Cooling body and laminated cooler

The stacked cooler with intersecting flow paths and multiple cooling bodies improves cooling efficiency by enhancing heat exchange surface area and promoting turbulent flow, addressing the heat generation challenges in inverter systems of electric vehicles and hybrid vehicles.

JP2025109385APending Publication Date: 2025-07-25SANWA PACKING IND
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Patent Information

Application Number
JP2024003237
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-12
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

Existing coolers for inverter systems in electric vehicles and hybrid vehicles fail to adequately address the increasing heat generation demands due to higher functionality, necessitating improved cooling efficiency.

Method used

A stacked cooler design featuring a flat cooling body with intersecting longitudinal and transverse flow paths formed by ridge and concave portions, allowing refrigerant to flow through both sides of electronic components, and utilizing multiple cooling bodies stacked in the thickness direction with enhanced surface area and turbulent flow for improved heat exchange.

Benefits of technology

The design enhances cooling efficiency by increasing heat exchange surface area and promoting turbulent flow, effectively cooling electronic components in inverter systems.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a cooling body and a laminated cooler that can further improve cooling effect.SOLUTION: A flat-shaped cooling body 10 that is used for a laminated cooler 1 that cools an electronic component 20 from both sides and causes coolant 100 to circulate inside the cooling body, and comprises: a flat-shaped housing 11 that causes the coolant 100 to circulate therein; an intermediate plate 12 that is arranged in a circulation space S and divides the circulation space S; and a cooling fin 13 that forms a channel R of the coolant 100. The channel R has longitudinal direction channels RL for causing the coolant 100 to circulate in a longitudinal direction L, and short direction channels RS for causing the coolant 100 to circulate in a depth direction D of the flat shape, and has crest parts 131 forming the longitudinal direction channel RL and concave parts 134 forming the short direction channel RS. The longitudinal direction channels RL formed by the crest parts 131, and the short direction channels RS formed by the concave parts 134 intersect each other to allow circulation of the coolant.SELECTED DRAWING: Figure 1
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Description

Technical Field

[0001] The present invention relates to a cooling body and a stacked cooler that can further improve the cooling effect, for example.

Background Art

[0002] Recently, the number of automobiles powered by motors, such as electric vehicles and hybrid vehicles, has been increasing, and these vehicles are equipped with an inverter that converts the DC current of the in-vehicle battery into an AC current for driving the motor.

[0003] Since the above-mentioned inverter drives a motor for running the vehicle as described above, an extremely large current is output and the amount of heat generation also increases, and cooling is essential for proper operation. As a cooling device for such an inverter, for example, a cooler in which electronic components, which are heat generating bodies, are sandwiched and stacked by a cooling body through which a cooling medium can flow inside is known, as disclosed in Patent Document 1.

[0004] In such a cooler, the cooling medium is circulated through a plate-like member in which a flow path is formed inside the cooling body, and it is said that the heat exchange efficiency is improved and the cooling performance is improved by expanding the surface area of the plate-like member. However, with the increasing functionality of motors, for example, further improvement of the cooling effect has been demanded.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present invention is to provide a cooling body and a stacked cooler that can further improve the cooling effect.

Means for Solving the Problems

[0007] The present invention is used for a stacked cooler that cools electronic components from both sides, and is a flat cooling body that allows a refrigerant to flow from one side in the longitudinal direction to the other side inside, and has a flow space inside for the refrigerant to flow through, the flat outer shell member, an intermediate plate member disposed in the flow space, which divides the flow space in the thickness direction to form a divided flow space, and a flow path forming member disposed in the divided flow space and having a flow path forming portion that forms a flow path for the refrigerant in the divided flow space. The flow path has a first flow path for flowing the refrigerant in the longitudinal direction and a second flow path for flowing the refrigerant in the short side direction of the flat shape. The flow path forming portion has a first flow path forming portion that forms the first flow path and a second flow path forming portion that forms the second flow path, and is characterized in that the first flow path formed by the first flow path forming portion and the second flow path formed by the second flow path forming portion intersect so as to be communicable.

[0008] The present invention also provides a plurality of cooling bodies stacked in the thickness direction, an electronic component disposed between the stacked cooling bodies, a refrigerant supply portion that supplies the refrigerant to the cooling body, and a refrigerant discharge portion that discharges the refrigerant from the cooling body. Among the plurality of cooling bodies stacked in the thickness direction, the cooling body disposed at the other end in the thickness direction is used as an end cooling body. The outer shell member of the cooling body is provided with a supply port that communicates with the flow space and to which the refrigerant is supplied, and a discharge port that communicates with the flow space and discharges the refrigerant. The supply port is provided with a first supply port and a second supply port, and the discharge port is provided with a first discharge port and a second discharge port. The end cooling body is provided with only the first supply port as the supply port and only the first discharge port as the discharge port. Among the plurality of cooling bodies stacked in the thickness direction, the cooling body disposed at one end in the thickness direction is a stacked cooler in which the refrigerant supply portion and the refrigerant discharge portion are connected.

[0009] According to the present invention, the cooling effect of the cooling body and the stacked cooler using the cooling body can be further improved. Specifically, in the flat cooling body used in a stacked cooler for cooling electronic components from both sides and allowing the refrigerant to flow from one side to the other side in the longitudinal direction inside, the flow path forming portion of the flow path forming member disposed in the divided flow space formed inside the flat outer shell member and divided in the thickness direction by the intermediate plate member to form a flow path for the refrigerant to flow through the divided flow space. Thus, heat exchange can be performed between the cooling body disposed on both sides of the electronic component generating heat in the stacked cooler and the electronic component by the refrigerant flowing along the flow path, thereby achieving cooling.

[0010] In addition, the flow path formed by the flow path forming portion of the flow path forming member has a first flow path for allowing the refrigerant to flow in the longitudinal direction of the flat shape and a second flow path for allowing the refrigerant to flow in the short side direction of the flat shape. Since the flow path forming member has a first flow path forming portion for forming the first flow path and a second flow path forming portion for forming the second flow path, the surface area can be expanded compared to a flow path forming member provided with only one of the first flow path forming portion and the second flow path forming portion, and the heat exchange property by the flowing refrigerant can be improved.

[0011] Further, since the first flow path formed by the first flow path forming portion and the second flow path formed by the second flow path forming portion intersect in a communicable manner, a turbulent flow occurs in the refrigerant flowing through the intersecting first flow path and second flow path. Therefore, compared with the case where the refrigerant is made to flow through the first flow path and the second flow path that do not intersect in a communicable manner, heat exchange between the refrigerant and the electronic component can be efficiently performed, and the electronic component can be efficiently cooled. Therefore, the cooling effect of the cooling body and the stacked cooler using the cooling body can be further improved. Note that in the stacked cooler in which a plurality of the cooling bodies configured as described above are stacked, the refrigerant supplied from the refrigerant supply portion flows through the cooling body and is discharged from the refrigerant discharge portion, so that the electronic component can be cooled.

[0012] As an aspect of the present invention, the flow paths may be formed on both sides in the thickness direction of the flow path forming member. According to the present invention, since the flow paths are formed on both sides in the thickness direction of the flow path forming member, the surface area of the flow path forming member can be further enlarged. Thereby, the heat exchange efficiency between the electronic component and the refrigerant can be further improved. Therefore, the cooling effect of the cooling body and the stacked cooler using the cooling body can be further improved.

[0013] Also, as an aspect of the present invention, the first flow path on one side in the thickness direction and the first flow path on the other side may be alternately arranged in the short side direction, and the second flow path on one side in the thickness direction and the second flow path on the other side may be alternately arranged in the long side direction.

[0014] According to the present invention, since the first flow path on one side in the thickness direction and the first flow path on the other side are alternately arranged in the short side direction, and the second flow path on one side in the thickness direction and the second flow path on the other side are alternately arranged in the long side direction, in the flow path forming member, the thickness along the thickness direction can be formed compactly. Thereby, the cooling body for housing the flow path forming member can be configured compactly, and the stacked cooler in which the cooling bodies are stacked can also be made compact.

[0015] Also, as an aspect of the present invention, the first flow path may be in a substantially corrugated shape in which convex portions and concave portions are alternately arranged along the long side direction, and the second flow path may be in a substantially corrugated shape in which convex portions and concave portions are alternately arranged along the short side direction.

[0016] According to the present invention, since the first flow path and the second flow path are formed in a substantially corrugated shape, the turbulence intensity of the turbulent flow generated in the refrigerant flowing through the first flow path and the second flow path, that is, the degree of the strength of disturbing the flow of the refrigerant, becomes high. Thereby, the heat exchange between the electronic component and the refrigerant can be further promoted, and the cooling effect of the cooling body on the heat of the electronic component can be further improved. In addition, the thickness along the thickness direction of the flow path forming member can be formed compactly.

[0017] Also, as an aspect of the present invention, both the first flow path and the second flow path may have a trapezoidal cross section. According to the present invention, the fluidity of the refrigerant with respect to the first flow path and the second flow path can be improved. That is, the refrigerant that generates turbulent flow by flowing through the first flow path and the second flow path becomes easier to flow. Thereby, the heat exchange efficiency between the electronic component and the refrigerant can be further improved, and the heat exchange between the electronic component and the refrigerant can be further promoted. Therefore, the cooling effect of the cooling body and the stacked cooler using the cooling body can be further improved.

[0018] Also, as an aspect of the present invention, the flow path forming member having the first flow path forming portion and the second flow path forming portion may be composed of a metal plate material having an uneven shape in the thickness direction. According to the present invention, the flow path forming member can be easily configured by processing a metal plate material having a high thermal conductivity.

[0019] Also, as an aspect of the present invention, the flow path forming member may be disposed on both sides of the intermediate plate member in the thickness direction, and at least a part of the flow path forming portion may be in contact with the outer shell member. According to the present invention, in the cooling body, the first flow path and the second flow path are provided on both sides of the intermediate plate member. Therefore, in the cooling body, compared with the case where the flow path forming member is provided only on one side of the intermediate plate member in the thickness direction, the contact area between the flowing refrigerant and the flow path forming member can be increased. Accordingly, the heat exchange efficiency between the electronic component and the refrigerant can be further improved, and the cooling effect of the cooling body and the stacked cooler using the cooling body can be further improved.

[0020] Furthermore, since at least a part of the flow path forming portion is in contact with the outer shell member, in the stacked cooler, the heat of the electronic component is first conducted to the outer shell member, and then conducted from the outer shell member to the flow path forming member, and then conducted from the flow path forming member to the refrigerant. At this time, heat can be directly conducted from the outer shell member to the flow path forming portion by the contact portion between the outer shell member and the flow path forming portion. Thereby, the heat of the electronic component can be more efficiently conducted to the refrigerant via the flow path forming member, and the heat exchange efficiency between the electronic component and the refrigerant can be further improved. Therefore, the cooling effect of the cooling body on the heat of the electronic component can be further improved.

Advantages of the Invention

[0021] According to the present invention, it is possible to provide a cooling body and a stacked cooler capable of further improving the cooling effect.

Brief Description of the Drawings

[0022]

Figure 1

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Figure 19

Embodiments for Carrying Out the Invention

[0023] One embodiment of this invention will be described below together with FIGS. 1 to 11. (First Embodiment) FIG. 1 shows a schematic perspective view of the stacked cooler 1, and FIG. 2 shows a schematic exploded perspective view of the stacked cooler 1. FIG. 3 shows a schematic exploded perspective view of the cooling body 10, FIG. 4 shows a schematic exploded perspective view of the lower cooling body 10B, and FIG. 5 shows a schematic partial cross-sectional view of the cooling body 10. FIGS. 6 to 9 show explanatory drawings of the cooling fins 13, FIG. 10 shows a schematic enlarged cross-sectional view of the stacked cooler 1, and FIG. 11 shows an explanatory drawing of the stacked cooler 1.

[0024] Details will be described with reference to FIGS. 5 to 11. FIG. 5(a) shows a schematic cross-sectional view along the longitudinal direction L at the central portion in the depth direction D of the cooling body 10, and FIG. 5(b) shows a schematic cross-sectional view along the depth direction D at the central portion in the longitudinal direction L of the cooling body 10. FIG. 6(a) shows a schematic enlarged perspective view seen from above the cooling fins 13, and FIG. 6(b) shows an enlarged view of part a in FIG. 6(a). FIG. 7(a) shows a schematic enlarged perspective view seen from below the cooling fins 13, and FIG. 7(b) shows an enlarged view of part b in FIG. 7(a).

[0025] FIG. 8(a) shows a schematic enlarged plan view of the cooling fins 13, and FIG. 8(b) shows an enlarged view of part c in FIG. 8(a). FIG. 9(a) shows a view taken along the A-A arrow in FIG. 8(a), FIG. 9(b) shows a view taken along the B-B arrow in FIG. 8(a), FIG. 9(c) shows a view taken along the C-C arrow in FIG. 8(a), and FIG. 9(d) shows a view taken along the D-D arrow in FIG. 8(a).

[0026] FIG. 10 shows a schematic enlarged cross-sectional view along the longitudinal direction L at the central portion in the depth direction D of the stacked cooler 1. FIG. 11(a) shows a schematic enlarged cross-sectional view of part d in FIG. 10, FIG. 11(b) shows a schematic enlarged cross-sectional view of part e in FIG. 10, FIG. 11(c) shows a schematic enlarged cross-sectional view of part f in FIG. 10, and FIG. 11(d) shows a schematic enlarged cross-sectional view of part g in FIG. 10(c).

[0027] Here, the direction along the long side of the cooling body 10 having a substantially oval shape in plan view is defined as the longitudinal direction L. The right rear side in FIG. 1 is defined as one side La, and the left front side is defined as the other side Lb. Among the directions orthogonal to the longitudinal direction L, the direction connecting the right front side and the left rear side is defined as the depth direction D, and the vertical direction is defined as the height direction H. The upper side in the height direction H is defined as the upper side Hu, and the lower side is defined as the lower side Hd. Hereinafter, the same shall apply to FIGS. 2 to 11.

[0028] As shown in FIGS. 1 and 2, the stacked cooler 1 is composed of a plurality of cooling bodies 10 stacked in the height direction H and electronic components 20, which are heat-generating bodies sandwiched and held between the cooling bodies 10. The refrigerant 100, which is a fluid, circulates inside the cooling body 10 to cool the electronic components 20.

[0029] In the stacked cooler 1 of this embodiment, nine cooling bodies 10 are stacked in the height direction H, and each of the eight electronic components 20 is disposed between the cooling bodies 10. Further, among the cooling bodies 10 stacked in the height direction H, the cooling body 10 disposed on the uppermost side Hu is defined as the upper-stage cooling body 10A, and the cooling body 10 disposed on the lowermost side Hd is defined as the lower-stage cooling body 10B.

[0030] And in the stacked cooler 1, in the upper-stage cooling body 10A disposed on the uppermost side Hu, a pipe 30 for supplying the refrigerant 100 to the cooling body 10 of the stacked cooler 1 or discharging the refrigerant 100 from the cooling body 10 is connected to the upper rib 114 described later. Note that the other end side of the pipe 30 is connected to a radiator (not shown) or the like.

[0031] Specifically, among the pipes 30 connected to the upper rib 114 described later, the pipe 30 connected to the upper supply rib 114a on one side La is an inlet pipe 31 for supplying the refrigerant 100 into the cooling body 10, and the pipe 30 connected to the upper discharge rib 114b on the other side Lb is an outlet pipe 32 for discharging the refrigerant 100 from the cooling body 10. Note that the upper rib 114, the upper supply rib 114a, and the upper discharge rib 114b will be described in detail later.

[0032] First, in the stacked cooler 1, the electronic component 20 disposed between the cooling bodies 10 will be described. The electronic component 20 is a so-called semiconductor device for power control, and is composed of semiconductor elements such as an insulated gate bipolar transistor (IGBT), for example. Such an electronic component 20 includes a thin rectangular parallelepiped-shaped component body 21 and three flat plate-shaped terminals 22 protruding from the component body 21.

[0033] To cool the electronic component 20, the cooling body 10, as shown in FIG. 3, is composed of a housing 11, an intermediate plate 12 assembled to the housing 11, and cooling fins 13 accommodated in the housing 11. Note that the housing 11, the intermediate plate 12, and the cooling fins 13 are made of an appropriate metal that satisfies the required performance such as thermal conductivity and strength, for example, an aluminum alloy.

[0034] The housing 11 is a hollow case body that is formed in a substantially oval shape that is long in the longitudinal direction L in a plan view and has a flow space S in which the refrigerant 100 can flow. Such a housing 11 is composed of an upper plate 111 disposed on the upper side Hu and a lower plate 112 mounted on the lower side Hd of the upper plate 111.

[0035] The upper plate 111 is substantially oval in shape that is long in the longitudinal direction L that forms the shape of the housing 11 in a plan view, and is substantially flat in shape with the height direction H lower than the longitudinal direction L, and is formed in a substantially reverse concave cross-section. More specifically, in the upper plate 111, a portion at a predetermined interval inward from the outer edge portion 111a protrudes upward Hu by a size slightly smaller than the outer shape of the upper plate 111 (see FIG. 3). In this way, the upper plate 111 is formed in a substantially reverse concave cross-section in which the surface on the lower side Hd is concave upward Hu.

[0036] In the upper plate 111 having such a shape, a circular upper through-hole 113 and upper ribs 114 standing from the inner edge portion of the upper through-hole 113 are provided near both ends in the longitudinal direction L. The upper through-hole 113 is a hole for supplying the refrigerant 100 to the inside or discharging the refrigerant 100 to the outside in the cooling body 10. The upper through-holes 113 are respectively provided near both ends in the longitudinal direction L of the upper plate 111. Here, among the upper through-holes 113, the upper through-hole 113 provided on one side La is defined as the first supply port 113a for supplying the refrigerant 100, and the upper through-hole 113 provided on the other side Lb is defined as the first discharge port 113b for discharging the refrigerant 100. The first supply port 113a is formed with a diameter slightly larger than that of the first discharge port 113b.

[0037] The upper rib 114 is a connecting portion for connecting the stacked cooling bodies 10 or the above-described pipe 30 to each other in the stacked cooler 1. The upper rib 114 erected in the height direction H from the inner edge portion of the upper through-hole 113 is formed in a cylindrical shape. Here, among the upper ribs 114, the side erected from the inner edge portion of the first supply port 113a is defined as the upper supply rib 114a, and the side erected from the inner edge portion of the first discharge port 113b is defined as the upper discharge rib 114b. Further, the upper supply rib 114a erected from the inner edge portion of the first supply port 113a formed with a diameter slightly larger than that of the first discharge port 113b has a cylindrical shape with a larger diameter than the upper discharge rib 114b erected from the inner edge portion of the first discharge port 113b.

[0038] The lower plate 112 attached to the upper plate 111 has substantially the same shape as the upper plate 111 and is arranged in an up-and-down symmetric orientation. Specifically, a location at a predetermined interval inward from the outer edge portion 112a protrudes downward Hd with a size slightly smaller than the outer shape of the lower plate 112. In this way, the lower plate 112 is formed in a substantially concave cross-section in which the upper surface Hu is concave downward Hd.

[0039] In this way, the lower plate 112 having an up-and-down symmetric orientation with the upper plate 111 is provided with a circular lower through-hole 115 and a lower rib 116 erected from the inner edge portion of the lower through-hole 115 near both ends in the longitudinal direction L.

[0040] The lower through-hole 115 is, similarly to the upper through-hole 113, a hole in the cooling body 10 for supplying the refrigerant 100 to the inside or discharging the refrigerant 100 to the outside. The lower through-holes 115 are respectively provided near both ends in the longitudinal direction L of the upper plate 111. Here, among the lower through-holes 115, the lower through-hole 115 provided on one side La is defined as the second discharge port 115a for discharging the refrigerant 100, and the lower through-hole 115 provided on the other side Lb is defined as the second supply port 115b for supplying the refrigerant 100. Note that the second supply port 115b is formed with a diameter slightly larger than that of the second discharge port 115a.

[0041] The lower rib 116 is a connecting portion for connecting the stacked cooling bodies 10 in the stacked cooler 1. The lower rib 116 standing in the height direction H from the inner edge portion of the lower through-hole 115 is formed in a cylindrical shape. Here, among the lower ribs 116, the side standing from the inner edge portion of the second discharge port 115a is defined as the lower discharge rib 116a, and the side standing from the inner edge portion of the second supply port 115b is defined as the lower supply rib 116b. Further, the lower supply rib 116b standing from the inner edge portion of the second supply port 115b formed with a diameter slightly larger than that of the second discharge port 115a has a cylindrical shape with a larger diameter than the lower discharge rib 116a standing from the inner edge portion of the second discharge port 115a.

[0042] The lower plate 112 configured as described above is mounted on the upper plate 111 with the upper rib 114 facing the upper side Hu such that the lower rib 116 faces the lower side Hd (see FIG. 3). Specifically, the outer edge portion 111a of the upper plate 111 and the outer edge portion 112a of the lower plate 112 are overlapped and integrated in the height direction H.

[0043] At this time, the housing 11 assembled with the upper plate 111 and the lower plate 112 is mounted such that the upper supply rib 114a of the upper plate 111 and the lower discharge rib 116a of the lower plate 112, and the upper discharge rib 114b of the upper plate 111 and the lower supply rib 116b of the lower plate 112 face each other in the height direction H.

[0044] Here, as described above, since the upper plate 111 and the lower plate 112 are formed in a substantially concave cross-sectional shape, a predetermined space (referred to as a flow space S) for allowing the refrigerant 100 to flow inside is formed by integrally assembling the upper plate 111 and the lower plate 112. Note that the flow space S is a space in which one intermediate plate 12 and two cooling fins 13 are arranged, as shown in FIGS. 5(a) and 5(b).

[0045] As described above, the intermediate plate 12 arranged in the flow space S is a substantially flat plate-like body having substantially the same shape as the upper plate 111 and the lower plate 112 constituting the housing 11 in plan view, and plate holes 121 are formed in the vicinity of both ends in the longitudinal direction L.

[0046] The plate holes 121 provided in the vicinity of both ends in the longitudinal direction L are located at positions corresponding to the upper through holes 113 and the lower through holes 115 in a state where the intermediate plate 12 is assembled to the cooling body 10, that is, positions where the upper through holes 113 of the upper plate 111, the plate holes 121 of the intermediate plate 12, and the lower through holes 115 of the lower plate 112 communicate in the height direction H.

[0047] And, inside the cooling body 10, the cooling fins 13 arranged one by one in the upper space S1 and the lower space S2 to be described later are substantially rectangular plate-like bodies made of metal having concavo-convex shapes along the longitudinal direction L and the depth direction D on both surfaces, as shown in FIGS. 6 to 9.

[0048] Specifically, as shown in FIGS. 6(a) and 6(b), the cooling fins 13 are formed such that convex ridges 131 and concave valleys 132 along the longitudinal direction L are alternately formed along the depth direction D, and on each of the ridges 131 and valleys 132, convex protrusions 133 and concave portions 134 are alternately formed along the longitudinal direction L. Among the convex protrusions 133 formed on each of the ridges 131 and valleys 132, the convex protrusion 133 formed on the ridge 131 is defined as the mountain-side convex protrusion 1331, and the convex protrusion 133 formed on the valley 132 is defined as the valley-side convex protrusion 1332. Similarly, among the concave portions 134 formed on each of the ridges 131 and valleys 132, the concave portion 134 formed on the ridge 131 is defined as the mountain-side concave portion 1341, and the concave portion 134 formed on the valley 132 is defined as the valley-side concave portion 1342.

[0049] In this way, by forming the ridges 131, valleys 132, protrusions 133, and concave portions 134, the cooling fins 13 have an uneven shape with protrusions and recesses repeating in the height direction H along the depth direction D, and also have an uneven shape with protrusions and recesses repeating in the height direction H along the longitudinal direction L.

[0050] As shown in FIGS. 6(a) and 6(b), the ridge 131 is formed with an isosceles trapezoidal cross-section that is convex upward toward the upper side Hu, with a pair of inclined surfaces 141 approaching each other as they go toward the upper side Hu, and an upper surface 142 connecting the tips of the inclined surfaces on the upper side Hu.

[0051] As shown in FIGS. 6(a) and 6(b), the valley 132 is formed with an isosceles trapezoidal cross-section that is convex downward toward the lower side Hd, with a pair of inclined surfaces 141 approaching each other as they go toward the lower side Hd, and a bottom surface 143 connecting the tips of the inclined surfaces on the lower side Hd.

[0052] Therefore, the inclined surface 141 connects the upper surface 142 and the bottom surface 143 adjacent to each other in the depth direction D in a direction inclined in the height direction H and the depth direction D. Thus, the height of the ridge portion 131, that is, the length in the height direction H from the bottom surface 143 to the upper surface 142, and the depth of the groove portion 132, that is, the length in the height direction H from the upper surface 142 to the bottom surface 143, are equal, and the cross-sectional shape of the ridge portion 131 and the cross-sectional shape of the groove portion 132 are equal but opposite in the height direction H.

[0053] Note that the upper surface 142 forming the ridge portion 131 having the convex portion 1331 on the ridge side and the concave portion 1341 on the ridge side has a convex upper surface 1421, a concave upper surface 1422, and an inclined upper surface 1423. Specifically, the upper surface 142 has a convex upper surface 1421 that constitutes the upper surface of the convex portion 1331 on the ridge side, a concave upper surface 1422 that constitutes the bottom surface of the concave portion 1341 on the ridge side, and an inclined upper surface 1423 that connects the convex upper surface 1421 and the concave upper surface 1422 in a direction inclined with respect to the height direction H, and is formed in a wave shape along the longitudinal direction L.

[0054] Further, the bottom surface 143 forming the groove portion 132 having the convex portion 1332 on the groove side and the concave portion 1342 on the groove side has a convex lower surface 1431, a concave lower surface 1432, and an inclined lower surface 1433. Specifically, the bottom surface 143 has a convex lower surface 1431 that constitutes the upper surface of the convex portion 1332 on the groove side, a concave lower surface 1432 that constitutes the bottom surface of the concave portion 1342 on the groove side, and an inclined lower surface 1433 that connects the convex lower surface 1431 and the concave lower surface 1432 in a direction inclined with respect to the height direction H, and is formed in a wave shape along the longitudinal direction L. The inclined surface 141 that connects the upper surface 142 and the bottom surface 143 configured as described above in a direction inclined with respect to the height direction H and the depth direction D has a wave shape in a side view.

[0055] In addition, the convex portions 133 and concave portions 134 formed in each of the peak portions 131 and valley portions 132 are formed at the same position in the longitudinal direction L. Specifically, the peak-side convex portion 1331 formed in the peak portion 131, the valley-side convex portion 1332 formed in the valley portion 132, the peak-side concave portion 1341 formed in the peak portion 131, and the valley-side concave portion 1342 formed in the valley portion 132 are formed at the same position in the longitudinal direction L.

[0056] Therefore, the peak-side convex portions 1331 and valley-side convex portions 1332, and the peak-side concave portions 1341 and valley-side concave portions 1342 in the peak portions 131 and valley portions 132 formed alternately along the depth direction D are also arranged alternately along the depth direction D.

[0057] In addition, the height of the peak-side convex portion 1331 with respect to the valley-side convex portion 1332 and the height of the peak-side concave portion 1341 with respect to the valley-side concave portion 1342 are equal. Specifically, the height of the convex upper surface 1421 constituting the peak-side convex portion 1331 with respect to the convex lower surface 1431 constituting the valley-side convex portion 1332 is equal to the height of the convex lower surface 1431 constituting the peak-side concave portion 1341 with respect to the concave lower surface 1432 constituting the valley-side concave portion 1342.

[0058] In the cooling fins 13, the peak portions 131, valley portions 132, convex portions 133, and concave portions 134 formed on the upper surface Hu are described with reference to FIG. 6. However, as shown in FIG. 7, the peak portions 131, valley portions 132, convex portions 133, and concave portions 134 are also formed on the lower surface Hd of the cooling fins 13. However, the peak portions 131 and valley portions 132, and the convex portions 133 and concave portions 134 on the upper surface Hu are the valley portions 132 and peak portions 131, and the concave portions 134 and convex portions 133 on the lower surface Hd. That is, the peak portions 131 and convex portions 133 protruding upward on the upper surface Hu become the valley portions 132 and concave portions 134 that are concave toward the upper surface Hu on the lower surface Hd, and the valley portions 132 and concave portions 134 that are concave toward the upper surface Hu on the upper surface Hu become the peak portions 131 and convex portions 133 protruding upward on the lower surface Hd.

[0059] Therefore, regarding the peaks 131 to concave portions 134 on the lower side Hd surface of the cooling fins 13, that is, the surface on the side of the intermediate plate 12, the peaks 131 and convex portions 133 on the upper side Hu surface may be read as the valleys 132 and concave portions 134 on the lower side Hd surface, and the valleys 132 and concave portions 134 on the upper side Hu surface may be read as the peaks 131 and convex portions 133 on the lower side Hd surface.

[0060] The above-described cooling body 10 configured as such has the intermediate plate 12 and the cooling fins 13 accommodated in the flow space S formed inside the housing 11 (see FIG. 5). In the cooling body 10, by disposing the intermediate plate 12 in the flow space S, the flow space S is divided into two in the height direction H. Here, of the divided flow spaces S, the upper side Hu space is defined as the upper side space S1, and the lower side Hd space is defined as the lower side space S2 (see FIGS. 5(a) and 5(b)).

[0061] And the cooling fins 13 are disposed in each of the upper side space S1 and the lower side space S2. The cooling fins 13 are disposed in the same orientation. And the cooling fin 13 disposed in the upper side space S1 is disposed such that the convex upper surface 1421 of the upper surface 142 that constitutes the peak 131, that is, the uppermost surface Hu, abuts against the upper plate 111, and the concave lower surface 1432 of the bottom surface 143 that constitutes the valley 132, that is, the lowermost surface Hd, abuts against the intermediate plate 12.

[0062] Conversely, the cooling fin 13 disposed in the lower side space S2 is disposed such that the convex upper surface 1421 of the upper surface 142 that constitutes the peak 131, that is, the uppermost surface Hu, abuts against the intermediate plate 12, and the concave lower surface 1432 of the bottom surface 143 that constitutes the valley 132, that is, the lowermost surface Hd, abuts against the lower plate 112.

[0063] In addition, the housing 11 that houses the intermediate plate 12 and the cooling fins 13 inside in this way is integrated in a state where the upper plate 111 and the lower plate 112 are laminated in the height direction H.

[0064] The cooling body 10 configured in this way can form a flow path R through which the refrigerant 100 flows in the upper space S1 and the lower space S2 where the cooling fins 13 are arranged. Specifically, in the upper space S1, a flow path R is formed between the inner surface of the upper plate 111 and the upper surface Hu of the cooling fins 13, and between the lower surface Hd of the cooling fins 13 and the upper surface Hu of the intermediate plate 12. In the lower space S2, a flow path R is formed between the upper surface Hu of the cooling fins 13 and the lower surface Hd of the intermediate plate 12, and between the lower surface Hd of the cooling fins 13 and the inner surface of the lower plate 112.

[0065] More specifically, in the upper side Hu of the cooling fins 13 in the upper space S1, a longitudinal flow path RL extending in the longitudinal direction L is formed by the valley portion 132 and the inner surface of the upper plate 111. Also, a transverse flow path RS extending in the depth direction D is formed by the concave portion 134 formed in the peak portion 131 and the valley portion 132 and the inner surface of the upper plate 111.

[0066] In addition, in the lower side Hd of the cooling fins 13 in the upper space S1, a longitudinal flow path RL extending in the longitudinal direction L is formed by the valley portion 132 and the upper surface Hu of the intermediate plate 12, and a transverse flow path RS extending in the depth direction D is formed by the concave portion 134 formed in the peak portion 131 and the valley portion 132 and the upper surface Hu of the intermediate plate 12.

[0067] Furthermore, in the lower space S2, a longitudinal flow path RL and a transverse flow path RS are formed with the same configuration. That is, in the upper space S1 and the lower space S2 where the flow space S is divided in the height direction H by the intermediate plate 12, a longitudinal flow path RL and a transverse flow path RS are formed on each of the upper side Hu and the lower side Hd of the cooling fins 13.

[0068] The longitudinal flow path RL is formed by the convex lower surface 1431, the concave lower surface 1432, and the inclined lower surface 1433 on the bottom surface 143 that constitutes the trough portion 132, and has a corrugated shape formed by the valley-side convex portions 1332 and the valley-side concave portions 1342 that are alternately arranged in the longitudinal direction L.

[0069] The short transverse flow path RS formed by the concave portion 134 and the inner surface of the upper plate 111 has a corrugated shape formed by the peak-side concave portion 1341 in the peak portion 131 and the valley-side concave portion 1342 in the valley portion 132. Furthermore, the longitudinal flow path RL extending in the longitudinal direction L and the short transverse flow path RS extending in the depth direction D are arranged in a grid pattern in plan view, and are communicatively connected through the concave portion 134 of the trough portion 132 (see Fig. 8(b)).

[0070] The cooling bodies 10 configured in this way are stacked in the height direction H, and the electronic components 20 are arranged between the cooling bodies 10 to form a stacked cooler 1. Here, in the stacked cooler 1 of the present embodiment, nine cooling bodies 10 are stacked in the height direction H as described above, and each of the eight electronic components 20 is arranged between the cooling bodies 10. Also, among the cooling bodies 10 stacked in the height direction H, the cooling body 10 arranged on the uppermost side Hu is defined as the upper-stage cooling body 10A, and the cooling body 10 arranged on the lowermost side Hd is defined as the lower-stage cooling body 10B. However, only the lower-stage cooling body 10B has a different shape from the other cooling bodies 10.

[0071] In the stacked cooler 1, the lower-stage cooling body 10B arranged on the lowermost side Hd has the same shape as the other cooling bodies 10 except that the shape of the lower plate 112 that constitutes the housing 11 is different from that of the other cooling bodies 10. Here, the lower plate 112 that constitutes the lower-stage cooling body 10B is referred to as the lower-stage lower plate 112B. Unlike the lower plate 112, the lower-stage lower plate 112B is formed in a substantially concave cross-section in which the lower through-hole 115 and the lower rib 116 are not provided (see Fig. 4).

[0072] Then, eight cooling bodies 10 are stacked above the lower cooling body 10B configured as described above. With electronic components 20 arranged between the lower cooling body 10B and the cooling bodies 10, and between the cooling bodies 10 themselves, an inlet pipe 31 is connected to the upper supply rib 114a of the upper cooling body 10A, and an outlet pipe 32 is connected to the upper discharge rib 114b, thereby forming a stacked cooler 1 in which the refrigerant 100 can circulate inside.

[0073] Specifically, between the cooling bodies 10, between the upper cooling body 10A and the cooling body 10, or between the lower cooling body 10B and the cooling body 10, as shown in FIG. 10, the lower discharge rib 116a on the upper side Hu is inserted and fitted inside the upper supply rib 114a on the lower side Hd, and the upper discharge rib 114b on the lower side Hd is inserted and fitted inside the lower supply rib 116b on the upper side Hu, so that the upper through-hole 113, the plate hole 121, and the lower through-hole 115 can be assembled in a communicable manner.

[0074] In the stacked cooler 1 configured as described above, the refrigerant 100 can be circulated through the flow space S inside the cooling body 10. For the following description, unless otherwise noted for the upper cooling body 10A and the lower cooling body 10B, the upper cooling body 10A and the lower cooling body 10B will also be described as the cooling body 10.

[0075] Specifically, when the refrigerant 100 is supplied from the inlet pipe 31 to the upper cooling body 10A of the stacked cooler 1, as shown in FIG. 11(a), the refrigerant 100 is introduced into the flow space S from the first supply port 113a, and the refrigerant 100 passes through the plate hole 121 and is discharged from the second discharge port 115a.

[0076] The refrigerant 100 discharged from the second discharge port 115a is supplied from the first supply port 113a of the cooling body 10 on the lower side Hd fitted to the lower discharge rib 116a into the flow space S of the cooling body 10 on the lower side Hd. This is repeatedly carried out in sequence for the cooling body 10 on the lower side Hd. In the lowermost lower-stage cooling body 10B on the lower side Hd, as shown in FIG. 11(b), the refrigerant 100 discharged from the second discharge port 115a of the cooling body 10 on the upper side Hu is supplied to the flow space S from the first supply port 113a of the upper supply rib 114a fitted and connected to the lower discharge rib 116a on the lower side of the cooling body 10. Since the lower-stage cooling body 10B is not provided with the lower through-hole 115, the supplied refrigerant 100 flows through the flow space S.

[0077] The refrigerant 100 supplied to the flow space S as described above flows into the upper space S1 and the lower space S2 divided in the height direction H by the intermediate plate 12. The refrigerant 100 flowing into the upper space S1 and the lower space S2 exchanges heat with the electronic component 20 sandwiched between the cooling bodies 10 while flowing through the flow path R formed by the inner surface of the housing 11, the cooling fins 13, and the intermediate plate 12 as described above, and can cool the electronic component 20.

[0078] Specifically, the refrigerant 100 flowing into the upper space S1 and the lower space S2 passes through the longitudinal flow path RL extending in the longitudinal direction L and flows in the longitudinal direction L from one side La toward the other side Lb. Further, the refrigerant 100 flowing around the longitudinal flow path RL and the cooling fins 13 flows in the depth direction D by the short-side flow path RS.

[0079] At this time, since the longitudinal flow path RL and the short-side flow path RS are communicatively connected so that the refrigerant 100 can flow through, a turbulent flow occurs in the flow of the refrigerant 100. Further, since the longitudinal flow path RL and the short-side flow path RS are formed in a corrugated shape along the extending direction, the intensity of the turbulent flow generated in the refrigerant 100 flowing through the longitudinal flow path RL and the short-side flow path RS increases.

[0080] However, since the longitudinal flow path RL and the short-side flow path RS have an isosceles trapezoidal cross-section, the refrigerant 100 in which the turbulent flow has occurred can flow smoothly through the longitudinal flow path RL and the short-side flow path RS. In this way, the refrigerant 100 supplied from the first supply port 113a on one side La flows through the flow path R in the circulation space S, reaches the other side Lb, and can be discharged from the first discharge port 113b.

[0081] Specifically, in the lower cooling body 10B, the refrigerant 100 that has passed through the flow path R and reached the other side Lb is discharged upward from the first discharge port 113b toward the cooling body 10 on the upper side Hu as shown in Fig. 11(c). The upper cooling body 10 on the upper side Hu, in which the lower supply rib 116b is fitted to the upper discharge rib 114b of the cooling body 10 on the lower side Hd, allows the refrigerant 100 discharged from the cooling body 10 on the lower side Hd to flow in from the second supply port 115b. At the same time, the refrigerant 100 that has flowed through the circulation space S of the cooling body 10 reaches the other side Lb and is discharged together toward the cooling body 10 on the upper side Hu from the first discharge port 113b.

[0082] Repeating this process, in the upper cooling body 10A on the uppermost upper side Hu, as shown in Fig. 11(d), the refrigerant 100 discharged from the cooling body 10 on the lower side Hd flows in from the second supply port 115b. At the same time, the refrigerant 100 that has flowed through the circulation space S of the cooling body 10 reaches the other side Lb and is discharged together from the first discharge port 113b to the outlet pipe 32.

[0083] In this way, the stacked cooler 1 in which the refrigerant 100 supplied from the inlet pipe 31 flows through the circulation space S of each cooling body 10 and is discharged from the outlet pipe 32 can cool the electronic component 20 arranged between the cooling bodies 10 by flowing through the flow path R formed by the cooling fins 13 arranged in the circulation space S.

[0084] As described above, the flat cooling body 10 used in the stacked cooler 1 for cooling the electronic component 20 from both sides and allowing the refrigerant 100 to flow in the direction from one side La to the other side Lb in the longitudinal direction L inside includes a flat housing 11 having a flow space S for allowing the refrigerant 100 to flow inside, an intermediate plate 12 disposed in the flow space S and dividing the flow space S in the height direction H to form an upper space S1 and a lower space S2, and cooling fins 13 disposed in the upper space S1 and the lower space S2 and having ridges 131, concave portions 134, etc. that form flow paths R of the refrigerant 100 in the upper space S1 and the lower space S2. The flow path R has a longitudinal flow path RL for allowing the refrigerant 100 to flow in the longitudinal direction L and a transverse flow path RS for allowing the refrigerant 100 to flow in the flat depth direction D. The ridges 131, concave portions 134, etc. have ridges 131 that form the longitudinal flow path RL and concave portions 134 that form the transverse flow path RS, and the longitudinal flow path RL formed by the ridges 131 and the transverse flow path RS formed by the concave portions 134 intersect so as to be communicable.

[0085] Further, the stacked cooler 1 includes a plurality of cooling bodies 10 stacked in the height direction H, electronic components 20 disposed between the stacked cooling bodies 10, an inlet pipe 31 for supplying refrigerant 100 to the cooling bodies 10, and an outlet pipe 32 from which the refrigerant 100 is discharged from the cooling bodies 10. Among the plurality of cooling bodies 10 stacked in the height direction H, the cooling body 10 disposed at the other end Lb in the height direction H is defined as the lower-stage cooling body 10B. In the housing 11 of the cooling body 10, there are provided a first supply port 113a and a second supply port 115b that communicate with the flow-through space S and to which the refrigerant 100 is supplied, and a first discharge port 113b and a second discharge port 115a that communicate with the flow-through space S and discharge the refrigerant 100. The first supply port 113a and the second supply port 115b are provided, and the first discharge port 113b and the second discharge port 115a are provided. The lower-stage cooling body 10B is provided with only the first supply port 113a and only the second discharge port 115a. An inlet pipe 31 and an outlet pipe 32 are connected to the cooling body 10 disposed at one end La in the height direction H among the plurality of cooling bodies 10 stacked in the height direction H.

[0086] Therefore, the cooling effect of the cooling body 10 and the stacked cooler 1 using the cooling body 10 can be further improved. Specifically, in the stacked cooler 1 that cools the electronic components 20 from both sides and in the flat cooling body 10 in which the refrigerant 100 flows in the internal longitudinal direction L from one side La to the other side Lb, in the flat housing 11, the flow-through space S for the refrigerant 100 is divided in the height direction H by an intermediate plate 12, and flow paths R through which the refrigerant 100 flows are formed by the peaks 131, concave portions 134, etc. of the cooling fins 13 disposed in the upper-side space S1 and the lower-side space S2. Therefore, heat exchange can be performed between the cooling bodies 10 disposed on both sides of the electronic components 20 that generate heat in the stacked cooler 1 and the electronic components 20 by the refrigerant 100 flowing along the flow paths R, thereby cooling the components.

[0087] Further, the flow path R formed by the crest portions 131, concave portions 134, etc. of the cooling fins 13 has a longitudinal flow path RL for circulating the refrigerant 100 in the longitudinal direction L of the flat shape and a transverse flow path RS for circulating the refrigerant 100 in the depth direction D of the flat shape. Since the cooling fins 13 have the crest portions 131 forming the longitudinal flow path RL and the concave portions 134 forming the transverse flow path RS, the surface area can be enlarged compared to the cooling fins 13 provided with only either the crest portions 131 or the concave portions 134, and the heat exchange performance with the flowing refrigerant 100 can be improved.

[0088] Further, since the longitudinal flow path RL formed by the crest portions 131 and the transverse flow path RS formed by the concave portions 134 intersect in a flowable manner, a turbulent flow occurs in the refrigerant 100 flowing through the intersecting longitudinal flow path RL and transverse flow path RS. Therefore, compared with the case where the refrigerant 100 is circulated through the longitudinal flow path RL and the transverse flow path RS that do not intersect in a flowable manner, the heat exchange between the refrigerant 100 and the electronic component 20 can be efficiently performed, and the electronic component 20 can be efficiently cooled. Thus, the cooling effect of the cooling body 10 and the stacked cooler 1 using the cooling body 10 can be further improved. Note that in the stacked cooler 1 in which a plurality of the cooling bodies 10 configured as described above are stacked, the refrigerant 100 supplied from the inlet pipe 31 circulates through the cooling body 10 and is discharged from the outlet pipe 32, so that the electronic component 20 can be cooled.

[0089] Further, since the flow path R is formed on both sides of the cooling fins 13 in the height direction H of the cooling fins 13, the surface area of the cooling fins 13 can be further enlarged. Thereby, the heat exchange efficiency between the electronic component 20 and the refrigerant 100 can be further improved. Thus, the cooling effect of the cooling body 10 and the stacked cooler 1 using the cooling body 10 can be further improved.

[0090] In addition, since the longitudinal flow paths RL on the upper side Hu and the longitudinal flow paths RL on the lower side Hd of the cooling fins 13 are alternately arranged in the depth direction D, and the transverse flow paths RS on the upper side Hu and the transverse flow paths RS on the lower side Hd are alternately arranged in the longitudinal direction L, in the cooling fins 13, the thickness along the height direction H can be formed compactly. Thereby, the cooling body 10 that houses the cooling fins 13 can be configured compactly, and the stacked cooler 1 in which the cooling bodies 10 are stacked can also be made more compact.

[0091] In addition, the longitudinal flow path RL has a substantially corrugated shape in which the convex portions 133 of the trough portions 132 and the concave portions 134 of the trough portions 132 are alternately arranged along the longitudinal direction L, and the transverse flow path RS has a substantially corrugated shape in which the concave portions 134 of the peak portions 131 and the concave portions 134 of the trough portions 132 are alternately arranged along the depth direction D. That is, since the longitudinal flow path RL and the transverse flow path RS are formed in a substantially corrugated shape, the turbulence intensity of the turbulent flow generated in the refrigerant 100 flowing through the longitudinal flow path RL and the transverse flow path RS, that is, the degree of the strength of disturbing the flow of the refrigerant 100, becomes high. Thereby, the heat exchange between the electronic component 20 and the refrigerant 100 can be further promoted, and the cooling effect of the cooling body 10 on the heat of the electronic component 20 can be further improved. In addition, the thickness along the height direction H of the cooling fins 13 can be formed compactly.

[0092] In addition, since both the longitudinal flow path RL and the transverse flow path RS have a trapezoidal cross section, the fluidity of the refrigerant 100 with respect to the longitudinal flow path RL and the transverse flow path RS can be improved. That is, the refrigerant 100 that generates turbulent flow by flowing through the longitudinal flow path RL and the transverse flow path RS can flow more easily. Thereby, the heat exchange efficiency between the electronic component 20 and the refrigerant 100 can be further improved, and the heat exchange between the electronic component 20 and the refrigerant 100 can be further promoted. Therefore, the cooling effect of the cooling body 10 and the stacked cooler 1 using the cooling body 10 can be further improved.

[0093] In addition, since the cooling fin 13 having the mountain portion 131 and the concave portion 134 is composed of a metal plate material having an uneven shape in the height direction H, the cooling fin 13 can be easily formed by processing a metal plate material having a high thermal conductivity.

[0094] Further, the cooling fins 13 are disposed on both sides of the intermediate plate 12 in the height direction H, and the upper surface 142 of the mountain portion 131 is in contact with the housing 11. Specifically, in the cooling body 10, the longitudinal flow path RL and the lateral flow path RS are provided on both sides of the intermediate plate 12. Therefore, in the cooling body 10, the contact area between the flowing refrigerant 100 and the cooling fins 13 can be expanded as compared with the case where the cooling fins 13 are provided only on one side of the intermediate plate 12 in the height direction H. Accordingly, the heat exchange efficiency between the electronic component 20 and the refrigerant 100 can be further improved, and the cooling effect of the cooling body 10 and the stacked cooler 1 using the cooling body 10 can be further improved.

[0095] Furthermore, since the upper surface 142 of the mountain portion 131 is in contact with the housing 11, in the stacked cooler 1, the heat of the electronic component 20 is first conducted to the housing 11, then conducted from the housing 11 to the cooling fins 13, and then conducted from the cooling fins 13 to the refrigerant 100. At this time, the heat can be directly conducted from the housing 11 to the upper surface 142 of the mountain portion 131 by the housing 11 and the upper surface 142 of the mountain portion 131. Thereby, the heat of the electronic component 20 can be more efficiently conducted to the refrigerant 100 via the cooling fins 13, and the heat exchange efficiency between the electronic component 20 and the refrigerant 100 can be further improved. Therefore, the cooling effect of the cooling body 10 on the heat of the electronic component 20 can be further improved.

[0096] (Second Embodiment) Hereinafter, the cooling fin 13a of the second embodiment will be described with reference to FIG. 12. In the following description, the same components as those described above are denoted by the same reference numerals and the description thereof is omitted.

[0097] Further, FIG. 12 shows a perspective view of the cooling fin 13a of the second embodiment. Specifically, FIG. 12(a) shows a schematic enlarged perspective view seen from above the cooling fin 13a, and FIG. 12(b) shows a schematic enlarged perspective view seen from below the cooling fin 13a.

[0098] The cooling fin 13a of the second embodiment shown in FIG. 12 is provided with a convex portion 133a having a lower height in the height direction H compared to the convex portion 133 of the above-described first embodiment. Since the other configurations are the same as those of the above-described cooling fin 13, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment, the convex portion 133a is formed in a trapezoidal cross-sectional shape with the protruding height suppressed to approximately three-quarters of that of the convex portion 133.

[0099] Note that the cooling fin 13a is formed to have the same overall thickness including the uneven shapes on both sides as the cooling fin 13. Therefore, since the protruding height of the convex portion 133a is formed lower than that of the convex portion 133, the groove depth of the valley portion 132 is formed deeper than the valley portion 132 of the first embodiment.

[0100] The cooling fin 13a having the convex portion 133a configured as described above can increase the surface area compared to the longitudinal flow path RL of the cooling fin 13 of the first embodiment described above. Therefore, the cooling body 10 provided with the cooling fin 13a and the stacked cooler 1 using a plurality of the cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and the cooling effect can be improved by increasing the surface area of the longitudinal flow path RL in the cooling fin 13a.

[0101] (Third Embodiment) Hereinafter, the cooling fin 13b of the third embodiment in which the protruding height of the convex portion 133a is formed higher than that of the cooling fin 13 will be described with reference to FIG. 13. Note that FIG. 13 shows a perspective view of the cooling fin 13b of the third embodiment. Specifically, FIG. 13(a) shows a schematic enlarged perspective view seen from above the cooling fin 13b, and FIG. 13(b) shows a schematic enlarged perspective view seen from below the cooling fin 13b.

[0102] The cooling fin 13b of the third embodiment shown in FIG. 13 is provided with a concave portion 134b instead of the concave portion 134, and since the other configurations are the same as those of the above-described cooling fin 13, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment, the concave portion 134b is formed in a trapezoidal cross-sectional shape having a height in the height direction H of about 1.5 times that of the concave portion 134.

[0103] The cooling fin 13b having the concave portion 134b configured as described above can increase the surface area compared to the short-side flow path RS of the cooling fin 13 of the first embodiment described above. Therefore, the cooling body 10 provided with the cooling fin 13b and the stacked cooler 1 using a plurality of the cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and by increasing the surface area of the short-side flow path RS in the cooling fin 13b, the balance of the refrigerant 100 flowing through the longitudinal flow path RL and the short-side flow path RS can be adjusted, and the desired cooling effect can be adjusted.

[0104] (Fourth Embodiment) Hereinafter, the cooling fin 13c of the fourth embodiment will be described with reference to FIG. 14. Note that FIG. 14 shows a perspective view of the cooling fin 13c of the fourth embodiment. Specifically, FIG. 14(a) shows a schematic enlarged perspective view seen from above the cooling fin 13c, and FIG. 14(b) shows a schematic enlarged perspective view seen from below the cooling fin 13c.

[0105] The cooling fin 13c of the fourth embodiment shown in FIG. 14 is provided with a convex portion 133c and a concave portion 134c instead of the convex portion 133 and the concave portion 134, and since the other configurations are the same as those of the above-described cooling fin 13, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment, the convex portion 133c and the concave portion 134c are formed to have a length in the longitudinal direction L of about 60% of the lengths of the convex portion 133 and the concave portion 134. Therefore, the convex portion 133c and the concave portion 134c are more numerous than the convex portion 133 and the concave portion 134 formed along the longitudinal direction L.

[0106] The cooling fin 13c having the convex portion 133c and the concave portion 134c configured as described above can increase the surface area compared to the longitudinal flow path RL and the lateral flow path RS of the cooling fin 13 of the first embodiment described above. Therefore, the cooling body 10 provided with the cooling fin 13c and the stacked cooler 1 using a plurality of the cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and by increasing the surface areas of the longitudinal flow path RL and the lateral flow path RS in the cooling fin 13c, the cooling effect by the refrigerant 100 flowing through the longitudinal flow path RL and the lateral flow path RS can be improved.

[0107] (Fifth Embodiment) Hereinafter, the cooling fin 13d of the fifth embodiment in which the length along the longitudinal direction L of the convex portion 133c is formed longer than that of the cooling fin 13 will be described with reference to FIG. 15. Note that FIG. 15 shows a perspective view of the cooling fin 13d of the fifth embodiment. Specifically, FIG. 15(a) shows a schematic enlarged perspective view seen from above the cooling fin 13d, and FIG. 15(b) shows a schematic enlarged perspective view seen from below the cooling fin 13d.

[0108] In the cooling fin 13d of the fifth embodiment shown in FIG. 15, convex portions 133d and concave portions 134d are provided instead of the convex portion 133 and the concave portion 134, and since the other configurations are the same as those of the cooling fin 13 described above, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment, the convex portions 133d and the concave portions 134d are formed such that the length in the longitudinal direction L is about 1.3 times the length of the convex portion 133 and the concave portion 134. Therefore, the number of the convex portions 133d and the concave portions 134d formed along the longitudinal direction L is less than the number of the convex portion 133 and the concave portion 134.

[0109] The cooling fin 13d having the convex portion 133d and the concave portion 134d configured as described above has improved workability compared to the cooling fin 13 of the first embodiment described above. Therefore, the cooling fin 13d can be easily formed by processing a metal plate material. The cooling body 10 provided with the cooling fin 13d configured in this way and the stacked cooler 1 using a plurality of cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and can be easily configured.

[0110] (Sixth Embodiment) Hereinafter, the cooling fin 13e of the sixth embodiment in which the valley portion 132 and the peak portion 131 are formed wide will be described with reference to FIG. 16. Note that FIG. 16 shows a perspective view of the cooling fin 13d of the fifth embodiment. Specifically, FIG. 16(a) shows a schematic enlarged perspective view seen from above the cooling fin 13e, and FIG. 16(b) shows a schematic enlarged perspective view seen from below the cooling fin 13e.

[0111] In the cooling fin 13e of the sixth embodiment shown in FIG. 16, peak portions 131e and valley portions 132e are provided instead of the peak portion 131 and the valley portion 132, and since the other configurations are the same as those of the cooling fin 13 described above, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment, the peak portions 131e and the valley portions 132e are formed such that the length in the depth direction D is about 1.4 times the length of the convex portion 133 and the concave portion 134. That is, the cross-sectional width of the peak portions 131e and the valley portions 132e is formed wider than that of the peak portion 131 and the valley portion 132. Therefore, the number of the peak portions 131e and the valley portions 132e formed along the depth direction D is less than the number of the peak portion 131 and the valley portion 132.

[0112] The cooling fin 13e having the ridge portion 131e and the groove portion 132e configured as described above has improved workability compared to the cooling fin 13 of the first embodiment described above. Therefore, the cooling fin 13e can be easily formed by processing a metal plate material. The cooling body 10 provided with the cooling fin 13e configured in this way and the stacked cooler 1 using a plurality of cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and can be easily configured.

[0113] (Seventh Embodiment) Hereinafter, the cooling fin 13f of the seventh embodiment in which the groove portion 132 and the ridge portion 131 are formed to be narrow will be described with reference to FIG. 17. Note that FIG. 17 shows a perspective view of the cooling fin 13f of the seventh embodiment. Specifically, FIG. 17(a) shows a schematic enlarged perspective view seen from above the cooling fin 13f, and FIG. 17(b) shows a schematic enlarged perspective view seen from below the cooling fin 13f.

[0114] In the cooling fin 13f of the seventh embodiment shown in FIG. 17, ridge portions 131f and groove portions 132f are provided instead of the ridge portion 131 and the groove portion 132, and since the other configurations are the same as those of the cooling fin 13 described above, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment, the ridge portions 131f and the groove portions 132f are formed such that the length in the depth direction D is about 0.8 times the length of the convex portion 133 and the concave portion 134. That is, the cross-sectional width of the ridge portions 131f and the groove portions 132f is formed to be narrower than that of the ridge portion 131 and the groove portion 132. Therefore, the number of the ridge portions 131f and the groove portions 132f formed along the depth direction D is larger than the number of the ridge portion 131 and the groove portion 132.

[0115] The cooling fin 13f having the mountain portion 131f and the valley portion 132f configured as described above can increase the surface area compared to the longitudinal flow path RL of the cooling fin 13 of the first embodiment described above. Therefore, the cooling body 10 provided with the cooling fin 13f and the stacked cooler 1 using a plurality of the cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and by increasing the surface area of the longitudinal flow path RL in the cooling fin 13f, the cooling effect by the refrigerant 100 flowing through the longitudinal flow path RL can be improved.

[0116] (Eighth Embodiment) Hereinafter, the cooling fin 13g of the eighth embodiment in which the shape of the valley portion 132 is deformed will be described with reference to FIG. 18. Note that FIG. 18 shows a perspective view of the cooling fin 13g of the eighth embodiment. Specifically, FIG. 18(a) shows a schematic enlarged perspective view seen from above the cooling fin 13g, and FIG. 18(b) shows a schematic enlarged perspective view seen from below the cooling fin 13g.

[0117] In the cooling fin 13g of the eighth embodiment shown in FIG. 18, a valley portion 132g is provided instead of the valley portion 132, and since the other configurations are the same as those of the cooling fin 13 described above, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment in which the convex lower surface 1431 is provided on the bottom surface 143 constituting the valley portion 132, the valley portion 132g is configured with a flat bottom surface 143g without providing the convex lower surface 1431.

[0118] The cooling fin 13g having the valley portion 132g configured as described above improves the fluidity of the longitudinal flow path RL formed in the valley portion 132g. On the other hand, since the transverse flow path RS on the lower side Hd side is not formed, the flow rate of the refrigerant 100 in the depth direction D can be reduced. Further, since the bottom surface 143g of the valley portion 132g is flat, the workability of the cooling fin 13g can be improved. Therefore, the cooling body 10 provided with the cooling fin 13g and the stacked cooler 1 using a plurality of cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and improve the cooling effect by improving the fluidity of the longitudinal flow path RL in the cooling fin 13g, and can be easily configured.

[0119] (Ninth Embodiment) Hereinafter, the cooling fin 13h of the ninth embodiment in which the shape of the crest portion 131 is deformed will be described with reference to FIG. 19. Note that FIG. 19 shows a perspective view of the cooling fin 13h of the ninth embodiment. Specifically, FIG. 19(a) shows a schematic enlarged perspective view seen from above the cooling fin 13h, and FIG. 19(b) shows a schematic enlarged perspective view seen from below the cooling fin 13h.

[0120] In the cooling fin 13h of the ninth embodiment shown in FIG. 19, a crest portion 131h is provided instead of the crest portion 131, and since the other configurations are the same as those of the above-described cooling fin 13, the description thereof will be omitted. Specifically, with respect to the cooling fin 13 of the first embodiment in which the convex upper surface 1421 is provided on the upper surface 142 constituting the crest portion 131, the crest portion 131h is configured by a flat upper surface 142h without providing the convex upper surface 1421.

[0121] The cooling fin 13h having the ridge portion 131h configured as described above improves the fluidity of the longitudinal flow path RL formed in the ridge portion 131h. On the other hand, since the transverse flow path RS on the upper side Hu side is not formed, the flow rate of the refrigerant 100 in the depth direction D can be reduced. Further, since the upper surface 142h of the ridge portion 131h is flat, the workability of the cooling fin 13h can be improved. Therefore, the cooling body 10 provided with the cooling fin 13h and the stacked cooler 1 using a plurality of the cooling bodies 10 exhibit the same operations and effects as the cooling body 10 and the stacked cooler 1 of the first embodiment, and improve the cooling effect by improving the fluidity of the longitudinal flow path RL in the cooling fin 13h, and can be easily configured. In addition, the cooling fin 13 may be configured by combining various configurations of the above-described cooling fins 13, 13a to 13h. Thereby, the effects of the above-described various configurations can be achieved.

[0122] In the correspondence between the configuration of the present invention and the above-described embodiment, The electronic component of the present invention corresponds to the electronic component 20 of the embodiment. Similarly hereinafter, The electronic component corresponds to the electronic component 20, The stacked cooler corresponds to the stacked cooler 1, The longitudinal direction corresponds to the longitudinal direction L, One side corresponds to one side La, The other side corresponds to the other side Lb, The refrigerant corresponds to the refrigerant 100, The cooling body corresponds to the cooling body 10, The flow space corresponds to the flow space S, The outer shell member corresponds to the housing 11, The divided flow space corresponds to the upper side space S1 and the lower side space S2, The intermediate plate member corresponds to the intermediate plate 12, The flow path corresponds to the flow path R, The flow path forming portion corresponds to the ridge portion 131 or the concave portion 134 and the housing 11 or the intermediate plate 12, The flow path forming member corresponds to the cooling fins 13, 13a to 13j, The first flow path corresponds to the longitudinal flow path RL, The short-side direction corresponds to the depth direction D. The second flow path corresponds to the short-side direction flow path RS. The first flow path forming portion corresponds to the ridge portions 131, 131b, 131c, 131e, 131f, 131h and the housing 11 or the intermediate plate 12. The second flow path forming portion corresponds to the concave portions 134, 134b to 134d and the housing 11 or the intermediate plate 12. The convex portion corresponds to the convex portion 133 of the valley portions 132, 132b, 132c, 132e, 132f, 132g. The concave portion corresponds to the concave portions 134, 134b to 134d of the valley portions 132, 132b, 132c, 132e, 132f, 132g. The convex portion corresponds to the concave portions 134, 134b to 134d of the ridge portions 131, 131b, 131c, 131e, 131f, 131h. The concave portion corresponds to the concave portions 134, 134b to 134d of the valley portions 132, 132b, 132c, 132e, 132f, 132g. The thickness direction corresponds to the height direction H. The refrigerant supply portion corresponds to the inlet pipe 31. The refrigerant discharge portion corresponds to the outlet pipe 32. The end cooler corresponds to the lower cooler 10B. The supply ports correspond to the first supply port 113a and the second supply port 115b. The discharge ports correspond to the first discharge port 113b and the second discharge port 115a. The first supply port corresponds to the first supply port 113a. The second supply port corresponds to the second supply port 115b. The first discharge port corresponds to the second discharge port 115a. The second discharge port corresponds to the first discharge port 113b. However, the present invention is not limited only to the configuration of the above-described embodiment, and many embodiments can be obtained.

[0123] For example, in the above description, the refrigerant 100 is regarded as a fluid, but the refrigerant 100 is not particularly limited. For example, it may be a natural refrigerant such as water or ammonia, an alcohol-based refrigerant such as methanol, or even a chlorofluorocarbon refrigerant such as HFC134a.

[0124] Also, the electronic component 20 is not particularly limited, and for example, switching elements such as thyristors, diodes, and MOSFETs (MOS field effect transistors) can be appropriately used.

Explanation of Reference Numerals

[0125] 1…Stacked cooler 10…Cooling body 10B…Lower cooling body 11…Housing 12…Intermediate plate 13…Cooling fins 20…Electronic component 31…Inlet pipe 32…Outlet pipe 100…Refrigerant 113a…First supply port 113b…First discharge port 115a…Second discharge port 115b…Second supply port 131, 131b, 131c, 131e, 131f, 131h…Peak portions 132, 132b, 132c, 132e, 132f, 132g…Valley portions 133, 133a, 133c~133e…Convex portions 134, 134b~134d…Concave portions D…Depth direction H…Height direction L…Longitudinal direction La…One side Lb…The other side R…Flow path RL…Longitudinal flow path RS…Lateral flow path S…Flow-through space S S1…Upper space S2…Lower space

Claims

1. A flat cooling body used in a stacked cooler for cooling an electronic component from both sides, the cooling body having a refrigerant flowing therethrough in a direction from one side to the other side in the longitudinal direction inside, a flat outer shell member having a flow space for the refrigerant to flow through therein, an intermediate plate member disposed in the flow space and dividing the flow space in the thickness direction to form a divided flow space, and a flow path forming member disposed in the divided flow space and having a flow path forming portion for forming a flow path of the refrigerant in the divided flow space, wherein the flow path has a first flow path for flowing the refrigerant in the longitudinal direction and a second flow path for flowing the refrigerant in the short side direction of the flat shape, the flow path forming portion has a first flow path forming portion for forming the first flow path and a second flow path forming portion for forming the second flow path, and the first flow path formed by the first flow path forming portion and the second flow path formed by the second flow path forming portion intersect so as to be communicable. Cooling body.

2. The cooling body according to claim 1, wherein the flow paths are formed on both sides in the thickness direction of the flow path forming member. The cooling body according to claim 1.

3. The cooling body according to claim 2, wherein the first flow paths on one side and the other side in the thickness direction are alternately arranged in the short side direction, and the second flow paths on one side and the other side in the thickness direction are alternately arranged in the longitudinal direction. The cooling body according to claim 2.

4. The cooling body according to claim 2, wherein the first flow path is substantially wavy with convex portions and concave portions alternately arranged along the longitudinal direction, and the second flow path is substantially wavy with convex portions and concave portions alternately arranged along the short side direction. The cooling body according to claim 2.

5. The cooling body according to claim 2, wherein both the first flow path and the second flow path have a trapezoidal cross section. The cooling body according to claim 2.

6. The cooling body according to claim 2, wherein the flow path forming member having the first flow path forming portion and the second flow path forming portion is composed of a metal plate material having an uneven shape in the thickness direction. The cooling body according to claim 2.

7. The cooling body according to any one of claims 1 to 6, wherein the flow path forming member is disposed on both sides of the intermediate plate member in the thickness direction, and at least a part of the flow path forming portion is in contact with the outer shell member. The cooling body according to any one of claims 1 to 6.

8. A plurality of cooling bodies according to any one of claims 1 to 6 stacked in the thickness direction, electronic components disposed between the stacked cooling bodies, a refrigerant supply unit for supplying the refrigerant to the cooling body, and a refrigerant discharge unit for discharging the refrigerant from the cooling body are provided. Among the plurality of the cooling bodies laminated in the thickness direction, the cooling body disposed at the other end portion in the thickness direction is defined as an end cooling body, in the outer shell member of the cooling body, a supply port that communicates with the flow space and to which the refrigerant is supplied, and a discharge port that communicates with the flow space and discharges the refrigerant are provided, the supply port is provided with a first supply port and a second supply port, the discharge port is provided with a first discharge port and a second discharge port, the end cooling body is provided with only the first supply port as the supply port and only the first discharge port as the discharge port, among the plurality of the cooling bodies laminated in the thickness direction, to the cooling body disposed at one end portion in the thickness direction, a refrigerant supply portion and a refrigerant discharge portion are connected a stacked cooler.

Citation Information

Patent Citations

  • Cooling tube and manufacturing method therefor

    JP2008166423A