Manufacturing method and three-dimensional molding system

Abstract

To create a more appropriate molded object.SOLUTION: A method for manufacturing a molded object used in a three-dimensional molding system that includes an application part that applies a liquid material to a base material on which a component is placed, and a pressing part that places the base material to which the liquid material has been applied on a mounting member and performs a heat pressing step includes: a pressing step in which the base material on which the components are placed, the liquid material is applied, and the base material placed on the mounting member is subjected to the heat pressing step to fix the components; and a reprocessing step in which the base material that has been subjected to the heat and pressure treatment after being peeled off from the mounting member is further heated and pressed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This specification discloses a manufacturing method and a three-dimensional fabrication system. [Background technology]

[0002] Conventionally, a proposed device for manufacturing a three-dimensional object involves applying a resin material onto a base member and hardening it, then applying a fluid containing metal particles onto the resulting resin layer, and while cooling the base member, heating and hardening the fluid containing metal particles applied onto the resin layer to form metal wiring (see, for example, Patent Document 1). This device for manufacturing a three-dimensional object can suppress swelling and cracking of the metal wiring. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 106179 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the manufacturing process of a three-dimensional object involves heating and cooling, and the expansion and contraction caused by this can cause problems such as insufficient electrical connections between parts and wiring, etc. Thus, there has been a demand for a manufacturing method of a three-dimensional object that can produce more appropriate objects.

[0005] The present disclosure has been made to solve the above problems, and a main object of the present disclosure is to provide a method for manufacturing a 3D object and a 3D printing system that are capable of producing a more appropriate 3D object. [Means for solving the problem]

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The manufacturing method of the present disclosure includes: A method for manufacturing a 3D object used in a 3D printing system including an application unit that applies a liquid material to a base material on which a component is arranged, and a pressing unit that places the base material to which the liquid material has been applied on a mounting member and performs a heat and pressure treatment, the method comprising: a pressing step of performing a heat pressing process on the base material on which the components are arranged, the liquid material is applied, and the base material is placed on the mounting member to fix the components; a re-processing step of further heating and pressing the substrate that has been subjected to the heating and pressing process after being peeled off from the mounting member; a re-treatment step of further heat-pressing the substrate that has been heat-pressed; It includes:

[0008] In this manufacturing method, after the heat-pressing process is performed to fix the components, the heat-pressing-treated base material is further heated and pressed after being peeled off from the mounting member, which makes it possible to eliminate, for example, problems with electrical connections that may occur due to the effects of expansion and contraction, problems that may occur due to misalignment of the components, etc. In this way, this manufacturing method can further reduce the occurrence of problems and produce a more appropriate shaped object. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic explanatory diagram showing an example of a three-dimensional printing system 10. [Figure 2] FIG. 2 is a schematic explanatory diagram showing an example of the structure of the printing device 11 as seen from the front. [Figure 3] FIG. 2 is an explanatory diagram showing an example of a schematic configuration of a dispenser unit 40. [Figure 4] FIG. 3 is an explanatory diagram showing an example of a schematic configuration of a pressing unit 70. [Figure 5] 10 is a flowchart showing an example of a shaped object production processing routine. [Figure 6] FIG. 1 is an explanatory diagram showing an example of an outline of a forming process. [Figure 7] FIG. 10 is an explanatory diagram showing an example of an object 65 before reprocessing. [Figure 8] FIG. 2 is an explanatory diagram showing an example of a heating and pressing device 80 of the three-dimensional modeling system 10B. DETAILED DESCRIPTION OF THE INVENTION

[0010] This embodiment will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram showing an example of a three-dimensional printing system 10 according to the present disclosure. FIG. 2 is a schematic explanatory diagram showing an example of the structure of a printing device 11 as viewed from the front. FIG. 3 is an explanatory diagram showing an example of a dispenser unit 40. FIG. 4 is an explanatory diagram showing an example of a pressing unit 70, with FIG. 4A being an explanatory diagram before pressing and FIG. 4B being an explanatory diagram during pressing. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in FIGS. 1 to 4.

[0011] The 3D printing system 10 includes a printing device 11, a mounting device 12, and an information processing device (not shown). The 3D printing system 10 is configured as a production line in which the printing device 11 forms a model as a first process, forms predetermined components on the model as a second process, and then the mounting device 12 mounts components P. The printing device 11 may form a wiring (circuit) pattern as a conductive material as the second process, and the mounting device 12 may mount components P at predetermined positions on the conductive material. The 3D printing system 10 may also include, in addition to the mounting device 12, one or more mounting-related devices, such as a printing device that prints solder as a viscous fluid on the model, a printing inspection device that inspects the printing results, a mounting inspection device that inspects the mounting results, and a transport device that transports the model. While the 3D printing system 10 shown in FIG. 1 includes one mounting device 12, multiple mounting devices 12 may also be included. The information processing device is a management server that manages the printing device 11 and the mounting device 12.

[0012] The mounting device 12 mounts components P on the object formed by the printing device 11. The mounting device 12 includes a control device, a transport processing unit 13, a component supply unit 14, an imaging unit 16, a mounting unit 17, an operation panel, and a communication unit. The control device is configured as a microprocessor centered around a mounting control unit such as a CPU, and controls the entire device. This control device outputs control signals to the transport processing unit 13, the component supply unit 14, the imaging unit 16, the mounting unit 17, and the operation panel, and inputs signals from the transport processing unit 13, the component supply unit 14, the imaging unit 16, the mounting unit 17, and the operation panel. The transport processing unit 13 loads, transports, fixes at the mounting position, and removes a pallet 60 on which the object is placed. The component supply unit 14 is a unit that supplies components P to the mounting unit 17 from a feeder 15 or the like. The imaging unit 16 is a camera that captures images above, capturing images of components P held by a mounting head 19 of the mounting unit 17, etc. The operation panel is a unit that accepts input from the operator and presents information to the operator. The mounting unit 17 is a unit that picks up components P from the component supply unit 14 and places them on a shaped object fixed to the transport processing unit 13. The mounting unit 17 includes a head moving unit 18, a mounting head 19, and a picking member. The head moving unit 18 includes a slider that moves in the X and Y directions along a guide rail, and a motor that drives the slider. The mounting head 19 is removably attached to the slider, picks up one or more components, and moves in the X and Y directions by the head moving unit 18. One or more picking members are removably attached to the underside of the mounting head 19. The picking member may be a suction nozzle that picks up components using negative pressure, or a mechanical chuck that mechanically holds components. The communication unit is an interface that exchanges information with external devices such as the printing device 11 and an information processing device.

[0013] The printing apparatus 11 is a three-dimensional modeling apparatus that ejects a fluid onto a target object to form and manufacture a shaped object having a substrate, a conductive material, or the like. The shaped object may include, for example, a substrate, a conductive material formed on and / or within the substrate, and components disposed on and / or within the substrate. The target object is a pallet 60 at the initial stage of modeling. The object refers to the shaped object if the substrate, wiring, conductive material, or the like is formed on the pallet 60. The material to be modeled is not particularly limited, and examples include resin and ceramics. As shown in FIGS. 1 to 4 , the printing apparatus 11 includes a control device 20, a memory unit 22, a moving unit 25, a flattening unit 29, a first discharging unit 30, a first maintenance unit 33, a first curing unit 34, a second discharging unit 35, a second maintenance unit 38, a second curing unit 39, a dispenser unit 40, a pressing unit 70, an inspection unit 55, an operation panel 58, and a communication unit 59. The printing apparatus 11 also includes, as structural components, a first gantry 51, a second gantry 52, a third gantry 53, and a housing 54. Here, the printing apparatus 11 will be described mainly as a device that executes a process of forming an insulator, such as a base material for a molded object, using a first discharging unit 30, and then forming a conductive material, such as a wiring pattern, on the molded insulator using a second discharging unit 35. Note that the first discharging unit 30 and the second discharging unit 35 are collectively referred to simply as "discharging units," the first discharging head 32 and the second discharging head 37 are collectively referred to simply as "discharging heads," the first maintenance unit 33 and the second maintenance unit 38 are collectively referred to simply as "maintenance units," the first curing unit 34 and the second curing unit 39 are collectively referred to simply as "curing units," and the dispensers 43A to 43C are collectively referred to as dispensers 43.

[0014] The control device 20 is configured as a microprocessor centered on a print control unit 21 such as a CPU, and controls the entire printing device 11. The control device 20 exchanges information with a memory unit 22 and each unit. The memory unit 22 is, for example, a large-capacity storage medium such as a flash memory. The memory unit 22 stores modeling job information 23 and the like. The modeling job information 23 is information including, for example, the shape and size of the object to be manufactured, and information on conductive materials such as wiring patterns to be formed on the substrate. The printing device 11 executes modeling processing based on the information stored in the memory unit 22.

[0015] The moving unit 25 is a stage that moves a pallet 60, which is an object onto which the fluid is ejected. The moving unit 25 includes a support part 26 and a support moving part 27. The support part 26 supports and fixes the pallet 60, on which the object is placed in the printing region 61. The support moving part 27 is a drive part that moves the support part 26 in a printing path that runs along the front-to-rear direction in the center of the housing 54, and raises and lowers the support part 26 to relatively change the distance between the ejection head and the object. The support moving part 27 may have a linear drive part, which is configured by a linear motor, a ball screw mechanism, or the like.

[0016] The pallet 60 is a mounting member having an area where a modeled object is formed, and is removably attached to the support unit 26. The pallet 60 has a modeling area 61, a receiving area, etc. A removable film is attached to the top surface of the pallet 60, and the next modeled object can be produced by replacing this film. The modeling area 61 is a printing area where a modeled object is formed by the first discharging unit 30, a predetermined pattern is formed on the modeled object by the second discharging unit 35, and a liquid material is applied to the target object by the dispenser unit 40. The receiving area is an area that receives unnecessary fluid or liquid material discharged from the first discharging head 32, the second discharging head 37, and the application head 42.

[0017] The first discharging unit 30 is a unit that discharges a fluid serving as a base material for forming a model onto a modeling region 61 of a pallet 60. The first discharging unit 30 is movably disposed to the left of a first gantry 51, which is fixed to a front region in the Y-axis direction of a housing 54 of the printing device 11. The first discharging unit 30 includes a first moving unit 31, a first discharging head 32, and a first fluid processing unit. The first moving unit 31 includes a slider that moves along the X-axis direction while being guided by a guide rail, and a motor that drives the slider. The first discharging head 32 is attached to the slider, and the first discharging head 32 moves along the X-axis direction in accordance with the movement of the slider. The first moving unit 31 moves the first discharging head 32 between a standby position and a discharging position on the pallet 60. The first discharging head 32 is a structural fluid discharging head that discharges a fluid that forms a model onto a target object, such as the pallet 60, to form the model. The first discharge head 32 has a first nozzle and a discharge drive unit. The first nozzle is formed in a nozzle plate. This first nozzle is an opening hole that discharges the fluid supplied from the first fluid processing unit onto the pallet 60. The discharge drive unit, for example, discharges the fluid toward the pallet 60, and may be, for example, a piezoelectric element. The fluid discharged by the first discharge head 32 may be, for example, a liquid curable resin (e.g., ultraviolet curable resin, thermosetting resin, two-part mixed curable resin, etc.), a thermoplastic resin, or a liquid material such as a slurry in which a solid material such as an inorganic substance is mixed with a solvent. The first fluid processing unit is a unit that delivers the fluid and includes a first supply tank that stores the fluid and a first recovery tank that stores the recovered fluid.

[0018] The first maintenance unit 33 is a unit that seals and protects the first ejection head 32, and also performs ejection maintenance based on the ejection state of the first ejection head 32. The first maintenance unit 33 has, for example, a first cap that seals the first ejection head 32, a first ejection receiving portion that receives fluid ejected from the first ejection head 32, and a first cleaning portion that cleans the first ejection head 32. The ejection maintenance includes, for example, performing a flushing process and performing a process of wiping and cleaning the nozzle plate of the first ejection head 32.

[0019] The first curing unit 34 is a unit that performs a predetermined process on the fluid discharged from the first discharging head 32 onto the pallet 60 or onto a model that has been cured on the pallet 60, thereby curing the fluid. The first curing unit 34 may be a unit that irradiates the fluid discharged onto the modeling region 61 with light of a predetermined wavelength, such as ultraviolet light, to cure the fluid. The first curing unit 34 may also be a unit that dries or bakes the fluid depending on its material. For example, every time a layer of fluid is formed on the modeling region 61 by the first discharging head 32, the pallet 60 is moved below the first curing unit 34 to cure the fluid.

[0020] The second dispensing unit 35 is a unit that dispenses a fluid onto the pallet 60 or onto the shaped object, which serves as a conductive material, such as wiring, formed inside or on the surface of the shaped object. The second dispensing unit 35 is movably disposed to the right of the first gantry 51, which is fixed to the front region of the housing 54 in the Y-axis direction. The second dispensing unit 35 includes a second moving unit 36, a second dispensing head 37, and a second fluid processing unit. The second moving unit 36 ​​includes a slider that moves along the X-axis direction while guided by a guide rail, and a motor that drives the slider. The second dispensing head 37 is attached to the slider, and the second dispensing head 37 moves along the X-axis direction in accordance with the movement of the slider. The second moving unit 36 ​​moves the second dispensing head 37 between a standby position and a dispensing position on the pallet 60. The second dispensing head 37 is a conductive fluid dispensing head that dispenses a fluid onto an object, such as the pallet 60, to form a conductive material. The second ejection head 37, like the first ejection head 32, has a second nozzle and an ejection drive unit. Since the second ejection head 37 has the same structure and function as the first ejection head 32, detailed description thereof will be omitted. Examples of the fluid ejected by the second nozzle include a liquid mixture in which a solid is mixed with a solvent, and a liquid solution in which a resin is dissolved in a solvent. Examples of this fluid include a conductive paste in which metal particles are dispersed in a resin that hardens when heated, and a metal ink conductive fluid in which metal microparticles are dispersed in a solvent. For example, in a conductive paste, when the resin hardens and shrinks, the metal particles dispersed in the resin come into contact with each other. This allows the conductive paste to exhibit conductivity. The resin in the conductive paste is, for example, an organic adhesive, and exhibits adhesive strength when hardened.

[0021] The second maintenance unit 38 is a unit that seals and protects the second discharge head 37, and also performs discharge maintenance based on the discharge state of the second discharge head 37. The second maintenance unit 38 has, for example, a second cap that seals the second discharge head 37, a second discharge receiving portion that receives fluid discharged from the second discharge head 37, and a second cleaning portion that cleans the second discharge head 37. The discharge maintenance includes the flushing process and cleaning process described above.

[0022] The second curing unit 39 is a unit that performs a predetermined process on the fluid discharged from the second discharging head 37 onto the modeling region 61 of the pallet 60 or onto a modeled object that has been cured on the pallet 60, thereby curing the fluid. The second curing unit 39 may be a unit that irradiates the fluid discharged onto the modeling region 61 with light of a predetermined wavelength, such as infrared light, to cure the fluid. The second curing unit 39 may also be a unit that dries or bakes the fluid depending on its material. For example, every time a layer of fluid is formed on the pallet 60 by the second discharging head 37, the pallet 60 is moved underneath the second curing unit 39, and the second curing unit 39 cures the fluid.

[0023] The flattening unit 29 flattens the surface of the fluid dispensed onto the pallet 60 and / or the model using a flattening member. The flattening member may be, for example, a flattening roller that rotates relative to the model, or a flat flattening blade.

[0024] The dispenser unit 40 is a unit that applies a liquid material to a model on a pallet 60. As shown in FIGS. 1 to 3 , the dispenser unit 40 is movably disposed on a second gantry 52 fixed to a central region in the Y-axis direction of a housing 54 of the printing apparatus 11. The dispenser unit 40 is disposed on a transport path through which the pallet 60 is carried in and out of the mounting apparatus 12, and is configured to be able to perform a coating process by a dispenser 43, a coating amount detection process, a pallet 60 carrying in and out process, an imaging process, a height measurement process, and the like. The dispenser unit 40 is composed of a coating movement section 41, a coating head 42, and a discharge amount detection section 57. The dispenser unit 40 also includes a working section 50 that includes the coating head 42, an imaging section 44, a height detection section 45, and a mounting transport section 46.

[0025] The moving applicator unit 41 includes a slider that moves along the X-axis direction while being guided by a guide rail disposed on the second gantry 52, and a motor that drives the slider. A coating head 42 is attached to the slider, and the coating head 42 moves along the X-axis direction as the slider moves. As shown in FIG. 1, the moving applicator unit 41 moves the coating head 42 between a coating position above a pallet 60 in a central region along the X-axis of the housing 54, a carry-in / out position on the mounting device 12 side, and a retracted position on the opposite side from the mounting device 12 side. Dispensers 43A to 43C that apply conductive paste, filler, or the like are disposed on the coating head 42.

[0026] Dispenser 43 has a discharge port for discharging a liquid material and is equipped with a syringe that contains the liquid material. The syringe is a columnar member that contains the liquid material and discharges the liquid material from a discharge port provided at the tip of its lower end when pressure is applied from above. Examples of liquid materials include multiple types of resins with different viscosities and conductivities, such as resins with dispersed conductive materials and insulating resins. For example, dispenser 43A contains a conductive paste, dispenser 43B contains a conductive paste with different properties, and dispenser 43C contains a resin filler (underfill).

[0027] The imaging unit 44 is a camera that captures images of the downward direction, i.e., the pallet 60 side. The imaging unit 44 captures, for example, images of the object in the building region 61 and the inspection region 56 of the inspection unit 55. The height detection unit 45 is configured as a sensor that moves a contact terminal at its tip downward and determines the height of the object it contacts based on the position of contact with the object. The height detection unit 45 is used to measure the height of the pallet 60 and the object on the pallet 60. The mounting transport unit 46 is used to transport the pallet 60 to the mounting device 12 side, which is an area outside the printing path, and to transport the pallet 60 from the mounting device 12. The mounting transport unit 46 has a rod structure that can extend downward. Its tip contacts the edge of the pallet 60 and pushes it out, or hooks and retracts it to move the pallet 60. The discharge amount detection unit 57 detects the weight of the liquid material dispensed from the dispenser 43. The discharge amount detection unit 57 applies an arbitrary pressure to the dispenser 43 and measures the amount of liquid material discharged from the syringe per unit time. Using this measurement value, the control device 20 controls the discharge amount of the liquid material to an appropriate value.

[0028] The pressing unit 70 is a pressing section that heats and presses the object 65 on the pallet 60 or a liquid material applied to the pallet 60 or the object 65. The pressing unit 70 may, for example, heat and press the substrate S on which the liquid material is applied and on which the components P are arranged, thereby hardening the liquid material. As shown in FIGS. 1 and 4 , the pressing unit 70 includes a fixing section 71, a pressure applying section 72, a heating section 73, a pressing member 74, and a placing section 78. The placing section 78 is a rigid plate-shaped member on which the pallet 60 is placed. The heating section 73 may be disposed inside the placing section 78. The pressing unit 70 is disposed on a side of the moving unit 25 that is away from the printing path, and the pallet 60 is moved below the pressing unit 70 by a pressing conveying section 79. The pressing conveying section 79 may be mechanically similar to the mounting conveying section 46. As shown in FIG. 4 , the fixing unit 71 fixes the pressing member 74 in a detachable manner. The pressing member 74 is attached to the underside of the fixing unit 71. The pressure unit 72 presses the object 65 on the pallet 60 by relatively moving the pressing member 74 and the placement unit 78 on which the pallet 60 is placed. The pressure unit 72 may move the pallet 60 relative to the fixed pressing member 74, or may move the pressing member 74 relative to the fixed pallet 60. The heating unit 73 heats the object 65. If the heating unit 73 heats the object 65, it may heat the placement unit 78 side, the fixing unit 71 side, or both the placement unit 78 side and the fixing unit 71 side. The heating unit 73 may be a non-contact heating type or a contact heating type. Here, the heating section 73 is configured such that contact heaters are disposed on the pallet 60 side and the fixing section 71 side.

[0029] The pressing member 74 is a member that contacts and presses the object 65. When the pressing unit 70 includes the heating section 73, the pressing member 74 is a member that contacts the object 65 and presses and heats the object 65. The pressing member 74 is a flexible member that can sufficiently contact and press an object within a predetermined tracking range T in the height direction (see FIG. 5B). The pressing member 74 includes a first pressing member 75 and a second pressing member 76. The pressing member 74 may include, for example, a support plate that is detachably fixed to the fixing section 71, the first pressing member 75 attached to the support plate, and the second pressing member 76 laminated on the first pressing member 75. Furthermore, the pressing member 74 may include a film 77 disposed between the second pressing member 76 and the object 65 to prevent deformation and misalignment during pressing. Because the pressing member 74 may be deformed by heat, it is replaced by an operator after each production of a molded object. The first pressing member 75 may be made of the same elastic material as the second pressing member 76 but with a different hardness, or may be made of the same elastic material as the second pressing member 76, or may be made of a different elastic material. However, the first pressing member 75 is preferably made of the same elastic material from the viewpoint of uniform pressing characteristics. Examples of the material for the first pressing member 75 include elastic materials such as rubber and resin, specifically silicone rubber. The second pressing member 76 is a member that is layered on the first pressing member 75 and contacts and presses the object 65. It is preferable that the area of ​​the second pressing member 76 that contacts the object 65 is a single piece from the viewpoint of further suppressing misalignment in the planar direction of the component P placed on the object 65. Examples of the material for the second pressing member 76 include elastic materials such as rubber and resin. The thickness, size, hardness, etc. of the first pressing member 75 and the second pressing member 76 may be set appropriately depending on the shape and material of the object 65. The first pressing member 75 and the second pressing member 76 may be made of the same material. As the pressing member 74, a single pressing member (only the first pressing member 75) may be used instead of multiple pressing members. The film 77 is a member that further suppresses misalignment between the pressing member 74 and the object 65. The film 77 may be made of a thin film resin.The material of the film 77 is not particularly limited as long as it allows sliding in the surface direction when the pressing member 74 and the object 65 are pressed against each other, and may be a fluorine-based resin.

[0030] The inspection unit 55 is a unit that inspects the discharge state of the first discharge unit 30 and / or the second discharge unit 35. The inspection unit 55 is composed of a mark substrate as an inspection area 56 and an imaging unit 44. The inspection unit 55 inspects the discharge position of the discharge unit by causing fluid discharged from the first discharge unit 30 or the second discharge unit 35 to land on the surface of a film fixed on the mark substrate and capturing an image of this with the imaging unit 44.

[0031] The operation panel 58 is a unit that receives input from the worker and presents information to the worker. The operation panel 58 includes a display unit and an operation unit with a touch panel and buttons. The communication unit 59 is an interface that exchanges information with external devices such as the mounting device 12 and an information processing device.

[0032] Next, the 3D modeling process of the printing device 11 configured as described above will be described. Fig. 5 is a flowchart showing an example of a modeling object production process routine executed by the print control unit 21 of the control device 20. This routine is stored in the storage unit 22 and is executed by the control device 20 after an operator inputs a command to execute the production process. When this routine starts, the print control unit 21 of the control device 20 first reads and acquires modeling job information 23 from the storage unit 22 (S100). Note that the print control unit 21 may also acquire the modeling job information 23 from an information processing device.

[0033] Next, the print control unit 21 determines whether it is time to inspect and maintain the first discharging unit 30 and the second discharging unit 35 (S110). This timing may be, for example, when new production starts, when a predetermined number of shaped objects, such as five or ten, have been produced, or when a predetermined time, such as 30 minutes or one hour, has passed. If it is time to inspect and maintain, the print control unit 21 executes an inspection and maintenance process for the first discharging head 32 and / or the second discharging head 37 (S120). In this process, the print control unit 21 executes the inspection process using the inspection unit 55, or executes the maintenance process using the first maintenance unit 33 or the second maintenance unit 38. Specifically, in the inspection process, the print control unit 21 moves a mark substrate having an inspection area 56 below the first discharging head 32 or the second discharging head 37, ejects fluid onto the inspection area 56, and then captures an image of the inspection area 56 with the imaging unit 44 to determine the ejection status of the fluid. In addition, in the maintenance process, the print control unit 21 performs maintenance on the first discharge unit 30 and the second discharge unit 35 using the first maintenance unit 33 and the second maintenance unit 38. Examples of maintenance processes include flushing the discharge head and cleaning the nozzle plate with a cleaning member. After S120, or when it is not the timing for inspection and maintenance in S110, the print control unit 21 checks the modeling process to be performed based on the modeling job information 23 (S130).

[0034] Here, the modeling process will be described. FIG. 6 is an explanatory diagram showing an example of an overview of the modeling process, in which FIG. 6A illustrates the printing process of the substrate S, FIG. 6B illustrates the printing process of the wiring (circuit) E, FIG. 6C illustrates the printing process of the cavity C, FIG. 6D illustrates the application process of the conductive material B (conductive paste) and the underfill U, FIG. 6E illustrates the mounting process and the heat pressing process of the component P, FIG. 6F illustrates the application process and the heat pressing process of the filler F, FIG. 6G illustrates the peeling process of the target object 65, and FIG. 6H illustrates the reprocessing. The printing device 11 is also capable of producing a modeling unit with multiple layers, but for ease of explanation, a single-layer model will be described here. In the modeling process, the print control unit 21 prints and cures the substrate S (FIG. 6A), prints and cures the wiring E on the substrate S (FIG. 6B), and then prints and cures the cavity C on top of that (FIG. 6C). The print control unit 21 also applies conductive material B and underfill U to the object 65 (FIG. 6D), mounts the component P thereon (FIG. 6E), and hardens the liquid material by heating and pressing using the pressing unit 70 (FIGS. 4A and 4B). Next, the print control unit 21 fills in filler material F (FIG. 6F), and fixes the component P by pressing and heating using the pressing unit 70. In this modeling process, two or more layers of substrate S and wiring E may be printed and hardened, and the component P may be mounted, as needed. The substrate S and cavity C may be made of the same material or different materials. The wiring E and conductive material B may be made of the same material or different materials. The underfill U and filler material F may be made of the same material or different materials.

[0035] When the process executed in S130 is a process for discharging a structural material, the print control unit 21 executes a first printing process using the first discharging head 32 (S140). At this time, the print control unit 21 executes a process for printing the substrate S based on the print image, executes a flattening process using the flattening unit 29, and hardens the fluid using the first hardening unit 34. When the process executed in S130 is a process for discharging a conductive material, the print control unit 21 executes a second printing process using the second discharging head 37 (S150). In the second printing process, the print control unit 21 also executes a process for printing wiring E based on the print image and hardens the wiring E. When the process executed in S130 is a dispenser process, the print control unit 21 executes a dispenser process using the dispensing head 42 (S160). In the dispenser process, the print control unit 21 executes the dispenser 43 to apply underfill U, conductive material B, and filler F. Furthermore, the print control unit 21 causes the pressing unit 70 to perform a hardening process of the liquid material. Furthermore, when the process performed in S130 is the mounting process of the components P, the print control unit 21 causes the mounting transport unit 46 to perform a carry-out process and a carry-in process of the pallet 60 to the mounting device 12 (S170). After carrying in the pallet 60, the mounting device 12 performs a placement process of the components P based on the modeling job information. Here, the mounting device 12 places the components P, which are set in order of the number of mounting executions in the component information, on the substrate S based on the modeling job information. After the mounting process is completed and the target object 65 on which the components P are placed is carried in the printing device 11, the print control unit 21 causes the dispenser 43 to apply the filler F as necessary, and causes the pressing unit 70 to perform a pressing process.

[0036] After S140 to S170, the print control unit 21 determines whether the target object 65 has undergone a heat and pressure process, in which the modeling process and the component fixing process have been completed (S180). Here, the print control unit 21 may determine whether the target object 65 is a nearly finished product, in which the application of the liquid material from the dispenser 43 has been completed. The print control unit 21 may also determine whether the target object 65 has undergone a heat and pressure process, in which the uncured liquid material has not been applied. Alternatively, the print control unit 21 may determine whether the target object 65 has undergone the printing process and the application process. That is, the print control unit 21 determines whether the target object 65 has undergone all steps of the modeling process and the mounting process. If the target object 65 has not undergone a heat and pressure process, in which the modeling process and the component fixing process have been completed, the print control unit 21 executes the processes from S110 onwards. That is, for example, after the modeling process of the substrate S is completed, the print control unit 21 executes the modeling process of the wiring E and the cavity C. Furthermore, after the formation process of the wiring E and the cavity C is completed, the print control unit 21 appropriately performs processes such as applying the conductive material B and underfill U, mounting the components P, and applying the filler F. If the object 65 has undergone the heat and pressure process in S180, in which the formation process and the component fixing process have been completed, the print control unit 21 performs a peeling process to peel the object 65 from the pallet 60 (S190). Note that, to ensure the accuracy of the formation position and the mounting position, the object 65 is assumed to be relatively firmly fixed to the pallet 60. In the peeling process, for example, a predetermined process is performed on the object 65 to peel the object 65. For example, in the peeling process, the object 65 may be fixed with an adhesive, and a predetermined process may be performed by the heating unit 73 to reduce the adhesive strength. Alternatively, in the peeling process, a peeling force may be applied to the object 65 by a peeling unit (not shown) to physically peel the object 65.

[0037] FIG. 7 is an explanatory diagram showing an example of an object 65 immediately after peeling and before reprocessing. Note that FIG. 7 exaggerates the features of the object 65. Also, FIG. 7 omits the illustration of the wiring (circuit) E, conductive material B, and underfill U. As shown in FIG. 7, the object 65 may have a large thermal expansion coefficient for the structural resin that forms the substrate S, while the thermal expansion coefficients of the components P, underfill U, and filler F are small. When cooled from a high temperature, the bottom surface of the substrate S shrinks significantly, while the components P, underfill U, and filler F on the top surface of the substrate S do not shrink easily, which can cause warping. This warping can apply force to the object 65 in a direction that separates the electrodes of the components P from the wiring E and conductive material B (e.g., bumps), which were in close contact with each other, and can cause deterioration of conductivity between the components P and the wiring E. The print control unit 21 then performs reprocessing (S200) on the object 65, which has been subjected to the peeling process and the heat and pressure process performed in S190. In the reprocessing, the substrate S may be heated and pressed at a temperature higher than that of the heat-pressing process but below the glass transition point of the substrate S and the cavity C. The reprocessing may also be performed with a higher pressing force than that of the heat-pressing process. In the reprocessing, the substrate S on the pallet 60 may be brought into contact with the rigid mounting portion 78, and the component P side may be heated and pressed with a flexible pressing member 74. In the reprocessing, the object 65 has already been subjected to the heat-pressing process. For example, the liquid material from the dispenser 43 has hardened. Therefore, it is possible to apply a higher temperature and load than in the heat-pressing process. This reprocessing can further improve the electrical contact between the component P and the wiring E in the object 65, or correct warping of the substrate S.

[0038] After S200, the print control unit 21 determines whether all production processes have been completed (S210). If all production processes have not been completed, or if the printing and coating process has not been completed in S180, the print control unit 21 executes the processes from S110 onward. On the other hand, if the production process has been completed in S210, this routine ends. In this way, by executing the forming job information 23, the print control unit 21 heats and presses the substrate S on which one or more components P are arranged, and then, after the entire process is completed, executes a re-processing to heat and press the substrate S again, thereby making it possible to make the electrical connection between the components P and the wiring E, etc., more optimal.

[0039] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The printing device 11 of this embodiment corresponds to an example of the printing device of the present disclosure, the dispenser unit 40 corresponds to an example of an application unit, the pressing unit 70 corresponds to an example of a pressing unit, the print control unit 21 corresponds to an example of a control unit, the pallet 60 corresponds to an example of a mounting member, the pressing member 74 corresponds to an example of a pressing member, the mounting unit 78 corresponds to an example of a mounting unit, and the first discharge head 32 and the second discharge head 37 correspond to examples of a discharge head. Note that in this embodiment, by explaining the operation of the printing device 11 and the three-dimensional modeling system 10, examples of a manufacturing method and a control method of a printing device of the present disclosure will also be clarified.

[0040] The printing apparatus 11 of the present embodiment described above executes a manufacturing method for a 3D object used in a 3D printing system 10 equipped with a dispenser unit 40 that applies a liquid material to a substrate S on which components P are arranged, and a pressing unit 70 that places the substrate S, on a pallet 60 as a mounting member, and performs a heat-pressing process. The printing apparatus 11 executes a manufacturing method for a 3D object, including a pressing step in which a target object 65 including the substrate S on which components P are arranged and coated with a liquid material is subjected to a heat-pressing process to fix the components P, and a reprocessing step in which the target object 65 including the substrate S that has been subjected to the heat-pressing process and has been peeled off from the pallet 60 is further heated and pressed. In this manufacturing method, after the heat-pressing process to fix the components P, the substrate S that has been subjected to the heat-pressing process is further heated and pressed. This can eliminate, for example, problems with electrical connections that may occur due to the effects of expansion and contraction, or problems that may occur due to component misalignment. In this way, this manufacturing method further reduces the occurrence of problems and enables the production of a more appropriate 3D object.

[0041] In the reprocessing step, the substrate S is heated and pressed at a temperature higher than the heating temperature in the pressing step but below the glass transition point of the substrate S. In this manufacturing method, reprocessing at a higher temperature can improve electrical connection and placement accuracy, while reprocessing at a temperature below the glass transition point can further reduce defects that may occur due to deformation of the substrate S. Furthermore, in the reprocessing step, the substrate S is heated and pressed at a higher pressing force than in the pressing step. In this manufacturing method, reprocessing at a higher pressing force can improve, for example, electrical connection and placement accuracy. Furthermore, in the reprocessing step, the object 65 is brought into contact with the rigid mounting portion 78 via the pallet 60, and the component P side is heated and pressed with the flexible pressing member 74. In this manufacturing method, the pressing member 74 can further reduce the impact of the pressing force on the component P, while the rigid mounting portion 78 via the pallet 60 can perform a sufficient pressing process.

[0042] In the reprocessing step, the substrate S is subjected to a predetermined process and then peeled off from the pallet 60, after which the peeled substrate S is heated and pressed. With this manufacturing method, even if the peeling of the substrate S causes deformation of the substrate S, it is possible to further suppress the occurrence of defects and produce a more appropriate shaped object. Furthermore, because the pressing step and the reprocessing step are performed by the pressing unit 70, a series of steps are performed using the same configuration, making it possible to more efficiently produce a more appropriate shaped object.

[0043] The 3D modeling system 10 is a printing system for manufacturing a modeled object, and includes a dispenser unit 40 that applies a liquid material to a substrate S on which a component P is arranged, a pressing unit 70 that places the substrate S with the applied liquid material on a pallet 60 and heats and presses it, and a print control unit 21 that causes the pressing unit 70 to perform a heat and press process on the substrate S on which the component P is arranged, the liquid material is applied, and the substrate S placed on the pallet 60 to fix the component P, and then causes the printing control unit 21 to perform a reprocessing, for example, to further heat and press the substrate S that has been heat and pressed and has completed the modeling process and the fixation process for the component P after being peeled from the pallet 60. In this 3D modeling system 10, after the heat and press process is performed to fix the component P, the heat and press processed substrate S is further heat and pressed, which can eliminate problems with electrical connections that may occur due to the effects of expansion and contraction, or problems that may occur due to misalignment of the component P. In this way, the 3D printing system 10 can further suppress the occurrence of defects and produce a more appropriate model. The 3D printing system 10 also includes a discharge head that discharges a fluid onto the target 65, a curing unit that hardens the fluid discharged onto the target 65 to produce a substrate S, and a mounting device 12 that places components P on the substrate S. The dispenser unit 40 applies a liquid material to the produced substrate S, and the pressing unit 70 performs a heat and pressure treatment on the produced substrate S. The 3D printing system 10 produces the substrate S, and further suppresses the occurrence of defects in the produced substrate S, making it possible to produce a more appropriate model.

[0044] It goes without saying that the printing apparatus 11 and the three-dimensional modeling system 10 of the present disclosure are not limited to the above-described embodiment, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0045] For example, in the above-described embodiment, the reprocessing step is performed at a temperature higher than the heating temperature of the pressing step, but this is not particularly limited, and the reprocessing may be performed at a temperature lower than the heating temperature of the pressing step. Also, in the above-described embodiment, the reprocessing step is performed by heating and pressing with a higher pressing force than the pressing step, but this is not particularly limited, and the reprocessing may be performed with a pressure lower than the pressing force of the pressing step. Note that, in the reprocessing step, it is preferable to use a higher temperature and a higher pressing force than the pressing step in terms of the effects obtained.

[0046] In the above-described embodiment, the reprocessing step involves performing a predetermined process on the substrate S, peeling the substrate S from the pallet 60 serving as a mounting member, and then applying heat and pressure to the peeled substrate S. However, this is not particularly limited, and the isolation process may be omitted. Note that, from the viewpoint of preventing warping of the object 65 after peeling, it is preferable to peel the object 65 from the pallet 60 and then perform the reprocessing.

[0047] In the above-described embodiment, the pressing step and the reprocessing step are performed by the pressing unit 70. However, this is not limited thereto, and a device other than the pressing unit 70 may perform the heat pressing process and the reprocessing. FIG. 8 is an explanatory diagram showing an example of a heat pressing device 80 included in the three-dimensional modeling system 10B. Note that the same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. This three-dimensional modeling system 10B includes a printing device 11, a mounting device 12, and a heat pressing device 80 that heats and presses the substrate S. In this three-dimensional modeling system 10B, the pressing unit 70 of the printing device 11 performs the heat pressing process in the pressing step, and the heat pressing device 80 performs the reprocessing in the reprocessing step. The heat pressing device 80 includes a pressing unit 70B similar to the pressing unit 70, except that the target object 65 that can be placed thereon is different. One or more objects 65 are placed on the pressing unit 70B, and a reprocessing is performed in which the objects 65 are heated and pressed by the pressure unit 72 and the heating unit 73. The pressing unit 70B may be configured so that the objects 65 are arranged on the placement unit 78 by a robot, or the objects 65 that have been peeled off from the pallet 60 are arranged on the placement unit 78 by an operator. The peeling process may be performed by the printing device 11, or may be performed manually by an operator. In this manufacturing method, by performing the reprocessing in a separate dedicated device, a more appropriate shaped object can be produced more reliably.

[0048] In the above-described embodiment, the ejection head includes a first ejection head 32 which is a structural fluid ejection head and a second ejection head 37 which is a conductive fluid ejection head, but this is not particularly limited to this, and one of them may be omitted, or another ejection head may be included.

[0049] In the above-described embodiment, the present disclosure has been described as a 3D printing system 10, but is not particularly limited to this, and may be a printing device 11 only, or a printing device 11 and a mounting device 12. When only a printing device 11 is used, component mounting may be performed by a mounting device 12 outside the system. Furthermore, in the above-described embodiment, the 3D printing system 10 and the printing device 11 are used, but the present disclosure may also be a method for manufacturing a model, a method for controlling the printing device 11, an information processing method, or a program thereof.

[0050] This specification also discloses the technical idea of ​​changing "the manufacturing method described in claim 1 or 2" in claim 4 as originally filed to "the manufacturing method described in any one of claims 1 to 3," the technical idea of ​​changing "the manufacturing method described in claim 1 or 2" in claim 5 as originally filed to "the manufacturing method described in any one of claims 1 to 4," the technical idea of ​​changing "the manufacturing method described in claim 1 or 2" in claim 6 as originally filed to "the manufacturing method described in any one of claims 1 to 5," and the technical idea of ​​changing "the manufacturing method described in claim 1 or 2" in claim 7 as originally filed to "the manufacturing method described in any one of claims 1 to 6." [Industrial Applicability]

[0051] The present disclosure is applicable to the technical field of devices that eject fluids and manufacture shaped objects. [Explanation of symbols]

[0052] 10, 10B 3D modeling system, 11 printing device, 12 mounting device, 13 transport processing unit, 14 component supply unit, 15 feeder, 16 imaging unit, 17 mounting unit, 18 head moving unit, 19 mounting head, 20 control device, 21 print control unit, 22 memory unit, 23 modeling job information, 25 moving unit, 26 support unit, 27 support moving unit, 29 flattening unit, 30 first discharge unit, 31 first moving unit, 32 first discharge head, 33 first maintenance unit, 34 first curing unit, 35 second discharge unit, 36 second moving unit, 37 second discharge head, 38 second maintenance unit, 39 second curing unit, 40 dispenser unit, 41 coating moving unit, 42 coating head, 43, 43A to 43C dispensers, 44 imaging unit, 45 height detection unit, 46 Mounting and transport section, 50 working section, 51 first gantry, 52 second gantry, 53 third gantry, 54 housing, 55 inspection unit, 56 inspection area, 57 discharge amount detection section, 58 operation panel, 59 communication section, 60 pallet, 61 printing area, 65 object, 70, 70B pressing unit, 71 fixing section, 72 pressure section, 73 heating section, 74 pressing member, 75 first pressing member, 76 second pressing member, 77 film, 78 placing section, 79 pressing and transport section, 80 heating and pressing device, B conductive material, C cavity, E wiring, F filling material, O printed object, P component, S substrate, U underfill.

Claims

1. A method for manufacturing a shaped object used in a three-dimensional modeling system including an application unit that applies a liquid material to a base material on which a component is arranged, and a pressing unit that places the base material to which the liquid material has been applied on a mounting member and performs a heating and pressing process, the method comprising: a pressing step of performing a heat pressing process on the base material on which the components are arranged, the liquid material is applied, and the base material is placed on the mounting member to fix the components; a reprocessing step of further heating and pressing the substrate that has been subjected to the heating and pressing process after being peeled off from the mounting member; A manufacturing method comprising:

2. The manufacturing method according to claim 1 , wherein the reprocessing step involves heating and pressing at a temperature higher than the heating temperature in the pressing step and equal to or lower than the glass transition point of the substrate.

3. The manufacturing method according to claim 1 or 2, wherein the reprocessing step involves heating and pressing at a higher pressing force than the pressing step.

4. The manufacturing method according to claim 1 or 2, wherein in the reprocessing step, the substrate is brought into contact with a mounting portion side of a rigid body, and the component side is heated and pressed with a flexible pressing member.

5. 3. The manufacturing method according to claim 1, wherein the reprocessing step comprises subjecting the substrate to a predetermined process to separate the substrate from the mounting member, and then heating and pressing the separated substrate.

6. The manufacturing method according to claim 1 or 2, wherein the pressing step and the reprocessing step are performed by the pressing unit.

7. the three-dimensional modeling system includes a printing device including the application unit and the pressing unit, and a heating and pressing device that heats and presses the base material; the pressing step is performed by the pressing unit of the printing device, The manufacturing method according to claim 1 or 2, wherein the reprocessing step is performed by the hot pressing device.

8. A three-dimensional printing system for manufacturing a model, comprising: an application unit that applies a liquid material to the base material on which the components are arranged; a pressing unit that places the substrate coated with the liquid material on a placing member and heats and presses it; a control unit that causes the pressing unit to perform a heat and pressure treatment to fix the components on the substrate that has been placed on the mounting member and coated with the liquid material, and that causes the pressing unit to perform a re-treatment to further heat and press the substrate that has been subjected to the heat and pressure treatment and has been peeled off from the mounting member; A three-dimensional modeling system equipped with the above.

9. a discharge head that discharges a fluid onto a target; a curing unit that cures the fluid dispensed onto the object to produce the base material; a mounting device that places the component on the base material, the coating unit coats the liquid material on the prepared substrate; The three-dimensional printing system according to claim 8 , wherein the pressing unit performs the heating and pressing process.

10. a mounting device that places the component on the base material; a printing device that includes the application unit, the pressing unit, and the control unit and that performs the heating and pressing process; The three-dimensional printing system according to claim 8 or 9, further comprising: a heating and pressing device that performs the reprocessing on the base material.

Images