Ocular Area Heat Transfer Devices and Associated Systems

Abstract

Wearable heat transfer devices and associated systems and methods are disclosed herein. In some embodiments, an exemplary heat transfer device can include (i) a thermoelectric component (TEC) including a first side configured to be operated at a desired temperature and a second side opposite the first side, (ii) a thermally conductive contact member thermally coupled to the TEC, and (iii) a heat transfer system configured to dissipate heat from the TEC. The heat transfer system includes a heat transfer structure thermally coupled to the TEC and a heat exchanger thermally coupled to the heat transfer structure.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 266,400, filed January 4, 2022, which is related to U.S. Patent Application No. 17 / 183,313, filed February 23, 2021, entitled "WEARABLE HEAT TRANSFER DEVICES AND ASSOCIATED SYSTEMS AND METHODS," and U.S. Patent Application No. [Attorney Docket No. 135533.8008.US01], filed January 3, 2023, entitled "WEARABLE HEAT TRANSFER DEVICES AND ASSOCIATED SYSTEMS AND METHODS," the disclosures of which are incorporated herein by reference in their entireties.

[0002] The present disclosure relates to a heat transfer device, and associated systems and methods, configured to be worn by a human. In some embodiments, the heat transfer device is configured to be worn around the ocular region of a human. [Background technology]

[0003] Many types of devices and systems produce significant heat flux, and there is a growing demand for advanced and efficient systems that can extract and dissipate such heat flux and keep temperatures within acceptable operating ranges. Many wearable devices, for example, dissipate heat from a target area to reduce pain or swelling, alter tissue structure (e.g., reducing adipose tissue and treating skin disorders), or alleviate localized heating of tissue caused by other procedures (e.g., laser treatments). While wearable devices are desirably lightweight and portable, this presents a challenge for dissipating the significant heat flux required in many applications. As a result, a significant gap exists between the heat transfer performance required for many applications and that of existing devices and systems. For example, current heat transfer systems are often too large and heavy to provide adequate heating or cooling for controlling swelling and other post-surgical applications. Thus, such systems can be cumbersome and uncomfortable on wearable devices, and they are often too large and unable to work with the complex contours of certain anatomical features. Furthermore, thermal therapy applications for more sensitive areas, such as the tissue under the eye, are limited and often unable to provide consistent active cooling treatment for the required time duration needed to freeze and kill the corresponding fat cells. As a result, a need exists for improved wearable heat transfer devices. Summary of the Invention [Means for solving the problem]

[0004] I. Overview Heat transfer devices generally have the potential for efficient thermal management of high heat flux operations and may be useful in treating different regions of the body. For example, cooling human tissue in the facial or ocular region, and more specifically, in the tissues under the eyes, can be an effective treatment for common eye problems, including under-eye puffiness, under-eye bags, dark circles, and sunken eyes, among other known problems. For example, eye puffiness, which is the result of periorbital edema and causes fluid accumulation under the eyes, can be treated by cooling the area and reducing inflammation. Under-eye bags, which are the result of under-eye fat accumulation, can be treated by a procedure known as cryolipolysis, which applies temperatures below 5°C to freeze and kill the corresponding fat cells. Dark circles can be eliminated by using cooling to shrink dilated blood vessels under the eye skin, which affects vasoconstriction, constricting the vessels and reducing the appearance of dark circles. Rounded pockets around the eyes occur due to muscle tension caused by prolonged computer and phone work, but cooling the area around the eyes can help relax these muscles and reduce pressure on the eye muscles, thereby eliminating the pockets.

[0005] Existing products for treating these and other problems associated with the ocular region have limited and inadequate applications. The most widely accepted wearable heat transfer devices used to thermally treat such target tissue areas with low temperatures are cold compresses or ice / gel packs, which are often recommended by medical facilities. However, cold compresses have significant drawbacks, including (i) a lack of temperature control to which the tissue is exposed; (ii) a limited capacity for cooling or a limited ability to cool for the required duration; (iii) an inability to provide sustained cold therapy without adjusting or caring for the device; and (iv) a lack of flexibility of the device, for example, due to the rigidity of ice packs, which can result in an uncomfortable fit for the user or person. This last drawback is further exacerbated by the inflexible and bulky nature of the device, which prevents a conformal fit and can limit the amount of heat transfer between the device and the person, making contact with the under-eye area difficult, unreliable, and inefficient. As a result, these and other wearable devices for treating the face or ocular area are inappropriate and generally ineffective at treating the underlying condition (e.g., pain, swelling, overheating, reduced blood perfusion, etc.).

[0006]

[0004] Embodiments of the present disclosure address at least some of the problems described above by providing thermal management and / or heat transfer devices and systems that, among other features, enable better temperature control and improved thermal contact between the device and a human, e.g., by being more flexible, lighter, and thinner than current related devices. For example, as described in additional detail herein, embodiments of the present disclosure can include a heat transfer device including: (i) a thermoelectric component (TEC) including a first side configured to operate at a first temperature and a second side opposite the first side configured to operate at a second temperature above the first temperature; (ii) a contact member thermally coupled to the TEC; and (iii) a heat transfer system configured to dissipate heat from the TEC. The heat transfer system can include a heat transfer structure thermally coupled to the TEC, a low-temperature fluid passage fluidly coupled to the heat transfer structure, a high-temperature fluid passage fluidly coupled to the heat transfer structure, and a heat exchanger (e.g., an air-cooled heat exchanger) thermally coupled to the heat transfer structure. The contact members, TEC, and heat transfer system can be incorporated onto a rigid frame such that when the rigid frame is worn by a person or user, the contact members are capable of thermally treating a desired target area. By doing so, embodiments of the present disclosure allow target areas on a person to receive rapid and controlled cooling, for example, to treat certain underlying conditions in the ocular region.

[0007] Embodiments of the present disclosure can further include an expandable interface positioned adjacent to the contact member. When expanded, the expandable interface applies pressure toward the contact member, which can allow for better heat transfer between the contact member and the desired area. In some embodiments, the pressure of the expandable interface can be set to maintain a specific contact pressure on the target area or can be varied between alternating pressures during heat treatment to induce a massaging sensation.

[0008] As used herein, the term "thermally coupled" can mean directly or indirectly thermally coupled. For example, a first component and a second component can be thermally coupled to each other despite being spaced apart if heat supplied from the first component is distributed to the second component in some manner. Thus, the term "thermally coupled" should not be limited to requiring that heat emitted from the first component be directly absorbed by the second component.

[0009] In the figures, the same reference numbers generally identify similar and / or identical elements. Many of the details, dimensions, and other features shown in the figures are merely illustrative of particular embodiments of the disclosed technology. Thus, other embodiments may have other details, dimensions, and features without departing from the spirit or scope of the present disclosure. Additionally, those skilled in the art will appreciate that further embodiments of the various disclosed technologies may be practiced without some of the details described below. [Brief explanation of the drawings]

[0010] The features, aspects, and advantages of the techniques of the present disclosure may be better understood with regard to the following drawings.

[0011] [Figure 1A] FIG. 1A is a partial schematic isometric view of a heat transfer device in accordance with an embodiment of the present technology.

[0012] [Figure 1B] FIG. 1B is an exploded view of a portion of the heat transfer device shown in FIG. 1A.

[0013] [Figure 2A] FIG. 2A is a partial schematic cross-sectional view of a portion of a heat-transfer device in accordance with an embodiment of the present technology.

[0014] [Figure 2B] FIG. 2B is a partial schematic isometric view of a portion of the heat transfer device shown in FIG. 2A.

[0015] [Figure 3] FIG. 3 is a partial schematic isometric view of a heat transfer structure of a heat-transfer device, in accordance with an embodiment of the present technology.

[0016] [Figure 4A] 4A and 4B are partial schematic isometric views of a thermoelectric component, in accordance with an embodiment of the present technology. [Figure 4B] 4A and 4B are partial schematic isometric views of a thermoelectric component, in accordance with an embodiment of the present technology.

[0017] [Figure 5] FIG. 5 is a partial schematic side view of a heat transfer device in accordance with an embodiment of the present technology.

[0018] [Figure 6] FIG. 6 is a partial schematic isometric view of a heat-transfer device being worn by a human, in accordance with an embodiment of the present technology.

[0019] [Figure 7] FIG. 7 is a partial schematic side view of a heat transfer device in accordance with an embodiment of the present technology.

[0020] [Figure 8] FIG. 8 is a partial schematic isometric view of a heat-transfer device configured to be worn by a human, in accordance with an embodiment of the present technology.

[0021] [Figure 9] FIG. 9 is an enlarged, partially schematic, cross-sectional isometric view of a portion of the heat transfer device shown in FIG.

[0022] [Figure 10] FIG. 10 is a partial schematic side view of a heat transfer device in accordance with an embodiment of the present technology.

[0023] [Figure 11]FIG. 11 is a partial schematic isometric view of a heat-transfer device configured to be worn by a human, in accordance with an embodiment of the present technology.

[0024] [Figure 12] FIG. 12 is an enlarged, partially schematic, cross-sectional isometric view of a portion of the heat transfer device shown in FIG.

[0025] [Figure 13A] FIG. 13A is a partial schematic side view of a heat-transfer device in accordance with an embodiment of the present technology.

[0026] [Figure 13B] FIG. 13B is a partial schematic cross-sectional view of the heat transfer structure shown in FIG. 13A.

[0027] [Figure 14A] 14A and 14B are partial schematic isometric views of a heat-transfer device configured to be worn by a human, in accordance with an embodiment of the present technology. [Figure 14B] 14A and 14B are partial schematic isometric views of a heat-transfer device configured to be worn by a human, in accordance with an embodiment of the present technology.

[0028] [Figure 15] FIG. 15 is a partial schematic front view of a heat-transfer device being worn by a human in accordance with an embodiment of the present technology.

[0029] [Figure 16] FIG. 16 is a partial schematic isometric view of the ocular device shown in FIG.

[0030] [Figure 17] FIG. 17 is a partial schematic cross-sectional top view of a heat-transfer device in accordance with an embodiment of the present technology.

[0031] [Figure 18A]FIG. 18A is a partial schematic isometric view of a heat-transfer device being worn by a human in accordance with an embodiment of the present technology.

[0032] [Figure 18B] FIG. 18B is a partial schematic cross-sectional view of the heat-transfer device shown in FIG. 18A.

[0033] [Figure 18C] FIG. 18C is a partial schematic side view of the heat-transfer device shown in FIGS. 18A and 18B in accordance with an embodiment of the present technology.

[0034] [Figure 19] FIG. 19 is a partial schematic isometric view of a heat-transfer device being worn by a human in accordance with an embodiment of the present technology.

[0035] [Figure 20] FIG. 20 is a schematic block diagram illustrating a system including a heat transfer device in accordance with an embodiment of the present technology.

[0036] [Figure 21] FIG. 21 is a flow diagram illustrating a method for thermally treating a human via a heat-transfer device in accordance with an embodiment of the present technology.

[0037] Those skilled in the art will appreciate that the features shown in the drawings are for illustrative purposes and that variations, including different and / or additional features and arrangements thereof, are possible. DETAILED DESCRIPTION OF THE INVENTION

[0038] II. HEAT TRANSFER DEVICES AND ASSOCIATED SYSTEMS AND METHODS 1A is a partial schematic cross-sectional side view of a heat-transfer device 100 ("device 100") configured to be placed on a portion of a mammal or human 10 ("human 10"), and FIG. 1B is an enlarged partial schematic cross-sectional isometric view of a portion of device 100. Referring to both FIGS. 1A and 1B, device 100 includes (i) a contact member 105 on a portion or target area of ​​human 10 (e.g., skin, tissue, head, face, or other body part area), (ii) a thermoelectric component or module 110 ("TEC 110") on contact member 105 and thermally coupled to human 10, and (iii) a heat-transfer system 115 thermally coupled to TEC 110 and configured to remove heat therefrom. The heat transfer system 115 can be a closed-loop system and can include: (i) a heat transfer structure 120 above and thermally coupled to the TEC 110; (ii) a heat exchanger 150; (iii) a cooling or second fluid distribution passage 130 (“cold fluid passage 130”) (e.g., conduits, tubing, or piping) configured to direct a cooled working fluid toward the TEC 110 and away from the heat exchanger 150; and (iv) a heating or first fluid distribution passage 140 (“hot fluid passage 140”) (e.g., conduits, tubing, or piping) configured to direct a heated working fluid away from the TEC 110 toward the heat exchanger 150 (e.g., for cooling). The heat exchanger 150 can passively or actively (e.g., via a fan or separate cooling source) cooled and remove heat (Q) provided via the heated working fluid. As described in additional detail herein, heat transfer system 115 can include a single-phase heat transfer system or a two-phase heat transfer system (e.g., an evaporative cooling system or a pool boiling system). For embodiments including a two-phase heat transfer system, heat transfer structure 120 can be an evaporator, the heated working fluid can be a vapor, the cooled working fluid can be a liquid, and heat exchanger 150 can be a condenser.

[0039] 1A , device 100 further includes a controller 160, a power source 165 in electrical communication with TEC 110 and configured to be controlled by controller 160, a user interface 170 in electrical communication with controller 160, and one or more temperature sensors 180 in electrical communication with controller 160. In operation, controller 160 adjusts the amount of current sent from power source 165 to TEC 110 based on a desired set temperature for TEC 110 configured to heat and / or cool a target area of ​​human 10. Temperature sensor 180 can be positioned to detect the temperature of the target area of ​​human 10 and provide feedback to controller 160 to determine any deviation from the desired temperature, which controller 160 can use to make necessary adjustments to the current provided to TEC 110. When device 100 is in a cooling mode, for example, heat is transferred from human 10 to contact members 105, individual TECs 110, and heat transfer system 115. As heat is removed from the human 10 in such a manner, a cooling zone may form on the target area and extend to a cooling depth in the human 10, which may be at least 1 millimeter (mm), 2 mm, 3 mm, 4 mm, or 5 mm, or within the range of 1-5 mm or any incremental range thereof (e.g., 1.5 mm or 2.1-3 mm). The cooling zone may correspond to a heating zone when the device 50 is in a heating mode. As discussed in additional detail herein, cooling (or heating) the target area in such a controlled manner may enable the device 100 and other embodiments of the present technology to efficiently thermally treat the target area in a way that current conventional heat transfer devices cannot.

[0040] In some embodiments, the heat transfer system 115 can include one or more pumps, and the flow of the working fluid through the heat transfer system 115 is driven by the pumps. In other embodiments, the flow of the working fluid through the heat transfer system 115 (e.g., a two-phase heat transfer system) is driven by gravity. For example, when driven by gravity, the heat exchanger 150 may be physically positioned above other portions of the heat transfer system 115 (e.g., the heat transfer structure 120) so that gravity can provide sufficient head pressure to circulate the working fluid to the heat transfer structure 120. Additionally or alternatively, as described in more detail herein, the flow of the working fluid through the heat transfer system 115 can be driven by capillary forces induced by microfeatures (e.g., posts, pins, or walls) forming channels present within the chambers of the heat transfer structure that drive the liquid phase of the working fluid from the inlet of the chamber toward the outlet of the chamber. Additionally or alternatively, in some embodiments, heat transfer system 115 includes a buffer vessel or reservoir configured to hold an excess amount of working fluid, e.g., to ensure that the supply of working fluid can be sustained and does not run out. A buffer vessel may be particularly beneficial when device 100 operates at more extreme temperatures (e.g., 45°C, -20°C, etc.). In some embodiments, the buffer vessel and heat exchanger 150 may comprise a single integrated unit.

[0041] The contact members 105 are thermally coupled to each of the TECs 110 and extend between and / or over each of the TECs 110. The contact members 105 may comprise thermally conductive and / or semi-rigid contact members that act as heat spreaders and enhance heat transfer to and / or from the target area of ​​the human 10, at least in the regions between the TECs 110. Additionally or alternatively, the contact members 105 may comprise conductive and / or biocompatible materials, including metals, metal alloys, coatings, polymers, silicones, and / or combinations thereof. In some embodiments, the contact members 105 may comprise a biocompatible adhesive, for example, to retain the device 100 against the target area. In some embodiments, the contact members 105 comprise a metallic sheet or material on a first side of the contact member 105 that contacts the individual TECs 110 and a non-metallic sheet or material on a second, opposing side of the contact member 105 that contacts the human 10. 1A and 1B, the TECs 110 are each disposed on a contact member 105. In some embodiments, the contact members 105 extend only between the TECs 110, and the TECs 110 are disposed directly on (e.g., in direct contact with) the human 10. In some embodiments, the contact members 105 can be omitted entirely, and the TECs 110 are disposed on or directly on the human 10.

[0042] The TEC 110 can comprise semiconductor-based electronic components configured to transfer heat from one side of the TEC 110 to a second, opposing side of the TEC 110. The TEC 110 can provide precise, controllable, and / or localized temperature control at the interface between the target area and the device 100. The TEC 110 can be set by the controller 160 to a specific temperature and / or a predetermined temperature profile (e.g., a constant temperature profile, a temperature cycling profile, and / or a time-based profile) to cool and / or heat the adjacent target area of ​​the human 10. Setting the TEC 110 to a specific temperature, for example, can include providing a current to the TEC 110 via the power supply 165 that corresponds to that temperature.

[0043] In some embodiments, each TEC 110 is individually controlled by the controller 160. For example, each TEC 110 can be controlled independently of the other individual TECs 110, e.g., providing localized and variable control as desired. Thus, when the device 100 is positioned such that the contact members 105 are thermally coupled to the human 10, different regions of the device 100 can be heated and / or cooled at different temperatures depending on the desired therapy for the individual regions. For example, when the device 100 is wrapped around an arm or leg, an individual TEC 110 or groups of TECs 110 adjacent to bony regions may be set to a first temperature, while other TECs 110 or groups of TECs 110 adjacent to more muscular regions may be set to a second temperature (e.g., higher than the first temperature). By doing so, the human 10 can receive a desired therapy only in certain target areas.

[0044] As an example of how the TEC 110 may be operated, in some embodiments, a first side of the TEC 110 facing the human 10 or a second side of the TEC 110 facing the heat transfer structure 120 can be set to a temperature within a range of 45°C to −20°C (e.g., 40°C, 35°C, 20°C, 5°C, 0°C, −5°C, −10°C, −15°C, etc.). In some embodiments, the TEC 110 can be configured, either alone or in combination with the evaporator 120, such that the second side of the TEC 110 is set or maintained at a first temperature or first temperature range and the first side of the TEC 110 is cooled from normal body surface temperature to a second temperature or second temperature range. In such embodiments, the second temperature or second temperature range can be higher or lower than the first temperature or first temperature range (e.g., higher or lower than 5°C, 10°C, 20°C, 30°C, or 40°C). Additionally or alternatively, in response to setting the temperature on the second side of the TEC 110, the first side of the TEC 110 can be configured to reach the desired temperature within a predetermined time, for example, 10 seconds or less, 20 seconds or less, 30 seconds or less, 40 seconds or less, or 60 seconds or less, or any increment range between 10 and 60 seconds. As disclosed herein, operation of the TEC 110 may be based on a signal received from a temperature sensor 180 configured to detect the temperature of a target area, the first side of the TEC 110, or the second side of the TEC 110.

[0045] The TECs 110 can be placed in a heating mode, a cooling mode, or a mode that cycles between cooling and heating to control the temperature in the target area. Heat flow across an individual TEC 110 can be a function of the temperature difference between its two sides and / or the power input provided to the individual TEC 110 from the power source 165. The mode and / or mode of operation can be selected, for example, based on a predetermined cycle time and / or feedback from the temperature sensor 180. When in the heating mode, the TEC 110 can provide heat to the target area of ​​the human 10 by heating a first side of the TEC 110, causing a second side of the TEC 110 to cool (e.g., via the contact member 105). The heat transfer structure 120 can be controlled (e.g., turned off) to mitigate further cooling of the second side of the TEC 110. In some embodiments, the device 100 can further include an additional resistive heater that can be controlled via the controller and configured to heat an adjacent target area of ​​the human 10.

[0046] When in cooling mode, the heat transfer structure 120 is configured to remove heat from the hotter second side of the TEC 110, thereby allowing the opposing first side of the TEC 110 to cool an adjacent target area of ​​the human 10. Thus, in cooling mode, heat flows radially outward from the target area of ​​the human 10 to the TEC 110 and then to the heat transfer structure 120. As described above, the TEC 110 can also cycle between cooling and heating modes, which may improve blood flow and perfusion to the target area. In some embodiments, the parameters of the cooling and / or heating modes are based on or limited by safety considerations, such as a maximum heating or cooling temperature and / or a maximum amount of heating or cooling time (e.g., 15 minutes, 20 minutes, etc.). Additional details regarding individual TECs 110 are provided herein (e.g., with reference to FIGS. 3 and 4).

[0047] As shown in the illustrated embodiment, device 100 includes four separate TECs 110. In other embodiments, the actual number of TECs 110 may be more or less (e.g., 2, 3, 5, 10, 20, 30, or more) depending on the particular end use of device 100 and the heating / cooling capacity requirements needed from device 100. Additionally or alternatively, TECs 110 may be arranged differently than shown in FIGS. 1A and 1B. For example, in addition to individual TECs 110 being arranged in rows, individual TECs 110 may be arranged around a target area (e.g., around the circumference of person 10) or stacked on top of each other to increase the heating and / or cooling capacity of that particular stack of TECs 110. In such an embodiment, a second TEC 110 stacked on top of a first TEC 110 may have one side in contact with the first TEC 110 and another opposing side in contact with heat transfer structure 120. A stacked arrangement of TECs 110 can be particularly beneficial when more extreme temperatures (e.g., below 0°C, -10°C, or -20°C) are desired in the target area of ​​the person 10. This ability to vary the number and arrangement of TECs 110 allows the device 100 to be tailored for a wider variety of end use applications.

[0048] 1A and 1B, the heat transfer structures 120 overlie multiple TECs 110. However, in some embodiments, as described herein, the heat transfer structures 120 overlie a corresponding single TEC 110, and each heat transfer structure 120 is fluidly coupled to a hot fluid passage 140 and a cold fluid passage 130. For example, for each individual heat transfer structure 120, a working fluid is supplied from the cooled distribution passage 130 to an inlet (e.g., one of multiple inlets) of the heat transfer structure 120. As the working fluid flows through the heat transfer structure 120, it absorbs heat from the corresponding TEC 110 and is directed to the hot fluid passage 140 through an outlet 142 (e.g., one of multiple outlets) of the heat transfer structure 120. The hot fluid passage 140 and the cold fluid passage 130 are each fluidly coupled to a heat exchanger 150 and are part of a closed-loop system. The heat exchanger 150 can be spaced away from the heat transfer structure 120 and / or the target area of ​​the human 10 where space is limited. Additionally, spacing the heat exchanger 150 in such a manner can allow the heat exchanger to be larger, thereby allowing for more heat transfer, and / or ensure that the heat exchanger 150 does not interfere with the comfort or fit of the device 100 when worn by the human 10. In some embodiments, the heat exchanger is at the radial periphery of each of the hot and cold fluid passages 140, 130. Additionally, or alternatively, the heat exchanger can be physically above the heat transfer structure 120 so that the working fluid provided from the heat exchanger 150 has additional head pressure, which may beneficially provide better circulation of the working fluid through the heat transfer structure 120.

[0049] 1A and elsewhere herein, the closed-loop system enables embodiments of the present technology to provide improved thermal therapy (e.g., improved cooling) over conventional heat transfer devices. In addition, the closed-loop system of embodiments of the present technology often mitigates problems presented with inferior devices, such as overheating, desiccation, and the like.

[0050] The sensors 180 can be configured to measure desired parameters (e.g., temperature, pressure, etc.) of the contact members 105, the individual TECs 110, and / or the target area. The sensors 180 each communicate with the controller 160 and, via the controller 160, can be used to verify and / or improve the safety, effectiveness, and operation of the device 100 (e.g., prevent overcooling and / or high pressure zones).

[0051] As described above, controller 160 can be configured to operate device 100 in one of a plurality of operating modes (e.g., a cooling mode, a heating mode, or both) and / or provide a process value (e.g., a setpoint temperature) at which device 100 is configured to operate. Controller 160 can provide a setpoint temperature within a range of 40°C to −20°C (e.g., 35°C, 20°C, 0°C, −10°C, etc.) to device 100 such that TEC 110 (e.g., the first or second side of the TEC) is configured to operate at the setpoint temperature. Additionally or alternatively, controller 160 can be configured to receive input from sensors 180 on device 100 and control device 100 based on the received input. For example, controller 160 can determine any abnormalities in device 100 and automatically generate an indication of the abnormality and / or adjust operating parameters of device 100. Additionally or alternatively, the controller 160 may utilize artificial intelligence and / or machine learning to adjust power and / or other control parameters, for example, based on previous treatments used for the same person or group of people.

[0052] User interface 170 may include a display and / or applications or programs that allow person 10 to utilize the device, for example, through a mobile device (e.g., phone, tablet, watch, laptop, etc.) or other computing device. User interface 170 may include pre-programmed thermal management procedures and / or allow person 10 to adjust cooling and heating parameters based on a desired application.

[0053] 2A is a partial schematic cross-sectional view of a portion of heat-transfer device 200 (“device 200”), and FIG. 2B is a cross-sectional isometric view of a portion of device 200. Device 200 can be a two-phase or a single-phase heat-transfer device and generally corresponds to and includes many features similar to or the same as those of device 100 (FIGS. 1A and 1B). For example, as shown in FIG. 2A, device 200 includes the aforementioned contact member 105 and TEC 110, as well as heat-transfer structures 220 (e.g., heat-transfer structures 120), cold fluid passages 230 (e.g., cold fluid passages 130) fluidly coupled to the respective heat-transfer structures 220 via inlet regions 232, and hot fluid passages 240 (e.g., hot fluid passages 140) fluidly coupled to the respective heat-transfer structures 220 via outlet regions 242. The cold fluid path 230 and the hot fluid path 240 are fluidly coupled to a heat exchanger (e.g., heat exchanger 150; FIG. 1A), which is omitted from FIG. 2A. The heat transfer structure 220, the cold fluid path 230, the hot fluid path 240, and other components (e.g., the heat exchanger) together can comprise a heat transfer system. The heat transfer structure 220 and the TEC 110 illustrated in FIG. 2A correspond to a single module, which can be one of the modules of the device 200.

[0054] 1A or 1B. For example, as shown in FIG. 2A, the TEC 110 of device 200 includes a thermoelectric first surface 212 on a first side of the TEC 110 and adjacent the contact member 105, a thermoelectric second surface 216 on a second, opposing side of the TEC 110 and adjacent the heat-transfer structure 220, and thermoelectric legs or posts 214 extending between the first surface 212 and the second surface 216. In some embodiments, the second surface 216 may be omitted, and the legs 214 directly contact the heat-transfer structure 220. As shown in FIG. 2A , the TEC 110 and heat transfer structure 220, the cold fluid passages 230, and the hot fluid passages 240 can have a dimension (D3) of 1 mm or less, 3 mm or less, 5 mm or less, 10 mm or less, 15 mm or less, 25 mm or less, or 30 mm or less, or in the range of 1 millimeter (mm) to 30 mm, or any increment therebetween, and the TEC 110 and heat transfer structure 220 can have a dimension (D4) greater than the dimension (D3) of 1 mm or less, 3 mm or less, 5 mm or less, 10 mm or less, 15 mm or less, 25 mm or less, or 30 mm or less, or in the range of 1 mm to 30 mm, or any increment therebetween.

[0055] In some embodiments, the TEC 110 (e.g., first surface 212, second surface 216, and / or legs 214) can comprise a generally inflexible, rigid material. In such embodiments, it may be desirable to limit the footprint of an individual TEC 110 to ensure that the device 200 (or any other heat transfer device disclosed herein) maintains overall flexibility and can conform to the periphery or geometry of the target area (e.g., the ocular region). That is, by limiting the footprint of the TEC 110, and therefore the rigid portions of the device 200, in such embodiments, the device 200, from, for example, the contact member 105 onwards, has sufficient flexibility to conform to the periphery or geometry of the target area and improve thermal contact between the person 10 and the TEC 110 of the device 200. In some embodiments, the TEC 110 is 2 mm 2 Below, 3mm 2Below, 4mm 2 Below, 5mm 2 Below, 6mm 2 Below, 7mm 2 Below, 8mm 2 or less, or 9mm 2 or less, or 2 to 9 mm 2 or any incremental range therebetween (eg, on the contact member 105).

[0056] In some embodiments, the first surface 212, second surface 216, and / or legs 214 of the individual TEC 110 comprise a flexible material, for example, when the device 200 is worn by the person 10, which can allow the TEC 110 to better conform to the target area. For those embodiments in which the TEC 110 is formed from a rigid material, using a flexible material, for example, for the first surface 212 (i.e., the hot side) of the TEC 110, can allow the TEC 110 to have a larger footprint because the flexibility of the device 200 is no longer limited by the TEC 110. By doing so, a larger thermal TEC 110 can allow for a higher capacity for heat transfer and / or reduce manufacturing costs for the device 200.

[0057] 2A, the heat transfer structure 220 can include a chamber 220, a base substrate or member 222 within the chamber 220, microfeatures 224 protruding from the base member 222, and channels 226 formed between and defined by adjacent ones of the microfeatures 224. The heat transfer structure 220 comprises a monolithic structure (e.g., a single component) and can therefore include a continuous surface extending along the base member 222 and the channels 226. As shown in FIG. 2, a working fluid (WF) can be disposed within the channels 226 and form a meniscus, which is due in part to the properties of the working fluid (WF) and the microfeatures 224, or more specifically, the heat of the microfeatures 224 and the arrangement (e.g., spacing) of the microfeatures 224 relative to one another. Without being bound by theory, the meniscus can form a thin film portion at the interface with adjacent microfeature walls that enhances evaporation and / or heat transfer from the TEC 110 to the heat transfer structure 120 and then to the working fluid (WF) for a two-phase heat transfer system. In operation, the heat and / or alignment of the microfeatures 224 induces capillary forces on the working fluid (WF), causing the liquid to move from an inlet region 232 at a first end of the chamber 220 to an outlet region 242 at a second, opposite end of the chamber 220, where it exits as a heated working fluid (WF) (e.g., vapor or heated liquid). Individual microfeatures 224 can have a lateral dimension (D1) of 5 microns, 10 microns, 20 microns, 50 microns, 100 microns, 200 microns, or 250 microns, or any increment in the range of 5 to 250 microns or therebetween. The microfeatures can be spaced apart from adjacent microfeatures 224 by a lateral dimension (D2) of 5 microns, 50 microns, 10 microns, 200 microns, 400 microns, 500 microns, or 1,000 microns, or in the range of 5 to 1,000 microns.

[0058] 2A , the microfeatures 224 extend from the base member 222 away from the TEC 110. In other embodiments, the heat transfer structure 220 can be positioned in an opposing orientation, with the base member 222 adjacent to the cooled working fluid passage 130 and the microfeatures extending from the base member 222 toward the TEC 110. In such embodiments, the heat transfer structure 220 can include a reservoir adjacent to the TEC 110 containing a working fluid (WF), with end portions of the microfeatures 224 submerged in the working fluid (WF). In operation, the microfeatures 224 induce capillary forces on the liquid working fluid (WF), generating heated working fluid (WF) (e.g., vapor) that escapes from the chamber 220 and collects in the heated working fluid passage 240.

[0059] 2A can be a two-phase or single-phase heat transfer device. When operating as a single-phase heat transfer device, the working fluid remains as a liquid throughout the closed-loop heat transfer system, transitioning between a cooled working fluid provided from the heat exchanger to the heat transfer structure 220 and a heated working fluid provided from the heat transfer structure 220 to the heat exchanger. Thus, when operating as a single-phase heat transfer device, the heated working fluid is supplied to the heated working fluid passage 240 from a liquid reservoir of working fluid within the channel 426 of the heat transfer structure 220.

[0060] FIG. 2B is a cross-sectional isometric view of a portion of the heat-transfer device 200 of FIG. 2A. Only the TEC 110 and heat-transfer structure 220 are shown in FIG. 2B; other elements of the device 200 are omitted for illustrative purposes. As shown in FIG. 2B, the heat-transfer structure 220 includes microfeatures 224 defined by continuous elongated walls that form continuous elongated channels 226 arranged in multiple rows. The channels 226 can be substantially the same as one another and have uniform widths along their lengths. In some embodiments, the channels 226 can have widths that vary along their lengths, for example, becoming narrower as they approach the inlet or outlet of the chamber. Additionally or alternatively, individual channels can differ (e.g., wider or narrower) from adjacent channels. Without being bound by theory, such channel designs can induce additional favorable pressure gradients for liquid working fluid flow.

[0061] In some embodiments, the microfeatures 224 of the heat transfer structure 220 can include different shapes. For example, as shown in Figure 3, which is a cross-sectional view of a portion of the heat transfer structure 320, the heat transfer structure 320 includes microfeatures 324 that are posts or pins arranged in rows and columns or other suitable arrangements that define channels 326 in the spaces between the microfeatures 324. While the pin-type microfeatures 324 shown in Figure 3 have a rectilinear cross-section, in some embodiments, the microfeatures 324 can have circular or other cross-sectional shapes (e.g., hexagonal, octagonal, etc.).

[0062] As described above, the TEC of the heat-transfer device can be flexible and / or comprise a flexible material, which can allow the TEC to flex and better conform to the target area of ​​the human body and provide better heat transfer therefrom. Figures 4A and 4B, which are partial schematic isometric views of a TEC 410, illustrate one such embodiment. The TEC 410 may correspond to the TEC 110 referenced herein. 4A and 4B together, the TEC 410 includes a thermoelectric first surface 412 (e.g., thermoelectric first surface 212; FIG. 2A) on a first side of the TEC 410, a thermoelectric second surface 416 (e.g., thermoelectric second surface 212; FIG. 2A) on a second, opposing side of the TEC 410, and thermoelectric legs or pillars 414 (e.g., thermoelectric pillars 412; FIG. 2A) extending between the first surface 412 and the second surface 416. One or both of the thermoelectric first surface 412 and the thermoelectric second surface 416 can be made of a flexible material and / or be thin enough to have some degree of flexibility. The TEC 410 is electrically connected to a power source via a coupler 430, for example, extending from the first thermoelectric surface 412.

[0063] 4B , which omits the thermoelectric second surface 416 for illustrative purposes, the TEC 410 includes conductive members 420, 422, 424 extending between and electrically coupled to adjacent thermoelectric pillars 414. Conductive member 420 can extend over and between top surfaces of the thermoelectric pillars 414 proximate the thermoelectric second surface 416, conductive member 422 can extend between bottom surfaces of the thermoelectric pillars 414 proximate the thermoelectric surface 416 in a first direction parallel to the row of the thermoelectric pillars 414, and conductive member 424 can extend between bottom surfaces of the thermoelectric pillars 414 proximate the thermoelectric surface 416 in a second direction parallel to the column of the thermoelectric pillars 414. The conductive members 420, 422, 424 may comprise copper (eg, braided copper wire) or other metals that are flexible and conductive.

[0064] The flexibility of the TEC 410, and more specifically, the flexibility of the thermoelectric first surface 412, the thermoelectric second surface 416, and / or the conductive members 420, 422, 424, can allow the TEC 410, and corresponding devices, to generally better conform around contact members (e.g., contact members 105; FIG. 1A ) or components that directly contact a target area on a human. By doing so, the TEC 410 can have better heat transfer with the contact members, and therefore with the target area, relative to a rigid TEC.

[0065] 5 is a partial schematic cross-sectional view of a heat-transfer device 500 (“device 500”) in accordance with an embodiment of the present technology. Device 500 may include a contact member 105 on top of human 10 and a TEC 110 thermally coupled to human 10 on top of contact member 105, as described above. Device 300 may further include a heat transfer system 515 including a heat spreader 505 on top of and thermally coupled to a hot surface of TEC 110, a heat exchanger 550 on top of heat spreader 505, and a fan on top of heat exchanger 550 configured to remove heat from heat exchanger 550. Heat exchanger 550 may include fins or other elongated structures to increase surface area exposure and improve heat transfer. In some embodiments, heat spreader 505 is omitted and heat exchanger 550 is disposed directly on top of TEC 110.

[0066] 6 is a partial schematic isometric view of a heat-transfer device 600 ("device 600") being worn by a human 10, in accordance with an embodiment of the present technology. Device 600 may correspond to device 500 in that all of the components described with reference to FIG. 5 are included within device 600. As shown in FIG. 6, device 600 includes a frame 690 worn by human 10 and additional components mechanically coupled to frame 690 and configured to thermally treat left and right ocular regions of human 10. Device 600 includes a contact member 605 (e.g., contact member 105 (FIG. 1A)) coupled to a frame 690, a TEC 610 (e.g., TEC 110 (FIG. 1A) or TEC 410 (FIG. 4)) thermally coupled to contact member 605, a heat exchanger 650 (e.g., heat exchanger 150 (FIG. 1A) or heat exchanger 550 (FIG. 5)) on top of TEC 610 and configured to remove heat therefrom, a fan 652, a controller 660 (e.g., controller 160), and a power supply 665 (e.g., power supply 165; FIG. 1A) fluidly coupled to heat exchanger 650 via conduit 630. Conduit 630 can indirectly mechanically couple heat exchanger 650, TEC 610, and contact member 605 to frame 690. As indicated by arrow 653, conduit 630 is configured to direct cooling fluid from fan 652 to heat exchanger 650. In some embodiments, fan 652 directs air away from heat exchanger 650 to the ambient environment, thereby drawing heat from heat exchanger 650. Heat exchanger 650, conduit 630, and fan 652 together can comprise a heat transfer system configured to remove and / or dissipate heat from TEC 110.

[0067] In some embodiments, the heat exchanger 650 is mechanically coupled to the frame 690, for example, via a separate mechanical coupler (not shown), such that the heat exchanger 650, the TEC 610, and / or the contact member 605 are movable relative to the frame 690. The contact member 605 is coupled to the frame 690 such that the contact member 605 contacts a target area (e.g., the under-eye area) of the human 10. The contact member 605 can be pivotally coupled to the TEC 610 and / or the heat exchanger 650 such that the human 10 can adjust the position of the contact member 605 independently of the rest of the device 600. By doing so, the human 10 can position the contact member 605 in proximity to the tissue to be thermally treated while also not interfering with the fit or comfort of the frame 690.

[0068] In operation, the controller 660 receives input regarding the desired temperature (e.g., −20° C., −15° C., −10° C., −5° C., 0° C., 5° C., 10° C., or 15° C.) for the cold side of the TEC 610 (i.e., the side of the TEC 610 coupled to the contact member 605) and commands the power supply 665 to deliver a corresponding current to the TEC 610 to enable the desired temperature. As the cold side of the TEC 610 cools to the desired temperature, the hot side (i.e., the opposite side) of the TEC 610 heats up. The heat exchanger 650 removes heat from the hot side of the TEC 610, for example, via conduction, and is cooled via the fan 652. The fan 652 supplies a cooling fluid that absorbs heat from the heat exchanger 650 and is expelled to the ambient environment. The cooling fluid allows the cold surface of the TEC 610 to remain at the desired temperature and cool the target areas of the face and eye region for the desired duration (e.g., at least 10 minutes, 20 minutes, 30 minutes, 45 minutes, 60 minutes, 2 hours, 5 hours, or 10 hours) so that the underlying condition can be appropriately treated.

[0069] 7 is a partial schematic cross-sectional view of a heat-transfer device 700 ("device 700") in accordance with an embodiment of the present technology. Device 700 includes a contact member 105 on a human 10 and a TEC 110 thermally coupled to human 10 on contact member 105, as described above. Device 700 also includes a heat transfer system thermally coupled to TEC 110 and configured to remove heat therefrom. The heat transfer system includes a first heat transfer structure 720a and a second heat transfer structure 720b above and thermally coupled to the TEC 110, a low-temperature fluid passage 730 (e.g., low-temperature fluid passage 130 (FIG. 1A)) extending between the first heat transfer structure 720a and the second heat transfer structure 720b, a high-temperature fluid passage 740 (e.g., high-temperature fluid passage 140 (FIG. 1A)) extending between the first heat transfer structure 720a and the second heat transfer structure 720b, a heat exchanger 750 (e.g., heat exchanger 550 (FIG. 5)), and a fan 752 (e.g., fan 552 (FIG. 5)) above the heat exchanger configured to supply a cooling fluid that absorbs heat from the heat exchanger 650. The low temperature fluid passage 730 is configured to provide cooled working fluid from the second heat transfer structure 720b to the first heat transfer structure 720a, and the high temperature fluid passage 740 is configured to provide heated working fluid from the first heat transfer structure 720a to the second heat transfer structure 720b.

[0070] In operation, cooled working fluid is provided from second heat transfer structure 720b to first heat transfer structure 720a, absorbing heat generated from TEC 110. The resulting heated working fluid is provided to second heat transfer structure 720b via hot fluid passage 740 and cooled via heat exchanger 750. Fan 752 blows air away from heat exchanger 750, thereby drawing heat from heat exchanger 750. The cooled working fluid is provided back to first heat transfer structure 720a as part of a closed-loop heat transfer system that allows TEC 110 to continue cooling contact member 105 and / or human 10 to a desired temperature for a desired duration.

[0071] The first heat transfer structure 720a and the second heat transfer structure 720b (collectively referred to as "heat transfer structures 720a / b") can be similar to or the same as the heat transfer structure 220 (FIGS. 2A and 2B). For example, the heat transfer structures 720a / b can each include a chamber 220, a base substrate or member 222 within the chamber 220, microfeatures 224 (e.g., defined by elongated walls or posts) protruding from the base member 222, and channels 226 formed between and defined by adjacent ones of the microfeatures 224, as described above with reference to FIGS. 2A and 2B. In such an embodiment, with respect to the first heat transfer structure 720a, a cooled working fluid can flow through the channels, absorb heat from the microfeatures and indirectly from the TEC, and become a heated working fluid, which is then directed to the high-temperature fluid passage 740. With respect to the second heat transfer structure 720b, the heated working fluid can flow through the channels, reject heat to the microfeatures, and become a cooled working fluid, which is then directed to the cold fluid passage 730. In some embodiments, the heat transfer structure 720a / b does not correspond to the heat transfer structure 220 and instead includes other means for absorbing and / or rejecting heat from and / or to the working fluid. For example, the heat transfer structure 720a / b may be a vessel or heat exchanger without microfeatures.

[0072] As shown in FIG. 7 , the first heat transfer structure 720a and the second heat transfer structure 720b can be spaced apart from each other via a cold fluid path 730 and / or a hot fluid path 740. In some embodiments, the cold fluid path 730 and the hot fluid path 740 can be insulated to prevent exposure of the cold fluid path 730 and the hot fluid path 740, which may be cold and hot to the touch, respectively. Additionally, the cold fluid path 740 can be insulated to prevent heat loss from the cooled working fluid contained therein. In some embodiments, the hot fluid path 740 can comprise a conductive metal (e.g., copper or aluminum) that is not insulated and can radiate heat and facilitate heat loss. Additionally or alternatively, the length of the hot fluid path 740 can be longer than the cold fluid path 730 or maximized to facilitate heat loss from the heated working fluid to the hot fluid path 740 and the surrounding environment. Advantageously, spacing the heat exchanger 750 away from the TEC 110 and the target area of ​​the human 10 can allow the heat exchanger 750 to have a larger footprint and thereby a higher heat transfer / removal capacity. If the heat exchanger 750 is located above the TEC 110 and / or the target area where space is limited, the heat exchanger 750 may necessarily be smaller so that the device 700 can be comfortably worn by the human 10.

[0073] The heat transfer system of device 700 can be a two-phase or single-phase heat transfer system. When operating as a two-phase heat transfer system, a cooled working fluid is provided as a liquid to first heat transfer structure 720a and heated via heat absorbed from TEC 110 to become a vapor working fluid. The vapor working fluid proceeds via heated working fluid passage 740 to second heat transfer structure 720b, where it cools and condenses to become a liquid. When operating as a two-phase heat transfer structure, first heat transfer structure 720a can be positioned directly below or at a lower elevation than second heat transfer structure 720b to provide additional head pressure from the cooled liquid working fluid proceeding via cold fluid passage 730, for example, to facilitate the flow of heated vapor working fluid via hot fluid passage 740.

[0074] FIG. 8 is a partial schematic diagram of a heat-transfer device 800 (“device 800”) configured to be worn by a human, in accordance with an embodiment of the present technology. Device 800 generally corresponds to device 700 ( FIG. 7 ) in that all of the components of device 700 are included within device 800. As shown in FIG. 8 , device 800 includes a frame 890 worn by human 10 and additional components mechanically coupled to frame 890 and configured to thermally treat left and right ocular regions of human 10. Frame 890 includes end portions 893, a bridge portion 891 extending between end portions 893, a nose portion 892, and temple portions 894 extending from respective ones of end portions 893. As shown in FIG. 8 , frame 890 may also include a coupler 895 and a coupling member 896 configured to attach one or more of the components of device 800 to frame 890.

[0075] Device 800 includes a contact member 805 (e.g., contact member 105 (FIG. 1A)), a TEC 810 (e.g., TEC 110 (FIG. 1A) or TEC 410 (FIG. 4)) thermally coupled to contact member 805, and a first heat transfer structure 820a (e.g., first heat transfer structure 720a (FIG. 7) or heat transfer structure 220 (FIGS. 2A and 2B)) thermally coupled to TEC 810. First heat transfer structure 820a is pivotally coupled to frame 890 via couplers 895 and coupling members 896 such that first heat transfer structure 820a, TEC 810, and / or contact member 805 are independently movable relative to frame 890 (e.g., bridge portion 891 or end portion 893). The device 800 further includes a second heat transfer structure 820b (e.g., second heat transfer structure 720b (FIG. 7) or heat transfer structure 220 (FIGS. 2A and 2B)), a low-temperature fluid passage 830 (e.g., low-temperature fluid passage 730 (FIG. 7) or low-temperature fluid passage 230 (FIGS. 2A and 2B)) fluidly coupling the second heat transfer structure 820b to the first heat transfer structure 820a, a high-temperature fluid passage 840 (e.g., high-temperature fluid passage 740 (FIG. 7) or high-temperature fluid passage 240 (FIGS. 2A and 2B)) fluidly coupling the second heat transfer structure 820b to the first heat transfer structure 820a, a heat exchanger 850 (e.g., heat exchanger 750 (FIG. 7)), and a fan 852 (e.g., fan 752 (FIG. 7)). The first heat transfer structure 820 a, the second heat transfer structure 820 b, the cold fluid path 830, the hot fluid path 840, the heat exchanger 850, and the fan 852 together may comprise a heat transfer system configured to remove and / or dissipate heat from the TEC 110. The first heat transfer structure 820 a may be positioned directly below or at a lower elevation than the second heat transfer structure 820 b, for example, to provide additional head pressure from the cooled liquid working fluid traveling through the cold fluid path 830 to facilitate the flow of the heated steam working fluid through the hot fluid path 840 when operating as a two-phase heat transfer system.

[0076] 8, device 800 also includes a pump 845 fluidly coupled to second heat transfer structure 820b and cryogenic fluid passage 830. In some embodiments, pump 845 is mechanically coupled to frame 890, more specifically, temple 894. Pump 845 increases the pressure of the cooled working fluid, enabling more effective heat transfer from TEC 810 to first heat transfer structure 820a and ensuring that adequate working fluid flows through the closed-loop system to properly cool TEC 810. In some embodiments, pump 845 is omitted.

[0077] In operation, a controller (e.g., controller 160 (FIG. 1)) receives input regarding a desired temperature (e.g., −20° C., −15° C., −10° C., −5° C., 0° C., 5° C., 10° C., or 15° C.) for the cold side of the TEC 810 (i.e., the side of the TEC 810 coupled to the contact member 805) and commands a power supply (e.g., power supply 165 (FIG. 1A)) to deliver a corresponding current to the TEC 810 to enable the desired temperature. As the cold side of the TEC 810 cools to the desired temperature, it therefore also cools the contact member 805 and the target area of ​​the person 10. Additionally, as the cold side of the TEC 810 cools, the hot side of the TEC 810 (i.e., the opposite side) heats up. The cooled working fluid passing through first heat transfer structure 820a absorbs heat from TEC 810 and becomes a heated working fluid, which is directed to second heat transfer structure 820b to be cooled. Heat exchanger 850 removes heat from the heated working fluid, for example via conduction, and is cooled via fan 832. Fan 832 provides cooled fluid that absorbs heat from heat exchanger 850 and is released into the surrounding environment. Such cooling allows the cold surface of TEC 810 to remain at a desired temperature and cool target areas of the face and ocular region for a desired duration so that underlying conditions can be appropriately treated.

[0078] 9 is an enlarged, partial, schematic, cross-sectional view of a portion of device 800 of FIG. 8. As shown in FIG. 9, second heat transfer structure 820b is mechanically coupled to frame 890, heat exchanger 850 is mechanically coupled to second heat transfer structure 820b, and fan 852 is mechanically coupled to heat exchanger 850. Advantageously, by coupling heat exchanger 850 and fan 852 to temple portion 894 of frame 890 and away from TEC 810 and the target area being thermally treated, heat exchanger 850 can have a larger footprint and thereby a higher heat transfer capacity. If heat exchanger 850 is positioned above TEC 810 and / or the target area where space is limited, heat exchanger 850 may need to be smaller so that device 700 can be comfortably worn by person 10.

[0079] FIG. 10 is a partial schematic cross-sectional view of a heat-transfer device 1000 (“device 1000”) in accordance with an embodiment of the present technology. Device 1000 is similar to device 800 in that device 1000 includes a contact member 105, a first heat-transfer structure 720a, a cold fluid passage 730, a hot fluid passage 740, a second heat-transfer structure 720b, a TEC 110, a heat exchanger 750, and a fan 752. However, as shown in FIG. 10 , device 1000 arranges these components differently from that of device 800. Specifically, TEC 110 is spaced apart from contact member 105, as opposed to being directly coupled to contact member 105. With such an arrangement, device 1000 can achieve a more gradual thermal response in a target area of ​​human 10 over a slightly longer period of time relative to that of device 800. Additionally or alternatively, device 1000 may allow contact member 105 to be more flexible because it is not constrained by the stiffness of TEC 110 and provides a thinner structure to the target area. The added flexibility and thinner structure of device 1000 may allow device 1000 to better conform to and contact the surface of the target area, allowing for better heat transfer between device 1000 and the target area.

[0080] 10 , a first heat transfer structure 720a is positioned on and thermally coupled to the contact member 105 (e.g., directly on the contact member). The first heat transfer structure 720a is fluidly coupled to a second heat transfer structure 720b via a cold fluid passage 730 and a hot fluid passage 740. The TEC 110 is positioned between and thermally coupled to the second heat transfer structure 720b and the heat exchanger 750, with the cold side of the TEC 110 proximate to and / or in contact with the second heat transfer structure 720b and the hot side of the TEC 110 proximate to and / or in contact with the heat exchanger 750. The first heat transfer structure 720a, the second heat transfer structure 720b, the low temperature fluid passage 730, the high temperature fluid passage 740, the heat exchanger 750, and the fan 752 may together constitute a heat transfer system configured to remove and / or dissipate heat from the contact member 105 and / or the TEC 110.

[0081] The heat transfer system of the device 1000 can include a two-phase or single-phase heat transfer system. When operating as a two-phase heat transfer system, a cooled working fluid is provided as a liquid to the first heat transfer structure 720a and heated via heat absorbed from the contact member 105, becoming a vapor working fluid. The vapor working fluid proceeds via the heated working fluid passage 740 to the second heat transfer structure 720b, where it is cooled via the TEC 110, condensed, and becomes a liquid. When operating as a two-phase heat transfer structure, the first heat transfer structure 720a can be positioned directly below or at a lower elevation than the second heat transfer structure 720b to provide additional head pressure from the cooled liquid working fluid proceeding via the cold fluid passage 730, for example, to facilitate the flow of the heated vapor working fluid via the hot fluid passage 740.

[0082] 11 is a partial schematic isometric view of a heat-transfer device 1100 ("device 1100") configured to be worn by a human, in accordance with an embodiment of the present technology. Device 1100 generally corresponds to device 800 (FIG. 8) and device 1000 (FIG. 10) in that all of the components of device 1100 are contained within devices 800 and 1000. As shown in FIG. 11, device 1100 includes a frame 890 worn by a human and additional components mechanically coupled to frame 890 and configured to thermally treat left and right ocular regions of human 10.

[0083] 11, the first heat transfer structure 820a and the contact member 805 can have the same or similar shapes, which maximizes surface area contact for more effective heat transfer. The first heat transfer structure 820a is pivotally coupled to the frame 890 via a coupler 895 and a coupling member 896 such that the first heat transfer structure 820a and / or the contact member 805 are independently movable relative to the frame 890 (e.g., the bridge portion 891 or the end portion 893). 11, the second heat transfer structure 820b, the heat exchanger 850, the TEC 810, and the fan 852 are coupled to temple 894 and are therefore spaced apart from the contact member 1105 and the target area being thermally treated. The first heat transfer structure 820a may be positioned directly below or at a lower elevation than the second heat transfer structure 820b and may provide additional head pressure from the cooled liquid working fluid traveling through, for example, the cold fluid passage 830 to facilitate the flow of heated steam working fluid through the hot fluid passage 840 when operating as a two-phase heat transfer system.

[0084] 11 , device 1100 also includes a pump 845 fluidly coupled to second heat transfer structure 820b and cryogenic fluid passage 830. In some embodiments, pump 845 is mechanically coupled to frame 890, more specifically, temple 894. Pump 845 increases the pressure of the cooled working fluid, enabling more effective heat transfer from first heat transfer structure 820a to contact member 805 and ensuring that adequate working fluid flows through the closed-loop system to properly cool contact member 805. In some embodiments, pump 845 is omitted.

[0085] Figure 12 is an enlarged, partial schematic cross-sectional view of a portion of device 1100 of Figure 10. As shown in Figure 12, second heat transfer structure 820b is mechanically coupled to frame 890, TEC 810 is thermally and mechanically coupled to second heat transfer structure 820b, heat exchanger 850 is mechanically coupled to TEC 810, and fan 852 is mechanically coupled to heat exchanger 850. Advantageously, by coupling heat exchanger 850 and fan 852 to second heat transfer structure 820b and TEC 810, to temple portion 894 of frame 890 and away from contact member 805 and the target area being thermally treated, heat exchanger 850 and fan 852 can, for example, have a larger footprint and thereby a higher heat transfer capacity. If the heat exchanger 850 and / or fan 852 are positioned above the contact member 805 and / or target area where space is limited, the heat exchanger 850 and / or fan 852 may need to be smaller so that the device 1100 can be comfortably worn by a person.

[0086] 13A is a partial schematic cross-sectional view of a heat-transfer device 1300 (“device 1300”) in accordance with an embodiment of the present technology. Device 1300 is similar to device 800 in that device 1300 includes a contact member 105, a TEC 110, a heat exchanger 750, and a fan 752. As shown in FIG. 13 , device 1300 further includes a thermal strap or interface material 1305 (“thermal strap 1305”) (e.g., heat spreader 505 ( FIG. 5 )) and a heat-transfer structure 1330 extending from the TEC 110 to the thermal strap 1305. The thermal strap 1305 can be a flexible material that adds flexibility to device 1300 and can accommodate movement of the heat-transfer structure 1320 relative to the heat exchanger 750. Additionally or alternatively, a thermal strap 1305 can be positioned between the contact member 105 and the TEC 110 and / or between the TEC 110 and an evaporator portion of the heat transfer structure 1320. The thermal strap 1305 may comprise copper, aluminum, or other material with high thermal conductivity. The heat transfer structure 1320, the thermal strap 1305, the heat exchanger 750, and the fan 852 together can comprise a heat transfer system configured to remove and / or dissipate heat from the contact member 105 and / or the TEC 110.

[0087] The heat transfer structure 1320 can be a vacuum-sealed heat pipe or elongated structure. The heat transfer structure 1320 includes an evaporator portion adjacent the TEC 110 at a proximal region of the heat transfer structure 1320 and a condenser portion adjacent the thermal strap 1305 at a distal region of the heat transfer structure 1320. In some embodiments, the device 1300 includes a conductive block between and coupled to the TEC 110 and the evaporative portion of the heat transfer structure 1320. As shown in FIG. 13B , a partial schematic cross-sectional view of the heat transfer structure 1320, the heat transfer structure 1320 can include an outer material 1332 (e.g., copper or aluminum), a capillary action material 1334 radially inward from and lining the outer material 1332, and a void 1336 radially inward from and enclosed by the capillary action material 1334. The void 1336 can contain a working fluid (WF) that transitions between a vapor and a liquid as it transitions between the evaporator and condenser portions of the heat transfer structure 1320. The capillary action material can be grooved, sintered, or comprise a wire mesh. In some embodiments, the device 1300 includes insulation surrounding the heat transfer structure 1320 to prevent exposure of the heat transfer structure 1320, which may be cold or hot to the touch.

[0088] In operation, a controller (e.g., controller 130 (FIG. 1)) receives input regarding a desired temperature (e.g., −20° C., −15° C., −10° C., −5° C., 0° C., 5° C., 10° C., or 15° C.) for the cold side of the TEC 110 (i.e., the side of the TEC 110 coupled to the contact member 105) and commands a power supply (e.g., power supply 165 (FIG. 1A)) to deliver a corresponding current to the TEC 110 to enable the desired temperature. As the cold side of the TEC 110 cools to the desired temperature, it also cools the contact member 105 and the target area of ​​the person 10. Additionally, as the cold side of the TEC 110 cools, the hot side (i.e., the opposite side) of the TEC 110 heats, which applies heat to the evaporative portion of the heat transfer structure 1320. As heat from the TEC 110 is applied to the heat transfer structure 1320 in the evaporator portion, the working fluid within the heat transfer structure 1320 is heated and transformed into a vapor working fluid, which is facilitated by the sealed vacuum of the heat transfer structure 1320. The vapor working fluid increases pressure within the heat transfer structure 1320, which causes the vapor working fluid to flow toward the cooler side or condenser portion of the heat transfer structure 1320. In the condenser portion, heat from the vapor working fluid is released and the vapor working fluid condenses into a liquid working fluid. The condensed liquid working fluid then flows back toward the hotter side or evaporator portion, where the cycle repeats as long as heat continues to be applied through the TEC 110. The heat strap 1305 absorbs heat from the heat transfer structure 1320, and the heat exchanger 750 removes heat from the heat strap 1305, for example, via conduction. Heat exchanger 750 is cooled via fan 752, which provides a cooling fluid that absorbs heat from heat exchanger 750 and is released into the surrounding environment. Such cooling allows the cold surface of TEC 110 to remain at a desired temperature and cool a target area (e.g., the face and eye area) for a desired duration so that the underlying ailment can be appropriately treated.

[0089] 14A and 14B are partial schematic diagrams of a heat-transfer device 1400 ("device 1400") configured to be worn by a human, in accordance with an embodiment of the present technology. Device 1400 generally corresponds to device 1300 (FIG. 13), which is incorporated onto a frame 1490. Referring together to FIGS. 14A and 14B, device 1400 includes frame 890, previously described with reference to FIG. 8, and additional components mechanically coupled to frame 890 and configured to thermally treat left and right ocular regions of human 10.

[0090] Device 1400 includes a contact member 1405 (e.g., contact member 805 (FIG. 8)), a TEC 1410 (e.g., TEC 810 (FIG. 8)) thermally coupled to contact member 1405, a conductive block 1490 thermally coupled to TEC 1410, and a heat pipe 1430 (e.g., heat transfer structure 1320 (FIG. 13)) thermally coupled to conductive block 1490 and / or TEC 1410. The heat pipe 1430, the conductive block 1490, and / or the TEC 1410 can be pivotally coupled to the frame 890 via the coupler 895 and the coupling member 896 such that the heat pipe 1430, the conductive block 1490, the TEC 1410, and / or the contact member 1405 are independently movable relative to the frame 890 (e.g., the bridge portion 891 or the end portion 893). The device 1400 further includes a heat exchanger 1450 (e.g., the heat exchanger 850 (FIG. 8)) and a fan 1452 (e.g., the fan 852 (FIG. 8)) coupled to the end portion of the heat pipe 1430.

[0091] In operation, a controller (e.g., controller 130 (FIG. 1)) receives input regarding a desired temperature (e.g., −20° C., −15° C., −10° C., −5° C., 0° C., 5° C., 10° C., or 15° C.) for the cold side of TEC 1410 (i.e., the side of TEC 1410 coupled to contact member 1405) and commands a power supply (e.g., power supply 165 (FIG. 1A)) to deliver a corresponding current to TEC 1410 to enable the desired temperature. As the cold side of TEC 1410 cools to the desired temperature, it also cools contact member 805 and the target area of ​​person 10. Additionally, as the cold side of TEC 810 cools, the hot side (i.e., the opposite side) of TEC 810 heats up and applies heat to the evaporative portion of heat pipe 1430. The working fluid in the heat pipe 1430 is then evaporated, which causes pressure to increase within the heat transfer structure 1320, forcing the vapor working fluid to flow toward the condenser portion of the heat pipe 1430. A heat exchanger 1450 removes heat from the condenser portion of the heat pipe 1430, for example, via conduction, and the heat exchanger 1450 is cooled via a fan 1452.

[0092] 15 is a partial schematic front view of a heat-transfer device 1500 ("device 1500") coupled to an ocular frame 1590 worn by a person 10, in accordance with an embodiment of the present technology, and FIG. 16 is an isometric view of device 1500 and frame 1590. Device 1500 may correspond to any of the heat-transfer devices described herein, including devices 100, 200, 700, 1000, 1300, and frame 1590 may correspond to any of the frames described herein, including frame 890.

[0093] The device 1500 can be placed on the target ocular area of ​​the human 10 using any fasteners, adhesives, straps, tape (e.g., Velcro®), belts, or other grasping means. However, because the skin under the eye is relatively sensitive and thin, using any fasteners that apply pressure (e.g., vacuums, straps, Velcro®, etc.) may cause damage to the skin or tissue. Also, the device 1500 may be displaced with slight head movement, and it may not be practical to restrain the human from moving during thermal treatment. Therefore, as shown in FIGS. 15 and 16 , the device 1500 may be positioned relative to the target ocular area using a frame 1590 to which the device 1500 is coupled. The device 1500 can be configured to improve thermal contact with the target ocular area. When the frame 1590 is worn by the human 10, the device 1500 is placed in contact with the human 10 at the target area. By doing so, the device 1500 can be held in a fixed position, allowing the therapist within the human 10 to have freedom of movement of its head with limited risk of the device 1500 being displaced.

[0094] 16 , the frame 1590 can be adjusted to accommodate different individuals 10 and allow for better thermal contact with the device 1500. For example, the frame 1590 of the device 1500 can be adjusted along the x-axis, as illustrated by B1, and / or along the y-axis, as illustrated by B2, and along the y-axis, as illustrated by A1, and / or along the x-axis, as illustrated by A2. By doing so, the frame 1590 can be positioned to allow optimal thermal contact with the target ocular area.

[0095] 17 is a partial schematic cross-sectional view of a heat-transfer device 1700 (“device 1700”) according to an embodiment of the present technology. Device 1700 is similar to device 1000 in that device 1700 includes a contact member 105, a first heat-transfer structure 720a, a cold fluid passage 730, a hot fluid passage 740, a second heat-transfer structure 720b, a TEC 110, a heat exchanger 750, and a fan 752. As shown in FIG. 17 , the first heat-transfer structure 720a is positioned above (e.g., directly above) the contact member 105 and thermally coupled thereto. The first heat-transfer structure 720a is fluidly coupled to the second heat-transfer structure 720b via the cold fluid passage 730 and the hot fluid passage 740. The TEC 110 is positioned between and thermally coupled to the second heat transfer structure 720b and the heat exchanger 750, with the cold side of the TEC 110 proximate to and / or in contact with the second heat transfer structure 720b and the hot side of the TEC 110 proximate to and / or in contact with the heat exchanger 750. The heat exchanger 750 removes heat from the TEC 110, for example, via conduction, and is cooled via a fan 752, which provides a cooling fluid that absorbs heat from the heat exchanger 750 and is discharged to the ambient environment. The first heat transfer structure 720a, the second heat transfer structure 720b, the cold fluid path 730, the hot fluid path 740, the heat exchanger 750, and the fan 752 together can comprise a heat transfer system configured to remove and / or dissipate heat from the contact member 105 and / or the TEC 110.

[0096] The device 1700 further includes an inflatable interface 1770 on the first heat transfer structure 720a and the contact member 105, and a pump 1775 fluidly coupled to the inflatable interface 1770 and configured to inflate and / or deflate the inflatable interface 1770. The device 1700 further includes a rigid frame 1790 over the inflatable interface 1770 on the first side 11 of the human 10, a rigid member 1792 disposed on the second, opposing side 12 of the human 10, and an adjustable band extending between the rigid frame 1790 and the rigid member 1792 and configured to secure the device 1700 to the human 10. When the device 1700 is worn by the human 10, the rigid frame 1790 applies pressure on the contact member 105, urging it toward the first side 11 of the human 10. As the inflatable interface 1770 is inflated via the pump 1775, more pressure is applied to the first heat transfer structure 720a and the contact member 105, which improves contact and / or heat transfer from the contact member 105 to the person 10.

[0097] The device 1700 may further include a user interface 170, as previously described herein (see, for example, FIG. 1A ), a controller 160 operably coupled to the user interface 170, and a power source 165 operably coupled to the controller 160 and the pump 1775. The user interface 170, the controller 160, and / or the power source 165 may be positioned and / or contained within the rigid member 1792. The device may further include a pressure sensor 1780 operably coupled to the controller 1770 and positioned at the interface between the contact member 105 and the human 10. The pressure sensor 1780 may detect the contact pressure of the device 1700 or the contact member 105 applied against the human 10 and may be used as an input to adjust the inflatable interface 1770. For example, the pump 1775 can be configured to inflate and / or deflate the inflatable interface 1770 based on a signal from the pressure sensor 1780, e.g., to maintain a set contact pressure during heat treatment or to adjust the pressure between various pressures to induce a massaging sensation.

[0098] The heat transfer system of device 1700 can be a two-phase or single-phase heat transfer system. When operating as a two-phase heat transfer system, a cooled working fluid is provided as a liquid to first heat transfer structure 720a and heated via heat absorbed from contact member 105 to form a vapor working fluid. The vapor working fluid proceeds via heated working fluid passage 740 to second heat transfer structure 720b, where it is cooled via TEC 110 and condensed to form a liquid. When operating as a two-phase heat transfer structure, first heat transfer structure 720a can be positioned directly below or at a lower elevation than second heat transfer structure 720b to provide additional head pressure from the cooled liquid working fluid proceeding via cold fluid passage 730, for example, to facilitate the flow of heated vapor working fluid via hot fluid passage 740.

[0099] In operation, a controller (e.g., controller 130 (FIG. 1)) receives input regarding a desired temperature for the cold side of the TEC 110 (e.g., −20° C., −15° C., −10° C., −5° C., 0° C., 5° C., 10° C., or 15° C.), which directly correlates to the temperature of the cooled working fluid and / or the temperature of the contact member 105. The controller commands a power source (e.g., power source 165 (FIG. 1A)) to deliver a corresponding current to the TEC 110 to enable the desired temperature. As the cold side of the TEC 110 cools to the desired temperature, it therefore also cools the working fluid supplied from the second heat transfer structure 720b to the first heat transfer structure 720a, which in turn cools the contact member 105. Additionally, as the cold side of the TEC 110 cools, the hot side (i.e., the opposite side) of the TEC 110 heats up. The heat exchanger 750 removes heat from the TEC 110, for example, via conduction, and is cooled via a fan 752, which provides a cooling fluid that absorbs heat from the heat exchanger 750 and releases it to the surrounding environment. While this thermal therapy occurs, the controller can also operate the pump 1775 to inflate the inflatable interface 1770 between the first heat transfer structure 720a and the rigid frame 1790, which can increase the pressure applied by the contact members 105 against the tissue of the person 10. Additionally or alternatively, the controller can also operate the pump 1775 to repeatedly inflate and deflate the inflatable interface 1770 during the thermal therapy to provide a massaging sensation.

[0100] Figure 18A is a partial schematic isometric view of heat-transfer device 1800 ("device 1800") being worn by a person, Figure 18B is a partial schematic isometric cross-sectional view of device 1800, and Figure 18C is a partial schematic side view of device 1800, including adjustable band 1785. Adjustable band 1785 is omitted from Figures 18A and 18B for illustrative purposes. 18A and 18B, device 1800 includes a rigid frame 1890 (e.g., rigid frame 1790 ( FIG. 17 )), an inflatable interface 1870 (e.g., inflatable interface 1770 ( FIG. 17 )) radially inward from rigid frame 1890, a first heat transfer structure 1820 a (e.g., first heat transfer structure 720 a ( FIG. 17 )) radially inward from inflatable interface 1870, and a contact member 1805 (e.g., contact member 105 ( FIG. 17 )) radially inward from heat transfer structure 1820 a that contacts an ocular region of human 10. Contact member 1805 can provide a comfortable contact surface between device 1800 and human 10. In some embodiments, the first heat transfer structure 1820a and the contact member 1805 are incorporated into a single element of the device 1800 that contacts the ocular region of the human 10. As shown in FIG. 18C , the device 1800 can include a rigid member 1892 (e.g., rigid member 1792 ( FIG. 17 )) on an opposing side of the human's head relative to a rigid frame 1890, and an adjustable band 1885 (e.g., adjustable band 1785 ( FIG. 17 )) extending between the rigid frame 1890 and the rigid member 1892. The rigid member 1892 can comprise and / or contain a second heat transfer structure (e.g., second heat transfer structure 720b ( FIG. 17 )), a TEC on and thermally coupled to the second heat transfer structure, a heat exchanger on and thermally coupled to the TEC, and a fan on and thermally coupled to the heat exchanger. The adjustable band may comprise and / or contain a cold fluid passage (e.g., cold fluid passage 730) extending between the first heat transfer structure and the second heat transfer structure, and a hot fluid passage (e.g., hot fluid passage 740) extending between the first heat transfer structure and the second heat transfer structure.The adjustable band 1885 can be elastic such that when the device 1800 is worn by a person, the adjustable band 1885 compresses the device 1800 against the rigid frame 1890 and thereby the contact member 1805 against the eyeball area of ​​the person 10.

[0101] 19 is a partial schematic isometric view of a heat-transfer device 1900 ("device 1900") being worn by a person 10, in accordance with an embodiment of the present technology. Device 1900 is similar to device 1800 (FIG. 18), but includes a rigid frame 1990 that is fully enclosed and also includes a periocular opening. Device 1900 further includes an inflatable interface 1870 radially inward from the rigid frame 1990, and a contact member 1805 radially inward from the inflatable interface.

[0102] 20 is a schematic block diagram illustrating a system 2090 including a heat-transfer device 2000 ("device 2000"), in accordance with an embodiment of the present technology. Any one of the heat-transfer devices 100, 200, 500, 600, 700, 800, 1000, 1100, 1300, 1400, 1500, 1700, 1800, 1900 described herein with reference to FIGS. 1-19 can be incorporated into countless other and / or more complex systems, a representative example of which is system 2090, shown diagrammatically in FIG. 20. System 2290 may include a device 2000 (e.g., heat transfer device 100, 200, 500, 600, 700, 800, 1000, 1100, 1300, 1400, 1500, 1700, 1800, 1900), a power source 2292 (e.g., portable power source, battery, etc.) operably coupled to device 2000 (e.g., the TEC of the device), a controller 2094 (e.g., a processor) operably coupled to the device and power source 2092, a user interface 2096 operably coupled to controller 2094 and power source 2092, and other subsystems. System 2090 may perform any of a wide variety of functions, such as memory storage, data processing, and / or other suitable functions.

[0103] Controller 2094 can be configured to operate device 2000 in one of a plurality of operating modes (e.g., a cooling mode, a heating mode, or both) and / or provide a process value (e.g., a setpoint temperature) at which the device is configured to operate. As described above with reference to FIG. 1A , for example, controller 2094 can provide device 2000 with a setpoint temperature within a range of 40° C. to −20° C. (e.g., 35° C., 20° C., 0° C., −10° C., etc.) such that TEC 110 (e.g., the first or second side of the TEC) is configured to operate at the setpoint temperature. Additionally or alternatively, controller 2094 can be configured to receive input from a sensor (e.g., sensor 180 on the device ( FIGS. 1A and 1B )) and control device 2000 based on the received input. For example, controller 2094 can determine any abnormality in device 2000 and automatically generate an indication of the abnormality and / or adjust operating parameters of device 2000. Additionally or alternatively, controller 2094 may utilize artificial intelligence and / or machine learning to adjust power and / or other control parameters, for example, based on previous treatments used for the same person or group of people. User interface 2096 may include a display and / or applications or programs that allow a person to utilize the device through a mobile device (e.g., phone, tablet, watch, laptop, etc.) or other computing device. User interface 2096 may include pre-programmed thermal management procedures and / or allow a person to adjust cooling and heating parameters based on the desired application.

[0104] 21 is a flow diagram illustrating a method 2200 for treating a human (e.g., under-eye puffiness, under-eye bags, dark circles, or sunken eyes) via a heat-transfer device in accordance with an embodiment of the present technology. Method 2000 can include providing a heat-transfer device (e.g., device 100, 200, 500, 600, 700, 800, 1000, 1100, 1300, 1400, 1500, 1700, 1800, 1900) (process portion 2102) and placing the heat-transfer device over a target area of ​​the human (process portion 2104). Placing the heat-transfer device over the target area can include, for example, fastening the device over the target area such that the device or a contact member of the device provides a compressive force on the target area, positioning a TEC of the device in thermal contact with the target area.

[0105] Method 2100 can further include initiating, via a controller (e.g., controller 2094; FIG. 20), a temperature control and / or operational mode of the heat transfer device, thereby transferring heat from the target area of ​​the human to the heat transfer device or vice versa (process portion 2106). Initiating an operational mode can include initiating a cooling mode, a heating mode, or both a cooling mode and a heating mode. Initiating a temperature control can include providing a temperature at which the TEC (e.g., TEC 110; FIGS. 1A, 1B, 2A-14B) operates, or at which the device is configured to heat or cool the target area within a predetermined time (e.g., 10 seconds, 20 seconds, 30 seconds, 40 seconds, 60 seconds, or 120 seconds). In some embodiments, the temperature can be set within a range of 40°C to -20°C (e.g., 35°C, 20°C, 0°C, -10°C, etc.).

[0106] III. Conclusion It will be apparent to those skilled in the art that changes may be made to the details of the above-described embodiments without departing from the underlying principles of the present disclosure. In some cases, well-known structures and functions have not been shown or described in detail to avoid unnecessarily obscuring the description of embodiments of the present technology. While method steps may be presented herein in a particular order, alternative embodiments may perform the steps in a different order. Similarly, certain aspects of the present technology that are disclosed in the context of particular embodiments may be combined or eliminated in other embodiments. Furthermore, while advantages associated with certain embodiments of the present technology may be disclosed in the context of those embodiments, other embodiments may also exhibit such advantages, and not all embodiments necessarily need to exhibit such advantages or other advantages disclosed herein to fall within the scope of the present technology. Thus, the present disclosure and associated technology may encompass other embodiments not explicitly shown or described herein, and the present invention is not limited except as by the appended claims.

[0107] Throughout this disclosure, the singular terms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. The term "and / or," when used in reference to a list of two or more items, should be interpreted as including (a) any single item in the list, (b) all of the items in the list, or (c) any combination of items in the list. Additionally, the terms "comprising," "including," and "having" should be interpreted as meaning the inclusion of at least the recited features, so as not to exclude any greater number of the same features and / or other features of additional types.

[0108] As used herein, references to "one embodiment," "an embodiment," "some embodiments," or similar formulaic phrases mean that a particular feature, structure, operation, or characteristic described in connection with an embodiment can be included in at least one embodiment of the technology. Thus, appearances of such phrases or formulaic phrases herein do not necessarily all refer to the same embodiment. Furthermore, various particular features, structures, operations, or characteristics may be combined in any suitable manner in one or more embodiments.

[0109] Unless otherwise indicated, all numbers used in the specification and claims expressing numerical values ​​should be understood in all instances to be modified by the term "about" or "approximately." When used in reference to a value, the term "about" or "approximately" should be interpreted to mean within 10% of the stated value. Thus, unless indicated to the contrary, the numerical parameters set forth in the following specification and appended claims are approximations that may vary depending on the desired properties sought to be obtained by the present technology. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should be construed at least in light of the number of reported significant digits and by applying ordinary rounding techniques. In addition, all ranges disclosed herein should be understood to encompass all subranges subsumed therein. For example, a range of "1 to 10" includes all subranges (and includes) between a minimum value of 1 and a maximum value of 10, i.e., all subranges having a minimum value equal to or greater than 1 and a maximum value equal to or less than 10, such as 5.5 to 10.

[0110] The foregoing disclosure should not be interpreted as reflecting an intention that any claim require more features than are expressly recited in that claim. Rather, as the following claims reflect, inventive aspects lie in combinations of fewer than all features of any single foregoing disclosed embodiment. Accordingly, the claims following this detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment. The present disclosure includes all enumerations of those dependent claims, along with the independent claims.

[0111] The present technology is illustrated according to various aspects, for example, as described below as numbered appendices (1, 2, 3, etc.). These appendices are provided as examples and are not intended to limit the present technology. Note that any of the dependent appendices may be combined in any combination and placed into a separate, independent appendice. Other appendices may be presented in a similar manner. (Appendix 1) 1. A heat transfer device comprising: a thermoelectric component (TEC) including a first side configured to be thermally coupled to a target area of ​​a human and a second side opposite the first side; a thermally conductive contact member coupled to a first side of the TEC, the contact member being a heat spreader configured to enhance heat transfer to and / or from a target area of ​​the human; a heat transfer system configured to dissipate heat from the TEC, the heat transfer system including a heat transfer structure thermally coupled to the TEC and a heat exchanger thermally coupled to the heat transfer structure; a rigid frame configured to be worn by a human, the rigid frame including a first region coupled to a contact member and a second region coupled to a heat exchanger, the first region being spaced apart from the second region, and wherein when the rigid frame is worn by the human, the contact member is adjacent to a target area of ​​the human; A device comprising: (Appendix 2) 10. The device of claim 1, further comprising a low-temperature fluid passage configured to direct the working fluid toward the heat transfer structure and a high-temperature fluid passage configured to direct the working fluid away from the heat transfer structure, wherein the heat transfer structure is spaced from the heat exchanger via at least one of the low-temperature fluid passage or the high-temperature fluid passage. (Appendix 3) 3. The device of claim 2, wherein the low temperature fluid passage is positioned at a higher altitude than the high temperature fluid passage. (Appendix 4) 4. The device of claim 2 or 3, wherein the heat transfer structure is a first heat transfer structure; the device further includes a second heat transfer structure, wherein the low-temperature fluid passage and the high-temperature fluid passage each extend between the first heat transfer structure and the second heat transfer structure; and wherein the heat exchanger overlies the second heat transfer structure such that the heat exchanger, during operation, removes heat from the second heat transfer structure via at least one of conduction or convection. (Appendix 5) 5. The device of claim 4, wherein the first heat transfer structure, the second heat transfer structure, the low temperature fluid passage, and the high temperature fluid passage comprise a closed loop system. (Appendix 6) 6. The device of claim 4 or 5, wherein the heat transfer system is a two-phase system such that the working fluid directed to the first heat transfer structure via the cold fluid passage comprises a liquid and the working fluid directed from the first heat transfer structure via the hot fluid passage comprises a vapor. (Appendix 7) 5. The device of claim 4, wherein the TEC is directly on the contact member and the first heat transfer structure is directly on the TEC. (Appendix 8) 5. The device of claim 4, wherein the TEC is spaced from the heat exchanger via at least one of a cold fluid passage or a hot fluid passage. (Appendix 9) 5. The device of claim 4, wherein the first heat transfer structure is on the contact member, the TEC is on the second heat transfer structure, and the heat transfer structure is on the TEC. (Appendix 10) 5. The device of claim 4, wherein the TEC is spaced from the contact member via at least one of a low-temperature fluid passage or a high-temperature fluid passage. (Appendix 11) A device described in any one of the appendices herein, wherein the heat transfer structure comprises an inlet region, an outlet region, and microfeatures spaced apart from one another and at least partially defining channels configured to receive a working fluid, wherein during operation the working fluid flows from the inlet region to the outlet region and absorbs heat from the microfeatures. (Appendix 12) the contact member is coupled to the TEC and configured such that when the contact member is attached to the human, the TEC is aligned adjacent to the target area; The heat transfer structure includes a heat pipe extending from the TEC to the heat exchanger. 1. A device as described in Appendix 1. (Appendix 13) 13. The device of claim 12, wherein the heat pipe includes an evaporator portion adjacent to the TEC and a condenser portion adjacent to the heat exchanger, the heat pipe including an outer metallic material, a capillary material radially inward from the outer metallic material, and an air gap radially inward from the outer metallic material. (Appendix 14) 14. The device of claim 13, further comprising a heat spreader coupled to the heat exchanger and condenser portions of the heat pipe. (Appendix 15) A device described in any one of the appendices herein, wherein the first region of the rigid frame comprises one of a bridge portion or an end portion of the rigid frame, and the second region of the rigid frame comprises a temple portion of the rigid frame. (Appendix 16) 1. A wearable heat transfer device configured to provide thermal therapy to an ocular region of a human, the device comprising: thermoelectric components (TECs) arranged in an array and spaced apart from one another, each TEC including a first side configured to be thermally coupled to a target eye region of the human and a second side opposite the first side; a thermally conductive contact member coupled to the first side of the TEC and positioned to transfer heat to and / or from the target ocular region of the human; a heat transfer system configured to dissipate heat from the TEC, the heat transfer system including a heat transfer structure thermally coupled to the TEC and a heat exchanger thermally coupled to the heat transfer structure, the contact member spaced from the heat exchanger; a controller coupled to the TEC, the controller configured to operate the TEC and the heat transfer system such that the heat transfer system cools a second side of the TEC to a first temperature within a predetermined period of time, and the TEC changes the temperature of the target ocular region to a second temperature different from the first temperature; A device comprising: (Appendix 17) 17. The device of claim 16, further comprising: a cold fluid passage configured to direct the working fluid toward the heat transfer structure; and a hot fluid passage configured to direct the working fluid away from the heat transfer structure, wherein the heat transfer structure is spaced from the heat exchanger via at least one of the cold fluid passage or the hot fluid passage. (Appendix 18) 18. The device of claim 17, wherein the low temperature fluid passage is positioned at a higher elevation than the high temperature fluid passage. (Appendix 19) 19. The device of claim 17 or 18, wherein the heat transfer structure is a first heat transfer structure, the device further comprising a second heat transfer structure, the low temperature fluid passage and the high temperature fluid passage each extending between the first heat transfer structure and the second heat transfer structure, and the heat exchanger overlies the second heat transfer structure such that the heat exchanger, during operation, removes heat from the second heat transfer structure via at least one of conduction or convection. (Appendix 20) 17. The device of claim 16, wherein a first side of each individual TEC is coupled to a contact member such that the individual TEC is thermally coupled to the target ocular region via the contact member and a second side of the individual TEC is coupled to the heat transfer structure. (Appendix 21) 17. The device of claim 16, wherein the heat transfer structure overlies the contact member and is thermally coupled to a first side of the individual TEC, and the individual TEC is coupled to the heat exchanger such that the heat exchanger is configured to cool a second side of the individual TEC. (Appendix 22) 17. The device of claim 16, wherein the heat transfer structure comprises an elongated heat pipe including an evaporator portion thermally coupled to the second side of the TEC and a condenser portion thermally coupled to the heat exchanger. (Appendix 23) 23. The device of claim 22, wherein the heat pipe includes an outer metallic material, a capillary material radially inward from the outer metallic material, and a void radially inward from the outer metallic material, the void containing a working fluid that transitions from a vapor in the evaporator portion to a liquid in the condenser portion during operation of the device. (Appendix 24) A device described in any one of the appendices herein, further comprising a rigid frame configured to be worn by a human and including edge portions, a bridge portion extending between the edge portions in a first direction, and temple portions extending from the edge portions in a second direction different from the first direction, wherein the contact member is coupled to at least one of the bridge portion or the end portion, and the heat exchanger is coupled to the temple portion. (Appendix 25) 1. A heat transfer device comprising: a thermoelectric component (TEC) including a first side configured to be operated at a desired temperature and a second side opposite the first side; a contact member thermally coupled to the TEC, the contact member comprising a thermally conductive material and configured to enhance heat transfer to and / or from a target area of ​​the human; a heat transfer system configured to dissipate heat from the TEC, the heat transfer system including a heat transfer structure thermally coupled to the TEC and a heat exchanger thermally coupled to the heat transfer structure; an expandable interface overlying and radially outward from the contact member, the expandable interface applying pressure toward the contact member when expanded; A device comprising: (Appendix 26) 26. The device of claim 25, further comprising: a rigid frame radially outward from the inflatable interface and configured to overly a first side of the human; and an adjustable band extending from the rigid frame and configured to be worn around a second side of the human opposite the first side, wherein when worn by the human, the adjustable strap causes the rigid frame to exert pressure against the first side of the human. (Appendix 27) 27. The device of claim 26, wherein the heat transfer structure is disposed between the contact member and the expandable interface, and the heat transfer system further comprises: (i) a cold fluid passage fluidly coupled to an inlet region of the heat transfer structure and configured to provide cooled working fluid to the heat transfer structure; and (ii) a hot fluid passage fluidly coupled to an outlet region of the heat transfer structure and configured to receive heated working fluid from the heat transfer structure, wherein the cold fluid passage and the hot fluid passage extend along at least a portion of the adjustable strap. (Appendix 28) 28. The device of claim 27, wherein the heat transfer structure is a first heat transfer structure, and the device further includes a second heat transfer structure thermally coupled to the first side of the TEC and fluidly coupled to the low temperature fluid passage and the high temperature fluid passage, the second heat transfer structure configured to provide cooled working fluid to the low temperature fluid passage and receive heated working fluid from the high temperature fluid passage. (Appendix 29) 26. The device of claim 25, wherein the TEC is coupled to the heat exchanger such that a second side of the TEC is configured to be cooled by the heat exchanger, and the TEC and the heat exchanger are spaced apart from the contact member. (Appendix 30) 26. The device of claim 25, further comprising: a controller; and a pump operably coupled to the controller and fluidly coupled to the inflatable interface, the pump configured to inflate and / or deflate the inflatable interface based on a signal received from the controller.

Claims

1. 1. A heat transfer device comprising: a thermoelectric component (TEC) including a first side configured to be thermally coupled to a target area of ​​a human and a second side opposite the first side; a thermally conductive contact coupled to the first side of the TEC, the contact being a heat spreader configured to enhance heat transfer to and / or from the target area on the human; a heat transfer system configured to dissipate heat from the TEC, the heat transfer system including a heat transfer structure thermally coupled to the TEC and a heat exchanger thermally coupled to the heat transfer structure; a rigid frame sized and shaped to be fitted around and supported by a facial region of the person, the rigid frame including: (i) a first region coupled to the contact member; and (ii) a second region mounted to the heat exchanger and having a length, the second region including a rigid material extending from the first region and extending along the entire length of the second region, the contact member adjacent the target area of ​​the person when the rigid frame is worn by the person; A device comprising:

2. 10. The device of claim 1, further comprising: a cold fluid passage configured to direct a working fluid toward the heat transfer structure; and a hot fluid passage configured to direct the working fluid away from the heat transfer structure, the heat transfer structure being spaced from the heat exchanger via at least one of the cold fluid passage or the hot fluid passage.

3. The device of claim 2 , wherein the entire cold fluid passage is located at a higher elevation than the entire hot fluid passage.

4. 3. The device of claim 2, wherein the heat transfer structure is a first heat transfer structure, the device further comprising a second heat transfer structure, the cold fluid passage and the hot fluid passage each extending between the first heat transfer structure and the second heat transfer structure, and the heat exchanger overlies the second heat transfer structure such that the heat exchanger, during operation, removes heat from the second heat transfer structure via at least one of conduction or convection.

5. The device of claim 4 , wherein the first heat transfer structure, the second heat transfer structure, the cold fluid passage, and the hot fluid passage comprise a closed loop system.

6. 5. The device of claim 4, wherein the heat transfer system is a two-phase system such that the working fluid directed to the first heat transfer structure via the low-temperature fluid passage comprises a liquid and the working fluid directed from the first heat transfer structure via the high-temperature fluid passage comprises a vapor.

7. The device of claim 4 , wherein the TEC is directly on the contact member and the first heat transfer structure is directly on the TEC.

8. The device of claim 4 , wherein the TEC is spaced from the heat exchanger via at least one of the cold fluid path or the hot fluid path.

9. The device of claim 4 , wherein the first heat transfer structure is on the contact member, the TEC is on the first heat transfer structure, and the second heat transfer structure is on the TEC.

10. The device of claim 4 , wherein the TEC is spaced from the contact member via at least one of the cold fluid passage or the hot fluid passage.

11. 10. The device of claim 1, wherein the heat transfer structure comprises an inlet region, an outlet region, and microfeatures spaced apart from one another and defining channels configured to at least partially receive a working fluid, wherein during operation the working fluid flows from the inlet region to the outlet region and absorbs heat from the microfeatures.

12. the contact member is coupled to the TEC and configured such that when the contact member is attached to the human, the TEC is aligned adjacent to the target area; the heat transfer structure comprises a heat pipe extending from the TEC to the heat exchanger; The device of claim 1 .

13. 13. The device of claim 12, wherein the heat pipe includes an evaporator portion adjacent the TEC and a condenser portion adjacent the heat exchanger, the heat pipe including an outer metallic material, a capillary material radially inward from the outer metallic material, and an air gap radially inward from the outer metallic material.

14. The device of claim 13 , further comprising a heat spreader coupled to the heat exchanger and the condenser portion of the heat pipe.

15. 10. The device of claim 1, wherein the first region of the rigid frame comprises one of a bridge portion or an end portion of the rigid frame, and the second region of the rigid frame comprises a temple portion of the rigid frame.

16. A wearable heat transfer device sized and shaped to be worn about a facial region of a human being and configured to provide thermal therapy to an ocular region of said human being, said device comprising: thermoelectric components (TECs) arranged in an array and spaced apart from one another, each TEC including a first side configured to be thermally coupled to a target eye region of a human and a second side opposite the first side; a thermally conductive contact member coupled to a first side of the TEC and positioned to transfer heat to and / or from the target ocular region of the human; a heat transfer system configured to dissipate heat from the TEC, the heat transfer system including: (i) a heat transfer structure thermally coupled to the TEC; and (ii) a heat exchanger thermally coupled to the heat transfer structure, the contact member being spaced from the heat exchanger; a rigid frame including: (i) a first region coupled to the contact member; and (ii) a second region mounted to the heat exchanger and having a length, the second region including a rigid material extending from the first region and extending along the entire length of the second region; a controller coupled to the TEC, the controller configured to operate the TEC and the heat transfer system such that the heat transfer system cools the second side of the TEC to a first temperature within a predetermined time period, and the TEC changes the temperature of the target eye area to a second temperature different from the first temperature; and A device comprising:

17. 17. The device of claim 16, further comprising: a cold fluid passage configured to direct a working fluid toward the heat transfer structure; and a hot fluid passage configured to direct the working fluid away from the heat transfer structure, the heat transfer structure being spaced from the heat exchanger via at least one of the cold fluid passage or the hot fluid passage.

18. 20. The device of claim 17, wherein the cold fluid passage is located at a higher elevation than the hot fluid passage.

19. 18. The device of claim 17, wherein the heat transfer structure is a first heat transfer structure, the device further comprising a second heat transfer structure, the cold fluid passage and the hot fluid passage each extending between the first heat transfer structure and the second heat transfer structure, and the heat exchanger overlies the second heat transfer structure such that the heat exchanger, during operation, removes heat from the second heat transfer structure via at least one of conduction or convection.

20. 17. The device of claim 16, wherein the first side of the individual TEC is coupled to the contact member such that the individual TEC is thermally coupled to the target ocular region via the contact member and the second side of the individual TEC is coupled to the heat transfer structure.

21. 17. The device of claim 16, wherein the heat transfer structure overlies the contact member and is thermally coupled to the first side of the individual TEC, and the individual TEC is coupled to the heat exchanger such that the heat exchanger is configured to cool the second side of the individual TEC.

22. 17. The device of claim 16, wherein the heat transfer structure comprises an elongated heat pipe including an evaporator portion thermally coupled to the second side of the TEC and a condenser portion thermally coupled to the heat exchanger.

23. 23. The device of claim 22, wherein the heat pipe includes an outer metallic material, a capillary material radially inward from the outer metallic material, and a void radially inward from the outer metallic material, the void containing a working fluid that transitions from a vapor in the evaporator portion to a liquid in the condenser portion during operation of the device.

24. The device described in claim 16, wherein the rigid frame is worn by the person, the first region of the rigid frame comprises edge portions and bridge portions extending between the edge portions in a first direction, the second region of the rigid frame comprises temple portions extending from the edge portions in a second direction different from the first direction, the contact member is coupled to at least one of the bridge portions or the edge portions, and the heat exchanger is mounted to the temple portions.

25. 1. A heat transfer device comprising: a thermoelectric component (TEC) including a first side configured to be operated at a desired temperature and a second side opposite the first side; a contact member thermally coupled to the TEC, the contact member comprising a thermally conductive material and configured to enhance heat transfer to and / or from a target area of ​​the human; a heat transfer system configured to dissipate heat from the TEC, the heat transfer system including a heat transfer structure thermally coupled to the TEC and a heat exchanger thermally coupled to the heat transfer structure; an inflatable interface overlying and radially outward from the contact member, the inflatable interface applying pressure toward the contact member when inflated, the heat transfer device sized and shaped to fit around a human facial area, the inflatable interface including: (i) a rigid frame coupled to the inflatable interface; and (ii) a rigid member mounted to the heat exchanger. A device comprising:

26. the rigid frame facing outward from the inflatable interface and configured to overly a first side of the facial region of the person; the rigid member configured to be attached around a second side of the human facial region opposite the first side; an adjustable band extending from the rigid frame to the rigid member; Furthermore, 26. The device of claim 25, wherein when worn by the person, the adjustable band causes the rigid frame to exert pressure against the first side.

27. 27. The device of claim 26, wherein the heat transfer structure is disposed between the contact member and the expandable interface, and the heat transfer system further comprises: (i) a cold fluid passage fluidly coupled to an inlet region of the heat transfer structure and configured to provide cooled working fluid to the heat transfer structure; and (ii) a hot fluid passage fluidly coupled to an outlet region of the heat transfer structure and configured to receive heated working fluid from the heat transfer structure, the cold fluid passage and the hot fluid passage extending along at least a portion of the adjustable strap.

28. 28. The device of claim 27, wherein the heat transfer structure is a first heat transfer structure, the device further comprising a second heat transfer structure thermally coupled to the first side of the TEC and fluidly coupled to the cold fluid passage and the hot fluid passage, the second heat transfer structure configured to provide the cooled working fluid to the cold fluid passage and receive the heated working fluid from the hot fluid passage.

29. 26. The device of claim 25, wherein the TEC is coupled to the heat exchanger such that the second side of the TEC is configured to be cooled by the heat exchanger, and the TEC and the heat exchanger are spaced apart from the contact member.

30. A controller; a pump operably coupled to the controller and fluidly coupled to the inflatable interface; Furthermore, 26. The device of claim 25, wherein the pump is configured to inflate and / or deflate the inflatable interface based on signals received from the controller.

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