Electronic component transport device and electronic component attitude correction device

The electronic component attitude correction device addresses the challenges of conventional posture correction mechanisms by generating vibrations through a shuttle-striking mechanism, ensuring easy installation and adjustable vibration strength for precise posture correction.

JP2025157879APending Publication Date: 2025-10-16NS TECH INC
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Patent Information

Application Number
JP2024060197
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-04-03
Publication Date
2025-10-16

AI Technical Summary

Technical Problem

Conventional mechanisms for correcting the posture of electronic components in handler devices require additional drive sources like motors and air pipes, necessitating installation work and modifications, and struggle to finely adjust vibration strength as devices become smaller.

Method used

An electronic component attitude correction device that generates vibrations by striking a shuttle using a vibration generator with a roller and contact member, eliminating the need for additional drive sources and allowing for adjustable vibration strength without requiring installation of motors or air pipes.

Benefits of technology

Enables easy installation and fine adjustment of vibration strength to correct the attitude of electronic components, improving posture correction efficiency without additional hardware modifications.

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Abstract

To provide an electronic component attitude correction device that does not require an additional drive source, is easy to install, and can adjust the strength of vibration to correct the attitude of the device, and an electronic component transport device comprising the electronic component attitude correction device.SOLUTION: An electronic component attitude correction device for correcting the attitude of an electronic component on a shuttle for transporting an electronic component, the electronic component attitude correction device having a vibration generator that strikes the shuttle from a lateral side relative to an electronic component transport direction of the shuttle to generate vibrations, and a contact member that moves together with the shuttle and collides with the vibration generator. An electronic component transport device has the electronic component attitude correction device in which the contact member collides with the vibration generator as the shuttle moves, so that the vibration generator moves and strikes the shuttle.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present invention relates to an electronic component transport device and an electronic component attitude correcting device. [Background technology]

[0002] There is a handler device that sets electronic device components in a tester, tests their electrical characteristics, and then classifies them into good or bad products based on the test results. Conventionally, mechanisms have been proposed for this handler device that correct the orientation of devices placed on a tray. For example, Patent Document 1 discloses that an impact applying member is provided between an area in the handler device where inspected devices are collected onto a tray (device collection area 16) and an area where the tray is ejected (tray removal area 12). The impact applying member applies an impact to the tray, thereby enabling devices that protrude from the tray's pockets to be properly stored within the pockets.

[0003] In addition, there are mechanisms that apply vibration to correct the device's posture. Examples of vibration mechanisms include those that use a motor to generate vibrations and those that use air to generate vibrations. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-79894 Summary of the Invention [Problem to be solved by the invention]

[0005] In either of the above mechanisms, various devices must be installed inside the handler to generate shocks and vibrations. Specifically, drive sources such as compression pumps and motors, and power transmission devices such as air pipes, electric cables, and valves are required. Furthermore, space must be secured within the handler to accommodate these devices. Adding these devices to an existing handler requires installation work, and modifications may be required to properly install the electric cables and air pipes.

[0006] Another issue is that when the mechanism for correcting the device's posture uses electricity or air as a driving source to apply shock or vibration, it is difficult to adjust the strength of the vibration. As devices become smaller, it is desirable to be able to finely adjust the strength of the vibration to properly correct the posture. However, this has been difficult to achieve with the conventional mechanisms described above.

[0007] Therefore, the present application aims to provide an electronic component attitude correction device that does not require an additional drive source, is easy to install, and is capable of adjusting the strength of vibration to correct the attitude of the device, and an electronic component conveying device equipped with an electronic component attitude correction device. [Means for solving the problem]

[0008] (1) a vibration generator that generates vibrations by striking a shuttle that transports electronic components from the side of the shuttle in the direction of transport of the electronic components; a contact member that moves with the shuttle and impacts the vibration generator; an electronic component attitude correcting device for correcting the attitude of electronic components on the shuttle, the electronic component attitude correcting device comprising: a vibration generator that moves and strikes the shuttle when the contact member collides with the vibration generator as the shuttle moves.

[0009] (2) The electronic component conveying device described in (1) above, characterized in that the vibration generator has a roller that collides with the contact member, and when the roller collides with the contact member and is pushed down below the contact member, the vibration generator rotates toward the shuttle and hits the shuttle.

[0010] (3) the contact member is disposed below the shuttle; The electronic component transport device described in (2) above is characterized in that the vibration generator is fixed at a position adjacent to the shuttle and has an L-shaped rotating member, the roller, and an impact part that hits the shuttle, the roller is located at one end of the rotating member and below the shuttle, the impact part is located at the other end of the rotating member and to the side of the shuttle, and the rotating member is supported and rotated by a rotating shaft located between the roller and the impact part.

[0011] (4) An electronic component conveying device as described in (3) above, characterized in that the collision portion of the contact member that collides with the roller is located downwardly away from the underside of the shuttle and protrudes outward in the width direction of the shuttle.

[0012] (5) The electronic component conveying device described in (3) above, characterized in that the vibration generator has a spring that applies force to the rotating member in a direction that causes the striking portion to move away from the position where it strikes the shuttle, and when the roller is not pressed down by the contact member, the spring causes the striking portion to move away from the shuttle.

[0013] (6) The electronic component transport device according to (1) above, characterized in that the shuttle is reciprocated to cause the vibration generator and the contact member to collide continuously, thereby generating continuous vibrations in the shuttle.

[0014] (7) The electronic component transport device described in (1) above, characterized in that when the shuttle moves to a predetermined position upstream in the electronic component transport direction from a transport position for transferring the electronic component to a test socket, the vibration generator and the contact member collide.

[0015] (8) The electronic component conveying device described in (7) above, characterized in that when the shuttle moves to a predetermined position upstream in the electronic component conveying direction from a receiving position where electronic components are received from a supply robot that supplies electronic components, the vibration generator and the contact member collide with each other.

[0016] (9) An electronic component transport device according to (7) or (8) above, further comprising an electronic component posture sensor for detecting improper posture of an electronic component on the shuttle, and when the electronic component posture sensor detects improper posture of an electronic component, the shuttle is moved to cause the contact member to collide with the vibration generator, thereby generating vibration in the shuttle.

[0017] (10) An electronic component conveying device as described in (1) above, characterized in that it performs a first posture correction process in which vibration is generated by collision between the vibration generator and the contact member, and a second posture correction process in which vibration is generated by reciprocating the shuttle at a position where the vibration generator and the contact member do not collide.

[0018] (11) A vibration generator that generates vibrations by striking a shuttle that transports electronic components in an electronic component transport device from the side of the shuttle in the electronic component transport direction; a contact member fixed to the shuttle, moving together with the shuttle and colliding with the vibration generator; and a vibration generator that moves and strikes the shuttle when the contact member collides with the vibration generator as the shuttle moves.

[0019] (12) The electronic component attitude correction device described in (11) above, characterized in that the vibration generator has a roller that collides with the contact member, and the roller collides with the contact member and is pushed down below the contact member, causing the vibration generator to rotate to hit the shuttle.

[0020] (13) The contact member is used by being fixed below the shuttle, The electronic component attitude correction device described in (12) above is characterized in that the vibration generator is fixed at a position adjacent to the shuttle in the electronic component transport device, and has an L-shaped rotating member, the roller, and an impact part that hits the shuttle, the roller is arranged on one end side of the rotating member, the impact part is arranged on the other end side of the rotating member, and the rotating member is supported and rotated on a rotating shaft located between the roller and the impact part.

[0021] (14) The electronic component attitude correction device described in (13) above, characterized in that the contact member is used by fixing the collision portion that collides with the roller downward and away from the underside of the shuttle, and the collision portion protrudes outward from the fixing portion that fixes it to the shuttle.

[0022] (15) The electronic component attitude correction device according to (13) above, characterized in that the vibration generator has a spring that applies a force to the rotating member in a direction away from the position where the striking portion strikes the shuttlecock. [Effects of the Invention]

[0023] According to the present invention, the present application provides an electronic component attitude correction device that does not require an additional drive source, is easy to install, and is capable of adjusting the strength of vibration to correct the attitude of a device, and an electronic component conveying device equipped with an electronic component attitude correction device. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a schematic diagram of an electronic component transport device according to an embodiment of the present invention; [Figure 2] 2 is a schematic diagram illustrating the configuration and operation of an electronic component attitude correcting device. FIG. [Figure 3] 2 is a schematic diagram illustrating the configuration and operation of an electronic component attitude correcting device. FIG. [Figure 4] 2 is a schematic diagram illustrating the configuration and operation of an electronic component attitude correcting device. FIG. [Figure 5]2 is a schematic diagram illustrating the configuration and operation of an electronic component attitude correcting device. FIG. [Figure 6] FIG. 2 is a block diagram illustrating a configuration for controlling the operation of the electronic component transport device. [Figure 7] 10A and 10B are diagrams illustrating an example of the position of the shuttle when the contact members collide. DETAILED DESCRIPTION OF THE INVENTION

[0025] (First embodiment) An electronic component conveying device 1 according to this embodiment will be described with reference to the drawings. FIG. 1 is a schematic plan view illustrating an example of the configuration of the electronic component conveying device 1. FIGS. 2 to 5 are schematic diagrams illustrating the configuration and operation of an electronic component orientation correction device 30. FIG. 6 is a block diagram illustrating a configuration for controlling the operation of the electronic component conveying device 1. The electronic component conveying device 1 is a so-called handler device that automatically supplies fully assembled devices to a tester under a predetermined measurement environment and automatically sorts and stores them based on the inspection results. The electronic component conveying device 1 according to this embodiment includes an electronic component orientation correction device 30. The electronic component orientation correction device 30 corrects the orientation of devices placed on a shuttle that transports the devices to the correct orientation. The electronic component orientation correction device 30 can correct the orientation of the devices by applying vibration by striking the side of the shuttle using a mechanism that operates using the shuttle's reciprocating motion. Therefore, this embodiment can correct the orientation of the devices without installing additional drive sources, wiring, piping, etc.

[0026] The "device" whose posture is to be corrected here is an electronic component such as an IC (Integrated Circuit) device. Examples of IC devices include LSI (Large Scale Integration), CMOS (Complementary Metal Oxide Semiconductor), CCD (Charge Coupled Device), a modular IC in which multiple modules are packaged, a quartz device, a pressure sensor, an inertial sensor, an acceleration sensor, a gyro sensor, and a fingerprint sensor.

[0027] An overview of the electronic component transport device 1 will be described. The electronic component transport device 1 transports devices along a path indicated by a dashed arrow 50 in FIG. 1 . When the electronic component transport device 1 transports the devices to a test socket 34, a tester performs a predetermined inspection. The electronic component transport device 1 sorts and collects the devices based on the inspection results and stores them in the appropriate locations. The electronic component transport device 1 of this embodiment includes a tray loader 10, a supply robot 14, a hot plate 16, an empty tray transport robot 18, an empty tray buffer 20, a shuttle 22, an electronic component orientation correction device 30, an electronic component orientation sensor 31, a measuring robot 32, a test socket 34, a collection robot 40, a tray unloader 42, a fixed tray 44, and a control unit 60. The shuttle 22, the electronic component orientation correction device 30, the electronic component orientation sensor 31, the control unit 60, and other components realize the electronic component orientation correction function. Note that the configuration of the electronic component transport device 1 shown in FIG. 1 is merely an example and is not limited to this configuration. Mechanisms related to unnecessary functions or parts of multiple mechanisms that share functions may be omitted, and additional mechanisms may be added as necessary. The layout of each part is also not limited to the example in Figure 1.

[0028] The configuration and function of each part of the electronic component conveying device 1 will be described below. The electronic component conveying device 1 can be broadly divided into a device supply area, an inspection area, and a collection area. A tray loader 10 in the supply area transports a tray T on which devices are placed to a supply stage 12. The tray loader 10 transports the tray T, for example, using a conveyor. A supply robot 14 transfers the devices from the tray on the supply stage 12 to a supply-side pocket 24 of a shuttle 22 using a suction hand that moves in the XY (two-axis) and Z-axis directions using an arm. When a device is to be subjected to high-temperature inspection (or low-temperature inspection), the supply robot 14 transfers the device to a hot plate 16, where it is heated (or cooled), and then transferred to the supply-side pocket 24 of the shuttle 22. An empty tray transport robot 18 transports an empty tray from the supply stage 12 to an empty tray buffer 20. When an empty tray is needed, the empty tray transport robot 18 further transports the empty tray from the empty tray buffer 20 to a collection stage 43 of a tray unloader 42.

[0029] Next, shuttles 22 (22a, 22b) in the test area transport the devices in the supply pocket 24 to the position (transport position) of the measurement robot 32 and transport the inspected devices placed in the collection pocket 26 to a position where the collection robot 40 collects them (the position of shuttle 22b in Figure 1). The shuttle 22 is a linear transport mechanism that moves back and forth, for example, using a linear actuator mechanism. In this embodiment, two shuttles, shuttle 22a and shuttle 22b, are provided, which transport devices alternately. The supply pocket 24 and the collection pocket 26 are formed on shuttle jigs 23 located at both ends of the shuttle 22. The shuttle jigs 23 can be arranged with an appropriate number, size, and shape of pockets depending on the size of the devices to be handled. The electronic component orientation correction device 30 strikes the side of the shuttle 22 to generate vibrations, thereby correcting the orientation of the devices and ensuring proper seating in the pockets. For example, if the electronic component orientation sensor 31 detects that a device is not properly seated, the electronic component orientation correction device 30 can correct the orientation of the device. The details of the electronic component attitude correction device 30 will be described later. The measuring robot 32 uses a suction hand that moves in the Y-axis and Z-axis directions by an arm to transfer the device to be inspected from the supply-side pocket 24 of the shuttle 22 to the test socket 34, and transfers the inspected device from the test socket 34 to the collection-side pocket 26. The test socket 34 is a socket into which a device is attached when the electrical characteristics, etc. of the device are inspected by a tester (electronic component inspection device) not shown.

[0030] Next, the collection robot 40 in the collection area uses its suction hand, which moves in the XY (two axes) and Z directions, to hold the devices in the collection pocket 26 and transfer them to one of the collection trays corresponding to the tester's inspection results. The user can set the inspection results for each collection tray as desired, such as "good" or "bad." In the example shown in FIG. 1, the collection tray is tray T in the tray unloader 42 or fixed tray 44. The tray unloader 42 transports tray T, on which the inspected devices are placed, from the collection stage 43 and stores it in an appropriate location. The tray unloader 42 transports the devices, for example, using a conveyor. Tray T is fixed to the fixed tray 44, and the collection robot 40 places the devices with the corresponding inspection results. When tray T becomes full of devices, it is replaced with a new tray as appropriate. In FIG. 1, three tray unloaders 42 and three fixed trays 44 are provided, but this number is not limited to three; two or fewer, four or more, may be provided. 1 may also be provided. The empty tray loader 46 is a mechanism for loading empty trays, and the empty tray unloader 48 is a mechanism for unloading empty trays. These can be configured with conveyors similar to those of the tray loader 10.

[0031] Next, the operation control portion of the electronic component conveying device 1 will be described with reference to Fig. 6. The electronic component conveying device 1 includes a control unit 60. The control unit 60 controls various operations and processes of the electronic component conveying device 1. Specifically, the control unit 60 controls the shuttle drive motor 22m that is the drive source for the shuttle 22, the above-mentioned robots, the tray loader 10, etc. The control unit 60 can control the posture correction process based on the detection signal of the electronic component posture sensor 31.

[0032] The control unit 60 includes a control circuit 62 and a memory unit 64. The memory unit 64 stores an attitude correction processing program 66 and other control programs. The control circuit 62 is a circuit that executes the control programs stored in the memory unit 64 to perform various processes. The control circuit 62 executes the attitude correction processing program 66 to perform attitude correction processing of the device according to this embodiment. The control circuit 62 is, for example, a central processing unit (CPU) or a micro processing unit (MPU). The memory unit 64 may be, for example, a semiconductor storage device such as a flash memory, a hard disk drive (HDD) or other magnetic storage device, an optical storage device, or any combination thereof. The control unit 60 may also include an application specific integrated circuit (ASIC) that executes a program to implement some or all of the functions.

[0033] The shuttle drive motor 22m is the drive source of a linear actuator mechanism that linearly moves the shuttle 22. A servo motor or a stepping motor, for example, can be used as the shuttle drive motor 22m. The shuttle drive motor 22m is controlled by the control unit 60, and can move the shuttle 22 to a desired position.

[0034] The electronic component posture sensor 31 is a sensor that detects improper posture of a device. The electronic component posture sensor 31 can detect when a device placed in the supply-side pocket 24 of the shuttle 22 by the supply robot 14 is not seated correctly in the pocket. For example, the electronic component posture sensor 31 can detect when a device is tilted and partially touching the inner wall of the pocket, causing it to float. The electronic component posture sensor 31 can be any sensor that can detect the posture of a device, and is not limited to this, but can be, for example, a photoelectric sensor, a fiber sensor, a laser sensor, or an image sensor.

[0035] Next, the electronic component attitude correcting device 30 of this embodiment will be described in detail with reference to FIGS. 2 to 5. FIGS. 2 and 3 are views of the shuttle 22 (22a) as seen from the upstream side (the direction of arrow A in FIG. 1) in the device conveying direction (X-axis direction). FIGS. 4 and 5 are views of the shuttle 22 as seen from diagonally below. In FIGS. 4 and 5, the top plate B is shown in perspective. The electronic component attitude correcting device 30 has a vibration generator 300 and a contact member 320. The vibration generator 300 is installed on the top plate B of the electronic component conveying device 1. The contact member 320 is installed relative to the shuttle 22 and moves together with the shuttle 22. As the shuttle 22 moves (in the X-axis direction in this embodiment), the contact member 320 hits the vibration generator 300, causing the vibration generator 300 to move and strike the shuttle 22. In other words, the vibration generator 300 converts the linear motion of the shuttle 22 into rotational motion by utilizing the collision between the contact member 320 and the vibration generator 300, and strikes the shuttle 22, thereby applying vibration. This vibration and impact can correct the device's orientation. The position and timing at which the electronic component orientation correction device 30 generates vibration can be set arbitrarily depending on the shape and arrangement of each part. The vibration generator 300 and the contact member 320 may be placed on either side (one or both sides) of the shuttle 22 in the width direction (Y-axis direction), as long as they are placed on the side that is easiest for placement.

[0036] The configuration of the electronic component attitude correction device 30 will be described. First, the configuration of the vibration generator 300 will be described. The vibration generator 300 has a rotating member 302, a base 304, a rotating shaft 306, a striking portion 308, a roller 310, a spring 312, a pressing member 314, and the like. The vibration generator 300 is disposed adjacent to the side and below the shuttle 22. The vibration generator 300 can be disposed near the upstream end of the movement range of the shuttle 22 in the device transport direction (electronic component transport direction).

[0037] Each part of vibration generator 300 will be described. Rotating member 302 is an L-shaped member, and is rotatably supported on rotating shaft 306. Rotating shaft 306 is supported by base 304. Roller 310 is arranged on one end of rotating member 302, and striking section 308 is arranged on the other end. The roller 310 side is below shuttle 22, and the striking section 308 side is to the side of shuttle 22. Rotating shaft 306 is located at a corner of the L shape between roller 310 and striking section 308. The corner where rotating shaft 306 is located is outside the corner below shuttle 22, and rotating member 302 is shaped to follow the cross-sectional shape of one side of shuttle 22 below.

[0038] The striking portion 308 is a member that strikes the side of the shuttle 22 when the vibration generator 300 is operating. The striking portion 308 protrudes from the other end of the rotating member 302 toward the shuttle 22, and the protruding tip hits the shuttle 22 when striking. In this embodiment, the striking portion 308 strikes the side (the inclined side portion) of the shuttle jig 23 having the supply-side pocket 24. The shape and material of the striking portion 308 are not particularly limited as long as they can strike the shuttle 22 and generate vibrations. For example, the shape can be like the head of a hammer as shown in FIG. 2. The material can be, for example, a metal such as stainless steel (e.g., SUS420J2), rubber, or synthetic resin.

[0039] Roller 310 is a member that collides with contact member 320 and generates a moment that rotates rotating member 302. Roller 310 is rotatably supported on a shaft that extends forward (toward the center of shuttle 22) from one end of rotating member 302. When roller 310 collides with contact member 320, which moves relatively, roller 310 rotates, overcomes the step of contact member 320, and is pushed down below contact member 320. There are no particular restrictions on the material of roller 310 as long as it can rotate when it collides with contact member 320, but for example, metal such as stainless steel (e.g., SUS440C), rubber, or synthetic resin can be used.

[0040] Spring 312 is a member that applies force to rotating member 302 in a direction that moves striking portion 308 away from the position where striking portion 308 strikes shuttlecock 22 (see FIG. 3). In this embodiment, spring 312 pushes the roller 310 side of rotating member 302 from below upward. When roller 310 is not pressed down by contact member 320, spring 312 causes rotating member 302 to tilt outward from shuttlecock 22, and striking portion 308 maintains a state separated from shuttlecock 22. This allows striking portion 308 to strike shuttlecock 22 only when roller 310 is pressed down. Note that a configuration in which a spring pulls rotating member 302 toward the outside of shuttlecock 22 may be used. The spring may be replaced with another elastic member, etc., as long as it can apply a force similar to that of spring 312.

[0041] The presser member 314 is a member that restricts the rotation range of the rotating member 302. The presser member 314 can stop the rotating member 302, which rotates in a direction in which the striking portion 308 moves away from the shuttle 22, at a predetermined position. The presser member 314 of this embodiment is disposed outward of the rotating member 302 in the width direction of the shuttle 22. The presser member 314 can be shaped like the head of a hammer, for example, as shown in FIG. 2. The portion of the presser member 314 that comes into contact with the rotating member 302 can be made of metal, rubber, or synthetic resin.

[0042] The base 304 is a member that supports the above-mentioned components and is fixed onto the top plate B of the electronic component transporting device 1.

[0043] Next, the configuration of the contact member 320 of the electronic component attitude correcting device 30 will be described. The contact member 320 is fixed to the shuttle 22 and moves together with the shuttle 22. The contact member 320 has the function of pressing down the roller 310 of the vibration generator 300 when it collides with the roller 310 at a predetermined collision position. The contact member 320 of this embodiment has a collision portion 320a that collides with the roller 310. The collision portion 320a protrudes outward (toward the roller 310) in the width direction of the shuttle 22.

[0044] In this embodiment, the contact member 320 is attached to the bottom side of the shuttle 22. As described above, the shuttle 22 is moved by, for example, a linear actuator mechanism. In this embodiment, the linear actuator mechanism is, for example, composed of a carriage 28, a rail 29, a timing belt (not shown), a shuttle drive motor 22m, and the like. As shown in Figures 2 and 4, the shuttle 22 is fixed to the carriage 28, and when the carriage 28 is driven by the timing belt, it can move back and forth in the X-axis direction along the rail 29. The rail 29 is fixed on the top board B. In this embodiment, the contact member 320 is fixed to the bottom of the connecting member 22A. The connecting member 22A is a member for fixing the shuttle 22 to the carriage 28, and is located between the underside of the shuttle 22 and the carriage 28.

[0045] The contact member 320 of this embodiment has a collision portion 320a and a fixing portion 320b. The collision portion 320a is a portion that collides with the roller 310. The collision portion 320a protrudes outward from the fixing portion 320b and, when fixed to the shuttle 22, protrudes outward in the width direction of the shuttle 22 (toward the roller 310). The fixing portion 320b is a portion for fixing to the shuttle 22 and, in this embodiment, is disposed in front of the carriage 28 in the X-axis direction. The collision portion 320a is formed at one end of the L-shaped contact member 320. Furthermore, in this embodiment, the collision portion 320a is located downward from the underside of the shuttle 22 in the Z-axis direction by the thickness of the connecting member 22A. When the contact member 320 has the shape and is disposed in the position described above, it can be retrofitted to an existing shuttle 22 without any modification.

[0046] The shape and fixed position of the contact member 320 are merely examples, and the collision portion 320a may be located at a position where the vibration generator 300 is to apply vibration to the shuttle 22, and the shape and fixed position are not limited to those shown. Specifically, if there are two rows of supply-side pockets 24 in the device conveyance direction, the shape and fixed position may be such that the vibration generator 300 strikes the shuttle 22 near the center of the rows. The positions of the contact member 320 (and roller 310) in the Y-axis and Z-axis directions may be within a range where the contact member 320 and roller 310 can collide with each other. Furthermore, the position of the contact member 320 (and roller 310) in the Z-axis direction may be such that the roller 310 moves downward upon collision. Specifically, the collision portion 320a and roller 310 may be located in a position where the collision portion 320a strikes the upper side of the roller 310.

[0047] Furthermore, spring 312 may have a guide pin that guides the expansion and contraction of the spring in the axial direction. The guide pin can also function as a stopper in the contraction direction of spring 312, limiting the rotation of rotating member 302 when pressed down by contact member 320. By setting the guide pin to an appropriate length and limiting the downward movement of roller 310, collision portion 320a can also be slightly deformed and operated to ride on roller 310 upon collision. In this case, collision portion 320a is pushed up in the Z-axis direction, generating vibration in shuttle 22 in the Z-axis direction. Since collision portion 320a is separated from the underside of shuttle 22, collision portion 320a can be displaced in the Z-axis direction, generating the vibration. This vibration can also be used to correct the device's attitude.

[0048] The operation of the electronic component orientation correction device 30 will now be described. As shown in FIG. 4, when correcting the orientation of a device, the shuttle 22 is moved to move the contact member 320 to the collision position with the vibration generator 300. When the collision portion 320a of the contact member 320 collides with the roller 310 of the vibration generator 300, the roller 310 is pushed downward. As shown in FIGS. 3 and 5, the roller 310 side of the rotating member 302 is lowered, causing the striking portion 308 side to rotate toward the shuttle 22 and fall toward the shuttle 22, and the striking portion 308 strikes the shuttle 22. The striking of the shuttle 22 generates vibrations, shaking the misaligned device and seating it in the supply-side pocket 24 with the correct orientation. When the contact member 320 moves forward or backward from the collision position and the roller 310 disengages from the contact member 320, the spring 312 pushes the rotating member 302 upward, causing it to fall outside the shuttle 22, and the striking portion 308 returns to its position away from the shuttle 22. Note that continuous vibrations can also be generated by shuttle 22 reciprocating and causing continuous collisions between vibration generator 300 and contact member 320. For example, continuous vibrations can be generated when collision part 320a passes through roller 310 and moves back and forth between the front and rear of roller 310, or when collision part 320a does not pass through roller 310 and moves back and forth between the position before collision and the position where roller 310 is pushed down (i.e., when collision part 320a and roller 310 do not overlap and the position where they overlap in the X-axis direction).

[0049] Where on the shuttle 22 the vibration generator 300 strikes and to what position the shuttle 22 moves to cause vibration can be set appropriately depending on the arrangement position and shape of the vibration generator 300 and the contact member 320. The position on the shuttle 22 in the X-axis direction that the vibration generator 300 strikes is as described above. The position on the shuttle 22 moving to cause vibration can be determined depending on the collision position between the vibration generator 300 and the contact member 320. The collision position can be set to any position depending on the arrangement position and shape of the vibration generator 300 and the contact member 320, as described above. Figure 7 shows an example of the position of the shuttle 22 when it is struck by the vibration generator 300 (shuttle position at collision). In the example of FIG. 7 , the collision position is set so that the contact member 320 collides with the roller 310 when the shuttle 22 is at a collision shuttle position (the position of shuttle 22a shown by the solid line) further upstream in the device transport direction than the receiving position (the position of shuttle 22a shown by the dashed line) where the shuttle 22 receives the device from the supply robot 14 to the supply pocket 24. In this case, if it is detected at the receiving position that the device transported to the supply pocket 24 is not seated in the correct orientation, the shuttle 22 is moved upstream in the device transport direction to generate vibrations and perform an orientation correction process. If the device is placed in the correct orientation by the supply robot 14, the shuttle 22 can be moved directly in the device transport direction without performing the orientation correction process. The collision position and the collision shuttle position of the contact member 320 may be the same in the X-axis direction for shuttles 22a and 22b.

[0050] The following describes the flow of the device attitude correction process (attitude correction method) performed by the electronic component attitude correction device 30 in the electronic component transport device 1. The flow of the attitude correction process described below as an example will be explained for the case where the shuttle position at the time of collision of the shuttle 22 is set to the position shown in Fig. 7 (upstream of the receiving position in the device transport direction).

[0051] First, the control unit 60 moves the shuttle 22a to the receiving position and controls the supply robot 14 to place the device in the supply pocket 24 of the shuttle 22a. The control unit 60 then causes the electronic component attitude sensor 31 on the shuttle 22a to detect whether or not the device is in a proper attitude and acquires the detection result. If the device is placed in the supply pocket 24 in the correct attitude and no attitude error is detected, the control unit 60 drives the shuttle drive motor 22m to move the shuttle 22a to a transfer position next to the test socket 34. On the other hand, if the electronic component attitude sensor 31 detects that the device is in a proper attitude relative to the supply pocket 24, the control unit 60 drives the shuttle drive motor 22m to move the shuttle 22a upstream in the device transfer direction (toward the shuttle position at the time of collision). Then, the contact member 320 collides with the roller 310, causing the vibration generator 300 to generate vibrations in the shuttle 22a.

[0052] In this case, the number of collisions between the two (i.e., the number of times that striking unit 308 hits shuttle 22a) in one cycle of the posture correction process can be set to any number. Control unit 60 operates shuttle drive motor 22m to reciprocate shuttle 22 so as to hit shuttle 22a a preset number of times. When reciprocating, it can also be appropriately set whether collision unit 320a is caused to reciprocate so as to pass roller 310 as described above, or whether it is caused to reciprocate without passing through roller 310.

[0053] Once one cycle of the attitude correction process is complete, the control unit 60 returns the shuttle 22a to the receiving position and has the electronic component attitude sensor 31 detect again whether or not there is an attitude error. If the attitude error has been resolved, the control unit 60 moves the shuttle 22a to the transfer position. If the attitude error has not been resolved, the control unit 60 can execute the attitude correction process again. When the shuttle 22a moves to the transfer position to the test socket 34, the other shuttle 22b moves to the receiving position, and the attitude correction process is executed for the shuttle 22b in the same manner.

[0054] The above processing makes it possible to correct the attitude of a device placed in the pocket of shuttle 22. Vibration in the Y-axis direction can be generated by vibration generator 300 hitting shuttle 22, and vibration in the X-axis direction can also be generated by shuttle 22 reciprocating. By controlling shuttle drive motor 22m and changing the movement speed and acceleration of shuttle 22, it is possible to freely adjust the strength of vibration generated by vibration generator 300 and the strength of vibration generated by the reciprocating motion of shuttle 22. The strength of vibration can also be finely adjusted depending on the size and mass of the device.

[0055] According to the present embodiment described above, if a device is not placed in the correct orientation in the pocket of the shuttle 22, the electronic component orientation correction device 30 can correct the device to the correct orientation. Furthermore, the electronic component orientation correction device 30 generates vibrations in the shuttle 22 by utilizing the reciprocating motion of the shuttle 22 as it transports the device, so the orientation correction process can be performed without installing a separate drive source for the orientation correction process. The electronic component orientation correction device 30 can also be retrofitted to an existing electronic component transport device owned by the user. Because the electronic component orientation correction device 30 of this embodiment does not use a separate motor or compressed air, there is no need to install wiring or piping, which would be difficult to modify.

[0056] In this embodiment, the electronic component orientation correction device 30 performs the orientation correction process near the receiving position where the shuttle 22 receives devices from the supply robot 14. However, this is not limited to this. The orientation correction process can be performed when the shuttle 22 is located at any predetermined position upstream in the device transport direction from the transport position on the test socket 34 side. Specifically, the orientation correction process may be performed by placing a vibration generator 300 between the receiving position and the transport position and generating vibrations during device transport. Furthermore, multiple vibration generators 300 may be placed so that the orientation correction process is performed at multiple positions. As another example, the electronic component orientation correction device 30 may correct the orientation of the devices in the collection-side pocket 26. In this case, the vibration generator 300 may be placed at any position downstream (toward the fixed tray 44 in FIG. 1 ) of the transport position next to the test socket 34 in the device transport direction.

[0057] Furthermore, in this embodiment, the electronic component attitude sensor 31 executes attitude correction processing when it detects a device having a poor attitude, but this is not limited to this. For example, as described above, the vibration generator 300 may be disposed between the receiving position and the transfer position so that vibration is always generated in the shuttle 22 during the device transfer process.

[0058] (Second embodiment) This embodiment, which is a modified example, is an embodiment in which, in addition to the first attitude correction process of the first embodiment, a second attitude correction process is also performed as the attitude correction process of the device, in which vibrations are generated only by the reciprocating motion of the shuttle 22. In the second attitude correction process, the control unit 60 controls the shuttle drive motor 22m to reciprocate the shuttle 22 in the device transport direction (X-axis direction) at a location other than the collision position between the vibration generator 300 and the contact member 320, thereby generating vibrations only in the X-axis direction.

[0059] In controlling the electronic component transport apparatus 1 of this embodiment, for example, the control unit 60 can first apply vibration only in the X-axis direction by reciprocating the shuttle 22 as a second attitude correction process, and then move the shuttle 22 as a first attitude correction process to generate vibration (in the Y-axis and X-axis directions) by the vibration generator 300. Furthermore, at this time, for example, after the second attitude correction process is performed first, the attitude of the device may be checked by the electronic component attitude sensor 31, and only if the attitude is found to be improper may the first attitude correction process be performed. Conversely, the second attitude correction process may be performed after the first attitude correction process.

[0060] According to the present embodiment, it is possible to perform an attitude correction process different from that of the first embodiment. If the electronic component transport device 1 is capable of performing both attitude correction processes, it is possible to select and execute the more appropriate attitude correction process depending on the type of device, the occurrence of poor attitude, etc. [Explanation of symbols]

[0061] 1 Electronic parts transport device 14 Supply Robot 22 Shuttle 22m shuttle drive motor 23 Shuttle jig 24 Supply pocket 26 Collection pocket 30 Electronic component attitude correction device 31 Electronic component position sensor 34 Test Socket 300 Vibration Generator 302 Rotating members 304 Pedestal 306 Rotational Axis 308 Striking section 310 Laura 312 Spring 314 Pressing member 320 Contact member 60 Control Unit

Claims

1. a vibration generator that generates vibrations by striking a shuttle that transports electronic components from a side of the shuttle in a direction in which the electronic components are transported; a contact member that moves with the shuttle and impacts the vibration generator; an electronic component attitude correcting device for correcting the attitude of electronic components on the shuttle, the electronic component attitude correcting device comprising: a vibration generator that moves and strikes the shuttle when the contact member collides with the vibration generator as the shuttle moves.

2. 2. The electronic component transport device according to claim 1, wherein the vibration generator has a roller that collides with the contact member, and when the roller collides with the contact member and is pressed down below the contact member, the vibration generator rotates toward the shuttle and strikes the shuttle.

3. the contact member is disposed below the shuttle; 3. The electronic component transport device according to claim 2, wherein the vibration generator is fixed at a position adjacent to the shuttle and comprises an L-shaped rotating member, the roller, and an impact portion that impacts the shuttle, the roller being located at one end of the rotating member and below the shuttle, the impact portion being located at the other end of the rotating member and to the side of the shuttle, and the rotating member being supported and rotated by a rotating shaft located between the roller and the impact portion.

4. 4. The electronic component transport device according to claim 3, wherein the collision portion of the contact member that collides with the roller is located below the bottom surface of the shuttle and protrudes outward in the width direction of the shuttle.

5. 4. The electronic component transport device according to claim 3, wherein the vibration generator has a spring that applies a force to the rotating member in a direction that causes the striking portion to move away from the position where it strikes the shuttle, and when the roller is not pressed down by the contact member, the spring causes the striking portion to move away from the shuttle.

6. 2. The electronic component transport device according to claim 1, wherein the shuttle is reciprocated to cause the vibration generator and the contact member to collide with each other continuously, thereby generating vibrations continuously in the shuttle.

7. 2. The electronic component transport device according to claim 1, wherein the vibration generator and the contact member collide when the shuttle moves to a predetermined position upstream in the electronic component transport direction from a transport position for transferring the electronic component to a test socket.

8. 8. The electronic component transport device according to claim 7, wherein the vibration generator and the contact member collide when the shuttle moves to a predetermined position upstream in the electronic component transport direction from a receiving position where the shuttle receives electronic components from a supply robot that supplies electronic components.

9. 9. The electronic component transport device according to claim 7, further comprising an electronic component attitude sensor that detects improper attitude of an electronic component on the shuttle, and when the electronic component attitude sensor detects improper attitude of an electronic component, the shuttle is moved to cause the contact member to collide with the vibration generator, thereby generating vibration in the shuttle.

10. 2. The electronic component transport device according to claim 1, further comprising: a first attitude correction process for generating vibrations by collision between the vibration generator and the contact member; and a second attitude correction process for generating vibrations by reciprocating the shuttle at a position where the vibration generator and the contact member do not collide.

11. a vibration generator that generates vibrations by striking a shuttle that transports electronic components in an electronic component transport device from a side of the shuttle in a direction in which the electronic components are transported; a contact member fixed to the shuttle, moving together with the shuttle and colliding with the vibration generator; and a vibration generator that moves and strikes the shuttle when the contact member collides with the vibration generator as the shuttle moves.

12. 12. The electronic component attitude correction device according to claim 11, wherein the vibration generator has a roller that collides with the contact member, and the roller collides with the contact member and is pressed down below the contact member, causing the vibration generator to rotate to strike the shuttle.

13. The contact member is fixed below the shuttle, 13. The electronic component attitude correction device according to claim 12, wherein the vibration generator is fixed to a position adjacent to the shuttle in the electronic component transport device, and comprises an L-shaped rotating member, the roller, and an impact portion that strikes the shuttle, the roller being disposed on one end side of the rotating member, the impact portion being disposed on the other end side of the rotating member, and the rotating member being supported and rotated by a rotating shaft located between the roller and the impact portion.

14. 14. The electronic component attitude correction device according to claim 13, wherein the contact member is fixed so that a collision portion that collides with the roller is spaced downward from the underside of the shuttle, and the collision portion protrudes outward from a fixing portion that is fixed to the shuttle.

15. 14. The electronic component attitude correcting device according to claim 13, wherein the vibration generator has a spring that applies a force to the rotating member in a direction away from the position where the striking portion strikes the shuttlecock.

Citation Information

Patent Citations

  • Device conveyance apparatus

    JP2022079894A