Plasma-resistant arc-prevention coatings for manufacturing equipment components

Abstract

The method includes depositing a first layer of a first material on a surface of a chamber component of the processing chamber. The first material includes a polymer, the polymer having a dielectric strength of at least 40 MV / m. The method further includes depositing a second layer of a second material on the first layer. The second material includes a first ceramic material impregnated with the first polymer or the second polymer. The method further includes depositing a third layer. The third layer is a third material. The third material includes the first ceramic material or the second ceramic material. The third material does not adhere to the first polymer or the second polymer. The third material adheres to the first ceramic material or the second ceramic material of the second layer.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to coatings for components of manufacturing equipment. More specifically, the present disclosure relates to plasma-resistant, arc-preventing coatings for components of manufacturing equipment.

[0002] In various manufacturing processes, chamber components and their coating materials are exposed to high temperatures, high energy plasmas, mixtures of corrosive gases, high stresses, high strength electric fields, and combinations thereof. These extreme conditions increase the susceptibility of components and coating materials to defects. Coatings are effective in protecting chamber components from one or more of these damaging conditions. In some cases, coatings that protect against multiple conditions can be applied to a particular component, chamber, process, etc. In some cases, multi-layer components can protect chamber components from multiple damaging conditions. Overview

[0003] The following is a simplified summary of the disclosure to provide a basic understanding of some aspects of the disclosure. This summary is not an extensive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor to delineate the scope of particular implementations of the disclosure or the claims. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented below.

[0004] In one aspect of the disclosure, a method of coating a chamber component of a processing chamber is described. The method includes depositing a first layer of a first material on a surface of the chamber component. The first material includes a first polymer. The first polymer has a dielectric strength (maximum electric field the material can withstand before electrical breakdown) of at least 40 megavolts per meter (MV / m). The method further includes depositing a second layer of a second material on the first layer. The second material includes a polymer, which may be the first polymer or the second polymer. The second material includes a first ceramic material impregnated in the polymer of the second layer. The method includes depositing a third layer of a third material on the second layer. The third material includes the first ceramic material or the second ceramic material. The third material does not adhere to the first material. The third material adheres to the ceramic material of the second material.

[0005] In another aspect of the disclosure, a chamber component for a processing chamber is described. The chamber component includes a body and a coating deposited on the body. The coating includes a first layer of a first material deposited on a surface of the chamber component. The first material includes a first polymer having a dielectric strength of at least 40 MV / m. The coating also includes a second layer of a second material. The second material includes a first ceramic material. The first ceramic material is impregnated with the first polymer or the second polymer. The coating also includes a third layer of a third material. The third material includes the first ceramic material or the second ceramic material. The first ceramic material or the second ceramic material of the third layer does not adhere to the first polymer or the second polymer. The first ceramic material or the second ceramic material of the third layer adheres to the first ceramic material of the second layer.

[0006] In another aspect of the present disclosure, a processing chamber is described. The processing chamber includes a substrate support. The substrate support includes a coating deposited on a surface of the substrate support. The coating includes a first layer of a first material deposited on a surface of the substrate support. The first material includes a first polymer having a dielectric strength of at least 40 MV / m. The coating also includes a second layer of a second material. The second material includes a first ceramic material. The first ceramic material of the second layer is impregnated with the first polymer or the second polymer. The coating also includes a third layer of a third material. The third material includes the first ceramic material or the second ceramic material. The first ceramic material or the second ceramic material of the third layer does not adhere to the first polymer or the second polymer of the second layer. The first ceramic material or the second ceramic material of the third layer adheres to the first ceramic material of the second layer. [Brief description of the drawings]

[0007] The present disclosure is described by way of example, not by way of limitation. It should be noted that different references to "a" or "an" embodiment in the present disclosure do not necessarily refer to the same embodiment, and such references mean at least one embodiment. [Figure 1] FIG. 1 illustrates a cross-sectional view of a processing chamber having one or more chamber components that can be coated with a dual arc-resistant and plasma-resistant coating according to some embodiments. [Figure 2A] ~ [Figure 2B] 1 illustrates a cross-sectional view of an exemplary coated article according to some embodiments. [Diagram 3] 1 illustrates an exemplary architecture of a deposition system for performing aerosol deposition, according to some embodiments. [Figure 4A] ~ [Figure 4B] 1 illustrates an arrangement and apparatus for performing energetic particle assisted deposition techniques, according to some embodiments. [Diagram 5] 1 shows a schematic diagram of a plasma spray deposition apparatus used for spray deposition techniques according to some embodiments. [Figure 6A] ~ [Figure 6B] FIG. 1 is a flow diagram illustrating a method for depositing a protective coating on a component according to some embodiments. Detailed Description

[0008] Described herein are techniques related to protecting components of a manufacturing chamber by coating them with one or more resistant materials. Manufacturing equipment (such as processing chambers) are used to process substrates, such as semiconductor wafers. The characteristics of the substrate are determined by the conditions under which the substrate is processed. The components of the processing chamber affect the conditions proximate to the substrate, which affects performance (target substrate characteristics, consistency of production, etc.). In some embodiments, the components of the processing chamber may be exposed to harsh or damaging environments. Coating the components with a resistant material can protect the components from wear and damage caused by these environments.

[0009] In some embodiments, processing may involve large amounts of electrical energy (e.g., high current, high voltage, etc.) in components of a processing chamber. In such cases, arcing may occur in gaps (e.g., intentional gaps, gaps induced by small manufacturing differences in the flatness or smoothness of adjacent surfaces, etc.) between components of a manufacturing device. Arcing may cause component damage, substrate damage, adverse conditions, unintended plasma generation, etc. Arcing may occur, for example, when an electric field overcomes the binding energy of electrons in an insulator (e.g., air), causing a current to flow through the insulator. In a vacuum, a similar phenomenon may occur due to an electric field that is strong enough to release electrons from a component and move them through the vacuum to other components, or an electric field that accelerates electrons released by other means.

[0010] In some embodiments, a substrate can be processed using a plasma. Plasma processing can include generating a plasma from halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, CH2F3, F2, NF3, Cl2, CCl4, BCl3, SiF4, and other gases such as O2 and N2O. The plasma can interact with components of the processing chamber. Contact with the plasma can cause damage or wear to the components of the processing chamber.

[0011] The disclosed method and device address at least some of the deficiencies of conventional approaches. In some embodiments, components of a fabrication chamber may be subject to both the large amount of electrical energy and plasma introduced for substrate processing. Arc prevention can be achieved by coating one or more components (or portions of components) with a material of high dielectric strength, e.g., a material that is resistant to arcing to high electric field strengths. For example, many polymers exhibit high dielectric strength. Resistance to damage from interaction with plasma can be reduced by providing one or more components of the processing chamber with a plasma-resistant coating. A plasma-resistant coating is comprised of a material that is resistant to erosion and corrosion from exposure to plasma processing conditions. The resistance of a coating material to plasma can be measured by its "etch rate" (ER), which has units of angstroms per minute (Å / min), over the duration of operation and exposure to plasma of the coated component. Plasma resistance can also be measured by its erosion rate, which has units of nanometers per radio frequency hour (nm / RFHr), where 1 RFHr represents 1 hour of treatment at the plasma processing conditions. Measurements are taken after different treatment times. For example, measurements are taken before treatment, after 50 treatment hours, 150 treatment hours, 200 treatment hours, etc. Erosion rates of less than about 100 nm / RFHr are typical for plasma-resistant coating materials. A single plasma-resistant material may have multiple different plasma resistance or erosion rate values. For example, a plasma-resistant material may have a first plasma resistance or erosion rate associated with a first type of plasma and a second plasma resistance or erosion rate associated with a second type of plasma. Many ceramic materials, including oxide ceramics, carbide ceramics, and nitride ceramics, exhibit such low erosion rates and can be used as plasma-resistant coating materials.

[0012] Materials with high dielectric strength (e.g., polymers such as ethylene chlorotrifluoroethylene) may not be sufficiently plasma resistant for use in plasma processing chambers (e.g., etch chambers). Materials with high plasma resistant properties (e.g., metal oxides) may not have high dielectric strength. Polymers also tend to have poor adhesion to other materials, and plasma resistant ceramics in particular generally do not adhere well to polymeric materials. For chamber components, the coating may be robust enough to withstand processing conditions, handling (e.g., during maintenance events), thermal stress, cleaning, and machining (e.g., polishing). The adhesion between the polymer and ceramic layers may not have such capabilities.

[0013] Embodiments of the present disclosure are directed to a multi-layer coating for a chamber component that protects against both arcing and plasma damage. The multi-layer coating can include at least three layers, a polymer layer that protects against arcing, a ceramic layer that is comprised of a plasma-resistant ceramic material and provides plasma resistance, and an intermediate layer that provides adhesion between the other polymer layer and the ceramic layer. In embodiments, the intermediate layer is comprised of (e.g., includes, or consists of) a polymer that is impregnated with particles of a ceramic material. The polymer of material can bond with a polymer layer deposited on the chamber component. The polymer layer is a base layer and can provide insulation against the effects of arcing. The ceramic particles of the material in the intermediate layer can provide points for anchoring the ceramic layer and can exhibit high plasma resistance.

[0014] The embodiments of the present disclosure allow for the manufacture of articles, such as chamber components for processing chambers, that have both a high dielectric strength layer and a plasma-resistant coating layer on one or more surfaces of the article. The high dielectric strength layer comprises a polymer. The polymer can include polymers of ethylene (e.g., polymers of ethylene monomers that may or may not be synthesized directly from ethylene) and related compounds such as fluorine or chlorine substituted ethylenes (e.g., polymers including fluorinated ethylene monomers, polymers including chlorinated ethylene monomers). The polymer can be deposited on the chamber component using any suitable means, such as blade coating, spray coating, thermal spray coating, aerosol deposition, pulsed laser deposition, plasma polymerization, flow coating, spin coating, dip coating, and the like. The plasma-resistant coating layer can be deposited on the article using a variety of techniques, such as plasma spray techniques, thermal spray techniques such as detonation spray, wire arc spray, high velocity fuel (HVOF) spray, flame spray, warm spray, and cold spray, aerosol deposition, electron beam evaporation, electroplating, ion-assisted deposition (IAD), physical vapor deposition (PVD), chemical vapor deposition (CVD), and plasma-assisted deposition. The plasma-resistant coating layer may comprise one ceramic material or a mixture of ceramic materials. Some materials that may be used include oxide-based ceramics such as SiO2 (quartz), Al2O3, Y2O3, Y4Al2O9, Y2O3-ZrO2, etc. The plasma-resistant coating may comprise carbide-based ceramics such as SiC, Si-SiC, etc. The plasma-resistant coating may comprise nitride-based ceramics such as AlN, SiN, etc. The plasma-resistant coating may comprise any of these compounds, and combinations thereof. The increased erosion resistance of the plasma-resistant coating material to the coated article, and the increased arc resistance of the base polymer layer to the coated article, increases the useful life of the article and reduces maintenance and manufacturing costs.

[0015] FIG. 1 is a cross-sectional view of a processing chamber 100 with one or more chamber components that can be coated with an arc-resistant and plasma-resistant duplex coating, according to some embodiments. The processing chamber 100 can be used for processes in which the components of the processing chamber 100 carry large amounts of electrical energy (high current, high voltage, etc.). The processing chamber 100 can be used for processes in which a corrosive plasma environment with plasma processing conditions is provided. For example, the processing chamber 100 can be a chamber of a plasma etcher or plasma etch reactor, plasma cleaner, etc. Examples of chamber components that can include the arc-resistant and plasma-resistant coating include the substrate support assembly 104, electrostatic chuck (ESC), ring (such as a process kit ring or single ring), chamber walls, base, gas distribution plate, showerhead 106, nozzle, lid, liner, liner kit, shield, plasma screen, flow equalizer, cooling base, chamber viewport, chamber lid, etc. The coating applied to one or more components of the chamber can include a polymer component and a ceramic component.

[0016] As shown, the substrate support assembly 104, according to one embodiment, has an arc- and plasma-resistant coating 136. It should be understood that any of the other chamber components, such as those listed above, may include an arc- and plasma-resistant coating.

[0017] In one embodiment, the processing chamber 100 includes a chamber body 108 and a showerhead 106 that enclose an interior volume 110. The showerhead may include a showerhead base and a showerhead gas distribution plate. Alternatively, the showerhead 106 may be replaced by a lid and a nozzle in some embodiments. The chamber body 108 may be fabricated from aluminum, stainless steel, or other suitable materials. The chamber body 108 typically includes a sidewall 112 and a bottom 114. Any of the showerhead 106 (or lid and / or nozzle), sidewall 112, and / or bottom 114 may include an arc- and plasma-resistant coating layer.

[0018] An exhaust port 116 may be formed in the chamber body 108 and couple the interior volume 110 to a pumping system 118. The pumping system 118 may include one or more pumps and a throttle valve used to evacuate and regulate the pressure of the interior volume 110 of the processing chamber 100.

[0019] The showerhead 106 can be supported on a sidewall 112 of the chamber body 108. The showerhead 106 (or lid) can be opened to allow access to the interior volume 110 of the processing chamber 100 and can be closed to seal the processing chamber 100. A gas panel 120 can be coupled to the processing chamber 100 and can provide process gases and / or cleaning gases to the interior volume 110 through the showerhead 106 or the lid and nozzles. The showerhead 106 is used in processing chambers used for dielectric etching (etching dielectric materials). The showerhead 106 includes a gas distribution plate (GDP) with multiple gas supply holes throughout the GDP. The showerhead 106 can include a GDP bonded to an aluminum base or an anodized aluminum base. The GDP can be made of Si or SiC and can be ceramics such as Y2O3, Al2O3, YAG, etc.

[0020] For processing chambers used for conductor etching (etching conductive materials), a lid can be used instead of a showerhead. The lid can include a central nozzle that fits into a central hole in the lid. The lid can be a ceramic, such as Al2O3, Y2O3, YAG, or a ceramic compound including a solid solution of Y4Al2O9 and Y2O3-ZrO2. The nozzle can also be a ceramic, such as Y2O3, YAG, or a ceramic compound including a solid solution of Y4Al2O9 and Y2O3-ZrO2. The lid, showerhead base, GDP, and / or nozzle can be coated with an arc and plasma resistant coating layer according to embodiments.

[0021] Examples of process gases that can be used to process a substrate in the process chamber 100 include halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, CH2F3, F, NF3, Cl2, CCl4, BCl3, SiF4, and other gases such as O2, N2O. Examples of carrier gases include N2, He, Ar, and other gases that are inert to the process gas (such as non-reactive gases). The substrate support assembly 104 is disposed in the interior volume 110 of the process chamber 100 below the showerhead 106 or lid. The substrate support assembly 104 holds the substrate 102 during processing. A ring (e.g., a single ring) can cover a portion of the support assembly 104 (e.g., the susceptor 122) to protect the covered portion from exposure to plasma during processing. The ring is silicon or quartz in one embodiment. The substrate support assembly 104 can include a pedestal 124 and a susceptor 122.

[0022] FIG. 1 shows a protective coating 136 disposed on a surface of a portion of the substrate support assembly 104. Other components of the processing chamber can be coated with the same coating or a different coating. The coating 136 is composed of multiple layers of various materials and exhibits high dielectric strength to provide arc resistance and a layer of ceramic material to provide plasma resistance. In some embodiments, the coating 136 can include a polymer layer. In some embodiments, the polymer layer can be applied directly to the body of the chamber component (such as a metal component body and / or a ceramic component body), for example, by aerosol deposition. Aerosol deposition is described in more detail in connection with FIG. 3.

[0023] In some embodiments, the coating layer 136 may not be applied to the same portion of the surface of the chamber component. For example, in some embodiments, the polymer layer may be applied to a larger area of ​​the surface of the chamber component than the ceramic layer. In some embodiments, the chamber component may extend beyond the area where any hazardous conditions exist. As shown, the substrate support assembly 104 extends from the interior volume 110 through the chamber bottom 114 to an area outside the chamber. This area of ​​the substrate support assembly 104 may not encounter plasma conditions. This area may be protected from arcing by the polymer layer. In some embodiments, a seal is formed between the parts (e.g., to maintain a vacuum condition in the interior volume 110). In some embodiments, a seal may be formed on a surface coated with at least some components of the coating 136. For example, the polymer layer of the coating 136 may penetrate the chamber bottom 114 and form a seal between the chamber bottom 114 and the coating 136 (e.g., with an O-ring, gasket, etc.).

[0024] 2A-B show cross-sectional views of an exemplary coated article according to some embodiments. FIG. 2A shows coated article 200 having body 202 and coating layers 240, 206, and 208. Body 202 may be the body of any of a variety of chamber components including, but not limited to, a substrate support assembly, an electrostatic chuck (ESC), a ring (e.g., a process kit ring or a single ring), a chamber wall, a base, a gas distribution plate, a showerhead, a nozzle, a lid, a liner, a liner kit, a shield, a plasma screen, a flow equalizer, a cooling base, a chamber viewport, a chamber lid, etc. The body may be made of a metal (aluminum, stainless steel, etc.), a ceramic, a metal-ceramic composite, a polymer, a polymer-ceramic composite, or other suitable material.

[0025] In some embodiments, the coating layer 204 applied directly to the body 202 can include a polymeric material. In some embodiments, one or more primer layers are applied to the body 202 prior to the coating layer 204. Polymeric materials tend to exhibit high dielectric strength, e.g., resistance to breakdown and arcing in high electric field environments. The coating layer 204 can be provided with a polymer having a high dielectric strength, e.g., 20 MV / m or more, 40 MV / m or more, 50 MV / m or more, 70 MV / m or more, or other threshold suitable for the application of the body 202. The determination of the material to be used in the coating layer 204 can also include other considerations, e.g., thermal expansion characteristics, ease of handling of the material, chemical properties, physical properties, surface properties, affinity for the material of the body 202, etc. The coating layer 204 can be applied using any technique suitable for depositing a thin layer of polymer on a body, such as aerosol coating, dip coating, blade coating, spin coating, etc.

[0026] A wide range of polymers may be suitable for the coating layer 204. Suitable polymers include polymers of ethylene, propylene, styrene, polymers containing monomers of multiple structures, polymers containing fluorinated or chlorinated versions of these monomers, or other polymers. Suitable polymers include polyethylene, polytetrafluoroethylene, ethylene chlorotrifluoroethylene, ethylene tetrafluoroethylene, polyether ether ketone, and the like. In some embodiments, a mixture of polymers may be used. In some embodiments, the coating layer 204 may include other additives, such as plasticizers, materials that increase durability or resistance, in addition to the polymers contained in the coating layer 204. The thickness of the coating layer 204 may be any suitable thickness, from a few thousandths of an inch to a few hundredths of an inch. In some embodiments, the thickness of the coating layer 204 may be between 2 and 15 thousandths of an inch. In some embodiments, the thickness of the coating layer 204 may be between 3 and 101 thousandths of an inch. In some embodiments, the surface of the coating layer 204 may be further processed (polished, smoothed, etc.) after deposition.

[0027] In some embodiments, the coating layer 208 can provide plasma resistance to the body 202 and underlying coating layers (e.g., layer 206). The plasma-resistant coating layer 208 can be coated onto the body by a variety of techniques depending on the application and coating properties selected. Coating techniques include plasma spray techniques, thermal spray techniques such as detonation spray, wire arc spray, high velocity fuel (HVOF) spray, flame spray, warm spray, cold spray, aerosol deposition, electron beam evaporation, electroplating, ion-assisted deposition (IAD), physical vapor deposition (PVD), chemical vapor deposition (CVD), and plasma-assisted deposition. The plasma-resistant coating layer 208 can include one or more plasma-resistant materials.

[0028] The plasma resistant coating layer 208 may be a ceramic oxide (e.g., alumina Al2O3, yttria Y2O3, yttrium aluminum garnet Y3Al5O 12 , Yttrium aluminum perovskite YAlO3, Zirconia ZrO2, Silicon dioxide SiO2, Er2O3, ErAl x O Y , YAl x O Y , YZr x O Y and YZr x Al Y O z , Gd2O3, Yb2O3, Y2O3 stabilized ZrO2 (YSZ), Er3Al5O 12 The plasma-resistant ceramic material may include ceramic materials (plasma-resistant ceramic materials) such as ceramic oxides (e.g., silicon carbide SiC, silicon-silicon carbide Si-SiC, boron carbide B4C, etc.), nitride-based ceramics (e.g., aluminum nitride AlN, silicon nitride SiN), other ceramic materials, or combinations of materials. Examples of ceramic oxides that may be used in the plasma-resistant coating layer 208 include, for example, yttrium-based oxides, erbium-based oxides. Additionally, ceramic fluorides / oxyfluorides may be used in the plasma-resistant coating layer 208. Examples include YO x F y , YF3, etc.

[0029] In one embodiment, the plasma-resistant coating layer 208 is a metal oxide coating that includes or consists of a solid solution of yttria and zirconia (Y2O3-ZrO2). In one embodiment, the Y2O3-ZrO2 solid solution can include 20-80 mol% Y2O3 and 20-80 mol% ZrO2. In another embodiment, the Y2O3-ZrO2 solid solution can include 30-70 mol% Y2O3 and 30-70 mol% ZrO2. In a further embodiment, the Y2O3-ZrO2 solid solution can include 40-60 mol% Y2O3 and 40-60 mol% ZrO2. In a further embodiment, the Y2O3-ZrO2 solid solution can include 50-80 mol% Y2O3 and 20-50 mol% ZrO2. In further embodiments, the Y2O3-ZrO2 solid solution includes 60-70 mol% Y2O3 and 30-40 mol% ZrO2. In other examples, the Y2O3-ZrO2 solid solution can include 45-85 mol% Y2O3 and 15-60 mol% ZrO2, 55-75 mol% Y2O3 and 25-45 mol% ZrO2, 58-62 mol% Y2O3 and 38-42 mol% ZrO2, and 68-72 mol% Y2O3 and 28-32 mol% ZrO2.

[0030] In various embodiments, the plasma resistant coating layer 208 is YAlO 12 (YAG), Y4Al2O9(YAM), Er3Al5O 12 (EAG), Gd3Al5O 12 (GAG), YAlO3(YAP), Er4Al2O9(EAM), ErAlO3(EAP), Gd4Al2O9(GdAM), GdAlO3(GdAP), Nd3Al5O 12(NdAG), Nd4Al2O9 (NdAM), NdAlO3 (NdAP), and / or ceramic compounds including Y4Al2O9 and Y2O3-ZrO2 solid solutions. The plasma-resistant coating layer 208 may be an Er-Y composition (e.g., Er 80 wt%, Y 20 wt%), an Er-Al-Y composition (e.g., Er 70 wt%, Al 10 wt%, Y 20 wt%), an Er-Y-Zr composition (e.g., Er 70 wt%, Y 20 wt%, Zr 10 wt%), or an Er-Al composition (e.g., Er 80 wt%, Al 20 wt%). It should be noted that wt% means weight percent, whereas mol% is a molar ratio.

[0031] The plasma-resistant coating layer 208 may be based on a solid solution formed by any of the aforementioned ceramics. With respect to ceramic compounds including Y4Al2O9 and Y2O3-ZrO2 solid solutions, in one embodiment the ceramic compound includes 62.93 mole percent (mol %) Y2O3, 23.23 mol % ZrO2, and 13.94 mol % Al2O3. In another embodiment, the ceramic compound includes 62.93 mole percent Y2O3, 23.23 mol % ZrO2, and 13.94 mol % Al2O3 in the range of 50-75 mol % Y2O3. 3、 In another embodiment, the ceramic compound may include ZrO2 in the range of 10-30 mol% and Al2O3 in the range of 10-30 mol%. 3、 ZrO in the range of 0 to 60 mol% 2、 and Al2O3 in the range of 0-10 mol %. In another embodiment, the ceramic compound may include YO in the range of 40-60 mol %. 3、 ZrO in the range of 30-50 mol% 2、 and Al2O3 in the range of 10-20 mol %. In another embodiment, the ceramic compound may include YO in the range of 40-50 mol %. 3、 ZrO in the range of 20-40 mol% 2、 and Al2O3 in the range of 20-40 mol %. In another embodiment, the ceramic compound may include YO in the range of 70-90 mol %. 3、 ZrO in the range of 0-20 mol% 2、and 10-20 mol% Al2O3. In another embodiment, the ceramic compound may include 60-80 mol% YO 3、 ZrO in the range of 0-10 mol% 2、 and Al2O3 in the range of 20-40 mol %. In another embodiment, the ceramic compound may include YO in the range of 40-60 mol %. 3、 ZrO in the range of 0-20 mol% 2、 and Al2O3 in the range of 30-40 mol %. Other distributions for the ceramic compound may be used in other embodiments.

[0032] Any of the aforementioned plasma-resistant coating layers 208 may include one or more dopants constituting up to about 2 mole percent of the coating. Such dopants may be rare earth oxides of the lanthanide series, such as Er (erbium), Ce (cerium), Gd (gadolinium), Yb (ytterbium), Lu (lutetium), etc. Additionally or alternatively, such dopants may include Al (aluminum) and / or Si (silicon).

[0033] The plasma-resistant coating layer 208 may be of any suitable thickness. In some embodiments, the coating layer 208 may be of a thickness between 15 and 40 thousandths of an inch. In some embodiments, the coating layer 208 may be of a thickness between 8 and 30 thousandths of an inch. In some embodiments, the coating layer 208 may be of a thickness between 10 and 25 thousandths of an inch. In some embodiments, the surface of the coating layer 208 may be processed after deposition. For example, the surface of the coating layer 208 may be polished after deposition.

[0034] In some cases, the material of the plasma-resistant layer 208 may not adhere to the polymeric material of the coating layer 204 (e.g., may not adhere strongly enough to withstand lamination or separation under normal manufacturing or operating conditions of the body 202). The coating layer 206 may be considered a transition layer that exhibits sufficient adhesion to both the coating layer 204 and the coating layer 208. The coating layer 206 may include a polymeric material. The polymeric material may be of the same or different composition as the polymer of the coating layer 204. The polymeric material may include any of the materials described above in connection with the coating layer 204. The coating layer 206 may also include a ceramic material. The ceramic material may include any of the materials described above in connection with the coating layer 208. The ceramic material of the layer 206 may be the same or different from the material of the layer 208. The ceramic material may be impregnated into the polymeric material of the layer 206 as small particles. In some embodiments, the size of the ceramic material particles may be up to 100 μm. In some embodiments, the size of the ceramic material particles of the layer 206 may be between 1 μm and 80 μm. The composition of layer 206 (e.g., ratio of polymeric material to ceramic material) can be tailored for a particular application, chamber component, etc. In some embodiments, the material of layer 206 can include 10 percent to 90 percent ceramic material (measured by volume). In some embodiments, the material of layer 206 can include 20 percent to 80 percent ceramic material. In some embodiments, the ceramic material of layer 208 can utilize the ceramic particles of layer 206 to secure layer 208 to layer 206, without being bound by theory. In some embodiments, the surface of coating layer 206 can be roughened. Roughening can increase the exposure of the ceramic particles of layer 206 (e.g., can increase the surface area of ​​exposed ceramic material). Coating layer 206 can be roughened to have an Ra (arithmetic mean of deviation from average height) value between 8 and 64 thousandths of an inch. In one embodiment, the roughening is performed using bead or sand blasting of coating layer 206.Alternatively, other roughening processes such as chemical etching, mechanical roughening, etc. may be performed. The layer 206, which includes both polymeric and ceramic phases, may be deposited in a variety of ways. In some embodiments, the polymeric and ceramic materials of the layer 206 may be deposited simultaneously. The polymer and ceramic may be deposited by co-spraying the polymer and ceramic from a single spray device. The polymer and ceramic may be deposited from a single spray device with dual feed ports. The polymer and ceramic may be deposited using two spray devices simultaneously, where one spray device performs an aerosol spray coating of the polymer and another spray device performs an aerosol spray coating of the ceramic.

[0035] FIG. 2B illustrates a coated article 210 including a body 212 and multiple coating layers. The body 212 may be any of a variety of chamber components, such as those described above in connection with the body 202 of FIG. 2A. The body 212 may be constructed from a variety of materials, such as those described above in connection with the body 202. The coating layer 214 may provide high dielectric strength to reduce arcing to or from the surface of the article 210. The coating layer 214 may include a polymeric material. The coating layer 214 may have many features in common with the coating layer 204 of FIG. 2A. The coating layer 218 may provide plasma resistance. The coating layer 218 may include one or more ceramic materials, including ceramic oxides, ceramic carbides, ceramic nitrides, and the like. The coating layer 218 may have many features in common with the coating layer 208 of FIG. 1A.

[0036] The article 210 includes two intermediate layers of material, coating layer 216 and coating layer 217. In some embodiments, the composition of these two layers may be different. Either or both of these layers may have features in common with coating layer 206 of FIG. 2A. In some embodiments, the performance of the article 210 may be improved by reducing the property differences between layers at the interfaces between the layers. For example, the materials of the body 212, coating layer 214, and coating layer 218 may be selected to provide maximum usability for the operation of the article 210. The materials of the coating layers 216 and 217 may be selected to reduce large property changes at a single interface. For example, the polymeric materials of the coating layers 216 and 217 may be selected such that the thermal expansion coefficients of adjacent layers are below a target threshold at each layer interface. As the article 210 expands and contracts upon heating and cooling, different materials (e.g., different coating layers) may expand and contract at different rates, become different sizes, etc. The mismatch in the coefficients of thermal expansion between adjacent layers can make the coating susceptible to cracking, flaking, delaminating, or loss of bond between the layers. The material of coating layer 216 can include a different polymer phase, a different ceramic phase, and / or a different ratio of polymer content to ceramic content than coating layer 217.

[0037] In some embodiments, the final plasma-resistant coating material (e.g., coating layer 208, coating layer 218) may be a thin film. In some embodiments, the coated article may include multiple layers of the final plasma-resistant coating material forming a thin film stack. Each thin film plasma-resistant coating material layer may have a thickness of less than about 20 micrometers, and in some embodiments, less than about 10 micrometers. In some embodiments, thin film coatings may be advantageous for improving chamber performance due to their dense and defect-free characteristics.

[0038] 3-5 illustrate several methods of applying a coating to a component, according to some embodiments. FIG. 3 illustrates an exemplary architecture of a deposition system 300 for aerosol deposition, according to some embodiments. The system 300 can be used to apply various coatings to components of processing equipment. The system 300 can be used to apply coatings of many types of materials, including polymeric coatings (e.g., high dielectric strength coatings), ceramic coatings (e.g., plasma resistant coatings), coatings with multiple components (e.g., polymeric and ceramic phases, etc.), or other types of coatings. The system 300 includes a deposition chamber 302. The deposition chamber can include a stage 304 for mounting a component 306 to be coated (e.g., body 202 of FIG. 1A, body 212 of FIG. 1B, etc.). Ambient pressure within the interior volume 303 of the chamber 302 can be reduced by a vacuum system 308 connected to the interior volume 303 through an exhaust port 309 formed in the body of the chamber 302. The aerosol chamber 310 contains a coating powder for coating the component 306, such as a polymer powder, a metal oxide powder, a mixture of powders, etc. The aerosol chamber 310 is connected to a gas container 312. The coating material in the aerosol chamber 310 may be in the form of a fine powder, for example with particle sizes ranging from a few μm to hundreds of μm. A carrier gas flows from the gas container 312 through the aerosol chamber 310 and into the interior volume 303. The carrier gas propels the coating powder through a nozzle 314, directing the coating powder towards the component 306 to form a coating.

[0039] The component 306 may be a component used in semiconductor manufacturing. The component 306 may be a component of an etch reactor, a thermal reactor, a semiconductor processing chamber, etc. Examples of possible components include a lid, a substrate support, a process kit ring, a chamber liner, a nozzle, a showerhead, a wall, a base, a gas distribution plate, etc. The component 306 may be formed of materials such as aluminum, silicon, quartz, metal oxides, ceramic compounds, polymers, composites, etc.

[0040] In some embodiments, the surface of the component 306 can be polished to reduce the surface roughness of the component 306. Reducing the surface roughness may improve the thickness and uniformity of the coating. In some embodiments, the surface roughness is reduced to below the target thickness of the coating layer. In some embodiments, not all areas of the component 306 are coated. Areas of the component 306 may be masked, shielded, or removed from areas accessed by the aerosol powder. In some embodiments, the coating can be removed from areas that should not be coated after coating.

[0041] The component 306 can be mounted on a stage 304 within the deposition chamber 302 during deposition of the coating. The stage 304 can be a movable stage (e.g., a motorized stage) that can move in one, two, or three dimensions and / or rotate in one or more dimensions such that the stage 304 can be moved to various positions to facilitate coating the component 306 with the coating powder ejected from the nozzle 314. For example, the stage 304 can be moved to coat different portions or sides of the component 306. The nozzle 314 can be selectively aimed at particular portions of the component 306 from various angles and directions.

[0042] In some embodiments, the deposition chamber 302 can be evacuated using a vacuum system 308. Providing a vacuum environment in the interior volume 303 facilitates the application of the coating. For example, when the interior volume 303 is under vacuum, the coating powder ejected from the nozzle 314 faces less resistance when traveling to the component 306. The coating powder can impinge on the component 306 more regularly, at a higher velocity, etc., which can facilitate adhesion to the component 306, facilitate the formation of the coating, and reduce wasted coating material.

[0043] The gas container 312 holds a pressurized carrier gas. The pressurized carrier gas used may include an inert gas such as argon, nitrogen, krypton, etc. The pressurized carrier gas travels under pressure from the gas container 312 to the aerosol chamber 310. As the pressurized gas travels from the aerosol chamber 310 to the nozzle 314, the carrier gas propels a portion of the coating powder out of the aerosol chamber 310 and towards the nozzle 314.

[0044] In some embodiments, the system 300 can be used to deposit a single material on one or more surfaces of the component 306. In some embodiments, the system 300 can be used to deposit multiple materials on the component 306. In some embodiments, a polymer layer including multiple polymers may be deposited on the component 306. In some embodiments, a ceramic layer including multiple ceramic materials may be deposited on the component 306. In some embodiments, a material including a polymer phase and a ceramic phase may be deposited on the component 306. Multiple materials can be co-deposited by providing a mixture of powder materials to the aerosol chamber 310. In alternative embodiments, two or more aerosol chambers can be coupled to the pressurized gas and the nozzle 314, each providing a material to the nozzle 314 individually. In alternative embodiments, multiple nozzles can receive material from multiple aerosol chambers coupled to a pressurized carrier gas. These embodiments allow for multiple materials to be deposited simultaneously.

[0045] As the carrier gas propelling the suspension of coating powder enters the deposition chamber 302 through the nozzle 314, the coating powder is propelled towards the component 306. In one embodiment, the carrier gas is pressurized such that the coating powder is propelled towards the component 306 at a velocity of 150 m / s to 500 m / s. In some embodiments, the particle size of the coating powder and the pressure of the carrier gas can be adjusted to target velocity distribution of the coating powder.

[0046] In some embodiments, the nozzle 314 is formed to be wear resistant. Because the coating powder passes through the nozzle 314 at high velocity, the nozzle 314 can wear and deteriorate quickly. The nozzle 314 can be formed with a shape and material that reduces wear.

[0047] In some embodiments, upon impact with the component 306, the particles of the coating powder are crushed and deformed by kinetic energy to form a layer that adheres to the component 306. As the application of the coating powder continues, the particles bond together into a coating or film. The coating on the component 306 continues to grow as the particles of the coating powder continue to impact the component 306. In some embodiments, the particles mechanically collide with each other and with the substrate at high speeds under vacuum and, rather than melting, break into smaller pieces to form a dense layer. In some embodiments, the crystalline structure of the particles of the coating powder in the aerosol chamber 310 is maintained throughout application to the component 306. In some embodiments, melting of the particles may occur when kinetic energy is converted to thermal energy. In some embodiments, the aerosol deposition can be performed at room temperature or between 15° C. and 35° C. In some embodiments, the component 306 does not need to be heated and the aerosol application process does not significantly increase the temperature of the component 306. Such applications can be used to coat assemblies that may be damaged in high temperature environments. For example, a component made of multiple pieces secured together with adhesive layers that melt at low temperatures may be damaged during a deposition process carried out at high temperatures. In yet another example, a component made of multiple pieces of different materials with different thermal expansion properties may be damaged as the pieces expand at different rates or to different sizes during deposition. Such components may be less susceptible to damage when coated at room temperature.

[0048] In some embodiments, the aerosol deposition can be performed at an elevated temperature. In some embodiments, the component 306 can be heated before or during aerosol deposition. Such heating can facilitate melting of the coating powder. In some embodiments, after deposition occurs, the component 306 can be placed in an oven to heat the component and coating material for a period of time. The temperature of the component 306 and coating can increase, partially or completely melting the coating. The coating can be caused to flow over the surface of the component 306, for example, to improve coating uniformity and allow the coating to reach new areas of the surface of the component 306.

[0049] In some embodiments, the coated component may be subjected to post-coating processes. For example, the ceramic coating may be polished or ground after application to the component 306. The coated component may be subjected to other post-coating processes, such as heat treatment. In some embodiments, heat treatment creates a coating interface between the coating and the component. For example, an yttria (YO) coating on an alumina (Al2O3) component may form a yttrium aluminum garnet (YAG) layer that aids in adhesion and further protects the component. The barrier layer may reduce the occurrence of delamination, chipping, peeling, flaking, etc. Heat treatment may also change the chemical composition of the coating, and a yttria / alumina duplex coating may be converted to a YAG coating by heat treatment.

[0050] 4A-4B show mechanisms and apparatus for performing energetic particle-based deposition techniques, according to some embodiments. FIG. 4A shows a deposition mechanism applicable to various energetic particle-based deposition techniques, such as ion-assisted deposition (IAD). Exemplary IAD methods include deposition processes incorporating ion bombardment, such as evaporation (e.g., activated reactive evaporation (ARE)), and processes for forming coatings described herein by sputtering in the presence of ion bombardment. Any IAD method can be performed in the presence of reactive gas species, such as O2, N2, halogens, etc.

[0051] As shown, a thin coating layer 415 is formed by accumulating deposition material 402 in the presence of energetic particles 403, such as ions. The deposition material 402 may include atoms, ions, radicals, or a mixture thereof. The energetic particles 403 may impact and compact the thin final plasma-resistant coating layer 415 that is formed.

[0052] In one embodiment, IAD is utilized to form the thin coating layer 415, as previously described elsewhere herein. FIG. 4B is a schematic diagram of an IAD deposition apparatus. As shown, a material source 450 provides a flux of deposition material 452 for deposition on an article 460, while an energetic particle source 455 provides a flux of energetic particles 453, both of which bombard the article 460 throughout the IAD process. The energetic particle source 455 may be an oxygen or other ion source. The energetic particle source 455 can also provide other types of energetic particles, such as inert radicals, neutron atoms, and nano-sized particles, generated from a particle generation source (e.g., a plasma, a reactive gas, or a material source providing the deposition material). IAD can utilize one or more plasmas or beams to provide the material and the energetic ion source. Reactive species can also be provided during deposition of the plasma resistant coating.

[0053] In an IAD process, energetic particles 453 can be controlled by an energetic ion (or other particle) source 455, independent of other deposition parameters. Depending on the energy (e.g., velocity, etc.), density and incidence angle of the energetic ion flux, the composition, structure, crystal orientation and grain size of the thin protective layer can be manipulated. Additional parameters that can be adjusted are the temperature of the article during deposition and the duration of deposition. Ion energy can be broadly classified as low energy ion assist and high energy ion assist. Ions are projected at higher velocities with high energy ion assist than with low energy ion assist. Generally, high energy ion assist has shown superior performance. Substrate (article) temperature during deposition can be broadly classified as low (about 120-150°C in one embodiment, typical room temperature) and high (about 270°C in one embodiment).

[0054] FIG. 5 shows a schematic diagram of a plasma spray deposition apparatus 500 used in spray deposition techniques, according to some embodiments. The plasma spray apparatus 500 can include a casing 502 that encloses a nozzle anode 506 and a cathode 504. The casing 502 allows a gas flow 508 to flow between the nozzle anode 506 and the cathode 504 through the plasma spray apparatus 500. An external power source can be used to apply a voltage potential between the nozzle anode 506 and the cathode 504. The voltage potential creates an arc between the nozzle anode 506 and the cathode 504, igniting the gas flow 508 and generating plasma gas. The ignited plasma gas flow 508 generates a high velocity plasma plume 514 that exits the nozzle anode 506 and is directed toward an article 520.

[0055] The plasma spray apparatus 500 can be located in a chamber or atmospheric booth. In some embodiments, the gas stream 508 can be a gas or gas mixture, including but not limited to argon, nitrogen, hydrogen, helium, and combinations thereof. In some embodiments using a spray system to perform slurry plasma spraying, the plasma spray apparatus 500 can be equipped with one or more fluid lines 512 for delivering the slurry to the plasma plume 514. In some embodiments, a particle stream 516 is generated from the plasma plume 514 and propelled toward the article 520. Upon impacting the article 520, the particle stream forms a coating 518.

[0056] 6A-6B are flow diagrams illustrating a method of depositing a protective coating on a processing chamber component according to some embodiments. FIG. 6A is a flow diagram illustrating a method 600 of depositing a dual arc-resistant and plasma-resistant protective coating on a component. In some embodiments, the chamber component includes a substrate support (e.g., an electrostatic chuck). In block 602, a first layer of a first material is deposited on a surface of the chamber component. In some embodiments, the surface includes a sidewall of the substrate support. Prior to depositing the first layer, the surface to be coated may undergo one or more preparation procedures. The surface of the component may be cleaned. A pre-coating, e.g., a primer, may be applied to the surface. In some embodiments, the primer is a material designed to adhere to both the chamber component and the first material. In some embodiments, the primer may be a polymer that includes a monomer from a polymer of the first material. In some embodiments, the first material may be a polymer of ethylene and chlorotrifluoroethylene, and the primer includes a polymer of ethylene, chlorotrifluoroethylene, and hexafluoroisobutene. The cleaning and pre-coating procedures can improve adhesion between the first layer and the component, improve the properties of the coated body, etc. The first material comprising the first layer includes a first polymer. The first material exhibits a dielectric strength above a target threshold selected to prevent arcing in the target application of the chamber component. For example, in processes where the component carries more electrical energy (higher current, higher voltage, etc.), it may be coated with a material of higher dielectric strength. The target dielectric strength may be any value, for example, greater than 20 MV / m, greater than 40 MV / m, greater than 50 MV / m, greater than 70 MV / m, etc. Suitable polymers include polymers of ethylene, polymers of propylene, polymers of styrene, halogenated versions of these, polymers of mixtures of monomers, etc. The first material may be a mixture of two or more polymers. The first material may include non-polymeric materials, such as additives.

[0057] The first material may be deposited by any suitable means. In some embodiments, the first material is deposited by aerosol deposition, as described in more detail in connection with FIG. 3. The first material may undergo a curing process after deposition, such as thermal curing, chemical curing, UV curing, etc. The first material may be deposited in several steps (e.g., layers) to achieve a target thickness. The target thickness may be tailored to the target application of the chamber component. In some embodiments, the target thickness may be between 1 / 1000ths of an inch and 20 / 1000ths of an inch. In some embodiments, the target thickness may be between 2 / 1000ths of an inch and 15 / 1000ths of an inch. In some embodiments, the target thickness may be between 3 / 1000ths of an inch and 10 / 1000ths of an inch.

[0058] At block 604, a second layer of coating is deposited on the first layer. The second layer is composed of a second material. The second material includes a polymer phase and a ceramic phase. The polymer phase may be of the same or different composition as the polymer in the first layer. The ceramic phase may include ceramic oxides, ceramic nitrides, ceramic carbides, other ceramic materials, or mixtures of these materials. The second material may be a polymer phase impregnated with ceramic particles. In some embodiments, the ceramic particles may be within a target size range. In some embodiments, the ceramic particles may be between 1 μm and 80 μm in size. In some embodiments, the ratio of ceramic material to polymer material may be within a target range. In some embodiments, the second material may include 10 volume percent to 90 volume percent ceramic material. In some embodiments, the second material may include 20 volume percent to 80 volume percent ceramic material. The second material may be deposited by any suitable deposition technique. The polymer phase (which may include any of the polymer materials described in connection with the first layer) may be deposited along with the ceramic phase. The second material may be deposited by aerosol deposition. In some embodiments, the second layer can be of a target thickness. In some embodiments, the target thickness of the second layer may be between one thousandth of an inch and ten thousandths of an inch. In some embodiments, the target thickness may be between one thousandth of an inch and five thousandths of an inch.

[0059] At block 606, a third layer of a third material is deposited on the second layer of the coating of the chamber component. The third material includes a ceramic material. The ceramic material can provide plasma resistance to the coating, component, etc. The ceramic material can be the first ceramic material or the second ceramic material. The third material can include a ceramic composition similar to the ceramic composition suitable for use in the first ceramic phase of the second layer. In some embodiments, the third material does not adhere to the polymer phase of the first layer and / or does not adhere to the polymer phase of the second layer. By "does not adhere" it is meant that the adhesion between the material of the third layer and the material of the other layer (e.g., the first material of the first layer) is not strong enough for the coating to withstand the intended processing and intended use of the chamber component. For example, the ceramic material of the third layer, if applied directly to the first layer of the first material, may peel, flake, chip, or otherwise separate from the first layer under normal processing or operating conditions of the chamber component. The material of the third layer can adhere to the ceramic particles of the second material of the second layer. The ceramic particles of the second layer can provide anchor points for the third layer of the coating. The third layer can be deposited using any suitable technique. In some embodiments, the third layer can be deposited using plasma deposition, as described in more detail in connection with FIG. 5. In some embodiments, the third layer can be of a target thickness. In some embodiments, the target thickness can be between 5 and 40 thousandths of an inch. In some embodiments, the target thickness can be between 10 and 25 thousandths of an inch. In some embodiments, the fourth layer can be subjected to further processing after deposition, including heat treatment, grinding, polishing, etc.

[0060] FIG. 6B is a flow diagram illustrating an expanded method 610 for depositing a protective coating on a component, including additional operations, according to some embodiments. In some embodiments, the chamber component includes a substrate support (e.g., an electrostatic chuck). In block 612, a first layer of a first material is deposited on a surface of the chamber component. In some embodiments, the surface includes a sidewall of the substrate support. Prior to depositing the first layer, the surface to be coated may have undergone one or more preparatory procedures. The surface of the component may be cleaned. A pre-coating, e.g., a primer, may be applied to the surface. In some embodiments, the primer is a material designed to adhere to both the chamber component and the first material. In some embodiments, the primer may be a polymer that includes a monomer from a polymer of the first material. In some embodiments, the first material may be a polymer of ethylene and chlorotrifluoroethylene, and the primer includes a polymer of ethylene, chlorotrifluoroethylene, and hexafluoroisobutene. The cleaning and pre-coating procedures may improve adhesion between the first layer and the component, improve the properties of the coated body, etc. The first material that constitutes the first layer includes a first polymer. The first material exhibits a dielectric strength above a target threshold selected to prevent arcing in the target application of the chamber component. For example, in processes where the component involves more electrical energy (higher current, higher voltage, etc.), it may be coated with a material of higher dielectric strength. The target dielectric strength may be any value, e.g., 20 MV / m or more, 40 MV / m or more, 50 MV / m or more, 70 MV / m or more, etc. Suitable polymers include polymers of ethylene, polymers of propylene, polymers of styrene, halogenated versions thereof, polymers of mixtures of monomers, etc. The first material may be a mixture of two or more polymers. The first material may include non-polymeric materials, such as additives.

[0061] The first material may be deposited by any suitable means. In some embodiments, the first material is deposited by aerosol deposition, as described in more detail in connection with FIG. 3. The first material may undergo a curing process after deposition, such as thermal curing, chemical curing, UV curing, etc. The first material may be deposited in several steps (e.g., layers) to achieve a target thickness. The target thickness may be tailored to the target application of the chamber component. In some embodiments, the target thickness may be between 1 / 1000ths of an inch and 20 / 1000ths of an inch. In some embodiments, the target thickness may be between 2 / 1000ths of an inch and 15 / 1000ths of an inch. In some embodiments, the target thickness may be between 3 / 1000ths of an inch and 10 / 1000ths of an inch.

[0062] At block 614, a second layer is optionally deposited on the first layer. The second layer is composed of a second material, which is different from the first material. The second layer may include one or more polymers. The second layer may include the same polymer as the first layer or a different polymer than the first layer. The second material may differ from the first material in terms of the compounds (e.g., polymers) included, the ratio of components included in the second material, or both. The second material may be selected to improve the properties of the coated chamber component. For example, the second material may be selected such that the adhesion between the first layer (e.g., the polymer of the first layer) and the second layer and the adhesion between the second layer and the third layer are both stronger than the adhesion between the first layer and the third layer. As another example, the second material may be selected to reduce the difference in properties at the interface between the layers, for example, the second material may be selected to exhibit thermal expansion characteristics between the thermal expansion characteristics of the first layer and the third layer. This may improve the integrity of the coating and reduce the likelihood of peeling, flaking, cracking, etc. The second layer may be deposited by any suitable technique. In some embodiments, the second layer can be deposited by aerosol deposition. In some embodiments, deposition can be performed at an elevated temperature to allow the second material to flow and cover the surface being coated. In some embodiments, heating can be carefully controlled (e.g., controlled temperature, controlled heating time) to melt the second material and not melt the first material. In some embodiments, heating can be controlled to avoid melting the first layer and destroying the individual compositions, properties, etc. of the first and second materials. In some embodiments, the second material can be selected such that a deposition temperature effective for the second material does not melt the first material. In some embodiments, the second material can be selected such that a deposition temperature effective to cause the second material to flow does not melt the first material to the extent that the first and second materials are thoroughly mixed. In some embodiments, separation of the first and second materials can be controlled by limiting the heating time.

[0063] At block 616, a third layer of the coating is deposited on the second layer. The third layer is composed of a third material. The third material includes a polymer phase and a ceramic phase. The polymer phase may be of the same composition as the polymer comprising the first or second layer, or may be different. The ceramic phase may include ceramic oxides, ceramic nitrides, ceramic carbides, other ceramic materials, or mixtures of these materials. The third material may be a polymer phase impregnated with ceramic particles. In some embodiments, the ceramic particles may be within a target size range. In some embodiments, the ceramic particles may be between 1 μm and 80 μm in size. In some embodiments, the ratio of ceramic material to polymer material may be within a target range. In some embodiments, the third material may include 10 volume percent to 90 volume percent ceramic material. In some embodiments, the third material may include 20 volume percent to 80 volume percent ceramic material. The third material may be deposited by any suitable deposition technique. The polymer phase (including any of the polymer materials described in connection with the first layer) may be deposited along with the ceramic phase. The third material may be deposited by aerosol deposition. Many of the same techniques for preserving the properties of the first and second layers described in connection with the deposition of the second layer may be applied to the deposition of the third material. In some embodiments, the third layer may be of a target thickness. In some embodiments, the target thickness of the third layer may be between one thousandth of an inch and ten thousandths of an inch. In some embodiments, the target thickness may be between one thousandth of an inch and five thousandths of an inch.

[0064] At block 618, the surface of the third layer is optionally roughened. In some embodiments, the deposition technique used to deposit the third layer may expose a relatively small surface area of ​​the ceramic material of the third layer. In some embodiments, a fourth layer may be deposited that adheres to the ceramic particles of the third layer. The surface of the third layer may be roughened to expose a larger surface area of ​​the ceramic particles in the third material of the third layer. The surface of the third layer may be roughened using any suitable technique, depending, for example, on the composition of the third material. Techniques for roughening the surface of the third layer may include methods such as polishing, liquid etching (e.g., acid etching), gas etching (e.g., reactive gas etching including flame, corona, plasma, etc.).

[0065] At block 620, a fourth layer of a fourth material is deposited on the third layer of the coating of the chamber component. The fourth material includes a ceramic material. The ceramic material can provide plasma resistance to the coating, component, etc. The ceramic material can be the first ceramic material or the second ceramic material. The fourth material can include similar components as suitable for use in the first ceramic phase of the third layer. In some embodiments, the fourth material does not adhere to the polymer phase of the third layer, does not adhere to the polymer phase of the second layer, does not adhere to the polymer of the first layer, etc. By "adheres" it is meant that the adhesion between the material of the fourth layer and the other layer (e.g., the first material of the first layer) is not strong enough for the coating to withstand the intended processing and intended use of the chamber component. For example, the ceramic material of the fourth layer, if applied directly to the first layer of the first material, may peel, flake, chip, or otherwise separate from the first layer under normal processing or operating conditions of the chamber component. The material of the fourth layer can adhere to the ceramic particles of the third material of the third layer. The ceramic particles of the third layer can provide anchor points for the fourth layer of the coating. The fourth layer can be deposited using any suitable technique. In some embodiments, the fourth layer can be deposited using plasma deposition, as described in more detail in connection with FIG. 5. In some embodiments, the fourth layer can be of a target thickness. In some embodiments, the target thickness can be between 5 and 40 thousandths of an inch. In some embodiments, the target thickness can be between 10 and 25 thousandths of an inch. In some embodiments, the fourth layer can undergo further processing after deposition, such as heat treatment, grinding, polishing, etc.

[0066] In the preceding description, numerous specific details are provided for examples of particular systems, components, methods, etc., to allow a thorough understanding of some embodiments of the present disclosure. It will be apparent to those skilled in the art that at least some embodiments of the present disclosure can be practiced without these specific details. In other instances, well-known components or methods have not been described in detail or have been presented in simple block diagram form to avoid unnecessarily obscuring the present disclosure. Thus, the specific details described are merely illustrative. Particular implementations may vary from these example details and are still contemplated to be within the scope of the present disclosure.

[0067] The foregoing description describes applying coatings to various components, bodies, articles, etc. In some cases, a coating or layer is described as being applied "on" or "over" a body, layer, material, etc. Unless clear from the context, a layer described as being "on" a layer, body, component, material, etc. may not be directly adjacent to what the layer is placed on, and there may be other layers of material intervening.

[0068] References throughout this specification to "one embodiment" or "one embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Thus, the appearances of the phrase "in one embodiment" or "in one embodiment" in various places throughout this specification do not necessarily all refer to the same embodiment. Furthermore, the term "or" means inclusive "or" rather than exclusive "or". When the term "about" or "approximately" is used herein, this means that the nominal value presented is accurate to within ±10%.

[0069] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be changed such that certain operations are performed in the reverse order, or such that certain operations are performed at least in part concurrently with other operations. In other embodiments, separate operations or sub-operations may be performed intermittently and / or alternatingly.

[0070] It should be understood that the above description is intended to be illustrative, and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. The scope of the disclosure should therefore be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. depositing a first layer of a first material on a surface of a chamber component of a processing chamber, the first material comprising a first polymer having a dielectric strength of at least 40 MV / m; depositing a second layer of a second material on the first layer, the second material comprising a first ceramic material impregnated with a first polymer or a second polymer; 11. A method comprising: depositing a third layer over the second layer, the third material comprising a third material, the third material comprising a first ceramic material or a second ceramic material, wherein the first ceramic material or the second ceramic material of the third layer does not adhere to the first polymer or the second polymer of the second layer, and the first ceramic material or the second ceramic material of the third layer adheres to the first ceramic material of the second layer.

2. The method of claim 1 , wherein the third material comprises a plasma resistant ceramic material.

3. 10. The method of claim 1 , wherein the first layer is deposited by aerosol deposition, the aerosol deposition comprising spraying a powder including the first material onto the chamber component, heating the chamber component, and causing the first material to flow and form the first layer.

4. The method of claim 1 , wherein the second layer is formed by simultaneously depositing the first polymer or the second polymer and depositing the first ceramic material.

5. The method of claim 1 , further comprising the step of roughening the surface of the second layer, the roughening being performed to increase a surface area of ​​exposed ceramic material of the second layer.

6. The method of claim 1 , wherein the first ceramic material is present in the second material in an amount of from 10 to 90 percent, measured by volume.

7. At least one of the first ceramic material or the second ceramic material is Al ２ O ３ , Y ２ O ３ , Y ３ A ５ O １２ , Y ２ A ４ O ９ , or ZrO ２ The method of claim 1 , comprising one or more of the following:

8. The method of claim 1 , comprising depositing a fourth layer of a fourth material between the second layer and the third layer, the fourth material being different from the first material and the second material, and the fourth material comprising a polymer.

9. 2. The method of claim 1, wherein the first layer has a thickness between 2 thousandths and 15 thousandths of an inch, the second layer has a thickness between 1 thousandths and 10 thousandths of an inch, and the third layer has a thickness between 8 thousandths and 30 thousandths of an inch.

10. The method of claim 1 , wherein the first polymer comprises at least one of a polymer comprising ethylene monomer, a polymer comprising a fluorinated ethylene monomer, or a polymer comprising a chlorinated ethylene monomer.

11. The method of claim 1 , wherein the chamber component comprises a substrate support, and the surface of the chamber component comprises a sidewall of the substrate support.

12. A chamber component for a processing chamber, comprising: The main body, A coating deposited on the body, comprising: a first layer of a first material deposited on a surface of the body, the first material comprising a first polymer having a dielectric strength of at least 40 MV / m; a second layer of a second material, the second material comprising the first ceramic material impregnated with the first polymer or the second polymer; 11. A chamber component comprising: a coating having a third layer of a third material, the third material comprising the first ceramic material or the second ceramic material, wherein the first ceramic material or the second ceramic material of the third layer does not adhere to the first polymer or the second polymer of the second layer, and the first ceramic material or the second ceramic material of the third layer adheres to the first ceramic material of the second layer.

13. The chamber component of claim 12 , wherein the third material comprises a plasma resistant ceramic material.

14. The chamber component of claim 12 , wherein the second layer is formed by simultaneously depositing the first or second polymer and depositing the first ceramic material.

15. The chamber component of claim 12 , wherein the first ceramic material is present in the second material in an amount of 10 to 90 percent, measured by volume.

16. The chamber component of claim 12 , wherein the first polymer comprises at least one of a polymer comprising an ethylene monomer, a polymer comprising a fluorinated ethylene monomer, or a polymer comprising a chlorinated ethylene monomer.

17. A processing chamber comprising: A substrate support; A coating deposited on a surface of a substrate support, comprising: a first layer of a first material deposited on a surface of a substrate support, the first material comprising a first polymer having a dielectric strength of at least 40 MV / m; a second layer of a second material, the second material comprising the first ceramic material impregnated with the first polymer or the second polymer; A processing chamber comprising a coating of a third layer of a third material, the third material comprising the first ceramic material or the second ceramic material, wherein the first ceramic material or the second ceramic material of the third layer does not adhere to the first polymer or the second polymer of the second layer, and the first ceramic material or the second ceramic material of the third layer adheres to the first ceramic material of the second layer.

18. The processing chamber of claim 17 , wherein the third material comprises a plasma resistant ceramic material.

19. 20. The processing chamber of claim 17, wherein the second layer is formed by simultaneously depositing the first or second polymer and depositing the first ceramic material.

20. 18. The processing chamber of claim 17, wherein the first ceramic material is present in the second material in an amount between 10 and 90 percent, measured by volume.

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