Copper foil manufacturing equipment

Abstract

The present invention relates to a copper foil manufacturing apparatus, comprising: a plating tank (100) filled with an electrolyte; a negative electrode drum (300) formed of an inner drum body (310) made of copper material to which a negative electrode (negative electrode) is applied and an outer drum body (320) made of titanium material provided on the outer surface of the inner drum body (310), the negative electrode drum (300) being installed on the upper surface of the plating tank (100) so that the lower end of the negative electrode drum (300) is immersed in the electrolyte and rotates; a round arc-shaped electrode plate (200) made of an inner member (210) made of copper material and an outer member (220) made of titanium material coated on the outer surface of the inner member (210), the round arc-shaped electrode plate (200) being installed on both sides of the inside of the plating tank (100) facing each other; and a bus bar (240) coated with a titanium layer (250), one end of which is welded to the inner member (210) of the electrode plate (200) and the other end of which is connected to the positive electrode (positive electrode) of a rectifier (10) to energize the positive electrode. The electrode plate (200) is made of a titanium outer member (220) and an inner member (210) made of copper is sandwiched between the outer member (220) and bonded to the titanium inner member (210) by explosive cladding. The curved inner surface of the electrode plate (200) is further provided with a catalytic reaction electrode (400). When copper foil is produced by electroplating, the electrical conductivity is improved to minimize heat generation, and the plating efficiency is maximized to improve the plating speed and make the plating quality uniform.

Description

[Technical field]

[0001] The present invention relates to a copper foil manufacturing apparatus, and more particularly, to a copper foil manufacturing apparatus that can minimize heat generation by improving electrical conductivity when producing ultra-thin copper foil by electroplating, and can achieve improved plating speed and uniform plating quality by maximizing plating efficiency. [Background technology]

[0002] Generally, methods for producing copper foil include a rolling method using a roller and an electroplating method.

[0003] The copper foil is widely used in various mobile products and electronic devices including smartphones and notebook computers, and various electronic devices in many industrial fields including automobiles.

[0004] As described above, copper foils used in the circuit lines of PCB circuit boards installed in various electronic devices, lithium secondary batteries, etc. must be formed into extremely thin plates of 0.01t to 0.05t as necessary, or made into ultra-thin plates with a very fine thickness of around 0.01t to 0.001t.

[0005] However, rolled copper foil made by the rolling method must be rolled multiple times to reduce its thickness, which makes it more expensive.In addition, the width of rolled copper foil cannot exceed a maximum of 60 cm, and if the width exceeds 60 cm, the surface condition becomes very uneven, the quality deteriorates, and the product loses its marketability.

[0006] In addition, the rolling method has a limitation in that it is difficult to make the copper foil into an ultra-thin sheet with a very fine thickness, even if the copper sheet is rolled several times.

[0007] Meanwhile, the copper foil produced by the electroplating method is an electrolytic copper foil obtained by precipitating "copper" on the surface of the negative electrode drum in an electrolyte mainly containing copper sulfate, and can be easily produced into an ultra-thin sheet or ultra-thin sheet. It can also be mass-produced in a wide variety of widths according to the width of the negative electrode drum, so it can be provided at a significantly lower price than the rolled copper foil.

[0008] A prior art document for such an electroplating type copper foil manufacturing apparatus is the "Electrolytic Copper Foil Manufacturing Apparatus" disclosed in the following patent document, Korean Patent Registration No. 10-2273727 (announced on July 5, 2021) (hereinafter referred to as "Patent Document 1").

[0009] The patent document 1 discloses a structure in which a first rotating drum (negative drum) rotates with its lower surface immersed to a certain depth in the electrolyte filled in the electrolytic cell, and a semicircular counter electrode (positive electrode member) is installed on the inner surface of the electrolytic cell so as to be spaced a certain distance from the first rotating drum (negative drum). When the negative and positive poles of a power source are applied to the first rotating drum and the counter electrode, copper from the electrolyte is deposited on the surface of the rotating first rotating drum, producing a thin film of copper foil.

[0010] Other prior art documents include the "Copper Foil Manufacturing Apparatus" disclosed in the following patent document, Korean Patent Registration No. 10-2323914 (announced on November 8, 2021) (hereinafter referred to as "Patent Document 2").

[0011] The above Patent Document 2 also has a structure in which an anode drum rotates with its lower surface immersed to a certain depth in the electrolyte filled in an electrolytic cell, and a positive electrode member is installed below the anode drum at a certain distance. When the positive electrode of a power source is applied to the anode drum and the positive electrode member, electricity is passed through the electrolyte. When the current flows, copper ions dissolved in the electrolyte are reduced on the surface of the anode drum. Copper foil 200 is electrodeposited on the surface of the anode drum 21, and the copper foil in the form of a thin film peeled off from the surface of the anode drum is wound around a roller in a winding section. [Prior art documents] [Patent documents]

[0012] [Patent Document 1] Republic of Korea Patent Registration No. 10-2273727 (announced on July 5, 2021) "Electrolytic copper foil manufacturing device" [Patent Document 2] "Copper foil manufacturing device" in the Republic of Korea Patent Publication Registration No. 10-2323914 (announced on November 8, 2021) Summary of the Invention [Problem to be solved by the invention]

[0013] When the positive electrode members of Patent Documents 1 and 2 are made of "copper" material and installed to improve the conductivity of "+ current", the positive electrode members are easily dissolved in the copper sulfate-based electrolyte filled in the plating tank (electrolytic cell), and their shape is deformed, resulting in a decrease in the deposition efficiency of the copper foil.

[0014] Furthermore, because conventional positive electrode materials made by mixing iridium or platinum with "lead" are highly contaminated with heavy metals, an electrode plate made of titanium and an iridium-platinum alloy was used as the "+" electrode plate. However, when the conductivity of "copper" is taken as 100, the electrical conductivity of titanium is very low at about 3.1, and the "+ current" required for the deposition of "copper" only comes into effect when a very large amount of "+ current" is sent. This causes a lot of electrical resistance to occur in the "+" electrode plate, and this electrical resistance is transformed into thermal energy, generating a considerable amount of heat in the electrode plate.

[0015] This requires a process of cooling the heat of the electrode plate, and the excessive consumption of electricity leads to high electricity bills, which increases maintenance costs. In addition, the plating speed is reduced, making it difficult to achieve uniform quality.

[0016] Therefore, the present invention has been developed to solve the above problems, and the object of the present invention is to provide a copper foil manufacturing apparatus that can minimize heat generation by maximizing the "+ pole" conductivity of the electrode plate when producing copper foil by electroplating, and can achieve uniform and optimized plating quality by reducing electricity charges, improving plating speed, and optimizing solution management. [Means for solving the problem]

[0017] In order to achieve the above object, the present invention is characterized by comprising: a plating tank filled with a certain amount of an electrolyte containing copper sulfate as a main component; a negative electrode drum formed of an inner drum body made of copper material to which the "negative pole" of a rectifier is applied and an outer drum body made of titanium material coated on the outer surface of the inner drum body, and installed on the upper surface of the plating tank so that the lower end is immersed in the electrolyte and rotates; a round arc-shaped electrode plate made of an inner member made of copper material and an outer member made of titanium material coated in close contact with the outer surface of the inner member, and installed facing each other inside the plating tank; and a bus bar with one end welded to the electrode plate and the other end connected to the "positive pole" of the rectifier to energize the "positive pole" of the electrode plate, and coated with a titanium layer on the outside.

[0018] The electrode plate further includes a catalytic reaction electrode that is installed in close contact with the curved inner surface of the electrode plate in the same curved shape.

[0019] In addition, the electrode plate is characterized in that an internal copper member is sandwiched between an external titanium member by explosive cladding, and electricity is uniformly applied to the "+" pole at all points on the electrode plate. Effect of the Invention

[0020] In the present invention, the electrode plate is made of an inner member made of copper and an outer member made of titanium, which are sandwiched together by explosive cladding. When electricity is applied to the inner member, a good flow of electricity can be swiftly and uniformly introduced to all parts of the electrode plate. This maximizes efficiency and significantly reduces electricity usage, resulting in a significant reduction in electricity bills.

[0021] In addition, a catalytic reaction electrode that receives the "positive pole" from the electrode plate is installed in close contact with the inner surface of the electrode plate, promoting the catalytic reaction of the electrolyte, greatly increasing the deposition effect that causes copper to stick to the negative electrode drum.

[0022] In addition, the temperature rise of the plating solution can be minimized and solution management can be optimized, which results in increased plating speed and minimized heat generation, maximizing efficiency of electroplating, uniform quality, improved productivity, and reduced costs. [Brief description of the drawings]

[0023] [Figure 1] 1 is a side cross-sectional view showing an example of the structure of a copper foil manufacturing apparatus in which the present invention is implemented. [Diagram 2] FIG. 2 is a perspective view showing an electrode plate having a catalytic reaction electrode in the present invention, in which the electrode plate is separated. [Diagram 3] FIG. 2 is an enlarged cross-sectional view showing the installation structure of the electrode plate and catalytic reaction electrode of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Hereinafter, a copper foil manufacturing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0025] FIG. 1 is a side cross-sectional view showing an example of the structure of a copper foil manufacturing apparatus in which the present invention is implemented, FIG. 2 is a perspective view showing an electrode plate having a catalytic reaction electrode in the present invention, and FIG. 3 is an enlarged cross-sectional view showing the installation structure of the electrode plate and catalytic reaction electrode in the present invention.

[0026] As shown in these drawings, the copper foil manufacturing apparatus of the present invention comprises a plating tank 100, a negative electrode drum 300, an electrode plate 200, and a bus bar 240.

[0027] The plating tank 100 is made of a PP material, and a certain amount of an electrolyte (plating solution) containing copper sulfate as a main component is filled inside through an inlet 110.

[0028] The negative electrode drum 300 is formed of an inner drum body 310 made of copper material to which the negative electrode of the rectifier 10 is energized, and an outer drum body 320 made of titanium material coated on the outer surface of the inner drum body 310, and is installed at a certain height on the upper surface of the plating tank 100.

[0029] More specifically, the negative electrode drum 300 is installed so as to rotate with the lower end of the negative electrode drum 300 immersed to a certain depth in the electrolyte filled inside the plating tank 100 .

[0030] The electrode plate 200 is characterized in that it is made of an inner member 210 made of copper material and formed in a circular arc shape, and an outer member 220 made of titanium material that is coated so as to closely contact the outer surface of the inner member 210, forming a circular arc shape.

[0031] More specifically, it is preferable to sandwich the copper inner member 210 into the titanium outer member 220 using an explosive cladding method.

[0032] It is preferable that the electrode plate 200 further includes a catalytic reaction electrode 400 formed in a rounded arc shape so as to be in close contact with the curved inner surface.

[0033] Two such electrode plates 200 are installed in a set facing each other to form a semicircle inside the plating tank 100, and the copper inner member 210 is safely protected from the electrolyte by the titanium outer member 220, which is coated on the entire outer periphery.

[0034] One end of the bus bar 240 is welded to the electrode plate 200, and the other end is connected to the “+ pole” of the rectifier 10, thereby passing electricity to the “+ pole” of the internal member 210 of the electrode plate 200. The outside is covered with a titanium layer 250, which can safely protect the copper bus bar 240 from being melted and damaged by the electrolyte in the plating tank 100.

[0035] In the figure, unexplained reference numeral 230 denotes a support for maintaining the electrode plate 200 in a stably installed state within the plating tank 100, and reference numeral 600 denotes a winding drum for the copper foil 500.

[0036] In the copper foil manufacturing apparatus of the present invention, the negative electrode drum 300 and the positive electrode of the rectifier 10 are electrically connected to the bus bar 240 of the electrode plate 200 and the negative electrode drum 300. When the negative electrode drum 300 is rotated while feeding the negative electrode of the rectifier 10 to the internal drum body 310 of the negative electrode drum 300 and the positive electrode of the rectifier 10 to the internal member 210 of the electrode plate 200, an electrical reaction occurs in the electrolyte, and copper is precipitated in a fine thickness on the surface of the titanium external drum body 320 immersed in the electrolyte.

[0037] Since the outer drum body 320 of the anode drum 300 is made of titanium, the deposited “copper” is easily separated from the anode drum 300 in the form of thin copper foil 500, and then wound around the winding drum 600 to produce an ultra-thin or ultra-thin copper foil 500.

[0038] In the present invention, the electrode plate 200 is made only of copper and titanium, and does not contain any lead as in the conventional art, so there is no risk of contamination by heavy metals.

[0039] In addition, the inner member 210 made of copper and the outer member 220 made of titanium of the electrode plate 200 are bonded in a sandwich shape by explosive cladding, so that when electricity is applied to the "positive pole", the entire electricity can be quickly applied to the inner member 210 made of copper.

[0040] Therefore, the good flow of electricity in the "+ pole" reduces electricity usage, which has the effect of saving electricity bills. The stable flow of electricity in the "+ pole" improves plating speed and minimizes heat generation, maximizing the efficiency of electroplating. It also minimizes the temperature rise of the plating solution, allowing for optimization of solution management.

[0041] The catalytic reaction electrode 400 provided on the electrode plate 200 is preferably made of iridium or platinum. The catalytic reaction electrode 400 receives the positive electrode from the internal member 210 of the electrode plate 200 and causes a catalytic reaction in the electrolyte, thereby increasing the deposition efficiency by allowing the copper in the electrolyte to adhere very well to the surface of the negative electrode drum 300.

[0042] In the present invention, the catalytic reaction electrode 400 is preferably detachably installed by forming a number of fastening holes 410 along the frame and bolting the fastening holes 410 to the inner surface of the electrode plate 200 with bolts 420, so that the catalytic reaction electrode 400 can be replaced at any time when necessary.

[0043] When installing the catalytic reaction electrode 400, the fastening bolts 420 are fastened only to the outer member 220 of the electrode plate 200 so as not to come into contact with the copper inner member 210. As a result, the bolts 420 do not come into direct contact with the copper inner member 210 during bolting, and the electrical conductivity of the inner member 210 can be prevented from being dispersed or reduced through a large number of bolts 420.

[0044] In addition, each fastening hole 410 of the catalytic reaction electrode 400 has a burring portion for receiving the head of a bolt 420 in the hole frame, and the outer member 220 of the electrode plate 200 has a recess for receiving the burring portion, so that the head of the bolt 420 does not protrude and is in maximum contact with the electrode plate 200. As a result, the internal member 210 can effectively receive the energized "+ pole", improving the efficiency of the catalytic reaction.

[0045] As described above, the electrode plate 200 of the present invention is composed of an inner member made of copper and an outer member made of titanium, and has a significantly better electrical conductivity than the conventional electrode plate made entirely of titanium, thereby reducing electricity usage and maximizing efficiency, thereby greatly reducing electricity bills.

[0046] In addition, by reducing the amount of electricity used, heat generation is almost eliminated, and the cooling process that is required with conventional electrodes made only of titanium is no longer necessary, which increases the plating speed, improving productivity and reducing costs.

[0047] Although the present invention has been specifically described above using the above-mentioned embodiments, it will be obvious to those having ordinary skill in the art that the present invention is not limited to the above-mentioned embodiments and can be modified in various ways without departing from the gist of the present invention. [Explanation of symbols]

[0048] 10 : Rectifier 100: Plating tank 110: Inlet 200 : Electrode plate 210: Internal parts 220: External parts 240: Busbar 250: Titanium layer 300: Negative electrode drum 310: Inner drum body 320: External drum body 400: Catalytic reaction electrode 410 : Fastening hole 420: Bolt 500 : Copper foil 600: Winding drum

Claims

1. A plating tank (100) in which a certain amount of an electrolyte containing copper sulfate as a main component is filled; A negative electrode drum (300) is formed of an inner drum body (310) made of copper material to which a negative electrode (negative electrode) is electrically connected, and an outer drum body (320) made of titanium material coated on the outer surface of the inner drum body (310), and is installed on the upper surface of the plating tank (100) so that the lower end of the negative electrode drum (300) is immersed in the electrolyte and rotates; A circular arc-shaped electrode plate (200) is comprised of an inner member (210) made of copper and an outer member (220) made of titanium that is tightly attached to and coated on the outer surface of the inner member (210), and is installed on both sides of the inside of the plating tank (100) facing each other; and a bus bar (240) having one end welded to an internal member (210) of the electrode plate (200) and the other end connected to the "+ pole" of the rectifier (10) to energize the "+ pole" and coated with a titanium layer (250); A copper foil manufacturing apparatus that is characterized by being able to achieve uniform plating quality by minimizing heat generation from electrode plates and maximizing plating efficiency.

2. The copper foil manufacturing apparatus according to claim 1, wherein the electrode plate (200) further includes a catalytic reaction electrode (400) on the curved inner surface thereof, and the efficiency of copper deposition is increased by a good catalytic reaction of the electrolyte.

3. 3. The copper foil manufacturing apparatus according to claim 2, wherein the catalytic reaction electrode (400) is fastened only to the outer member (220) so as not to come into contact with the inner member (210) made of copper when the catalytic reaction electrode (400) is installed on the inner surface of the electrode plate (200) with bolts (420) through a plurality of fastening holes (410) formed along the frame.

4. The copper foil manufacturing apparatus according to claim 1, characterized in that the electrode plate (200) is made of an outer member (220) made of titanium material and an inner member (210) made of copper is sandwiched in the outer member (220) by explosive cladding, thereby increasing the conductivity of the "positive pole" of the inner member (210).

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