Laser beam machining apparatus

Abstract

To reduce an amount of sputter adhering to a laser head.SOLUTION: A laser beam machining apparatus includes: a laser head for irradiating a processing part of a workpiece with a laser beam; a first nozzle for jetting a gas toward the processing part; a second nozzle disposed on an opposite side to the first nozzle across a passage route of the laser beam between the laser head and the processing part to jet a gas toward the processing part; and a partition wall member for at least partially blocking an interval between the laser head and the first nozzle and an interval between the first nozzle and the workpiece.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a laser processing machine.

Background Art

[0002] Conventionally, a technique for suppressing the adhesion of spatter to a laser head using air injection has been known (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the prior art, there is a possibility that spatter that avoids gas injection reaches the laser head. Therefore, a technique for reducing the amount of spatter adhering to the laser head is desired.

Means for Solving the Problems

[0005] The present disclosure can be realized in the following forms.

[0006] (1) According to a first aspect of the present disclosure, a laser processing machine is provided. The laser processing machine includes a laser head that irradiates a laser beam onto a processing portion of a workpiece, a first nozzle that injects gas toward the processing portion, a second nozzle that is disposed on the opposite side of the first nozzle across the passage path of the laser beam between the laser head and the processing portion and injects gas toward the processing portion, and a partition member that closes at least a part between the laser head and the first nozzle and between the first nozzle and the workpiece. According to the laser processing machine of this embodiment, by injecting gas from the first nozzle and the second nozzle, it is possible to suppress the spatter generated at the processing part from reaching the laser head through the space between the first nozzle and the second nozzle. Further, since the partition member is arranged, it is possible to suppress the spatter generated at the processing part from reaching the laser head through the rear of the first nozzle. Therefore, the amount of spatter adhering to the laser head can be reduced. (2) The laser processing machine of the above embodiment may further include a first shielding member that is disposed between the first nozzle and the workpiece and between the second nozzle and the workpiece and has an opening through which the laser beam passes. According to the laser processing machine of this embodiment, by arranging the first shielding member, it is possible to suppress the spatter generated at the processing part from reaching the laser head. (3) The laser processing machine of the above embodiment may further include a third nozzle that is disposed between the first nozzle and the first shielding member and injects gas toward the opening of the first shielding member. According to the laser processing machine of this embodiment, by injecting gas from the third nozzle, it is possible to suppress spatter from depositing on the opening of the first shielding member. (4) The laser processing machine of the above embodiment may further include a fourth nozzle that is disposed between the first shielding member and the workpiece and injects gas toward the processing part. According to the laser processing machine of this embodiment, it is possible to suppress spatter from depositing on the processing part. (5) The laser processing machine of the above embodiment further includes a second shielding member that is disposed between the first nozzle and the laser head and between the second nozzle and the laser head and has an opening through which the laser beam passes. According to the laser processing machine of this embodiment, it is possible to suppress the spatter that has broken through the injection of gas from the first nozzle and the second nozzle from reaching the laser head. The present disclosure can also be realized in various forms other than the laser processing machine. For example, it can be realized in the form of a laser processing method or the like.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Mode for Carrying Out the Invention

[0008] A. First Embodiment: FIG. 1 is a first explanatory drawing showing the configuration of the laser processing machine 10 in the first embodiment. FIG. 2 is a second explanatory drawing showing the configuration of the laser processing machine 10 in the first embodiment. The laser processing machine 10 is used to perform laser processing on the workpiece WK. Laser processing includes, for example, cutting, drilling, marking, welding, quenching, etc.

[0009] As shown in FIG. 1, the laser processing machine 10 includes a laser head 100, a first nozzle 210, a second nozzle 220, a third nozzle 230, a fourth nozzle 240, a partition member 300, a first shielding member 410, a second shielding member 420, a third shielding member 430, an exhaust duct 500, and a control device 600. In FIG. 2, the illustration of the second nozzle 220, the exhaust duct 500, and the control device 600 is omitted.

[0010] The laser head 100 irradiates the laser beam LS on the processing portion of the workpiece WK. The laser head 100 includes optical system components such as lenses and mirrors. In the present embodiment, the laser head 100 includes a movable mirror driven by a motor, and the irradiation position of the laser beam LS can be changed by changing the direction of the mirror.

[0011] A protective glass 150 for protecting optical system components from spatter, fume, etc. generated during processing is mounted on the laser exit port of the laser head 100. The laser beam LS emitted from the laser exit port is irradiated onto the workpiece WK through the protective glass 150. A protective glass cover 160 configured in a cylindrical shape is provided at the end of the laser head 100. The protective glass cover 160 is provided so as to surround the protective glass 150.

[0012] The laser head 100 is supported by a robot arm (not shown). The robot arm has a function of changing the position and orientation of the laser head 100. In the present embodiment, the laser head 100 is supported so that the protective glass 150 and the surface of the workpiece WK are parallel. Note that the laser head 100 may be supported by a fixing jig that does not have a function of changing the position and orientation of the laser head 100.

[0013] The laser beam LS emitted from the laser head 100 is supplied to the laser head 100 from a laser oscillator (not shown) via an optical fiber or a bend mirror. In the present embodiment, the laser beam LS is a fiber laser. The laser beam LS is not limited to a fiber laser, and may be, for example, a solid laser other than a fiber laser such as a disk laser, a semiconductor laser, or a YAG laser, or a gas laser such as a carbon dioxide laser.

[0014] The first nozzle 210, the second nozzle 220, the third nozzle 230, and the fourth nozzle 240 inject gas into the space between the laser head 100 and the work WK. In the present embodiment, the first nozzle 210, the second nozzle 220, the third nozzle 230, and the fourth nozzle 240 are arranged between the laser head 100 and the work WK. The first nozzle 210 and the second nozzle 220 are arranged near the laser head 100. The second nozzle 220 is arranged on the opposite side of the first nozzle 210 across the passing path of the laser beam LS between the laser head 100 and the work WK. The third nozzle 230 and the fourth nozzle 240 are arranged on the same side as the first nozzle 210 across the passing path of the laser beam LS. That is, the first nozzle 210, the third nozzle 230, and the fourth nozzle 240 are arranged on one side across the passing path of the laser beam LS between the laser head 100 and the work WK, and the second nozzle 220 is arranged on the opposite side. The first nozzle 210, the third nozzle 230, and the fourth nozzle 240 are arranged in the order of the first nozzle 210, the third nozzle 230, and the fourth nozzle 240 from the laser head 100 toward the work WK.

[0015] Each of the nozzles 210, 220, 230, and 240 injects gas from injection ports N1 to N4 provided at the respective tip portions. In the present embodiment, the gas injected from each of the nozzles 210, 220, 230, and 240 is air. The gas injected from each of the nozzles 210, 220, 230, and 240 is not limited to air, and may be, for example, an inert gas such as nitrogen gas or argon gas. The types of gas injected from each of the nozzles 210, 220, 230, and 240 may be different from each other. Supply pipes 215, 225, 235, and 245 are connected to the rear end portions of the respective nozzles 210, 220, 230, and 240. Gas is supplied to each of the nozzles 210, 220, 230, and 240 via the supply pipes 215, 225, 235, and 245 from, for example, a compressor or a high-pressure tank.

[0016] In FIG. 1, the gas injection directions of the nozzles 210, 220, 230, and 240 are indicated by dashed arrows. The first nozzle 210 and the second nozzle 220 inject gas toward the processing portion of the workpiece WK. In the present embodiment, as will be described later, since the first shielding member 410 is disposed between the first nozzle 210 and the workpiece WK and between the second nozzle 220 and the workpiece WK, the first nozzle 210 and the second nozzle 220 inject gas into the processing portion of the workpiece WK through the opening H1 of the first shielding member 410. The third nozzle 230 injects gas toward the opening H1 of the first shielding member 410. The fourth nozzle 240 injects gas toward the processing portion of the workpiece WK.

[0017] As shown in FIG. 2, in the present embodiment, the shapes of the injection ports N1 to N4 of the nozzles 210, 220, 230, and 240 are rectangles having a longitudinal direction perpendicular to the direction from the laser head 100 toward the workpiece WK. The shapes of the injection ports N1 to N4 of the nozzles 210, 220, 230, and 240 are not limited to rectangles, and may be, for example, squares, circles, ellipses, or the like. Each of the nozzles 210, 220, 230, and 240 may have a plurality of injection ports arranged side by side in a direction perpendicular to the direction from the laser head 100 toward the workpiece WK.

[0018] In FIGS. 1 and 2, arrows indicating the X direction, Y direction, and Z direction orthogonal to each other are shown. The X direction and the Y direction are directions parallel to the surface of the workpiece WK, and the Z direction is a direction perpendicular to the surface of the workpiece WK. It is preferable that the nozzles 210, 220, 230, and 240 are arranged such that the positions of the injection ports N1 to N4 in the X direction, the positions of the injection ports N1 to N4 in the Z direction, and the angle of the gas injection direction with respect to the XY plane perpendicular to the Z direction are within the following ranges. Here, the positions of the injection port N1 of the first nozzle 210 and the injection port N2 of the second nozzle 220 are based on the center point Pa of the laser exit port, and the positions of the injection port N3 of the third nozzle 230 and the injection port N4 of the fourth nozzle 240 are based on the center point Pb of the processing portion. <The first nozzle 210> X direction: -50 to -20 mm, Z direction: -130 to -220 mm, angle: 70 ± 20 degrees. <Second nozzle 220> X direction: -40 to -100 mm, Z direction: -90 to -180 mm, angle: 90 ± 20 degrees. <Third nozzle 230> X direction: 20 to 120 mm, Z direction: 70 to 150 mm, angle: 30 ± 20 degrees. <Fourth nozzle 240> X direction: 1 to 100 mm, Z direction: 0 to 60 mm, angle: 20 ± 20 degrees.

[0019] The partition member 300 is disposed so as to block at least a part between the laser head 100 and the first nozzle 210, and between the first nozzle 210 and the work WK. In the present embodiment, it is disposed between the laser head 100 and the first nozzle 210, between the first nozzle 210 and the third nozzle 230, between the third nozzle 230 and the fourth nozzle 240, and between the fourth nozzle 240 and the work WK. The partition member 300 is disposed behind the injection port N1 of the first nozzle 210, behind the injection port N3 of the third nozzle 230, and behind the injection port N4 of the fourth nozzle 240, and separates the space in front of and behind the first nozzle 210, the third nozzle 230, and the fourth nozzle 240. In the present disclosure, the rear end side of the nozzle as viewed from the nozzle is referred to as the rear of the nozzle, and the front end side of the nozzle as viewed from the nozzle is referred to as the front of the nozzle. In the present embodiment, the partition member 300 is composed of a plurality of plate members. Specifically, the partition member 300 includes a plate member disposed between the laser head 100 and the first nozzle 210, a plate member disposed between the first nozzle 210 and the third nozzle 230, a plate member disposed between the third nozzle 230 and the fourth nozzle 240, and a plate member extending from the fourth nozzle 240 to the vicinity of the work WK. The partition member 300 may be composed of a single plate member having through holes for inserting the first nozzle 210, the third nozzle 230, and the fourth nozzle 240. It is preferable that the space between the first nozzle 210, the third nozzle 230, the fourth nozzle 240, and the partition member 300 is sealed.

[0020] The first shielding member 410, the second shielding member 420, and the third shielding member 430 are disposed between the laser head 100 and the work WK. The first shielding member 410, the second shielding member 420, and the third shielding member 430 are arranged in the order of the third shielding member 430, the second shielding member 420, and the first shielding member 410 from the laser head 100 toward the work WK. Each of the shielding members 410, 420, 430 has openings H1 to H3 through which the laser light LS emitted from the laser head 100 passes. In the present disclosure, the opening may be a through-hole provided in the central portion of the member or a notch provided at the end of the member. In the present embodiment, each of the shielding members 410, 420, 430 is composed of a plate member, and each of the shielding members 410, 420, 430 has through-holes as the openings H1 to H3.

[0021] The first shielding member 410 is disposed between the first nozzle 210 and the work WK and between the second nozzle 220 and the work WK. More specifically, the first shielding member 410 is disposed between the third nozzle 230 and the fourth nozzle 240. In other words, the third nozzle 230 is disposed between the first nozzle 210 and the first shielding member 410, and the fourth nozzle 240 is disposed between the first shielding member 410 and the work WK. The second shielding member 420 and the third shielding member 430 are disposed between the first nozzle 210 and the laser head 100 and between the second nozzle 220 and the laser head 100. In the present embodiment, the first shielding member 410 is fixed to the partition member 300. The second shielding member 420 is fixed to the first nozzle 210. The third shielding member 430 is fixed to the protective glass cover 160.

[0022] The first shielding member 410 and the second shielding member 420 are disposed to be inclined with respect to the protective glass 150, and the third shielding member 430 is disposed parallel to the protective glass 150. In the present embodiment, the laser head 100 is supported such that the protective glass 150 and the surface of the work WK are parallel. The first shielding member 410 is inclined such that the distance between the end of the first shielding member 410 on the first nozzle 210 side and the work WK is wider than the distance between the end of the first shielding member 410 on the second nozzle 220 side and the work WK. When viewed in parallel with the first shielding member 410, the end of the first shielding member 410 on the second nozzle 220 side is located between the upper end portion and the lower end portion of the exhaust duct 500. The second shielding member 420 is inclined such that the distance between the end of the second shielding member 420 on the first nozzle 210 side and the work WK is narrower than the distance between the end of the second shielding member 420 on the second nozzle 220 side and the work WK.

[0023] The exhaust duct 500 is disposed between the second nozzle 220 and the work WK. The exhaust duct 500 discharges the gas jetted from each of the nozzles 210, 220, 230, 240. The exhaust duct 500 is connected to a dust collecting device (not shown). The dust collecting device sucks the gas through the exhaust duct 500. The spatter and fume contained in the gas discharged from the exhaust duct 500 are collected by the dust collecting device.

[0024] The control device 600 is constituted by a computer including a CPU 601, a memory 602, an input / output interface 603, and an internal bus 604. The CPU 601, the memory 602, and the input / output interface 603 are connected to be communicable bidirectionally via the internal bus 604. The laser head 100 is connected to the input / output interface 603 via a signal cable. In the present embodiment, in addition to the laser head 100, the above-described laser oscillator, robot arm, compressor, and dust collecting device are connected to the input / output interface 603. The CPU 601 controls each part of the laser processing machine 10 to execute laser processing by executing a processing program PG stored in advance in the memory 602.

[0025] During laser processing, spatter scatters from the processing area. When the spatter adheres to the protective glass 150, the energy of the laser light LS irradiated on the processing area decreases, and the processing quality of the laser processing deteriorates. Therefore, it is necessary to replace the protective glass 150 in order to restore the processing quality. The higher the replacement frequency of the protective glass 150, the higher the maintenance cost of the laser processing machine 10 and the lower the operating rate of the laser processing machine 10. In particular, in non-penetrating laser processing such as marking processing, small spatter is likely to occur and the flying speed of the spatter is high, so the spatter is likely to adhere to the protective glass 150. The laser processing machine 10 of the present embodiment is provided with a device for suppressing the adhesion of spatter to the protective glass 150. In addition, during laser processing, the processing quality may deteriorate due to the deposition of spatter on the processing area. For example, in marking processing, the processing quality may deteriorate due to the deposition of spatter around the grooves representing characters, figures, etc. The laser processing machine 10 of the present embodiment is provided with a device for suppressing the deposition of spatter on the processing area in addition to the device for suppressing the adhesion of spatter to the protective glass 150.

[0026] Since the laser processing machine 10 is provided with the fourth nozzle 240 that injects gas toward the processing area of the workpiece WK, the spatter generated in the processing area can be flushed into the exhaust duct 500 by the air flow generated by the fourth nozzle 240. Therefore, it is possible to suppress the spatter from reaching the protective glass 150 and the deposition of spatter on the processing area.

[0027] Even if the spatter breaks through the airflow generated by the fourth nozzle 240, since the first shielding member 410 is disposed between the spatter and the protective glass 150, the spatter that has broken through the airflow generated by the fourth nozzle 240 can be bounced back by the first shielding member 410. Therefore, it is possible to suppress the spatter from reaching the protective glass 150. Further, since the fourth nozzle 240 is disposed between the first shielding member 410 and the workpiece WK, the spatter bounced back by the first shielding member 410 can be washed away into the exhaust duct 500 by the airflow generated by the fourth nozzle 240. Therefore, it is possible to suppress the spatter bounced back by the first shielding member 410 from depositing on the processing portion.

[0028] Even if the spatter passes through the opening H1 of the first shielding member 410, since the third nozzle 230 for injecting gas toward the opening H1 of the first shielding member 410 is disposed between the first shielding member 410 and the laser head 100, the spatter that has passed through the opening H1 of the first shielding member 410 can be washed away into the exhaust duct 500 by the airflow generated by the third nozzle 230. Therefore, it is possible to suppress the spatter from reaching the protective glass 150 and the spatter from depositing around the opening H1 of the first shielding member 410.

[0029] Even if the spatter breaks through the airflow generated by the third nozzle 230, the first nozzle 210 for injecting gas toward the processing portion is disposed between the third nozzle 230 and the laser head 100, and the second nozzle 220 for injecting gas toward the processing portion is disposed opposite the first nozzle 210. Since the airflow generated by the first nozzle 210 and the airflow generated by the second nozzle 220 merge into an airflow substantially perpendicular to the surface of the workpiece WK, the spatter that has broken through the airflow generated by the third nozzle 230 can be pushed back toward the workpiece WK by the airflow generated by the first nozzle 210 and the second nozzle 220. Therefore, it is possible to suppress the spatter from reaching the protective glass 150.

[0030] Even if the sputter breaks through the airflow generated by the first nozzle 210 and the second nozzle 220, since the second shielding member 420 is disposed between the sputter and the protective glass 150, the sputter that breaks through the airflow generated by the first nozzle 210 and the second nozzle 220 can be bounced back by the second shielding member 420. Since the second shielding member 420 is disposed in an inclined manner, the sputter can be bounced back by the second shielding member 420 toward the exhaust duct 500. Even if the sputter passes through the opening H2 of the second shielding member 420, since the third shielding member 430 is disposed between the sputter and the protective glass 150, the sputter that has passed through the opening H2 of the second shielding member 420 can be bounced back by the third shielding member 430. Therefore, it is possible to suppress the sputter from reaching the protective glass 150.

[0031] In the present embodiment, since the partition member 300 is disposed between the laser head 100 and the first nozzle 210, it is possible to suppress the sputter from reaching the protective glass 150 from between the laser head 100 and the first nozzle 210 via the rear of the first nozzle 210. In other words, it is possible to suppress the sputter from avoiding the gas injection from the first nozzle 210 and reaching the protective glass 150. Further, since the partition member 300 is also disposed between the first nozzle 210 and the third nozzle 230, between the third nozzle 230 and the fourth nozzle 240, and between the fourth nozzle 240 and the workpiece WK, it is possible to suppress the sputter from reaching the protective glass 150 via the rear of the fourth nozzle 240 or the third nozzle 230.

[0032] FIG. 3 is an explanatory diagram showing the laser processing machine 10b of the comparative example. The laser processing machine 10b of the comparative example is different from the laser processing machine 10 of the present embodiment in that it does not include the second nozzle 220, the partition member 300, the first shielding member 410, the second shielding member 420, and the third shielding member 430. In FIG. 3, the illustration of the control device 600 is omitted. In the comparative example, the sputter may reach the protective glass 150 through any of the following three paths A to C. In particular, in the comparative example, since the partition member 300 is not provided in the laser processing machine 10b, the sputter may reach the protective glass 150 through path C. In the comparative example, due to the negative pressure caused by the injection of gas from the first nozzle 210, the third nozzle 230, and the fourth nozzle 240, the sputter easily passes through path C. · Path A: A path that goes straight to the protective glass 150. · Path B: A path that bounces back to any of the first nozzle 210, the third nozzle 230, and the fourth nozzle 240. · Path C: A path that passes behind any of the first nozzle 210, the third nozzle 230, and the fourth nozzle 240.

[0033] FIG. 4 is a first explanatory diagram showing the test results. FIG. 5 is a second explanatory diagram showing the test results. FIGS. 4 and 5 show the test results using the laser processing machine 10 of the present embodiment and the test results using the laser processing machine 10b of the comparative example. In the test, when the character "A" was marked on the surface of the workpiece WK a predetermined number of times, the depth of the groove representing the character "A" and the sputter adhesion amount on the protective glass 150 were investigated. <Test Conditions> · Workpiece WK: Galvanized steel sheet, plate thickness t = 1.4 mm. · Laser beam LS: Output 1000 W, fiber laser. · Gas injected from each nozzle 210, 220, 230, 240: Air, flow rate 2800 L / min.

[0034] As shown in FIG. 4, the amount of sputter deposition at the end of the 4000th time in this embodiment is less than the amount of sputter deposition at the end of the 100th time in the comparative example. As shown in FIG. 5, the amount of decrease in the groove depth from the end of the 1st time to the end of the 4000th time in this embodiment is smaller than the amount of decrease in the groove depth from the end of the 1st time to the end of the 100th time in the comparative example. Therefore, in this embodiment, the deterioration of the processing quality due to the adhesion of sputter to the protective glass 150 is suppressed.

[0035] As described above, according to the laser processing machine 10 in this embodiment, the amount of sputter deposition adhering to the protective glass 150 of the laser head 100 can be reduced.

[0036] B. Other Embodiments: (B1) The laser processing machine 10 of the first embodiment described above includes a laser head 100 configured to be able to change the irradiation position of the laser beam LS. In contrast, the laser processing machine 10 may include a laser head 100 that is not configured to be able to change the irradiation position of the laser beam LS, and the irradiation position of the laser beam LS may be changed by moving at least one of the laser head 100 and the workpiece WK. In this case, it is preferable that the laser processing machine 10 is configured so that the relative positional relationship between the laser head 100 and each of the nozzles 210, 220, 230, 240, the partition member 300, and each of the shielding members 410 to 410 is maintained.

[0037] (B2) The laser processing machine 10 of the first embodiment described above includes a first nozzle 210, a second nozzle 220, a third nozzle 230, and a fourth nozzle 240. In contrast, the laser processing machine 10 may not include at least one of the third nozzle 230 and the fourth nozzle 240.

[0038] (B3) The laser processing machine 10 of the first embodiment described above includes a first shielding member 410, a second shielding member 420, and a third shielding member 430. In contrast, it may not include at least one of the first shielding member 410, the second shielding member 420, and the third shielding member 430.

[0039] (B4) In the first embodiment described above, the laser head 100 includes a protective glass 150 that protects optical system components such as lenses and mirrors, and sputter adhesion to the protective glass 150 is suppressed. In contrast, the laser head 100 may not include the protective glass 150. In this case, sputter adhesion to the optical system components of the laser head 100 is suppressed.

[0040] The present disclosure is not limited to the above-described embodiments, and can be realized in various configurations without departing from the gist thereof. For example, the technical features in the embodiments corresponding to the technical features in each form described in the summary of the invention can be appropriately replaced or combined in order to solve some or all of the above-described problems or to achieve some or all of the above-described effects. Further, if the technical feature is not described as essential in this specification, it can be appropriately deleted.

Explanation of Reference Numerals

[0041] 10... Laser processing machine, 100... Laser head, 150... Protective glass, 160... Protective glass cover, 210... First nozzle, 220... Second nozzle, 230... Third nozzle, 240... Fourth nozzle, 300... Partition member, 410... First shielding member, 420... Second shielding member, 430... Third shielding member, 500... Exhaust duct, 600... Control device, 601... CPU, 602... Memory, 603... Input / output interface, 604... Internal bus, H1~H3... Openings, LS... Laser beam, N1~N4... Injection ports, PG... Processing program, WK... Workpiece

Claims

1. A laser processing machine, comprising: a laser head that irradiates a laser beam onto a processing portion of a workpiece; a first nozzle that injects a gas toward the processing portion; a second nozzle that is disposed on the opposite side of the first nozzle across the passing path of the laser beam between the laser head and the processing portion, and injects a gas toward the processing portion; a partition member that closes at least a part between the laser head and the first nozzle and between the first nozzle and the workpiece; The laser processing machine comprising the above.

2. The laser processing machine according to Claim 1, further comprising: a first shielding member that is disposed between the first nozzle and the workpiece and has an opening through which the laser beam passes.

3. The laser processing machine according to Claim 2, further comprising: a third nozzle that is disposed between the first nozzle and the first shielding member and injects a gas toward the opening of the first shielding member.

4. The laser processing machine according to Claim 2, further comprising: a fourth nozzle that is disposed between the first shielding member and the workpiece and injects a gas toward the processing portion.

5. The laser processing machine according to Claim 1, further comprising: a second shielding member that is disposed between the first nozzle and the laser head and between the second nozzle and the laser head and has an opening through which the laser beam passes.

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