Laser processing system, laser processing method, and program

The laser processing system corrects laser light irradiation position using an imaging unit and sensor to calculate deviation amounts, addressing the challenge of mark-free alignment for precise laser processing.

JP2026037686APending Publication Date: 2026-03-06TOYOTA JIDOSHA KK
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

Existing laser processing systems cannot correct the irradiation position of laser light without leaving marks on the workpiece when it is difficult to form irradiation marks.

Method used

A laser processing system that includes an imaging unit, a sensor, and a control unit to calculate and correct the irradiation position of laser light by determining deviation amounts between different coordinate systems, allowing precise alignment without forming marks on the workpiece.

Benefits of technology

The system enables accurate laser light irradiation correction without leaving marks on the workpiece, ensuring high-precision laser processing.

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Abstract

To provide a technique for correcting the irradiation position of a laser beam without forming irradiation marks on a workpiece. [Solution] A control device 4 calculates a first deviation amount, which is the deviation amount between a laser coordinate system 2A of a laser welding device 2 and the equipment coordinate system 1A, based on an image captured by a coaxial camera 33 of a reference mark M, whose position in the equipment coordinate system 1A is known. The control device 4 calculates a second deviation amount, which is the deviation amount between a camera coordinate system 3A of the imaging camera 3 and the equipment coordinate system 1A, based on an image captured by the imaging camera 3 of the reference mark M. The control device 4 calculates a third deviation amount, which is the deviation amount of a welding portion N of a workpiece 16 from a target workpiece position N1 in the equipment coordinate system 1A, based on an image captured by the imaging camera 3 of a workpiece 16. The control device 4 corrects the irradiation position at which the laser light is irradiated onto the workpiece 16, based on the first deviation amount, the second deviation amount, and the third deviation amount.
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Description

[Technical Field]

[0001] The present invention relates to a laser processing system, a laser processing method, and a program. [Background technology]

[0002] Patent Document 1 discloses a laser welding device that irradiates a laser beam emitted from a laser oscillator onto the irradiated surface of a workpiece placed below it and includes a head unit capable of capturing an image of the irradiated surface. Specifically, to correct the irradiation position of the laser beam, the laser beam from the laser oscillator is split and irradiated onto the irradiated surface of the workpiece, and the irradiation marks created on the irradiated surface are simultaneously observed with a camera to determine the amount of deviation between the actual irradiation position of the laser beam and the target position. Laser welding is then performed while correcting the irradiation position of the laser beam based on the determined amount of deviation. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-5775 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above Patent Document 1, since it is necessary to at least form an irradiation mark on the workpiece, it is not possible to correct the irradiation position of the laser light under circumstances where it is difficult to form an irradiation mark on the workpiece.

[0005] An object of the present disclosure is to provide a technology for correcting the irradiation position of laser light without leaving irradiation marks on the workpiece. [Means for solving the problem]

[0006] a laser processing device that can irradiate a workpiece with laser light and includes an imaging unit that can image an irradiation surface irradiated with the laser light; a sensor capable of detecting the workpiece; A control unit; Including, 1. A laser processing system, comprising: The control unit Calculating a first deviation amount, which is a deviation amount between a laser coordinate system as a coordinate system of the laser processing device and the equipment coordinate system, based on an image captured by the imaging unit of a reference mark whose position in the equipment coordinate system is known; calculating a second deviation amount, which is a deviation amount between a sensor coordinate system as a coordinate system of the sensor and the equipment coordinate system, based on a detection result of the sensor detecting the reference mark; calculating a third deviation amount, which is a deviation amount of the workpiece from a target workpiece position in the equipment coordinate system, based on a detection result of the workpiece detected by the sensor; correcting an irradiation position at which the laser light is irradiated onto the workpiece based on the first deviation amount, the second deviation amount, and the third deviation amount; The present invention provides a laser processing system that can correct the irradiation position of a laser beam without forming irradiation marks on the workpiece.

[0007] The sensor may be an imaging device capable of imaging the workpiece, and the detection result of the sensor detecting the reference mark may be a captured image. According to the above configuration, the sensor can be realized at low cost.

[0008] the sensor is a three-dimensional measuring device capable of measuring the three-dimensional shape of the workpiece, The detection result of the sensor detecting the reference mark may be three-dimensional shape data. The above configuration is suitable for the case where the reference mark is formed three-dimensionally.

[0009] a laser processing device that can irradiate a workpiece with laser light and includes an imaging unit that can image an irradiation surface irradiated with the laser light; a sensor capable of detecting the workpiece; A control unit; Including, A laser processing method in a laser processing system, comprising: Calculating a first deviation amount, which is a deviation amount between a laser coordinate system as a coordinate system of the laser processing device and the equipment coordinate system, based on an image captured by the imaging unit of a reference mark whose position in the equipment coordinate system is known; calculating a second deviation amount, which is a deviation amount between a sensor coordinate system as a coordinate system of the sensor and the equipment coordinate system, based on a detection result of the sensor detecting the reference mark; calculating a third deviation amount, which is a deviation amount of the workpiece from a target workpiece position in the equipment coordinate system, based on a detection result of the workpiece detected by the sensor; correcting an irradiation position at which the laser light is irradiated onto the workpiece based on the first deviation amount, the second deviation amount, and the third deviation amount; A laser processing method is provided. According to the above method, the irradiation position of the laser beam can be corrected without forming an irradiation mark on the workpiece.

[0010] a control unit that controls a laser processing device that is capable of irradiating a workpiece with laser light and includes an imaging unit that can image an irradiation surface onto which the laser light is irradiated, and a sensor that can detect the workpiece, calculates a first deviation amount that is a deviation amount between a laser coordinate system as a coordinate system of the laser processing device and the equipment coordinate system based on an image captured by the imaging unit of a reference mark whose position in the equipment coordinate system is known; calculating a second deviation amount, which is a deviation amount between a sensor coordinate system as a coordinate system of the sensor and the equipment coordinate system, based on a detection result of the sensor detecting the reference mark; calculating a third deviation amount, which is a deviation amount of the workpiece from a target workpiece position in the equipment coordinate system, based on a detection result of the workpiece detected by the sensor; correcting an irradiation position at which the laser light is irradiated onto the workpiece based on the first deviation amount, the second deviation amount, and the third deviation amount; The control unit is caused to function as follows: A program is provided that allows the laser beam irradiation position to be corrected without leaving any irradiation marks on the workpiece. [Effects of the Invention]

[0011] According to the present disclosure, the irradiation position of the laser light can be corrected without forming irradiation marks on the workpiece. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic diagram of a laser processing system. [Figure 2] FIG. 1 is a schematic diagram illustrating the configuration of a laser welding device. [Figure 3] 1 is a control flow of a laser processing system. [Figure 4] FIG. 10 is an explanatory diagram of a control flow. [Figure 5] FIG. 4 is an explanatory diagram of a first deviation amount and a second deviation amount. [Figure 6] FIG. 10 is an explanatory diagram of a third deviation amount. DETAILED DESCRIPTION OF THE INVENTION

[0013] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential means for solving the problems. For clarity of explanation, the following description and drawings have been omitted and simplified as appropriate. In each drawing, the same elements are given the same reference numerals, and repeated explanations are omitted as necessary.

[0014] Fig. 1 is a schematic diagram of a laser processing system 1. As shown in Fig. 1, the laser processing system 1 includes a laser welding device 2, an imaging camera 3, a control device 4, an actuator 5, a reference plate 6, and an equipment stand 50. As shown in Fig. 1, the coordinate system of the laser processing system 1 is referred to as an equipment coordinate system 1A. The equipment coordinate system 1A is a coordinate system fixed to the equipment in which the laser processing system 1 is installed.

[0015] The actuator 5 includes an X-axis guide 10 , two Y-axis guides 11 , two Z-axis guides 12 , an X-axis drive motor 13 , a Y-axis drive motor 14 , and a Z-axis drive motor 15 .

[0016] The X-axis guide 10 extends in the X direction in the facility coordinate system 1A. The X-axis guide 10 supports the laser welding device 2 and the imaging camera 3 so that the laser welding device 2 and the imaging camera 3 are movable in the X-axis direction along the X-axis guide 10. The X-axis drive motor 13 drives the laser welding device 2 and the imaging camera 3 individually along the X-axis guide 10 based on a control signal from the control device 4.

[0017] The two Z-axis guides 12 each extend in the Z direction in the equipment coordinate system 1A. The two Z-axis guides 12 support the X-axis guide 10 so that both ends of the X-axis guide 10 are movable in the Z-axis direction along the two Z-axis guides 12. The Z-axis drive motor 15 drives the X-axis guide 10 along the Z-axis guides 12 based on a control signal from the control device 4.

[0018] The two Y-axis guides 11 each extend in the Y direction in the equipment coordinate system 1A. The two Y-axis guides 11 support the two Z-axis guides 12 so that the lower ends of the two Z-axis guides 12 are movable in the Y-axis direction along the two Y-axis guides 11. The Y-axis drive motor 14 drives the Z-axis guides 12 along the Y-axis guides 11 based on a control signal from the control device 4.

[0019] As described above, in this embodiment, the laser welding device 2 and the imaging camera 3 are movable in the X, Y, and Z directions in the facility coordinate system 1A by the actuator 5. However, the laser processing system 1 may also include two articulated robots that control the positions and attitudes of the laser welding device 2 and the imaging camera 3, respectively.

[0020] Hereinafter, the coordinate system of the laser welding device 2 will be referred to as a laser coordinate system 2A, and the coordinate system of the imaging camera 3 will be referred to as a camera coordinate system 3A. The imaging camera 3 is a specific example of a sensor. The camera coordinate system 3A is a specific example of a sensor coordinate system.

[0021] The laser welding apparatus 2 is a specific example of a laser processing apparatus. The laser welding apparatus 2 is also called a galvanometer scanner. As shown in FIG. 2, the laser welding apparatus 2 has a laser oscillator 20 and a head unit 21. The laser oscillator 20 and the head unit 21 are connected by a fiber cable 22. The head unit 21 irradiates the laser light emitted from the laser oscillator 20 onto the workpiece 16 set below. The laser light irradiated from the head unit 21 onto the workpiece 16 has the ability to locally melt the workpiece 16. The head unit 21 also has the function of capturing images of the reference plate 6 and the workpiece 16.

[0022] The head unit 21 is provided with a collimator lens 30, a dichroic mirror 32, a coaxial camera 33, a reflecting mirror 34, a Z-direction lens driving unit 35, a reflecting mirror 36, a condenser lens 37, an XY scanner unit 38, and a three-axis driver 39.

[0023] Of these, the Z-direction lens driving unit 35 has a built-in Z-direction lens 40. Furthermore, the XY scanner unit 38 has a built-in galvanometer mirror 41.

[0024] The collimator lens 30 is a lens that collimates the laser light emitted from the laser oscillator 20. The dichroic mirror 32 is an optical element that reflects only light in a specific wavelength range and transmits light of other wavelengths. The dichroic mirror 32 reflects the laser light emitted from the laser oscillator 20 and transmits light of other wavelengths. This allows the laser light from the laser oscillator 20 to be irradiated onto the workpiece 16, while the coaxial camera 33 can observe and capture images of the workpiece 16 and the reference plate 6. In other words, the coaxial camera 33 is disposed on the optical path of the head unit 21. The coaxial camera 33 is a specific example of an imaging unit. Note that the coaxial camera 33 is not suitable for observing the workpiece 16. For example, the image captured by the coaxial camera 33 cannot detect the edge of the workpiece 16. This is because the captured image is distorted by the multiple lenses of the laser welding device 2.

[0025] The Z-direction lens drive unit 35 adjusts the focus on the workpiece 16 or the reference plate 6 by moving the Z-direction lens 40 up and down. The XY scanner unit 38 adjusts the irradiation position of the laser light on the workpiece 16 in the X-axis direction and the Y-axis direction by driving the galvanometer mirror 41. In other words, the XY scanner unit 38 allows the laser welding device 2 to irradiate multiple locations on the workpiece 16 with laser light without moving the laser welding device 2 and the workpiece 16 relative to each other. Both the Z-direction lens drive unit 35 and the XY scanner unit 38 are controlled by a three-axis driver 39.

[0026] Returning to FIG. 1 , the imaging camera 3 is a specific example of a sensor that detects the workpiece 16 and the reference plate 6. The imaging camera 3 captures images of the workpiece 16, the reference plate 6, etc., and outputs the captured images to the control device 4. Instead of the imaging camera 3, a measuring device such as a 3D camera that can measure the three-dimensional shapes of the workpiece 16 and the reference plate 6 may be used as the sensor that detects the workpiece 16 and the reference plate 6. In this case, the measuring device outputs three-dimensional shape data, which is the measurement result of the three-dimensional shapes of the workpiece 16 and the reference plate 6, to the control device 4.

[0027] The reference plate 6 is placed and positioned on an equipment table 50 whose position is fixed in an equipment coordinate system. A plurality of reference marks M are provided on the upper surface 6a of the reference plate 6. Typically, each reference mark M is a cross pattern painted on the upper surface 6a of the reference plate 6 with paint. However, instead of this, each reference mark M may be a cross groove formed by cutting into the upper surface 6a of the reference plate 6. Furthermore, each reference mark M may be a cross groove formed by cutting into the upper surface 6a of the reference plate 6, the inner surface of which is painted with a color different from that of the reference plate 6. Hereinafter, it is assumed that the XY coordinates of the plurality of reference marks M in the equipment coordinate system 1A are known.

[0028] The workpiece 16 is typically set on the equipment table 50 in the same manner as the reference plate 6. The workpiece 16 is positioned on the equipment table 50 using, for example, positioning pins. The workpiece 16 has a plurality of welding portions N. The welding portions N are a specific example of processing portions.

[0029] The multiple reference marks M on the reference plate 6 and the multiple welding locations N on the workpiece 16 are arranged in a positional relationship where they correspond to each other. Specifically, the multiple reference marks M are arranged in two rows in the X direction and four rows in the Y direction in the equipment coordinate system. Similarly, the multiple welding locations N on the workpiece 16 are arranged in two rows in the X direction and four rows in the Y direction in the equipment coordinate system. The reference plate 6 is formed so that, if the reference plate 6 is placed on the workpiece 16, the multiple reference marks M and the multiple welding locations N will be aligned vertically.

[0030] The control device 4 is a specific example of a control unit. The control device 4 has a processor 4a and a memory 4b. The processor 4a can access the memory 4b. The processor 4a reads and executes a program stored in the memory 4b. As a result, the processor 4a executes the processing specified by the program.

[0031] FIG. 3 shows the control flow of the control device 4. Hereinafter, it is assumed that the coordinate transformation data between the laser coordinate system 2A of the laser welding device 2 and the equipment coordinate system 1A, and the coordinate transformation data between the camera coordinate system 3A of the imaging camera 3 and the equipment coordinate system 1A, were acquired during the manufacturing of the laser processing system 1. It is also assumed that the reliability of these transformation data decreases due to various factors, such as aging and ambient temperature. Therefore, when performing laser welding on each of the multiple weld locations N of the workpiece 16 using the laser welding device 2, it is typically necessary to correct each coordinate transformation data again immediately before the welding.

[0032] First, the control device 4 calculates a first deviation amount, which is the deviation amount between the laser coordinate system 2A of the laser welding device 2 and the equipment coordinate system 1A, based on an image captured by the coaxial camera 33 of a reference mark M whose position in the equipment coordinate system 1A is known (S100). Specifically, as shown in FIG. 4A, the control device 4 outputs a control signal to the actuator 5 so that the laser welding device 2 is positioned directly above the reference plate 6. The laser welding device 2 being positioned directly above the reference plate 6 typically means a position where the X and Y coordinates in the equipment coordinate system 1A of the galvanometer mirror 41 of the XY scanner unit 38 of the laser welding device 2 are the average values ​​of the X and Y coordinates in the equipment coordinate system 1A of the multiple reference marks M formed on the reference plate 6. Then, the control device 4 controls the laser welding device 2 to cause the coaxial camera 33 to capture images of the multiple reference marks M. At this time, the control device 4 typically uses coordinate transformation data to control the laser welding device 2 so that the optical axis of the coaxial camera 33 coincides with the center of each reference mark M. In this way, the control device 4 acquires fiducial mark captured images of the plurality of fiducial marks M from the laser welding device 2. Then, based on each fiducial mark captured image, the control device 4 calculates a first deviation amount, which is the deviation amount between the laser coordinate system 2A of the laser welding device 2 and the equipment coordinate system 1A. It is considered that the first deviation amount is different for each fiducial mark M. This is because the error varies depending on the imaging direction of the coaxial camera 33 due to structural aging inside the laser welding device 2 and the ambient temperature. FIG. 5 shows an example of a fiducial mark captured image. The fiducial mark M is the fiducial mark M itself captured in the fiducial mark captured image. The assumed fiducial mark M1 indicates the original (ideal) position of the fiducial mark M when the fiducial mark M is captured using the coordinate transformation data. As shown in FIG. 5, the fiducial mark M captured in the fiducial mark captured image is shifted by c in the X direction and d in the Y direction from the assumed fiducial mark M1. Therefore, the control device 4 calculates a first deviation amount, which is the current deviation amount between the laser coordinate system 2A of the laser welding device 2 and the equipment coordinate system 1A, based on the captured image of the reference mark shown in Fig. 5. In Fig. 5, the X component of the first deviation amount is indicated by the symbol c, and the Y component is indicated by the symbol d.The X and Y components of this first deviation amount are different for each reference mark M.

[0033] Similarly, the control device 4 calculates a second deviation amount, which is the deviation amount between the camera coordinate system 3A of the imaging camera 3 and the facility coordinate system 1A, based on a reference mark captured image of the reference mark M captured by the imaging camera 3 (S110). Specifically, as shown in (B) in FIG. 4 , the control device 4 outputs a control signal to the actuator 5 so that the imaging camera 3 is positioned directly above the reference plate 6. The imaging camera 3 being positioned directly above the reference plate 6 typically means a position where the X and Y coordinates of the optical axis of the imaging camera 3 in the facility coordinate system 1A are the average values ​​of the X and Y coordinates of the multiple reference marks M formed on the reference plate 6 in the facility coordinate system 1A. The control device 4 then controls the imaging camera 3 to capture images of the multiple reference marks M. In this way, the control device 4 acquires one reference mark captured image from the imaging camera 3. The control device 4 then calculates a second deviation amount, which is the deviation amount between the camera coordinate system 3A of the imaging camera 3 and the facility coordinate system 1A, based on the reference mark captured image. It is considered that the second deviation amount differs for each reference mark M. This is because the error varies depending on the imaging direction of the imaging camera 3 due to structural deterioration over time within the imaging camera 3 and the ambient temperature. The assumed reference mark M2 in FIG. 5 indicates the original (ideal) position of the reference mark M when the reference mark M is imaged using coordinate transformation data. As shown in FIG. 5, the reference mark M captured in the reference mark image is shifted from the assumed reference mark M2 by a in the X direction and b in the Y direction. Therefore, the control device 4 calculates a second shift amount, which is the current shift amount between the camera coordinate system 3A of the imaging camera 3 and the equipment coordinate system 1A, based on the reference mark image shown in FIG. 5. In FIG. 5, the X component of the second shift amount is indicated by the symbol a, and the Y component is indicated by the symbol b. It is assumed that the X and Y components of this second shift amount differ for each reference mark M.

[0034] Next, the control device 4 calculates a third deviation amount, which is the deviation amount of the workpiece 16 from the target workpiece position in the equipment coordinate system 1A, based on the workpiece image captured by the imaging camera 3 (S120). Specifically, as shown in (C) in FIG. 4, the control device 4 outputs a control signal to the actuator 5 so that the imaging camera 3 is positioned directly above the workpiece 16. The imaging camera 3 being positioned directly above the workpiece 16 typically means a position where the X and Y coordinates of the optical axis of the imaging camera 3 in the equipment coordinate system 1A are the average values ​​of the X and Y coordinates of the multiple welds N formed on the workpiece 16 in the equipment coordinate system 1A. At this time, the control device 4 positions the imaging camera 3 taking into account the coordinate transformation data as well as the second deviation amount. Then, the control device 4 calculates a third deviation amount, which is the deviation amount of the welds N from the target workpiece position N1 in the equipment coordinate system 1A, based on the workpiece image shown in FIG. 6. That is, when the workpiece 16 is placed on the equipment table 50, positioning pins are typically used. Therefore, within the accuracy range achievable by the positioning pins, deviations of each welding portion N of the workpiece 16 from the target workpiece position N1 occur in the equipment coordinate system 1A. The target workpiece position N1 is the ideal position of the welding portion N in the equipment coordinate system 1A, and is a position assuming that multiple welding portions N are positioned without error in the equipment coordinate system 1A. Furthermore, deviations of each welding portion N of the workpiece from the target workpiece position N1 in the equipment coordinate system 1A will occur within the range of manufacturing error of the workpiece 16. Therefore, the third deviation amount, which is the deviation amount of each welding portion N of the workpiece 16 from the target workpiece position N1 in the equipment coordinate system 1A, is considered to be different for each welding portion N. Therefore, as shown in FIG. 6, the welding portion N appears shifted from the target workpiece position N1 in the workpiece image. Therefore, the control device 4 calculates a third deviation amount, which is a deviation amount of each of the multiple welding portions N of the workpiece from the target workpiece position N1 in the equipment coordinate system 1A, for each welding portion N based on the workpiece image captured by the imaging camera 3. In Fig. 6, the X component of the third deviation amount is indicated by the symbol e, and the Y component is indicated by the symbol f. The X component and the Y component of the third deviation amount are assumed to be different for each welding portion N.

[0035] Next, the control device 4 corrects the irradiation position at which the laser light is irradiated onto the workpiece 16 for each welding region N based on the first, second, and third deviation amounts (S130). Specifically, the control device 4 calculates the correction amount Δx of the irradiation position in the X direction as Δx = c + ae. Similarly, the control device 4 calculates the correction amount Δy of the irradiation position in the Y direction as Δy = d + bf. This eliminates all of the deviations that occurred during the period from the manufacture of the laser processing system 1 to when laser welding is actually performed and when the workpiece 16 is set on the equipment table 50, thereby making it possible to perform laser welding on the multiple welding regions N of the workpiece 16 with high accuracy.

[0036] Next, as shown in FIG. 4(D), the control device 4 performs laser welding on the multiple welding areas N by controlling the laser welding device 2 while taking into account the correction amounts Δx and Δy for each welding area N calculated in step S130 (S140).

[0037] In summary, the above laser processing system 1 has the following features.

[0038] The laser processing system 1 includes a laser welding device 2 (laser processing device) capable of irradiating a workpiece 16 with laser light and including a coaxial camera 33 (imaging unit) capable of capturing an image of an upper surface 6a (irradiation surface) onto which the laser light is irradiated, an imaging camera 3 (sensor) capable of detecting the workpiece 16, and a control device 4 (control unit). The control device 4 calculates a first deviation amount, which is the deviation amount between the laser coordinate system 2A of the laser welding device 2 and the equipment coordinate system 1A, based on an image captured by the coaxial camera 33 of a reference mark M whose position in the equipment coordinate system 1A is known (S100). The control device 4 calculates a second deviation amount, which is the deviation amount between the camera coordinate system 3A (sensor coordinate system) of the imaging camera 3 and the equipment coordinate system 1A, based on an image (detection result) captured by the imaging camera 3 of the reference mark M (S110). The control device 4 calculates a third deviation amount, which is a deviation amount of the welding portion N of the workpiece 16 from the target workpiece position N1 in the equipment coordinate system 1A, based on the captured image (detection result) of the workpiece 16 captured by the imaging camera 3 (S120). The control device 4 corrects the irradiation position where the laser light is irradiated onto the workpiece 16, based on the first deviation amount, the second deviation amount, and the third deviation amount (S130). With the above configuration, the irradiation position of the laser light can be corrected without forming an irradiation mark on the workpiece 16.

[0039] The sensor capable of detecting the workpiece 16 is an imaging camera 3 (imaging device) capable of capturing an image of the workpiece 16. The detection result of the imaging camera 3 detecting the reference mark M is a captured image. With the above configuration, a sensor capable of detecting the workpiece 16 can be realized at low cost.

[0040] Furthermore, the sensor capable of detecting the workpiece 16 may be a three-dimensional measuring device capable of measuring the three-dimensional shape of the workpiece 16. The detection result of the three-dimensional measuring device detecting the reference mark M may be three-dimensional shape data. With the above configuration, the reference mark M can be formed three-dimensionally, and high durability of the reference mark M can be ensured.

[0041] In the above embodiment, the first and second deviation amounts are calculated for each of the plurality of reference marks M. However, instead of this, it is also possible to calculate only the first and second deviation amounts of the four outermost reference marks M among the plurality of reference marks M, and estimate the first and second deviation amounts of the four innermost reference marks M among the plurality of reference marks M based on the calculation results.

[0042] Alternatively, the first and second shift amounts of only one of the multiple reference marks M may be calculated, and based on this calculation result, the first and second shift amounts of the remaining five of the multiple reference marks M may be estimated.

[0043] The workpiece 16 has a plurality of welding sites N. However, the workpiece 16 may have only one welding site N. The reference plate 6 has a plurality of reference marks M. However, the reference plate 6 may similarly have only one reference mark M. [Explanation of symbols]

[0044] 1. Laser processing system 1A Facility Coordinate System 2 Laser welding equipment 2A Laser Coordinate System 3. Imaging camera 3A Camera Coordinate System 4. Control device 4a processor 4b Memory 5 Actuators 6 Reference Plate 6a Top side 10 X-axis guide 11 Y-axis guide 12 Z-axis guide 13 X-axis drive motor 14 Y-axis drive motor 15 Z-axis drive motor 16 Work 20 Laser oscillator 21 Head Unit 22 Fiber Cable 30 Collimator Lens 32 Dichroic mirror 33 Coaxial Camera 34 Reflective mirror 35 Z-direction lens drive unit 36 Reflective mirror 37 Condenser Lens 38 XY scanner unit 39 3-axis driver 40 Z-direction lens 41 Galvanometer mirror 50 Equipment stand

Claims

1. a laser processing device that can irradiate a workpiece with laser light and includes an imaging unit that can image an irradiation surface irradiated with the laser light; a sensor capable of detecting the workpiece; A control unit; Including, 1. A laser processing system, comprising: The control unit calculating a first deviation amount that is a deviation amount between a laser coordinate system as a coordinate system of the laser processing device and the equipment coordinate system based on an image captured by the imaging unit of a reference mark whose position in the equipment coordinate system is known; calculating a second deviation amount, which is a deviation amount between a sensor coordinate system as a coordinate system of the sensor and the equipment coordinate system, based on a detection result of the sensor detecting the reference mark; calculating a third deviation amount, which is a deviation amount of the workpiece from a target workpiece position in the equipment coordinate system, based on a detection result of the workpiece detected by the sensor; correcting an irradiation position at which the laser light is irradiated onto the workpiece based on the first deviation amount, the second deviation amount, and the third deviation amount; Laser processing system.

2. 2. The laser processing system according to claim 1, The sensor is an imaging device capable of imaging the workpiece, The detection result of the sensor detecting the reference mark is a captured image. Laser processing system.

3. 2. The laser processing system according to claim 1, the sensor is a three-dimensional measuring device capable of measuring a three-dimensional shape of the workpiece, The detection result of the sensor detecting the reference mark is three-dimensional shape data. Laser processing system.

4. a laser processing device that can irradiate a workpiece with laser light and includes an imaging unit that can image an irradiation surface irradiated with the laser light; a sensor capable of detecting the workpiece; A control unit; Including, A laser processing method in a laser processing system, comprising: calculating a first deviation amount that is a deviation amount between a laser coordinate system as a coordinate system of the laser processing device and the equipment coordinate system based on an image captured by the imaging unit of a reference mark whose position in the equipment coordinate system is known; calculating a second deviation amount, which is a deviation amount between a sensor coordinate system as a coordinate system of the sensor and the equipment coordinate system, based on a detection result of the sensor detecting the reference mark; calculating a third deviation amount, which is a deviation amount of the workpiece from a target workpiece position in the equipment coordinate system, based on a detection result of the workpiece detected by the sensor; correcting an irradiation position at which the laser light is irradiated onto the workpiece based on the first deviation amount, the second deviation amount, and the third deviation amount; Laser processing method.

5. a control unit that controls a laser processing device that is capable of irradiating a workpiece with laser light and includes an imaging unit that can image an irradiation surface onto which the laser light is irradiated, and a sensor that can detect the workpiece, calculates a first deviation amount that is a deviation amount between a laser coordinate system as a coordinate system of the laser processing device and the equipment coordinate system based on an image captured by the imaging unit of a reference mark whose position in the equipment coordinate system is known; calculating a second deviation amount, which is a deviation amount between a sensor coordinate system as a coordinate system of the sensor and the equipment coordinate system, based on a detection result of the sensor detecting the reference mark; calculating a third deviation amount, which is a deviation amount of the workpiece from a target workpiece position in the equipment coordinate system, based on a detection result of the workpiece detected by the sensor; correcting an irradiation position at which the laser light is irradiated onto the workpiece based on the first deviation amount, the second deviation amount, and the third deviation amount; The control unit is caused to function as follows: program.

Citation Information

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