Pressure sintering method and corresponding pressure sintering device

Abstract

A pressure sintering method and apparatus are provided for attaching a part to a substrate via a sintering material by pressure sintering at a sintering pressure and a sintering temperature during a pressure sintering time interval. The pressure sintering apparatus includes a first tool part and a second tool part configured to hold a substrate, the first tool part and the second tool part being movable relative to one another between an open configuration for receiving the part and the substrate between the first tool part and the second tool part and a closed configuration for applying a sintering pressure to the part, the sintering material and the substrate, holding the part and the substrate in contact with the first tool part and the second tool part between the first tool part and the second tool part with the sintering material in contact with the part and the substrate.

Description

[Technical field]

[0001]

[0001] The present invention relates to a pressure sintering method for attaching a component to a substrate via a sintering material by pressure sintering, and further to a pressure sintering apparatus for attaching a component to a substrate via a sintering material by pressure sintering. [Background technology]

[0002] Sintering processes are used to fabricate devices by creating a good bond between components, such as semiconductor devices like power ICs, and a substrate. In known sintering methods and apparatus, the device to be sintered is positioned on the substrate of the device, with sintering material between the components and the substrate. The substrate with the components may be preheated, for example at about 130-150°C, prior to the actual sintering process. Pressure is then applied on the associated components and sintering material, while the device, sintering material, and substrate are heated in a sintering tool to a sintering temperature, for example at about 230-300°C, to complete the sintering process.

[0003]

[0003] In conventional systems, the sintering material, for example having a paste-like form, is disposed on all devices on a substrate or carrier in one step during the process. If there are any defects, the process should be interrupted and the substrate or carrier needs to be thoroughly cleaned. Since the sintering material is interposed between the substrate and the components, drying times of the sintering material occur during preheating, which can waste time during the process. Moreover, heating the substrate with the components from the preheating temperature to the sintering temperature can result in a time-consuming process as well.

[0004]

[0004] In addition, the transfer of the substrate with the components to the sintering tool must be done slowly and carefully to prevent any displacement of the components. As mentioned above, in sintering processes and systems of sintering processes, the heating of the sintering material can lead to non-uniform effects of the sintering (paste) material and quality problems of the components themselves. The quality of the sintered bond between the substrate and the components depends very much on the actual temperature profile combined with the sintering time and pressure (profile) during the sintering process. This can be especially important for components where the sintered bond quality is very important. There are drawbacks and disadvantages in the known processes and systems. Summary of the Invention

[0005] An object of the present invention is to reduce the time cycle for processing parts.

[0006] Another or alternative object of the present invention is to provide a pressure sintering apparatus that can provide a rapid and uniform drying process for the sintered material on each part.

[0007] It is yet another or alternative object of the present invention to provide a pressure sintering apparatus which prevents any displacement of the parts on the substrate or carrier during delivery of the substrate or carrier with the parts to the sintering tool.

[0008] It is yet another or alternative object of the present invention to provide a pressure sintering apparatus capable of providing a well-defined pressure to each of the parts.

[0009]

[0009] In one aspect, the present invention provides a pressure sintering method for attaching a component to a substrate via a sintering material by pressure sintering, the pressure sintering being carried out at a sintering pressure and sintering temperature during a pressure sintering time interval of the sintering material to provide a sintered bond between the substrate and the component after pressure sintering, the method comprising: providing a pressure sintering apparatus comprising a first tool part and a second tool part configured to hold a substrate, the first tool part and the second tool part being constructed and arranged to be movable relative to one another between an open configuration for receiving a part and a substrate between the first tool part and the second tool part, and a closed configuration for holding the part and the substrate in contact with the first tool part and the second tool part between the first tool part and the second tool part with a sintering material in contact with the part and the substrate, applying a sintering pressure to the part, the sintering material, and the substrate, and heating the part, the sintering material, and the substrate at a sintering temperature during a pressure sintering time interval; heating the first tool part and the second tool part to a sintering temperature; providing a substrate on a second tool piece heated to a sintering temperature, the substrate having no sintering material applied thereto, and heating the substrate on the second tool piece to a sintering temperature with the first and second tool pieces in an open configuration; maintaining the first tool piece and a second tool piece having a substrate thereon at a sintering temperature; Applying a sintering material onto the part; preheating the part with the sintering material applied thereto to a part preheat temperature that is lower than the sintering temperature; subsequently, in an open configuration of the first and second tool parts, providing a part with sintering material applied thereon and preheated to a part preheat temperature between the first tool part and a substrate held on the second tool part, the sintering material applied on the part facing towards the substrate; subsequently, holding the part and the substrate between the first and second tool parts in contact with the first and second tool parts with the sintering material between the part and the substrate in a closed configuration to apply a sintering pressure to the part, the sintering material, and the substrate, and heating the part, the sintering material, and the substrate at a sintering temperature during a pressure sintering time interval; subsequently, placing the first and second tooling pieces in an open configuration and removing the substrate with the attached components from the second tooling piece; The present invention provides a pressure sintering method, comprising:

[0010]

[0010] According to one embodiment, the part with the sintering material applied thereto is provided and held in an open configuration of the first and second tool parts, between the first tool part and the substrate held on the second tool part, at a distance from and out of thermal contact with the first tool part and the substrate held on the second tool part.

[0011]

[0011] According to one embodiment, the first tool piece is disposed above the second tool piece, and the first tool piece and the second tool piece are vertically movable relative to each other.

[0012] According to one embodiment, the first tool piece is movable.

[0013]

[0013] According to one embodiment, the second tool part is not movable.

[0014]

[0014] According to one embodiment, a part having sintering material thereon is provided on a carrier that leaves the sintering material exposed, and the carrier holding the part with the sintering material applied thereto is provided between the first tool piece and the second tool piece by manipulating the carrier.

[0015] According to one embodiment, the carrier, in the closed configuration, leaves a component side of the component exposed for contact with the first tooling part.

[0016] According to one embodiment, the parts are held by gravity and / or friction on the carrier.

[0017] According to one embodiment, the carrier is moved out of contact with the part in the closed configuration of the first and second tool parts.

[0018] According to one embodiment, when placing the first tool piece and the second tool piece in the closed configuration, the carrier is moved further, optionally vertically downward, than the part held by the carrier.

[0019]

[0019] According to one embodiment, the part presents an upper surface and a lower surface when provided between the first tool piece and the second tool piece, the lower surface having a sintered material applied thereto, and the upper surface contacts the first tool piece in the closed configuration.

[0020] According to another embodiment, at least two components are attached to the substrate via a sintering material by pressure sintering.

[0021] In another aspect, the present invention is a pressure sintering apparatus for attaching a component to a substrate via a sintering material by pressure sintering, the pressure sintering being carried out at a sintering pressure and sintering temperature during a pressure sintering time interval of the sintering material to provide a sintered bond between the substrate and the component after pressure sintering; a pressure sintering apparatus comprising a first tool part and a second tool part configured to hold a substrate, the first tool part and the second tool part being constructed and arranged to be movable relative to one another between an open configuration for receiving a part and a substrate between the first tool part and the second tool part, and a closed configuration for holding the part and the substrate in contact with the first tool part and the second tool part between the first tool part and the second tool part with a sintering material in contact with the part and the substrate, applying a sintering pressure to the part, the sintering material, and the substrate, and heating the part, the sintering material, and the substrate at a sintering temperature during a pressure sintering time interval; in an open configuration, the apparatus is configured to hold the part, with the sintering material applied on the part and directed toward the substrate and preheated to a part preheat temperature, between the first tool part and the substrate held on the second tool part, at a distance from and out of thermal contact with the first tool part and the substrate held on the second tool part; an apparatus configured to perform at least a portion of the above-described method in relation to a first tooling piece, a second tooling piece, and to receive and hold a part between the first tooling piece and the second tooling piece; A pressure sintering device is provided.

[0022] According to one embodiment, the apparatus is configured to preheat the part with the sintering material applied thereon to a part preheat temperature.

[0023]

[0023] According to one embodiment, the pressure sintering apparatus comprises a preheating station and a sintering station comprising first and second tool parts, the preheating station configured to preheat a part having sintering material to a part preheat temperature, and the pressure sintering apparatus configured to receive the part having sintering material preheated to the part preheat temperature from the preheating station to the sintering station between the first tool part and the second tool part in an open configuration.

[0024] According to one embodiment, sintering is configured to hold the substrate on a second tool part and heat the substrate on the second tool part to a sintering temperature.

[0025] According to one embodiment, the parts are held on a carrier and the apparatus is configured to transport the carrier from the preheat station to the sintering station.

[0026] According to one embodiment, the first tool piece is configured to hold the carrier.

[0027]

[0027] According to another embodiment, the pressure sintering apparatus is configured to attach at least two components to a substrate via a sintering material by pressure sintering.

[0028] In another aspect, the present invention provides a carrier for holding at least one component for use in the above-described apparatus or device.

[0029]

[0029] According to one embodiment, the carrier comprises a thermal insulating material.

[0030] Further features and advantages of the present invention will become apparent from the description of the present invention by non-limiting and non-exclusive embodiments. These embodiments should not be interpreted as limiting the scope of protection. Those skilled in the art will understand that other alternatives and equivalent embodiments of the present invention can be conceived and put into practice without departing from the scope of the present invention. The embodiments of the present invention will be described with reference to the accompanying drawings, in which similar or identical reference symbols indicate similar, identical or corresponding parts. [Brief description of the drawings]

[0031] [Figure 1] FIG. 2 shows a schematic diagram of an apparatus for mounting sintered material on a part before a pressure sintering apparatus. [Figure 2A] 1 shows a schematic diagram of a pressure sintering apparatus with a part and a substrate provided in first and second tool parts, respectively, and their configuration relative to one another for attaching the part to the substrate via the sintering material by pressure sintering; [Figure 2B] 1 shows a schematic diagram of a pressure sintering apparatus with a part and a substrate provided in first and second tool parts, respectively, and their configuration relative to one another for attaching the part to the substrate via the sintering material by pressure sintering; [Figure 2C] 1 shows a schematic diagram of a pressure sintering apparatus with a part and a substrate provided in first and second tool parts, respectively, and their configuration relative to one another for attaching the part to the substrate via the sintering material by pressure sintering; [Figure 2D] 1 shows a schematic diagram of a pressure sintering apparatus with a part and a substrate provided in first and second tool parts, respectively, and their configuration relative to one another for attaching the part to the substrate via the sintering material by pressure sintering; [Figure 3A]FIG. 1 shows a schematic diagram of a pressure sintering apparatus having a part held by a carrier and provided in a first tool part and a substrate provided in a second tool part, as well as their configuration relative to one another for attaching the part to the substrate via a sintering material by pressure sintering. [Figure 3B] FIG. 1 shows a schematic diagram of a pressure sintering apparatus having a part held by a carrier and provided in a first tool part and a substrate provided in a second tool part, as well as their configuration relative to one another for attaching the part to the substrate via a sintering material by pressure sintering. [Figure 3C] FIG. 1 shows a schematic diagram of a pressure sintering apparatus having a part held by a carrier and provided in a first tool part and a substrate provided in a second tool part, as well as their configuration relative to one another for attaching the part to the substrate via a sintering material by pressure sintering. [Figure 3D] FIG. 1 shows a schematic diagram of a pressure sintering apparatus having a part held by a carrier and provided in a first tool part and a substrate provided in a second tool part, as well as their configuration relative to one another for attaching the part to the substrate via a sintering material by pressure sintering. [Figure 3E] FIG. 1 shows a schematic diagram of a pressure sintering apparatus having a part held by a carrier and provided in a first tool part and a substrate provided in a second tool part, as well as their configuration relative to one another for attaching the part to the substrate via a sintering material by pressure sintering. [Figure 4] 1 shows a schematic cross-section of a pressure sintering processing apparatus having a first tool part and a second tool part having a heating mechanism. [Figure 5A] 1 shows a schematic cross-section of a pressure sintering processing apparatus having a first tool part having multiple insert members and a second tool part before a part in the first tool part and a substrate in the second tool part are brought together. [Figure 5B] Schematic showing a cross section of a pressure sintering processing apparatus having a first tool part having multiple insert members and a second tool part when a part in the first tool part and a substrate in the second tool part are brought together. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] 2A, 2B, 2C, and 2D show a schematic diagram of the preheating station 101 and the sintering station 102 of the pressure sintering apparatus 100 and various process steps according to an embodiment of the present invention. FIG. 1 shows an additional step performed in an additional apparatus before the sintering apparatus and a process step performed therein to mount sintering material on the part. The sintering station 102 of the sintering apparatus 100 comprises a first tool part 110 for holding the part 130 and a second tool part 120 for holding the substrate 140. The first tool part 110 and the second tool part 120 are constructed and arranged to be movable relative to each other to apply pressure to the part 130 and the substrate 140 held between the first tool part 110 and the second tool part 120 with sintering material 150 between the part and the substrate, and to allow the part and the substrate to be heated at a sintering temperature in a pressure sintering step.

[0033]

[0032] Prior to being placed in the sintering apparatus 100, a sintering material 150 is applied to the mounting surface 130a of the part 130, as shown diagrammatically in FIG. 1. The part 130 is to be attached to the substrate 140 at the mounting surface of the part 130 by pressure sintering. Typically, the sintering material 150, such as a sintering paste, is applied to the part 130 in a machine specifically designed for that purpose. The part 130 with the sintering material 150 applied thereon is then fed to the preheating station 101 of the sintering apparatus 100. A number of parts 130 may be placed on carriers in a section of the preheating station 101 for preheating to a part preheating temperature, which may be in the range of 130-150°C. The part 130 is held on the first tooling 110 and is handled and preheated in the preheating station 101 with the sintering material 150 applied to the part 130 facing downwards, so that the part 130 will be processed in the sintering station 102 with the mounting surface 130a of the part 130 and the sintering material 150 applied to the mounting surface 130a facing downwards towards the substrate 140 held on the second tooling 120. Meanwhile, the substrate 140 is preheated in the sintering station 102 to a sintering temperature that will be the temperature required for the pressure sintering step. The temperature required for the pressure sintering step may be in the range of 200-300° C., depending on the particular application and sintering material 150 employed. Only one substrate 140 and one part 130 are shown in FIGS. 1 and 2A-2D for illustrative purposes. Briefly, multiple parts 140 held in one or more carriers and with sintering material applied to the parts can be processed together in a pressure sintering process in a pressure sintering station and attached to one or more substrates.

[0034]

[0033] Figure 2B shows a schematic of the first tool part 110 and the second tool part in an open configuration relative to each other before the part 130 and the substrate 140 are brought together. The first tool part 110 is configured to hold the part 130 with the sintering material 150 preheated to the part preheat temperature. As shown in Figure 2B, the part 130 with the sintering material 150 is positioned facing the substrate 140 held on the second tool part 120 in the open configuration of the sintering station 102. In one embodiment, as shown in Figure 2B, in the open configuration, the apparatus 100 is configured to hold the part 130 between the first tool part 110 and the substrate 140 held on the second tool part 120 with the sintering material applied 150 on the part 130 and facing the substrate 140. A part 130 having sintered material 150 preheated to a part preheat temperature is positioned in an open configuration, away from and out of thermal contact with the first tool part 110 and the substrate 140 held on the second tool part 120.

[0035]

[0034] Preheating the part(s) with the sintering material applied on the respective mounting surface(s) 130a(s) of the underside of the part serves two different purposes: pre-drying the sintering material and pre-heating the part before the actual press sintering process. In this way, the sintering material is pre-dried before the actual press sintering process to evaporate the organic capping agent in the sintering material and to allow the nanoparticles in the sintering material to fuse together better during the later press sintering process. Pre-heating the part(s) 130 with the sintering material 150 in the pre-heating station 101 of the sintering apparatus 100 shortens the time cycle of the sintering process, especially in the sintering station 102.

[0036] In the exemplary embodiment shown in Fig. 2B, the substrate 140 is heated to a sintering temperature on the second tool part 120, in particular to a temperature of, for example, 300°C. The first and second tool parts 110, 120 of the pressure sintering apparatus 100 have previously been heated to the sintering temperature and are maintained at the sintering temperature. Thus, the substrate 140 is likewise maintained at the sintering temperature on the second tool part.

[0037]

[0036] Figure 2C shows a schematic of the first tool part 110 and the second tool part 120 in a closed configuration relative to each other when the part 130 and the substrate 140 are brought together. In the embodiment shown in Figure 2C, the first tool part 110 is configured to be lowered onto the upper side of the part 130 with the sintering material 150 so as to attach the part to the substrate via the sintering material. Initially, the part 130 with the sintering material is held at a distance from the substrate and the first tool part. When lowering the part and the first tool part, the part may first contact the substrate and then the first tool part may contact the part, or the first tool part may first contact the part and then both the part and the first tool part may be further lowered so that the part contacts the substrate, or both the part and the first tool part may be lowered so that the part contacts the substrate and the first tool part simultaneously. In FIG. 2C, in a closed configuration, the first tool part 110 and the second tool part 120 are positioned to hold the part 130 and the substrate 140 along with the sintering material 150 between the first tool part 110 and the second tool part 120.

[0038] In the process steps of the embodiment shown in Fig. 2C, after the part(s) 130 with the sintering material 150 are held at the preheat temperature (e.g., 140°C) for a selected time to achieve a desired drying of the sintering material and the part(s) are provided between the first and second tooling parts, the first and second tooling parts 110, 120 are moved to bring together the substrate 140 and the part 130 with the sintering material to start the pressure sintering process at a selected sintering pressure applied by the first and second tooling parts. The first tooling part 110 is configured to attach the part 130 to the substrate 140 by lowering the part 130 relative to the second tooling part 120 to bring the heated substrate 140 and the part 130 together and pressure sintering the sintering material between the part 130 and the substrate 140.

[0039] During the pressure sintering process, the heated substrate 140 and the first tool part are in thermal contact with the heated part 130, which now rapidly transfer heat to the part 130. The sintering pressure applied to the part 130 together with the substrate 140 can be, for example, about 10-15 MPa, with a sintering temperature of, for example, 300°C. When the part 130 is brought into contact with the substrate 140 and the first tool part in the pressure sintering process step of FIG. 2C, the temperature of the part 130 with the sintering material 150 rises very quickly from a preheat (first predetermined) temperature of, for example, 140°C to a sintering temperature of, for example, 300°C. The temperature rise of the part and the sintering material from the preheat temperature to the sintering temperature is substantially instantaneous, taking into account the thermal mass of the part, as well as the thermal mass of the substrate and the first and second tool parts. To achieve a uniform process and resulting sintered bond, the aforementioned sintering pressure and temperature should be maintained for a predetermined time interval, for example, 180 seconds to 250 seconds. Thus, after bringing together the heated substrate 140 and the component 130, the substrate 140 is held at a sintering temperature, for example, 300° C.

[0040]

[0039] Figure 2D shows a schematic configuration of the first tool part 110 and the second tool part 120 moved away from each other after the pressure sintering process step of Figure 2C, thus completing the attachment of the part 130 to the substrate 140 by pressure sintering the sintering material 150 between the part 130 and the substrate 140. As shown, after the pressure sintering process, the first tool part moves vertically away from the part 130 now attached to the substrate 140 and rises relative to the second tool part 120, placing the first and second tool parts in an open configuration. The second tool part is stationary and not movable.

[0041] 3A, 3B, 3C, 3D and 3E show a schematic sequence of handling the part in a sintering tool using a carrier 160 for the part(s) 130. FIG. 3A shows a schematic application of sintering material 150 to the mounting surface 130a of the part, which can be done with a tool dedicated for that purpose. The part 130 with the sintering material is then provided on a carrier 160, which can be a plastic frame, as shown in FIG. 3B. The carrier leaves exposed the side of the part with the sintering material thereon, thus leaving the sintering material uncovered and exposed, and leaves the upper side of the part exposed for contact with the first tool part. The part(s) can be held by gravity and / or friction on the carrier. For example, the part can be held in the opening by friction by a protrusion from the side or sides of the opening of the carrier. Tabs can be provided on which the part is supported, or any combination of means for holding by gravity and friction can be provided as well.

[0042]

[0041] The steps of Figures 3A and 3B are generally performed outside the sintering apparatus 100. Multiple parts 100 can be placed in a single carrier 160 for simultaneous processing in the sintering apparatus 100. Figure 3C shows that the carrier 160 with the part(s) 130 is provided in the preheat station 101 of the sintering apparatus, as discussed with reference to Figure 2A above. The part(s) are preheated to the respective preheat temperature of the part(s) as previously described. The substrate 140 is provided on the second tool part 120, which is heated to and maintained at the sintering temperature. After preheating, the carrier 160 with the part(s) 130 with the sintering material 150 applied on the part(s) 130 is provided in a position intermediate the first tool part 101 and the substrate 140 on the second tool part 102, as shown in Figure 3D. The second tool part 120 with the substrate 140 thereon is kept at the sintering temperature, while the carrier 160 with the part 130 is at a lower temperature corresponding to the part preheat temperature. The first and second tool parts 110, 120 are then closed by moving the first tool part 110 vertically downwards towards the second tool part 120, as shown diagrammatically in FIG. 3E, and at the same time, the carrier 160 with the part(s) is moved downwards as well. Multiple parts 130 can be provided from a single carrier 160 onto a single substrate 140 and / or onto multiple substrates. Since the thermal mass of the part(s) with the sintering material 150 will be much smaller than the thermal mass of the first and second tool parts and the substrate, the part(s) will be heated up to the sintering temperature of the first and second tool parts and the substrate substantially instantly. Thus, pressure sintering of the sintering material 150 will proceed immediately when the first and second tooling parts are closed. After a predetermined sintering time, the first and second tooling parts are opened as discussed with reference to Figure 2D. Figure 3E shows that as soon as the part 130 is supported by the substrate 140, the carrier 160 moves further down than the part 130, so that the part is released from the carrier.

[0043]

[0042] Figure 4 shows a schematic cross-section of a pressure sintering apparatus 100. The pressure sintering apparatus 100 comprises a first tool part 110 for contacting the part 130 and a second tool part 120 for holding a substrate 140. The second tool part 120 comprises a heating mechanism 122 for heating the second tool part and the substrate 140 to a sintering temperature. The first tool part is likewise heated in the sintering apparatus, the heating means being not shown but known as such.

[0044] 5A and 5B show a schematic cross-section of an embodiment of a pressure sintering apparatus 100, in particular a sintering station 102. The apparatus 100 comprises a first tool part 110 having at least one dynamic insert member 111 coupled to a pressure chamber 113 of the first tool part 110. When the pressure chamber 113 is pressurized by gas under pressure, a force is exerted on the dynamic insert member 111 of the first tool part, exerting a force on the associated part 130 along a direction A. Each insert member 111 is associated with a part 130 having a sintering material 150 on a mounting surface 130a of the part 130. A heating block may be provided around the insert member for heating it to a sintering temperature of the insert member. The apparatus 100 of FIGS. 5A and 5B further comprises a second tool part 120 configured to hold a substrate 140, which in the illustrated embodiment has a number of cooling fins 141. 5A shows the configuration of the first tool part 110 and the second tool part relative to each other, before the parts 130 and the substrate 140 are brought together, with the carrier 160 holding the parts 130 thereon. In this configuration of the apparatus 100, the insert member 111 is in a retracted position relative to the first tool part 110. The substrates, in the illustrated embodiment, each have at least one pedestal 142 that receives a respective part 130 and lifts the respective part from the carrier 160. The pedestal(s) allow the carrier to move downward some further, thereby freeing the parts from the carrier and allowing an appropriate force to be applied to the parts 130(s) and the substrate 140 for pressure sintering of the sintering material 150.

[0045]

[0044] The insert member 111 is displaceable in a direction substantially perpendicular to a surface 130a of the associated part 130 in contact with the insert member 111, which is direction A in Fig. 5A. The configuration of Fig. 5A corresponds to the configuration shown in Fig. 3D.

[0046] FIG. 5B illustrates the configuration of the first tool part 110 and the second tool part 120 relative to each other when the component 130 and the substrate 140 are brought together, which corresponds to the configuration illustrated in FIG. 3E.

[0047]

[0046] The configuration of Figure 5A can be reached from that of Figure 5B by bringing the first and second tool parts together and pressurizing the pressure chamber 113. When the first tool part 110 and the second tool part 120 are brought together, a force is exerted on each part 130 carrying the sintered material 150 along a pressure direction A via the respective inserts 111 by pressurizing the pressure chamber 313.

[0048]

[0047] The above-mentioned components 130 can be various kinds of semiconductor products that are generally manufactured using semiconductor manufacturing techniques. The above-mentioned components 130 can include chips, power ICs, sensors, MEMs, LEDs, etc., and combinations thereof.

Claims

1. 1. A pressure sintering method for attaching a component (130) to a substrate (140) via a sintering material (150) by pressure sintering, the pressure sintering being carried out at a sintering pressure and sintering temperature during a pressure sintering time interval of the sintering material to provide a sintered bond between the substrate and the component after pressure sintering, the method comprising: providing a pressure sintering apparatus comprising a first tool part (110) and a second tool part (120) configured to hold the substrate (140), the first tool part (110) and the second tool part (120) being configured and arranged to be movable relative to one another between an open configuration for receiving the part (130) and the substrate (140) between the first tool part and the second tool part, and a closed configuration for holding the part and the substrate in contact with the first tool part and the second tool part between the first tool part and the second tool part with the sintering material (150) contacting the part and the substrate, applying the sintering pressure to the part, the sintering material, and the substrate, and heating the part, the sintering material, and the substrate at the sintering temperature during the pressure sintering time interval; heating the first tool part (110) and the second tool part (120) to the sintering temperature; providing the substrate on the second tool part heated to the sintering temperature, the substrate having no sintering material applied thereto; and heating the substrate (140) on the second tool part to the sintering temperature in the open configuration of the first and second tool parts; maintaining the first tool piece and the second tool piece with the substrate thereon at the sintering temperature; applying the sintering material onto the component; preheating the part with the sintering material applied thereto to a part preheat temperature which is lower than the sintering temperature; subsequently, providing the part, with the sintering material applied thereon, and preheated to the part preheat temperature, between the first tool part and the substrate held on the second tool part in the open configuration of the first and second tool parts, the sintering material applied on the part facing towards the substrate; subsequently, holding the part and the substrate in contact with the first and second tool parts between the first and second tool parts with the sintering material (150) in contact with the part and the substrate between the first and second tool parts in the closed configuration, applying the sintering pressure to the part, the sintering material, and the substrate, and heating the part, the sintering material, and the substrate at the sintering temperature during the pressure sintering time interval; followed by placing the first and second tool pieces in the open configuration and removing the substrate with the attached component from the second tool piece; The pressure sintering method includes the steps of:

2. 2. The method of claim 1, wherein the part (130) with the sintering material (150) applied thereon is provided and held in the open configuration of the first and second tool parts between the substrate (140) held on the first and second tool parts (110) and at a distance from and out of thermal contact with the substrate (140) held on the first and second tool parts (110) and (120).

3. 3. The method of claim 1, wherein the first tool part (110) is disposed above the second tool part (120), and the first tool part and the second tool part are vertically movable relative to each other.

4. The method of any one of claims 1 to 3, wherein the first tool part (110) is movable.

5. The method of claim 4, wherein the second tool part (120) is not movable.

6. The method for pressure sintering according to any one of claims 1 to 5, wherein the part (130) having the sintering material thereon is provided on a carrier (160) that leaves the sintering material exposed, and the carrier that holds the part with the sintering material applied thereon is provided between the first tool part (110) and the second tool part (120) by manipulating the carrier.

7. The method of claim 6, wherein the carrier (160) leaves a part side of the part exposed for contact with the first tool part (110) in the closed configuration.

8. A pressure sintering process according to claims 1 to 7, wherein the part is held by gravity and / or friction on the carrier.

9. The method of any one of claims 6 to 8, wherein the carrier is moved out of contact with the part in the closed configuration of the first and second tool parts.

10. 10. The method of claim 9, wherein when the first tool part and the second tool part are placed in the closed configuration, the carrier is optionally moved further vertically downward than the part held by the carrier.

11. 11. The method of claim 1, wherein the part presents an upper side and a lower side when provided between the first tool part and the second tool part, the lower side having the sintering material applied thereto, and the upper side is in contact with the first tool part in the closed configuration.

12. The method of any one of claims 1 to 11, wherein at least two components (130) are attached to a substrate (140) via a sintering material (150) by pressure sintering.

13. A pressure sintering apparatus (100) for attaching a part (130) to a substrate (140) via a sintering material (150) by pressure sintering, said pressure sintering being carried out at a sintering pressure and a sintering temperature during a pressure sintering time interval of said sintering material to provide a sintered bond between said substrate and said part after said pressure sintering; the pressure sintering apparatus comprises a first tool part (110) and a second tool part (120) configured to hold the substrate (140), the first tool part (110) and the second tool part (120) being constructed and arranged to be movable relative to one another between an open configuration for receiving the part (130) and the substrate (140) between the first tool part and the second tool part, and a closed configuration for holding the part and the substrate in contact with the first tool part and the second tool part between the first tool part and the second tool part with the sintering material (150) in contact with the part (130) and the substrate (140), applying the sintering pressure to the part (130), the sintering material (150), and the substrate (140), and heating the part, the sintering material, and the substrate at the sintering temperature during the pressure sintering time interval; in the open configuration, the apparatus is configured to hold the part, with the sintering material applied on the part and directed toward the substrate and preheated to a part preheat temperature, between the first tool part and the substrate held on the second tool part, at a distance from and out of thermal contact with the first tool part and the substrate held on the second tool part; The apparatus is configured to carry out at least a part of the method according to any one of claims 1 to 12 in relation to the first tool part, the second tool part, and to receive and hold the part between the first tool part and the second tool part. Pressure sintering apparatus (100).

14. The pressure sintering apparatus (100) of claim 13, wherein the apparatus is configured to preheat the part with the sintering material applied thereon to the part preheat temperature.

15. 15. The pressure sintering apparatus (100) according to claim 14, comprising a preheating station (101) and a sintering station (102) comprising the first and second tool parts (110, 120), the preheating station (101) being configured to preheat the part (130) having the sintering material (150) to the part preheat temperature, and the pressure sintering apparatus being configured to receive the part (130) having the sintering material (150) preheated to the part preheat temperature from the preheating station (101) to the sintering station (102) between the first tool part (110) and the second tool part (120) in the open configuration.

16. 16. The pressure sintering apparatus (100) of claim 15, wherein the sintering station (102) is configured to hold the substrate on the second tool part (120) and heat the substrate (140) on the second tool part (120) to the sintering temperature.

17. 17. The pressure sintering apparatus (100) according to claim 15 or 16, wherein the parts are held on a carrier (160) and the apparatus (100) is configured to transport the carrier (160) from the preheating station (101) to the sintering station (102).

18. The pressure sintering apparatus (100) of claim 17, wherein the first tool piece (110) is configured to hold the carrier (160).

19. The pressure sintering apparatus (100) according to any one of claims 13 to 18, wherein the pressure sintering apparatus is configured to attach at least two components (130) to a substrate (140) via a sintering material (150) by pressure sintering.

20. A carrier (160) for holding at least one component for use in the apparatus (100) according to any one of claims 13 to 19 or the method according to any one of claims 1 to 12.

21. The carrier of claim 20 , wherein the carrier comprises a thermal insulator.

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