Cooling module and electronic apparatus

Abstract

To reduce cost while securing cooling performance.SOLUTION: A cooling module is mounted to an electronic apparatus having a heating element. The cooling module includes: a first fan having a discharge port; a second fan having a discharge port; a first heat sink disposed to face the discharge port of the first fan; a second heat sink disposed to face the discharge port of the second fan; and a heat pipe for transporting heat of the heating element to the first heat sink and the second heat sink. The heat pipe includes: a first pipe part for connection to the heating element; a second pipe part branched from one end part of the first pipe part and connected to the first heat sink; and a third pipe part branched from one end part of the first pipe part and connected to the second heat sink.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a cooling module and an electronic device equipped with the cooling module. [Background technology]

[0002] Electronic devices such as laptop PCs are equipped with a cooling module that cools heat-generating components such as the CPU. The cooling module absorbs the heat generated by the heat-generating components and dissipates it to the outside.

[0003] Patent Document 1 discloses a cooling module including a pair of left and right fans, a pair of heat sinks arranged facing the outlets of each fan, and two heat pipes that transport heat from a heat generating element to each heat sink. One end of each of the two heat pipes is connected to the heat generating element adjacent to each other, and the other end is connected to the left and right heat sinks, respectively. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7349537 Summary of the Invention [Problem to be solved by the invention]

[0005] As in the configuration of Patent Document 1, conventional cooling modules use two heat pipes to transport heat from a heat-generating element to left and right heat sinks. This configuration allows for highly efficient heat transport to each heat sink using the heat pipes, resulting in high cooling performance. However, this configuration uses two heat pipes, which increases component costs and labor costs for assembling the heat pipes.

[0006] The present invention has been made in consideration of the above-mentioned problems with the conventional technology, and aims to provide a cooling module that can reduce costs while ensuring cooling performance, and an electronic device equipped with the cooling module. [Means for solving the problem]

[0007] A cooling module according to a first aspect of the present invention is a cooling module to be mounted on an electronic device having a heat generating element, and comprises: a first fan having an outlet; a second fan having an outlet; a first heat sink arranged facing the outlet of the first fan; a second heat sink arranged facing the outlet of the second fan; and a heat pipe that transports heat from the heat generating element to the first heat sink and the second heat sink, wherein the heat pipe has a first pipe section for connecting to the heat generating element, a second pipe section branching off from one end of the first pipe section and connected to the first heat sink, and a third pipe section branching off from one end of the first pipe section and connected to the second heat sink.

[0008] An electronic device according to a second aspect of the present invention comprises a housing, a heat generating element provided within the housing, and a cooling module provided within the housing for cooling the heat generating element, wherein the cooling module has a first fan having an outlet, a second fan having an outlet, a first heat sink arranged facing the outlet of the first fan, a second heat sink arranged facing the outlet of the second fan, and a heat pipe for transporting heat from the heat generating element to the first heat sink and the second heat sink, wherein the heat pipe has a first pipe section connected to the heat generating element, a second pipe section branching from one end of the first pipe section and connected to the first heat sink, and a third pipe section branching from one end of the first pipe section and connected to the second heat sink. [Effects of the Invention]

[0009] According to the above aspects of the present invention, it is possible to reduce costs while ensuring cooling performance. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment, viewed from above. [Figure 2] FIG. 2 is a bottom view schematically showing the internal structure of the housing. [Figure 3] FIG. 3 is a schematic cross-sectional plan view of a heat pipe. [Figure 4] FIG. 4 is a schematic diagram of a cooling module according to a modified example. [Figure 5] FIG. 5 is a schematic cross-sectional plan view of the heat pipe shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional plan view of a heat pipe according to a modification of the heat pipe shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cooling module and an electronic device according to preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0012] 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in FIG. 1, the electronic device 10 is a clamshell notebook PC in which a cover 12 and a housing 14 are connected by a hinge 16 so that they can rotate relative to each other. In this embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a tablet PC, a smartphone, or a portable game console.

[0013] The lid 12 is a thin, flat box. The lid 12 is equipped with a display 18. The display 18 can be configured as, for example, an organic EL display or a liquid crystal display.

[0014] The housing 14 is a thin, flat box. A keyboard 20 and a touchpad 21 face the top surface of the housing 14. Hereinafter, the housing 14 and each component mounted thereon will be described based on the posture of the operator operating the keyboard 20, with the depth direction of the housing 14 referred to as the front-to-rear direction, the width direction of the housing 14 referred to as the left-to-right direction, and the thickness direction of the housing 14 referred to as the up-to-down direction. These directions are determined for the sake of convenience, and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0015] The housing 14 is composed of a cover member 14A that forms the top surface and four side surfaces, and a cover member 14B that forms the bottom surface. The upper cover member 14A has a roughly bathtub shape with an open bottom surface. The lower cover member 14B has a roughly flat plate shape and serves as a lid that closes the bottom opening of the cover member 14A. The cover members 14A and 14B are stacked in the thickness direction and detachably connected to each other. The rear end of the housing 14 is connected to the lid 12 using a hinge 16.

[0016] Fig. 2 is a bottom view that schematically shows the internal structure of the housing 14. Fig. 2 is a view of the inside of the housing 14 as seen from the bottom side with the lower cover member 14B removed.

[0017] 2, the housing 14 contains a cooling module 22, a motherboard 24, and a battery device 26. The housing 14 can also contain various electronic components, mechanical components, and the like.

[0018] The motherboard 24 is the main board of the electronic device 10. The motherboard 24 is disposed toward the rear of the housing 14 and extends in the left-right direction. The motherboard 24 is a printed circuit board assembly (PCBA) on which various electronic components, such as a central processing unit (CPU) 30, a graphics processing unit (GPU), power components, a communication module, memory, and connection terminals, are mounted. The motherboard 24 is disposed below the keyboard 20 and is screwed to the rear surface of the keyboard 20 and the inner surface of the cover member 14A. For example, the upper surface of the motherboard 24 is the mounting surface for the cover member 14A, and the lower surface is the mounting surface 24a for the CPU 30 and other components. The CPU 30 performs calculations related to the main control and processing of the electronic device 10. The CPU 30 is configured by mounting a die 30a on a package substrate 30b.

[0019] The battery device 26 is a rechargeable battery that serves as a power source for the electronic device 10. The battery device 26 is disposed in front of the motherboard 24, and extends left and right along the front end of the housing 14.

[0020] Next, the configuration of the cooling module 22 will be described.

[0021] The CPU 30 is a heat-generating element that generates the largest amount of heat among all the electronic components housed in the housing 14. The cooling module 22 mainly absorbs and diffuses the heat generated by the CPU 30 and expels it to the outside of the housing 14. The cooling module 22 is stacked below the motherboard 24 so as to cover part of the mounting surface 24a of the motherboard 24. The cooling module 22 can also cool electronic components other than the CPU 30.

[0022] 2, the cooling module 22 includes a pair of left and right fans 32 and 33, a pair of left and right heat sinks 34 and 35, and a heat pipe 36. The cooling module 22 may also include a heat spreader formed of, for example, a copper plate, and a vapor chamber which is a plate-type heat transport device.

[0023] The fans 32 and 33 are disposed immediately in front of the heat sinks 34 and 35, respectively. The first left fan 32 is disposed with its outlet port 32a facing the first left heat sink 34. The second right fan 33 is disposed with its outlet port 33a facing the second right heat sink 35. The fans 32 and 33 are centrifugal fans that rotate impellers housed inside fan housings 32b and 33b using motors. The fans 32 and 33 have intake ports 32c and 33c that open to one or both of the top and bottom surfaces of the fan housings 32b and 33b. The fans 32 and 33 can cool the heat sinks 34 and 35 by drawing in air through the intake ports 32c and 33c and discharging it through the outlet ports 32a and 33a.

[0024] The heat sinks 34, 35 have a structure in which multiple plate-shaped fins are arranged at equal intervals in the left-right direction. Each fin stands upright in the vertical direction and extends in the front-to-back direction. Each fin is made of a metal with high thermal conductivity, such as aluminum or copper. A gap is formed between adjacent fins to allow air discharged from the fans 32, 33 to pass through. The air that passes through the heat sinks 34, 35 is exhausted to the outside of the housing 14 through an exhaust port opened on the rear side of the housing 14.

[0025] The structure of the heat pipe 36 will now be described.

[0026] The heat pipe 36 is a pipe-type heat transport device. The heat pipe 36 is made by flattening a metal pipe into a thin, elliptical cross-sectional shape, forming an enclosed space inside. The heat pipe 36 achieves highly efficient heat transport by allowing the working fluid sealed in the enclosed space to undergo a phase change as it flows. The metal pipe can be made of a metal with high thermal conductivity, such as copper or aluminum. Examples of the working fluid include water, alternative chlorofluorocarbons, acetone, or butane. A wick is provided within the enclosed space, and the condensed working fluid is transported by capillary action.

[0027] 2, the heat pipe 36 may be configured by extending a flat metal pipe in a substantially T-shape. The heat pipe 36 has a first pipe section 38, a second pipe section 39, and a third pipe section 40.

[0028] The first pipe section 38 is a section for connecting to the CPU 30 (die 30a), which is a heat-generating body. The first pipe section 38 constitutes a heat-receiving section (evaporator section) that absorbs heat from the CPU 30. A copper plate, thermally conductive grease, or the like may be interposed between the first pipe section 38 and the CPU 30. The first pipe section 38 may have a larger diameter than the second pipe section 39 and the third pipe section 40. In the configuration example shown in FIG. 2, the first pipe section 38 is disposed so as to extend in the front-to-rear direction on the mounting surface 24a. The installation direction, arrangement, etc. of the first pipe section 38 are not limited to this.

[0029] The second pipe section 39 and the third pipe section 40 are sections for connecting to the heat sinks 34, 35. The pipe sections 39, 40 branch out in two directions from the rear end (one end section 38a) of the first pipe section 38 and extend in the left-right direction. In this way, the heat pipe 36 is configured such that the three pipe sections 38 to 40 branch out in three directions at the branch section (branching point) 36a.

[0030] The second pipe section 39 has an end 39a opposite to the branch section 36a side connected to the first heat sink 34. The third pipe section 40 has an end 40a opposite to the branch section 36a side connected to the second heat sink 35. The ends 39a, 40a of the pipe sections 39, 40 can be joined to the undersides of the heat sinks 34, 35 by brazing, for example. The ends 39a, 40a form a heat dissipation section (condensation section) that dissipates heat from the CPU 30 transported from the first pipe section 38 to the heat sinks 34, 35.

[0031] FIG. 3 is a schematic cross-sectional plan view of the heat pipe 36. As shown in FIG.

[0032] 2 and 3, in the heat pipe 36 of this embodiment, the second pipe section 39 and the third pipe section 40 can be formed from a single metal pipe extending in the left-right direction. The pipe sections 39, 40 do not need to be straight. The pipe sections 39, 40 can also be configured with a curved shape, for example, near the branch section 36a. The first pipe section 38 is connected so that one end 38a penetrates the outer surface of the metal pipe forming the pipe sections 39, 40, and the pipe sections can be joined to each other by brazing or the like.

[0033] 3, the heat pipe 36 has a first wick 42, a second wick 43, and a third wick 44. The wicks 42 to 44 receive heat from the CPU 30 to promote evaporation of the working fluid, and then transport the condensed working fluid by dissipating heat after evaporation through capillary action.

[0034] The first wick 42 is housed in the sealed space 38b of the first pipe section 38. The second wick 43 is housed in the sealed space 39b of the second pipe section 39. The third wick 44 is housed in the sealed space 40b of the third pipe section 40. As described above, the pipe sections 39 and 40 of the heat pipe 36 are formed from a single metal pipe. Therefore, the wicks 43 and 44 can be made from the same wick, and can be filled simultaneously into the continuous sealed spaces 39b and 40b.

[0035] In the heat pipe 36, the first wick 42 is formed of a fiber wick, and the second wick 43 and the third wick 44 are formed of a powder wick. The fiber wick that constitutes the first wick 42 can be formed by weaving or bundling thin metal wires such as copper, aluminum, or stainless steel, or thin non-metallic wires such as carbon fiber wires. The fiber wick may also be called a mesh wick. The powder wick that constitutes the second wick 43 and the third wick 44 can be formed of a sintered metal made by sintering powder of a metal such as copper or nickel. The powder wick can be fixed to the inner surface of the pipe sections 38 and 40 by sintering fine powder filled in the sealed spaces 39b and 40b.

[0036] The end 42a of the first wick 42 on the one end 38a side is provided so as to protrude from the one end 38a of the first pipe section 38. Hereinafter, the end 42a may also be referred to as the "protruding portion 42a." The protruding portion 42a protrudes into the branch section 36a and can be inserted into the wicks 43, 44 and joined to each other.

[0037] That is, the first wick 42, which is made of a fiber wick, has its protruding portion 42a inserted into the wicks 43, 44, which are made of a powder wick. The heat pipe 36 can be joined to each other by heating and sintering the protruding portion 42a inserted into the powder that forms the wicks 43, 44. This allows the working fluid condensed at the ends 39a, 40a to be smoothly transported from the wicks 43, 44 to the first wick 42.

[0038] As described above, the cooling module 22 of this embodiment is mounted on an electronic device 10 that includes, for example, a CPU 30 as a heat-generating element. The cooling module 22 may include a first fan 32, a second fan 33, a first heat sink 34 arranged facing the outlet 32a of the first fan 32, a second heat sink 35 arranged facing the outlet 33a of the second fan 33, and a heat pipe 36 that transports heat from the CPU 30 to the heat sinks 34 and 35. The heat pipe 36 may include a first pipe section 38 for connecting to the CPU 30, a second pipe section 39 branching from one end 38a of the first pipe section 38 and connected to the first heat sink 34, and a third pipe section 40 branching from one end 38a of the first pipe section 38 and connected to the second heat sink 35.

[0039] Therefore, in the cooling module 22, the CPU 30, which is a heat-generating element, and the left and right heat sinks 34, 35, which are arranged adjacent to the left and right fans 32, 33, are connected by a single heat pipe 36. In other words, in the cooling module 22, the heat pipe 36 that transports heat to the left and right heat sinks 34, 35 does not need to be configured as two separate components. This reduces the component cost of the cooling module 22. The cooling module 22 simplifies the assembly work of the heat pipe 36, thereby reducing the labor cost. Furthermore, the cooling module 22 maintains highly efficient heat transport to each heat sink 34, 35 through the heat pipe 36. This allows the cooling module 22 and the electronic device 10 equipped with it to ensure high cooling performance while reducing costs.

[0040] The heat pipe 36 may have wicks 42, 43, and 44 housed in the pipe sections 38, 39, and 40, respectively. The first wick 42 may be a fiber wick made of thin wire. The second wick 43 and the third wick 44 may be powder wicks made of powder. In this case, the end 39a of the first wick 42, made of fiber wick, may be butted against the flanks of the wicks 43 and 44 made of powder wick, allowing them to be joined together. This allows the wicks 42 to 44 filled in the pipe sections 38 to 40 to be joined together. As a result, smooth flow of the working fluid is ensured at the junctions between the first wick 42 and the wicks 43 and 44, improving the heat transport efficiency of the entire heat pipe 36.

[0041] 2 and 3, the heat pipe 36 has a configuration in which the first pipe section 38 is inserted into the side of the pipe sections 39 and 40, which are formed from a single metal pipe, and connected to the other sections. Therefore, if the first wick 42 of the first pipe section 38 were made of a powder wick, it would be difficult to butt or insert the first wick 42 into the side of the other wicks 43 and 44. This could result in an unstable joint between the first wick 42 and the other wicks 43 and 44, which could result in insufficient liquid transfer. In this regard, the heat pipe 36 has a first wick 42 made of a fiber wick, which allows for a strong joint between the first wick 42 and the other wicks 43 and 44.

[0042] In particular, the first wick 42 made of a fiber wick may be provided so as to protrude from one end 38a of the first pipe section 38. In this case, the protruding portion 42a of the first wick 42 may be inserted into the wicks 43 and 44 made of powder wicks and joined together. This further improves the joining strength between the first wick 42 and the wicks 43 and 44, ensuring smoother delivery of the working fluid in this portion.

[0043] Fig. 4 is a schematic diagram of a cooling module 22A according to a modified example, and Fig. 5 is a schematic cross-sectional plan view of a heat pipe 36A shown in Fig. 4.

[0044] The cooling module 22A shown in Fig. 4 includes a heat pipe 36A having a different configuration from the heat pipe 36 of the cooling module 22 shown in Fig. 2. The heat pipe 36 described above has a configuration in which each pipe section 38 to 40 branches off at a substantially T-shaped branch section 36a. More specifically, the heat pipe 36 has a configuration in which the first pipe section 38 is inserted into the side of the pipe sections 39 and 40, which are formed from a single metal pipe.

[0045] 4 and 5 has a configuration in which each pipe section 38-40 branches off at a substantially Y-shaped branch section 36b. In the heat pipe 36A, the second pipe section 39 and the third pipe section 40 are each formed from a different metal pipe. In the heat pipe 36A, the first pipe section 38 has a larger diameter than the pipe sections 39, 40. In the heat pipe 36A, one end 38a of the first pipe section 38 is connected to the end sections 39a, 40 of the pipe sections 39, 40 by piercing them, and the ends are joined together by brazing or the like.

[0046] 5, the heat pipe 36A has a first wick 46, a second wick 47, and a third wick 48 instead of the above-described first wick 42, second wick 43, and third wick 44. In the heat pipe 36A, the second pipe section 39 and the third pipe section 40 are formed from different metal pipes, so the wicks 47 and 48 are housed individually in sealed spaces 39b and 40b, respectively.

[0047] In this heat pipe 36A, the first wick 46 is formed of a fiber wick, and the second wick 47 and the third wick 48 are formed of a powder wick. Ends 46a and 46b on the one end 38a side of the first wick 46 are provided so as to protrude from the one end 38a of the first pipe section 38. Hereinafter, the ends 46a and 46b may also be referred to as "protruding portions 46a and 46b." The protruding portions 46a and 46b protrude into the branch section 36b and can be inserted into the wicks 47 and 48, respectively, and joined to each other.

[0048] That is, the first wick 46, which is made of a fiber wick, has its protruding portions 46a and 46b inserted into the wicks 47 and 48, which are made of a powder wick. As with the heat pipe 36, the heat pipe 36A can bond the wicks 46 to 48 to each other by heating and sintering the protruding portions 46a and 46b inserted into the powder that forms the wicks 47 and 48. This firmly bonds the first wick 46 and the wicks 47 and 48 in the heat pipe 36A as well, ensuring smooth flow of the working fluid through this portion.

[0049] Therefore, in this cooling module 22A, the CPU 30, which is a heat generating element, can be connected to the left and right heat sinks 34, 35 by a single heat pipe 36A. This allows the cooling module 22A and the electronic device 10 equipped with it to ensure high cooling performance while reducing costs.

[0050] FIG. 6 is a schematic cross-sectional plan view of a heat pipe 36B according to a modification of the heat pipe 36A shown in FIG.

[0051] The heat pipe 36B shown in Fig. 6 is similar to the heat pipe 36A shown in Fig. 5 in that the pipe sections 38 to 40 are branched at a substantially Y-shaped branch section 36b. The heat pipe 36B has a first wick 50, a second wick 51, and a third wick 52 instead of the first wick 46, the second wick 47, and the third wick 48 of the heat pipe 36A shown in Fig. 5.

[0052] In the heat pipe 36B, the first wick 50 is formed of a powder wick, and the second wick 51 and the third wick 52 are formed of a fiber wick. The ends 51a and 52a of the wicks 51 and 52 on the one end 38a side are provided so as to protrude from the ends 39c and 40c on the branched portion 36b side of the pipe portions 39 and 40. Hereinafter, the ends 51a and 52a may also be referred to as "protruding portions 51a and 52a." The protruding portions 51a and 52a can be inserted into the first wick 50 and joined to each other.

[0053] That is, the wicks 51 and 52 made of fiber wicks have their protruding portions 51a and 52a inserted into the first wick 50 made of powder wick. As with the heat pipes 36 and 36B, the heat pipe 36B can bond the wicks 50 to 52 together by heating and sintering the protruding portions 51a and 52a inserted into the powder that forms the first wick 508. This firmly bonds the first wick 50 and the wicks 51 and 52 in the heat pipe 36AB as well, ensuring smooth flow of the working fluid through this portion.

[0054] Therefore, the cooling module 22A having such a heat pipe 36B and the electronic device 10 including the cooling module 22A can also ensure high cooling performance while reducing costs.

[0055] It should be noted that the present invention is not limited to the above-described embodiment, and can be freely modified without departing from the spirit of the present invention. [Explanation of symbols]

[0056] 10 Electronic equipment 12 Lid 14. Case 22,22A Cooling Module 24 Motherboard 30 CPU 32 First Fan 33 Second Fan 34 First heat sink 35 Second heat sink 36, 36A, 36B heat pipes 38 First Pipe Section 39 Second Pipe Section 40 Third Pipe Section 42, 46, 50 1st Wick 43, 47, 51 Second Wick 44, 48, 52 3rd Wick

Claims

1. A cooling module mounted on an electronic device having a heat generating element, a first fan having an outlet; a second fan having an outlet; a first heat sink disposed facing an outlet of the first fan; a second heat sink disposed facing an outlet of the second fan; a heat pipe that transports heat from the heat generating element to the first heat sink and the second heat sink; Equipped with The heat pipe is a first pipe portion for connecting to the heating element; a second pipe section branched from one end of the first pipe section and connected to the first heat sink; a third pipe section branched from one end of the first pipe section and connected to the second heat sink; have A cooling module characterized by:

2. 10. The cooling module of claim 1, The heat pipe is a first wick accommodated in the first pipe section; a second wick accommodated in the second pipe section; a third wick accommodated in the third pipe section; and The first wick is a fiber wick formed by a thin wire, The second wick and the third wick are powder wicks formed by powder. A cooling module characterized by:

3. 3. The cooling module of claim 2, The fiber wick is provided so as to protrude from one end of the first pipe portion, and the protruding portion is inserted into the powder wick and joined to each other. A cooling module characterized by:

4. 10. The cooling module of claim 1, The heat pipe is a first wick accommodated in the first pipe section; a second wick accommodated in the second pipe section; a third wick accommodated in the third pipe section; and the first wick is a powder wick formed of powder, The second wick and the third wick are fiber wicks formed by thin wires. A cooling module characterized by:

5. 5. The cooling module of claim 4, The fiber wick is provided so as to protrude from one end of the second pipe section and the third pipe section, and the protruding portion is inserted into the powder wick and joined to each other. A cooling module characterized by:

6. An electronic device, The housing and a heating element provided within the housing; a cooling module provided in the housing and configured to cool the heat generating element; Equipped with The cooling module comprises: a first fan having an outlet; a second fan having an outlet; a first heat sink disposed facing an outlet of the first fan; a second heat sink disposed facing an outlet of the second fan; a heat pipe that transports heat from the heat generating element to the first heat sink and the second heat sink; and The heat pipe is a first pipe portion connected to the heating element; a second pipe section branched from one end of the first pipe section and connected to the first heat sink; a third pipe section branched from one end of the first pipe section and connected to the second heat sink; have An electronic device characterized by:

7. 7. The electronic device according to claim 6, The heat pipe is a first wick accommodated in the first pipe section; a second wick accommodated in the second pipe section; a third wick accommodated in the third pipe section; and The first wick is a fiber wick formed by a thin wire, The second wick and the third wick are powder wicks formed by powder. An electronic device characterized by:

8. 7. The electronic device according to claim 6, The heat pipe is a first wick accommodated in the first pipe section; a second wick accommodated in the second pipe section; a third wick accommodated in the third pipe section; and the first wick is a powder wick formed of powder, The second wick and the third wick are fiber wicks formed by thin wires. An electronic device characterized by:

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