Equipment and method for manufacturing tape

Abstract

The manufacturing process of the conventional tape is complicated, which leads to energy waste and an increase in manufacturing cost.SOLUTION: The present invention discloses an apparatus and a method for manufacturing a tape. The equipment for manufacturing the tape includes a base film forming section, an adhesive film forming section, a co-extrusion section, and a stretching section. The base film-forming portion thermally melts the substrate to form a base film. The adhesive film forming portion thermally melts the adhesive material to form a pressure sensitive adhesive film. The co-extrusion section is respectively connected to the base film forming section and the adhesive film forming section, and the base film and the pressure sensitive adhesive film enter the co-extrusion section to perform a co-extrusion manufacturing process, thereby obtaining a co-extruded film having the base film and the pressure sensitive adhesive film. The stretching section performs a stretching process on the co-extruded film.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a tape manufacturing facility and method. [Background technology]

[0002] Conventional tapes, such as laminated tape, use organic solvents in their manufacturing process. Although these organic solvents can be recovered and reused, the construction costs of recovery facilities are very high, and it is difficult to achieve a 100% recovery rate, making it difficult to achieve zero detection of organic solvents and failing to meet environmental protection requirements. Summary of the Invention [Problem to be solved by the invention]

[0003] The manufacturing process of conventional tapes is complicated, which leads to energy waste and increased manufacturing costs. [Means for solving the problem]

[0004] The present invention aims to provide a tape manufacturing equipment and method that reduces manufacturing costs. Since the present invention does not use organic solvents, the step of removing the solvent can be omitted, shortening the manufacturing process and reducing costs.

[0005] To achieve the above object, the present invention provides a tape manufacturing equipment, which includes a base film forming section, an adhesive film forming section, a co-extrusion molding section, and a stretching section. The base film forming section heat-melts a substrate to form a base film. The adhesive film forming section heat-melts an adhesive material to form a pressure-sensitive adhesive film. The co-extrusion molding section is connected to the base film forming section and the adhesive film forming section, respectively, and the base film and pressure-sensitive adhesive film enter the co-extrusion molding section to perform the co-extrusion manufacturing process, resulting in a co-extruded film having the base film and pressure-sensitive adhesive film. The stretching section performs a stretching process on the co-extruded film.

[0006] In one embodiment, the substrate comprises isotactic polypropylene and atactic polypropylene.

[0007] In one embodiment, the adhesive material includes styrene-ethylene-butylene-styrene block copolymer, styrene-isoprene-styrene block copolymer, resin, thermoplastic elastomer pressure sensitive adhesive, or polyacrylate, or the like.

[0008] In one embodiment, the adhesive film forming section includes a hot melt transport device.

[0009] In one embodiment, the coextrusion section includes at least one burnishing roller, the surface of which is coated with Teflon or anti-stick silica gel.

[0010] In one embodiment, the coextrusion section includes a T-shaped extrusion head, and the coextruded film is coextruded through the T-shaped extrusion head.

[0011] In one embodiment, the stretching step comprises a uniaxial stretching step, and the stretching parameters of the uniaxial stretching step are 1.5, 2.0, 2.5, or 3.0 times.

[0012] In one embodiment, the stretching step includes a biaxial stretching step, and the stretching parameters of the biaxial stretching step are 1.5*1.5, 2.0*2.0, 2.5*2.5 or 3.0*3.0 times.

[0013] In order to achieve the above object, the present invention provides a method for manufacturing a tape, which includes at least the following steps: a heat-melting step in which a substrate and an adhesive material are heat-melted to form a base film and a pressure-sensitive adhesive film, respectively; a co-extrusion step in which the base film and the pressure-sensitive adhesive film are subjected to a co-extrusion molding process to obtain a co-extruded film having the base film and the pressure-sensitive adhesive film; and a stretching step in which the co-extruded film is stretched.

[0014] In one embodiment, the heat-melting step uses a hot melt transport device to heat-melt the adhesive material to form a pressure-sensitive adhesive film.

[0015] In one embodiment, the manufacturing method further comprises a machine washing step.

[0016] In one embodiment, the co-extrusion process includes at least one burnishing roller, the surface of which is coated with Teflon or anti-stick silica gel.

[0017] In one embodiment, the coextruded film is coextruded through a T-shaped extrusion head.

[0018] As described above, in the tape manufacturing equipment and method of the present invention, a substrate and an adhesive material are thermally melted to form a base film and a pressure-sensitive adhesive film, respectively; the base film and the pressure-sensitive adhesive film are subjected to a co-extrusion manufacturing process to obtain a co-extruded film having a base film and a pressure-sensitive adhesive film; and the co-extruded film is then stretched. Thus, the manufacturing equipment and method of the present invention produce tape through a co-extrusion manufacturing process, thereby reducing manufacturing costs. Furthermore, because the present invention does not require an organic solvent, the solvent removal step can be omitted, shortening the manufacturing process and reducing costs. [Effects of the Invention]

[0019] The production equipment or production method provided by the present invention can reduce production costs, and because it does not require an organic solvent, the step of removing the solvent can be omitted, thereby shortening the production process and reducing costs. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a diagram showing a tape manufacturing facility according to an embodiment of the present invention; [Figure 2A] 1 is a diagram showing a three-dimensional shape of a tape produced by the production equipment according to an embodiment of the present invention; [Figure 2B]1 is a diagram showing a cross section of a tape produced by a production facility according to an embodiment of the present invention. [Figure 3] FIG. 1 is a flow diagram of a method for manufacturing a tape according to an embodiment of the present invention. [Figure 4A] FIG. 2 is a diagram showing a thermal analysis of an adhesive material according to an embodiment of the present invention. [Figure 4B] FIG. 2 is a diagram showing a thermal analysis of an adhesive material according to an embodiment of the present invention. [Figure 5A] 1A-1C show SEM morphologies of cross sections of substrates of different examples of the present invention. [Figure 5B] 1A-1C show SEM morphologies of cross sections of substrates of different examples of the present invention. [Figure 6A] 1A and 1B show SEM morphologies of cross sections of coextruded tapes of different examples of the present invention. [Figure 6B] 1A and 1B show SEM morphologies of cross sections of coextruded tapes of different examples of the present invention. [Figure 7A] 1A and 1B are diagrams showing a peel test and a yield strength test of a tape sample according to an embodiment of the present invention. [Figure 7B] 1A and 1B are diagrams showing a peel test and a yield strength test of a tape sample according to an embodiment of the present invention. [Figure 7C] 10A-10C show peel and percent flexibility tests of tape samples of different embodiments of the present invention. [Figure 7D] 10A-10C show peel and percent flexibility tests of tape samples of different embodiments of the present invention. [Figure 8] FIG. 8(A) is a photograph of a tape sample according to one embodiment of the present invention, and FIGS. 8(B) to 8(E) are photographs of the tape sample of FIG. 8(A) after uniaxial stretching at different magnifications. [Figure 9A] 1A and 1B are SEM morphologies of cross sections of a tape sample according to an embodiment of the present invention after uniaxial stretching at different magnifications. [Figure 9B] 1A and 1B are SEM morphologies of cross sections of a tape sample according to an embodiment of the present invention after uniaxial stretching at different magnifications. [Figure 9C]1A and 1B are SEM morphologies of cross sections of a tape sample according to an embodiment of the present invention after uniaxial stretching at different magnifications. [Figure 9D] 1A and 1B are SEM morphologies of cross sections of a tape sample according to an embodiment of the present invention after uniaxial stretching at different magnifications. [Figure 10] 10(A) to 10(C) are diagrams showing the process of stretching a tape sample according to one embodiment of the present invention. [Figure 11A] 3A-3C are photographs of a tape sample of an embodiment of the present invention after biaxial stretching at different magnifications. [Figure 11B] 3A-3C are photographs of a tape sample of an embodiment of the present invention after biaxial stretching at different magnifications. [Figure 11C] 3A-3C are photographs of a tape sample of an embodiment of the present invention after biaxial stretching at different magnifications. [Figure 11D] 3A-3C are photographs of a tape sample of an embodiment of the present invention after biaxial stretching at different magnifications. DETAILED DESCRIPTION OF THE INVENTION

[0021] The following describes embodiments of the tape manufacturing equipment and manufacturing method of the present invention with reference to the accompanying drawings. The same elements are denoted by the same reference numerals. The elements in the following embodiments are shown only to illustrate their relative relationships, and do not represent the actual proportions or dimensions of the elements.

[0022] Fig. 1 is a diagram showing a tape manufacturing facility according to an embodiment of the present invention. Fig. 2A is a diagram showing a three-dimensional view of a tape manufactured by the manufacturing facility according to an embodiment of the present invention. Fig. 2B is a diagram showing a cross section of a tape manufactured by the manufacturing facility according to an embodiment of the present invention. Fig. 3 is a flow chart of a tape manufacturing method according to an embodiment of the present invention.

[0023] First, please refer to Figure 1. The manufacturing equipment (or manufacturing machine) 1 of the present invention can manufacture tapes, such as, but not limited to, laminated tapes. The manufacturing equipment 1 includes a base film forming section 11, an adhesive film forming section 12, a co-extrusion molding section 13, and a stretching section 14.

[0024] It should be noted that the manufacturing equipment 1 in this specification may be a single machine or a combination of multiple machines connected in series or across. When the manufacturing equipment 1 is a single machine, each section (11-16) is a separate section of the single machine. When the manufacturing equipment 1 is a combination of multiple machines, each section (11-16) corresponds to a separate machine, or multiple sections are combined into a single machine. The present invention does not limit the manufacturing equipment 1 to a single machine or a combination of multiple machines. In one embodiment, the manufacturing equipment 1 includes a multi-screw (e.g., bi-screw or tri-screw) film coextrusion equipment.

[0025] The base film forming section 11 heat-melts the substrate to form a base film. In other words, for example, a granular substrate is fed into the base film forming section 11 through a material inlet, and is heated and melted through the rolls of the base film forming section 11 to form a base film. In one embodiment, the substrate can be polypropylene (PP), for example, isotactic polypropylene or atactic polypropylene, but is not limited to these. The density of isotactic polypropylene is 0.903 g / cm 3 The melting point is 150-170°C. The density of atactic polypropylene is 0.900 g / cm 3 and a melting point of 130 to 160°C. Atactic polypropylene has high strength, excellent heat resistance, good dimensional stability, extremely good toughness at low temperatures (good flexibility), good transparency, and excellent gloss, making it more suitable as a base film material.

[0026] In one embodiment, the melt index (MI) of the isotactic polypropylene or atactic polypropylene may be, for example, 25. In one embodiment, the forming stability of the base film is enhanced by preheating the machine to 280°C for 1 hour, and then first washing the machine using polypropylene with an MI of 1 to 25. In one embodiment, the thermal melting temperature of the substrate (PP material) in the roll is, for example, about 210°C, but is not limited thereto.

[0027] The adhesive film forming section 12 heat-melts the adhesive material to form a pressure-sensitive adhesive film. In other words, the adhesive material is introduced into the adhesive film forming section 12, where it is heated and melted to form a viscous pressure-sensitive adhesive film. In one embodiment, the adhesive material may include, but is not limited to, styrene-ethylene-butylene-styrene block copolymer (SEBS), a thermoplastic elastomer pressure-sensitive adhesive, or polyacrylate. Thermoplastic elastomer pressure-sensitive adhesives are typically made from SIS and C5 petroleum resin. In this embodiment, the adhesive film forming section 12 includes a hot melt transport device 121, which heat-melts the adhesive material to form a more uniform pressure-sensitive adhesive film. In one embodiment, the adhesive film forming section 12 is mechanically washed (using the adhesive material) for 2 to 3 hours to confirm the formation of a film after the adhesive material is extruded and to check the viscosity of the adhesive. In one embodiment, the adhesive film forming section 12 is preheated to, for example, 140°C for, for example, 120 seconds. In one embodiment, the adhesive material has a melting temperature of about 170° C., but is not limited to this.

[0028] The use of the hot melt transport device 121 in the tape manufacturing process of this embodiment can alleviate the problem of poor co-extrusion flowability and dispersibility in the process of uniformly melting the adhesive material. The hot melt transport device 121 heats the adhesive material above its melting point and applies it evenly to the substrate at a constant speed, ensuring that the adhesive material is evenly dispersed and attached to the substrate surface.

[0029] In terms of temperature control, the hot melt transport device 121 is equipped with a precise temperature control system, which ensures that the adhesive material is melted and applied at the most appropriate temperature. The ability to control the temperature is closely related to the even application and performance stability of the adhesive material. In terms of improving fluidity, the operation of the hot melt transport device 121 can improve the fluidity of the adhesive material, making it easier to form an even coating layer on the substrate surface, which is very important for the uniformity and consistency of the material in the co-extrusion molding process.

[0030] It should be noted that the base film forming section 11 can produce the base film and the adhesive film forming section 12 can produce the pressure-sensitive adhesive film at the same time, or the base film forming section 11 and the adhesive film forming section 12 can produce the base film and the pressure-sensitive adhesive film at different times, and this is not a limitation of the present invention.

[0031] The co-extrusion molding section 13 is connected to the base film forming section 11 and the adhesive film forming section 12, respectively. After the base film formed in the base film forming section 11 and the pressure-sensitive adhesive film formed in the adhesive film forming section 12 enter the co-extrusion molding section 13 as described above, the co-extrusion molding manufacturing process can be carried out. The co-extrusion molding manufacturing process is also called the co-extrusion process (Co-Extrusion), and a co-extruded film having a base film and a pressure-sensitive adhesive film is obtained.

[0032] In one embodiment, one of the shafts is a roll that melts the adhesive material in a hot melt transport device 121 and then pours it into the coextrusion molding section 13. The other shaft feeds atactic or isotactic polypropylene in the form of granules into the roll, and the coextrusion molding process produces a coextruded film.

[0033] In this embodiment, the coextrusion section 13 includes a T-die extrusion head, and the coextruded film is coextruded through the T-die extrusion head. In one embodiment, the coextrusion section 13 includes at least one burnishing roller, but the number of burnishing rollers is not limited. The surface of the burnishing roller can be coated (e.g., with Teflon or anti-sticking silica gel) to prevent roller sticking. Here, the coextruded tape is stretched into a film using a casting method, and the required thickness is achieved by adjusting the speed of the cooling roller. Finally, the wound-up finished product is stretched uniaxially or biaxially as required in the following stretching section 14, where it is thinned to a transparent state.

[0034] The stretching section 14 performs a stretching process on the coextruded film. Here, the coextruded film formed in the coextrusion section 13 enters the stretching section 14 and undergoes a stretching process. In one embodiment, the stretching process includes a uniaxial stretching process, and the stretching parameters of the uniaxial stretching process are, for example, 1.5, 2.0, 2.5, 3.0 times, or other multiples. In another embodiment, the stretching process includes a biaxial stretching process, and the stretching parameters of the biaxial stretching process are, for example, 1.5*1.5, 2.0*2.0, 2.5*2.5, 3.0*3.0 times, or other multiples, but the present invention is not limited thereto. Here, uniaxial stretching, for example, refers to stretching along the stretching direction (X-axis) of the coextruded film, i.e., in the machine direction (MD) of the film; biaxial stretching, for example, refers to stretching along a direction (Y-axis) perpendicular to the stretching direction (X-axis) of the coextruded film, i.e., simultaneously in the machine direction (MD) and transverse direction (TD) of the film, and the stretching parameters are determined according to the required product specifications or design parameters. In one embodiment, the temperature range of the stretching process is, for example, 140°C, and the stretching time is, for example, 8 seconds. The heat-setting temperature is, for example, 140°C.

[0035] In one embodiment, the manufacturing equipment 1 includes a cooling and shaping section 15, which cools and shapes the co-extruded film that has undergone the stretching process. In one embodiment, the manufacturing equipment 1 includes a winding section 16, which winds up the co-extruded film and, after appropriate cutting, forms it into tape. Here, the surfaces of the cooling roller used in the cooling and shaping section 15 and the winding roller (e.g., a wooden cylinder) used in the winding section 16 can be provided (e.g., painted or coated) with Teflon or anti-stick silica gel to prevent the rollers from sticking together.

[0036] See Figures 2A and 2B. In one embodiment of the present invention, tape 2 manufactured by manufacturing equipment 1 includes base layer 21 and pressure-sensitive adhesive layer 22, with pressure-sensitive adhesive layer 22 disposed on upper surface 211 of base layer 21. In one embodiment, tape manufactured by manufacturing equipment 1 can be cut into tape 2 of desired specifications. In some embodiments, tape 2 has a thickness of, for example, 40 micrometers (μm), a width of, for example, 5 to 100 centimeters (cm), and a length of, for example, 90 meters, as determined by actual needs. In some embodiments, tape 2 is a transparent laminate tape.

[0037] Also, as shown in FIG. 3, the present invention discloses a method for manufacturing a tape, which includes at least a heat-melting step S01 to a winding step S05.

[0038] First, in the heat-melting step S01, the substrate and adhesive material are heat-melted to form a base film and a pressure-sensitive adhesive film, respectively. In one embodiment, the heat-melting step uses a hot melt transport device to heat-melt the adhesive material and form a pressure-sensitive adhesive film. The heat-melting step S01 also includes a mechanical cleaning step, for example, for 2-3 hours to confirm the formation of a film after extrusion and to check the stability of the base film and the viscosity of the pressure-sensitive adhesive film.

[0039] In the co-extrusion step S20, the base film and the pressure-sensitive adhesive film are subjected to a co-extrusion process to obtain a co-extruded film of the base film and the pressure-sensitive adhesive film. The co-extruded film is co-extruded using a T-type extrusion head. In addition, at least one burnishing roller is used in the co-extrusion process, and the surface of the burnishing roller is coated with Teflon or anti-sticking silica gel to prevent roller sticking.

[0040] Then, in the stretching step S03, the coextruded film is stretched. The stretching process can include a uniaxial stretching process or a biaxial stretching process, and the stretching parameters for the uniaxial stretching process can be, but are not limited to, 1.5, 2.0, 2.5, or 3.0 times. The stretching parameters for the biaxial stretching process can be, but are not limited to, 1.5*1.5, 2.0*2.0, 2.5*2.5, or 3.0*3.0 times.

[0041] Next, in the cooling and shaping step S04, the co-extruded film that has been through the stretching process is cooled and shaped. The cooling rollers used in the cooling and shaping step are coated with Teflon or anti-sticking silica gel to prevent roller sticking.

[0042] Finally, in the winding step S05, the co-extruded film is wound up to obtain a tape.

[0043] Furthermore, other technical features of the tape manufacturing method of the present invention have already been described in detail in the above manufacturing equipment, so they will not be further described.

[0044] The characteristics of tapes in some embodiments of the present invention will be described below with reference to the accompanying drawings. FIGS. 4A and 4B are diagrams showing thermal analysis of an adhesive material in one embodiment of the present invention. FIGS. 5A and 5B are diagrams showing SEM morphology of a cross section of a substrate in another embodiment of the present invention. FIGS. 6A and 6B are diagrams showing SEM morphology of a cross section of a coextruded tape in another embodiment of the present invention. FIGS. 7A and 7B are diagrams showing peel tests and yield strength tests of tape samples in another embodiment of the present invention. FIGS. 7C and 7D are diagrams showing peel tests and strain percentage tests of tape samples in another embodiment of the present invention. FIG. 8(A) is a photograph of a tape sample in one embodiment of the present invention. FIGS. 8(B) to 8(E) are photographs of the tape sample in FIG. 8(A) after uniaxial stretching at different magnifications. FIGS. 9A to 9D are diagrams showing SEM morphology of a cross section of a tape sample in one embodiment of the present invention after uniaxial stretching at different magnifications. FIGS. 10(A) to 10(C) are diagrams showing the stretching process of a tape sample in one embodiment of the present invention. 11A to 11D are photographs of a tape sample according to one embodiment of the present invention after being biaxially stretched at different magnifications.

[0045] First, let us explain that the substrate in Figure 5A is isotactic polypropylene (IPP), and the substrate in Figure 5B is atactic polypropylene (APP); Figure 6A shows an SEM cross section of a co-extruded tape of isotactic polypropylene (IPP) with a flow rate of 16 and an adhesive material with a flow rate of 16, and Figure 6B shows an SEM cross section of a co-extruded tape of atactic polypropylene (APP) with a flow rate of 16 and an adhesive material with a flow rate of 16. Furthermore, the adhesive material used in the embodiments in Figures 4A and 4B, 6A to 9D, and 11A to 11D is, for example, a thermoplastic elastomer pressure-sensitive adhesive.

[0046] Please refer to Figures 4A and 4B. In the thermal analysis of the adhesive material (thermoplastic elastomer pressure-sensitive adhesive) of this example, Figure 4A shows the 95% thermal decomposition temperature (T d95%) is 404.2 °C, and Figure 4B shows the melting temperature (T m ) is 59.3℃.

[0047] Measurements revealed that the thickness of the substrate (isotactic polypropylene) in Figure 5A was 178 μm, and the thickness of the substrate (atactic polypropylene) in Figure 5B was 190 μm. Measurements also revealed that the thickness of the substrate (isotactic polypropylene) in the co-extruded tape in Figure 6A was 85 μm, and the thickness of the adhesive material was 101 μm. The thickness of the substrate (atactic polypropylene) in the co-extruded tape in Figure 6B was 84 μm, and the thickness of the adhesive material was 87 μm. As can be seen from Figures 6A and 6B, there is a clear interface between the substrate and the adhesive material, confirming good bonding between the two.

[0048] See Figure 7A. Figure 7A shows a 180-degree peel test performed on a tape sample attached to polypropylene (PP). The 180-degree peel test was performed according to ASTM D3330, with a peel speed of 300 mm / min and a tape sample size of 25 mm x 305 mm. The substrate and adhesive manufacturing process conditions for the three different tape samples shown in Figure 7A are: isotactic polypropylene with a flow rate of 16 and an adhesive with a flow rate of 16 (IPP16 / Adhesive Material 16), atactic polypropylene with a flow rate of 26 and an adhesive with a flow rate of 16 (APP26 / Adhesive Material 16), and atactic polypropylene with a flow rate of 16 and an adhesive with a flow rate of 16 (APP16 / Adhesive Material 16). As can be seen from Figure 7A, the higher the flow rate of atactic polypropylene (APP), the lower the viscosity; that is, APP26 / Adhesive Material 16 had the worst viscosity, while APP16 / Adhesive Material 16 had the best viscosity.

[0049] See Figure 7B. The yield strength test in Figure 7B was performed according to ASTM D3759, with a stretching speed of 50 mm / min and a tape sample size of 12 mm x 150 mm. The substrate and adhesive conditions for the three tape samples in Figure 7B are the same as those in Figure 7A. Figure 7B clearly shows that atactic polypropylene (APP) has high yield strength, proving its suitability as a base film material.

[0050] As shown in Figure 7C, a tape sample was attached to a stainless steel plate and subjected to a 180-degree peel test. The substrate and adhesive conditions for the three tape samples shown in Figure 7C are the same as those shown in Figure 7A. As can be seen from Figure 7C, APP26 / Adhesive 16 had the poorest viscosity, while APP16 / Adhesive 16 had the best viscosity.

[0051] As shown in Figure 7D, the substrate and adhesive conditions for the three tape samples in Figure 7D are the same as those in Figure 7A. The high flexural modulus and good mechanical strength of APP26 and APP16 again prove that atactic polypropylene (APP) is a suitable base film material.

[0052] Figure 8(A) is a photograph of a tape sample of one embodiment, Figure 8(B) shows the stretching parameter at 1.5 times (Ratio), Figure 8(C) shows the stretching parameter at 2.0 times, Figure 8(D) shows the stretching parameter at 2.5 times, and Figure 8(E) shows the stretching parameter at 3.0 times.

[0053] In the SEM morphology of the cross section after uniaxial stretching in Figures 9A to 9D, the stretching parameter in Figure 9A is 1.5 times, the stretching parameter in Figure 9B is 2.0 times, the stretching parameter in Figure 9C is 2.5 times, and the stretching parameter in Figure 9D is 3.0 times.

[0054] Figure 10(A) shows the tape sample before stretching, Figure 10(B) shows the uniaxial (Y-axis) stretching of the tape sample, and Figure 10(C) shows the biaxial (X-axis, Y-axis) stretching of the tape sample.

[0055] Furthermore, the stretching parameters in FIG. 11A are 1.5*1.5 times, the stretching parameters in FIG. 11B are 2.0*2.0 times, the stretching parameters in FIG. 11C are 2.5*2.5 times, and the stretching parameters in FIG. 11D are 3.0*3.0 times.

[0056] See Tables 1 to 4 below. Tables 1 to 3 show the haze values ​​of tapes according to different embodiments of the present invention after uniaxial stretching, and Table 4 shows the haze values ​​of a tape according to one embodiment of the present invention after biaxial stretching. The base layer materials in Tables 1 and 4 are all isotactic polypropylene, the base layers in Tables 2 and 3 are all atactic polypropylene, and the pressure-sensitive adhesive layers used in Tables 1 to 4 are all thermoplastic elastomer pressure-sensitive adhesives. Additionally, the MD direction is the machine direction of the film, the TD direction is the cross direction of the film, Tt is the total luminous transmittance, Td is the diffused luminous transmittance, and Tp is the parallel luminous transmittance.

[0057] [Table 1]

[0058] [Table 2]

[0059] [Table 3]

[0060] [Table 4]

[0061] In summary, the tape manufacturing equipment and method of the present invention include: thermally melting a substrate and an adhesive material to form a base film and a pressure-sensitive adhesive film, respectively; co-extrusion molding the base film and the pressure-sensitive adhesive film to obtain a co-extruded film having the base film and the pressure-sensitive adhesive film; and stretching the co-extruded film. As a result, the manufacturing equipment or method of the present invention produces tape through a co-extrusion molding process, thereby reducing manufacturing costs. Furthermore, because the present invention does not require the addition of an organic solvent, the solvent removal step can be omitted, shortening the manufacturing process and reducing costs.

[0062] The foregoing is intended to be illustrative and not limiting, and any modifications or variations thereto that do not depart from the spirit and scope of the present invention should fall within the scope of the claims of the present invention. [Industrial Applicability]

[0063] The present invention produces tapes by co-extrusion molding, and does not add organic solvents, so that zero organic solvents can be detected, meeting the demand for environmental friendliness. [Explanation of symbols]

[0064] 1 Manufacturing equipment 11 Base film forming part 12 Adhesive film forming part 13 Co-extrusion molding part 14 Stretched part 15 Cooling fixed part 16 Winding section 121 Hot melt transport equipment 2 Tape 21 Base Layer 22 Pressure-sensitive adhesive layer 211 Upper surface S01 Thermal dissolution step S02 Co-extrusion molding step S03 Stretching step (uniaxial stretching / biaxial stretching) S04 Cooling routine step S05 Winding step

Claims

1. a base film forming section for thermally melting the substrate to form a base film; an adhesive film forming section for thermally melting an adhesive material to form a pressure-sensitive adhesive film; a co-extrusion molding portion connected to the base film forming portion and the adhesive film forming portion, an extension portion; The base film and the pressure-sensitive adhesive film enter the co-extrusion molding section and perform a co-extrusion molding manufacturing process, thereby obtaining a co-extruded film having the base film and the pressure-sensitive adhesive film, and the stretching section performs a stretching process on the co-extruded film.

2. a heat-melting step of heat-melting the substrate and the adhesive material to form a base film and a pressure-sensitive adhesive film, respectively; a co-extrusion step in which the base film and the pressure-sensitive film are subjected to a co-extrusion manufacturing process to obtain a co-extruded film having the base film and the pressure-sensitive film; and a stretching step of stretching the extruded film.

3. 3. The tape manufacturing equipment according to claim 1, or the tape manufacturing method according to claim 2, wherein the base material contains isotactic polypropylene and atactic polypropylene.

4. 10. The tape manufacturing equipment of claim 1 or the tape manufacturing method of claim 2, wherein the adhesive material comprises a styrene-ethylene-butylene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a resin, a thermoplastic elastomer pressure-sensitive adhesive, or a polyacrylate.

5. 10. The tape manufacturing equipment according to claim 1, or the tape manufacturing method according to claim 2, wherein the adhesive material is thermally melted using a hot melt transport device to form a pressure-sensitive adhesive film.

6. 10. The tape manufacturing equipment according to claim 1 or the tape manufacturing method according to claim 2, wherein the co-extrusion molding process uses at least one burnishing roller, and the surface of the burnishing roller is coated with Teflon or anti-sticking silica gel.

7. 3. The tape manufacturing equipment according to claim 1, or the tape manufacturing method according to claim 2, wherein the co-extruded film is co-extruded by a T-type extrusion head.

8. 3. The tape manufacturing equipment according to claim 1 or the tape manufacturing method according to claim 2, wherein the stretching step includes a uniaxial stretching step, and the stretching parameter of the uniaxial stretching step is 1.5, 2.0, 2.5 or 3.0 times.

9. 3. The tape manufacturing equipment according to claim 1, or the tape manufacturing method according to claim 2, wherein the stretching step includes a biaxial stretching step, and the stretching parameters of the biaxial stretching step are 1.5*1.5, 2.0*2.0, 2.5*2.5, or 3.0*3.0 times.

10. The method of claim 2 further comprising a mechanical cleaning step.

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