Power electronics assembly

Abstract

A power electronics assembly in a small package size.SOLUTION: The power electronics assembly includes a printed circuit board including a plurality of substrate layers. The plurality of substrate layers includes a first core layer and a second core layer stacked vertically below the first core layer, the first core layer having a first electrical component embedded in the first core layer and the second core layer having a second electrical component embedded in the second core layer. The first electrical component and the second electrical component are arranged in a vertical column.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION The present disclosure relates generally to power electronic assemblies, and more particularly to apparatus and methods for power electronic assemblies with small package sizes. [Background technology]

[0002] The increasing use of electronics in vehicles has led to a need for smaller electronic systems. One component of these electronic systems is the power electrical components used as switches in inverters or converters. Power electrical components have large cooling requirements due to the heat they generate.

[0003] Additionally, power electrical components traditionally constructed from silicon have recently been trending toward silicon carbide, gallium nitride, or gallium oxide. The use of silicon carbide, gallium nitride, or gallium oxide defines smaller device footprints, resulting in greater heat flux. For these and other reasons, there is a need to improve the cooling of power electrical components while maintaining small package sizes. [Brief explanation of the drawings]

[0004] The embodiments set forth in the drawings are illustrative and exemplary in nature and are not intended to limit the subject matter defined by the claims. The following detailed description of exemplary embodiments can be understood when read in conjunction with the following drawings, in which like structure is designated with like reference numerals and in which: [Figure 1] FIG. 1 illustrates a schematic diagram of a power electronics assembly according to one or more embodiments shown and described herein. [Figure 2A] FIG. 2A schematically illustrates a subassembly of electrical components and mounting substrates in the power electronics assembly of FIG. 1 according to one or more embodiments shown and described herein. [Figure 2B]FIG. 2B schematically illustrates a mounting substrate of the subassembly of FIG. 2A according to one or more embodiments shown and described herein. [Figure 3] FIG. 3 schematically illustrates another power electronics assembly according to one or more embodiments shown and described herein. [Figure 4] FIG. 4 schematically illustrates yet another power electronics assembly according to one or more embodiments shown and described herein. [Figure 5] FIG. 5 schematically illustrates yet another power electronics assembly according to one or more embodiments shown and described herein. [Figure 6] FIG. 6 schematically illustrates yet another power electronics assembly according to one or more embodiments shown and described herein. [Figure 7] FIG. 7 schematically illustrates yet another power electronics assembly according to one or more embodiments shown and described herein. Summary of the Invention

[0005] In one embodiment, a power electronics assembly includes a printed circuit board including a plurality of substrate layers, the plurality of substrate layers including a first core layer and a second core layer stacked vertically below the first core layer, the first core layer including a first electrical component embedded therein, and the second core layer including a second electrical component embedded therein, the first electrical component and the second electrical component being arranged in a vertical column.

[0006] In another embodiment, a power electronics assembly includes a printed circuit board including multiple substrate layers and at least one mounted electronic device. The multiple substrate layers include a first core layer, a second core layer, and a first signal layer. The first core layer includes a first electrical component embedded therein. The second core layer is stacked vertically below the first core layer and includes a second electrical component embedded therein. The first electrical component and the second electrical component are arranged in a vertical column. The first signal layer is stacked vertically above the first core layer. The at least one mounted electronic device is mounted on the top surface of the printed circuit board and electrically coupled to the first signal layer.

[0007] In another embodiment, a power electronics assembly includes a printed circuit board including a plurality of substrate layers. The plurality of substrate layers includes a first core layer, a second core layer, a first signal layer, and a second signal layer. The first core layer includes a first electrical component embedded therein. The second core layer includes a second electrical component stacked vertically below the first core layer and embedded in the second core layer. The first electrical component and the second electrical component are arranged in a vertical column. The first signal layer is stacked vertically above the first core layer. The second signal layer is disposed between the first and second core layers.

[0008] These and additional features provided by the embodiments described herein will be more fully understood by reference to the following detailed description taken in conjunction with the drawings. DETAILED DESCRIPTION OF THE INVENTION

[0009] The embodiments described herein are generally directed to power electronic assemblies having one or more vertical rows of electrical components embedded directly into a circuit board, such as a printed circuit board. Arranging the electrical components in stacked rows with the electrical components fully embedded may increase the power density of the assembly while allowing sufficient heat dissipation from the electrical components.

[0010] The electrical components, circuit board assemblies, and power electronics assembly configurations described herein may be used in electrified vehicles, including but not limited to electric vehicles, hybrid electric vehicles, any electric motor, generator, industrial tool, household appliance, etc. The power electronics assemblies described herein may be electrically coupled to an electric motor and / or battery and may be configured as converter or inverter circuits.

[0011] As used herein, "electrical component" means any electrical component that generates waste heat, such as electrical components used to convert direct current (DC) power to alternating current (AC) power and vice versa. Non-limiting examples of electrical components include power metal oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), thyristors, and power transistors.

[0012] As used herein, "fully embedded" means that each surface of a component is surrounded by the substrate. For example, when a power electronic device assembly is fully embedded in a circuit board substrate, it means that the circuit board substrate material covers each surface of the circuit board substrate. A component is said to be "partially embedded" when one or more surfaces of the component are exposed.

[0013] As used herein, the terms "first," "second," and "third" may be used interchangeably to distinguish one component from another and are not intended to denote the location or importance of the individual components.

[0014] As used herein, the term "vertically" is used directional to refer to the direction in which substrate layers of a power electronics assembly are stacked, and is generally represented by the Z direction of the illustrated coordinate system. The term "vertically" is not intended to refer to an absolute vertical direction or a direction perpendicular to a larger assembly that may include the power electronics assembly.

[0015] As used herein, the singular forms "a," "an," and "the" include plural referents unless the context dictates otherwise. Thus, for example, reference to "a component" includes aspects having two or more, such as "components," unless the context dictates otherwise.

[0016] As used throughout this specification and claims, the term "approximate" is intended to modify any quantitative expression that can vary permissibly without resulting in a change in the basic function to which it pertains. Thus, a value modified by one or more terms such as "about," "approximately," and "substantially" is not limited to a specific exact value. In at least some instances, the term "approximate" may correspond to the precision of an instrument for measuring the value, or the precision of a method or machine for assembling or producing a component and / or system. In at least some instances, the term "approximate" may correspond to the precision of an instrument for measuring the value, or the precision of a method or machine for assembling or producing a component and / or system. For example, the term "approximate" may refer to a value within 1, 2, 4, 5, 10, 15, or 20 percent of a particular value, a range of values, and / or any of the endpoints defining the range of values.

[0017] Various embodiments of the power electronic device assembly, the circuit board assembly, and the power electronics assembly are described in detail below. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like parts.

[0018] Referring to FIG. 1 , an example power electronics assembly is illustrated schematically. The power electronics assembly 100 may include a printed circuit board 102 with multiple substrate layers 120 stacked vertically (e.g., along the Z-axis of the illustrated coordinate system). The multiple substrate layers 120 may be made of a conductive material such as FR-4. As illustrated, the power electronics assembly 100 may include eight individual substrate layers 120. However, a greater or lesser number of substrate layers 120 is also contemplated and possible.

[0019] Embedded within the plurality of substrate layers 120 are a plurality of electrical components 110 that generate excess heat during operation that must be removed. The electrical components 110 may be power chips, such as insulated gate bipolar transistors (IGBTs), power diodes, IGBT / diode combinations, metal oxide semiconductor field effect transistors (MOSFETs), or other power semiconductor devices. The electrical components 110 may be completely embedded within the substrate layers 120 such that the electrical components 110 are surrounded on all sides by the substrate layers 120. As shown, each electrical component 110 may be mounted to a conductive mounting substrate 136 within the substrate layers 120. In some embodiments, the electrical components 110 may be mounted generally on top of and within recesses in the mounting substrate 136. As shown, in some embodiments, the power electronics assembly 100 may have six electrical components 110 that define a converter or inverter circuit, such as an inverter circuit for an electrified vehicle, although other quantities of electrical components 110 are contemplated and possible.

[0020] 2A and 2B illustrate an example subassembly 104 of an electrical component 110 and a mounting substrate 136 in a top perspective view and a cross-sectional view, respectively. The subassembly 104 illustrated by FIGS. 2A and 2B includes an inner graphite layer 175 surrounded by a metal layer 172. The inner graphite layer 175 and the metal layer 172 may together comprise the mounting substrate 136. The metal layer 172 includes a surface 178 having a recess 177 dimensioned to receive the electrical component 110. As described in more detail below, the metal layer 172 provides the electrically conductive surface 178 that may contact conductive vias for electrically connecting to electrodes on the underside of the electrical component 110. The example electrical component 110 is shown having an upper electrode 141 through which a switch current flows and a plurality of signal electrodes 142 for controlling the electrical component. The recess 177 is formed, for example, by chemical etching. The metal layer 172 may be made of any suitable metal or alloy. By way of non-limiting example, copper and aluminum may be used for metal layer 172. Additional features of subassembly 104 are described in U.S. patent application Ser. No. 17 / 874,462, filed July 27, 2022, entitled "Power Electronics Assemblies Having Embedded Power Electronics Devices," which is incorporated herein by reference. It should be understood that mounting substrate 136 may have other configurations.

[0021] Referring again to FIG. 1 , in some embodiments, the substrate layer 120 may include a first core layer 122 having a first electrical component 112 embedded therein and a second core layer 124 having a second electrical component 114 embedded therein. The first core layer 122 may be stacked vertically above the second core layer 124, and the first electrical component 112 and the second electrical component 114 may be aligned along the Z-axis to form a first vertical column 150. In some embodiments, multiple electrical components 110 may be arranged to form multiple vertical columns. For example, as shown, the power electronics assembly 100 may include six electrical components 110 arranged in a first vertical column 150, a second vertical column 152, and a third vertical column 154. In other embodiments, the power electronics assembly 100 may include more or fewer electrical components 110, which may be arranged in a greater or lesser number of vertical columns.

[0022] 1, a first power supply layer 130 may be disposed between the first core layer 122 and the second core layer 124. The first power supply layer 130 is an output layer comprising a conductive material, such as copper, that is further electrically coupled to output terminals that are electrically coupled to a load, such as an electric motor or a battery. Thus, the first electrical component 112 and the second electrical component 114 may be in electrical communication with the first power supply layer 130 such that the first electrical component 112 and the second electrical component 114 can provide power to the output terminals.

[0023] The power electronics assembly 100 includes a second power layer 132, which may be a positive layer comprising a conductive material such as copper, and may electrically couple the second power layer 132 to a positive terminal of a power source such as a battery. As shown, in some embodiments, the second power layer 132 may be disposed vertically above the first core layer 122 and the second core layer 124. The power electronics assembly 100 includes a third power layer 134, which may be a negative layer comprising a conductive material such as copper, and may electrically couple the third power layer 134 to a negative terminal of a power source such as a battery. As shown, in some embodiments, the third power layer 134 may be disposed vertically below the first core layer 122 and the second core layer 124. A plurality of conductive vias 138 extending in a vertical direction (e.g., the Z-axis direction of the illustrated coordinate system) may be disposed between the core layers 122, 124 and the power layers 130, 132, 134, and the conductive vias 138 may electrically couple each of the core layers 122, 124 to each of the power layers 130, 132, 134. In this manner, current may flow through the core layers to the electrical component 110. In particular, as indicated by the illustrated arrows A and B, current originates at the positive terminal and flows through the second power layer 132, the first electrical component 112, the second electrical component 114, and the third power layer 134 to the negative terminal, where arrow A indicates the flow of input current and arrow B indicates the output generated by the electrical component 110.

[0024] The power electronics assembly 100 may include multiple signal layers configured to transmit electrical signals, such as a first signal layer 116 and a second signal layer 118, to control (i.e., switch on and off) the electrical components 110. The first signal layer 116 and the second signal layer 118 may be separated by one or more core layers and / or power layers, which may prevent crosstalk between the first signal layer 116 and the second signal layer 118. As shown, in some embodiments, the first signal layer 116 may be disposed vertically above the first core layer 122. The second signal layer 118 may be disposed between the first core layer 122 and the second core layer 124.

[0025] The second signal layer 118 may be electrically coupled to the first signal layer 116 through the conductive vias 138. In this manner, the second signal layer 118 may receive signals from one or more mounted electronics 160 mounted on the first signal layer 116, as described in detail herein. The first signal layer 116 may be electrically coupled to the first core layer 122, and the second signal layer 118 may be electrically coupled to the second core layer 124 through the conductive vias 138. In this manner, the first electrical component 112 and the second electrical component 114 may communicate with one or more mounted electronics 140 through the first signal layer 116 and the second signal layer 118, respectively.

[0026] The power electronics assembly 100 may include one or more mounted electronics 160. The one or more mounted electronics 160 may include resistors, capacitors, inductors, gate drive components, or other components. In some embodiments, the one or more mounted electronics 160 may be mounted on a top surface of the printed circuit board 102. The one or more mounted electronics 160 may be electrically coupled to the first signal layer 116. In this manner, the one or more mounted electronics 160 may communicate with an electrical component (e.g., a pair of electrical components in the vertical column 150, such as the first electrical component 112 and the second electrical component 114) through the first signal layer 116, the second signal layer 118, and the conductive vias.

[0027] While the power supply layers 130, 132, 134 and signal layers 116, 118 are described primarily with reference to the first and second electrical components 112, 114 in the first vertical column 150, it will be understood that this description applies equally to the electrical components in the second and third vertical columns 152, 154. In other words, the first and second electrical components 112, 114 in each vertical column 150, 152, 154 may receive input through the second power supply layer 132 and provide output through the first power supply layer 130. Similarly, the first electrical components in each vertical column 150, 152, 154 may communicate with one or more on-board electronics 160 through the first signal layer 116. As illustrated, the first, second, and third vertical columns 150, 152, and 154 may be similar. However, the first, second, and third vertical columns 150, 152, and 154 need not be identical. In some embodiments, there may be a difference between the first vertical column 150, the second vertical column 152, and the third vertical column 154.

[0028] 1 , the power electronics assembly 100 may include a first cooling plate 126 and a second cooling plate 128. Each of the first cooling plate 126 and the second cooling plate 128 may be formed from a thermally conductive material such that the first cooling plate 126 and the second cooling plate 128 are configured to conduct heat away from the printed circuit board 102. In this manner, the first cooling plate 126 and the second cooling plate 128 may reduce the temperature of the printed circuit board 102 through conduction and convection. In some embodiments, the first cooling plate 126 and the second cooling plate 128 may be made from copper, aluminum, graphite, a composite material, or a thermally conductive material.

[0029] As shown, in some embodiments, a first cooling plate 126 may be disposed on a first side of the printed circuit board 102. A second cooling plate 128 may be disposed on a second side of the printed circuit board 102 opposite the first side. In this manner, heat generated by the electrical component 110 may be removed from the printed circuit board 102 in two directions (i.e., the +Z and −Z axes of the illustrated coordinate system). In some embodiments, as shown, the first cooling plate 126 directly abuts the first signal layer 116, and the second cooling plate 128 directly abuts the third power layer 134.

[0030] In some embodiments, in addition to or in place of the first and second cooling plates 126, 128, the power electronics assembly 100 may include one or more convection cooling elements, such as a fan or liquid impingement cooling. In some embodiments, the printed circuit board 102 may be immersed in a cooler or submerged in a cooling fluid.

[0031] 1 , it will be appreciated that the configuration of electrical components 110 within printed circuit board 102 may increase the power density of power electronics assembly 100. Specifically, power density may be increased by embedding electrical components 110 within substrate layers 120 and by stacking electrical components 110 so that electrical components 110 are positioned in vertical rows. In particular, the configuration of power electronics assembly 100 may enable the size and inductance of printed circuit board 102 to be reduced. First and second cooling plates 128 may be disposed on first and second sides of printed circuit board 102, respectively, and may draw heat away from printed circuit board 102 to prevent overheating of printed circuit board 102 due to increased power density.

[0032] 3, an embodiment of a power electronics assembly 200 is illustrated schematically. Power electronics assembly 200 is similar to power electronics assembly 100. Accordingly, like numbers are used for like features. For example, power electronics assembly 200 may include first electrical component 112 and second electrical component 114 arranged in a first vertical column 150.

[0033] The power electronics assembly 200 may include a first power layer 130 disposed between the first core layer 122 and the second core layer 124. The first power layer 130 may be configured as an output layer with an output terminal coupled to the output terminal, which is further electrically coupled to a load, such as an electric motor. The first electrical components 112 and second electrical components 114 of the first vertical column 150 may be in electrical communication with the first power layer 130 such that the first electrical components 112 and second electrical components 114 provide an output. A portion 135 of the first power layer 130 may additionally be configured as a negative layer connecting the first electrical components 112 and second electrical components 114 to a negative terminal. In other words, the first power layer 130 may include a conductive material connecting the first electrical components 112 and second electrical components 114 to the output terminal and a separate conductive material connecting the first electrical components 112 and second electrical components 114 to the negative terminal. Note that the portion 135 of the first power layer 130 that is coupled to the negative terminal extends along the Y-axis, and thus the power electronics assembly 200 may have fewer substrate layers 120 compared to embodiments that have separate power layers for electrical connection to the ground electrode and the negative terminal.

[0034] 1. Specifically, power electronics assembly 200 may have second power layer 132 disposed vertically above first core layer 122 and electrically coupled to the positive terminal. Thus, current may flow from the positive terminal, through second power layer 132, through first core layer 122, through second core layer 124, and through first power layer 130 to the negative terminal.

[0035] As shown, the second core layer 124 may be the bottom layer of the power electronics assembly 200, and the first core layer 122 may be stacked vertically above the second core layer 124. Thus, in some embodiments, the second core layer may directly abut the second cooling plate 128.

[0036] Although the power supply layers 130, 132 and core layers 122, 124 have been described primarily with reference to the first electrical component 112 and the second electrical component 114 of the first vertical column 150, it will be understood that the description applies equally to the electrical components of the second vertical column 152 and the third vertical column 154 illustrated in FIG. 2.

[0037] Referring to FIG. 4 , a power electronics assembly 300 is schematically illustrated. The power electronics assembly 300 is similar to the power electronics assemblies 100 and 200. Accordingly, like numbers are used for like features. For example, the power electronics assembly 300 may include a first electrical component 112 and a second electrical component 114 arranged in a first vertical column 150. Like the power electronics assembly 200, the power electronics assembly 300 may include a first power layer 130 that electrically connects the first electrical component 112 and the second electrical component 114 to both the output terminal and the negative terminal (e.g., by a portion 137 extending along the Y-axis indicated by arrow A). However, the configuration of the substrate layer 120 that includes the first power layer 130 may be different. Additionally, the first electrical component 112 and the second electrical component 114 may be positioned opposite each other.

[0038] The first electrical component 112 may be embedded within the first core layer 122 such that the first electrical component 112 is assembled to the bottom of the first core layer 122. In other words, the first electrical component 112 may be located generally below the mounting substrate 136. In contrast, the second electrical component 114 may be assembled to the top of the second core layer 124 such that the second electronics assembly is located generally below the mounting substrate 136. In this manner, the first electrical component 112 and the second electrical component 114 may be described as being positioned opposite one another or in a mirror image configuration.

[0039] 4 , the second signal layer 118 may be located between the first core layer 122 and the second core layer 124 and may be electrically coupled to both the first electrical component 112 and the second electrical component 114 by conductive vias 138. The first signal layer 116, located on top of the plurality of substrate layers 120, may be electrically coupled to the second signal layer 118 by conductive vias 138. In this manner, the first signal layer 116 and the second signal layer 118 may enable communication between the mounted electrical components and the first electrical component 112 and the second electrical component 114.

[0040] The first power layer 130 may be disposed between the first core layer 122 and the second core layer 124. The power electronics assembly 300 may have a second power layer 132 disposed between the first core layer 122 and the second core layer 124, which may be electrically coupled to the positive terminal. The second signal layer 118 may be disposed between the first power layer 130 and the second power layer 132. This configuration of the first power layer 130, the second power layer 132, and the second signal layer 118 allows the second signal layer 118 to separate the first power layer 130 and the second power layer 132, which may prevent unintentional shorting of the circuit.

[0041] Referring to FIG. 5 , a power electronics assembly 400 is schematically illustrated. The power electronics assembly 400 is similar to the power electronics assemblies 100, 200, and 300. Accordingly, similar numbers are used for similar features. For example, the power electronics assembly 400 may include a first electrical component 112 and a second electrical component 114 arranged in a first vertical column 150. Similar to the power electronics assembly 300, the first electrical component 112 and the second electrical component 114 may be arranged opposite each other. However, unlike the power electronics assembly 300, the first power layer 130 may electrically connect the first electrical component 112 and the second electrical component 114 to the output terminal, while the third power layer 134 electrically connects the first electrical component 112 and the second electrical component 114 to the negative terminal. Accordingly, the specific configuration of the substrate layer 120 may differ.

[0042] As shown, the first electrical component 112 and the second electrical component 114 may be positioned opposite one another or in a mirror image configuration. As described herein above with reference to the power electronics assembly 300, the first signal layer 116 may be located on top of the multiple substrate layers 120, and the second signal layer 118 may be located between the first core layer 122 and the second core layer 124.

[0043] 5, the power electronics assembly 400 may include a first power supply layer 130 disposed between the first core layer 122 and the second core layer 124 and may electrically connect the first electrical component 112 and the second electrical component 114 to an output terminal. The power electronics assembly 400 may include a second power supply layer 132 disposed between the first core layer 122 and the second core layer 124 and may electrically connect the first electrical component 112 and the second electrical component 114 to a positive terminal. Note that the input current path, as indicated by arrow A, passes in the same plane as the output of the first power supply layer 130. The first power supply layer 130 includes conductive traces offset along the Y-axis from the output connection.

[0044] A second signal layer 118 may be disposed between the first power layer 130 and the second power layer 132. The second signal layer 118 may thus separate the first power layer 130 and the second power layer 132, thereby preventing unintentional shorting of the circuits. A third power layer 134 may be disposed below the second power layer 132 and adjacent to the second cooling plate 128, and the third power layer 134 may electrically connect the first electrical component 112 and the second electrical component 114 to the negative terminal.

[0045] Referring to FIG. 6 , an embodiment of a power electronics assembly 500 is schematically illustrated. The power electronics assembly 500 is similar to the power electronics assemblies 100, 200, 300, and 400. Accordingly, like numbers are used for like features. For example, the power electronics assembly 500 may include a first electrical component 112 and a second electrical component 114 arranged in a first vertical column 150. Similar to the power electronics assemblies 300 and 400, the first electrical component 112 and the second electrical component 114 may be positioned opposite one another. However, unlike the power electronics assemblies 100, 200, and 300, the power electronics assembly 400 may include only a first power layer 130 and not the second power layer 132 and the third power layer 134 described with reference to the above embodiments. Rather, the first power layer 130 has conductive portions electrically coupled to a positive terminal, an output terminal, and a negative terminal.

[0046] As shown, the first electrical component 112 and the second electrical component 114 may be positioned opposite one another or in a mirror image configuration. As described herein above with reference to the power electronics assemblies 300, 400, the first signal layer 116 may be located on top of the plurality of substrate layers 120, and the second signal layer 118 may be located between the first core layer 122 and the second core layer 124.

[0047] The power electronics assembly 500 may include a first power layer 130 that may be electrically coupled to a positive terminal, to a negative terminal (by conductive portion 139), and to an output terminal (by conductive portion 133). Thus, the power electronics assembly 500 may include a single power layer. The first power layer 130 may be disposed between the first core layer 122 and the second core layer 124. The first power layer 130 may be electrically connected to the first core layer 122 and the second core layer 124 by conductive vias 138. Thus, current may flow from the positive terminal, through the first power layer 130, through the first core layer 122, back to the first power layer 130, through the second core layer 124, back to the first power layer 130, and to the negative terminal. By using a single power layer, the power electronics assembly 500 may include six substrate layers 120.

[0048] Referring to FIG. 7 , an embodiment of a power electronics assembly 600 is schematically illustrated. Power electronics assembly 600 is similar to power electronics assemblies 100, 200, 300, 400, and 500. Accordingly, like numbers are used for like features. For example, power electronics assembly 600 may include first electrical components 112 and second electrical components 114 arranged in a first vertical column 150. As described herein, power electronics assembly 600 may include one or more mounted electronics 140 plus a second selection of one or more mounted electronics 144.

[0049] As described herein above with reference to power electronics assembly 500, power electronics assembly 600 may include first power layer 130, which may be a single power layer disposed between first core layer 122 and second core layer 124.

[0050] The power electronics assembly 600 may include a first signal layer 116 disposed vertically above the first core layer 122, a second signal layer 118 disposed between the first core layer 122 and the second core layer 124, and a third signal layer 602 disposed vertically below the second core layer 124. One or more mounted electronics 160 may be electrically coupled to the first signal layer 116. A second selection of one or more mounted electronics 164 may be electrically coupled to the third signal layer 602. The first signal layer 116 and the third signal layer 602 may be electrically coupled to the second signal layer 118 by conductive vias 138. The second signal layer 118 may be electrically connected to the first electrical component 112 and the second electrical component 114 by conductive vias 138. In this manner, both the first electrical component 112 and the second electrical component 114 may communicate with the mounted electronics 160 and a second selection of one or more mounted electronics 164 via the second signal layer 118. This configuration may increase the available area for mounted electronics by allowing mounting along both the top and bottom sides of the printed circuit board 102.

[0051] In view of the above, it will be appreciated that at least some embodiments of the present disclosure are directed to a power electronics assembly including a printed circuit board including a plurality of substrate layers, the plurality of substrate layers including a first core layer and a second core layer stacked vertically below the first core layer, the first core layer including a first electrical component embedded vertically below the first core layer, and the second core layer including a second electrical component embedded vertically below the first core layer, the first electrical component and the second electrical component being arranged in a row.

[0052] While particular embodiments have been illustrated and described herein, it should be understood that various other changes and modifications can be made without departing from the spirit and scope of the claimed subject matter. Moreover, although various aspects of the claimed subject matter have been described herein, such aspects need not be used in combination. Accordingly, the appended claims are intended to cover all such changes and modifications that are within the scope of the claimed subject matter.

[0053] It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments described herein without departing from the scope of the claimed subject matter. Accordingly, the present specification is intended to cover modifications and variations of the various embodiments described herein, provided such modifications and variations come within the scope of the appended claims and their equivalents.

[0054] The invention described herein may include the following aspects. (1) A power electronics assembly comprising: a printed circuit board comprising a plurality of vertically stacked substrate layers; The plurality of substrate layers include: a first core layer having a first electrical component embedded therein; a second core layer stacked vertically below the first core layer, the second core layer including a second electrical component embedded therein, the first electrical component and the second electrical component being arranged in a vertical row; A power electronics assembly comprising: (2) A power electronics assembly according to (1) above, wherein each of the first electrical component and the second electrical component is embedded in a conductive mounting substrate. (3) A power electronics assembly as described in (1) above, further comprising three rows of fully embedded electrical components. (4) A power electronics assembly as described in (1) above, further comprising a first cooling plate disposed on a first side of the printed circuit board and a second cooling plate disposed on a second side of the printed circuit board opposite the first side. (5) A power electronics assembly according to (4) above, wherein the second core layer directly abuts the second cooling plate. (6) A power electronics assembly according to (1) above, further comprising a signal layer disposed between the first core layer and the second core layer. (7) A power electronics assembly according to (1) above, further comprising a power supply layer disposed between the first core layer and the second core layer. (8) A power electronics assembly according to (1) above, further comprising a power supply layer disposed vertically above the first core layer. (9) A power electronics assembly according to (1) above, further comprising a power supply layer disposed vertically below the second core layer. (10) A power electronics assembly according to (1) above, wherein the first electrical component and the second electrical component are arranged opposite each other. (11) A power electronics assembly, 1. A printed circuit board comprising a plurality of substrate layers, the plurality of substrate layers comprising: a first core layer having a first electrical component embedded therein; a second core layer stacked vertically below the first core layer, the second core layer including a second electrical component embedded therein, the first electrical component and the second electrical component being arranged in a vertical row; a first signal layer stacked vertically above the first core layer; a printed circuit board comprising: at least one mounted electronic device mounted on a top surface of the printed circuit board and electrically coupled to the first signal layer; A power electronics assembly comprising: (12) A power electronics assembly as described in (11) above, wherein the printed circuit board comprises a second vertical row of embedded electrical components. (13) A power electronics assembly according to (11) above, further comprising a second signal layer disposed between the first core layer and the second core layer. (14) The power electronics assembly according to (11) above, further comprising a cooling plate abutting the first signal layer. (15) A power electronics assembly as described in (11) above, wherein the plurality of substrate layers comprises at least six individual substrate layers. (16) The power electronics assembly according to (11), a second signal layer disposed below the second core layer; a second on-board electronics electrically coupled to the second signal layer; The power electronics assembly further comprises: (17) A power electronics assembly, A printed circuit board comprising a plurality of substrate layers, The plurality of substrate layers include: a first core layer having a first electrical component embedded therein; a second core layer stacked vertically below the first core layer, the second core layer including a second electrical component embedded therein, the first electrical component and the second electrical component being arranged in a vertical row; a printed circuit board comprising: a first signal layer disposed vertically above the first core layer; a second signal layer disposed between the first core layer and the second core layer; A power electronics assembly comprising: (18) A power electronics assembly as described in (17) above, wherein the second signal layer is electrically coupled to the second electrical component. (19) A power electronics assembly as described in (17) above, wherein the second signal layer is electrically coupled to the first electrical component. (20) A power electronics assembly as described in (17) above, further comprising at least one mounted electronic device electrically coupled to the first signal layer.

Claims

1. 1. A power electronics assembly comprising: a printed circuit board comprising a plurality of vertically stacked substrate layers; The plurality of substrate layers include: a first core layer having a first electrical component embedded therein; a second core layer stacked vertically below the first core layer, the second core layer including a second electrical component embedded therein, the first electrical component and the second electrical component being arranged in a vertical row; A power electronics assembly comprising:

2. 10. The power electronics assembly of claim 1, wherein each of the first electrical component and the second electrical component is embedded in a conductive mounting substrate.

3. 10. The power electronics assembly of claim 1, further comprising three rows of fully embedded electrical components.

4. 10. The power electronics assembly of claim 1, further comprising a first cooling plate disposed on a first side of the printed circuit board and a second cooling plate disposed on a second side of the printed circuit board opposite the first side.

5. 5. The power electronics assembly according to claim 4, wherein the second core layer directly abuts the second cooling plate.

6. 10. The power electronics assembly of claim 1, further comprising a signal layer disposed between the first core layer and the second core layer.

7. 10. The power electronics assembly according to claim 1, further comprising a power layer disposed between the first core layer and the second core layer.

8. 10. The power electronics assembly of claim 1, further comprising a power layer disposed vertically above the first core layer.

9. 10. The power electronics assembly of claim 1, further comprising a power layer disposed vertically below the second core layer.

10. 2. The power electronics assembly according to claim 1, wherein the first electrical component and the second electrical component are disposed opposite each other.

11. 1. A power electronics assembly comprising:

1. A printed circuit board comprising a plurality of substrate layers, the plurality of substrate layers comprising: a first core layer having a first electrical component embedded therein; a second core layer stacked vertically below the first core layer, the second core layer including a second electrical component embedded therein, the first electrical component and the second electrical component being arranged in a vertical row; a first signal layer stacked vertically above the first core layer; a printed circuit board comprising: at least one mounted electronic device mounted on a top surface of the printed circuit board and electrically coupled to the first signal layer; A power electronics assembly comprising:

12. 12. The power electronics assembly of claim 11, wherein the printed circuit board comprises a second vertical row of embedded electrical components.

13. 12. The power electronics assembly of claim 11, further comprising a second signal layer disposed between the first core layer and the second core layer.

14. 12. The power electronics assembly of claim 11, further comprising a cooling plate abutting the first signal layer.

15. 12. The power electronics assembly of claim 11, a second signal layer disposed below the second core layer; a second on-board electronics electrically coupled to the second signal layer; The power electronics assembly further comprises:

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