Intermediate connection member, method for manufacturing electronic module, electronic module, and electronic apparatus

Abstract

To obtain an intermediate connection member in which wiring parts are arranged with high accuracy.SOLUTION: An intermediate connection member 300 comprises: an insulating substrate part 321; an insulating substrate part 322; and an insulating layer part 323 arranged between the insulating substrate part 321 and the insulating substrate part 322, and made of material different from the insulating substrate part 321 and the insulating substrate part 322. The intermediate connection member 300 includes: a plurality of wiring parts 311 arranged to extend in a Z-direction between the insulating substrate part 321 and the insulating layer part 323, and exposed to the outside at both end faces in the Z-direction; and a plurality of wiring parts 312 arranged to extend in the Z-direction between the insulating substrate part 322 and the insulating layer part 323, and exposed to the outside at both end faces in the Z-direction.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an intermediate connection member that electrically connects two circuit units together. [Background technology]

[0002] Imaging devices such as digital cameras and smartphones with built-in cameras, which are examples of electronic devices, include imaging modules, which are examples of electronic modules. The imaging modules have multiple electronic components. In the case of imaging modules, one of the multiple electronic components is an image sensor. Each electronic component is mounted on a rigid substrate such as a printed wiring board, but due to the demand for miniaturization of electronic devices, high-density mounting is required for imaging modules.

[0003] One known structure for achieving high-density packaging is a three-dimensional packaging structure in which circuit units are stacked in multiple layers. Known three-dimensional packaging structures include a method of connecting two opposing circuit units using solder balls and a method of connecting two opposing circuit units using an intermediate connector with wiring. When electronic components are placed between the two rigid boards of two circuit units, a method of connecting the two circuit units using an intermediate connector is used.

[0004] Patent Document 1 discloses an intermediate connection member configured by forming a plurality of through holes in an insulating substrate and filling each of the through holes in the insulating substrate with a conductor. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-111232 Summary of the Invention [Problem to be solved by the invention]

[0006] The demand for further miniaturization of electronic devices has led to a demand for further miniaturization of 3D packaging structures using intermediate connectors, which in turn has led to a demand for finer wiring pitches in the intermediate connectors. The typical method for forming wiring in through holes is to drill holes in insulating substrates using a mechanical drill. When attempting to narrow the pitch between through holes, the insulating material between the through holes becomes thinner, which can peel off or deform during the drilling process, making it difficult to maintain high-precision processing to meet the demand for finer wiring pitches.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an intermediate connecting member in which wiring portions are arranged with high precision. [Means for solving the problem]

[0008] The present invention provides a method for manufacturing an intermediate connecting member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, the method comprising the steps of: forming a first insulating substrate having a first main surface with a plurality of first grooves; forming a second insulating substrate having a second main surface with a plurality of second grooves; arranging a plurality of first conductive members in the plurality of first grooves; arranging a plurality of second conductive members in the plurality of second grooves; bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate together via an insulating member so that the extending directions of the plurality of first conductive members and the plurality of second conductive members are aligned to form a structure; and cutting the structure in a second direction that intersects with the first direction in which the plurality of first conductive members and the plurality of second conductive members extend.

[0009] Furthermore, the intermediate connecting member of the present invention is an intermediate connecting member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, and is characterized by comprising: a first insulating substrate portion; a second insulating substrate portion; an insulating layer portion that is arranged between the first insulating substrate portion and the second insulating substrate portion and is made of a material different from that of the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions that are arranged to extend in a first direction between the first insulating substrate portion and the insulating layer portion and have both end faces in the first direction exposed to the outside; and a plurality of second wiring portions that are arranged to extend in the first direction between the second insulating substrate portion and the insulating layer portion and have both end faces in the first direction exposed to the outside.

[0010] Furthermore, the intermediate connection member of the present invention is an intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, and is characterized in that it comprises a plurality of first wiring portions arranged at intervals from each other in a second direction that intersects with the first direction, each of the plurality of first wiring portions being arranged extending in the first direction so that both end faces in the first direction are exposed to the outside, at least one of the plurality of first wiring portions has a first width, and at least one of the plurality of first wiring portions has a second width that is wider than the first width.

[0011] Furthermore, the intermediate connecting member of the present invention is an intermediate connecting member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, and is characterized in that it comprises a plurality of first wiring portions arranged at intervals in a second direction that intersects with the first direction, each of the plurality of first wiring portions being arranged extending in the first direction so that both end faces in the first direction are exposed to the outside, at least one of the plurality of first wiring portions has a first thickness, and at least one of the plurality of first wiring portions has a second thickness that is thicker than the first thickness.

[0012] Furthermore, the intermediate connecting member of the present invention is an intermediate connecting member used to electrically connect a first circuit unit and a second circuit unit arranged opposite each other, and is characterized in that it comprises a first insulating substrate portion and a plurality of first wiring portions arranged on the first insulating substrate portion at intervals from each other in a second direction intersecting the first direction, each of the plurality of first wiring portions being arranged extending in the first direction so that both end faces in the first direction are exposed to the outside, and the first insulating substrate portion includes a first groove portion that is wider than the width of one of the plurality of first wiring portions and / or deeper than the thickness of one of the plurality of first wiring portions. [Effects of the Invention]

[0013] According to the present invention, an intermediate connecting member in which wiring portions are arranged with high precision can be obtained. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is an explanatory diagram of a digital camera as an example of an electronic device according to a first embodiment. [Figure 2] 1A is a plan view of an imaging module as an example of an electronic module according to the first embodiment, and FIG. 1B is a cross-sectional view of the imaging module according to the first embodiment. [Figure 3] 1(a) is a perspective view of an intermediate connection member according to a first embodiment, and FIG. 1(b) is an enlarged view of a portion of the intermediate connection member shown in FIG. [Figure 4] 5(a) and 5(b) are views for explaining a method for manufacturing an intermediate connection member according to the first embodiment. [Figure 5] 5(a), (b), and (c) are views for explaining a method for manufacturing an intermediate connection member according to the first embodiment. [Figure 6] 5(a), (b), and (c) are views for explaining a method for manufacturing an intermediate connection member according to the first embodiment. [Figure 7] 5(a), (b), and (c) are views for explaining a method for manufacturing an intermediate connection member according to the first embodiment. [Figure 8]5(a) and 5(b) are views for explaining a method for manufacturing an intermediate connection member according to the first embodiment. [Figure 9] 5(a), (b), and (c) are diagrams illustrating a method for manufacturing an imaging module according to the first embodiment. [Figure 10] 5(a), (b), and (c) are diagrams illustrating a method for manufacturing an imaging module according to the first embodiment. [Figure 11] 10(a) is a perspective view of an intermediate connecting member according to a second embodiment, and (b) is an enlarged view of a portion of the intermediate connecting member shown in (a). [Figure 12] 10(a), (b), (c), and (d) are views for explaining a method for manufacturing an intermediate connection member according to a second embodiment. [Figure 13] FIG. 11 is a perspective view of an intermediate connecting member according to a third embodiment. [Figure 14] FIG. 10 is a perspective view of an intermediate connecting member according to a fourth embodiment. [Figure 15] 10(a) is a perspective view of an intermediate connection member according to a fifth embodiment, and FIG. 10(b) is an explanatory view of two insulating substrate parts according to the fifth embodiment. [Figure 16] 10(a) is a perspective view of an intermediate connection member according to a sixth embodiment, and (b) is an explanatory view of two insulating substrate parts according to the sixth embodiment. [Figure 17] 10(a) and 10(b) are explanatory views of a modified intermediate connecting member. [Figure 18] 13(a) is a perspective view of an intermediate connection member according to a seventh embodiment, and (b) is an explanatory view of an insulating substrate portion according to the seventh embodiment. [Figure 19] FIG. 13 is a perspective view of an intermediate connecting member according to an eighth embodiment. [Figure 20] 10(a) and 10(b) are explanatory views of a modified intermediate connecting member. DETAILED DESCRIPTION OF THE INVENTION

[0015] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0016] [First embodiment] 1 is an explanatory diagram of a digital camera 100, which is an imaging device as an example of an electronic device according to a first embodiment. The digital camera 100 is an interchangeable lens digital camera and includes a camera body 101. A lens barrel 102 containing a lens is detachable from the camera body 101. The lens barrel 102 is an interchangeable lens, i.e., a lens unit.

[0017] The camera body 101 includes a housing 111, and an imaging module 200 and a processing module 400 provided inside the housing 111. The imaging module 200 and the processing module 400 are electrically connected to each other via a cable (not shown) so that they can communicate with each other.

[0018] The imaging module 200 is an example of an electronic module and has a three-dimensional mounting structure. The imaging module 200 includes circuit units 201 and 202 and a plurality of intermediate connection members 300. In this embodiment, the circuit unit 201 is a first circuit unit, and the circuit unit 202 is a second circuit unit. The circuit unit 201 is a printed wiring board, a printed circuit board, or a semiconductor package, and is a semiconductor package in this embodiment. The circuit unit 202 is a printed wiring board, a printed circuit board, or a semiconductor package, and is a printed circuit board in this embodiment. The circuit units 201 and 202 are spaced apart in the Z direction, which is the stacking direction, and are electrically and mechanically connected by a plurality of intermediate connection members 300. That is, each intermediate connection member 300 is used to electrically and mechanically connect the circuit units 201 and 202 that are arranged opposite each other in the Z direction.

[0019] Circuit unit 201 has wiring board 211 and image sensor 212, which is an example of a first electronic component, mounted on wiring board 211. Wiring board 211 is a package substrate. Wiring board 211 is also a rigid substrate. Image sensor 212 is a semiconductor element and an imaging element.

[0020] The circuit unit 202 has a wiring board 221 and a plurality of memory elements 222, which are an example of a second electronic component, mounted on the wiring board 221. The wiring board 221 is a printed wiring board. The wiring board 221 is also a rigid substrate. The memory elements 222 are semiconductor elements, and in this embodiment, are capable of storing image data. An electronic component, the memory elements 222 mounted on the wiring board 221 in this embodiment, is disposed between the wiring boards 211 and 221. Therefore, in this embodiment, the wiring boards 211 and 221 are electrically and mechanically connected by a plurality of intermediate connection members 300 so that the memory elements 222 do not interfere with the wiring board 211.

[0021] The image sensor 212 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The image sensor 212 has a function of converting light incident via the lens barrel 102 into an electrical signal.

[0022] The processing module 400 includes a printed wiring board 401 and an image processing device 402, which is a semiconductor device mounted on the printed wiring board 401. The image processing device 402 is, for example, a digital signal processor. The image processing device 402 has a function of acquiring an electrical signal from the image sensor 212, correcting the acquired electrical signal, and generating image data.

[0023] FIG. 2(a) is a plan view of the imaging module 200, and FIG. 2(b) is a cross-sectional view of the imaging module 200. In FIG. 2(a), for the sake of explanation, the circuit unit 201 is omitted. FIG. 2(b) is a cross-sectional view of the imaging module 200 taken along line IIB-IIB shown in FIG. 2(a). The circuit unit 201 of the imaging module 200 has a frame 213 provided on a wiring board 211 and a LID 214 provided on the frame 213. The LID 214 is made of, for example, a glass substrate.

[0024] The plurality of intermediate connection members 300 are arranged to surround the plurality of memory elements 222. In this embodiment, the number of intermediate connection members 300 is five, and the number of memory elements 222 is two.

[0025] In wiring board 211, a plurality of pads 215 are arranged on main surface 2112 opposite main surface 2111 on which image sensor 212 is mounted. A solder resist film (not shown) may be provided on main surface 2112. In this case, it is preferable that openings are formed in the solder resist film at positions corresponding to each of pads 215. The shape of each pad 215 is not particularly limited, and may be, for example, circular or polygonal in plan view. The relationship between the solder resist film and the pads may be either SMD or NSMD. A resin with a low thermal expansion coefficient is used as the insulating material for the insulating substrate of wiring board 211.

[0026] In wiring board 221, a plurality of pads 225 and a plurality of pads 226 are arranged on main surface 2211 on which memory elements 222 are mounted. The plurality of memory elements 222 are bonded to the plurality of pads 226 with solder 230. A solder resist film (not shown) may be provided on main surface 2211. In this case, it is preferable that openings are formed in the solder resist film at positions corresponding to each of pads 225 and 226. The shape of each of pads 225 and 226 is not particularly limited and may be, for example, circular or polygonal in plan view. The relationship between the solder resist film and the pads may be either SMD or NSMD. Resin such as FR-4 is used as the insulating material for the insulating substrate of wiring board 221.

[0027] Each intermediate connection member 300 has a plurality of wiring portions 310 extending in the Z direction. Both end faces 3101, 3102 of each wiring portion 310 in the Z direction are exposed to the outside. The end face 3101 and the pad 215 are electrically and mechanically connected by solder 240, and the end face 3102 and the pad 225 are electrically and mechanically connected by solder 250.

[0028] Each of the pads 215, 225, and 226 is an electrode made of a conductive metal, such as copper, and serves as a signal electrode, a power electrode, a ground electrode, or a dummy electrode.

[0029] Fig. 3(a) is a perspective view of an intermediate connection member 300 according to the first embodiment, and Fig. 3(b) is an enlarged view of a portion of the intermediate connection member 300 shown in Fig. 3(a).

[0030] The intermediate connection member 300 is a rectangular parallelepiped rigid substrate, and each of a pair of end faces 301, 302 in the Z direction is a surface used for bonding. Here, the longitudinal direction of the intermediate connection member 300 is the X direction, the width direction of the intermediate connection member 300 is the Y direction, and the height direction of the intermediate connection member 300 is the Z direction. The Z direction is the first direction, the X direction is the second direction, and the Y direction is the third direction. The X direction, Y direction, and Z direction intersect with each other. In this embodiment, the X direction, Y direction, and Z direction are perpendicular to each other.

[0031] The intermediate connection member 300 has a plurality of wiring portions 311 which are a plurality of first wiring portions, and a plurality of wiring portions 312 which are a plurality of second wiring portions. The plurality of wiring portions 311 and the plurality of wiring portions 312 constitute the plurality of wiring portions 310 shown in Figures 2(a) and 2(b).

[0032] Intermediate connection member 300 has a first insulating substrate portion, insulating substrate portion 321, and a second insulating substrate portion, insulating substrate portion 322. Intermediate connection member 300 also has insulating layer portion 323, which is disposed between insulating substrate portion 321 and insulating substrate portion 322 and is made of a different material from insulating substrate portion 321 and insulating substrate portion 322.

[0033] The plurality of wiring portions 311 are disposed between the insulating substrate portion 321 and the insulating layer portion 323. The plurality of wiring portions 311 are disposed at intervals in the X direction. The plurality of wiring portions 311 are disposed so as to extend in the Z direction. As a result, both end faces 3111, 3112 of each of the plurality of wiring portions 311 in the Z direction are exposed to the outside at both end faces 301, 302 of the intermediate connection member 300 so as to be solder-joinable to the wiring boards 211, 221.

[0034] The plurality of wiring portions 312 are disposed between the insulating substrate portion 322 and the insulating layer portion 323. The plurality of wiring portions 312 are disposed at intervals in the X direction. The plurality of wiring portions 312 are disposed so as to extend in the Z direction. As a result, both end faces 3121, 3122 in the Z direction of each of the plurality of wiring portions 312 are exposed to the outside at both end faces 301, 302 of the intermediate connection member 300 so as to be solder-joinable to the wiring boards 211, 221.

[0035] Furthermore, the plurality of wiring portions 311 and the plurality of wiring portions 312 are alternately arranged in the X direction. An insulating layer portion 323 is disposed between the plurality of wiring portions 311 and the plurality of wiring portions 312. That is, the plurality of wiring portions 311 and the plurality of wiring portions 312 are arranged at intervals in the Y direction. Therefore, the plurality of wiring portions 311 and the plurality of wiring portions 312 are arranged in a staggered manner in the X direction. By arranging the plurality of wiring portions 311 and the plurality of wiring portions 312 in this staggered manner, it is possible to achieve even higher density wiring and to reduce the size of the imaging module 200. However, when high density wiring is not required, the plurality of wiring portions 311 and the plurality of wiring portions 312 may be arranged facing each other rather than in a staggered manner.

[0036] The insulating layer portion 323 is formed by solidifying, i.e., curing, the adhesive. In other words, the insulating substrate portion 321, the insulating substrate portion 322, the plurality of wiring portions 311, and the plurality of wiring portions 312 are integrated by the insulating layer portion 323, thereby forming the intermediate connection member 300.

[0037] The insulating substrate portion 321 and the insulating substrate portion 322 are formed of the same insulating material. The insulating material of the insulating substrate portion 321 and the insulating substrate portion 322 is glass epoxy. Glass epoxy is, for example, a glass woven fabric made by weaving glass fibers into a cloth-like shape, impregnated with liquid epoxy resin, and then heat-cured; it is also called epoxy glass or epoxy glass resin. The insulating layer portion 323 is formed by solidifying an adhesive whose main component is, for example, epoxy resin or silicone resin. Each of the wiring portions 311 and 312 is formed of a conductive material, for example, copper.

[0038] The plurality of wiring portions 311 are formed to have the same thickness. Therefore, among the plurality of wiring portions 311, wiring portions through which a large current flows, such as wiring portions serving as ground wiring, may be made of a material different from that of the other wiring portions, i.e., a material with low electrical resistance. The same applies to the plurality of wiring portions 312.

[0039] Length L of intermediate connection member 300 in the X direction is shorter than the lengths of wiring boards 211, 221. Width W of intermediate connection member 300 in the Y direction depends on the area of main surfaces 2112, 2211 of wiring boards 211, 221 and the method for manufacturing imaging module 200.

[0040] When intermediate connection member 300 is made to stand on wiring board 221 during the manufacturing process and soldered to wiring board 221, width W of intermediate connection member 300 is preferably 1 mm or more. Furthermore, in consideration of high-density mounting, width W of intermediate connection member 300 is preferably 5 mm or less.

[0041] Furthermore, of the electronic components mounted on main surface 2211 of wiring board 221, memory element 222 is the tallest. Height H of intermediate connection member 300 in the Z direction is preferably set to be greater than that of memory element 222. For example, if memory element 222 has a height of 1.6 mm in the Z direction, height H of intermediate connection member 300 is preferably set to be greater than 1.6 mm.

[0042] The pitch P between the two closest wiring portions 311, 312 among the plurality of wiring portions 311 and the plurality of wiring portions 312 is preferably 0.36 mm or more and 0.44 mm or less. This allows the intermediate connection member 300 to be manufactured with high precision while realizing a narrow pitch between the wiring portions 311, 312.

[0043] A method for manufacturing the intermediate connection member 300 will now be described. Figures 4(a), 4(b), 5(a), 5(b), 5(c), 6(a), 6(b), 6(c), 7(a), 7(b), 7(c), 8(a), and 8(b) are diagrams for explaining the steps in the method for manufacturing the intermediate connection member 300.

[0044] In the steps shown in Figures 4(a) and 4(b), a plate-shaped base material 500 is prepared. Figure 4(a) shows a plan view of the base material 500, and Figure 4(b) shows a cross-sectional view of the base material 500 taken along line IV-IV in Figure 4(a). Although not shown, two base materials 500 are prepared. The base materials 500 are made of an insulating material such as glass epoxy, e.g., FR-4. The thickness W of the intermediate connection member 300 shown in Figure 3(a) is preferably 5 mm or less. Therefore, the thickness of the base material 500 is preferably 2.5 mm or less.

[0045] Next, processing is performed to form multiple grooves on the main surfaces 501 of the two base materials 500. As a result, in the process shown in Figures 5(a) and 5(b), an insulating substrate 601 is formed having a main surface 611 with multiple grooves 621. Figure 5(a) shows a plan view of the insulating substrate 601, and Figure 5(b) shows a cross-sectional view of the insulating substrate 601 taken along line VV in Figure 5(a). The grooves 621 are first grooves. The main surfaces 611 are the first main surfaces. The insulating substrate 601 is the first insulating substrate.

[0046] Similarly, in the step shown in Fig. 5(c), an insulating substrate 602 is formed having a main surface 612 with a plurality of grooves 622. Fig. 5(c) shows a cross-sectional view of the insulating substrate 602. The grooves 622 are second grooves. The main surface 612 is the second main surface. The insulating substrate 602 is a second insulating substrate.

[0047] The plurality of grooves 621 are formed to extend in the Z direction at intervals in the X direction. The plurality of grooves 622 are formed to extend in the Z direction at intervals in the X direction, similar to the plurality of grooves 621. In this embodiment, the plurality of grooves 621 and the plurality of grooves 622 are formed in a linear shape, but may also be formed in a curved shape.

[0048] The width and depth of the grooves 621, 622 are set according to the thickness of the wiring portions 311, 312 to be formed. For example, if the thickness of the wire described below is φ0.2 mm, it is preferable that the width and depth of each groove 621, 622 be about 0.2 mm, the same as the thickness of the wire. It is also preferable that the pitch of the multiple grooves 621 and the pitch of the multiple grooves 622 are set to the same, and for example, each pitch is set to about 0.57 mm.

[0049] In this embodiment, the cross-sectional shape of the grooves 621 and 622 is rectangular, but is not limited thereto and may be, for example, semicircular. The grooves 621 and 622 are preferably formed by mechanical processing using a dicer or slicer. However, the base material 500 may be masked with resist or the like and physically processed using a milling device. Alternatively, the insulating substrates 601 and 602 may be molded using a mold shaped to form the grooves. Forming an insulating substrate having multiple grooves adjacent to each other is easier than forming an insulating substrate having multiple through holes adjacent to each other. Therefore, it is possible to form the insulating substrate 601 having multiple grooves 621 and the insulating substrate 602 having multiple grooves 622 with high precision.

[0050] Next, in the process shown in FIGS. 6(a) and 6(b), a plurality of conductive members 701 are arranged in a plurality of grooves 621. FIG. 6(a) is a plan view of the insulating substrate 601 on which the plurality of conductive members 701 are arranged, and FIG. 6(b) is a cross-sectional view of the insulating substrate 601 on which the plurality of conductive members 701 are arranged, taken along line VI-VI in FIG. 6(a). The conductive members 701 are first conductive members. Similarly, in the process shown in FIG. 6(c), a plurality of conductive members 702 are arranged in a plurality of grooves 622. FIG. 6(c) is a cross-sectional view of the insulating substrate 602 on which the plurality of conductive members 702 are arranged. The conductive members 702 are second conductive members.

[0051] Each of the plurality of conductive members 701 and each of the plurality of conductive members 702 is a wire made of metal, for example, copper. In this embodiment, the diameters of the conductive members 701 are set to be the same. In this embodiment, the diameters of the conductive members 702 are also set to be the same. In addition, in this embodiment, the diameters of the conductive members 701 and 702 are also set to be the same.

[0052] Although the cross-sectional shape of the wire is circular in this embodiment, it is not limited thereto and may be polygonal, for example, rectangular. In the process shown in Figures 6(a) and 6(b), a plurality of conductive members 701 are fitted into a plurality of grooves 621. In the process shown in Figure 6(c), a plurality of conductive members 702 are fitted into a plurality of grooves 622. This prevents the conductive members 701 from falling off from the respective grooves 621 of the insulating substrate 601 and prevents the conductive members 702 from falling off from the respective grooves 622 of the insulating substrate 602 in a later process.

[0053] When fitting each conductive member 701 into each groove 621, an adhesive (not shown) may be applied to each groove 621. Similarly, when fitting each conductive member 702 into each groove 622, an adhesive (not shown) may be applied to each groove 622. It is preferable to select an adhesive that hardens at about room temperature. This effectively prevents each conductive member 701 from falling off from each groove 621 of the insulating substrate 601, and effectively prevents each conductive member 702 from falling off from each groove 622 of the insulating substrate 602.

[0054] Note that, although a suitable method for arranging the conductive members 701, 702 in the grooves 621, 622 is to fit wires into the grooves, this is not a limitation. For example, the conductive members may be formed by applying a conductive paste to the grooves using a dispenser or the like and then baking the paste. The conductive members 701, 702 may be made of any conductive material, and may be, for example, an inorganic material such as copper, silver, or aluminum, or an organic material such as conductive rubber.

[0055] The width and thickness of conductive members 701, 702 are preferably 0.05 mm or more and 2 mm or less, taking into consideration the solderability with the pads of wiring boards 211, 221, and the handleability and deformation of conductive members 701, 702 when arranging them in grooves 621, 622. In consideration of high-density wiring, the width and thickness of conductive members 701, 702 are more preferably 0.5 mm or less.

[0056] Next, steps for forming structure 800 shown in Figures 7(a) to 7(c) will be described. In this series of steps, structure 800 is formed by bonding main surface 611 of insulating substrate 601 and main surface 612 of insulating substrate 602 together via insulating member 651 so that the extending direction of the plurality of conductive members 701 and the extending direction of the plurality of conductive members 702 are aligned. In this series of steps, structure 800 is formed by bonding main surface 611 of insulating substrate 601 and main surface 612 of insulating substrate 602 together so that the plurality of conductive members 701 and the plurality of conductive members 702 are alternately arranged in the X direction.

[0057] The steps for forming the structure 800 shown in Figures 7(a) to 7(c) will be described in detail below. First, in the step shown in Figure 7(a), an adhesive 650 is applied to the main surface 611 of the insulating substrate 601. The adhesive 650 is an insulating adhesive whose main component is, for example, epoxy resin or silicone resin. The adhesive 650 can be selected from those that are thermoset at about 100°C, for example.

[0058] Next, in the step shown in FIG. 7( b), before the adhesive 650 hardens, the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650, and the adhesive 650 is sandwiched between the main surfaces 611 and 612. The insulating substrates 601 and 602 are aligned using an alignment device (not shown). Thus, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together via the plurality of conductive members 701 and 702 while controlling the thickness of the adhesive 650. The alignment of the insulating substrates 601 and 602 may be performed by abutting the end faces of the insulating substrates 601 and 602 against an abutment member (not shown), or by using a pre-formed alignment mark (not shown). Furthermore, in order to control the thickness of the adhesive 650, the adhesive may contain an insulating spacer (thickness-regulating material).

[0059] 7(c), adhesive 650 is cured to form insulating member 651. In this manner, main surface 611 of insulating substrate 601 and main surface 612 of insulating substrate 602 are bonded together with adhesive 650, whereby insulating member 651 is formed by solidifying adhesive 650.

[0060] In this embodiment, intermediate connection member 300 is formed by processing structure 800. Insulating substrate 601 in structure 800 corresponds to insulating substrate portion 321 in intermediate connection member 300. Insulating substrate 602 in structure 800 corresponds to insulating substrate portion 322 in intermediate connection member 300. Insulating member 651 in structure 800 corresponds to insulating layer portion 323 in intermediate connection member 300. Conductive member 701 in structure 800 corresponds to wiring portion 311 in intermediate connection member 300. Conductive member 702 in structure 800 corresponds to wiring portion 312 in intermediate connection member 300.

[0061] The Y-direction thickness of the insulating member 651 that becomes the insulating layer portion 323 is preferably 10 μm or more to prevent the insulating substrate portions 321 and 322 in FIG. 3(a) from peeling off from each other during the subsequent reflow process. If the thickness is less than 10 μm, the insulating substrate portions 321 and 322 may peel off from each other, or the conductive members 701 and 702 may short-circuit when arranged facing each other. Furthermore, the Y-direction thickness of the insulating member 651 that becomes the insulating layer portion 323 is preferably 300 μm or less, taking into consideration deformation of the conductive members. If the thickness exceeds 300 μm, the conductive members may deform, or the insulating layer portion 323 may absorb moisture and thereby lose sufficient mechanical strength. In other words, the Y-direction thickness of the insulating member 651 that becomes the insulating layer portion 323 is preferably 10 μm or more and 300 μm or less. Therefore, the Y-direction thickness of the insulating layer portion 323 is preferably 10 μm or more and 300 μm or less.

[0062] Next, in the process shown in FIGS. 8(a) and 8(b), the structure 800 is cut in the X direction. FIG. 8(a) shows a plan view of the structure 800, and FIG. 8(b) shows a cross-sectional view of the structure 800 taken along line VIII-VIII in FIG. 8(a). By cutting the structure 800 in the X direction at intervals of H in the Z direction, the end faces 3111, 3112, 3121, and 3122 of the wiring portions 311 and 312 shown in FIG. 3(a) can be exposed. In this embodiment, by cutting the structure 800 in the X and Z directions, an intermediate connection member 300 having a predetermined size, i.e., length L, height H, and width W, is formed. For example, an intermediate connection member 300 having insulating substrate portions 321 and 322 with a thickness in the Y direction of 0.5 mm, an insulating layer portion 323 with a thickness in the Y direction of 0.085 mm, a length L of 41.0 mm, a height H of 2.0 mm, and a width W of 1.085 mm is formed. A dicer or wire saw device is used to cut the structure 800. In this process, one intermediate connection member 300 may be formed from one structure 800, or multiple intermediate connection members 300 may be formed from one structure 800. When multiple intermediate connection members 300 are formed from one structure 800, one structure 800 may be cut along the X direction at equal intervals with a pitch of H in the Z direction. Alternatively, one structure 800 may be cut along the Z direction at equal intervals with a pitch of L in the X direction.

[0063] The cutting direction of the structure 800 may be oblique to the conductive members 701 and 702. In this case, the end faces of the formed wiring portions are elliptical and have a larger cross-sectional area than when they are circular, thereby making it possible to increase the bonding area with the solder.

[0064] The manufacturing process described above provides an intermediate connection member 300 in which the wiring portions 311, 312 are arranged with high precision, as shown in Fig. 3(a). Also, a highly accurate intermediate connection member 300 is provided which contains the wiring portions 311, 312 arranged at a narrow pitch and with high density.

[0065] Here, the pitch between the two closest wiring portions among the plurality of wiring portions 311 and the plurality of wiring portions 312 is defined as P. The ratio H / P of the height H in the Z direction of the intermediate connection member 300 to the pitch P is preferably 4 or greater. For example, if the pitch P is 0.4 mm and the height H is 2.0 mm, the ratio H / P is 5. In this way, it is possible to form an intermediate connection member 300 with a high height H while forming the wiring portions 311, 312 at high density.

[0066] Next, we will explain a manufacturing method of the imaging module 200. Figures 9(a), 9(b), 9(c), 10(a), 10(b), and 10(c) are views for explaining each step of the manufacturing method of the imaging module 200 according to the first embodiment.

[0067] As shown in Fig. 9(a), a wiring board 221 is prepared. Next, as shown in Fig. 9(b), a solder paste P1 containing solder powder and flux is applied to each of the pads 225, 226 of the wiring board 221. For example, Sn-Ag-Cu solder powder is used as the solder powder. The solder paste P1 can be applied by screen printing or a dispenser, for example.

[0068] The solder paste P1 may be supplied so as to cover the entire surface of each of the pads 225, 226, or may be supplied so as to cover only part of each of the pads 225, 226, as in so-called offset printing.

[0069] Next, as shown in FIG. 9( c), the memory element 222, the intermediate connection member 300, and a chip component (not shown) are placed on the wiring board 211. The chip component (not shown) is, for example, a capacitor or a resistor. The memory element 222, the intermediate connection member 300, and the chip component (not shown) are placed on the corresponding pads using a mounter or the like. That is, the memory element 222 is placed on the pad 226, and the intermediate connection member 300 is placed on the pad 225. At this time, the intermediate connection member 300 is placed on the wiring board 221 so that the solder paste P1 contacts the end surface 3102 of the wiring portion 310 of the intermediate connection member 300. After being placed on the wiring board 221, the intermediate connection member 300 is preferably able to stand on its own without a support mechanism.

[0070] Next, in a reflow furnace (not shown), the solder paste P1 is heated to above the melting point of the solder powder to melt and agglomerate the solder powder, followed by a reflow process in which the solder paste P1 is cooled below the melting point of the solder powder and solidified. As the solder solidifies, the memory element 222, the intermediate connection member 300, and the chip component (not shown) are electrically and mechanically bonded to the wiring board 221, as shown in FIG. 10(a). In other words, a structure is produced in which the intermediate connection member 300 and the circuit unit 202 are solder-bonded. The wiring portion 310 of the intermediate connection member 300 and the pad 225 are electrically connected by the solder 250.

[0071] Next, as shown in FIG. 10(b), solder paste P2 containing solder powder and flux is applied onto each pad 215 of wiring board 211. For example, Sn-Ag-Cu solder powder is used as the solder powder. Solder paste P2 can be applied by screen printing or a dispenser, for example. Solder paste P2 may be applied so as to cover the entire surface of each pad 215, or it may be applied so as to cover only a portion of each pad 215, as in offset printing.

[0072] 10(c), the circuit unit 201 is mounted on the intermediate connection member 300 on the circuit unit 202. The circuit unit 201 is placed on the intermediate connection member 300 using a mounter or the like. At this time, the circuit unit 201 is mounted on the intermediate connection member 300 so that the solder paste P2 contacts the end surface 3101 of the wiring portion 310 of the intermediate connection member 300.

[0073] Next, in a reflow furnace (not shown), the solder paste P2 is heated to a temperature equal to or higher than the melting point of the solder powder to melt and agglomerate the solder powder, and then cooled below the melting point of the solder powder to solidify. As the solder solidifies, the intermediate connection member 300 and the circuit unit 201 are joined by solder, thereby producing the imaging module 200 shown in FIG. 2(b).

[0074] The imaging module 200 manufactured in this manner does not have poor solder joints between the intermediate connection member 300 and the circuit units 201 and 202, and the optical performance of the image sensor 212 built into the circuit unit 201 can be fully guaranteed.

[0075] [Second embodiment] Next, an intermediate connecting member according to a second embodiment will be described. Fig. 11(a) is a perspective view of an intermediate connecting member 300A according to the second embodiment. Fig. 11(b) is an enlarged view of a portion of the intermediate connecting member 300A shown in Fig. 11(a). Note that in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals in the drawings, and descriptions thereof will be omitted.

[0076] The intermediate connection member 300A is a rectangular parallelepiped rigid substrate, and each of a pair of end faces 301, 302 in the Z direction is a bonding surface. The intermediate connection member 300A has a plurality of wiring portions 311 and a plurality of wiring portions 312.

[0077] Intermediate connection member 300A has insulating substrate portion 321 and insulating substrate portion 322. Intermediate connection member 300A also has insulating layer portion 323A that is disposed between insulating substrate portion 321 and insulating substrate portion 322 and is made of a different material from insulating substrate portion 321 and insulating substrate portion 322.

[0078] The plurality of wiring portions 311 are arranged between the insulating substrate portion 321 and the insulating layer portion 323A. The plurality of wiring portions 312 are arranged between the insulating substrate portion 322 and the insulating layer portion 323A.

[0079] The insulating layer unit 323A includes three insulating layers 323A-1, 323A-2, and 323A-3. The insulating layer 323A-1 is a first insulating layer. The insulating layer 323A-2 is a second insulating layer. The insulating layer 323A-3 is a third insulating layer. The insulating layers 323A-1 and 323A-2 are formed by solidifying an adhesive made of the same material. The insulating layer 323A-3 is disposed between the insulating layers 323A-1 and 323A-2. The insulating layer 323A-3 is made of a different material from the insulating layers 323A-1 and 323A-2. The insulating layers 323A-1 and 323A-2 are formed by hardening an adhesive whose main component is, for example, epoxy resin or silicone resin. The insulating layer 323A-3 is made of, for example, polyimide.

[0080] The thickness W of the insulating layer portion 323A in the Y direction is preferably 10 μm or more and 300 μm or less, similar to the first embodiment.

[0081] Next, a method for manufacturing the intermediate connection member 300A according to the second embodiment will be described. The steps of the method for manufacturing the intermediate connection member 300A according to the second embodiment will be described below with reference to FIGS. 12(a) to 12(d). The method for manufacturing the intermediate connection member 300A according to the second embodiment differs from the method for manufacturing the intermediate connection member 300 according to the first embodiment only in the steps of forming the structure shown in FIGS. 7(a) to 7(c). That is, the structure 800A formed in the steps shown in FIGS. 12(a) to 12(d) differs from the structure 800 formed in the first embodiment. Therefore, only the steps of forming the structure 800A shown in FIGS. 12(a) to 12(d) will be described. In this series of steps, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together via the insulating member 651A so that the extending directions of the plurality of conductive members 701 and the plurality of conductive members 702 are aligned. In this series of steps, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together so that multiple conductive members 701 and multiple conductive members 702 are arranged alternately in the X direction, thereby forming the structure 800A.

[0082] 12(a) to 12(d), in the step of forming structure 800A, main surface 611 of insulating substrate 601 and main surface 612 of insulating substrate 602 are bonded together with an adhesive via insulating sheet 650A-3, thereby forming insulating member 651A. The step of forming structure 800A will be described in detail below. First, in the step shown in FIG. 12(a), adhesive 650A-1 is applied onto main surface 611 of insulating substrate 601. Adhesive 650A-1 is an insulating adhesive whose main component is, for example, epoxy resin or silicone resin.

[0083] 12(b), before adhesive 650A-1 hardens, insulating sheet 650A-3 is placed on adhesive 650A-1, and then adhesive 650A-2, which has the same composition as adhesive 650A-1, is applied onto insulating sheet 650A-3. Insulating sheet 650A-3 is a film-like sheet made of polyimide or the like.

[0084] 12(c), the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650A-1. The insulating substrates 601 and 602 are aligned using an alignment device (not shown). The insulating sheet 650A-3 defines the thickness of each adhesive 650A-1 and 650A-2 in the Y direction, making the thickness of the adhesives 650A-1 and 650A-2 uniform in the Y direction. In this way, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together with the plurality of conductive members 701 and 702 therebetween while controlling the thickness of the adhesives 650A-1 and 650A-2. The insulating substrates 601 and 602 may be aligned by abutting the end faces of the insulating substrates 601 and 602 against an abutting member (not shown), or by using a pre-formed alignment mark (not shown).

[0085] Then, adhesives 650A-1 and 650A-2 are cured to form insulating member 651A shown in Fig. 12(d). Insulating member 651A is composed of insulating layer 651A-1 formed by curing adhesive 650A-1, insulating layer 651A-2 formed by curing adhesive 650A-2, and insulating sheet 650A-3.

[0086] In this embodiment, intermediate connection member 300A is formed by cutting structural member 800A. The cutting method is the same as in the first embodiment. Insulating substrate 601 in structural member 800A corresponds to insulating substrate portion 321 in intermediate connection member 300A. Insulating substrate 602 in structural member 800A corresponds to insulating substrate portion 322 in intermediate connection member 300A. Insulating member 651A in structural member 800A corresponds to insulating layer portion 323A in intermediate connection member 300A. Conductive member 701 in structural member 800A corresponds to wiring portion 311 in intermediate connection member 300A. Conductive member 702 in structural member 800A corresponds to wiring portion 312 in intermediate connection member 300A.

[0087] Furthermore, insulating layer 651A-1 in structural body 800A corresponds to insulating layer 323A-1 in intermediate connection member 300A. Insulating layer 651A-2 in structural body 800A corresponds to insulating layer 323A-2 in intermediate connection member 300A. Insulating sheet 650A-3 in structural body 800A corresponds to insulating layer 323A-3 in intermediate connection member 300A.

[0088] In the second embodiment, as in the first embodiment, an intermediate connection member 300A is obtained in which the wiring portions 311, 312 are arranged with high precision. Also, a highly accurate intermediate connection member 300A is obtained that contains the wiring portions 311, 312 arranged at a narrow pitch with high density. Note that in the second embodiment, the manufacturing method for the imaging module is the same as in the first embodiment, and therefore description thereof will be omitted.

[0089] [Third embodiment] An intermediate connecting member according to the third embodiment will now be described. Fig. 13 is a perspective view of an intermediate connecting member 300B according to the third embodiment. Note that in the third embodiment, the same components as those in the first embodiment will be denoted by the same reference numerals in the drawings and will not be described again. Furthermore, the manufacturing method of the intermediate connecting member 300B is also the same as that in the first embodiment, and therefore will not be described again.

[0090] Intermediate connection member 300B has insulating substrate portion 321, insulating substrate portion 322, and insulating layer portion 323. Intermediate connection member 300B also has wiring portion group 311B consisting of a plurality of first wiring portions and wiring portion group 312B consisting of a plurality of second wiring portions. Wiring portion groups 311B and 312B are made of a metal such as copper.

[0091] The wiring portion group 311B includes a wiring portion 311B-1 and a wiring portion 311B-2 that is thicker than the wiring portion 311B-1. The wiring portion group 312B includes a wiring portion 312B-1 and a wiring portion 312B-2 that is thicker than the wiring portion 312B-1.

[0092] This allows a larger current to flow through the wiring portions 311B-2 and 312B-2 than through the wiring portions 311B-1 and 312B-1. Therefore, the wiring portions 311B-2 and 312B-2 can be used, for example, as ground wiring. When manufacturing the intermediate connection member 300B, the wires that will become the wiring portions 311B-2 and 312B-2 should be thicker than the wires that will become the wiring portions 311B-1 and 312B-1. For example, if the diameter of the wiring portions 311B-1 and 312B-1 is φ0.2 mm, the diameter of the wiring portions 311B-2 and 312B-2 that will become ground wiring should be thicker, at φ0.3 mm.

[0093] The wiring group 311B and the wiring group 312B may each include a wiring portion having a first thickness and a wiring portion having a second thickness that is thicker than the first thickness. In this embodiment, the wiring portions having the first thickness are wiring portions 311B-1 and 312B-1, and the wiring portions having the second thickness are wiring portions 311B-2 and 312B-2. Note that only the wiring group 311B may include the wiring portion 311B-2 that is thicker than the wiring portion 311B-1, or only the wiring group 312B may include the wiring portion 312B-2 that is thicker than the wiring portion 312B-1. That is, it is sufficient that at least one wiring portion of the wiring group 311B and the wiring group 312B is thicker than the remaining wiring portions. The insulating layer 323 may also be configured like the insulating layer 323A of the second embodiment.

[0094] [Fourth embodiment] An intermediate connection member according to a fourth embodiment will now be described. FIG. 14 is a perspective view of an intermediate connection member 300C according to the fourth embodiment. In the fourth embodiment, components similar to those in the first embodiment are denoted by the same reference numerals in the drawings, and their description will be omitted. Furthermore, the manufacturing method of the intermediate connection member 300C is similar to that of the first embodiment, and therefore its description will be omitted. The intermediate connection member 300 of the first embodiment has a laminated structure of two insulating substrate portions 321, 322, and a plurality of wiring portions 311 and a plurality of wiring portions 312 are disposed at the connection portion between the two insulating substrate portions. However, the present invention is not limited to this. It is sufficient that the intermediate connection member has three or more insulating substrate portions, and a plurality of first wiring portions and a plurality of second wiring portions are disposed at the connection portion between two adjacent insulating substrate portions.

[0095] The intermediate connection member 300C of the fourth embodiment has three insulating substrate portions 321C-1, 322C, and 321C-2. If the insulating substrate portion 321C-1 is the first insulating substrate portion, the insulating substrate portion 322C is the second insulating substrate portion. If the insulating substrate portion 321C-2 is the first insulating substrate portion, the insulating substrate portion 322C is the second insulating substrate portion. The insulating material forming the insulating substrate portions 321C-1, 322C, and 321C-2 is, for example, FR-4.

[0096] An insulating layer portion 323C-1 is disposed between the insulating substrate portion 321C-1 and the insulating substrate portion 322C, and an insulating layer portion 323C-2 is disposed between the insulating substrate portion 321C-2 and the insulating substrate portion 322C. The insulating layer portions 323C-1 and 323C-2 are made of an insulating material different from the insulating material that constitutes the insulating substrate portions 321C-1, 322C, and 321C-2. The insulating layer portions 323C-1 and 323C-2 are formed by curing an insulating adhesive whose main component is, for example, epoxy resin or silicone resin.

[0097] The intermediate connection member 300C of the fourth embodiment has a plurality of wiring portions 311-1 as a plurality of first wiring portions and a plurality of wiring portions 312-1 as a plurality of second wiring portions. The plurality of wiring portions 311-1 are arranged to extend in the Z direction between an insulating substrate portion 321C-1 and an insulating layer portion 323C-1, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 312-1 are arranged to extend in the Z direction between an insulating substrate portion 322C and an insulating layer portion 323C-1, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 311-1 and the plurality of wiring portions 312-1 are arranged alternately in the X direction.

[0098] The intermediate connection member 300C also has a plurality of wiring portions 311-2 as a plurality of first wiring portions and a plurality of wiring portions 312-2 as a plurality of second wiring portions. The plurality of wiring portions 311-2 are arranged to extend in the Z direction between the insulating substrate portion 321C-2 and the insulating layer portion 323C-2, with both end faces in the Z direction exposed to the outside. The plurality of wiring portions 312-2 are arranged to extend in the Z direction between the insulating substrate portion 322C and the insulating layer portion 323C-2, with both end faces in the Z direction exposed to the outside. The plurality of wiring portions 311-2 and the plurality of wiring portions 312-2 are arranged alternately in the X direction.

[0099] As described above, in the fourth embodiment, as in the first embodiment, an intermediate connection member 300C in which wiring portions 311-1, 312-1, 311-2, and 312-2 are arranged with high precision is obtained. Also, in the fourth embodiment, as in the first embodiment, it is possible to manufacture the intermediate connection member 300C with high precision while realizing a narrow-pitch wiring structure. Note that the insulating layer portions 323C-1 and 323C-2 have the same configuration as the insulating layer portion 323 in the first embodiment, but may also have the same configuration as the insulating layer portion 323A in the second embodiment.

[0100] [Fifth embodiment] Next, an intermediate connecting member of a fifth embodiment will be described. Fig. 15(a) is a perspective view of an intermediate connecting member 300D according to the fifth embodiment. The configuration and manufacturing method of the intermediate connecting member 300D of the fifth embodiment are the same as the configuration and manufacturing method of the intermediate connecting member 300B of the third embodiment. That is, the manufacturing method of the intermediate connecting member 300D of the fifth embodiment is the same as the manufacturing method of the intermediate connecting member 300 of the first embodiment.

[0101] The intermediate connection member 300D has a wiring portion group 311D having a configuration similar to the wiring portion group 311B of the third embodiment and a wiring portion group 312D having a configuration similar to the wiring portion group 312B of the third embodiment. The intermediate connection member 300D also has an insulating substrate portion 321D having a configuration similar to the insulating substrate portion 321 of the third embodiment, an insulating substrate portion 322D having a configuration similar to the insulating substrate portion 322 of the third embodiment, and an insulating layer portion 323D having a configuration similar to the insulating layer portion 323 of the third embodiment. The insulating substrate portion 321D is a first insulating substrate portion, and the insulating substrate portion 322D is a second insulating substrate portion. The insulating substrate portion 321D and the insulating substrate portion 322D face each other via the insulating layer portion 323D. The insulating substrate portions 321D and 322D are made of the same material as the insulating substrate portions 321 and 322 described in the first embodiment, such as glass epoxy. The insulating layer portion 323D is made of a different material from the insulating substrate portion 321D and the insulating substrate portion 322D, and is made of the same material as the insulating layer portion 323 described in the first embodiment, for example, a solidified adhesive whose main component is epoxy resin or silicone resin.

[0102] In the fifth embodiment, the wiring portion group 311D has a plurality of, for example, seven wiring portions 311D-0 as the plurality of first wiring portions. The plurality of wiring portions 311D-0 are arranged at intervals from each other in the X direction. Each wiring portion 311D-0 is arranged extending in the Z direction so that both end faces in the Z direction are exposed to the outside. Each wiring portion 311D-0 is made of a conductive material, for example, copper. The plurality of wiring portions 311D-0 includes, for example, six wiring portions 311D-1 as at least one first wiring portion, and, for example, one wiring portion 311D-2 as at least one first wiring portion having a size and / or shape different from the wiring portion 311D-1. The number of wiring portions 311D-1 is preferably two or more, and is six in the fifth embodiment. The number of wiring portions 311D-2 is preferably less than the number of wiring portions 311D-1, and is one in the fifth embodiment.

[0103] The wiring portion group 312D is arranged at an interval in the Y direction from the wiring portion group 311D. The wiring portion group 312D has a plurality of, for example, seven wiring portions 312D-0 as a plurality of second wiring portions. The plurality of wiring portions 312D-0 are arranged at intervals from each other in the X direction. Each wiring portion 312D-0 is arranged extending in the Z direction so that both end faces in the Z direction are exposed to the outside. Each wiring portion 312D-0 is made of a conductive material, for example, copper. The plurality of wiring portions 312D-0 includes, for example, six wiring portions 312D-1 as at least one second wiring portion, and, for example, one wiring portion 312D-2 as at least one second wiring portion having a size and / or shape different from the wiring portion 312D-1. The number of wiring portions 312D-1 is preferably two or more, and is six in the fifth embodiment. The number of wiring portions 312D-2 is preferably smaller than the number of wiring portions 312D-1, and is one in the fifth embodiment.

[0104] In the manufacturing process of the imaging module according to the fifth embodiment, it is preferable to provide alignment marks on intermediate connection member 300D in order to improve the alignment precision between intermediate connection member 300D and wiring board 221 shown in Fig. 9(c). By providing alignment marks on intermediate connection member 300D, it is possible to position the wiring portion in the imaging module with high precision.

[0105] In the manufacturing process of the intermediate connection member 300 in the first embodiment, the insulating substrate 601 and the insulating substrate 602 are bonded with an adhesive, as shown in FIG. 7(c). In the manufacturing process of the intermediate connection member 300D in the fifth embodiment, the insulating substrate corresponding to the insulating substrate portion 321D and the insulating substrate corresponding to the insulating substrate portion 322D are also bonded with an adhesive. To improve alignment accuracy during this process, it is preferable to provide alignment marks on at least one of the two insulating substrates. By providing alignment marks on the insulating substrates, the wiring portions can be positioned with high accuracy in the intermediate connection member 300.

[0106] Therefore, in the fifth embodiment, the wiring portion 311D-2 of the plurality of wiring portions 311D-0 and the wiring portion 312D-2 of the plurality of wiring portions 312D-0 are used as alignment marks. Of the plurality of wiring portions 311D-0, the wiring portion located at the end in the X direction is the wiring portion 311D-2. Of the plurality of wiring portions 312D-0, the wiring portion located at the end in the X direction is the wiring portion 312D-2.

[0107] The width in the X direction of each wiring portion 311D-1 is width W11D. Width W11D is a first width. The width in the X direction of wiring portion 311D-2 is width W12D, which is wider than width W11D. Width W12D is a second width. In this way, since width W12D of wiring portion 311D-2 is wider than width W11D of wiring portion 311D-1, wiring portion 311D-2 can be used as an alignment mark.

[0108] Furthermore, the thickness of each wiring portion 311D-1 in the Y direction is thickness T1D. Thickness T1D is a first thickness. The thickness of wiring portion 311D-2 in the Y direction is thickness T2D, which is thicker than thickness T1D. Thickness T2D is a second thickness. In this way, since thickness T2D of wiring portion 311D-2 is thicker than thickness T1D of wiring portion 311D-1, wiring portion 311D-2 can be used as an alignment mark.

[0109] Each of the wiring portions 311D-1 and 311D-2 is formed, for example, by a wire, and the diameter of the wiring portion 311D-2 is larger than the diameter of the wiring portion 311D-1, so that the width W12D of the wiring portion 311D-2 is larger than the width W11D of the wiring portion 311D-1, and the thickness T2D of the wiring portion 311D-2 is thicker than the thickness T1D of the wiring portion 311D-1.

[0110] The width in the X direction of each wiring portion 312D-1 is width W13D. Width W13D is a third width. The width in the X direction of wiring portion 312D-2 is width W14D, which is wider than width W13D. Width W14D is a fourth width. In this way, since width W14D of wiring portion 312D-2 is wider than width W13D of wiring portion 312D-1, wiring portion 312D-2 can be used as an alignment mark.

[0111] Furthermore, the thickness of each wiring portion 312D-1 in the Y direction is thickness T3D. Thickness T3D is a third thickness. The thickness of wiring portion 312D-2 in the Y direction is thickness T4D, which is thicker than thickness T3D. Thickness T4D is a fourth thickness. In this way, since thickness T4D of wiring portion 312D-2 is thicker than thickness T3D of wiring portion 312D-1, wiring portion 312D-2 can be used as an alignment mark.

[0112] Each of the wiring portions 312D-1 and 312D-2 is formed, for example, by a wire, and the diameter of the wiring portion 312D-2 is larger than the diameter of the wiring portion 312D-1. As a result, the width W14D of the wiring portion 312D-2 is larger than the width W13D of the wiring portion 312D-1, and the thickness T4D of the wiring portion 312D-2 is thicker than the thickness T3D of the wiring portion 312D-1.

[0113] In the fifth embodiment, the plurality of wiring portions 311D-0 are arranged on the insulating substrate portion 321D, and the plurality of wiring portions 312D-0 are arranged on the insulating substrate portion 322D. The configurations of the insulating substrate portion 321D on which the wiring portion 311D-0 is arranged and the insulating substrate portion 322D on which the wiring portion 312D-0 is arranged will be specifically described below. FIG. 15(b) is an explanatory diagram of the two insulating substrate portions 321D, 322D according to the fifth embodiment. FIG. 15(b) shows a plan view of the insulating substrate portions 321D, 322D as viewed in the Z direction.

[0114] The insulating substrate portion 321D has a surface 3211D and a surface 3212D opposite to the surface 3211D in the Y direction. The insulating substrate portion 322D has a surface 3221D and a surface 3222D opposite to the surface 3221D in the Y direction. The insulating layer portion 323D of FIG. 15(a) is disposed between the surfaces 3212D and 3222D. That is, the surfaces 3212D and 3222D face each other with the insulating layer portion 323D interposed therebetween.

[0115] The plurality of wiring portions 311D-0 are arranged on the surface 3212D, and the plurality of wiring portions 312D-0 are arranged on the surface 3222D. That is, the plurality of wiring portions 311D-0 are arranged between the insulating substrate portion 321D and the insulating layer portion 323D, and the plurality of wiring portions 312D-0 are arranged between the insulating substrate portion 322D and the insulating layer portion 323D.

[0116] A plurality of grooves 31D-0 corresponding to the plurality of wiring portions 311D-0 are formed on the surface 3212D. The plurality of grooves 31D-0 are formed at intervals in the X direction. Each groove 31D-0 extends in the Z direction. The plurality of grooves 31D-0 includes a plurality of grooves 31D-1 corresponding to the plurality of wiring portions 311D-1 and a groove 31D-2 corresponding to the wiring portion 311D-2. The groove 31D-2 is a first groove.

[0117] Each wiring portion 311D-1 is disposed in each groove 31D-1. Each wiring portion 311D-2 is disposed in each groove 31D-2. Therefore, the width W22D in the X direction of each groove 31D-2 is greater than the width W21D in the X direction of each groove 31D-1, i.e., the width W11D in the X direction of each wiring portion 311D-1. Furthermore, the depth D2D in the Y direction of each groove 31D-2 is greater than the depth D1D in the Y direction of each groove 31D-1, i.e., the thickness T1D in the Y direction of each wiring portion 311D-1.

[0118] The width W21D of each groove 31D-1 is preferably wider than the width W11D of each wiring portion 311D-1. That is, the width W21D of each groove 31D-1 is preferably wider than 1.0 times the width W11D of each wiring portion 311D-1. For example, the width W21D of each groove 31D-1 may be 1.1 times or more the width W11D of each wiring portion 311D-1, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W21D of each groove 31D-1 is preferably 20 times or less the width W11D of each wiring portion 311D-1.

[0119] The width W22D of the groove 31D-2 is preferably wider than the width W12D of the wiring portion 311D-2. That is, the width W22D of the groove 31D-2 is preferably wider than 1.0 times the width W12D of the wiring portion 311D-2. For example, the width W22D of the groove 31D-2 may be 1.1 times or more the width W12D of the wiring portion 311D-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W22D of the groove 31D-2 is preferably 20 times or less the width W12D of the wiring portion 311D-2.

[0120] The depth D1D of each groove 31D-1 is preferably deeper than the thickness T1D of each wiring portion 311D-1. That is, the depth D1D of each groove 31D-1 is preferably deeper than 1.0 times the thickness T1D of each wiring portion 311D-1. For example, the depth D1D of each groove 31D-1 may be 1.1 times or more the thickness T1D of each wiring portion 311D-1, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the depth D1D of each groove 31D-1 is preferably 20 times or less the thickness T1D of each wiring portion 311D-1.

[0121] The depth D2D of the groove 31D-2 is preferably deeper than the thickness T2D of the wiring portion 311D-2. That is, the depth D2D of the groove 31D-2 is preferably deeper than 1.0 times the thickness T2D of the wiring portion 311D-2. For example, the depth D2D of the groove 31D-2 may be 1.1 times or more the thickness T2D of the wiring portion 311D-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the depth D2D of the groove 31D-2 is preferably 20 times or less the thickness T2D of the wiring portion 311D-2.

[0122] A plurality of grooves 32D-0 corresponding to the plurality of wiring portions 312D-0 are formed on the surface 3222D. The plurality of grooves 32D-0 are formed at intervals in the X direction. Each groove 32D-0 extends in the Z direction. The plurality of grooves 32D-0 includes a plurality of grooves 32D-1 corresponding to the plurality of wiring portions 312D-1 and a groove 32D-2 corresponding to the wiring portion 312D-2. The groove 32D-2 is a second groove.

[0123] Each wiring portion 312D-1 is disposed in each groove 32D-1. Each wiring portion 312D-2 is disposed in each groove 32D-2. Therefore, the width W24D of each groove 32D-2 in the X direction is greater than the width W23D of each groove 32D-1 in the X direction, i.e., the width W13D of each wiring portion 312D-1 in the X direction. Furthermore, the depth D4D of each groove 32D-2 in the Y direction is greater than the depth D3D of each groove 32D-1 in the Y direction, i.e., the thickness T3D of each wiring portion 312D-1 in the Y direction.

[0124] The width W23D of each groove 32D-1 is preferably wider than the width W13D of each wiring portion 312D-1. That is, the width W23D of each groove 32D-1 is preferably wider than 1.0 times the width W13D of each wiring portion 312D-1. For example, the width W23D of each groove 32D-1 may be 1.1 times or more the width W13D of each wiring portion 312D-1, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W23D of each groove 32D-1 is preferably 20 times or less the width W13D of each wiring portion 312D-1.

[0125] The width W24D of the groove 32D-2 is preferably wider than the width W14D of the wiring portion 312D-2. That is, the width W24D of the groove 32D-2 is preferably wider than 1.0 times the width W14D of the wiring portion 312D-2. For example, the width W24D of the groove 32D-2 may be 1.1 times or more the width W14D of the wiring portion 312D-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W24D of the groove 32D-2 is preferably 20 times or less the width W14D of the wiring portion 312D-2.

[0126] The depth D3D of each groove 32D-1 is preferably greater than the thickness T3D of each wiring portion 312D-1. That is, the depth D3D of each groove 32D-1 is preferably greater than 1.0 times the thickness T3D of each wiring portion 312D-1. For example, the depth D3D of each groove 32D-1 may be 1.1 times or greater than the thickness T3D of each wiring portion 312D-1, or may be 1.5 times or greater, or may be 2 times or greater. Furthermore, the depth D3D of each groove 32D-1 is preferably 20 times or less the thickness T3D of each wiring portion 312D-1.

[0127] The depth D4D of the groove 32D-2 is preferably deeper than the thickness T4D of the wiring portion 312D-2. That is, the depth D4D of the groove 32D-2 is preferably deeper than 1.0 times the thickness T4D of the wiring portion 312D-2. For example, the depth D4D of the groove 32D-2 may be 1.1 times or more the thickness T4D of the wiring portion 312D-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the depth D4D of the groove 32D-2 is preferably 20 times or less the thickness T4D of the wiring portion 312D-2.

[0128] As such, when viewed in the Z direction, the area of wiring portion 311D-2 is larger than the area of wiring portion 311D-1, and the area of wiring portion 312D-2 is larger than the area of wiring portion 312D-1. By using wiring portions 311D-2 and 312D-2 as alignment marks, the alignment accuracy of intermediate connection member 300D with wiring board 221 shown in FIG. 9(c) is improved. Furthermore, because the area of wiring portions 311D-2 and 312D-2 is large when viewed in the Z direction, the self-alignment effect of intermediate connection member 300D with wiring board 221 is improved when wiring board 221 and intermediate connection member 300D are joined with solder.

[0129] In the fifth embodiment, a wiring portion 311D-2 having a width W12D and a thickness T2D and included in the plurality of wiring portions 311D-0 and a wiring portion 312D-2 having a width W14D and a thickness T4D and included in the plurality of wiring portions 312D-0 are misaligned in the X direction. That is, among the plurality of wiring portions 311D-0 and the plurality of wiring portions 312D-0, the distance between the wiring portion 311D-2 and the wiring portion 312D-2 is longer than the distance between the other two wiring portions. This further improves the alignment accuracy of the intermediate connection member 300D with respect to the wiring board 221 in the manufacturing process of the imaging module in the fifth embodiment. Furthermore, when the wiring board 221 and the intermediate connection member 300D are joined with solder, the self-alignment effect of the intermediate connection member 300D with respect to the wiring board 221 is further improved. Furthermore, in the manufacturing process of intermediate connection member 300D, alignment precision is further improved when bonding the insulating substrate corresponding to insulating substrate portion 321D and the insulating substrate corresponding to insulating substrate portion 322D with adhesive.

[0130] Although the case where the wiring portion 311D-2 and the wiring portion 312D-2 are used as alignment marks has been described, the present invention is not limited to this. For example, the wiring portion 312D-2 and the groove portion 32D-2 may be omitted, and the wiring portion 311D-2 may be used as the alignment mark. Furthermore, the wiring portion group 312D, i.e., the plurality of wiring portions 312D-0, may be omitted from the intermediate connection member 300D. In this case, too, the wiring portion 311D-2 may be used as the alignment mark.

[0131] Preferably, the width W12D of the wiring portion 311D-2 is wider than the width W11D of each wiring portion 311D-1, and the thickness T2D of the wiring portion 311D-2 is thicker than the thickness T1D of each wiring portion 311D-1, but this is not limitative. For example, if the width W12D of the wiring portion 311D-2 is wider than the width W11D of each wiring portion 311D-1, the thickness T2D of the wiring portion 311D-2 may be equal to or smaller than the thickness T1D of each wiring portion 311D-1. In this case, it is preferable that the width W22D of the groove portion 31D-2 is wider than the width W21D of each groove portion 31D-1, and the depth D2D of the groove portion 31D-2 is equal to or smaller than the depth D1D of each groove portion 31D-1. Similarly, when the thickness T2D of the wiring portion 311D-2 is thicker than the thickness T1D of each wiring portion 311D-1, the width W12D of the wiring portion 311D-2 may be equal to or smaller than the width W11D of each wiring portion 311D-1. In this case, it is preferable that the depth D2D of the groove portion 31D-2 is deeper than the depth D1D of each groove portion 31D-1, and the width W22D of the groove portion 31D-2 is equal to or smaller than the width W21D of each groove portion 31D-1. That is, the groove portion 31D-2 may be wider than each groove portion 31D-1, i.e., the width of each wiring portion 311D-1, and / or deeper than each groove portion 31D-1, i.e., the thickness of each groove portion 311D-1. Even in these cases, the wiring portion 311D-2 can be used as an alignment mark.

[0132] Similarly, it is preferable that the width W14D of the wiring portion 312D-2 is wider than the width W13D of each wiring portion 312D-1, and that the thickness T4D of the wiring portion 312D-2 is thicker than the thickness T3D of each wiring portion 312D-1, but this is not limited to this. For example, if the width W14D of the wiring portion 312D-2 is wider than the width W13D of each wiring portion 312D-1, the thickness T4D of the wiring portion 312D-2 may be equal to or less than the thickness T3D of each wiring portion 312D-1. In this case, it is preferable that the width W24D of the groove portion 32D-2 is wider than the width W23D of each groove portion 32D-1, and that the depth D4D of the groove portion 32D-2 is equal to or less than the depth D3D of each groove portion 32D-1. Similarly, if the thickness T4D of the wiring portion 312D-2 is thicker than the thickness T3D of each wiring portion 312D-1, the width W14D of the wiring portion 312D-2 may be equal to or smaller than the width W13D of each wiring portion 312D-1. In this case, it is preferable that the depth D4D of the groove portion 32D-2 is greater than the depth D3D of each groove portion 32D-1, and the width W24D of the groove portion 32D-2 is equal to or smaller than the width W23D of each groove portion 32D-1. That is, the groove portion 32D-2 may be wider than each groove portion 32D-1, i.e., the width of each wiring portion 312D-1, and / or deeper than each groove portion 32D-1, i.e., the thickness of each groove portion 32D-1. Even in these cases, the wiring portion 312D-2 can be used as an alignment mark.

[0133] Although the case where the wiring portion group 311D, i.e., the plurality of wiring portions 311D-0, includes one wiring portion 311D-2 has been described, this is not limiting and the wiring portion group 311D may include two or more wiring portions 311D-2. In this case, it is preferable that, of the plurality of wiring portions 311D-0, each of the two wiring portions located at both ends in the X direction is the wiring portion 311D-2.

[0134] Similarly, although the case where the wiring portion group 312D, i.e., the plurality of wiring portions 312D-0, includes one wiring portion 312D-2 has been described, this is not limitative and the wiring portion group 312D may include two or more wiring portions 312D-2. In this case, it is preferable that, of the plurality of wiring portions 312D-0, each of the two wiring portions located at both ends in the X direction is the wiring portion 312D-2.

[0135] Furthermore, although the case where each of the plurality of wiring portions 311D-0 is a wire has been described, the present invention is not limited to this. Each of the plurality of wiring portions 311D-0 may be a conductor. Therefore, any or all of the plurality of wiring portions 311D-0 may be, for example, a conductor pattern.

[0136] Similarly, although the case where each of the plurality of wiring portions 312D-0 is a wire has been described, this is not limiting. Each of the plurality of wiring portions 312D-0 may be a conductor. Therefore, any or all of the plurality of wiring portions 312D-0 may be, for example, a conductor pattern.

[0137] Although the case where the wiring portions 311D-2 and 312D-2 are disposed in the grooves 31D-2 and 32D-2, respectively, has been described, this is not limiting, and one or both of the wiring portions 311D-2 and 312D-2 may be omitted. In this case, the grooves without wiring portions can be used as alignment marks. Note that the grooves without wiring portions are filled with a portion of the insulating layer portion 323D.

[0138] [Sixth embodiment] Next, an intermediate connecting member of a sixth embodiment will be described. Fig. 16(a) is a perspective view of an intermediate connecting member 300E according to the sixth embodiment. The configuration and manufacturing method of the intermediate connecting member 300E of the sixth embodiment are substantially the same as the configuration and manufacturing method of the intermediate connecting member 300B of the third embodiment. In other words, the manufacturing method of the intermediate connecting member 300E of the sixth embodiment is substantially the same as the manufacturing method of the intermediate connecting member 300 of the first embodiment.

[0139] The intermediate connection member 300E includes a wiring group 311E and a wiring group 312E. The intermediate connection member 300E also includes an insulating substrate portion 321E, an insulating substrate portion 322E, and an insulating layer portion 323E. The insulating substrate portion 321E is a first insulating substrate portion, and the insulating substrate portion 322E is a second insulating substrate portion. The insulating substrate portion 321E and the insulating substrate portion 322E face each other via the insulating layer portion 323E. The insulating substrate portions 321E and 322E are made of the same material as the insulating substrate portions 321 and 322 described in the first embodiment, such as glass epoxy. The insulating layer portion 323E is made of a different material from the insulating substrate portions 321E and 322E, but is made of the same material as the insulating layer portion 323 described in the first embodiment, such as a solidified adhesive containing an epoxy resin or silicone resin as its main component.

[0140] In the sixth embodiment, the wiring portion group 311E has a plurality of, for example, seven wiring portions 311E-0 as the plurality of first wiring portions. The plurality of wiring portions 311E-0 are arranged at intervals from each other in the X direction. Each wiring portion 311E-0 is arranged extending in the Z direction so that both end faces in the Z direction are exposed to the outside. Each wiring portion 311E-0 is made of a conductive material, for example, copper. The plurality of wiring portions 311E-0 includes, for example, six wiring portions 311E-1 as at least one first wiring portion, and, for example, one wiring portion 311E-2 as at least one first wiring portion having a size and / or shape different from the wiring portion 311E-1. The number of wiring portions 311E-1 is preferably two or more, and is six in the sixth embodiment. The number of wiring portions 311E-2 is preferably less than the number of wiring portions 311E-1, and is one in the sixth embodiment.

[0141] The wiring portion group 312E is arranged at an interval in the Y direction from the wiring portion group 311E. The wiring portion group 312E has a plurality of, for example, seven wiring portions 312E-0 as a plurality of second wiring portions. The plurality of wiring portions 312E-0 are arranged at intervals from each other in the X direction. Each wiring portion 312E-0 is arranged extending in the Z direction so that both end faces in the Z direction are exposed to the outside. Each wiring portion 312E-0 is made of a conductive material, for example, copper. The plurality of wiring portions 312E-0 includes, for example, six wiring portions 312E-1 as at least one second wiring portion, and, for example, one wiring portion 312E-2 as at least one second wiring portion having a size and / or shape different from the wiring portion 312E-1. The number of wiring portions 312E-1 is preferably two or more, and is six in the sixth embodiment. The number of wiring portions 312E-2 is preferably smaller than the number of wiring portions 312E-1, and is one in the sixth embodiment.

[0142] In the manufacturing process of the electronic module, the intermediate connection member must be aligned with high precision relative to the wiring board to be joined. Therefore, in the manufacturing process of the imaging module of the sixth embodiment, it is preferable to provide alignment marks on the intermediate connection member 300E to improve the alignment precision between the intermediate connection member 300E and the wiring board 221 shown in FIG. 9(c). By providing alignment marks on the intermediate connection member 300E, the wiring portion can be positioned with high precision in the imaging module.

[0143] In the manufacturing process of the intermediate connection member 300E in the sixth embodiment, an insulating substrate corresponding to the insulating substrate portion 321E and an insulating substrate corresponding to the insulating substrate portion 322E are joined with an adhesive. To improve the alignment accuracy during this process, it is preferable to provide alignment marks on at least one of the two insulating substrates. By providing alignment marks on the insulating substrate, the wiring portions can be positioned with high accuracy in the intermediate connection member 300E.

[0144] Therefore, in the sixth embodiment, the wiring portion 311E-2 of the plurality of wiring portions 311E-0 and the wiring portion 312E-2 of the plurality of wiring portions 312E-0 are used as alignment marks. Of the plurality of wiring portions 311E-0, the wiring portion located at the end in the X direction is the wiring portion 311E-2. Of the plurality of wiring portions 312E-0, the wiring portion located at the end in the X direction is the wiring portion 312E-2.

[0145] The width in the X direction of each wiring portion 311E-1 is width W11E. Width W11E is a first width. The width in the X direction of wiring portion 311E-2 is width W12E, which is wider than width W11E. Width W12E is a second width. In this way, since width W12E of wiring portion 311E-2 is wider than width W11E of wiring portion 311E-1, wiring portion 311E-2 can be used as an alignment mark.

[0146] Furthermore, the thickness of each wiring portion 311E-1 in the Y direction is thickness T1E. Thickness T1E is a first thickness. The thickness of wiring portion 311E-2 in the Y direction is thickness T2E, which is thicker than thickness T1E. Thickness T2E is a second thickness. In this way, since thickness T2E of wiring portion 311E-2 is thicker than thickness T1E of wiring portion 311E-1, wiring portion 311E-2 can be used as an alignment mark.

[0147] Each of the wiring portions 311E-1 and 311E-2 is formed, for example, by a wire, and the diameter of the wiring portion 311E-2 is larger than the diameter of the wiring portion 311E-1. As a result, the width W12E of the wiring portion 311E-2 is larger than the width W11E of the wiring portion 311E-1, and the thickness T2E of the wiring portion 311E-2 is thicker than the thickness T1E of the wiring portion 311E-1.

[0148] The width in the X direction of each wiring portion 312E-1 is width W13E. Width W13E is a third width. The width in the X direction of wiring portion 312E-2 is width W14E, which is wider than width W13E. Width W14E is a fourth width. In this way, since width W14E of wiring portion 312E-2 is wider than width W13E of wiring portion 312E-1, wiring portion 312E-2 can be used as an alignment mark.

[0149] Furthermore, the thickness of each wiring portion 312E-1 in the Y direction is thickness T3E. Thickness T3E is a third thickness. The thickness of wiring portion 312E-2 in the Y direction is thickness T4E, which is thicker than thickness T3E. Thickness T4E is a fourth thickness. In this way, since thickness T4E of wiring portion 312E-2 is thicker than thickness T3E of wiring portion 312E-1, wiring portion 312E-2 can be used as an alignment mark.

[0150] Each of the wiring portions 312E-1 and 312E-2 is formed, for example, by a wire, and the diameter of the wiring portion 312E-2 is larger than the diameter of the wiring portion 312E-1. As a result, the width W14E of the wiring portion 312E-2 is larger than the width W13E of the wiring portion 312E-1, and the thickness T4E of the wiring portion 312E-2 is thicker than the thickness T3E of the wiring portion 312E-1.

[0151] In the sixth embodiment, the plurality of wiring portions 311E-0 are arranged on an insulating substrate portion 321E, and the plurality of wiring portions 312E-0 are arranged on an insulating substrate portion 322E. The configurations of the insulating substrate portion 321E on which the wiring portion 311E-0 is arranged and the insulating substrate portion 321E on which the wiring portion 312E-0 is arranged will be specifically described below. FIG. 16(b) is an explanatory diagram of two insulating substrate portions 321E, 322E according to the sixth embodiment. FIG. 16(b) shows a plan view of the insulating substrate portions 321E, 322E as viewed in the Z direction.

[0152] Insulating substrate portion 321E has surface 3211E and surface 3212E opposite surface 3211E. Insulating substrate portion 322E has surface 3221E and surface 3222E opposite surface 3221E. Insulating layer portion 323E of FIG. 16(a) is disposed between surfaces 3212E and 3222E. That is, surfaces 3212E and 3222E face each other with insulating layer portion 323E interposed therebetween.

[0153] The plurality of wiring portions 311E-0 are arranged on surface 3211E, and the plurality of wiring portions 312E-0 are arranged on surface 3221E. That is, the plurality of wiring portions 311E-0 are arranged on surface 3211E on the outer side of insulating substrate portion 321E, and the plurality of wiring portions 312E-0 are arranged on surface 3221E on the outer side of insulating substrate portion 321E. Note that an insulating layer (not shown) may be provided on each of surfaces 3211E and 3221E.

[0154] A plurality of grooves 31E-0 corresponding to the plurality of wiring portions 311E-0 are formed on the surface 3211E. The plurality of grooves 31E-0 are formed at intervals in the X direction. Each groove 31E-0 extends in the Z direction. The plurality of grooves 31E-0 includes a plurality of grooves 31E-1 corresponding to the plurality of wiring portions 311E-1 and a groove 31E-2 corresponding to the wiring portion 311E-2. The groove 31E-2 is a first groove.

[0155] Each wiring portion 311E-1 is disposed in each groove 31E-1. Each wiring portion 311E-2 is disposed in each groove 31E-2. Therefore, the width W22E in the X direction of each groove 31E-2 is greater than the width W21E in the X direction of each groove 31E-1, i.e., the width W11E in the X direction of each wiring portion 311E-1. Furthermore, the depth D2E in the Y direction of each groove 31E-2 is greater than the depth D1E in the Y direction of each groove 31E-1, i.e., the thickness T1E in the Y direction of each wiring portion 311E-1.

[0156] The width W21E of each groove 31E-1 is preferably wider than the width W11E of each wiring portion 311E-1. That is, the width W21E of each groove 31E-1 is preferably wider than 1.0 times the width W11E of each wiring portion 311E-1. For example, the width W21E of each groove 31E-1 may be 1.1 times or more the width W11E of each wiring portion 311E-1, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W21E of each groove 31E-1 is preferably 20 times or less the width W11E of each wiring portion 311E-1.

[0157] The width W22E of the groove 31E-2 is preferably wider than the width W12E of the wiring portion 311E-2. That is, the width W22E of the groove 31E-2 is preferably wider than 1.0 times the width W12E of the wiring portion 311E-2. For example, the width W22E of the groove 31E-2 may be 1.1 times or more the width W12E of the wiring portion 311E-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W22E of the groove 31E-2 is preferably 20 times or less the width W12E of the wiring portion 311E-2.

[0158] The depth D1E of each groove 31E-1 is preferably greater than the thickness T1E of each wiring portion 311E-1. That is, the depth D1E of each groove 31E-1 is preferably greater than 1.0 times the thickness T1E of each wiring portion 311E-1. For example, the depth D1E of each groove 31E-1 may be 1.1 times or greater than the thickness T1E of each wiring portion 311E-1, or may be 1.5 times or greater, or may be 2 times or greater. Furthermore, the depth D1E of each groove 31E-1 is preferably 20 times or less the thickness T1E of each wiring portion 311E-1.

[0159] The depth D2E of the groove 31E-2 is preferably deeper than the thickness T2E of the wiring portion 311E-2. That is, the depth D2E of the groove 31E-2 is preferably deeper than 1.0 times the thickness T2E of the wiring portion 311E-2. For example, the depth D2E of the groove 31E-2 may be 1.1 times or more the thickness T2E of the wiring portion 311E-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the depth D2E of the groove 31E-2 is preferably 20 times or less the thickness T2E of the wiring portion 311E-2.

[0160] A plurality of grooves 32E-0 corresponding to the plurality of wiring portions 312E-0 are formed on the surface 3221E. The plurality of grooves 32E-0 are formed at intervals in the X direction. Each groove 32E-0 extends in the Z direction. The plurality of grooves 32E-0 includes a plurality of grooves 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove 32E-2 corresponding to the wiring portion 312E-2. The groove 32E-2 is a second groove.

[0161] Each wiring portion 312E-1 is disposed in each groove 32E-1. Each wiring portion 312E-2 is disposed in each groove 32E-2. Therefore, the width W24E of each groove 32E-2 in the X direction is greater than the width W23E of each groove 32E-1 in the X direction, i.e., the width W13E of each wiring portion 312E-1 in the X direction. Furthermore, the depth D4E of each groove 32E-2 in the Y direction is greater than the depth D3E of each groove 32E-1 in the Y direction, i.e., the thickness T3E of each wiring portion 312E-1 in the Y direction.

[0162] The width W23E of each groove 32E-1 is preferably wider than the width W13E of each wiring portion 312E-1. That is, the width W23E of each groove 32E-1 is preferably wider than 1.0 times the width W13E of each wiring portion 312E-1. For example, the width W23E of each groove 32E-1 may be 1.1 times or more the width W13E of each wiring portion 312E-1, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W23E of each groove 32E-1 is preferably 20 times or less the width W13E of each wiring portion 312E-1.

[0163] The width W24E of the groove 32E-2 is preferably wider than the width W14E of the wiring portion 312E-2. That is, the width W24E of the groove 32E-2 is preferably wider than 1.0 times the width W14E of the wiring portion 312E-2. For example, the width W24E of the groove 32E-2 may be 1.1 times or more the width W14E of the wiring portion 312E-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the width W24E of the groove 32E-2 is preferably 20 times or less the width W14E of the wiring portion 312E-2.

[0164] The depth D3E of each groove 32E-1 is preferably greater than the thickness T3E of each wiring portion 312E-1. That is, the depth D3E of each groove 32E-1 is preferably greater than 1.0 times the thickness T3E of each wiring portion 312E-1. For example, the depth D3E of each groove 32E-1 may be 1.1 times or greater, 1.5 times or greater, or even 2 times or greater, the thickness T3E of each wiring portion 312E-1. Furthermore, the depth D3E of each groove 32E-1 is preferably 20 times or less the thickness T3E of each wiring portion 312E-1.

[0165] The depth D4E of the groove 32E-2 is preferably deeper than the thickness T4E of the wiring portion 312E-2. That is, the depth D4E of the groove 32E-2 is preferably deeper than 1.0 times the thickness T4E of the wiring portion 312E-2. For example, the depth D4E of the groove 32E-2 may be 1.1 times or more the thickness T4E of the wiring portion 312E-2, or may be 1.5 times or more, or may be 2 times or more. Furthermore, the depth D4E of the groove 32E-2 is preferably 20 times or less the thickness T4E of the wiring portion 312E-2.

[0166] As such, when viewed in the Z direction, the area of wiring portion 311E-2 is larger than the area of wiring portion 311E-1, and the area of wiring portion 312E-2 is larger than the area of wiring portion 312E-1. By using wiring portions 311E-2 and 312E-2 as alignment marks, the alignment accuracy of intermediate connection member 300E with wiring board 221 shown in FIG. 9(c) is improved. Furthermore, because the area of wiring portions 311E-2 and 312E-2 is large when viewed in the Z direction, the self-alignment effect of intermediate connection member 300E with wiring board 221 is improved when wiring board 221 and intermediate connection member 300E are joined with solder.

[0167] In the sixth embodiment, a wiring portion 311E-2 having a width W12E and a thickness T2E and included in the plurality of wiring portions 311E-0 and a wiring portion 312E-2 having a width W14E and a thickness T4E and included in the plurality of wiring portions 312E-0 are misaligned in the X direction. That is, among the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0, the distance between the wiring portion 311E-2 and the wiring portion 312E-2 is longer than the distance between the other two wiring portions. This further improves the alignment accuracy of the intermediate connection member 300E with respect to the wiring board 221 in the manufacturing process of the imaging module in the sixth embodiment. Furthermore, when the wiring board 221 and the intermediate connection member 300E are joined with solder, the self-alignment effect of the intermediate connection member 300E with respect to the wiring board 221 is further improved. Furthermore, in the manufacturing process of intermediate connection member 300E, alignment precision is further improved when bonding an insulating substrate corresponding to insulating substrate portion 321E and an insulating substrate corresponding to insulating substrate portion 322E with an adhesive.

[0168] Although the case where the wiring portion 311E-2 and the wiring portion 312E-2 are used as alignment marks has been described, the present invention is not limited to this. For example, the wiring portion 312E-2 and the groove portion 32E-2 may be omitted, and the wiring portion 311E-2 may be used as the alignment mark. Also, the wiring portion group 312E, i.e., the plurality of wiring portions 312-E, may be omitted from the intermediate connection member 300E. In this case, too, the wiring portion 311E-2 may be used as the alignment mark.

[0169] Preferably, the width W12E of the wiring portion 311E-2 is wider than the width W11E of each wiring portion 311E-1, and the thickness T2E of the wiring portion 311E-2 is thicker than the thickness T1E of each wiring portion 311E-1, but this is not limitative. For example, if the width W12E of the wiring portion 311E-2 is wider than the width W11E of each wiring portion 311E-1, the thickness T2E of the wiring portion 311E-2 may be equal to or less than the thickness T1E of each wiring portion 311E-1. In this case, it is preferable that the width W22E of the groove portion 31E-2 is wider than the width W21E of each groove portion 31E-1, and the depth D2E of the groove portion 31E-2 is equal to or less than the depth D1E of each groove portion 31D-1. Similarly, when the thickness T2E of the wiring portion 311E-2 is thicker than the thickness T1E of each wiring portion 311E-1, the width W12E of the wiring portion 311E-2 may be equal to or smaller than the width W11E of each wiring portion 311E-1. In this case, it is preferable that the depth D2E of the groove portion 31E-2 is deeper than the depth D1E of each groove portion 31E-1, and the width W22E of the groove portion 31E-2 is equal to or smaller than the width W21E of each groove portion 31E-1. That is, the groove portion 31E-2 may be wider than each groove portion 31E-1, i.e., the width of each wiring portion 311E-1, and / or deeper than each groove portion 31E-1, i.e., the thickness of each groove portion 31E-1. Even in these cases, the wiring portion 311E-2 can be used as an alignment mark.

[0170] Similarly, it is preferable that the width W14E of the wiring portion 312E-2 is wider than the width W13E of each wiring portion 312E-1, and that the thickness T4E of the wiring portion 312E-2 is thicker than the thickness T3E of each wiring portion 312E-1, but this is not limitative. For example, if the width W14E of the wiring portion 312E-2 is wider than the width W13E of each wiring portion 312E-1, the thickness T4E of the wiring portion 312E-2 may be equal to or smaller than the thickness T3E of each wiring portion 312E-1. In this case, it is preferable that the width W24E of the groove portion 32E-2 is wider than the width W23E of each groove portion 32E-1, and that the depth D4E of the groove portion 32E-2 is equal to or smaller than the depth D3E of each groove portion 32E-1. Similarly, when the thickness T4E of the wiring portion 312E-2 is thicker than the thickness T3E of each wiring portion 312E-1, the width W14E of the wiring portion 312E-2 may be equal to or smaller than the width W13E of each wiring portion 312E-1. In this case, it is preferable that the depth D4E of the groove portion 32E-2 is greater than the depth D3E of each groove portion 32E-1, and the width W24E of the groove portion 32E-2 is equal to or smaller than the width W23E of each groove portion 32E-1. That is, the groove portion 32E-2 may be wider than each groove portion 32E-1, i.e., the width of each wiring portion 312E-1, and / or deeper than each groove portion 32E-1, i.e., the thickness of each groove portion 32E-1. Even in these cases, the wiring portion 312E-2 can be used as an alignment mark.

[0171] Although the case where the wiring portion group 311E, i.e., the plurality of wiring portions 311E-0, includes one wiring portion 311E-2 has been described, this is not limitative and the wiring portion group 311E may include two or more wiring portions 311E-2. In this case, it is preferable that, of the plurality of wiring portions 311E-0, each of the two wiring portions located at both ends in the X direction is the wiring portion 311E-2.

[0172] Similarly, although the case where the wiring portion group 312E, i.e., the plurality of wiring portions 312E-0, includes one wiring portion 312E-2 has been described, this is not limitative and the wiring portion group 312E may include two or more wiring portions 312E-2. In this case, it is preferable that, of the plurality of wiring portions 312E-0, each of the two wiring portions located at both ends in the X direction is the wiring portion 312E-2.

[0173] Furthermore, although the case where each of the plurality of wiring portions 311E-0 is a wire has been described, the present invention is not limited to this. Each of the plurality of wiring portions 311E-0 may be a conductor. Therefore, any or all of the plurality of wiring portions 311E-0 may be, for example, a conductor pattern.

[0174] Similarly, although the case where each of the plurality of wiring portions 312E-0 is a wire has been described, this is not limiting. Each of the plurality of wiring portions 312E-0 may be a conductor. Therefore, any or all of the plurality of wiring portions 312E-0 may be, for example, a conductor pattern.

[0175] 17(a) and 17(b) are explanatory diagrams of modified intermediate connection members 300E-1 and 300E-2. In the sixth embodiment, the wiring portions 311E-2 and 312E-2 are disposed in the grooves 31E-2 and 32E-2, respectively. However, this is not limiting. One or both of the wiring portions 311E-2 and 312E-2 in FIG. 16(a) may be omitted. In the modified example of FIGS. 17(a) and 17(b), both of the wiring portions 311E-2 and 312E-2 are omitted. The grooves 31E-2 and 32E-2 of the intermediate connection member 300E-1 shown in FIG. 17(a) are left empty, and the grooves 31E-2 and 32E-2 are used as alignment marks.

[0176] 17(b), insulators 324E and 325E are disposed in the grooves 31E-2 and 32E-2 of the intermediate connection member 300E-2. The insulators 324E and 325E are insulators (not shown) that are made of a different material or color from the insulating substrate portions 321E and 322E, and are used as alignment marks.

[0177] [Seventh embodiment] Next, an intermediate connection member of a seventh embodiment will be described. Fig. 18(a) is a perspective view of an intermediate connection member 300F according to the seventh embodiment. Note that the intermediate connection member 300F of the seventh embodiment has an insulating substrate portion 321F instead of the insulating substrate portion 321E, insulating substrate portion 322E, and insulating layer portion 323E of the intermediate connection member 300E of the sixth embodiment. The manufacturing method of the intermediate connection member 300F of the seventh embodiment is the same as the manufacturing method of the intermediate connection member 300E of the sixth embodiment, except that the step of bonding the insulating substrate portion 321E and the insulating substrate portion 322E is omitted.

[0178] Similar to the sixth embodiment, the intermediate connection member 300F includes a wiring portion group 311E and a wiring portion group 312E. The intermediate connection member 300F also includes an insulating substrate portion 321F. The insulating substrate portion 321F is a first insulating substrate portion. The insulating substrate portion 321F is made of the same material as the insulating substrate portions 321 and 322 described in the first embodiment, such as glass epoxy.

[0179] In the seventh embodiment, the wiring portion group 311E has, for example, seven wiring portions 311E-0 as the plurality of first wiring portions. Each wiring portion 311E-0 is made of a conductive material, for example, copper. The plurality of wiring portions 311E-0 includes at least one, for example, six wiring portions 311E-1 and at least one, for example, one wiring portion 311E-2. The wiring portion group 312E is arranged at an interval from the wiring portion group 311E in the Y direction. The wiring portion group 312E has, for example, seven wiring portions 312E-0 as the plurality of second wiring portions. The plurality of wiring portions 312E-0 includes at least one, for example, six wiring portions 312E-1 and at least one, for example, one wiring portion 312E-2.

[0180] In the manufacturing process of the imaging module according to the seventh embodiment, it is preferable to provide alignment marks on the intermediate connection member 300F in order to improve the alignment precision between the intermediate connection member 300F and the wiring board 221 shown in Fig. 9(c). By providing alignment marks on the intermediate connection member 300F, it is possible to position the wiring portion in the imaging module with high precision.

[0181] Therefore, in the seventh embodiment, wiring portion 311E-2 of the plurality of wiring portions 311E-0 and wiring portion 312E-2 of the plurality of wiring portions 312E-0 are used as alignment marks. Of the plurality of wiring portions 311E-0, the wiring portion located at the end in the X direction is wiring portion 311E-2. Of the plurality of wiring portions 312E-0, the wiring portion located at the end in the X direction is wiring portion 312E-2. The widths and thicknesses of each of wiring portions 311E-1, 311E-2, and each of wiring portions 312E-1 and 312E-2 are as described in the sixth embodiment.

[0182] Each of the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0 is formed of, for example, a wire. In the seventh embodiment, the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0 are arranged on the same insulating substrate portion 321F. The configuration of the insulating substrate portion 321F on which the wiring portions 311E-0 and 312E-0 are arranged will be specifically described below. FIG. 18(b) is an explanatory diagram of the insulating substrate portion 321F according to the seventh embodiment. FIG. 18(b) shows a plan view of the insulating substrate portion 321F as viewed in the Z direction. The insulating substrate portion 321F has a surface 3211F and a surface 3212F opposite to the surface 3211F in the Y direction.

[0183] The plurality of wiring portions 311E-0 are arranged on surface 3211F, and the plurality of wiring portions 312E-0 are arranged on surface 3212F. That is, the plurality of wiring portions 311E-0 are arranged on outer surface 3211F of insulating substrate portion 321F, and the plurality of wiring portions 312E-0 are arranged on outer surface 3212F of insulating substrate portion 321F. Note that an insulating layer (not shown) may be provided on each of surfaces 3211F and 3212F.

[0184] The surface 3211F is formed with a plurality of grooves 31E-0 corresponding to the plurality of wiring portions 311E-0, having the same configuration as in the sixth embodiment. The plurality of grooves 31E-0 are formed at intervals from one another in the X direction. Each groove 31E-0 extends in the Z direction. The plurality of grooves 31E-0 includes a plurality of grooves 31E-1 corresponding to the plurality of wiring portions 311E-1 and a groove 31E-2 corresponding to the wiring portion 311E-2. The groove 31E-2 is a first groove. Each groove 31E-1 is arranged in one of the grooves. A wiring portion 311E-2 is arranged in one of the grooves 31E-2.

[0185] The surface 3212F is formed with a plurality of grooves 32E-0 corresponding to the plurality of wiring portions 312E-0, having the same configuration as in the sixth embodiment. The plurality of grooves 32E-0 are formed at intervals in the X direction. Each groove 32E-0 extends in the Z direction. The plurality of grooves 32E-0 includes a plurality of grooves 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove 32E-2 corresponding to the wiring portion 312E-2. The groove 32E-2 is a second groove. Each groove 32E-1 is arranged in one of the grooves. A wiring portion 312E-2 is arranged in one of the grooves 32E-2.

[0186] In the seventh embodiment, the widths and depths of the grooves 31E-1, 31E-2, 32E-1, and 32E-2 are the same as those described in the sixth embodiment.

[0187] As such, when viewed in the Z direction, the area of wiring portion 311E-2 is larger than the area of wiring portion 311E-1, and the area of wiring portion 312E-2 is larger than the area of wiring portion 312E-1. By using wiring portions 311E-2 and 312E-2 as alignment marks, the alignment accuracy of intermediate connection member 300F with wiring board 221 shown in FIG. 9(c) is improved. Furthermore, because the area of wiring portions 311E-2 and 312E-2 is large when viewed in the Z direction, the self-alignment effect of intermediate connection member 300F with wiring board 221 is improved when wiring board 221 and intermediate connection member 300F are joined with solder.

[0188] In the seventh embodiment, wiring portion 311E-2 included in the plurality of wiring portions 311E-0 and wiring portion 312E-2 included in the plurality of wiring portions 312E-0 are misaligned in the X direction. That is, among the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0, the distance between wiring portion 311E-2 and wiring portion 312E-2 is longer than the distance between the other two wiring portions. This further improves the alignment accuracy of intermediate connection member 300F with respect to wiring board 221 in the manufacturing process of the imaging module in the seventh embodiment.

[0189] In the seventh embodiment, modifications similar to those of the sixth embodiment are possible.

[0190] [Eighth embodiment] Next, an intermediate connecting member according to an eighth embodiment will be described. Fig. 19 is a perspective view of an intermediate connecting member 300G according to the eighth embodiment.

[0191] Intermediate connection member 300G includes wiring portion group 311G and wiring portion group 312G. Intermediate connection member 300G also includes insulating substrate portion 321G, which is a first insulating substrate portion. Insulating substrate portion 321G is made of the same material as insulating substrate portions 321 and 322 described in the first embodiment, such as glass epoxy.

[0192] In the eighth embodiment, the wiring portion group 311G has, for example, seven wiring portions 311G-0 as the plurality of first wiring portions. Each wiring portion 311G-0 is made of a conductive material, for example, copper. The plurality of wiring portions 311G-0 includes at least one, for example, six wiring portions 311G-1 and at least one, for example, one wiring portion 311G-2. The wiring portion group 312G is arranged at an interval from the wiring portion group 311G in the Y direction. The wiring portion group 312G has, for example, seven wiring portions 312G-0 as the plurality of second wiring portions. The plurality of wiring portions 312G-0 includes at least one, for example, six wiring portions 312G-1 and at least one, for example, one wiring portion 312G-2.

[0193] In the manufacturing process of the imaging module of the eighth embodiment, it is preferable to provide alignment marks on intermediate connection member 300G in order to improve the alignment precision between intermediate connection member 300G and wiring board 221 shown in Fig. 9(c). By providing alignment marks on intermediate connection member 300G, it is possible to position wiring portions in the imaging module with high precision.

[0194] Therefore, in the eighth embodiment, the wiring portion 311G-2 of the plurality of wiring portions 311G-0 and the wiring portion 312G-2 of the plurality of wiring portions 312G-0 are used as alignment marks. Of the plurality of wiring portions 311G-0, the wiring portion located at the end in the X direction is the wiring portion 311G-2. Of the plurality of wiring portions 312G-0, the wiring portion located at the end in the X direction is the wiring portion 312G-2. The widths and thicknesses of the wiring portions 311G-1, 311G-2, and each of the wiring portions 312G-1 and 312G-2 are as described in the sixth embodiment.

[0195] Each of the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0 is configured by, for example, a conductor pattern. In the eighth embodiment, the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0 are arranged on the same insulating substrate portion 321G.

[0196] The insulating substrate portion 321G has a surface 3211G and a surface 3212G opposite to the surface 3211G in the Y direction. The plurality of wiring portions 311G-0 are arranged on the surface 3211G, and the plurality of wiring portions 312G-0 are arranged on the surface 3212G. That is, the plurality of wiring portions 311G-0 are arranged on the surface 3211G on the outer side of the insulating substrate portion 321G, and the plurality of wiring portions 312G-0 are arranged on the surface 3212G on the outer side of the insulating substrate portion 321G. Note that an insulating layer (not shown) may be provided on each of the surfaces 3211G and 3212G.

[0197] As such, when viewed in the Z direction, the area of wiring portion 311G-2 is larger than the area of wiring portion 311G-1, and the area of wiring portion 312G-2 is larger than the area of wiring portion 312G-1. By using wiring portions 311G-2 and 312G-2 as alignment marks, the alignment accuracy of intermediate connection member 300G with wiring board 221 shown in FIG. 9(c) is improved. Furthermore, because the area of wiring portions 311G-2 and 312G-2 is large when viewed in the Z direction, the self-alignment effect of intermediate connection member 300G with wiring board 221 is improved when wiring board 221 and intermediate connection member 300G are joined with solder.

[0198] In the eighth embodiment, a wiring portion 311G-2 included in the plurality of wiring portions 311G-0 and a wiring portion 312G-2 included in the plurality of wiring portions 312G-0 are misaligned in the X direction. That is, among the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0, the distance between wiring portion 311G-2 and wiring portion 312G-2 is longer than the distance between the other two wiring portions. This further improves the alignment accuracy of intermediate connection member 300G with respect to wiring board 221 in the manufacturing process of the imaging module in the eighth embodiment.

[0199] In the eighth embodiment, the wiring portion 311G-2 and the wiring portion 312G-2 are used as alignment marks, but this is not limiting. For example, the wiring portion 312G-2 may be omitted and the wiring portion 311G-2 may be used as the alignment mark. Alternatively, the wiring portion group 312G, i.e., the plurality of wiring portions 312G-0, may be omitted from the intermediate connection member 300G. In this case, too, the wiring portion 311G-2 may be used as the alignment mark.

[0200] Furthermore, the width and / or thickness of each of the wiring portions 311G-2 and 312G-2 in the eighth embodiment can be modified in the same manner as the width and / or thickness of each of the wiring portions 311D-2 and 312D-2 in the fifth embodiment.

[0201] Although the case where the wiring portion group 311G, i.e., the plurality of wiring portions 311G-0, includes one wiring portion 311G-2 has been described, this is not limitative and the wiring portion group 311G may include two or more wiring portions 311G-2. In this case, it is preferable that, of the plurality of wiring portions 311G-0, each of the two wiring portions located at both ends in the X direction is the wiring portion 311G-2.

[0202] Similarly, although the case where the wiring portion group 312G, i.e., the plurality of wiring portions 312G-0, includes one wiring portion 312G-2 has been described, this is not limitative and the wiring portion group 312G may include two or more wiring portions 312G-2. In this case, it is preferable that, of the plurality of wiring portions 312G-0, each of the two wiring portions located at both ends in the X direction is the wiring portion 312G-2.

[0203] 20(a) and 20(b) are explanatory diagrams of modified intermediate connection members 300G-1 and 300G-2. First, the modified intermediate connection member 300G-1 shown in FIG. 20(a) will be described. The intermediate connection member 300G-1 has an insulating substrate portion 321G-1, a plurality of wiring portions 311G-1, and a plurality of wiring portions 312G-1. The insulating substrate portion 321G-1 has a surface 3211G-1 including a groove portion 31G-2 and a surface 3212G-1 including a groove portion 32G-2. The surface 3212G-1 is the surface opposite the surface 3211G-1 in the Y direction. The groove portion 31G-2 is a first groove portion, and the groove portion 32G-2 is a second groove portion.

[0204] The groove 31G-2 is preferably wider than the width W11G of each wiring portion 311G-1 and / or deeper than the thickness T1G of each wiring portion 311G-1. In the modified intermediate connection member 300G-1 shown in Figure 20(a), the width W22G of the groove 31G-2 in the X direction is wider than the width W11G of the wiring portion 311G-1 in the X direction. Furthermore, the depth D2G of the groove 31G-2 in the Y direction is deeper than the thickness T1G of the wiring portion 311G-1 in the Y direction.

[0205] The groove 32G-2 is preferably wider than the width W13G of each wiring portion 312G-1 and / or deeper than the thickness T3G of each wiring portion 312G-1. In the modified intermediate connection member 300G-1 shown in Figure 20(a), the width W24G of the groove 32G-2 in the X direction is wider than the width W13G of the wiring portion 312G-1 in the X direction. Furthermore, the depth D4G of the groove 32G-2 in the Y direction is deeper than the thickness T3G of the wiring portion 312G-1 in the Y direction.

[0206] With the above configuration, grooves 31G-2 and 32G-2 are used as alignment marks, thereby improving the alignment accuracy of intermediate connection member 300G-1 with wiring board 221 shown in FIG. 9(c).

[0207] The groove 31G-2 and the groove 32G-2 are preferably offset in the X direction. The groove 32G-2 may be omitted from the intermediate connection member 300G-1. The insulating substrate portion 321G-1 may have multiple grooves 31G-2 or multiple grooves 32G-2.

[0208] A modified intermediate connection member 300G-2 shown in FIG. 20(b) will now be described. Like the intermediate connection member 300G-1, the intermediate connection member 300G-2 has an insulating substrate portion 321G-1, a plurality of wiring portions 311G-1, and a plurality of wiring portions 312G-1. Insulators 324G and 325G are disposed in the grooves 31G-2 and 32G-2 of the intermediate connection member 300G-2 shown in FIG. 20(b). The insulators 324G and 325G are insulators (not shown) made of a different material or color from the insulating substrate portion 321G-1, and the insulators 324G and 325G are used as alignment marks.

[0209] With the above configuration, by using each of insulators 324G and 325G as alignment marks, the alignment precision of intermediate connection member 300G-2 with wiring board 221 shown in FIG. 9(c) is improved.

[0210] The groove 31G-2 and the groove 32G-2 are preferably offset in the X direction. The groove 32G-2 and the insulator 325G can be omitted from the intermediate connection member 300G-2. The insulating substrate portion 321G-1 may have multiple grooves 31G-2 or multiple grooves 32G-2.

[0211] The present invention is not limited to the above-described embodiments and many modifications are possible within the technical spirit of the present invention. For example, multiple embodiments can be combined. Furthermore, some features of at least one embodiment can be omitted or replaced. Furthermore, new features can be added to at least one embodiment. For example, in the sixth to eighth embodiments, at least a portion of the multiple wiring portions 312, excluding both end faces in the Z direction, may be covered with an insulating film, such as a solder resist film, provided on the insulating substrate portion 321. The insulating film can prevent short circuits and corrosion of the multiple wiring portions 312. Furthermore, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. The disclosure of this specification includes not only what is explicitly described herein but also all matters that can be understood from this specification and the accompanying drawings. The disclosure of this specification also includes complements of individual concepts described herein. In other words, if this specification states, for example, that "A is B," it can be said that this specification discloses "A is not B," even if the statement "A is not B" is omitted. This is because when it is stated that "A is B," it is assumed that the case where "A is not B" is also taken into consideration.

[0212] In the above-described embodiment, the electronic component is an image sensor or a memory element, but the present invention is not limited to this. For example, the electronic component may be a semiconductor device for image processing or a power supply IC. For example, the electronic component may be a semiconductor device for communications or a control IC. Furthermore, the present invention is not limited to this. For example, the electronic module may be an imaging module.

[0213] Furthermore, while the electronic device has been described as a digital camera, the present invention is not limited to this. For example, the electronic device may be a mobile communication device. For example, the electronic device may be an information device such as a smartphone or a personal computer, or a communication device such as a modem or a router. Alternatively, the electronic device may be office equipment such as a printer or a copier, medical equipment such as a radiographic device, a magnetic imaging device, an ultrasound imaging device, or an endoscope, industrial equipment such as a robot or a semiconductor manufacturing device, or transportation equipment such as a vehicle, an airplane, or a ship. When wiring is required in the limited space within the housing of an electronic device, using the intermediate connection member 300 enables the electronic device to be miniaturized and highly dense. The electronic module of the present invention is applicable to any electronic device. [Explanation of symbols]

[0214] 100...digital camera (electronic device), 200...imaging module (electronic module), 201...circuit unit (first circuit unit), 202...circuit unit (second circuit unit), 300...intermediate connecting member, 311...wiring section (first wiring section), 312...wiring section (second wiring section), 321...insulating substrate section (first insulating substrate section), 322...insulating substrate section (second insulating substrate section), 323...insulating layer section, 601...insulating substrate (first insulating substrate), 602...insulating substrate (second insulating substrate), 621...groove (first groove), 622...groove (second groove), 701...conductive member (first conductive member), 702...conductive member (second conductive member)

Claims

1. An intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, a plurality of first wiring portions arranged at intervals in a second direction intersecting the first direction; each of the plurality of first wiring portions is disposed to extend in the first direction such that both end faces in the first direction are exposed to the outside; At least one of the plurality of first wiring portions has a first width, and at least one of the plurality of first wiring portions has a second width that is wider than the first width. An intermediate connecting member characterized by:

2. further comprising a plurality of second wiring portions arranged at intervals in the second direction; the second wiring portions are arranged at intervals from the first wiring portions in a third direction intersecting the first direction and the second direction, each of the plurality of second wiring portions is disposed to extend in the first direction such that both end faces in the first direction are exposed to the outside; At least one of the plurality of second wiring portions has a third width, and at least one of the plurality of second wiring portions has a fourth width that is wider than the third width.

2. The intermediate connector according to claim 1.

3. a first wiring portion having the second width included in the plurality of first wiring portions and a second wiring portion having the fourth width included in the plurality of second wiring portions are shifted in the second direction; 3. The intermediate connector according to claim 2.

4. An intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, a plurality of first wiring portions arranged at intervals in a second direction intersecting the first direction; each of the plurality of first wiring portions is disposed to extend in the first direction such that both end faces in the first direction are exposed to the outside; At least one of the plurality of first wiring portions has a first thickness, and at least one of the plurality of first wiring portions has a second thickness that is thicker than the first thickness. An intermediate connecting member characterized by:

5. further comprising a plurality of second wiring portions arranged at intervals in the second direction; the second wiring portions are arranged at intervals from the first wiring portions in a third direction intersecting the first direction and the second direction, each of the plurality of second wiring portions is disposed to extend in the first direction such that both end faces in the first direction are exposed to the outside; At least one of the plurality of second wiring portions has a third thickness, and at least one of the plurality of second wiring portions has a fourth thickness that is thicker than the third thickness.

5. The intermediate connector according to claim 4.

6. a first wiring portion having the second thickness included in the plurality of first wiring portions and a second wiring portion having the fourth thickness included in the plurality of second wiring portions being misaligned in the second direction; 6. The intermediate connector according to claim 5.

7. a first insulating substrate portion; a second insulating substrate portion; the plurality of first wiring portions are disposed on the first insulating substrate portion; the plurality of second wiring portions are disposed on the second insulating substrate portion; 6. An intermediate connector according to claim 2 or 5.

8. An intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, a first insulating substrate portion; a plurality of first wiring portions arranged on the first insulating substrate portion at intervals in a second direction intersecting the first direction; each of the plurality of first wiring portions is disposed to extend in the first direction such that both end faces in the first direction are exposed to the outside; the first insulating substrate portion includes a first groove portion that is wider than a width of one of the plurality of first wiring portions and / or that is deeper than a thickness of one of the plurality of first wiring portions; An intermediate connecting member characterized by:

9. a plurality of second wiring portions disposed on the first insulating substrate portion at intervals in the second direction; the second wiring portions are arranged at intervals from the first wiring portions in a third direction intersecting the first direction and the second direction, each of the plurality of second wiring portions is disposed to extend in the first direction such that both end faces in the first direction are exposed to the outside; the first insulating substrate portion includes a second groove portion that is wider than a width of one of the plurality of second wiring portions and / or that is deeper than a thickness of one of the plurality of second wiring portions; 9. The intermediate connector according to claim 8.

10. a second insulating substrate portion; a plurality of second wiring portions disposed on the second insulating substrate portion at intervals in the second direction; the second wiring portions are arranged at intervals from the first wiring portions in a third direction intersecting the first direction and the second direction, each of the plurality of second wiring portions is disposed to extend in the first direction such that both end faces in the first direction are exposed to the outside; the second insulating substrate portion includes a second groove portion that is wider than a width of one of the plurality of second wiring portions and / or that is deeper than a thickness of one of the plurality of second wiring portions; 9. The intermediate connector according to claim 8.

11. An intermediate connector according to any one of claims 1 to 10 is prepared, The intermediate connection member and the first circuit unit are joined by soldering; the intermediate connection member and the second circuit unit are joined by soldering; A method for manufacturing an electronic module, comprising:

12. the first circuit unit having a first electronic component; the second circuit unit having a second electronic component arranged opposite to the first circuit unit; an intermediate connection member according to claim 1 , which electrically connects the first circuit unit and the second circuit unit; 1. An electronic module comprising:

13. the intermediate connection member and the first circuit unit are joined by solder; and / or The intermediate connection member and the second circuit unit are joined by soldering.

13. The electronic module of claim 12.

14. the first circuit unit includes a first wiring board on which the first electronic component is mounted, The second circuit unit includes a second wiring board on which the second electronic component is mounted.

14. Electronic module according to claim 12 or 13.

15. the intermediate connection member is located between the first electronic component and the second circuit unit; the second electronic component is located between the second wiring board and the first wiring board; and / or the second electronic component is located between the first electronic component and the second wiring board; 15. The electronic module of claim 14.

16. the first circuit unit and the second circuit unit are mechanically connected to each other outside the plurality of first wiring portions of the intermediate connection member; 16. Electronic module according to any one of claims 12 to 15.

17. the intermediate connector includes a glass epoxy portion; 17. Electronic module according to any one of claims 12 to 16.

18. the first electronic component is an image sensor, a memory element, a semiconductor device for image processing, a power supply IC, a semiconductor device for communication, or a control IC; and / or the second electronic component is an image sensor, a memory element, a semiconductor device for image processing, a power supply IC, a semiconductor device for communication, or a control IC; 18. Electronic module according to any one of claims 12 to 17.

19. the first electronic component is an image sensor; and / or The second electronic component is a memory element.

18. Electronic module according to any one of claims 12 to 17.

20. The housing and and an electronic module according to any one of claims 12 to 19 provided inside the housing. An electronic device characterized by:

Images