Vehicular light emitting module, vehicular illuminating device, and manufacturing method for vehicular light emitting module

Abstract

To provide a vehicular light emitting module in which a reflection part can be formed on a region of a board located inside a frame part without impairing the functions of the frame part, a vehicular illuminating device, and a manufacturing method for the vehicular light emitting module.SOLUTION: A vehicular light emitting module according to an embodiment comprises: a board; a light emitting element provided on the side of one surface of the board; a frame part having a frame shape, and surrounding the light emitting element; and a reflection part having a film shape, provided on a region of the board located inside the frame part, and between the board and the frame part, and whose reflectance with respect to light applied from the light emitting element is higher than that of the board.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD Embodiments of the present invention relate to a light emitting module for a vehicle, a vehicle lighting device, and a method for manufacturing a light emitting module for a vehicle. [Background technology]

[0002] From the viewpoint of energy saving and long life, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming more and more popular, replacing vehicle lighting devices equipped with lamps having filaments, etc. Such vehicle lighting devices include a socket and a light emitting module provided on one end side of the socket.

[0003] The light-emitting module includes, for example, a substrate, a chip-shaped light-emitting element provided on the substrate, and a frame provided on the substrate and surrounding the chip-shaped light-emitting element. Light emitted from the chip-shaped light-emitting element and incident on the inner wall of the frame is reflected by the inner wall of the frame and emitted toward the front side of the vehicle lighting device. Therefore, if the frame is provided, the light extraction efficiency from the vehicle lighting device (light-emitting module) can be improved.

[0004] In recent years, there has been a demand for further improvement in the light extraction efficiency from vehicle lighting devices (light-emitting modules) in order to achieve higher luminous flux, etc. Here, a portion of the light emitted from the chip-shaped light-emitting element is directed toward an area of ​​the substrate located inside the frame portion. Therefore, if the light directed toward the area of ​​the substrate located inside the frame portion is reflected, the light extraction efficiency from the vehicle lighting device (light-emitting module) can be further improved.

[0005] For example, if a film-like reflective portion is provided in an area of ​​the substrate located inside the frame, the reflectance of light directed toward that area can be improved. For example, if a supplying device such as a dispenser is used to supply a resin with high reflectance to the area of ​​the substrate located inside the frame, a reflective portion can be formed in that area.

[0006] However, doing so may cause interference between the nozzle of a supply device such as a dispenser and the inner wall of the frame. Interference between the nozzle and the inner wall of the frame may cause deformation or damage to the frame, potentially impairing its functionality. In this case, supplying resin or the like while leaving a predetermined gap between the nozzle and the inner wall of the frame can prevent interference between the nozzle and the inner wall of the frame. However, doing so may result in areas near the inner wall of the frame where no reflective portion is formed.

[0007] Therefore, there has been a demand for the development of a technique that allows a reflecting portion to be formed in the region of the substrate that is located inside the frame portion without impairing the function of the frame portion. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-247061 Summary of the Invention [Problem to be solved by the invention]

[0009] The problem that the present invention aims to solve is to provide a vehicle light-emitting module, a vehicle lighting device, and a method for manufacturing a vehicle light-emitting module that can form a reflective portion in an area of ​​a substrate that is located inside a frame portion without impairing the function of the frame portion. [Means for solving the problem]

[0010] The vehicle light-emitting module according to the embodiment comprises a substrate; a light-emitting element provided on one side of the substrate; a frame-shaped frame portion surrounding the light-emitting element; and a film-shaped region of the substrate located inside the frame portion, and a reflective portion provided between the substrate and the frame portion, the reflective portion having a higher reflectivity for light irradiated from the light-emitting element than the substrate. [Effects of the Invention]

[0011] According to an embodiment of the present invention, it is possible to provide a vehicle light-emitting module, a vehicle lighting device, and a method for manufacturing a vehicle light-emitting module that can form a reflective portion in an area of ​​a substrate that is located inside a frame portion without impairing the function of the frame portion. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic perspective view illustrating a vehicle lighting device; [Figure 2] 10A and 10B are schematic cross-sectional views illustrating the steps of a method for forming a reflecting portion according to a comparative example. [Figure 3] 10(a) to 10(c) are schematic cross-sectional views illustrating the steps of the method for forming a reflecting portion according to the present embodiment. [Figure 4] 10A and 10B are schematic cross-sectional views illustrating the steps of a method for forming a reflecting portion according to another embodiment. [Figure 5] FIG. 2 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments will be illustrated with reference to the drawings. In each drawing, like components are designated by like reference numerals and detailed descriptions thereof will be omitted where appropriate.

[0014] A vehicle lighting device 1 including a vehicle light emitting module 20 according to this embodiment (hereinafter simply referred to as the light emitting module 20) can be installed in, for example, an automobile or a railway vehicle. Examples of the vehicle lighting device 1 installed in an automobile include those used as front combination lights (for example, an appropriate combination of daytime running lamps (DRLs), position lamps, turn signal lamps, etc.) and rear combination lights (for example, an appropriate combination of stop lamps, tail lamps, turn signal lamps, backup lamps, fog lamps, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0015] FIG. 1 is a schematic perspective view illustrating a vehicle lighting device 1. As shown in FIG. As shown in FIG. 1, a vehicle lighting device 1 includes, for example, a socket 10, a light-emitting module 20, a power supply unit 30, and a heat transfer unit 40.

[0016] The socket 10 includes, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

[0017] The bayonet 12 is provided, for example, on the side surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used, for example, when mounting the vehicle lighting device 1 to a housing 101 of a vehicle lamp 100, which will be described later. The bayonet 12 can be used for a twist lock.

[0018] The flange 13 has, for example, a disk shape. A side surface of the flange 13 is located outward of the side surface of the bayonet 12 from the vehicle lighting device 1.

[0019] The heat dissipation fin 14 is provided on the opposite side of the flange 13 from the mounting portion 11 side. At least one heat dissipation fin 14 can be provided. For example, as shown in FIG. 1, the socket 10 can be provided with multiple heat dissipation fins 14. The multiple heat dissipation fins 14 can be arranged side by side in a predetermined direction. The heat dissipation fin 14 has, for example, a plate or cylindrical shape.

[0020] The connector holder 15 is provided on the opposite side of the flange 13 from the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 is cylindrical, and a connector 105 having a seal member 105a therein is inserted into the connector holder 15.

[0021] The socket 10 has the function of holding the light-emitting module 20 and the power supply unit 30, and the function of conducting heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably made of a material with high thermal conductivity. The socket 10 can be made of a metal such as an aluminum alloy, for example.

[0022] The socket 10 can also be made of a highly thermally conductive resin, such as a resin such as PET (Polyethylene terephthalate) or nylon, mixed with a filler such as carbon or aluminum oxide.

[0023] The light emitting module 20 (substrate 21) is provided on one end side of the socket 10. The light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, a circuit element 25, and a reflecting portion 26.

[0024] The substrate 21 has a plate-like shape. The planar shape of the substrate 21 (the shape when viewed from a direction along the central axis 1a of the vehicle lighting device 1) is, for example, substantially rectangular. The substrate 21 is formed from, for example, an inorganic material such as ceramics (e.g., aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is covered with an insulating material. The substrate 21 may have a single-layer structure or a multi-layer structure.

[0025] Furthermore, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is formed, for example, from a material containing silver as a main component or a material containing copper as a main component. A covering portion can also be provided to cover the wiring pattern 21a and a film resistor, which will be described later. The covering portion can include, for example, a glass material.

[0026] The light-emitting element 22 is provided on one surface of the substrate 21. The light-emitting element 22 is electrically connected to the wiring pattern 21a. At least one light-emitting element 22 can be provided. When a plurality of light-emitting elements 22 are provided, the plurality of light-emitting elements 22 can be connected in series. The number and arrangement of the light-emitting elements 22 can be changed as appropriate depending on the required total luminous flux, luminance distribution, etc.

[0027] The light emitting element 22 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.

[0028] The light emitting element 22 may be a chip-shaped light emitting element. If the light emitting element 22 is a chip-shaped light emitting element, the light emitting module 20 can be made smaller, and therefore the vehicle lighting device 1 can be made smaller.

[0029] The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21a by, for example, COB (Chip On Board). The chip-shaped light-emitting element 22 may be any of an upper electrode type light-emitting element, a top and bottom electrode type light-emitting element, and a flip chip type light-emitting element.

[0030] The frame portion 23 is provided on the substrate 21 via the reflecting portion 26. For example, the frame portion 23 can be adhered onto the reflecting portion 26 or formed integrally with the reflecting portion 26. The frame portion 23 has a frame shape and surrounds the light-emitting element 22. The frame portion 23 has, for example, a function of defining the formation area of ​​the sealing portion 24 and a function of a reflector. The outline of the planar shape of the frame portion 23 can be, for example, a rectangle or a circle. The outline of the planar shape of the frame portion 23 illustrated in FIG. 1 is a rectangle. The outline of the planar shape of the frame portion 23 can be changed as appropriate depending on the required luminance distribution, etc.

[0031] When the frame portion 23 is adhered onto the reflecting portion 26, the frame portion 23 can be molded by, for example, injection molding. In this case, the frame portion 23 can be formed from, for example, a thermoplastic resin. Examples of the thermoplastic resin include PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), and PS (polystyrene).

[0032] When the frame portion 23 is formed integrally with the reflecting portion 26, the frame portion 23 and the reflecting portion 26 can be formed from the same material, or the frame portion 23 and the reflecting portion 26 can be formed from different materials.

[0033] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having light-transmitting properties. For example, the resin is a silicone resin. The resin may also contain a phosphor. For example, the resin can be filled inside the frame portion 23 using a supplying device such as a dispenser.

[0034] The circuit element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The circuit element 25 is provided on the substrate 21. The circuit element 25 is provided, for example, around the periphery of the frame portion 23 and is electrically connected to the wiring pattern 21a.

[0035] The circuit elements 25 illustrated in FIG. 1 are a protection element 25a, a resistor 25b, and a control element 25c. However, the type of circuit element 25 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to those mentioned above, the circuit element 25 may also be a capacitor, a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, an inductor, a surge absorber, a varistor, a transistor, an integrated circuit, an arithmetic element, or the like.

[0036] The protective element 25a is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from being applied from the reverse direction to the light-emitting element 22. The protective element 25a may be, for example, a diode. The protective element 25a illustrated in FIG. 1 is a surface-mounted diode.

[0037] The resistor 25b may be, for example, a surface-mount resistor, a film resistor formed by screen printing, etc. The resistor 25b illustrated in FIG. 1 is a surface-mount resistor. The resistor 25b is connected in series to the light emitting element 22. The resistor 25b is provided so that the value of the current flowing through the light emitting element 22 falls within a predetermined range.

[0038] The control element 25c is provided, for example, to switch the voltage applied to the light-emitting element 22 or to perform temperature derating. However, the functions and uses of the control element 25c are not limited to those illustrated. The control element 25c can be, for example, a transistor or an integrated circuit. The control element 25c illustrated in FIG. 1 is a surface-mount integrated circuit.

[0039] The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 . The plurality of power supply terminals 31 may be rod-shaped. One end of each of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the plurality of power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of each of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted into the plurality of power supply terminals 31 exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed of a metal such as a copper alloy, for example.

[0040] The holding portion 32 is provided to insulate the plurality of power supply terminals 31 from the conductive socket 10. If the socket 10 is formed from an insulating, highly thermally conductive resin or the like, the holding portion 32 can be omitted. The holding portion 32 can be, for example, press-fitted into a hole provided in the socket 10 or adhered to the inner wall of the hole.

[0041] The heat transfer section 40 is provided between the socket 10 and the light-emitting module 20 (substrate 21). For example, the heat transfer section 40 can be adhered to the bottom surface 11a1 of the recess 11a, attached to the bottom surface 11a1 of the recess 11a via thermally conductive grease, or molded integrally with the socket 10 using an insert molding method.

[0042] The heat transfer unit 40 is made of a material with high thermal conductivity. For example, the heat transfer unit 40 is made of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. Note that the heat transfer unit 40 can be omitted, for example, when the amount of heat generated in the light-emitting module 20 is relatively small or when the socket 10 is made of a metal.

[0043] As described above, the frame 23 functions as a reflector. For example, a portion of the light emitted from the light-emitting element 22 is reflected by the inner wall of the frame 23 and emitted toward the front side of the vehicle lighting device 1 (the side opposite to the socket 10). Therefore, if the frame 23 is provided, the light extraction efficiency from the light-emitting module 20 can be improved.

[0044] In recent years, in order to increase luminous flux and the like, it is desired to further improve the light extraction efficiency from the light emitting module 20. Here, a part of the light emitted from the light emitting element 22 may be reflected at the interface between the sealing portion 24 and the outside air or at the inner wall of the frame portion 23, and may be directed toward a region of the substrate 21 located inside the frame portion 23.

[0045] For this reason, the light-emitting module 20 according to this embodiment is provided with a reflector 26. The reflector 26 is in the form of a film, and is provided in an area of ​​the substrate 21 located inside the frame 23, and between the substrate 21 and the frame 23. The reflector 26 has a higher reflectance than the substrate 21 for light emitted from the light-emitting element 22. The reflector 26 also covers the periphery of the light-emitting element 22.

[0046] If the reflecting portion 26 is provided, light directed toward the region of the substrate 21 located inside the frame portion 23 can be reflected and emitted toward the front side of the vehicle lighting device 1. Therefore, the light extraction efficiency from the light-emitting module 20 can be further improved.

[0047] The film-like reflective portion 26 can be formed by supplying a resin with high reflectivity onto the substrate 21 using a supplying device such as a dispenser.

[0048] 2A and 2B are schematic cross-sectional views illustrating the steps of a method for forming a reflecting portion according to a comparative example. First, as shown in FIG. 2(a), the light emitting element 22 and the circuit element 25 are mounted on the wiring pattern 21a of the substrate 21. Subsequently, the frame 23 is adhered to the surface of the substrate 21 so as to surround the light emitting element 22 .

[0049] Next, as shown in FIG. 2(b), a nozzle 200 of a supply device such as a dispenser is inserted into the inside of the frame portion . Next, resin 201 (corresponding to an example of a first resin) is discharged from nozzle 200 to supply resin 201 to an area of ​​substrate 21 located inside frame portion 23. At this time, the position of nozzle 200 can be moved to increase the area to which resin 201 is supplied. Resin 201 is supplied to the area of ​​substrate 21 located inside frame 23, and is cured to form a film-like reflecting portion.

[0050] Here, when frame portion 23 is adhered to the surface of substrate 21, the position of frame portion 23 may become misaligned. If the position of frame portion 23 becomes misaligned, nozzle 200 may interfere with the inner wall of frame portion 23 when nozzle 200 is inserted inside frame portion 23 or when the position of nozzle 200 is moved inside frame portion 23. If nozzle 200 interferes with the inner wall of frame portion 23, frame portion 23 may be deformed or damaged, and the function of frame portion 23 may be impaired.

[0051] In this case, if the resin 201 is supplied with a predetermined gap between the nozzle 200 and the inner wall of the frame 23, it is possible to prevent interference between the nozzle 200 and the inner wall of the frame 23. However, doing so may result in, for example, a portion near the inner wall of the frame 23 where the reflective portion is not formed.

[0052] In this case, the position of the frame portion 23 can be detected by image processing or the like, and the position of the nozzle 200 can be corrected according to the detected position of the frame portion 23. However, doing so may increase the time required to form the reflecting portion or complicate the position control of the nozzle 200, which may increase the manufacturing cost of the light-emitting module 20.

[0053] Therefore, in the light-emitting module 20 according to the present embodiment, the reflecting section 26 is provided as follows.

[0054] 3(a) to 3(c) are schematic cross-sectional views illustrating the steps of the method for forming the reflecting portion 26 according to this embodiment. First, as shown in FIG. 3(a), the light emitting element 22 and the circuit element 25 are mounted on the wiring pattern 21a of the substrate 21. Next, resin 201 is discharged from nozzle 200 to supply resin 201 to an area of ​​substrate 21 that is to be inside frame portion 23. At this time, by moving the position of nozzle 200, the area to which resin 201 is supplied can be enlarged. For example, the area to which resin 201 is supplied can be made larger than the area where frame portion 23 is provided. The supplied resin 201 spreads over the surface of substrate 21 to form a film. The resin 201 may contain, for example, light-scattering particles, such as a silicone resin containing titanium dioxide particles.

[0055] Next, as shown in FIG. 3(b), the film-like resin 201 is cured to form a film-like reflecting portion . For example, it is possible to heat and harden the film-like resin 201. When the resin 201 is a silicone resin containing light-scattering particles, the heating temperature may be set to about 150°C to 250°C, and the heating time may be set to about 0.5 to 1.0 hours.

[0056] 3(c), the frame portion 23 is adhered onto the reflecting portion 26. As described above, when adhering the frame portion 23 onto the reflecting portion 26, it is possible to use a frame portion 23 that has been molded in advance by, for example, injection molding.

[0057] In this way, there is no interference between the nozzle 200 and the frame portion 23. Therefore, the function of the frame portion 23 is not impaired, and the reflecting portion 26 can be formed in the region of the substrate 21 located inside the frame portion 23.

[0058] Here, if the thickness of the reflective portion 26 is made too thick, the thickness of the reflective portion 26 is likely to vary greatly. If the thickness of the reflective portion 26 varies greatly, the frame portion 23 may tilt when it is bonded onto the reflective portion 26. If the frame portion 23 tilts, it may not be possible to obtain the desired light distribution characteristics.

[0059] On the other hand, if the thickness of the reflecting portion 26 is made too thin, holes or the like may be formed in the reflecting portion 26. If holes or the like are formed in the reflecting portion 26, it may not be possible to improve the efficiency of extracting light from the light-emitting module 20.

[0060] According to the knowledge of the present inventors, it is preferable that the thickness of the reflecting portion 26 is 10 μm or more and 20 μm or less, which can prevent the frame portion 23 from tilting and improve the efficiency of extracting light from the light-emitting module 20.

[0061] 4A and 4B are schematic cross-sectional views illustrating the steps of a method for forming a reflecting portion 26 according to another embodiment. First, as shown in FIG. 4(a), the light emitting element 22 and the circuit element 25 are mounted on the wiring pattern 21a of the substrate 21. Next, in the same manner as in the example illustrated in FIG. 3(a) described above, resin 201 is supplied to the region of substrate 21 that is to be inside frame portion 23a. At this time, the region to which resin 201 is supplied can be enlarged by moving the position of nozzle 200. For example, the region to which resin 201 is supplied can be made larger than the region where frame portion 23a is provided. The supplied resin 201 spreads over the surface of substrate 21 to form a film.

[0062] 4(b), a resin 202 (corresponding to an example of the second resin) is discharged from a nozzle 200a onto the film-like resin 201, and the resin 202 is supplied in a frame shape so as to surround the light-emitting element 22. For example, the nozzle 200a may be moved around the periphery of the light-emitting element 22 in a frame shape.

[0063] Resin 202 may include, for example, light scattering particles. For example, resin 202 may be the same as or different from resin 201.

[0064] When the resin 202 is the same as the resin 201, the nozzle 200 can be used instead of the nozzle 200a. That is, the same nozzle 200 can be used to supply the resin 201 for forming the reflecting portion 26 and the resin 201 for forming the frame portion 23a.

[0065] In this case, the supply of resin 201 for forming frame portion 23a can be followed by the supply of resin 201 for forming reflector 26. Furthermore, under the heating conditions described above, resin 201 for forming reflector 26 and resin 201 for forming frame portion 23a can be cured together. This reduces the time required to form reflector 26 and frame portion 23a, thereby reducing the manufacturing cost of light-emitting module 20.

[0066] When the resin 202 is different from the resin 201, for example, the viscosity of the resin 202 can be set higher than the viscosity of the resin 201. For example, if the viscosity of the resin 201 is low, the supplied resin 201 spreads more easily, making it easier to form the reflective portion 26 with less thickness variation. For example, if the viscosity of the resin 202 is high, the shape of the supplied resin 202 in a frame shape can be easily maintained, making it easier to form the frame portion 23a with the intended shape. For example, the resin 202 can be a silicone resin containing titanium dioxide particles, and the viscosity can be adjusted by an additive such as a thickener. Note that the curing conditions (heating conditions) when using the resin 202 can be determined appropriately depending on the composition of the resin 202. For example, if the resin 202 is a silicone resin containing titanium dioxide particles and the additive such as a thickener is different, the resin 202 can be cured under the heating conditions described above.

[0067] Next, the film-shaped resin 201 and the frame-shaped resin 202 are cured to integrally form the film-shaped reflecting portion 26 and the frame-shaped frame portion 23a. For example, the film-shaped resin 201 and the frame-shaped resin 202 can be heated and cured together to form the reflecting portion 26 and the frame portion 23a integrally.

[0068] 3(c), when the frame portion 23 is adhered onto the reflecting portion 26, light may leak from the inside to the outside of the frame portion 23 through the adhesive layer formed between the reflecting portion 26 and the frame portion 23. The light leaked to the outside of the frame portion 23 is difficult to irradiate onto the front side of the vehicle lighting device 1, and this reduces the utilization efficiency of the light irradiated from the light-emitting element 22.

[0069] 4(b), when the reflecting portion 26 and the frame portion 23a are integrally formed, light is less likely to leak outside the frame portion 23a. If light is less likely to leak outside the frame portion 23a, it is possible to prevent a decrease in the efficiency of use of light emitted from the light-emitting element 22. Therefore, in consideration of improving the efficiency of use of light emitted from the light-emitting element 22, and therefore the efficiency of extracting light from the light-emitting module 20, it is preferable to integrally form the reflecting portion 26 and the frame portion 23a.

[0070] As described above, the method for manufacturing the vehicle light emitting module according to this embodiment can include the following steps. A step of mounting a light emitting element 22 on a substrate 21. A process of providing a film-like reflecting portion 26 by supplying a resin 201 having a higher reflectivity for light irradiated from the light emitting element 22 than the substrate 21 to the region of the substrate 21 where the light emitting element 22 is mounted. a step of providing a frame-shaped resin 202 having a higher reflectivity for light emitted from the light emitting element 22 than the substrate 21 on the reflecting portion 26 to provide frame portions 23, 23a surrounding the light emitting element 22;

[0071] Furthermore, the film-like resin 201 and the frame-like resin 202 can be hardened together. The contents of each step can be the same as those described above, so detailed explanations will be omitted.

[0072] Next, a vehicle lamp 100 according to this embodiment will be illustrated. In one embodiment of the present invention, a vehicle lamp 100 can be provided that includes the vehicle lighting device 1. The above-mentioned description of the vehicle lighting device 1 and modified versions of the vehicle lighting device 1 (for example, versions in which a person skilled in the art appropriately adds, deletes, or modifies components, and which still have the features of the present invention) can all be applied to the vehicle lamp 100.

[0073] In the following, as an example, a case where the vehicular lamp 100 is a rear combination light installed in an automobile will be described. However, the vehicular lamp 100 is not limited to a rear combination light installed in an automobile. The vehicular lamp 100 may be any vehicular lamp that is installed in an automobile, a railroad car, or the like.

[0074] FIG. 5 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 5, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0075] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end open. The housing 101 is formed, for example, from a light-opaque resin. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the periphery of the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may also be provided on the housing 101.

[0076] When attaching the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 where the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in a fitting portion provided on the periphery of the mounting hole 101a. This type of attachment method is called a twist lock.

[0077] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have a function such as a lens.

[0078] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in FIG. 5 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 and forms a predetermined light distribution pattern.

[0079] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is made of an elastic material such as rubber or silicone resin.

[0080] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. Furthermore, the elastic force of the seal member 104 presses the bayonet 12 against the housing 101. Therefore, the vehicle lighting device 1 can be prevented from detaching from the housing 101.

[0081] The connector 105 is fitted to the ends of the plurality of power supply terminals 31 exposed inside the connector holder 15. A lighting circuit or the like provided outside the vehicle lamp 100 is electrically connected to the connector 105. Therefore, by fitting the connector 105 to the ends of the plurality of power supply terminals 31, the lighting circuit or the like can be electrically connected to the light-emitting element 22. Furthermore, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the inside of the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0082] Although several embodiments of the present invention have been described above, these embodiments are presented by way of example only and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as set forth in the claims. Furthermore, the above-described embodiments can be implemented in combination with each other.

[0083] The following are additional notes regarding the above-described embodiment.

[0084] (Appendix 1) substrate and; a light emitting element provided on one surface side of the substrate; a frame portion having a frame shape and surrounding the light emitting element; a reflective portion having a film shape, the reflective portion being provided between an area of ​​the substrate located inside the frame portion and the substrate and the frame portion, the reflective portion having a reflectance higher than that of the substrate with respect to light irradiated from the light emitting element; A vehicle light emitting module comprising:

[0085] (Appendix 2) 2. The vehicle light emitting module according to claim 1, wherein the frame portion is integrally formed with the reflecting portion.

[0086] (Appendix 3) 2. The vehicle light emitting module according to claim 1, wherein the frame portion is adhered to the reflecting portion.

[0087] (Appendix 4) 4. The light emitting module for a vehicle according to claim 1, wherein the reflecting portion covers the periphery of the light emitting element.

[0088] (Appendix 5) A light emitting module for a vehicle according to any one of appendices 1 to 4; a socket on one end side in which the vehicle light emitting module is provided; A vehicle lighting device equipped with:

[0089] (Appendix 6) Mounting a light emitting element on the substrate; a step of providing a film-like reflective portion by supplying a first resin having a reflectivity higher than that of the substrate to a region of the substrate where the light emitting element is mounted; a step of supplying a second resin having a higher reflectivity for light irradiated from the light emitting element than the substrate in a frame shape onto the reflecting portion to provide a frame surrounding the light emitting element; A method for manufacturing a vehicle light emitting module comprising:

[0090] (Appendix 7) 7. The method for manufacturing a light emitting module for a vehicle according to claim 6, wherein the first resin in a film form and the second resin in a frame form are cured together. [Explanation of symbols]

[0091] 1 Vehicle lighting device, 1a central axis, 10 socket, 11 mounting portion, 20 light emitting module, 21 substrate, 22 light emitting element, 23 frame portion, 23a frame portion, 26 reflecting portion, 100 vehicle lamp, 101 housing

Claims

1. a substrate; a light emitting element provided on one surface side of the substrate; a frame portion having a frame shape and surrounding the light emitting element; a reflective portion having a film shape, the reflective portion being provided between an area of ​​the substrate located inside the frame portion and the substrate and the frame portion, the reflective portion having a reflectance higher than that of the substrate with respect to light irradiated from the light emitting element; A vehicle light emitting module comprising:

2. The vehicle light emitting module according to claim 1 , wherein the frame portion is integrally formed with the reflecting portion.

3. The vehicle light emitting module according to claim 1 , wherein the frame portion is bonded to the reflecting portion.

4. The vehicle light emitting module according to claim 1 , wherein the reflecting portion covers the periphery of the light emitting element.

5. The vehicle light emitting module according to claim 1 or 2; a socket on one end side in which the vehicle light emitting module is provided; A vehicle lighting device equipped with:

6. Mounting the light emitting element on the substrate; a step of providing a film-like reflective portion by supplying a first resin having a reflectivity higher than that of the substrate with respect to light irradiated from the light-emitting element to an area of ​​the substrate where the light-emitting element is mounted; a step of supplying a second resin having a higher reflectivity for light irradiated from the light emitting element than the substrate in a frame shape onto the reflecting portion to provide a frame portion surrounding the light emitting element; A method for manufacturing a vehicle light emitting module comprising:

7. The method for manufacturing a light emitting module for a vehicle according to claim 6, wherein the first resin in a film form and the second resin in a frame form are cured together.

Images