Processing device

Abstract

To provide a processing device that can appropriately process an object.SOLUTION: A processing device, which processes an object by irradiating the object with processing light from a processing light source, comprises: a synthetic optical system that synthesizes the processing light from the processing light source with measurement light including pulse light; an irradiation optical system that irradiates the object with the processing light and the measurement light synthesized through the synthetic optical system; and an irradiation position changing optical system, to which the processing light and the measurement light synthesized through the synthetic optical system are made to incident, which changes an irradiation position of the processing light on the object and an irradiation position of the measurement light on the object.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to the technical field of processing apparatuses capable of processing an object with processing light.

Background Art

[0002] As a processing apparatus capable of processing an object, Patent Document 1 describes a processing apparatus that irradiates the surface of an object with processing light to form a structure. In this type of processing apparatus, it is required to appropriately process the object.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] According to a first aspect, there is provided a processing apparatus that processes an object by irradiating the object with processing light from a processing light source, the processing apparatus including: a combining optical system that combines the processing light from the processing light source and measurement light including pulsed light; an irradiation optical system that irradiates the object with the processing light and the measurement light via the combining optical system; and an irradiation position changing optical system that receives the processing light and the measurement light via the combining optical system and changes an irradiation position of the processing light on the object and an irradiation position of the measurement light on the object.

Brief Description of the Drawings

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Embodiments for Carrying Out the Invention

[0006] Hereinafter, embodiments of a processing apparatus, a processing member, a robot system, and a measuring apparatus will be described with reference to the drawings. Hereinafter, embodiments of the processing apparatus, the processing member, the robot system, and the measuring apparatus will be described using a processing system SYS that processes a workpiece W using processing light EL. However, the present invention is not limited to the embodiments described below.

[0007] Also, in the following description, the positional relationship of various components constituting the processing system SYS will be described using an XYZ orthogonal coordinate system defined by an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. In the following description, for convenience of explanation, the X-axis direction and the Y-axis direction are each a horizontal direction (that is, a predetermined direction in a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane, and substantially an up-and-down direction). Also, the rotational directions (in other words, the inclination directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Also, the XY plane may be the horizontal direction.

[0008] (1) Machining System SYSa of the First Embodiment First, a processing system SYS of the first embodiment (hereinafter, the processing system SYS of the first embodiment is referred to as "processing system SYSa") will be described.

[0009] (1-1) Structure of Machining System SYSa First, with reference to FIGS. 1 and 2, the structure of the processing system SYSa of the first embodiment will be described. FIG. 1 is a cross-sectional view schematically showing the structure of the processing system SYSa of the first embodiment. FIG. 2 is a system configuration diagram showing the system configuration of the processing system SYSa of the first embodiment.

[0010] As shown in FIGS. 1 and 2, the processing system SYSa includes a processing device 1, a stage device 3, and a control device 5. The processing device 1 and the stage device 3 are housed in a housing 4. However, the processing device 1 and the stage device 3 may not be housed in the housing 4. That is, the processing system SYSa may not include the housing 4 that houses the processing device 1 and the stage device 3.

[0011] The processing device 1 can process the workpiece W under the control of the control device 5. The workpiece W may be, for example, metal, an alloy (e.g., duralumin, etc.), a semiconductor (e.g., silicon), a resin (e.g., CFRP (Carbon Fiber Reinforced Plastic), a paint layer (as an example, a paint applied to a substrate), etc.), glass, or an object made of any other arbitrary material.

[0012] The processing device 1 irradiates the workpiece W with processing light EL in order to process the workpiece W. The processing light EL may be any type of light as long as the workpiece W can be processed by irradiating the workpiece W with the processing light EL. In the first embodiment, an example in which the processing light EL is laser light will be used for the explanation, but the processing light EL may be a type of light different from laser light. Further, the wavelength of the processing light EL may be any wavelength as long as the workpiece W can be processed by irradiating the workpiece W with the processing light EL. For example, the processing light EL may be visible light or invisible light (e.g., at least one of infrared light and ultraviolet light, etc.). The processing light EL includes pulsed light, but may not include pulsed light. In other words, the processing light EL may be continuous light.

[0013] The processing apparatus 1 may irradiate the workpiece W with the processing light EL to perform a removal process (typically, cutting or grinding) for removing a part of the workpiece W. When performing the removal process, the processing apparatus 1 may form a riblet structure on the workpiece W. The riblet structure is a structure capable of reducing the resistance of the fluid on the surface of the workpiece W (in particular, frictional resistance, turbulent frictional resistance). The riblet structure may include, for example, a structure in which grooves extending along a first direction (e.g., the Y-axis direction) along the surface of the workpiece W are arranged in a plurality along a second direction (e.g., the X-axis direction) along the surface of the workpiece W and intersecting the first direction.

[0014] In addition to or instead of the removal process, the processing apparatus 1 may irradiate the workpiece W with the processing light EL to perform an addition process for adding a new structure to the workpiece W. In this case, the processing apparatus 1 may form the above-described riblet structure on the surface of the workpiece W by performing the addition process. In addition to or instead of at least one of the removal process and the addition process, the processing apparatus 1 may irradiate the workpiece W with the processing light EL to perform a marking process for forming a desired mark on the surface of the workpiece W.

[0015] The processing apparatus 1 can further measure the workpiece W under the control of the control device 5. The processing apparatus 1 irradiates the workpiece W with the measurement light ML to measure the workpiece W. The measurement light ML may be any type of light as long as the workpiece W can be measured by irradiating the workpiece W with the measurement light ML. In the first embodiment, an example in which the measurement light ML is a laser light will be used for the description, but the measurement light ML may be a type of light different from the laser light. Further, the wavelength of the measurement light ML may be any wavelength as long as the workpiece W can be measured by irradiating the workpiece W with the measurement light ML. For example, the measurement light ML may be visible light or invisible light (e.g., at least one of infrared light and ultraviolet light, etc.). The measurement light ML includes pulsed light.

[0016] The wavelength of the measurement light ML may be different from the wavelength of the processing light EL. For example, the wavelength of the measurement light ML may be shorter than the wavelength of the processing light EL. As an example, light in the wavelength band of 266 nm or 355 nm may be used as the measurement light ML, and light in the wavelength band of 532 nm, 1 μm, or 10 μm may be used as the processing light EL. In this case, the spot diameter of the measurement light ML on the workpiece W becomes smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML becomes higher than the processing resolution by the processing light EL. However, the wavelength of the measurement light ML may not be shorter than the wavelength of the processing light EL. The wavelength of the measurement light ML may be the same as the wavelength of the processing light EL.

[0017] The processing apparatus 1 may be capable of measuring the state of the workpiece W. The state of the workpiece W may include the position of the workpiece W. The position of the workpiece W may include the position of the surface of the workpiece W. The position of the surface of the workpiece W may include the position in at least one of the X-axis direction, Y-axis direction, and Z-axis direction of each surface portion obtained by subdividing the surface of the workpiece W. The state of the workpiece W may include the shape of the workpiece W (for example, a three-dimensional shape). The shape of the workpiece W may include the shape of the surface of the workpiece W. The shape of the surface of the workpiece W may include, in addition to or instead of the position of the surface of the workpiece W described above, the orientation of each surface portion obtained by subdividing the surface of the workpiece W (for example, the orientation of the normal line of each surface portion, which is substantially equivalent to the inclination amount of each surface portion with respect to at least one of the X-axis, Y-axis, and Z-axis). The state of the workpiece W may include the size of the workpiece W (for example, the size in at least one of the X-axis direction, Y-axis direction, and Z-axis direction).

[0018] In order to machine and measure the workpiece W, the machining apparatus 1 includes a machining head 11 that emits machining light EL and measurement light ML to the workpiece W, respectively, and a head drive system 12 that moves the machining head 11. The machining head 11 means any member capable of emitting machining light EL and measurement light ML to the workpiece W, respectively. Therefore, although the machining head 11 includes the word "head", it does not necessarily have to mean a member attached to the tip of some member. For this reason, the machining head 11 may be referred to as a machining member. Further, the machining head 11 includes a machining light source 111, a machining optical system 112, a measurement light source 113, a measurement optical system 114, a combining optical system 115, and a common optical system 116. Note that the structures of the machining head 11 and the head drive system 12 will be described in detail later.

[0019] The head drive system 12 moves the processing head 11 along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. When the processing head 11 moves, the positional relationship between the stage 32 (and further, the workpiece W placed on the stage 32) and the processing head 11 changes. That is, when the stage 32 moves, the relative positions of the stage 32 and the workpiece W and the processing head 11 change. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32 and the workpiece W and the processing head 11. Further, when the positional relationship between the stage 32 and the workpiece W and the processing head 11 changes, the positional relationship between the stage 32 and the workpiece W and each optical system (that is, at least one of the processing optical system 112, measurement optical system 114, synthesis optical system 115, and common optical system 116) provided in the processing head 11 changes. Therefore, moving the processing head 11 is equivalent to changing the positional relationship between the stage 32 and the workpiece W and each optical system provided in the processing head 11. Further, when the positional relationship between the stage 32 and the workpiece W and the processing head 11 changes, the positional relationship between the stage 32 and the workpiece W and the housing 117 of the processing head 11 changes. Therefore, moving the processing head 11 is equivalent to changing the positional relationship between the stage 32 and the workpiece W and the housing 117 of the processing head 11. Further, when the positional relationship between the stage 32 and the workpiece W and the processing head 11 changes, the irradiation positions of the processing light EL and the measurement light ML on the workpiece W change. Therefore, moving the processing head 11 is equivalent to changing the irradiation positions of the processing light EL and the measurement light ML on the workpiece W.

[0020] The stage device 3 includes a surface plate 31 and a stage 32. The surface plate 31 is disposed on the bottom surface of the housing 4 (or on a support surface such as the floor surface on which the housing 4 is placed). The stage 32 is disposed on the surface plate 31. An anti-vibration device (not shown) for reducing the transmission of vibrations of the surface plate 31 to the stage 32 may be installed between the bottom surface of the housing 4 or a support surface such as the floor surface on which the housing 4 is placed and the surface plate 31. Further, a support frame (not shown) for supporting the processing device 1 may be disposed on the surface plate 31.

[0021] The workpiece W is placed on the stage 32. The stage 32 may hold the placed workpiece W. For example, the stage 32 may hold the workpiece W by vacuum adsorption and / or electrostatic adsorption. Alternatively, the stage 32 may not hold the placed workpiece W.

[0022] Under the control of the control device 5, the stage 32 can move on the surface plate 31 while the workpiece W is placed thereon. The stage 32 is movable relative to at least one of the surface plate 31 and the processing device 1. The stage 32 is movable along each of the X-axis direction and the Y-axis direction. In this case, the stage 32 is movable along a stage running surface (moving surface) parallel to the XY plane. The stage 32 may further be movable along at least one of the Z-axis direction, the θX direction, the θY direction, and the θZ direction. To move the stage 32, the stage device 3 includes a stage drive system 33. The stage drive system 33 uses, for example, an arbitrary motor (e.g., a linear motor, etc.) to move the stage 32. Further, the stage device 3 may include a stage position measuring device for measuring the position of the stage 32. The stage position measuring device may include, for example, at least one of an encoder and a laser interferometer.

[0023] When the stage 32 moves, the positional relationship between the stage 32 (and further, the workpiece W placed on the stage 32) and the processing head 11 changes. That is, when the stage 32 moves, the relative positions of the processing head 11, the stage 32, and the workpiece W change. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32 and the workpiece W and the processing head 11. Further, when the positional relationship between the stage 32 and the workpiece W and the processing head 11 changes, the positional relationship between the stage 32 and the workpiece W and the housing 117 of the processing head 11 changes. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32 and the workpiece W and the housing 117 of the processing head 11. Further, when the positional relationship between the stage 32 and the workpiece W and the processing head 11 changes, the positional relationship between the stage 32 and the workpiece W and each optical system provided in the processing head 11 changes. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32 and the workpiece W and each optical system provided in the processing head 11. Further, when the positional relationship between the stage 32 and the workpiece W and the processing head 11 changes, the irradiation positions of the processing light EL and the measurement light ML on the workpiece W change. Therefore, moving the stage 32 is equivalent to changing the irradiation positions of the processing light EL and the measurement light ML on the workpiece W respectively.

[0024] The control device 5 controls the operation of the processing system SYSa. For example, the control device 5 sets the processing conditions of the workpiece W and controls the processing device 1 and the stage device 3 so that the workpiece W is processed according to the set processing conditions. For example, the control device 5 sets the measurement conditions of the workpiece W and controls the processing device 1 and the stage device 3 so that the workpiece W is measured according to the set measurement conditions.

[0025] The control device 5 may include, for example, a CPU (Central Processing Unit) (or, in addition to or instead of the CPU, a GPU (Graphics Processing Unit)) and a memory. The control device 5 functions as a device that controls the operation of the processing system SYSa by the CPU executing a computer program. This computer program is a computer program for causing the control device 5 (e.g., the CPU) to perform the operations described later that the control device 5 should perform (i.e., execute). That is, this computer program is a computer program for causing the control device 5 to function so as to cause the processing system SYSa to perform the operations described later. The computer program executed by the CPU may be recorded in the memory (i.e., the recording medium) provided in the control device 5, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built in the control device 5 or externally attachable to the control device 5. Alternatively, the CPU may download the computer program to be executed from a device external to the control device 5 via a network interface.

[0026] The control device 5 may not be provided inside the processing system SYSa. For example, it may be provided outside the processing system SYSa as a server or the like. In this case, the control device 5 and the processing system SYSa may be connected by a wired and / or wireless network (or a data bus and / or communication line). As the wired network, for example, a network using a serial bus interface typified by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) typified by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network compliant with IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) can be given. As the wireless network, a network using infrared rays may be used. As the wireless network, a network using optical communication may be used. In this case, the control device 5 and the processing system SYSa may be configured to be able to transmit and receive various types of information via the network. Further, the control device 5 may be able to transmit information such as commands and control parameters to the processing system SYSa via the network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 5 via the above network. Alternatively, a first control device that performs a part of the processing performed by the control device 5 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 5 may be provided outside the processing system SYSa.

[0027] As the recording medium for recording the computer program executed by the CPU, at least one of optical discs such as CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing programs may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which the computer program is implemented in a state executable in at least one of the forms of software and firmware). Further, each process and function included in the computer program may be realized by a logical processing block realized in the control device 5 (that is, a computer) by executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 5, or may be realized in a form in which a logical processing block and a partial hardware module realizing some elements of the hardware are mixed.

[0028] (1-2) Structure of Machining Head 11 Subsequently, with reference to FIG. 3, an example of the structure of the processing head 11 will be described. FIG. 3 is a cross-sectional view showing an example of the structure of the processing head 11.

[0029] As shown in FIG. 3, the processing head 11 includes a processing light source 111, a processing optical system 112, a measurement light source 113, a measurement optical system 114, a combining optical system 115, and a common optical system 116. The processing light source 111, the processing optical system 112, the measurement light source 113, the measurement optical system 114, the combining optical system 115, and the common optical system 116 are housed in the housing 117. However, at least one of the processing light source 111, the processing optical system 112, the measurement light source 113, the measurement optical system 114, the combining optical system 115, and the common optical system 116 may not be housed in the housing 117.

[0030] The processing light source 111 can generate processing light EL. When the processing light EL is laser light, the processing light source 111 may include, for example, a laser diode. Further, the processing light source 111 may be a light source capable of pulsed oscillation. In this case, the processing light source 111 can generate pulsed light (for example, pulsed light with a emission time of picoseconds or less) as the processing light EL. The processing light source 111 emits the generated processing light EL toward the processing optical system 112.

[0031] The processing optical system 112 is an optical system into which the processing light EL emitted from the processing light source 111 is incident. The processing optical system 112 is an optical system that emits the processing light EL incident on the processing optical system 112 toward the combining optical system 115. That is, the processing optical system 112 is an optical system that guides the processing light EL emitted from the processing light source 111 to the combining optical system 115. The processing light EL emitted by the processing optical system 112 is irradiated onto the workpiece W via the combining optical system 115 and the common optical system 116. Therefore, it can also be said that the processing optical system 112 is an optical system that emits the processing light EL toward the workpiece W via the combining optical system 115 and the common optical system 116.

[0032] The processing optical system 112 includes a position adjustment optical system 1121 and an angle adjustment optical system 1122. The position adjustment optical system 1121 can adjust the emission position of the processing light EL from the processing optical system 112. The position adjustment optical system 1121 includes, for example, a parallel flat plate that can be tilted with respect to the traveling direction of the processing light EL, and changes the position of the processing light by changing the tilt angle of the parallel flat plate. In the example of FIG. 3, the emission position of the processing light EL can be set to any position within the YZ plane by a plurality of parallel flat plates with different tilt directions. When the emission position of the processing light EL from the processing optical system 112 changes, the incident angle of the processing light EL (for example, the incident angle with respect to the workpiece W) changes. The angle adjustment optical system 1122 can adjust the emission angle of the processing light EL from the processing optical system 112. The angle adjustment optical system 1122 includes, for example, a mirror that can be tilted with respect to the traveling direction of the processing light EL, and changes the emission angle of the processing light by changing the tilt angle of this mirror. In the example of FIG. 3, the emission angle of the processing light EL can be set to any direction around the θX axis and the θY axis by a plurality of mirrors with different tilt directions. When the emission angle of the processing light EL from the processing optical system 112 changes, the irradiation position of the processing light EL (for example, the irradiation position on the workpiece W) changes. However, the processing optical system 112 may not include at least one of the position adjustment optical system 1121 and the angle adjustment optical system 1122. In addition to or instead of at least one of the position adjustment optical system 1121 and the angle adjustment optical system 1122, the processing optical system 112 may include other optical elements and optical members (these may also be referred to as optical systems, the same hereinafter).

[0033] The processing light EL emitted from the processing optical system 112 is incident on the combining optical system 115. The combining optical system 115 includes a beam splitter (for example, a polarization beam splitter) 1151. The beam splitter 1151 emits the processing light EL incident on the beam splitter 1151 toward the common optical system 116. In the example shown in FIG. 3, the processing light EL incident on the beam splitter 1151 is emitted toward the common optical system 116 by passing through the polarization separation surface. For this reason, in the example shown in FIG. 3, the processing light EL is incident on the polarization separation surface of the polarization beam splitter 1151 in a state having a polarization direction (a polarization direction that becomes p-polarized with respect to the polarization separation surface) that can pass through the polarization separation surface.

[0034] The processing light EL emitted from the synthetic optical system 115 is incident on the common optical system 116. The common optical system 116 emits the processing light EL incident thereon toward the workpiece W. The common optical system 116 includes a galvanometer mirror 1161 and an fθ lens 1162.

[0035] The processing light EL emitted from the synthetic optical system 115 is incident on the galvanometer mirror 1161. The galvanometer mirror 1161 changes the irradiation position of the processing light EL on the workpiece W by deflecting the processing light EL (that is, changing the emission angle of the processing light EL). That is, the galvanometer mirror 1161 changes the position of the irradiated area EA set on the workpiece W or on the optical path of the processing light EL as the area irradiated with the processing light EL. Since the galvanometer mirror 1161 is disposed at or near the entrance pupil position of the fθ lens 1162, the change in the emission angle of the processing light EL by the galvanometer mirror 1161 is converted by the fθ lens 1162 into a change in the irradiation position of the processing light EL (that is, the position of the irradiated area EA). For example, the galvanometer mirror 1161 includes an X-scanning mirror 1161X and a Y-scanning mirror 1161Y. Each of the X-scanning mirror 1161X and the Y-scanning mirror 1161Y is a tilt angle variable mirror whose angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1161 is changed. The X-scanning mirror 1161X deflects the processing light EL by swinging or rotating so as to change the irradiation position along the X-axis direction of the processing light EL on the workpiece W (that is, changing the angle of the X-scanning mirror 1161X with respect to the optical path of the processing light EL). The Y-scanning mirror 1161Y deflects the processing light EL by swinging or rotating so as to change the irradiation position along the Y-axis direction of the processing light EL on the workpiece W (that is, changing the angle of the Y-scanning mirror 1161Y with respect to the optical path of the processing light EL).

[0036] The machining light EL from the galvanometer mirror 1161 is incident on the fθ lens 1162. Therefore, the galvanometer mirror 1161 is disposed on the optical path of the machining light EL between the synthetic optical system 115 and the fθ lens 1162. The fθ lens 1162 is disposed on the optical path of the machining light EL between the galvanometer mirror 1161 and the workpiece W. The fθ lens 1162 is disposed on the optical path of the machining light EL between the galvanometer mirror 1161 and the irradiated region EA. The fθ lens 1162 is an optical system for irradiating the workpiece W with the machining light EL from the galvanometer mirror 1161. The fθ lens 1162 is an optical system for irradiating the irradiated region EA with the machining light EL from the galvanometer mirror 1161. In particular, the fθ lens 1162 is an optical system for condensing the machining light EL from the galvanometer mirror 1161 onto the workpiece W. For this reason, the fθ lens 1162 irradiates the workpiece W with the convergent machining light EL. As a result, the workpiece W is machined by the machining light EL. Incidentally, since the fθ lens 1162 irradiates the workpiece W with the machining light EL, it may be referred to as an irradiation optical system. Incidentally, the movement range of the irradiated region EA that moves on the workpiece W by the galvanometer mirror 1161 may be referred to as a machined region. In other words, it may be assumed that the irradiated region EA moves within the machined region.

[0037] Subsequently, the measurement light source 113 can generate the measurement light ML. When the measurement light ML is a laser beam, the measurement light source 113 may include, for example, a laser diode. In particular, since the measurement light ML includes pulsed light as described above, the measurement light source 113 is a light source capable of pulsed oscillation. In this case, the measurement light source 113 can generate pulsed light (for example, pulsed light with a emission time of picoseconds or less) as the measurement light ML. The measurement light source 113 emits the generated measurement light ML toward the measurement optical system 114.

[0038] In the first embodiment, the measurement light source 113 includes an optical frequency comb light source. The optical frequency comb light source is a light source capable of generating light (hereinafter referred to as "optical frequency comb") including frequency components arranged at equal intervals on the frequency axis as pulsed light. In this case, the measurement light source 113 emits pulsed light including frequency components arranged at equal intervals on the frequency axis as the measurement light ML.

[0039] In the example shown in FIG. 1, the processing head 11 includes a plurality of measurement light sources 113. For example, the processing head 11 includes a measurement light source 113#1 and a measurement light source 113#2. The plurality of measurement light sources 113 each emit a plurality of measurement lights ML that are phase-synchronized with each other and have interference. For example, the plurality of measurement light sources 113 may have different oscillation frequencies. Therefore, the plurality of measurement lights ML emitted by the plurality of measurement light sources 113 respectively are a plurality of measurement lights ML having different pulse frequencies (for example, the number of pulsed lights per unit time, which is the reciprocal of the emission period of the pulsed light). As an example, the measurement light source 113#1 may emit a measurement light ML#1 having a pulse frequency of 25 GHz, and the measurement light source 113#2 may emit a measurement light ML#2 having a pulse frequency of 25 GHz + α (for example, +100 kHz).

[0040] The measurement optical system 114 is an optical system into which the measurement light ML emitted from the measurement light source 113 is incident. The measurement optical system 114 is an optical system that emits the measurement light ML incident on the measurement optical system 114 toward the combining optical system 115. That is, the measurement optical system 114 is an optical system that guides the measurement light ML emitted from the measurement light source 113 to the combining optical system 115. The measurement light ML emitted by the measurement optical system 114 is irradiated onto the workpiece W via the combining optical system 115 and the common optical system 116. Therefore, it can also be said that the measurement optical system 114 is an optical system that emits the measurement light ML toward the workpiece W via the combining optical system 115 and the common optical system 116.

[0041] The measurement optical system 114 is optically separated from the processing optical system 112. Therefore, the optical path of the processing light EL between the processing light source 111 and the combining optical system 115 and the optical path of the measurement light ML between the measurement light source 113 and the combining optical system 115 are optically separated. Note that when an optical system and another optical system are optically separated, it may mean that the optical path of one optical system and the optical path of the other optical system do not overlap each other.

[0042] The measurement optical system 114 includes, for example, a beam splitter 1141, a beam splitter 1142, a detector 1143, a beam splitter 1144, a mirror 1145, a detector 1146, and a mirror 1147.

[0043] The measurement light ML emitted from the measurement light source 113 enters the beam splitter 1141. Specifically, the measurement light ML (hereinafter referred to as "measurement light ML#1") emitted from the measurement light source 113#1 and the measurement light ML (hereinafter referred to as "measurement light ML#2") emitted from the measurement light source 113#2 enter the beam splitter 1141. The beam splitter 1141 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1141 toward the beam splitter 1142.

[0044] The beam splitter 1142 reflects a part of the measurement light ML#1, which is the measurement light ML#1-1, incident on the beam splitter 1142 toward the detector 1143. The beam splitter 1142 emits another part of the measurement light ML#1, which is the measurement light ML#1-2, incident on the beam splitter 1142 toward the beam splitter 1144. The beam splitter 1142 reflects a part of the measurement light ML#2, which is the measurement light ML#2-1, incident on the beam splitter 1142 toward the detector 1143. The beam splitter 1142 emits another part of the measurement light ML#2, which is the measurement light ML#2-2, incident on the beam splitter 1142 toward the beam splitter 1144.

[0045] The measurement light ML#1-1 and ML#2-1 emitted from the beam splitter 1142 enter the detector 1143. The detector 1143 detects the interference light generated by the interference between the measurement light ML#1-1 and the measurement light ML#2-1. Specifically, the detector 1143 detects the interference light by receiving the interference light. For this reason, the detector 1143 may include a light receiving element (a light receiving part, typically a photoelectric conversion element) capable of receiving light. The detection result of the detector 1143 is output to the control device 5.

[0046] The measurement lights ML#1-2 and ML#2-2 emitted from the beam splitter 1142 are incident on the beam splitter 1144. The beam splitter 1144 emits at least a part of the measurement light ML#1-2 incident on the beam splitter 1144 toward the mirror 1145. The beam splitter 1144 emits at least a part of the measurement light ML#2-2 incident on the beam splitter 1144 toward the mirror 1147.

[0047] The measurement light ML#1-2 emitted from the beam splitter 1144 is incident on the mirror 1145. The measurement light ML#1-2 incident on the mirror 1145 is reflected by the reflecting surface of the mirror 1145 (the reflecting surface may be referred to as a reference surface). Specifically, the mirror 1145 reflects the measurement light ML#1-2 incident on the mirror 1145 toward the beam splitter 1144. That is, the mirror 1145 emits the measurement light ML#1-2 incident on the mirror 1145 toward the beam splitter 1144 as the measurement light ML#1-3 which is its reflected light. The measurement light ML#1-3 emitted from the mirror 1145 is incident on the beam splitter 1144. The beam splitter 1144 emits the measurement light ML#1-3 incident on the beam splitter 1144 toward the beam splitter 1142. The measurement light ML#1-3 emitted from the beam splitter 1144 is incident on the beam splitter 1142. The beam splitter 1142 emits the measurement light ML#1-3 incident on the beam splitter 1142 toward the detector 1146.

[0048] On the other hand, the measurement light ML#2-2 emitted from the beam splitter 1144 is incident on the mirror 1147. The mirror 1147 reflects the measurement light ML#2-2 incident on the mirror 1147 toward the combining optical system 115. That is, the mirror 1147 emits the measurement light ML#2-2 incident on the mirror 1147 toward the combining optical system 115.

[0049] The measurement light ML#2-2 emitted from the mirror 1147 is incident on the combined optical system 115. The beam splitter 1151 of the combined optical system 115 emits the measurement light ML#2-2 incident on the beam splitter 1151 toward the common optical system 116. In the example shown in FIG. 3, the measurement light ML#2-2 incident on the beam splitter 1151 is emitted toward the common optical system 116 by being reflected at the polarization separation surface. For this reason, in the example shown in FIG. 3, the measurement light ML#2-2 is incident on the polarization separation surface of the polarization beam splitter 1151 in a state having a polarization direction (a polarization direction that becomes s-polarized with respect to the polarization separation surface) that can be reflected by the polarization separation surface.

[0050] Here, as described above, the processing light EL is incident on the beam splitter 1151 in addition to the measurement light ML#2-2. That is, both the measurement light ML#2-2 and the processing light EL pass through the beam splitter 1151. The beam splitter 1151 emits the processing light EL and the measurement light ML#2-2 that have entered from different directions to the beam splitter 1151 in the same direction (that is, toward the same common optical system 116). Therefore, the beam splitter 1151 substantially functions as an optical system that combines the processing light EL and the measurement light ML#2-2. Note that the above-mentioned same direction may be the direction of the processing light EL and the measurement light ML#2-2 such that the processing light EL and the measurement light ML#2-2 are incident on the common optical system 116, which is an optical system located on the emission side of the combined optical system 115, and the directions of the processing light EL and the measurement light ML#2-2 may be slightly different as long as the processing light EL and the measurement light ML#2-2 are incident on the common optical system 116.

[0051] Note that the combined optical system 115 may have any structure as long as it can combine the processing light EL and the measurement light ML#2-2. For example, in addition to or instead of using the beam splitter 1151, the combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 using a dichroic mirror that reflects light in a certain wavelength band and transmits light in another wavelength band.

[0052] The measurement light ML#2-2 emitted from the synthetic optical system 115 is incident on the common optical system 116. The common optical system 116 emits the measurement light ML#2-2 incident on the common optical system 116 toward the workpiece W.

[0053] Specifically, the measurement light ML#2-2 emitted from the synthetic optical system 115 is incident on the galvanometer mirror 1161. The galvanometer mirror 1161 changes the irradiation position of the measurement light ML#2-2 on the workpiece W by deflecting the measurement light ML#2-2. That is, the galvanometer mirror 1161 changes the position of the irradiated area MA set on the workpiece W or on the optical path of the measurement light ML#2-2 as the area irradiated with the measurement light ML#2-2 by deflecting the measurement light ML#2-2. Since the galvanometer mirror 1161 is disposed at the entrance pupil position of the fθ lens 1162 or in the vicinity thereof, the change in the emission angle of the measurement light ML#2-2 by the galvanometer mirror 1161 is converted by the fθ lens 1162 into a change in the irradiation position of the measurement light ML#2-2 (that is, the position of the irradiated area MA). For example, the X-scanning mirror 1161X swings or rotates so as to change the irradiation position along the X-axis direction of the measurement light ML#2-2 on the workpiece W (that is, changes the angle of the X-scanning mirror 1161X with respect to the optical path of the measurement light ML#2-2) to deflect the measurement light ML#2-2. The Y-scanning mirror 1161Y swings or rotates so as to change the irradiation position along the Y-axis direction of the measurement light ML#2-2 on the workpiece W (that is, changes the angle of the Y-scanning mirror 1161Y with respect to the optical path of the measurement light ML#2-2) to deflect the measurement light ML#2-2. Note that the galvanometer mirror 1161 may be referred to as an irradiation position changing optical system.

[0054] The measurement light ML#2-2 from the galvanometer mirror 1161 is incident on the fθ lens 1162. The fθ lens 1162 is an optical system for concentrating the measurement light ML#2-2 from the galvanometer mirror 1161 on the workpiece W. The fθ lens 1162 is an optical system for irradiating the measurement light ML#2-2 from the galvanometer mirror 1161 onto the workpiece W. The fθ lens 1162 is an optical system for irradiating the measurement light ML#2-2 from the galvanometer mirror 1161 onto the irradiated area MA. For this reason, the fθ lens 1162 is disposed on the optical path of the measurement light ML#2-2 between the galvanometer mirror 1161 and the irradiated area MA. In particular, the fθ lens 1162 irradiates the measurement light ML#2-2 in a convergent state onto the workpiece W. As a result, the workpiece W is machined by the measurement light ML (specifically, the measurement light ML#2-2). Incidentally, the fθ lens 1162 may be referred to as an irradiation optical system because it irradiates the workpiece W with the measurement light ML#2-2.

[0055] The range of movement of the irradiation area MA moved on the workpiece W by the galvanometer mirror 1161 may be referred to as the measurement area. In other words, the irradiation area MA may move within the measurement area.

[0056] Here, as described above, the processing light EL is incident on the common optical system 116 in addition to the measurement light ML#2-2. That is, the processing light EL and the measurement light ML#2-2 combined by the combining optical system 115 are incident on the common optical system 116. Therefore, both the measurement light ML#2-2 and the processing light EL pass through the same common optical system 116 (specifically, the same galvanometer mirror 1161 and the same fθ lens 1162). For this reason, the galvanometer mirror 1161 can synchronously change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W. The galvanometer mirror 1161 can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other. That is, the galvanometer mirror 1161 can synchronously and / or synchronously change the relative position of the irradiated area EA with respect to the workpiece W and the relative position of the irradiated area MA with respect to the workpiece W.

[0057] The opening angle of the measurement light ML#2-2 traveling from the common optical system 116 toward the workpiece W may be larger than the opening angle of the processing light EL traveling from the common optical system 116 toward the workpiece W. In this case, the spot diameter of the measurement light ML on the workpiece W becomes smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML becomes higher than the processing resolution by the processing light EL.

[0058] The opening angle of the measurement light ML#2-2 traveling from the common optical system 116 toward the workpiece W depends on the size of the light beam of the measurement light ML#2-2 incident on the common optical system 116. Specifically, the larger the size of the light beam of the measurement light ML#2-2 incident on the common optical system 116, the larger the opening angle of the measurement light ML#2-2 traveling from the common optical system 116 toward the workpiece W. Similarly, the opening angle of the processing light EL traveling from the common optical system 116 toward the workpiece W depends on the size of the light beam of the processing light EL incident on the common optical system 116. Specifically, the larger the size of the light beam of the processing light EL incident on the common optical system 116, the larger the opening angle of the processing light EL traveling from the common optical system 116 toward the workpiece W. For this reason, the size of the light beam of the measurement light ML#2-2 incident on the common optical system 116 may be larger than the size of the light beam of the processing light EL incident on the common optical system 116. In this case, the spot diameter of the measurement light ML on the workpiece W becomes smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML becomes higher than the processing resolution by the processing light EL. Here, the "size of the light beam" may mean the size of the cross-section of the light beam intersecting the traveling direction of the light. When the cross-section of the light beam intersecting the traveling direction of the light is not circular, the "size of the light beam" may mean the maximum size of the cross-section of the light beam intersecting the traveling direction of the light. For example, when the cross-section of the light beam intersecting the traveling direction of the light is an ellipse, the major axis of the ellipse may be used as the maximum size.

[0059] The opening angle of the measurement light ML#2-2 traveling from the common optical system 116 toward the workpiece W depends on the size of the light beam of the measurement light ML#2-2 at the pupil position of the fθ lens 1162 (typically the entrance pupil position, or the exit pupil position when considering the light traveling from the workpiece W toward the fθ lens 1161). Specifically, the larger the size of the light beam of the measurement light ML#2-2 at the pupil position of the fθ lens 1162, the larger the opening angle of the measurement light ML#2-2 traveling from the common optical system 116 toward the workpiece W. Similarly, the opening angle of the processing light EL traveling from the common optical system 116 toward the workpiece W depends on the size of the light beam of the processing light EL at the pupil position of the fθ lens 1162. Specifically, the larger the size of the light beam of the processing light EL at the pupil position of the fθ lens 1162, the larger the opening angle of the processing light EL traveling from the common optical system 116 toward the workpiece W. For this reason, the size of the light beam of the measurement light ML#2-2 at the pupil position of the fθ lens 1162 may be larger than the size of the light beam of the processing light EL at the pupil position of the fθ lens 1162. In this case, the spot diameter of the measurement light ML on the workpiece W becomes smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML becomes higher than the processing resolution by the processing light EL.

[0060] The combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 overlap at least partially (in other words, are superimposed) between the combined optical system 115 and the workpiece W. That is, the combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the combined optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the combined optical system 115 to the workpiece W overlap at least partially. Note that the "optical path of light" when considering the overlap of optical paths may mean the aggregate of the paths along which light propagates (or the paths of light rays). For example, the optical path of the processing light EL between the combined optical system 115 and the workpiece W may include the first path, which is the spatial region occupied by the processing light EL reaching the first position of the workpiece W from the combined optical system 115, the second path, which is the spatial region occupied by the processing light EL reaching the second position of the workpiece W from the combined optical system 115, ···, and the Nth path, which is the spatial region occupied by the processing light EL reaching the Nth position of the workpiece W from the combined optical system 115. For example, the optical path of the processing light EL between the combined optical system 115 and the workpiece W may include the spatial region through which the processing light EL can pass by the galvanometer mirror 1161 (see FIGS. 4 and 7 described later). For example, the optical path of the measurement light ML between the combined optical system 115 and the workpiece W may include the spatial region through which the measurement light ML can pass by the galvanometer mirror 1161 (see FIGS. 4 and 7 described later).

[0061] Since the common optical system 116 exists between the synthetic optical system 115 and the workpiece W, the synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 overlap at least partially within the common optical system 116. The synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL within the common optical system 116 and the optical path of the measurement light ML#2-2 within the common optical system 116 overlap at least partially. The synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 overlap at least partially between the common optical system 116 and the workpiece W. The synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the common optical system 116 to the workpiece W and the optical path of the measurement light ML#2-2 from the common optical system 116 to the workpiece W overlap at least partially.

[0062] As shown in FIG. 4, which is a cross-sectional view partially showing the optical path of the processing light EL and the optical path of the measurement light ML#2-2 between the synthetic optical system 115 and the workpiece W, the synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the optical path of the processing light EL from the synthetic optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the synthetic optical system 115 to the workpiece W are coaxial. In this case, as shown in FIG. 5, which is a plan view showing the irradiated region EA irradiated with the processing light EL and the irradiated region MA irradiated with the measurement light ML, the synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the irradiated region EA and the irradiated region MA at least partially overlap. The synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W at least partially coincide. When the irradiated region EA and the irradiated region MA at least partially overlap, at least a part of the irradiated region EA irradiated with the processing light EL is irradiated with the measurement light ML#2-2, and at least a part of the irradiated region MA irradiated with the measurement light ML#2-2 is irradiated with the processing light EL. That is, the processing light EL and the measurement light ML#2-2 are irradiated to the same region. Note that the optical path of the processing light EL from the synthetic optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the synthetic optical system 115 to the workpiece W being coaxial may include that the principal ray of the processing light EL from the synthetic optical system 115 to the workpiece W and the principal ray of the measurement light ML#2-2 from the synthetic optical system 115 to the workpiece W coincide. Here, the principal rays of the processing light EL and the measurement light ML#2-2 can be rays that pass through the position of the center of light quantity in the light beam cross-section (a cross-section intersecting the traveling direction of the processing light EL and the measurement light ML#2-2) of the processing light EL and the measurement light ML#2-2.

[0063] When the irradiated area EA and the irradiated area MA at least partially overlap, the processing apparatus 1 may simultaneously irradiate the processing light EL to the irradiated area EA and the measurement light ML#2-2 to the irradiated area MA. Specifically, as shown in FIG. 6(a), which is a timing chart showing the irradiation timing of the processing light EL and the irradiation timing of the measurement light ML#2-2, when each of the processing light EL and the measurement light ML#2-2 includes pulsed light as described above, the processing apparatus 1 determines the timing (in other words, the time, period) at which at least one of the plurality of pulsed lights constituting the processing light EL is irradiated to the irradiated area EA, and the timing (that is, the time, period) at which at least one of the plurality of pulsed lights constituting the measurement light ML#2-2 is irradiated to the irradiated area MA. The processing light EL and the measurement light ML#2-2 may be irradiated so as to coincide with each other.

[0064] Alternatively, when the irradiated area EA and the irradiated area MA at least partially overlap, the processing apparatus 1 may irradiate the processing light EL to the irradiated area EA and the measurement light ML#2-2 to the irradiated area MA at different timings. Specifically, as shown in FIGS. 6(b) and 6(c) which are timing charts showing the irradiation timing of the processing light EL and the irradiation timing of the measurement light ML#2-2, the processing apparatus 1 determines the timing (i.e., time, period) when at least one of the plurality of pulsed lights constituting the processing light EL is irradiated to the irradiated area EA, and the timing (i.e., time, period) when at least one of the plurality of pulsed lights constituting the measurement light ML#2-2 is irradiated to the irradiated area MA. The processing light EL and the measurement light ML#2-2 may be irradiated so that they are different. The processing apparatus 1 may irradiate the processing light EL and the measurement light ML#2-2 so that the timing (i.e., time, period) when at least one of the plurality of pulsed lights constituting the processing light EL is irradiated to the irradiated area EA does not overlap with the timing (i.e., time, period) when at least one of the plurality of pulsed lights constituting the measurement light ML#2-2 is irradiated to the irradiated area MA. Typically, the processing apparatus 1 irradiates the processing light EL and the measurement light ML#2-2 so that the timing when one pulsed light PL#13 constituting the processing light EL is irradiated to the irradiated area EA is set between the timing when one pulsed light PL#12 constituting the measurement light ML#2-2 is irradiated to the irradiated area MA and the timing when another pulsed light PL#14 constituting the measurement light ML#2-2 is irradiated to the irradiated area MA. The processing apparatus 1 may irradiate the processing light EL and the measurement light ML#2-2 so that the timing when one pulsed light PL#12 constituting the measurement light ML#2-2 is irradiated to the irradiated area MA is set between the timing when one pulsed light PL#11 constituting the processing light EL is irradiated to the irradiated area EA and the timing when another pulsed light PL#13 constituting the processing light EL is irradiated to the irradiated area EA. In this case, the possibility that the irradiation of the measurement light ML#2-2 to the workpiece W is obstructed by substances (e.g., fumes, etc.) generated due to the irradiation of the processing light EL to the workpiece W is reduced. As a result, more appropriate measurement using the measurement light ML#2-2 becomes possible.

[0065] Alternatively, the combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are at least partially separated between the combined optical system 115 and the workpiece W. That is, the combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the combined optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the combined optical system 115 to the workpiece W are at least partially separated. Since there is a common optical system 116 between the combined optical system 115 and the workpiece W, the combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are at least partially separated within the common optical system 116. The combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL within the common optical system 116 and the optical path of the measurement light ML#2-2 within the common optical system 116 are at least partially separated. The combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are at least partially separated between the common optical system 116 and the workpiece W. The combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the common optical system 116 to the workpiece W and the optical path of the measurement light ML#2-2 from the common optical system 116 to the workpiece W are at least partially separated.

[0066] As shown in FIG. 7, which is a cross-sectional view partially showing the optical path of the processing light EL between the synthetic optical system 115 and the workpiece W and the optical path of the measurement light ML#2-2, the synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the synthetic optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the synthetic optical system 115 to the workpiece W are at least partially separated along a direction intersecting the optical axis AX of the synthetic optical system 115 and / or the common optical system 116. That is, the synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the synthetic optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the synthetic optical system 115 to the workpiece W are in an off-axis relationship. In this case, as shown in FIG. 8, which is a plan view showing the irradiated region EA irradiated with the processing light EL and the irradiated region MA irradiated with the measurement light ML, the synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the irradiated region EA and the irradiated region MA are at least partially separated. The synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W are at least partially different.

[0067] FIG. 7 shows an example in which the processing light EL reaching the workpiece W from the fθ lens 1162 and the measurement light ML#2-2 reaching the workpiece W from the fθ lens 1162 are parallel. That is, FIG. 7 shows an example in which the principal ray of the processing light EL reaching the workpiece W from the fθ lens 1162 and the principal ray of the measurement light ML#2-2 reaching the workpiece W from the fθ lens 1162 are parallel. However, the processing light EL reaching the workpiece W from the fθ lens 1162 and the measurement light ML#2-2 reaching the workpiece W from the fθ lens 1162 may be non-parallel. That is, the principal ray of the processing light EL reaching the workpiece W from the fθ lens 1162 and the principal ray of the measurement light ML#2-2 reaching the workpiece W from the fθ lens 1162 may be non-parallel. In other words, the telecentricity on the workpiece side of the fθ lens 1162 may be non-telecentric with respect to the processing light EL, and the telecentricity on the workpiece side of the fθ lens 1162 may be non-telecentric with respect to the measurement light ML.

[0068] In order to at least partially separate the irradiated region EA and the irradiated region MA, the synthetic optical system 115 may typically combine the processing light EL and the measurement light ML#2-2 such that the processing light EL and the measurement light ML#2-2 have an angular difference at the pupil plane of the fθ lens 1162. That is, the synthetic optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the incident angle of the processing light EL with respect to the pupil plane of the fθ lens 1162 and the incident angle of the measurement light ML#2-2 with respect to the pupil plane of the fθ lens 1162 are different. As a result, the angular difference between the processing light EL and the measurement light ML#2-2 at the pupil plane is converted by the fθ lens 1162 into a difference in the irradiation positions of the processing light EL and the measurement light ML#2-2 at the image plane (typically, the surface of the workpiece W). That is, the angular difference between the processing light EL and the measurement light ML#2-2 at the pupil plane is converted by the fθ lens 1162 into a difference in the positions between the irradiated region EA and the irradiated region MA on the workpiece W.

[0069] In order to at least partially separate the irradiated region EA and the irradiated region MA on the workpiece W, as shown in FIG. 9, the common optical system 116 may include a relay lens 1163 between the galvanometer mirror 1161 and the fθ lens 1162. The relay lens 1163 is an optical member (optical system) for at least partially separating the optical path of the processing light EL and the optical path of the measurement light ML#2-2 on a plane optically conjugate to the surface of the workpiece W.

[0070] When the irradiated region EA and the irradiated region MA are at least partially separated, the processing apparatus 1 may irradiate the processing light EL to the irradiated region EA and the measurement light ML#2-2 to the irradiated region MA at the same timing (see FIG. 6(a)). Alternatively, when the irradiated region EA and the irradiated region MA are at least partially separated, the processing apparatus 1 may irradiate the processing light EL to the irradiated region EA and the measurement light ML#2-2 to the irradiated region MA at different timings (see FIGS. 6(b) and 6(c)).

[0071] In addition, the combined optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are separated (so as not to overlap even partially) between the combined optical system 115 and the workpiece W.

[0072] Alternatively, when the irradiated region EA and the irradiated region MA at least partially overlap, when the irradiated region EA and the irradiated region MA are at least partially separated, and when the irradiated region EA and the irradiated region MA are completely separated, the processing apparatus 1 may irradiate the workpiece W with the measurement light ML before the processing apparatus 1 starts processing the workpiece W (for example, at the timing when the workpiece W is placed on the stage 32 or when the workpiece W becomes irradiatable with the measurement light ML). That is, the processing apparatus 1 may irradiate the irradiated region MA with the measurement light ML#2-2 before the processing apparatus 1 starts processing the workpiece W (for example, at the timing when the workpiece W is placed on the stage 32 or when the workpiece W becomes irradiatable with the measurement light ML). The processing apparatus 1 may irradiate the workpiece W with the measurement light ML after the processing apparatus 1 finishes processing the workpiece W. The processing apparatus 1 may irradiate the irradiated region MA with the measurement light ML#2-2 after the processing apparatus 1 finishes processing the workpiece W.

[0073] Again, in FIG. 3, when the workpiece W is irradiated with the measurement light ML#2-2, light generated from the workpiece W due to the irradiation of the measurement light ML#2-2 occurs. That is, when the workpiece W is irradiated with the measurement light ML#2-2, light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2 is emitted. For example, when the workpiece W is irradiated with the measurement light ML#2-2, the reflected light of the measurement light ML#2-2 is emitted from the workpiece W. For example, when the workpiece W is irradiated with the measurement light ML#2-2, the scattered light of the measurement light ML#2-2 is emitted from the workpiece W. Here, the light caused by the irradiation of the measurement light ML#2-2, in other words, the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2, may include at least one of the measurement light ML#2-2 reflected by the workpiece W (that is, the reflected light), the scattered light generated by the irradiation of the measurement light ML#2-2 on the workpiece W, the measurement light ML#2-2 diffracted by the workpiece W (that is, the diffracted light), and the measurement light ML#2-2 transmitted through the workpiece W (that is, the transmitted light).

[0074] At least a part of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2 (hereinafter, this light is referred to as "measurement light ML#2-3") enters the common optical system 116. The measurement light ML#2-3 that has entered the common optical system 116 enters the synthesis optical system 115 via the fθ lens 1162 and the galvanometer mirror 1161. The beam splitter 1151 of the synthesis optical system 115 emits the measurement light ML#2-3 that has entered the beam splitter 1151 toward the measurement optical system 114. In the example shown in FIG. 3, the measurement light ML#2-3 that has entered the beam splitter 1151 is emitted toward the measurement optical system 114 by being reflected at the polarization separation surface. Therefore, in the example shown in FIG. 3, the measurement light ML#2-3 enters the polarization separation surface of the polarization beam splitter 1151 in a state having a polarization direction that can be reflected by the polarization separation surface.

[0075] The measurement light ML#2-3 emitted from the synthesis optical system 115 enters the mirror 1147 of the measurement optical system 114. The mirror 1147 reflects the measurement light ML#2-3 that has entered the mirror 1147 toward the beam splitter 1144. The beam splitter 1144 emits at least a part of the measurement light ML#2-3 that has entered the beam splitter 1144 toward the beam splitter 1142. The beam splitter 1142 emits at least a part of the measurement light ML#2-3 that has entered the beam splitter 1142 toward the detector 1146.

[0076] Here, as described above, in addition to the measurement light ML#2-3, the measurement light ML#1-3 enters the detector 1146. That is, the measurement light ML#2-3 that travels toward the detector 1146 via the workpiece W and the measurement light ML#1-3 that travels toward the detector 1146 without passing through the workpiece W enter the detector 1146. Note that the measurement light ML#1-3 may be referred to as a reference light. The detector 1146 detects the interference light generated by the interference between the measurement light ML#1-3 and the measurement light ML#2-3. Specifically, the detector 1146 detects the interference light by receiving the interference light. Therefore, the detector 1146 may include a light-receiving element (light-receiving unit) capable of receiving light. The detection result of the detector 1146 is output to the control device 5.

[0077] Based on the detection results of the detector 1143 and the detector 1146, the control device 5 calculates the state of the workpiece W. Here, with reference to FIG. 10, the principle of calculating the state of the workpiece W based on the detection results of the detector 1143 and the detector 1146 will be described.

[0078] FIG. 10 is a timing chart showing the measurement light ML#1-1 incident on the detector 1143, the measurement light ML#2-1 incident on the detector 1143, the interference light detected by the detector 1143, the measurement light ML#1-3 incident on the detector 1146, the measurement light ML#2-3 incident on the detector 1146, and the interference light detected by the detector 1146. Since the pulse frequencies of the measurement light ML#1 and the measurement light ML#2 are different, the pulse frequencies of the measurement light ML#1-1 and the measurement light ML#2-1 are different. Therefore, the interference light between the measurement light ML#1-1 and the measurement light ML#2-1 becomes interference light in which pulse light appears in synchronization with the timing when the pulse light constituting the measurement light ML#1-1 and the pulse light constituting the measurement light ML#2-1 are simultaneously incident on the detector 1143. Similarly, the pulse frequencies of the measurement light ML#1-3 and the measurement light ML#2-3 are different. Therefore, the interference light between the measurement light ML#1-3 and the measurement light ML#2-3 becomes interference light in which pulse light appears in synchronization with the timing when the pulse light constituting the measurement light ML#1-3 and the pulse light constituting the measurement light ML#2-3 are simultaneously incident on the detector 1146.

[0079] Here, the position of the pulsed light that creates the interference light detected by the detector 1146 (position on the time axis) varies according to the positional relationship between the processing head 11 and the workpiece W. This is because the interference light detected by the detector 1146 is the interference light between the measurement light ML#2-3 that travels toward the detector 1146 through the workpiece W and the measurement light ML#1-3 that travels toward the detector 1146 without passing through the workpiece W. On the other hand, the position of the pulsed light that creates the interference light detected by the detector 1143 (position on the time axis) does not vary according to the positional relationship between the processing head 11 and the workpiece W. Therefore, it can be said that the time difference between the pulsed light that creates the interference light detected by the detector 1146 and the pulsed light that creates the interference light detected by the detector 1143 indirectly indicates the positional relationship between the processing head 11 and the workpiece W (typically, the distance between the processing head 11 and the workpiece W). For this reason, the control device 5 can calculate the state of the workpiece W based on the time difference between the pulsed light that creates the interference light detected by the detector 1146 and the pulsed light that creates the interference light detected by the detector 1143. Specifically, the control device 5 can calculate the position of the portion of the workpiece W irradiated with the measurement light ML#2-2 based on the time difference between the pulsed light that creates the interference light detected by the detector 1146 and the pulsed light that creates the interference light detected by the detector 1143. That is, the control device 5 can obtain information regarding the position of the portion of the workpiece W irradiated with the measurement light ML#2-2. Furthermore, if the measurement light ML#2-2 is irradiated at a plurality of locations on the workpiece W and / or if the measurement light ML#2-2 is irradiated so as to scan the surface of the workpiece W, the control device 5 can also calculate the shape of the workpiece W.

[0080] The calculated state of the workpiece W may be used to control the processing system SYSa. Specifically, the calculated state of the workpiece W may be used to control the processing device 1. The calculated state of the workpiece W may be used to control the processing head 11. The calculated state of the workpiece W may be used to control the head drive system 12. The calculated state of the workpiece W may be used to control the stage device 3. The calculated state of the workpiece W may be used to control the stage drive system 33.

[0081] For example, based on the calculated state of the workpiece W, the control device 5 may change the relative positional relationship between the workpiece W and the processing head 11 so that the relative positional relationship becomes a desired positional relationship. That is, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and the processing head 11 so that the relative positional relationship between the workpiece W and the processing head 11 becomes a desired positional relationship based on the calculated state of the workpiece W. As an example of a device capable of changing the relative positional relationship between the workpiece W and the processing head 11, at least one of the head drive system 12 and the stage drive system 33 can be mentioned. Incidentally, as an example of the "desired positional relationship", there is a positional relationship in which the processing light EL and / or the measurement light ML is irradiated at a desired position on the workpiece W.

[0082] For example, based on the calculated state of the workpiece W, the control device 5 may change the relative positional relationship between the workpiece W and each optical system (for example, at least one of the processing optical system 112, the measurement optical system 114, the combining optical system 115, and the common optical system 116) provided in the processing head 11 so that the relative positional relationship becomes a desired relationship. That is, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and each optical system provided in the processing head 11 so that the relative positional relationship between the workpiece W and each optical system provided in the processing head 11 becomes a desired relationship based on the calculated state of the workpiece W. As an example of a device capable of changing the relative positional relationship between the workpiece W and each optical system provided in the processing head 11, at least one of the head drive system 12 and the stage drive system 33 can be mentioned.

[0083] For example, the control device 5 may change the relative position of the irradiated area EA with respect to the workpiece W based on the calculated state of the workpiece W, so that the irradiated area EA is set at a desired position on the workpiece W (i.e., the processing light EL is irradiated). In other words, the control device 5 may control a device capable of changing the relative position of the irradiated area EA with respect to the workpiece W, so that the irradiated area EA is set at a desired position on the workpiece W based on the calculated state of the workpiece W. Examples of devices capable of changing the relative position of the irradiated area EA with respect to the workpiece W include the angle adjustment optical element 1122 of the processing optical system 112, the galvanometer mirror 1161 of the common optical system 116, the head driving system 12, and the stage driving system 33.

[0084] For example, the control device 5 may change the relative position of the irradiated area MA with respect to the workpiece W based on the calculated state of the workpiece W, so that the irradiated area MA is set at a desired position on the workpiece W (i.e., the measurement light ML#2-2 is irradiated). In other words, the control device 5 may control a device capable of changing the relative position of the irradiated area MA with respect to the workpiece W, so that the irradiated area MA is set at a desired position on the workpiece W based on the calculated state of the workpiece W. Examples of devices capable of changing the relative position of the irradiated area MA with respect to the workpiece W include the angle adjustment optical element 1122 of the processing optical system 112, the galvanometer mirror 1161 of the common optical system 116, the head driving system 12, and the stage driving system 33.

[0085] However, as described above, in the first embodiment, the galvanometer mirror 1161 can change the relative position of the irradiated area MA with respect to the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other. Therefore, when the relative position of the irradiated area MA with respect to the workpiece W is changed using the galvanometer mirror 1161, the relative position of the irradiated area EA with respect to the workpiece W is also changed at the same time. In other words, when the relative position of the irradiated area EA with respect to the workpiece W is changed using the galvanometer mirror 1161, the relative position of the irradiated area MA with respect to the workpiece W is also changed at the same time.

[0086] The head drive system 12 also moves the processing head 11, and therefore can change the relative position of the irradiated area MA with respect to the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other. Therefore, when the relative position of the irradiated area MA with respect to the workpiece W is changed using the head drive system 12, the relative position of the irradiated area EA with respect to the workpiece W is also changed at the same time. In other words, when the relative position of the irradiated area EA with respect to the workpiece W is changed using the head drive system 12, the relative position of the irradiated area MA with respect to the workpiece W is also changed at the same time.

[0087] The stage drive system 33 also moves the stage 32 (i.e., moves the workpiece W placed on the stage 32), and therefore can change the relative position of the irradiated area MA with respect to the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in a coordinated manner. When the relative position of the irradiated area MA with respect to the workpiece W is changed using the stage drive system 33, the relative position of the irradiated area EA with respect to the workpiece W is also changed at the same time. In other words, when the relative position of the irradiated area EA with respect to the workpiece W is changed using the stage drive system 33, the relative position of the irradiated area MA with respect to the workpiece W is also changed at the same time.

[0088] For example, the control device 5 may determine whether or not the workpiece W has been appropriately processed by the processing light EL based on the calculated state of the workpiece W. That is, the control device 5 may perform a post-inspection of the workpiece W after the workpiece W has been processed by the processing light EL based on the calculated state of the workpiece W. Specifically, the control device 5 may determine whether or not the workpiece W has been appropriately processed by the processing light EL by comparing the calculated state of the workpiece W with an ideal state of the workpiece W after processing. When it is determined that the workpiece W has not been appropriately processed by the processing light EL, the control device 5 may control the processing device 1 so that the workpiece W is appropriately processed by the processing light EL.

[0089] When post-inspection of the work W is performed, on the work W, the irradiated area MA irradiated with the measurement light ML#2-2 may be set behind the irradiated area EA irradiated with the processing light EL. The "behind" mentioned here means behind along the moving direction of the processing light EL on the work W (that is, the moving direction of the irradiated area EA). In this case, after the processing light EL irradiates a certain area on the work W, the measurement light ML#2-2 irradiates the area. Therefore, the irradiation order of the processing light EL and the measurement light ML#2-2 becomes an order suitable for post-inspection of the work W.

[0090] For example, the control device 5 may perform pre-inspection of the work W before the work W is processed by the processing light EL based on the calculated state of the work W. For example, the control device 5 may perform pre-inspection to determine whether there are defects on the work W that may prevent appropriate processing by the processing light EL. For example, the control device 5 may perform pre-inspection to identify the state of the work W in order to determine the processing content by the processing light EL.

[0091] When pre-inspection of the work W is performed, on the work W, the irradiated area MA irradiated with the measurement light ML#2-2 may be set in front of the irradiated area EA irradiated with the processing light EL. The "front" mentioned here means in front along the moving direction of the processing light EL on the work W. In this case, after the measurement light ML#2-2 irradiates a certain area on the work W, the processing light EL irradiates the area. Therefore, the irradiation order of the processing light EL and the measurement light ML#2-2 becomes an order suitable for pre-inspection of the work W.

[0092] (1-3) Structure of Head Drive System 12 (1-3-1) Overall Structure of Head Drive System 12 Subsequently, with reference to FIG. 11, an example of the structure of the head drive system 12 will be described. FIG. 11 is a cross-sectional view showing an example of the structure of the head drive system 12.

[0093] As shown in FIG. 11, the head drive system 12 includes a first drive system 121 and a second drive system 122. The second drive system 121 is attached to the first drive system 121. The first drive system 121 supports the second drive system 122. The processing head 11 is attached to the second drive system 122. The second drive system 122 supports the processing head 11. Therefore, the second drive system 122 may substantially function as a connecting device that connects the first drive system 121 and the processing head 11.

[0094] Under the control of the control device 5, the first drive system 121 moves the second drive system 122 relative to the workpiece W. That is, the first drive system 121 functions as a moving device that moves the second drive system 122 relative to the workpiece W. Since the processing head 11 is attached to the second drive system 122, it can be said that the first drive system 121 moves the processing head 11 relative to the workpiece W by moving the second drive system 122. That is, the first drive system 121 moves the processing head 11 together with the second drive system 122. The first drive system 121 moves the processing head 11 via the second drive system 122. The first drive system 121 functions as a drive unit that moves (in other words, drives) each optical system provided in the processing head 11 via the second drive system 122.

[0095] Under the control of the control device 5, the second drive system 122 moves the processing head 11 relative to the workpiece W. That is, the second drive system 122 functions as a moving device that moves the processing head 11 relative to the workpiece W. The second drive system 122 functions as a moving device that moves the processing head 11 relative to the workpiece W. Since the second drive system 122 supports the processing head 11 as described above, it can be said that the second drive system 122 supports the processing head 11 in a state where the processing head 11 is displaceable relative to the workpiece W. In this case, the second drive system 122 functions as a support unit that supports each optical system provided in the processing head 11 in a state where each optical system provided in the processing head 11 is displaceable relative to the workpiece W.

[0096] Hereinafter, such a first drive system 121 and a second drive system 122 will be described in order.

[0097] (1-3-1-1) Structure of First Drive System 121 As shown in FIG. 11, the first drive system 121 includes a base 1211 and an arm drive system 1212.

[0098] The base 1211 is attached to the housing 4 (for example, the ceiling member of the housing 4) or a support frame (support structure) (not shown). The arm drive system 1212 is attached to the base 1211. The base 1211 supports the arm drive system 1211. The base 1211 is used as a base member for supporting the arm drive system 1211.

[0099] The arm drive system 1212 includes a plurality of arm members 12121. The plurality of arm members 12121 are swingably connected via at least one joint member 12122. Therefore, the arm drive system 1212 is a robot having a so-called vertical articulated structure. Note that the arm drive system 1212 is not limited to a robot having a vertical articulated structure, and may be, for example, a robot having a horizontal articulated structure, a polar coordinate type robot, a cylindrical coordinate type robot, a rectangular coordinate type robot, or a parallel link type robot. The arm drive system 1212 may include a single joint (that is, a drive shaft defined by the joint member 12122). Alternatively, the arm drive system 1212 may include a plurality of joints. FIG. 11 shows an example in which the arm drive system 1212 includes three joints. Two arm members 12121 connected via each joint swing by an actuator 12123 corresponding to each joint. FIG. 11 shows an example in which the arm drive system 1212 includes three actuators 12123 corresponding to the three joints. As a result, at least one arm member 12121 moves. For this reason, at least one arm member 12121 is movable with respect to the workpiece W. That is, at least one arm member 12121 is movable so that the relative positional relationship between at least one arm member 12121 and the workpiece W is changed.

[0100] The second drive system 122 is attached to the arm drive system 1212. Specifically, the second drive system 122 is attached to one arm member 12121 located at the position farthest from the base 1211 among the plurality of arm members 12121. Hereinafter, for convenience of explanation, one arm member 12121 to which the second drive system 122 is attached is referred to as the tip arm member 12124. The second drive system 122 may be directly attached to the tip arm member 12124, or may be indirectly attached to the tip arm member 12124 via another member.

[0101] When the tip arm member 12124 moves by the actuator 12123 described above, the second drive system 122 attached to the tip arm member 12124 also moves. For this reason, the arm drive system 1212 (that is, the first drive system 121) can move the second drive system 122. Specifically, the arm drive system 1212 can move the second drive system 122 with respect to the work W. The arm drive system 1212 can move the second drive system 122 so that the relative positional relationship between the second drive system 122 and the work W is changed. Further, when the second drive system 122 moves, the processing head 11 attached to the second drive system 122 also moves. For this reason, the arm drive system 1212 (that is, the first drive system 121) can move the processing head 11.

[0102] Note that the first drive system 121 is not limited to a multi-joint robot, and may have any structure as long as it can move the second drive system 122 with respect to the work W.

[0103] (1-3-1-2) Structure of Second Drive System 122 Subsequently, with reference to FIG. 12, the structure of the second drive system 122 will be described. FIG. 12 is a cross-sectional view showing the structure of the second drive system 122.

[0104] As shown in FIG. 12, the second drive system 122 includes a support member 1221, a support member 1222, an air spring 1223, a damper member 1224, and a drive member 1225.

[0105] The support member 1221 is attached to the first drive system 121. Specifically, the support member 1221 is attached to the tip arm member 12124 of the first drive system 121. The support member 1222 is attached to the processing head 11.

[0106] The support member 1221 and the support member 1222 are coupled (in other words, connected or joined) via an air spring 1223, a damper member 1224, and a drive member 1225. That is, each of the air spring 1223, the damper member 1224, and the drive member 1225 is attached to the support members 1221 and 1222 so as to couple the support member 1221 and the support member 1222. Since the first drive system 121 is attached to the support member 1221 and the processing head 11 is attached to the support member 1222, it can also be said that each of the air spring 1223, the damper member 1224, and the drive member 1225 is attached to the support members 1221 and 1222 so as to substantially couple the first drive system 121 and the processing head 11.

[0107] The air spring 1223 applies, under the control of the control device 5, an elastic force resulting from the pressure of a gas (e.g., air) to at least one of the support members 1221 and 1222. The air spring 1223 applies, under the control of the control device 5, an elastic force resulting from the pressure of a gas to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222. In particular, the air spring 1223 may apply, along the direction in which the support member 1221 and the support member 1222 are arranged (in the example shown in FIG. 12, the Z-axis direction, which is the direction of gravity), an elastic force resulting from the pressure of a gas to at least one of the support members 1221 and 1222. That is, the air spring 1223 may apply, along the direction in which the first drive system 121 (in particular, the tip arm member 12124) and the processing head 11 are arranged (in the example shown in FIG. 12, the Z-axis direction, which is the direction of gravity), an elastic force resulting from the pressure of a gas to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222. Note that the air spring 1223 may be referred to as an elastic member.

[0108] To apply an elastic force resulting from the pressure of a gas, gas is supplied to the air spring 1223 from a gas supply device 12261 via a pipe 12262 and a valve 12263. The control device 5 controls at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of a pressure gauge 1226 that measures the pressure of the airframe within the air spring 1223. Note that the gas supply device 12261, the pipe 12262, and the valve 12263 may be omitted. In this case, the air spring 1223 may apply, regardless of the control of the control device 5, an elastic force resulting from the pressure of the internal gas to at least one of the support members 1221 and 1222.

[0109] The air spring 1223 may support the weight of the support member 1222 under the control of the control device 5 by utilizing elastic force. Specifically, the air spring 1223 may support the weight of the support member 1222 along the direction in which the support member 1221 and the support member 1222 are aligned by utilizing elastic force. Since the processing head 11 is attached to the support member 1222, the air spring 1223 may support the weight of the processing head 11 attached to the support member 1222 by utilizing elastic force. Specifically, the air spring 1223 may support the weight of the processing head 11 along the direction in which the first drive system 121 (particularly, the tip arm member 12124) and the processing head 11 are aligned by utilizing elastic force. In this case, the air spring 1223 may function as a self-weight canceller that cancels the self-weight of the processing head 11. Note that the air spring 1223 may support the weight of the support member 1222 by utilizing elastic force regardless of the control of the control device 5.

[0110] The air spring 1223 may reduce the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 under the control of the control device 5 by utilizing the elastic force. That is, the air spring 1223 may attenuate the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 by utilizing the elastic force. Specifically, the air spring 1223 may reduce (attenuate) the vibration traveling (i.e., being transmitted) from the first drive system 121 to the processing head 11 via the second drive system 122 by utilizing the elastic force. That is, the air spring 1223 may reduce (attenuate) the vibration traveling from the portion of the first drive system 121 where the second drive system 122 is attached (i.e., the tip arm portion 12124) to the portion of the processing head 11 where the second drive system 122 is attached by utilizing the elastic force. In this case, the control device 5 may control at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of the pressure gauge 1226 so that the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 is reduced (i.e., attenuated). Incidentally, the air spring 1223 (or the second drive system 122 including the air spring 1223) may be referred to as a vibration reduction device or a vibration attenuation device. Incidentally, the air spring 1223 may reduce the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 by utilizing the elastic force regardless of the control of the control device 5.

[0111] The damper member 1224 applies an elastic force resulting from a factor different from the air pressure to at least one of the support members 1221 and 1222. The damper member 1224 applies an elastic force resulting from a factor different from the air pressure to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222. In particular, the damper member 1224 may apply an elastic force to at least one of the support members 1221 and 1222 along the direction in which the support member 1221 and the support member 1222 are arranged (in the example shown in FIG. 12, it is the Z-axis direction, which is the direction of gravity). That is, the damper member 1224 may apply an elastic force to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222 along the direction in which the first drive system 121 (particularly, the tip arm member 12124) and the processing head 11 are arranged (in the example shown in FIG. 12, it is the Z-axis direction, which is the direction of gravity). Incidentally, the damper member 1224 may be referred to as an elastic member.

[0112] The damper member 1224 may be any member as long as it can apply an elastic force. For example, the damper member 1224 may include a compression coil spring. For example, the damper member 1224 may include a leaf spring.

[0113] The damper member 1224 may support the weight of the support member 1222 by using the elastic force. Specifically, the damper member 1224 may support the weight of the support member 1222 along the direction in which the support member 1221 and the support member 1222 are arranged by using the elastic force. Since the processing head 11 is attached to the support member 1222, the damper member 1224 may support the weight of the processing head 11 attached to the support member 1222 by using the elastic force. Specifically, the damper member 1224 may support the weight of the processing head 11 along the direction in which the first drive system 121 (particularly, the tip arm member 12124) and the processing head 11 are arranged by using the elastic force. In this case, the damper member 1224 may function as a self-weight canceller that cancels the self-weight of the processing head 11.

[0114] The damper member 1224 may reduce the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 by utilizing elastic force. That is, the damper member 1224 may attenuate the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 by utilizing elastic force. Specifically, the damper member 1224 may reduce (attenuate) the vibration traveling (i.e., being transmitted) from the first drive system 121 to the processing head 11 via the second drive system 122 by utilizing elastic force. For this reason, the damper member 1224 (or the second drive system 122 including the damper member 1224) may be referred to as a vibration reduction device or a vibration attenuation device.

[0115] The damper member 1224 may convert the vibration of the air spring 1223 into damped vibration by utilizing elastic force. That is, the damper member 1224 may convert the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 into damped vibration by utilizing elastic force.

[0116] The drive member 1225 can generate a driving force under the control of the control device 5. The drive member 1225 can apply the generated driving force to at least one of the support members 1221 and 1222. The drive member 1225 can apply the generated driving force to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222. As long as the drive member 1225 can generate a driving force, it may have any structure. For example, the drive member 1225 may have a structure capable of generating a driving force electrically. For example, the drive member 1225 may have a structure capable of generating a driving force magnetically. As an example, FIG. 12 shows an example in which the drive member 1225 is a voice coil motor (VCM) capable of generating a driving force electrically. Note that since the voice coil motor is a type of linear motor, the drive member 1225 may be a linear motor different from the voice coil motor. The drive member 1225 may generate a driving force along a linear axis.

[0117] Further, the drive member 1225 may have a structure in which a member attached to the support member 1221 of the drive member 1225 and a member attached to the support member 1222 of the drive member 1225 do not physically contact each other. For example, when the drive member 1225 is a voice coil motor, a member attached to the support member 1221 of the drive member 1225 (for example, a member including either the coil or one of the magnetic poles) and a member attached to the support member 1222 of the drive member 1225 (for example, a member including the other of the coil and the magnetic poles) do not physically contact each other.

[0118] The drive member 1225 may move at least one of the support members 1221 and 1222 using a driving force under the control of the control device 5. The drive member 1225 may move at least one of the support members 1221 and 1222 using a driving force under the control of the control device 5, and thereby move at least one of the first drive system 121 and the processing head 11. In this case, the drive member 1225 may change the relative position between the first drive system 121 and the processing head 11 by moving at least one of the first drive system 121 and the processing head 11 using a driving force. In this case, it can be said that the second drive system 122 including the drive member 1225 couples the first drive system 121 and the processing head 11 so that the relative position between the first drive system 121 and the processing head 11 can be changed. That is, it can be said that the air spring 1223 and the damper member 1224 (further, the drive member 1225) described above couple the first drive system 121 and the processing head 11 so that the relative position between the first drive system 121 and the processing head 11 can be changed by the drive member 1225. Further, the drive member 1225 may be referred to as a position changing device.

[0119] The drive member 1225 may change the relative position between the first drive system 121 and the processing head 11 under the control of the control device 5 based on the measurement result of the position measurement device 1227 provided in the second drive system 122. The position measurement device 1226 measures the relative position between the first drive system 121 and the processing head 11. For example, the position measurement device 1226 may be an encoder including a detection unit 12261 attached to the support member 1221 and a scale unit 12262 attached to the support member 1222. The measurement result of the position measurement device 1226 includes information regarding the relative position between the support member 1221 and the support member 1222. Since the first drive system 121 is attached to the support member 1221 and the processing head 11 is attached to the support member 1222, the information regarding the relative position between the support member 1221 and the support member 1222 includes information regarding the relative position between the first drive system 121 and the processing head 11. Therefore, the control device 5 can appropriately specify the relative position between the first drive system 121 and the processing head 11. As a result, the control device 5 can appropriately change the relative position between the first drive system 121 and the processing head 11 based on the measurement result of the position measurement device 1227.

[0120] The drive member 1225 may move the processing head 11 relative to the workpiece W by changing the relative position between the first drive system 121 and the processing head 11 (typically, moving the processing head 11 relative to the first drive system 121) under the control of the control device 5. The drive member 1225 may move the processing head 11 so that the relative positional relationship between the processing head 11 and the workpiece W is changed.

[0121] The drive member 1225 may reduce the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 by changing the relative position between the first drive system 121 and the processing head 11 under the control of the control device 5 using the driving force. That is, the drive member 1225 may attenuate the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 using the driving force. Specifically, the drive member 1225 may reduce (attenuate) the vibration traveling (i.e., being transmitted) from the first drive system 121 to the processing head 11 via the second drive system 122 using the driving force. For this reason, the drive member 1225 (or the second drive system 122 including the drive member 1225) may be referred to as a vibration reduction device or a vibration attenuation device.

[0122] The drive member 1225 may convert the vibration of the air spring 1223 into damped vibration by changing the relative position between the first drive system 121 and the processing head 11 using the driving force. That is, the drive member 1225 may convert the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 into damped vibration using the driving force. In this case, it can be said that the drive member 1225 reduces the relative displacement amount between the first drive system 121 and the processing head 11 caused by the vibration traveling from the first drive system 121 to the processing head 11 using the driving force. Specifically, it can be said that the drive member 1225 reduces the relative displacement amount between the portion of the first drive system 121 to which the second drive system 122 is connected (i.e., the tip arm portion 12124) and the portion of the processing head 11 to which the second drive system 122 is connected caused by the vibration traveling from the first drive system 121 to the processing head 11 using the driving force. Incidentally, when the drive member 1225 can convert the vibration of the air spring 1223 into damped vibration, the second drive system 122 may not include the damper member 1224. However, even when the drive member 1225 cannot convert the vibration of the air spring 1223 into damped vibration, the second drive system 122 may not include the damper member 1224. Also, the number of air springs 1223, the number of damper members 1224, and the number of drive members 1225 do not have to be equal to each other.

[0123] The drive member 1225 may apply a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 applies an elastic force. For example, in the example shown in FIG. 12, since the air spring 1223 and / or the damper member 1224 applies an elastic force along the Z-axis direction, the drive member 1225 may apply a driving force acting along a direction including a component in the Z-axis direction. When the drive member 1225 generates a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 applies an elastic force, the drive member 1225 can utilize this driving force to convert the vibration of the air spring 1223 into damped vibration. When damping the vibration of the air spring 1223, the drive member 1225 may utilize the driving force to change the resonance frequency of the air spring 1223. Typically, the drive member 1225 may utilize the driving force to increase the resonance frequency of the air spring 1223.

[0124] A device that actively reduces vibration using an elastic member such as the air spring 1223 and the drive member 1225 may be referred to as an active vibration isolation device. Therefore, the second drive system 122 may be referred to as an active vibration isolation device. The active vibration isolation device may be referred to as an active vibration isolation system (AVIS).

[0125] (1-4) Technical Effects of Machining System SYSa The processing system SYSa described above can appropriately process the workpiece W using the processing light EL. Further, the processing system SYSa can appropriately measure the workpiece W using the measurement light ML. In particular, in the first embodiment, since the optical communication is used as the measurement light ML, the measurement accuracy of the workpiece W is improved.

[0126] Furthermore, the processing system SYSa can irradiate the workpiece W with the processing light EL and the measurement light ML via the same optical system (specifically, the common optical system 116). In particular, the processing system SYSa can irradiate the workpiece W with the processing light EL and the measurement light ML via the same galvanometer mirror 1161. Therefore, the processing system SYSa can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W synchronously and / or in conjunction with each other. That is, the processing system SYSa can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in a state where the relative positional relationship between the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W is fixed. Therefore, the accuracy of the alignment of the processing light EL and the measurement light ML by the processing system SYSa is improved. For example, the possibility that the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W are significantly shifted is reduced.

[0127] (2) Machining System SYSb of the Second Embodiment Next, a processing system SYS of a second embodiment (hereinafter, the processing system SYS of the second embodiment is referred to as "processing system SYSb") will be described. The processing system SYSb of the second embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 1b instead of the processing device 1. Other features of the processing system SYSb may be the same as other features of the processing system SYSa. The processing device 1b is different from the processing device 1 in that it includes a processing head 11b instead of the processing head 11. Other features of the processing device 1b may be the same as other features of the processing device 1. Therefore, hereinafter, the processing head 11b of the second embodiment will be described with reference to FIG. 13. FIG. 13 is a cross-sectional view showing an example of the structure of the processing head 11b of the second embodiment. Note that the same components as those already described will be given the same reference numerals and detailed descriptions thereof will be omitted.

[0128] As shown in FIG. 13, the processing head 11b is different from the above-described processing head 11 in that at least one of the processing light source 111 and the measurement light source 113 is disposed outside the housing 117, while both the processing light source 111 and the measurement light source 113 are disposed inside the housing 117. FIG. 13 shows an example in which both the processing light source 111 and the measurement light source 113 are disposed outside the housing 117. Other features of the processing head 11b may be the same as those of the processing head 11.

[0129] In this case, the processing head 11b emits the processing light EL emitted from the processing light source 111 disposed outside the processing head 11b and / or the measurement light ML emitted from the measurement light source 113 disposed outside the processing head 11b toward the workpiece W. Specifically, the processing light EL emitted from the processing light source 111 enters the processing optical system 112 inside the housing 117 from outside the housing 117 through an optical transmission member 1111b such as an optical fiber. Similarly, the measurement light ML emitted from the measurement light source 113 enters the measurement optical system 114 inside the housing 117 from outside the housing 117 through an optical transmission member 1131b such as an optical fiber. In the example shown in FIG. 13, the measurement light ML#1 emitted from the measurement light source 113#1 enters the measurement optical system 114 inside the housing 117 from outside the housing 117 through the optical transmission member 1131b#1, and the measurement light ML#2 emitted from the measurement light source 113#2 enters the measurement optical system 114 inside the housing 117 from outside the housing 117 through the optical transmission member 1131b#2.

[0130] Note that one of the processing light source 111 and the measurement light source 113 may be disposed inside the housing 117 and the other may be disposed outside the housing 117. Also, one of the measurement light sources 113#1 and 113#2 may be disposed inside the housing 117 and the other may be disposed outside the housing 117.

[0131] Such a processing system SYSb of the second embodiment can enjoy the same effects as those that the processing system SYSa of the first embodiment described above can enjoy. Furthermore, in the second embodiment, at least one of the processing light source 111 and the measurement light source 113 does not have to be arranged inside the housing 117 of the processing head 11b. That is, the processing head 11b does not have to include at least one of the processing light source 111 and the measurement light source 113. Therefore, the processing head 11b can be miniaturized and / or lightened.

[0132] (3) Machining System SYSc of the Third Embodiment Subsequently, a processing system SYS of the third embodiment (hereinafter, the processing system SYS of the third embodiment is referred to as "processing system SYSc") will be described. The processing system SYSc of the third embodiment is different from the processing system SYSb of the second embodiment described above in that it includes a processing device 1c instead of the processing device 1b. Other features of the processing system SYSc may be the same as other features of the processing system SYSb. The processing device 1c is different from the processing device 1b in that it includes a processing head 11c instead of the processing head 11b. Other features of the processing device 1c may be the same as other features of the processing device 1b. Therefore, hereinafter, the processing head 11c of the third embodiment will be described with reference to FIG. 14. FIG. 14 is a cross-sectional view showing an example of the structure of the processing head 11c of the third embodiment.

[0133] As shown in FIG. 14, the processing head 11c is different from the above-described processing head 11b in which both the processing optical system 112 and the measurement optical system 114 are arranged inside the housing 117 in that at least a part of the processing optical system 112 and / or the measurement optical system 114 is arranged outside the housing 117. FIG. 14 shows an example in which both the processing optical system 112 and the measurement optical system 114 are arranged outside the housing 117. Furthermore, the processing head 11c is different from the processing head 11b in that it includes a combining optical system 115c instead of the combining optical system 115. Other features of the processing head 11c may be the same as other features of the processing head 11b.

[0134] In this case, the processing head 11c emits the processing light EL emitted from the processing optical system 112 disposed outside the processing head 11c and / or the measurement light ML emitted from the measurement optical system 114 disposed outside the processing head 11c toward the workpiece W. Specifically, the processing light EL emitted from the processing optical system 112 enters the combined optical system 115c inside the housing 117 from outside the housing 117 through an optical transmission member 1111c such as an optical fiber. Similarly, the measurement light ML (specifically, the measurement light ML#2-2) emitted from the measurement optical system 114 enters the combined optical system 115c inside the housing 117 from outside the housing 117 through an optical transmission member 1131c such as an optical fiber.

[0135] The combined optical system 115c is different in that it includes condenser lenses 1152c and 1153c as compared with the combined optical system 115. Other features of the combined optical system 115c may be the same as other features of the combined optical system 115. The processing light EL that has entered the combined optical system 115c through the optical transmission member 1111c enters the beam splitter 1151 through the condenser lens 1152c. The condenser lens 1152c is arranged such that the front focal point of the condenser lens 1152c is located at the end face of the optical transmission member 1111c (specifically, the end face on the combined optical system 115 side). As a result, the condenser lens 1152c converts the diverging processing light EL into parallel light. For this reason, the parallel light-converted processing light EL enters the beam splitter 1151. The measurement light ML#2-2 that has entered the combined optical system 115c through the optical transmission member 1131c enters the beam splitter 1151 through the condenser lens 1153c. The condenser lens 1153c is arranged such that the front focal point of the condenser lens 1153c is located at the end face of the optical transmission member 1131c (specifically, the end face on the combined optical system 115 side). As a result, the condenser lens 1153c converts the diverging measurement light ML#2-2 into parallel light. For this reason, the parallel light-converted measurement light ML#2-2 enters the beam splitter 1151.

[0136] Furthermore, at least a part of the processing optical system 112 may be disposed outside the housing 117 and the measurement optical system 114 may be disposed inside the housing 117. Also, the processing optical system 112 may be disposed inside the housing 117 and at least a part of the measurement optical system 114 may be disposed outside the housing 117. Further, at least a part of the processing optical system 112 may be disposed outside the housing 117 and at least a part of the measurement optical system 114 may be disposed outside the housing 117.

[0137] Such a processing system SYSc according to the third embodiment can enjoy the same effects as those that the processing system SYSb according to the second embodiment described above can enjoy. Further, in the third embodiment, at least a part of the processing optical system 112 and / or the measurement optical system 114 does not have to be disposed inside the housing 117 of the processing head 11c. That is, the processing head 11c does not have to include at least a part of the processing optical system 112 and / or the measurement optical system 114. For this reason, further miniaturization and / or weight reduction of the processing head 11c becomes possible.

[0138] As shown in FIG. 15, which is a cross-sectional view showing another example of the structure of the processing head 11c of the third embodiment, the processing head 11c may include a spatial filter 1181c. The spatial filter 1181c may be, for example, a light shielding plate in which an opening 1182c is formed. The spatial filter 1181c is arranged such that the measurement light ML#2-2 from the optical transmission member 1131c enters the condenser lens 1153c through the opening 1182c, and the measurement light ML#2-3 from the condenser lens 1153c enters the optical transmission member 1131c through the opening 1182c. The size (e.g., diameter) of the opening 1182c of the spatial filter 1181c may be smaller than the size (e.g., diameter) of the core of the optical fiber constituting the optical transmission member 1131c. The surface of the spatial filter 1181c on the synthetic optical system 115 side may have a knife-edge shape, or may have an arbitrary shape. In addition, the surface of the spatial filter 1181c on the optical transmission member 1131c side may have a knife-edge shape. The spatial filter 1181c may be arranged at the end face of the optical transmission member 1131c (specifically, the end face on the synthetic optical system 115 side). In this case, since the front focal point of the condenser lens 1153c is located at the end face of the optical transmission member 1131c, the spatial filter 1181c may be arranged at the front focal point position of the condenser lens 1153c. In this case, the rear focal point position of the condenser lens 1153c may coincide with the front focal point position of the fθ lens 1162. The spatial filter 1181c may be arranged at a position optically conjugate to the surface of the workpiece W. When the spatial filter 1181c is arranged in this way, stray light (noise light) traveling toward the measurement optical system 114 after being generated on at least one optical surface of the fθ lens 1162, the beam splitter 1151, and the condenser lens 1153c can be reduced. In addition, when there is a position optically conjugate to the surface of the workpiece W (i.e., an intermediate imaging point) between the end face of the optical transmission member 1131c and the workpiece W, the spatial filter 1181c may be arranged at a position optically conjugate to the surface of the workpiece W between the end face of the optical transmission member 1131c and the workpiece W. The spatial filter 1181c may be arranged at a position that performs an optical Fourier transform on the workpiece W (typically, the entrance pupil position and / or the exit pupil position of the fθ lens 1162).However, the spatial filter 1181c may be disposed at a position different from the position optically conjugate to the surface of the workpiece W and the pupil position. Alternatively, the core itself of the optical fiber constituting the optical transmission member 1131c may be used as the spatial filter 1181c. That is, the core itself of the optical fiber constituting the optical transmission member 1131c may function as the spatial filter 1181c.

[0139] As shown in FIG. 16, which is a cross-sectional view showing another example of the structure of the processing head 11c of the third embodiment, when the wavelength of the processing light EL is different from the wavelength of the measurement light ML, the processing head 11c may include a dichroic filter 1183c. The dichroic filter 1183c is a filter that reflects light having the wavelength of the processing light EL and transmits light having the wavelength of the measurement light ML. The dichroic filter 1183c may be a transmissive filter or a reflective filter. The dichroic filter 1183c may be disposed on the optical path of the measurement light ML#2-2 between the end face of the optical transmission member 1131c (specifically, the end face on the synthetic optical system 115 side) and the beam splitter 1151. The dichroic filter 1183c may be disposed at a position where the measurement light ML#2-2 becomes a parallel light beam between the end face of the optical transmission member 1131c and the beam splitter 1151 (specifically, on the optical path of the measurement light ML#2-2 between the condenser lens 1153c and the polarization separation surface of the beam splitter 1151). Also in this case, stray light (noise light) traveling toward the measurement optical system 114 after being generated on at least one optical surface of the fθ lens 1162 and the beam splitter 1151 can be reduced.

[0140] Alternatively, as described above, the combined optical system 115 may include a dichroic mirror instead of the beam splitter 1151. When the polarization direction of the processing light EL is p-polarized with respect to the dichroic surface of the dichroic mirror and the polarization direction of the measurement light ML#2-2 is s-polarized with respect to the dichroic surface of the dichroic mirror in the situation where the combined optical system 115 includes a dichroic mirror, the processing head 11c may include a polarization filter instead of the dichroic filter 1183c. The polarization filter is a filter that blocks or reflects light in the polarization direction of the processing light EL and transmits light in the polarization direction of the measurement light ML#2-2. The polarization filter may be a transmissive filter or a reflective filter. The polarization filter may be disposed at the same position as the position where the dichroic filter 1183c is disposed. Also in this case, stray light (noise light) traveling toward the measurement optical system 114 after being generated on at least one optical surface of the fθ lens 1162 and the beam splitter 1151 can be reduced.

[0141] Alternatively, the processing head 11c may include an optical isolator instead of the dichroic filter 1183c and the polarization filter. The optical isolator may be a polarization-dependent optical isolator or a polarization-independent optical isolator. The optical isolator may be disposed at the same position as or in the vicinity of the position where the dichroic filter 1183c is disposed. Also in this case, stray light (noise light) traveling toward the measurement optical system 114 after being generated on at least one optical surface of the fθ lens 1162 and the beam splitter 1151 can be reduced.

[0142] As shown in FIG. 17, which is a cross-sectional view showing another example of the structure of the processing head 11c of the third embodiment, the processing head 11c may include a wave plate 1184c. The wave plate 1184c is rotatable around its optical axis or around an axis parallel to its optical axis. The wave plate 1184c may be disposed on the optical path of the measurement light ML#2-2 between the condenser lens 1153c and the polarization separation surface of the beam splitter 1151. The processing head 11c may include a single wave plate 1184c or a plurality of wave plates 1184c. When the processing head 11c includes a plurality of wave plates 1184c, the plurality of wave plates 1184c may include at least one 1 / 2 wave plate 1184c and at least one 1 / 4 wave plate 1184c. In this case, the ellipticity, which is one of the polarization states of the measurement light ML#2-2, may be adjusted by rotation around the axis of the 1 / 4 wave plate 1184c. The polarization direction, which is one of the polarization states of the measurement light ML#2-2, may be adjusted by rotation around the axis of the 1 / 2 wave plate 1184c.

[0143] As shown in FIG. 18, which is a cross-sectional view showing another example of the structure of the processing head 11c according to the third embodiment, the optical transmission member 1131c may include a plurality of cores through which at least a part of the measurement light ML#2-2 and / or the measurement light ML#2-3 can propagate. The plurality of cores are arranged in a plane that crosses the traveling direction of the measurement light ML#2-2 and / or the measurement light ML#2-3. In order to include a plurality of cores, the optical transmission member 1131c may include an optical fiber bundle in which a plurality of optical fibers are bundled. Here, the optical fiber bundle in which a plurality of optical fibers are bundled may be a bundle fiber (so-called image fiber) in which a plurality of optical fibers are bundled so as to maintain the same positional relationship at both ends thereof. In order to include a plurality of cores, the optical transmission member 1131c may include an image fiber in which a plurality of cores and a cladding are integrated (that is, an image fiber having a plurality of cores and a cladding between the plurality of cores). The image fiber may be an optical transmission member in which the arrangement of the cores at the incident end is the same as the arrangement of the cores at the emission end (the positional relationship between the cores at the incident end and the cores at the emission end is the same), and the light quantity distribution at the incident end can be transmitted to the emission end. When the optical transmission member 1131c includes a plurality of cores, the detector 1146 may be a detector in which a plurality of photoelectric conversion elements 11461 are arranged along at least one direction. For example, as shown in FIG. 18, the detector 1146 may be a detector in which a plurality of photoelectric conversion elements 11461 are arranged in one direction (that is, the plurality of photoelectric conversion elements 11461 are arranged linearly). The detector 1146 may be a detector in which a plurality of photoelectric conversion elements 11461 are arranged in two directions (that is, the plurality of photoelectric conversion elements 11461 are arranged two-dimensionally). Further, the processing head 11c may include an optical system 1184c for making the end face of the optical transmission member 1131c (specifically, the end face on the detector 1146 side) and the detection surface of the detector 1146 (that is, the surface on which the plurality of photoelectric conversion elements 11461 are arranged) optically conjugate surfaces. In the example shown in FIG. 18, the optical system 1184c is arranged between the optical transmission member 1131c and the beam splitter 1144, but the arrangement position of the optical system 1184c is not limited to this example.When the machining head 11c has the structure shown in FIG. 18, the surface of the workpiece W can be measured, and as a result, the throughput regarding the measurement of the workpiece W is improved.

[0144] In addition, it can also be said that the machining system SYSc including the machining head 11c shown in FIG. 18 includes a measuring device (in other words, a measuring apparatus) that measures the workpiece W using the measuring light ML. Specifically, it can also be said that the machining head 11c includes a measuring device (in other words, a measuring apparatus) including a measuring light source 112, a measuring optical system 114 (particularly, a mirror 1145 and a detector 1146), an optical transmission member 1131c, a common optical system 116 (particularly, an fθ lens 1162), and a control device 5.

[0145] In the processing head 11c shown in FIGS. 14 to 18, the refractive surface of the optical member located on the optical path of the measurement light ML#2-2 and / or ML#2-3 may be arranged to be inclined with respect to the plane orthogonal to the optical axis. For example, in the optical path of the measurement light ML#2-2 and / or ML#2-3, the refractive surface of the polarization beam splitter 1151 may be arranged to be inclined with respect to the plane orthogonal to the optical axis of the optical system (in this case, the combined optical system 115c) including the polarization beam splitter 1151. The refractive surface of the polarization beam splitter 1151 may include, for example, at least one of the optical surface of the polarization beam splitter 1151 where the measurement light ML#2-2 is incident and the measurement light ML#2-3 is emitted (the +X side optical surface in FIG. 14) and the optical surface of the polarization beam splitter 1151 where the measurement light ML#2-2 is emitted and the measurement light ML#2-3 is incident (the -Z side optical surface in FIG. 14). Also, in the processing head 11c shown in FIG. 16, in the optical path of the measurement light ML#2-2 and / or ML#2-3, the refractive surface of the dichroic mirror 1183c (or a polarization filter or an optical isolator, the same in the following paragraphs) may be arranged to be inclined with respect to the plane orthogonal to the optical axis of the optical system (for example, the combined optical system 115c) including the dichroic mirror 1183c. The refractive surface of the dichroic mirror 1183c includes, for example, at least one of the optical surface of the dichroic mirror 1183c where the measurement light ML#2-2 is incident and the measurement light ML#2-3 is emitted (the +X side optical surface in FIG. 16) and the optical surface of the dichroic mirror 1183c where the measurement light ML#2-2 is emitted and the measurement light ML#2-3 is incident (the -X side optical surface in FIG. 16). Also in this case, stray light (noise light) that travels toward the measurement optical system 114 after being generated on at least one of the optical surfaces of the fθ lens 1162 and the beam splitter 1151 can be reduced. Although not shown to avoid duplication of explanation, in the processing head 11c shown in FIGS. 14 to 18, the refractive surface of the optical member located on the optical path of the processing light EL may be arranged to be inclined with respect to the plane orthogonal to the optical axis.

[0146] In the processing head 11c shown in FIGS. 14 to 18, at least one of the plurality of lenses constituting the fθ lens 1162 may be arranged such that the optical axis of the at least one lens is inclined with respect to the optical axis of the fθ lens 1162. At least one of the plurality of lenses constituting the fθ lens 1162 may be arranged such that the optical axis of the at least one lens is separated from (i.e., eccentric to) the optical axis of the fθ lens 1162. Also in this case, stray light (noise light) that travels toward the measurement optical system 114 after being generated on the optical surface of the fθ lens 1162 can be reduced.

[0147] In the processing head 11c shown in FIGS. 14 to 18, the common optical system 116 may include an achromatic lens that has been corrected for chromatic aberration with respect to the wavelength of the measurement light ML and the wavelength of the processing light EL, as the fθ lens 1162. In the processing head 11c shown in FIGS. 14 to 18, the focal length of the condenser lens 1152c and the focal length of the condenser lens 1153c may be different. As an example, when the wavelength of the measurement light ML is shorter than the wavelength of the processing light EL, the focal length of the condenser lens 1153c may be longer than the focal length of the condenser lens 1152c. However, the focal length of the condenser lens 1152c and the focal length of the condenser lens 1153c may be the same. In the processing head 11c shown in FIGS. 14 to 18, with respect to the wavelength of the measurement light ML, the optical system including the fθ lens 1162 and the condenser lens 1153c may be configured such that the surface of the workpiece W and the end face of the optical transmission member 1131c (specifically, the end face on the side of the combined optical system 115) are in an optically conjugate positional relationship. In the processing head 11c shown in FIGS. 14 to 18, with respect to the wavelength of the processing light EL, the optical system including the fθ lens 1162 and the condenser lens 1152c may be configured such that the surface of the workpiece W and the end face of the optical transmission member 1111c (specifically, the end face on the side of the combined optical system 115) are in an optically conjugate positional relationship. In the processing head 11c shown in FIGS. 14 to 18, at least one of the condenser lenses 1152c and 1153c may be a zoom optical system. When the condenser lens 1152c is a zoom optical system, the focus position of the processing light EL can be adjusted independently of the focus position of the measurement light ML by the condenser lens 1152c. When the condenser lens 1153c is a zoom optical system, the focus position of the measurement light ML can be adjusted independently of the focus position of the processing light EL by the condenser lens 1153c.

[0148] (4) Machining System SYSd of the Fourth Embodiment Next, a processing system SYS of the fourth embodiment (hereinafter, the processing system SYS of the fourth embodiment is referred to as "processing system SYSd") will be described. The processing system SYSd of the fourth embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 1d instead of the processing device 1. Other features of the processing system SYSd may be the same as other features of the processing system SYSa. The processing device 1d is different from the processing device 1 in that it includes a processing head 11d instead of the processing head 11. Other features of the processing device 1d may be the same as other features of the processing device 1. Therefore, hereinafter, with reference to FIG. 19, the processing head 11d of the fourth embodiment will be described. FIG. 19 is a cross-sectional view showing an example of the structure of the processing head 11d of the fourth embodiment.

[0149] As shown in FIG. 19, the processing head 11d is different from the processing head 11 in that it includes a measurement optical system 114d instead of the measurement optical system 114. Other features of the processing head 11d may be the same as other features of the processing head 11.

[0150] The measurement optical system 114d is different from the measurement optical system 114 in that it emits a plurality of measurement lights ML. In order to emit a plurality of measurement lights ML, the measurement optical system 114d is different from the measurement optical system 114 in that it includes a beam splitter 1147d and an X-scanning mirror 1148dX instead of the mirror 1147. Other features of the measurement optical system 114d may be the same as other features of the measurement optical system 114.

[0151] In the fourth embodiment, the measurement light ML#2-2 emitted from the beam splitter 1144 enters the beam splitter 1147d. The beam splitter 1147d emits a part of the measurement light ML#2-2 incident on the beam splitter 1147d, i.e., the measurement light ML#2-21, toward the combining optical system 115. The measurement light ML#2-21 is irradiated onto the workpiece W via the combining optical system 115 and the common optical system 116. Therefore, the measurement light ML#2-21 of the fourth embodiment is irradiated onto the workpiece W through the same optical path as the measurement light #2-2 of the first embodiment.

[0152] At least a part of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-21 (for example, at least a part of the above-described reflected light, scattered light, diffracted light, and / or transmitted light, hereinafter referred to as "measurement light ML#2-31") enters the common optical system 116. The measurement light ML#2-31 incident on the common optical system 116 enters the combining optical system 115 via the fθ lens 1162 and the galvanometer mirror 1161. The beam splitter 1151 of the combining optical system 115 emits the measurement light ML#2-31 incident on the beam splitter 1151 toward the measurement optical system 114. The measurement light ML#2-31 incident on the measurement optical system 114 from the combining optical system 115 enters the detector 1146 via the beam splitter 1147d, the beam splitter 1144, and the beam splitter 1142. Therefore, the measurement light ML#2-31 of the fourth embodiment enters the detector 1146 through the same optical path as the measurement light #2-3 of the first embodiment. Therefore, the detector 1146 detects the interference light between the measurement light ML#1-3 and the measurement light ML#2-31.

[0153] On the other hand, the beam splitter 1147d emits a part of the measurement light ML#2-22, which is another part of the measurement light ML#2-2 incident on the beam splitter 1147d, toward the X-scanning mirror 1148dX. The X-scanning mirror 1148dX changes the irradiation position of the measurement light ML#2-22 on the workpiece W by deflecting the measurement light ML#2-22. Specifically, the X-scanning mirror 1148dX swings or rotates so as to change the irradiation position of the measurement light ML#2-22 along the X-axis direction on the workpiece W (that is, changes the angle of the X-scanning mirror 1148dX with respect to the optical path of the measurement light ML#2-22) to deflect the measurement light ML#2-22.

[0154] The measurement light ML#2-22 emitted from the X-scanning mirror 1148dX is incident on the Y-scanning mirror 1161Y of the common optical system 116. The Y-scanning mirror 1161Y deflects the measurement light ML#2-22 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-22 along the Y-axis direction on the workpiece W (that is, changes the angle of the Y-scanning mirror 1161Y with respect to the optical path of the measurement light ML#2-22). The measurement light ML#2-22 emitted from the Y-scanning mirror 1161Y is irradiated onto the workpiece W through the fθ lens 1162. As a result, the common optical system 116 emits a plurality of measurement lights ML (in the example shown in FIG. 19, two measurement lights ML#2-21 and ML#2-22) toward the workpiece W.

[0155] The common optical system 116 may emit a plurality of measurement lights ML toward different positions on the work W. That is, the common optical system 116 may emit a plurality of measurement lights ML such that the irradiation position of the measurement light ML#2-21 on the work W is different from the irradiation position of the measurement light ML#2-22 on the work W. The common optical system 116 may emit a plurality of measurement lights ML such that the position of the irradiated region MA#1 irradiated with the measurement light ML#2-21 is different from the position of the irradiated region MA#2 irradiated with the measurement light ML#2-22. Typically, an X-scanning mirror 1161X capable of changing the irradiation position of the measurement light ML#2-21 independently of the irradiation position of the measurement light ML#2-22 and an X-scanning mirror 1148dX capable of changing the irradiation position of the measurement light ML#2-22 independently of the irradiation position of the measurement light ML#2-21 may deflect the measurement lights ML#2-21 and ML#2-22, respectively, so that the common optical system 116 emits the measurement lights ML#2-21 and ML#2-22 toward different positions on the work W.

[0156] At least a part of the light emitted from the work W due to the irradiation of the measurement light ML#2-22 (for example, at least a part of the reflected light, scattered light, diffracted light, and / or transmitted light described above, hereinafter referred to as this light as "measurement light ML#2-32") enters the common optical system 116. The measurement light ML#2-32 that has entered the common optical system 116 enters the X-scanning mirror 1148dX via the fθ lens 1162 and the Y-scanning mirror 1161Y. The measurement light ML#2-32 that has entered the X-scanning mirror 1148dX enters the detector 1146 via the X-scanning mirror 1148dX, the beam splitter 1147d, the beam splitter 1144, and the beam splitter 1142. Therefore, the detector 1146 detects the interference light between the measurement light ML#1-3 and the measurement light ML#2-32.

[0157] Further, the measurement light ML#2-22 does not necessarily need to be incident on the Y scanning mirror 1161Y of the common optical system 116. In this case, another Y scanning mirror (not shown) that is arranged in the optical path of the measurement light ML#2-22 near the Y scanning mirror 1161Y and swings or rotates so as to change the irradiation position along the Y-axis direction of the measurement light ML#2-22 on the work W may be provided. This another Y scanning mirror may change the angle of the another Y scanning mirror with respect to the optical path of the measurement light ML#2-22. At this time, the measurement light ML#2-21 may not be present. That is, in the fourth embodiment, the common optical system 116 is not essential.

[0158] The control device 5 calculates the state of the work W based on the detection results of the detector 1143 and the detector 1146. Here, as described above, in the fourth embodiment, the detector 1146 detects a plurality of interference lights. The control device 5 may use the detection results of the plurality of interference lights for different uses respectively. For example, the control device 5 may use the detection result of the first interference light (for example, the interference light between the measurement light ML#1-3 and the measurement light ML#2-31) for the first use. That is, the control device 5 may calculate the state of the work W used for the first use based on the detection result of the first interference light. In this case, the measurement light ML#2-21 corresponds to the measurement light ML used for the first use. Further, for example, the control device 5 may use the detection result of the detection result of the second interference light (for example, the interference light between the measurement light ML#1-3 and the measurement light ML#2-32) for the second use. That is, the control device 5 may calculate the state of the work W used for the second use different from the first use based on the detection result of the second interference light.

[0159] As an example of the first use, there is a use of specifying the shape of the work W. As an example of the second use, there is a use of specifying the position of the work W (particularly, the relative position of the work W with respect to the processing head 11). Information regarding the position of the work W is mainly used for controlling the position of the processing head 11 with respect to the work W, the irradiation position of the processing light EL on the work W, and / or the irradiation position of the measurement light ML on the work W. For this reason, as an example of the second use, there is a use of controlling the position of the processing head 11 with respect to the work W, the irradiation position of the processing light EL on the work W, and / or the irradiation position of the measurement light ML on the work W based on the position of the work W (particularly, the relative position of the work W with respect to the processing head 11). In this case, the control device 5 may specify the shape of the work W based on the detection result of the first interference light (for example, the interference light between the measurement light ML#1-3 and the measurement light ML#2-31). Further, the control device 5, based on the detection result of the second interference light (for example, the interference light between the measurement light ML#1-3 and the measurement light ML#2-32), may control the position of the processing head 11 with respect to the work W, the irradiation position of the processing light EL on the work W, and / or the irradiation position of the measurement light ML on the work W so that the processing light EL and / or the measurement light ML is irradiated to the desired position of the work W whose shape has been specified.

[0160] Such a processing system SYSd of the fourth embodiment can enjoy the same effects as those that the processing system SYSa of the first embodiment described above can enjoy. Further, the processing system SYSd of the fourth embodiment can irradiate the work W with a plurality of measurement lights ML having different uses. For this reason, the processing system SYSd can appropriately process the work W based on the detection results of the plurality of measurement lights ML (that is, the detection results of the plurality of interference lights).

[0161] Furthermore, the measurement optical system 114d may include a mirror that is insertable into and removable from the optical path of the measurement light ML#2-2 instead of the beam splitter 1147d. In a state where this mirror is inserted (i.e., disposed) in the optical path of the measurement light ML#2-2, the mirror may reflect the measurement light ML#2-2 toward the synthesis optical system 115. On the other hand, in a state where the mirror is out of the optical path of the measurement light ML#2-2, it does not affect the optical path of the measurement light ML#2-2. In this case, the X-scanning mirror 1148dX may be disposed such that the measurement light ML#2-2 from the beam splitter 1144 is incident on the X-scanning mirror 1148dX.

[0162] Also, in the above description, the measurement optical system 114d includes the X-scanning mirror 1148dX. This is because in the galvanometer mirror 1161, the Y-scanning mirror 1161Y is disposed closer to the workpiece W than the X-scanning mirror 1161X, and the measurement light ML#2-22 emitted from the X-scanning mirror 1148dX is incident on the Y-scanning mirror 1161Y of the galvanometer mirror 1161. However, when the X-scanning mirror 1161X is disposed closer to the workpiece W than the Y-scanning mirror 1161Y in the galvanometer mirror 1161, the measurement optical system 114d may include a Y-scanning mirror in addition to or instead of the X-scanning mirror 1148dX. The Y-scanning mirror of the measurement optical system 114d deflects the measurement light ML#2-22 by swinging or rotating (i.e., changing the angle of the Y-scanning mirror with respect to the optical path of the measurement light ML#2-22) so as to change the irradiation position of the measurement light ML#2-22 along the Y-axis direction on the workpiece W. Further, the measurement light ML#2-22 emitted from the Y-scanning mirror of the measurement optical system 114d may be incident on the X-scanning mirror 1161X of the galvanometer mirror 1161.

[0163] Also, in the fourth embodiment, the constituent elements described in at least one of the second to third embodiments described above may be adopted. The constituent elements described in the second embodiment include the constituent elements related to the arrangement outside the housing 117 of at least one of the processing light source 111 and the measurement light source 113. The constituent elements described in the third embodiment include the constituent elements related to the arrangement outside the housing 117 of at least one of the processing optical system 112 and the measurement optical system 114.

[0164] (5) Machining System SYSe of the Fifth Embodiment Subsequently, the processing system SYS of the fifth embodiment (hereinafter, the processing system SYS of the fifth embodiment is referred to as "processing system SYSe") will be described. The processing system SYSe of the fifth embodiment is different in that, compared with the processing system SYSa of the first embodiment described above, it includes a processing device 1e instead of the processing device 1. Other features of the processing system SYSe may be the same as other features of the processing system SYSa. The processing device 1e is different in that, compared with the processing device 1, it includes a processing head 11e instead of the processing head 11. Other features of the processing device 1e may be the same as other features of the processing device 1. Therefore, hereinafter, with reference to FIG. 20, the processing head 11e of the fifth embodiment will be described. FIG. 20 is a cross-sectional view showing an example of the structure of the processing head 11e of the fifth embodiment.

[0165] As shown in FIG. 20, the processing head 11e is different in that, compared with the processing head 1, it includes a measurement optical system 114e instead of the measurement optical system 114. Other features of the processing head 11e may be the same as other features of the processing head 1.

[0166] The measurement optical system 114e is different in that, compared with the measurement optical system 114, it includes a galvanometer mirror 1148e. Other features of the measurement optical system 114e may be the same as other features of the measurement optical system 114.

[0167] In the fourth embodiment, the measurement light ML#2-2 emitted from the beam splitter 1144 (that is, the measurement light ML#2-2 emitted through the mirror 1147) enters the galvanometer mirror 1148e. The galvanometer mirror 1148e changes the irradiation position of the measurement light ML#2-2 on the workpiece W by deflecting the measurement light ML#2-2 (that is, changing the emission angle). For example, the galvanometer mirror 1148e includes an X-scanning mirror 1148eX and a Y-scanning mirror 1148eY. Each of the X-scanning mirror 1148eX and the Y-scanning mirror 1148eY is a tilt angle variable mirror whose angle with respect to the optical path of the measurement light ML#2-2 incident on the galvanometer mirror 1148e is changed. The X-scanning mirror 1148eX deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 along the X-axis direction on the workpiece W (that is, changing the angle of the X-scanning mirror 1148eX with respect to the optical path of the measurement light ML#2-2). The Y-scanning mirror 1148eY deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 along the Y-axis direction on the workpiece W (that is, changing the angle of the Y-scanning mirror 1148eY with respect to the optical path of the measurement light ML#2-2).

[0168] The galvanometer mirror 1148e emits the deflected measurement light ML#2-2 toward the combining optical system 115. The measurement light ML#2-2 is irradiated onto the workpiece W through the combining optical system 115 and the common optical system 116. Further, the measurement light ML#2-3, which is at least a part of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2, enters the galvanometer mirror 1148e of the measurement optical system 114e through the common optical system 116 and the combining optical system 115. The measurement light ML#2-3 incident on the galvanometer mirror 1148e enters the detector 1146 through the galvanometer mirror 1148e, the mirror 1147, the beam splitter 1144, and the beam splitter 1142.

[0169] Further, the measurement optical system 114e may include a position adjustment optical system (not shown) instead of / in addition to the galvanometer mirror 1148e. This position adjustment optical system may have a parallel plate that can be tilted with respect to the traveling direction of the measurement light ML2-2 in order to set the position of the measurement light ML2-2 from the measurement optical system 114e to an arbitrary position in a plane orthogonal to the optical path of the measurement light ML2-2.

[0170] Such a processing system SYSe of the fifth embodiment can enjoy the same effects as those that the processing system SYSa of the first embodiment described above can enjoy. Further, the processing system SYSe of the fifth embodiment includes a galvanometer mirror 1148e that can deflect the measurement light ML#2-2 without deflecting the processing light EL. Therefore, the processing system SYSe can move the irradiation position of the measurement light ML#2-2 on the workpiece W with respect to the irradiation position of the processing light EL on the workpiece W. The processing system SYSe can move the irradiated area MA irradiated with the measurement light ML#2-2 with respect to the irradiated area EA irradiated with the processing light EL. In this way, the processing system SYSe can independently change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W. The processing system SYSe can independently change the position of the irradiated area EA and the position of the irradiated area MA.

[0171] Further, also in the fifth embodiment, the constituent elements described in at least one of the second to fourth embodiments described above may be adopted. The constituent elements described in the fourth embodiment include constituent elements related to the emission of a plurality of measurement lights ML.

[0172] (6) Machining System SYSf of the Sixth Embodiment Next, a processing system SYS of the sixth embodiment (hereinafter, the processing system SYS of the sixth embodiment is referred to as "processing system SYSf") will be described. The processing system SYSf of the sixth embodiment is different in that it includes a processing device 1f instead of the processing device 1 as compared with the processing system SYSa of the first embodiment described above. Other features of the processing system SYSf may be the same as other features of the processing system SYSa. The processing device 1f is different in that it includes a processing head 11f instead of the processing head 11 as compared with the processing device 1. Other features of the processing device 1f may be the same as other features of the processing device 1. The processing head 11f is different in that the common optical system 116 is detachable from the processing head 11f as compared with the processing head 11. The processing head 11f is different in that the common optical system 116 is replaceable as compared with the processing head 11. Other features of the processing head 11f may be the same as other features of the processing head 11.

[0173] One optical system candidate 118f selected from a plurality of different optical system candidates 118f each of which can be used as the common optical system 116 may be attached to the processing head 11f. For example, one optical system 118f selected according to the processing content of the processing system SYSf may be attached to the processing head 11f from among a plurality of different optical system candidates 118f.

[0174] For example, the plurality of optical system candidates 118f may include at least two optical system candidates 118f in which the emission directions of the processing light EL and / or the measurement light ML with respect to the optical axis of the optical system candidate 118f (particularly, the optical axis on the incident side of the processing light EL and / or the measurement light ML) are different. In this case, one optical system 118f capable of emitting the processing light EL and / or the measurement light ML in an emission direction suitable for the processing content of the processing system SYSf may be attached to the processing head 11f from among the plurality of optical system candidates 118f.

[0175] For example, the plurality of optical system candidates 118f may include at least two optical system candidates 118f having different distances from the position where the combined optical system 115 emits the processing light EL and / or the measurement light ML to the position where the optical system candidate 118 emits the processing light EL and / or the measurement light ML. In this case, on the processing head 11f, one optical system 118f may be attached from among the plurality of optical system candidates 118f, the distance from the position where the combined optical system 115 emits the processing light EL and / or the measurement light ML to the position where the optical system candidate 118 emits the processing light EL and / or the measurement light ML being a distance suitable for the processing content of the processing system SYSf.

[0176] For example, the plurality of optical system candidates 118f may include at least two optical system candidates 118f having different distances from the position where the processing optical system 112 emits the processing light EL to the position where the optical system candidate 118 emits the processing light EL (that is, the distance from the processing optical system 112 to the position where the optical system candidate 118 emits the processing light EL). In this case, on the processing head 11f, one optical system 118f may be attached from among the plurality of optical system candidates 118f, the distance from the position where the processing optical system 112 emits the processing light EL to the position where the optical system candidate 118 emits the processing light EL being a distance suitable for the processing content of the processing system SYSf.

[0177] For example, the plurality of optical system candidates 118f may include at least two optical system candidates 118f having different distances from the position where the measurement optical system 114 emits the measurement light ML to the position where the optical system candidate 118 emits the measurement light ML (that is, the distance from the measurement optical system 114 to the position where the optical system candidate 118 emits the processing light EL). In this case, on the processing head 11f, one optical system 118f may be attached from among the plurality of optical system candidates 118f, the distance from the position where the measurement optical system 114 emits the measurement light ML to the position where the optical system candidate 118 emits the measurement light ML being a distance suitable for the processing content of the processing system SYSf.

[0178] For example, the plurality of optical system candidates 118f may include at least two optical system candidates 118f with different distances from the position where the processing light EL and / or the measurement light ML enters the optical system candidate 118f to the position where the processing light EL and / or the measurement light ML exits the optical system candidate 118f (that is, the distance from the incident surface of the optical system candidate 118f to the exit surface of the optical system candidate 118f). In this case, the processing head 11f may be attached with one optical system 118f whose distance from the position where the processing light EL and / or the measurement light ML enters the optical system candidate 118f to the position where the processing light EL and / or the measurement light ML exits the optical system candidate 118f is a distance suitable for the processing content of the processing system SYSf.

[0179] Hereinafter, an example of the optical system candidate 118f will be described with reference to FIGS. 21 to 23.

[0180] FIG. 21 is a cross-sectional view showing a processing head 11f to which a first optical system candidate 118f#1 is attached as a common optical system 116. As shown in FIG. 21, the first optical system candidate 118f#1 is an optical system including a galvanometer mirror 1161 and an fθ lens 1162. That is, the first optical system candidate 118f#1 is the same as the common optical system 116 of the first embodiment described with reference to FIG. 3 and the like. The first optical system candidate 118f#1 can function as a common optical system 116 that can emit the processing light EL and / or the measurement light ML along the optical axis on the incident side of the first optical system candidate 118f#1. Since the optical axis on the incident side of the first optical system candidate 118f#1 is parallel to the Z axis, the first optical system candidate 118f#1 can function as a common optical system 116 that can emit the processing light EL and / or the measurement light ML along the Z axis direction. Such a first optical system candidate 118f#1 may be selected as the common optical system 116 to be attached to the processing head 11f, for example, when the processing system SYSf processes a surface of the workpiece W that intersects the Z axis.

[0181] FIG. 22 is a cross-sectional view showing a processing head 11f in which a second optical system candidate 118f#2 is attached as a common optical system 116. As shown in FIG. 22, the second optical system candidate 118f#2 includes a housing 1161f#2, an actuator 1162f#2, a condenser lens 1163f#2, and a scanning mirror 1164f#2. The housing 1161f#2 is a cylindrical housing in which a space 1165f#2 extending along the Z-axis direction is formed inside. The actuator 1162f#2 operates to rotate the housing 1161f#2 around the Z-axis. In the space 1165f#2 of the housing 1161f#2, a condenser lens 1163f#2 and a scanning mirror 1164f#2 are arranged. The processing light EL and / or the measurement light ML emitted from the synthetic optical system 115 enters the space 1165f#2 through an opening 1166f#2 formed in the upper part of the housing 1161f#2. The processing light EL and / or the measurement light ML that has entered the space 1165f#2 enters the scanning mirror 1164f#2 through the condenser lens 1163f#2. The scanning mirror 1164f#2 reflects the processing light EL and / or the measurement light ML propagating in the Z-axis direction toward a direction intersecting the Z-axis. Since the optical axis on the incident side of the second optical system candidate 118f#2 is parallel to the Z-axis, the second optical system candidate 118f#2 can function as a common optical system 116 capable of emitting the processing light EL and / or the measurement light ML along a direction intersecting the optical axis on the incident side of the second optical system candidate 118f#2. At this time, the scanning mirror 1164f#2 swings or rotates so as to change the emission direction of the processing light EL and / or the measurement light ML from the second optical system candidate 118f#2 along the X-axis or the Y-axis. The processing light EL and / or the measurement light ML emitted from the scanning mirror 1164f#2 is emitted to the outside of the second optical system candidate 118f#2 through an opening 1167f#2 formed in the side surface of the housing 1161f#2. Here, due to the rotation of the housing 1161f#2 around the Z-axis by the actuator 1162f#2, the emission direction of the processing light EL and / or the measurement light ML from the second optical system candidate 118f#2 is changed around the Z-axis.Such a second optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the processing head 11f, for example, when the processing system SYSf processes the surface along the Z-axis of the surface of the work W. The second optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the processing head 11f, for example, when the processing system SYSf processes the work W so as to form a cylindrical depression in the work W. The second optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the processing head 11f, for example, when the work W is processed so as to form a structure surrounding the common optical system 116.

[0182] FIG. 23 is a cross-sectional view showing a processing head 11f in which a third optical system candidate 118f#3 is attached as a common optical system 116. As shown in FIG. 23, the third optical system candidate 118f#3 includes a housing 1161f#3, a condenser lens 1162f#3, and a galvanometer mirror 1163f#3. The housing 1161f#3 is a cylindrical housing in which a space 1164f#3 extending along the Z-axis direction is formed inside. In the space 1164f#3 of the housing 1161f#3, a condenser lens 1162f#3 and a galvanometer mirror 1163f#3 are arranged. The processing light EL and / or the measurement light ML emitted from the synthetic optical system 115 enters the space 1164f#3 through an opening 1165f#3 formed in the upper part of the housing 1161f#3. The processing light EL and / or the measurement light ML that has entered the space 1164f#3 enters the galvanometer mirror 1163f#3 through the condenser lens 1162f#3. The galvanometer mirror 1163f#3 reflects the processing light EL and / or the measurement light ML that has propagated in the Z-axis direction in a direction intersecting the Z-axis. Since the optical axis on the incident side of the third optical system candidate 118f#3 is parallel to the Z-axis, the third optical system candidate 118f#3 can function as a common optical system 116 that can emit the processing light EL and / or the measurement light ML along a direction intersecting the optical axis on the incident side of the third optical system candidate 118f#3. At this time, the galvanometer mirror 1163f#3 swings or rotates so as to change the emission direction of the processing light EL and / or the measurement light ML from the second optical system candidate 118f#2 along each of the X-axis and Y-axis directions. Specifically, the galvanometer mirror 1163f#3 includes an X-scanning mirror 1163fX#3 that swings or rotates so as to change the emission direction of the processing light EL and / or the measurement light ML from the second optical system candidate 118f#2 along the X-axis direction, and a Y-scanning mirror 1163fY#3 that swings or rotates so as to change the emission direction of the processing light EL and / or the measurement light ML from the second optical system candidate 118f#2 along the Y-axis direction. The processing light EL and / or the measurement light ML emitted from the galvanometer mirror 1163f#3 is emitted to the outside of the third optical system candidate 118f#3 through an opening 1166f#3 formed in the side surface of the housing 1161f#3.Such a third optical system candidate 118f#3 may be selected as the common optical system 116 to be attached to the processing head 11f when, for example, the processing system SYSf processes the surface of the work W along the Z axis. The third optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the processing head 11f when, for example, the processing system SYSf processes the work W to form a slit (i.e., a slit-shaped depression or groove) extending in the X-axis direction or the Y-axis direction on the work W.

[0183] In the sixth embodiment, the common optical system 116 is made replaceable, but only the fθ lens 1162 may be made replaceable. For example, at least a part of the common optical system 116 may be disposed between the beam splitter 1151 and the condenser lens 1163f#2, and at least a part of the common optical system 116 may be disposed between the beam splitter 1151 and the condenser lens 1162f#3. At this time, the common optical system 116 may include a scanning mirror having a scanning direction different from the scanning direction by the galvanometer mirror 1164f#2 and the galvanometer mirror 1163f#3. Here, the scanning direction may be the direction in which the processing light and / or the measurement light moves on the work W.

[0184] Such a processing system SYSf of the sixth embodiment can enjoy the same effects as those that the processing system SYSa of the first embodiment described above can enjoy. Furthermore, the processing system SYSf of the sixth embodiment can process the work W using the common optical system 116 suitable for the processing content of the processing system SYSf. Therefore, the work W can be processed with more diverse processing contents.

[0185] In the above description, the entire common optical system 116 is replaceable. However, instead of the entire common optical system 116 being replaceable, a part of the common optical system 116 may be replaceable. That is, a part of the plurality of optical members constituting the common optical system 116 may be replaceable.

[0186] Also, in the sixth embodiment, the constituent elements described in at least one of the second to fifth embodiments described above may be adopted. The constituent elements described in the fifth embodiment include the constituent elements related to the independent control of the irradiation position of the measurement light ML on the workpiece W.

[0187] (7) Machining System SYSg of the Seventh Embodiment Subsequently, with reference to FIG. 24, the processing system SYS of the seventh embodiment (hereinafter, the processing system SYS of the seventh embodiment is referred to as "processing system SYSg") will be described. FIG. 24 is a cross-sectional view schematically showing the overall structure of the processing system SYSg of the seventh embodiment.

[0188] As shown in FIG. 24, the processing system SYSg of the seventh embodiment is different in that it further includes a position measuring device 6g as compared with the processing system SYSa of the first embodiment described above. Other features of the processing system SYSg may be the same as other features of the processing system SYSa.

[0189] The position measuring device 6g measures the relative positional relationship between the workpiece W and the processing head 11. In the seventh embodiment, the position measuring device 6g measures the position of the workpiece W with respect to the processing head 11. In order to measure the position of the workpiece W with respect to the processing head 11, the position measuring device 6g may measure the workpiece W. Since the processing head 11 is provided with each optical system, the operation of measuring the relative positional relationship between the workpiece W and the processing head 11 is substantially equivalent to the operation of measuring the relative positional relationship between the workpiece W and each optical system provided in the processing head 11. That is, the operation of measuring the position of the workpiece W with respect to the processing head 11 is substantially to measure the position of the workpiece W with respect to each optical system provided in the processing head 11.

[0190] The position measuring device 6g may be arranged at a position fixed with respect to the machining head 11 (in particular, each optical system provided in the machining head 11). The position measuring device 6g may be arranged at a position where the relative position with respect to the machining head 11 is fixed. The position measuring device 6g may be arranged at a position where the relative position between the machining head 11 and the position measuring device 6g does not change even if the head drive system 12 moves the machining head 11. For example, FIG. 24 shows an example in which the position measuring device 6g is attached to the outer surface of the machining head 11 (for example, the outer surface of the housing 117).

[0191] When the position measuring device 6g is arranged at a position fixed with respect to the machining head 11, the output from the position measuring device 6g (that is, the measurement result of the position measuring device 6g) will include information regarding the position of the workpiece W with respect to the machining head 11. Specifically, the measurement result of the position measuring device 6g includes information regarding the position of the workpiece W with respect to the position measuring device 6g. That is, the measurement result of the position measuring device 6g includes information regarding the position of the workpiece W in the measurement coordinate system of the position measuring device 6g. Here, when the position measuring device 6g is arranged at a position fixed with respect to the machining head 11, the information regarding the position of the workpiece W with respect to the position measuring device 6g will substantially include information regarding the position of the workpiece W with respect to the machining head 11 arranged at a position fixed with respect to the position measuring device 6g. Therefore, the control device 5 can appropriately specify the position of the workpiece W with respect to the machining head 11.

[0192] The position measuring device 6g may be any type of measuring device as long as it can measure the workpiece W. For example, the position measuring device 6g may include an imaging device (that is, a camera) capable of imaging the surface of an object such as the workpiece W. The position measuring device 6g may include an irradiation device that irradiates the workpiece W with measurement light that draws a predetermined pattern on the workpiece W, and an imaging device that images the pattern drawn on the workpiece W by the measurement light. In this way, the position measuring device 6g may be a measuring device that measures the workpiece W in a non-contact manner (as an example, at least one of a light detection method, a sound wave detection method, and a radio wave detection method, etc.).

[0193] The measurement result of the position measuring device 6g (that is, information regarding the position of the workpiece W with respect to the machining head 11) may be used to control the machining system SYSa. Specifically, the measurement result of the position measuring device 6g may be used to control the machining device 1. The measurement result of the position measuring device 6g may be used to control the machining head 11. The measurement result of the position measuring device 6g may be used to control the head drive system 12. The measurement result of the position measuring device 6g may be used to control the stage device 3. The measurement result of the position measuring device 6g may be used to control the stage drive system 33.

[0194] For example, based on the measurement result of the position measuring device 6g, the control device 5 may change the relative positional relationship between the workpiece W and the machining head 11 so that the relative positional relationship between the workpiece W and the machining head 11 becomes a desired positional relationship. That is, based on the measurement result of the position measuring device 6g, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and the machining head 11 so that the relative positional relationship between the workpiece W and the machining head 11 becomes a desired positional relationship. An example of a device capable of changing the relative positional relationship between the workpiece W and the machining head 11 has already been described above. Also, the "desired positional relationship" has already been described above.

[0195] For example, based on the measurement result of the position measuring device 6g, the control device 5 may change the relative positional relationship between the workpiece W and each optical system provided in the machining head 11 (for example, at least one of the machining optical system 112, the measurement optical system 114, the combining optical system 115, and the common optical system 116) so that the relative positional relationship becomes a desired relationship. That is, based on the measurement result of the position measuring device 6g, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and each optical system provided in the machining head 11 so that the relative positional relationship between the workpiece W and each optical system provided in the machining head 11 becomes a desired relationship. An example of a device capable of changing the relative positional relationship between the workpiece W and each optical system provided in the machining head 11 has already been described above.

[0196] For example, based on the measurement result of the position measurement device 6g, the control device 5 may change the relative position of the irradiated area EA with respect to the workpiece W so that the irradiated area EA is set at a desired position on the workpiece W (that is, the processing light EL is irradiated). That is, the control device 5 may control a device capable of changing the relative position of the irradiated area EA with respect to the workpiece W so that the irradiated area EA is set at a desired position on the workpiece W based on the measurement result of the position measurement device 6g. An example of a device capable of changing the relative position of the irradiated area EA with respect to the workpiece W is as already described above.

[0197] For example, based on the measurement result of the position measurement device 6g, the control device 5 may change the relative position of the irradiated area MA with respect to the workpiece W so that the irradiated area MA is set at a desired position on the workpiece W (that is, the measurement light ML#2-2 is irradiated). That is, the control device 5 may control a device capable of changing the relative position of the irradiated area MA with respect to the workpiece W so that the irradiated area MA is set at a desired position on the workpiece W based on the measurement result of the position measurement device 6g. An example of a device capable of changing the relative position of the irradiated area MA with respect to the workpiece W is as already described above.

[0198] For example, the control device 5 may perform a first operation based on the state of the workpiece W calculated from the detection results of the detectors 1143 and 1146, and perform a second operation based on the measurement result of the position measuring device 6g. For example, the control device 5 may control the first drive system 121 of the head drive system 12 based on the state of the workpiece W calculated from the detection results of the detectors 1143 and 1146, and control the second drive system 122 of the head drive system 12 based on the measurement result of the position measuring device 6g. More specifically, the control device 5 may roughly align the irradiated region EA and / or the irradiated region MA relative to the workpiece W by controlling the first drive system 121 based on the state of the workpiece W calculated from the detection results of the detectors 1143 and 1146. Then, the control device 5 may more accurately align the irradiated region EA and / or the irradiated region MA relative to the workpiece W by controlling the second drive system 122 based on the measurement result of the position measuring device 6g. The control device 5 may cancel the vibration of the first drive system 121 so that the vibration of the first drive system 121 is not transmitted to the processing head 11 via the second drive system 122 by controlling the second drive system 122 based on the measurement result of the position measuring device 6g.

[0199] In the seventh embodiment, the position measuring device 6g is attached to the outer surface of the processing head 11. However, a part of the position measuring device 6g may be attached inside the processing head 11 (inside the housing 117), or the entire position measuring device 6g may be attached inside the processing head 11 (inside the housing 117).

[0200] Such a processing system SYSg of the seventh embodiment can enjoy the same effects as those that the processing system SYSa of the first embodiment described above can enjoy. Furthermore, the processing system SYSg of the seventh embodiment can machine the workpiece W using the detection result of the position measuring device 6g in addition to the detection results of the detectors 1143 and 1146. Therefore, the processing system SYSg can machine the workpiece W more appropriately. For example, the processing system SYSg can machine the workpiece W with higher precision.

[0201] Also, in the seventh embodiment, the constituent elements described in at least one of the second to sixth embodiments described above may be adopted. The constituent elements described in the sixth embodiment include the constituent elements related to the replacement of the common optical system 116.

[0202] (8) Machining System SYSh of the Eighth Embodiment Subsequently, the processing system SYS of the eighth embodiment (hereinafter, the processing system SYS of the eighth embodiment is referred to as "processing system SYSh") will be described. The processing system SYSh of the eighth embodiment is different from the processing system SYSa of the first embodiment described above in that, instead of the processing device 1, it includes a processing device 1h. Other features of the processing system SYSh may be the same as other features of the processing system SYSa. The processing device 1h is different from the processing device 1 in that, instead of the processing head 11, it includes a processing head 11h. Other features of the processing device 1h may be the same as other features of the processing device 1. Therefore, hereinafter, with reference to FIG. 25, the processing head 11h of the eighth embodiment will be described. FIG. 25 is a cross-sectional view showing an example of the structure of the processing head 11h of the eighth embodiment.

[0203] As shown in FIG. 25, the processing head 11h is different from the processing head 1 in that it may not include the combined optical system 115. Further, the processing head 11h is different from the processing head 1 in that, instead of the common optical system 116, it includes a processing irradiation optical system 118h and a measurement irradiation optical system 119h. Other features of the processing head 11h may be the same as other features of the processing head 1.

[0204] The processing irradiation optical system 118h receives the processing light EL emitted from the processing optical system 112. The processing irradiation optical system 118h irradiates the workpiece W with the processing light EL incident on the processing irradiation optical system 118h. On the other hand, the measurement light ML#2-2 emitted from the measurement optical system 114 does not enter the processing irradiation optical system 118h. The processing irradiation optical system 118h does not irradiate the workpiece W with the measurement light ML#2-2 emitted from the measurement optical system 114.

[0205] To irradiate the work W with the processing light EL, the processing irradiation optical system 118h includes a galvanometer mirror 1181h and an fθ lens 1182h.

[0206] The processing light EL emitted from the processing optical system 112 is incident on the galvanometer mirror 1181h. The galvanometer mirror 1181h changes the irradiation position of the processing light EL on the work W by deflecting the processing light EL. For example, the galvanometer mirror 1181h includes an X-scanning mirror 1181hX and a Y-scanning mirror 1181hY. Each of the X-scanning mirror 1181hX and the Y-scanning mirror 1181hY is a tilt angle variable mirror whose angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1181h is changed. The X-scanning mirror 1181hX deflects the processing light EL by swinging or rotating so as to change the irradiation position along the X-axis direction of the processing light EL on the work W (that is, changing the angle of the X-scanning mirror 1181hX with respect to the optical path of the processing light EL). The Y-scanning mirror 1181hY deflects the processing light EL by swinging or rotating so as to change the irradiation position along the Y-axis direction of the processing light EL on the work W (that is, changing the angle of the Y-scanning mirror 1181hY with respect to the optical path of the processing light EL). Considering such characteristics of the galvanometer mirror 1181h, the galvanometer mirror 1181h is different in that, while changing the irradiation position of the processing light EL on the work W, it does not change the irradiation position of the measurement light ML on the work W compared with the galvanometer mirror 1161 of the common optical system 116. The galvanometer mirror 1181h is different in that the processing light EL passes through it while the measurement light ML does not pass through it compared with the galvanometer mirror 1161. Other characteristics of the galvanometer mirror 1181h may be the same as other characteristics of the galvanometer mirror 1161.

[0207] The machining light EL from the galvano mirror 1181h is incident on the fθ lens 1182h. The fθ lens 1182h is an optical system for irradiating the workpiece W with the machining light EL from the galvano mirror 1181h. In particular, the fθ lens 1182h is an optical system for condensing the machining light EL from the galvano mirror 1181h onto the workpiece W. Considering such characteristics of the fθ lens 1182h, the fθ lens 1182h is different from the fθ lens 1162 of the common optical system 116 in that while irradiating the workpiece W with the machining light EL, it does not change the irradiation position of the measurement light ML on the workpiece W. The fθ lens 1182h is different from the fθ lens 1162 in that the machining light EL passes through while the measurement light ML does not pass through. Other features of the fθ lens 1182h may be the same as other features of the fθ lens 1162.

[0208] The measurement light ML#2-2 emitted from the measurement optical system 114 is incident on the measurement irradiation optical system 119h. The measurement irradiation optical system 119h irradiates the workpiece W with the measurement light ML#2-2 incident on the measurement irradiation optical system 119h. On the other hand, the machining light EL emitted from the machining optical system 112 does not enter the measurement irradiation optical system 119h. The measurement irradiation optical system 119h does not irradiate the workpiece W with the machining light EL emitted from the machining optical system 112.

[0209] In order to irradiate the workpiece W with the measurement light ML#2-2, the measurement irradiation optical system 119h includes a galvano mirror 1191h and an fθ lens 1192h.

[0210] The measurement light ML#2-2 emitted from the measurement optical system 114 is incident on the galvanometer mirror 1191h. The galvanometer mirror 1191h changes the irradiation position of the measurement light ML#2-2 on the workpiece W by deflecting the measurement light ML#2-2. For example, the galvanometer mirror 1191h includes an X-scanning mirror 1191hX and a Y-scanning mirror 1191hY. Each of the X-scanning mirror 1191hX and the Y-scanning mirror 1191hY is a tilt angle variable mirror whose angle with respect to the optical path of the measurement light ML#2-2 incident on the galvanometer mirror 1191h is changed. The X-scanning mirror 1191hX deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 along the X-axis direction on the workpiece W (that is, changing the angle of the X-scanning mirror 1191hX with respect to the optical path of the measurement light ML#2-2). The Y-scanning mirror 1191hY deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 along the Y-axis direction on the workpiece W (that is, changing the angle of the Y-scanning mirror 1191hY with respect to the optical path of the measurement light ML#2-2). Considering such characteristics of the galvanometer mirror 1191h, the galvanometer mirror 1191h is different in that it changes the irradiation position of the measurement light ML#2-2 on the workpiece W while not changing the irradiation position of the processing light EL on the workpiece W compared with the galvanometer mirror 1161 of the common optical system 116. The galvanometer mirror 1191h is different in that the measurement light ML passes through while the processing light EL does not pass through compared with the galvanometer mirror 1161. Other features of the galvanometer mirror 1191h may be the same as other features of the galvanometer mirror 1161.

[0211] Measurement light ML#2-2 from the galvano mirror 1191h is incident on the fθ lens 1192h. The fθ lens 1192h is an optical system for irradiating the workpiece W with the measurement light ML#2-2 from the galvano mirror 1191h. In particular, the fθ lens 1192h is an optical system for condensing the measurement light ML#2-2 from the galvano mirror 1191h onto the workpiece W. Considering such characteristics of the fθ lens 1192h, the fθ lens 1192h is different from the fθ lens 1162 of the common optical system 116 in that it irradiates the workpiece W with the measurement light ML#2-2 while not changing the irradiation position of the measurement light ML on the workpiece W. The fθ lens 1192h is different from the fθ lens 1162 in that the processing light EL does not pass through while the measurement light ML passes through. Other features of the fθ lens 1192h may be the same as other features of the fθ lens 1162.

[0212] In the eighth embodiment, the optical axis of the fθ lens 1182h that irradiates the workpiece W with the processing light EL and the optical axis of the fθ lens 1192h that irradiates the workpiece W with the measurement light ML were substantially parallel to each other. However, the optical axis of the fθ lens 1182h and the optical axis of the fθ lens 1192h do not have to be parallel to each other. For example, the optical axis of the fθ lens 1182h and the optical axis of the fθ lens 1192h may intersect each other on the surface where the surface of the workpiece W is located or in the vicinity thereof, and the optical axis of the fθ lens 1182 and the optical axis of the fθ lens 1192h may be set so that at least a part of the fields of view of the fθ lens 1182 and the fθ lens 1192h overlap. In these cases, it can be said that the optical axis of the fθ lens 1182h inclines toward the fθ lens 1192h side, or it can be said that the optical axis of the fθ lens 1192h inclines toward the fθ lens 1182h side. Also, the optical axis of the fθ lens 1182h and the optical axis of the fθ lens 1192h may be set so that when the two optical axes are viewed from the direction intersecting the plane in which the fθ lenses 1182h and 1192h are arranged, the two optical axes form an acute angle.

[0213] As described above, in the eighth embodiment, within the processing head 11, the optical system for the processing light EL (specifically, the processing optical system 112 and the processing irradiation optical system 118h) and the optical system for the measurement light ML (specifically, the measurement optical system 114 and the measurement irradiation optical system 119h) are optically separated. That is, the processing head 11h may not include an optical element or optical member through which both the processing light EL and the measurement light ML pass. Similar to the processing system SYSa of the first embodiment, such a processing system SYSh of the eighth embodiment can also appropriately process the workpiece W using the processing light EL and appropriately measure the workpiece W using the measurement light ML.

[0214] In addition, in the eighth embodiment, a configuration may be adopted in which the processing light EL from the galvanometer mirror 1181h and the measurement light ML from the galvanometer mirror 1191h are incident on a single fθ lens.

[0215] In addition, in the eighth embodiment as well, the constituent elements described in at least one of the above-described second to seventh embodiments may be adopted. The constituent elements described in the seventh embodiment include the constituent elements related to the position measurement device 6g. Further, in the eighth embodiment, since the processing head 11h includes the processing irradiation optical system 118h and the measurement optical system 119h instead of the common optical system 116, the constituent elements applicable to the common optical system 116 may be adopted in at least one of the processing irradiation optical system 118h and the measurement optical system 119h. For example, at least one of the processing irradiation optical system 118h and the measurement optical system 119h may be replaceable similar to the common optical system 116 of the sixth embodiment.

[0216] (9) Machining System SYSi of the Ninth Embodiment Subsequently, with reference to FIGS. 26 to 27, the processing system SYS of the ninth embodiment (hereinafter, the processing system SYS of the ninth embodiment is referred to as "processing system SYSi") will be described. FIG. 26 is a cross-sectional view schematically showing the overall structure of the processing system SYSi of the ninth embodiment. FIG. 27 is a system configuration diagram showing the system configuration of the processing system SYSi of the ninth embodiment.

[0217] As shown in FIGS. 26 and 27, the processing system SYSi of the ninth embodiment is different in that it includes a processing device 1i instead of the processing device 1 as compared with the processing system SYSa of the first embodiment described above. Further, the processing system SYSi of the ninth embodiment is different in that it further includes a measuring device 2i as compared with the processing system SYSa of the first embodiment described above. Other features of the processing system SYSi may be the same as those of the processing system SYSa.

[0218] The processing device 1i is different in that it includes a processing head 11i instead of the processing head 1 as compared with the processing device 1. Other features of the processing device 1i may be the same as those of the processing device 1. The processing head 11i is different from the above-described processing head 1 that emits the processing light EL and the measurement light ML to the workpiece W in that it emits the processing light EL to the workpiece W but does not emit the measurement light ML. An example of the structure of such a processing head 11i is shown in FIG. 28. As shown in FIGS. 27 and 28, the processing head 11i includes a processing light source 111, a processing optical system 112, and a processing irradiation optical system 118h. The processing light source 111, the processing optical system 112, and the processing irradiation optical system 118h may be housed in the housing 117 of the processing head 11i. It can be said that the processing head 11i is an optical member that selectively includes the optical members that contribute to the emission of the processing light EL among the plurality of optical members provided in the processing head 11h of the eighth embodiment shown in FIG. 25. Therefore, a detailed description of the processing head 11i is omitted.

[0219] The measuring device 2i includes a measuring head 21i that emits the measurement light ML to the workpiece W and a head drive system 22i that moves the measuring head 21i. The measuring head 21i means any member capable of emitting the measurement light ML to the workpiece W. Therefore, although the measuring head 21i includes the word "head", it does not necessarily mean a member attached to the tip of some member. Therefore, the measuring head 21i may be referred to as a measuring member.

[0220] The measurement head 21i is different from the above-described processing head 11 that emits both the processing light EL and the measurement light ML to the workpiece W in that it emits the measurement light ML to the workpiece W while not emitting the processing light EL. An example of the structure of such a measurement head 21i is shown in FIG. 29. As shown in FIGS. 27 and 29, the measurement head 21i includes a measurement light source 113, a measurement optical system 114, and a measurement irradiation optical system 119h. The measurement light source 113, the measurement optical system 114, and the measurement irradiation optical system 119h may be housed in the housing 217i of the measurement head 21i. It can be said that the measurement head 21i is an optical member that selectively includes the optical members that contribute to the emission of the measurement light ML among the plurality of optical members included in the processing head 11h of the eighth embodiment shown in FIG. 25. Therefore, a detailed description of the measurement head 21i is omitted.

[0221] The head drive system 22i may have the same structure as the above-described head drive system 12. That is, the head drive system 22i may include a first drive system 121 and a second drive system 122. The head drive system 22i and the measurement head 21i may be connected in the same connection mode as the connection mode in which the head drive system 12 and the processing head 11 are connected. Therefore, a detailed description of the head drive system 22i is omitted.

[0222] In the ninth embodiment, when the processing head 11i moves, the irradiation position of the processing light EL on the workpiece W changes, while the irradiation position of the measurement light ML on the workpiece W does not change. Therefore, moving the processing head 11i in the ninth embodiment is equivalent to changing the irradiation position of the processing light EL (or the position of the irradiated area EA) on the workpiece W. On the other hand, when the measurement head 21i moves, the irradiation position of the measurement light ML on the workpiece W changes, while the irradiation position of the processing light EL on the workpiece W does not change. Therefore, moving the measurement head 21i in the ninth embodiment is equivalent to changing the irradiation position of the measurement light ML (or the position of the irradiated area MA) on the workpiece W. Thus, in the ninth embodiment, the processing system SYSi can independently change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W.

[0223] In the ninth embodiment, the stage 32 may move such that an irradiated area EA irradiated with the processing light EL is set on the workpiece W at least in part of a processing period during which the processing apparatus 1i is to emit the processing light EL toward the workpiece W. The stage 32 may move such that the workpiece W is positioned at a position where the processing apparatus 1i can irradiate the processing light EL at least in part of the processing period. On the other hand, the stage 32 may move such that an irradiated area MA irradiated with the measurement light ML is set on the workpiece W at least in part of a measurement period during which the measurement apparatus 2i is to emit the measurement light ML toward the workpiece W. The stage 32 may move such that the workpiece W is positioned at a position where the measurement apparatus 2i can irradiate the measurement light ML at least in part of the measurement period. That is, the stage 32 may move between a position where the processing apparatus 1i can irradiate the processing light EL and a position where the measurement apparatus 2i can irradiate the measurement light ML.

[0224] Thus, in the ninth embodiment, as in the eighth embodiment, the optical system related to the processing light EL (specifically, the processing optical system 112 and the processing irradiation optical system 118h) and the optical system related to the measurement light ML (specifically, the measurement optical system 114 and the measurement irradiation optical system 119h) are optically separated. Furthermore, in the ninth embodiment, the apparatus for emitting the processing light EL toward the workpiece W (that is, the processing apparatus 1i) and the apparatus for emitting the measurement light ML toward the workpiece W (that is, the measurement apparatus 2i) are separate apparatuses. Such a processing system SYSi of the ninth embodiment can also appropriately process the workpiece W using the processing light EL and appropriately measure the workpiece W using the measurement light ML, similarly to the processing system SYSa of the first embodiment.

[0225] Also, in the ninth embodiment, a constituent element described in at least one of the second to eighth embodiments described above may be adopted. The constituent element described in the eighth embodiment includes a constituent element related to optical separation between the optical system for processing light EL and the optical system for measurement light ML. Further, in the ninth embodiment, since the processing system SYSi includes a processing irradiation optical system 118h and a measurement optical system 119h instead of the common optical system 116, a constituent element that can be adopted for the common optical system 116 may be adopted for at least one of the processing irradiation optical system 118h and the measurement optical system 119h. For example, at least one of the processing irradiation optical system 118h and the measurement optical system 119h may be replaceable in the same manner as the common optical system 116 of the sixth embodiment.

[0226] (10) Machining System SYSj of the Tenth Embodiment Subsequently, with reference to FIG. 30, the processing system SYS of the tenth embodiment (hereinafter, the processing system SYS of the tenth embodiment is referred to as "processing system SYSj") will be described. FIG. 30 is a cross-sectional view schematically showing the overall structure of the processing system SYSj of the tenth embodiment.

[0227] As shown in Fig. 30, the processing system SYSj of the tenth embodiment is different from the processing system SYSi of the ninth embodiment described above in that the measuring device 2i emits the measuring light ML obliquely incident on the workpiece W. Other features of the processing system SYSj may be the same as those of the processing system SYSi. Such a processing system SYSj of the tenth embodiment can also enjoy the same effects as those that the processing system SYSi of the ninth embodiment can enjoy. Further, the processing system SYSj of the tenth embodiment can emit the processing light EL and the measuring light ML toward the same position on the workpiece W. That is, even when the processing device 1i and the measuring device 2i are separate devices, the processing system SYSj can emit the processing light EL and the measuring light ML so that the optical path of the processing light EL and the optical path of the measuring light ML at least partially overlap. As a result, the stage 32 does not necessarily have to move between a position where the processing device 1i can irradiate the processing light EL and a position where the measuring device 2i can irradiate the measuring light ML.

[0228] In addition, in the tenth embodiment as well, the constituent elements described in at least one of the second to ninth embodiments described above may be adopted. The constituent elements described in the ninth embodiment include a constituent element in which a device that emits the processing light EL to the workpiece W and a device that emits the measuring light ML to the workpiece W are separate devices.

[0229] (11) Machining System SYSk of the Eleventh Embodiment Subsequently, with reference to Fig. 31, the processing system SYS of the eleventh embodiment (hereinafter, the processing system SYS of the eleventh embodiment is referred to as "processing system SYSk") will be described. Fig. 31 is a cross-sectional view schematically showing the overall structure of the processing system SYSk of the eleventh embodiment.

[0230] As shown in FIG. 31, the processing system SYSk of the 11th embodiment is different in that it includes a plurality of measuring devices 2 instead of the measuring device 2i as compared with the processing system SYSj of the 10th embodiment described above. In the example shown in FIG. 31, the processing system SYSk includes two measuring devices 2k (specifically, measuring device 2k#1 and measuring device 2k#2). Other features of the processing system SYSk may be the same as other features of the processing system SYSj.

[0231] The measuring device 2k#1 is a device that includes at least a part of the optical members included in the measuring device 2i. The measuring device 2k#2 is a device that includes at least the remaining part of the optical members included in the measuring device 2i (that is, the optical members not included in the measuring device 2k#1). That is, it can be said that the processing system SYSk of the 11th embodiment is different from the processing system SYSj of the 10th embodiment described above in that the measuring device 2i is further divided into a plurality of measuring devices 2k. Note that the measuring devices 2k#1 and 2k#2 may include the same optical members. That is, the measuring devices 2k#1 and 2k#2 may include optical members having the same function or performing the same operation.

[0232] In the example shown in FIG. 31, the measuring device 2k#1 includes at least a measuring light source 113, a measuring optical system 114#1 corresponding to a part of the measuring optical system 114, and a measuring irradiation optical system 119h. On the other hand, the measuring device 2k#2 includes at least a measuring optical system 114#2 corresponding to the remaining part of the measuring optical system 114 (that is, including at least the optical members not included in the measuring optical system 114#1 among the plurality of optical members included in the measuring optical system 114). In particular, the measuring optical system 114#2 includes at least a detector 1146. Therefore, in the example shown in FIG. 31, measuring light ML (specifically, measuring light ML#2-2) is emitted from the measuring optical system 114#1 to the workpiece W, and the measuring light ML (specifically, measuring light #2-3) from the workpiece W enters the measuring optical system 114#2.

[0233] Such a processing system SYSk of the 11th embodiment can enjoy the same effects as those that the processing system SYSj of the 10th embodiment can enjoy.

[0234] In addition, in the 11th embodiment as well, the constituent elements described in at least one of the 2nd to 10th embodiments described above may be adopted. The constituent elements described in the 10th embodiment include the constituent element in which the measurement light ML is obliquely incident on the workpiece W.

[0235] (12) Machining System SYSl of the Twelfth Embodiment Subsequently, with reference to FIG. 32, a processing system SYS of the 12th embodiment (hereinafter, the processing system SYS of the 12th embodiment is referred to as "processing system SYSl") will be described. FIG. 32 is a cross-sectional view schematically showing the overall structure of the processing system SYSl of the 12th embodiment.

[0236] As shown in FIG. 32, the processing system SYSl of the 12th embodiment is different from the processing system SYSj of the 10th embodiment described above in that an index 13l measurable by the measuring device 2i is attached to the processing device 1i. For example, the index 13l may be attached to the housing 117 (for example, the outer surface of the housing 117) of the processing device 1i. Other features of the processing system SYSl may be the same as other features of the processing system SYSj.

[0237] In addition to emitting the measurement light ML to the workpiece W, the measuring device 2i emits the measurement light ML (specifically, the measurement light ML#2-2) to the index 13l. For example, the measuring device 2i may emit the measurement light ML to the index 13l by deflecting the measurement light ML with the galvanometer mirror 1191h. For example, the measuring device 2i may emit the measurement light ML to the index 13l by changing the position of the measuring device 2i in at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction by the head drive system 22i.

[0238] The measuring device 2i may emit the measurement light ML to the indicator 13l before the processing device 1i starts processing the workpiece W (for example, at the timing when the workpiece W is placed on the stage 32). The measuring device 2i may emit the measurement light ML to the indicator 13l before the processing device 1i irradiates the workpiece W with the processing light EL. The measuring device 2i may emit the measurement light ML to the indicator 13l at least in part of the period during which the processing device 1i irradiates the workpiece W with the processing light EL. The measuring device 2i may emit the measurement light ML to the indicator 13l after the processing device 1i irradiates the workpiece W with the processing light EL. The measuring device 2i may emit the measurement light ML to the indicator 13l after the processing device 1i completes the processing of the workpiece W.

[0239] When the indicator 13l is irradiated with the measurement light ML (specifically, the measurement light ML#2-2), light (for example, at least one of the above-described reflected light, scattered light, diffracted light, and transmitted light) is generated from the indicator 13l due to the irradiation of the measurement light ML#2-2. For this reason, in the twelfth embodiment, the measurement light ML#2-3 including at least a part of the light emitted from the indicator 13l due to the irradiation of the measurement light ML#2-2 enters the detector 1146. For this reason, the control device 5 can calculate the state of the indicator 13l (specifically, the position of the indicator 13l with respect to the measurement head 21i) based on the detection results of the detectors 1143 and 1146. Further, since the indicator 13l is attached to the processing head 11i, the control device 5 can calculate the position of the processing head 11i with respect to the measurement head 21i based on the calculated position of the indicator 13l. That is, the control device 5 can calculate the relative positional relationship (typically, the distance between the reference point of the measurement head 21i and the reference point of the processing head 11i) between the reference point of the measurement head 21i and the reference point of the processing head 11i.

[0240] The control device 5 may control the positions of the processing head 11i and / or the measurement head 21i based on the information on the relative positional relationship between the calculated reference point of the measurement head 21i and the reference point of the processing head 11i (hereinafter referred to as "baseline amount"). The control device 5 may control the position of the stage 32 based on the baseline amount. The control device 5 may control the irradiation position of the processing light EL and / or the irradiation position of the measurement light ML based on the baseline amount. For example, the control device 5 may control the position of the processing head 11i, the position of the measurement head 21i, the position of the stage 32, the irradiation position of the processing light EL, and / or the irradiation position of the measurement light ML so that the processing light EL is irradiated at a desired position of the workpiece W based on the baseline amount. For example, the control device 5 may control the position of the processing head 11i, the position of the measurement head 21i, the position of the stage 32, the irradiation position of the processing light EL, and / or the irradiation position of the measurement light ML so that the measurement light ML is irradiated at a desired position of the workpiece W based on the baseline amount.

[0241] Such a processing system SYS1 of the twelfth embodiment can enjoy the same effects as those that the processing system SYSj of the tenth embodiment can enjoy. Further, the processing system SYS1 can process the workpiece W based on the baseline amount. For this reason, even if the positional relationship between the processing device 1i and the measuring device 2i deviates from an ideal positional relationship (typically, the designed nominal positional relationship), the processing system SYS1 can process the workpiece W based on the baseline amount that reflects the deviation of the positional relationship. For this reason, the processing system SYS1 can process the workpiece W more appropriately.

[0242] In addition, also in the twelfth embodiment, the constituent elements described in at least one of the second to eleventh embodiments described above may be adopted. The constituent elements described in the eleventh embodiment include the constituent elements related to the division of the measurement head 21i.

[0243] (13) Other Modification Examples In the above description, the processing system SYS forms a riblet structure on the surface of the workpiece W. However, the processing system SYS may form any structure having any shape on the surface of the workpiece W. Even in this case, if the control device 5 controls the processing head 11 or the like so that the processing light EL scans along a scanning locus corresponding to the structure to be formed, any structure having any shape can be formed. As an example of any structure, there is a fine texture structure (typically an uneven structure) on the order of micro- and nanometers formed regularly or irregularly. Such a fine texture structure may include at least one of a sharkskin structure and a dimple structure having a function of reducing resistance by a fluid (gas and / or liquid). The fine texture structure may include a lotus leaf surface structure having at least one of a liquid repellent function and a self-cleaning function (for example, having a lotus effect). The fine texture structure may include a fine protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), an uneven structure having a lyophilic function, an uneven structure having an antifouling function, a moth-eye structure having at least one of a reflectance reduction function and a liquid repellent function, an uneven structure that exhibits a structural color by enhancing only light of a specific wavelength by interference, a pillar array structure having an adhesion function using van der Waals force, an uneven structure having an aerodynamic noise reduction function, and a honeycomb structure having a droplet collection function, etc.

[0244] In the above description, the processing system SYS forms a riblet structure on the workpiece W to reduce the resistance of the fluid on the surface of the workpiece W. However, the processing system SYS may form other structures different from the riblet structure for reducing the resistance of the fluid on the surface on the workpiece W. For example, the processing system SYS may form a riblet structure on the workpiece W to reduce the noise generated when the fluid and the surface of the workpiece W move relative to each other. For example, the processing system SYS may form a structure on the workpiece W that generates vortices in the flow of the fluid on the surface of the workpiece W. For example, the processing system SYS may form a structure on the workpiece W to impart hydrophobicity to the surface of the workpiece W.

[0245] In the above description, the processing system SYS for processing an object with processing light EL has been described. That is, in the above description, an example in which the second drive system 122 connects the processing head 11 and the first drive system 121 has been described. However, in addition to or instead of the processing head 11 in the processing system SYS, an end effector that acts on the object may be used. For example, as shown in FIG. 33 which shows an example of the structure of a processing apparatus 1m including an end effector, the second drive system 122 may connect the end effector 13m and the first drive system 121. In the example shown in FIG. 33, the end effector 13m is attached to the processing head 11, and the second drive system 122 connects the end effector 13m and the first drive system 121 via the processing head 11. However, the end effector 13m may be attached to the second drive system 122 without passing through the processing head 11. Such a processing system SYS including an end effector may be referred to as a robot system. Note that FIG. 33 shows an example in which the processing apparatus 1 of the first embodiment includes the end effector 13m, but at least one of the processing apparatuses 1 from the second embodiment to the processing apparatus 1i of the twelfth embodiment may include the end effector 13m.

[0246] Note that the end effector may be a part that has a function of directly acting on a work target (for example, an object). Further, the end effector may be a part that obtains properties of a work target (for example, an object). Here, the properties of the object (for example, the work target) may include at least one of the shape of the object, the position of the object, the position of the feature points of the object, the posture of the object, the surface properties of the object (for example, at least one of reflectance, spectral reflectance, surface roughness, and color), and the hardness of the object. Note that the processing head 11, the measurement head 21i, and the position measurement device 6g in the above description can be regarded as a kind of end effector.

[0247] In the above description, the processing light source and the measurement light source are separate light sources, but they may be a single light source.

[0248] In the above description, a galvanometer mirror is used as the irradiation position changing optical system, but a polygon mirror or a MEMS mirror may also be used.

[0249] In the above description, an fθ lens having a projection characteristic of fθ is used as the irradiation optical system for irradiating the processing light EL and / or the measurement light ML onto the workpiece W, but an optical system having other projection characteristics may also be used. Further, the irradiation optical system is not limited to the all-refractive type optical system (dioptric optical system) as described above, and may be a catadioptric optical system (catadioptric optical system) or a catoptric optical system (catoptric optical system).

[0250] In the above description, the processing head 11 is made movable by the head drive system 12. Here, the head drive system 12 is not limited to a robot, and may be, for example, a flying object capable of flying to a position away from the workpiece W. Examples of the flying object include at least one of an aircraft, a drone, a helicopter, a balloon, and an airship.

[0251] (9) Supplementary Note Regarding the embodiments described above, the following additional notes are further disclosed. [Additional Note 1] A processing member that processes an object by irradiating the object with processing light from a processing light source, a measurement optical system that emits measurement light including pulsed light, an irradiation optical system that irradiates the object with the measurement light from the measurement optical system and at least a part of the optical path of the processing light and the optical path of the measurement light overlap. Processing member. [Additional Note 2] The optical path of the processing light overlaps at least a part of the optical path of the measurement light between the irradiation optical system and the object. The processing member according to Additional Note 1. [Additional Note 3] An irradiation position changing optical system for changing the irradiation position of the measurement light on the object is provided. The processing member according to Additional Note 1 or 2. [Appended Note 4] The optical path of the measurement light is an area through which the measurement light can pass by the irradiation position changing optical system. The processing member according to Appended Note 3. [Appended Note 5] The irradiation optical system condenses the measurement light from the irradiation position changing optical system. The processing member according to Appended Note 3 or 4. [Appended Note 6] The irradiation position changing optical system changes the emission angle of the measurement light. The processing member according to any one of Appended Notes 3 to 5. [Appended Note 7] When the emission angle of the measurement light is changed by the irradiation position changing optical system, the irradiation position on the object is changed. The processing member according to Appended Note 6. [Appended Note 8] The irradiation optical system emits the measurement light and the processing light respectively toward the object. The processing member according to any one of Appended Notes 1 to 7. [Appended Note 9] An irradiation position changing optical system that changes the irradiation position of the processing light on the object and the irradiation position of the measurement light on the object is provided. The processing member according to Appended Note 8. [Appended Note 10] The optical path of the processing light is an area through which the processing light can pass by the irradiation position changing optical system, and The optical path of the measurement light is an area through which the measurement light can pass by the irradiation position changing optical system. The processing member according to Appended Note 9. [Appended Note 11] The irradiation position changing optical system changes the irradiation position of the processing light on the object and the irradiation position of the measurement light on the object in conjunction with each other. The processing member according to Appended Note 9 or 10. [Appended Note 12] The irradiation optical system condenses the processing light and the measurement light from the irradiation position changing optical system. The processing member according to any one of Appended Notes 8 to 11. [Appendix 13] The irradiation position changing optical system changes the emission angle of the processing light and the emission angle of the measurement light. The processing member according to any one of Appendices 8 to 12. [Appendix 14] The irradiation position changing optical system includes a tilt angle variable mirror whose angles with respect to the optical path of the incident processing light and the optical path of the incident measurement light are changed. The processing member according to any one of Appendices 8 to 13. [Appendix 15] In the irradiation optical system, the path of the processing light and the path of the measurement light at least partially overlap. The processing member according to any one of Appendices 1 to 14. [Appendix 16] In the irradiation optical system, the path of the processing light and the path of the measurement light are at least partially separated along a direction intersecting the optical axis of the irradiation optical system. The processing member according to any one of Appendices 1 to 15. [Appendix 17] The processing member further includes a processing optical system that emits the processing light incident from the processing light source to the irradiation optical system. The processing member according to any one of Appendices 1 to 16. [Appendix 18] The processing member includes a combining optical system that combines the processing light from the processing optical system and the measurement light from the measurement optical system and emits the combined light to the irradiation optical system. The processing member according to Appendix 17. [Appendix 19] The combining optical system emits the measurement light and the processing light that are incident from different directions with respect to the combining optical system in the same direction. The processing member according to Appendix 18. [Appendix 20] The processing optical system is optically separated from the measurement optical system. The processing member according to any one of Appendices 17 to 19. [Appendix 21] The processing member includes a measurement light source that supplies the measurement light, The measurement optical system emits the measurement light from the measurement light source toward the irradiation optical system. The processing member according to any one of Appendices 1 to 20. [Appendix 22] The measurement light source is provided in a housing in which the measurement optical system is housed. The processing member according to Appendix 21. [Appendix 23] The measurement optical system includes a detector that detects light generated by the measurement light irradiated on the object. The processing member according to any one of Appendices 1 to 22. [Appendix 24] The detector detects interference light in which the light generated by the measurement light irradiated on the object interferes with reference light generated from a part of the measurement light. The processing member according to Appendix 23. [Appendix 25] The reference light does not pass through the object. The processing member according to Appendix 24. [Appendix 26] The detector detects the light generated by the measurement light irradiated on the object through the irradiation optical system. The processing member according to any one of Appendices 23 to 25. [Appendix 27] The processing member is controlled based on the detection result of the detector. The processing member according to any one of Appendices 23 to 26. [Appendix 28] The irradiation position of the processing light on the object and the relative position between the object are controlled based on the detection result of the detector. The processing member according to any one of Appendices 23 to 27. [Appendix 29] The relative position between the irradiation optical system and the object is controlled based on the detection result of the detector. The processing member according to any one of Appendices 23 to 28. [Appendix 30] The apparatus further includes an irradiation position changing optical system that changes the irradiation position of the processing light on the surface of the object. The irradiation position changing optical system is controlled based on the detection result of the detector. The processing member according to any one of Appendices 23 to 29. [Appendix 31] Further comprising the processing light source. The processing member according to any one of Appendices 1 to 30. [Appendix 32] Further comprising a processing light irradiation optical system that emits the processing light from the processing light source toward the object. The processing member according to any one of Appendices 1 to 31. [Appendix 33] The processing light from the processing light source does not pass through the irradiation optical system. The processing member according to Appendix 32. [Appendix 34] The wavelength of the processing light is different from the wavelength of the measurement light. The processing member according to any one of Appendices 1 to 33. [Appendix 35] The processing light includes pulsed light. The processing member according to any one of Appendices 1 to 34. [Appendix 36] The measurement light includes light from an optical comb light source as the pulsed light. The processing member according to any one of Appendices 1 to 35. [Appendix 37] The measurement light includes light having frequency components arranged at equal intervals on the frequency axis as the pulsed light. The processing member according to any one of Appendices 1 to 36. [Appendix 38] At least some of the optical members constituting the irradiation optical system are replaceable. The processing member according to any one of Appendices 1 to 37. [Appendix 39] The replaceable part of the optical members is one of a plurality of measurement candidate optical systems having different emission directions of the measurement light with respect to the processing member. The processing member according to Appendix 38. [Appendix 40] The exchangeable part of the optical members is one of a plurality of measurement candidate optical systems in which the distance along the optical path of the measurement light between the incident position of the measurement light on the irradiation optical system and the emission position of the measurement light from the irradiation optical system is different. The processing member according to appended note 38 or 39. [Appended note 41] It includes a processing light irradiation optical system that emits the processing light incident from the processing light source toward the object. At least a part of the optical members constituting the processing light irradiation optical system is exchangeable. The processing member according to any one of appended notes 1 to 40. [Appended note 42] The exchangeable part of the optical members is one of a plurality of processing candidate optical systems in which the emission direction of the processing light with respect to the processing member is different. The processing member according to appended note 41. [Appended note 43] The exchangeable part of the optical members is one of a plurality of processing candidate optical systems in which the distance along the optical path of the processing light between the incident position of the processing light on the processing light irradiation optical system and the emission position of the processing light from the processing light irradiation optical system is different. The processing member according to appended note 41 or 42. [Appended note 44] The irradiation optical system emits a plurality of the measurement lights toward the object. The processing member according to any one of appended notes 1 to 43. [Appended note 45] The irradiation optical system emits the plurality of measurement lights toward different positions of the object, respectively. The processing member according to appended note 44. [Appended note 46] Among the plurality of measurement lights, the first measurement light is used for a first application. Among the plurality of measurement lights, the second measurement light different from the first measurement light is used for a second application different from the first application. The processing member according to appended note 44 or 45. [Appended note 47] The first use includes the use for specifying the shape of the object. The second use includes the use for specifying the relative position between the object and at least one of the measurement optical system and the processing optical system that emits the processing light toward the object. The processing member according to Supplementary Note 46. [Supplementary Note 48] It further includes a position changing device for changing the relative position between the object and the housing in which the object and the processing member are accommodated. The processing member according to any one of Supplementary Notes 1 to 47. [Supplementary Note 49] The position changing device includes a movable member whose relative positional relationship with a part of the object can be changed, and a connecting device that connects the movable member and the housing so that the relative positional relationship between the movable member and the housing can be changed. and is provided with The connecting device includes a driving member that moves at least one of the movable member and the housing, and an elastic member that couples the movable member and the housing. The processing member according to Supplementary Note 48. [Supplementary Note 50] The position changing device changes the relative position between the housing and the object based on the detection result of the light generated by the measurement light irradiated on the object. The processing member according to Supplementary Note 49. [Supplementary Note 51] It includes a position measuring device for measuring the relative position between at least one of the irradiation optical system and the processing light irradiation optical system that emits the processing light toward the object and the object. The processing member according to any one of Supplementary Notes 1 to 50. [Supplementary Note 52] The position measuring device includes an imaging device for imaging the surface of the object. The processing member according to Supplementary Note 51. [Supplementary Note 53] A first optical system that emits measurement light including pulsed light toward the object, a second optical system that processes the object by irradiating the object with processing light, A support unit that supports at least a part of the first optical system in a state where it is displaceable with respect to the object, and supports at least a part of the second optical system in a state where it is displaceable with respect to the object, A drive unit that drives at least a part of the first optical system and at least a part of the second optical system via the support unit A robot system comprising the above. [Appendix 54] A light source that emits an optical frequency comb as reference light that is phase-synchronized with each other and has interference, and an optical frequency comb as measurement light, An irradiation optical system that irradiates an object with the measurement light emitted from the light source, A reference surface on which the reference light emitted from the light source is incident, A detection unit that detects an interference signal based on the interference light between the light generated from the object by the measurement light irradiated on the object and the reference light returned from the reference surface, An optical fiber that transmits at least one of the measurement light traveling from the light source toward the irradiation optical system and the light generated from the object by the measurement light irradiated on the object, A signal processing unit that obtains information regarding the position of the object using the interference signal detected by the detection unit above Comprising the above, The optical fiber includes an image fiber having a plurality of cores arranged on a plane crossing the traveling direction of the at least one light A measuring device. [Appendix 55] The detection unit has a plurality of photoelectric conversion elements arranged along at least one direction The measuring device according to Appendix 54. [Appendix 56] Further comprising an optical system that conjugates the end face on the detector side of the optical fiber and the plane on which the plurality of photoelectric conversion elements are arranged The measuring device according to Appendix 55. [Appendix 57] The image fiber has a bundle of a plurality of fibers arranged on the crossing plane The measuring device according to any one of Supplementary Notes 54 to 56. [Supplementary Note 58] The image fiber has a multi-core optical fiber having a plurality of cores arranged on the transverse plane and a cladding between the plurality of cores. The measuring device according to any one of Supplementary Notes 54 to 57.

[0252] The requirements of each of the above embodiments can be combined as appropriate. Some of the requirements of each of the above embodiments may not be used. The requirements of each of the above embodiments can be replaced with the requirements of other embodiments as appropriate. Also, to the extent permitted by law, all published gazettes and U.S. patent disclosures regarding the devices and the like cited in each of the above embodiments are incorporated by reference to form part of the description herein.

[0253] Further, the present invention can be appropriately modified within the scope not contrary to the gist or idea of the invention that can be read from the claims and the entire specification, and a processing device, a processing member, a robot system, and a measuring device involving such modifications are also included in the technical idea of the present invention.

Explanation of Reference Numerals

[0254] 1 Processing device 11 Processing head 111 Processing light source 112 Processing optical system 113 Measurement light source 114 Measurement optical system 115 Combining optical system 116 Common optical system 12 Head drive system 5 Control device EL Processing light ML Measurement light SYS Processing system

Claims

1. A measurement system for measuring an object, comprising: a shape measurement device that measures the object with a first measurement light; a position measurement device that measures the position of the shape measurement device using a second measurement light; Equipped with The shape measurement device includes a scanning member that scans the first measurement light on the surface of the object, and a light receiving member that receives the first measurement light that has passed through the surface of the object, and measures the shape of the surface of the object based on a light reception result of the light receiving member. Measurement system.

2. 2. The measurement system according to claim 1, The shape measuring device further includes a moving device for moving the shape measuring device. Measurement system.

3. 3. The measurement system according to claim 2, the shape measuring device includes a housing that is moved by the moving device, and a measurement target member that is moved together with the housing by the moving device; The position measuring device measures the position of the measurement target member. Measurement system.

4. 4. The measurement system according to claim 3, a control device that controls the moving device based on a positional relationship between the position of the measurement target member measured by the position measurement device and a reference point of the shape measurement device; Measurement system.

5. The measurement system according to claim 3 or 4, The control device controls the irradiation position on the surface of the first measurement light from the shape measurement device. Measurement system.

6. In the measurement system according to claim 2, the moving device comprises a first moving device; the scanning member includes a second moving device and a housing moved by the moving device; The first moving device moves the housing together with the second moving device. Measurement system.

7. In the measurement system according to claim 6, The irradiation position of the first measurement light on the surface relative to the first moving device changes as the housing is moved by the second moving device. Measurement system.

8. In the measurement system according to claim 1, The scanning member includes an optical scanning member that can change the exit angle of the incident first measurement light. Measurement system.

9. In the measurement system according to claim 8, The shape measurement device includes an irradiation optical system that irradiates the surface of the object with light from the optical scanning member. Measurement system.

10. The measurement system according to any one of claims 2 to 9, The moving device includes a robot having a plurality of arm members. Measurement system.

11. The measurement system according to any one of claims 1 to 10, The position measurement device includes a change device that changes the traveling direction of the second measurement light. Measurement system.

12. The measurement system according to claim 11, The change device includes a scanning mirror that changes the traveling direction of the second measurement light. Measurement system.

13. The measurement system according to claim 11, The change device includes a drive member that changes the direction of the second measurement device. Measurement system.

14. The measurement system according to any one of claims 1 to 13, a moving device that moves the shape measurement device; an imaging device that is moved together with the shape measuring device by the moving device; Measurement system.

15. A measurement system for measuring an object, comprising: a shape measurement device that measures the object using measurement light; a moving device that moves the shape measurement device relative to the object; an imaging device that is moved together with the shape measuring device by the moving device; Equipped with The shape measurement device includes a scanning member that scans the measurement light on the surface of the object, and a light receiving member that receives the measurement light that has passed through the surface of the object, and measures the shape of the surface of the object based on the light receiving result of the light receiving member. Measurement system.

16. The measurement system according to claim 14 or 15, The imaging device measures the position of the object relative to the shape measurement device. Measurement system.

17. 17. The measurement system according to claim 16, a control device that controls the moving device based on a measurement result of the position of the object by the imaging device; Measurement system.

18. 18. The measurement system according to claim 17, The control device controls the moving device to change the positional relationship between the object and the shape measuring device. Measurement system.

19. 19. The measurement system according to claim 18, The control device controls the moving device to change the positional relationship between the object and the shape measuring device so that the first measurement light is irradiated onto a desired position on the surface of the object. Measurement system.

20. The measurement system according to any one of claims 14 to 19, The imaging device captures an image of the surface of the object. Measurement system.

21. In a processing system for processing an object, a processing device for processing the object; The measurement system according to any one of claims 1 to 20. Equipped with The object is processed by changing the positional relationship between the processing device and the object based on the measurement result by the measurement system. Processing system.

22. A measurement method for measuring an object, comprising: measuring a shape of the object using a first measurement light from a shape measurement device; measuring the position of the shape measuring device with a second measurement light; Including, Measuring the shape includes scanning the first measurement light on the surface of the object, receiving the first measurement light through the surface of the object, and measuring the shape of the surface of the object based on a result of receiving the first measurement light. Measurement method.

23. 23. The measurement method according to claim 22, and further comprising: moving the shape measurement device. Measurement method.

24. 24. The measurement method according to claim 23, Measuring the position includes measuring the position of a measurement target member that moves in accordance with the movement of the shape measurement device. Measurement method.

25. 25. The measurement method according to claim 24, Moving the shape measuring device includes moving the shape measuring device based on a positional relationship between the position of the measurement target member measured by measuring the position and a reference point of the shape measuring device. Measurement method.

26. 26. The measurement method according to claim 23, Moving the shape measurement device includes moving the shape measurement device using a robot having a plurality of arm members. Measurement method.

27. 27. The measurement method according to claim 22, wherein Measuring the position includes changing a traveling direction of the second measurement light. Measurement method.

28. 28. The measurement method according to claim 22, wherein moving the shape measurement device relative to the object; moving an imaging device together with the shape measuring device; Also includes Measurement method.

29. A measurement method for measuring an object, comprising: measuring a shape of the object using a first measurement light from a shape measurement device; moving the shape measurement device relative to the object; moving an imaging device together with the shape measuring device; Including, Measuring the shape includes scanning the first measurement light on the surface of the object, receiving the first measurement light through the surface of the object, and measuring the shape of the surface of the object based on a result of receiving the first measurement light. Measurement method.

30. 30. The measurement method according to claim 28 or 29, and measuring the position of the object relative to the shape measurement device using the imaging device. Measurement method.

31. 31. The measurement method according to claim 30, Moving the shape measurement device includes moving the shape measurement device based on a measurement result of the position of the object by the imaging device. Measurement method.

32. 32. The measurement method according to claim 31, Moving the shape measurement device includes controlling the moving device to change the positional relationship between the object and the shape measurement device so that the first measurement light is irradiated onto a desired position on the surface of the object. Measurement method.

33. In a processing method for processing an object, The object is processed by changing a positional relationship between a processing device that processes the object and the object based on a measurement result obtained by the measurement method according to any one of claims 22 to 32. Processing method.

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