Container assembly, chamber structure, and semiconductor processing system including container assembly, and method for fabricating container assembly and deposition material layer

Abstract

To provide a container assembly.SOLUTION: A container assembly includes a vessel, a conduit, and a jacket. The vessel is formed from a first material having a first thermal conductivity, the conduit is installed within the vessel and communicates with the interior of the vessel, and the jacket extends around the vessel and is formed from a second material having a second thermal conductivity. The second thermal conductivity is higher than the first thermal conductivity, and the jacket is tightly fitted to the vessel to limit resistance to a heat flow between the vessel and the jacket. A chamber structure and semiconductor processing system, a deposition material layer method, and a method for fabricating a container assembly are provided.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 654,595, filed May 31, 2024, the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to fluid systems, and more particularly to fluid systems employed to communicate vaporized liquid fluids. [Background technology]

[0003] Fluid systems are generally employed to communicate a fluid from a fluid source to a fluid destination. In some fluid systems, a process fluid may be contained in a fluid source in a liquid state, and the liquid fluid is vaporized prior to communication to the fluid destination, such as in the state of a liquid material layer precursor employed in a gas-phase reactor to deposit a material layer onto a substrate. Vaporization of the liquid process fluid may be achieved by introducing a gas into the liquid process fluid contained in the fluid source to fill a headspace within the fluid source with vaporized liquid process fluid, and withdrawing the vaporized process fluid for communication to the process fluid destination. The concentration of the vaporized process fluid in the headspace is typically controlled by driving the temperatures of the liquid process fluid and the vaporized process fluid, as well as the pressure within the headspace occupied by the vaporized liquid process fluid, to the desired temperature and pressure.

[0004] Such systems and methods have generally been considered suitable for their intended purposes. However, there remains a need in the art for improvements in vessel assemblies, chamber structures, and semiconductor processing systems including vessel assemblies, as well as related material layer deposition methods and methods of making vessel assemblies. The present disclosure provides a solution to this need. Summary of the Invention [Means for solving the problem]

[0005] A vessel assembly is provided, the vessel assembly including a vessel, a conduit, and a jacket. The vessel is formed from a first material having a first thermal conductivity, the conduit is mounted within and in communication with the interior of the vessel, and the jacket extends around the vessel and is formed from a second material having a second thermal conductivity. The second thermal conductivity is greater than the first thermal conductivity, and the jacket is affixed to the vessel with an interference fit to limit resistance to heat flow between the vessel and the jacket.

[0006] In addition to or in the alternative to one or more of the above features, in further embodiments of the container assembly, the conduit may be a first conduit, and the container assembly may further include a second conduit and a third conduit. The second conduit may be mounted within the vessel, may be in fluid communication with the interior of the vessel, and may extend into the interior of the vessel a distance greater than that of the first conduit. The third conduit may be mounted within the vessel, may be in fluid communication with the interior of the vessel, and may extend into the interior of the vessel to a location beyond that of the second conduit.

[0007] In addition to or in the alternative to one or more of the above-mentioned features, further embodiments of the container assembly may include: the first conduit including a first manual valve and a first actuated valve disposed along the first conduit; the second conduit including a second manual valve and a second actuated valve disposed along the second conduit; and the third conduit including a third manual valve and a third actuated valve disposed along the third conduit.

[0008] In addition to or in place of one or more of the above-mentioned features, further embodiments of the container assembly may include a probe member. The probe member may be mounted within the vessel. The probe member may extend into the interior of the vessel. The probe member may include a temperature sensor configured to obtain a temperature within the vessel. The probe member may include one or more level sensors configured to obtain a level of a liquid contained within the vessel.

[0009] In addition to or in the alternative to one or more of the above-mentioned features, further examples of the container assembly may include the vessel being formed from a stainless steel material and the jacket being formed from an aluminum-containing material.

[0010] In addition to or in the alternative to one or more of the above-mentioned features, further embodiments of the container assembly may include an interference between the vessel and the jacket of between about 0.005 millimeters and about 0.345 millimeters, or between about 0.112 millimeters and about 0.178 millimeters, or between about 0.163 millimeters and about 0.229 millimeters, or between about 0.241 millimeters and about 0.345 millimeters.

[0011] In addition to or in place of one or more of the features described above, further embodiments of the vessel assembly may include a thermoelectric heat pump, a heat sink, and a coolant circuit. The thermoelectric heat pump may be coupled to the jacket. The heat sink may be coupled to the thermoelectric heat pump. The coolant circuit may be connected to the heat sink and configured to circulate a liquid coolant across the heat sink.

[0012] In addition to or in place of one or more of the above-mentioned features, further examples of the container assembly may include the vessel having a vessel wall thickness, the jacket having a jacket wall thickness, and the jacket wall thickness being greater than the vessel wall thickness.

[0013] In addition to or in the alternative to one or more of the above features, further embodiments of the container assembly may include: the thermoelectric heat pump is a first thermoelectric heat pump; the container assembly further includes one or more second thermoelectric heat pumps coupled to the jacket; and the heat sink is coupled to the one or more second thermoelectric heat pumps.

[0014] In addition to or in place of one or more of the above-mentioned features, further embodiments of the container assembly may include a second thermoelectric heat pump connected to a probe member mounted within the vessel, and the second thermoelectric heat pump thermally coupled to the interior of the container assembly through the probe member.

[0015] In addition to or in the alternative to one or more of the features described above, further embodiments of the vessel assembly may include the jacket having one or more protruding portions extending in a direction opposite the conduit, and the thermoelectric heat pump may be coupled to the one or more protruding portions of the jacket.

[0016] In addition to or in the alternative to one or more of the above features, further embodiments of the vessel assembly may include the one or more protruding portions being a first protruding portion and the jacket having a second protruding portion spaced apart from the first protruding portion. The thermoelectric heat pump may be a first thermoelectric heat pump mounted on the first protruding portion, and the second thermoelectric heat pump may be mounted on a second protruding portion of the jacket.

[0017] In addition to or as an alternative to one or more of the features described above, further embodiments of the vessel assembly may include insulation extending around and separated from the vessel by the jacket.

[0018] In addition to or in place of one or more of the features described above, further embodiments of the container assembly may include a liquid precursor contained within the interior of the vessel, which may be selected from the group consisting of a silicon-containing precursor, a germanium-containing precursor, a phosphorus-containing precursor, and an arsenic-containing precursor.

[0019] A chamber structure is provided, comprising a chamber body having a horizontal cross-flow structure and a container assembly as described above, wherein a first material forming the vessel is a stainless steel material, a second material forming the jacket is an aluminum-containing material, and a conduit connects the vessel to the chamber body for depositing a material layer from an interior of the vessel onto a substrate mounted within the chamber body using a vaporized liquid precursor communicating with the interior of the vessel.

[0020] A semiconductor processing system is provided. The semiconductor processing system includes a container assembly as described above, a chamber structure, and a controller. The vessel included in the container assembly is formed from a stainless steel material, the jacket included in the container assembly is formed from an aluminum-containing material, and a thermoelectric heat pump is connected to the jacket. The chamber structure is connected to a conduit and configured to deposit a material layer onto a substrate using vaporized liquid material layer precursor received from the container assembly. The controller is operably connected to the thermoelectric heat pump and responsive to instructions recorded on a memory, receives a temperature measurement of the temperature of the liquid precursor contained within the interior of the vessel, receives a predetermined liquid precursor temperature value, compares the temperature measurement to the predetermined liquid precursor temperature value, and uses a throttle valve to adjust the rate of heat transfer between the liquid precursor and a heat sink when the temperature measurement received by the controller differs from the predetermined liquid precursor temperature measurement by more than a predetermined difference.

[0021] A material layer deposition method is provided. The method includes receiving a carrier gas in a vessel in a container assembly as described above, vaporizing a liquid precursor contained within the vessel, communicating the vaporized liquid precursor to a chamber structure connected to a conduit using the carrier gas, and depositing a material layer onto a substrate mounted in the chamber structure using the vaporized liquid precursor. It is contemplated that vaporizing the liquid precursor includes transferring heat between the liquid precursor and an external environment outside the container assembly through the vessel and jacket. It is also contemplated that an interference fit between the vessel and the jacket limits resistance to heat transfer between the vessel and the jacket during heat transfer between the liquid precursor and the external environment.

[0022] A method of making a container assembly is provided. The method includes forming a vessel from a first material having a first thermal conductivity, mounting a conduit within the vessel such that the conduit communicates with the interior of the vessel, and forming a jacket from a second material having a second thermal conductivity higher than the first thermal conductivity of the first material forming the jacket. The vessel is disposed within (e.g., inserted into) the jacket such that the jacket extends around the vessel and is affixed to the vessel with an interference fit, whereby the interference fit between the jacket and the vessel limits resistance to heat flow between the jacket and the vessel during transfer of heat between a liquid precursor and an external environment.

[0023] In addition to or in the alternative to one or more of the above features, further examples of the method may include wherein affixing the jacket to the vessel with an interference fit includes cooling the vessel before disposing the jacket around the vessel, and heating the vessel after disposing the jacket around the vessel, such that heating the vessel forms an interference fit between the jacket and the vessel.

[0024] In addition to or in the alternative to one or more of the above features, further examples of the method may include wherein affixing the jacket to the vessel with an interference fit includes heating the jacket before disposing the jacket around the vessel, and cooling the jacket after disposing the jacket around the vessel, such that cooling of the vessel forms an interference fit between the jacket and the vessel.

[0025] In addition to or in the alternative to one or more of the above features, further embodiments of the method may include affixing the jacket to the vessel with an interference fit including press-fitting the vessel into the jacket.

[0026] This Summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail below in the Detailed Description of the Invention. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0027] These and other features, aspects, and advantages of the inventions disclosed herein are described below with reference to drawings of certain specific embodiments, which are intended to illustrate, but not to limit, the invention. [Brief explanation of the drawings]

[0028] [Figure 1] 1 is a schematic diagram of a semiconductor processing system having a container assembly according to the present disclosure, showing the container assembly communicating a flow of vaporized liquid precursor to a chamber structure. [Figure 2] FIG. 2 is a cross-sectional side view of the chamber structure of FIG. 1 , illustrating a material layer deposited onto a substrate mounted within the chamber structure using a vaporized liquid precursor, according to an embodiment of the present disclosure. [Figure 3]FIG. 2 is a cross-sectional side view of the container assembly of FIG. 1 according to an embodiment of the present disclosure, schematically illustrating a vessel containing a liquid precursor having a jacket extending around the exterior of the vessel and coupled to one or more thermoelectric heat pumps, a heat sink, and a heat transfer circuit. [Figure 4] 2 is a cross-sectional side view of the container assembly of FIG. 1, illustrating a vessel containing a liquid precursor with a jacket interference fit on the exterior of the vessel, according to an embodiment of the present disclosure. [Figure 5] 2 is a plan view of a portion of the container assembly shown in FIG. 1, illustrating schematically an opening defined in an upper portion of the vessel for mounting accessories within the vessel, according to an embodiment of the present disclosure. [Figure 6] 2 is an exploded view of the vessel assembly of FIG. 1, showing the jacket and accessories exploded away from the vessel, according to an embodiment of the present disclosure. [Figure 7] FIG. 2 is a block diagram of a controller included in the semiconductor processing system of FIG. 1 , illustrating generally inputs and outputs to and from the controller during vaporization of a liquid precursor contained within the interior of a vessel, according to an embodiment of the present disclosure. [Figure 8] FIG. 1 is a block diagram of a method for depositing a material layer onto a substrate using vaporized liquid precursor received from a container assembly according to one embodiment of the present disclosure, illustrating operation of the method according to an exemplary and non-limiting embodiment of the present disclosure. [Figure 9] 9 is a block diagram illustrating operations for controlling the temperature of a liquid precursor contained within a container assembly, according to an illustrative and non-limiting example of the method of FIG. 8. [Figure 10] 1 is a block diagram of a method of making a container assembly according to the present disclosure, illustrating the operation of the method according to an exemplary and non-limiting example of the method. DETAILED DESCRIPTION OF THE INVENTION

[0029] It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the relative size of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of the illustrated embodiments of the present disclosure.

[0030]

[0023] Here, like reference numerals refer to the drawings, identifying similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, an example of a semiconductor processing system including a vessel assembly according to the present disclosure is shown in FIG. 1 and is generally identified by the reference numeral 100. Other examples of vessel assemblies, chamber structures, and semiconductor processing systems including the vessel assembly, as well as related material layer deposition methods and methods of making the vessel assembly, as described below, are provided in FIGS. 2-10. While the systems and methods of the present disclosure may be used to vaporize liquids, such as liquid material layer precursors employed to deposit silicon-containing material layers onto substrates using epitaxial methods, the present disclosure is not limited to any particular type of material layer deposition method or to material layer deposition generally.

[0031] Referring to Figure 1, a semiconductor processing system 100 is shown. The semiconductor processing system 100 generally includes a vessel assembly 300, a chamber structure 200, an exhaust source 102, and a controller 120. The vessel assembly 300 is fluidly connected to the chamber structure 200 via a precursor supply conduit 104 and is configured to communicate a vaporized liquid precursor 304 to the chamber structure 200. The chamber structure 200 is configured to expose a substrate 214 mounted within the chamber structure 200 to the vaporized liquid precursor 304 under conditions selected to deposit a material layer 216 onto the substrate 214 using the vaporized liquid precursor 304. The exhaust source 102 fluidly connects the chamber structure 200 to an external environment 150 outside the semiconductor processing system 100 via an exhaust conduit 106, for example, through an abatement device such as a vacuum pump and / or a scrubber, to communicate residual vaporized liquid precursors and / or reaction by-products emitted by the chamber structure 200 to the external environment 150 outside the semiconductor processing system 100.

[0032] According to certain embodiments of the present disclosure, the container assembly 300 may be positioned proximate to the chamber structure 200 to provide vaporized liquid precursor to the chamber structure 200. As described, the container assembly 300 is configured to maintain the temperature of the liquid precursor contained within the container assembly 300 within a predetermined range (e.g., within a predetermined temperature differential) to ensure safe operation of the semiconductor processing system 100 and / or reliable delivery of the vaporized liquid precursor. In this regard, the container assembly 300 may be located within 10 feet of the chamber structure 200, or within 5 feet of the chamber structure 200, or within 3 feet of the chamber structure 200. For example, the container assembly 300 may be supported above or below the chamber structure 200 to limit (e.g., minimize) the footprint of the semiconductor processing system 100. In certain embodiments, the chamber structure includes the container assembly 300. Positioning the container assembly 300 in close proximity to the chamber structure 200 reduces the risk of condensation of vaporized liquid precursor in the precursor supply conduit 104 connecting the container assembly 300 to the chamber structure 200 and may also simplify the design of the semiconductor processing system 100.

[0033] As used herein, "liquid precursor" generally refers to a compound that participates in a chemical reaction to form another compound or element. A portion of the liquid precursor (an element or group within the precursor) may be incorporated into the compound or element resulting from the chemical reaction. For example, the compound or element resulting from the chemical reaction may be a layer and / or film formed on the surface of a substrate. In other cases, the compound or element resulting from the chemical reaction does not contain a portion or significant portion of the liquid precursor (an element or group within the precursor). In this regard, liquid etchants, passivators, reducing agents, and the like are included within the scope of liquid precursor. Generally, liquid precursors are liquids at standard pressure and at least in the temperature range of about 5°C to room temperature (e.g., about 20-23°C).

[0034] In certain examples, the liquid precursor may include, consist of, or consist essentially of a silicon-containing liquid precursor. In this regard, a silicon-containing liquid precursor includes at least one silicon atom and one or more additional elements, such as, for example, one or more of carbon, nitrogen, oxygen, halogens (e.g., F, Cl, Br, and I), phosphorus, and hydrogen. Examples of suitable silicon-containing liquid precursors include silanes (e.g., silane (SiH4), disilane (Si2H6), trisilane (Si3H8), and tetrasilane (Si4H 10)), halosilanes (e.g., chlorosilane (SiH3Cl), dichlorosilane (SiH2Cl2), trichlorosilane (SiHCl3), tetrachlorosilane (SiCl4), bromosilane (SiH3Br), iodosilane (SiH3I), diiodosilane (SiH2I2), hexachlorodisilane (HCDS, Si2Cl6), and octachlorotrisilane (OCTS, Si3Cl8)), organosilanes (e.g., methylsilane (SiH3CH3), dimethylsilane (SiH2(CH3)2), trimethylsilane (SiH(CH3)3), and tetramethylsilane (Si(CH3)4)), aminosilanes, oxysilanes, and silyl phosphides (e.g., trisilylphosphine (P(SiH3)3)). In other examples, the liquid precursor may include, consist of, or consist essentially of a germanium-containing liquid precursor. In this regard, the germanium-containing liquid precursor includes at least one germanium atom and one or more additional elements, such as, for example, one or more of carbon, nitrogen, oxygen, halogen (e.g., F, Cl, Br, and I), and hydrogen. Examples of suitable germanium-containing liquid precursors include, but are not limited to, germanes (e.g., germane (GeH4), digermane (Ge2H4), and trigermane (Ge3H8)), halogermanes (e.g., dichlorogermane (GeH2Cl2), trichlorogermane (GeHCl3), tetrachlorogermane (GeCl4), tetrabromogermane (GeBr4)), germylsilanes (e.g., silylgermane (GeH3SiH3)), organogermanes, aminogermanes, and oxygermanes. In yet other examples, the liquid precursor may comprise, consist of, or consist essentially of a dopant-containing precursor, such as a p-type dopant (e.g., boron (B), aluminum (Al), gallium (Ga), and indium (In)) or an n-type dopant (e.g., phosphorus (P), arsenic (As), antimony (Sb), bismuth (Bi), and lithium (Li)). Examples of n-type dopant-containing precursors include, for example, tertbutylarsine (CH 11Examples of arsenic-containing liquid precursors include arsenic-containing liquid precursors such as arsenic-containing precursors (As).

[0035] The chamber structure 200 includes a means for mounting the substrate 214 within a chamber body that allows for control of deposition conditions. A variety of different chamber structure configurations are possible. For example, the chamber structure may have a flow-type configuration, such as a cross-flow configuration. In another example, the chamber structure may have a showerhead-type configuration. In yet another example, the chamber structure may have a spatially divided reactor-type configuration. In some embodiments, the chamber structure is a batch reactor for simultaneously processing multiple substrates. In other embodiments, the chamber structure is a single-wafer deposition reactor. In one particular embodiment, the chamber structure 200 has a single-wafer cross-flow configuration (e.g., as shown in FIG. 2).

[0036] As used herein, the term "substrate" refers to an underlying material or materials that may be used to form or on which a device, circuit, material, or material layer may be formed. Substrates may be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. Substrates may be in any form, such as a powder, sheet, plate, or workpiece. Substrates in sheet form may extend beyond the boundaries of the chamber body where the deposition process occurs, and in some cases may move through the chamber, allowing the process to continue until the edge of the substrate is reached. Substrates in plate form may include wafers of various shapes and sizes, including, for example, 200-millimeter and 300-millimeter wafers. Substrates may be made of semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide. The substrate can include one or more layers overlying a bulk material, for example, the substrate can include nitrides, oxides, insulating materials, dielectric materials, conductive materials, metals, crystalline materials, epitaxial, heteroepitaxial, and / or single crystal materials. The substrate can include various topologies, such as, for example, gaps, recesses, lines, trenches, vias, holes, or spaces between elevated portions such as fins, and the like, formed in or on at least a portion of the layers of the substrate.

[0037] The controller 120 may be operatively connected to one or more of the vessel assembly 300, the chamber structure 200, and the exhaust source 102, for example, to control the flow of vaporized liquid precursor from the vessel assembly 300 into the chamber structure 200 and / or to control processing of the substrate 214 within the chamber structure 200. The controller 120 generally includes a device interface 124, a processor 123, a user interface 125, and a memory 121. The device interface 124 connects the processor 123 to the vessel assembly 300, the chamber structure 200, and / or the exhaust source 102 via a wired or wireless link 110. The processor 123 is, in turn, operatively connected to the user interface 125 to, for example, receive user input and / or provide user output, and is in communication with the memory 121. The memory 121 may include a non-transitory machine-readable medium having a plurality of program modules 122 recorded thereon that, when read by the processor 123, cause the processor 123 to perform certain operations. Among the operations are those of a material layer deposition method using vaporized liquid precursors, as described (e.g., as shown in Figures 9 and 10). Although shown and described herein as having a particular architecture, it should be understood and appreciated that other controller architectures, e.g., distributed architectures, may be employed and still fall within the scope of the present disclosure.

[0038] Referring to FIG. 2 , a chamber structure 200 having a single-wafer cross-flow configuration is shown in accordance with some embodiments of the present disclosure. The chamber structure 200 includes an inlet flange 202, a chamber body 208, and an exhaust flange 204. In the illustrated example, a precursor supply conduit 104 provides vaporized liquid precursor from a vessel assembly 300 through the inlet flange 202 into the chamber body 208 having a substrate 214 mounted therein for depositing a material layer 216 on the surface of the substrate 214. Residual vaporized liquid precursor and other process gases and reaction byproducts are removed through the exhaust flange 204 and the exhaust conduit 106. The chamber structure further includes an upper heater element array 230, a lower heater element array 232, a partition 218, and a lift and rotate module 228. Although shown and described herein as including certain elements and having a particular structure, it is understood and appreciated that the chamber structure 200 may include other elements and / or may exclude certain elements described herein or may have a different structure and still be within the scope of the present disclosure.

[0039] The chamber body 208 has an inlet end 205 and a longitudinally opposed exhaust end 206, and is formed from a transparent material 209 (e.g., a material that is transmissive to electromagnetic radiation in the infrared wavelength band), and may include a plurality of exterior ribs extending laterally around the exterior of the chamber body 208 and spaced longitudinally apart from one another between the inlet end 205 and the exhaust end 206 of the chamber body 208. The inlet flange 202 is connected to the inlet end 205 of the chamber body 208 and fluidly couples the precursor supply conduit 104 to the interior 210 of the chamber body 208. The exhaust flange 204 is connected to the exhaust end 206 of the chamber body 208 and fluidly couples the interior 210 of the chamber body 208 to the exhaust source 102.

[0040] The upper heater element array 230 and the lower heater element array 232 are supported above and below the chamber body 208, respectively, and each includes a plurality of heater elements configured to heat the substrate 214 when mounted within the interior 210 of the chamber body 208. In this regard, the plurality of heater elements of the upper heater element array 230 and the lower heater element array 232 may be configured to emit electromagnetic radiation within the infrared wavelength band that communicates the transparent material 209 into the interior 210 of the chamber body 208. In certain embodiments, the upper heater element array 230 and the lower heater element array 232 may include linear filament heat lamps. According to certain embodiments, the upper heater element array 230 and / or the lower heater element array 232 may include spot lamps.

[0041] The divider 218 is secured within the chamber body 208 and divides the interior 210 of the chamber body 208 into an upper portion 213 and a lower portion 212. The divider 218 may be formed from an opaque material 219 (e.g., a material that is opaque to electromagnetic radiation in the infrared wavelength band). In certain embodiments, the opaque material 219 may include a bulk silicon carbide material. According to certain embodiments, the opaque material 219 may include a bulk carbonaceous material with silicon carbide material, such as, by way of non-limiting example, bulk graphite or pyrolytic carbon. The divider 218 defines an opening 220 that fluidly connects the upper portion 213 of the chamber body 208 to the lower portion 212 of the chamber body 208. A substrate support 222 may be disposed within the opening 220 to support the substrate 214 during deposition of the material layer 216 thereon (e.g., according to the operations illustrated in FIGS. 9 and 10 ). It is also contemplated that, according to certain embodiments, the substrate support 222 may be connected to a lift and rotate module 228 via a support member 224 and a shaft member 226 that may be configured to rotate the support member about an axis of rotation 229 within the opening 220. According to certain embodiments, the support member 224 and the shaft member 226 may be formed from a transparent material 209.

[0042] 3-6 illustrate a container assembly 300 according to some embodiments of the present disclosure. As shown in FIG. 3 , the container assembly 300 is configured to store a liquid precursor 304 in an interior 302 of a vessel 310 and to provide vaporized liquid precursor from the interior 302 of the container 310. The vessel includes an inlet conduit 331 for providing a carrier gas to the interior 302 of the vessel 310, an outlet conduit 341 for providing vaporized liquid precursor to the precursor supply conduit 104, and a probe member 360 for measuring the temperature of the liquid precursor 304 and / or the amount of liquid precursor 304 contained within the interior 302 of the vessel 310. The container assembly 300 is further configured to facilitate heat transfer between the liquid precursor 304 contained in the interior 302 of the vessel 310 and an external environment 150 outside the container assembly 300. In this regard, the vessel 310 is at least partially surrounded by a jacket 320 affixed to and extending around the exterior of the vessel 310. Container assembly 300 may further include insulation 350, one or more thermoelectric heat pumps 370, a heat sink 372, and a heat transfer circuit 380. While shown and described herein as including certain elements and having a particular structure, it is understood and appreciated that container assembly 300 may include other elements and / or exclude certain elements described herein or may have a different structure and still be within the scope of the present disclosure.

[0043] The vessel may generally be cylindrical in shape having a bottom 314 and a top 312 connected by a cylindrical body 316 (shown in FIG. 4 ) to enclose an interior 302 for containing the liquid precursor 304. The vessel 310 is formed from a first material 484 (shown in FIG. 4 ) that is generally unreactive with the liquid precursor 304. For example, the vessel 310 may be formed from a first material 484 that is resistant to corrosive forms of the liquid precursor 304 and / or does not contain trace impurities that may leach into the liquid precursor 304. Additionally, in some embodiments, the vessel 310 may comply with U.S. Department of Transportation (DOT) regulations, such as 49 C.F.R. § 178 (2021). As such, the vessel 310 may be formed from a DOT 4B compliant material. In certain embodiments, the vessel 310 may be formed from stainless steel, such as 316L stainless steel and / or 304L stainless steel. The volume of the interior 302 of the vessel 310 may vary in different embodiments of the present disclosure. For example, the volume of the interior 302 of the vessel 310 may range from about 100 milliliters to about 19 liters, or more typically from about 500 milliliters to about 2000 milliliters. The maximum fill volume of the liquid precursor is generally smaller than the volume of the interior of the vessel. Typically, the maximum fill volume of the liquid precursor is about 65% to about 85% of the volume of the interior of the vessel, or more typically about 70% to about 80% of the volume of the interior 302 of the vessel 310.

[0044] An inlet conduit 331 is mounted within the top 312 of the vessel 310 and communicates with the interior 302 of the vessel 310. The inlet conduit 331 may be configured to flow a carrier gas into the interior 302 of the vessel 310 either through the liquid precursor 304 or above the surface of the liquid precursor 304. In this regard, the inlet conduit 331 may have one or more valves for opening and closing the inlet conduit 331 and controlling the flow of carrier gas into the vessel 310. For example, the inlet conduit 331 may have one or both of a manual valve 333 and an actuated valve 332 disposed on the exterior of the vessel 310 along the inlet conduit 331. The actuated valve 332 may be operably associated with the controller 120 (shown in FIG. 1 ) to control the opening and closing of the inlet conduit 331. Furthermore, the inlet conduit 331 may extend into the interior 302 toward the bottom 314 of the vessel 310. For example, the inlet conduit 331 may extend into the interior 302 of the vessel 310 to a depth just above the bottom 314 of the vessel 310 so that the carrier gas may pass over the liquid precursor 304. Alternatively, the inlet conduit 331 may extend into the interior 302 of the vessel 310 towards the bottom 314 of the vessel 310 so that the carrier gas passes over the surface of the liquid precursor 304.

[0045] Carrier gas mass flow controller (MFC) 325 is configured to provide a flow of carrier gas from carrier gas source 321 to vessel 310. In this regard, carrier gas source 321 is coupled to inlet conduit 331 via carrier gas supply conduit 324 on which carrier gas MFC 325 is disposed. Carrier gas MFC 325 may be operatively associated with controller 120 (shown in FIG. 1) to control the flow rate of carrier gas to vessel 310. The carrier gas may include, consist of, or consist essentially of an inert gas, such as, for example, nitrogen (N) or a noble gas (e.g., helium (He), argon (Ar), krypton (Kr)). It is also contemplated that the carrier gas may include one or more of hydrogen (H), ammonia (NH), or oxygen (O), which may be supplied neat or as a mixture with an inert gas.

[0046] An outlet conduit 341 is mounted within the top 312 of the vessel 310 and communicates with the interior 302 of the vessel 310. The outlet conduit 341 is configured to provide vaporized liquid precursor from the interior 302 of the vessel 310 to the precursor supply conduit 104. In this regard, the outlet conduit 341 may include one or more valves for opening and closing the outlet conduit and for controlling the flow of vaporized liquid precursor from the vessel 310. For example, the outlet conduit 341 may have one or both of a manual valve 343 and an actuated valve 342 disposed on the exterior of the vessel 310 along the outlet conduit 341. The actuated valve 342 may be operatively associated with the controller 120 (shown in FIG. 1 ) for controlling the opening and closing of the outlet conduit 341.

[0047] The vaporized liquid precursor may be entrained in a flow of carrier gas exiting the vessel 310 of the container assembly 300 via an outlet conduit 341. A vapor pressure concentration sensor (VPCS) 346 and a vaporized liquid precursor MFC 348 may be disposed along the outlet conduit 341 and configured to provide the vaporized liquid precursor 304 from the vessel 310 to the chamber structure 200 (shown in FIG. 1 ). In this regard, the VPCS 346 and the vaporized liquid precursor MFC 348 may be operatively associated with the controller 120 (shown in FIG. 1 ) to control the flow rate of the vaporized liquid precursor to the chamber structure 200. The VPCS 346 may be configured to provide the measured concentration of the vaporized liquid precursor to the controller 120. The controller 120 may compare the measured concentration of the vaporized liquid precursor to a target vaporized liquid precursor concentration and adjust the vaporized liquid precursor MFC 348 so that the measured vaporized liquid precursor concentration measurement is within a predetermined difference from the target vaporized liquid precursor concentration.

[0048] The vessel may further include a refill conduit 351 mounted within the top 312 of the vessel 310 and in communication with the interior 302 of the vessel 310. The refill conduit 351 may be configured to refill the vessel 310 with the liquid precursor 304. In this regard, the refill conduit 351 may have one or more valves for opening and closing the refill conduit 351 and for controlling the flow of the liquid precursor 304 into the vessel 310. For example, the refill conduit 351 may have one or both of a manual valve 353 and an actuated valve 352 disposed on the exterior of the vessel 310 along the refill conduit 351. The actuated valve 352 may be operatively associated with the controller 120 (shown in FIG. 1 ) for controlling the opening and closing of the refill conduit 351. Additionally, the refill conduit 351 may extend into the interior 302 toward the bottom 314 of the vessel 310. The refill conduit 351 may extend into the interior 302 toward the bottom 314 of the vessel 310 to a shallower depth than the inlet conduit 331. Furthermore, in certain embodiments, the portion of the refill conduit 351 that extends into the interior of the vessel 310 may be bent toward a wall of the vessel 310 to reduce splashing and / or fluctuations in the liquid precursor level during refill. Refilling of the vessel with the liquid precursor 304 may occur at a location remote from the semiconductor processing system 100 (shown in FIG. 1 ). For example, it is contemplated that the vessel 310 may be removed from the semiconductor processing system 100 so that the vessel 310 may be refilled at a remote location, e.g., a regional bulk refill station, or at a location outside the clean room environment housing the semiconductor processing system 100 (shown in FIG. 1 ), such as a chemical supplier's site. Additionally or alternatively, the refill conduit 351 may be fluidly connected to a bulk liquid precursor source located remotely from the semiconductor processing system 100, such as, for example, a sub-fab, for refilling the vessel 310 without removing the vessel 310 from the semiconductor processing system 100.In this regard, the vessel 310 may optionally have, among other things, an inlet conduit quick connect 330, an outlet conduit quick connect 340, and a refill conduit quick connect 355 for easily isolating the vessel 310 from the carrier gas supply conduit 324 and the precursor supply conduit 104 (shown in FIG. 4).

[0049] The probe member 360 is mounted within the top 312 of the vessel 310 and extends into the interior 302 of the vessel 310 toward the bottom 314 of the vessel 310. In certain embodiments, the probe member 360 may be removably secured within the probe member opening 560 (shown in FIG. 5 ) so that the probe member 360 can be removed for cleaning or replacement as needed. The probe member 360 may contain one or more temperature sensors 362 operably associated with the controller 120 (shown in FIG. 1 ) and configured to provide liquid precursor temperature measurements 710 (shown in FIG. 7 ) to the controller 120. Additionally or alternatively, the controller 120 may contain one or more level sensors 363 operably associated with the controller 120 and configured to provide liquid precursor level measurements 714 (shown in FIG. 7 ) to the controller 120. Although the probe member 360 is shown and described herein as including a certain number of temperature sensors 361 and / or one or more level sensors 363, it should be understood and appreciated that the probe member 360 may include fewer or additional sensors of any type, and such variations would still be within the scope of the present disclosure.

[0050] As shown in Figure 5, the top 312 of the vessel 310 may have an outlet conduit opening 530, an inlet conduit opening 550, a refill opening 540, and a probe member opening 560. The outlet conduit opening 530 is configured to mount the outlet conduit 341 therein (shown in Figure 6). The refill conduit opening 540 is offset from the outlet conduit opening 530 and is configured to mount the refill conduit 351 therein (shown in Figure 6), such that the refill conduit 351 extends through the top 312 of the vessel 310 and into the interior 302 of the vessel 310 (shown in Figure 3). Inlet conduit opening 550 is positioned between outlet conduit opening 530 and refill conduit opening 540 and is configured to mount inlet conduit 331 therein (shown in FIG. 6 ), such that inlet conduit 331 extends through top 312 of vessel 310 and into interior 302 of vessel 310 (shown in FIG. 3 ). Probe member opening 560 is offset from outlet conduit opening 530, refill conduit opening 540, and inlet conduit opening 550 and is configured to mount probe member 360 therein, such that probe member 360 extends through top 312 of vessel 310 and into interior 302 of vessel 310 (shown in FIG. 3 ). In addition to the various openings, top 312 of vessel 310 may optionally have one or more protruding portions 494 extending from vessel top 312 away from interior 302 of vessel 310 (shown in FIG. 4 ). One or more of the protruding portions 494 may be configured to removably attach a handle for caring for the vessel 310, a ring-shaped device for protecting the valve during transport of the vessel 310, and / or insulation 350 (shown in FIG. 3 ) to the vessel 310. While the top 312 of the vessel 310 is shown and described herein as having certain opening configurations for the various conduits and probe members 360, it is understood and appreciated that other opening configurations, including having fewer openings or additional openings, are possible and that such variations remain within the scope of the present disclosure. Likewise, it is understood and appreciated that other configurations of the one or more protruding portions 494 are possible and that such variations remain within the scope of the present disclosure, including excluding one or more of the protruding portions 494.

[0051] 4 and with continued reference to FIG. 5, jacket 320 at least partially surrounds or otherwise extends around the exterior of vessel 310. For example, jacket 320 may extend around cylindrical body 316 and bottom 314 of vessel 310. In some embodiments, jacket 320 may optionally extend around top 312 of vessel 310 (denoted by 322 in FIG. 4). Jacket 320 is intended to be formed from a second material 482 having a higher thermal conductivity than the thermal conductivity of a first material 484 forming vessel 310. In other words, vessel 310 is formed from a first material 484 having a first thermal conductivity, and the jacket is formed from a second material 482 having a second thermal conductivity that is higher than the first thermal conductivity. For example, as discussed above, the vessel 310 may be formed from a first material 484 that is non-reactive with the liquid precursor 304 and may additionally be DOT 4B compliant. In certain embodiments, the vessel 310 may be formed from stainless steel, such as 316L stainless steel and / or 304L stainless steel. While stainless steel is generally non-reactive with the liquid precursor 304, it has a relatively low thermal conductivity (e.g., approximately 16 W / mK at 25 degrees Celsius). To (at least partially) compensate for the relatively low thermal conductivity of the first material 484, the jacket 320 is made from a second material 482 that has a higher thermal conductivity to facilitate heat transfer from the liquid precursor 304 contained within the interior 302 of the vessel 310 to the external environment 150 outside the container assembly 300. In certain embodiments, the jacket 320 may be formed from an aluminum-containing material, such as 6060 aluminum, 6061 aluminum, and / or 6063 aluminum. The thermal conductivity of aluminum varies depending on the composition of the particular alloy, but is generally in the range of about 160-210 W / mK at 25 degrees Celsius.

[0052] Jacket 320 is affixed to vessel 310 using an interference fit 486. The interference fit may be such that either (or both) of vessel 310 and jacket 320 deviate in size from their respective nominal dimensions (e.g., dimensions when separated such that the parts are not dimensionally constrained relative to one another when at room temperature), thereby creating an interference between vessel 310 and jacket 320. For example, in some embodiments, when jacket 320 and vessel 310 are separated and at room temperature, the diameter of jacket 320 may deviate from its nominal diameter. Additionally or alternatively, in some embodiments, when vessel 310 and jacket 320 are separated and at room temperature, the diameter of vessel 310 may deviate from its nominal diameter. 3 and 4 at the interface between the vessel 410 and the jacket 420, as will be understood by those skilled in the art, the interference fit may extend across the entire interface between the vessel 310 and the jacket 320. Advantageously, the interference fit 486 provides a high degree of contact between the jacket 320 and the vessel 310, limiting resistance to heat flow between the vessel 310 and the jacket 320. As will be understood by those skilled in the art in light of the present disclosure, limiting the thermal resistance between the vessel 310 and the jacket 320 in turn increases heat transfer between the liquid precursor 304 contained within the interior 302 of the vessel 310 and the external environment 150 outside the container assembly 300, allowing for the use of a material, e.g., the second material 482, having a relatively low thermal conductivity to form the vessel 310.

[0053] The degree of interference in the interference fit 486 between the vessel 310 and the jacket 320 may vary in different embodiments of the present disclosure. The degree of interference may be expressed as the difference between the outer radius of the inner component (e.g., the outer diameter of the vessel 310) and the inner radius of the outer component (e.g., the inner diameter of the jacket 320) when the components are separated so that they are dimensionally unconstrained relative to one another at room temperature. It is contemplated that the degree of interference in the interference fit 486 between the vessel 310 and the jacket 320 may be at least about 0.005 millimeters and not more than about 0.345 millimeters, typically at least about 0.023 millimeters and not more than about 0.345 millimeters, or at least about 0.074 millimeters and not more than about 0.345 millimeters. In some embodiments, the degree of interference within the interference fit 486 between the vessel 310 and the jacket 320 may be at least about 0.005 millimeters and not more than about 0.071 millimeters, or at least about 0.005 millimeters and not more than about 0.048 millimeters, or at least about 0.023 millimeters and not more than about 0.089 millimeters, or at least about 0.046 millimeters and not more than about 0.089 millimeters. Such a level of interference may generally be achieved by press-fitting the jacket 320 and the vessel 310 together by hand or using mechanical force.In other embodiments, the degree of interference within the interference fit 486 between the vessel 310 and the jacket 320 is at least about 0.074 millimeters to no more than about 0.346 millimeters, or at least about 0.074 millimeters and no more than about 0.229 millimeters, or at least about 0.074 millimeters and no more than about 0.178 millimeters, or at least about 0.074 millimeters and no more than about 0.140 millimeters, or at least about 0.074 millimeters and no more than about 0.112 millimeters, or at least about 0.112 millimeters, and about 0.345 millimeters or less, or at least about 0.112 millimeters and about 0.241 millimeters or less, or at least about 0.112 millimeters and about 0.229 millimeters or less, or at least about 0.112 millimeters and about 0.178 millimeters or less, or at least about 0.163 millimeters and about 0.345 millimeters or less, or at least about 0.163 millimeters and about 0.241 millimeters or less, or at least about 0.163 millimeters and about 0.229 millimeters or less. Such a level of interference may generally be obtained by shrink-fitting vessel 310 and jacket 320 together, for example, by heating jacket 320 to increase its dimensions compared to its nominal dimensions (e.g., when the parts are separated and at room temperature) and / or by cooling vessel 310 to contract its dimensions compared to its nominal dimensions so that the two parts can be joined. Increasing the degree of interference within the interference fit 486 may result in a higher degree of contact between the jacket 320 and the vessel 310 and further extend the life of the vessel assembly 300. As the temperature of the vessel assembly 300 cycles, the degree of interference within the interference fit 486 between the jacket 320 and the vessel 310 may decrease.Therefore, having a high degree of interference within the interference fit 486 on a newly manufactured container assembly 300 may increase the lifespan of the container assembly 300 by extending the number of cycles with acceptable interference within the interference fit 486 and therefore the acceptable heat transfer between the liquid precursor 304 contained within the interior 302 of the vessel 310 and the external environment 150.

[0054] In addition to the difference in thermal conductivity between the first material 484 of the vessel 310 and the second material 482 of the jacket 320 and the degree of interference at the interference fit 486 between the two, the wall thickness 472 of the jacket 320 (shown in FIG. 5 ) relative to the wall thickness 474 of the vessel 310 may be used to further facilitate heat transfer between the liquid precursor 304 contained within the interior 302 of the vessel 310 and the external environment 150. In this regard, the wall thickness 472 of the jacket 320 is generally greater than the wall thickness of the vessel. In certain embodiments, the vessel assembly 300 (e.g., the wall thickness 474 of the vessel 310) may comply with U.S. Department of Transportation regulations, such as 49 CFR § 178 (2021). For example, the wall thickness 474 of the vessel 310 may be between about 2 millimeters and about 10 millimeters, or between about 3 millimeters and about 8 millimeters, or between about 3 millimeters and about 6 millimeters. Advantageously, thicknesses within these ranges can provide compliance with the aforementioned DOT regulations while limiting the handicap otherwise potentially presented by the relatively low thermal conductivity of the first material 484 forming the vessel 310.

[0055] The wall thickness 472 of the jacket 320 may be greater than the wall thickness 474 of the vessel 310, although embodiments in which the wall thickness 474 of the jacket 320 is equal to or less than the wall thickness 474 of the vessel 310 are within the scope of the present disclosure. For example, the wall thickness 472 of the jacket 320 / 310 may be between about 2 millimeters and about 20 millimeters, or between about 4 millimeters and about 15 millimeters, or between about 4 millimeters and about 10 millimeters. Advantageously, a jacket wall thickness within these ranges, in combination with the vessel wall thickness, may provide compliance with the aforementioned DOT regulations and / or may provide sufficient thermal mass to compensate (at least partially) for the relatively low thermal conductivity of the first material 484 forming the vessel 310.

[0056] In certain embodiments, the vessel assembly 300 may optionally include a thermal compound 490 disposed at two interfaces between the jacket 320 and the vessel 310. While the thermal compound 490 is shown schematically in FIGS. 3 and 4 at the interface between the vessel 410 and the jacket 420, the thermal compound 490 may be disposed between the vessel 310 and the jacket 320 as a continuous or discontinuous layer across the interface between the two. The thermal compound 490 may be used to increase the degree of contact between the jacket 320 and the vessel 310. In this manner, the thermal compound 490 may allow for a lower degree of interference in the interference fit 486 between the vessel 310 and the jacket 320, which may simplify the manufacturing process of the vessel assembly 300. Examples of suitable thermal compounds (or thermal pastes) include silicone oil-based compounds such as 120 Series Thermal Joint Compound® available from Wakefield Thermal, Inc.® of Nashua, New Hampshire.

[0057] 3 , insulation 350, one or more thermoelectric heat pumps 370, heat sink 372, and heat transfer circuit 380 are configured to transfer heat between liquid precursor 304 contained within interior 302 of vessel 310 and external environment 150. Insulation 350 at least partially surrounds or extends around jacket 320 and vessel 310, insulating the enclosed portion from external environment 150. In some embodiments, insulation 350 surrounds cylindrical body 316 and bottom 314 of vessel 310 and jacket 320, and is separated from vessel 310 by jacket 320. Insulation 350 may also surround top 312 of vessel 310 (shown in FIG. 6 ). Various conduits (e.g., inlet conduit 331, outlet conduit 341, and refill conduit 351) and probe member 360 extend from the top 312 of vessel 310 through insulation 350. Insulation 350 may optionally be secured to vessel 310 by attaching insulation 350 to one or more protruding portions 494 positioned on the top 312 of vessel 310. Jacket 420 may also include one or more protruding portions 424 extending through insulation 350. For example, jacket 320 may include one or more protruding portions 424 extending from a bottom of jacket 320, through insulation 350, in a direction opposite outlet conduit 341. In the illustrated embodiment, the jacket 320 has two protruding portions 424 from which both of the insulation 350 extend from the bottom of the jacket 320 and in a direction opposite the outlet conduits 341-651 (shown in FIG. 6). An example of a suitable insulation material is Thermal Wrap Aerogel Blanket® available from Cabot Corporation® of Boston, Massachusetts.

[0058] The vessel 310 and jacket 320 may be in thermal communication with a heat sink 372 and a heat transfer circuit 380 via one or more thermoelectric heat pumps 370. In this regard, one or more protruding portions 424 of the jacket 320 may be in direct contact with one or more thermoelectric heat pumps 370, which in turn are in contact with the heat sink 372. In the illustrated embodiment, the jacket 320 has two protruding portions 424, each in contact with a thermoelectric heat pump 370. The one or more thermoelectric heat pumps 370 are in turn in contact (e.g., direct mechanical contact) with the heat sink 372.

[0059] Heat sink 372 is in thermal communication with heat transfer circuit 380. In this regard, heat transfer circuit 380 is configured to provide heat transfer medium 388 to and from heat sink 372 using mechanical circulator 386. In certain embodiments, heat transfer circuit 380 may include a heat transfer medium supply conduit 382 and a heat transfer medium return conduit 384 to pass heat transfer medium 388 through and / or around heat sink 372. In certain examples, heat transfer medium 388 may include, consist of, or consist essentially of air. In certain other examples, heat transfer medium 388 may include, consist of, or consist essentially of water. In certain other examples, heat transfer medium 388 may include, consist of, or consist essentially of glycol and / or alcohol. In certain other embodiments, the heat transfer medium 388 may include, consist of, or consist essentially of a perfluorinated refrigerant. Examples of suitable refrigerants include Fluorinert®, available from 3M Company® of Maplewood, Minnesota.

[0060] Each of the one or more thermoelectric heat pumps 370 may be configured to throttle (e.g., increase or decrease) heat transfer between the liquid precursor 304 contained within the interior 302 of the vessel 310 and the heat transfer medium 388, which then transfers heat to or from the external environment 150. In this regard, the one or more thermoelectric heat pumps 370 may be operatively associated with the controller 120 (shown in FIG. 1 ) to throttle the heat transfer between the liquid precursor 304 contained within the interior 302 of the vessel 310 and the external environment 150 using a drive current 720 (shown in FIG. 7 ) provided by the controller 120 to the one or more thermoelectric heat pumps 370. In some embodiments, the one or more thermoelectric heat pumps 370 are configured to throttle the heat transfer from the liquid precursor 304 contained within the interior 302 of the vessel 310 to the external environment 150. In other embodiments, one or more thermoelectric heat pumps 370 are configured to throttle heat transfer from the external environment 150 to the liquid precursor 304 contained within the interior 302 of the vessel 310 .

[0061] 4 , it is contemplated that the thermoelectric heat pump 370 and heat sink 372 may be a first thermoelectric heat pump 370 and a first heat sink 372, respectively, and that the container assembly 300 may further include one or more second thermoelectric heat pumps 390 and one or more second heat sinks 392. In such an embodiment, the one or more thermoelectric heat pumps 370 may be mechanically coupled, e.g., through the probe member 360 and / or the inlet conduit 331, to a structure that projects into the liquid precursor 304 contained within the container assembly 300, and the one or more second heat sinks 392 may in turn be coupled to a structure that projects into the liquid precursor 304 contained within the container assembly 300. When coupled in this manner, the one or more second thermoelectric heat pumps 390 may be configured to transfer heat between the liquid precursor 304 and the external environment 150, e.g., to supplement the transfer of heat transferred using the first thermoelectric heat pump 370. Advantageously, this may utilize the available surface area of ​​the structures that protrude into the liquid precursor 304 to increase the rate at which heat is transferred between the liquid precursor 304 and the external environment 150 .

[0062] In certain embodiments, the one or more second thermoelectric heat pumps 392 may be directly connected to a structure that protrudes into the liquid precursor 304, for example, without an intermediate piece or coolant circuit. In this regard, it is contemplated that the one or more second thermoelectric heat pumps 392 may be directly connected to the probe member 360 and, through this, thermally coupled to the liquid precursor 304. According to certain embodiments, the protruding structure (e.g., probe member 360) may act as a cold finger immersed in the liquid precursor 304 and may enhance cooling and / or temperature control of the liquid precursor 304. According to certain embodiments, the protruding structure (e.g., probe member 360) may act as a hot finger immersed in the liquid precursor 304 and may enhance heating and / or temperature control of the liquid precursor 304. It is also contemplated that the second thermoelectric heat pump 390 may operate as a cold finger at certain times and as a hot finger at other times to alternately heat and cool the liquid precursor 304 as needed during use of the loaded liquid precursor 304 contained within the container assembly 300, according to environmental conditions within the container assembly 300.

[0063] 7, controller 120 is shown in accordance with an embodiment of the present disclosure, schematically illustrating inputs to and outputs from controller 120 for vessel assembly 300 (shown in FIG. 1). In the illustrated embodiment, controller 120 is in communication with probe member 360, and through this, with one or more temperature sensors 362 and level sensors 363, to receive liquid precursor temperature measurements 710 and liquid precursor level measurements 714, respectively. Controller 120 may also be in communication with VPCS 346 to receive precursor concentration measurements 716 therefrom. As will be understood by those skilled in the art in light of the present disclosure, controller 120 may be in communication with fewer and / or other sensors than those shown and described herein and still be within the scope of the present disclosure.

[0064] In certain embodiments, the controller 120 may compare the measured liquid precursor temperature 710 to a predetermined precursor temperature stored in one of the program modules 122 stored on the memory 121. When the difference between the measured liquid precursor temperature and the predetermined liquid precursor temperature exceeds a predetermined liquid precursor temperature difference, also stored in one of the program modules 122, the controller 120 may throttle (e.g., increase or decrease) the rate of heat transfer between the liquid precursor 304 (shown in FIG. 3 ) and the external environment 150 (shown in FIG. 3 ). Throttle throttling may be achieved by applying a drive current 720 to one or more thermoelectric heat pumps 370. The direction and magnitude of the applied drive current are adjusted by the controller (using a power source operatively associated with the controller 108) to minimize the temperature difference between the measured temperature 710 of the liquid precursor 304 and the target temperature of the liquid precursor 304. Additionally or alternatively, throttling may be achieved by adjusting the flow rate and / or temperature of the heat transfer medium 388 from the heat transfer circuit 380 across the heat sink 372. When the difference between the liquid precursor 304 temperature measurement 710 and the predetermined precursor temperature is less than the difference in temperature of the predetermined precursor, the controller 120 may leave the rate of heat transfer unchanged and may continue precursor temperature monitoring.

[0065] In certain embodiments, the controller 120 may compare the measured liquid precursor level 714 to a predetermined liquid precursor value stored in one of the program modules 122 stored in the memory 121. When the liquid level is less than the predetermined liquid level value, the controller 120 may provide a user output to the user interface 125 (shown in FIGS. 3-6 ), for example, to alert the user to the need to replace or refill the container assembly 300. According to certain other embodiments, the controller 120 may send a signal to open the refill conduit actuated valve 352 to refill the vessel 310 with the liquid precursor 304 from the bulk liquid precursor source.

[0066] In certain embodiments, controller 120 may use liquid precursor level measurements 714 to correct the predetermined liquid precursor temperature. Additionally or alternatively, controller 120 may use liquid precursor level measurements 714 to adjust liquid precursor temperature measurements 710. As will be appreciated by those skilled in the art in light of the present disclosure, this can limit the risk of deviation from the predetermined liquid precursor temperature due to differences in thermal mass of the vaporized liquid precursor by regulating the rate of heat transfer between liquid precursor 304 (shown in FIG. 3 ) and external environment 150 (shown in FIG. 3 ) with a throttle valve.

[0067] 8 and 9, a material layer deposition method 800 according to some embodiments of the present disclosure is illustrated. The material layer deposition method 800 may be performed using the semiconductor processing system 100 (shown in FIG. 1). As shown in FIG. 8, the method 800 includes receiving a carrier gas in a vessel assembly 300 (shown in FIG. 1), as indicated by box 802. The vessel assembly 300 according to various embodiments of the present disclosure is shown in FIGS. 1-6 and described above. The vessel assembly 300 includes a vessel 310 (shown in FIG. 3) formed from a first material 484 (shown in FIG. 4) having a first thermal conductivity, and a jacket 320 (shown in FIG. 3) affixed to the vessel 310 with an interference fit and extending at least partially around the exterior of the vessel 310. The jacket 320 is formed from a second material 482 (shown in FIG. 4) having a second thermal conductivity, the second thermal conductivity being higher than the first thermal conductivity. The carrier gas is received through an inlet conduit 331 (shown in FIG. 3 ) mounted within the vessel 310 and in communication with the interior 302 (shown in FIG. 3 ) of the vessel 310. Receiving the carrier gas in the container assembly 300 may further include controlling the temperature of the liquid precursor 304 (shown in FIG. 3 ) contained within the interior 302 (shown in FIG. 3 ) of the vessel 310, as indicated by box 900. The method 800 also includes vaporizing the liquid precursor 304 contained within the interior 302 of the vessel 310, as indicated by box 804. Vaporizing the liquid precursor 304 includes transferring heat between the liquid precursor 304 and the external environment 150 (shown in FIG. 3 ) outside the container assembly 300 through the vessel 310 and jacket 320. Vaporizing the liquid precursor 304 may further include controlling the temperature of the liquid precursor 304 contained within the interior 302 of the vessel 310, as indicated by box 900. Method 800 also includes communicating the vaporized liquid precursor to chamber structure 200 (shown in FIG. 1), as indicated by box 806. The vaporized liquid precursor is provided to chamber structure 200 from outlet conduit 341 (shown in FIG. 3) mounted within vessel 310 and in communication with interior 302 of vessel 310.In certain embodiments, the chamber structure 200 has a single-wafer cross-flow configuration (e.g., as shown in FIG. 2 ) and as described above. Communicating the vaporized liquid precursor to the chamber structure 200 may further include controlling a temperature of the liquid precursor 304 contained within the interior 302 of the vessel 310, also as shown in block 900. The method also includes depositing a material layer 216 (shown in FIG. 1 ) onto a substrate 214 (shown in FIG. 1 ) mounted within the chamber structure 200, as shown in box 808. The material layer 216 is deposited onto the substrate 214 by exposing the substrate 214 to the vaporized liquid precursor. Depositing the material layer 216 onto the substrate 214 mounted within the chamber structure 200 may further include controlling a temperature of the liquid precursor 304 contained within the interior 302 of the vessel 310, as further shown in box 900.

[0068] 9, controlling 900 the temperature of the liquid precursor 304 contained within the interior 302 of the vessel 310 may be accomplished by receiving a liquid precursor temperature measurement, such as liquid precursor temperature measurement 710 (shown in FIG. 7), as indicated by box 910. In this regard, the liquid precursor temperature measurement 710 may be received by the controller 120 (shown in FIG. 7) in communication with one or more temperature sensors 362 (shown in FIG. 3) within a probe member 360 (shown in FIG. 3) mounted within the vessel 310 and extending into the interior 302 of the vessel 310 and into the liquid precursor 304. Controlling 900 the temperature of the liquid precursor may also include calculating a difference between a predetermined temperature value and the received liquid precursor temperature measurement 710, as indicated by box 920. The target temperature value may be stored in one of the program modules 122 (shown in FIG. 7) stored on the memory 121 (shown in FIG. 7) of the controller 120. When the difference between the measured liquid precursor temperature and the predetermined liquid precursor temperature exceeds a predetermined liquid precursor temperature difference, also recorded in one of the program modules 122, the rate of heat transfer between the liquid precursor 304 and the external environment 150 may be throttled, as indicated by box 940. Throttle throttling may be achieved by applying a drive current 720 (shown in FIG. 7) to one or more thermoelectric heat pumps 370 (shown in FIG. 3). The direction and magnitude of the drive current 720 is adjusted by the controller 120 (using a power source operatively associated with the controller 120) to minimize the temperature difference between the measured temperature 710 of the liquid precursor 304 and the target temperature of the liquid precursor 304. Additionally or alternatively, throttle throttling may be achieved by adjusting the flow rate and / or temperature of the heat transfer medium 388 (shown in FIG. 3) from the heat transfer circuit 380 (shown in FIG. 3) across the heat sink 372 (shown in FIG. 3). Adjusting the throttle valve may continue until the difference between the liquid precursor temperature measurement 710 and the predetermined precursor temperature is less than the difference in the temperature of the predetermined precursor. After adjusting the throttle valve, operation to control the liquid precursor temperature may continue, as indicated by arrow 950.When the difference between the liquid precursor temperature measurement 710 and the predetermined precursor temperature is less than the difference in temperature of the predetermined precursor, the controller 120 may leave the rate of heat transfer unchanged and the operation 900 for controlling the liquid precursor temperature may continue as indicated by arrow 960.

[0069] Referring to FIG. 10 , a method of making a vessel assembly, e.g., vessel assembly 300 (shown in FIG. 1 ), is illustrated. Method 1000 includes forming a vessel from a first material having a first thermal conductivity, e.g., forming vessel 310 (shown in FIG. 3 ) from first material 484 (shown in FIG. 4 ), and attaching a conduit, e.g., outlet conduit 341 (shown in FIG. 3 ), within the vessel, as indicated by boxes 1010 and 1020. Method 1000 also includes forming a jacket from a second material having a second thermal conductivity, e.g., forming jacket 320 (shown in FIG. 3 ) from second material 482 (shown in FIG. 4 ), and disposing the vessel within the jacket, as indicated by boxes 1030 and 1040. It is contemplated that method 1000 may further include affixing the jacket to the vessel using an interference fit, e.g., interference fit 486 (shown in FIG. 4 ), as indicated by box 1060. Although shown and described herein as including certain operations, it will be understood and appreciated that method 1000 may include additional operations and may omit operations shown and described herein and still be within the scope of the present disclosure.

[0070] Forming a vessel 1010 may include forming a vessel in the shape of a cylinder, as also indicated by Box 1010. In this regard, the vessel may be formed within a bottom and top connected by a cylindrical body, e.g., bottom 314 (shown in FIG. 3) and top 312 (shown in FIG. 3) connected by cylindrical body 316 (shown in FIG. 3), as further indicated by Box 1010. The vessel may be formed to enclose an interior of the vessel to contain a liquid precursor, e.g., to enclose interior 302 (shown in FIG. 3) to contain liquid precursor 304 (shown in FIG. 3), as additionally indicated by Box 1010. As further indicated by Box 1010, it is contemplated that the first material may be non-reactive with the liquid precursor and / or the first material may cooperate with features of the container assembly (e.g., dimensions and assembly) to make the container assembly DOT 4B compliant. In certain embodiments, the first material may include (or consist of, or consist essentially of) a stainless steel material, such as 316L stainless steel or 304L stainless steel.

[0071] Mounting 1020 the conduits within the vessel may include mounting one or more of an outlet conduit, a refill conduit, and a carrier gas conduit within the vessel, for example, mounting one or more of refill conduit 351 (shown in FIG. 3 ), carrier gas supply conduit 324 (shown in FIG. 3 ), and outlet conduit 341 (shown in FIG. 3 ), as also shown in box 1020. The conduits may be mounted such that they communicate with the interior of the vessel, for example, with a loss space defined above a liquid precursor charge contained within the vessel or within the liquid precursor charge itself, as further shown in box 1020. Mounting 1020 may also include mounting a probe member within the vessel, for example, probe member 360 (shown in FIG. 10 ), as additionally shown in box 1020. In this regard, it is contemplated that the probe member may be mounted within the vessel such that the probe member extends into the liquid precursor contained in the container, both through a loss space defined within the vessel and into the liquid precursor contained within the vessel, to obtain one or more of the temperature of the vaporized liquid precursor and / or the liquid precursor as well as the level of the liquid precursor within the vessel, as also shown in box 1020.

[0072] Forming the jacket from a second material 1030 may include forming the jacket from a second material having a second thermal conductivity higher than the first thermal conductivity of the first material, as also shown in Box 1030. The second material may be an aluminum-containing material (e.g., consisting of, or consisting essentially of, an aluminum-containing material), as further shown in Box 1030. In this regard, as additionally shown in Box 1030, the second material may be selected from the group including 6060 aluminum, 6061 aluminum, and 6063 aluminum. Forming the jacket 1030 may include forming a jacket having an open top and a sealed bottom connected to one another by a middle portion, as also shown in Box 1030. Forming the jacket 1030 may include forming the jacket with one or more protruding portions extending from the sealed bottom in a direction opposite the open top of the jacket, as further shown in Box 1030.

[0073] Disposing 1040 the vessel within the jacket may include disposing the vessel within the jacket such that the jacket extends (at least partially) around the exterior of the vessel, also as indicated by box 1040. Disposing 1040 the vessel within the jacket may include contacting a lower surface of the vessel with an inner surface of the base of the jacket, as further indicated by box 1040. Disposing 1040 the vessel within the jacket may include coating either (or both) the exterior of the vessel and the interior of the jacket with a thermal compound, such as thermal compound 490 (shown in FIG. 4 ), as further indicated by box 1040. Advantageously, in addition to limiting thermal resistance between the vessel and the jacket, the thermal paste may facilitate assembly of the container assembly, for example, by limiting friction between the vessel and the jacket during construction of the jacket around the vessel and / or affixing 1060 of the jacket to the vessel via the aforementioned interference fit.

[0074] Affixing 1060 the vessel within the jacket may include heating the jacket such that the actual dimensions of the jacket increase relative to the dimensions of the jacket at room temperature (e.g., the nominal dimensions of the jacket when separated from the jacket at room temperature), then disposing 1040 the vessel within the heated jacket, and then allowing the jacket to cool to form an interference fit, as indicated by box 1060. For example, the jacket may be heated to a temperature of about 20 degrees Celsius to about 100 degrees Celsius, or about 20 degrees Celsius to about 200 degrees Celsius, or even about 20 degrees Celsius to about 500 degrees Celsius, and then disposing the vessel within the jacket while still warm to the jacket. It is also contemplated that affixing 1060 the jacket to the vessel may include heating the jacket prior to disposing 1040 the vessel within the jacket, as further indicated by box 1060. Advantageously, heating the jacket prior to disposing the vessel within the jacket allows for the jacket to be formed with a relatively large nominal interference relative to the vessel, allowing for a tighter interference fit than would otherwise be possible. As will be understood by those skilled in the art in light of the present disclosure, the increased tightness reduces resistance to heat transfer between the vessel and the jacket, simplifying vessel temperature control of the liquid precursor contained within the vessel.

[0075] Affixing 1060 the vessel within the jacket may include cooling the vessel such that the actual dimensions of the vessel are reduced relative to the dimensions of the vessel at room temperature (e.g., the nominal dimensions of the vessel when separated from the vessel and at room temperature), thereafter disposing 1040 the vessel within the jacket, and then warming the vessel to room temperature to allow the interference fit to form, also as shown in box 1060. For example, the vessel may be cooled to a temperature of about 20 degrees Celsius to about −100 degrees Celsius, or about 20 degrees Celsius to about −150 degrees Celsius, or even about 20 degrees Celsius to about −200 degrees Celsius, and then the vessel is disposed within the jacket while cold to the jacket. It is also contemplated that affixing 1060 the jacket to the vessel may include cooling the vessel prior to disposing 1040 the vessel within the jacket, as further shown in box 1060. It is further contemplated that affixing 1060 the jacket to the vessel may include both heating the jacket and cooling the vessel prior to disposing the vessel within the jacket, as further indicated at box 1060. As additionally indicated at box 1060, it is acceptable to then warm the vessel, e.g., to a common equilibrium temperature, e.g., to room temperature, and to cool the jacket, to form an interference fit between the vessel and jacket. As will be understood by those skilled in the art in view of the present disclosure, using both jacket heating and vessel cooling allows the vessel and / or jacket to be formed with a relatively large interference, thereby resulting in a larger interference than would otherwise be possible in embodiments where only one of the vessel and jacket is dimensionally changed via heating or cooling prior to disposing the vessel within the jacket.

[0076] In some embodiments, disposing 1040 the vessel within the jacket and affixing 1060 the jacket to the vessel may be performed simultaneously, as indicated by box 1070. For example, jacket 320 may be disposed around vessel 310 by press-fitting the jacket around the vessel or the vessel into the jacket, such as by applying force by hand or using a mechanical device such as a press, as also indicated by bracket 1070. The press-fit may be performed with the jacket and vessel at room temperature. Alternatively, the press-fit may be performed when the jacket is at a high temperature and / or the vessels are at a low or room temperature relative to each other and still be within the scope of the present disclosure. In certain examples, the vessel may be clamped within the jacket, for example, by applying pressure to the top of the vessel against the bottom of the jacket, such that when an interference fit is formed, a residual compressive force exists between the lower wall of the vessel and the lower wall of the jacket, further limiting heat transfer between the vessel and the jacket, as further indicated by box 1040.

[0077] While the present disclosure has been provided in the context of certain embodiments and examples, it will be understood by those skilled in the art that the present disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses of the present embodiments and obvious variations and their equivalents. In addition, while several variations of the embodiments of the present disclosure have been shown and described in detail, other variations that are within the scope of the present disclosure will be readily apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or subcombinations of specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It will be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another to form varying modes of embodiment of the present disclosure. Therefore, it is not intended that the scope of the present disclosure should be limited by the specific embodiments described above.

Claims

1. 1. A container assembly comprising: a vessel formed from a first material having a first thermal conductivity; a conduit mounted within the vessel and communicating with the interior of the vessel; a jacket extending around the vessel and formed from a second material having a second thermal conductivity; the second thermal conductivity is higher than the first thermal conductivity; The vessel assembly, wherein the jacket is affixed to the vessel with an interference fit, limiting resistance to heat flow between the vessel and the jacket.

2. the conduit is a first conduit; The container assembly includes: a second conduit mounted within the vessel and in fluid communication with the interior of the vessel, the second conduit extending a greater distance into the interior of the vessel than the first conduit; 10. The container assembly of claim 1, further comprising: a third conduit mounted within and in fluid communication with the interior of the vessel, the third conduit extending into the interior of the vessel beyond the second conduit.

3. the first conduit has a first manual valve and a first actuated valve disposed along the first conduit; the second conduit has a second manual valve and a second actuated valve disposed along the second conduit; 3. The container assembly of claim 2, wherein the third conduit has a third manual valve and a third actuated valve disposed along the third conduit.

4. a probe member mounted within the vessel and extending into the interior of the vessel; The container assembly of claim 1 , wherein the probe member comprises a temperature sensor and one or more level sensors.

5. the vessel is formed from a stainless steel material; 10. The container assembly of claim 1, wherein the jacket is formed from an aluminum-containing material.

6. 10. The container assembly of claim 1, wherein the interference between the vessel and the jacket is between 0.005 millimeters and 0.345 millimeters.

7. a thermoelectric heat pump coupled to the jacket; a heat sink coupled to the thermoelectric heat pump; The container assembly of claim 1 , further comprising a heat transfer circuit connected to the heat sink.

8. the thermoelectric heat pump is a first thermoelectric heat pump; the vessel assembly further comprising one or more second thermoelectric heat pumps coupled to the jacket; The container assembly of claim 7 , wherein the heat sink is coupled to the one or more second thermoelectric heat pumps.

9. a second thermoelectric heat pump connected to a probe member mounted within the vessel; 8. The container assembly of claim 7, wherein the second thermoelectric heat pump is thermally coupled to the interior of the container assembly through the probe member.

10. the jacket has one or more protruding portions extending in a direction opposite to the conduit; The container assembly of claim 7 , wherein the thermoelectric heat pump is coupled to the one or more protruding portions of the jacket.

11. the one or more protruding portions are a first protruding portion and a second protruding portion spaced apart from the first protruding portion; the thermoelectric heat pump is a first thermoelectric heat pump mounted on the first protruding portion; 10. The container assembly of claim 9, further comprising a second thermoelectric heat pump mounted on the second protruding portion.

12. 10. The container assembly of claim 1, further comprising insulation extending around and separated from the vessel by the jacket.

13. The container assembly of claim 1 , further comprising a liquid precursor contained within the interior of the vessel.

14. 14. The container assembly of claim 13, wherein the liquid precursor is selected from the group consisting of a silicon-containing precursor, a germanium-containing precursor, a phosphorus-containing precursor, and an arsenic-containing precursor.

15. A chamber structure, a chamber body having a horizontal cross-flow structure; 10. The container assembly of claim 1, wherein the container assembly is supported above the chamber body, the first material is a stainless steel material; the second material is an aluminum-containing material; the conduit connects the vessel to the chamber body, and a container assembly for depositing a material layer onto a substrate mounted in the chamber body using vaporized liquid precursor from the interior of the vessel in communication with the interior.

16. 1. A semiconductor processing system comprising:

10. The container assembly of claim 1, the vessel is formed from a stainless steel material; the jacket is formed from an aluminum-containing material; a vessel assembly, the vessel assembly further comprising a thermoelectric heat pump coupled to the jacket; a chamber structure coupled to the conduit and configured to deposit a material layer onto a substrate using vaporized liquid material layer precursor received from the container assembly; a controller operatively connected to the thermoelectric heat pump and responsive to instructions stored on a memory, the controller comprising: receiving a temperature measurement of a temperature of a liquid precursor contained within the interior of the vessel; receiving a predetermined liquid precursor temperature value; comparing the temperature measurement to a predetermined liquid precursor temperature value; and and a controller that throttles a rate of heat transfer between the liquid precursor and an external environment using the thermoelectric heat pump when the temperature measurement received by the controller differs from the predetermined liquid precursor temperature value by more than a predetermined difference.

17. 1. A method for depositing a material layer, comprising: In the container assembly: a vessel formed from a first material having a first thermal conductivity; a conduit mounted within the vessel and communicating with the interior of the vessel; a jacket extending at least partially around an exterior of the vessel and formed from a second material having a second thermal conductivity, the second thermal conductivity being greater than the first thermal conductivity, the jacket being affixed to the vessel with an interference fit; receiving a carrier gas in the vessel; vaporizing a liquid precursor contained within the interior of the vessel; communicating the vaporized liquid precursor with a chamber structure coupled to the conduit using the carrier gas; and depositing a layer of material onto a substrate mounted within the chamber structure using the vaporized liquid precursor; vaporizing the liquid precursor includes transferring heat between the liquid precursor and an external environment outside the container assembly through the vessel and the jacket; The method, wherein the interference fit between the vessel and the jacket limits resistance to heat transfer between the vessel and the jacket during the transfer of heat between the liquid precursor and the external environment.

18. 1. A method of making a container assembly, comprising: forming a vessel from a first material having a first thermal conductivity; mounting the conduit within the vessel such that the conduit is in communication with the interior of the vessel; forming a jacket from a second material having a second thermal conductivity, the second thermal conductivity being greater than the first thermal conductivity; disposing the vessel within the jacket such that the jacket extends around the vessel; and affixing the jacket to the vessel with an interference fit; wherein the interference fit between the jacket and the vessel limits resistance to heat flow between the jacket and the vessel during transfer of heat between a liquid precursor contained within the interior of the vessel and an external environment.

19. Affixing the jacket to the vessel with the interference fit comprises: cooling the vessel before disposing the jacket around the vessel; 20. The method of claim 18, comprising heating the vessel after disposing the jacket around the vessel, wherein the heating of the vessel forms the interference fit between the jacket and the vessel.

20. Affixing the jacket to the vessel with the interference fit comprises: heating the jacket before disposing the jacket around the vessel; 20. The method of claim 18, comprising: cooling the jacket after disposing the jacket around the vessel, wherein the cooling of the vessel forms the interference fit between the jacket and the vessel.

21. 20. The method of claim 18, wherein affixing the jacket to the vessel with the interference fit comprises press-fitting the vessel into the jacket.

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