Crystal cooling device and artificial crystal preparation equipment for simultaneously extracting multiple crystals

Abstract

A crystal cooling device and an artificial crystal preparation device are provided for simultaneously pulling multiple crystals. The crystal cooling device is provided with multiple first lifting holes for the pulled crystals to pass through and a cooling medium channel for cooling the crystals. According to the present application, the pulled crystals can be cooled quickly, and multiple crystals can be pulled simultaneously, thereby increasing the speed of pulling silicon cores. Furthermore, broken silicon material can be used to simultaneously pull multiple silicon cores, so that the waste of resources of broken silicon material can be effectively prevented.

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of Chinese Patent Application No. 202210278020.X, filed on March 21, 2022, Chinese Patent Application No. 202211182774.1, filed on September 27, 2022, and Chinese Patent Application No. 202211182775.6, filed on September 27, 2022, with the State Intellectual Property Office of the People's Republic of China, the entire contents of which are hereby incorporated by reference in their entirety.

[0002] The present application relates to the technical field of artificial crystal preparation, and in particular to a crystal cooling device for simultaneously pulling a plurality of crystals and an artificial crystal preparation device including the crystal cooling device. [Background technology]

[0003] The solar power generation industry has become a "new boon" of the new energy industry, driven by the national macro-strategic policy of "peaking out carbon dioxide emissions and achieving carbon neutrality."

[0004] In this context, with the development of the photovoltaic power generation industry, the global demand for polycrystalline silicon / monocrystalline silicon is growing rapidly, and the market supply is insufficient to meet the demand. As a result, the price of polycrystalline silicon / monocrystalline silicon, the main raw material for solar cells, is soaring. Many domestic companies are expanding their production.

[0005] Taking polycrystalline silicon / monocrystalline silicon as an example, the amount of silicon cores used in the entire manufacturing process of polycrystalline silicon / monocrystalline silicon is very large. Existing silicon cores are mostly prepared by zone melting (the pulling process is mainly completed by high-frequency coils and seed chucks). Its working principle is as follows: In operation, by passing high-frequency current through the high-frequency coil to perform high-frequency induction heating, the high-frequency coil generates an electric current to generate a magnetic field line in the raw material rod. A melting zone is formed at the upper end of the heated raw material rod, and a seed crystal is inserted into the melting zone. When the tip of the seed crystal is integrated into the melting zone of the raw material rod, the seed crystal is slowly raised, and the melt of the molten raw material follows the rise of the seed crystal to form a new columnar crystal. The new columnar crystal is the finished silicon core.

[0006] In the actual production process of polycrystalline silicon / monocrystalline silicon production enterprises, it is found that the handling of the residual materials in the preparation process of silicon cores, the accidentally broken silicon cores, and the crushed materials generated in the reduction, cutting, grinding, polishing and other process steps is very complicated. Many enterprises directly dispose of the above residual materials, broken cores, and crushed materials, or store them in warehouses to save labor. Still other companies reuse the crushed materials, pull them through a Czochralski furnace to form silicon rods, and then pull the silicon rods into silicon cores. This not only increases the cost of pulling silicon cores, but also results in a large waste of resources, etc. Some enterprises reuse the above crushed materials, pull the crushed materials through a Czochralski furnace into silicon rods, and then cut the silicon rods into multiple columnar silicon rods with a size of 8mm x 8mm or 10mm x 10mm by a multi-wire cutting machine. This not only increases the production cost of columnar silicon rods, but also introduces more impurities during the cutting process. As a result, this results in a decrease in product quality, a large waste of resources, etc. And how to reuse the crushed silicon materials has become one of the long-term technical demands of those skilled in the art.

[0007] The technology for pulling silicon rods by the Czochralski method is well established and widely used in the preparation of artificial crystals. However, when silicon rods are pulled by the conventional Czochralski method, only one silicon rod can be pulled up at the center of the crucible. For example, the technology disclosed in Patent Document 1 (Patent Application No. 201320678696.4, filed on October 30, 2013, Chinese utility model of the invention "Soft shaft pulling type single crystal furnace") and the technology disclosed in Patent Document 2 (Patent Application No. 202011063763.2, filed on September 30, 2020, Chinese invention patent of the invention "Czochralski method single crystal furnace and method for controlling the temperature gradient of the melt therein") can be mentioned. The technical solutions disclosed in the above two patents can only realize the pulling of one silicon rod, but cannot realize the simultaneous pulling of multiple silicon rods.

[0008] Furthermore, the inventors have found through a search a Chinese invention patent with patent application number 200910064106.7, filed on January 20, 2009, and titled "Silicon core pulled by crushed material of crystal and an apparatus for carrying out the method". An apparatus and method for pulling silicon core using crushed material of crystal is disclosed in this patent application. Although this patent application describes that silicon core can be pulled from crushed silicon material, the cooling rate of the pulled silicon core is slow, resulting in a slightly large ellipticity of the silicon core and low pulling efficiency. Therefore, there is a long-felt technical need in the art to provide a crystal cooling device for an artificial crystal furnace that can achieve a relatively high cooling rate. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] China Utility Model No. 203639604 Specification [Patent Document 2] China Patent Application Publication No. 112176400 Summary of the Invention

[0010] In order to solve the above problems, the present application provides a crystal cooling device for simultaneously pulling multiple crystals, which can cool the pulled crystal relatively quickly and simultaneously pull multiple crystals, thereby increasing the silicon core pulling speed. Furthermore, the crystal cooling device of the present application can simultaneously pull multiple silicon cores by using crushed silicon material to effectively avoid the waste of crushed silicon material resources.

[0011] According to one aspect of the present application, the present application provides a crystal cooling apparatus for simultaneously pulling multiple crystals, the crystal cooling apparatus being provided with a plurality of first lift holes through which the crystals to be pulled pass and a cooling medium channel for cooling the crystals.

[0012] Preferably, the crystal cooling device comprises an upper flange and a lower flange, and a crystal cooling pipe arranged between the upper flange and the lower flange, one end of the crystal cooling pipe is connected to the upper flange and the other end of the crystal cooling pipe is connected to the lower flange, the crystal cooling pipe forms a first lifting hole, and the cooling medium channel is arranged around the crystal cooling pipe.

[0013] Preferably, drain and inlet ports for access of cooling medium to cool the crystals are located on the upper or lower flange.

[0014] Preferably, the upper flange is provided with an upper crystal through-hole penetrating the upper flange, the upper crystal through-hole being provided in correspondence with the first ascending / descending hole.

[0015] Preferably, an upwardly recessed groove is arranged on the underside of the upper flange or a downwardly recessed groove is arranged on the upper surface of the upper flange, a lower cover plate is arranged at the open end of the groove, the lower cover plate and the groove form a water injection chamber, an upper crystal through hole penetrating the upper flange is arranged at the bottom of the groove, the upper crystal through hole is arranged corresponding to the first lifting hole, and a plurality of through holes are arranged in the lower cover plate.

[0016] Preferably, the upper groove and the lower groove are respectively arranged on the upper surface and the lower surface of the upper flange, the cover plate of the water injection chamber and the cover plate of the water return chamber are respectively arranged on the open ends of the upper groove and the lower groove, the cover plate of the water injection chamber and the upper groove form the water injection chamber, the cover plate of the water return chamber and the lower groove form the water return chamber, an upper crystal through hole penetrating to the groove bottom of the lower groove, a drain port and a water injection port are respectively arranged on the cover plate of the water injection chamber, the upper crystal through hole is arranged corresponding to the first lift hole, a water injection hole penetrating to the groove bottom of the lower groove is provided at the groove bottom of the upper groove, the water injection chamber is connected to the water injection port, the return chamber is connected to the drain port, and a plurality of through holes are arranged on the cover plate of the water return chamber.

[0017] Preferably, the upper flange comprises an upper disk, a central disk and a lower disk stacked to form the flange body, a central hole penetrating the flange body is located at the center of the upper surface of the flange body, a hollow water return chamber is located in the upper part of the flange body, a hollow water inlet chamber is located in the lower part of the flange body, a connecting pipe penetrating to the water inlet chamber is located on the upper surface of the flange body, the connecting pipe forms a water inlet, a drain port penetrating to the water return chamber is located on the upper surface of the flange body, a water return switch pipe penetrating to the water return chamber is located on the lower surface of the flange body, upper crystal through holes penetrating the flange plate are located on the upper surface of the flange plate around the central hole, and the upper crystal through holes are located in correspondence with the first lift hole.

[0018] Preferably, the switching ring is disposed on the lower surface of the flange body, the central hole is disposed in the center of the switching ring, and the upper crystal through-hole, the drain opening and the return water opening are disposed on the upper surface of the switching ring respectively.

[0019] Preferably, the lower flange is provided with a lower crystal through-hole passing through the lower flange, the lower crystal through-hole being disposed corresponding to the first ascending hole.

[0020] Preferably, a downwardly recessed groove is arranged on the upper surface of the lower flange, an upper cover plate is arranged at the open end of the groove, the groove and the upper cover plate form a water collection chamber, a lower crystal through hole that penetrates to the bottom of the lower flange is arranged at the bottom of the groove, the lower crystal through hole is arranged corresponding to the first lift hole, and a plurality of through holes are arranged in the upper cover plate.

[0021] Preferably, a cooling disk is disposed below the lower flange, a cavity is disposed within the cooling disk, and the cooling disk is provided with crystal lifting holes disposed corresponding to the lower crystal through holes, as well as drainage holes and water inlet holes respectively communicating with the cavity.

[0022] Preferably, a connecting cylinder is disposed between the upper flange and the lower flange, a crystal cooling pipe is disposed inside the connecting cylinder, one end of the crystal cooling pipe is connected to an upper crystal through-hole disposed on the upper flange, and the other end of the crystal cooling pipe is connected to a lower crystal through-hole disposed on the lower flange, and a cooling medium channel is formed by a cavity between the inner edge surface of the connecting cylinder, the lower end surface of the upper flange, and the upper end surface of the lower flange.

[0023] Preferably, a bushing is sleeve-shaped around the crystal cooling pipe, one end of the bushing communicates with a water injection chamber arranged in the upper flange, and the other end of the bushing communicates with a water collection chamber arranged in the lower flange, and the cooling medium channel is formed by the cooling chamber, the water injection chamber and the water collection chamber between the inner edge surface of the bushing and the outer edge surface of the crystal cooling pipe.

[0024] Preferably, the bushing is sleeve-shaped around the crystal cooling pipe, a downwardly recessed semicircular step portion is disposed at the upper end of the bushing, the upper end of the bushing communicates with a water injection chamber disposed at the upper flange, the upper end of the semicircular step portion communicates with a water return chamber disposed at the lower part of the upper flange, and the lower end of the bushing communicates with a water collection chamber disposed at the upper part of the lower flange or is connected to the lower flange, and the cooling medium channel is formed by the cooling chamber, the water injection chamber, the water return chamber and the water collection chamber between the inner edge surface of the bushing and the outer edge surface of the crystal cooling pipe.

[0025] Preferably, a separator is disposed within the cooling chamber between the crystal cooling pipe and the bushing.

[0026] Preferably, the crystal cooling device is provided with a plurality of crystal cooling pipes, one of which is located at the center of the crystal cooling device and multiple groups of crystal cooling pipes are arranged radially around the central crystal cooling pipe, each group of crystal cooling pipes comprising at least two crystal cooling pipes, or a central hole is located at the center of the crystal cooling device and multiple groups of crystal cooling pipes are arranged radially around the central hole, each group of crystal cooling pipes comprising at least two crystal cooling pipes.

[0027] Preferably, a connecting cylinder and an inner connecting cylinder are respectively provided between the flange body and the lower flange, a crystal cooling pipe is arranged in the cavity between the connecting cylinder and the inner connecting cylinder, an upper end of the crystal cooling pipe is connected to an upper crystal through-hole arranged in the flange body, and a lower end of the crystal cooling pipe is connected to a lower crystal through-hole arranged in the lower flange, and a cooling medium channel is formed by a cavity between the inner edge surface of the connecting cylinder, the lower end surface of the upper flange, the upper end surface of the lower flange and the outer edge surface of the inner connecting cylinder.

[0028] Preferably, an outlet and an inlet for access of a cooling medium for cooling the crystals are arranged on the connecting cylinder.

[0029] Preferably, a cooling disk is arranged below the lower flange, a cavity is arranged within the cooling disk, and the cooling disk is provided with a crystal lifting hole arranged corresponding to the lower crystal through hole, as well as a drain hole and a water inlet hole respectively communicating with the cavity, the water inlet hole is connected to the lower end of the water inlet pipe, the upper end of the water inlet pipe is connected to the drain port below the flange body through the lower flange, the drain hole is connected to the lower end of the drain pipe, and the upper end of the drain pipe is connected to the cooling medium channel of the flange body through the lower flange.

[0030] Preferably, the crystal cooling apparatus further comprises an insulating plate arranged below the lower flange, the insulating plate being provided with at least one second lift hole arranged in one-to-one correspondence with the lower crystal through hole of the lower flange.

[0031] Preferably, the crystal cooling device further comprises an insulating plate arranged below the cooling disk, the insulating plate being provided with at least one second lift hole, the second lift hole being arranged in one-to-one correspondence with the crystal lift hole of the cooling disk.

[0032] Preferably, a central hole is formed in the center of the insulating plate, and the second lift holes are formed radially around the central hole.

[0033] Preferably, the outer dimensions of the insulating plate are equal to or greater than the outer dimensions of the lower flange or cooling disk.

[0034] Preferably, an upwardly raised step portion is disposed on the upper surface of the heat insulating plate from the outside to the inside, the step portion corresponding to a step surface on the lower surface of the lower flange or the lower surface of the cooling disk.

[0035] Preferably, the insulating plate is a barrel-shaped structure formed by providing a downwardly recessed groove in the center, the inner peripheral surface of the groove being a clearance fit or interference fit with the outer peripheral surface of the lower flange or cooling disk.

[0036] Preferably, where the inner peripheral surface of the groove is a clearance fit with the outer peripheral surface of the lower flange or cooling disk, a thermal insulating filler is disposed in the clearance.

[0037] Preferably, the cooling disk is provided with an upper through hole at its center, the cavity is disposed within the cooling disk, and the plurality of crystal lift holes are radially disposed around the upper through hole.

[0038] Preferably, the lower surface of the lower flange or cooling disk is provided with a stepped surface formed by providing upwardly recessed stepped portions from the outside to the inside, and the circles of the crystal ascending holes are arranged on each stepped surface.

[0039] According to another aspect of the present application, there is provided an artificial crystal preparation apparatus comprising the above crystal cooling device.

[0040] According to the present application, by providing multiple crystal cooling pipes between the upper flange and the lower flange, and providing a cooling medium channel around the crystal cooling pipes, a low temperature area can be formed in the space above the crucible using a cooling medium, thereby forming a temperature gradient with a higher temperature at the bottom and a lower temperature at the top, thus reducing the temperature of the molten silicon liquid above the crucible, increasing the viscosity of the silicon liquid, and promoting the silicon liquid to follow the seed crystal for crystallization. Most importantly, the silicon core can be cooled to increase the pulling speed of the silicon core. According to the present application, the simultaneous pulling of multiple silicon cores is realized while increasing the silicon core pulling speed. In the device for simultaneously pulling multiple silicon cores from crushed silicon material of the present application, the waste of the resource of crushed silicon material is effectively avoided.

[0041] Furthermore, according to the present application, an insulating plate is disposed, for example, below the lower flange or cooling disk, and the surface of the crystal cooling mechanism is insulated by the insulating plate, so that the volatile substances are effectively prevented from adhering to the lower surface and side walls of the crystal cooling mechanism due to the condensation phenomenon. In the present application, the heat preservation function of the insulating plate prevents the adhesion of volatile substances to the crystal cooling mechanism, while avoiding the cooling of the corresponding crucible area caused by the low temperature below the crystal cooling mechanism, and prevents the crystal cooling mechanism from escaping excessive temperature, which has the effect of reducing heating energy consumption, etc. Meanwhile, due to the heat preservation function of the insulating plate, the cooling effect of the cooling medium in the crystal cooling mechanism is fully applied to the inner wall of the crystal lifting hole, thereby improving the cooling effect on the pulled crystal, realizing the rapid crystallization of the crystal, and achieving the purpose of improving the crystal pulling speed, etc. [Brief description of the drawings]

[0042] [Figure 1]FIG. 1 is a perspective view of a cooling device according to a first embodiment of the present application. [Diagram 2] FIG. 1 is a schematic partial perspective view of a cooling device according to a first embodiment of the present application. [Diagram 3] FIG. 2 is a schematic diagram of a structure of an upper flange of the cooling device according to the first embodiment of the present application. [Figure 4] 3 is a schematic diagram of a structure of a lower flange of the cooling device according to the first embodiment of the present application. FIG. [Diagram 5] FIG. 4 is a schematic diagram showing a second structure of the coolant channel of the cooling device according to the first embodiment of the present application. [Figure 6] FIG. 4 is a schematic diagram showing a third structure of a coolant channel of the cooling device according to the first embodiment of the present application. [Figure 7] FIG. 11 is a schematic diagram of a fourth structure of the coolant channel of the cooling device according to the first embodiment of the present application. [Figure 8] 1 is a schematic diagram of a structure of a bushing according to a first embodiment of the present application. [Figure 9] FIG. 2 is a schematic diagram of a first structure in which a cooling disk is connected to a cooling device according to a first embodiment of the present application. [Figure 10] FIG. 4 is a schematic diagram of a second structure in which a cooling disk is connected to the cooling device according to the first embodiment of the present application. [Figure 11] FIG. 4 is a schematic diagram of a third structure in which a cooling disk is connected to the cooling device according to the first embodiment of the present application. [Figure 12] 1 is a schematic diagram showing the structure of a separator according to a first embodiment of the present application. [Figure 13] FIG. 11 is a schematic diagram showing a fourth structure in which a cooling disk is connected to the cooling device according to the first embodiment of the present application. [Figure 14] FIG. 14 is a detailed perspective view of the cooling disk shown in FIG. [Figure 15] FIG. 11 is a schematic perspective view of a cooling device provided with a heat insulating plate according to a second embodiment of the present application. [Figure 16] FIG. 11 is a schematic partial perspective view of a cooling device provided with a heat insulating plate according to a second embodiment of the present application. [Figure 17] FIG. 4 is a schematic diagram of the structure of an upper flange of an apparatus according to a second embodiment of the present application. [Figure 18] FIG. 11 is a schematic diagram of the structure of a lower flange of a device according to a second embodiment of the present application. [Figure 19] FIG. 4 is a schematic diagram showing a first alternative structure of the heat insulating plate according to the second embodiment of the present application. [Figure 20] FIG. 4 is a schematic diagram showing a second alternative structure of the insulating plate according to the second embodiment of the present application. [Figure 21] FIG. 11 is a schematic diagram showing a third alternative structure of the heat insulating plate according to the second embodiment of the present application. [Figure 22] FIG. 11 is a schematic diagram showing a fourth alternative structure of the heat insulating plate according to the second embodiment of the present application. [Figure 23] 1 is a schematic diagram of a specific application example according to the first and second embodiments of the present application. FIG. [Figure 24] FIG. 11 is a schematic diagram showing a fifth alternative structure of the heat insulating plate according to the second embodiment of the present application. [Diagram 25] 6 is a schematic diagram showing the structure of a step portion in a heat insulating plate according to a second embodiment of the present application. FIG. [Figure 26] FIG. 8 is a schematic diagram showing an alternative structure to that of FIG. 7; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] Without implying any adverse limitations to the present application, the present application will be described in detail below by way of examples. Although the present application has been described in detail and specific embodiments thereof have been disclosed, it will be apparent to those skilled in the art that various changes and modifications can be made in the specific embodiments of the present application without departing from the spirit and scope of the present application.

[0044] In describing the present invention, the directional or positional relationships indicated by the terms "center", "side", "length", "width", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "lower", "inside", "outside", "side", etc., are based on the directional or positional relationships shown in the drawings. This is merely for the purpose of explaining and simplifying the present application, and is not intended to indicate or suggest that a particular orientation, configuration and operation of the referenced devices or elements is required, and should not be construed as limiting the scope of the present invention.

[0045] It should be further noted that in describing the present invention, unless expressly specified and limited otherwise, the terms "provided / provided", "attached", "connected" and "connect" should be interpreted broadly. For example, it may be a fixed connection or a removable connection or an integral connection. It may be a mechanical connection or an electrical connection. It may be a direct connection or an indirect connection through an intermediate medium. It may be a communication within two elements. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific situation.

[0046] The present application provides a crystal cooling apparatus for simultaneously pulling multiple crystals, the crystal cooling apparatus being provided with a plurality of first ascending holes through which the crystals to be pulled pass and a cooling medium channel for cooling the crystals.

[0047] The crystal cooling apparatus of the present application allows for faster cooling of pulled crystals, allows multiple crystals to be pulled simultaneously, and increases the pulling speed of the silicon core.

[0048] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific structures of preferred embodiments of the present application will be described in detail with reference to the accompanying drawings and embodiments.

[0049] First embodiment 1-14 show a crystal cooling device for an artificial crystal furnace, which is one specific example of the crystal pulling mechanism of the present application. The crystal cooling device includes an upper flange 2003, a lower flange 2005, a crystal cooling pipe 2007, and a cooling medium channel. The upper flange 2003 is connected to the lifting mechanism of the crystal cooling device. A plurality of crystal cooling pipes 2007 for cooling the crystals are disposed between the upper flange 2003 and the lower flange 2005. A first lifting hole through which the crystal rod passes is formed in the crystal cooling pipe 2007. In practice, the arrangement of the plurality of crystal cooling pipes 2007 is such that one crystal cooling pipe 2007 is disposed in the center, and a plurality of groups of crystal cooling pipes 2007 are radially disposed around the central crystal cooling pipe 2007. Each group of crystal cooling pipes 2007 includes at least two crystal cooling pipes 2007. In practice, the arrangement of the crystal cooling pipes 2007 may be such that the crystal cooling pipes 2007 located on concentric circles form one group. It is also possible that the crystal cooling pipes 2007 extending outward along the same diameter form one group. The number of crystal cooling pipes 2007 provided is selected specifically according to the number of crystals to be pulled. A cooling medium channel is arranged around the crystal cooling pipes 2007. A cooling medium for cooling is introduced into the cooling medium channel. The inlet of the cooling medium channel is connected to a cooling source via a pipeline. The outlet of the cooling medium channel is connected to a cooling medium recovery mechanism via a pipeline, thereby forming a crystal cooling device for an artificial crystal furnace.

[0050] Also, as shown in FIG. 13, in an embodiment, a connecting cylinder 2004 and an inner connecting cylinder 20031 can be used to form a cooling medium channel in which a cooling pipe 2007 is arranged to cool the entire structure. A specific protocol is described below. Also, as shown in FIG. 9-14, a cooling disk 20025 can be arranged below the lower flange 2005. A cavity 20024 is arranged inside the cooling disk 20025. A plurality of fixing columns 20026 are arranged in the cavity 20024. A crystal lifting hole 20027 is arranged in each fixing column 20026. The cavity 20024 is respectively connected to a drain pipe 20023 and a water injection pipe 20028. The drain pipe 20023 and the water injection pipe 20028 are respectively connected to the cooling medium channel.

[0051] In practice, as shown in Fig. 9, the upper end of the water injection pipe 20028 is connected to the water injection chamber 20011 in the upper flange 2003. The upper end of the drain pipe 20023 is connected to the water collection chamber 20016 in the lower flange 2005. Alternatively, as shown in Fig. 10, the upper end of the water injection pipe 20028 is connected to the water injection chamber 20011 in the upper flange 2003, and the upper end of the drain pipe 20023 is connected to the water return chamber 20020 in the upper flange 2003.

[0052] Alternatively, as shown in FIG. 11, the cooling disk 20025 is disposed below the lower flange 2005. The cavity 20024 is disposed inside the cooling disk 20025. A plurality of fixing columns 20026 are disposed in the cavity 20024. A crystal lifting hole 20027 is disposed in each fixing column 20026. The cavity 20024 is respectively connected to the drain pipe 20023 and the water injection pipe 20028. The drain pipe 20023 and the water injection pipe 20028 are respectively connected to the cooling medium channel formed by the lower flange 2005, the connecting cylinder 2004 and the upper flange 2003 through the lower flange 2005. Alternatively, the drain pipe 20023 and the water injection pipe 20028 are connected to the water injection port and the drain port disposed in the lower flange 2005.

[0053] In practice, the upper ends of the drain pipe 20023 and the water inlet pipe 20028 may pass through the lower flange 2005 and be directly connected to the drain port 2002 and the water inlet port 2006 disposed on the upper flange 2003, i.e., the cooling disk 20025 forms an independent cooling circuit. In this case, the upper flange 2003 may be provided with a plurality of drain ports 2002 and water inlets 2006, i.e., the cooling disk 20025 and the crystal cooling pipe 2007 are cooled by a plurality of drain ports 2002 and water inlets 2006, respectively.

[0054] Alternatively, the upper end of the drain pipe 20023 or the water injection pipe 20028 is connected to the drain port 2002 or the water injection port 2006. The upper end of the water injection pipe 20028 or the drain pipe 20023 is connected to a cooling medium channel consisting of the lower flange 2005, the connecting cylinder 2004 and the upper flange 2003, that is, realizing independent injection and total discharge, or realizing independent discharge and total injection. That is, depending on the structural form of the cooling medium channel, it can be flexibly set to which member the drain pipe 20023 and the water injection pipe 20028 are specifically connected.

[0055] In practice, the cooling disk 20025 is disposed below the lower flange 2005, and the inner holes of each crystal cooling pipe 2007 of the lower flange 2005 correspond to and are concentric with each crystal lifting hole 20027 of the cooling disk 20025. This ensures that the crystal rod passes smoothly through the crystal lifting hole 20027 and the crystal cooling pipe 2007. Meanwhile, the operator can check the crystal pulling status through the gap between the lower flange 2005 and the cooling disk 20025.

[0056] In use, when the seed crystal puts the melt into the crystal lift hole 20027 of the cooling disk 20025, as the temperature drops, the seed crystal starts to crystallize and form a new crystal rod. As the crystal rod passes through the crystal lift hole 20027 and enters the crystal cooling pipe 2007, the crystal cooling pipe 2007 cools the crystal rod again to form the desired crystal rod. At this time, the operator can see the crystal being pulled up through the gap between the lower flange 2005 and the cooling disk 20025. The crystal cooling pipe 2007 not only cools the crystal rod (as the cooling medium in the cooling medium channel cools the crystal cooling pipe 2007, thereby creating the temperature gradient region required for crystal growth), but also acts as a crystal rod guide to ensure that the lower end of the crystal rod does not vibrate (when the crystal rod is pulled up to a certain length, if a slight vibration occurs at the upper end and is transmitted to the lower end of the crystal rod, the amplitude of the vibration will increase by several times to ten times or more, thereby affecting the pulling of the crystal rod. It should be mentioned that currently, the pulling length of the crystal rod is generally about 2m to 3m).

[0057] As shown in Figs. 1-4, the first structure of the cooling medium channel configuration is that the connecting cylinder 2004 is disposed between the upper flange 2003 and the lower flange 2005. In practice, the lower annular positioning step 2008 may be disposed below the upper flange 2003. The upper annular positioning step 20010 may be disposed above the lower flange 2005. And the upper and lower ends of the connecting cylinder 2004 may be sleeved in the lower annular positioning step 2008 and the upper annular positioning step 20010, respectively. The connecting cylinder 2004 may be welded to the upper flange 2003 and the lower flange 2005 by welding. A plurality of crystal cooling pipes 2007 are disposed in the connecting cylinder 2004. The upper end of each crystal cooling pipe 2007 is connected to an upper crystal through-hole 2001 arranged on the upper flange 2003, and the lower end of each crystal cooling pipe 2007 is connected to a lower crystal through-hole 2009 arranged on the lower flange 2005. A coolant channel is formed by a cavity between the inner edge surface of the connecting cylinder 2004, the lower end surface of the upper flange 2003 and the upper end surface of the lower flange 2005. A water outlet 2002 and a water inlet 2006 are arranged on the upper flange 2003, respectively, and the water outlet 2002 and the water inlet 2006 form the inlet and outlet of the coolant channel, respectively.

[0058] According to a preferred embodiment of the present application, the structure of the upper flange 2003 is such that the upper flange 2003 is a solid structure, and the upper flange 2003 is provided with a drain hole 2002, a water inlet 2006, and a plurality of upper crystal through holes 2001 extending from the top surface to the bottom surface.

[0059] According to another preferred embodiment of the present application, the structure of the lower flange 2005 is such that the lower flange 2005 is a solid structure and is provided with a plurality of lower crystal through holes 2009 penetrating the lower flange 2005 from the upper surface to the lower surface.

[0060] In use, the cooling medium enters the cooling medium channel formed by the upper flange 2003, the connecting cylinder 2004 and the lower flange 2005 through the water inlet 2006. When the entire cooling medium channel is filled with cooling medium, the cooling medium flows out through the water outlet 2002, thereby achieving the purpose of cooling the crystals in each crystal cooling pipe 2007.

[0061] According to an embodiment of the present application, as shown in FIG. 5, the second structure of the cooling medium channel configuration is that a bushing 20013 is provided around each crystal cooling pipe 2007 in a sleeve shape. The upper end of each of the bushings 20013 is connected to a water injection chamber 20011 disposed in the center of the upper flange 2003. The lower end of each of the bushings 20013 is connected to a water collection chamber 20016 disposed in the center of the lower flange 2005. The cooling medium channel is formed by the cooling chamber 20012, the water injection chamber 20011 and the water collection chamber 20016 between the inner edge surface of the bushing 20013 and the outer edge surface of the crystal cooling pipe 2007. The water injection chamber 20011 is connected to the water injection port 2006, and the water collection chamber 20016 is connected to the drain port 2002 via the return water pipe 20014. Water outlet 2002 and water inlet 2006 form the inlet and outlet, respectively, of the coolant channel.

[0062] In practice, when the bushings 20013 are provided around each crystal cooling pipe 2007 in the form of a sleeve, the cross-sectional shape of the bushings 20013 may be a circle as shown in FIG. 8. Alternatively, the cross-sectional shape of the bushings 20013 may be set as a complete circle surrounded by two semicircles. Alternatively, the cross-sectional shape of the bushings 20013 may be set as a complete circle surrounded by a plurality of arcs. Alternatively, the cross-sectional shape of the bushings 20013 may be set to form a complete ellipse surrounded by two semi-ellipses. When the cross-sectional shape of the bushings 20013 is set as an ellipse, the two side walls of the short axis of the ellipse may have a gap with the outer peripheral surface of the crystal cooling pipes 2007, or the two side walls of the short axis of the ellipse may not have a gap with the outer peripheral surface of the crystal cooling pipes 2007, i.e., the two side walls of the short axis of the ellipse coincide with the outer peripheral surface of the crystal cooling pipes 2007. The two side walls of the long axis of the ellipse are provided with gaps with the outer peripheral surface of the crystal cooling pipe 2007, and the cooling medium channels are formed by the gaps. When the cross-sectional shape of the bushing 20013 is set to be egg-shaped, the following two advantageous effects are realized.

[0063] 1. When the bushings 20013 are arranged along the same circumference, the minor axis of the elliptical bushing 20013 is smaller than the diameter of the circular bushing 20013, so that more bushings 20013 can be arranged on the same circumference, thereby realizing the simultaneous pulling of more crystals (when arranged, the major axis of the elliptical bushing 20013 faces in the radial direction of the circumference).

[0064] 2. When an oval bushing 20013 is provided, the technical effect of providing a separator 20029 between the circular bushing 20013 and the crystal cooling pipe 2007 can also be achieved if the oval bushing 20013 is provided in the form of a sleeve around the crystal cooling pipe 2007 without providing a separator 20029.

[0065] In practice, the upper flange 2003 is configured such that an upwardly recessed groove is disposed on the lower surface of the upper flange 2003, or a downwardly recessed groove is disposed on the upper surface of the upper flange 2003, and the lower cover plate 20017 is disposed at the open end of the groove. The cavity formed by the lower cover plate 20017 and the groove (i.e., the cavity closed in the groove by the lower cover plate 20017) is the water injection chamber 20011. A plurality of crystal cooling pipe through-holes, the drain hole 2002, and the water injection hole 2006 penetrating to the upper surface of the upper flange 2003 are respectively disposed at the groove bottom of the groove. A plurality of bushing through-holes and return water pipe through-holes are disposed in the lower cover plate 20017.

[0066] The lower flange 2005 is configured such that a downwardly recessed groove is disposed on the upper surface of the lower flange 2005, an upper cover plate 20015 is disposed at an open end of the groove, and a plurality of crystal cooling pipe through holes are disposed at the bottom of the groove, which extend through to the underside of the lower flange 2005. A plurality of bushing through holes are disposed in the upper cover plate 20015.

[0067] In use, the cooling medium enters the water inlet chamber 20011 in the upper flange 2003 via the water inlet 2006 and is then diverted through the water inlet chamber 20011 into each cooling chamber 20012. The cooling medium then flows through the cooling chamber 20012 into the water collection chamber 20016 in the lower flange 2005. Finally, the cooling medium enters the water return pipe 20014 via the water collection chamber 20016 and then through the water return pipe 20014 into the water outlet 2002.

[0068] According to yet another embodiment of the present application, as shown in Figures 6 and 8, the third structure of the cooling medium channel configuration is configured such that a bushing 20013 is provided around each crystal cooling pipe 2007 in a sleeve-like shape. The upper end of each of the bushings 20013 is provided with a semicircular step portion 20022 recessed downwards. The upper end of each of the bushings 20013 is connected to the water injection chamber 20011 arranged in the upper part of the upper flange 2003. The upper end of each of the semicircular step portions 20022 is connected to the water return chamber 20020 arranged in the lower part of the upper flange 2003. The lower end of each of the bushings 20013 is connected to the water collection chamber 20016 arranged in the upper part of the lower flange 2005. The coolant channel is formed by the cooling chamber 20012 between the inner peripheral surface of the bushing 20013 and the outer peripheral surface of the crystal cooling pipe 2007, the water inlet chamber 20011, the water return chamber 20020 and the water collection chamber 20016. The water inlet chamber 20011 is communicated with the water inlet 2006, and the water return chamber 20020 is connected to the water outlet 2002 via a connecting pipe 20019. The water outlet 2002 and the water inlet 2006 form the inlet and outlet of the coolant channel, respectively.

[0069] In practice, the structure of the upper flange 2003 is such that the upper and lower grooves are disposed on the upper and lower surfaces of the upper flange 2003, respectively, and the cover plate 20018 for the water injection chamber and the cover plate 20021 for the water return chamber are disposed on the open ends of the upper and lower grooves, respectively. The cavity formed by the cover plate 20018 for the water injection chamber and the upper groove is the water injection chamber 20011, and the cavity formed by the cover plate 20021 for the water return chamber and the lower groove is the water return chamber 20020. A plurality of crystal cooling pipe through holes, a drain hole 2002 and a water injection hole 2006 penetrating to the bottom of the lower groove are disposed on the cover plate 20018 for the water injection chamber, respectively. A plurality of bushing through holes and return pipe through holes are disposed on the cover plate 20021 for the water return chamber. A semicircular water injection hole penetrating to the bottom of the lower groove is provided on the bottom of the upper groove. The return water chamber 20020 communicates with the drain port 2002 through a connecting pipe 20019. The structure of the lower flange 2005 is such that a downwardly recessed groove is disposed on the upper surface of the lower flange 2005, an upper cover plate 20015 is disposed at the open end of the groove, and a number of crystal cooling pipe through-holes are disposed below the bottom of the groove, which extend through to the underside of the lower flange 2005. A number of bushing through-holes are disposed in the upper cover plate 20015.

[0070] In practice, in order to enhance the cooling effect, a separator 20029 may be disposed in the cooling chamber 20012 between the crystal cooling pipe 2007 and the bushing 20013, as shown in FIG. 12. The cooling chamber 20012 is divided into a water inlet chamber body and a drain chamber body by the separator 20029, that is, the cooling medium is guided to the lower end of the crystal cooling pipe 2007. In use, the cooling medium enters the water inlet chamber 20011 through the water inlet 2006, and then is diverted to the water inlet chambers in each cooling chamber 20012 through the water inlet chamber 20011. The cooling medium flows through the water inlet chamber body of the cooling chamber 20012, enters the water collecting chamber 20016, then enters the drain chamber body of each cooling chamber 20012 through the water collecting chamber 20016, and finally enters the return water chamber 20020 through the drain chamber body. The cooling medium in the return water chamber 20020 enters the drain outlet 2002 via a connecting pipe 20019 .

[0071] According to yet another embodiment of the present application, as shown in Figures 7 and 8, a fourth structure of the cooling medium channel configuration is that the bushings 20013 are provided around each crystal cooling pipe 2007 in a sleeve-like shape. A downwardly recessed semicircular step 20022 is disposed at the upper end of each bushing 20013. The upper end of each bushing 20013 is respectively connected to the water injection chamber 20011 disposed at the upper part of the upper flange 2003. The upper end of each semicircular step 20022 is respectively connected to the water return chamber 20020 disposed at the lower part of the upper flange 2003. The lower end of each bushing 20013 is respectively connected to the lower flange 2005. The cooling medium channel is formed by the cooling chamber 20012, the water injection chamber 20011 and the water return chamber 20020 between the inner edge surface of the bushing 20013 and the outer edge surface of the crystal cooling pipe 2007. The water inlet chamber 20011 communicates with the water inlet 2006, and the water return chamber 20020 communicates with the water outlet 2002 via a connecting pipe 20019, the water outlet 2002 and the water inlet 2006 forming the inlet and outlet of the coolant channel respectively.

[0072] As shown in Figures 6, 7, 9 and 10, the third structure of the upper flange 2003 is that the upper groove and the lower groove are respectively arranged on the upper surface and the lower surface of the upper flange 2003, the cover plate 20018 for the injection cavity and the cover plate 20021 for the return water chamber are respectively arranged on the open ends of the upper groove and the lower groove, the cavity formed by the cover plate 20018 for the injection cavity and the upper groove is the water injection chamber 20011, and the cavity formed by the cover plate 20021 for the return water chamber and the lower groove is the return water chamber 20020. A plurality of crystal cooling pipe through holes penetrating to the bottom of the lower groove, a drain hole 2002 and a water injection hole 2006 are respectively arranged on the cover plate 20018 for the water injection chamber. A plurality of sleeve through holes and return pipe through holes are respectively arranged on the cover plate 20021 for the return water chamber. A semicircular water injection hole is provided at the bottom of the upper gutter, which penetrates to the bottom of the lower gutter. The return water chamber 20020 communicates with the drain port 2002 via a connecting pipe 20019.

[0073] The structure of the lower flange 2005 is such that the lower flange 2005 is a solid structure with a plurality of lower crystal through-holes 2009 disposed on an upper surface of the lower flange 2005 which penetrate to the lower surface of the lower flange 2005 .

[0074] Alternatively, in fact, the lower flange 2005 shown in FIG. 7 may be replaced by the spout sealing ring 20037 of FIG. 26 to similarly accomplish the objectives of the present invention.

[0075] As shown in Fig. 26, the structure of the upper flange 2003 is the same as that of the upper flange 2003 in Fig. 7, that is, the upper groove and the lower groove are respectively arranged on the upper surface and the lower surface of the upper flange 2003, and the cover plate 20018 for the water injection chamber and the cover plate 20021 for the water return chamber are respectively arranged at the open ends of the upper groove and the lower groove. The cavity formed by the cover plate 20018 for the injection cavity and the upper groove is the water injection chamber 20011, and the cavity formed by the cover plate 20021 for the water return chamber and the lower groove is the water return chamber 20020. A plurality of crystal cooling pipe through holes penetrating to the bottom of the lower groove, the drain hole 2002 and the water injection hole 2006 are respectively arranged on the cover plate 20018 for the water injection chamber. A plurality of bushing through holes and return pipe through holes are arranged on the cover plate 20021 for the water return chamber. A semicircular water injection hole is provided at the bottom of the upper groove, which penetrates to the bottom of the lower groove. The return water chamber 20020 communicates with the drain port 2002 via a connecting pipe 20019. The upper end of the crystal cooling pipe 2007 passes through the return water chamber cover plate 20021, the return water chamber 20020, and the water injection chamber 20011 in this order, and then communicates with the bushing through hole of the water injection chamber cover plate 20018. The bushing 20013 is provided in a sleeve shape on the outer peripheral surface of the crystal cooling pipe 2007, and a space is provided between the outer peripheral surface of the crystal cooling pipe 2007 and the inner peripheral surface of the bushing 20013. An independent cooling medium channel is formed by a cavity between the outer peripheral surface of the crystal cooling pipe 2007 and the inner peripheral surface of the bushing 20013. A spout sealing ring 20037 is disposed between the outer peripheral surface of the lower end of the crystal cooling pipe 2007 and the inner peripheral surface of the lower end of the sleeve pipe (bushing) 20013 (the function of the spout sealing ring 20037 is similar to that of the lower flange 2005 in FIG. 7).

[0076] In practice, the outer shape of the upper flange 2003 in FIG. 26 is provided in a ring-like structure, i.e., the center of the upper flange 2003 is provided with a central hole passing therethrough, and at least one circle of bushing through-holes is disposed on the upper flange 2003. The bushing through-holes are respectively connected to the crystal cooling pipes 2007. In practice, a bushing support ring 20035 may be disposed on the outer peripheral surface of the bushing 20013 to improve the stability of the bushing 20013. It is also possible to provide a crystal observation hole 20036 at the lower end of the independent cooling medium channel, and check the pulling of the crystal through the crystal observation hole 20036. In an embodiment, the crystal observation hole 20036 should be provided to ensure the airtightness of the independent cooling medium channel. For example, a blocking plate may be used to block the openings of the crystal cooling pipes 2007 and the bushing 20013, so that a sealed cavity body is formed by the cavity between the crystal cooling pipes 2007 and the bushing 20013.

[0077] In practice, in order to enhance the cooling effect, a separator 20029 may be disposed in the cooling chamber 20012 between the crystal cooling pipe 2007 and the bushing 20013, as shown in FIG. 12. The cooling chamber 20012 is divided into a water injection chamber body and a drainage chamber body by the separator 20029, and the lower ends of the water injection chamber body and the drainage chamber body communicate with each other to form a circulation channel. In use, the cooling medium enters the water injection chamber 20011 through the water injection port 2006, and is then diverted to the water injection chamber body in each cooling chamber 20012 through the water injection chamber 20011. The cooling medium flows through the water injection chamber body of the cooling chamber 20012, enters the drainage chamber body in the cooling chamber 20012, and then enters the return chamber 20020 through the drainage chamber body. The cooling medium in the return chamber 20020 enters the drainage port 2002 through the connecting pipe 20019.

[0078] In the practice of the present invention, there may be one or more water inlets 2006 arranged on the upper flange 2003. If one is required to supply the cooling medium to the cooling disk 20025 and the cooling medium channel respectively, the upper flange 2003 may be arranged in a structure as shown in Fig. 5, so that the cooling medium can be diverted to the cooling disk 20025 and the cooling medium channel through the water inlet chamber 20011.

[0079] Also, preferably, as shown in Figures 13 and 14, the upper flange 2003 actually includes an upper disk, a center disk, and a lower disk. The upper disk, the center disk, and the lower disk are stacked to form the flange body. A center hole 20034 penetrating the flange body is disposed at the upper center of the flange body, a hollow return water chamber 20020 is disposed at the top of the flange body, and a hollow water injection chamber 20011 is disposed at the bottom of the flange body. A connection pipe 20019 is disposed at the top of the flange body and passes through to the water injection chamber 20011, and the connection pipe 20019 forms a water injection port 2006. A drain port 2002 is disposed at the top of the flange body and passes through to the return water chamber 20020, and a return water switching pipe 20030 is disposed at the bottom of the flange body and passes through to the return water chamber 20020. The upper crystal through-hole 2001 is disposed in the flange body around the central hole 20034 and penetrates to the flange body, and the upper crystal through-hole 2001 is disposed corresponding to the first ascending hole. The drain port is disposed below the flange body and passes through to the water injection chamber 20011, the drain port communicates with the water injection port of the cooling medium channel, and the drain port of the cooling medium channel communicates with the return water switching pipe 20030.

[0080] Also, in practice, the switching ring 20033 may be provided below the flange body, and has a central hole 20034 in the center of the switching ring 20033. The upper crystal through-hole 2001, the drain port and the return water port are respectively provided above the switching ring 20033. In an embodiment, the upper surface of the switching ring 20033 may be connected to the flange body via a bolt. The lower surface of the switching ring 20033 is fixedly connected to the connecting cylinder 2004 and the inner connecting cylinder 20031, so that the connecting cylinder 2004 and the inner connecting cylinder 20031 can be prevented from being directly connected to the flange body, and the flange body is movably connected to the connecting cylinder 2004 and the inner connecting cylinder 20031. When the flange body or the connecting cylinder 2004 and the inner connecting cylinder 20031 are broken and need to be replaced, separate replacement and the like can be realized. In order to improve the sealing properties of the cooling medium, sealing rings are respectively arranged at the drain port and the return water port. In practice, the sealing ring may be located on the switching ring 20033 or on the flange body.

[0081] In addition, in practice, the connecting cylinder 2004 and the inner connecting cylinder 20031 are respectively disposed between the flange body and the lower flange 2005. The crystal cooling pipe 2007 is disposed in the cavity between the connecting cylinder 2004 and the inner connecting cylinder 20031. The upper end of the crystal cooling pipe 2007 is connected to the upper crystal through-hole 2001 disposed in the flange body, and the lower end of the crystal cooling pipe 2007 is connected to the lower crystal through-hole 2009 disposed in the lower flange 2005. The cooling medium channel is formed by the cavity between the inner edge surface of the connecting cylinder 2004, the lower end surface of the upper flange 2003, the upper end surface of the lower flange 2005, and the outer edge surface of the inner connecting cylinder 20031. The water outlet 2002 and the water inlet 2006 form the inlet and outlet of the cooling medium channel, respectively. In addition, in the embodiment, a deflector 20032 is disposed in the cooling medium channel to smooth the flow of the cooling medium in the cooling medium channel and achieve a better cooling effect. By providing the deflector 20032, the cooling medium is forced to flow in a predetermined direction, which may provide a relatively uniform cooling effect.

[0082] Also, a cooling disk 20025 is disposed below the lower flange 2005. A cavity 20024 is disposed within the cooling disk 20025, and the cooling disk 20025 is provided with a crystal lifting hole 20027 corresponding to the lower crystal through hole 2009, and a drain hole and a water inlet hole communicating with the cavity 20024, respectively. The water inlet hole is connected to the lower end of a water inlet pipe 20028, the upper end of which passes through the lower flange 2005 and is connected to a drain below the flange body. The drain hole is connected to the lower end of a drain pipe 20023, the upper end of which passes through the lower flange 2005 and is connected to a cooling medium channel of the flange body.

[0083] In use, the cooling disk 20025 may or may not be disposed below the lower flange 2005. When the cooling disk 20025 is disposed below the lower flange 2005, the specific structure is as shown in FIG. 13. The cooling medium enters the water injection chamber 20011 through the water injection port 2006, then enters the water injection pipe 20028 through the drain port of the water injection chamber 20011, enters the cavity 20024 in the cooling disk 20025 through the water injection pipe 20028, enters the drain pipe 20023 through the cavity 20024, enters the cooling medium channel through the drain pipe 20023, is guided into the cooling medium channel by the deflector 20032, enters the return water chamber 20020 through the return water switching pipe 20030 in the cooling medium channel, enters the drain port 2002 through the return water chamber 20020 and is discharged. When the cooling disk 20025 is not disposed below the lower flange 2005, the cooling medium enters the water injection chamber 20011 through the water injection port 2006, and then enters the water injection pipe 20028 through the drain port of the water injection chamber 20011. At this time, when the water injection pipe 20028 is disposed inside the cooling medium channel, the lower end of the water injection pipe 20028 is located at the lower part of the cooling medium channel. After the cooling medium flows into the lower part of the cooling medium channel through the water injection pipe 20028, the cooling medium is guided into the cooling medium channel by the deflector 20032. The cooling medium flows from the lower part to the upper part of the cooling medium channel, and the cooling medium enters the return water chamber 20020 through the return water switching pipe 20030 at the upper part of the cooling medium channel, and enters the drain port 2002 through the return water chamber 20020 to be discharged. When the water injection pipe 20028 is disposed outside the cooling medium channel, the lower end of the water injection pipe 20028 is located at the lower part of the cooling medium channel, and the lower end of the water injection pipe 20028 is connected to the water injection port disposed at the lower part of the cooling medium channel via a bent part. After the cooling medium flows into the lower part of the cooling medium channel via the water injection pipe 20028, the cooling medium is guided into the cooling medium channel by the deflector 20032. The cooling medium flows from the lower part to the upper part of the cooling medium channel, and the cooling medium enters the return water chamber 20020 via the return water switching pipe 20030 at the upper part of the cooling medium channel, and enters the drain port 2002 via the return water chamber 20020 to be discharged.Alternatively, when the cooling disk 20025 is not disposed below the lower flange 2005, the cooling medium enters the water injection chamber 20011 through the water inlet 2006, and then enters the water injection pipe 20028 through the drain port of the water injection chamber 20011. At this time, the lower end of the water injection pipe 20028 is located at the upper part of the interior of the cooling medium channel. After the cooling medium enters the cooling medium channel, the cooling medium is guided in the cooling medium channel to the bottom of the cooling medium channel through the deflector 20032. At this time, the drain pipe 20023 is connected to the lower part of the cooling medium channel. The lower end of the drain pipe 20023 is located at the lower part of the cooling medium channel. The upper end of the drain pipe 20023 is connected to the return water switching pipe 20030. The cooling medium at the bottom of the cooling medium channel enters the return water chamber 20020 via the drain pipe 20023 and the return water switching pipe 20030, and enters the return water chamber 20020 into the drain port 2002 to be discharged.

[0084] In the practice of the present invention, all of the cooling medium inlets and outlets mentioned may be arranged in groups.

[0085] In a specific application example, the crystal cooling device according to the present embodiment is disposed above the crucible in the furnace chamber, and the lower surface of the lower flange 2005 or the lower surface of the cooling disk 20025 is close to but does not contact the silicon melt in the crucible. In operation, crushed silicon material is first put into the crucible. The heater is turned on to heat the crucible located on the crucible support table. After the crushed silicon material in the crucible melts into silicon material melt, the upper lifting head drives the seed crystal to descend. When the seed crystal passes through the crystal cooling pipe 2007 or the crystal cooling pipe 2007 and the crystal lifting hole 20027, it comes into contact with the silicon melt, causing the seed crystal to stop descending, and the seed crystal is slowly lifted after the lower end of the seed crystal melts. At this time, since the cooling medium is introduced in the present invention, the temperature of the lower surface of the lower flange 2005 or the lower surface of the cooling disk 20025 forms a temperature gradient with a higher temperature at the bottom and a lower temperature at the top. At this time, the silicon melt rises together with the seed crystal, and as the silicon melt approaches the lower surface of the lower flange 2005 or the lower surface of the cooling disk 20025, the silicon melt gradually crystallizes because its temperature is lower than that of the crucible. When the crystallized silicon melt enters the crystal cooling pipe 2007 or the crystal cooling pipe 2007 and the crystal lift hole 20027, the temperature gradually decreases, thereby forming the desired silicon core. In use, the cooling medium channel of the present invention allows for forced cooling of the silicon core immediately after crystallization, improving the yield and pulling efficiency of the silicon core.

[0086] The crushed silicon material involved in the present invention includes not only residual material generated during the preparation of silicon cores, inadvertently broken silicon cores, crushed material generated by polycrystalline silicon / monocrystalline silicon manufacturers during the process steps of reduction, cutting, grinding and polishing, but also silicon material in other shapes (such as cauliflower material, shorter silicon rods, etc.) Alternatively, according to the present invention, silicon cores may be directly pulled using silicon material purchased directly.

[0087] In fact, the present invention can be used not only to pull silicon cores but also to pull other crystalline materials.

[0088] According to this embodiment, by providing multiple crystal cooling pipes between the upper flange and the lower flange, and providing a cooling medium channel around the crystal cooling pipes, a low temperature area can be formed in the space above the crucible using the cooling medium, thereby forming a temperature gradient with a higher temperature at the bottom and a lower temperature at the top, thus reducing the temperature of the molten silicon liquid above the crucible, increasing the viscosity of the silicon liquid, and promoting the silicon liquid to follow the seed crystal for crystallization. Most importantly, the silicon core can be cooled to increase the pulling speed of the silicon core. According to this embodiment, the simultaneous pulling of multiple silicon cores is realized while increasing the silicon core pulling speed. When the embodiment is applied to an apparatus for simultaneously pulling multiple silicon cores from crushed silicon material, the waste of the resource of crushed silicon material is effectively avoided, which is suitable for widespread popularization and application.

[0089] Second embodiment 15 to 21 show schematic diagrams of a cooling device provided with a heat insulating plate according to a second embodiment of the present application, which is a combination of the cooling device according to the first embodiment and the heat insulating plate. Specifically, the heat insulating plate is disposed below the cooling device.

[0090] The configurations of the structures such as the cooling medium channel, bushing, cooling disk, and separator in this embodiment may be the same as those in the first embodiment described above (for example, as shown in Figs. 5 to 14), and the structure of the heat insulating plate in this embodiment is shown in Figs. 15, 16, 19, 20, 21, and 22. However, the structures of the components in this application are not limited to these.

[0091] The crystal cooling apparatus for crystal pulling described in relation to Figures 15 to 18 includes an upper flange 4003, a lower flange 4005, crystal cooling pipes 4007, a cooling medium channel and an insulating plate 40030, and a plurality of crystal cooling pipes 4007 are arranged between the upper flange 4003 and the lower flange 4005.

[0092] In practice, the arrangement of the crystal cooling pipes is such that one crystal cooling pipe is arranged in the center, and multiple groups of crystal cooling pipes are arranged radially around the central crystal cooling pipe, with each group of crystal cooling pipes including at least two crystal cooling pipes. Alternatively, a second arrangement of the crystal cooling pipes may be such that multiple groups of crystal cooling pipes are arranged radially around the gas through hole 40031 of the upper flange 4003 (as shown in FIG. 16), with the crystal cooling pipes located on concentric circles forming one group. It is also possible to group crystal cooling pipes that extend outward along the same diameter. Each group of crystal cooling pipes includes at least two crystal cooling pipes, and the number of crystal cooling pipes 4007 arranged is specifically selected depending on the number of crystals to be extracted.

[0093] The cooling medium channel is arranged around the crystal cooling pipe 4007. The cooling medium for cooling is introduced into the cooling medium channel. The inlet of the cooling medium channel is connected to a cooling source via a pipeline. The outlet of the cooling medium channel is connected to a cooling medium recovery mechanism via a pipeline. The heat insulating plate 40030 is arranged below the lower flange 4005.

[0094] Alternatively, as shown in Figs. 5-11, the cooling disk 20025 is disposed below the lower flange 2005. The cavity 20024 is disposed in the center of the cooling disk 20025. A plurality of fixing columns 20026 are disposed in the cavity 20024. A crystal lifting hole 20027 is disposed in each fixing column 20026. The cavity 20024 is communicated with the drain pipe 20023 and the water injection pipe 20028, respectively. The drain pipe 20023 and the water injection pipe 20028 are communicated with the cooling medium channel. The heat insulating plate 40030 is disposed below the cooling disk 20025 to constitute a crystal cooling device for pulling the crystal.

[0095] In the practical application of the present invention, by providing an insulating plate, the problems in practical application can be solved and the following effects can be realized:

[0096] 1. The cooling medium is introduced into the lower flange or cooling disk near the melt in the crucible, so that the outer surface temperature of the lower flange or cooling disk is lower than the temperature of the area where it is located. When the silicon material in the crucible melts into silicon liquid, the silicon liquid and impurities in the furnace chamber vaporize and float on the lower bottom or side wall of the lower flange or cooling disk. Because the cooling medium is introduced into the lower flange or cooling disk, the temperature of the lower flange or cooling disk is relatively low, and the volatile substances then condense and adhere to the bottom or side wall of the lower flange or cooling disk. When the volatile substances accumulate to a certain thickness, they fall into the crucible and float on the top surface of the melt due to the effects of gas flow turbulence and thermal expansion and contraction. Because the melting point of the volatile substances is higher than the melting point of the silicon material, the volatile substances cannot be melted and cannot be vaporized. In other words, the volatile substances remain on the top surface of the melt. Since the crucible is constantly rotating during pulling, the volatile substances in the crucible float at variable positions on the upper surface of the silicon melt, rather than remaining stationary at a specific point. If the floating substances adhere to the crystallization position of the silicon core, it will cause a convex deformation on the outer edge surface of the pulled silicon core, and in serious cases, the silicon core will be left behind in the crystal through-hole due to the change in the diameter of the silicon core. The pulling is eventually forced to stop, and the pulling for this round is terminated. The pulled silicon core cannot be used as a final product and must be discarded.

[0097] The provision of an insulating plate reduces or prevents the surface temperature of the lower flange or cooling disk from becoming lower than the temperature at which volatile substances will adhere and accumulate in the furnace due to the introduced cooling medium, thereby reducing or preventing condensation and adhesion of volatile substances in the melt to the outer surface of the lower flange or cooling disk.

[0098] 2. The lower surface of the lower flange or cooling disk is flat, so the cooling effect of the cooling medium of each crystal lifting hole in the lower flange or cooling disk is the same. In practical use, a cylindrical heater is used to heat the outside of the crucible, which results in a higher temperature in the outer area than in the center area due to the circular crucible. The temperature in the crucible gradually decreases from the inner edge of the crucible to the center of the crucible. Therefore, the crystals in the outer ring of the lower flange or cooling disk during pulling have a lower crystallization rate than the crystals in the inner ring of the lower flange or cooling disk due to the higher temperature of the outer ring than that of the inner ring (the closer the crystals are to the center of the crucible, the faster the crystallization rate is due to the relatively lower temperature). The diameter of the crystals in the outer ring of the lower flange or cooling disk is smaller than that of the crystals in the inner ring of the lower flange or cooling disk under the same pulling speed condition, so that the diameters of multiple crystals being pulled at the same time are uneven.

[0099] The temperature uniformity of each lower crystal through-hole 2009 or crystal lift hole 20027 of the lower flange 2005 or cooling disk 20025 can be better ensured by the heat insulating plate (i.e., the temperature of the lower crystal through-hole 2009 of the inner ring of the lower flange and the lower crystal through-hole 2009 of the outer ring or the temperature of the crystal lift hole 20027 of the inner ring of the cooling disk 20025 and the crystal lift hole 20027 of the outer ring may be adjusted, thereby realizing that the temperature of the lower crystal through-hole 2009 or crystal lift hole 20027 of the inner ring and the outer ring is more likely to be isothermal). This can ensure the consistency of crystallization of the crystals of the inner and outer rings.

[0100] 3. The lower surface of the lower flange or cooling disk is close to, but does not touch, the upper surface of the melt in the crucible, and the lower temperature of the surface of the lower flange or cooling disk absorbs some of the heat above the crucible, thereby resulting in unnecessary heat loss and certain losses in power consumption, etc.

[0101] By providing the heat insulating plate, the temperature of the crystallization region in the crucible becomes uniform, and unnecessary temperature drop of the crystallization region in the crucible caused by the cooling medium in the lower flange 2005 or the cooling disk 20025 (the surface temperature of the lower flange 2005 or the cooling disk 20025 is low, some heat is taken away, and the temperature drops after the heat is lost) can be reduced or avoided. Furthermore, since it is guaranteed that the temperature of the crystallization region in the crucible does not drop, there is no need to increase the heating power to ensure that the temperature of the crystallization region in the crucible does not drop, thereby realizing the effect of reducing energy consumption (i.e., through the configuration of the heat insulating plate, the absorption of the liquid surface temperature of the melt in the crucible by the lower flange 2005 or the cooling disk 20025 can be reduced or adjusted, thereby avoiding unnecessary heat loss and increased power consumption, etc.), and further realizing a uniform temperature of the crystallization region in the crucible, etc.

[0102] The thickness of the surface of the lower flange 4005 or the cooling disk 20025 can be increased by providing a heat insulating plate. When the thickness of the surface of the lower flange 4005 or the cooling disk 20025 is increased, the cooling effect of the lower flange 4005 or the cooling disk 20025 is improved (in this application, the wall thickness of the lower flange 4005 or the cooling disk 20025 is adjusted by providing a heat insulating plate, and the dissipation effect of the cooling air is improved, i.e., the cooling is fast in the thin wall and slow in the thick wall), thereby reducing the too fast low temperature dissipation in the lower flange 4005 or the cooling disk 20025.

[0103] Also, as shown in Figs. 21 and 22, the step surface is formed by disposing at least one upwardly recessed step portion from outside to inside under the lower flange or cooling disk 40025 of the cooling device. In order to simultaneously realize the pulling of more crystal rods, multiple rings of crystal lift holes 40027 are arranged on the lower flange or cooling disk 40025 from the outer edge to the inside at a predetermined interval (as shown in Fig. 22). At this time, in order to ensure the consistency of the diameter of the crystal pulled by each ring of crystal lift holes 40027, the main technical problem to be avoided is to overcome the problem of uneven temperature of the melt in the crucible. Therefore, the step surface is formed by disposing at least one upwardly recessed step portion from outside to inside under the lower flange or cooling disk 40025. A ring of crystal lift holes 40027 is arranged on each step surface respectively. The shape of the stepped surface corresponds to the stepped portion 4003003 of the insulating plate 40030 (as shown in FIG. 21 or 22). If implemented, the stepped portion may better ensure temperature uniformity of the crystal through-holes or crystal lift-off holes 40027 of the lower flange 4005 or cooling disk 40025, so as to ensure consistency of crystallization of the crystals in the inner and outer rings.

[0104] Also, as shown in FIG. 20, the heat insulating plate 40030 may have a plate-type structure. A plurality of through holes 4003001 are provided in the heat insulating plate 40030, and each through hole 4003001 corresponds to the lower crystal through hole 4009 of the lower flange 4005 or the crystal lift hole 40027 of the cooling disk 40025 (as shown in FIG. 20). The outer dimension of the heat insulating plate 40030 is equal to or larger than the outer dimension of the lower flange 4005 or the cooling disk 40025. In practice, the central hole may be arranged in the center of the heat insulating plate 40030, as 4003002 in FIG. 22. A plurality of groups of through holes may be arranged radially around the central hole, as 4003001 in FIG. 22. The central hole and the through holes correspond to the lower crystal through hole 2009 or the crystal lift hole 40027 of the lower flange or the cooling disk, respectively.

[0105] Also, as shown in FIG. 22, when the insulating plate 40030 has a plate-type structure, at least one upwardly raised step portion 4003003 is arranged on the upper surface of the insulating plate from the outside to the inside, and the step portion 4003003 coincides with the lower flange of the cooling device or the lower step surface of the cooling disk 400254.

[0106] 15, 16, 19 and 20, the insulating plate 40030 is provided with a groove recessed downwardly in the center of the insulating plate to form a barrel-like structure. A plurality of through holes are disposed in the insulating plate. Each through hole corresponds to a lower crystal through hole 4009 in the lower flange or a crystal lift hole 40027 in the cooling disk 40025 (as shown in FIG. 22). The inner edge surface of the groove has a clearance fit or an interference fit with the outer edge surface of the lower flange 4005 or the cooling disk 40025.

[0107] 15, 16, 19 and 21, the insulating plate 40030 is provided with a groove recessed downwards in its center to form a barrel-type configuration. In fact, an alternative configuration is to place an insulating ring on top of the insulating plate of the plate-type configuration, with the combination of the insulating ring and the insulating plate of the plate-type configuration forming a barrel-type configuration.

[0108] In practice, the insulating ring has a ring-like structure. One insulating ring or multiple insulating rings are stacked and placed together on the insulating plate with a flat plate-like structure. That is, the insulating plate with a barrel-type structure can be provided as an integral structure or as a divided structure. When the insulating plate with a barrel-type structure is provided as a divided structure, it includes an insulating ring and a bottom plate. The ring body of the insulating ring is disposed on the bottom plate, or multiple insulating rings are stacked on the bottom plate. The ring body of the insulating ring forms the barrel wall of the insulating plate with a barrel structure, and the bottom plate forms the barrel bottom of the insulating plate with a barrel structure.

[0109] Alternatively, a plurality of arc-shaped insulation blocks are placed on the insulation plate of the plate-type structure. The insulation ring is surrounded by the plurality of arc-shaped insulation blocks. The insulation ring surrounded by the plurality of arc-shaped insulation blocks and the insulation plate of the plate-type structure are combined to form a barrel-type structure.

[0110] In practice, the thickness of each arc-shaped insulation block and the spacing between two arc-shaped insulation blocks can be adjusted by cutting a complete insulation ring into multiple arc-shaped blocks to form arc-shaped insulation blocks, and then recombining the cut arc-shaped insulation blocks to form a complete insulation ring at a predetermined spacing.

[0111] In an embodiment, the materials of the insulating plate and the insulating ring of the plate-type structure can be set to be the same material, or the materials of the insulating plate and the insulating ring of the plate-type structure can be set to be different materials.

[0112] Also, where the outer peripheral surface of the lower flange or cooling disk 40025 is in a clearance fit with the inner peripheral surface of the groove, a thermal insulating filler 40032 is placed in the clearance, as shown in Figure 21. The thermal insulating filler is either quartz felt, graphite felt or zirconium felt.

[0113] Also, as shown in Fig. 21, when the heat insulating plate 40030 is arranged in a barrel-type structure, at least one step portion raised upward is arranged from outside to inside on the upper side of the heat insulating plate. As shown in Fig. 22 (4003003), the step portion coincides with the lower step surface of the lower flange 4005 or the cooling disk 40025. In the embodiment, the step portion can better ensure the temperature uniformity of the lower crystal through hole 4009 of the lower flange 4005 or the crystal lifting hole 40027 of the cooling disk 40025. Because the temperature distribution range of the crucible is such that the ambient temperature is higher than the central temperature, the cooling range of the lower flange 4005 or the cooling disk 40025 should also be changed during crystal pulling to ensure the consistency of crystallization of the crystal in the inner and outer circles.

[0114] In practice, the outer dimensions of the insulating plate are larger than those of the lower flange or cooling disk, resulting in a structure as shown in FIG. 20. The outer edge of the insulating plate 40030 extends outward to reduce or avoid adhesion of volatile materials to the outer edge of the lower flange 4005 or cooling disk 40025, while also acting as a tray or the like for volatile materials that drop onto the upper surface of the insulating plate 40030 extending therefrom. If the outer dimensions of the insulating plate 40030 are equal to the outer dimensions of the lower flange or cooling disk 40025, the structure will be as shown in FIG. 22. The insulating plate 40030 may be connected to the lower flange 4005 or cooling disk 40025 by adhesive, by pinning or screw fixing, or may be suspended below the lower flange 4005 or cooling disk 40025 by a connecting rod, or the like. The material of the insulating plate may be graphite felt, graphite plate, carbon-carbon composite plate, or the like.

[0115] The configuration of the insulating plate with a barrel-shaped structure may prevent volatile substances from adhering to and accumulating on the side wall of the lower flange or cooling disk, and may also play a role in adjusting the insulating effect of the side wall of the lower flange or cooling disk. By adjusting the insulating effect of the side wall of the lower flange or cooling disk and adjusting the temperature of the lower crystal through hole 4009 of the outer ring of the lower flange or the crystal lift hole 40027 of the outer ring of the cooling disk, the diameter of the cylindrical crystal to be pulled can be adjusted. The function of providing the insulating filler 40032 is to adjust the insulating temperature by adjusting the thickness of the additional insulating filler while exerting the insulating function, and finally to adjust the temperature of the lower crystal through hole 4009 of the outer ring of the lower flange or the crystal lift hole 40027 of the outer ring of the cooling disk, and to adjust the diameter of the cylindrical crystal to be pulled.

[0116] In fact, it is possible to provide an insulating plate on the upper panel of the lower flange or cooling disk, i.e. the entire outer surface of the lower flange or cooling disk is covered with insulating material.

[0117] In practice, a central hole 4003002 may be arranged in the center of the heat insulating plate to coincide with the through hole at the center of the cooling disk 40025. A plurality of through holes 1003001 corresponding to the crystal lifting holes 40027 of the cooling disk 40025 may be arranged around the central hole. When the lower flange or the lower surface of the cooling disk 40025 is provided with at least one step portion recessed upward from the outside to the inside to form a step surface, the heat insulating plate is provided with at least one step portion 4003003 protruding upward from the outside to the inside, and the step portion 4003003 cooperates with the step surface of the lower flange or the cooling disk 40025. The detailed structure is shown in Figures 21 and 22.

[0118] In practice, the cooling medium is preferably cooled pure water, but other cooling gases may be selected. In practice, the cooling disk 20025 may be arranged below the lower flange 4005 (as shown in Figures 10 and 11). A cavity 20024 is arranged in the center of the cooling disk 20025. A number of fixing columns 20026 are arranged in the cavity 20024. A crystal lifting hole 20027 is arranged in each fixing column 20026, respectively. The cavity 20024 communicates with a drain pipe 20023 and a water injection pipe 20028, respectively. The drain pipe 20023 and the water injection pipe 20028 communicate with a water injection port and a drain port arranged in the lower flange 2005 or 4005.

[0119] In a specific application of the present invention, the lower part of the lower flange or cooling disk of the present invention is positioned above the crucible in the furnace and is close to but not in contact with the melt in the crucible. In operation, raw material is first put into the crucible and the heater is turned on to heat the crucible located on the lower shaft. After the raw material in the crucible melts into a melt, the seed crystal is driven by the upper lifting mechanism to descend. After the seed crystal passes through the lower crystal through hole 2009 or the lower crystal through hole 2009 and the crystal lifting hole 20027 and the through hole 100501, the seed crystal comes into contact with the melt and is not lowered. After the lower end of the seed crystal melts, the seed crystal is slowly raised. As the cooling medium is introduced into the lower flange or cooling disk, the melt now follows the seed crystal and rises. As the melt approaches the underside of the lower flange or cooling disk, it gradually crystallizes because its temperature is below that of the crucible. As the crystallized melt enters the lower crystal through-hole 2009 or the lower crystal through-hole 2009 and the crystal lift hole 20027, the temperature gradually decreases to form the desired columnar crystals.

[0120] When applied, the cooling medium in the lower flange or cooling disk may perform forced cooling on the cylindrical crystal immediately after crystallization through the lower crystal through-hole 2009 or the lower crystal through-hole 2009 and the crystal lifting hole 20027. The heat insulating plate arranged on the lower flange or cooling disk may prevent volatile substances from adhering to the surface of the lower flange or cooling disk. In addition, the heat insulating effect (cooling insulation effect) in each ring of the lower crystal through-hole 2009 or the crystal lifting hole 20027 may be adjusted by the configuration of the heat insulating plate, thereby adjusting the diameter of the cylindrical crystal pulled up by the lower crystal through-hole 2009 or the crystal lifting hole 20027 in the inner and outer rings.

[0121] In practice, the shape of the step portions 100502 arranged on the insulating plate may be a circle or a quincunx shape formed by providing an inwardly recessed arc between every two of the through holes 100501 or an outwardly protruding arc between every two of the through holes 100501, or a variety of special shapes.

[0122] In the practice of this invention, all of the coolant inlets and outlets mentioned may be arranged in groups.

[0123] The crushed silicon material involved in the present invention includes not only residual material generated during the preparation of silicon cores, inadvertently broken silicon cores, crushed material generated by polycrystalline silicon / monocrystalline silicon manufacturers during the process steps of reduction, cutting, grinding and polishing, but also silicon material in other shapes (such as cauliflower material, shorter silicon rods, etc.) Alternatively, according to the present invention, silicon cores may be directly pulled using silicon material purchased directly.

[0124] In fact, this embodiment can be used not only for pulling silicon cores but also for pulling other crystalline materials.

[0125] In this embodiment, multiple crystal cooling pipes are disposed between the upper flange and the lower flange. A cooling medium channel is disposed around the crystal cooling pipes. A low temperature area is formed in the space above the crucible by the cooling medium to form a temperature gradient with a higher temperature at the bottom and a lower temperature at the top. It is also possible to reduce the temperature of the molten silicon liquid above the crucible and increase the viscosity of the silicon liquid to promote the silicon liquid to follow the seed crystal for crystallization. Most importantly, it is also possible to cool the silicon core, thereby increasing the pulling speed of the silicon core.

[0126] Furthermore, according to this embodiment, the insulation plate is disposed below the lower flange or cooling disk, and the surface of the crystal cooling mechanism is insulated by the insulation plate, so that the volatile substances are effectively prevented from adhering to the lower surface and side walls of the crystal cooling mechanism due to the condensation phenomenon. In this embodiment, the heat preservation function of the insulation plate prevents the adhesion of volatile substances to the crystal cooling mechanism, while avoiding the cooling of the corresponding crucible area caused by the low temperature below the crystal cooling mechanism, and prevents the crystal cooling mechanism from escaping excessive temperature, which has the effect of reducing heating energy consumption, etc. Meanwhile, due to the heat preservation function of the insulation plate, the cooling effect of the cooling medium in the crystal cooling mechanism can be fully applied to the inner wall of the crystal lifting hole, thereby improving the cooling effect on the pulled crystal, realizing the rapid crystallization of the crystal, and achieving the purpose of improving the crystal pulling speed, etc.

[0127] Application of this application According to the present application, there is also provided an artificial crystal preparation apparatus including a furnace body, a crucible disposed within the furnace body and arranged so as to be movable up and down within the furnace body, a lifting device disposed above the crucible and arranged so as to be movable up and down above the crucible, the lifting device having a receiving portion at an end thereof, and a crystal cooling device disposed above the crucible, the crystal cooling device having at least one first lifting hole through which a crystal pulled up from the crucible passes, and the ends of the lifting device being aligned with the first lifting holes, respectively.

[0128] FIG. 23 shows an artificial crystal preparation apparatus according to an embodiment of the present application. As shown in FIG. 23, the artificial crystal preparation apparatus includes a furnace body 1001, an upper lifting mechanism 1002, a crystal cooling mechanism 1004, a heat insulating plate 1005, a crucible 1007, and a heater 1008. The upper lifting mechanism 1002 corresponds to the lifting device in the present application. The crystal cooling mechanism 1004 is a specific example of the crystal pulling mechanism in the present application. The heater 1008 is disposed in the furnace body 1001. An insulating layer is disposed between the inner wall of the furnace body 1001 and the outer peripheral surface of the heater 1008. The crucible 1007, which is fixed in place or can be raised and lowered, is disposed in the center of the heater 1008. The crystal cooling mechanism 1004, which is fixed in place or can be raised and lowered, is disposed above the crucible 1007. By raising and lowering the crucible 1007 or the crystal cooling mechanism 1004, it is possible to realize that the distance between the lower surface of the crystal cooling mechanism 1004 and the liquid level of the melt 1006 in the crucible 1007 is easily constant. In a specific embodiment, by raising and lowering the crucible 1007 or raising and lowering the crystal cooling mechanism 1004, it is possible to ensure that the distance between the lower surface of the crystal cooling mechanism 1004 and the liquid level of the melt 1006 in the crucible 1007 is easily constant. The heat insulating plate 1005 is disposed at the lower part of the crystal cooling mechanism 1004. A plurality of lower crystal lifting holes (through holes) 100501, which correspond one-to-one to the upper crystal lifting holes 100401 of the crystal cooling mechanism 1004, are disposed in the heat insulating plate 1005. The upper crystal lifting holes are a specific example of the first lifting holes in this application. The lower crystal lifting hole is a specific example of the second lifting hole in the present application. The upper lifting mechanism 1002 is provided above the crystal cooling mechanism 1004, and a receiving portion is provided at the end of the upper lifting mechanism 1002. The lower ends of the seed crystals received in the receiving portions of the upper lifting mechanism 1002 are aligned with the upper crystal lifting holes 100401 of the crystal cooling mechanism 1004. The upper crystal lifting holes 100401 are a specific example of the first lifting hole in the present application. Multiple crystals can be pulled up simultaneously by the cooling mechanism.

[0129] In the practical application of the present invention, the following effects can be achieved by providing the heat insulating plate 1005:

[0130] 1. The provision of an insulating plate 1005 reduces or prevents the surface temperature of the crystal cooling mechanism 1004 from becoming lower than the temperature at which volatile substances adhere and accumulate in the furnace due to the cooling medium introduced, thereby reducing or preventing condensation and adhesion of volatile substances in the melt 1006 to the outer surface of the crystal cooling mechanism 1004.

[0131] 2. The temperature uniformity of each upper crystal lifting hole 100401 of the crystal cooling mechanism 1004 can be better ensured by the configuration of the insulating plate 1005 (i.e., the temperature of the upper crystal lifting hole 100401 of the inner ring and the upper crystal lifting hole 100401 of the outer ring of the crystal cooling mechanism 1004 may be adjusted, thereby making it easier for the temperatures of the upper crystal lifting holes 100401 of the inner ring and the outer ring to be isothermal).

[0132] 3. The cooling effect of the cooling mechanism 1004 is weakened by providing the insulating plate 1005 as at least one step recessed upward to form a step surface and by the difference in thickness of the step. That is, the temperature required for the central pull is high and the thickness of the insulating plate 1005 at the center is large, which weakens the cooling effect of the insulating plate 1005 on the melt 1006. In contrast, the temperature required for the outer pull is low and the thickness of the insulating plate 1005 at the edge is small, which enhances the cooling effect of the insulating plate 1005 on the melt 1006. The configuration of the insulating plate 1005 makes the pulling conditions on the inside and outside easier to be the same, which ensures the consistency of crystallization of the crystals on the inner and outer rings, and therefore the consistency of the diameter of the crystals pulled in each circle.

[0133] 4. By providing the heat insulating plate 1005, the temperature of the crystallization region in the crucible becomes uniform, and unnecessary temperature drop of the crystallization region in the crucible caused by the cooling medium in the crystal cooling mechanism 1004 (the surface temperature of the crystal cooling mechanism 1004 is low, some heat is taken away, and the temperature drops after the heat is lost) can be reduced or avoided. Furthermore, since it is guaranteed that the temperature of the crystallization region in the crucible does not drop, there is no need to increase the heating power to ensure that the temperature of the crystallization region in the crucible does not drop, thereby realizing the effect of reducing energy consumption (i.e., the configuration of the heat insulating plate 1005 reduces or adjusts the absorption of the liquid surface temperature of the melt 1006 in the crucible by the crystal cooling mechanism 1004, thereby making it possible to avoid unnecessary heat loss and increased power consumption, etc.).

[0134] In practice, in order to realize the distance between the lower surface of the crystal cooling mechanism 1004 and the liquid level of the melt 1006 in the crucible 1007 being easily constant, it is preferable that the crucible 1007 is raised and lowered so that the position of the crystal cooling mechanism 1004 does not move. The raising and lowering of the crucible 1007 is a relatively common conventional technical solution in the present technology. In particular, the lower end of the crucible 1007 may be disposed on a crucible support table, and the lower end of the crucible support table is connected to a lower shaft 1009 that can be raised and lowered. The raising and lowering of the crucible 1007 is realized by raising and lowering the lower shaft 1009. This technical solution not only has a simple structure, but can always ensure that the crystallization line of the crystal does not fluctuate (i.e., the liquid level of the melt 1006 is always at a fixed position of the heater).

[0135] When the technical solution is selected in which the crystal cooling mechanism 1004 is raised and lowered while the crucible 1007 is stationary, the crystal cooling mechanism 1004 is connected to a lifting mechanism that realizes the lifting function. The crystal cooling mechanism 1004 is driven up and down by the lifting mechanism. Note that the lifting mechanism is a conventional technique in this technology, and the specific structure will not be described here repeatedly.

[0136] In practice, the heater 1008 may also be configured to be raised and lowered. As the level of the melt 1006 in the crucible 1007 drops, the crystal cooling mechanism 1004 lowers, causing the heater 1008 to lower as well. This also ensures that the crystallization line of the crystal does not fluctuate. Similarly, the structure for raising and lowering the heater 1008 is also a conventional structure in the art and will not be described again here.

[0137] In addition, the crystal cooling mechanism 1004 is provided with an upper through hole 100403 at its center, and a cavity 100402 is disposed within the crystal cooling mechanism 1004. A plurality of groups of fixing columns are radially disposed around the upper through hole 100403. Each group of fixing columns includes at least two fixing columns. When implemented, the arrangement of the plurality of groups of fixing columns is such that fixing columns located on concentric circles or fixing columns extending outward along the same diameter can form one group. An upper crystal lifting hole 100401 is disposed in each fixing column. The cavity 100402 communicates with a drain pipe and a water injection pipe, respectively, and the drain pipe and the water injection pipe are respectively connected to a cooling medium source.

[0138] In addition, in order to simultaneously pull up more crystal rods, multiple cycles of upper crystal lifting holes 100401 are arranged at a predetermined interval from the outer edge to the inside of the crystal cooling mechanism 1004. At this time, in order to ensure the consistency of the diameter of the crystal pulled up by the upper crystal lifting holes 100401 in each circle, it is necessary to overcome the problem of the temperature distribution of the melt in the crucible 1007 being non-uniform. Therefore, at least one step surface of a step part recessed upward is provided from the outer side to the inside under the crystal cooling mechanism 1004, and the rings of the upper crystal lifting holes 100401 are respectively arranged on each step surface.

[0139] The specific structure of the crystal cooling mechanism 1004 may employ a cooling device according to a second embodiment of the present application, which will be described later.

[0140] The lower through-hole 100503 is disposed at the center of the heat insulating plate 1005, and a plurality of groups of lower crystal ascending holes 100501 are disposed radially around the lower through-hole 100503. The lower through-hole 100503 and the lower crystal ascending holes 100501 correspond to the upper through-hole 100403 and the upper crystal ascending holes 100401 of the crystal cooling mechanism 1004, respectively.

[0141] According to a preferred embodiment of the present application, the heat insulating plate 1005 has a plate-type structure, as shown in Figures 23 and 24. The outer dimension of the heat insulating plate 1005 is equal to or larger than the outer dimension of the crystal cooling mechanism 1004.

[0142] According to another preferred embodiment of the present application, as shown in Fig. 24, the heat insulating plate 1005 has a plate-type structure, and at least one upwardly raised step portion 100502 is disposed from the outside to the inside on the upper surface of the heat insulating plate 1005. The step portion 100502 coincides with the step surface of the lower part of the crystal cooling mechanism 1004.

[0143] According to yet another preferred embodiment of the present application, an alternative structural form of the insulating plate 1005 is a barrel-shaped structure in which the central portion of the insulating plate 1005 is recessed downward to form a groove, and its inner edge surface is in a clearance fit or interference fit with the outer edge surface of the crystal cooling mechanism 1004.

[0144] According to another preferred embodiment of the present application, when the insulating plate 1005 is arranged in a barrel-shaped structure, at least one upwardly raised step portion 100502 is arranged from the outside to the inside on the upper surface of the insulating plate 1005. The step portion 100502 coincides with the step surface of the lower part of the crystal cooling mechanism 1004.

[0145] When the outer peripheral surface of the crystal cooling feature 1004 is in a clearance fit with the inner peripheral surface of the groove, a thermal insulating filler is placed in the clearance. The thermal insulating filler is either quartz felt, graphite felt or zirconium felt.

[0146] The barrel-shaped insulating plate 1005 acts to prevent volatile substances from adhering to and accumulating on the sidewall of the crystal cooling mechanism 1004, and can also act to adjust the heat retention effect of the sidewall of the crystal cooling mechanism 1004. By adjusting the heat retention effect of the sidewall of the crystal cooling mechanism 1004, the temperature of the upper crystal lifting hole 100401 of the outer ring of the crystal cooling mechanism 1004 is adjusted, and thus the diameter of the cylindrical crystal 1003 to be pulled is adjusted. The function of providing the insulating filler is to adjust the insulating temperature by adjusting the thickness of the additional insulating filler while exerting the insulating function, and finally to adjust the temperature of the upper crystal lifting hole 100401 of the outer ring of the crystal cooling mechanism 1004, and adjust the diameter of the cylindrical crystal 1003 to be pulled, etc.

[0147] The lower part of the crystal cooling mechanism 1004 is provided with at least one step surface of a step portion recessed upward from the outside to the inside, and a heat insulating plate 1005 conforming to the shape of the step surface is disposed below the step surface. When implemented, the step portion can better ensure the temperature uniformity of the upper crystal lifting hole 100401 of the crystal cooling mechanism 1004. Since the temperature distribution range of the crucible is such that the temperature of the periphery is higher than the temperature of the center, when the crystal is pulled up, the cooling range of the crystal cooling mechanism 1004 should be changed according to the temperature distribution range of the crucible, so as to ensure the consistency of the crystallization of the crystal in the inner and outer circles.

[0148] As shown in FIG. 1, the insulating plate 1005 has a plate-type structure. The outer dimensions of the insulating plate 1005 are equal to or larger than the outer dimensions of the lower flange or cooling disk of the crystal cooling mechanism 1004. That is, according to a preferred embodiment of the present application, the outer dimensions of the insulating plate 1005 are larger than the outer dimensions of the crystal cooling mechanism 1004, and the outer edge of the insulating plate 1005 extends outward. Thus, the adhesion of volatile substances to the outer edge of the crystal cooling mechanism 1004 can be reduced or avoided. Also, the insulating plate 1005 can function as a tray, so that volatile substances fall onto the upper surface of the protruding insulating plate 1005, for example.

[0149] According to yet another preferred embodiment of the present application, the outer dimensions of the insulating plate 1005 are equal to the outer dimensions of the crystal cooling mechanism 1004. When the insulating plate 1005 is connected to the crystal cooling mechanism 1004, the insulating plate 1005 and the crystal cooling mechanism 1004 may be connected by gluing, by pins or screw fixing, or may be suspended below the crystal cooling mechanism 1004 by a connecting rod, etc.

[0150] The material of the insulating plate 1005 can be graphite felt, graphite plate or carbon-carbon composite plate, etc.

[0151] In practice, the insulating plate may be placed on the upper panel of the crystal cooling mechanism 1004, ie, the entire outer surface of the crystal cooling mechanism 1004 is covered with a layer of insulating material.

[0152] In implementation, the lower through-hole 100503 corresponding to the through-hole in the central part of the crystal cooling mechanism 1004 can be arranged in the center of the heat insulating plate 1005. A plurality of lower crystal lift holes 100501 corresponding to the upper crystal lift holes 100401 of the crystal cooling mechanism 1004 can be arranged around the lower through-hole 100503. When the lower surface of the crystal cooling mechanism 1004 forms a step surface by providing at least one step recessed upward from the outside to the inside, the heat insulating plate 1005 has at least one step raised upward from the outside to the inside, and the step 100502 cooperates with the step surface of the crystal cooling mechanism 1004. A detailed structure is shown in FIG. 24.

[0153] The cooling medium referred to in the present invention is cooling water, cooling oil or cooling gas such as liquid nitrogen.

[0154] In a specific application of the present invention, the insulating plate 1005 is positioned above the crucible 1007 in the furnace body 1001, and the lower surface of the crystal cooling mechanism 1004 is close to but does not contact the melt 1006 in the crucible 1007. In operation, raw material is first charged into the crucible 1007, and the heater 1008 is turned on to heat the crucible 1007 located on the lower shaft 1009. After the raw material in the crucible 1007 melts into the melt 1006, the seed crystal is driven by the upper lifting mechanism 1002 to descend. The seed crystal passes through the upper crystal lifting hole 100401 and the lower crystal lifting hole 100501 and comes into contact with the melt 1006, and the descent of the seed crystal is stopped. After the bottom end of the seed crystal melts, the seed crystal is slowly raised, with the melt 1006 following the seed crystal as it rises. As the melt approaches the bottom surface of the crystal cooling mechanism 1004, the cooling medium introduced into the crystal cooling mechanism 1004 causes the melt 1006 to gradually crystallize as its temperature is below that of the crucible 1007. As the crystallized melt enters the upper crystal lift hole 100401 and its temperature gradually decreases, the desired columnar crystal (tubular crystal) 1003 is formed. In use, the cooling medium in the crystal cooling mechanism 1004 may be forced by the upper crystal lift hole 100401 to cool the tubular crystal 1003 immediately after crystallization. The insulating plate 1005 arranged in the crystal cooling mechanism 1004 may prevent volatile substances from adhering to the surface of the crystal cooling mechanism 1004, and may also adjust the insulating effect (insulation effect) of each ring of the upper crystal lifting hole 100401, thereby adjusting the diameter of the tubular crystal 1003 pulled up by the upper crystal lifting hole 100401 in the inner and outer rings.

[0155] In practice, the shape of the step portion 100502 arranged on the insulation plate 1005 may be arranged in a circular shape, or may be formed in a five-point shape by providing an inwardly recessed arc between every two lower crystal ascending holes 100501 (a specific structure is shown in Figure 25), or may be formed in a flower shape by providing an outwardly protruding arc between every two lower crystal ascending holes 100501, or may be formed in various other shapes.

[0156] In the practice of the present invention, all of the cooling medium inlets and outlets mentioned may be arranged in groups.

[0157] In fact, the present invention can be used not only for pulling silicon cores and silicon rods, but also for pulling other crystalline materials.

[0158] According to this embodiment, by providing an insulating plate below the crystal cooling mechanism so that the surface of the crystal cooling mechanism is insulated by the insulating plate, the adhesion of volatile substances to the underside and sidewall of the crystal cooling mechanism due to condensation is effectively avoided. In the present invention, the heat retention function of the insulating plate prevents the adhesion of volatile substances to the crystal cooling mechanism, while avoiding the temperature drop of the crucible area corresponding to the underside of the crystal cooling mechanism due to the low temperature of the underside of the crystal cooling mechanism, preventing the crystal cooling mechanism from escaping excessive temperature, reducing heating energy consumption, etc. Meanwhile, due to the heat retention function of the insulating plate, the cooling effect of the cooling medium in the crystal cooling mechanism is fully applied to the inner wall of the upper crystal lifting hole, thereby improving the cooling effect of the pulled crystal, realizing rapid crystallization of the crystal, and achieving the purpose of improving the crystal pulling speed, etc.

[0159] This application is primarily applicable to silicon core furnaces for pulling silicon cores with crushed silicon material.

[0160] The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Those skilled in the art may combine the above embodiments of the present invention with each other, and the present invention may have various modifications and variations. Any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A crystal cooling apparatus for simultaneously pulling a plurality of crystals, the crystal cooling apparatus being provided with a plurality of first ascent holes for passing the pulled crystals therethrough, and a cooling medium channel for cooling the crystals.

2. An upper flange (2003) and a lower flange (2005), and a crystal cooling pipe (2007) disposed between the upper flange (2003) and the lower flange (2005), 2. A crystal cooling apparatus for simultaneously pulling multiple crystals as described in claim 1, wherein one end of the crystal cooling pipe (2007) is connected to the upper flange (2003) and the other end of the crystal cooling pipe (2007) is connected to the lower flange (2005), the crystal cooling pipe (2007) forms the first lifting hole, and the cooling medium channel is arranged around the crystal cooling pipe (2007).

3. 3. A crystal cooling apparatus for simultaneously pulling multiple crystals as described in claim 2, wherein a water outlet (2002) and a water inlet (2006) for access of a cooling medium to cool the crystals are arranged on the upper flange (2003) or the lower flange (2005).

4. 3. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 2, wherein the upper flange (2003) is provided with an upper crystal through hole (2001) penetrating the upper flange (2003), the upper crystal through hole (2001) being provided in correspondence with the first lifting hole.

5. 3. A crystal cooling device for simultaneously pulling up multiple crystals as described in claim 2, wherein an upwardly recessed groove is arranged on the underside of the upper flange (2003) or a downwardly recessed groove is arranged on the upper side of the upper flange (2003), a lower cover plate (20017) is arranged at the open end of the groove, the lower cover plate (20017) and the groove form a water injection chamber (20011), an upper crystal through hole (2001) penetrating the upper flange (2003) is arranged at the bottom of the groove, the upper crystal through hole (2001) is arranged corresponding to the first lifting hole, and multiple through holes are arranged in the lower cover plate (20017).

6. An upper groove and a lower groove are respectively disposed on the upper and lower surfaces of the upper flange (2003), a cover plate for a water injection chamber (20018) and a cover plate for a water return chamber (20021) are respectively disposed on the open ends of the upper groove and the lower groove, the cover plate for the water injection chamber (20018) and the upper groove form a water injection chamber (20011), the cover plate for the water return chamber (20021) and the lower groove form a water return chamber (20020), and an upper crystal through hole (2001), a drain port (2002) and a water return port (2003) extend through to the bottom of the lower groove. A crystal cooling device for simultaneously pulling up multiple crystals as described in claim 2, wherein water inlets (2006) are respectively arranged on the cover plate for the water injection chamber (20018), the upper crystal through-holes (2001) are arranged corresponding to the first lifting hole, a water injection hole is provided at the bottom of the upper groove that penetrates to the bottom of the lower groove, the water injection chamber (20011) is connected to the water injection port (2006), the return water chamber (20020) is connected to the drain port (2002), and multiple through-holes are arranged on the cover plate for the return water chamber (20021).

7. The upper flange (2003) comprises an upper disk, a central disk and a lower disk stacked to form a flange body, a central hole (20034) penetrating the flange body is located at the center of the upper surface of the flange body, a hollow water return chamber (20020) is located in the upper part of the flange body, a hollow water injection chamber (20011) is located in the lower part of the flange body, a connecting pipe (20019) penetrating to the water injection chamber (20011) is located on the upper surface of the flange body, and the connecting pipe (20019) is a water injection chamber. A crystal cooling device for simultaneously pulling up multiple crystals as described in claim 2, wherein a drain port (2002) forming an inlet (2006) and penetrating to the return water chamber (20020) is arranged on the upper surface of the flange body, a return water switching pipe (20030) penetrating to the return water chamber (20020) is arranged on the lower surface of the flange body, upper crystal through holes (2001) penetrating the flange plate are arranged on the upper surface of the flange body around the central hole (20034), and the upper crystal through holes (2001) are arranged in correspondence with the first lifting hole.

8. A crystal cooling device for simultaneously pulling up multiple crystals as described in claim 7, wherein a switching ring (20033) is arranged on the underside of the flange body, a central hole (20034) is arranged in the center of the switching ring (20033), and an upper crystal through hole (2001), a drain opening and a return water opening are respectively arranged on the upper surface of the switching ring (20033).

9. 3. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 2, wherein the lower flange (2005) is provided with a lower crystal through hole (2009) penetrating the lower flange (2005), and the lower crystal through hole (2009) is arranged to correspond to the first lift hole.

10. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 2, wherein a downwardly recessed groove is arranged on the upper surface of the lower flange (2005), an upper cover plate (20015) is arranged at the open end of the groove, the groove and the upper cover plate (20015) form a water collection chamber (20016), a lower crystal through hole (2009) penetrating to the bottom of the lower flange (2005) is arranged at the bottom of the groove, the lower crystal through hole (2009) is arranged corresponding to the first lifting hole, and multiple through holes are arranged in the upper cover plate (20015).

11. A crystal cooling device for simultaneously pulling up multiple crystals as described in any one of claims 2 to 10, wherein a cooling disk (20025) is arranged below the lower flange (2005), a cavity (20024) is arranged within the cooling disk (20025), and the cooling disk (20025) is provided with a crystal lifting hole (20027) arranged corresponding to the lower crystal through hole (2009), as well as a drain hole and a water inlet hole each communicating with the cavity (20024).

12. 11. A crystal cooling apparatus for simultaneously pulling multiple crystals according to any one of claims 2 to 10, wherein a connecting cylinder (2004) is disposed between the upper flange (2003) and the lower flange (2005), the crystal cooling pipe (2007) is disposed inside the connecting cylinder (2004), one end of the crystal cooling pipe (2007) is connected to an upper crystal through hole (2001) disposed in the upper flange (2003), and the other end of the crystal cooling pipe (2007) is connected to a lower crystal through hole (2009) disposed in the lower flange (2005), and the cooling medium channel is formed by a cavity between the inner edge surface of the connecting cylinder (2004), the lower end surface of the upper flange (2003) and the upper end surface of the lower flange (2005).

13. A crystal cooling device for simultaneously pulling up multiple crystals as described in any one of claims 2 to 10, wherein a bushing (20013) is provided in the shape of a sleeve around the crystal cooling pipe (2007), one end of the bushing (20013) is connected to a water injection chamber (20011) arranged in the upper flange (2003), and the other end of the bushing (20013) is connected to a water collection chamber (20016) arranged in the lower flange (2005), and the cooling medium channel is formed by the cooling chamber (20012), the water injection chamber (20011) and the water collection chamber (20016) between the inner edge surface of the bushing (20013) and the outer edge surface of the crystal cooling pipe (2007).

14. A bushing (20013) is provided around the crystal cooling pipe (2007) in a sleeve shape, and a downwardly recessed semicircular step portion (20022) is disposed at the upper end of the bushing (20013), the upper end of the bushing (20013) communicates with a water injection chamber (20011) disposed in the upper flange (2003), and the upper end of the semicircular step portion (20022) communicates with a return water chamber (20020) disposed at the lower part of the upper flange (2003), and the bushing (20013) A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in any one of claims 2 to 10, wherein the lower end of the cooling chamber (20011), the lower end of the cooling chamber (20011) communicates with or is connected to a water collecting chamber (20016) arranged on the upper part of the lower flange (2005), and the cooling medium channel is formed by the cooling chamber between the inner edge surface of the bushing (20013) and the outer edge surface of the crystal cooling pipe (2007), the water injection chamber (20011), the return water chamber (20020) and the water collecting chamber (20016).

15. A crystal cooling device for simultaneously pulling multiple crystals according to claim 13 or 14, wherein a separator (20029) is arranged in the cooling chamber (20012) between the crystal cooling pipe (2007) and the bushing (20013).

16. The crystal cooling device is provided with a plurality of crystal cooling pipes (2007); one of said crystal cooling pipes (2007) is located at the center of said crystal cooling device, and a plurality of groups of crystal cooling pipes (2007) are arranged radially around said central crystal cooling pipe (2007), each group of crystal cooling pipes (2007) comprising at least two crystal cooling pipes (2007); or A crystal cooling device for simultaneously pulling multiple crystals as described in any one of claims 2 to 10, wherein a central hole (20034) is arranged in the center of the crystal cooling device, and multiple groups of crystal cooling pipes (2007) are arranged radially around the central hole (20034), and each group of crystal cooling pipes (2007) has at least two crystal cooling pipes (2007).

17. 9. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 7 or 8, wherein a connecting cylinder (2004) and an inner connecting cylinder (20031) are respectively provided between the flange body and the lower flange (2005), the crystal cooling pipe (2007) is arranged in a cavity between the connecting cylinder (2004) and the inner connecting cylinder (20031), the upper end of the crystal cooling pipe (2007) is connected to an upper crystal through hole (2001) arranged in the flange body, and the lower end of the crystal cooling pipe (2007) is connected to a lower crystal through hole (2009) arranged in the lower flange (2005), and the cooling medium channel is formed by a cavity between an inner edge surface of the connecting cylinder (2004), a lower end surface of the upper flange (2003), an upper end surface of the lower flange (2005) and an outer edge surface of the inner connecting cylinder (20031).

18. 18. A crystal cooling device for simultaneously pulling multiple crystals as described in claim 12 or 17, wherein a water outlet (2002) and a water inlet (2006) for access of a cooling medium to cool the crystals are arranged on the connecting cylinder.

19. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 17, wherein a cooling disk (20025) is arranged below the lower flange (2005), a cavity (20024) is arranged within the cooling disk (20025), the cooling disk (20025) is provided with a crystal lifting hole (20027) arranged corresponding to the lower crystal through hole (2009), as well as a drain hole and a water inlet hole respectively communicating with the cavity (20024), the water inlet hole being connected to the lower end of a water inlet pipe (20028), the upper end of the water inlet pipe (20028) being connected to a drain port below the flange body through the lower flange (2005), the drain hole being connected to the lower end of a drain pipe (20023), the upper end of the drain pipe (20023) being connected to the cooling medium channel of the flange body through the lower flange (2005).

20. Further comprising an insulating plate (40030) disposed below the lower flange (4005); A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 2, wherein the insulating plate (40030) is provided with at least one second lifting hole arranged in one-to-one correspondence with the lower crystal through hole (4009) of the lower flange (4005).

21. Further comprising an insulating plate (40030) disposed below the cooling disk (40025); A crystal cooling apparatus for simultaneously pulling multiple crystals as described in claim 1, wherein the insulating plate (40030) is provided with at least one second lifting hole, the second lifting hole being arranged in one-to-one correspondence with the crystal lifting hole (40027) of the cooling disk (40025).

22. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 20 or 21, wherein a central hole (4003002) is formed in the center of the insulating plate (40030) and the second lifting holes are arranged radially around the central hole (4003002).

23. A crystal cooling device for simultaneously pulling multiple crystals as described in claim 20 or 21, wherein the outer dimensions of the insulation plate (40030) are equal to or greater than the outer dimensions of the lower flange (4005) or the cooling disk (40025).

24. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 20 or 21, wherein an upwardly raised step portion (4003003) is arranged from the outside to the inside on the upper surface of the insulation plate (40030), and the step portion (4003003) corresponds to a step surface on the lower surface of the lower flange (4005) or the lower surface of the cooling disk (40025).

25. A crystal cooling apparatus for simultaneously pulling multiple crystals as described in claim 20 or 21, wherein the insulating plate (40030) has a groove recessed downward to form a barrel-shaped structure in the center, and the inner edge surface of the groove is in a clearance fit or interference fit with the outer edge surface of the lower flange (4005) or the cooling disk (40025).

26. 26. A crystal cooling apparatus for simultaneously pulling multiple crystals as described in claim 25, wherein an insulating filler (40032) is disposed in the gap when the inner edge surface of the groove is in clearance fit with the outer edge surface of the lower flange (4005) or the cooling disk (40025).

27. A crystal cooling apparatus for simultaneously pulling up multiple crystals as described in claim 11, wherein the cooling disk (40025) has an upper through hole in its center, a cavity (40024) is disposed within the cooling disk (40025), and multiple crystal lifting holes (40027) are radially disposed around the upper through hole.

28. A crystal cooling device for simultaneously pulling up multiple crystals as described in claim 11, wherein a step surface is formed by providing an upwardly recessed step portion from the outside to the inside on the underside of the lower flange (4005) or the cooling disk (40025), and the circles of the crystal lifting holes (40027) are arranged on each step surface.

29. An artificial crystal preparation device comprising a crystal cooling device according to any one of claims 1 to 28.

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