made accurately. Therefore, the switching of the operation mode can be performed more appropriately.

[0020] Further, in the substrate working apparatus according to the fifth aspect, the changing unit may change the interval by moving each of the two working units. Note that the fifth aspect may be dependent on any one of the first aspect to the fourth aspect.

[0021] As a result, since each of the two working units moves, the time required to change the interval can be shortened. That is, when only one of the two working units is moved, it is necessary to move that one a long distance, so a long time is required to change the interval. However, in the fifth aspect, since each of the two working units is moved, the time required to change the interval can be reduced, for example, by half compared to the case where only one is moved.

[0022] Further, in the substrate working apparatus according to the sixth aspect, each of the first operation and the second operation may be an operation of attaching an ACF (Anisotropic Conductive Film) to the substrate. Note that the sixth aspect may be dependent on any one of the first aspect to the fifth aspect.

[0023] As a result, an apparatus (for example, an attaching unit) for attaching an ACF to the substrate can be miniaturized.

[0024] Hereinafter, embodiments will be specifically described with reference to the drawings.

[0025] Note that all the embodiments described below show comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, order of steps, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, the components not described in the independent claims indicating the top-level concept are described as optional components. Each figure is a schematic diagram and is not necessarily drawn precisely. Also, in each figure, the same constituent members are denoted by the same reference numerals.

[0026] (Embodiment) [Schematic Configuration of Component Mounting Line] FIG. 1 is a diagram showing a schematic configuration of a component mounting line in the present embodiment.

[0027] The component mounting line 1 in the present embodiment is a system for producing a product (i.e., a mounting substrate) such as a display panel by mounting components 5 on a substrate 3 such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel. Note that the component 5 is an electronic component such as a drive circuit, for example. The component mounting line 1 is also called a component crimping system.

[0028] As shown in FIG. 1, such a component mounting line 1 includes a substrate loading section 10, an attaching section 20, a temporary crimping section 30, a main crimping section 40, and a substrate unloading section 50. The substrate loading section 10, the attaching section 20, the temporary crimping section 30, the main crimping section 40, and the substrate unloading section 50 are connected in this order.

[0029] The substrate loading section 10 receives the rectangular substrate 3 carried in by an operator or another upstream device. Then, the substrate 3 is unloaded to the downstream attaching section 20.

[0030] The adhering portion 20 receives the substrate 3 unloaded from the substrate loading portion 10, and adheres ACF or the like to each of a plurality of electrode portions 4 on the periphery of the substrate 3 as an adhesive member. Then, the substrate 3 to which the adhesive member is adhered is unloaded to the temporary crimping portion 30. Each of the plurality of electrode portions 4 is constituted by, for example, a plurality of electrodes.

[0031] The temporary crimping portion 30 receives the substrate 3 unloaded from the adhering portion 20, mounts the component 5 on the portion of the substrate 3 where the adhesive member is adhered, and performs temporary crimping. Then, the substrate 3 to which the component 5 is temporarily crimped is unloaded to the main crimping portion 40.

[0032] The main crimping portion 40 receives the substrate 3 unloaded from the temporary crimping portion 30, and performs main crimping (also referred to as thermocompression bonding) on the component 5 temporarily crimped to the substrate 3. Then, the substrate 3 on which the main crimping is performed is unloaded to the substrate unloading portion 50.

[0033] The substrate unloading portion 50 receives the substrate 3 unloaded from the main crimping portion 40. The substrate 3 received by the substrate unloading portion 50 is unloaded to the downstream side.

[0034] In this way, the component mounting line 1 executes a component mounting operation of mounting the component 5 on each of a plurality of electrode portions 4 provided on the periphery of the loaded substrate 3, and unloads the substrate 3 on which the component 5 is mounted from the substrate unloading portion 50 as a mounted substrate.

[0035] [Detailed Configuration of Component Mounting Line] FIG. 2 is a plan view of the component mounting line 1 in the present embodiment. Specifically, FIG. 2 shows the configuration of the component mounting line 1 as viewed from above. In the present embodiment, the conveyance direction of the substrate 3, that is, the left-right direction is referred to as the X-axis direction, the vertical direction, that is, the up-down direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, that is, the depth direction is referred to as the Y-axis direction. Also, the negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side in the conveyance direction of the substrate 3, respectively, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side in the vertical direction, respectively, and the negative side and the positive side in the Y-axis direction correspond to the front side and the back side in the depth direction, or the front side and the rear side, respectively.

[0036] The substrate loading unit 10 includes a base 1a for placing the loaded substrate 3. A stage 11 on which the substrate 3 is placed is provided on the base 1a of the substrate loading unit 10. The stage 11 moves up and down in the Z-axis direction with respect to the base 1a. Further, a plurality of suction holes 11a are provided on the upper surface of the stage 11. Such a stage 11 vacuum-sucks and holds the substrate 3 carried in by an operator or another device on the upstream side and placed on the stage 11 from the suction holes 11a by a suction device such as a pump (not shown).

[0037] The sticking unit 20 has a function of performing a sticking operation of sticking an ACF, which is an adhesive member, to the electrode portion 4 of the substrate 3. The sticking unit 20 includes a substrate moving mechanism 21 and a sticking mechanism 22.

[0038] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. On the base 1b of the substrate moving mechanism 21, an X-axis table, a Y-axis table, a Z-axis table, and a stage 23 are provided in this order from below in a stacked manner.

[0039] The Y-axis table is provided extending in the Y-axis direction and can freely move on the X-axis table in the X-axis direction. The Z-axis table can freely move on the Y-axis table in the Y-axis direction, raises and lowers the stage 23 provided on the upper part in the Z-axis direction, and rotates around the Z-axis.

[0040] Also, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 vacuum-suction holds the substrate 3 placed on its upper surface. In this way, the substrate moving mechanism 21 adsorbs and holds the substrate 3 and moves it in the horizontal plane (specifically, in the X-axis direction and the Y-axis direction), raises and lowers it in the vertical direction (that is, the Z-axis direction), and rotates it around the Z-axis.

[0041] The sticking mechanism 22 includes, for example, two sticking mechanism units arranged in the X-axis direction above the base 1b. Each sticking mechanism unit includes an ACF supply unit for supplying ACF, a sticking head for sticking the ACF to the substrate 3, and a sticking backup stage arranged below the sticking head. Each of such two sticking mechanism units sticks the ACF supplied from the ACF supply unit to positions corresponding to a plurality of electrode portions 4 on the substrate 3 supported by the sticking backup stage by raising and lowering the sticking head.

[0042] The temporary bonding unit 30 performs a temporary bonding operation of mounting the component 5 on the region where the ACF of the substrate 3 is stuck (that is, the bonding target portion) and temporarily bonding it. The temporary bonding unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component transfer unit 35.

[0043] The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the adhering part 20. Specifically, the substrate moving mechanism 31 has a stage 37 for holding the substrate 3. A plurality of suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 vacuum-sucks and holds the substrate 3 placed on the stage 37 by the plurality of suction holes 37a. Further, the substrate moving mechanism 31 has a function of moving the stage 37 that adsorbs and holds the substrate 3 in the horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By the movement and rotation of the stage 37 of the substrate moving mechanism 31, the region where the ACF of the substrate 3 held by suction is adhered is positioned above the backup part 36 which is the backup stage of the component mounting mechanism 32.

[0044] The component supply unit 33 is provided so as to project from the rear part of the base 1b to the back side (i.e., the positive side in the Y-axis direction) of the component mounting mechanism 32. For example, the component supply unit 33 includes a supply reel 33a around which a tape member such as a TCP (Tape Carrier Package) in which components are incorporated is wound, a punching part 33b, a movable stage 33c, and a rail 33d. Such a component supply unit 33 sequentially supplies the components 5 from the tape member by the movement of these components.

[0045] The component transfer unit 35 moves the component 5 supplied from the component supply unit 33 to the side of the crimping tool 34 included in the component mounting mechanism 32.

[0046] The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a backup part 36.

[0047] The backup part 36 is a long-shaped member that supports the substrate 3 from below. That is, the backup part 36 supports the crimping target part, which is a predetermined part of the substrate 3 held by the stage 37, from below. Note that this crimping target part is the part of the substrate 3 where the ACF is adhered.

[0048] The crimping tool 34 holds the component 5 and crimps the component 5 onto the upper surface of the substrate 3 supported by the backup portion 36. That is, the crimping tool 34 crimps the component 5 onto the crimping target portion of the substrate 3. Specifically, the crimping tool 34 moves up and down in the Z-axis direction and adsorbs (i.e., picks up) the component 5 moved by the component transfer portion 35 from above. Then, the crimping tool 34 mounts the adsorbed component 5 on the ACF and presses the entire substrate 3 against the backup portion 36 to temporarily crimp the component 5 to the substrate 3. Note that the temporary crimping portion 30 may include a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0049] This crimping portion 40 performs a main crimping operation (also referred to as a thermocompression bonding operation) for main-crimping (i.e., thermocompression bonding) the component 5 temporarily crimped to the substrate 3 by the temporary crimping portion 30 to the substrate 3. By doing so, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a main crimping portion 40 includes a substrate moving mechanism 41 and a crimping mechanism 42.

[0050] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the sticking portion 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 vacuum-sucks and holds the substrate 3 placed on the stage 49 by the plurality of suction holes 49a. Further, the substrate moving mechanism 41 has a function of moving the stage 49 that sucks and holds the substrate 3 in the horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z-axis. The substrate moving mechanism 41 positions the region where the component 5 of the substrate 3 held by suction is temporarily crimped above the crimping support portion of the crimping mechanism 42 by moving and rotating the stage 49.

[0051] The crimping mechanism 42 presses the component 5 of the substrate 3 toward the crimping support portion side with a heated head. As a result, the component 5 is main-crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0052] The substrate unloading unit 50 has a function of vacuum-sucking and holding the substrate 3 conveyed from the main crimping unit 40 on the stage 51. The substrate 3 held in the substrate unloading unit 50 is unloaded to another downstream device or taken out from the stage 51 by an operator. The stage 51 moves up and down in the Z-axis direction with respect to the base 1c. Further, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 vacuum-sucks and holds the substrate 3 transferred from the main crimping unit 40 on its upper surface.

[0053] The conveying unit 60 is a device for conveying the substrate 3. Specifically, the conveying unit 60 has a function of delivering (transferring) the substrate 3 carried into the substrate loading unit 10 to the sticking unit 20, the temporary crimping unit 30, the main crimping unit 40, and the substrate unloading unit 50 in this order. The conveying unit 60 is arranged in the front region (i.e., the negative side in the Y-axis direction) of the sticking unit 20, the temporary crimping unit 30, and the main crimping unit 40.

[0054] The conveying unit 60 includes a substrate conveying mechanism 62A, a substrate conveying mechanism 62B, a substrate conveying mechanism 62C, and a substrate conveying mechanism 62D, which are arranged in order from the upstream side on a moving base 61 extending in the X-axis direction across the bases 1a, 1b, and 1c. The substrate conveying mechanisms 62A to 62D each include a base 63 and one or more arm units 64. In the present embodiment, a case where the substrate conveying mechanisms 62A to 62D each include two arm units 64 is illustrated. The base 63 is provided on the moving base 61 and moves freely in the X-axis direction. Two arm units 64 are provided side by side in the X-axis direction on the base 63. The arm unit 64 vacuum-sucks the substrate 3 from above.

[0055] Each of the substrate transfer mechanisms 62A to 62D moves to a substrate transfer position where it vacuum-sucks the substrate 3 held by the stages 11, 23, 37, 49, and 51 from above, and receives or transfers the substrate 3 from or to the elevating stages 11, 23, 37, 49, and 51. For example, the substrate transfer mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate loading unit 10 and transfers it to the stage 23 of the sticking unit 20. Also, for example, the substrate transfer mechanism 62B receives the substrate 3 from the stage 23 of the sticking unit 20 and transfers it to the stage 37 of the temporary pressure bonding unit 30. Also, for example, the substrate transfer mechanism 62C receives the substrate 3 from the stage 37 of the temporary pressure bonding unit 30 and transfers it to the stage 49 of the main pressure bonding unit 40. Also, for example, the substrate transfer mechanism 62D receives the substrate 3 from the stage 49 of the main pressure bonding unit 40 and transfers it to the stage 51 of the substrate unloading unit 50.

[0056] [Details of the Sticking Unit (Substrate Working Device)] FIG. 3 is a diagram showing an example of the sticking mechanism 22 of the sticking unit 20 in the present embodiment. Specifically, FIG. 3 schematically shows the appearance of the sticking mechanism 22 as viewed from the negative side in the Y-axis direction.

[0057] The sticking mechanism 22 includes two sticking mechanism units 220L and 220R, an X-axis rail mechanism 228, and a sticking base 229.

[0058] The sticking base 229 is a base for supporting the two sticking mechanism units 220L and 220R.

[0059] The X-axis rail mechanism 228 is arranged along the X-axis direction on the upper surface of the sticking base 229. On this X-axis rail mechanism 228, the two sticking mechanism units 220L and 220R are mounted so as to be movable along the X-axis direction. Also, the X-axis rail mechanism 228 includes a changing part for changing the interval between the two sticking mechanism units 220L and 220R.

[0060] The two sticking mechanism units 220L and 220R are mechanisms for sticking ACF to the substrate 3 and have the same configuration as each other. For example, the sticking mechanism unit 220L includes a tape supply reel 221, a tape recovery unit 222, a sticking head 223, a sticking backup stage 224, and a tape cutting unit 225.

[0061] The tape supply reel 221 is a reel around which the tape member tp is wound. The tape member tp is composed of a base tape and an ACF tape laminated on the base tape. The above-mentioned ACF is an ACF slice cut from the ACF tape. The tape member tp is fed out from the tape supply reel 221 by the drive of one or more rollers. It can be said that such a tape supply reel 221 and one or more rollers constitute the above-mentioned ACF supply unit.

[0062] The tape cutting unit 225 cuts the ACF tape of the tape member tp fed out from the tape supply reel 221 by moving the cutter in the vertical direction. That is, the tape cutting unit 225 makes a half cut on the tape member tp. By this cutting, an ACF slice is formed.

[0063] The sticking backup stage 224 is a base for supporting the peripheral edge of the substrate 3 from below.

[0064] The sticking head 223 moves up and down. Specifically, by moving downward, the sticking head 223 presses the tape member tp passed between it and the sticking backup stage 224 against the peripheral edge of the substrate 3 supported by the sticking backup stage 224. That is, the sticking head 223 presses the tape member tp against the peripheral edge of the substrate 3 and the side of the sticking backup stage 224. At this time, the above-described ACF segments are formed on the lower surface of the base tape of the tape member tp to be pressed. Also, electrode portions 4 are formed on the peripheral edge of the substrate 3. Therefore, the ACF segments are pressed against and stuck to the electrode portions 4 of the substrate 3 and peeled off from the base tape. The base tape from which the ACF segments have been peeled off is recovered by the tape recovery unit 222 as the tape member tp is fed out.

[0065] FIG. 4 is a diagram showing an example of the sticking portion 20 in the present embodiment. Specifically, FIG. 4(a) schematically shows the appearance of the sticking portion 20 as viewed from the positive side in the X-axis direction, and FIG. 4(b) schematically shows the appearance of a part of the sticking portion 20 as viewed from the positive side in the Z-axis direction.

[0066] As shown in FIG. 4(a), the sticking portion 20 includes a sticking base 229, a substrate moving mechanism 21 and an X-axis rail mechanism 228 disposed on the sticking base 229, and two sticking mechanism units 220L and 220R placed on the X-axis rail mechanism 228. In FIG. 4(a), the sticking mechanism unit 220L is on the negative side in the X-axis direction relative to the sticking mechanism unit 220R and is hidden behind the sticking mechanism unit 220R.

[0067] As shown in FIGS. 4(a) and 4(b), the substrate transfer mechanism 21 includes an X-axis table 211, a Y-axis table 212, a Z-axis table 213, and a stage 23. The X-axis table 211 is, for example, in a rail shape and is arranged along the X-axis direction on the adhering base 229. The Y-axis table 212 is, for example, in a rail shape and is arranged on the X-axis table 211 in a state parallel to the Y-axis direction and can move freely in the X-axis direction. The Z-axis table 213 is arranged on the Y-axis table 212, can move freely in the Y-axis direction, and raises and lowers the stage 23 provided on the upper part in the Z-axis direction and rotates it around the Z-axis. The substrate 3 is placed on the stage 23 and adsorbed and held. Such a substrate transfer mechanism 21 moves the substrate 3 adsorbed and held on the stage 23 in the X-axis direction, Y-axis direction, and Z-axis direction, and further rotates the substrate 3 around the Z-axis.

[0068] For example, the substrate transfer mechanism 21 rotates and moves the substrate 3 such that the peripheral portion of the substrate 3 adsorbed and held on the stage 23 is placed on the adhering backup stage 224 and supported from below by the adhering backup stage 224. A plurality of electrode portions 4 are formed on the peripheral portion of the substrate 3.

[0069] The tape cutting unit 225 of the adhering mechanism unit 220R has a platen 225a and a cutter 225b. By rising, the cutter 225b sandwiches the tape member tp between the platen 225a and cuts through the ACF tape of the tape member tp. Then, as described above, when the substrate 3 is supported by the adhering backup stage 224, the peripheral portion of the substrate 3 enters a state of getting between the adhering head 223, the platen 225a and the tape member tp, and the adhering backup stage 224.

[0070] FIG. 5 is a block diagram showing the functional configuration of the substrate working apparatus in the present embodiment.

[0071] The substrate processing apparatus 100 in the present embodiment includes a control unit 101, a substrate placement unit 102, a drive unit 103, a processing unit 104L, a processing unit 104R, and a modification unit 105. Such a substrate processing apparatus 100 is configured as an adhering unit 20 in the present embodiment.

[0072] The substrate placement unit 102 has a placement surface on which the substrate 3 is placed, and is a unit that can rotate about a rotation axis extending in the normal direction of the placement surface. The substrate 3 has a first side and a second side that intersects the first side. If the substrate 3 is a rectangular plate, the first side is one of the long side and the short side, and the second side is the other of the long side and the short side. Such a substrate placement unit 102 and the placement surface are, in a specific example, the stage 23 included in the substrate transfer mechanism 21 and the upper surface of the stage 23.

[0073] The drive unit 103 moves and rotates the substrate placement unit 102. In a specific example, the drive unit 103 includes an X-axis table 211, a Y-axis table 212, and a Z-axis table 213 in the substrate transfer mechanism 21. The drive unit 103 also has an actuator such as a motor, and moves and rotates the substrate placement unit 102 by the driving force of the actuator.

[0074] When the substrate 3 is in the first arrangement state, the working units 104L and 104R perform a first operation which is an operation performed on the first side, and when the substrate 3 is in the second arrangement state, they perform a second operation which is an operation performed on the second side. In a specific example, the working units 104L and 104R are the attaching mechanism units 220L and 220R included in the attaching portion 20. In this case, the first operation is an operation of attaching an ACF (i.e., an ACF chip) to the first side of the substrate 3, and the second operation is an operation of attaching an ACF to the second side of the substrate 3. Specifically, the first side where the operation is performed is the peripheral portion of the substrate 3 having one or more electrode portions 4 arranged along the first side of the substrate 3. Similarly, the second side where the operation is performed is the peripheral portion of the substrate 3 having one or more electrode portions 4 arranged along the second side of the substrate 3. Note that the operation of attaching the ACF to the substrate 3 can also be said to be an operation of crimping the ACF to the substrate 3.

[0075] The changing unit 105 changes the distance between the working unit 104L and the working unit 104R. In a specific example, the changing unit 105 is included in the X-axis rail mechanism 228 of the attaching portion 20. Further, the changing unit 105 has an actuator such as a motor, and by the driving force of the actuator, at least one of the working unit 104L and the working unit 104R is moved along the X-axis rail mechanism 228.

[0076] The control unit 101 controls the drive unit 103, the working unit 104L, the working unit 104R, and the changing unit 105. Specifically, the control unit 101 executes an arrangement change process for switching the state of the substrate 3 from the first arrangement state to the second arrangement state after the above-described first operation and before the second operation. In that arrangement change process, the control unit 101 causes the changing unit 105 to widen the interval between the working unit 104L and the working unit 104R, and then rotates the substrate mounting unit 102 on which the substrate 3 is mounted by the drive unit 103. The first arrangement state is the state of the substrate 3 in which the first operation is possible. For example, when the substrate working device 100 is the sticking unit 20, the first side of the substrate 3 is arranged between the sticking head 223 and the tape member tp and the sticking backup stage 224. The second arrangement state is the state of the substrate 3 in which the second operation is possible. For example, when the substrate working device 100 is the sticking unit 20, the second side of the substrate 3 is arranged between the sticking head 223 and the tape member tp and the sticking backup stage 224.

[0077] [Arrangement change process] FIG. 6 is a diagram schematically showing an example of the arrangement change process. Note that FIGS. 6(a) to 6(c) show the state of the working unit 104L, the working unit 104R, and the substrate 3 as viewed from the positive side in the Z-axis direction. Also, in the following example, the first side is the long side and the second side is the short side. Also, the dashed-dotted line passing vertically through FIGS. 6(a) to 6(c) indicates the midpoint or the line of symmetry between the working unit 104L and the working unit 104R in the X-axis direction.

[0078] For example, as shown in Fig. 6(a), the control unit 101 controls the drive unit 103 to move and rotate the substrate mounting unit 102 so that the substrate 3 is in the first arrangement state. When the substrate 3 is in the first arrangement state, the substrate mounting unit 102 (for example, the central position of the substrate mounting unit 102) is at the position L in the Y-axis direction. Since the position L is the position of the substrate mounting unit 102 where work is performed with respect to the long side of the substrate 3, it is also called the long-side working position. And when the substrate 3 is in the first arrangement state, the long side of the substrate 3 is on the positive side of the Y-axis direction and is arranged along the X-axis direction, and is further arranged between the sticking head 223 and the tape member tp and the sticking backup stage 224. In Fig. 6, the sticking head 223, the tape member tp, and the sticking backup stage 224 are not shown from the viewpoint of visibility, and among the working parts 104L and 104R, members at substantially the same height as the substrate 3 are shown.

[0079] Furthermore, the control unit 101 controls the changing unit 105 to set the interval between the working part 104L and the working part 104R to the first interval. For example, the first interval is substantially the same as the interval between the two electrode parts 4 arranged along the long side of the substrate 3.

[0080] When the substrate 3 is in such a first arrangement state, the control unit 101 causes the working parts 104L and 104R to perform, for example, simultaneously, the pasting of the ACF to the two electrode parts 4 of the substrate 3 as the first operation. Furthermore, the control unit 101 controls the drive unit 103 to repeatedly execute the first operation with respect to the working parts 104L and 104R while moving the substrate 3 along the X-axis direction. Thereby, the ACF is pasted to all the electrode parts 4 on the long side of the substrate 3.

[0081] Next, the control unit 101 changes the state of the substrate 3 from the first arrangement state to the second arrangement state. At this time, as shown in FIG. 6(b), the control unit 101 causes the changing unit 105 to widen the interval between the working unit 104L and the working unit 104R. For example, the changing unit 105 widens the interval by moving each of the working unit 104L and the working unit 104R in a direction away from each other. That is, the control unit 101 retracts the working unit 104L and the working unit 104R. Further, the control unit 101 controls the driving unit 103 to move the substrate mounting unit 102 to the position M in the Y-axis direction and rotate it by 90 degrees around the Z-axis. The position M may be a predetermined position for rotating the substrate 3. Since the position M is a position for rotating the substrate 3, it is also called a rotation position. For example, the control unit 101 controls the driving unit 103 to move the substrate mounting unit 102 from the position L to the position M by moving the substrate mounting unit 102 by a distance A1 in the negative Y-axis direction. That is, the control unit 101 retracts the substrate mounting unit 102. Then, after the interval between the working unit 104L and the working unit 104R is widened by the changing unit 105, the control unit 101 causes the driving unit 103 to execute the rotation of the substrate mounting unit 102. As a result, the substrate 3 rotates. When the center of the substrate 3 is on the rotation axis of the substrate mounting unit 102, the substrate 3 rotates about its center.

[0082] Here, if the interval between the working unit 104L and the working unit 104R is not widened, the rotating substrate 3 may collide with each of the working unit 104L and the working unit 104R. Specifically, when the substrate working device 100 is the sticking unit 20, the substrate 3 may collide with the tape cutting unit 225 at the same height as the substrate 3. However, in the present embodiment, as described above, since the interval between the working unit 104L and the working unit 104R is widened, the substrate 3 can rotate without colliding with the working unit 104L and the working unit 104R.

[0083] When the substrate 3 rotates as shown in Fig. 6(b), as shown in Fig. 6(c), the control unit 101 controls the driving unit 103 to move the substrate placement unit 102 to the position N in the Y-axis direction with the short side of the substrate 3 along the X-axis direction. For example, the control unit 101 moves the substrate placement unit 102 by a distance D1 in the negative Y-axis direction by controlling the driving unit 103, thereby moving the substrate placement unit 102 from the position M to the position N. Since the position N is the position of the substrate placement unit 102 where work is performed on the short side of the substrate 3, it is also called the short-side work position. By this movement of the substrate 3, the substrate 3 is in the second arrangement state. When the substrate 3 is in the second arrangement state, the short side of the substrate 3 is arranged on the positive side of the Y-axis and along the X-axis direction, and is further arranged between the sticking head 223 and the tape member tp and the sticking backup stage 224. Then, the control unit 101 causes the changing unit 105 to narrow the interval between the working unit 104L and the working unit 104R and sets the interval to the second interval. For example, the changing unit 105 narrows the interval by moving the working unit 104L and the working unit 104R respectively in a direction approaching each other. The second interval is substantially the same as the interval between the two electrode portions 4 arranged along the short side of the substrate 3. At this time, the control unit 101 may move the substrate placement unit 102 in the X-axis direction so that the sticking heads 223 of the working unit 104L and the working unit 104R face the electrode portion 4 respectively.

[0084] When the substrate 3 is in such a second arrangement state, the control unit 101 causes the working unit 104L and the working unit 104R to perform, for example, simultaneously, the attachment of the ACF to the two electrode portions 4 of the substrate 3 as the second operation. Further, the control unit 101 repeatedly performs the second operation on the working unit 104L and the working unit 104R while moving the substrate 3 along the X-axis direction by controlling the driving unit 103. Thereby, the ACF is attached to all the electrode portions 4 on the short side of the substrate 3.

[0085] In this way, in the present embodiment, since the distance between the working unit 104L and the working unit 104R is widened, a space can be provided between the working unit 104L and the working unit 104R into which at least a part of the rotating substrate 3 can enter. Therefore, the length of the substrate working apparatus 100 in the depth direction, that is, the Y-axis direction, can be shortened. For example, when there is no such space, it is necessary to provide a gap between the working unit 104L and the working unit 104R and the rotating substrate 3 in the Y-axis direction so that the working unit 104L and the working unit 104R do not interfere with the rotating substrate 3. However, in the present embodiment, since there is the above-mentioned space, at least a part of the rotating substrate 3 can be made to enter that space, and interference between the working unit 104L and the working unit 104R and the rotating substrate 3 can be suppressed. Therefore, the distance from the working unit 104L and the working unit 104R in the Y-axis direction to the rotating substrate 3 can be shortened. As a result, the length of the substrate working apparatus 100 in the Y-axis direction can be shortened. Thereby, miniaturization of the substrate working apparatus 100 can be achieved. Further, due to the miniaturization, the working unit 104L and the working unit 104R can be arranged closer to the front side of the substrate working apparatus 100. Therefore, an operator can easily access the working unit 104L and the working unit 104R from the front side of the substrate working apparatus 100 for maintenance, and the accessibility and maintainability can be improved. Furthermore, since there is the above-mentioned space, if the substrate placement unit 102 is moved in the Y-axis direction by a distance A1, the substrate 3 can be rotated, and compared with the case where there is no such space, the distance by which the substrate placement unit 102 is moved in the Y-axis direction can be shortened. As a result, the time for moving the substrate placement unit 102 can be shortened, and the working efficiency can be improved.

[0086] Also, in the present embodiment, each of the first operation and the second operation is an operation of attaching an ACF to the substrate 3. Thereby, the attaching portion 20 for attaching the ACF to the substrate 3 can be miniaturized.

[0087] In addition, in the present embodiment, the changing unit 105 changes the interval by moving each of the working units 104L and 104R. As a result, since each of the working units 104L and 104R moves, the time required to change the interval can be shortened. That is, when only one of the working units 104L and 104R is moved, it is necessary to move that one a long distance, so it takes a long time to change the interval. However, in the present embodiment, since each of the working units 104L and 104R is moved, the time required to change the interval can be reduced, for example, by half compared to the case where only one is moved.

[0088] In the example of FIG. 6, as shown in FIG. 6(b), the driving unit 103 moves the substrate placement unit 102 in the negative Y-axis direction and rotates the substrate placement unit 102. However, before rotating the substrate placement unit 102, the substrate placement unit 102 may be moved in the X-axis direction. For example, the driving unit 103 may move the substrate placement unit 102 in the X-axis direction so that, in the X-axis direction, the position of the rotation axis of the substrate placement unit 102 coincides with the position of the midpoint between the working unit 104L and the working unit 104R. Thereby, interference between the working unit 104L and the working unit 104R and the rotating substrate 3 can be effectively suppressed.

[0089] Also, in the example of FIG. 6, the rotation center of the substrate placement unit 102 and the center of the substrate 3 coincide, but they do not have to coincide. When the rotation center of the substrate placement unit 102 and the center of the substrate 3 do not coincide, the substrate 3 rotates around the Z-axis about a point at a position different from the center of the substrate 3. Therefore, in this case, the rotation radius of the substrate 3 becomes longer than the case where the rotation center and the center of the substrate 3 coincide. Therefore, it is necessary to widen the interval between the working unit 104L and the working unit 104R more, or move the substrate placement unit 102 in the negative Y-axis direction by a distance longer than the distance A1.

[0090] FIG. 7 is a flowchart showing an example of the arrangement change process by the control unit 101. An example of the arrangement change process is the example shown in FIG. 6.

[0091] When the first operation by the working units 104L and 104R is completed, the control unit 101 controls the driving unit 103 to retract the substrate placement unit 102 on which the substrate 3 is placed (step S11). That is, when the substrate 3 rotates, the driving unit 103 retracts the substrate placement unit 102 so that the substrate 3 does not collide with the working units 104L and 104R, in other words, so that there is no interference. Specifically, as shown in FIG. 6(b), the driving unit 103 moves the substrate placement unit 102 in the negative Y-axis direction by a distance A1 to place the substrate placement unit 102 at position M (i.e., the rotation position).

[0092] Next, the control unit 101 controls the changing unit 105 to retract the working units 104L and 104R (step S12). That is, when the substrate 3 rotates, the changing unit 105 retracts the working units 104L and 104R so that the substrate 3 does not collide with the working units 104L and 104R, in other words, so that there is no interference. Specifically, as shown in FIG. 6(b), the changing unit 105 moves the working units 104L and 104R away from each other along the X-axis direction to increase the distance between the working unit 104L and the working unit 104R. That is, the distance between the working unit 104L and the working unit 104R is increased from the above-described first distance.

[0093] Next, the control unit 101 controls the driving unit 103 to rotate the substrate placement unit 102 on which the substrate 3 is placed, for example, by 90 degrees (step S13). By this rotation, the long side of the substrate 3 is changed from the state along the X-axis direction to the state along the Y-axis direction, and conversely, the short side of the substrate 3 is changed from the state along the Y-axis direction to the state along the X-axis direction.

[0094] Next, the control unit 101 moves the substrate placement unit 102 on which the substrate 3 is placed by controlling the drive unit 103 (step S14). Specifically, as shown in FIG. 6(c), the drive unit 103 moves the substrate placement unit 102 by a distance D1 in the negative Y-axis direction to place the substrate placement unit 102 at position N (i.e., the short-side working position).

[0095] Then, the control unit 101 changes the distance between the working units 104L and 104R by controlling the changing unit 105 (step S15). Specifically, as shown in FIG. 6(c), the changing unit 105 moves the working units 104L and 104R closer to each other along the X-axis direction to narrow the distance between the working unit 104L and the working unit 104R. As a result, the distance between the working unit 104L and the working unit 104R is set to the above-mentioned second distance.

[0096] In the examples of FIGS. 6 and 7, the first side of the substrate 3 is the long side and the second side of the substrate 3 is the short side. Conversely, the first side may be the short side and the second side may be the long side. That is, after the first operation on the short side of the substrate 3, the second operation on the long side of the substrate 3 may be performed. Also, the process of step S11 in FIG. 7 may not be performed. In this case, even if the substrate placement unit 102 rotates while in the position L, the distance between the working unit 104L and the working unit 104R is widened more in step S12 so that the substrate 3 does not interfere with the working unit 104L and the working unit 104R. Also, the distance A1 that the substrate placement unit 102 moves in step S11 and the distance that the working unit 104L and the working unit 104R move in step S12 are set so that the substrate 3 does not interfere with the working unit 104L and the working unit 104R during the rotation in step S13. Also, in FIG. 7, after the process of step S14, the process of step S15 is performed. However, if the substrate 3 does not interfere with the working unit 104L and the working unit 104R, the process of step S14 may be performed after the process of step S15.

[0097] Also, in the examples of FIGS. 6 and 7, the substrate mounting portion 102 moves and rotates to position M, and then moves to position N. However, the substrate mounting portion 102 may move from position M to position N and rotate at position N. In this case, since the substrate mounting portion 102 and the substrate 3 rotate on the nearer side of the substrate working device 100, if there is a structure of the substrate working device 100 on that nearer side, the possibility of the substrate 3 interfering with that structure increases. Therefore, the substrate mounting portion 102 rotating at position M can suppress the possibility of interference of the substrate 3 more than rotating at position N.

[0098] FIG. 8 is a diagram schematically showing another example of the arrangement change process. Note that FIGS. 8(a) to 8(c) show the states of the working portion 104L, the working portion 104R, and the substrate 3 as viewed from the positive side in the Z-axis direction. Also, in the following example, the first side is the long side and the second side is the short side. Further, FIG. 8 shows an example of the arrangement change process in which the state of the substrate 3 can be changed from the first arrangement state to the second arrangement state without the working portion 104L and the working portion 104R retracting. Also, the one-dot chain line passing vertically through FIGS. 8(a) to 8(c) indicates the midpoint or the line of symmetry between the working portion 104L and the working portion 104R in the X-axis direction.

[0099] For example, the control unit 101 controls the drive unit 103 to move and rotate the substrate mounting portion 102 so that the substrate 3 is in the first arrangement state as shown in FIG. 8(a), similar to the example of FIG. 6(a). Further, the control unit 101 sets the interval between the working portion 104L and the working portion 104R to the first interval by controlling the change unit 105. Also, in FIG. 8 as well, similar to FIG. 6, the sticking head 223, the tape member tp, and the sticking backup stage 224 are not shown from the viewpoint of visibility, and among the working portion 104L and the working portion 104R, members at substantially the same height as the substrate 3 are shown.

[0100] When the substrate 3 is in such a first arrangement state, the control unit 101 causes the work units 104L and 104R to perform, for example, simultaneously, the attachment of the ACF to the two electrode portions 4 of the substrate 3 as a first operation. Further, the control unit 101 controls the drive unit 103 to repeatedly perform the first operation on the work units 104L and 104R while moving the substrate 3 along the X-axis direction. Thereby, the ACF is attached to all the electrode portions 4 on the long side of the substrate 3.

[0101] Next, the control unit 101 changes the state of the substrate 3 from the first arrangement state to the second arrangement state. At this time, as shown in FIG. 8(b), the control unit 101 causes the drive unit 103 to move the substrate placement unit 102 without expanding the interval between the work unit 104L and the work unit 104R by the changing unit 105. Specifically, the control unit 101 controls the drive unit 103 to move the substrate placement unit 102 to the position M in the Y-axis direction. For example, the control unit 101 moves the substrate placement unit 102 from the position L to the position M by moving the substrate placement unit 102 by a distance A2 in the negative Y-axis direction by controlling the drive unit 103. That is, the control unit 101 retracts the substrate placement unit 102. Then, the control unit 101 causes the changing unit 105 to narrow the interval between the work unit 104L and the work unit 104R. That is, the control unit 101 causes the changing unit 105 to narrow the interval between the work unit 104L and the work unit 104R and sets the interval to a second interval. For example, the changing unit 105 narrows the interval by moving each of the work unit 104L and the work unit 104R in a direction approaching each other. Thereafter, the control unit 101 causes the drive unit 103 to rotate the substrate 3. That is, the control unit 101 controls the drive unit 103 to rotate the substrate placement unit 102 by 90 degrees around the Z-axis. Thereby, the substrate 3 rotates. When the center of the substrate 3 is on the rotation axis of the substrate placement unit 102, the substrate 3 rotates about its center.

[0102] Here, for example, when the size of the substrate 3 placed on the substrate placement unit 102 is small, the substrate 3 can rotate without interfering with the working units 104L and 104R even if the retraction of the working units 104L and 104R is not performed, that is, even if the interval between them is not widened. Therefore, in the example of FIG. 8(b), the control unit 101 determines in advance whether interference occurs between the working units 104L and 104R and the substrate 3. In a specific example, the control unit 101 may determine whether interference occurs when the first operation on the long side of the substrate 3 is completed, or may determine whether interference occurs when the substrate placement unit 102 moves to the position M. Then, when the control unit 101 determines that no interference occurs, it causes the drive unit 103 to rotate the substrate placement unit 102 without causing the change unit 105 to retract the working units 104L and 104R.

[0103] Then, when the substrate 3 rotates as shown in FIG. 8(b), the control unit 101 controls the drive unit 103 in a state where the short side of the substrate 3 is aligned with the X-axis direction, as shown in FIG. 8(c), to move the substrate placement unit 102 to the position N in the Y-axis direction. For example, the control unit 101 moves the substrate placement unit 102 from the position M to the position N by moving the substrate placement unit 102 by a distance D2 in the negative Y-axis direction by controlling the drive unit 103. By this movement of the substrate 3, the substrate 3 is in the second arrangement state. At this time, the control unit 101 may move the substrate placement unit 102 in the X-axis direction so that the respective sticking heads 223 of the working units 104L and 104R face the electrode unit 4.

[0104] Also, in the example of FIG. 8, as shown in FIG. 8(b), the drive unit 103 moves the substrate placement unit 102 in the negative Y-axis direction and rotates the substrate placement unit 102. However, before rotating the substrate placement unit 102, the substrate placement unit 102 may be moved in the X-axis direction. For example, the drive unit 103 may move the substrate placement unit 102 in the X-axis direction so that the position of the rotation axis of the substrate placement unit 102 in the X-axis direction coincides with the position of the midpoint between the working unit 104L and the working unit 104R. Thereby, the interference between the working unit 104L and the working unit 104R and the rotating substrate 3 can be effectively suppressed.

[0105] Also, in the example of FIG. 8, the rotation center of the substrate placement unit 102 and the center of the substrate 3 coincide, but they do not have to coincide. When the rotation center of the substrate placement unit 102 and the center of the substrate 3 do not coincide, the substrate 3 rotates around the Z axis with a point at a position different from the center of the substrate 3 as the center. Therefore, in this case, compared with the case where the rotation center and the center of the substrate 3 coincide, the rotation radius of the substrate 3 becomes longer. Therefore, it is necessary to move the substrate placement unit 102 in the negative Y-axis direction by a distance longer than the distance A2.

[0106] FIG. 9 is a flowchart showing another example of the arrangement change process by the control unit 101. Note that another example of the arrangement change process is the example shown in FIG. 8.

[0107] When the first operation by the working unit 104L and the working unit 104R is completed, the control unit 101 controls the drive unit 103 to retract the substrate placement unit 102 on which the substrate 3 is placed (step S21). That is, the drive unit 103 retracts the substrate placement unit 102 so that the substrate 3 does not collide with the working unit 104L and the working unit 104R when the substrate 3 rotates, in other words, so that there is no interference. Specifically, as shown in FIG. 8(b), the drive unit 103 moves the substrate placement unit 102 in the negative Y-axis direction by a distance A2 to place the substrate placement unit 102 at the position M (i.e., the rotation position).

[0108] Next, the control unit 101 controls the changing unit 105 to change the distance between the working units 104L and 104R (step S22). Specifically, as shown in FIG. 8(b), the changing unit 105 moves the working units 104L and 104R closer to each other along the X-axis direction, thereby narrowing the distance between the working unit 104L and the working unit 104R. As a result, the distance between the working unit 104L and the working unit 104R is set to the above-described second distance.

[0109] Next, the control unit 101 controls the driving unit 103 to rotate the substrate mounting unit 102 on which the substrate 3 is placed, for example, by 90 degrees (step S23). By this rotation, the long side of the substrate 3 is changed from the state along the X-axis direction to the state along the Y-axis direction, and conversely, the short side of the substrate 3 is changed from the state along the Y-axis direction to the state along the X-axis direction.

[0110] Then, the control unit 101 controls the driving unit 103 to move the substrate mounting unit 102 on which the substrate 3 is placed (step S24). Specifically, as shown in FIG. 8(c), the driving unit 103 moves the substrate mounting unit 102 by a distance D2 in the negative Y-axis direction, thereby arranging the substrate mounting unit 102 at the position N (i.e., the short-side working position).

[0111] In the examples of FIGS. 8 and 9, the first side of the substrate 3 is the long side and the second side of the substrate 3 is the short side. Conversely, the first side may be the short side and the second side may be the long side. That is, after the first operation on the short side of the substrate 3 is performed, the second operation on the long side of the substrate 3 may be performed. Also, the process of step S21 in FIG. 9 may not be performed. For example, if the control unit 101 determines that the substrate 3 will not interfere with the working units 104L and 104R even when the substrate placement unit 102 rotates while in the position L, the process of step S21 may not be performed. Also, the distance A2 by which the substrate placement unit 102 moves in step S21 is set so that the substrate 3 does not interfere with the working units 104L and 104R during the rotation in step S23. Also, the order of the three processes of steps S22, S23, and S24 shown in FIG. 9 is not limited to this, and any order may be used as long as the substrate 3 does not interfere with the working units 104L and 104R.

[0112] Also, in the examples of FIGS. 8 and 9, the substrate placement unit 102 moves to the position M and rotates, and then moves to the position N. However, the substrate placement unit 102 may move through the position M to the position N and rotate at the position N.

[0113] FIG. 10 is a flowchart showing an example of the processing operation of the substrate working apparatus 100.

[0114] First, the control unit 101 of the substrate working apparatus 100 causes the working units 104L and 104R to execute the first operation (step S1). That is, the control unit 101 previously moves and rotates the substrate placement unit 102 to the driving unit 103 so that the substrate 3 is in the first arrangement state, and further controls the changing unit 105 to set the interval between the working unit 104L and the working unit 104R to the first interval. Thereafter, the control unit 101 causes the driving unit 103 to move the substrate placement unit 102 in the X-axis direction while causing the working units 104L and 104R to attach the ACF to the long side of the substrate 3.

[0115] Next, when the substrate mounting unit 102 is at position M, the control unit 101 determines whether interference occurs between the substrate 3 due to the rotation of the substrate 3 and the working units 104L and 104R (step S2). Here, when the control unit 101 determines that interference occurs (Yes in step S2), it executes the arrangement change process in the first operation mode (step S10). The arrangement change process in the first operation mode is the arrangement change process shown in FIG. 6, which is a process of retracting the working units 104L and 104R and changing the state of the substrate 3 from the first arrangement state to the second arrangement state. Note that the flowchart in FIG. 7 shows the details of the process in step S10.

[0116] On the other hand, when the control unit 101 determines that no interference occurs (No in step S2), it executes the arrangement change process in the second operation mode (step S20). The arrangement change process in the second operation mode is the arrangement change process shown in FIG. 8, which is a process of changing the state of the substrate 3 from the first arrangement state to the second arrangement state without retracting the working units 104L and 104R. Note that the flowchart in FIG. 9 shows the details of the process in step S20.

[0117] Then, after the process in step S10 or S20 is performed, the control unit 101 causes the working units 104L and 104R to execute the second operation. That is, the control unit 101 causes the driving unit 103 to move the substrate mounting unit 102 in the X-axis direction, and causes the working units 104L and 104R to attach the ACF to the short side of the substrate 3.

[0118] As described above, in this embodiment, the control unit 101 switches the operation mode of the arrangement change process between a first operation mode and a second operation mode. In the first operation mode, the control unit 101 causes the changing unit 105 to widen the interval between the working unit 104L and the working unit 104R, and then rotates the substrate placement unit 102 on which the substrate 3 is placed by the driving unit 103. In the second operation mode, the control unit 101 rotates the substrate placement unit 102 on which the substrate 3 is placed by the driving unit 103 without causing the changing unit 105 to widen the interval between the working unit 104L and the working unit 104R. Thereby, when the working unit 104L and the working unit 104R do not interfere with the rotating substrate 3 without widening the interval between the working unit 104L and the working unit 104R, the arrangement change process can be performed in the second operation mode, and the time required for the arrangement change process can be shortened.

[0119] Here, the control unit 101 may switch the above-described operation mode based on the substrate information regarding the substrate 3. Thereby, the switching of the operation mode can be appropriately performed.

[0120] Further, the substrate information indicates, for example, the dimensions of the substrate 3 and the position of the substrate 3 on the placement surface of the substrate placement unit 102. Note that the substrate information may further indicate the shape of the substrate 3. Also, the position of the substrate 3 may indicate the relative position of the substrate 3 with respect to the substrate placement unit 102. Based on the dimensions of the substrate 3 and the position of the substrate 3 indicated in the substrate information, when the arrangement change process is performed in the second operation mode, the control unit 101 determines whether at least one of the working units 104L and 104R interferes with the rotating substrate 3. Note that the control unit 101 specifies the position of the substrate placement unit 102 and the respective positions of the working units 104L and 104R, and also based on those positions, determines whether at least one of the working units 104L and 104R interferes with the rotating substrate 3. The position of the substrate placement unit 102 is, for example, position M. Then, when it is determined that there is interference, the control unit 101 switches the operation mode to the first operation mode, and when it is determined that there is no interference, the control unit 101 switches the operation mode to the second operation mode. Thereby, since the dimensions of the substrate 3 and the position of the substrate 3 are used to determine whether at least one of the working units 104L and 104R interferes with the rotating substrate 3, the determination can be made accurately. Therefore, the switching of the operation mode can be performed more appropriately. That is, it is possible to achieve both miniaturization of the substrate working apparatus 100 and shortening of the time required for the arrangement change process.

[0121] Also, the substrate working method in the present embodiment is a substrate working method performed by a substrate working apparatus 100 including a working unit 104L, a working unit 104R, and a substrate placement unit 102, and includes a first working step, an arrangement change step, and a second working step. In the first working step, when the substrate 3 having a first side and a second side intersecting the first side and placed on the placement surface of the substrate placement unit 102 is in the first arrangement state, the working unit 104L and the working unit 104R perform a first operation on the first side. In the arrangement change step, after the first working step, the state of the substrate 3 is switched from the first arrangement state to the second arrangement state. In the second working step, when the substrate 3 is in the second arrangement state, the working unit 104L and the working unit 104R perform a second operation on the second side. Further, in the arrangement change step, after widening the distance between the working unit 104L and the working unit 104R, the substrate placement unit 102 on which the substrate 3 is placed is rotated about a rotation axis extending in the normal direction of the placement surface, thereby switching the state of the substrate 3 from the first arrangement state to the second arrangement state. In such a substrate working method, the same effects as those of the substrate working apparatus 100 can be achieved.

[0122] (Modification example) In the above embodiment, the substrate working apparatus 100 includes one substrate placement unit 102 and one drive unit 103 each. In this modification example, the substrate working apparatus 100 includes two substrate placement units 102 and two drive units 103 each. That is, the substrate working apparatus 100 in this modification example includes a substrate placement unit 102 and a drive unit 103 for the working unit 104L, and a substrate placement unit 102 and a drive unit 103 for the working unit 104R.

[0123] FIG. 11 is a diagram schematically showing an example of the arrangement change process in this modification example. Note that FIGS. 11(a) to 11(c) show the states of the working unit 104L, the working unit 104R, and the substrate 3 as viewed from the positive side in the Z-axis direction. Also, in the following example, the first side is the long side and the second side is the short side. Also, the dashed-dotted line passing vertically through FIGS. 11(a) to 11(c) indicates the midpoint or the line of symmetry between the working unit 104L and the working unit 104R in the X-axis direction.

[0124] For example, as shown in FIG. 11(a), substrates 3 are placed on each of the two substrate placement units 102, and these substrates 3 are set in the first arrangement state. That is, the control unit 101 controls the two drive units 103 to move and rotate the two substrate placement units 102 so that the two substrates 3 are in the first arrangement state. When the two substrates 3 are in the first arrangement state, the two substrate placement units 102 are at the position L in the Y-axis direction. And when the two substrates 3 are in the first arrangement state, the long sides of these substrates 3 are arranged on the positive side in the Y-axis direction and along the X-axis direction. Further, the long side of the substrate 3 worked on by the working unit 104L is arranged between the sticking head 223 and the tape member tp included in the working unit 104L and the sticking backup stage 224. Similarly, the long side of the substrate 3 worked on by the working unit 104R is arranged between the sticking head 223 and the tape member tp included in the working unit 104R and the sticking backup stage 224. Note that in FIG. 11, as in FIG. 6 and the like, the sticking head 223, the tape member tp, and the sticking backup stage 224 are not shown from the viewpoint of visibility, and among the working unit 104L and the working unit 104R, members at substantially the same height as the substrate 3 are shown.

[0125] Furthermore, the control unit 101 controls the changing unit 105 to adjust the positions of the working unit 104L and the working unit 104R in the X-axis direction so that the respective sticking heads 223 of the working unit 104L and the working unit 104R face the electrode portions 4 of the substrate 3. Alternatively, the control unit 101 controls the two drive units 103 to adjust the positions of the two substrates 3 in the X-axis direction so that the respective sticking heads 223 of the working unit 104L and the working unit 104R face the electrode portions 4 of the substrate 3.

[0126] When the two substrates 3 are in such a first arrangement state, the control unit 101 causes the work units 104L and 104R to execute, for example, simultaneously, the attachment of the ACF to the electrode portions 4 of each of the two substrates 3 as a first operation. Further, the control unit 101 controls the two drive units 103 to repeatedly execute the first operation on the work units 104L and 104R while moving the two substrates 3 along the X-axis direction. Thereby, the ACF is attached to all the electrode portions 4 on the long sides of the two substrates 3.

[0127] Next, the control unit 101 changes the state of the two substrates 3 from the first arrangement state to the second arrangement state. At this time, the control unit 101 controls the two drive units 103 to move the two substrate mounting portions 102 to the position M in the Y-axis direction and rotate them by 90 degrees about the Z-axis. For example, the control unit 101 controls the two drive units 103 to move the two substrate mounting portions 102 from the position L to the position M by moving the two substrate mounting portions 102 in the negative Y-axis direction. Then, the control unit 101 causes the two drive units 103 to execute the rotation of the two substrate mounting portions 102. Thereby, the two substrates 3 rotate. When the center of each of the two substrates 3 is on the rotation axis of the substrate mounting portion 102 on which the substrate 3 is mounted, the substrate 3 rotates about its center.

[0128] When the two substrates 3 rotate as shown in FIG. 11(b), the control unit 101 controls the two drive units 103 in a state where the short sides of the two substrates 3 are along the X-axis direction, as shown in FIG. 11(c), to move the two substrate placement units 102 to the position N in the Y-axis direction. For example, the control unit 101 moves the two substrate placement units 102 from the position M to the position N by controlling the two drive units 103 to move the two substrate placement units 102 in the negative Y-axis direction. Due to the movement of these two substrates 3, the two substrates 3 are in the second arrangement state. When the two substrates 3 are in the second arrangement state, the short sides of the two substrates 3 are on the positive side of the Y-axis direction and are arranged along the X-axis direction, and are further arranged between the sticking head 223 and the tape member tp and the sticking backup stage 224.

[0129] Furthermore, the control unit 101 controls the changing unit 105 to adjust the positions of the working units 104L and 104R in the X-axis direction so that the sticking heads 223 of the working units 104L and 104R face the electrode portions 4 on the short sides of the substrate 3. Alternatively, the control unit 101 controls the two drive units 103 to adjust the positions of the two substrates 3 in the X-axis direction so that the sticking heads 223 of the working units 104L and 104R face the electrode portions 4 on the short sides of the substrate 3.

[0130] When the two substrates 3 are in such a second arrangement state, the control unit 101 causes the working units 104L and 104R to perform, for example, simultaneously, the attachment of the ACF to the respective electrode portions 4 of the two substrates 3 as a second operation. Furthermore, the control unit 101 controls the drive unit 103 to repeatedly perform the second operation on the working units 104L and 104R while moving the two substrates 3 along the X-axis direction. Thereby, the ACF is attached to all the electrode portions 4 on the short sides of the two substrates 3.

[0131] The substrate processing apparatus and the substrate processing method according to one or more aspects have been described based on the above embodiments and their modifications. However, the present disclosure is not limited to these embodiments and modifications. Without departing from the spirit of the present disclosure, various modifications conceived by those skilled in the art applied to the above embodiments and their modifications, or forms constructed by combining the components in the above embodiments and their modifications may also be included within the scope of the present disclosure.

[0132] For example, in the above embodiments and their modifications, the substrate 3 is a liquid crystal panel, and the component 5 is temporarily bonded and finally bonded to the liquid crystal panel. However, the substrate 3 may be a substrate other than the liquid crystal panel.

[0133] Also, in the above embodiments and their modifications, the substrate processing apparatus 100 is the bonding unit 20, but may be the temporary bonding unit 30 or the final bonding unit 40. When the substrate processing apparatus 100 is the temporary bonding unit 30, the first operation and the second operation are operations of temporarily bonding the component 5 to the substrate 3. Also, when the substrate processing apparatus 100 is the final bonding unit 40, the first operation and the second operation are operations of finally bonding the component 5 to the substrate 3.

[0134] Also, in the above embodiments and their modifications, all or part of the components such as the control unit 101 may be configured by dedicated hardware, or may be realized by executing a software program suitable for the components. The control unit 101 may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit causes the substrate processing apparatus 100 to execute each step shown in FIGS. 7, 9, and 10.

[0135] In addition, the control unit 101 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated on one chip or on multiple chips. Here, it is called an IC or LSI, but the name may change depending on the degree of integration, and it may be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). Also, an FPGA (Field Programmable Gate Array) programmed after the manufacture of the LSI can be used for the same purpose.

Industrial Applicability

[0136] The present disclosure can be applied to a substrate working device included in, for example, a component mounting line for producing a liquid crystal display.

Explanation of Signs

[0137] 1 Component mounting line 3 Substrate 4 Electrode part 5 Component 10 Substrate loading part 11, 23, 37, 49, 51 Stage 20 Adhesion part 21, 31, 41 Substrate moving mechanism 30 Temporary crimping part 32 Component mounting mechanism 33 Component supply part 33a Supply reel 33b Punching part 33c Movable stage 33d Rail 34 Crimping tool 35 Component transfer part 36 Backup part 40 Final crimping part 50 Substrate unloading unit 60 Conveyor unit 100 Substrate processing device 101 Control unit 102 Substrate placement unit 103 Driving unit 104L, 104R Working units 105 Changing unit 211 X-axis table 212 Y-axis table 213 Z-axis table 220L, 220R Adhesive mechanism units 221 Tape supply reel 223 Adhesive head 224 Adhesive backup stage 225 Tape cutting unit 228 X-axis rail mechanism 229 Adhesive base tp Tape member

Claims

1. It has a placement surface on which a substrate having a first side and a second side intersecting the first side is placed, and a substrate placement unit rotatable about a rotation axis extending in the normal direction of the placement surface, a drive unit for rotating the substrate placement unit, two working units for performing a first operation, which is an operation performed on the first side when the substrate is in a first placement state, and a second operation, which is an operation performed on the second side when the substrate is in a second placement state, a changing unit for changing the interval between the two working units, and a control unit for controlling the drive unit and the changing unit, wherein the control unit executes an arrangement change process for switching the state of the substrate from the first arrangement state to the second arrangement state after the first operation and before the second operation, and in the arrangement change process, after expanding the interval between the two working units by the changing unit, the substrate placement unit on which the substrate is placed is rotated by the drive unit. A substrate working device.

2. The control unit switches the operation mode of the arrangement change process between a first operation mode and a second operation mode, and in the first operation mode, after expanding the interval between the two working units by the changing unit, the substrate placement unit on which the substrate is placed is rotated by the drive unit, and in the second operation mode, the substrate placement unit on which the substrate is placed is rotated by the drive unit without expanding the interval between the two working units by the changing unit. The substrate working device according to Claim 1.

3. The control unit switches the operation mode based on substrate information regarding the substrate. The substrate working device according to Claim 2.

4. The substrate information indicates the dimensions of the substrate and the position of the substrate on the placement surface, and the control unit determines whether or not there is interference between at least one of the two working units and the rotating substrate when the arrangement change process is performed in the second operation mode based on the dimensions and the position of the substrate indicated in the substrate information, and when it is determined that there is interference, the operation mode is switched to the first operation mode, and when it is determined that there is no interference, the operation mode is switched to the second operation mode. The substrate working device according to Claim 3.

5. The changing unit changes the interval by moving each of the two working units. The substrate working device according to any one of Claims 1 to 4.

6. Each of the first operation and the second operation is an operation of attaching an ACF (Anisotropic Conductive Film) to the substrate. The substrate working apparatus according to claim 1.

7. A substrate working method performed by a substrate working apparatus including two working units and a substrate placing unit, A substrate having a first side and a second side intersecting the first side, and when the substrate placed on the placement surface of the substrate placing unit is in a first arrangement state, a first working step in which the two working units perform a first operation on the first side; An arrangement changing step of changing the state of the substrate from the first arrangement state to a second arrangement state after the first working step; A second working step in which the two working units perform a second operation on the second side when the substrate is in the second arrangement state, In the arrangement changing step, After widening the distance between the two working units, the substrate placing unit on which the substrate is placed is rotated about a rotation axis extending in the normal direction of the placement surface, thereby changing the state of the substrate from the first arrangement state to the second arrangement state. Substrate working method.

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