Wafer polishing system, mounting method and method of use thereof

Abstract

The present invention discloses a wafer polishing system, which includes a wafer transport device and a polishing module. The wafer transport device includes a fixed seat and a sheet placement platform, and the fixed seat can move along the X-axis direction in the wafer transport passage with the sheet placement platform. The polishing module is installed on the side of the wafer transfer passage, and can pick up and polish the wafer on the sheet placement platform. A docking mechanism is provided between the fixed seat and the sheet placement platform, and the docking mechanism has a part connected to the fixed seat and a part connected to the sheet placement platform. When the two parts are docked, the sheet placement platform and the fixed seat realize a stopper function, and the docking mechanism can move within the plane where the X-axis and the Y-axis are located, and move the sheet placement platform to a target position. The present invention further discloses a mounting method for the wafer polishing system. The present invention further discloses a method for using the wafer polishing system. The present invention effectively ensures that the sheet placement platform moves to a target position, and is adjusted by overlapping in two dimensions, and has a wide docking range. The function of docking to realize a stopper can be performed in different processes and can be flexibly applied.

Description

[Technical field]

[0001] The present invention relates to the field of semiconductor integrated circuit chip manufacturing technology, and more particularly to a wafer polishing system, a mounting method and a method of using the same. [Background technology]

[0002] Chemical Mechanical Planarization (CMP) equipment usually includes a semiconductor equipment front-end module (EFEM), a cleaning unit, and a polishing unit. The EFEM mainly includes a cartridge for storing wafers, a sheet-transporting robot arm, and an air purification system. The cleaning unit mainly includes a different number of megasonic cleaning parts, a roll brush cleaning part, a drying part, and a wafer transport device between parts. The polishing unit mainly includes a polishing table, a polishing head, a polishing liquid supply system, and a polishing pad repair system.

[0003] With the change of CMP equipment, in order to pursue higher polishing yield, one equipment usually contains multiple polishing units, and during the wafer processing, the transfer of wafers between each module has a significant impact on the overall polishing yield of the chemical mechanical planarization equipment. The transfer of wafers between the polishing units and the outside, and between the polishing units, is usually realized by devices such as sheet carriers and robot arms.

[0004] As shown in Fig. 1, the sheet placement table and the robot arm usually have multiple workstations, the robot arm 101 moves from a to b, and the sheet placement table moves from c to d, but due to various errors, the ab line and the cd line cannot be completely parallel, so when the robot arm comes into contact with the wafer, it deviates from the design state, making it difficult to remove the chip, and even damaging the wafer. Summary of the Invention

[0005] To overcome the deficiencies of the prior art, the present invention provides a wafer polishing system, mounting method and method of use that overcomes the misalignment that exists between the robot arm and the sheet placement platform and ensures that the robot arm can efficiently remove the wafer.

[0006] The technical solution adopted by the present invention to solve the technical problem is a wafer polishing system, which includes: The wafer transport apparatus includes a stationary seat and a sheet rest for carrying the wafer. The fixed seat holds a sheet placement table and can move along the X-axis direction within the wafer transport path. The polishing module is provided on the side of the wafer transport path and is capable of receiving and polishing a wafer on a sheet placement platform. A docking mechanism is provided between the fixed seat and the sheet placement table, and the docking mechanism has a portion connected to the fixed seat and a portion connected to the sheet placement table. When both parts of the docking mechanism complete docking, the sheet support and the fixed seat jointly realize a stopper function, and the docking mechanism can move within the plane where the X-axis and the Y-axis are located, thereby moving the sheet support to a target position within the plane where the X-axis and the Y-axis are located.

[0007] Furthermore, the docking mechanism includes: a movable plate provided on the fixed seat so as to be movable by a slide rail; an upper docking section provided on the sheet placement table; A lower docking portion is provided on the moving plate, The moving plate can move within a plane in which the X-axis and Y-axis are located, and moves the sheet placement table to a target position by axial docking of the lower docking portion and the upper docking portion.

[0008] Furthermore, the upper docking portion includes at least a first portion and a second portion arranged coaxially, an inner diameter of the first portion corresponds to an outer diameter of the lower docking portion, an inner diameter of the second portion is larger than an inner diameter of the first portion, and the second portion is adjacent to the lower docking portion. Alternatively, the lower docking portion includes at least a first portion and a second portion arranged coaxially, the inner diameter of the first portion corresponds to the outer diameter of the upper docking portion, the inner diameter of the second portion is larger than the inner diameter of the first portion, and the second portion is close to the upper docking portion.

[0009] Furthermore, the sheet placing platform has a fine-motion state in which it floats at least in the X-axis and Y-axis directions, and when the sheet placing platform is in the fine-motion state, a docking mechanism provides a fixed seat and stopper function, and the sheet placing platform switches from the fine-motion state to a stop state.

[0010] Furthermore, the moving plate is provided with a groove that contacts the eccentric cam, and when an external force drives the eccentric cam to rotate, the moving plate moves along the plane on which the X-axis and Y-axis are located.

[0011] Further, the device includes a storage unit for storing the rotation angle of the eccentric cam for each working position.

[0012] Furthermore, the target position is a position where the sheet placement platform and the clamp face each other, thereby overcoming the misalignment of the sheet placement platform in the plane where the X-axis and Y-axis are located when the fixed base moves to different working positions along the X-axis direction.

[0013] Further, the number of the clamps is at least two, at least one clamp is used for loading and unloading the wafer before polishing, and at least one clamp is used for loading and unloading the wafer after polishing.

[0014] The present invention further discloses a method for mounting the above-mentioned wafer polishing system, comprising the steps of: A part of the docking mechanism moves in a plane in which the X-axis and Y-axis are located relative to the fixed base. The sheet placement table moves up and down along the Z-axis direction to approach the fixed seat. The docking mechanism and the sheet rest provide axial docking. The above three steps may be performed in sequence, in parallel, or simultaneously. The sheet placement table is moved to a target position within a plane in which the X-axis and Y-axis are located.

[0015] It further includes the following steps: The moving plate moves within the plane in which the X-axis and Y-axis are located relative to the fixed base. The sheet placement table moves up and down along the Z-axis direction to approach the fixed seat. An upper docking portion below the sheet placement table and a lower docking portion above the moving plate are docked in the axial direction. The above three steps may be performed in sequence, in parallel, or simultaneously. The sheet placement table is moved to a target position within a plane in which the X-axis and Y-axis are located.

[0016] It further includes the following steps: The moving plate moves within the plane in which the X-axis and Y-axis are located relative to the fixed base. The sheet placement table starts to move up and down in the Z-axis direction and approaches the fixed seat. The movable plate continues to move within the plane in which the X-axis and Y-axis are located relative to the fixed seat, and the sheet placement table continues to rise and fall in the Z-axis direction until the upper docking portion and the lower docking portion dock in the axial direction, approaching the fixed seat. The moving plate stops moving. The sheet placement table stops moving up and down.

[0017] It further includes the following steps: The moving plate moves to a target position within the plane where the X-axis and Y-axis are located relative to the fixed base. The sheet placement table moves up and down in the Z-axis direction and approaches the fixed seat until the upper docking portion and the lower docking portion are docked in the axial direction.

[0018] It further includes the following steps: The sheet placement platform starts to move up and down in the Z-axis direction until the upper docking section and the lower docking section dock, approaching the fixed seat. The moving plate, holding the sheet placement platform, moves to a target position in the Y-axis direction relative to the fixed seat.

[0019] The present invention also discloses a method of using the above-mentioned wafer polishing system, comprising the steps of: The docking mechanism docks the sheet placement table and the fixed seat to realize a stopper function, and the sheet placement table is positioned at a position opposite to the clamp target position, and the clamp places the wafer on the sheet placement table. The polishing head of the polishing module rotates above the sheet mounting table, the sheet mounting table switches to a fine motion state in which it can float in the X-axis and Y-axis directions, and the polishing head removes the wafer. The docking mechanism docks the sheet placement platform and the fixed seat to realize a stopper function, and the sheet placement platform moves to different working positions in the X-axis direction. The above three steps may be carried out in sequence, or any selected steps may be combined, or one, two or more steps may be repeated in combination. The misalignment of the sheet placement table in the X-axis and Y-axis directions is removed, and the sheet placement table and the clamp are aligned.

[0020] It further includes the steps of: After both parts of the docking mechanism complete docking, the docking mechanism moves within a plane along which the X-axis and the Y-axis lie, and positions the sheet placement platform in a position opposite the clamp, and the clamp places the wafer on the sheet placement platform.

[0021] It further includes the following steps: The docking mechanism docks the sheet placement table and the fixed seat to realize a stopper function, and positions the sheet placement table in a position opposite the clamp. The clamp moves in the X-axis direction to above the sheet placement table, carrying the wafer, and then moves up and down in the Z-axis direction to place the wafer on the sheet placement table. The polishing head rotates above the sheet platform. The sheet placement table moves up and down in the Z-axis direction and switches to a fine-motion state in which it can float in the X-axis and Y-axis directions, and moves to a corresponding position of the polishing head under the constraints of the stopper function structure. The sheet placement platform moves up and down in the Z-axis direction, and a docking mechanism docks the sheet placement platform with the fixed seat to provide a stopper function. The polishing head picks up the wafer and polishes it. The sheet placement platform moves in the X-axis direction to another working position. The sheet placement table moves up and down in the Z-axis direction and switches to a fine movement state in which it floats in the X-axis and Y-axis directions. A part of the docking mechanism moves to a target position within the plane on which the X-axis and Y-axis are located in response to the action of an external force. The sheet placement platform moves up and down in the Z-axis direction and docks with the fixed base using a docking mechanism to achieve a stopper function, eliminating misalignment in the X-axis and Y-axis directions and aligning with the clamp.

[0022] It further includes the following steps: The docking mechanism docks the sheet placement table and the fixed seat to realize a stopper function, and positions the sheet placement table at a position opposite to the clamp target position. The clamp holds the wafer and moves along the X-axis direction above the sheet placement table, then moves up and down in the Z-axis direction to place the wafer on the sheet placement table, and then moves the clamp. The polishing head rotates above the sheet placement table, which then rises in the Z-axis direction and floats within the plane where the X-axis and Y-axis are located to align the polishing head. The polishing head picks up the wafer on the sheet placement table. The sheet placement table rises and falls in the Z-axis direction, and the sheet placement table and the fixed seat are docked by the docking mechanism to a target position required for the sheet placement table of the next work position, thereby limiting the position, and this target position is stored in the memory unit. The polishing head positions the wafer in a polishing position in the polishing module. The sheet placement table is moved in the X-axis direction to another working position.

[0023] The beneficial effects of the present invention are as follows: 1) Even if the fixed seat moves to different working positions, the fixed seat docks with the sheet placement table at the same working position to realize the stopper function, and these operations can effectively ensure that the sheet placement table moves accurately to the target position. 2) The docking mechanism uses the sliding of the moving plate on the slide rail to realize the movement relative to the fixed seat, and the axial docking of the upper docking part and the lower docking part is performed by overlapping and adjusting in two dimensions to realize the docking of the sheet placement table and the fixed seat, which has a wide docking range, can be adapted to different use scenarios, and can be widely applied. 3) The structure of the docking mechanism is relatively simple, easy to assemble, and has a simple driving structure. 4) The stopper function realized by docking between the docking mechanisms can be performed in different processes, and can be flexibly applied. 5) Under the premise of ensuring that the docking of the polishing head and the wafer transfer device is not affected, the precise docking of the wafer transfer device and the clamp is overlapped, and the structure is compact, and precise double docking is realized at each workstation. 6) The docking mechanism is disposed on the wafer transport device and can dynamically move according to the wafer transport device, and can adjust the position of the wafer transport device at each workstation. 7) The docking mechanism can store multiple positions at a specific workstation, and can adjust the position in real time to meet the misalignment needs of multiple clamp workstations. 8) It has a high adaptability to the robot arm, and can perform accurate alignment in any situation, such as multiple robot arms at a single workstation, a single robot arm at multiple workstations, or multiple robot arms at multiple workstations. [Brief description of the drawings]

[0024] [Figure 1] 1 is a schematic diagram of the misalignment that occurs when a robot arm and a sheet platform move to different workstations in the prior art; [Diagram 2] 1 is a schematic diagram of the structure of a wafer polishing system of the present invention; [Diagram 3] FIG. 3 is an enlarged view of the structure of portion A in FIG. 2. [Figure 4] FIG. 2 is a schematic diagram of the docking mechanism of the present invention when both parts of the docking mechanism are not completely docked. [Diagram 5] 2 is a schematic diagram of the docking mechanism of the present invention when both parts of the docking mechanism have been fully docked; FIG. [Figure 6] FIG. 4 is a schematic diagram showing an eccentric cam of the docking mechanism of the present invention. [Figure 7] 13 is a schematic diagram of the structure between the sheet placement table and the moving plate of the present invention when the docking between the upper docking portion and the lower docking portion is not completed. FIG. [Figure 8] 13 is a schematic diagram of the structure between the sheet placement table and the moving plate of the present invention when the docking between the upper docking portion and the lower docking portion is completed. FIG. [Figure 9] 1 is a schematic diagram of the structure of the docking process between the upper docking portion and the lower docking portion of the present invention; FIG. [Figure 10] FIG. 2 is a schematic plan view of the movable plate of the present invention; [Figure 11] FIG. 1 is a schematic diagram of the present invention for overcoming the misalignment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] In order to allow those skilled in the art to better understand the embodiments of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. It is clear that the described embodiments are only some embodiments of the present invention, and are not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative labor shall fall within the protection scope of the present invention.

[0026] As shown in FIG. 2, the wafer polishing system includes a wafer transport device 1 for transporting a wafer in a wafer transport passage 3, a polishing module 4 provided on a side of the wafer transport passage 3, and a gripping mechanism having a clamp 6. As shown in the coordinate system of FIG. 2, the longitudinal extension direction of the wafer transport passage 3 is defined as the X-axis direction, the width direction of the wafer transport passage 3 as the Y-axis direction, and the direction perpendicular to the plane on which the X-axis and Y-axis exist as the Z-axis direction. The wafer transport device 1 further includes a fixed seat 11 and a sheet mounting table 12 for supporting the wafer 2, and the fixed seat 11 can move in the X-axis direction in the wafer transport passage 3 while holding the sheet mounting table 12. The polishing module 4 can obtain the wafer 2 from the sheet mounting table 12 and polish it.

[0027] A docking mechanism 5 is provided between the fixed base 11 and the sheet support 12. A part of the docking mechanism 5 is connected to the fixed base 11, and a part of the docking mechanism 5 is connected to the sheet support 12. When both parts of the docking mechanism 5 complete docking, the sheet support 12 and the fixed base 11 realize a stopper function, and the docking mechanism 5 can move within the plane on which the X-axis and the Y-axis are located, thereby moving the sheet support 12 to a target position within the plane on which the X-axis and the Y-axis are located.

[0028] Here, the sheet placement platform 12 and the fixed seat 11 realizing the stopper function means that they do not move relative to each other, particularly in the plane in which the X-axis and Y-axis are located. In this embodiment, the position of the fixed seat 11 is relatively fixed, and when the docking of both parts of the docking mechanism 5 is not completed, the fixed seat 11 and the sheet placement platform 12 are connected in the conventional configuration, but are in a relatively floating state, and a small amount of movement may occur between them.

[0029] Therefore, when the docking mechanism 5 is present and the sheet placement platform 12 is not at the target position, the target position here may be a position directly facing the clamp 6 of the gripping mechanism, or may be another position. The position of the fixed seat 11 is relatively fixed, and after both parts of the docking mechanism 5 complete the docking, the positions of the docking mechanism 5 and the sheet placement platform 12 are relatively fixed, and the docking mechanism 5 again moves the sheet placement platform 12 to the target position by moving in the plane where the X-axis and Y-axis are located relative to the fixed seat 11. Alternatively, after a part of the docking mechanism 5 moves in the plane where the X-axis and Y-axis are located to relatively fix the position with respect to the fixed seat 11, the docking is completed by both parts of the docking mechanism 5, and the sheet placement platform 12 is moved to the target position. The specific order is not limited.

[0030] As shown in Figs. 2 to 8, the docking mechanism 5 includes a moving plate 51, an upper docking section 53, and a lower docking section 54. The moving plate 51 is provided movably on the fixed seat 11 via a slide rail 52. That is, the moving plate 51 realizes relative movement with the fixed seat 11 in a plane on which the X-axis and the Y-axis are located via the slide rail 52. The function of the slide rail 52 is realized as a conventional technique, so it will not be described. The upper docking section 53 is provided on the sheet placement table 12, and in this embodiment, it is particularly provided on the lower surface of the sheet placement table 12, but it can be provided at another position on the sheet placement table 12 in other embodiments. The lower docking section 54 is provided on the moving plate 51, and in this embodiment, it is particularly provided on the upper surface of the moving plate 51, but it can be provided at another position on the moving plate 51 in other embodiments.

[0031] The moving plate 51 is movable within a plane on which the X-axis and the Y-axis are located, and the sheet placement table 12 is moved to a target position by docking the lower docking section 54 and the upper docking section 53 in the axial direction. As shown in FIG. 9, the upper docking section 53 includes at least a first section 531 and a second section 532 that are provided coaxially, and the inner diameter of the first section 531 matches the outer diameter of the lower docking section 54. Here, matching means that when the lower docking section 54 is cylindrical, the inner diameter of the first section 531 and the outer diameter of the lower docking section 54 are equal. The inner diameter of the second section 532 is larger than the inner diameter of the first section 531, and the second section 532 is close to the lower docking section 54. In this embodiment, the tip of the lower docking section 54 is cut to form a tapered surface 541, and a squeezed segment 533 is further formed between the first section 531 and the second section 532. As a result, when the upper docking portion 53 and the lower docking portion 54 are docked in the axial direction, as shown in Figure 9a, first the lower docking portion 54 is inserted into the second body 532, then the tapered surface 541 abuts and slides against the inner wall of the throttle segment 533, and as shown in Figure 9b, it enters into the first body 531, and as shown in Figure 9c, axial docking of the upper docking portion 53 and the lower docking portion 54 is achieved.

[0032] Of course, in other embodiments, the throttle segment 533 may be the second body 532, as long as its inner diameter is larger than the inner diameter of the first body 531 to ensure easy insertion of the lower docking part 54.

[0033] Alternatively, the structure is interchangeable, i.e., the lower docking portion includes at least a first portion and a second portion arranged coaxially, the inner diameter of the first portion corresponds to the outer diameter of the upper docking portion, the inner diameter of the second portion is larger than the inner diameter of the first portion, and the second portion is adjacent to the upper docking portion.

[0034] The sheet placing platform 12 has a slight movement state in which it can float at least in the X-axis direction and the Y-axis direction, and in the slight movement state, the docking mechanism 5 realizes a stopper function with the fixed seat 11, so that the sheet placing platform 12 switches from the slight movement state to a stopped state. The slight movement state of the sheet placing platform 12 here means that, although the fixed seat 11 and the sheet placing platform 12 are connected by an existing configuration, they move relatively by a small amount. The stopped state here means that at least the sheet placing platform 12 and the docking mechanism 5 do not move relatively to each other.

[0035] As shown in Fig. 7, when the sheet placing table 12 is at the upper position, the upper docking portion 53 and the lower docking portion 54 are in a separated state, and even at this time, the sheet placing table 12 remains in a slight motion state. As shown in Fig. 8, when the sheet placing table 12 descends to a lower position along the Z axis, the upper docking portion 53 and the lower docking portion 54 enter an axial docking state, and the sheet placing table 12 switches to a stopped state.

[0036] The movement of the docking mechanism 5 relative to the fixed seat 11 is realized by an external force. In this embodiment, a groove 56 is provided in the movable plate 51, and an eccentric cam 55 connected to a motor 551 extends into the groove 56 and contacts the inner wall of the groove 56. Specifically, as shown in FIG. 10, the outer diameter of the eccentric cam 55 and the width of the groove 56 are equal, the length of the groove 56 is greater than the outer diameter of the eccentric cam 55, the axis of the output shaft of the motor 551 is located at point A, the contact point between the eccentric cam 55 and the groove 56 is located at normal line B, and the deviation between A and B is located in the X-axis direction. The position of the motor 551 is relatively fixed, and when the motor 551 drives the eccentric cam 55 to rotate, the movable plate 51 moves along the slide rail 52 within the plane where the X-axis and Y-axis are located, and particularly generates a movement in the X-axis direction. The movable plate 51 can be controlled to stop arbitrarily within the stroke range according to the rotation angle of the motor 551.

[0037] The wafer polishing system also includes a memory unit, which is used to store the rotation angle of the eccentric cam 55 at each working position, so that it can be quickly rotated to the target position according to the value recorded by the memory unit. In the above, a part of the docking mechanism 5 first moves in the plane where the X-axis and Y-axis are located, and then it is fixed relative to the position of the fixed seat 11, and then the two parts of the docking mechanism 5 complete the docking and move the sheet support 12 to the target position, that is, the memory unit is used to first move the moving plate 51 to the target position, and then the two parts of the docking mechanism 5 are docked. The installation of the memory unit can realize the automatic adjustment of the clamp at different positions, and can also realize the situation where one sheet support corresponds to multiple clamps.

[0038] When the target position of the sheet placement table 12 is the position facing the clamp 6 of the gripping mechanism, the conventional clamp 6 structure can only move parallel to the X-axis and move up and down along the Z-axis, but cannot move in the Y-axis direction, so there are two work stations in the Z-axis direction, and when the clamp is in the upper position, the wafer can be transported in different areas according to the movement in the X-axis direction, and when the clamp is in the lower position, the wafer can be removed from the sheet placement table or placed on it. This overcomes the problem that the sheet placement table 12 cannot face the clamp 6 due to the deviation of the sheet placement table 12 in the plane where the X-axis and Y-axis of the sheet placement table 12 are located when the fixed seat 11 moves to different work stations of the wafer transport passage 3 along the X-axis direction, for example, when it moves to the wafer loading / unloading positions corresponding to the polishing heads of the two polishing modules.

[0039] To ensure that the clamps 6 do not contaminate the wafer 2, the number of clamps 6 is at least two, at least one clamp is used for loading and unloading the wafer before polishing, and at least one clamp is used for loading and unloading the wafer after polishing, i.e., the sheet-loading clamp is responsible for loading the wafer to be polished onto the sheet-loading platform, and the sheet-removing clamp is responsible for removing the polished wafer from the sheet-loading platform, and the two clamps are respectively located on both sides of the wafer transport path 3. Of course, in other embodiments, the number of clamps 6 may be one.

[0040] A mounting method for a wafer polishing system is performed based on the structure of the wafer polishing system, and includes the following steps. A part of the docking mechanism 5 moves relative to the fixed base 11 within a plane in which the X-axis and Y-axis are located. The sheet placement table 12 moves up and down in the Z-axis direction to approach the fixed seat 11 . The docking mechanism 5 realizes docking with the sheet placement table 12 in the axial direction. The above three steps may be performed in sequence, in parallel, or simultaneously. The final objective is to move the sheet placement table 12 to a target position within a plane on which the X and Y axes are located.

[0041] More specifically, A mounting method for a wafer polishing system is performed based on a structure of the wafer polishing system, and includes the following steps. The movable plate 51 moves relative to the fixed base 11 within a plane on which the X-axis and the Y-axis are located. The sheet placement table 12 moves up and down in the Z-axis direction to approach the fixed seat 11 . An upper docking portion 53 on the lower side of the sheet placement table 12 and a lower docking portion 54 on the upper side of the moving plate 51 are docked in the axial direction. The above three steps may be performed in sequence, in parallel, or simultaneously. The final objective is to move the sheet placement table 12 to a target position on a plane on which the X and Y axes are located.

[0042] Three embodiments will be specifically described below. EMBODIMENT 1 A method for mounting a wafer polishing system based on the structure of the wafer polishing system includes the following steps. The movable plate 51 moves within a plane including the X-axis and the Y-axis relative to the fixed base 11, and this movement is defined as movement A. The sheet placement table 12 starts to move up and down in the Z-axis direction and approaches the fixed base 11; The movable plate 51 continues to move within a plane defined by the X-axis and Y-axis relative to the fixed seat 11, and the sheet loading platform 12 continues to move up and down in the Z-axis direction to approach the fixed seat; that is, both of the above-mentioned movements A and B exist until the upper docking portion 53 and the lower docking portion 54 are docked in the axial direction. The movement of the moving plate 51 stops, and the movement A ends. The rising and lowering of the sheet placement table 12 stops, and the movement B ends. The start and end order of the above movements A and B is interchangeable and will not be described in detail. In this embodiment, the entire docking process requires less movement time and is more time efficient.

[0043] EMBODIMENT 2 A method for mounting a wafer polishing system based on the structure of the wafer polishing system includes the following steps. The movable plate 51 moves within a plane on which the X-axis and the Y-axis are located relative to the fixed base 11, and this movement is defined as a movement A. When the target position is reached, movement A ends. The sheet placement table 12 moves up and down in the Z-axis direction to approach the fixed base 11 . This movement is defined as movement B. Movement B ends when the upper docking portion 53 and the lower docking portion 54 are axially docked. In this embodiment, the requirements for structural design are low, and the position adjustment function for the sheet placement table 12 can be realized simply by driving the moving plate 51 with an external force.

[0044] EMBODIMENT 3 The sheet placement table 12 moves up and down in the Z-axis direction to approach the fixed base 11 . This movement is defined as movement B. When the upper docking portion 53 and the lower docking portion 54 are docked, movement B ends. The moving plate 51 moves in the Y-axis direction relative to the fixed base 11 while holding the sheet placement table 12. This movement is defined as a movement A. When the target position is reached, movement A ends. In this embodiment, before the moving plate 51 moves, both parts of the docking mechanism are in a docking stop state, so that the external force directly drives the moving plate 51 and the sheet placement table 12 as a whole to move.

[0045] EMBODIMENT 4 The above-mentioned wafer polishing system and its installation method are applied to a specific use scenario, i.e., a method for using the wafer polishing system is based on the structure and installation method of the above-mentioned wafer polishing system, and includes the following steps: The docking mechanism 5 docks the sheet mounting table 12 and the fixed seat 11 to realize a stopper function, and the sheet mounting table 12 is positioned opposite the target position of the clamp 6, and the clamp 6 places the wafer 2 on the sheet mounting table 12. The above step may be such that, after completing the docking between the sheet mounting table 12 and the fixed seat 11, the docking mechanism 5 is allowed to move within a plane on which the X-axis and Y-axis are located, the sheet mounting table 12 is positioned opposite the clamp 6, and the clamp 6 places the wafer 2 on the sheet mounting table 12. The polishing head 41 of the polishing module 4 rotates above the sheet mounting table 12, the sheet mounting table 12 switches to a fine motion state in which it can float in the X-axis and Y-axis directions, and the polishing head 41 removes the wafer 2. The docking mechanism 5 docks the sheet placement table 12 and the fixed seat 11 to realize a stopper function, and the sheet placement table 12 moves to different operating positions in the X-axis direction. The above three steps may be performed in order, or any selected steps may be selected and combined, or one, two or more of the steps may be repeated and combined. The misalignment of the sheet placement table 12 in the X-axis direction and the Y-axis direction is eliminated, and the position of the sheet placement table 12 with the clamp 6 is adjusted.

[0046] As shown in Fig. 11, this embodiment absorbs various errors that inevitably occur in a polishing apparatus during manufacturing and assembly, and prevents the movement paths of the actual clamp 6 and fixed seat 11 along the X-axis direction from becoming non-parallel due to the presence of errors, and further prevents the alignment between the clamp 6 and the sheet mounting table 12 from being inconsistent with the alignment between the clamp 6 and the sheet mounting table 12 along the X-axis and Y-axis directions, especially the Y-axis direction, when the clamp 6 inserts or removes the wafer 2 on the sheet mounting table 12 at different positions along the X-axis. Taking Fig. 11 as an example, the ideal wafer insertion / removal position is position d, and the actual wafer insertion / removal position is position e due to errors, with a deviation Δy between the two in the Y-axis direction. This embodiment eliminates this deviation Δy, and realizes accurate alignment between the clamp 6 and the sheet mounting table 12. The third embodiment will be specifically described below in the manner of two embodiments.

[0047] EMBODIMENT 5 A method of using a wafer polishing system, comprising the steps of: The docking mechanism 5 docks the sheet placement table 12 and the fixed seat 11 so that the sheet placement table 12 faces the target position of the clamp 6, thereby realizing a stopper function. The clamp 6 moves with the wafer 2 in the X-axis direction to above the sheet placement table 12 and then moves up and down in the Z-axis direction to place the wafer 2 on the sheet placement table 12 . The polishing head 41 rotates above the sheet placement table 12 . The sheet placement table 12 moves up and down in the Z-axis direction, switches to a fine-motion state in which it can float in the X-axis and Y-axis directions, and moves to a corresponding position of the polishing head 41 under the constraints of the stopper function structure. The stopper function structure here can be realized by conventional technology, and will not be described further. The sheet placement table 12 moves up and down in the Z-axis direction, and the sheet placement table 12 and the fixed seat 11 are docked by the docking mechanism 5 to realize a stopper function. The polishing head 41 picks up the wafer 2 and polishes it. The sheet placement table 12 moves in the X-axis direction to another working position. The sheet placement table 12 moves up and down in the Z-axis direction and switches to a fine movement state in which it can float in the X-axis and Y-axis directions. A moving plate 51, which is a part of the docking mechanism 5, is moved to a target position within a plane on which the X-axis and Y-axis are located by an external force. The sheet placing table 12 moves up and down in the Z-axis direction, and is docked with the fixed seat 11 by the docking mechanism 5 to realize a stopper function, eliminate misalignment in the X-axis and Y-axis directions, and align the sheet placing table 12 with the other clamp 6.

[0048] EMBODIMENT 6 A method of using a wafer polishing system, comprising the steps of: The docking mechanism 5 docks the sheet placement table 12 and the fixed seat 11 so that the sheet placement table 12 faces the target position of the clamp 6, thereby realizing a stopper function. The clamp 6 holds the wafer 2 and moves in the X-axis direction above the sheet placement table 12, then moves up and down in the Z-axis direction to place the wafer 2 on the sheet placement table 12, and the clamp 6 moves again. The polishing head 41 rotates above the sheet mounting table 12. The sheet mounting table 12 rises in the Z-axis direction and floats within the plane in which the X-axis and Y-axis are located, and is aligned with the polishing head 41. The polishing head 41 picks up the wafer 2 on the sheet placement table 12 . The sheet placing table 12 moves up and down in the Z-axis direction, and the docking mechanism 5 docks the sheet placing table 12 and the fixed seat 11 to the target position required for the sheet placing table 12 at the next working position, thereby realizing a stopper function, and the target position is stored in the memory unit. The polishing head 41 transports the wafer 2 to a polishing position in the polishing module 4 . The sheet placement table 12 moves in the X-axis direction to another working position.

[0049] EMBODIMENT 7 A method of using a wafer polishing system, comprising the steps of: The clamp 6 holds the wafer 2 and moves in the X-axis direction to above the sheet placement table 12, and then moves up and down in the Z-axis direction so as to place the wafer 2 on the sheet placement table 12. The polishing head 41 rotates above the sheet placement table 12 . The sheet placement table 12 moves up and down in the Z-axis direction, switches to a fine movement state in which it can float in the X-axis and Y-axis directions, and moves to a position corresponding to the polishing head 41 under the constraints of the structure of the stopper function. A moving plate 51, which is a part of the docking mechanism 5, is moved to a target position within a plane on which the X-axis and Y-axis are located by an external force. The sheet placement table 12 moves up and down along the Z-axis direction, and docks with the fixed seat 11 via the docking mechanism 5 to achieve a stopper function. The polishing head 41 takes out the wafer on the sheet placement table 12 and polishes it. The sheet placement table 12 moves in the X-axis direction to another working position.

[0050] The above specific embodiments are intended to illustrate the present invention, but are not intended to limit the present invention. Any modifications and variations to the present invention within the spirit of the present invention and the scope of protection of the claims are included in the scope of protection of the present invention.

Claims

1. a wafer transport device (1) including a fixed seat (11) and a sheet placement table (12) for carrying a wafer (2), the fixed seat (11) being movable along an X-axis direction within a wafer transport passage (3) while holding the sheet placement table (12); a polishing module (4) provided on a side of the wafer transport passage (3) and capable of acquiring and polishing a wafer (2) on a sheet placement table (12), A docking mechanism (5) is provided between the fixed seat (11) and the sheet placement table (12), The docking mechanism (5) has a portion connected to a fixed seat (11) and a portion connected to a sheet placement table (12), When both parts of the docking mechanism (5) complete docking, the sheet mounting table (12) and the fixed seat (11) realize a stopper function, and the docking mechanism (5) can move within a plane on which the X-axis and Y-axis are located, thereby moving the sheet mounting table (12) to a target position within the plane on which the X-axis and Y-axis are located. This wafer polishing system is characterized by the above.

2. The docking mechanism (5) A movable plate (51) provided on a fixed seat (11) so as to be movable by a slide rail (52); an upper docking section (53) provided on the sheet placement table (12); A lower docking portion (54) is provided on the moving plate (51), 2. The wafer polishing system according to claim 1, wherein the movable plate (51) can move within a plane in which the X-axis and the Y-axis are located, and the sheet loading table (12) is moved to a target position by axial docking of the lower docking portion (54) and the upper docking portion (53).

3. The upper docking section (53) includes at least a first section (531) and a second section (532) arranged coaxially, the inner diameter of the first section (531) is adapted to the outer diameter of the lower docking section (54), the inner diameter of the second section (532) is larger than the inner diameter of the first section (531), and the second section (532) is close to the lower docking section (54); Alternatively, the lower docking portion includes at least a first portion and a second portion arranged coaxially, the inner diameter of the first portion corresponds to the outer diameter of the upper docking portion, the inner diameter of the second portion is larger than the inner diameter of the first portion, and the second portion is closer to the upper docking portion.

4. 2. The wafer polishing system of claim 1, wherein the sheet mounting table (12) has a fine-motion state capable of floating at least in the X-axis and Y-axis directions, and when the sheet mounting table (12) is in the fine-motion state, a stopper function is realized by a docking mechanism (5) and a fixed seat (11), and the sheet mounting table (12) switches from the fine-motion state to a stop state.

5. 3. The wafer polishing system according to claim 2, wherein the movable plate (51) is provided with a groove (56) that comes into contact with the eccentric cam (55), and when an external force drives the eccentric cam (55) to rotate, the movable plate (51) moves along a plane on which the X-axis and Y-axis are located.

6. 6. The wafer polishing system according to claim 5, further comprising a memory unit for storing the rotation angle of said eccentric cam (55) at each working position.

7. 2. The wafer polishing system according to claim 1, wherein the target position is a position opposite the sheet mounting table (12) and the clamp (6), and is a position that overcomes any deviation in the plane in which the X-axis and Y-axis of the sheet mounting table (12) are located when the fixed seat (11) is moved to a different working position along the X-axis direction.

8. 8. The wafer polishing system of claim 7, wherein the number of clamps (6) is at least two, at least one clamp is used for loading and unloading a wafer before polishing, and at least one clamp is used for loading and unloading a wafer after polishing.

9. A method for mounting a wafer polishing system according to any one of claims 1 to 8, comprising the steps of: A step of moving a part of the docking mechanism (5) relative to the fixed seat (11) within a plane on which the X-axis and the Y-axis are located; A step in which the sheet placement table (12) moves up and down along the Z-axis direction to approach the fixed seat (11); The docking mechanism (5) and the sheet placement platform (12) include a step of realizing axial docking; The above three steps can be performed in sequence, in parallel, or simultaneously. A method for mounting a wafer polishing system, comprising the steps of: moving the sheet mounting table (12) to a target position within a plane on which the X-axis and the Y-axis are located.

10. A step in which the movable plate (51) moves relative to the fixed seat (11) within a plane on which the X-axis and the Y-axis are located; A step in which the sheet placement table (12) moves up and down along the Z-axis direction to approach the fixed seat (11); The method includes a step of docking an upper docking portion (53) below the sheet placement table (12) and a lower docking portion (54) above the moving plate (51) in the axial direction, The above three steps can be performed in sequence, in parallel, or simultaneously.

10. The method for mounting a wafer polishing system according to claim 9, wherein the sheet placement table (12) is moved to a target position within a plane in which the X-axis and the Y-axis lie.

11. A step in which the movable plate (51) moves relative to the fixed seat (11) within a plane on which the X-axis and the Y-axis are located; a step in which the sheet placement table (12) starts to move up and down in the Z-axis direction and approaches the fixed seat (11); the movable plate (51) continues to move relative to the fixed seat (11) within a plane on which the X-axis and Y-axis are located, and the sheet placement table (12) continues to move up and down in the Z-axis direction until the upper docking portion (53) and the lower docking portion (54) dock in the axial direction, approaching the fixed seat (11); A step of the moving plate (51) stopping the movement; 10. The method for mounting a wafer polishing system according to claim 9, further comprising the step of: stopping the lifting and lowering of the sheet placement table (12).

12. A step of moving the movable plate (51) to a target position within a plane on which the X-axis and the Y-axis are located relative to the fixed seat (11); 10. The method for mounting a wafer polishing system according to claim 9, wherein the sheet loading table (12) moves up and down in the Z-axis direction to approach the fixed seat (11) until the upper docking portion (53) and the lower docking portion (54) are docked in the axial direction.

13. The sheet placement table (12) starts to move up and down in the Z-axis direction until the upper docking portion (53) and the lower docking portion (54) are docked, and approaches the fixed seat (11).

10. The method for mounting a wafer polishing system according to claim 9, wherein the movable plate (51) holds the sheet placement table (12) and moves in the Y-axis direction relative to the fixed base (11) to a target position.

14. A method of using the wafer polishing system according to any one of claims 1 to 8, comprising: a step of docking the sheet placement table (12) and the fixed seat (11) with a docking mechanism (5) to realize a stopper function, thereby positioning the sheet placement table (12) at a position opposite to the target position of the clamp (6), and the clamp (6) placing the wafer (2) on the sheet placement table (12); a step in which a polishing head (41) of the polishing module (4) rotates above a sheet mounting table (12), the sheet mounting table (12) switches to a fine motion state in which the sheet mounting table (12) can float in the X-axis and Y-axis directions, and the polishing head (41) removes the wafer (2); and a step of docking the sheet placement table (12) and the fixed seat (11) by the docking mechanism (5) to realize a stopper function, and moving the sheet placement table (12) to different working positions in the X-axis direction. The above three steps are carried out in order, or any selected steps are combined, or one, two or more steps are repeated in combination, A method for using a wafer polishing system, comprising removing misalignment of a sheet placement table (12) in the X-axis direction and the Y-axis direction, and aligning the sheet placement table (12) with a clamp (6).

15. 15. A method of using a wafer polishing system as described in claim 14, characterized in that after both parts of the docking mechanism (5) complete docking, the docking mechanism (5) moves in a plane along which the X-axis and Y-axis lie, thereby positioning the sheet mounting table (12) in a position opposite the clamp (6), and the clamp (6) places the wafer (2) on the sheet mounting table (12).

16. a step of positioning the sheet placement table (12) in a position opposite the clamp (6) by docking the sheet placement table (12) and the fixed seat (11) with the docking mechanism (5) to realize a stopper function; a step in which the clamp (6) holds the wafer (2) and moves in the X-axis direction to above the sheet placement table (12), and then moves up and down in the Z-axis direction to place the wafer (2) on the sheet placement table (12); A step of rotating a polishing head (41) above a sheet placement table (12); a step in which the sheet placement table (12) moves up and down in the Z-axis direction to switch to a fine movement state in which it can float in the X-axis and Y-axis directions, and moves to a corresponding position of the polishing head (41) under the constraints of the structure of the stopper function; a step of lifting and lowering the sheet placement table (12) in the Z-axis direction and docking the sheet placement table (12) and the fixed seat (11) by the docking mechanism (5) to realize a stopper function; A polishing head (41) picks up and polishes a wafer (2); moving the sheet placement table (12) to another working position in the X-axis direction; A step of lifting and lowering the sheet placement table (12) in the Z-axis direction to switch to a fine movement state in which the sheet placement table (12) can float in the X-axis and Y-axis directions; a step of moving a part of the docking mechanism (5) to a target position within a plane on which the X-axis and the Y-axis are located by the action of an external force; A method of using the wafer polishing system described in claim 14, characterized in that it includes a step of eliminating misalignment in the X-axis direction and the Y-axis direction by raising and lowering the sheet mounting table (12) in the Z-axis direction and docking it with the fixed seat (11) by the docking mechanism (5) to realize a stopper function, thereby aligning the sheet mounting table (12) with the clamp (6).

17. a step of docking the sheet placement table (12) and the fixed seat (11) by the docking mechanism (5) to realize a stopper function and positioning the sheet placement table (12) at a position opposite to the target position of the clamp (6); a step of moving the clamp (6) holding the wafer (2) along the X-axis direction to above the sheet placement table (12), lifting and lowering the clamp (6) in the Z-axis direction to place the wafer (2) on the sheet placement table (12), and then moving the clamp (6); A step of rotating a polishing head (41) above a sheet placement table (12); a step in which the sheet placement table (12) rises in the Z-axis direction and floats in a plane in which the X-axis and Y-axis are located to align with the polishing head (41); A step in which a polishing head (41) acquires a wafer (2) on a sheet placement table (12); a step in which the sheet placement table (12) moves up and down in the Z-axis direction, the sheet placement table (12) and the fixed seat (11) are docked by the docking mechanism (5) to realize a stopper function, the sheet placement table (12) is set to a target position required for the next work position, and this target position is stored in the memory unit; a polishing head (41) transporting the wafer (2) to a polishing position in a polishing module (4); 15. The method of claim 14, further comprising the step of: moving the sheet placement table (12) to another working position in the X-axis direction.

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