Electronic component mounting method

Abstract

To eliminate printed circuit board etching and soldering in electronic component mounting.SOLUTION: A method includes a process of providing component insertion grooves to a sheet material 1 to match electronic component shapes using a precision machining device equipped with a computer control unit that performs automatic machining based on input data, and a process of clamping together, using uniform pressure fasteners, the sheet material 1 with electronic components mounted in the component insertion grooves, and a sheet material 2 whose copper foil surface is removed by the precision machining device equipped with the computer control unit and performing automatic machining based on the input data to form electrical connection patterns 3.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to mounting electronic components using a plate structure in which a plate material having an electrical connection pattern and a plate material having a component fitting groove that matches the shape of the component are sandwiched between them. [Background technology]

[0002] A known method of mounting electronic components is to use solder fusion to a printed circuit board that has been chemically treated and provided with an electrical connection pattern.

[0003] One technique for applying electrical connection patterns is the printed circuit board etching method, in which the copper on the surface of a plate material to which copper foil has been attached is chemically treated to leave only the electrical connection patterns.

[0004] Printed circuit board etching methods are known to produce harmful chemicals that are by-products of oxidizing and anti-corrosive agents, which can have adverse effects on humans and the environment.

[0005] The soldering method, in which components are mounted on a printed circuit board by fusing solder, is said to cause lead poisoning if the lead and lead compounds, which are the main components of the solder, are absorbed into the body in large amounts. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent 7161825 Plasma processing equipment Summary of the Invention [Problem to be solved by the invention]

[0007] The advantage is that it eliminates the need for printed circuit board etching and soldering methods, which have been suggested to have a negative impact on the environment when mounting electronic components. [Means for solving the problem]

[0008] This method involves scraping away the copper foil on the surface of the plate material and applying an electrical connection pattern using a precision processing device equipped with a computer control device that automatically processes based on input data.

[0009] This is a method in which a precision machining device equipped with a computer control device performs automatic machining based on input data, and a part fitting groove is made in the plate material to match the part shape.

[0010] The plate structure is constructed by mounting electronic components on a plate with an electrical connection pattern and a plate with component fitting grooves that match the component shape, and the electrical connection pattern and component electrodes come into contact and become conductive when pressure is applied by tightening. [Effects of the Invention]

[0011] The present invention is a method that eliminates the need for printed circuit board etching and soldering processes.

[0012] Electronic components mounted in this way do not require melting or heating, and can be easily disassembled and reassembled into individual electronic components by releasing the pressure applied by fastening the plate structure.

[0013] The structure prevents direct contact with electronic components, which has the potential to improve safety and reduce equipment deterioration.

[0014] This board structure allows boards on which electronic components are mounted to be easily stacked, demonstrating the possibility of reducing the volume of the device.

[0015] This plate structure shows the possibility of reducing the influence of electromagnetic fields by the physical properties of the plates themselves and the physical properties of the material sandwiched between the plates.

[0016] This method is suitable for small-lot production of a wide variety of products. [Brief explanation of the drawings]

[0017] [Figure 1]Figure 1 shows a mounting method in which electronic components are mounted on a plate material with an electrical connection pattern and a plate material with a component fitting groove that matches the component shape, and then these plates are sandwiched together. (Example) DETAILED DESCRIPTION OF THE INVENTION

[0018] The plate material 1 has component fitting grooves formed to match the shapes of the electronic components semiconductor element 5, passive element 6, and external connection terminal 7, using a precision processing device equipped with a computer control device that automatically processes based on input data.

[0019] The plate material 2 has copper foil scraped off the surface of the plate material and an electrical connection pattern 3 formed thereon by a precision processing device equipped with a computer control device that automatically processes based on input data.

[0020] A plate material 2 having an electrical connection pattern 3 and a plate material 1 having a component fitting groove into which a semiconductor element 5, a passive element 6, and an external connection terminal 7 are inserted are clamped with an even pressure clamping tool 4 with pressure that connects the electrical connection pattern 3 to the terminals of the electronic components. [Industrial Applicability]

[0021] The embodiment of Figure 1 shows the possibility of eliminating printed circuit board etching and soldering methods.

[0022] The embodiment of Figure 1 illustrates the possibility of separating the components by removing the equalizing pressure fasteners.

[0023] The embodiment of FIG. 1 illustrates the possibility of not being able to directly contact the built-in electronic components. [Explanation of symbols]

[0024] 1 Plate material with part fitting grooves 2. Plate material with electrical connection pattern 3 Electrical connection pattern 4. Equal pressure clamp 5. Semiconductor elements 6 Passive elements 7 External connection terminal

Claims

[Claim 1] This method involves using a precision processing device equipped with a computer control device that automatically processes based on input data to create component insertion grooves in the sheet material that match the shape of the electronic components, and then fastening the sheet material with the electronic components inserted into the component insertion grooves and the sheet material with the copper foil on the surface scraped off to create an electrical connection pattern using an even pressure clamp.

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