Electronic component and manufacturing method of the electronic component

Abstract

To provide an electronic component capable of improving a bonding strength between an element body and a terminal electrode, and a manufacturing method of the electronic component.SOLUTION: An electronic component 1 includes: an element body 2 having a pair of main surfaces 2a and 2b facing each other and four side surfaces 2c, 2d, 2e, and 2f connecting the pair of main surfaces 2a and 2b; and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, and a sixth terminal electrode 9 which are embedded in the element body 2 on the side surfaces 2e and 2f. The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are configured to include a plurality of terminal conductors 40, 50, 60, 70, 80 and 90, and at least one terminal conductor 40, 50, 60, 70, 80 and 90 of the plurality of terminal conductors 40, 50, 60, 70, 80 and 90 has a tapered surface inclined with respect to a first direction D1.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component and a method for manufacturing an electronic component. [Background technology]

[0002] A known electronic component includes an element body having a pair of opposing main surfaces and four side surfaces connecting the pair of main surfaces, and a plurality of terminal electrodes arranged on each of the four side surfaces (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-135139 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of one aspect of the present invention is to provide an electronic component and a method for manufacturing an electronic component that can improve the bonding strength between an element body and a terminal electrode. [Means for solving the problem]

[0005] (1) An electronic component according to one aspect of the present invention comprises a base body having a pair of opposing main surfaces and four side surfaces connecting the pair of main surfaces, and a terminal electrode embedded in the base body on at least one of the four side surfaces, the terminal electrode including a plurality of terminal conductors, at least one of which has a tapered surface that is inclined relative to the opposing direction of the pair of main surfaces.

[0006] In an electronic component according to one aspect of the present invention, at least one of the plurality of terminal conductors has a tapered surface that is inclined relative to the opposing direction of the pair of main surfaces. This allows the element body to fit into the tapered surface of the terminal electrode. Therefore, in the electronic component, the anchor effect can be used to enhance adhesion between the element body and the terminal electrode. Therefore, in the electronic component, the bonding strength between the element body and the terminal electrode can be improved.

[0007] (2) In the electronic component of (1), the terminal electrodes are exposed on each of the pair of main surfaces and the side surfaces, and the surfaces of the terminal electrodes do not have to protrude from the pair of main surfaces or the side surfaces. In this configuration, since the terminal electrodes do not protrude from the pair of main surfaces, the pair of main surfaces of the electronic component can be made flat.

[0008] (3) In the electronic component of (1) or (2), the terminal conductors may be connected and arranged side by side in a direction perpendicular to the facing direction on the side surface, as viewed from a direction perpendicular to the side surface. In this configuration, a (wide) terminal electrode extending in a direction perpendicular to the facing direction can be formed on the side surface of the element body.

[0009] (4) In the electronic component of (3), the terminal electrodes are exposed on each of a pair of main surfaces, and the shape of the terminal electrodes exposed on one main surface may be different from the shape of the terminal electrodes exposed on the other main surface. In this configuration, the orientation (mounting direction) of the electronic component can be recognized at a glance.

[0010] (5) In any one of the electronic components (1) to (4) above, the tapered surface of the terminal conductor may have a curved shape when viewed from the opposing direction. In this configuration, the entire circumference of the terminal conductor has a tapered surface, which can more effectively obtain the anchor effect. Therefore, in the electronic component, the adhesion between the element body and the terminal electrode can be further improved.

[0011] (6) In the electronic component of any one of (1) to (6), the terminal electrodes are exposed on each of a pair of main surfaces, and the area of ​​the terminal electrodes exposed on one main surface may be different from the area of ​​the terminal electrodes exposed on the other main surface. With this configuration, the orientation (mounting direction) of the electronic component can be recognized at a glance.

[0012] (7) An electronic component according to one aspect of the present invention comprises a base body having a pair of opposing main surfaces and four side surfaces connecting the pair of main surfaces, and a terminal electrode embedded in the base body on at least one of the four side surfaces, the terminal electrode including a plurality of terminal conductors and having projections and recesses in the opposing direction of the pair of main surfaces.

[0013] In an electronic component according to one aspect of the present invention, the terminal electrode includes a plurality of terminal conductors and has irregularities in the opposing direction of the pair of main surfaces. This allows the element body to fit into the irregularities in the terminal electrode. Therefore, in the electronic component, the anchor effect can enhance adhesion between the element body and the terminal electrode. Therefore, in the electronic component, the bonding strength between the element body and the terminal electrode can be improved.

[0014] (8) In the electronic component of (7), the terminal electrodes are exposed on each of the pair of main surfaces and the side surfaces, and the surfaces of the terminal electrodes do not have to protrude from the pair of main surfaces or the side surfaces. In this configuration, since the terminal electrodes do not protrude from the pair of main surfaces, the pair of main surfaces of the electronic component can be made flat.

[0015] (9) In the electronic component of (7) or (8), the terminal conductors may be connected and arranged side by side in a direction perpendicular to the facing direction on the side surface, as viewed from a direction perpendicular to the side surface. In this configuration, a (wide) terminal electrode extending in a direction perpendicular to the facing direction can be formed on the side surface of the element body.

[0016] (10) In the electronic component of any one of (7) to (9), the terminal conductor may have a tapered surface that is inclined relative to the opposing direction of the pair of main surfaces and may have a curved shape when viewed from the opposing direction. In this configuration, the entire periphery of the terminal conductor has a tapered surface, which can more effectively obtain the anchor effect. Therefore, in the electronic component, the adhesion between the element body and the terminal electrode can be further improved.

[0017] (11) In the electronic component of any one of (7) to (10), the terminal electrodes are exposed on each of a pair of main surfaces, and the area of ​​the terminal electrodes exposed on one main surface may be different from the area of ​​the terminal electrodes exposed on the other main surface. With this configuration, the orientation (mounting direction) of the electronic component can be recognized at a glance.

[0018] (12) A method for manufacturing an electronic component according to one aspect of the present invention is a method for manufacturing an electronic component having a base body, a conductor disposed within the base body, and a terminal electrode disposed on the base body, and includes the steps of stacking green sheets to form a laminate, forming conductors on the green sheets, forming via conductors in the green sheets at positions where the terminal electrodes will be formed, and cutting the laminate, and when cutting the laminate, the via conductors are cut to form the terminal electrodes.

[0019] In a method for manufacturing an electronic component according to one aspect of the present invention, via conductors are formed in green sheets at positions where terminal electrodes are to be formed. The green sheets are then stacked to form a laminate, and when the laminate is cut, the via conductors are cut to form the terminal electrodes. In this manner, the method for manufacturing an electronic component allows the terminal electrodes to be formed in the cutting process. Therefore, the manufacturing process for the electronic component can be simplified compared to when the terminal electrodes are formed after cutting the laminate. Furthermore, when terminal electrodes are formed by a dip process, the terminal electrodes protrude from the main surfaces of the element body, but when the terminal electrodes are formed using via conductors, the terminal electrodes do not protrude from the main surfaces. Therefore, an electronic component having a pair of flat main surfaces can be manufactured.

[0020] Furthermore, when the terminal electrode is formed by cutting the via conductor, the terminal electrode has irregularities in the opposing direction of the pair of main surfaces. This allows the element body to fit into the irregularities in the terminal electrode. This allows for an anchor effect, which improves adhesion between the element body and the terminal electrode. This in turn improves the bonding strength between the element body and the terminal electrode.

[0021] (13) In the method for manufacturing an electronic component according to (12), in the step of forming the via conductors, through holes may be formed in the green sheet at positions where terminal electrodes are to be formed, and the through holes may be filled with a conductive paste to form the via conductors. This method allows the formation of terminal conductors.

[0022] (14) In the method for manufacturing an electronic component according to (12) or (13), the step of forming the conductors may include the step of forming via conductors that connect the conductors, and the step of forming the via conductors may be the same as the step of forming the via conductors that connect the conductors. In this method, the via conductors that become terminal electrodes can be formed in the same manner as the via conductors that connect conductors to each other, thereby simplifying the process. [Effects of the Invention]

[0023] According to the present invention, the bonding strength between the element body and the terminal electrodes can be improved. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a perspective view showing an electronic component according to one embodiment. [Figure 2] FIG. 2 is an equivalent circuit diagram of the electronic component shown in FIG. [Figure 3] FIG. 3 is an exploded perspective view of the electronic component shown in FIG. [Figure 4] FIG. 4 is a perspective view showing the configuration inside the element body of the electronic component shown in FIG. [Figure 5] FIG. 5 is a view of the first terminal electrode as seen from the side. [Figure 6] FIG. 6 is a diagram showing a cross-sectional configuration of the first terminal electrode. [Figure 7] FIG. 7 is a diagram showing a part of the manufacturing process of an electronic component. [Figure 8] 8(a) and 8(b) are side views of a first terminal electrode of an electronic component according to another embodiment. [Figure 9] 9(a) and 9(b) are side views of a first terminal electrode of an electronic component according to another embodiment. [Figure 10] 10(a), 10(b), and 10(c) are views of the first terminal electrode as viewed from the main surface side. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and redundant description will be omitted.

[0026] Fig. 1 is a perspective view showing an electronic component according to one embodiment. As shown in Fig. 1, the electronic component 1 includes an element body 2, a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, and a sixth terminal electrode 9. The electronic component 1 is, for example, a multilayer filter. In this embodiment, the electronic component 1 is a diplexer.

[0027] The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The element body 2 has, as its outer surfaces, a pair of opposing main surfaces 2a, 2b, a pair of opposing side surfaces 2c, 2d extending to connect the pair of main surfaces 2a, 2b, and a pair of opposing side surfaces 2e, 2f extending to connect the pair of main surfaces 2a, 2b. The main surface 2a is defined as the surface (mounting surface) that faces another electronic device (not shown) when the electronic component 1 is mounted on the other electronic device (e.g., a circuit board, electronic component, etc.).

[0028] A first direction D1 in which the pair of main surfaces 2a, 2b face each other, a second direction D2 in which the pair of side surfaces 2c, 2d face each other, and a third direction D3 in which the pair of side surfaces 2e, 2f face each other are approximately perpendicular to each other.

[0029] The element body 2 is formed by laminating a plurality of insulator layers 10 (see FIG. 3). Each insulator layer 10 is laminated in a first direction D1. That is, the lamination direction of each insulator layer 10 coincides with the first direction D1. Each insulator layer 10 has a substantially rectangular shape in plan view. In the actual element body 2, each insulator layer 10 is integrated to the extent that the boundaries between the layers are not visible. Each insulator layer 10 is formed, for example, from a sintered ceramic green sheet containing a dielectric material (such as a BaTiO3-based material, a Ba(Ti,Zr)O3-based material, a (Ba,Ca)TiO3-based material, a glass material, or an alumina material).

[0030] The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are arranged on the side surface 2e side of the element body 2. The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are embedded in the element body 2. In the element body 2, the second terminal electrode 5 is located in the center in the second direction D2, the first terminal electrode 4 is located closer to the side surface 2c than the second terminal electrode 5, and the third terminal electrode 6 is located closer to the side surface 2d than the second terminal electrode 5. The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 extend along the first direction D1 on the side surface 2e. The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are exposed on the side surface 2e and on the principal surface 2a and the principal surface 2b. The surfaces of the first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are flush with the side surface 2e, the principal surface 2a, and the principal surface 2b, respectively.

[0031] The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are arranged on the side surface 2f side of the element body 2. The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are embedded in the element body 2. In the element body 2, the fifth terminal electrode 8 is located in the center in the second direction D2, the fourth terminal electrode 7 is located closer to the side surface 2c than the fifth terminal electrode 8, and the sixth terminal electrode 9 is located closer to the side surface 2d than the fifth terminal electrode 8. The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 extend along the first direction D1 on the side surface 2f. The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are exposed on the side surface 2f and on the principal surface 2a and the principal surface 2b. The surfaces of the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are flush with the side surface 2f, the principal surface 2a, and the principal surface 2b, respectively.

[0032] Next, the circuit configuration of the electronic component 1 will be described, followed by the internal configuration of the electronic component 1. As shown in FIG. 2, the electronic component 1 has an input terminal T IN and the first output terminal T OUT1 and the second output terminal T OUT2 and input terminal T IN and the first output terminal T OUT1 a first filter F1 provided on a line S1 connecting the input terminal T IN and the second output terminal T OUT2 a second filter F2 provided on a line S2 connecting the OPEN It is equipped with the following.

[0033] The first filter F1 includes a first LC resonant circuit RC1 and a second LC resonant circuit RC2. The first LC resonant circuit RC1 and the second LC resonant circuit RC2 are connected in series. The first LC resonant circuit RC1 forms a high-pass filter. The first LC resonant circuit RC1 selectively passes a second signal between a first signal having a frequency within a first frequency band and a second signal having a frequency within a second frequency band higher than the first frequency band. The first LC resonant circuit RC1 includes an inductor L1 and three capacitors C11, C12, and C13. The capacitors C11 and C13 are connected in series. The capacitor C12 is connected in parallel with the capacitors C11 and C13. One end of the inductor L1 is connected between the capacitors C11 and C13, and the other end is connected to a ground terminal.

[0034] The second LC resonant circuit RC2 forms a low-pass filter. The second LC resonant circuit RC2 selectively passes the first signal out of the first signal and the second signal. The second LC resonant circuit RC2 includes an inductor L2 and a capacitor C2. The inductor L2 and the capacitor C2 are connected in parallel.

[0035] The second filter F2 includes a third LC resonant circuit RC3, a fourth LC resonant circuit RC4, and a capacitor C. The third LC resonant circuit RC3 and the fourth LC resonant circuit RC4 are connected in series. The third LC resonant circuit RC3 and the fourth LC resonant circuit RC4 form a low-pass filter. The third LC resonant circuit RC3 includes an inductor L3 and a capacitor C3. The inductor L3 and the capacitor C3 are connected in parallel. The fourth LC resonant circuit RC4 includes an inductor L4 and a capacitor C4. The inductor L4 and the capacitor C4 are connected in parallel. One end of the capacitor C is connected between the third LC resonant circuit RC3 and the fourth LC resonant circuit RC4, and the other end is connected to the ground terminal G.

[0036] Open inductor LOPEN has one end connected to the ground terminal G and the other end open.

[0037] The first terminal electrode 4 shown in FIG. 1 constitutes a ground terminal G. The second terminal electrode 5 constitutes an input terminal T IN The third terminal electrode 6 constitutes a ground terminal G. The fourth terminal electrode 7 constitutes a second output terminal T OUT2 The fifth terminal electrode 8 constitutes the ground terminal G. The sixth terminal electrode 9 constitutes the first output terminal T OUT1 The first filter F1, the second filter F2, and the open inductor L OPEN is placed in the prime field 2.

[0038] FIG. 3 is an exploded perspective view of the electronic component 1 shown in FIG. 1. FIG. 4 is a perspective view showing the internal configuration of the element body 2 of the electronic component 1 shown in FIG. 1. As shown in FIGS. 3 and 4, the inductor L1 is composed of coil conductors 12, 15, and 17. The inductor L1 is configured in a loop shape with its axis aligned with the lamination direction. One end of the coil conductor 12 is connected to the fifth terminal electrode 8. One end of the coil conductor 17 is electrically connected to the internal electrode 28 and the internal electrode 31 by via conductors. The coil conductors 12 and 17 are formed, for example, with at least one of Ag and Pd as a conductive material. The coil conductors 12 and 17 are formed as sintered bodies of a conductive paste containing at least one of Ag and Pd as a conductive material. In the following description, the coil conductors and the internal electrodes are formed in the same manner.

[0039] The capacitor C11 is composed of an internal electrode 32 and an internal electrode 34. The internal electrode 34 is connected to the second terminal electrode 5. The capacitor C12 is composed of an internal electrode 31 and an internal electrode 34. The capacitor C13 is composed of an internal electrode 28 and an internal electrode 32.

[0040] The inductor L2 is composed of a coil conductor 13, a coil conductor 16, and a coil conductor 18. The inductor L2 is configured in a loop shape with its axis aligned along the stacking direction. One end of the coil conductor 18 is electrically connected to the internal electrode 32 by a via conductor. The capacitor C2 is composed of the internal electrode 32 and an internal electrode 35. The internal electrode 35 is connected to the sixth terminal electrode 9.

[0041] The inductor L3 is composed of a coil conductor 11 and a coil conductor 14. The inductor L3 is configured in a loop shape with its axis aligned along the lamination direction. One end of the coil conductor 11 is connected to the second terminal electrode 5. The capacitor C3 is composed of an internal electrode 26 and an internal electrode 27. The internal electrode 26 is connected to the second terminal electrode 5. The internal electrode 27 is electrically connected to the coil conductor 22 by a via conductor.

[0042] The inductor L4 is composed of a coil conductor 19 and a coil conductor 22. The inductor L4 is configured in a loop shape with its axis aligned with the stacking direction. One end of the coil conductor 22 is electrically connected to one end of the coil conductor 14 by a via conductor. The capacitor C4 is composed of an internal electrode 30, an internal electrode 27, and an internal electrode 33. The internal electrode 30 is connected to the fourth terminal electrode 7.

[0043] The capacitor C is composed of an internal electrode 29, an internal electrode 36, an internal electrode 27, and an internal electrode 33. The internal electrode 29 is connected to the first terminal electrode 4. The internal electrode 36 is connected to the first terminal electrode 4 and the fifth terminal electrode 8.

[0044] Open inductor L OPEN The open inductor L is composed of a coil conductor 20, a coil conductor 23, a coil conductor 24, and a coil conductor 25. OPEN The open inductor L is formed in a loop shape with its axis aligned along the lamination direction. One end of the coil conductor 20 is connected to the third terminal electrode 6. OPENis disposed at a position facing the inductor L2 of the second LC resonant circuit RC2. That is, the open inductor L OPEN and inductor L2 are adjacent to each other in the lamination direction. OPEN The coil conductor 20 is disposed in a position facing the coil conductor 18 of the inductor L2 (overlapping when viewed from the lamination direction of the element body 2) with the insulating layer 10 sandwiched therebetween.

[0045] As shown in FIG. 3, the first terminal electrode 4 is formed by stacking a plurality of terminal conductors 40. The second terminal electrode 5 is formed by stacking a plurality of terminal conductors 50. The third terminal electrode 6 is formed by stacking a plurality of terminal conductors 60. The fourth terminal electrode 7 is formed by stacking a plurality of terminal conductors 70. The fifth terminal electrode 8 is formed by stacking a plurality of terminal conductors 80. The sixth terminal electrode 9 is formed by stacking a plurality of terminal conductors 90.

[0046] Next, the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 will be described in detail. The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 have the same configuration. Below, the first terminal electrode 4 (terminal conductor 40) will be described in detail as an example.

[0047] Fig. 5 is a view of the first terminal electrode 4 as viewed from the side surface 2e. Fig. 6 is a view showing a cross-sectional configuration of the first terminal electrode 4. As shown in Figs. 5 and 6, the first terminal electrode 4 is composed of a plurality of terminal conductors 40. The first terminal electrode 4 is composed of a plurality of terminal conductors 40 stacked in a first direction D1. In this embodiment, the first terminal electrode 4 is composed of a plurality of terminal conductors 40 stacked linearly in the first direction D1.

[0048] The terminal conductor 40 has a first surface 40A, a second surface 40B, and a side surface 40C. The first surface 40A and the second surface 40B face each other in the first direction D1. The first surface 40A is the surface on the principal surface 2b side. The second surface 40B is the surface on the principal surface 2a side. The first surface 40A and the second surface 40B are semicircular when viewed in the first direction D1. The area of ​​the first surface 40A is larger than the area of ​​the second surface 40B. In other words, the area of ​​the second surface 40B is smaller than the area of ​​the first surface 40A. This causes the first surface 40A and the second surface 40B to have different appearances (sizes).

[0049] The side surface 40C connects the first surface 40A and the second surface 40B. The side surface 40C is a tapered surface. The side surface 40C is inclined with respect to the first direction D1 so as to taper from the first surface 40A toward the second surface 40B. The terminal conductor 40 has a shape obtained by cutting a via conductor having a truncated cone shape in the opposing direction of the first surface 40A and the second surface 40B. In the first terminal electrode 4, the first surface 40A of one terminal conductor 40 and the second surface 40B of the other terminal conductor 40 are arranged to face each other.

[0050] 5, the first terminal electrode 4 has projections and recesses in the first direction D1 when viewed from the third direction D3. As shown in Fig. 6, the first terminal electrode 4 has projections and recesses in the first direction D1 when viewed from the second direction D2. In the first terminal electrode 4, the first surface 40A of the terminal conductor 40 is exposed on the main surface 2b of the element body 2, and the second surface 40B of the terminal conductor 40 is exposed on the main surface 2a of the element body 2.

[0051] Next, a method for manufacturing the electronic component 1 will be described with reference to Fig. 7. Fig. 7 is a diagram showing part of the manufacturing process of the electronic component 1.

[0052] A slurry is prepared by mixing metal magnetic particles, an insulating resin, a solvent, etc. The prepared slurry is applied to a substrate (such as a PET film) by a doctor blade method to form a green sheet that will become the insulator layer 10.

[0053] Next, through holes are formed by laser processing in the green sheet at the positions where the via conductors are to be formed. As shown in Fig. 7, through holes are also formed at the positions where conductors T1, T2, T3, T4, T5, and T6 are to be formed, just like the via conductors. Conductors T1, T2, T3, T4, T5, and T6 are formed at the positions where the first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9 are to be formed, respectively.

[0054] Next, conductive paste is filled into the through holes of the green sheet. The conductive paste is made by mixing conductive metal powder, binder resin, etc. Next, conductors that will become coil conductors and internal electrodes are provided on the green sheet. The coil conductors and internal electrodes are formed by, for example, screen printing the conductive paste. At this time, the conductors are connected to the conductive paste in the through holes.

[0055] Next, the green sheets are stacked. Here, multiple green sheets with conductors provided thereon are peeled from the substrate, stacked, and pressed in the stacking direction to form the laminate 100. At this time, the green sheets are stacked so that the coil conductors and the conductors that will become conductors T1, T2, T3, T4, T5, and T6 overlap in the stacking direction. Each of conductors T1, T2, T3, T4, T5, and T6 is formed by stacking multiple terminal conductors.

[0056] Next, the green sheet laminate 100 is cut into chips of a predetermined size using a cutting machine to obtain green chips P. As shown in Fig. 7, the laminate 100 is cut along cutting lines CL. The cutting lines CL are set to correspond to the green chips P. By cutting the laminate 100 along the cutting lines CL, the green chips P are obtained.

[0057] Conductor T1, conductor T2, conductor T3, conductor T4, conductor T5, and conductor T6 are formed in the laminate 100 by filling the through holes with a conductive paste. Conductor T1, conductor T2, conductor T3, conductor T4, conductor T5, and conductor T6 are formed by laminating conductors that can have the same configuration as via conductors.

[0058] Conductor T1, conductor T2, conductor T3, conductor T4, conductor T5, and conductor T6 are formed so as to be located on cutting line CL. It can also be said that cutting line CL is set so as to be located on conductors T1, conductor T2, conductor T3, conductor T4, conductor T5, and conductor T6. By cutting the laminate 100 along the cutting line CL, parts of conductors T1, conductor T2, conductor T3, conductor T4, conductor T5, and conductor T6 are cut (cut in half), and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, and a sixth terminal electrode 9 are formed.

[0059] Next, the green chip P is fired. The firing removes (decomposes) the binder resin contained in each part. Finally, plating may be applied to the surfaces of the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 to form a plating layer. Through the above steps, the electronic component 1 is obtained.

[0060] As described above, in the electronic component 1 according to this embodiment, the plurality of terminal conductors 40 constituting the first terminal electrode 4 have side surfaces 40C (tapered surfaces) that are inclined with respect to the first direction D1. As a result, in the electronic component 1, the element body 2 fits into the side surfaces 40C of the first terminal electrode 4. The same is true for the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9. Therefore, in the electronic component 1, the anchor effect can improve the adhesion between the element body 2 and the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9. Therefore, in the electronic component 1, the bonding strength between the element body 2 and the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 can be improved.

[0061] In the electronic component 1 according to this embodiment, the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are exposed on the principal surfaces 2a and 2b and the side surfaces 2e and 2f, respectively. The surfaces of the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 do not protrude from the principal surfaces 2a and 2b and the side surfaces 2e and 2f. In this configuration, the principal surfaces 2a and 2b and the side surfaces 2e and 2f do not protrude from the principal surfaces 2a and 2b, respectively, so that the principal surfaces 2a and 2b of the electronic component 1 can be flat.

[0062] In the electronic component 1 according to this embodiment, the side surfaces (tapered surfaces) of the terminal conductors 40, 50, 60, 70, 80, and 90 have a curved shape when viewed from the first direction D1. With this configuration, the entire periphery of the terminal conductors 40, 50, 60, 70, 80, and 90 has a tapered surface, which more effectively achieves the anchor effect. Therefore, in the electronic component 1, the adhesion between the element body 2 and the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 can be further improved.

[0063] In electronic component 1 according to this embodiment, first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9 are exposed on each of principal surfaces 2a and 2b, and the areas of first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9 exposed on principal surface 2a are different from the areas of first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9 exposed on principal surface 2b. With this configuration, the orientation (mounting direction) of electronic component 1 can be recognized at a glance.

[0064] In electronic component 1 according to this embodiment, via conductors are formed in the green sheets at positions where first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9 are to be formed. Green sheets are then stacked to form laminate 100, and when laminate 100 is cut, the via conductors (conductors T1, T2, T3, T4, T5, and T6) are cut to form first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9. In this way, in the method for manufacturing electronic component 1, first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, and sixth terminal electrode 9 can be formed in the cutting step. Therefore, the manufacturing process of electronic component 1 can be simplified compared to when the terminal electrodes are formed after cutting laminate 100. Furthermore, when the terminal electrodes are formed by the dip coating method, the terminal electrodes protrude from the main surfaces 2a and 2b of the element body 2, but when the first, second, 5, third, 6, fourth, 7, fifth, 8, and sixth terminal electrodes 9 are formed using via conductors, the first, second, 5, third, 6, fourth, 7, fifth, 8, and sixth terminal electrodes 9 do not protrude from the main surfaces 2a and 2b. Therefore, an electronic component 1 having flat main surfaces 2a and 2b can be manufactured.

[0065] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0066] In the above embodiment, the first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are arranged on the side surface 2e, and the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are arranged on the side surface 2f. However, terminal electrodes may be arranged on the side surfaces 2c and 2d.

[0067] In the above embodiment, as shown in Fig. 5, an example has been described in which the terminal conductors 40 in the first terminal electrode 4 are linearly arranged (stacked) in the first direction D1. However, the terminal conductors 40 do not have to be linearly arranged in the first direction D1. As shown in Fig. 8(a), for example, adjacent terminal conductors 40 may be arranged so as to be shifted from each other in the second direction D2 (so as to be offset with respect to the first direction D1). The same applies to the terminal conductors 50, 60, 70, 80, 90 of the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9.

[0068] In the above embodiment, an example has been described in which the side surface 40C of the terminal conductor 40 (50, 60, 70, 80, 90) is a tapered surface. However, the configuration of the terminal conductor 40 is not limited thereto. As shown in FIG. 8(b), the side surface 40C of the terminal conductor 40 may extend along the first direction D1. The terminal conductor 40 may have a cubic shape. In this configuration, for example, the first terminal electrode 4 formed by the terminal conductor 40 may have irregularities in the first direction D1.

[0069] In the above embodiment, as shown in Fig. 5, an example has been described in which the terminal conductors 40 are continuously arranged from the principal surface 2a to the principal surface 2b in the first terminal electrode 4. However, as shown in Fig. 9(a), the terminal conductors 40 may be arranged discontinuously in the first direction D1. In the example shown in Fig. 9(a), two sets of multiple terminal conductors 40 are arranged spaced apart in the first direction D1. Furthermore, as shown in Fig. 9(b), the terminal conductors 40 may be arranged with their positions shifted in the second direction D2.

[0070] In the above embodiment, as shown in Fig. 10(a), the first surface 40A (second surface 40B) of the terminal conductor 40 has a semicircular shape. However, as shown in Fig. 10(b), the first surface 40A of the terminal conductor 40 may have a rectangular shape.

[0071] Furthermore, the terminal conductors 40 may be arranged side by side and connected in the first direction D1 on the side surfaces 2e and 2f when viewed from the second direction D2. As shown in FIG. 10(c), for example, the first terminal electrode 4 is configured by connecting multiple terminal conductors 40 (three in the example shown in FIG. 3). The configuration shown in FIG. 10(c) has a shape in which semicircles overlap each other. Specifically, a pair of adjacent semicircles has a shape in which parts of the semicircles overlap. For example, two adjacent semicircles overlap such that the outer periphery of one semicircle passes through the center of the other semicircle. With this configuration, a (wide) terminal electrode extending in the second direction D2 can be formed on the side surfaces 2e and 2f of the element body 2. [Explanation of symbols]

[0072] 1...electronic component, 2...element body, 2a, 2b...main surfaces, 2c, 2d, 2e, 2f...side surfaces, 40, 50, 60, 70, 80, 90...terminal conductors, 40C...side surface (tapered surface), 100...laminated body.

Claims

1. an element body having a pair of main surfaces facing each other and four side surfaces connecting the pair of main surfaces; a terminal electrode embedded in the element body on at least one of the four side surfaces, the terminal electrode is configured to include a plurality of terminal conductors, At least one of the plurality of terminal conductors has a tapered surface that is inclined with respect to the opposing direction of the pair of main surfaces.

2. the terminal electrodes are exposed on the pair of principal surfaces and the pair of side surfaces, The electronic component according to claim 1 , wherein the surfaces of the terminal electrodes do not protrude beyond the pair of main surfaces and the pair of side surfaces.

3. The electronic component according to claim 1 , wherein the plurality of terminal conductors are arranged side by side on the side surface, connected in a direction perpendicular to the opposing direction, when viewed from a direction perpendicular to the side surface.

4. the terminal electrodes are exposed on each of the pair of main surfaces, 4. The electronic component according to claim 3, wherein the terminal electrodes exposed on one of the main surfaces have a different shape from the terminal electrodes exposed on the other main surface.

5. The electronic component according to claim 1 , wherein the tapered surface of the terminal conductor has a curved shape when viewed from the opposing direction.

6. the terminal electrodes are exposed on each of the pair of main surfaces, 3. The electronic component according to claim 1, wherein an area of ​​the terminal electrode exposed on one of the main surfaces is different from an area of ​​the terminal electrode exposed on the other main surface.

7. an element body having a pair of main surfaces facing each other and four side surfaces connecting the pair of main surfaces; a terminal electrode embedded in the element body on at least one of the four side surfaces, The terminal electrode includes a plurality of terminal conductors, and has projections and depressions on the pair of main surfaces in the opposing direction.

8. the terminal electrodes are exposed on the pair of principal surfaces and the pair of side surfaces, The electronic component according to claim 7 , wherein the surfaces of the terminal electrodes do not protrude beyond the pair of main surfaces and the pair of side surfaces.

9. The electronic component according to claim 1 , wherein the plurality of terminal conductors are arranged side by side on the side surface, connected in a direction perpendicular to the opposing direction, when viewed from a direction perpendicular to the side surface.

10. 9. The electronic component according to claim 7, wherein the terminal conductor has a tapered surface that is inclined with respect to the opposing direction of the pair of main surfaces, and has a curved shape when viewed from the opposing direction.

11. the terminal electrodes are exposed on each of the pair of main surfaces, 9. The electronic component according to claim 7, wherein an area of ​​the terminal electrode exposed on one of the main surfaces is different from an area of ​​the terminal electrode exposed on the other main surface.

12. A method for manufacturing an electronic component comprising: an element body; a conductor disposed within the element body; and a terminal electrode disposed on the element body, a step of stacking the green sheets to form a laminate; forming the conductor on the green sheet; forming via conductors in the green sheet at positions where the terminal electrodes are to be formed; and cutting the laminate, The method for manufacturing an electronic component further comprises cutting the via conductors to form the terminal electrodes when cutting the laminate.

13. 13. The method for manufacturing an electronic component according to claim 12, wherein in the step of forming the via conductors, through holes are formed in the green sheet at positions where the terminal electrodes are to be formed, and the through holes are filled with a conductive paste to form the via conductors.

14. The step of forming the conductors includes a step of forming via conductors connecting the conductors, The method for manufacturing an electronic component according to claim 12 or 13, wherein the step of forming the via conductor is the same as the step of forming the via conductor that connects the conductors.

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