Processing device

Abstract

To facilitate replacement work of a chuck table and a processing tool in a processing chamber of a processing device.SOLUTION: A processing device includes: a chuck table (21) for holding a workpiece (W); a processing unit (25) which processes the workpiece with a processing tool (34) disposed at a tip of a spindle (31); a horizontal movement mechanism (27) which moves the processing unit in a horizontal direction; and a processing chamber (50) which houses the chuck table and the processing tool. A ceiling (55) of the processing chamber includes: a center plate (57) including an opening (60) through which a spindle penetrates; and two bellows (58, 59) which are disposed at both end sides of the center plate in a horizontal movement direction of the processing unit and expand and contract in a horizontal direction. The processing device includes attachment / detachment tools (61) for attaching / detaching the center plate and the bellows. A side plate of the processing chamber includes: an opening / closing door (64) in which the bellows (58) is connected to an upper part; and a hinge (65) disposed at a lower part of the opening / closing door so that the opening / closing door is opened outward.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing device for processing a workpiece. [Background technology]

[0002] A polishing apparatus for polishing a wafer is provided with a processing chamber that houses a chuck table that holds a wafer and a polishing pad that polishes the wafer, and the wafer is polished in the processing chamber.

[0003] The polishing apparatus disclosed in Patent Document 1 polishes wafers while moving a polishing unit equipped with a polishing pad in the horizontal direction (perpendicular to the holding surface of the chuck table). In this type of polishing apparatus, the top plate of the processing chamber is provided with a plate with an opening through which a spindle equipped with a polishing pad passes, and bellows connected to both ends of the plate, and when the polishing pad and spindle move horizontally, the plate and bellows move following them, keeping the ceiling of the processing chamber covered.

[0004] Maintenance of polishing machines involves replacing the chuck table and polishing pads. Similar maintenance is also performed on processing machines that perform processes other than polishing. For example, in grinding machines, the chuck table and grinding wheel are replaced. Therefore, maintenance of processing machines such as polishing machines and grinding machines involves replacing the chuck table and processing tools.

[0005] In order to facilitate the maintenance work described above in a processing apparatus, a configuration is known in which the side panels of the processing chamber are opened, as disclosed in Patent Documents 2, 3 and 4. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-054373 [Patent Document 2] Japanese Patent Application Publication No. 2023-066697 [Patent Document 3] Patent Publication No. 2021-176666 [Patent Document 4] Japanese Patent Publication No. 2020-015158 Summary of the Invention [Problem to be solved by the invention]

[0007] In conventional processing equipment, even if the side panels of the processing chamber can be opened, the bellows that form the ceiling of the processing chamber cannot be removed, so there are limitations on the size of the opening formed in the processing chamber, and it is sometimes not easy to replace the chuck table or processing tools.

[0008] Therefore, in a processing apparatus having a bellows on the top plate of a processing chamber, there is a problem to be solved, namely, to facilitate the replacement of the chuck table and processing tools in the processing chamber. [Means for solving the problem]

[0009] One aspect of the present invention is a processing device comprising a chuck table for holding a workpiece, a processing unit for processing the workpiece held on the chuck table with a processing tool arranged at the tip of a spindle, a horizontal movement mechanism for moving the processing unit horizontally, and a processing chamber for accommodating the chuck table and the processing tool, wherein the ceiling of the processing chamber comprises a central plate with an opening through which the spindle passes, and two bellows arranged on each end of the central plate in the horizontal movement direction of the processing unit by the horizontal movement mechanism and which expand and contract horizontally, and a detachment device for detaching and attaching the central plate and the bellows, and the side panels of the processing chamber comprise an opening door to the top of which the bellows is connected, and a hinge arranged at the bottom of the opening door so as to open the opening door outward.

[0010] One aspect of the present invention is a processing apparatus comprising a chuck table for holding a workpiece, a processing unit for processing the workpiece held on the chuck table with a processing tool arranged at the tip of a spindle, a horizontal movement mechanism for moving the processing unit horizontally, and a processing chamber for accommodating the chuck table and the processing tool, wherein the ceiling of the processing chamber comprises a central plate with an opening through which the spindle passes, and two bellows arranged on both ends of the central plate in the horizontal movement direction of the processing unit by the horizontal movement mechanism and which expand and contract horizontally, the central plate comprising a first central plate and a second central plate which divide the opening in half, and a connecting portion connecting the first central plate and the second central plate, and the side plates of the processing chamber comprise an opening door to the top of which the bellows is connected, and a hinge arranged at the bottom of the opening door so as to open the opening door outward. [Effects of the Invention]

[0011] According to the processing device of the present invention, when the door is opened, the bellows connected to the top of the door work together to open the ceiling, forming large openings on the sides and top of the processing chamber, making it easy to replace the chuck table and processing tools. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a perspective view of a processing device according to a first embodiment. [Figure 2] 2 is a perspective view of a processing chamber provided in the processing device of the first embodiment with an openable / closable door and a first bellows closed. FIG. [Figure 3] 2 is a perspective view of a processing chamber provided in the processing device of the first embodiment with an open door and a first bellows open. FIG. [Figure 4] 2 is a cross-sectional view of a part of a processing chamber provided in the processing apparatus of the first embodiment. FIG. [Figure 5] FIG. 10 is a perspective view of a processing device according to a second embodiment. [Figure 6] 10 is a perspective view of a processing chamber provided in a processing device according to a second embodiment, with an open door and a first bellows open. FIG. [Figure 7]10 is a perspective view of a processing chamber provided in a processing device of a third embodiment, with an opening / closing door and a first bellows closed. FIG. [Figure 8] 10 is a perspective view showing a state in which the opening / closing door and the first bellows of the processing chamber provided in the processing device of the third embodiment are open. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, with reference to the drawings, a description will be given of a processing device according to each embodiment of the present invention. The X-axis, Y-axis, and Z-axis directions shown in each drawing are perpendicular to one another. The X-axis and Y-axis directions are horizontal. The Z-axis direction is the up-down direction, with the +Z direction side being the top and the -Z direction side being the bottom.

[0014] The processing apparatus in each embodiment is a grinding apparatus that performs grinding on a wafer, which is a workpiece, and is equipped with a grinding wheel (including a grinding wheel with a grinding wheel attached) as a processing tool. Note that application to a grinding apparatus is just one example, and the present invention can also be applied to processing apparatuses other than grinding apparatuses, such as a polishing apparatus.

[0015] A processing apparatus 1 according to a first embodiment will be described with reference to Fig. 1 to Fig. 4. Fig. 1 shows the overall structure of the processing apparatus 1. Figs. 2 and 3 show a processing chamber 50 provided in the processing apparatus 1. Fig. 4 shows a part of the processing chamber 50. The processing apparatus 1 is controlled by a control unit 5 and fully automatically performs a series of operations on a wafer W, which is a workpiece, such as loading, grinding, cleaning, and unloading.

[0016] The processing device 1 has a first base 10 located on the -Y direction side and a second base 11 located on the +Y direction side. The upper surface of the second base 11 is lower than the upper surface of the first base 10, and there is a step between the upper surfaces of the first base 10 and the second base 11.

[0017] Two cassette stages 12 are provided at different positions in the X-axis direction at the end of the first base 10 on the -Y direction side. A cassette 13 containing wafers W before grinding is placed on one of the cassette stages 12. A cassette 13 containing wafers W after grinding is placed on the other cassette stage 12.

[0018] A temporary placement table 14 and a cleaning unit 15 are provided on the +Y direction side of the first base 10. The temporary placement table 14 and the cleaning unit 15 are arranged at different positions in the X axis direction, with the temporary placement table 14 located on the +X direction side and the cleaning unit 15 located on the -X direction side.

[0019] The temporary placement table 14 is a table on which the wafer W is temporarily placed before grinding. A plurality of positioning pins 16 that can move in the radial direction of the temporary placement table 14 are provided around the temporary placement table 14. The wafer W is held on the holding surface of the temporary placement table 14, and the plurality of positioning pins 16 are each brought into contact with the outer periphery of the wafer W, thereby positioning the wafer W so that the center of the temporary placement table 14 coincides with the center of the wafer W.

[0020] The cleaning unit 15 cleans the wafer W after grinding. The wafer W is held on a cleaning table 17 provided in the cleaning unit 15, and while the cleaning table 17 is rotating, cleaning water is sprayed from a cleaning nozzle 18 to clean the wafer W. After cleaning, air is blown onto the wafer W from the cleaning nozzle 18 to dry it.

[0021] A transfer robot 19 is provided at a position between the pair of cassette stages 12, the temporary placement table 14, and the cleaning unit 15. The transfer robot 19 has a configuration in which a robot hand is attached to the tip of a movable arm made up of multiple links, and suction-holds a wafer W on the robot hand, and by relatively rotating the multiple links making up the movable arm, the position of the robot hand is changed to transport the wafer W. The transfer robot 19 performs an operation of removing a wafer W before grinding from the cassette 13 and placing it on the temporary placement table 14, and an operation of carrying out a wafer W after grinding and cleaning from the cleaning unit 15 and storing it in the cassette 13.

[0022] A turntable 20 is provided on the second base 11, and two chuck tables 21 are arranged on the turntable 20. The turntable 20 is disk-shaped, and by driving a turntable rotation mechanism 22 equipped with a motor, the turntable 20 is rotated about an axis extending in the Z-axis direction.

[0023] Each of the two chuck tables 21 is a disk-shaped plate with a smaller diameter than the turntable 20, and has a holding surface on its upper surface that holds the wafer W. The holding surface of the chuck table 21 is formed from a porous plate, which is a porous material, and has a large number of fine pores on the holding surface. By operating the suction source to suck air from the porous plate, negative pressure is generated on the holding surface of the chuck table 21, and the wafer W is sucked and held. The two chuck tables 21 are rotated individually about an axis extending in the Z-axis direction by driving a chuck table rotation mechanism 23 equipped with a motor.

[0024] The two chuck tables 21 are disposed symmetrically with respect to the rotation center of the turntable 20. The control unit 5 controls the operation of the turntable rotation mechanism 22 so as to rotate the turntable 20 by 180° at a time. By the rotation of the turntable 20, the two chuck tables 21 are alternately positioned between a processing position on the +Y direction side and a load / unload position on the -Y direction side. The processing position of the chuck table 21 is a position where the upper surface of the wafer W held on the chuck table 21 is ground using the processing unit 25. The load / unload position of the chuck table 21 is a position where the wafer W is loaded and unloaded relative to the chuck table 21 using the transport mechanism 35.

[0025] In this embodiment, two chuck tables 21 are arranged on the turntable 20, but the number of chuck tables is not limited to two. For example, a configuration may be adopted in which only one chuck table is provided and the chuck table is moved linearly in the Y-axis direction to be positioned at the processing position and the load / unload position. Alternatively, three or more chuck tables may be arranged on the turntable.

[0026] A processing unit 25 is provided above the turntable 20. The processing unit 25 performs grinding on the wafer W on the chuck table 21 positioned at the processing position. A column 26 is erected on the upper surface of the second base 11 near the end on the +Y direction side. The processing unit 25 is supported relative to the column 26 by a horizontal movement mechanism 27 so as to be movable in the X-axis direction (horizontal direction), and is supported by an elevation mechanism 28 so as to be movable in the Z-axis direction (up and down direction).

[0027] The horizontal movement mechanism 27 includes a pair of guide rails 271 that are disposed on the −Y direction surface of the column 26 and extend in the X axis direction, an X axis movement table 272 that is supported so as to be movable in the X axis direction via the pair of guide rails 271, a ball screw 273 that extends in the X axis direction and screws into a screw portion (not shown) of the X axis movement table 272, and a motor 274 that rotates the ball screw 273. When the ball screw 273 is rotated by the driving of the motor 274, the X axis movement table 272 moves in the X axis direction.

[0028] The lifting mechanism 28 includes a pair of guide rails 281 that are disposed on the −Y direction surface of the X-axis moving table 272 and extend in the Z-axis direction, a lifting table 282 that is supported so as to be movable in the Z-axis direction via the pair of guide rails 281, a ball screw 283 that extends in the Z-axis direction and screws into a screw-fitting portion (not shown) of the lifting table 282, and a motor 284 that rotates the ball screw 283. When the ball screw 283 is rotated by the driving of the motor 284, the lifting table 282 moves in the Z-axis direction.

[0029] The processing unit 25 is attached to the lift table 282 via the housing 29. When the X-axis moving table 272 moves in the X-axis direction, the processing unit 25 changes its position in the X-axis direction. When the lift table 282 moves in the Z-axis direction, the processing unit 25 changes its position in the Z-axis direction.

[0030] The machining unit 25 includes a spindle unit 30. The spindle unit 30 is, for example, an air spindle, and rotatably supports a spindle 31 inside the casing via high-pressure air. The spindle 31 is a shaft extending in the Z-axis direction. A mount 32 is connected to the lower end of the spindle 31, and a grinding wheel 33 is attached to the underside of the mount 32. A plurality of grinding stones 34 are arranged in an annular shape on the underside of the grinding wheel 33. A motor included in the spindle unit 30 rotates the spindle 31, thereby rotating the grinding wheel 33 equipped with the grinding stones 34. The grinding wheel 33 is detachable from the mount 32, and when replacing a worn grinding wheel 34, the grinding wheel 33 is removed from the mount 32. The grinding wheel 33 is attached to the mount 32 using, for example, screws.

[0031] A transfer mechanism 35 is provided between the temporary placement table 14, the cleaning unit 15, and the turntable 20. The transfer mechanism 35 transfers the wafer W to and from the chuck table 21 positioned at the transfer position. The transfer mechanism 35 receives the wafer W before grinding from the temporary placement table 14 and transfers it to the chuck table 21, and receives the wafer W after grinding from the chuck table 21 and transfers it to the cleaning unit 15.

[0032] The transfer mechanism 35 includes a transfer pad 36 that can suction and hold the upper surface of the wafer W. A porous plate made of a porous material is provided on the lower surface of the transfer pad 36, and a suction force can be applied to the lower surface of the transfer pad 36 by sucking air from the porous plate using a suction source.

[0033] The transport mechanism 35 further includes a rotation mechanism 37 that rotates (pivots) the transport pad 36 about an axis extending in the Z-axis direction, an elevation mechanism 38 that moves the transport pad 36 up and down in the Z-axis direction, and a Y-axis movement mechanism 39 that moves the transport pad 36 in the Y-axis direction. A support block 40 is provided on the upper surface near the boundary between the first base 10 and the second base 11. Each component of the Y-axis movement mechanism 39 is attached to the support block 40, which supports the elevation mechanism 38 via the Y-axis movement mechanism 39, and the rotation mechanism 37 via the elevation mechanism 38. The transport pad 36 is supported at the tip end of a transport arm 41 that extends horizontally from the bottom end of the rotation mechanism 37.

[0034] The rotation mechanism 37 and the lifting mechanism 38 cause the transfer arm 41 to rotate and lift using the driving force of a motor and an actuator (not shown), respectively.

[0035] The Y-axis moving mechanism 39 includes a pair of guide rails 391 that are disposed on the surface of the support block 40 on the +X-direction side and extend in the Y-axis direction, a Y-axis moving unit 392 that is supported via the pair of guide rails 391 so as to be movable in the Y-axis direction, a ball screw 393 that extends in the Y-axis direction and that screws into a screw-type engaging portion (not shown) of the Y-axis moving unit 392, and a motor 394 that rotates the ball screw 393. When the ball screw 393 is rotated by the driving of the motor 394, the Y-axis moving unit 392 moves in the Y-axis direction. When the Y-axis moving unit 392 moves in the Y-axis direction, the transport arm 41 that is supported by the Y-axis moving unit 392 via the rotation mechanism 37 and the lifting mechanism 38 moves in the Y-axis direction, and as a result, the position of the transport pad 36 changes in the Y-axis direction.

[0036] The transport mechanism 35 moves the transport pad 36 in the horizontal direction using a rotational operation by a rotation mechanism 37 and movement in the Y-axis direction by a Y-axis movement mechanism 39. The transport mechanism 35 also moves the transport pad 36 up and down in the Z-axis direction by a lifting operation by a lifting mechanism 38. These operations enable the wafer W to be transported between the chuck table 21 positioned at the loading / unloading position, the temporary placement table 14, and the cleaning unit 15.

[0037] A series of operations will be described when the processing apparatus 1 having the above configuration grinds the wafer W. The operations of each part of the processing apparatus 1 described below are performed under the control of the control unit 5, and unless a controlling entity is specified, it is assumed that the control unit 5 is in charge of the operations.

[0038] A cassette 13 containing wafers W before grinding is placed on the cassette stage 12 of the processing device 1. The wafers W before grinding stored in the cassette 13 are held by the robot hand of a transfer robot 19, and are transported to the temporary placement table 14 by the operation of the transfer robot 19. After the transfer robot 19 places the wafers W on the temporary placement table 14, a positioning operation is performed in which a plurality of positioning pins 16 arranged around the temporary placement table 14 are moved toward the center of the temporary placement table 14, and the plurality of positioning pins 16 are brought into contact with the outer edge of the wafer W. This aligns the center of the temporary placement table 14 with the center of the wafer W.

[0039] Next, the wafer W before grinding is transported from the temporary placement table 14 to the chuck table 21 using the transport mechanism 35. First, the upper surface of the wafer W on the temporary placement table 14 is suction-held by the lower surface of the transport pad 36. The transport pad 36, which is holding the upper surface of the wafer W by suction, is moved above the chuck table 21, which is positioned at the load / unload position, by movement in the +Y direction by the Y-axis movement mechanism 39 and rotation by the rotation mechanism 37. The transport pad 36 is lowered by operation of the lifting mechanism 38, and the wafer W is placed on the holding surface of the chuck table 21. The suction-holding of the wafer W by the transport pad 36 is released, and the wafer W is held on the holding surface of the chuck table 21 by suction.

[0040] The turntable 20 is rotated to move the chuck table 21, which holds the wafer W before grinding, from the carry-in / out position to the processing position. The wafer W on the chuck table 21 positioned at the processing position is ground using the processing unit 25. During grinding, the grinding wheel 33 and the wafer W are rotated relative to each other, and the grinding stone 34 is brought into contact with the upper surface of the wafer W. Specifically, the spindle 31 is rotated to rotate the grinding wheel 33, and the lifting mechanism 28 lowers the grinding wheel 33, bringing the grinding stone 34 closer to the wafer W held on the chuck table 21. The chuck table rotation mechanism 23 also rotates the chuck table 21. Furthermore, the horizontal movement mechanism 27 horizontally moves the processing unit 25 in the X-axis direction. In this manner, grinding is performed by bringing the grinding wheel 33 equipped with the grinding stone 34 into contact with the upper surface of the wafer W while moving the grinding wheel 33 equipped with the grinding stone 34 relative to the wafer W on the chuck table 21. A processing fluid (grinding water) is supplied to the location where the grinding stone 34 contacts the wafer W.

[0041] Once the wafer W has been ground to a predetermined thickness, the grinding wheel 33 is raised by the lifting mechanism 28, and the grinding stone 34 is separated from the upper surface of the wafer W. Next, the turntable 20 is rotated, and the chuck table 21 holding the ground wafer W is moved from the processing position to the carry-in / out position.

[0042] Next, the ground wafer W is transported from the chuck table 21 to the cleaning unit 15 using the transport mechanism 35. First, the upper surface of the wafer W on the chuck table 21 positioned at the load / unload position is suction-held on the lower surface of the transport pad 36. The transport pad 36, which is suction-holding the upper surface of the wafer W, is moved above the cleaning table 17 of the cleaning unit 15 by movement in the -Y direction by the Y-axis movement mechanism 39 and rotation by the rotation mechanism 37. The transport pad 36 is lowered by operation of the lifting mechanism 38, and the wafer W is placed on the holding surface of the cleaning table 17. The suction-holding of the wafer W by the transport pad 36 is released, and the wafer W is suction-held on the holding surface of the cleaning table 17.

[0043] The cleaning table 17 holding the wafer W is rotated, and cleaning water is sprayed from the cleaning nozzle 18 to clean the wafer W. After cleaning, air is blown onto the wafer W from the cleaning nozzle 18 to dry it. The wafer W that has been cleaned and dried is sucked and held by the robot hand of the transfer robot 19, and is stored in the cassette 13 by the operation of the transfer robot 19.

[0044] The processing apparatus 1 is equipped with a processing chamber 50. FIG. 1 shows a see-through view of the inside of the processing chamber 50, and FIGS. 2 and 3 show the specific structure of the processing chamber 50. The processing chamber 50 is a box-shaped structure that covers a portion of the upper surface of the second base 11, and accommodates the chuck table 21 positioned at the processing position, and a grinding wheel 33 and a grinding stone 34, which are processing tools in the processing unit 25. By performing grinding processing on the wafer W inside the storage space S (see FIG. 3) covered by the processing chamber 50, it is possible to prevent processing debris generated by grinding and processing fluid supplied during grinding from scattering around and contaminating the surrounding area.

[0045] The processing chamber 50 will be described in detail. As shown in FIG. 2, the processing chamber 50 includes side plates 51 and 52 located on both sides in the Y-axis direction, side plates 53 and 54 located on both sides in the X-axis direction, and a ceiling 55 covering the upper portion in the Z-axis direction. The side plates 51 and 52 are approximately parallel to each other and extend in the X-axis and Z-axis directions. The side plates 53 and 54 are approximately parallel to each other and extend in the Y-axis and Z-axis directions. The ceiling 55 extends generally horizontally. The side plates 51, 52, 53, and 54 protrude from the upper surface of the second base 11 at approximately the same height in the +Z direction, and the upper ends of these side plates are connected by the ceiling 55 to form the box-shaped processing chamber 50. Inside the processing chamber 50, an accommodation space S (see FIG. 3) is formed to accommodate the chuck table 21, the grinding wheel 33, and the grinding stone 34.

[0046] As shown in FIG. 1 , the processing chamber 50 is configured to accommodate a portion of the turntable 20, with the portion of the turntable 20 on the +Y side entering the storage space S inside the processing chamber 50 and the portion of the turntable 20 on the -Y side located outside the processing chamber 50. The chuck table 21 positioned at the processing position is located inside the processing chamber 50, and the chuck table 21 positioned at the load / unload position is located outside the processing chamber 50. A notch 56 is formed in the side plate 51 on the -Y side of the processing chamber 50, allowing the rotating turntable 20 to pass through. As the turntable 20 rotates, the two chuck tables 21 alternately enter and exit the storage space S through the notches 56.

[0047] 3, the processing chamber 50 is formed with a side opening Pa and an upper opening Pb that communicate the accommodation space S with the outside. The side opening Pa extends vertically across the side plate 53 in the Z-axis direction. The upper opening Pb extends horizontally across the ceiling 55 in the X-axis direction. The end (upper end) of the side opening Pa on the +Z direction side and the end of the upper opening Pb on the +X direction side communicate with each other, and the side opening Pa and the upper opening Pb together form an L-shaped opening.

[0048] 2, a side opening Pa of side plate 53 is covered by an openable / closable door 64. An upper opening Pb of ceiling 55 is covered by a central plate 57 and two bellows members, a first bellows 58 and a second bellows 59, which are arranged on both ends of central plate 57 in the X-axis direction.

[0049] Central plate 57 is formed with a circular opening 60 through which spindle 31 of processing unit 25 passes. First bellows 58 and second bellows 59 are made of a flexible material such as rubber, and are formed by bending them multiple times into a mountain shape, so that they can expand and contract horizontally to change their length in the X-axis direction.

[0050] The central plate 57 and the first bellows 58 are detachably connected by detachable fixtures 61. A pair of detachable fixtures 61 are provided at the end of the central plate 57 on the positive side, spaced apart in the Y-axis direction. The detachable fixtures 61 have a simple structure that allows for easy attachment and detachment, such as a magnet, a hook-like engaging portion, or a snap-fit ​​button-like mating portion. One end of the first bellows 58 is provided with a connecting plate 581 that is connected to the central plate 57 via the detachable fixtures 61. When the central plate 57 and the connecting plate 581 are connected via the detachable fixtures 61, the connecting plate 581 overlaps with the central plate 57, sealing the gap between the central plate 57 and the first bellows 58. Therefore, in the state shown in FIG. 2 where the central plate 57 and the first bellows 58 are connected to form the ceiling 55, machining debris and machining fluid inside the storage space S do not pass between the central plate 57 and the first bellows 58, preventing dirt from scattering above the ceiling 55.

[0051] When connected via detachable tool 61, central plate 57 and first bellows 58 move integrally in the X-axis direction. Central plate 57 and second bellows 59 are always connected and move integrally in the X-axis direction. When central plate 57 moves in the +X direction, first bellows 58 contracts and second bellows 59 expands. When central plate 57 moves in the -X direction, second bellows 59 contracts and first bellows 58 expands. Through such movements, it is possible to cover upper opening Pb of ceiling 55 while following the movement of processing unit 25 in the X-axis direction.

[0052] 3, a pair of rails 62 extending in the X-axis direction are formed on both edges of upper opening Pb of ceiling 55. Each of the pair of rails 62 is plate-shaped with a flat upper surface, and the lower surfaces of both edges of central plate 57, first bellows 58, and second bellows 59 are supported so as to be slidable in the X-axis direction along the upper surfaces of the pair of rails 62.

[0053] A pair of fitting portions 63 extending in the Z-axis direction are formed on both edges of the side opening Pa of the side plate 53. As shown enlarged in FIGS. 3 and 4, each fitting portion 63 has a groove 631 that opens to the +X direction side and extends in the Z-axis direction. The upper end of the fitting portion 63 is located directly below the end of the rail 62 on the +X direction side. The lower end of the fitting portion 63 is located near the lower end of the side plate 53.

[0054] The side panel 53 is equipped with an opening / closing door 64 having a first bellows 58 connected to its upper portion, and a hinge 65 disposed at the bottom of the opening / closing door 64. The opening / closing door 64 has an area and shape that closes the side opening Pa. The hinge 65 supports the opening / closing door 64 so that it can rotate about an axis extending in the Y-axis direction, and the opening / closing door 64 is connected via the hinge 65 so that it can open and close. FIG. 2 shows the opening / closing door 64 in a closed state, and FIG. 3 shows the opening / closing door 64 in a state where it is opened outward. In the closed state, the opening / closing door 64 stands upright in the Z-axis direction and closes the side opening Pa. In the open state, the opening / closing door 64 leans horizontally and exposes the side opening Pa.

[0055] The door 64 has a pair of fitting portions 66 on both edges in the Y-axis direction. As shown in Fig. 4, each fitting portion 66 is plate-shaped and protrudes toward the -X direction when the door 64 is closed. When the door 64 is closed, the fitting portion 66 enters the groove 631 and fits into the fitting portion 63. The labyrinth structure formed by the fitting portions 63 and 66 fitting together in this manner prevents machining waste and machining fluid inside the storage space S from passing through both sides of the side opening Pa, preventing dirt from scattering to the outside.

[0056] A structure may be adopted in which an elastically deformable sealing member is disposed inside groove 631, and fitting portion 66 entering groove 631 presses and deforms the sealing member. The sealing member can improve the airtightness when fitting portion 63 and fitting portion 66 are fitted together.

[0057] A holder for holding the opening / closing door 64 in a closed state may be provided. As shown in FIG. 2, the side plate 53 has fixed wall portions that connect to the side plates 51 and 52 on the sides (the +Y direction side and the -Y direction side) of the opening / closing door 64 in a closed state. A holder for holding the opening / closing door 64 in a closed state can be installed on the fixed wall portion of the side plate 53. The holder can be configured, for example, with a magnet, an engaging portion such as a hook, or a fitting portion such as a snap-fit ​​button. When a holder is provided, the opening / closing door 64 is opened after the holding by the holder is released.

[0058] An upper portion of the opening / closing door 64 is connected to the first bellows 58 via a hinge 67. A connecting plate 582 connected to the opening / closing door 64 via the hinge 67 is provided on the end of the first bellows 58 opposite to the end having the connecting plate 581. The hinge 67 connects the connecting plate 582 to the opening / closing door 64 so that the connecting plate 582 is rotatable about an axis extending in the Y-axis direction. When the opening / closing door 64 opens or closes, the connecting plate 582 moves in accordance with the movement of the opening / closing door 64. The connection structure via the hinge 67 allows the opening / closing door 64 and the first bellows 58 (connecting plate 582) to move smoothly in conjunction with each other. Note that it is also possible to configure the end portion of the flexible first bellows 58 to be directly connected to the upper portion of the opening / closing door 64 without using the hinge 67 or the connecting plate 582.

[0059] A handle 68 is provided on the outer side surface of the opening / closing door 64. An operator can hold the handle 68 to open or close the opening / closing door 64.

[0060] When the processing chamber 50 configured as described above grinds the wafers W using the processing unit 25, as shown in FIG. 2 , the ceiling 55, with the central plate 57 and the first bellows 58 connected by the detachable device 61, closes the upper opening Pb to cover the top of the storage space S, and the opening / closing door 64 closes the side opening Pa to cover the end of the storage space S on the +X direction side. This allows the processing chamber 50 to cover the entire top and side of the storage space S. The spindle 31 passes through the opening 60 of the central plate 57, and the mount 32, grinding wheel 33, and grinding stone 34 are housed inside the storage space S.

[0061] When the horizontal movement mechanism 27 moves the machining unit 25 in the X-axis direction while the machining chamber 50 is in use as shown in FIG. 2 , a moving force is applied from the spindle 31 to the center plate 57, and the center plate 57 moves in the X-axis direction together with the spindle 31 along the rails 62. As the center plate 57 moves, one of the first bellows 58 and the second bellows 59 expands and the other contracts along the rails 62, maintaining the ceiling 55 covering the entire upper part of the storage space S. The labyrinth structure formed by the engagement of the fittings 63 and 66 provides a sealing effect on both sides of the closed opening / closing door 64 in the Y-axis direction. Therefore, the entire storage space S is covered by the machining chamber 50, preventing chips generated during grinding and machining fluid supplied during grinding from scattering from the inside to the outside of the storage space S.

[0062] 4, the groove 631 of the fitting portion 63 and the fitting portion 66 have a cross-sectional shape that allows the fitting portion 66 to move into and out of the groove 631 as the opening and closing door 64 rotates around the hinge 65. In other words, the fitting portion 63 and the fitting portion 66 are set to a shape that does not interfere with the rotation of the opening and closing door 64 around the hinge 65.

[0063] When performing maintenance on the processing unit 25, the connection between the central plate 57 and the first bellows 58 is released by the detachable tool 61, as shown in Figure 3, and then the door 64 is opened outward in the +X direction by rotating it about the hinge 65. By gripping the handle 68, the worker can easily open the door 64 outward.

[0064] When opening door 64 outward, fitting portions 66 on both sides in the Y-axis direction are released from grooves 631 of fitting portions 63. Furthermore, first bellows 58, which is connected to opening door 64 via hinge 67, moves in the +X direction along pair of rails 62 following the movement of the upper end of opening door 64. When connecting plate 581 of first bellows 58 reaches the end of rail 62 on the +X direction side, support of first bellows 58 by rail 62 is released, and first bellows 58 can be placed in a state where it overlaps the back side of opening door 64 that is open outward, as shown in FIG. 3 . More specifically, by contracting first bellows 58 and shortening the distance between connecting plate 581 and connecting plate 582 in the X-axis direction, the area of ​​first bellows 58 in the horizontal direction becomes approximately the same as the area of ​​opening door 64, and first bellows 58 can be accommodated in a space-efficient manner behind opening door 64.

[0065] 2 to the maintenance state shown in FIG. 3 can be easily performed by disconnecting the attachment / detachment tool 61 from the first bellows 58, rotating the door 64 outward around the hinge 65, and placing the retracted first bellows 58 on the back (inside) of the open door 64. Opening the door 64 and the first bellows 58 widens the side opening Pa and the top opening Pb, facilitating access to the interior of the storage space S. This facilitates the replacement of the grinding wheel 33 and the grinding stone 34, improving workability. In particular, by not only opening the door 64 on the side panel 53 but also removing the first bellows 58 connected to the door 64, and moving the processing unit 25 in the +X direction, a large opening is formed in the ceiling 55 connected to the side of the processing chamber 50, making it extremely easy to replace the grinding wheel 33 and the grinding stone 34.

[0066] Furthermore, by opening the door 64 and removing the first bellows 58 to open the side opening Pa and the upper opening Pb, the replacement work of the chuck table 21 in the processing position can be facilitated. The chuck table 21 can also be replaced while positioned at the load / unload position outside the processing chamber 50, but for maintenance of the chuck table 21 positioned at the processing position, a configuration of the processing chamber 50 that widely opens the side opening Pa and the upper opening Pb is useful for improving workability.

[0067] 3, when the opening / closing door 64 is open, the fitting portions 66 are oriented to protrude in the +Z direction, and the first bellows 58 is housed between the pair of fitting portions 66. The pair of fitting portions 66 function as side walls, thereby preventing the machining fluid adhering to the underside of the first bellows 58 from flowing out to the side of the opening / closing door 64.

[0068] After the replacement of the grinding wheel 33 and the grinding stone 34 and the replacement of the chuck table 21 at the processing position are completed, the open / close door 64 is closed and the detachable tool 61 is connected to the first bellows 58, returning the processing chamber 50 to the use state shown in Fig. 2. The operation of changing from the maintenance state shown in Fig. 3 to the use state shown in Fig. 2 can be performed by a simple process of rotating the open / close door 64 inward around the hinge 65 while lifting the first bellows 58, and connecting the detachable tool 61 to the first bellows 58.

[0069] According to the structure in which the door 64 rotates via the hinge 65 disposed at the bottom, the upper portion of the door 64, to which the connecting plate 582 of the first bellows 58 is connected, moves in an arc-shaped trajectory centered on the hinge 65. Therefore, the door 64 can be opened and closed smoothly without applying an excessive load to the first bellows 58. Furthermore, since the door 64 opens and closes without protruding above the ceiling 55 of the processing chamber 50, the door 64 can be opened and closed without any problems even in a situation where the space above the processing chamber 50 is limited. Furthermore, when the door 64 is open as shown in FIG. 3 , the door 64 and the first bellows 58 remain connected to the processing chamber 50 via the hinge 65. This eliminates the need to secure a storage space for the door 64 and the first bellows 58, and also eliminates the risk of losing the door 64 and the first bellows 58.

[0070] Next, a processing apparatus 2 of a second embodiment will be described with reference to Figures 5 and 6. Figure 5 shows the overall structure of the processing apparatus 2. Figure 6 shows a processing chamber 70 provided in the processing apparatus 2. In the processing apparatus 2, structures common to the processing apparatus 1 of the first embodiment are indicated by the same reference numerals, and descriptions thereof will be omitted. Although there are some differences in the drawings between the processing apparatus 1 and the processing apparatus 2, parts that function substantially in the same way will be indicated by the same reference numerals. Specifically, this applies to the lifting mechanism 28.

[0071] The processing device 2 is provided with a horizontal movement mechanism 69 on the second base 11. The horizontal movement mechanism 69 is provided with a pair of guide rails 691 disposed on either side of the turntable 20 in the X-axis direction and extending in the Y-axis direction, a Y-axis movement table 692 supported so as to be movable in the Y-axis direction via the pair of guide rails 691, a ball screw 693 extending in the Y-axis direction and screwed into a screw-fitting portion (not shown) of the Y-axis movement table 692, and a motor 694 that rotates the ball screw 693. When the ball screw 693 is rotated by driving the motor 694, the Y-axis movement table 692 moves in the Y-axis direction.

[0072] The Y-axis moving table 692 has a gate-like shape that straddles the upper part of the processing chamber 70 between a pair of guide rails 691, and the processing chamber 70 is disposed inside a recess 695 provided in the lower part of the Y-axis moving table 692. The processing chamber 70 is longer in the Y-axis direction than the Y-axis moving table 692, and when the horizontal movement mechanism 69 moves the Y-axis moving table 692 in the Y-axis direction, the Y-axis moving table 692 changes its position in the Y-axis direction relative to the outer surface of the processing chamber 70.

[0073] The lifting mechanism 28 is disposed on the surface of the Y-axis moving table 692 on the -Y direction side, and when the ball screw 283 is rotated by the drive of the motor 284, the lifting table 282 is moved up and down in the Z-axis direction along the pair of guide rails 281. The processing unit 25 is supported on the lifting table 282 via the housing 29.

[0074] The processing chamber 70 in the processing device 2 is a box-shaped structure that covers a portion of the upper surface of the second base 11, and accommodates the chuck table 21 positioned at the processing position and the grinding wheel 33 and grinding stone 34, which are processing tools in the processing unit 25.

[0075] 6, the processing chamber 70 includes side plates 71 and 72 located on both sides in the Y-axis direction, side plates 73 and 74 located on both sides in the X-axis direction, and a ceiling 75 covering the upper part in the Z-axis direction. The side plates 71, 72, 73, and 74 protrude from the upper surface of the second base 11 at approximately the same height in the +Z direction, and the upper ends of these side plates are connected by the ceiling 75 to form the box-shaped processing chamber 70. An accommodation space S is formed inside the processing chamber 70.

[0076] 5, the processing chamber 70 is disposed above a portion of the turntable 20, the chuck table 21 positioned at the processing position is located inside the processing chamber 70, and the chuck table 21 positioned at the load / unload position is located outside the processing chamber 70. A notch 76 through which the chuck table 21 can pass is formed in the side plate 71 on the -Y direction side of the processing chamber 70. As the turntable 20 rotates, the two chuck tables 21 pass through the notches 76 to enter and exit the storage space S. Note that instead of providing the notches 76, the side plate 71 may be entirely removed, and the entire side surface of the processing chamber 70 on the -Y direction side may be open.

[0077] 6, a side opening Qa and an upper opening Qb that connect the storage space S to the outside are formed in the middle of the side plate 72 and the ceiling 75 in the X-axis direction. The side opening Qa extends in the Z-axis direction so as to cut vertically through the side plate 72. The upper opening Qb extends horizontally so as to cut across the ceiling 75 in the Y-axis direction.

[0078] The side opening Qa of the side plate 72 is covered by an openable / closable door 84. The upper opening Qb of the ceiling 75 is covered by a central plate 77 and two bellows members, a first bellows 78 and a second bellows 79, which are arranged on both ends of the central plate 77 in the Y-axis direction.

[0079] A circular opening 80 is formed in the central plate 77 to allow the spindle 31 of the processing unit 25 to pass through. The first bellows 78 and the second bellows 79 are made of a flexible material such as rubber, and can expand and contract horizontally to change the length in the Y-axis direction.

[0080] The central plate 77 is made up of a first central plate 771 disposed on the +Y direction side and a second central plate 772 disposed on the -Y direction side. The first central plate 771 and the second central plate 772 can be separated in the Y axis direction and are detachably connected by a connecting portion 81. Figure 6 shows a state in which the connection by the connecting portion 81 has been released and the first central plate 771 and the second central plate 772 have been separated.

[0081] A semicircular cutout is formed in each of the opposing portions of the first central plate 771 and the second central plate 772, and when the first central plate 771 and the second central plate 772 are connected by the connecting portion 81, these semicircular cutouts join together to form a circular opening 80. When the first central plate 771 and the second central plate 772 are separated, the opening 80 is divided into two.

[0082] The second central plate 772 is provided with a pair of connecting portions 81 on both sides of the opening 80 in the X-axis direction. The connecting portions 81 are composed of a magnet, an engaging portion such as a hook, a fitting portion such as a snap-fit ​​button, or the like. A first bellows 78 is connected to the end of the first central plate 771 on the +Y direction side, and a second bellows 79 is connected to the end of the second central plate 772 on the -Y direction side. When the first central plate 771 and the second central plate 772 are connected via the connecting portions 81, the central plate 77, the first bellows 78, and the second bellows 79 are connected to cover the upper opening Qb of the ceiling 75.

[0083] A pair of rails 82 extending in the Y-axis direction are formed on both edges of the upper opening Qb of the ceiling 75. The pair of rails 82 are plate-shaped with flat upper surfaces, and the lower surfaces of both edges of the central plate 77, the first bellows 78, and the second bellows 79 are supported so as to be slidable in the Y-axis direction along the upper surfaces of the pair of rails 82.

[0084] A pair of fitting portions 83 extending in the Z-axis direction are formed on both edges of the side opening Qa of the side plate 72. Each fitting portion 83 has a groove 831 that opens on the +Y direction side and extends in the Z-axis direction. The upper end of the fitting portion 83 is located directly below the end of the rail 82 on the +Y direction side. The lower end of the fitting portion 83 is located near the lower end of the side plate 73.

[0085] The side plate 73 includes an opening / closing door 84 having a first bellows 78 connected to its upper part, and a hinge 85 disposed below the opening / closing door 84. The hinge 85 supports the opening / closing door 84 so that it can rotate about an axis extending in the X-axis direction, and the opening / closing door 84 is connected to the side plate 73 via the hinge 85 so that it can be opened and closed. Figure 6 shows the opening / closing door 84 when it is opened outward.

[0086] The door 84 has a pair of fitting portions 86 on both edges in the X-axis direction. When the door 84 is closed, the fitting portions 86 enter the grooves 831 of the fitting portion 83. The labyrinth structure formed by the fitting portions 83 and 86 fitting together prevents machining debris and machining fluid inside the storage space S from passing through both sides of the side opening Qa, preventing dirt from scattering to the outside. To improve airtightness, an elastically deformable seal member may be placed inside the groove 831, and the fitting portion 86 entering the groove 831 may press and deform the seal member.

[0087] A holder may be provided to hold the opening / closing door 84 in a closed state. As shown in Fig. 6, the side plate 72 has fixed wall portions that connect to the side plates 73 and 74 on the sides (+X direction side and -X direction side) of the opening / closing door 84. A holder such as a magnet, an engaging portion such as a hook, or a fitting portion such as a snap-fit ​​button can be installed on the fixed wall portion of the side plate 72.

[0088] An upper portion of the opening / closing door 84 is connected to the first bellows 78 via a hinge 87. The hinge 87 connects the first bellows 78 and the opening / closing door 84 so that the first bellows 78 and the opening / closing door 84 can rotate about an axis extending in the X-axis direction. When the opening / closing door 84 is opened or closed, the first bellows 78 moves following the movement of the opening / closing door 84. Note that the end portion of the first bellows 78 may be directly connected to the upper portion of the opening / closing door 84 without using the hinge 87.

[0089] A handle 88 is provided on the outer side surface of the opening / closing door 84. An operator can hold the handle 88 to open or close the opening / closing door 84.

[0090] When the processing chamber 70 configured as described above grinds the wafers W using the processing unit 25, the first central plate 771 and the second central plate 772 are connected by the connecting portion 81 to form the integrated central plate 77, and the ceiling 75 closes the upper opening Qb to cover the top of the storage space S, and the opening / closing door 84 is closed to close the side opening Qa and cover the end of the storage space S on the +Y direction side. This allows the processing chamber 70 to completely cover the top and side of the storage space S. The spindle 31 passes through the opening 80 of the central plate 77, and the mount 32, grinding wheel 33, and grinding stone 34 are housed inside the storage space S.

[0091] When the horizontal movement mechanism 69 moves the processing unit 25 in the Y-axis direction during grinding of the wafer W using the processing unit 25, a moving force is applied from the spindle 31 to the center plate 77, causing the center plate 77 to move in the Y-axis direction together with the spindle 31 along the rails 82. As the center plate 77 moves, one of the first bellows 78 and the second bellows 79 expands and the other contracts along the rails 82, maintaining a state in which the ceiling 75 covers the entire upper part of the storage space S. The labyrinth structure formed by the engagement of the fitting portions 83 and 86 provides a sealing effect on both sides of the closed opening / closing door 84 in the X-axis direction. Therefore, the entire storage space S is covered by the processing chamber 70, preventing processing debris and processing fluid from scattering from the inside of the storage space S to the outside.

[0092] When performing maintenance on the processing unit 25, as shown in FIG. 6 , the connection between the first central plate 771 and the second central plate 772 by the connection portion 81 is released, and then the opening / closing door 84 is opened outward in the +Y direction by rotating it about the hinge 85. When the opening / closing door 84 is opened outward, the fitting portion 86 disengages from the groove 831 of the fitting portion 83. Furthermore, the first central plate 771 and the first bellows 78 move in the +Y direction along the pair of rails 82 in response to the movement of the upper end of the opening / closing door 84. When the first central plate 771 reaches the end of the rails 82 on the +Y direction side, the support of the first central plate 771 and the first bellows 78 by the rails 82 is released, and the first bellows 78 can be placed behind the outwardly opened opening of the opening / closing door 84, as shown in FIG. 6 .

[0093] 6 can be changed from the usage state (not shown) to the maintenance state in Fig. 6 by a simple process of disconnecting the first central plate 771 and the second central plate 772, rotating the opening / closing door 84 outward around the hinge 85, and placing the retracted first bellows 78 on the back side of the open opening / closing door 84. Then, by opening the opening / closing door 84 so that the first central plate 771 and the first bellows 78 do not cover the storage space S, the side opening Qa and the upper opening Qb are opened widely, making it easier to access the inside of the storage space S. This facilitates the replacement of the grinding wheel 33 and the grinding stone 34, improving workability. In particular, by not only opening the opening / closing door 84 provided on the side plate 72 but also removing the first bellows 78 connected to the opening / closing door 84 and the first central plate 771 connected to the first bellows 78, a large opening is formed in the portion of the ceiling 75 connected to the side of the processing chamber 70, making it extremely easy to replace the grinding wheel 33 and the grinding stone 34. Furthermore, by opening the opening / closing door 84 and removing the first bellows 78 and the first central plate 771 to open the side opening Qa and the upper opening Qb, the replacement work of the chuck table 21 in the processing position also becomes easy.

[0094] In the machining chamber 70, in the maintenance state, the first bellows 78 and the first central plate 771 no longer cover the upper opening Qb, further improving accessibility to the interior of the storage space S. Furthermore, by removing the first central plate 771 from the ceiling 75, the opening 80 is half-opened, improving accessibility to the area around the spindle 31. For example, with the first central plate 771 removed as shown in FIG. 6 , the horizontal movement mechanism 69 can be used to move the machining unit 25 in the +Y direction to move the spindle 31 away from the opening 80 of the second central plate 772, allowing the grinding wheel 33 and the grinding stone 34 to be replaced in a position that is not covered by the second central plate 772.

[0095] As shown in Figure 6, when the opening / closing door 84 is open, the first bellows 78 is housed between a pair of fitting portions 86 that are oriented to protrude in the +Z direction, and the pair of fitting portions 86 prevent the machining fluid adhering to the underside of the first bellows 78 from flowing out to the side.

[0096] After the replacement of the grinding wheel 33 and the grinding stone 34 and the replacement of the chuck table 21 at the processing position are completed, the opening / closing door 84 is closed and the connection part 81 is connected to the first central plate 771 to return to the usage state. The operation of changing from the maintenance state of FIG. 6 to the usage state can be performed by a simple work process in which the opening / closing door 84 is rotated inward around the hinge 85 while lifting the first central plate 771 and the first bellows 78, and the connection part 81 is connected to the first central plate 771.

[0097] 6, the opening and closing door 84, which opens and closes by rotating via hinge 85, maintains a state in which the opening and closing door 84, first bellows 78, and first central plate 771 are connected to the processing chamber 70, so there is no need to secure a storage space for these components, and there is no risk of these components being lost. Furthermore, the opening and closing operation by rotating the opening and closing door 84 can move the first bellows 78 and first central plate 771 connected to the opening and closing door 84 smoothly with little movement.

[0098] Next, a processing chamber 90 provided in a processing apparatus of a third embodiment will be described with reference to Figures 7 and 8. Figure 7 shows the processing chamber 90 in use, and Figure 8 shows the processing chamber 90 in a maintenance state. The processing apparatus of the third embodiment has parts in common with the processing apparatus 1 of the first embodiment shown in Figure 1 except for the processing chamber 90, and therefore illustration and description of the entire processing apparatus will be omitted. Furthermore, the processing chamber 90 has a configuration in common with the processing chamber 50 of the first embodiment, except for the central plate 91 that constitutes the ceiling 55, and the common parts will be denoted by the same reference numerals as the processing chamber 50, and description thereof will be omitted.

[0099] The central plate 91 of the processing chamber 90 is composed of a first central plate 911 disposed on the +X direction side and a second central plate 912 disposed on the -X direction side. The first central plate 911 and the second central plate 912 are separable in the X-axis direction and are detachably connected by a pair of connectors 92. Semicircular cutouts are formed in the opposing portions of the first central plate 911 and the second central plate 912, respectively. When the first central plate 911 and the second central plate 912 are connected by the connectors 92, these semicircular cutouts connect to form a circular opening 93 (see FIG. 7). The pair of connectors 92 are disposed on both sides (the +Y direction side and the -Y direction side) of the opening 93. When the connection by the connectors 92 is released to separate the first central plate 911 and the second central plate 912, the opening 93 is divided into two (see FIG. 8).

[0100] When grinding the wafer W using the processing unit 25, the first central plate 911 and the second central plate 912 are connected at the connection portion 92, and the opening / closing door 64 is closed to place the processing chamber 90 in the use state shown in Figure 7.

[0101] When performing maintenance such as replacing the grinding wheel 33 and grinding stone 34 or the chuck table 21, as shown in FIG. 8 , the first central plate 911 and the second central plate 912 are disconnected by the connecting portion 92, and the openable door 64 is then rotated about the hinge 65 to open outward. This opens the side opening Pa and the top opening Pb. In the maintenance state of the machining chamber 90, the first central plate 911 and the first bellows 58 no longer cover the top opening Qb, improving the ease of maintenance. In particular, by making the central plate 91 separable into the first central plate 911 and the second central plate 912 and opening the first central plate 911 together with the first bellows 58, the same ease of maintenance as in the machining chamber 70 of the second embodiment can be achieved.

[0102] As described above, in the processing apparatus of each embodiment, in a processing chamber with a bellows on the top plate, an opening / closing door with a bellows connected to the top is provided on a side plate, and by opening the side plate outward, the bellows does not cover the opening in the top plate. This forms a large opening in the ceiling portion connected to the side of the processing chamber, making it easy to replace processing tools and chuck tables placed in the processing chamber.

[0103] Although the processing apparatus in each embodiment is an example applied to a grinding apparatus, the present invention is not limited to this and can be applied to processing apparatuses that perform different processes such as polishing. In a polishing apparatus, the efficiency of replacing the chuck table and polishing pad can be improved, and in a tool cutting apparatus, the efficiency of replacing the chuck table and cutting tool can be improved.

[0104] It is also possible to improve the efficiency of maintenance work such as replacing and adjusting units placed in the processing chamber. The units placed in the processing chamber include a thickness gauge that measures the thickness of the wafer held on the chuck table, a grinding water nozzle that supplies grinding water to the grinding wheel, a dressing unit that dresses the polishing surface of the polishing pad, and a setup unit that moves above the chuck table when storing the positional relationship between the grinding wheel or cutting tool and the chuck table.

[0105] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0106] As described above, according to the processing apparatus of the present invention, by opening the door and making the bellows connected to the top of the door not cover the ceiling, large openings are formed on the sides and top of the processing chamber, making it easy to replace the chuck table and processing tools, and significantly improving the efficiency of maintenance work. [Explanation of symbols]

[0107] 1: Processing equipment 2: Processing equipment 10: First Foundation 11: The second foundation 12: Cassette Stage 13: Cassette 14: Temporary table 15: Cleaning section 19: Transport robot 20: Turntable 21: Chuck table 25: Processing unit 27: Horizontal movement mechanism 28: Lifting mechanism 31: Spindle 32: Mount 33: Grinding wheel (processing tool) 34: Grinding wheel (processing tool) 35:Transport mechanism 50: Processing room 51: Side panel 52: Side panel 53: Side panel 54: Side panel 55: Ceiling 57: Central plate 58: First bellows 59: Second bellows 60:Aperture 61: Detachment tool 62: Rail 63: Fitting part 631: Groove 64: Opening and closing door 65: Hinge 66: Fitting part 67: Hinge 69: Horizontal movement mechanism 70: Processing room 71: Side panel 72: Side panel 73: Side panel 74: Side panel 75: Ceiling 77: Central plate 771: 1st center plate 772: 2nd center plate 78: First bellows 79: Second bellows 80:Aperture 81: Connection part 82: Rail 83: Fitting part 831: Groove 84: Opening and closing door 85: Hinge 86: Fitting part 87: Hinge 90: Processing room 91: Center plate 911: 1st center plate 912: 2nd center plate 92: Connection part 93 :Aperture Pa: Side opening Pb: Upper opening Qa: Side opening Qb: Upper opening S: Storage space W: Wafer (workpiece)

Claims

1. A processing device comprising: a chuck table for holding a workpiece; a processing unit for processing the workpiece held on the chuck table with a processing tool disposed at the tip of a spindle; a horizontal movement mechanism for moving the processing unit in a horizontal direction; and a processing chamber for accommodating the chuck table and the processing tool, the ceiling of the processing chamber comprises a central plate having an opening through which the spindle passes, and two bellows that are arranged on both ends of the central plate in the horizontal movement direction of the processing unit by the horizontal movement mechanism and expand and contract in the horizontal direction, a detachment tool for attaching and detaching the center plate and the bellows, The side panel of the processing chamber includes an opening / closing door having the bellows connected to an upper portion thereof, and a hinge disposed at a lower portion of the opening / closing door so as to open the opening / closing door outward.

2. A processing device comprising: a chuck table for holding a workpiece; a processing unit for processing the workpiece held on the chuck table with a processing tool disposed at the tip of a spindle; a horizontal movement mechanism for moving the processing unit in a horizontal direction; and a processing chamber for accommodating the chuck table and the processing tool, the ceiling of the processing chamber comprises a central plate having an opening through which the spindle passes, and two bellows that are arranged on both ends of the central plate in the horizontal movement direction of the processing unit by the horizontal movement mechanism and expand and contract in the horizontal direction, the central plate includes a first central plate and a second central plate that divide the opening into two, and a connecting portion that connects the first central plate and the second central plate; The side panel of the processing chamber includes an opening / closing door having the bellows connected to an upper portion thereof, and a hinge disposed at a lower portion of the opening / closing door so as to open the opening / closing door outward.

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