Substrate depressing device and substrate depressing method

Abstract

To provide a substrate depressing device enabling production of a substrate on which electronic parts can be easily mounted and which includes solder precoats.SOLUTION: A substrate depressing device 100 includes: a substrate supporting part 10 supporting a second main surface of a substrate 1 having a first main surface and the second main surface; a roller 124 for depressing a first main surface side of the substrate 1 supported by the substrate supporting part 10; and a moving part (moving mechanism 121) moving at least one of the substrate 1 and the roller 124. A plurality of lands for connecting components, and a plurality of solder precoats formed on the plurality of lands are disposed on the first main surface. The roller 124 can simultaneously depress tops of two or more solder precoats. The roller 124 is relatively moved along the first main surface several times to depress the solder precoats by the roller 124, and thereby the tops of the plurality of solder precoats are crushed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a substrate pressing device and a substrate pressing method. [Background technology]

[0002] A reflow method is a well-known method for mounting multiple electronic components on a substrate, in which electronic components are mounted on the substrate using solder paste. In the reflow method, a method of forming a solder precoat on the lands has been proposed.

[0003] Claim 1 of Patent Document 1 (JP 2023-120046 A) describes a substrate having a first main surface and a second main surface opposite to the first main surface, the substrate having a solder precoat formed on the first main surface, and a backup part having a support surface that supports the second main surface from below; a pair of side clampers each having a clamping surface that contacts a side surface of the substrate, and clamping the substrate supported by the backup section by sandwiching the clamping surface; a roller that presses the substrate clamped by the side clamper from the first main surface side to crush the top of the solder precoat; Equipped with When viewed from the normal direction of the first main surface, the rotation axis of the roller intersects with the direction in which the clamp surface extends."

[0004] Claim 1 of Patent Document 2 (JP 2023-121296 A) describes a substrate heating device that heats a substrate on which solder paste has been placed to form a solder precoat on the substrate and a residue covering the surface of the solder precoat; a substrate pressing device that receives the substrate from the substrate heating device and breaks the residue covering the surface of the solder precoat; a flux application device that receives the substrate from the substrate pressing device and applies flux to the solder precoat; Equipped with The patent discloses a mounting system in which electronic components are placed on the solder precoat to which the flux has been applied, and then soldered and mounted. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2023-120046 [Patent Document 2] Japanese Patent Application Publication No. 2023-121296 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the surface of the solder precoat is curved due to the surface tension of the solder. When attempting to mount an electronic component on such a curved solder precoat, there is a risk that the electronic component will slip off the solder precoat. In light of this situation, one of the objectives of the present disclosure is to provide a substrate pressing device capable of manufacturing a substrate including a solder precoat on which electronic components can be easily mounted. [Means for solving the problem]

[0007] One aspect of the present disclosure is a substrate pressing device, comprising: a substrate support portion that supports a second main surface of a substrate having a first main surface and a second main surface opposite to the first main surface; a roller for pressing the first main surface side of the substrate supported by the substrate support portion; a moving unit that moves at least one of the substrate and the roller so as to relatively reciprocate the roller along the first main surface in a state in which the roller presses the first main surface side of the substrate, a plurality of lands for connecting components and a plurality of solder precoats formed on the lands are arranged on the first main surface; the roller is capable of pressing the tops of two or more of the solder precoats simultaneously; The present invention relates to a substrate pressing device that presses the solder precoat with the roller multiple times by moving the roller relatively along the first main surface multiple times, thereby crushing the tops of the multiple solder precoats.

[0008] Another aspect of the present disclosure is a substrate pressing method, comprising: a supporting step of supporting, by a substrate supporting part, the second main surface of a substrate having a first main surface and a second main surface opposite to the first main surface; a pressing step of relatively reciprocating the roller along the first main surface while the roller presses the first main surface side of the substrate, a plurality of lands for connecting components and a plurality of solder precoats formed on the lands are arranged on the first main surface; the roller is capable of pressing the tops of two or more of the solder precoats simultaneously; The present invention relates to a substrate pressing method in which, in the pressing step, the roller is moved relatively along the first main surface multiple times, thereby pressing the solder precoat multiple times with the roller, thereby crushing the tops of the multiple solder precoats. [Effects of the Invention]

[0009] The present disclosure provides a substrate that includes a solder precoat onto which electronic components can be easily mounted. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram schematically showing the configuration of a mounting substrate manufacturing apparatus according to the first embodiment. [Figure 2] FIG. 2 is a top view schematically illustrating an example of a substrate. [Figure 3A] FIG. 3A is a cross-sectional view schematically illustrating an example of a substrate before a pressing step. [Figure 3B] FIG. 3B is a cross-sectional view schematically illustrating an example of the substrate after the pressing step. [Figure 4]FIG. 4 is a diagram schematically illustrating an example of a part of the pressing portion. [Figure 5] FIG. 5 is a perspective view schematically illustrating an example of the pressing step. [Figure 6] FIG. 6 is a top view schematically showing one step of the pressing step. [Figure 7] FIG. 7 is a top view schematically showing another step of the pressing step. [Figure 8] FIG. 8 is a perspective view schematically showing another example of a substrate pressing device. [Figure 9] FIG. 9 is a diagram schematically illustrating another example of a substrate pressing device. [Figure 10] FIG. 10 is a diagram schematically showing the function of the substrate pressing device shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] The following describes embodiments of the present disclosure using examples, but the present disclosure is not limited to the examples described below. In the following description, specific numerical values ​​and materials may be exemplified. However, other numerical values ​​and other materials may be applied as long as the invention of the present disclosure can be implemented. In this specification, the term "numerical value A to numerical value B" includes numerical value A and numerical value B and can be read as "numerical value A or more and numerical value B or less." In the following description, when lower and upper limits of numerical values ​​related to specific physical properties or conditions are exemplified, any of the exemplified lower limits and any of the exemplified upper limits can be arbitrarily combined, as long as the lower limit is not equal to or greater than the upper limit. In the following description, when examples of components or methods are listed, only one of the listed examples may be used, or multiple of the listed examples may be used in combination, unless otherwise specified.

[0012] (Substrate pressing device) The substrate pressing device according to this embodiment will be described below. Hereinafter, the substrate pressing device according to this embodiment may be referred to as a "substrate pressing device (D)" or "device (D)." The substrate pressing device (D) includes a substrate support unit that supports a second main surface of a substrate having a first main surface and a second main surface opposite the first main surface; a roller for pressing the first main surface of the substrate supported by the substrate support unit; and a moving unit that moves at least one of the substrate and the roller so as to relatively move the roller back and forth along the first main surface while the roller presses the first main surface of the substrate. The first main surface has a plurality of lands for connecting components and a plurality of solder precoats formed on the lands. The roller can simultaneously press the tops of two or more solder precoats. By moving the roller relatively along the first main surface multiple times, the roller presses the solder precoats multiple times, thereby crushing the tops of the multiple solder precoats.

[0013] Typically, a single substrate has a large number of lands (e.g., several thousand or more lands). The solder precoat is formed on these many lands. The solder precoat is formed, for example, by applying solder paste onto the lands, followed by heating and cooling. The formed solder precoat has a curved top. Electronic components are placed on the solder precoat to be soldered to it. However, if the top of the solder precoat is curved, the electronic component is likely to slip off the solder precoat. If the electronic component slips off the solder precoat, poor soldering will occur. Therefore, it is preferable to use a roller to crush the top of the solder precoat.

[0014] However, since multiple solder precoats are formed on a single substrate, it is not easy to properly crush the tops of all the solder precoats. In the substrate pressing device (D), the roller is moved relatively multiple times along the first main surface, thereby pressing the solder precoats multiple times with the roller. Therefore, even if there are many solder precoats, their tops can be properly crushed. By crushing the tops of the solder precoats, it becomes easier to mount electronic components on the solder precoats. In other words, by crushing the tops of the solder precoats, they are flattened, making it less likely that electronic components mounted on them will slip off.

[0015] The substrate pressing device (D) may further include a direction changing unit that relatively changes the orientation Ds of the first main surface with respect to the rotation axis of the roller when viewed from the normal direction Dn of the first main surface. In this case, it is preferable that the orientation Ds of the first main surface in at least one of multiple relative movements of the roller along the first main surface be different from the orientation Ds of the first main surface in other movements.

[0016] Typically, the distribution of multiple solder precoats on a board varies, so the pressure applied by the roller tends to be insufficient in areas where the solder precoats are densely packed. If the pressure of the roller is increased, the pressure may cause the board to bend or the solder precoat to be excessively crushed in areas where there is little solder precoat. As described above, by changing the orientation Ds of the first main surface relative to the roller's rotation axis, it becomes easier to uniformly crush the tops of the solder precoats.

[0017] The orientation Ds of the first main surface is the orientation of the first main surface in a plane parallel to the first main surface. The amount of change in the orientation Ds of the first main surface can be expressed as the rotation angle of the substrate when the normal to the first main surface is used as the rotation axis. The orientation Ds of the first main surface and the angle between the orientation Ds and the direction Dr parallel to the rotation axis of the roller will be described in the first embodiment, and therefore will not be described again here.

[0018] Consider the case where the substrate is rectangular. In this case, the direction Dsa of the side of the substrate that is parallel to the substrate transport direction may be used as the reference direction for the orientation Ds of the first main surface. When the roller is moved in the same direction as the substrate transport direction Dt, the angle formed by the direction Dr parallel to the roller rotation axis and the direction Dsa is 90°. The angle formed by the direction Dsb of the side of the substrate that is perpendicular to the substrate transport direction Dt and the direction Dr parallel to the roller rotation axis is 0°.

[0019] When the roller is moved relatively along the first main surface multiple times, the angle between the direction Ds of the first main surface and the direction Dr parallel to the rotation axis of the roller is changed at least once. The amount of change Δα in the angle α may be 45° or less, 30° or less, 10° or less, or 5° or less. The amount of change Δα in the angle α may be 0.3° or more, 0.5° or more, or 1° or more. The amount of change Δα in the angle α in one change may be in the range of 0.3° to 1°.

[0020] From another perspective, it can also be considered as follows: Angle X is the angle formed by any one side of the substrate (for example, a side parallel to the transport direction of the substrate) and the direction Dr parallel to the rotation axis of the roller. The angle X in at least one of the multiple movements of the roller relative to the first main surface of the substrate may be different from the angle X in the other movements. By changing angle X, the above-mentioned effect can be obtained.

[0021] The direction changer may be a rotation mechanism that rotates the substrate support horizontally. By rotating the substrate support horizontally, the substrate rotates horizontally. Here, rotating horizontally means rotating around the direction of the Earth's gravity as the rotation axis.

[0022] The substrate pressing device (D) may include a heating unit that heats at least one of the substrate and the roller. This configuration makes it easier to crush the top of the solder precoat. The heating temperature may be any temperature that makes it easier to crush the solder precoat. The heating temperature may be 120°C or higher, or 140°C or higher, or 170°C or lower, or 150°C or lower.

[0023] The substrate pressing device (D) may include a rotation shaft support part (roller holder) that supports the rotation shaft of the roller. The substrate pressing device (D) may include an elastic part connected to the rotation shaft support part. The presence of the elastic part makes it possible to oscillate the roller in accordance with variations in the height of the solder precoat. As a result, variations in the pressure applied to the multiple solder precoats can be reduced. The structure of the elastic part is not particularly limited. The elastic part may be configured using an elastic body such as a spring or rubber.

[0024] The substrate pressing device (D) may include a screen printing unit for performing screen printing. The screen printing unit may include a screen mask and a print head.

[0025] The substrate pressing device (D) may further include a flux application unit that applies flux to the solder precoat whose top has been crushed by the roller. Note that a flux application device that is independent from the substrate pressing device (D) may be disposed downstream of the substrate pressing device (D).

[0026] The material of the roller is not particularly limited, as long as it can crush the top of the solder precoat. A roller made of metal (such as stainless steel) may be used. A coating may be formed on the surface of the roller. For example, the surface of the roller may be coated with a fluororesin (such as polytetrafluoroethylene). The use of such a coating can prevent dirt on the surface of the solder precoat from adhering to the roller.

[0027] (Substrate pressing method) The substrate pressing method according to this embodiment will be described below. Hereinafter, the substrate pressing method according to this embodiment may be referred to as the "substrate pressing method (M)" or "method (M)." The substrate pressing method (M) can be easily implemented by using the substrate pressing device (D). Since the matters explained about the substrate pressing device (D) can be applied to the substrate pressing method (M), duplicated explanations may be omitted. The matters explained about the substrate pressing method (M) may also be applied to the substrate pressing device (D).

[0028] The substrate pressing method (M) includes a supporting step of supporting the second main surface of a substrate having a first main surface and a second main surface opposite the first main surface with a substrate support part, and a pressing step of relatively moving a roller back and forth along the first main surface while pressing the first main surface side of the substrate. The first main surface has a plurality of lands for connecting components and a plurality of solder precoats formed on the lands. The roller is capable of simultaneously pressing the tops of two or more solder precoats. In the pressing step, the roller is moved relatively along the first main surface a plurality of times, thereby pressing the solder precoats a plurality of times with the roller, thereby crushing the tops of the plurality of solder precoats.

[0029] As explained for the substrate pressing device (D), the substrate pressing method (M) can properly crush the tops of the solder precoats even if there are a large number of them.

[0030] A substrate having a plurality of lands and a plurality of solder precoats formed on the lands may be produced by a known method, or a commercially available substrate may be used. In one example of producing such a substrate, a solder paste is first applied to the lands of a substrate having lands formed thereon. The solder paste is then heated to melt and then cooled, thereby forming a solder precoat on the lands. The substrate may then be washed as necessary. In this manner, a substrate having a solder precoat formed thereon can be produced.

[0031] In the substrate pressing method (M), the orientation Ds of the first main surface relative to the rotation axis of the roller during at least one of the multiple relative movements of the roller along the first main surface may be different from the orientation Ds of the first main surface during the other movements. This method makes it easier to uniformly crush the peaks of the solder precoat. The orientation Ds of the first main surface relative to the rotation axis of the roller may be changed using the direction changer described above.

[0032] In the pressing step, at least one of the substrate and the roller may be heated to a temperature within the range described above.

[0033] Below, examples of the substrate pressing device (D) and substrate pressing method (M) according to this embodiment will be specifically described with reference to the drawings. The components described above can be applied to the components of the example described below. Furthermore, the components of the example described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above embodiment. Furthermore, in the example described below, components that are not essential to the device and method according to the present disclosure may be omitted. The figures shown below are schematic and do not accurately reflect the shapes and numbers of actual components.

[0034] (Embodiment 1) In the first embodiment, an example of a substrate pressing device (D) and a substrate pressing method (M) will be described. The substrate pressing device 100 of the first embodiment is shown schematically in FIG. 1. The substrate pressing device 100 includes a substrate holding unit 110, a pressing unit 120, and a control unit 130. The control unit 130 is connected to devices (driving devices, measuring instruments, etc.) within the substrate pressing device 100. The control unit 130 controls the driving devices, etc. If necessary, the control unit 130 includes a central processing unit (CPU) and controls the driving devices, etc. based on information from the measuring instruments, etc. The control unit 130 includes a storage device in which a program for controlling the substrate pressing device 100 is stored.

[0035] The substrate holding unit 110 holds the substrate 1 and rotates it. The substrate 1 has a first main surface 1a and a second main surface 1b opposite the first main surface 1a. The substrate holding unit 110 includes a base 111, a moving table 112, a direction changer 113, and a substrate support unit 114. The substrate support unit 114 supports the second main surface 1b of the substrate 1. FIG. 1 shows a normal direction Dn (a direction perpendicular to the first main surface 1a) of the first main surface 1a. In the first embodiment, the normal direction Dn is assumed to be the Z axis in the XYZ coordinate space. That is, in the first embodiment, a plane parallel to the first main surface 1a is assumed to be the XY plane in the XYZ coordinate space. Typically, the substrate 1 is positioned so that the first main surface 1a is parallel to a horizontal plane.

[0036] As will be described later, the first main surface 1a has a plurality of lands for connecting components and a plurality of solder precoats formed on the lands. Note that the second main surface may also have a plurality of lands and solder precoats. In this case, the substrate support portion 114 may include a plurality of pins that support a portion of the second main surface 1b.

[0037] A moving table 112 is arranged on the base 111. The moving table 112 is a table for moving the substrate support part 114 along the XY plane (usually a horizontal plane). The direction change part 113 rotates the substrate support part 114 around the normal direction Dn (Z axis) as the rotation axis. When the substrate support part 114 rotates, the substrate 1 rotates around the normal direction Dn (Z axis) as the rotation axis. The drive mechanisms for the moving table 112 and the direction change part 113 are not particularly limited, and known drive mechanisms (motors, etc.) can be used.

[0038] The substrate support unit 114 may include a mechanism for fixing the substrate. The mechanism for fixing the substrate is not limited, and may be a vacuum suction mechanism or a clamping mechanism. The substrate support unit 114 may include a flat stage on which the second main surface 1b is placed. By supporting the second main surface 1b on a flat stage, it is possible to reduce variations in the pressing force applied to the solder precoat by the roller.

[0039] The pressing unit 120 is a part for pressing the first main surface 1a side of the substrate 1 with rollers 124. The pressing unit 120 includes a moving mechanism (moving unit) 121, a pressing mechanism 122, an output shaft 123, and rollers 124. The moving mechanism 121 includes a mechanism for moving the pressing mechanism 122, the rollers 124, and the like. The pressing mechanism 122 and the rollers 124 are moved back and forth in the direction of the arrow in FIG. 1 by the moving mechanism 121. The pressing mechanism 122 includes a pressing mechanism that moves the output shaft 123 to press the substrate 1 with the rollers 124. In FIG. 1, the state in which the pressing mechanism 122 presses the first main surface 1a side of the substrate 1 with the rollers 124 while reciprocating along the moving mechanism 121 is shown by dotted lines. The configuration of the moving mechanism 121 is not particularly limited, and may be configured with a motor, rails, or the like.

[0040] A top view of an example of the substrate 1 is shown in Figure 2. A plurality of lands 2 are formed on the first main surface 1a of the substrate 1. In Figure 2, the reference numeral 2 is given to only some of the lands. The circles and rectangles drawn on the first main surface 1a indicate the lands.

[0041] FIG. 3A is a schematic cross-sectional view of an example of a substrate 1 on which a solder precoat 3 has been formed. The solder precoat 3 is formed on a land 2. The top of the solder precoat 3 has a hill-like curved surface. FIG. 3B is a schematic cross-sectional view of the state after the top of the solder precoat 3 has been crushed with a roller. The top of the solder precoat 3 shown in FIG. 3B has been crushed to be almost flat.

[0042] An electronic component is placed on the solder precoat 3 in Fig. 3B and soldered by a reflow process. Alternatively, flux may be applied to the solder precoat in Fig. 3B before the electronic component is placed.

[0043] FIG. 4 shows a portion of an example of the pressing unit 120. The pressing unit 120 shown in FIG. 4 includes a pressing mechanism 122, an output shaft 123, a roller 124, an elastic portion 125, and a roller holder 126. The roller holder 126 rotatably holds the rotation shaft 124a of the roller 124. The output shaft 123 and the roller holder 126 are connected by the elastic portion 125. The elastic portion 125 includes an elastic body and holds the roller holder 126 so that the roller holder 126 can swing. With this configuration, the roller holder 126 swings as shown by the arrow in FIG. 4. This reduces the variation in the pressure applied to multiple solder precoats.

[0044] FIG. 5 is a schematic diagram of an example of a state in which the roller 124 presses the first main surface 1a side of the substrate 1. In the example shown in FIG. 5, the roller 124 presses the first main surface 1a side of the substrate 1 while reciprocating along a movement direction A parallel to the side 1sa of the rectangular substrate 1. The movement direction A is a direction perpendicular to the rotation axis of the roller 124. FIG. 5 also shows the normal direction Dn of the first main surface 1a. FIG. 5 also shows the XYZ axes, with the normal direction Dn being the Z axis and the direction of the side 1sa being the X axis.

[0045] When the roller 124 makes multiple movements, at least once, as indicated by arrow B, the substrate 1 is rotated around the normal direction Dn as the rotation axis. The rotation angle β of the substrate 1 at this time is the change amount Δα of the angle α described above. Regarding the movement of the roller 124, the movement until the direction of movement is changed is counted as one movement. The back and forth movement of the roller 124 along the movement direction A is counted as two movements. The number N of times the roller is moved to press the substrate 1 is two or more. The number N may be selected taking into consideration the pressing force of the roller 124, the number of solder precoats, etc. The number N may be five or more, ten or more, twenty or less, or fifteen or less.

[0046] The length of the roller 124 (the length along the rotation axis of the roller 124) is preferably greater than the length of one side of the substrate 1. For example, the length of the roller 124 is preferably greater than the length of the short side of the substrate 1. This configuration can reduce the number of times the roller moves back and forth. The length of the roller 124 may be selected depending on the size of the substrate 1.

[0047] FIG. 6 shows a top view of an example of the state before the substrate 1 is rotated. In the example shown in FIG. 6, the side 1sa of the substrate 1 is parallel to the transport direction Dt of the substrate 1. Furthermore, the direction of the rotation axis of the roller 124 is perpendicular to the transport direction Dt of the substrate 1. Here, the direction of the side 1sa is set as the reference direction for the orientation Ds of the substrate 1. FIG. 6 also shows the XY axes shown in FIG. 5. The roller 124 presses the substrate 1 while moving along the movement direction A. Here, in a plane parallel to the first main surface 1a, the angle α between the direction Dr parallel to the rotation axis of the roller 124 and the side 1sa is 90°. Note that in the example shown in FIG. 6, the movement direction A of the roller 124 is parallel to the transport direction Dt of the substrate, but the direction of the movement direction A is not particularly limited.

[0048] As shown in Fig. 7, one of the movements of the roller 124 is performed while the substrate 1 is rotated. The substrate 1 in Fig. 7 is rotated by an angle β around a direction perpendicular to the paper surface (normal direction Dn) as the rotation axis. The roller 124 presses the substrate 1 while moving along the movement direction A, as in Fig. 6. In a plane parallel to the first main surface 1a, the angle α on the acute angle side of the angle formed between the direction Dr parallel to the rotation axis of the roller 124 and the side 1sa is 90°-β.

[0049] The pressing process in FIG. 6 differs from the pressing process in FIG. 7 in the angle between the direction Dr parallel to the rotation axis of the roller 124 and the side 1sa on the first main surface 1a. That is, the orientation Ds of the first main surface is different between the pressing process in FIG. 6 and the pressing process in FIG. 7. As shown in FIG. 6, if many lands are arranged along the side of the substrate 1, the number of solder precoats pressed by the roller 124 increases in the pressing process in FIG. 6. By rotating the substrate 1 as shown in FIG. 7, it is possible to change the number of solder precoats pressed by the roller 124 and the combination of multiple solder precoats pressed simultaneously. As a result, it is possible to complete the pressing of all solder precoats with a small number of movements.

[0050] In the pressing step, the substrate 1 may be rotated after each movement. Alternatively, the substrate 1 may be rotated after each of several movements. The more times the substrate is rotated, the easier it is to crush the solder precoat uniformly. The direction in which the substrate is rotated does not have to be the same. When the first main surface 1a is viewed from above, the substrate 1 may be rotated clockwise or counterclockwise. Alternatively, the substrate 1 may be rotated both clockwise and counterclockwise.

[0051] As shown in FIG. 8, the width of the roller 124 may be shorter than the width of the substrate 1. In this case, the position of the roller 124 in the width direction Dw of the substrate 1 is changed, and the roller 124 is moved back and forth. By shortening the width of the roller 124, it becomes easier to uniformize the pressing force applied to the solder precoat. It also becomes possible to reduce the pressure applied to the output shaft 123. By shortening the width of the roller 124, the number of movements of the roller 124 may increase. However, by rotating the substrate 1, the number of movements of the roller 124 can be prevented from increasing.

[0052] In the first embodiment, an example has been described in which the orientation of the substrate 1 is changed. However, the orientation of the roller 124 may be changed instead of the orientation of the substrate 1. Alternatively, both the orientation of the substrate 1 and the orientation of the roller may be changed.

[0053] In the first embodiment, the substrate 1 is used as an example of a substrate in which lands and solder precoating are formed only on the first main surface 1a side. However, lands and solder precoating may also be formed on the second main surface 1b side of the substrate 1. The second main surface 1b side of the substrate 1 may also be pressed by a roller 124. In this case, the substrate 1 may be supported by a plurality of pin-shaped portions, clamps, or the like.

[0054] (Embodiment 2) In embodiment 2, another example of a substrate pressing device (D) and a substrate pressing method (M) will be described. A substrate pressing device 100a of embodiment 2 is shown schematically in FIGS. 9 and 10. The substrate pressing device 100a differs from the substrate pressing device 100 in that it includes a screen printing unit and a lifting mechanism. Other aspects are generally the same as the substrate pressing device 100, so redundant explanations will be omitted. Since the substrate pressing device 100a includes a screen printing unit, it is possible to print flux onto the solder precoat 3 in addition to crushing the top of the solder precoat.

[0055] The substrate pressing device 100a includes a substrate holding unit 110, a pressing unit 120, a control unit 130, and a screen printing unit 140. The substrate holding unit 110 of the substrate pressing device 100a includes a lifting mechanism 115. The lifting mechanism 115 raises and lowers the direction change unit 113 and the substrate support unit 114 along the normal direction Dn. The pressing unit 120 of the substrate pressing device 100a includes a camera unit 127. The screen printing unit 140 includes a screen mask 141 and a print head 142. The print head 142 includes a squeegee 142a that prints the object 150 on the screen mask 141. The camera unit 127 is attached to a movement mechanism 121 and is movable in the X direction by the movement mechanism 121 to be above the substrate 1. The camera unit 127 captures an image of a reference mark on the substrate 1 held by the substrate support unit 114. The control unit 130 recognizes the position of the substrate 1 based on the image of the reference mark captured by the camera unit 127, and uses the recognition result to control the moving table 112 and the direction change unit (θ table) 113 to align the substrate 1 with the screen mask 141.

[0056] 9 shows an arrangement for performing a pressing step in which the first main surface side of the substrate 1 is pressed by the pressing unit 120. At this time, the substrate 1 is placed at a height suitable for pressing by the lifting mechanism 115. The pressing step has been described above, so a repeated description will be omitted.

[0057] FIG. 10 shows the screen printing process. Once the substrate 1 is held by the substrate support part 114, the pressing part 120 performs the pressing step of the solder precoat 3. The pressing step in the second embodiment is the same as that in the first embodiment, so a description thereof will be omitted. After the pressing step is completed, the camera unit 127 captures an image of the substrate 1 (imaging step). Next, the substrate 1 is brought close to the screen mask 141 while being aligned with the screen mask 141 (alignment step). At this time, the pressing part 120 and the camera unit 127 are retracted from above the substrate support part 114 by the moving mechanism 121. Then, with the object 150 placed on the screen mask 141, the print head 142 is moved. As a result, the object 150 is filled into the printing openings of the screen mask 141 by the squeegee 142a and printed onto the solder precoat 3 (printing step).

[0058] The object 150 to be coated is not particularly limited and may be solder paste or solder flux. For example, to form a solder precoat, a screen printing unit 140 may be used to coat the lands with solder paste. In the second embodiment, the printing step is performed after the pressing step, but the pressing step may also be performed after the printing step. According to the second embodiment, the screen printing device can be given the function of pressing the solder precoat, which has the advantage of eliminating the need to separately prepare a screen printing device and a board pressing device.

[0059] (Addendum) The above description discloses the following techniques. (Technology 1) A substrate pressing device, a substrate support portion that supports a second main surface of a substrate having a first main surface and a second main surface opposite to the first main surface; a roller for pressing the first main surface side of the substrate supported by the substrate support portion; a moving unit that moves at least one of the substrate and the roller so as to relatively reciprocate the roller along the first main surface in a state in which the roller presses the first main surface side of the substrate, a plurality of lands for connecting components and a plurality of solder precoats formed on the lands are arranged on the first main surface; the roller is capable of pressing the tops of two or more of the solder precoats simultaneously; a substrate pressing device that presses the solder precoat with the roller multiple times by moving the roller relatively along the first main surface multiple times, thereby crushing the tops of the multiple solder precoats; (Technology 2) a direction changer configured to relatively change an orientation Ds of the first principal surface with respect to the rotation axis of the roller when viewed from a normal direction of the first principal surface, The substrate pressing device according to Technology 1, wherein the orientation Ds of the first main surface in at least one of the multiple relative movements of the roller along the first main surface is different from the orientation Ds of the first main surface in other movements. (Technology 3) The substrate pressing device according to Technology 2, wherein the direction changing unit is a rotation mechanism that rotates the substrate support unit horizontally. (Technology 4) The substrate pressing device according to any one of techniques 1 to 3, further comprising a heating section that heats at least one of the substrate and the roller. (Technology 5) A substrate pressing method, comprising: a supporting step of supporting, by a substrate supporting part, the second main surface of a substrate having a first main surface and a second main surface opposite to the first main surface; a pressing step of relatively reciprocating the roller along the first main surface while the roller presses the first main surface side of the substrate, a plurality of lands for connecting components and a plurality of solder precoats formed on the lands are arranged on the first main surface; the roller is capable of pressing the tops of two or more of the solder precoats simultaneously; A substrate pressing method, wherein in the pressing step, the roller is moved relatively along the first main surface multiple times, thereby pressing the solder precoat multiple times with the roller, thereby crushing the tops of the multiple solder precoats. (Technology 6) The substrate pressing method according to technique 5, wherein the orientation Ds of the first main surface relative to the rotation axis of the roller in at least one of the multiple movements of the roller relative to the first main surface is different from the orientation Ds of the first main surface in other movements. [Industrial Applicability]

[0060] The present disclosure can be used for a substrate pressing device and a substrate pressing method. [Explanation of symbols]

[0061] 1: Circuit board 1a: First main surface 1b: Second main surface 2: Land 3: Solder pre-coating 100, 100a: Substrate pressing device 110: Board holding part 113: Direction change section 114: Substrate support part 121: Moving mechanism (moving part) 122: Pressing mechanism 124: Laura 124a: Rotating axis 125: Elastic part 126: Roller holder

Claims

1. A substrate pressing device, a substrate support portion that supports a first main surface of a substrate having a second main surface opposite to the first main surface; a roller for pressing the first main surface side of the substrate supported by the substrate support portion; a moving unit that moves at least one of the substrate and the roller so as to relatively reciprocate the roller along the first main surface in a state in which the roller presses the first main surface side of the substrate, a plurality of lands for connecting components and a plurality of solder precoats formed on the lands are arranged on the first main surface; the roller is capable of pressing the tops of two or more of the solder precoats simultaneously; A substrate pressing device that presses the solder precoat with the roller multiple times by moving the roller relatively along the first main surface multiple times, thereby crushing the tops of the multiple solder precoats.

2. a direction changer configured to relatively change an orientation Ds of the first principal surface with respect to the rotation axis of the roller when viewed from a normal direction of the first principal surface, 2. The substrate pressing device according to claim 1, wherein a direction Ds of the first main surface in at least one of a plurality of movements of the roller relative to the first main surface is different from a direction Ds of the first main surface in other movements.

3. The substrate pressing device according to claim 2 , wherein the direction changing unit is a rotation mechanism that rotates the substrate support unit horizontally.

4. 4. The substrate pressing device according to claim 1, further comprising a heating section that heats at least one of the substrate and the roller.

5. A substrate pressing method, comprising: a supporting step of supporting, by a substrate support part, the second main surface of a substrate having a first main surface and a second main surface opposite to the first main surface; a pressing step of relatively reciprocating the roller along the first main surface while the roller presses the first main surface side of the substrate, a plurality of lands for connecting components and a plurality of solder precoats formed on the lands are arranged on the first main surface; the roller is capable of pressing the tops of two or more of the solder precoats simultaneously; A substrate pressing method, wherein in the pressing step, the roller is moved relatively along the first main surface a plurality of times, thereby pressing the solder precoat with the roller a plurality of times, thereby crushing the tops of the plurality of solder precoats.

6. 6. The substrate pressing method according to claim 5, wherein an orientation Ds of the first main surface relative to the rotation axis of the roller during at least one of multiple relative movements of the roller along the first main surface is different from an orientation Ds of the first main surface during other movements.

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