Chemical solution supply device, cleaning system, and liquid supply method

Abstract

To provide a chemical solution supply device capable of supplying to an external device not only any cleaning solution diluted with pure water from any two types of chemical solutions, but also other liquids.SOLUTION: The chemical solution supply device includes a junction point, a dilution water pipe, a first chemical solution pipe, a second chemical solution pipe, a first valve, a second valve, a third valve, a cleaning chemical solution supply pipe, and a control device operable in a first mode, a second mode, a third mode, a fourth mode, and a fifth mode. The control device controls the first valve, the second valve, and the third valve such that only a first chemical solution is supplied to the external device in the first mode, only a second chemical solution is supplied to the external device in the second mode, the first cleaning solution is supplied to the external device in the third mode, and the second cleaning solution is supplied to the external device in the fourth mode, and the third cleaning solution is supplied to the external device in the fifth mode.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to a chemical liquid supply device, a cleaning system, and a liquid supply method. [Background technology]

[0002] In semiconductor manufacturing processes, a CMP (Chemical Mechanical Polishing) apparatus is used to planarize the surface of a substrate. The CMP apparatus may include a polishing apparatus for polishing the surface of the substrate and a cleaning apparatus for cleaning the substrate. The cleaning apparatus is connected to a chemical liquid supplying apparatus. The chemical liquid supplying apparatus supplies a cleaning liquid to the cleaning apparatus. For example, Patent Document 1 discloses an example of a chemical liquid supplying apparatus.

[0003] As shown in FIG. 3, the cleaning liquid supply device (chemical liquid supply device) disclosed in Patent Document 1 includes a pure water supply line 50, an ammonia water supply line 52, a hydrogen peroxide water supply line 54, a confluence M, and a cleaning liquid supply line 68. At the confluence M, pure water flowing through the pure water supply line 50, ammonia water flowing through the ammonia water supply line 52, and hydrogen peroxide water flowing through the hydrogen peroxide water supply line 54 converge to generate a cleaning liquid. The cleaning liquid supply line 68 is configured to supply the generated cleaning liquid to a substrate. With this configuration, the cleaning liquid supply device can generate an SC-1 cleaning liquid by diluting a mixture of ammonia water and hydrogen peroxide water with pure water and supply this cleaning liquid to the cleaning liquid supply nozzles 34 and 38. In other words, Patent Document 1 discloses a cleaning liquid supply device that can supply a cleaning liquid obtained by diluting any two types of chemical liquids with pure water to a nozzle. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-216483 [Patent Document 2] Patent No. 6212253 [Patent Document 3] Japanese Patent Publication No. 2020-174086 [Patent Document 4] Japanese Patent Application Publication No. 2023-116395 Summary of the Invention [Problem to be solved by the invention]

[0005] Recent advances in semiconductor technology have created a demand for thinner wiring widths formed on the surface of semiconductor substrates. Forming thinner wiring on the surface of semiconductor substrates requires the removal of smaller particles adhering to the substrate surface, necessitating the development of cleaning processes capable of removing such small particles. The size of particles that a cleaning device can remove is thought to vary depending on the type, concentration, flow rate, etc., of the cleaning chemicals. Therefore, developing a cleaning process may require a chemical supply device capable of supplying various types of liquids to a nozzle used to clean the surface of a semiconductor substrate. Furthermore, in some cleaning processes, cleaning of not only the front surface but also the back surface of a semiconductor substrate may be required. Therefore, developing a cleaning process may require a device capable of supplying various types of liquids to a nozzle used to clean the back surface of a semiconductor substrate.

[0006] As described above, Patent Document 1 discloses a cleaning liquid supplying device that can supply a cleaning liquid obtained by diluting any two types of chemical liquid with pure water to a nozzle. However, recent developments in cleaning processes have created a demand for chemical liquid supplying devices that can supply various types of liquids, and the cleaning liquid supplying device of Patent Document 1 may not function satisfactorily. In other words, there is a demand for a chemical liquid supplying device that can supply liquids other than a cleaning liquid obtained by diluting any two types of chemical liquid with pure water to an external device such as a nozzle.

[0007] Therefore, one object of the present disclosure is to provide a chemical liquid supplying device, a cleaning system, and a chemical liquid supplying method that can supply liquids other than cleaning liquids obtained by diluting any two types of chemical liquids with pure water to an external device. [Means for solving the problem]

[0008] A chemical liquid supply device according to the present disclosure is a chemical liquid supply device for supplying a supply liquid to an external device, comprising: a junction; a dilution water pipe for supplying water to the junction; a first chemical liquid pipe for supplying a first chemical liquid to the junction; a second chemical liquid pipe for supplying a second chemical liquid to the junction; a first valve attached to the dilution water pipe; a second valve attached to the first chemical liquid pipe; a third valve attached to the second chemical liquid pipe; a cleaning chemical liquid supply pipe located downstream of the junction for supplying the supply liquid to the external device; and a control device operable in a first mode, a second mode, a third mode, a fourth mode, and a fifth mode, The control device controls the first valve, the second valve, and the third valve so that in a first mode, only the first chemical liquid is supplied to the external device as the supply liquid, in a second mode, only the second chemical liquid is supplied to the external device as the supply liquid, in a third mode, a first cleaning chemical liquid obtained by mixing the first chemical liquid and the water is supplied to the external device as the supply liquid, in a fourth mode, a second cleaning chemical liquid obtained by mixing the second chemical liquid and the water is supplied to the external device as the supply liquid, and in a fifth mode, a third cleaning chemical liquid obtained by mixing the first chemical liquid, the second chemical liquid, and the water is supplied to the external device as the supply liquid.

[0009] A cleaning system according to the present disclosure is a cleaning system comprising the above-described chemical liquid supply device and a substrate cleaning device for cleaning a substrate, wherein the cleaning chemical liquid supply piping has an upstream piping that forms a flow path from the confluence point to the branch point, a first piping that forms a flow path from the branch point to a first nozzle, and a second piping that forms a flow path from the branch point to a second nozzle, and the substrate cleaning device has the first nozzle and the second nozzle, wherein the first nozzle is configured to supply the supply liquid to a first surface of the substrate, and the second nozzle is configured to supply the supply liquid to a second surface behind the first surface of the substrate.

[0010] A liquid supply method according to the present disclosure is a liquid supply method using the above-described chemical liquid supply device, and includes a step in which the chemical liquid supply device supplies at least one of the first chemical liquid, the second chemical liquid, the first cleaning chemical liquid, the second cleaning chemical liquid, and the third cleaning chemical liquid to the external device. [Brief explanation of the drawings]

[0011] [Figure 1A] FIG. 1 is a fluid circuit diagram of a cleaning system according to an embodiment of the present disclosure. [Figure 1B] FIG. 1B is a detailed fluid circuit diagram of the substrate cleaning apparatus of FIG. 1A. [Figure 2] 1B is a schematic front view showing the drug solution supplying device shown in FIG. 1A. FIG. [Figure 3] FIG. 2 is a fluid circuit diagram showing the configuration of a flow rate control device. [Figure 4A] 4 is a time chart showing the timing of opening and closing each valve when the control device operates in a first mode. [Figure 4B] 6 is a time chart showing the timing of opening and closing each valve when the control device operates in the second mode. [Figure 4C] 6 is a time chart showing the timing of opening and closing each valve when the control device operates in a third mode. [Figure 4D] 10 is a time chart showing the timing of opening and closing each valve when the control device operates in a fourth mode. [Figure 4E] 10 is a time chart showing the timing of opening and closing each valve when the control device operates in a fifth mode. [Figure 5A] 4 is a time chart showing the timing of opening and closing each valve when the control device operates in a first flushing mode. [Figure 5B] 6 is a time chart showing the timing of opening and closing each valve when the control device operates in the second flushing mode. [Figure 5C] 10 is a time chart showing the timing of opening and closing each valve when the control device operates in a third flushing mode. [Figure 6]FIG. 10 is a fluid circuit diagram of a cleaning system according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and redundant description will be omitted.

[0013] <Cleaning System 500> <Configuration> FIG. 1A is a fluid circuit diagram of a cleaning system 500 according to an embodiment of the present disclosure. FIG. 1B is a fluid circuit diagram showing in detail the substrate cleaning apparatus 400 of FIG. 1A. Referring to FIG. 1A, the cleaning system 500 includes a chemical liquid supplying apparatus 100, a substrate cleaning apparatus (an example of an external apparatus) 400, and a control device 320. The chemical liquid supplying apparatus 100 is an apparatus for supplying water and a supply liquid to the substrate cleaning apparatus 400. The substrate cleaning apparatus 400 is an apparatus for cleaning a substrate W using the water and the supply liquid supplied from the chemical liquid supplying apparatus 100. The components of the chemical liquid supplying apparatus 100 and the substrate cleaning apparatus 400 will be described below.

[0014] 1A, the substrate cleaning apparatus 400 includes a water cleaning unit 410 and a cleaning module 418. The water cleaning unit 410 is configured to clean the substrate W polished by the polishing apparatus with water (DIW). As an example, the water cleaning unit 410 is configured to ultrasonically clean the substrate W.

[0015] 1B, the cleaning module 418 includes a first nozzle 421, a second nozzle 422, a standby unit 423, and a cleaning tank 420. The first nozzle 421 is configured to supply the supply liquid supplied from the chemical liquid supply device 100 to a first surface of the substrate W. The second nozzle 422 is configured to supply the supply liquid supplied from the chemical liquid supply device 100 to a second surface of the substrate W. This allows the substrate cleaning apparatus 400 to simultaneously clean both surfaces of the substrate W with the supply liquid. Note that, as an example, the first surface of the substrate W is a pattern surface on which wiring is formed, and the second surface is a surface opposite to the first surface. Furthermore, when cleaning the substrate W, the substrate W may be placed so that the first surface faces in any direction, such as vertically or horizontally, depending on specifications.

[0016] The standby section 423 is configured to supply the supply liquid to the waiting substrate W before it is cleaned by the first nozzle 421 and the second nozzle 422. This prevents oxidation of the waiting substrate W. The standby section 423 may have a nozzle for supplying the supply liquid to the substrate W or the wafer cleaning sponge. The cleaning tank 420 is configured to accommodate the first nozzle 421, the second nozzle 422, and the standby section 423.

[0017] Next, reference will be made to Figure 2. As shown in Figure 2, the chemical solution supplying apparatus 100, for example, includes a frame 105, a dilution water CLC box 110, a first chemical solution CLC box 120, a second chemical solution CLC box 140, and a plurality of utility boxes 170 and 180. The dilution water CLC box 110, the first chemical solution CLC box 120, the second chemical solution CLC box 140, and the plurality of utility boxes 170 and 180 are housed in the frame 105.

[0018] Referring again to FIG. 1A, the chemical liquid supplying device 100 includes a water pipe 201, a valve 191, a level The water pipe 201 is provided with a regulator 192 and a pressure gauge 193. The water pipe 201 is connected to a water supply source 902 and the water cleaning unit 410. The water supply source 902 has a function of supplying water such as DIW, for example. This allows the chemical liquid supply device 100 to supply water to the water cleaning unit 410. The valve 191 is provided upstream of a connection port 221 on the water pipe 201. The valve 191 is controlled by the control device 320, and controls the flow rate of water flowing through the water pipe 201. The regulator 192 has a function of adjusting the supply pressure of water supplied to the water cleaning unit 410. The pressure gauge 193 has a function of measuring the pressure of water passing through the water pipe 201.

[0019] Moreover, chemical liquid supply device 100 includes, as an example, supply module 108. Supply module 108 includes junction M, first chemical liquid piping 240, and second chemical liquid piping 242. First chemical liquid piping 240 connects first chemical liquid supply source 903 and junction M. As a result, first chemical liquid supply source 903 and junction M are fluidically connected. Moreover, first chemical liquid supply source 903 has, as an example, a function of supplying the first chemical liquid. As a result, the first chemical liquid is supplied from first chemical liquid supply source 903 to junction M. On the other hand, second chemical liquid piping 242 connects second chemical liquid supply source 904 and junction M. As a result, second chemical liquid supply source 904 and junction M are fluidically connected. Moreover, second chemical liquid supply source 904 has, as an example, a function of supplying the second chemical liquid. As a result, the second chemical liquid is supplied from the second chemical liquid supply source 904 to the confluence M.

[0020] The supply module 108 also includes dilution water pipes 202 and 203. The dilution water pipe 202 extends from a connection port 221 provided on the water pipe 201 to a connection port 225. The dilution water pipe 203 extends from a connection port 222 provided on the dilution water pipe 202 to a junction M. This places the water supply source 902 in fluid communication with the junction M. As a result, water is supplied to the junction M from the water supply source 902.

[0021] The supply module 108 also includes a flow rate control device (an example of a dilution water control device, a CLC: Closed Loop Controller) 111 and a valve 112 (an example of a first valve). The valve 112 is attached to the dilution water pipe 203. The valve 112 is controlled and opened and closed by the control device 320. The flow rate control device 111 is also attached to the dilution water pipe 203. The flow rate control device 111 is configured to perform feedback control based on the flow rate of water in the dilution water pipe 203 so that the flow rate of water flowing through the dilution water pipe 203 becomes a set flow rate. In other words, the flow rate control device 111 is configured to perform feedback control so that the flow rate of water supplied from the water supply source 902 to the junction M becomes a set flow rate.

[0022] More specifically, the flow control device 111 has the configuration shown in FIG. 3 as an example. FIG. 3 is a fluid circuit diagram showing the configuration of the flow control device 111 shown in FIG. 1A. The flow control device 111 includes a flow meter 1112, a flow control valve 1111, and a control unit 1113. The flow meter 1112 is, for example, a differential pressure flow meter (orifice flow meter). Note that in another embodiment according to the present disclosure, the flow meter 1112 may be another type of flow meter, such as an ultrasonic flow meter. The flow control valve 1111 is, for example, a motor valve, and the opening of a valve body 1111a is controlled by the power of a drive source 1111b including a motor. Note that in another embodiment according to the present disclosure, the flow control valve 1111 may be any valve whose opening is adjustable, and may be another type of variable flow valve (for example, an electromagnetic valve driven by a solenoid or the like). The control unit 1113 is configured to receive a fluid flow rate set value iT from the control device 320 (see FIG. 1A) and a fluid flow rate detection value io from the flow meter 1112, and to feedback-control the flow rate control valve 1111 so that the flow rate detection value io matches the flow rate set value iT. Note that other flow rate control devices described later have the same configuration as the flow rate control device 111 described here, as an example.

[0023] 1A again, supply module 108 includes flow rate control device 121 (an example of a first chemical liquid control device) and valve 122 (an example of a second valve) (see FIG. 1A). Valve 122 is attached to first chemical liquid piping 240. Valve 122 is controlled and opened / closed by control device 320. Flow rate control device 121 is also attached to first chemical liquid piping 240. Flow rate control device 121 is configured to feedback-control the flow rate of the first chemical liquid flowing through first chemical liquid piping 240 based on the flow rate of the first chemical liquid in first chemical liquid piping 240 so that the flow rate becomes a set flow rate. In other words, flow rate control device 121 is configured to feedback-control the flow rate of the first chemical liquid supplied from first chemical liquid supply source 903 to junction M so that the flow rate becomes a set flow rate.

[0024] Supply module 108 also includes flow rate control device 141 (an example of a second chemical liquid control device) and valve 142 (an example of a third valve) (see FIG. 1A). Valve 142 is attached to second chemical liquid piping 242. Valve 142 is controlled and opened / closed by control device 320. Flow rate control device 141 is also attached to second chemical liquid piping 242. Flow rate control device 141 is configured to perform feedback control, based on the flow rate of the second chemical liquid in second chemical liquid piping 242, to adjust the flow rate of the second chemical liquid flowing through second chemical liquid piping 242 to a set flow rate. In other words, flow rate control device 141 is configured to perform feedback control to adjust the flow rate of the second chemical liquid supplied from second chemical liquid supply source 904 to junction M to a set flow rate.

[0025] As described above, the supply module 108 is configured to supply the first chemical liquid, the second chemical liquid, and water to the junction M. The supply module 108 has a function of preparing a supply liquid at the junction M as needed from the first chemical liquid, the second chemical liquid, and the water supplied to the junction M. The supply liquids include the first chemical liquid, the second chemical liquid, a first cleaning chemical liquid obtained by mixing the first chemical liquid and water, a second cleaning chemical liquid obtained by mixing the second chemical liquid and water, and a third cleaning chemical liquid obtained by mixing the first chemical liquid, the second chemical liquid, and water. The supply module 108 also includes a mixer 123, for example. The mixer 123 is, for example, an in-line mixer, and is attached to the upstream pipe 261 of the cleaning chemical supply pipe 260 downstream of the junction M. The mixer 123 has a function of mixing the supply liquids prepared at the junction M so that the supply liquid is uniform.

[0026] Furthermore, supply module 108 includes manual valve 171 and valve (an example of a fourth valve) 172. Manual valve 171 and valve 172 are provided on first chemical liquid piping 240 and housed in utility box 170. Valve 172 is controlled and opened / closed by air control device 300, which will be described later.

[0027] The supply module 108 also includes a flushing water pipe 207, a valve (an example of a fifth valve) 174, and a check valve 175. The flushing water pipe 207 connects a connection port 224 provided on the dilution water pipe 202 to a connection port 230 provided on the first chemical liquid pipe 240. The connection port 230 is located on the first chemical liquid pipe 240 between the flow rate control device 121 and the valve 172. The valve 174 and the check valve 175 are provided on the flushing water pipe 207 and housed in the utility box 170. The valve 174 is configured to be opened and closed under the control of the control device 320. The check valve 175 is configured to block the flow from the connection port 230 to the connection port 224. When the valve 174 is opened, the flushing water flows from the connection port 230 into the first chemical liquid pipe 240. Thereby, the chemical liquid supplying apparatus 100 can replace the first chemical liquid in the first chemical liquid pipe 240 with water, and flush the inside of the first chemical liquid pipe 240 (pipe cleaning).

[0028] The supply module 108 also includes a manual valve 181 and a valve (an example of a sixth valve) 1. 82. Manual valve 181 and valve 182 are provided on second chemical liquid pipe 242 and housed in utility box 180. Valve 182 is controlled and opened / closed by air control device 300, which will be described later.

[0029] The supply module 108 also includes a flushing water pipe 208, a valve 184 (an example of a seventh valve), and a check valve 185. The flushing water pipe 208 connects a connection port 225 provided on the dilution water pipe 202 to a connection port 231 provided on the second chemical liquid pipe 242. The connection port 231 is located on the second chemical liquid pipe 242 between the flow rate control device 141 and the valve 182. The valve 184 and the check valve 185 are also provided on the flushing water pipe 208 and housed in the utility box 180. The valve 184 is configured to be opened and closed under the control of the control device 320. The check valve 185 is configured to block the flow from the connection port 231 to the connection port 225. When the valve 184 is opened, the flushing water flows from the connection port 231 into the second chemical liquid pipe 242. Thereby, the chemical liquid supplying apparatus 100 can replace the second chemical liquid in the second chemical liquid pipe 242 with water, and flush the inside of the second chemical liquid pipe 242 (pipe cleaning).

[0030] The supply module 108 also includes a cleaning chemical liquid supply pipe 260. The cleaning chemical liquid supply pipe 260 is located downstream of the junction M and can supply the supply liquid to the substrate cleaning apparatus 400. More specifically, the cleaning chemical liquid supply pipe 260 includes an upstream pipe 261, a first pipe 262, a second pipe 263, and a third pipe 264. The upstream pipe 261 forms a flow path from the junction M to the branch point 271. The first pipe 262 forms a flow path from the branch point 271 to the first nozzle 421 (see FIG. 1B). The second pipe 263 forms a flow path from the branch point 271 to the second nozzle 422 (see FIG. 1B). The third pipe 264 forms a flow path from a connection port 272 on the upstream pipe 261 to a standby section 423 (see FIG. 1B). In other words, the cleaning chemical liquid supply pipe 260 is configured to connect the junction M and the standby section 423 via the third pipe 264. This allows the supply liquid to flow from the junction M to the first nozzle 421, the second nozzle 422, and the standby section 423. That is, the chemical liquid supply device 100 can supply the supply liquid to the first nozzle 421, the second nozzle 422, and the standby section 423.

[0031] The supply module 108 also includes a flow rate control device (an example of a first supply amount control device) 152. The flow rate control device 152 is attached to the first pipe 262. The flow rate control device 152 is configured to perform feedback control based on the flow rate of the supply liquid in the first pipe 262 so that the flow rate of the supply liquid flowing through the first pipe 262 becomes a set flow rate. This allows the chemical liquid supply device 100 to supply the supply liquid to the first nozzle 421 at a set flow rate.

[0032] The supply module 108 also includes valves 151, 158, and 155. The valve 151 is provided on the first pipe 262 between the flow control device 152 and the valve 153. The valve 158 is provided on the second pipe 263 downstream of the flow meter 154. The valve 155 is provided on the third pipe 264. The valves 151, 158, and 155 are configured to be controlled by the control device 320 and opened and closed. More specifically, the valves 151, 158, and 155 are, for example, on / off valves. In the present disclosure, an on / off valve refers to a valve that can only be configured in two stages: a fully open state and a fully closed state. In another embodiment of the present disclosure, the valves 151, 158, and 155 may be continuous control valves that can continuously change the valve opening, rather than on / off valves.

[0033] The supply module 108 also includes a valve 153. The valve 153 is provided downstream of the flow rate control device 152 on the first pipe 262. The valve 153 is, for example, The valve 153 is configured to perform a suck-back operation of sucking back the liquid in the first pipe 262 downstream of the valve 153 when the valve 151 is closed.

[0034] The supply module 108 also includes flow meters 154 and 156. The flow meter 154 is provided on the second pipe 263 and measures the flow rate of the supply liquid flowing through the second pipe 263. The flow meter 156 is provided on the third pipe 264 and measures the flow rate of the supply liquid flowing through the third pipe 264.

[0035] The chemical liquid supply device 100 also includes a first cleaning chemical liquid supply box 150. The first cleaning chemical liquid supply box 150 houses a flow rate control device 152, valves 153, 155, 158, 151, and flow meters 154, 156.

[0036] Furthermore, chemical liquid supply device 100 includes an IN-side pressure gauge 173, an IN-side pressure gauge 183, an IN-side pressure gauge 195, and an OUT-side pressure gauge 124. IN-side pressure gauge 173 is provided between first chemical liquid supply source 903 and flow control device 121. This allows IN-side pressure gauge 173 to measure the pressure upstream of flow control device 121. IN-side pressure gauge 183 is provided between second chemical liquid supply source 904 and flow control device 141. This allows IN-side pressure gauge 183 to measure the pressure upstream of flow control device 141. IN-side pressure gauge 195 is provided at a position between water supply source 902 and flow control device 111. This allows IN-side pressure gauge 195 to measure the pressure upstream of flow control device 111. Furthermore, the outlet pressure gauge 124 is provided at a position between the flow rate control device 111 and the flow rate control device 152, at a position between the flow rate control device 121 and the flow rate control device 152, and at a position between the flow rate control device 141 and the flow rate control device 152. This allows the outlet pressure gauge 124 to measure the pressure inside the upstream pipe 261 of the cleaning chemical liquid supply pipe 260.

[0037] In the chemical supplying apparatus 100, the first chemical CLC box 120 houses, for example, a flow control device 121, a valve 122, a mixer 123, and an outlet pressure gauge 124. The second chemical CLC box 140 houses, for example, a flow control device 141 and a valve 142. The dilution water CLC box 110 houses, for example, a flow control device 111 and a valve 112.

[0038] The chemical liquid supply device 100 also includes a regulator 194. The regulator 194 is provided downstream of the connection port 221 on the dilution water pipe 202 and upstream of the in-side pressure gauge 195. The regulator 192 has a function of adjusting the supply pressure of the water supplied to the flow rate control device 111.

[0039] The chemical solution supplying device 100 also includes an air control device 300 and air pipes 301 and 302. The air control device 300 is included in the control device 320 and is controlled by the control device 320. The air control device 300 is connected to an air supply source 901. The air supply source 901 has a function of supplying gas to the air control device 300. The air pipe 301 connects the air control device 300 to a valve 172. The air pipe 302 connects the air control device 300 to a valve 182. The air control device 300 controls the valves 172 and 182 by sending air to the valves 172 and 182 via the air pipes 301 and 302.

[0040] 1A, the chemical liquid supply apparatus 100 includes only one supply module 108. However, the chemical liquid supply apparatus 100 is not limited to such a configuration. In another embodiment according to the present disclosure, the chemical liquid supply apparatus 100 may include two or more supply modules 108 as needed. Similarly, the substrate cleaning apparatus 400 may include two or more cleaning modules as needed. A cleaning module 418 may be included.

[0041] <Operation> Next, the operation of the cleaning system 500 will be described with reference to Figures 1A, 1B, and 4A to 4E. The control device 320 is configured to be able to operate in at least a first mode, a second mode, a third mode, a fourth mode, and a fifth mode. The operation of each mode will be described below in this order.

[0042] (First mode) 4A is a timing chart showing the timing of opening and closing each valve when the control device 320 operates in the first mode. As shown in FIG. 4A, before the control device 320 starts operating in the first mode, the cleaning system 500 is in a standby state. In the standby state, the valves 112, 122, 142, 151, 158, 155, 174, and 184 are closed, and the valves 172 and 182 are open. Note that the standby state described below also refers to a similar state.

[0043] When the control device 320 starts operation in the first mode at time t1, the control device 320 opens the valves 122, 151, 158, and 155. As a result, the first chemical liquid passing through the first chemical liquid pipe 240 passes through the junction M and is supplied as a supply liquid to the first nozzle 421, the second nozzle 422, and the standby unit 423 (see FIGS. 1A and 1B). In other words, in the first mode, the chemical liquid supply device 100 can supply only the first chemical liquid as a supply liquid to the substrate cleaning apparatus 400. Thereafter, when the control device 320 ends operation in the first mode at time t2, the control device 320 closes the valves 122, 151, and 158, and the cleaning system 500 returns to the standby state.

[0044] 4A, the control device 320 opens all of the valves 151, 158, and 155. However, in another embodiment according to the present disclosure, the control device 320 does not need to perform such control. The control device 320 may open any of the valves 151, 158, and 155 as needed.

[0045] (Second mode) 4B is a timing chart showing the timing of opening and closing each valve when the control device 320 operates in the second mode. As shown in FIG. 4B, before the control device 320 starts operating in the second mode, the cleaning system 500 is in a standby state.

[0046] When the control device 320 starts operation in the second mode at time t1, the control device 320 opens the valves 142, 151, 158, and 155. As a result, the second chemical liquid passing through the second chemical liquid pipe 242 passes through the junction M and is supplied as a supply liquid to the first nozzle 421, the second nozzle 422, and the standby unit 423 (see FIGS. 1A and 1B). In other words, in the second mode, the chemical liquid supplying apparatus 100 can supply only the second chemical liquid as a supply liquid to the substrate cleaning apparatus 400. Thereafter, when the control device 320 ends operation in the second mode at time t2, the control device 320 closes the valves 142, 151, and 158, and the cleaning system 500 returns to the standby state.

[0047] 4B, the control device 320 opens all of the valves 151, 158, and 155. However, in another embodiment according to the present disclosure, the control device 320 does not need to perform such control. The control device 320 may open any of the valves 151, 158, and 155 as needed.

[0048] (Third mode) 4C is a timing chart showing the timing of opening and closing each valve when the control device 320 operates in the third mode. As shown in FIG. 4C, before the control device 320 starts operating in the third mode, the cleaning system 500 is in a standby state.

[0049] When the control device 320 starts operation in the third mode at time t1, the control device 320 opens valves 112, 151, 158, and 155. Then, after a delay time Δt from time t1, the control device 320 opens valve 122. As a result, the first chemical solution passing through first chemical solution pipe 240 and water passing through dilution water pipe 203 are supplied to junction M (see FIG. 1A). Then, at junction M, the first chemical solution and water are mixed to prepare a first cleaning chemical solution. Note that the delay time Δt may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds. Thereafter, the first cleaning chemical solution is supplied as a supply liquid to first nozzle 421, second nozzle 422, and standby section 423 (see FIGS. 1A and 1B). In other words, in the third mode, the chemical liquid supply apparatus 100 can supply the first cleaning chemical liquid as the supply liquid to the substrate cleaning apparatus 400. After that, when the control device 320 finishes the operation in the third mode at time t2, the control device 320 closes the valves 112, 122, 151, 158, and 155, and the cleaning system 500 returns to the standby state.

[0050] 4C, the control device 320 opens all of the valves 151, 158, and 155. However, in another embodiment according to the present disclosure, the control device 320 does not need to perform such control. The control device 320 may open any of the valves 151, 158, and 155 as needed.

[0051] Furthermore, in the third mode, the control device 320 opens the valve 112 and then the valve 122. As a result, the water that has passed through the dilution water piping 203 is first supplied to the first nozzle 421, the second nozzle 422, and the standby unit 423. In other words, the control device 320 controls the valves 112 and 122 so that the water that has passed through the dilution water piping 203 is first supplied to the substrate cleaning apparatus 400. As a result, the first chemical liquid that has not been diluted with water is prevented from being supplied to the substrate W. In other words, the chemical liquid supplying apparatus 100 can prevent the first chemical liquid that has not been diluted with water from being supplied to the substrate W and damaging the substrate W.

[0052] (4th mode) 4D is a timing chart showing the timing of opening and closing each valve when the control device 320 operates in the fourth mode. As shown in FIG. 4D, before the control device 320 starts operating in the fourth mode, the cleaning system 500 is in a standby state.

[0053] When the control device 320 starts operation in the fourth mode at time t1, the control device 320 opens valves 112, 151, 158, and 155. Then, after a delay time Δt from time t1, the control device 320 opens valve 142. As a result, the second chemical solution passing through second chemical solution pipe 242 and water passing through dilution water pipe 203 are supplied to junction M (see FIG. 1A). Then, at junction M, the second chemical solution and water are mixed to prepare a second cleaning chemical solution. Note that the delay time Δt may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds. Thereafter, the second cleaning chemical solution is supplied as a supply liquid to first nozzle 421, second nozzle 422, and standby section 423 (see FIGS. 1A and 1B). In other words, in the fourth mode, the chemical liquid supply apparatus 100 can supply the second cleaning chemical liquid as the supply liquid to the substrate cleaning apparatus 400. Thereafter, the control device 320 operates in the fourth mode at time t2. When the operation of is completed, the control device 320 closes the valves 112, 142, 151, 158, and 155, and the cleaning system 500 returns to the standby state.

[0054] 4D, the control device 320 opens all of the valves 151, 158, and 155. However, in another embodiment according to the present disclosure, the control device 320 does not need to perform such control. The control device 320 may open any of the valves 151, 158, and 155 as needed.

[0055] Furthermore, in the fourth mode, the control device 320 opens the valve 112 and then the valve 142. As a result, the water that has passed through the dilution water piping 203 is first supplied to the first nozzle 421, the second nozzle 422, and the standby section 423. In other words, the control device 320 controls the valves 112 and 142 so that the water that has passed through the dilution water piping 203 is first supplied to the substrate cleaning apparatus 400. As a result, the chemical liquid supplying apparatus 100 can prevent the second chemical liquid that has not been diluted with water from being supplied to the substrate W and damaging the substrate W.

[0056] (5th mode) 4E is a timing chart showing the timing of opening and closing each valve when the control device 320 operates in the fifth mode. As shown in FIG. 4E, before the control device 320 starts operating in the fifth mode, the cleaning system 500 is in a standby state.

[0057] When the control device 320 starts operation in the fifth mode at time t1, the control device 320 opens valves 112, 151, 158, and 155. Then, after a delay time Δt1 from time t1, the control device 320 opens valve 122. Next, after a delay time Δt2 from the opening of valve 122, the control device 320 opens valve 122. As a result, the first chemical solution passing through first chemical solution pipe 240, the second chemical solution passing through second chemical solution pipe 242, and water passing through dilution water pipe 203 are supplied to junction M (see FIG. 1A ). Then, at junction M, the first chemical solution, the second chemical solution, and water are mixed to prepare a third cleaning chemical solution. Note that delay times Δt1 and Δt2 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds. Thereafter, the third chemical cleaning liquid is supplied as a supply liquid to the first nozzle 421, the second nozzle 422, and the standby unit 423 (see FIGS. 1A and 1B). In other words, in the fifth mode, the chemical liquid supply device 100 can supply the third chemical cleaning liquid as a supply liquid to the substrate cleaning apparatus 400. Thereafter, when the control device 320 ends the operation in the fifth mode at time t2, the control device 320 closes the valves 112, 122, 142, 151, 158, and 155, and the cleaning system 500 returns to the standby state.

[0058] 4E, the control device 320 opens all of the valves 151, 158, and 155. However, in another embodiment according to the present disclosure, the control device 320 does not need to perform such control. The control device 320 may open any of the valves 151, 158, and 155 as needed.

[0059] Furthermore, in the fifth mode, the control device 320 opens the valve 112, and then opens the valves 122 and 142. As a result, the water that has passed through the dilution water pipe 203 is first supplied to the first nozzle 421, the second nozzle 422, and the standby section 423. In other words, the control device 320 controls the valves 112, 122, and 142 so that the water that has passed through the dilution water pipe 203 is first supplied to the substrate cleaning apparatus 400. As a result, the chemical liquid supplying apparatus 100 supplies at least one of the first chemical liquid and the second chemical liquid that has not been diluted with water to the substrate. This can prevent the substrate W from being damaged by being supplied to the plate W.

[0060] <Flushing operation> Furthermore, the control device 320 is configured to be operable in at least a first flushing mode, a second flushing mode, and a third flushing mode. The three flushing modes of the control device 320 will be described with reference to Figures 1A, 1B, and 5A to 5C.

[0061] (First flushing mode) 5A is a time chart showing the timing of opening and closing each valve when control device 320 operates in the first flushing mode. The first flushing mode is a mode in which first chemical liquid piping 240 and its downstream are cleaned by flowing water through first chemical liquid piping 240. As shown in FIG. 5A, before control device 320 operates in the first flushing mode, cleaning system 500 is in a standby state.

[0062] First, in the first flushing mode, cleaning of first chemical liquid pipe 240 is started at time t1. More specifically, at time t1, control device 320 opens valves 122, 151, 158, and 155. Next, after a delay time Δt1 from time t1, control device 320 closes valve 172. Next, after a delay time Δt2 (an example of a first delay time) from the closing of valve 172, control device 320 opens valve 174. As a result, the liquid in first chemical liquid pipe 240 and cleaning chemical liquid supply pipe 260 is replaced with water, and the inside of first chemical liquid pipe 240 and the inside of cleaning chemical liquid supply pipe 260 are cleaned (see FIG. 1A ). Note that delay times Δt1 and Δt2 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0063] Next, in the first flushing mode, at time t2, the process of ending cleaning of the first chemical liquid pipe 240 is started. More specifically, at time t2, the control device 320 closes valves 174, 122, 151, 158, and 155. Next, after a delay time Δt3 (an example of a second delay time) from time t2, the control device 320 opens valve 172. This stops the water flowing through the first chemical liquid pipe 240 and the cleaning chemical liquid supply pipe 260, and the cleaning system 500 returns to the standby state. Note that the delay time Δt3 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0064] As described above, in the first flushing mode, the valve 174 is opened after the delay time Δt2 from the closing of the valve 172. This prevents the occurrence of errors that may occur in the flow control device 121. Below, we will explain errors that may occur in the flow control device 121 and the reasons why these errors are prevented.

[0065] When the chemical liquid supply device 100 is miniaturized, the distance between each component is shortened. This shortens the distance between the valve 172 and the flow control device 121, reducing the volume of the piping in this section (see FIG. 1A ). Therefore, when the valve 172 is closed and the valve 174 is opened at the same time, the impact of the closure of the valve 172 is transmitted to the small volume of the piping between the valve 172 and the flow control device 121, and water flows in from the valve 174. As a result, the pressure in this section of the piping may suddenly spike. That is, the detection value of the flowmeter 1112 of the flow control device 121 adjacent to this section may overshoot, potentially resulting in a pressure upper limit error. Given the small volume of the piping in an integrated module, the inflow of a few cc of liquid may cause a sudden pressure increase. For these reasons, the flow control device 121 may potentially generate a pressure upper limit error.

[0066] In contrast, in the chemical solution supplying device 100, the valve 174 is opened after a delay time Δt2 from the closing of the valve 172. In this way, when a predetermined delay time Δt2 is provided between the closing timing of the valve 172 and the opening timing of the valve 174, the pressure increase in the piping between the valve 172 and the flow control device 121 due to the closure of the valve 172 is released downstream from the flow control valve 1211 of the flow control device 121 during the delay time Δt2. As a result, a sudden rise in pressure in this section of the piping is prevented. In other words, the occurrence of an upper limit pressure error in the flow control device 121 is prevented.

[0067] Furthermore, by providing the delay time Δt2, valve 174 opens after valve 172 is reliably closed. This reliably eliminates the period during which valves 172 and 174 are simultaneously open, and prevents water from valve 174 from flowing back upstream of valve 172.

[0068] Furthermore, if delay time Δt3 is not set during the process of terminating the cleaning of first chemical liquid piping 240, a similar error may occur. That is, when valve 174 closes and valve 172 opens, the pressure in the piping between valve 172 and flow control device 121 may rise, causing an upper pressure limit error in flow meter 1112 of flow control device 121.

[0069] However, in the chemical liquid supplying apparatus 100, a delay time Δt3 is set. That is, the valve 172 is opened after the delay time Δt3 has elapsed since the closing of the valve 174. Therefore, in the chemical liquid supplying apparatus 100, the occurrence of an upper limit pressure error in the flow meter 1112 of the flow control device 121 is suppressed even during the process of ending the cleaning of the first chemical liquid piping 240.

[0070] (Second flushing mode) 5B is a time chart showing the timing of opening and closing each valve when the control device 320 operates in the second flushing mode. The second flushing mode is a mode in which the second chemical liquid piping 242 and its downstream are cleaned by flowing water through the second chemical liquid piping 242. As shown in FIG. 5B, before the control device 320 operates in the second flushing mode, the cleaning system 500 is in a standby state.

[0071] First, in the second flushing mode, cleaning of second chemical liquid pipe 242 is started at time t1. More specifically, at time t1, control device 320 opens valves 142, 151, 158, and 155. Next, after a delay time Δt1 from time t1, control device 320 closes valve 182. Next, after a delay time Δt2 (an example of a third delay time) from the closing of valve 182, control device 320 opens valve 184. As a result, the liquid in second chemical liquid pipe 242 and cleaning chemical liquid supply pipe 260 is replaced with water, and the inside of second chemical liquid pipe 242 and the inside of cleaning chemical liquid supply pipe 260 are cleaned (see FIG. 1A ). Note that delay times Δt1 and Δt2 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0072] Next, in the second flushing mode, at time t2, the process of ending cleaning of the second chemical liquid pipe 242 is started. More specifically, at time t2, the control device 320 closes valves 184, 142, 151, 158, and 155. Next, after a delay time Δt3 (an example of a fourth delay time) from time t2, the control device 320 opens valve 182. This stops water flowing through the second chemical liquid pipe 242 and the cleaning chemical liquid supply pipe 260, and the cleaning system 500 returns to the standby state. Note that the delay time Δt3 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0073] As described above, in the second flushing mode, the valve 174 is opened after the delay time Δt2 from the closing of the valve 172. As a result, the pressure that may be generated in the flow rate control device 141 The occurrence of an upper limit error is prevented. Furthermore, water from valve 184 is prevented from flowing back upstream of valve 182. The reasons why these problems are prevented are the same as those in the first flushing mode, and therefore will not be explained here.

[0074] Furthermore, in the second flushing mode, a delay time Δt3 is set. Therefore, in the chemical liquid supplying device 100, the occurrence of an upper limit pressure error in the flow meter 1112 of the flow control device 141 is suppressed even during the process of ending cleaning of the second chemical liquid pipe 242. The reason why this problem is suppressed is the same as in the first flushing mode, and therefore the explanation thereof will be omitted.

[0075] (Third flushing mode) 5C is a time chart showing the timing of opening and closing each valve when control device 320 operates in the third flushing mode. The third flushing mode is a mode in which first chemical liquid pipe 240, second chemical liquid pipe 242, and the downstream of these pipes are cleaned by flowing water through first chemical liquid pipe 240 and second chemical liquid pipe 242. As can be seen from FIG. 5C, the operation of control device 320 in the third flushing mode is the same as the mode in which control device 320 performs the operation of control device 320 in the first flushing mode and then performs the operation of control device 320 in the second flushing mode. The operation of control device 320 in the third flushing mode will be described in more detail below.

[0076] First, in the third flushing mode, cleaning of first chemical liquid pipe 240 is started at time t1. More specifically, at time t1, control device 320 opens valves 122, 151, 158, and 155. Next, after a delay time Δt1 from time t1, control device 320 closes valve 172. Next, after a delay time Δt2 from the closing of valve 172, control device 320 opens valve 174. As a result, the liquid in first chemical liquid pipe 240 and cleaning chemical liquid supply pipe 260 is replaced with water, and the inside of first chemical liquid pipe 240 and the inside of cleaning chemical liquid supply pipe 260 are cleaned (see FIG. 1A ). Note that delay times Δt1 and Δt2 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0077] Next, in the third flushing mode, at time t2, the process of ending the cleaning of first chemical liquid pipe 240 is started. More specifically, at time t2, control device 320 closes valve 174, valve 122, valve 151, valve 158, and valve 155. Next, after a delay time Δt3 from time t2, control device 320 opens valve 172. This stops the water flowing through first chemical liquid pipe 240 and cleaning chemical liquid supply pipe 260. Note that delay time Δt3 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0078] Next, in the third flushing mode, cleaning of second chemical liquid pipe 242 begins at time t3. More specifically, at time t3, control device 320 opens valves 142, 151, 158, and 155. Next, after a delay time Δt4 from time t3, control device 320 closes valve 182. Next, after a delay time Δt5 from the closing of valve 182, control device 320 opens valve 184. As a result, the liquid in second chemical liquid pipe 242 and cleaning chemical liquid supply pipe 260 is replaced with water, and the inside of second chemical liquid pipe 242 and the inside of cleaning chemical liquid supply pipe 260 are cleaned (see FIG. 1A ). Note that delay times Δt4 and Δt5 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0079] Next, in the third flushing mode, the process of ending the cleaning of the second chemical liquid pipe 242 starts at time t4. More specifically, at time t4, the control device 320 closes the valves 184, 142, 151, 158, and 155. Next, after a delay time Δt6 from time t4, the control device 320 opens the valve 182. This stops the water flowing through the second chemical liquid pipe 242 and the cleaning chemical liquid supply pipe 260, and the cleaning system The system 500 returns to the standby state. The delay time Δt6 may be 0.1, 0.2, 0.3, 0.4, or 0.5 seconds.

[0080] In the third flushing mode, control device 320 operates in this manner. Therefore, in the third flushing mode, the inside of first chemical liquid pipe 240, the inside of second chemical liquid pipe 242, and the inside of cleaning chemical liquid supply pipe 260 are cleaned with water.

[0081] <Cleaning System 502> Next, reference is made to FIG. 6. FIG. 6 is a chemical fluid circuit diagram of a cleaning system 502 according to another embodiment, which is different from the cleaning system 500. As shown in FIG. 6, the cleaning system 502 includes a chemical liquid supplying apparatus 102 and a substrate cleaning apparatus 400. That is, the substrate cleaning apparatus 400 included in the cleaning system 502 is the same as the substrate cleaning apparatus 400 included in the cleaning system 500 described above. Therefore, a description of the substrate cleaning apparatus 400 will be omitted. The chemical liquid supplying apparatus 102 also differs from the chemical liquid supplying apparatus 100 in that it includes a flow rate control device (second supply amount control device) 157 and does not include the flow meter 154 included in the chemical liquid supplying apparatus 100. The following description of the chemical liquid supplying apparatus 102 will focus on the parts that are different from the chemical liquid supplying apparatus 100, and the same reference numerals will be used in the drawings to omit the description of the common components.

[0082] As described above, the chemical liquid supplying apparatus 102 includes a flow rate control device (an example of a second supply amount control device) 157. The flow rate control device 157 is attached to the second pipe 263. The flow rate control device 157 is configured to perform feedback control based on the flow rate of the supply liquid in the second pipe 263 so that the flow rate of the supply liquid flowing through the second pipe 263 becomes a set flow rate. This allows the chemical liquid supplying apparatus 102 to supply the supply liquid to the second nozzle 422 (see FIG. 1B) at a set flow rate.

[0083] Furthermore, the cleaning system 502 can operate in the same manner as the cleaning system 500. Therefore, a description of the operation of the cleaning system 502 will be omitted.

[0084] [Note] A part or all of the above-described embodiments can be described as, but not limited to, the following supplementary notes.

[0085] (Appendix 1) The chemical liquid supply device according to Supplementary Note 1 is a chemical liquid supply device for supplying a supply liquid to an external device, and includes a junction, a dilution water pipe for supplying water to the junction, a first chemical liquid pipe for supplying a first chemical liquid to the junction, a second chemical liquid pipe for supplying a second chemical liquid to the junction, a first valve attached to the dilution water pipe, a second valve attached to the first chemical liquid pipe, a third valve attached to the second chemical liquid pipe, a cleaning chemical liquid supply pipe located downstream of the junction and for supplying the supply liquid to the external device, and a control device operable in a first mode, a second mode, a third mode, a fourth mode, and a fifth mode, The control device controls the first valve, the second valve, and the third valve so that in a first mode, only the first chemical liquid is supplied to the external device as the supply liquid, in a second mode, only the second chemical liquid is supplied to the external device as the supply liquid, in a third mode, a first cleaning chemical liquid obtained by mixing the first chemical liquid and the water is supplied to the external device as the supply liquid, in a fourth mode, a second cleaning chemical liquid obtained by mixing the second chemical liquid and the water is supplied to the external device as the supply liquid, and in a fifth mode, a third cleaning chemical liquid obtained by mixing the first chemical liquid, the second chemical liquid, and the water is supplied to the external device as the supply liquid.

[0086] The chemical liquid supply device according to Supplementary Note 1 supplies, as supply liquids, a first chemical liquid, a second chemical liquid, a first cleaning chemical liquid, a second The second and third cleaning chemical liquids can be supplied to an external device. That is, this chemical liquid supplying device can supply liquids other than cleaning liquids obtained by diluting any two types of chemical liquids with pure water to an external device.

[0087] (Appendix 2) The chemical liquid supply device according to Supplementary Note 2 is the chemical liquid supply device according to Supplementary Note 1, and comprises a dilution water control device attached to the dilution water piping for feedback-controlling the flow rate of water supplied to the junction to a set flow rate, a first chemical liquid control device attached to the first chemical liquid piping for feedback-controlling the flow rate of the first chemical liquid supplied to the junction to a set flow rate, and a second chemical liquid control device attached to the second chemical liquid piping for feedback-controlling the flow rate of the second chemical liquid supplied to the junction to a set flow rate.

[0088] (Appendix 3) The chemical liquid supply device according to Supplementary Note 3 is the chemical liquid supply device according to Supplementary Note 1 or 2, wherein the cleaning chemical liquid supply pipe has an upstream pipe that forms a flow path from the confluence point to the branch point, a first pipe that forms a flow path from the branch point to a first nozzle, and a second pipe that forms a flow path from the branch point to a second nozzle.

[0089] The chemical liquid supplying device according to Supplementary Note 3 can supply the supply liquid to the first nozzle and the second nozzle.

[0090] (Appendix 4) The chemical liquid supplying device according to Supplementary Note 4 is the chemical liquid supplying device according to Supplementary Note 3, and includes a first supply amount control device attached to the first piping for feedback-controlling the flow rate of the liquid supplied to the first nozzle to a set flow rate, and a second supply amount control device attached to the second piping for feedback-controlling the flow rate of the liquid supplied to the second nozzle to a set flow rate.

[0091] (Appendix 5) The chemical liquid supply device of Appendix 5 is the chemical liquid supply device described in any one of Appendixes 1 to 4, wherein the control device controls the first valve, the second valve, and the third valve in the third mode, the fourth mode, and the fifth mode so that water that has passed through the dilution water piping is first supplied to the external device.

[0092] The chemical liquid supply device according to Supplementary Note 5 can supply water passing through the dilution water pipe to the external device before the chemical liquid when the control device operates in the third mode, the fourth mode, and the fifth mode.

[0093] (Appendix 6) The chemical liquid supplying device according to Supplementary Note 6 is the chemical liquid supplying device according to Supplementary Note 1, and includes a first chemical liquid control device attached to the first chemical liquid piping for feedback control of the flow rate of the first chemical liquid supplied to the junction to be a set flow rate, a fourth valve for controlling the supply of the first chemical liquid to the first chemical liquid control device, and a fifth valve for controlling the supply of water to the first chemical liquid control device, wherein the control device controls the fourth valve and the fifth valve so as to close the fourth valve when cleaning of the first chemical liquid piping starts and open the fifth valve a first delay time after the fourth valve is closed.

[0094] The chemical liquid supply device according to Supplementary Note 6 can clean the inside of the first chemical liquid piping and the inside of the cleaning chemical liquid supply piping with water. Furthermore, this chemical liquid supply device can prevent the first chemical liquid control device from generating an upper limit pressure error when cleaning of the first chemical liquid piping starts.

[0095] (Appendix 7) The chemical liquid supplying device according to Supplementary Note 7 is the chemical liquid supplying device according to Supplementary Note 6, wherein the control device controls the fourth valve and the fifth valve so as to close the fifth valve when cleaning of the first chemical liquid piping is completed and open the fourth valve a second delay time after the fifth valve is closed.

[0096] The chemical liquid supplying device according to Supplementary Note 7 can prevent the first chemical liquid control device from generating an upper limit pressure error when cleaning of the first chemical liquid pipe is completed.

[0097] (Appendix 8) The chemical liquid supplying device according to Supplementary Note 8 is the chemical liquid supplying device according to Supplementary Note 7, and further comprises: a second chemical liquid control device attached to the second chemical liquid piping for feedback control of the flow rate of the second chemical liquid supplied to the junction to a set flow rate; a sixth valve for controlling the supply of the second chemical liquid to the second chemical liquid control device; and a seventh valve for controlling the supply of water to the second chemical liquid control device, wherein the control device controls the sixth valve and the seventh valve so as to close the sixth valve when cleaning of the second chemical liquid piping starts and open the seventh valve a third delay time after the sixth valve is closed, and close the seventh valve when cleaning of the second chemical liquid piping is completed and open the sixth valve a fourth delay time after the seventh valve is closed.

[0098] The chemical liquid supply device according to Supplementary Note 8 can clean the inside of the second chemical liquid piping and the inside of the cleaning chemical liquid supply piping with water. Furthermore, this chemical liquid supply device can prevent the second chemical liquid control device from generating an upper limit pressure error when cleaning of the second chemical liquid piping starts. Furthermore, this chemical liquid supply device can prevent the second chemical liquid control device from generating an upper limit pressure error when cleaning of the second chemical liquid piping ends.

[0099] (Appendix 9) The cleaning system according to Appendix 9 is a cleaning system comprising the chemical liquid supply device according to Appendix 3 and a substrate cleaning device for cleaning a substrate, wherein the substrate cleaning device has the first nozzle and the second nozzle, the first nozzle configured to supply the supply liquid to a first surface of the substrate, and the second nozzle configured to supply the supply liquid to a second surface behind the first surface of the substrate.

[0100] In the cleaning system according to Supplementary Note 9, the chemical liquid supply device can supply liquids other than the cleaning liquid obtained by diluting any two types of chemical liquids with pure water to the substrate cleaning device.

[0101] (Appendix 10) The liquid supply method according to Supplementary Note 10 is a liquid supply method using the chemical liquid supply device described in any one of Supplementary Notes 1 to 8, and includes a step in which the chemical liquid supply device supplies at least one of the first chemical liquid, the second chemical liquid, the first cleaning chemical liquid, the second cleaning chemical liquid, and the third cleaning chemical liquid to the external device.

[0102] The chemical liquid supplying method according to Supplementary Note 10 can supply liquids other than the cleaning liquid obtained by diluting any two types of chemical liquids with pure water to an external device.

[0103] Although the embodiments of the present invention and various modifications thereof have been described above, it goes without saying that the above examples are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention can be appropriately modified and improved without departing from the spirit of the invention, and equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-mentioned problems or achieving at least part of the effects. [Explanation of symbols]

[0104] 100, 102: Chemical liquid supply device 108: Supply module 111: Flow control device (dilution water control device) 112: Valve (first valve) 121: Flow control device (first chemical liquid control device) 122: Valve (second valve) 123: Mixer 141: Flow control device (second chemical liquid control device) 142: Valve (third valve) 152: Flow rate control device (first supply amount control device) 157: Flow rate control device (second supply amount control device) 172: Valve (4th valve) 174: Valve (5th valve) 182: Valve (6th valve) 184: Valve (7th valve) 203: Dilution water piping 207:Flushing water piping 208:Flushing water piping 240: First chemical liquid piping 242: Second chemical liquid piping 260: Cleaning chemical supply pipe 261: Upstream piping 262: First piping 263: Second piping 264: Third piping 271: Divergence point 300: Air control device 320: Control device 400: Substrate cleaning equipment 418: Cleaning module 421: No. 1 nozzle 422: Second nozzle 500, 502: Cleaning system M: Confluence W: Substrate

Claims

1. A chemical liquid supply device for supplying a supply liquid to an external device, The confluence and a dilution water pipe for supplying water to the confluence; a first chemical liquid pipe for supplying a first chemical liquid to the junction; a second chemical liquid pipe for supplying a second chemical liquid to the junction; a first valve attached to the dilution water piping; a second valve attached to the first chemical liquid pipe; a third valve attached to the second chemical liquid pipe; a cleaning chemical liquid supply pipe located downstream of the junction for supplying the supply liquid to the external device; a control device operable in a first mode, a second mode, a third mode, a fourth mode, and a fifth mode; Equipped with The control device In the first mode, only the first chemical solution is supplied to the external device as the supply liquid, In the second mode, only the second chemical liquid is supplied to the external device as the supply liquid, In a third mode, a first cleaning chemical liquid obtained by mixing the first chemical liquid and the water is supplied to the external device as the supply liquid, In a fourth mode, a second cleaning chemical liquid obtained by mixing the second chemical liquid and the water is supplied to the external device as the supply liquid, In the fifth mode, a third cleaning chemical liquid obtained by mixing the first chemical liquid, the second chemical liquid, and the water is supplied to the external device as the supply liquid. Controlling the first valve, the second valve, and the third valve. Chemical liquid supply device.

2. The chemical solution supply device according to claim 1, a dilution water control device attached to the dilution water piping for feedback control of the flow rate of water supplied to the junction so that the flow rate becomes a set value; a first chemical liquid control device attached to the first chemical liquid pipe for feedback control of the flow rate of the first chemical liquid supplied to the junction so that the flow rate becomes a set flow rate; a second chemical liquid control device attached to the second chemical liquid pipe for feedback control of the flow rate of the second chemical liquid supplied to the junction so that the flow rate becomes a set flow rate; Equipped with Chemical liquid supply device.

3. The chemical solution supply device according to claim 1, The cleaning chemical liquid supply pipe is an upstream pipe that configures a flow path from the confluence point to the branch point; a first pipe that forms a flow path from the branch point to a first nozzle; a second pipe that forms a flow path from the branch point to a second nozzle; having Chemical liquid supply device.

4. The chemical solution supply device according to claim 3, a first supply amount control device attached to the first pipe for feedback control of the flow rate of the liquid supplied to the first nozzle so that the flow rate becomes a set flow rate; a second supply amount control device attached to the second pipe for feedback control of the flow rate of the liquid supplied to the second nozzle so that the flow rate becomes a set flow rate; Equipped with Chemical liquid supply device.

5. The chemical solution supply device according to claim 1, The control device controls the first valve, the second valve, and the third valve in the third mode, the fourth mode, and the fifth mode so that the water that has passed through the dilution water piping is first supplied to the external device. Chemical liquid supply device.

6. The chemical solution supply device according to claim 1, a first chemical liquid control device attached to the first chemical liquid pipe for feedback control of the flow rate of the first chemical liquid supplied to the junction so that the flow rate becomes a set flow rate; a fourth valve that controls the supply of the first chemical liquid to the first chemical liquid control device; a fifth valve that controls the supply of water to the first chemical liquid control device; Equipped with The control device When cleaning of the first chemical liquid pipe starts, the fourth valve is closed, and the fifth valve is opened after a first delay time has elapsed since the fourth valve was closed. Controlling the fourth valve and the fifth valve. Chemical liquid supply device.

7. The chemical solution supply device according to claim 6, The control device When cleaning of the first chemical liquid pipe is completed, the fifth valve is closed, and the fourth valve is opened after a second delay time has elapsed since the fifth valve was closed. Controlling the fourth valve and the fifth valve. Chemical liquid supply device.

8. The chemical solution supply device according to claim 7, a second chemical liquid control device attached to the second chemical liquid pipe for feedback control of the flow rate of the second chemical liquid supplied to the junction so that the flow rate becomes a set flow rate; a sixth valve that controls the supply of the second chemical liquid to the second chemical liquid control device; a seventh valve that controls the supply of water to the second chemical liquid control device; Equipped with The control device When cleaning of the second chemical liquid pipe starts, the sixth valve is closed, and the seventh valve is opened after a third delay time has elapsed since the sixth valve was closed; When cleaning of the second chemical liquid pipe is completed, the seventh valve is closed, and the sixth valve is opened after a fourth delay time has elapsed since the seventh valve was closed. Controlling the sixth valve and the seventh valve. Chemical liquid supply device.

9. 1. A cleaning system comprising: The chemical solution supply device according to claim 3; a substrate cleaning device for cleaning the substrate; Equipped with the substrate cleaning apparatus includes the first nozzle and the second nozzle, the first nozzle is configured to supply the supply liquid to a first side of the substrate; the second nozzle is configured to supply the supply liquid to a second surface of the substrate that is behind the first surface; Cleaning system.

10. A liquid supplying method using the chemical liquid supplying device according to any one of claims 1 to 8, comprising: the chemical liquid supply device supplies at least one of the first chemical liquid, the second chemical liquid, the first cleaning chemical liquid, the second cleaning chemical liquid, and the third cleaning chemical liquid to the external device; Liquid supply method.

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