Substrate processing apparatus

Abstract

To provide a substrate processing apparatus that can increase throughput.SOLUTION: A substrate processing apparatus 100 includes a first load port part 10, a second load port part 10, a first processing part 30, a second processing part 40, a mounting part 50, and a transfer part 20. Each of the first load port part 10 and the second load port part 10 stores a substrate W. Each of the first processing part 30 and the second processing part 40 processes the substrate W. The substrate W is temporarily placed on the mounting part 50. A first transfer robot 21 and a second transfer robot 22 are arranged on the transfer part 20. The first transfer robot 21 transfers the substrate W between the first load port part 10, the first processing part 30, and the mounting part 50. The second transfer robot 22 transfers the substrate W between the second load port part 10, the second processing part 40, and the mounting part 50.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, or substrates for solar cells. For example, Patent Document 1 describes a substrate processing apparatus that cleans substrates.

[0003] This substrate processing apparatus is provided with an indexer block, a reverse path block, and a processing block. The indexer robot in the indexer block removes a substrate from a carrier containing multiple substrates and transports it to the reverse path block. The center robot in the processing block removes the substrate from the reverse path block and transports it to one of multiple processing units stacked vertically within the processing block. In each processing unit, the front or back surface of the substrate is cleaned. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-57378 Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate processing apparatus described in Patent Document 1, by devising a method for transporting from the indexer robot to the reverse path block, the vertical movement distance of a single indexer robot can be shortened, thereby suppressing a decrease in throughput due to the operating status of a single indexer robot. However, in the configuration of Patent Document 1, the transport speed of the indexer robot is determined by the operating speed of the center robot, out of the two types of robots (indexer robot and center robot). Therefore, a decrease in throughput of the substrate processing apparatus cannot be sufficiently suppressed.

[0006] An object of the present invention is to provide a substrate processing apparatus capable of increasing throughput. [Means for solving the problem]

[0007] A substrate processing apparatus according to one aspect of the present invention includes a first load port section for storing substrates, a second load port section for storing substrates, a first processing section for processing substrates, a second processing section for processing substrates, a mounting section on which substrates are temporarily placed, and a transport section that, in a plan view, contacts the first load port section, the second load port section, the first processing section, and the second processing section, and the transport section is provided with a first transport robot that transports substrates between the first load port section, the first processing section, and the mounting section, and a second transport robot that transports substrates between the second load port section, the second processing section, and the mounting section. [Effects of the Invention]

[0008] According to the present invention, the throughput of the substrate processing apparatus can be increased. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view showing a configuration of a substrate processing apparatus according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a diagram showing an internal configuration of the substrate processing apparatus of FIG. [Figure 3] FIG. 2 is a diagram showing an internal configuration of the substrate processing apparatus of FIG. [Figure 4] 1 is a flowchart showing a surface treatment of a substrate. [Figure 5] 10 is a flowchart showing a back surface treatment of a substrate. [Figure 6] 10 is a flowchart showing a first double-sided processing of a substrate. [Figure 7] 10 is a flowchart showing a second double-sided processing of a substrate. [Figure 8] FIG. 10 is a diagram showing a configuration of a substrate processing apparatus according to a reference example. [Figure 9] 10 is a flowchart showing a surface treatment of a substrate in a reference example. [Figure 10] 10 is a flowchart showing a back surface treatment of a substrate in a reference example. [Figure 11] 10 is a flowchart showing a first double-sided processing of a substrate in a reference example. [Figure 12] 10 is a flowchart showing a second double-sided processing of a substrate in a reference example. [Figure 13] FIG. 10 is a diagram showing a configuration of a substrate processing apparatus according to a second embodiment of the present invention. [Figure 14] FIG. 14 is a diagram showing an internal configuration of the substrate processing apparatus of FIG. [Figure 15] FIG. 14 is a diagram showing an internal configuration of the substrate processing apparatus of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] A substrate processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

[0011] 1. First embodiment (1) Configuration of the substrate processing equipment Fig. 1 is a plan view showing the configuration of a substrate processing apparatus according to a first embodiment of the present invention. Figs. 2 and 3 are views showing the internal configuration of the substrate processing apparatus 100 of Fig. 1. In Figs. 1 to 3, arrows are added to indicate the mutually orthogonal X, Y, and Z directions to clarify the positional relationships. The X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction corresponds to the vertical direction (up and down direction).

[0012] 1, the substrate processing apparatus 100 includes a plurality of load port sections 10, a transport section (transport block) 20, processing sections (processing blocks) 30 and 40, a plurality of placement sections 50, a discharge section 60, and a control device 70. The substrate processing apparatus 100 also includes maintenance sections 110 and 120 and window sections 130 and 140. In this example, the substrate processing apparatus 100 is a substrate cleaning apparatus that performs a cleaning process on a substrate W to be processed.

[0013] Each load port section 10 stores a substrate W. In this example, the substrate processing apparatus 100 includes four load port sections 10. When distinguishing between the four load port sections 10, the four load port sections 10 are referred to as load port sections 11, 12, 13, and 14, respectively. The load port sections 11 to 14 are arranged in the stated order in the Y direction (from top to bottom on the paper in the example of FIG. 1). A carrier 15 is placed on each load port section 10. In each carrier 15, a plurality of substrates W are stored in multiple stages with their surfaces facing upward.

[0014] The transport unit 20 is in contact with the load port units 11 to 14 and the processing units 30 and 40 in a plan view. Transport robots 21 and 22 are arranged in the transport unit 20 so as to be aligned in the Y direction. The transport robot 21 has articulated hands 21a and 21b that are freely movable in the X, Y, and Z directions within the transport unit 20. The transport robot 21 uses the hands 21a and 21b to transport the substrate W from a predetermined location to another location. Similarly, the transport robot 22 has articulated hands 22a and 22b that are freely movable in the X, Y, and Z directions within the transport unit 20. The transport robot 22 uses the hands 22a and 22b to transport the substrate W from a predetermined location to another location.

[0015] Specifically, as indicated by arrows A, E, and G, the transfer robot 21 transfers the substrate W between the load port section 11, the processing section 30, and the receiver 50. Alternatively, as indicated by arrows B, E, and G, the transfer robot 21 transfers the substrate W between the load port section 12, the processing section 30, and the receiver 50. Furthermore, as indicated by arrows C, F, and H, the transfer robot 22 transfers the substrate W between the load port section 13, the processing section 40, and the receiver 50. Alternatively, as indicated by arrows D, F, and H, the transfer robot 22 transfers the substrate W between the load port section 14, the processing section 40, and the receiver 50.

[0016] Here, when a substrate W is placed at a predetermined location, the transport robot 21 can perform a swap operation in which the transport robot 21 removes the substrate W using one of the hands 21 a, 21 b and then places another substrate W held by the other of the hands 21 a, 21 b in that location. Similarly, the transport robot 22 can also perform a swap operation using the hands 22 a, 22 b.

[0017] In a plan view, the load port units 11 and 12 and the processing unit 30 are arranged along the X direction with the transport robot 21 of the transport unit 20 sandwiched therebetween, and the load port units 13 and 14 and the processing unit 40 are arranged along the X direction with the transport robot 22 of the transport unit 20 sandwiched therebetween. In a plan view, a separation space V is provided between the processing units 30 and 40 to separate the processing units 30 and 40. The separation space V extends in the X direction. In addition, in a plan view, a portion of the separation space V (the portion on the right side of the page in the example of FIG. 1) is open and not surrounded by the transport unit 20 and the processing units 30 and 40. In the following description, the surfaces of the processing units 30 and 40 that face each other will be referred to as the inner surface, and the surface opposite the inner surface in the Y direction will be referred to as the outer surface.

[0018] As shown in FIG. 2, the processing unit 30 has a plurality of (four in this example) processing chambers 31, 32, 33, and 34. In this embodiment, the processing chambers 31 to 34 are stacked in this order from bottom to top. A plurality of processing units 35, 36, 37, and 38 are provided in the processing chambers 31 to 34, respectively. Each of the processing units 35 to 38 includes a spin chuck, a nozzle, and a cup. In each of the processing units 35 to 38, the substrate W is rotated while being held in a substantially horizontal position by the spin chuck. A processing liquid is supplied from the nozzle to the upper surface of the rotating substrate W. The processing liquid splashed from the substrate W is caught in the cup.

[0019] Similarly, as shown in FIG. 3, processing unit 40 has multiple (four in this example) processing chambers 41, 42, 43, and 44. In this embodiment, processing chambers 41 to 44 are stacked in this order from bottom to top. Multiple processing units 45, 46, 4, and 48 are provided in the multiple processing chambers 41 to 44, respectively. Each processing unit 45 to 48 includes a spin chuck, a nozzle, and a cup. The operation of processing units 45 to 48 is similar to that of processing units 35 to 38.

[0020] In this way, the substrate W is processed by supplying a processing liquid to the upper surface of the substrate W in any of the processing units 35 to 38, 45 to 48. Here, when the substrate W is loaded into any of the processing units 35 to 38, 45 to 48 with its front surface facing upward, the processing is performed on the front surface of the substrate W. On the other hand, when the substrate W is loaded into any of the processing units 35 to 38, 45 to 48 with its back surface facing upward, the processing is performed on the back surface of the substrate W. In this example, the processing liquid is a cleaning liquid, and the substrate processing is a cleaning process.

[0021] Each mounting part 50 is configured so that a substrate W can be temporarily placed thereon and so that the placed substrate can be inverted. Here, inverting the substrate W means changing the substrate W from a state in which the front surface faces upward to a state in which the back surface faces upward, or changing the substrate W from a state in which the back surface faces upward to a state in which the front surface faces upward. In this embodiment, each mounting part 50 is disposed in the separation space V. The size of each mounting part 50 in the X direction is smaller than the size of the separation space V.

[0022] In this example, the substrate processing apparatus 100 includes two mounting parts 50. When distinguishing between the two mounting parts 50, the two mounting parts 50 are referred to as mounting parts 51 and 52, respectively. The mounting part 52 is disposed above the mounting part 51. Specifically, the mounting part 51 overlaps with the processing chambers 31 and 32 of the processing part 30 and the processing chambers 41 and 42 of the processing part 40 in a side view. The mounting part 52 overlaps with the processing chambers 33 and 34 of the processing part 30 and the processing chambers 43 and 44 of the processing part 40 in a side view. That is, the mounting part 51 is sandwiched between the processing chambers 31 and 32 and the processing chambers 41 and 42, and the mounting part 52 is sandwiched between the processing chambers 33 and 34 and the processing chambers 43 and 44 of the processing part 40.

[0023] According to the above arrangement, the mounting part 51 is adjacent to the processing chambers 31, 32, 41, and 42, and the mounting part 52 is adjacent to the processing chambers 33, 34, 43, and 44. Therefore, in the present embodiment, the mounting part 51 may be used to transport the substrate W between the processing chambers 31 and 32, and may also be used to transport the substrate W between the processing chambers 41 and 42. Furthermore, the mounting part 52 may be used to transport the substrate W between the processing chambers 33 and 34, and may also be used to transport the substrate W between the processing chambers 43 and 44.

[0024] The discharge unit 60 is disposed in the separated space V. In this example, the discharge unit 60 is disposed below the mounting unit 50 in the separated space V. The discharge unit 60 is configured to be able to discharge the processing fluid from the processing units 30, 40. The processing fluid includes a liquid and a gas. The discharge unit 60 includes a drainage unit 61 that discharges the liquid and an exhaust unit 62 that exhausts the gas. The processing liquid used in the processing units 30, 40 is guided to the drainage unit 61 through the drainage pipe 101 in FIG. 2 and is discharged from the drainage unit 61 to a drainage facility (not shown). The atmosphere inside the processing units 30, 40 is guided to the exhaust unit 62 through the exhaust pipe 102 in FIG. 3 and is discharged from the exhaust unit 62 to an exhaust facility (not shown).

[0025] The control device 70 includes, for example, a CPU (Central Processing Unit), and controls the operations of the transport part 20, processing parts 30, 40, and mounting part 50 in accordance with a processing recipe that describes the processing details of the substrate W. In FIG. 1, the control device 70 is arranged outside the transport part 20 and processing parts 30, 40, but the embodiment is not limited to this. The control device 70 may also be arranged inside the transport part 20 or processing parts 30, 40.

[0026] The maintenance unit 110 is provided on the inner surface of the processing unit 30 so as to face the separation space V, allowing a user to access the inside of the processing unit 30. The maintenance unit 110 includes an opening 111 and a cover 112. The opening 111 is formed on the inner surface of the processing unit 30 and connects the inside of the processing unit 30 with the separation space V. The cover 112 is provided on the inner surface of the processing unit 30 so as to be openable and closable. The cover 112 may be switched between an open state and a closed state by being attached to and detached from the processing unit 30, or may be switched between an open state and a closed state by being slid in the X direction.

[0027] When the cover 112 is in the closed state, the opening 111 is covered by the cover 112. This prevents foreign matter from entering the inside of the processing unit 30. On the other hand, when the cover 112 is in the open state, the opening 111 is not covered by the cover 112 and is exposed to the separated space V. This allows a user to access the inside of the processing unit 30 from the separated space V through the opening 111 for maintenance, etc. At least a portion of the cover 112 may be made of a light-transmitting member. In this case, the user can view the inside of the processing unit 30 through the maintenance unit 110 even when the cover 112 is in the closed state.

[0028] Similarly, maintenance unit 120 is provided on the inner surface of processing unit 40 so as to face separation space V, allowing a user to access the interior of processing unit 40. Maintenance unit 120 includes an opening 121 and a cover 122. Opening 121 is formed on the inner surface of processing unit 40 and connects the interior of processing unit 40 with separation space V. Cover 122 is provided on the inner surface of processing unit 40 so as to be able to be opened and closed freely. The configurations of opening 121 and cover 122 are similar to the configurations of opening 111 and cover 112, respectively.

[0029] The windows 130 and 140 are provided in the processing units 30 and 40, respectively. In this example, the window 130 is provided on the outer surface of the processing unit 30, and the window 140 is provided on the outer surface of the processing unit 40. At least a portion of each of the windows 130 and 140 is formed from, for example, a light-transmitting material. Therefore, during maintenance, etc., a user can view the inside of the processing unit 30 through the window 130, and the inside of the processing unit 40 through the window 140.

[0030] (2) Operation of the substrate processing device (a) Processing section The operation of the processing section 30 includes front surface processing, back surface processing, first double-sided processing, second double-sided processing, and transfer processing. Below, the operation of the processing section 30 will be described based on the transport operation of the transport robot 21. The operation of the processing section 40 is the same as that of the processing section 30, and the transport operation of the transport robot 22 is the same as that of the transport robot 21. Therefore, a description of the operation of the processing section 40 and the transport operation of the transport robot 22 will be omitted.

[0031] (b) Surface treatment Surface treatment is a process for cleaning the surface of the substrate W. Fig. 4 is a flowchart showing the surface treatment of the substrate W. In the surface treatment, the following steps S11 to S13 form one cycle. First, the transport robot 21 unloads the substrate W from the carrier 15 of one of the load port sections 10 using one of the hands 21a and 21b (step S11). The substrate W unloaded from the carrier 15 in step S11 is an unprocessed substrate W, and the surface of the substrate W faces upward.

[0032] Next, the transfer robot 21 uses the other of the hands 21a, 21b to unload the substrate W from one of the processing chambers 31 to 34, and then loads the substrate W unloaded by one of the hands 21a, 21b in step S11 into that processing chamber 31 to 34 (step S12). The substrate W unloaded from one of the processing chambers 31 to 34 in step S12 is a substrate W whose surface has been cleaned in that processing chamber 31 to 34. In addition, a processing liquid is supplied to the surface of the substrate W loaded into that processing chamber 31 to 34 by one of the processing units 35 to 38. This cleans the surface of the substrate W. The substrate W whose surface has been cleaned will be unloaded from that processing chamber 31 to 34 by the transfer robot 21 in the next cycle.

[0033] Next, the transport robot 21 loads the substrate W, which was loaded by the other of the hands 21a and 21b in step S12, into the carrier 15 (step S13). The substrate W loaded into the carrier 15 in step S13 is a substrate W whose surface has been cleaned. The carrier 15 into which the substrate W is loaded is the carrier 15 in which the substrate W was originally stored in an unprocessed state (hereinafter referred to as the original carrier 15). This completes one cycle of the transport operation of the transport robot 21 for surface processing.

[0034] In this way, in the surface treatment, three steps are performed during one cycle of the transfer robot 21. The transfer operation of the transfer robot 21 itself is repeated. Therefore, the process returns to step S11. In this case, step S13 and step S11 of the next cycle may be performed simultaneously.

[0035] (c) Back surface treatment The rear surface treatment is a treatment for cleaning the rear surface of the substrate W. Fig. 5 is a flowchart showing the rear surface treatment of the substrate W. In the rear surface treatment, the following steps S21 to S25 form one cycle. First, the transport robot 21 unloads the substrate W from the carrier 15 of one of the load port sections 10 using one of the hands 21a and 21b (step S21). The substrate W unloaded from the carrier 15 in step S11 is an unprocessed substrate W, and the front surface of the substrate W faces upward.

[0036] Next, the transport robot 21 uses the other of the hands 21a, 21b to take the substrate W out of one of the mount parts 50, and loads the substrate W that was loaded by one of the hands 21a, 21b in step S21 into that mount part 50 (step S22). The substrate W that was loaded out of one of the mount parts 50 in step S22 is a substrate W that has been inverted on that mount part 50. Therefore, the back surface of that substrate faces upward. Furthermore, the substrate W that has been loaded into that mount part 50 is inverted. As a result, the back surface of the substrate W faces upward. The inverted substrate W will be loaded out of that mount part 50 by the transport robot 21 in the next cycle.

[0037] Next, the transfer robot 21 uses one of the hands 21a, 21b to unload the substrate W from one of the processing chambers 31 to 34, and then loads the substrate W unloaded by the other of the hands 21a, 21b in step S22 into that processing chamber 31 to 34 (step S23). The substrate W unloaded from one of the processing chambers 31 to 34 in step S23 is a substrate W whose back surface has been cleaned in that processing chamber 31 to 34. Furthermore, a processing liquid is supplied to the back surface of the substrate W loaded into that processing chamber 31 to 34 by one of the processing units 35 to 38. This cleans the back surface of the substrate W. The substrate W whose back surface has been cleaned will be unloaded from that processing chamber 31 to 34 by the transfer robot 21 in the next cycle.

[0038] Thereafter, the transport robot 21 uses the other of the hands 21a and 21b to take the substrate W out of one of the mount parts 50, and loads the substrate W taken out by one of the hands 21a and 21b in step S23 into that mount part 50 (step S24). The substrate W taken out of one of the mount parts 50 in step S24 is a substrate W whose back surface has been cleaned and which has been inverted on that mount part 50. Therefore, the front surface of the substrate faces upward. Furthermore, the substrate W loaded onto that mount part 50 is a substrate W whose back surface has been cleaned and which has been inverted on that mount part 50. As a result, the front surface of the substrate W faces upward. The inverted substrate W will be taken out of that mount part 50 by the transport robot 21 in the next cycle.

[0039] Finally, the transport robot 21 transports the substrate W transported by the other of the hands 21a and 21b in step S24 back into the original carrier 15 (step S25). The substrate W transported into the carrier 15 in step S25 is a substrate W whose rear surface has been cleaned. This completes one cycle of the transport operation of the transport robot 21 in the rear surface processing.

[0040] Thus, in the rear surface processing, five steps are executed during one cycle of the transfer robot 21. The transfer operation of the transfer robot 21 itself is repeated. Therefore, the processing returns to step S21. In this case, step S25 and step S21 of the next cycle may be executed simultaneously.

[0041] (d) First double-sided processing The first double-sided processing is processing for cleaning both surfaces of the substrate W, and the back surface of the substrate W is cleaned first, followed by the front surface of the substrate W. FIG. 6 is a flowchart showing the first double-sided processing of the substrate W. As shown in FIG. 6, the first double-sided processing includes steps S31 to S36. In the first double-sided processing, steps S31 to S36 constitute one cycle. Steps S31 to S34 are the same as steps S21 to S24 in the back surface processing of FIG. 5, respectively. Steps S35 and S36 are the same as steps S12 and S13 in the front surface processing of FIG. 4, respectively. In this way, in the first double-sided processing, six steps are performed during one cycle of the transport robot 21.

[0042] (e) Second double-sided processing The second double-sided processing is processing for cleaning both surfaces of the substrate W, and the front surface of the substrate W is cleaned first, followed by the back surface of the substrate W. FIG. 7 is a flowchart showing the second double-sided processing of the substrate W. As shown in FIG. 7, the second double-sided processing includes steps S41 to S46. In the second double-sided processing, steps S41 to S46 constitute one cycle. Steps S41 and S42 are the same as steps S11 and S12, respectively, in the front surface processing of FIG. 4. Steps S43 to S46 are the same as steps S22 to S25, respectively, in the back surface processing of FIG. 5. Thus, in the second double-sided processing, as in the first double-sided processing, six steps are performed during one cycle of the transport robot 21.

[0043] (f) Transfer processing The transfer process is a control method in which the processing section 30 performs processing on the substrate W carried out from the carrier 15 by the transport robot 22, and is mainly executed when the processing section 40 is unable to perform processing. Alternatively, the transfer process is a control method in which the processing section 40 performs processing on the substrate W carried out from the carrier 15 by the transport robot 21 when the processing section 30 is unable to perform processing, and is mainly executed when the processing section 30 is unable to perform processing.

[0044] Specifically, when the processing section 40 is unable to perform the processing, the transfer robot 22 takes the substrate W out of one of the carriers 15 of the load port sections 13, 14 and transfers it onto one of the receivers 50. The transfer robot 21 transfers the substrate W between the receiver 50 and the processing section 30. As a result, the processing section 30 processes the substrate W. The processing section 30 may perform any of front surface processing, back surface processing, first double-sided processing, and second double-sided processing. Thereafter, the transfer robot 21 transfers the processed substrate W into one of the receivers 50. The transfer robot 22 transfers the processed substrate W that has been transferred into the receiver 50 back to the original carrier 15.

[0045] Alternatively, when the processing section 30 is unable to perform the processing, the transfer robot 21 takes the substrate W out of one of the carriers 15 of the load port sections 11, 12 and transfers it onto one of the receivers 50. The transfer robot 22 transfers the substrate W between the receiver 50 and the processing section 40. As a result, the processing section 40 processes the substrate W. The processing section 30 may perform any of front surface processing, back surface processing, first double-sided processing, and second double-sided processing. Thereafter, the transfer robot 22 transfers the processed substrate W into one of the receivers 50. The transfer robot 21 transfers the processed substrate W that has been transferred into the receiver 50 back to the original carrier 15.

[0046] (3) Reference example (a) Substrate processing equipment Fig. 8 is a diagram showing the configuration of a substrate processing apparatus according to a reference example. As shown in Fig. 8, a substrate processing apparatus 100A according to the reference example has the same configuration as the substrate processing apparatus 100 of Fig. 1, except for the following points. The substrate processing apparatus 100A includes a transfer section 20A and processing sections 30A and 40A instead of the transfer section 20 and processing sections 30 and 40. The substrate processing apparatus 100A also includes a transfer section 20B and a mounting section 50A.

[0047] Transport unit 20A has the same configuration as transport unit 20, except that it includes transport robot 23 instead of transport robots 21 and 22. Transport robot 23 has the same configuration as transport robots 21 and 22. Transport unit 20B is disposed between processing unit 30A and processing unit 40A without providing separation space V. Transport unit 20B includes transport robot 24 having two hands.

[0048] Processing section 30A has the same configuration as processing section 30, except that it does not have maintenance section 110 and window section 130. Processing section 40A has the same configuration as processing section 40, except that it does not have maintenance section 120 and window section 140. Mounting section 50A has the same configuration as mounting section 50, except that it does not invert the substrate placed on it, and is arranged so as to overlap mounting section 50 in the vertical direction.

[0049] The transport robot 23 unloads an unprocessed substrate W from the carrier 15 of one of the load port sections 10 and loads it onto one of the placement sections 50 or 50A. The transport robot 23 also unloads a processed substrate W from the placement section 50 or 50A and loads it into the original carrier 15.

[0050] The transport robot 24 transports the substrate W between any of the receivers 50 or receivers 50A and the processors 30A or receivers 40A. As a result, the processors 30A or receivers 40A perform front surface processing, rear surface processing, first double-sided processing, or second double-sided processing on the substrate W, and the processed substrate W is loaded onto the receivers 50 or receivers 50A. Below, the operation of the processor 30A will be described based on the transport operation of the transport robot 24. The operation of the processor 40A is the same as that of the processor 30A. Therefore, a description of the operation of the processor 40A will be omitted.

[0051] (b) Surface treatment 9 is a flowchart showing the surface treatment of a substrate W in a reference example. In the surface treatment in the reference example, the following steps S51 to S53 form one cycle. First, the transport robot 24 unloads the substrate W from the receiver 50A with one hand (step S51). The substrate W unloaded from the receiver 50A in step S51 is an unprocessed substrate W loaded onto the receiver 50A by the transport robot 23, with the surface of the substrate W facing upward.

[0052] Next, the transfer robot 24 uses the other hand to unload the substrate W from one of the processing chambers 31 to 34, and loads the substrate W unloaded by the one hand in step S51 into that processing chamber 31 to 34 (step S52). The substrate W unloaded from one of the processing chambers 31 to 34 in step S52 is the substrate W whose surface has been cleaned in that processing chamber 31 to 34. In addition, a processing liquid is supplied to the surface of the substrate W loaded into that processing chamber 31 to 34 by one of the processing units 35 to 38. This cleans the surface of the substrate W. The substrate W whose surface has been cleaned will be unloaded from that processing chamber 31 to 34 by the transfer robot 24 in the next cycle.

[0053] Subsequently, the transport robot 24 carries the substrate W carried out by the other hand in step S52 into one of the mount parts 50A (step S53). The substrate W carried into the mount part 50A in step S53 has its front surface cleaned and faces upward, and is carried by the transport robot 23 back into the carrier 15. This completes one cycle of the transport operation of the transport robot 24 in the surface treatment.

[0054] Thus, in the surface treatment by the substrate processing apparatus 100A, three steps are performed during one cycle of the transfer robot 24. The transfer operation of the transfer robot 24 is repeated. Therefore, the process returns to step S51. In this case, step S53 and step S51 of the next cycle may be performed simultaneously.

[0055] On the other hand, as described above, in the surface treatment by the substrate processing apparatus 100, three steps are executed during one cycle of the transfer robot 21. However, in the surface treatment by the substrate processing apparatus 100, the same number of steps are additionally executed by the transfer robot 22 during one cycle of the transfer robot 21, so the processing efficiency is doubled. Therefore, if the processing efficiency of the surface treatment by the substrate processing apparatus 100A is 100%, the processing efficiency of the surface treatment by the substrate processing apparatus 100 is 100×2=200%.

[0056] (c) Back surface treatment 10 is a flowchart showing the back surface processing of a substrate W in a reference example. In the back surface processing in the reference example, the following steps S61 to S64 form one cycle. First, the transport robot 24 unloads a substrate W from one of the receivers 50 with one of its hands (step S61). The substrate W unloaded from the receiver 50 in step S61 is an unprocessed substrate W loaded onto the receiver 50 by the transport robot 23, and has been inverted on the receiver 50 so that the back surface of the substrate W faces upward.

[0057] Next, the transfer robot 24 uses the other hand to unload the substrate W from one of the processing chambers 31 to 34, and loads the substrate W unloaded by one hand in step S61 into that processing chamber 31 to 34 (step S62). The substrate W unloaded from one of the processing chambers 31 to 34 in step S62 is a substrate W whose back surface has been cleaned in that processing chamber 31 to 34. Furthermore, a processing liquid is supplied to the back surface of the substrate W loaded into that processing chamber 31 to 34 by one of the processing units 35 to 38. This cleans the back surface of the substrate W. The substrate W whose back surface has been cleaned will be unloaded from that processing chamber 31 to 34 by the transfer robot 24 in the next cycle.

[0058] Next, the transport robot 24 uses one hand to take out the substrate W from one of the mount parts 50, and then loads the substrate W that was loaded by the other hand in step S62 into that mount part 50 (step S63). The substrate W that is loaded out of one of the mount parts 50 in step S63 is a substrate W whose back surface has been cleaned and that has been inverted on that mount part 50. Therefore, the front surface of the substrate faces upward. The substrate W that is loaded into that mount part 50 is a substrate W whose back surface has been cleaned and that has been inverted on that mount part 50. As a result, the front surface of the substrate W faces upward. The inverted substrate W will be loaded out of that mount part 50 by the transport robot 24 in the next cycle.

[0059] Thereafter, the transport robot 24 loads the substrate W unloaded by one of the hands in step S63 onto the mounting part 50A (step S64). The substrate W loaded onto the mounting part 50A in step S64 has its back surface cleaned and its front surface facing upward, and is loaded by the transport robot 23 into the original carrier 15. This completes one cycle of the transport operation of the transport robot 24 in the back surface processing.

[0060] Thus, in the rear surface processing by the substrate processing apparatus 100A, four steps are performed during one cycle of the transfer robot 24. The transfer operation of the transfer robot 24 is repeated. Therefore, the process returns to step S61. In this case, step S64 and step S61 of the next cycle may be performed simultaneously.

[0061] On the other hand, as described above, in the rear surface processing by the substrate processing apparatus 100, five steps are performed during one cycle of the transfer robot 21. In this case, the processing efficiency is 4 / 5. However, in the rear surface processing by the substrate processing apparatus 100, the same number of steps are additionally performed by the transfer robot 22 during one cycle of the transfer robot 21, so the processing efficiency is doubled. Therefore, if the processing efficiency of the rear surface processing by the substrate processing apparatus 100A is 100%, the processing efficiency of the rear surface processing by the substrate processing apparatus 100 is 100×4 / 5×2=160%.

[0062] (d) First double-sided processing 11 is a flowchart showing the first double-sided processing of a substrate W in a reference example. As shown in FIG. 11, the first double-sided processing in the reference example includes steps S71 to S75. In the first double-sided processing in the reference example, steps S71 to S75 constitute one cycle. Steps S71 to S73 are the same as steps S61 to S63 in the back surface processing of FIG. 10. Steps S74 and S75 are the same as steps S52 and S53 in the front surface processing of FIG. 9. In this way, in the first double-sided processing by the substrate processing apparatus 100A, five steps are performed during one cycle of the transport robot 24.

[0063] On the other hand, as described above, in the first double-sided processing by the substrate processing apparatus 100, six steps are performed during one cycle of the transfer robot 21. In this case, the processing efficiency is 5 / 6. However, in the first double-sided processing by the substrate processing apparatus 100, the same number of steps are additionally performed by the transfer robot 22 during one cycle of the transfer robot 21, so the processing efficiency is doubled. Therefore, if the processing efficiency of the first double-sided processing by the substrate processing apparatus 100A is 100%, the processing efficiency of the first double-sided processing by the substrate processing apparatus 100 is 100×5 / 6×2=167%.

[0064] (e) Second double-sided processing 12 is a flowchart showing the second double-sided processing of a substrate W in a reference example. As shown in FIG. 12, the second double-sided processing includes steps S81 to S86. In the second double-sided processing in the reference example, steps S81 to S86 constitute one cycle. Steps S81 and S82 are the same as steps S51 and S52, respectively, in the front surface processing of FIG. 9. Step S83 is the same as step S61 in the rear surface processing of FIG. 10 and step S53 in the front surface processing of FIG. 9. Steps S84 to S86 are the same as steps S62 to S64, respectively, in the rear surface processing of FIG. 10. In this way, in the second double-sided processing by the substrate processing apparatus 100A, six steps are performed during one cycle of the transport robot 24.

[0065] On the other hand, as described above, in the second double-sided processing by the substrate processing apparatus 100, six steps are also executed during one cycle of the transfer robot 21. However, in the second double-sided processing by the substrate processing apparatus 100, the same number of steps are additionally executed by the transfer robot 22 during one cycle of the transfer robot 21, so the processing efficiency is doubled. Therefore, if the processing efficiency of the second double-sided processing by the substrate processing apparatus 100A is 100%, the processing efficiency of the second double-sided processing by the substrate processing apparatus 100 is 100×2=200%.

[0066] (4) Effects In the substrate processing apparatus 100 according to this embodiment, a transfer robot 21 disposed in the transfer section 20 transfers a substrate W between the load port sections 11 and 12, the processing section 30, and the mounting section 50. A transfer robot 22 disposed in the transfer section 20 transfers a substrate W between the load port sections 13 and 14, the processing section 40, and the mounting section 50. This arrangement prevents the transfer speed of one of the transfer robots 21 and 22 from determining the transfer speed of the other. This allows the throughput of the substrate processing apparatus 100 to be increased.

[0067] In a plan view, the load port sections 11 and 12 and the processing section 30 are arranged along the X direction, and the load port sections 13 and 14 and the processing section 40 are arranged along the X direction. In this case, the transfer robot 21 can quickly transfer the substrate W between the load port sections 11 and 12 and the processing section 30. The transfer robot 22 can quickly transfer the substrate W between the load port sections 13 and 14 and the processing section 40. This can further increase the throughput of the substrate processing apparatus 100.

[0068] Furthermore, if the substrate W is warped or bent, it is necessary to carefully transport the substrate W by reducing the transport speed of the transport robots 21, 22. Even in this case, as described above, the substrate processing apparatus 100 according to this embodiment has improved processing efficiency compared to the substrate processing apparatus 100A according to the reference example. Therefore, even when the transport speed of the transport robots 21, 22 is reduced, sufficient processing efficiency is ensured. Therefore, even when processing a warped or bent substrate W, the substrate processing apparatus 100 can maintain sufficient throughput.

[0069] Furthermore, in the substrate processing apparatus 100A, the number of steps required for one cycle of the transfer robot 24 in the first double-sided processing is fewer than the number of steps required for one cycle of the transfer robot 24 in the second double-sided processing. That is, the processing efficiency in the first double-sided processing is higher than that in the second double-sided processing. Therefore, when performing double-sided processing, if processing efficiency is important, it is preferable to select the first double-sided processing. However, in the first double-sided processing, the back surface processing is performed before the front surface processing, and therefore suction marks of the spin chuck attached to the back surface of the substrate W during the front surface processing remain.

[0070] In contrast, in the substrate processing apparatus 100, the number of steps required for one cycle of the transport robot 21 in the first double-sided processing is equal to the number of steps required for one cycle of the transport robot 21 in the second double-sided processing. That is, the processing efficiency in the first double-sided processing is equal to the processing efficiency in the second double-sided processing. Therefore, the user can select a preferred double-sided processing method that does not leave suction marks of the spin chuck on the surface of importance, either the front or back surface of the substrate W, without reducing throughput.

[0071] In a plan view, a separation space V is provided between the processing units 30 and 40 to separate the processing units 30 and 40. In this case, the transport robots 21 and 22 are disposed in the transfer unit 20, so there is no need to dispose the transport robots 21 and 22 in the separation space V. This allows a large separation space V to be secured. Furthermore, the secured separation space V can be used for maintenance of the substrate processing apparatus 100, etc. In a plan view, a portion of the separation space V is open and not surrounded by the transfer unit 20 and the processing units 30 and 40. In this case, a user can easily enter the separation space V from the open portion of the separation space V.

[0072] The treatment section 30 is provided with a maintenance section 110 that faces the separated space V and allows a user to access the interior of the treatment section 30. The treatment section 40 is provided with a maintenance section 120 that faces the separated space V and allows a user to access the interior of the treatment section 40. In this case, the user can access the treatment sections 30, 40 from the separated space V through the maintenance sections 110, 120, respectively. This allows the user to easily perform maintenance on the treatment sections 30, 40. The maintenance section 110 also includes an opening 111 that connects the interior of the treatment section 30 to the separated space V. The maintenance section 120 also includes an opening 121 that connects the interior of the treatment section 40 to the separated space V. In this case, the user can easily access the treatment sections 30, 40.

[0073] The processing unit 30 is provided with a window 130 that allows the interior of the processing unit 30 to be viewed. The processing unit 40 is provided with a window 140 that allows the interior of the processing unit 40 to be viewed. In this case, the user can view the interiors of the processing units 30 and 40 through the windows 130 and 140, respectively. This allows the user to easily check whether or not there is an abnormality in the processing units 30 and 40.

[0074] The mounting part 50 is disposed in the separated space V. In this case, the mounting part 50 can be disposed compactly while preventing the substrate processing apparatus 100 from becoming large. Here, the separated space V extends in the X direction, and the size of the mounting part 50 in the X direction is smaller than the size of the separated space V. Therefore, even when the mounting part 50 is disposed in the separated space V, the separated space V can be secured to be relatively large.

[0075] The substrate processing apparatus 100 further includes a discharge unit 60 disposed in the separated space V and configured to discharge processing fluid from the processing units 30 and 40. In this case, it is not necessary to provide a discharge unit 60 for each of the processing units 30 and 40. This reduces the manufacturing cost of the substrate processing apparatus 100. The discharge unit 60 is disposed below the mounting unit 50. This allows the discharge unit 60 to be disposed compactly while preventing the substrate processing apparatus 100 from becoming large.

[0076] 2. Second embodiment (1) Configuration of the substrate processing equipment The following describes the differences between the substrate processing apparatus 100 according to the second embodiment and the substrate processing apparatus 100 according to the first embodiment. FIG. 13 is a diagram showing the configuration of the substrate processing apparatus 100 according to the second embodiment of the present invention. FIGS. 14 and 15 are diagrams showing the internal configuration of the substrate processing apparatus 100 of FIG. 13. As shown in FIGS. 13 to 15, in this embodiment, the processing section 30 and the processing section 40 are arranged so as to be stacked. In this example, the processing section 40 is arranged above the processing section 30.

[0077] Specifically, the processing unit 30 has processing spaces V1 and V2 facing each other along the Y direction. In the processing space V1, processing chambers 31 and 32 are stacked and arranged. In the processing space V2, processing chambers 33 and 34 are stacked and arranged. Similarly, the processing unit 40 has processing spaces V3 and V4 facing each other along the Y direction. In the processing space V3, processing chambers 41 and 42 are stacked and arranged. In the processing space V2, processing chambers 43 and 44 are stacked and arranged.

[0078] The processing space V1 of the processing section 30 and the processing space V3 of the processing section 40 overlap vertically, and the processing space V2 of the processing section 30 and the processing space V4 of the processing section 40 overlap vertically. Therefore, in this example, the processing chambers 31, 32, 41, and 42 are arranged in this order from bottom to top, and the processing chambers 33, 34, 43, and 43 are arranged in this order from bottom to top. In addition, in a plan view, the load port sections 11 and 12 and the processing spaces V1 and V3 are arranged along the X direction with the transfer section 20 in between, and the load port sections 13 and 14 and the processing spaces V2 and V4 are arranged along the X direction with the transfer section 20 in between.

[0079] According to this arrangement, in a plan view, a separation space V is provided between the processing spaces V1, V3 and the processing spaces V2, V4, separating the processing spaces V1, V3 from the processing spaces V2, V4. A maintenance unit 110 is provided on the inner surface of the portion of the processing unit 30, 40 where the processing spaces V1, V3 are provided, facing the separation space V, and a window unit 130 is provided on the outer surface on the opposite side. Similarly, a maintenance unit 120 is provided on the inner surface of the portion of the processing unit 30, 40 where the processing spaces V2, V4 are provided, facing the separation space V, and a window unit 140 is provided on the outer surface on the opposite side.

[0080] In a side view, the mounting portion 51 overlaps with the processing portion 30, and the mounting portion 52 overlaps with the processing portion 40. Specifically, in a side view, the mounting portion 51 overlaps with the processing chambers 31 and 32 of the processing space V1 and the processing chambers 33 and 34 of the processing space V2. In a side view, the mounting portion 52 overlaps with the processing chambers 41 and 42 of the processing space V3 and the processing chambers 43 and 44 of the processing space V4. In other words, the mounting portion 51 is sandwiched between the processing chambers 31 and 32 and the processing chambers 33 and 34, and the mounting portion 52 is sandwiched between the processing chambers 41 and 42 and the processing chambers 43 and 44.

[0081] As described above, in this embodiment, the placement unit 51 is located close to the processing unit 30, and the placement unit 52 is located close to the processing unit 40. Therefore, the placement unit 51 may be used to transport the substrate W between the processing unit 30 and the placement unit 52. The placement unit 52 may also be used to transport the substrate W between the processing unit 40 and the placement unit 51. In this case, the transport robot 22 may be disposed above the transport robot 21.

[0082] (2) Effects In this embodiment, processing units 35 and 36 are arranged in processing space V1 of processing section 30, and processing units 37 and 38 are arranged in processing space V2. Processing units 45 and 46 are arranged in processing space V3 of processing section 40, and processing units 47 and 48 are arranged in processing space V4. Processing section 30 and processing section 40 are stacked such that processing spaces V1 and V3 overlap in the vertical direction, and processing spaces V2 and V4 overlap in the vertical direction. In plan view, a separation space V is provided between processing spaces V1 and V3 and processing spaces V2 and V4.

[0083] In this configuration, the transport robots 21 and 22 are also disposed in the transport section 20, so there is no need to dispose the transport robots 21 and 22 in the separated space V. This makes it possible to ensure a large separated space V. Furthermore, the ensured separated space V can be used for maintenance of the substrate processing apparatus 100, etc.

[0084] 3. Other embodiments (1) In the above embodiment, the placement unit 50 is disposed in the separated space V, but the embodiment is not limited to this. The placement unit 50 may be disposed in a position other than the separated space V. For example, if the transport unit 20 is sufficiently large, the placement unit 50 may be disposed in the transport unit 20.

[0085] (2) In the above embodiment, two mounting portions 50 (mounting portions 51, 52) are provided, but the embodiment is not limited to this. Two or more mounting portions may be provided. For example, four mounting portions may be provided corresponding to the four processing chambers 31 to 34, respectively.

[0086] (3) In the above embodiment, the discharge unit 60 is located below the mounting unit 50, but the embodiment is not limited to this. The discharge unit 60 may be located in the separation space V so as not to overlap with the mounting unit 50, or may be located at a position different from the separation space V. For example, the discharge unit 60 may be located in the transport unit 20. Alternatively, the discharge unit 60 may be located in each of the processing units 30 and 40.

[0087] (4) In the above embodiment, the substrate processing apparatus 100 includes the maintenance units 110 and 120, but the embodiment is not limited to this. The substrate processing apparatus 100 does not necessarily have to include one or both of the maintenance units 110 and 120.

[0088] (5) In the above embodiment, the substrate processing apparatus 100 includes the window portions 130, 140, but the embodiment is not limited to this. The substrate processing apparatus 100 does not have to include one or both of the window portions 130, 140.

[0089] (6) In the above embodiment, the maintenance units 110, 120 are provided on the inner surfaces of the processing units 30, 40 so as to face the separation space V, and the window units 130, 140 are provided on the outer surfaces of the processing units 30, 40; however, the embodiment is not limited to this. The maintenance unit 110 and the window unit 130 may be provided on the inner and outer surfaces of the processing unit 30, respectively, and the maintenance unit 120 and the window unit 140 may be provided on the outer and inner surfaces of the processing unit 40, respectively. Alternatively, the maintenance unit 110 and the window unit 130 may be provided on the outer and inner surfaces of the processing unit 30, respectively, and the maintenance unit 120 may be provided on the inner surface of the processing unit 40 and the window unit 140 on the outer surface. In this case, the processing units 30 and 40 can be made common.

[0090] (7) In the above embodiment, different substrate processing operations may be performed in the processing section 30 and the processing section 40. For example, the processing section 30 may perform a front surface processing operation on the substrate W, and the processing section 40 may perform a rear surface processing operation on the substrate W. Alternatively, the processing section 30 may perform a substrate processing operation using an alkaline processing liquid, and the processing section 40 may perform a substrate processing operation using an acid processing liquid. In these configurations, the transfer processing may be performed when the processing section 30 or the processing section 40 is capable of performing the processing.

[0091] (8) In the above embodiment, each of the processing units 35 to 38, 45 to 48 is provided with a spin chuck, a nozzle, and a cup, but the embodiment is not limited to this. Some or all of the processing units 35 to 38, 45 to 48 may be provided with a nozzle and a brush for cleaning the substrate W.

[0092] (9) In the above embodiment, the transport robot 21 is provided with a total of two hands 21a, 21b, and the transport robot 22 is provided with a total of two hands 22a, 22b, but the embodiment is not limited to this. For example, each of the transport robots 21, 22 may be provided with four hands. Also, each of the two hands may form one pair. Furthermore, each of the two hands in one pair may be configured to move vertically, and the other pair may be configured to be able to selectively use a mode in which the two hands are joined together to transport one substrate W, and a mode in which the two hands of each pair are separated to transport two substrates W. In this case, each of the transport robots 21, 22 is provided with two pairs (four hands), and therefore can transport a maximum of four substrates W.

[0093] 4. Correspondence between each element of the claims and each part of the embodiment Below, examples of correspondence between each element of the claims and each element of the embodiments will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each element of the claims.

[0094] In the above-described embodiments, the substrate W is an example of a substrate, the load port sections 11 and 12 are examples of first load port sections, the load port sections 13 and 14 are examples of second load port sections, the processing section 30 is an example of a first processing section, and the processing section 40 is an example of a second processing section. The placement section 50 is an example of a placement section, the transport section 20 is an example of a transport section, the transport robot 21 is an example of a first transport robot, the transport robot 22 is an example of a second transport robot, the substrate processing apparatus 100 is an example of a substrate processing apparatus, and the separation space V is an example of a separation space.

[0095] The processing units 35 and 36 are examples of a first processing unit, the processing units 37 and 38 are examples of a second processing unit, the processing units 45 and 46 are examples of a third processing unit, and the processing units 47 and 48 are examples of a fourth processing unit. The processing space V1 is an example of a first processing space, the processing space V2 is an example of a second processing space, the processing space V3 is an example of a third processing space, the processing space V4 is an example of a fourth processing space, and the discharge unit 60 is an example of a discharge unit. The maintenance units 110 and 120 are examples of a maintenance unit, the openings 111 and 121 are examples of openings, and the window units 130 and 140 are examples of a window unit.

[0096] 5. Summary of the embodiment (Item 1) The substrate processing apparatus according to item 1 comprises: a first load port unit for storing substrates; a second load port unit for storing the substrate; a first processing unit for processing a substrate; a second processing section for processing the substrate; a placement section on which a substrate is temporarily placed; a transfer unit in contact with the first load port unit, the second load port unit, the first processing unit, and the second processing unit in a plan view; The transport section is provided with a first transport robot that transports substrates between the first load port section, the first processing section, and the placement section, and a second transport robot that transports substrates between the second load port section, the second processing section, and the placement section.

[0097] In this substrate processing apparatus, a first transfer robot disposed in the transfer section transfers substrates between the first load port section, the first processing section, and the receiving section. A second transfer robot disposed in the transfer section transfers substrates between the second load port section, the second processing section, and the receiving section. This arrangement prevents the transfer speed of one of the first and second transfer robots from determining the transfer speed of the other. This increases the throughput of the substrate processing apparatus.

[0098] (Item 2) In the substrate processing apparatus according to item 1, In the plan view, a separation space may be provided between the first processing section and the second processing section to separate the first processing section and the second processing section.

[0099] In this case, since the first and second transport robots are disposed in the transport section, there is no need to dispose the first and second transport robots in the separation space. This allows a large separation space to be secured. In addition, the secured separation space can be used for maintenance of the substrate processing apparatus, etc.

[0100] (Item 3) In the substrate processing apparatus according to item 1, the first processing section includes a first processing unit and a second processing unit for processing a substrate, and has a first processing space and a second processing space in which the first processing unit and the second processing unit are disposed, respectively; the second processing section includes a third processing unit and a fourth processing unit for processing a substrate, and has a third processing space and a fourth processing space in which the third processing unit and the fourth processing unit are disposed, respectively; the first processing unit and the second processing unit are stacked such that the first processing space and the third processing space are stacked in the vertical direction, and the second processing space and the fourth processing space are stacked in the vertical direction; In the planar view, a separation space may be provided between the first processing space and the third processing space and the second processing space and the fourth processing space, separating the first processing space and the third processing space from the second processing space and the fourth processing space.

[0101] In this case, since the first and second transport robots are disposed in the transport section, there is no need to dispose the first and second transport robots in the separation space. This allows a large separation space to be secured. In addition, the secured separation space can be used for maintenance of the substrate processing apparatus, etc.

[0102] (Item 4) In the substrate processing apparatus according to item 2 or 3, In the plan view, a part of the separation space may be open and not surrounded by the transport unit, the first processing unit, and the second processing unit.

[0103] In this case, the user can easily enter the separated space through the open portion of the separated space.

[0104] (Item 5) In the substrate processing apparatus according to any one of Items 2 to 4, The mounting portion may be disposed in the space.

[0105] In this case, the placement section can be arranged compactly while preventing the substrate processing apparatus from becoming large in size.

[0106] (Item 6) In the substrate processing apparatus according to item 5, The space extends in one direction, The size of the placement portion in the one direction may be smaller than the size of the separation space.

[0107] According to this configuration, even when the mounting portion is disposed in the space, a relatively large space can be ensured.

[0108] (Item 7) The substrate processing apparatus according to any one of items 2 to 4, The apparatus may further include a discharge unit disposed in the separated space and configured to discharge the processing fluid from the first processing unit and the second processing unit.

[0109] In this case, the discharge unit can be arranged compactly while preventing the substrate processing apparatus from becoming large. Also, there is no need to provide a discharge unit for each of the first processing unit and the second processing unit. This reduces the manufacturing cost of the substrate processing apparatus.

[0110] (Item 8) In the substrate processing apparatus according to item 7, the placement portion is disposed in the space; The discharge section may be disposed below the placement section.

[0111] In this case, the placement section can be arranged more compactly while preventing the substrate processing apparatus from becoming large in size.

[0112] (Item 9) In the substrate processing apparatus according to any one of Items 2 to 8, At least one of the first processing section and the second processing section may be provided with a maintenance section that faces the separation space and allows a user to access the inside of the processing section.

[0113] In this case, the user can access at least one of the first and second processing units through the maintenance unit from the separated space, thereby enabling the user to easily perform maintenance on the processing units.

[0114] (Item 10) In the substrate processing apparatus according to item 9, The maintenance unit may include an opening that connects the interior of the processing unit to the separated space.

[0115] In this case, the user can easily access the processing unit.

[0116] (Item 11) In the substrate processing apparatus according to any one of Items 1 to 10, At least one of the first processing section and the second processing section may be provided with a window section that allows the interior of the processing section to be viewed.

[0117] In this case, the user can see the inside of at least one of the first and second processing units through the window, which allows the user to easily check whether there is an abnormality in the processing unit.

[0118] (Item 12) In the substrate processing apparatus according to item 1 or 2, In the plan view, the first load port unit and the first processing unit are arranged along one direction, In the plan view, the second load port section and the second processing section may be arranged along the one direction.

[0119] In this case, the first transfer robot can quickly transfer substrates between the first load port and the first processing unit, and the second transfer robot can quickly transfer substrates between the second load port and the second processing unit, thereby further increasing the throughput of the substrate processing apparatus. [Explanation of symbols]

[0120] 10-14...load port section, 15...carrier, 20, 20A, 20B...transport section, 21-24...transport robot, 21a, 21b, 22a, 22b...hand, 30, 30A, 40, 40A...processing section, 31-34, 41-44...processing chamber, 35-38, 41-48...processing unit, 50-52, 50A...mounting section, 60...discharge section, 61...drain section, 62...exhaust section, 70...control device, 100...substrate processing apparatus, 101...drain pipe, 102...exhaust pipe, 110, 120...maintenance section, 111...opening, 112...cover, 130, 140...window section, V...separation space, V1-V4...processing space, W...substrate

Claims

1. a first load port unit for storing substrates; a second load port unit for storing the substrate; a first processing unit for processing a substrate; a second processing section for processing a substrate; a placement section on which a substrate is temporarily placed; a transport unit in contact with the first load port unit, the second load port unit, the first processing unit, and the second processing unit in a plan view; a first transport robot that transports substrates between the first load port section, the first processing section, and the mounting section, and a second transport robot that transports substrates between the second load port section, the second processing section, and the mounting section.

2. The substrate processing apparatus according to claim 1 , wherein a separation space is provided between the first processing section and the second processing section in the plan view, separating the first processing section and the second processing section.

3. the first processing section includes a first processing unit and a second processing unit for processing a substrate, and has a first processing space and a second processing space in which the first processing unit and the second processing unit are disposed, respectively; the second processing section includes a third processing unit and a fourth processing unit for processing a substrate, and has a third processing space and a fourth processing space in which the third processing unit and the fourth processing unit are disposed, respectively; the first processing unit and the second processing unit are stacked such that the first processing space and the third processing space are stacked in a vertical direction, and the second processing space and the fourth processing space are stacked in the vertical direction; 2. The substrate processing apparatus of claim 1, wherein, in the plan view, an isolation space is provided between the first processing space and the third processing space and the second processing space and the fourth processing space, isolating the first processing space and the third processing space from the second processing space and the fourth processing space.

4. 4. The substrate processing apparatus according to claim 2, wherein a part of the separation space is open and not surrounded by the transfer part, the first processing part, and the second processing part in the plan view.

5. The substrate processing apparatus according to claim 2 , wherein the platform is disposed in the space.

6. The space extends in one direction, The substrate processing apparatus according to claim 5 , wherein the size of the placement section in the one direction is smaller than the size of the separation space.

7. 4. The substrate processing apparatus according to claim 2, further comprising a discharge unit disposed in the separation space and configured to discharge processing fluid from the first processing unit and the second processing unit.

8. the placement portion is disposed in the space; The substrate processing apparatus according to claim 7 , wherein the discharge section is disposed below the placement section.

9. 4. The substrate processing apparatus according to claim 2, wherein at least one of the first processing section and the second processing section is provided with a maintenance section that faces the separation space and enables a user to access the inside of the processing section.

10. The substrate processing apparatus according to claim 9 , wherein the maintenance unit includes an opening that connects the inside of the processing unit to the separated space.

11. 4. The substrate processing apparatus according to claim 1, wherein at least one of the first processing section and the second processing section is provided with a window section that allows the interior of the processing section to be viewed.

12. In the plan view, the first load port unit and the first processing unit are arranged along one direction, The substrate processing apparatus according to claim 1 , wherein, in the plan view, the second load port section and the second processing section are arranged along the one direction.

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