Electrode, junction method for electrode and lead wire, junction structure foe electrode and lead wire, and heater chip

Abstract

To provide an electrode capable of obtaining a desired junction strength with a lead wire by heating junction of a heater chip, a junction method for an electrode and a lead wire, a junction structure for an electrode and a lead wire, and a heater chip.SOLUTION: An electrode is a block-shaped electrode protruding upward from a surface of a substrate. The electrode may also comprise a receiving recess in which a lead wire can be accommodated. A depth of the receiving recess is shallow in such a manner that an outer peripheral surface of the accommodated lead wire protrudes outside of the surface of the substrate or deep in such a manner that the outer peripheral surface is accommodated within the receiving recess. A junction method for an electrode and a lead wire is a method of heating junction for pressurizing / heating the electrode prior to the lead wire and pressurizing / heating both the lead wire and the electrode by a heater chip while heating the lead wire with heat of the heated electrode. In such a case, the junction method is a method for crimping or caulking the outer peripheral surface of the lead wire while making the electrode, which is softened with heat during the heating junction by the heater chip, closer to the side of the lead wire.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electrodes for printed circuit boards, ferrite core alumina substrates, lead frames, etc., a method for joining electrodes and conductors, a joining structure for electrodes and conductors, and a heater chip. [Background technology]

[0002] The heater chip exothermic bonding method is used when electrically bonding conductors and terminals (hereinafter referred to as "conductors") drawn from electronic components or external circuits to the joints (hereinafter referred to as "electrodes") of electrical circuits, terminals, electrodes, etc. on printed circuit boards, ferrite core alumina substrates, lead frames, etc. (hereinafter referred to as "substrates").The heater chip exothermic bonding method heats and bonds the conductors and electrodes with a heater chip, and includes solder bonding and diffusion bonding.

[0003] Heater tips come in a variety of shapes and structures. They are generally formed into a plate shape as shown in Figure 8, using a high-melting-point metal such as tungsten or molybdenum as the base material. The heater tip A in Figure 8 has a soldering iron part (heating part) C below (on the bottom surface of) a bifurcated connecting part B. The connecting part B is fixed to the heater head G with a fastener J, and moves up and down as the heater head G moves up and down (Patent Documents 1 to 3).

[0004] As shown in Figure 8, an example of thermal bonding using a heater chip A is to place a conductive wire F on an electrode E branching from a substrate D, then lower the heater chip A with a heater head G to bring the heating part C of the heater chip A into contact with the conductive wire F. The weight of the heater chip A or the heater head G presses the heater chip A to press the heating part C against the conductive wire F, while electricity is passed through the heater chip A to generate resistance heat in the heating part C. Heat from the heating part C is supplied from the conductive wire F to the bonding surface of the electrode E. For good heat transfer, the conductive wire F needs to be in close contact with the electrode E. The pressure is applied to achieve this. This pressure and heat instantly thermocompression bonds the electrode E and the conductive wire F. In Figure 8, H is a temperature sensor (e.g., a thermocouple), and I is a lead wire.

[0005] In heat bonding using a heater chip, the current stops after a predetermined time (current time) has passed since the current started to flow, and after a predetermined time (cooling time) has passed since the current stopped, the heater head G pulls up (returns) the heater chip A and separates the heated part C from the conductor F. During the cooling time, the heated part C drops to a predetermined temperature. This pressurized and heated (thermocompression bonding) process is repeated at regular intervals.

[0006] In the case of diffusion bonding, the conductor F is typically 1 mm or less in diameter (usually around 30 μm), the electrode E is flat and 1 mm or less in thickness (usually around 30 to 40 μm), the heating time is around 200 μsec, and the heat generation temperature is around 7500°C. In the case of solder bonding, if the diameter of the conductor F, the thickness of the electrode E, and the heating time are the same as above, the heat generation temperature is around 450°C. In the case of flat cables, the conductor wires may be round or rectangular.

[0007] In diffusion bonding, the heat of the conductor F heated by the heating part C is transferred to the electrode E, but the heat is absorbed by the electrode E (thermal diffusion), making it difficult to raise the temperature, resulting in an insufficient bond and weak bond strength. If the electrode E is thick, its thermal conductivity will be greater than that of a flat electrode, making it easier for the heat of the conductor F to diffuse through the electrode E, making it difficult to obtain the required bond strength.

[0008] To ensure the required bonding strength, the thickness of electrode E can be reduced to make heat diffusion more difficult, or the heating temperature can be increased, the heating time can be extended, or the pressure can be increased. However, there is a limit to how thin electrode E can be. Increasing the heating temperature increases power consumption. Extending the heating time not only increases power consumption, but also lengthens the working time and reduces work efficiency. When the heat from heating part C of heater chip A is transferred to conductor F and softens it, excessive pressure is applied, causing conductor F to collapse and form corners, reducing the tensile strength of conductor F and its mechanical strength. Adjusting the pressure is particularly difficult when the wire diameter of conductor F is 100 μm or less. Furthermore, the heater chip oxidizes significantly, compromising its durability. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Patent No. 3917964 [Patent Document 2] Patent No. 5794577 [Patent Document 3] Patent No. 6148800 Summary of the Invention [Problem to be solved by the invention]

[0010] The object of the present invention is to provide an electrode that, when thermally bonding a conductor to an electrode using a heater chip, is less likely to flatten the conductor and form corners, thereby achieving a desired bonding strength. It is also to provide a method for thermally bonding the electrode and conductor using a heater chip, a bonding structure for an electrode and conductor thermally bonded using a heater chip, and a heater chip suitable for thermal bonding. [Means for solving the problem]

[0011] The electrode of the present invention is a block-shaped electrode that protrudes in the thickness direction (upward) of the substrate from the surface of the substrate and has a thickness greater than the diameter of the conductor wire to be thermally joined. The block-shaped electrode may have a receiving recess that can accommodate the conductor wire. Multiple rows of receiving recesses can be provided on one electrode. The receiving recesses are grooves that can accommodate the conductor wire, holes into which the conductor wire can be inserted, etc.

[0012] One method of joining an electrode and a conductor of the present invention is to place a conductor on a block-shaped electrode with a flat upper surface, and then heat and pressurize the conductor and electrode with the heating part of a heater chip to exothermally bond them. In this case, the heating part of the heater chip can pressurize and heat the electrode before the conductor, and then heat and pressurize both the conductor and electrode with the heating part while heating the conductor with the heat of the heated electrode, or the heating part of the heater chip can pressurize and heat the conductor before the electrode, and then heat and pressurize the conductor and electrode with the heating part of the heater chip while heating the electrode with the heat of the heated conductor, to exothermally bond them.

[0013] Another method of joining electrodes and conductors according to the present invention involves placing a conductor in a block-shaped electrode with a receiving recess on its upper surface, and then applying pressure and heat to the conductor and electrode using the heating element of a heater chip to exothermally bond them. In this case, too, the electrode can be heated before the conductor, and the conductor and electrode can be heated and pressurized with the heating element of the heater chip while the conductor is heated by the heat of the heated electrode, or the conductor can be heated and pressurized with the heating element of the heater chip before the electrode, and the conductor and electrode can be heated and pressurized with the heating element of the heater chip while the electrode is heated by the heat of the heated conductor. Conductors wired into multiple rows of receiving recesses can also be exothermally bonded simultaneously using a single electrode. In either case, the outer periphery of the conductor can be crimped or crimped by the electrode softened by the application of pressure and heat.

[0014] The electrode and conductor joining structure of the present invention is a structure in which the conductor placed on a block-shaped electrode and the electrode are heated and pressurized with a heater tip to form a thermally joined conductor, and the conductor is then crimped from the outside with the electrode softened during the thermal joining, or a structure in which the softened electrode is placed over the conductor and crimped.

[0015] The heater chip of the present invention includes a heating portion. The heating portion is recessed so that it can be placed over the electrode over a conductor placed on top of it or placed on top of the electrode. There may be two or more recessed heating portions. The recessed heating portion is deeper than the diameter of the conductor, so that when placed over the electrode over the conductor, it contacts the electrode before the conductor and heats the electrode before the conductor. Furthermore, as the heater chip descends, it contacts both the electrode and the conductor, pressurizing and heating them to heat and bond them together, allowing the electrode softened by the pressure and heat to crimp or swage the conductor. The recessed shape of the heating portion has an end face shape, such as a downward-opening rectangular, inverted V-shape, trapezoidal, or arc-shaped, inverted V-shape. [Effects of the Invention]

[0016] The electrode of the present invention has the following effects. 1. A block-shaped electrode, which is thicker than the diameter of the conductor, is heated and softened with a heater tip before the conductor, and the electrode is then moved toward the conductor by applying pressure with the heater tip, allowing the conductor to be crimped or swaged, resulting in a stronger bond than conventional heat-generating bonding. 2. If there is a receiving recess on the top surface of the block-shaped electrode, the conductor can be placed inside the receiving recess and pressurized and heated with the heater tip. This makes it difficult for the conductor inside the receiving recess to be flattened due to stress concentration and makes it difficult for corners to form, so the tensile strength of the conductor is not impaired and there is no decrease in mechanical strength.

[0017] The method for joining an electrode and a conductor wire according to the present invention has the following advantages. 1.The heater tip applies pressure and heat to the electrode before the conductor wire, and the conductor wire is heated by the heat from the heated electrode while being pressurized and heated, so sufficient joint strength can be obtained without applying excessive pressure or heat to the conductor wire.This makes it less likely for the conductor wire to be crushed or to develop corners due to stress concentration, and the mechanical strength of the joint is not compromised. 2. The electrodes are softened by heating and can be used to crimp or tighten the conductor from the outside, resulting in a strong exothermic joint. 3. If the conductor is placed in the recessed receiving portion of the block-shaped electrode and pressurized and heated with a heater tip, the bottom or entire circumference of the conductor placed in the recessed receiving portion will be less likely to be flattened due to stress concentration, and corners will be less likely to form, so the tensile strength of the conductor will not be compromised and it will be possible to heat-bond it without reducing its mechanical strength.

[0018] The electrode-conductor bonding structure of the present invention has the following effects. 1. When the conductor is externally crimped with an electrode, a joint strength greater than that of ordinary heat-generating joints is ensured. 2. When the conductor is crimped with an electrode, the joining strength is not only improved compared to normal heat joining, but also stronger than when the conductor is simply crimped from the outside with an electrode.

[0019] The heater chip of the present invention has the following effects. Because the heating part is recessed to a width and depth that allows it to straddle the conductor, it is possible to heat the electrode by bringing the heating part into contact with the electrode before the conductor, and the conductor and electrode can be pressurized and heated by the heating part while the conductor is heated by the heat of the heated electrode, so exothermic bonding can be achieved without applying excessive pressure to the conductor.This means that exothermic bonding can be achieved without the conductor being flattened by stress concentration. [Brief explanation of the drawings]

[0020] [Figure 1] (a) is a perspective view of an example of an electrode of the present invention, (b) is a perspective view of an example of an electrode having a receiving recess on the upper surface, and (c) is a perspective view of an example of an electrode having two parallel receiving recesses on the upper surface. [Figure 2] (a) is an end view of the case where the conductor and electrode are exothermically joined using a heating part that is recessed in a trapezoidal shape on the heater chip, (b) is an explanatory diagram of the end view of the case where the conductor is exothermically joined using a heating part that is recessed in an inverted V shape, (c) is an end view of the case where the conductor is joined by crimping using an electrode, (d) is an explanatory diagram of the width of the heating part that is recessed in a trapezoidal shape on the heater chip, and (e) is an explanatory diagram of the width of the heating part that is recessed in an inverted V shape on the heater chip. [Figure 3] A conducting wire placed in a receiving recess of an electrode is exothermically bonded to the electrode by the flat heating part of the heater chip. (a) is an end view before the heater chip is lowered, and (b) is an end view when the heater chip is lowered and exothermically bonded. [Figure 4] (a) is an end view of a case where a conductor placed in a receiving recess of an electrode is exothermically joined by a flat heating part of a heater chip, and (b) is an end view of a case where a conductor placed in a receiving recess of an electrode is exothermically joined by a heating part that is recessed in an arc shape of a heater chip. [Figure 5] This is the case where a conductor placed in a receiving recess of an electrode is thermally bonded. (a) is an end view before the heater tip is lowered, and (b) is an end view after thermal bonding. [Figure 6] (a) is an explanatory diagram of a method for thermally joining conductors housed in two receiving recesses, and (b) is an end view of a joining structure joined using the joining method of (a). [Figure 7](a) is an explanatory diagram of an electrode in which the receiving recess is a horizontal hole, and (b) is an end view of when a conducting wire is inserted into the horizontal hole in (a) and thermally joined with a heater tip. [Figure 8] FIG. 10 is an explanatory diagram of conventional heater chip heat-generating bonding. DETAILED DESCRIPTION OF THE INVENTION

[0021] (Electrode embodiment) An embodiment of the electrode of the present invention will be described below with reference to the drawings.

[0022] (Electrode embodiment 1) Electrode 1 in Figure 1(a) protrudes in a block shape from surface 3 of substrate 2, and the upper surface 1a of electrode 1 is flat. Substrate 2 is a general-purpose printed circuit board, a ferrite core alumina substrate, a lead frame, etc., and has a foil film made of copper alloy, iron-nickel alloy, or other conductive material on surface 3. Electrode 1 is formed by etching the foil film on surface 3 of substrate 2 or by other processes.

[0023] The electrode 1 of the present invention may have a shape other than a square, such as a circle or an oval. The thickness and width of the electrode 1 can be set arbitrarily, but the thickness is set to be thicker than the diameter of the conductor wire 4 (FIG. 2(a)) to be joined, and the width is set to be wider than the diameter of the conductor wire 4. As an example, when the diameter of the conductor wire 4 is 30 μm, the thickness and width are preferably both about 100 μm, and more preferably about 60 μm thick and about 70 to 90 μm wide. Flat cable conductor wires include round wires and rectangular wires. The present invention can be used to join both round and rectangular wires.

[0024] The conductor 4 is similar to the conventional conductor F (FIG. 8), and is, for example, a copper or aluminum wire drawn from an electrical component or an external circuit (neither of which are shown). The wire diameter is about 30 μm, and the material is copper or aluminum, and it may be either a coated wire or a bare wire.

[0025] (Electrode embodiment 2) The electrode 1 in Fig. 1(b) protrudes upward from the surface 3 of the substrate 2 in the shape of a rectangular block, and has a receiving recess 5 formed in its upper surface 1a. The receiving recess 5 is a long, narrow groove extending in the longitudinal direction of the electrode 1 (the axial direction of the conductor 4 to be placed), and has a roughly U-shaped cross section that opens to the upper surface 1a. The depth of the receiving recess 5 can be half (including roughly half) the wire diameter of the conductor 4, as shown in Fig. 3(a), or it can be approximately the same as the wire diameter of the conductor 4 or slightly deeper than the wire diameter, as shown in Fig. 5(a).

[0026] (Electrode embodiment 3) The electrode 1 in FIG. 1(c) protrudes upward from the surface 3 of the substrate 2 in the shape of a rectangular block, and two parallel receiving recesses 5 are formed on the top surface 1a. The two receiving recesses 5 have the same shape and the same depth (including approximately the same). Both are elongated grooves extending in the longitudinal direction of the electrode 1 (the axial direction of the conductor 4 to be placed), and have a roughly U-shaped cross section that opens to the top surface 1a. The two receiving recesses 5 may have different shapes or depths. They may not be oriented parallel to one another, and some receiving recesses 5 may be slightly oblique to the other receiving recesses 5, or may be oriented in some other way.

[0027] (Electrode Embodiment 4) The electrode 1 in Figure 3(a), like the electrode in Figure 1(b), has a receiving recess 5 that is semicircular, has a width that can accommodate a conductor 4 with a wire diameter of approximately 30 μm, and is deep enough to accommodate the lower half (including approximately the lower half) of the conductor 4, with the upper half being shallower so that it protrudes above the upper surface 1a of the electrode 1.

[0028] (Electrode embodiment 5) The number of receiving recesses 5 provided on one electrode 1 can be any number, for example, three or more, that matches the number of conductive wires 4 to be thermally joined. In this case, all of the receiving recesses 5 may have the same shape and size, or may have different shapes and sizes. Furthermore, they do not all need to be oriented parallel to one another, and some of the receiving recesses 5 may be slightly oblique to the other receiving recesses 5, or may be oriented in some other way.

[0029] (Electrode Embodiment 6) In the electrode 1 of FIG. 4(a), the end face of the receiving recess 5 is V-shaped, and the depth of the receiving recess 5 is shallower than the diameter of the conducting wire 4 (approximately half the diameter).

[0030] (Electrode Embodiment 7) The electrode 1 in Figure 5(a) has a receiving recess 5 whose end face is roughly U-shaped, and whose depth is greater than the diameter of the conductor 4 so that the entire circumference of the conductor 4 fits within the receiving recess 5.

[0031] (Electrode Embodiment 8) The electrode 1 in Figure 6(a) has two receiving recesses 5 arranged in parallel on one electrode 1, with the end face of the receiving recesses 5 being roughly U-shaped and the depth of the receiving recess 5 being greater than the diameter of the conductor 4 so as to accommodate the entire circumference of the conductor 4. Furthermore, an insertion recess 1b is provided between the two receiving recesses 5 so that the convex heating portion 7d of the heater chip 6 in Figure 6(a) can be press-fitted.

[0032] The receiving recesses 5 may be arranged in three or more rows. The end face shape, depth, width (size), etc. of the multiple rows of receiving recesses 5 can be adapted to the shape and diameter of the conductor 4 to be placed, and may be any shape other than that shown in the figure. They may all be the same or different. The orientation of the multiple rows of receiving recesses 5 does not all have to be parallel, and they may be angled to match the wiring direction of the conductor 4, or may be oriented in other directions.

[0033] (Electrode Embodiment 9) The electrode 1 in FIG. 7(a) has a receiving recess 5 which is a horizontal hole that penetrates the side surface of the electrode 1 in a horizontal direction.

[0034] (Other embodiments of the electrode) 1 to 8 show the case where only one electrode 1 is provided on one substrate 2, but in the present invention, any number of electrodes can be provided on one substrate 2. In this case, the shape, size, etc. of the electrode 1 may be the same or different. Also, the surface may be flat or may be provided with a receiving recess 5. The shape, thickness, width, etc. of the electrode 1 with the receiving recess 5 in FIGS. 3 to 6 may be the same as that in FIG. 1(b) or may be different.

[0035] The electrode receiving recess 5 of the present invention may have a shape, a location on the electrode 1, and the like other than those shown in the drawings, as long as it can accommodate and place or insert the conductive wire 4 therein.

[0036] (Embodiment of a method for joining an electrode and a conducting wire) DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for joining an electrode and a conductor wire according to the present invention will be described below with reference to the drawings.

[0037] (Embodiment 1 of the method for joining an electrode and a conductor) In the method for joining an electrode and a conductor of the present invention, as shown in Figure 2(a), a conductor 4 is placed on the flat upper surface 1a of an electrode 1, and a heater tip 6 is lowered from above the conductor 4 using a heater head G (Figure 8). At this time, the trapezoidally recessed, concave heating portion (heat generating portion) 7 of the heater tip 6 descends across the conductor 4, so that the top surface 7b of the concave heating portion 7 does not come into contact with the conductor 4, but the side surface (slope) 7a comes into contact with the electrode 1 before the conductor 4 does, and the electrode 1 is pressurized by the weight of the heater tip 6 or the downward pressure of the heater head G. Electricity is then applied to the heater tip 6 from a heater power supply (not shown), causing Joule heat to be generated in the concave heating portion 7, which then heats the electrode 1 first. While the conductor 4 is being heated by the heat of the heated electrode 1, the heater tip 6 is further lowered so that the upper surface 7b of the concave heating portion 7 comes into contact with the conductor 4, and both the electrode 1 and the conductor 4 are pressurized and heated, thereby thermally joining the conductor 4 to the electrode 1.

[0038] (Embodiment 2 of the method for joining an electrode and a conductor) In another example of the method for joining an electrode and a conductor according to the present invention, as shown in FIG. 2( b), a conductor 4 is placed on the flat upper surface 1a of an electrode 1, and a heater tip 6 is lowered from above the conductor 4 using a heater head G (FIG. 8). At this time, the inverted V-shaped recessed heating portion 7 of the heater tip 6 is lowered across the conductor 4, so that the side surface 7a of the recessed heating portion 7 contacts the electrode 1 before the conductor 4 does, and the electrode 1 is pressurized by the weight of the heater tip 6 or by the downward pressure of the heater head G. Electricity is then applied to the heater tip 6 from a heater power supply (not shown), generating Joule heat in the recessed heating portion 7, which then heats the electrode 1. While the conductor 4 is being heated by the heat from the heated electrode 1, the heater tip 6 is further lowered, and the recessed heating portion 7 presses and heats both the electrode 1 and the conductor 4, thereby exothermally joining the conductor 4 and the electrode 1.

[0039] In either of the joining methods of the electrode and the conductor wire in the first and second embodiments, the conductor wire 4 is not excessively pressurized, is less likely to be flattened, and corners are less likely to form in the conductor wire 4, so that the mechanical strength of the conductor wire 4 is less likely to deteriorate. Furthermore, the electrode 1 softened by heating is brought toward the conductor wire 4 by the side surface 7a of the concave heating portion 7, and the conductor wire 4 is crimped from the outside. In some cases, as shown in FIG. 2(c), the upper surface 1a of the softened electrode 1 is placed over the side surface of the conductor wire 4 and crimped, thereby increasing the joining strength. In either of the joining methods in the first and second embodiments, the flat portion 7c (FIGS. 2(a) and 2(b)) next to the heating portion 7 can be either a heat-generating portion or a non-heat-generating portion, but is preferably a heat-generating portion in terms of heating the electrode 1 (the same applies below).

[0040] (Embodiment 3 of the method for joining an electrode and a conductor) In another example of the method for joining an electrode and a conductor according to the present invention, as shown in Figure 3(a), the lower part 4b of the conductor 4 is accommodated in a U-shaped receiving recess 5 on the upper surface 1a of the electrode 1, with the upper part 4a of the conductor 4 protruding above the upper surface 1a of the electrode 1. In this state, the heater chip 6 is lowered as shown in Figure 3(b), the flat heating portion 7 of the heater chip 6 presses the conductor 4, and electricity is started to be applied to the heater chip 6 to generate heat in the heating portion 7, which then heats the conductor 4. While the electrode 1 is being heated by the heat of the heated conductor 4, the heater chip 6 is further lowered to bring the heating portion 7 into contact with both the conductor 4 and the electrode 1, and both the conductor 4 and the electrode 1 are pressurized and heated to form an exothermic bond.

[0041] (Embodiment 4 of the method for joining an electrode and a conductor) In another example of the method of joining an electrode and a conductor according to the present invention, as shown in Figure 4(a), the lower part 4b of the conductor 4 is accommodated in the V-shaped receiving recess 5 of the electrode 1, with the upper part 4a of the conductor 4 protruding above the receiving recess 5. In this state, the heater tip 6 is lowered, the flat heating portion 7 of the heater tip 6 is brought into contact with the conductor 4, and electricity is passed through the heater tip 6 to cause the heating portion 7 to generate heat. The conductor 4 is heated by the generated heating portion 7, and the electrode 1 is heated by the heat of the heated conductor 4. While the heater tip 6 is further lowered, pressure and heat are applied to both the conductor 4 and the electrode 1 by the heating portion 7, resulting in exothermic joining.

[0042] (Embodiment 5 of the method for joining an electrode and a conductor) In another example of the method for joining an electrode and a conductor according to the present invention, as shown in FIG. 4(b), the lower portion 4b of the conductor 4 is accommodated in the U-shaped receiving recess 5 of the electrode 1, and the upper portion 4a of the conductor 4 protrudes above the upper surface 1a of the electrode 1. In this state, the heater chip 6 is lowered so that the arc-shaped recessed heating portion 7 of the heater chip 6 covers the conductor 4. In this state, electricity is applied to the heater chip 6 to generate heat in the heating portion 7, and the heater chip 6 is lowered to heat the conductor 4 with the heating portion 7. While the electrode 1 is heated by the heat from the heated conductor 4, the heater chip 6 is further lowered, and both the conductor 4 and the electrode 1 are pressurized and heated by the heating portion 7, thereby forming a thermally bonded connection. The flat portion 7c next to the heating portion 7 can be either a heat-generating portion or a non-heat-generating portion.

[0043] In any of the methods for joining an electrode and a conductor in Embodiments 3 to 5, the lower portion 4b of the conductor 4 housed in the receiving recess 5 is less likely to be flattened, corners are less likely to form in the conductor 4, and the mechanical strength of the conductor 4 is less likely to deteriorate. In addition, the upper surface 1a of the electrode 1 softened by heating is brought toward the conductor 4 by the side surface 7a of the heating portion 7, and the conductor 4 is crimped or crimped from the outside, thereby increasing the joining strength.

[0044] (Embodiment 6 of the method for joining an electrode and a conductor) In the method for joining an electrode and a conductor of the present invention, the entire outer periphery of the conductor 4 is accommodated in the U-shaped receiving recess 5 of the electrode 1, as shown in Figure 5(a). In this state, the heater tip 6 is lowered so that the trapezoidally recessed heating portion 7 of the heater tip 6 straddles the conductor 4, and the side surface 7a of the heating portion 7 contacts the electrode 1 before the conductor 4. Electricity is applied to the heater tip 6 to heat the electrode 1 with the heat of the heating portion 7. While the conductor 4 is being heated by the heat of the heated electrode 1, the heater tip 6 is further lowered, and the upper surface 7b of the heating portion 7 presses and heats both the conductor 4 and the electrode 1, thereby exothermically joining them. In this case, the flat portion 7c on the side of the heating portion 7 can be either a heat-generating portion or a non-heat-generating portion.

[0045] In the joining method of this embodiment, as shown in FIG. 5(b), the upper surface 1a of the softened electrode 1 is placed over (on the outer periphery of) the conductor wire 4, and the conductor wire 4 is crimped.

[0046] (Embodiment 7 of the method for joining an electrode and a conductor) In the method for joining an electrode and a conductor of the present invention, as shown in FIG. 6( a), the entire circumference of the conductor 4 is accommodated in the two U-shaped receiving recesses 5 of the electrode 1. In this state, the heater chip 6 is lowered, and the two trapezoidally recessed heating portions 7 of the heater chip 6 are lowered over the respective conductors 4, so that the side surfaces 7a of the two heating portions 7 contact the electrode 1 before the conductor 4. At this time, the convex heating portions 7d of the heater chip 6 are pressed into the recesses 1b of the electrode 1. Electricity is applied to the heater chip 6 to heat the electrode 1 with the heat of the heating portions 7. While the conductor 4 is being heated by the heat of the heated electrode 1, the heater chip 6 is further lowered, and the upper surfaces 7b of the heating portions 7 press and heat both the conductor 4 and the electrode 1, thereby exothermally joining them. In this case, the upper surface 1a of the softened electrode 1 covers the outer periphery of the conductor 4, as shown in FIG. 6( b), and the conductor 4 is crimped. The flat surface 7c on the side of the heating portion 7 can be a heat generating portion or a non-heat generating portion.

[0047] (Embodiment 8 of the method for joining an electrode and a conductor) In the method for joining an electrode and a conductor of the present invention, when performing heat bonding as shown in Figure 6(a), the upper surface 7b of the concave heating portion 7 can also be made to come into contact with the conductor 4 at the same time or approximately at the same time that the side surface 7a of the concave heating portion 7 covers and comes into contact with the electrode 1. In this case as well, the convex heating portion 7d of the heater chip 6 is press-fitted into the fitting recess 1b of the electrode 1. Furthermore, as the heater chip 6 continues to descend, the conductor 4 is pressurized and heated by the electrode 1, and the conductor 4 is crimped to the electrode 1 as shown in Figure 6(b).

[0048] In the seventh and eighth embodiments, there are two (two rows) receiving recesses 5 in one electrode 1, but if there are three or more receiving recesses 5, the conducting wires 4 are placed in all of those receiving recesses 5, and the heater chip 6 also has three or more recessed heating portions 7, and these recessed heating portions 7 pressurize and heat the conducting wires 4 in the three or more receiving recesses 5, joining them by heat and crimping.

[0049] (Embodiment 9 of the method for joining an electrode and a conductor) In the method for joining an electrode and a conductor of the present invention, as shown in FIG. 7(a), a conductor 4 is inserted into a receiving recess (insertion hole: horizontal hole) 5 penetrating the side surface of the electrode 1 as shown in FIG. 7(b), and in this state, a heater chip 6 is lowered so that the flat heating portion 7 of the heater chip 6 comes into contact with the upper surface 1a of the electrode 1 and applies pressure to the electrode 1. In this state, electricity is passed through the heater chip 6, causing the heating portion 7 of the heater chip 6 to generate heat and heat the electrode 1. While the conductor 4 is being heated by the heat from the heated electrode 1, the heater chip 6 is further lowered, and the heating portion 7 applies pressure and heat to both the conductor 4 and the electrode 1, thereby thermally joining the conductor 4 and the electrode 1. In this case, the outer surface of the conductor 4 inside the insertion hole 5 is crimped by the softened electrode 1, increasing the joining strength.

[0050] If two or more insertion holes 5 penetrate the side surface of the electrode 1, it is also possible to insert wires 4 into all of the insertion holes 5 and thermally join all of the wires 4 to the individual insertion holes 5.

[0051] (Another embodiment of the method for joining an electrode and a conductor wire) The above-mentioned method of joining an electrode and a conductor is to apply pressure and heat with a heater tip to directly heat-bond the electrode 1 and conductor 4, but in the present invention, as with conventional soldering, solder can be interposed between the conductor 4 housed in the receiving recess 5 of the electrode 1 or between the conductor 4 inserted into the insertion hole 5 of the electrode 1, and in that state the conductor 4 and electrode 1 can be soldered together by applying pressure and heat with a heater tip.

[0052] (Embodiment of the joining structure of the electrode and the conducting wire) Embodiments of the electrode-conductor bonding structure of the present invention will be described below with reference to the drawings. In all of the embodiments described below, the electrode-conductor bonding structure of the present invention has a structure in which a block-shaped electrode 1 and a conductor 4 are heat-bonded by applying pressure and heat with a heater tip 6.

[0053] (Embodiment 1 of the electrode and conductor joint structure) 2(a) and 2(b), an example of the joining structure between an electrode and a conductor wire according to the present invention is shown in which a conductor wire 4 placed on the flat upper surface 1a of an electrode 1 is pressurized and heated by a heater tip 6 to be thermally joined to the electrode 1. The upper surface 1a of the electrode 1, which has been softened by the pressure and heat applied during the thermal joining, is brought toward the conductor wire 4, and the conductor wire 4 is crimped from the outside. In some cases, as shown in FIG. 2(c), the softened upper surface 1a of the electrode 1 is placed over the conductor wire 4, crimping it.

[0054] (Embodiment 2 of the electrode and conductor joint structure) In another example of the joining structure between an electrode and a conductor according to the present invention, as shown in Figures 3(a) and 4(a) and (b), a conductor 4, whose lower part 4b is housed in a receiving recess 5 of an electrode 1, is pressurized and heated by a heater tip 6 that has been lowered and is then heated, and is joined by heating to the electrode 1. In this case, the lower part 4b of the conductor 4 housed in the receiving recess 5 is not significantly flattened. In addition, the outer peripheral surface of the conductor 4 is externally crimped or swaged by the electrode 1, which has been softened by the pressure and heat applied during the joining by heating.

[0055] (Embodiment 3 of the electrode and conductor joint structure) In another example of the joining structure of an electrode and a conductor wire of the present invention, as shown in Figure 5(a), a conductor wire 4 whose entire circumference is accommodated in a recess 5 is pressurized and heated by a heater tip 6 to be joined by heat to the electrode 1. In this case, the upper surface 1a of the electrode 1, which has been softened by the pressure and heat applied during the heat joining, is brought toward the conductor wire 4 in the receiving recess 5 and covers the upper outer peripheral surface of the conductor wire 4, thereby crimping the conductor wire 4, as shown in Figure 5(b).

[0056] (Embodiment 4 of the electrode and conductor joint structure) In another example of the joining structure of an electrode and a conductor according to the present invention, as shown in Figure 6(a), a conductor 4, the entire circumference of which is housed in two receiving recesses 5 of an electrode 1, is pressurized and heated by a heater tip 6 to be joined by heat to the electrode 1. In this case, the upper surface 1a of the electrode 1, which has been softened by the pressure and heat applied during the heat joining, is brought to the top side of the conductor 4 in the receiving recess 5 as shown in Figure 6(b), thereby crimping the conductor 4. When a conductor 4 housed in three or more receiving recesses 5 is pressurized and heated by three or more recessed heating parts 7, the conductor 4 is also crimped.

[0057] (Embodiment 5 of the electrode and conductor joint structure) In another example of the joining structure between an electrode and a conductor wire according to the present invention, a conductor wire 4 inserted into a horizontal receiving recess (insertion hole: horizontal hole) 5 of an electrode 1 shown in Fig. 7(a) is pressurized and heated by a heater tip 6 to be exothermically joined to the electrode 1 as shown in Fig. 7(b). In this case, the outer peripheral surface of the conductor wire 4 is crimped or swaged by the electrode 1 which has been softened by pressurization and heating.

[0058] (Embodiment of heater chip) The heater chip of the present invention is formed into a plate shape using the same material as the conventional heater chip A (FIG. 8), for example, a high-melting-point metal such as tungsten or molybdenum as the base material. If possible, it can also be formed into a plate shape using other high-melting-point metals as the base material.

[0059] (Embodiment 1 of the heater chip) The heater chip in Figure 2(a) has a recessed heating portion 7. The recessed shape is a trapezoidal shape that widens downward and opens downward. The recessed shape of the recessed heating portion 7 in Figure 2(b) is an inverted V shape and opens downward. The flat portions 7c on the sides of the recessed heating portion 7 in Figures 2(a) and 2(b) can be heat-generating portions that generate heat when current is applied, or non-heat-generating portions.

[0060] The recessed shape of the heating part 7 in Figures 2(a) and 2(b) is such that the width L1 of the bottom opening (Figures 2(d) and 2(e)) is wider than the width L2 of the top surface of the electrode 1 (Figure 2(c)), so that it covers the electrode 1. In addition, the depth is greater than the diameter of the conducting wire 4, so that when the side surface 7a of the recessed heating part 7 initially comes into contact with the electrode 1, the top surface 7b of the recessed heating part 7 does not come into contact with the conducting wire 4, but as the heater tip 6 descends, the top surface 7b comes into contact with the conducting wire 4 and can press it downward (apply pressure).

[0061] (Heater Chip Embodiment 2) The heater chips 6 in Figures 3(a), 4(a), and 7(b) have flat heating portions 7, but the heating portions 7 in the present invention may be deformed as long as they do not interfere with the application of pressure and heat to the conductive wires 4 and electrodes 1.

[0062] (Heater Chip Embodiment 3) The heater chip 6 in Fig. 4(b) has a semicircular (including approximately semicircular) recessed heating portion 7, which opens downward and has an inner diameter that covers the upper part of the conductor 4. The flat portion 7c on the side of the recessed heating portion 7 in Fig. 4(b) can also be a heat-generating portion that generates heat when current is applied, or a non-heat-generating portion.

[0063] (Embodiment 4 of the heater chip) The heater chip 6 in FIG. 5(a) has a recessed heating portion 7, which is trapezoidal and widens downward. The width L1 of the opening at the bottom of the recess is wider than the width L2 of the top surface of the electrode 1, and the depth is greater than the diameter of the conductor 4. With this structure, even when the heater chip 6 descends and the side surfaces 7a of the recessed heating portion 7 come into contact with both sides of the electrode 1, the top surface 7b of the recessed heating portion 7 does not straddle the conductor 4 and come into contact with it. Instead, as the heater chip 6 descends, the top surface 7b comes into contact with the conductor 4, pressing (applying pressure) the conductor 4 downward and heating it. The flat portions 7c on the sides of the recessed heating portion 7 in FIG. 5(a) can also be heat-generating portions that generate heat when current is applied, or non-heat-generating portions.

[0064] (Heater Chip Embodiment 5) The heater chip 6 in Figure 6(a) has two recessed, concave heating portions 7 lined up side by side, with a convex heating portion 7d provided between them. The recessed shape of the concave heating portion 7 widens downward, forming a trapezoid with a downward-facing opening. The width L1 of the lower end of the opening of the concave heating portion 7 is wider than the width L2 of the electrode 1 that the heating portion 7 covers, so that the concave heating portion 7 covers the electrode 1 when the heater chip 6 is lowered. The depth of the concave heating portion 7 is also greater than the diameter of the conducting wire 4. The convex heating portion 7d has a shape and size that allows it to be press-fit into the fitting recess 1b of the electrode 1 when the heater chip 6 is lowered. With this structure, even if the side surface 7a of the concave heating portion 7 comes into contact with the electrode 1 as the heater tip 6 descends, the upper surface 7b of the concave heating portion 7 does not come into contact with the conductor 4, and as the heater tip 6 descends further, the upper surface 7b comes into contact with the conductor 4, allowing pressure and heat to be applied to the conductor 4.

[0065] The concave shapes of the concave heating portions 7 in Figures 2(a) and 2(b), 4(b), 5(a), and 6(a) of the present invention and the protruding shapes of the convex heating portions 7d in Figure 6(a) may be shapes other than those shown. Furthermore, the concave shapes and concave sizes of two or more concave heating portions 7 in Figure 6(a) may be the same or different. The protruding shapes and protruding lengths of two or more convex heating portions 7d may also be the same or different.

[0066] In all of the heater chips shown in the figures, the upper portion of the heater chip of the present invention is bifurcated like the conventional heater chip A (FIG. 8), and is attached to the heater head G (FIG. 8) so as to rise and fall as the heater head G rises and falls. When the heating portion 7 is flat, it comes into contact with the conductor 4 as it descends, allowing it to apply pressure and heat. When the heating portion 7 is concave, it initially descends over the conductor 4 without coming into contact with it. However, before the concave heating portion 7 comes into contact with the conductor 4, the convex heating portion 7d comes into contact with the upper surface 1a of the electrode 1 (abuts). Thereafter, as the heater chip 6 descends, the concave heating portion 7 comes into contact with the conductor 4, allowing it to apply pressure and heat to the conductor 4. Furthermore, when a current for resistance heating is supplied (energized) from a heater power source (not shown), the concave heating portion 7 and the convex heating portion 7d generate heat, allowing it to apply pressure and heat to both the electrode 1 and the conductor 4.

[0067] [Control of heater power supply, power supply time, pressure strength, etc.] The heater power supply can be an AC waveform inverter type power supply circuit, similar to a general-purpose one. The various conditions for heat-generating bonding, such as the pressure strength applied by the heater tip 6, the time for which current is applied to the heater tip 6, and the cooling time after current application has stopped, as well as the display of the set conditions, changes to the set conditions, and control of operations associated with the set conditions, are controlled by a control circuit (not shown).

[0068] [Thermocouple installation] As with the conventional heater chip A, the heater chip of the present invention can also have a temperature sensor (for example, a thermocouple) attached to the heating portion 7. [Industrial Applicability]

[0069] The above embodiment is one example of the present invention, and the design may be modified within the scope of the present invention in terms of the method of forming the electrode 1, the concave heating portion 7, and the convex heating portion 7d, the shape, number, and size of the concave heating portion 7 and the convex heating portion 7d, the pressure and heating conditions for the electrode 1 and the conductor 4, the joining method (soldering or diffusion bonding), the pressure and heating conditions, etc. [Explanation of symbols]

[0070] 1 electrode 1a (electrode) top surface 1b (electrode) recess 2 boards 3. Surface (of the board) 4 conductors 4a (Top of the wire) 4b (conductor) bottom 5 (Electrode) receiving recess (insertion hole, horizontal hole) 6 heater chips 7 Heating section (concave heating section: heat generating section) 7a (heating part) side 7b (Heating section) top surface 7c Plane part 7d Convex heating section A heater tip B Connection part C Iron part (heating part) D board E-electrode F conductor G heater head H Temperature Sensor I Lead wire J fastener

Claims

1. A block-shaped electrode formed on the surface of a substrate, The width is wider than the diameter of the conductor wire, and the thickness is thicker than the diameter of the conductor wire. It is made of a material that can be thermally bonded to the conductor. An electrode characterized by:

2. A block-shaped electrode formed on the surface of a substrate, The width is wider than the diameter of the conductor wire, and the thickness is thicker than the diameter of the conductor wire. It is made of a material that can be thermally bonded to the conductor, The electrode has a receiving recess for receiving a conductor, The receiving recess is a groove-like opening on the surface of the electrode, and has a depth shallower than the diameter of the conductor wire to be accommodated in the receiving recess. An electrode characterized by:

3. A block-shaped electrode formed on the surface of a substrate, The width is wider than the diameter of the conductor wire, and the thickness is thicker than the diameter of the conductor wire. It is made of a material that can be thermally bonded to the conductor, The electrode has a receiving recess for receiving a conductor, the receiving recess is a groove-like opening on the surface of the electrode, and has a depth greater than the diameter of the conductor wire to be accommodated in the receiving recess; An electrode characterized by:

4. A block-shaped electrode formed on the surface of a substrate, The width is wider than the diameter of the conductor wire, and the thickness is thicker than the diameter of the conductor wire. It is made of a material that can be thermally bonded to the conductor, The electrode has a receiving recess for receiving a conductor, The receiving recess is a horizontal hole that opens to the side surface of the electrode. An electrode characterized by:

5. A block-shaped electrode formed on the surface of a substrate, The width is wider than the diameter of the conductor wire, and the thickness is thicker than the diameter of the conductor wire. It is made of a material that can be thermally bonded to the conductor, The electrode has a receiving recess for receiving a conductor, Two or more receiving recesses are formed in one electrode, The two or more receiving recesses are formed side by side in the width direction of the electrode. An electrode characterized by:

6. A block-shaped electrode formed on the surface of a substrate, The width is wider than the diameter of the conductor wire, and the thickness is thicker than the diameter of the conductor wire. It is made of a material that can be thermally bonded to the conductor, The electrode has a receiving recess for receiving a conductor, Two or more receiving recesses are formed in one electrode, The two or more receiving recesses are formed side by side in the width direction of the electrode, A fitting recess is provided between adjacent receiving recesses, and the fitting recess has a shape and size that allows the convex heating portion of the heater chip to be press-fitted into the fitting recess. An electrode characterized by:

7. A method for joining electrodes and conductors, 2. The electrode according to claim 1, wherein the electrode is block-shaped; A conducting wire is placed on the surface of the electrode, and the electrode is heated with a heater tip before the conducting wire. While the conducting wire is heated by the heat of the heated electrode, the conducting wire and the electrode are both heated and pressurized with the heater tip to form a thermal bond. A method for joining an electrode and a conductor.

8. A method for joining electrodes and conductors, 2. The electrode according to claim 1, wherein the electrode is block-shaped; A conductor is placed on the surface of the electrode, and the electrode is heated with a heater tip before the conductor. While the conductor is heated by the heat of the heated electrode, the heater tip applies pressure and heat to both the conductor and the electrode to heat-bond them, and the electrode, which has been softened by the pressure and heat, crimps or crimps the outer surface of the conductor. A method for joining an electrode and a conductor.

9. A method for joining electrodes and conductors, 3. The electrode according to claim 2, wherein the electrode is block-shaped and has a receiving recess on its surface, The lower portion of the conductor is accommodated in the receiving recess of the electrode, and the upper portion of the conductor protrudes above the receiving recess; The conductor and electrode are heated and compressed by the flat heating part of the heater chip, and the lower part of the conductor in the receiving recess is thermally bonded without being flattened. A method for joining an electrode and a conductor.

10. A method for joining electrodes and conductors, 3. The electrode according to claim 2, wherein the electrode is block-shaped and has a receiving recess on its surface, The lower portion of the conductor is accommodated in the receiving recess of the electrode, and the upper portion of the conductor protrudes above the receiving recess; The conductor is covered with the concave heating part of the heater chip, and the conductor is pressurized and heated, and the lower part of the conductor in the receiving recess is thermally bonded without being flattened. A method for joining an electrode and a conductor.

11. A method for joining electrodes and conductors, 4. The electrode according to claim 3, wherein the electrode is block-shaped and has a receiving recess on its surface, A conducting wire is accommodated in a receiving recess of the electrode, the conducting wire and the electrode are covered with a concave heating portion of the heater chip, the concave heating portion is brought into contact with the electrode before the conducting wire to heat the electrode, and while the conducting wire is being heated by the heated electrode, both the conducting wire and the electrode are pressurized and heated by the concave heating portion to form a heat-bonded connection. A method for joining an electrode and a conductor.

12. A method for joining electrodes and conductors, 4. The electrode according to claim 3, wherein the electrode is block-shaped and has a receiving recess on its surface, A conductor is placed in the receiving recess of the electrode, the conductor and the electrode are covered with the concave heating portion of the heater chip, the concave heating portion is brought into contact with the electrode before the conductor, the electrode is heated, and while the conductor is being heated by the heated electrode, both the conductor and the electrode are pressurized and heated by the concave heating portion to heat and bond them together, and the outer circumferential surface of the conductor is crimped or crimped with the electrode softened by the pressurization and heating. A method for joining an electrode and a conductor.

13. A method for joining electrodes and conductors, 7. The electrode according to claim 6, wherein the electrode is block-shaped and has two or more receiving recesses on its surface, The entire circumference of the conductor wires is accommodated in each of two or more receiving recesses of the electrode, and the recessed heating parts of the heater chip are placed over the conductor wires and brought into contact with the upper surface of the electrode before the conductor wires, thereby heating the electrode. The heater chip is lowered while the conductor wires are being heated by the heated electrode, and the conductor wires and the electrode are pressurized and heated by the recessed heating parts, thereby forming a thermal bond. A method for joining an electrode and a conductor.

14. A method for joining electrodes and conductors, 7. The electrode according to claim 6, wherein the electrode is block-shaped and has two or more receiving recesses on its surface, The entire circumference of the conductor is accommodated in each of two or more receiving recesses of the electrode, the recessed heating portion of the heater chip is placed over the conductor and brought into contact with the upper surface of the electrode before the conductor, thereby heating the electrode, the heater chip is lowered while the conductor is being heated by the heated electrode, and the conductor and electrode are heated and pressurized by the recessed heating portion to heat and bond them together, and the outer periphery of the conductor is crimped or crimped by the electrode softened by the pressure and heat. A method for joining an electrode and a conductor.

15. A method for joining electrodes and conductors, 5. The electrode of claim 4, wherein the electrode is block-shaped and has a transverse hole. Insert the conductor into the horizontal hole of the electrode. The electrode and the conductor are heated and pressurized with a heater tip to form a thermal bond, and the electrode softened by the heat and pressure is used to crimp or swage the conductor. A method for joining an electrode and a conductor.

16. It is a joint structure between an electrode and a conductor, 2. The electrode according to claim 1, wherein the electrode is block-shaped; The electrode and the conductor placed on it are thermally joined by the heater tip, and the outer surface of the conductor is crimped or swaged by the electrode. A bonding structure between an electrode and a conductor.

17. It is a joint structure between an electrode and a conductor, 3. The electrode according to claim 2, wherein the electrode is block-shaped and has a receiving recess; The electrode and the conductor, the lower part of which is housed in the electrode's receiving recess, are heated and pressurized by the heater tip to form a thermal bond. The bottom of the conductor in the receiving recess is not flattened. A bonding structure between an electrode and a conductor.

18. It is a joint structure between an electrode and a conductor, 3. The electrode according to claim 2, wherein the electrode is block-shaped and has a receiving recess; The electrode and the conductor, the lower part of which is housed in the electrode receiving recess, are heated and pressurized by the heater chip to be joined by heat. The bottom of the conductor in the receiving recess is not flattened, The outer surface of the conductor is crimped or swaged with an electrode that has been softened by the heat generated during the thermal bonding. A bonding structure between an electrode and a conductor.

19. It is a joint structure between an electrode and a conductor, 4. The electrode according to claim 3, wherein the electrode is block-shaped and has a receiving recess; The electrode and the conductor, the entire circumference of which is accommodated in the receiving recess of the electrode or substantially the entire circumference of which is accommodated, are heated and pressurized by the heating part of the heater chip to be exothermically joined. A bonding structure between an electrode and a conductor.

20. It is a joint structure between an electrode and a conductor, 4. The electrode according to claim 3, wherein the electrode is block-shaped and has a receiving recess; The electrode and the conductor, the entire circumference of which or nearly the entire circumference of which is accommodated in the receiving recess of the electrode, are pressurized and heated by the heating part of the heater chip to be thermally bonded, and the outer surface of the conductor is crimped or crimped by the electrode softened by the heat during the thermal bonding. A bonding structure between an electrode and a conductor.

21. It is a joint structure between an electrode and a conductor, 7. The electrode according to claim 6, wherein the electrode is block-shaped and has two or more receiving recesses, The electrode and the conducting wire, the entire circumference of which is accommodated in each of the two or more receiving recesses of the electrode, are heat-bonded by being pressurized and heated by the heating part of the heater chip. A bonding structure between an electrode and a conductor.

22. It is a joint structure between an electrode and a conductor, 7. The electrode according to claim 6, wherein the electrode is block-shaped and has two or more receiving recesses, The electrode and the conducting wire, the entire circumference of which is accommodated in each of the two or more receiving recesses of the electrode, are pressurized and heated by the heating part of the heater chip to be exothermically joined, The outer circumferential surface of the conductor in the receiving recess is crimped or swaged with the electrode softened by the heat during the thermal bonding. A bonding structure between an electrode and a conductor.

23. It is a joint structure between an electrode and a conductor, 5. The electrode of claim 4, wherein the electrode is block-shaped and has a transverse hole. The electrode and the conductor inserted into the horizontal hole of the electrode are thermally joined by the heater chip. A bonding structure between an electrode and a conductor.

24. It is a joint structure between an electrode and a conductor, 5. The electrode of claim 4, wherein the electrode is block-shaped and has a transverse hole. The electrode and the conductor inserted into the horizontal hole of the electrode are thermally bonded by the heater tip, and the electrode is softened by the heat during the thermal bonding process, and the conductor is crimped or swaged. A bonding structure between an electrode and a conductor.

25. This heater chip heats and pressurizes the electrodes and conductors to form a thermal bond. The heater is equipped with a heating section that generates heat when electricity is applied, and the heating section is recessed into a downward opening. The recessed shape is such that when placed over an electrode on which a conductor is placed, it comes into contact with the electrode before the conductor does, thereby heating the electrode, and then descends to come into contact with both the electrode and the conductor, allowing them to be pressurized and heated. A heater chip characterized by:

26. This heater chip heats and pressurizes the electrodes and conductors to form a thermal bond. The heater has two or more concave heating parts that generate heat when electricity is applied, and a convex heating part is located between the heating parts. The concave heating part is widened downward and recessed at the lower opening, so that even if the side surface of the concave heating part comes into contact with the electrode when the heater tip is lowered, the upper surface of the heating part does not come into contact with the conductor, and the recessed part is capable of contacting the conductor and applying pressure and heat as the heater tip continues to descend. The convex heating portion has a shape and size that allows it to be press-fitted into the fitting recess between the receiving recesses of the electrode. A heater chip characterized by:

27. This heater chip heats and pressurizes the electrodes and conductors to form a thermal bond. The heater has two or more concave heating parts that generate heat when electricity is applied, and a convex heating part is located between the heating parts. the concave heating portion is widened downward and recessed at the lower opening, and when the heater tip is lowered, the side surface of the concave heating portion contacts the electrode and at the same time or almost at the same time, the upper surface of the concave heating portion contacts the conductor, and the conductor is pressurized and heated as the heater tip is lowered; The convex heating portion has a shape and size that allows it to be press-fitted into the fitting recess between the receiving recesses of the electrode. A heater chip characterized by:

28. 27. The heater chip of claim 26, The recess shapes and recess sizes of two or more recessed heating parts are the same or different, The protrusion shapes and protrusion sizes of two or more convex heating parts may be the same or different. A heater chip characterized by:

29. 28. The heater chip of claim 27, The recess shapes and recess sizes of two or more recessed heating parts are the same or different, The protrusion shapes and protrusion sizes of two or more convex heating parts may be the same or different. A heater chip characterized by:

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