Rework support device and control method thereof

Abstract

To provide a rework support device and its control method that can reduce the burden on an operator required for rework, thereby shortening the time required for rework and improving work efficiency.SOLUTION: A rework support device detects changes in the substrate's appearance from its initial state as an abnormality by comparing the image captured by the imaging means with the initial appearance image of the substrate. If an abnormality is detected, it notifies that the substrate is not subject to rework. If no abnormality is detected, it determines the timing for replacing the electric part and notifies the determination result.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The embodiments relate to a rework support device and a control method thereof that support rework, which is a process for restoring a board on which electrical components are mounted to a state where the board functions normally. [Background technology]

[0002] A printed circuit board is known as a substrate on which electrical components (including electronic components) are mounted. This printed circuit board includes an insulating substrate body and multiple conductive patterns (conductive paths) printed on the surface of the substrate body, and these conductive patterns are soldered to each electrical component to form an electrical circuit (including electronic circuit). This printed circuit board is mounted on electrical equipment.

[0003] The electrical components mounted on such printed circuit boards have their own lifespans and replacement periods based on changes over time. If electrical components that have passed their replacement period or are close to their replacement period are continued to be used, the electrical circuits on the board may stop functioning properly. As a countermeasure, maintenance inspections are carried out by workers on a regular basis or as needed for electrical equipment in operation. During this maintenance inspection, the worker uses their own experience and the manual to identify electrical components on the circuit board that have reached or are close to due for replacement, and then replaces them with new ones, completing the so-called rework, which is a procedure to restore the circuit board to a state where it functions normally. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-271165 [Patent Document 2] Japanese Patent Application Laid-Open No. 2004-006709 [Patent Document 3] Patent Publication No. 2021-060364 Summary of the Invention [Problem to be solved by the invention]

[0005] When a printed circuit board of an electrical device brought in for maintenance inspection is cracked or damaged, it is difficult to rework the printed circuit board. The decision on whether or not this rework is possible is left to the worker's experience, and this decision places a heavy burden on the worker.

[0006] In addition, there are a wide variety of printed circuit boards for electrical equipment brought in for maintenance inspection. It is extremely difficult to accurately determine when to replace each electrical component mounted on these printed circuit boards. This also places a heavy burden on workers, and, together with the difficulty of determining whether rework is possible, is a major factor in increasing the work time required for rework and reducing work efficiency.

[0007] An object of the embodiment is to provide a rework support device and a control method thereof that can reduce the burden on workers required for rework, thereby shortening the work time required for rework and improving work efficiency. [Means for solving the problem]

[0008] A rework support device according to an embodiment supports rework, which is a process for repairing a board on which electrical components are mounted, and includes: an imaging means for capturing an image of the appearance of a board to be set as a target for the rework; a first detection means for detecting a change in the appearance of the set board from its initial state as an abnormality by comparing an image captured by the imaging means with an image of the appearance of the set board in its initial state; a first notification means for notifying the fact that the set board is not a target for the rework when an abnormality is detected by the first detection means; and a first notification means for determining, when no abnormality is detected by the first detection means, whether or not the set board has mounted thereon electrical components that have reached or are close to due for replacement, based on pre-stored information, and for notifying the fact that the set board has mounted thereon electrical components that may cause an abnormality in the connection state of the board. The system comprises: a determination means for determining whether an electrical component is mounted on the set board based on pre-stored information; a second notification means for notifying the user that replacement of the electrical component is unnecessary if the determination means determines that no electrical component that has reached or is close to replacement is mounted, and for notifying the user that replacement of the electrical component is necessary if the determination means determines that an electrical component that has reached or is close to replacement is mounted; a second detection means for detecting an abnormality in the connection state of the electrical component on the set board by comparing an image captured by the imaging means with an appearance image of the initial state if the determination means determines that an electrical component that may cause an abnormality in the connection state to the board is mounted; and a second notification means for notifying the detection result of the second detection means. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing the overall configuration of an embodiment. [Figure 2] FIG. 2 is a diagram showing the appearance of the printed circuit board according to the embodiment. [Figure 3] FIG. 3 is a diagram showing the format of a board information table in the embodiment. [Figure 4] FIG. 4 is a diagram showing an example of an appearance abnormality occurring in the printed circuit board according to the embodiment. [Figure 5] FIG. 5 is a diagram showing an example in which an abnormality occurs in the connection state of an electrical component on a printed circuit board according to the embodiment. [Figure 6] FIG. 6 is a diagram showing an example in which an abnormality occurs in the connection state of other electric components on the printed circuit board according to the embodiment. [Figure 7] FIG. 7 is a flowchart showing the control of the controller in the embodiment. [Figure 8] FIG. 8 is a flowchart following FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment will be described below with reference to the drawings. As shown in Figure 1, a board, such as a printed circuit board 11, designed by a manufacturer's board design department 1 is manufactured by the manufacturer's board manufacturing department 2, and an electrical device (including an electronic device) 10 equipped with the printed circuit board 11 is shipped to the market as a product from a product shipping department 3. 2, the printed circuit board 11 includes an insulating board body 11a and a plurality of conductive patterns (conductive paths) P printed on the surface of the board body 11a. Various electric components (including electronic components) 12, 13, 14, 15, 16, and 17 are attached to the board body 11b and electrically connected (soldered) to each of the conductive patterns P with solder H, thereby forming an electric circuit (including an electronic circuit) on the printed circuit board 11.

[0011] Electrical component 12 is, for example, a DIP (Dual Inline Package) and has a large number of lead pins 12a that are inserted into through holes in board body 11a. Electrical components 13, 14, and 15 are, for example, capacitors and transistors. Electrical component 16 is, for example, a chip resistor. Electrical component 17 is, for example, a connector and has a large number of lead pins 17a that are inserted into through holes in board body 11a. Character information 18 that uses letters and numbers to indicate the name, type, attributes, etc. of printed circuit board 11 is printed in gaps in board body 11a on which these electrical components are mounted.

[0012] The shipped electrical equipment 10 is brought by the user to the manufacturer's maintenance and inspection department 4 periodically or as needed, and is inspected by workers from the maintenance and inspection department 4. The workers from the maintenance and inspection department 4 may also visit the user's site to inspect the electrical equipment 10. One of the tasks performed by the workers from the maintenance and inspection department 4 is a procedure called rework, which restores the printed circuit board 11 to a state where it functions normally. A rework support device 20 that supports this rework is installed in or near the maintenance and inspection department 4. In addition, the maintenance and inspection department 4 is equipped with a display 4a that functions as a notification means for the rework support device 20.

[0013] The rework support device 20 includes a controller 21 consisting of a computer and its peripheral circuits as a main control unit, and also includes an operating device 22, a transport unit 23, branching units 24 and 25, a memory unit (memory means) 26, an imaging unit (imaging means) 30, an X-ray inspection unit (X-ray inspection means) 40, and an electrical inspection unit (electrical inspection means) 50, which are all connected to the controller 20.

[0014] The imaging unit 30 uses an imaging unit 31 such as a CCD camera to capture an image of the printed circuit board 11 set in the rework support device 20. The X-ray inspection unit 40 scans the printed circuit board 11 that has passed through the imaging unit 30 with an X-ray CT scanner 41.

[0015] The electrical inspection section 50 uses a measurement unit 51 to measure the electrical characteristics of the printed circuit board 11 that has passed through the X-ray inspection section 40. The measurement unit 51 includes inspection lead terminals 51a and 51b that can come into contact with each conductive pattern P on the printed circuit board 11, and an imaging unit 51c such as a CCD camera that images the printed circuit board 11. While recognizing the image of the printed circuit board 11 captured by the imaging unit 51c, the inspection lead terminals 51a and 51b are brought into contact with any position of each conductive pattern P on the printed circuit board 11, and the electrical resistance value between the contact positions of the inspection lead terminals 51a and 51b is obtained as the electrical characteristics.

[0016] The transport unit 23 includes a transport path 23a that transports the printed circuit board 11 set in the rework support device 20 sequentially to the imaging section 30, branching section 24, X-ray inspection section 40, branching section 25, and electrical inspection section 50, and then sends it to the maintenance and inspection section 4, a transport path 23b that is arranged between the branching section 24 on the transport path 23a and the board recovery section 5 outside the rework support device 20, and transports the printed circuit board 11 extracted at the branching section 24 to the board recovery section 5 for disposal, and a transport path 23c that is arranged between the branching section 25 on the transport path 23a and the middle part of the transport path 23b, and transports the printed circuit board 11 extracted at the branching section 25 to the board recovery section 5.

[0017] Branching unit 24 extracts printed circuit boards 11 on transport path 23a that have passed through imaging unit 30 in response to an instruction from controller 21, and sends them to transport path 23b. Branching unit 25 extracts printed circuit boards 11 on transport path 23a that have passed through X-ray inspection unit 40 in response to an instruction from controller 21, and sends them to transport path 23c.

[0018] 3 generated by an operator of the board manufacturing department 2. The contents of this board information table 26a can be updated as needed by an operator of the maintenance and inspection department 4 who has completed rework. The board information table 26a stores the board names of the multiple printed circuit boards 11 manufactured by the board manufacturing department 2, such as "printed circuit board P1," "printed circuit board P2," ... "printed circuit board Pn," multiple board identification information items "P001," "P002," ... "P00n" for identifying each printed circuit board 11, and the names of the electrical components mounted on each printed circuit board 11, such as "capacitor," "chip resistor," and "DIP."

[0019] In addition, the board information table 26a stores multiple component identification information such as "C001," "R001," and "D0n1" for identifying each electrical component, in association with the component identification information of each printed circuit board 11 on which each electrical component is mounted, stores the time (year, month, and day) when each electrical component should be replaced as replacement time information for each electrical component, in association with the component identification information of each printed circuit board 11 on which each electrical component is mounted, and stores whether or not there is a possibility of an abnormality occurring in the connection state of each electrical component (a circle indicates yes, an cross indicates no) as connection risk information for each electrical component, in association with the component identification information of each printed circuit board 11 on which each electrical component is mounted.

[0020] Furthermore, the board information table 26a stores a plurality of external appearance images "A1, A2, ... A8," "B1, B2, ... B8," to "N1, N2, ... N8" of the initial state of each printed circuit board 11 in association with each board identification information, stores a plurality of X-ray images "X1a, X1b, ... X1n," "X2a, X2b, ... X2n," to "Xna, Xnb, ... Xnn" of each specified location of each printed circuit board 11 in the initial state in association with each board identification information, and stores electrical characteristic information "Z1a, Z1b, ... Z1n," "Z2a, Z2b, ... Z2n," to "Zna, Znb, ... Znn" of each specified location of each printed circuit board 11 in the initial state in association with each board identification information.

[0021] Appearance images "A1, A2, ... A8" are images obtained by capturing images of the appearance of predetermined locations on the front and back surfaces of printed circuit board 11, board name "printed circuit board P1," using an imaging unit such as a CCD camera. Appearance images "B1, B2, ... B8" are images obtained by capturing images of the appearance of predetermined locations on the front and back surfaces of printed circuit board 11, board name "printed circuit board P2," using an imaging unit such as a CCD camera.

[0022] X-ray images "X1a, X1b, ... X1n" are X-ray images obtained by scanning a plurality of predetermined locations on printed circuit board 11 named "printed circuit board P1" with an X-ray CT scanner. X-ray images "X2a, X2b, ... X2n" are X-ray images obtained by scanning a plurality of predetermined locations on printed circuit board 11 named "printed circuit board P2" with an X-ray CT scanner.

[0023] Of the electrical characteristic information "Z1a, Z1b, ... Z1n," the electrical characteristic information "Z1a" is the electrical resistance value between two predetermined locations R1a, R1a on each conductive pattern P on the printed circuit board 11 having the board name "printed circuit board P1." The electrical characteristic information "Z1b" is the electrical resistance value between two predetermined locations R1b, R1b on each conductive pattern P on the printed circuit board 11 having the board name "printed circuit board P1." The electrical characteristic information "Z1n" is the electrical resistance value between two predetermined locations R1n, R1n on each conductive pattern P on the printed circuit board 11 having the board name "printed circuit board P1."

[0024] Similarly, among the electrical characteristic information "Z2a, Z2b, ... Z2n," the electrical characteristic information "Z2a" is the electrical resistance value between two predetermined locations R2a, R2a on each conductive pattern P on the printed circuit board 11 having the board name "printed circuit board P2." The electrical characteristic information "Z2b" is the electrical resistance value between two predetermined locations R2b, R2b on each conductive pattern P on the printed circuit board 11 having the board name "printed circuit board P2." The electrical characteristic information "Z2n" is the electrical resistance value between two predetermined locations R2n, R2n on each conductive pattern P on the printed circuit board 11 having the board name "printed circuit board P2."

[0025] [Controller 21 Function Description] The controller 21 has, as its main functions, a reading means 21a, a first detection means 21b, a first notification means 21c, a judgment means 21d, a second notification means 21e, a second detection means 21f, a third notification means 21g, a CT inspection means 21h, a third detection means 21i, a third notification means 21j, an electrical inspection means 21k, a fourth detection means 21l, and a fourth notification means 21m.

[0026] The reading means 21a identifies the printed circuit board 11 set on the transport unit 23 of the rework support device 20 based on information input by the operator operating the operating device 22 (information input from outside) or, for example, character information (character information expressing the name, type, attributes, etc. of the printed circuit board 11 using letters and numbers) 18 contained in the image captured by the imaging unit 30, and reads out from the board information table 26a in the memory unit 26 the appearance image, component identification information, replacement time information, connection risk information, X-ray image, and electrical characteristic information corresponding to the board identification information of the identified printed circuit board 11.

[0027] The printed circuit board 11 may be identified not only based on the input information from the operating device 22 or the character information 18 captured by the imaging unit 30, but also based on the shape and size of the printed circuit board 11 captured by the imaging unit 30.

[0028] The first detection means 21b compares the image captured by the imaging unit 30 with the appearance image read by the reading means 21a to detect any change in the appearance of the set printed circuit board 11 from its initial state as an abnormality.

[0029] Examples of abnormal appearance include cracks C in the substrate main body 11a as shown by the thick line in Fig. 4, scorched portions X in the substrate main body 11a, conductive pattern P, or electrical component 15 as shown by dots in Fig. 4, and foreign matter D attached to the conductive pattern P as shown by the jagged thick line in Fig. 4. Other examples of abnormal appearance include damage or defects to the substrate main body 11a, missing or damaged electrical components, and disconnections (disconnections) in the conductive pattern P due to cracks in the substrate main body 11a.

[0030] When an abnormality is detected by the first detection means 21b, the first notification means 21c notifies the worker by displaying text or an image on the display 4a of the maintenance and inspection unit 4 that the set printed circuit board 11 is not subject to rework.

[0031] If no abnormality is detected by the first detection means 21b, the judgment means 21d judges whether or not an electrical component that has reached the replacement time or is close to the replacement time is mounted on the set printed circuit board 11 based on the replacement time information read by the reading means 21a, and also judges whether or not an electrical component that may cause an abnormality in the connection state (soldering state) to the printed circuit board 11 is mounted on the set printed circuit board 11 based on the connection risk information read by the reading means 21a.

[0032] If the determination means 21d determines that there are no electrical components that have reached the replacement time or are close to the replacement time, the second notification means 21e notifies the worker that there is no need to replace the electrical component by displaying text or an image on the display 4a of the maintenance and inspection unit 4, and if it determines that there are electrical components that have reached the replacement time or are close to the replacement time, the second notification means 21e notifies the worker that there are electrical components that have reached the replacement time or are close to the replacement time, by displaying text or an image on the display 4a of the maintenance and inspection unit 4 together with the component identification information of the electrical component (component identification information read out by the reading means 21a).

[0033] When the determination means 21d determines that an electrical component that may cause an abnormality in the connection state to the printed circuit board 11 is installed, the second detection means 21f compares the image captured by the imaging unit 30 with the appearance image read by the reading means 21a to detect a change from the initial state of the connection state of the electrical component on the set printed circuit board 11 as an abnormality.

[0034] Electrical components that may have an abnormality in their connection to the printed circuit board 11 include, for example, a chip resistor 16 surface-mounted on the board body 11a as shown in Fig. 5, and a DIP 12 with lead pins inserted into through holes in the board body 11a as shown in Fig. 6. Specific examples of abnormalities in the connection of electrical components include cracks Hc in the solder H at the soldered portion between the chip resistor 16 and the conductive pattern P as shown in Fig. 5, and cracks Hc, loss or peeling of the solder H at the soldered portion between the lead pins 12a of the DIP 12 and the conductive pattern P as shown in Fig. 6.

[0035] The third notification means 21g notifies the operator of the detection result of the second detection means 21f by displaying text or images on the display 4a of the maintenance and inspection unit 4.

[0036] If the second detection means determines that there is no abnormality in the connection state, the CT inspection means 21h performs an X-ray CT scan using the X-ray inspection unit 40 on a predetermined location of the set printed circuit board 11.

[0037] The third detection means 21i compares the X-ray image obtained by the CT scan of the CT inspection unit 40 with the X-ray image read by the readout means 21a to detect, as an abnormality, any change from the initial state inside the connection portion of the electrical component on the set printed circuit board 11. An example of an abnormality inside the connection portion of the electrical component is a "crack" that occurs inside the solder at the soldered portion between the electrical component and the conductive pattern P.

[0038] The third notification means 21j notifies the operator of the detection result of the third detection means 21g by displaying text or images on the display 4a of the maintenance and inspection unit 4.

[0039] If either the second detection means or the third detection means determines that there is an abnormality, the electrical inspection means 21k acquires the electrical characteristics of a predetermined specified location on the set printed circuit board 11 using the electrical inspection unit 50.

[0040] The fourth detection means 21l detects any abnormalities in the connection state of the set printed circuit board 11 by comparing the electrical characteristics acquired by the electrical inspection unit 50 with the electrical characteristic information read by the reading means 21a.

[0041] The fourth notification means 21m notifies the operator of the detection result of the fourth detection means 21i by displaying text or images on the display 4a of the maintenance and inspection unit 4.

[0042] [Controller 21 control explanation] The control executed by the controller 21 will be described with reference to the flowcharts of FIGS. When the electrical device 10 is brought into the maintenance and inspection section 4, the worker at the maintenance and inspection section 4 removes the printed circuit board 11 from the brought-in electrical device 10 and sets the removed printed circuit board 11 on the transport unit 23 of the rework support device 20. Then, the worker operates the operation device 22 of the rework support device 20 to input the board name or board identification information of the set printed circuit board 11 and give an instruction to start operation.

[0043] When the printed circuit board 11 is set on the transport path 23a of the transport unit 23 and an instruction to start operation is given (YES in S1), the controller 21 sends the printed circuit board 11 to the imaging unit 30 via the transport path 23a, and the imaging unit 30 captures an image of the appearance of the printed circuit board 11 (S2). Then, the controller 21 reads out from the board information table 26a in the storage unit 26 the appearance image, component identification information, replacement time information, connection risk information, X-ray image, and electrical characteristic information corresponding to the board identification information input via the operation device 22 (S3).

[0044] Next, the controller 21 compares the image captured by the imaging unit 30 with the appearance image read from the board information table 26a to detect any change from the initial state of the appearance of the printed circuit board 11 on the transport path 23a as an abnormality (S4).

[0045] If an abnormality is detected (YES in S5), the controller 21 notifies the display 4a of the maintenance and inspection unit 4 that the set printed circuit board 11 is not a target for rework (S6), and sends the printed circuit board 11 on the transport path 23a from the branching unit 24 via the transport path 23b to the board recovery unit 5 to be discarded (S7). In other words, the printed circuit board 11 is discarded without being reworked.

[0046] If no abnormality in appearance is detected (NO in S5), the controller 21 determines whether or not any electrical components that have reached the replacement time or are close to the replacement time are mounted on the printed circuit board 11 on the transport path 23a based on the replacement time information read from the board information table 26a, and also determines whether or not any electrical components that may cause an abnormality in the connection state (soldering state) are mounted on the printed circuit board 11 on the transport path 23a based on the connection risk information read from the board information table 26a (S8).

[0047] When it is determined that there is no mounted electrical component that has reached the replacement time or is close to the replacement time (NO in S9), the controller 21 notifies the display 4a of the maintenance and inspection unit 4 that there is no need to replace the electrical component (S11). The worker who receives this notification recognizes that there is no need to replace the electrical component.

[0048] When it is determined that an electrical component that has reached its replacement time or is close to its replacement time is mounted (YES in S9), the controller 21 notifies the maintenance and inspection unit 4 on the display 4a thereof that the electrical component needs to be replaced together with the component identification information of the electrical component (component identification information read from the board information table 26a) (S10). Upon receiving this notification, the worker recognizes that the electrical component needs to be replaced and can begin the work of replacing the electrical component.

[0049] If it is determined in the above connection abnormality determination that no electrical components that may cause an abnormality in the connection to the printed circuit board 11 are mounted (NO in S12), the controller 21 notifies the display 4a of the maintenance and inspection unit 4 that there is no risk in the connection (S14). Then, the controller 21 sends the printed circuit board 11 on the transport path 23a to the maintenance and inspection unit 4 without operating the branch unit 24, the X-ray inspection unit 40, the branch unit 25, and the electrical inspection unit 50 (S21). In this case, the worker at the maintenance and inspection unit 4 recognizes that repair of the printed circuit board 11 is not necessary.

[0050] If it is determined that an electrical component that may cause an abnormality in the connection state of the printed circuit board 11 is mounted (YES in S12), the controller 21 notifies the display 4a of the maintenance and inspection unit 4 that there is a risk in the connection state (S13). Subsequently, the controller 21 compares the image captured by the imaging unit 30 with the appearance image read from the board information table 26a to detect a change from the initial state of the connection state of the electrical component on the printed circuit board 11 on the transport path 23a as an abnormality (S15).

[0051] 5, an example of this abnormality is a crack Hc in the solder H at the soldered portion between the chip resistor 16 and the conductive pattern P. Another example of an abnormality is a crack Hc in the solder H at the soldered portion between the lead pin 12a of the DIP 12 inserted and connected to the through hole in the substrate body 11a and the conductive pattern P, as shown in FIG.

[0052] If such cracks Hc in the solder H are detected as an abnormality (YES in S16), or if cracks Hc in the solder H at the soldered portion between the lead pins 12a of the DIP 12 inserted and connected to the through holes in the board body 11a and the conductive pattern P as shown in Fig. 6 are detected as an abnormality (YES in S16), the controller 21 notifies the details of the abnormality on the display 4a of the maintenance and inspection unit 4 (S17). Then, the controller 21 proceeds to an electrical inspection of the printed circuit board 11 on the transport path 23a (S18).

[0053] 5 or 6 is not detected (NO in S16), the controller 21 executes a CT scan using X-rays by the X-ray inspection unit 40 on a predetermined location of the printed circuit board 11 on the transport path 23a (S22).The controller 21 then compares the X-ray image obtained by the CT scan in the CT inspection unit 40 with the X-ray image read out from the board information table 26a to detect a change from the initial state inside the connection portion of the electrical component on the printed circuit board 11 on the transport path 23a as an abnormality (S23).

[0054] An example of an abnormality inside the connection of an electrical component is a crack occurring inside the solder at the soldered portion between the electrical component and the conductive pattern P. If no such abnormality is found (NO in S24), the controller 21 notifies the display 4a of the maintenance and inspection unit 4 that there is no abnormality inside the connection of the electrical component (S25). Then, the controller 21 sends the printed circuit board 11 on the transport path 23a to the maintenance and inspection unit 4 without operating the branching unit 25 and the electrical inspection unit 50 (S21). In this case, the worker at the maintenance and inspection unit 4 recognizes that repairs to the connection of the electrical component are not necessary.

[0055] When an internal abnormality in the connection state is detected in the detection using the X-ray image (YES in S24), the controller 21 proceeds to an electrical inspection of the printed circuit board 11 on the transport path 23a (S18).

[0056] In the electrical inspection (S18), the controller 21 acquires electrical characteristics of predetermined locations on the printed circuit board 11 on the transport path 23a using the electrical inspection unit 50, and compares the acquired electrical characteristics with electrical characteristic information read from the board information table 26a to detect an abnormal location on the printed circuit board 11 on the transport path 23a. If the controller 21 specifically identifies the location of the abnormality during this detection (YES in S19), the controller 21 notifies the display 4a of the maintenance and inspection unit 4 of the identified abnormal location (S20). The controller 21 then sends the printed circuit board 11 on the transport path 23a to the maintenance and inspection unit 4 (S21). In this case, a worker at the maintenance and inspection unit 4 can carry out appropriate repairs on the identified abnormal location.

[0057] As described above, if the printed circuit board 11 brought into the maintenance and inspection department 4 has an external abnormality such as a crack or damage, the rework support device 20 detects this and notifies the worker in the maintenance and inspection department 4 that the printed circuit board 11 is not eligible for rework, so the worker does not have to make the difficult decision of whether or not the board can be reworked. This reduces the burden on the worker.

[0058] The rework support device 20 accurately determines when it is time to replace each electrical component mounted on the printed circuit board 11 and notifies the worker in the maintenance and inspection department 4, which also reduces the burden on the worker, thereby reducing the work time required for rework and improving work efficiency.

[0059] The rework support device 20 also accurately determines whether there is a risk in the connection state of each electrical component mounted on the printed circuit board 11 and notifies the worker in the maintenance and inspection department 4, which also reduces the burden on the worker, thereby reducing the work time required for rework and improving work efficiency.

[0060] Furthermore, if there is a risk in the connection state of each electrical component, the rework support device 20 detects whether there is any external abnormality in the connection state of each electrical component and whether there is any abnormality inside the connection of each electrical component, and if there is an abnormality, the rework support device 20 notifies the worker in the maintenance and inspection department 4, so that the connection state of each electrical component can be properly repaired. Moreover, since the rework support device 20 identifies the part on the printed circuit board 11 where the abnormality has occurred by electrical inspection, the worker can focus their repair work on the abnormal part. This also reduces the work time required for rework and improves work efficiency.

[0061] The reworked printed circuit board 11 is remounted on the electrical device 10 and returned to the user. At this time, the worker in the maintenance and inspection department 4 acquires an external appearance image, an X-ray image, and electrical characteristics of the reworked printed circuit board 11, and updates and stores the acquired external appearance image, X-ray image, and electrical characteristics in the board information table 26a in the storage unit 26. As a result, even if the printed circuit board 11 returned to the user is brought back to the maintenance and inspection department 4, the rework support device 20 can appropriately determine whether or not rework can be performed on the printed circuit board 11 and what the rework content is.

[0062] [Variations] In the above embodiment, the printed circuit board 11 is used as an example of a board on which electrical components are mounted, but the present invention can be applied to other boards, not limited to the printed circuit board 11, as long as they are boards on which electrical components are mounted.

[0063] Furthermore, the above-described embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the inventions and their equivalents as defined in the claims. [Explanation of symbols]

[0064] 4...Maintenance and inspection section, 5...Board recovery section, 10...Electrical equipment, 11...Printed circuit board (board), 20...Rework support device, 21...Controller, 23...Transport unit, 24, 25...Branching section, 30...Imaging section, 40...X-ray inspection section, 50...Electrical inspection section.

Claims

1. A rework support device that supports rework, which is a procedure for repairing a substrate on which electrical components are mounted, an imaging means for imaging the appearance of the substrate set as the target for rework; a first detection means for detecting a change in the appearance of the set substrate from its initial state by comparing an image captured by the imaging means with an appearance image of the set substrate in its initial state; and a first notification means for notifying the user that the set substrate is not a target for the rework when an abnormality is detected by the first detection means; a determining means for determining, when no abnormality is detected by the first detecting means, whether or not an electrical component that has reached or is close to due for replacement is mounted on the set board based on pre-stored information, and for determining, when no abnormality is detected by the first detecting means, whether or not an electrical component that may cause an abnormality in the connection state to the board is mounted on the set board based on pre-stored information; a second notification means for notifying the user that replacement of the electrical component is unnecessary when it is determined by the determination means that no electrical component that has reached its replacement time or is close to its replacement time is installed, and for notifying the user that replacement of the electrical component is necessary when it is determined that any electrical component that has reached its replacement time or is close to its replacement time is installed; a second detection means for detecting a change in the connection state of the electrical components on the set board from the initial state as an abnormality by comparing the image captured by the imaging means with the appearance image of the initial state when the determination means determines that an electrical component that may cause an abnormality in the connection state of the set board is mounted; a second notification means for notifying a result of the detection by the second detection means; A rework support device comprising:

2. a storage means for storing an initial appearance image of each of a plurality of boards on which electric components are mounted, in association with a plurality of pieces of board identification information for identifying each of the boards, storing a plurality of pieces of component identification information for identifying each of the electric components, in association with the respective pieces of board identification information for each of the boards on which the electric components are mounted, storing replacement times for each of the electric components as replacement time information for each of the electric components, in association with the respective piece of component identification information for each of the boards on which the electric components are mounted, and storing whether or not there is a possibility of an abnormality occurring in the connection state of each of the electric components as connection risk information for each of the electric components, in association with the respective piece of component identification information for each of the boards on which the electric components are mounted; a reading means for reading from the storage means the appearance image, the component identification information, the replacement time information, and the connection risk information corresponding to the board identification information of the set board; Furthermore, When no abnormality is detected by the first detection means, the determination means determines whether or not an electrical component that has reached or is close to its replacement time is mounted on the set board based on the replacement time information read by the reading means, and determines whether or not an electrical component that may cause an abnormality in the connection state to the board is mounted on the set board based on the connection risk information read by the reading means. The rework support device according to claim 1 .

3. the reading means identifies the set board based on information input from outside or information included in the image captured by the imaging means, and reads out from the storage means the appearance image, the component identification information, the replacement time information, and the connection risk information corresponding to the board identification information of the identified board. The rework support device according to claim 2.

4. The storage means further stores an initial state X-ray image of each predetermined location of each of the substrates in association with the substrate identification information, The reading means further reads out the X-ray image corresponding to the substrate identification information of the set substrate from the storage means, moreover, a CT inspection means for executing a CT scan using X-rays on the predetermined portion of the set board when the second detection means determines that there is no abnormality in the connection state; and a third detection means for detecting an abnormality in an internal state of a connection portion of an electrical component on the set circuit board by comparing an X-ray image obtained by the CT scan of the CT inspection means with an X-ray image read by the readout means; and a third notification means for notifying a result of the detection by the third detection means; Equipped with The rework support device according to claim 2.

5. The storage means further stores initial state electrical characteristic information at each specified location of each of the substrates in association with each of the substrate identification information; The reading means further reads out the electrical characteristic information corresponding to the substrate identification information of the set substrate from the storage means, moreover, an electrical inspection means for acquiring electrical characteristics of the specified location on the set substrate when either the second detection means or the third detection means determines that there is an abnormality; and a fourth detection means for detecting an abnormality in the connection state of the set board by comparing the electrical characteristics acquired by the electrical inspection means with the electrical characteristic information read by the reading means; a fourth notification means for notifying a result of the detection by the fourth detection means; Equipped with The rework support device according to claim 4.

6. A control method for a rework support device that supports rework, which is a process for repairing a board on which electric components are mounted, and that is equipped with an imaging means for imaging the appearance of a board that is set as a target for the rework, comprising: detecting a change in the appearance of the set substrate from the initial state by comparing the image captured by the imaging means with an appearance image of the set substrate in an initial state; If the abnormality is detected, a notice is given that the set substrate is not a target for the rework; If no abnormality is detected, it is determined based on pre-stored information whether or not an electrical component that has reached or is close to due for replacement is mounted on the set board, and it is also determined based on pre-stored information whether or not an electrical component that may cause an abnormality in the connection state to the board is mounted on the set board, If it is determined that there are no electrical parts that have reached the replacement time or are close to the replacement time, it notifies the user that replacement of the electrical parts is not necessary, and if it is determined that there are electrical parts that have reached the replacement time or are close to the replacement time, it notifies the user that replacement of the electrical parts is necessary; When it is determined that an electrical component that may cause an abnormality in the connection state of the board is mounted, a change in the connection state of the electrical component on the set board from the initial state is detected as an abnormality by comparing the image captured by the imaging means with the appearance image of the initial state, and the detection result is notified. A method for controlling a rework support device.

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