Substrate processing apparatus, determination method, semiconductor device manufacturing method and program

Abstract

This technology reduces the possibility of misjudgment by determining the reproducibility of substrate processing based on multiple criteria. [Solution] The system comprises a substrate processing unit for processing a substrate, a gas supply unit for supplying a gas for processing the substrate to the substrate processing unit, an acquisition unit for performing the substrate processing a predetermined number of times and acquiring measured values ​​in a predetermined specific section during the processing of each substrate, a judgment condition setting unit for setting thresholds for each of a predetermined number of judgment items based on the measured values ​​acquired by the acquisition unit, and a determination unit for determining whether the substrate processing is reproducible in the substrate processing after the thresholds have been set and whether the acquired measured values ​​fall within the range of the thresholds for each judgment item.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus, a determination method, a method for manufacturing a semiconductor device, and a program.

Background Art

[0002] Patent Document 1 discloses a substrate processing system including a substrate processing apparatus that processes a substrate, a storage unit that stores measurement data transmitted from the substrate processing apparatus, a storage unit that individually stores items of the measurement data related to the operating state of the substrate processing apparatus, types of statistical quantities applied to the measurement data, and conditions used for determination of the statistical quantities, and an extraction unit that extracts combinations in which the measurement data stored in the storage unit is determined to be abnormal from combinations including the items of the measurement data, the statistical quantities, and the conditions stored in the storage unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique for suppressing the possibility of misjudgment by determining the presence or absence of reproducibility of substrate processing using a plurality of determination items.

Means for Solving the Problems

[0005] According to one aspect of the present disclosure, a substrate processing unit that processes a substrate, a gas supply unit that supplies a gas for processing the substrate to the substrate processing unit, an acquisition unit that performs the processing of the substrate a predefined number of times and acquires measurement values in a predefined specific section during each processing of the substrate, A judgment condition setting unit sets threshold values ​​for each of a plurality of predetermined judgment items based on the measured values ​​acquired by the acquisition unit, In the processing of the substrate after setting the threshold, a determination unit determines whether the acquired measured value falls within the range of the threshold for each of the determination items, and determines whether the processing of the substrate is reproducible. Technology that includes this feature is provided. [Effects of the Invention]

[0006] According to this disclosure, the possibility of misjudgment is reduced by determining whether or not the substrate processing is reproducible using multiple judgment items. [Brief explanation of the drawing]

[0007] [Figure 1] This is a perspective view showing an example of a substrate processing apparatus according to the embodiment. [Figure 2] This is a cross-sectional view of the substrate processing apparatus according to the embodiment, taken from the side. [Figure 3] This is a block diagram showing an example of the functional configuration of a control device provided in a substrate processing apparatus according to the embodiment. [Figure 4] This is a front view showing an example of a determination condition and learning condition setting screen according to the embodiment. [Figure 5] The diagram in the embodiment shows an example of the object to be judged in the judgment condition, where (A) is a diagram showing how the flow rate of the processing gas changes during the processing process, and (B) is a diagram showing how the pressure of the processing gas changes during the processing process. [Figure 6] This figure shows an example of a set determination condition in a substrate processing apparatus according to the embodiment. [Figure 7] This flowchart shows the procedure for calculating statistical values ​​of set judgment conditions in a substrate processing apparatus according to an embodiment. [Figure 8] This flowchart shows the procedure for determining the reproducibility of substrate processing based on set judgment conditions in a substrate processing apparatus according to an embodiment. [Figure 9]This figure shows how the substrate processing apparatus according to the embodiment notifies the result of the reproducibility of substrate processing based on the set determination conditions. [Modes for carrying out the invention]

[0008] Hereinafter, one aspect of this disclosure will be described, mainly with reference to Figures 1 to 3. Note that the drawings used in the following description are all schematic, and the dimensional relationships and proportions of each element shown in the drawings do not necessarily correspond to reality. Furthermore, the dimensional relationships and proportions of each element do not necessarily correspond between multiple drawings. Also, this disclosure is not limited in any way to the following embodiments, and can be implemented with appropriate modifications within the scope of this disclosure.

[0009] First, an overview of the substrate processing apparatus according to this embodiment will be described with reference to Figures 1 and 2.

[0010] Figure 1 is a perspective view showing an example of a substrate processing apparatus 1 according to this embodiment. Figure 2 is a cross-sectional view of the substrate processing apparatus 1 according to this embodiment, viewed from the side. Figures 1 and 2 show a vertical substrate processing apparatus 1 as an example of a substrate processing apparatus. The substrate processed in the substrate processing apparatus 1 is shown as a semiconductor wafer made of silicon or the like, as an example. In this specification, the term "wafer" may mean the wafer itself or a laminate of a wafer and a predetermined layer or film formed on its surface. In this specification, the term "surface of the wafer" may mean the surface of the wafer itself or the surface of a predetermined layer formed on the wafer. In this specification, when it is written that "a predetermined layer is formed on the wafer," it may mean that the predetermined layer is directly formed on the surface of the wafer itself or that the predetermined layer is formed on a layer or the like that is formed on the wafer. In this specification, the term "substrate" is used in the same sense as when the term "wafer" is used.

[0011] As shown in FIGS. 1 and 2, the substrate processing apparatus 1 includes a housing 2. A pod loading / unloading port 6 is formed in the front wall 3 of the housing 2 so as to communicate the inside and outside of the housing 2. The pod loading / unloading port 6 is opened and closed by a front shutter (loading / unloading port opening / closing mechanism) 7. A load port (substrate transfer container delivery stand) 8 is installed on the front side directly in front of the pod loading / unloading port 6.

[0012] The pod 9 is a sealed substrate transfer container and is configured to be loaded onto the load port 8 and unloaded from the load port 8 by an in-process transfer device (not shown).

[0013] An upper portion at a substantially central part in the front-rear direction inside the housing 2 is provided with a rotary pod shelf (substrate transfer container storage shelf) 11. The rotary pod shelf 11 includes a plurality of shelves (substrate transfer container placement shelves) 13 configured to store the pod 9 in a state where at least one pod 9 is placed thereon.

[0014] A pod opener (substrate transfer container lid opening / closing mechanism) 14 is provided below the rotary pod shelf 11. The pod opener 14 is configured to place the pod 9 thereon and to be able to open and close the lid of the pod 9.

[0015] A pod transfer mechanism (container transfer mechanism) 15 is installed between the load port 8, the rotary pod shelf 11, and the pod opener 14 and is configured to transfer the pod 9 between the load port 8, the rotary pod shelf 11, and the pod opener 14.

[0016] A sub-housing 16 is provided at a lower portion at a substantially central part in the front-rear direction inside the housing 2 so as to extend across the rear end. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 19 for loading and unloading the wafer (substrate) 18 into and out of the sub-housing 16 are formed in the front wall 17 of the sub-housing 16.

[0017] The pod opener 14 includes a mounting table 21 for mounting the pod 9 and an opening / closing mechanism 22 for opening and closing the lid of the pod 9. The pod opener 14 is configured to open and close the wafer inlet / outlet of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 with the opening / closing mechanism 22.

[0018] The sub housing 16 forms a transfer chamber 23 that is airtight from the space (pod transfer space) where the pod transfer mechanism 15 and the rotary pod rack 11 are disposed. A wafer transfer mechanism (substrate transfer mechanism) 24 is installed in the front region of the transfer chamber 23, and a predetermined number (five in FIG. 2) of wafers 18 to be placed by the wafer transfer mechanism 24 can move linearly in the horizontal direction, rotate in the horizontal direction, or move up and down. The wafer transfer mechanism 24 is configured to load and unload the wafers 18 with respect to a boat (substrate holder) 26.

[0019] A standby section 27 for accommodating and waiting for the boat 26 is formed in the rear region of the transfer chamber 23, and a vertical processing furnace 28 is provided above the standby section 27. Note that the processing chamber 29 is also referred to as a processing container and is an example of the "substrate processing section" in the present embodiment.

[0020] Next, the operation of the substrate processing apparatus 1 will be described.

[0021] When the pod 9 is supplied to the load port 8, the pod loading / unloading port 6 is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the inside of the housing 2 by the pod transfer mechanism 15 through the pod loading / unloading port 6 and placed on the designated shelf board 13 of the rotary pod rack 11. After being temporarily stored in the rotary pod rack 11, the pod 9 is transported from the shelf board 13 to one of the pod openers 14 by the pod transfer mechanism 15 and transferred to the mounting table 21, or directly transferred from the load port 8 to the mounting table 21.

[0022] The pod 9, placed on the mounting platform 21, has its open end face pressed against the opening edge of the wafer loading / unloading port 19 on the front wall 17 of the sub-housing 16, and the lid is removed by the opening / closing mechanism 22, opening the wafer entrance / exit.

[0023] When pod 9 is opened by the pod opener 14, the wafer transfer mechanism 24 removes the wafer 18 from pod 9, transports it to the standby unit 27, and loads (charges) it into the boat 26.

[0024] Once a predetermined number of wafers 18 are loaded into the boat 26, the furnace opening of the processing furnace 28, which had been closed by the furnace opening shutter 31, is opened by the furnace opening shutter 31. Subsequently, the boat 26 is raised by the boat elevator 32 and loaded into the processing chamber 29.

[0025] After loading, the furnace opening is hermetically sealed by the seal cap 34. In this embodiment, at this timing (after loading), there is a purging process (pre-purging process) in which the processing chamber 29 is replaced with an inert gas.

[0026] The processing chamber 29 is evacuated by a vacuum pump (not shown) to achieve the desired pressure (vacuum level). The processing chamber 29 is also heated to a predetermined temperature by a heater (not shown) to achieve the desired temperature distribution.

[0027] Furthermore, a gas supply unit (not shown) supplies a processing gas controlled to a predetermined flow rate. As the processing gas flows through the processing chamber 29, it comes into contact with the surface of the wafer 18, and a predetermined process is performed on the surface of the wafer 18. After the reaction, the processing gas is exhausted from the processing chamber 29 by a gas exhaust mechanism (not shown). The term "processing gas" here refers to the gas supplied into the processing chamber 29. These terms are also used in the following explanation.

[0028] Once the pre-set processing time has elapsed, inert gas is supplied from an inert gas supply source (not shown), replacing the processing chamber 29 with inert gas and returning the pressure in the processing chamber 29 to atmospheric pressure (after-purge process). Then, the boat 26 is lowered via the seal cap 34 by the boat elevator 32. The processing time referred to here means the time during which the processing is continued. These terms are also used in the following explanation.

[0029] For the removal of the processed wafers 18, the wafers 18 and pods 9 are discharged to the outside of the housing 2 in the reverse procedure of the above description. Unprocessed wafers 18 are then loaded into the boat 26, and the batch processing of wafers 18 is repeated. Alternatively, the pods 9 containing the processed wafers 18 may be temporarily stored on the rotating pod shelf 11, and then transported from the shelf 13 to the load port 8 by the pod transport mechanism 15 and discharged to the outside of the housing 2.

[0030] As shown in Figures 1 and 2, the substrate processing apparatus 1 includes a control device 100. The control device 100 controls the substrate processing apparatus 1. The control device 100 may be built into the substrate processing apparatus 1, or it may be provided externally so as to be accessible from the substrate processing apparatus 1.

[0031] Next, with reference to Figure 3, the configuration of the control system of the substrate processing apparatus 1 according to this embodiment will be described. Figure 3 is a block diagram showing an example of the functional configuration of the control device 100 provided in the substrate processing apparatus 1 according to this embodiment.

[0032] As shown in Figure 3, the substrate processing apparatus 1 comprises a control device (main controller) 100, an external communication unit 201, an external storage unit 202, an operation unit 203, a display unit 204, a process control unit 205, and a transport control unit 206.

[0033] Furthermore, the control device 100 includes a control unit 101, a storage unit 104, and an I / O port 105. The control unit 101 includes a CPU (Central Processing Unit) 102, RAM (Random Access Memory) 103, a determination unit 106, an acquisition unit 107, and a determination condition setting unit 108. Although the determination unit 106, acquisition unit 107, and determination condition setting unit 108 are shown as functions of the control unit 101, they may be implemented as separate functions from the control unit 101.

[0034] The control device 100 is connected to the operation unit 203, and the process control unit 205 and the transport control unit 206 are connected via the I / O port 105. Since the control device 100 is electrically connected to each of the process control unit 205 and the transport control unit 206 via the I / O port 105, it is configured to enable the transmission and reception of various data, as well as the download and upload of various files.

[0035] The control device 100 is connected to an external host computer (not shown) via an external communication unit 201. Therefore, even if the substrate processing device 1 is installed in a cleanroom, the host computer can be located in an office or other location outside the cleanroom. The control device 100 is also connected to an external storage unit 202, which serves as a mounting unit for inserting and removing recording media such as a USB (Universal Serial Bus) memory.

[0036] The operation unit 203 has an integrated display unit 204, or is connected to the display unit 204 via a video cable or the like. The display unit 204 is, for example, a liquid crystal display panel. The display unit 204 is configured to display various operation screens for operating the substrate processing apparatus 1. The operation screens include screens for checking the status of the substrate processing system controlled by the process control unit 205 and the substrate transport system controlled by the transport control unit 206. The display unit 204 can also be provided with operation buttons that serve as input units for inputting operation instructions to the substrate processing system and the substrate transport system via the operation unit 203. The operation unit 203 displays information generated within the substrate processing apparatus 1 on the display unit 204 via the operation screens. The operation unit 203 also outputs the information displayed on the display unit 204 to a device such as a USB memory inserted into the external storage unit 202. The operation unit 203 receives input data (input instructions) from the operation screens displayed on the display unit 204 and transmits the input data to the control device 100. Furthermore, the operation unit 203 receives instructions (control instructions) to execute any board processing recipe (also called a process recipe) from among the recipes deployed in the RAM 103 or the multiple recipes stored in the memory unit 104a, and transmits them to the control device 100. The operation unit 203 and the display unit 204 may be configured as touch panels. Here, the operation unit 203 and the display unit 204 are provided separately from the control device 100, but they may also be integrated into the control device 100. The display unit 204 is an example of a "notification unit" in this embodiment.

[0037] The process control unit 205 includes a temperature control unit 207, a gas flow control unit 208, a pressure control unit 209, and a valve control unit (not shown). The temperature control unit 207, gas flow control unit 208, pressure control unit 209, and valve control unit (not shown) each constitute a subcontroller and are electrically connected to the process control unit 205, enabling the transmission and reception of data and the download and upload of files. Although the process control unit 205 and each subcontroller (temperature control unit 207, gas flow control unit 208, and pressure control unit 209) are shown separately, they may be configured as an integrated unit.

[0038] The temperature control unit 207 is configured to control the processing temperature based on the measured value detected by the temperature sensor (not shown). Specifically, the temperature control unit 207 is configured to adjust the temperature inside the processing chamber 29 or the temperature of the wafer 18 by controlling the temperature of the heater (not shown). The processing temperature referred to here means the temperature of the wafer 18 or the temperature inside the processing chamber 29.

[0039] The gas flow control unit 208 is configured to adjust the flow rate of gas to the processing chamber 29 to a desired rate based on the measured value detected by the gas flow sensor (not shown).

[0040] The pressure control unit 209 is configured to control the processing pressure based on the pressure value detected by the pressure sensor (not shown). Specifically, the pressure control unit 209 is configured to control the switching (on / off) of the pressure regulator and the vacuum pump so that the pressure in the processing chamber 29 becomes a desired pressure at a desired timing. The processing pressure referred to here means the pressure inside the processing chamber 29.

[0041] A valve control unit (not shown) is configured to control the opening and closing operation of the valve according to the valve state set in the recipe.

[0042] The transport control unit 206 includes a rotating unit 210, a lifting unit 211, and a transport unit 212. Although the transport control unit 206, the rotating unit 210, the lifting unit 211, and the transport unit 212 are shown separately, they may be integrated into a single unit. The rotating unit 210 is the rotating system of the substrate processing apparatus 1 and consists of, for example, a pod transport mechanism 15, a wafer transfer mechanism 24, a rotating shaft 12 located at the center of the rotating pod rack 11, and a rotating mechanism (not shown). It is configured to control the operation of the rotating system based on the measured values ​​of a position sensor (not shown) and a torque sensor (not shown).

[0043] The lifting unit 211 is the lifting system of the substrate processing apparatus 1 and is configured to control the operation of the lifting system based on the measured values ​​of a position sensor (not shown) and a torque sensor (not shown). The transport unit 212 is the transport mechanism of the substrate processing apparatus 1 and is configured to control the operation of the transport mechanism based on the measured values ​​of a position sensor (not shown) and a torque sensor (not shown). The lifting unit 211 and the transport unit 212 are configured to control the transport operations of, for example, the boat elevator 32, the pod transport mechanism 15, and the wafer transfer mechanism 24, respectively.

[0044] In this embodiment, when referring to each temperature sensor, each gas flow sensor, each pressure sensor, each position sensor, and each torque sensor collectively, they are referred to as "various sensors provided by the substrate processing device 1." They may also simply be referred to as "sensors."

[0045] Furthermore, the control device 100, process control unit 205, and transport control unit 206 according to this embodiment can be implemented using a standard computer system, rather than a dedicated system. For example, each controller that performs the predetermined processing can be configured by installing the program for executing the above-mentioned processing from a recording medium (CD-ROM, USB, etc.) containing the program into a general-purpose computer.

[0046] Furthermore, the means for supplying these programs are arbitrary. In addition to being supplied via a predetermined recording medium as described above, they may also be supplied via, for example, communication lines, communication networks, and communication systems.

[0047] The control device 100 is configured as a computer equipped with a CPU 102, RAM 103, memory unit 104, and I / O ports 105. The memory unit 104 stores various recipe files, such as recipes that define processing conditions and processing procedures, control program files for executing these recipe files, parameter files (setting value files) for setting processing conditions and processing procedures, error handling program files and error handling parameter files, as well as various screen files including an input screen for entering process parameters, various icon files, etc. (none of which are shown). The control device 100 is connected to a network such as the Internet, LAN (Local Area Network), or WAN (Wide Area Network) using an external communication unit 201, and is capable of communicating with external devices via the network.

[0048] Furthermore, the storage unit 104 can be, for example, an HDD (Hard Disk Drive), an SSD (Solid State Drive), or flash memory. The storage unit 104 stores a program for executing the process of determining the reproducibility of the valve according to this embodiment.

[0049] The program may, for example, be pre-installed on the board processing device 1. The program may also be recorded on a non-volatile recording medium or distributed via a network and installed on the board processing device 1 as appropriate. Examples of non-volatile recording media include CD-ROMs, magneto-optical disks, HDDs, DVD-ROMs, flash memory, memory cards, and USB flash memory.

[0050] In other words, the program causes the computer to execute two procedures: one to edit a recipe that defines the processing conditions for the circuit board, and another to process the circuit board using the edited recipe.

[0051] In this embodiment, the CPU 102 of the substrate processing apparatus 1 functions as a control unit 101 including an acquisition unit 107 by writing a program stored in the storage unit 104 to the RAM 103 and executing it.

[0052] The processing furnace 28 then processes the substrate using a recipe that defines the processing conditions for the substrate.

[0053] The determination unit 106, in the reproducibility determination procedure described later, uses the determination items to determine whether or not the substrate stabilization process, or the substrate processing, is reproducible. The determination unit 106 may be provided as a function obtained by the CPU 102 executing a program, or it may be provided as a computer separate from the CPU 102. In this description, the determination unit 106 will be described as a function obtained by the CPU 102 executing a program.

[0054] The acquisition unit 107 acquires specific measured values ​​of a plurality of predetermined judgment items in the statistical calculation procedure and the reproducibility judgment procedure described later. More specifically, the acquisition unit 107 acquires measured values ​​measured by the temperature sensor of the temperature control unit 207, the gas flow rate of the gas flow rate control unit 208, the pressure sensor of the sensor pressure control unit 209, etc. The acquisition unit 107 may be provided as a function obtained by the CPU 102 executing a program, or it may be provided as a computer separate from the CPU 102. In this description, the acquisition unit 107 will be described as a function obtained by the CPU 102 executing a program.

[0055] The judgment condition setting unit 108 sets a range of thresholds for determining whether the substrate is reproducible for each judgment item in the statistical calculation procedure described later. The judgment condition setting unit 108 may be provided as a function obtained by the CPU 102 executing a program, or it may be provided as a separate computer from the CPU 102. In this description, the judgment condition setting unit 108 will be described as a function obtained by the CPU 102 executing a program.

[0056] (Screen for setting judgment and learning conditions) As shown in Figure 4, the display unit 204 can display a judgment condition and learning condition setting screen 300 for setting conditions that will be referenced in the statistical calculation procedure and the reproducibility judgment procedure described later. The judgment condition and learning condition setting screen 300 displays the following judgment conditions: the judgment target content name field 301, the judgment target recipe name field 302, the judgment start step name field 303, the judgment target processing container field 304, the judgment target execution processing type field 305, and the loop count field 306.

[0057] The "Content to be judged" field 301 displays the name of the content to be judged for reproducibility. The "Recipe to be judged" field 302 displays the name of the recipe to be judged for reproducibility. The "Start step to be judged" field 303 displays the name of the step to be judged for reproducibility. The "Processing container to be judged" field 304 displays the processing chamber 29 to be judged for reproducibility. The "Processing type to be judged" field 305 displays the type of processing selected by the user, specifically one of film deposition, maintenance, or pre-maintenance. The "Loop count" field 306 displays the specified number of steps in the specified step sequence.

[0058] Furthermore, as shown in Figure 4, the display unit 204 can display a judgment condition and learning condition setting screen 300 for setting conditions that will be referenced in the statistical calculation procedure and the reproducibility judgment procedure described later. The judgment condition and learning condition setting screen 300 displays the following judgment conditions: sensor name field 311, stability judgment method field 312, stability judgment upper limit field 313, stability judgment lower limit field 314, stability judgment duration field 315, area judgment upper limit field 316, area judgment lower limit field 317, and area division number field 318, which indicate the criteria for judging reproducibility.

[0059] The Sensor Name field 311 is where the name identifying the sensor measuring the target value in the selected judgment method is entered. The Stability Judgment Method field 312 is where the range of sensor values ​​set in the Sensor Name field 311 is entered. In the Stability Judgment Method field 312, as an example, the ratio to the set value, the ratio to the full scale of the sensor being measured, and the deviation amount from the set value are selected and entered. The Stability Judgment Upper Limit field 313 is where the upper limit of the range according to the selected judgment method is entered. The Stability Judgment Lower Limit field 314 is where the lower limit of the range according to the selected judgment method is entered. Note that negative values ​​may be entered in the Stability Judgment Upper Limit field 313 and the Stability Judgment Lower Limit field 314. The Stability Judgment Duration field 315 is where the period until the measured value is judged to be stable is entered. In the Stability Judgment Duration field 315, as an example, 500ms to 3000ms is entered in 100ms increments. The Area Judgment Upper Limit field 316 is where the upper limit of the cumulative amount of measured values ​​acquired from the start of judgment until it is judged to be stable is entered. The area determination lower limit field 317 is where the lower limit of the cumulative amount of measured values ​​obtained from the start of the determination until it is determined to be stable is entered. The area division number field 318 is where the divisions from the start of the determination until it is determined to be stable are entered.

[0060] In this specification, numerical ranges such as "500ms to 3000ms" indicate that the lower and upper limits are included within that range. Therefore, for example, "500ms to 3000ms" means "500ms or more and 3000ms or less." The same applies to other numerical ranges.

[0061] The range of values ​​defined in the stability judgment upper limit field 313 and the stability judgment lower limit field 314 is an example of the "threshold range" in this embodiment. In other words, the range of acceptable values ​​for each judgment method is entered on the judgment condition and learning condition setting screen 300. The acceptable values ​​may be defined by setting only an upper limit or only a lower limit.

[0062] In addition, the display unit 204 also displays the following learning conditions: the required number of learning attempts field 319, the presence or absence of alarm notification 321, the confirmation button for setting the judgment condition 322, and the cancellation button for setting the judgment condition 323. The required number of learning attempts field 319 is where the number of learning attempts required to set the judgment condition is entered. The presence or absence of alarm notification 321 is where the user selects whether or not to receive an alarm notification if the reproducibility judgment is NG. If the user selects the confirmation button for setting the judgment condition 322, the learning conditions for the judgment condition being entered are confirmed. On the other hand, if the user selects the cancellation button for setting the judgment condition 323, the learning conditions for the judgment condition being entered are canceled.

[0063] Incidentally, with respect to the substrate processing apparatus 1, the reproducibility of the substrate processing process is considered important for manufacturing semiconductor devices. As an example, as shown in Figure 5, it is desirable that the graph showing the relationship between the flow rate of the processing gas and the elapsed time in the substrate processing process be the same for each substrate processing process.

[0064] More specifically, regarding the flow rate of the process gas, as shown in Figure 5(A), these include the magnitude of the flow rate at the start of the step ("Condition 1" in the figure), the time until the flow rate of the process gas stabilizes ("Condition 2" in the figure), the total flow rate of the process gas that has flowed until the flow rate stabilizes ("Condition 3" in the figure), and the total flow rate for each section that divides the time until the flow rate stabilizes ("Condition 4" to "Condition 7" in the figure). Furthermore, as shown in Figure 5(B), regarding the pressure to which the process gas is supplied, these include the time until the pressure to which the process gas is supplied stabilizes ("Condition 8" in the figure), and the fluctuation in the opening degree of the APC valve during a predetermined period after the flow rate of the process gas has stabilized ("Condition 9" in the figure). Note that the APC valve is an example of a "gas release valve" in this embodiment.

[0065] Furthermore, for each of the conditions from Condition 1 to Condition 9, as explained in Figure 5, the judgment criteria are defined as shown in Figure 6. More specifically, as shown in the "Judgment Range" column in Figure 6, the conditions under which a condition is judged to be stable in the judgment procedure described later are defined. In other words, Figure 6 shows the range of conditions under which a condition is judged to be stable in the judgment procedure, using statistical quantities defined for the reference value.

[0066] As shown in Figures (A) and (B) of Figure 5, respectively, the flow rate of the processed gas and the pressure of the processed gas are the names of the content used to determine reproducibility, as shown in Figure 4. Furthermore, conditions 1 to 9 in Figures 5 and 6 are the judgment conditions and the values ​​specifically set for them, as shown in Figure 4. In the above explanation, the time periods targeted by conditions 2 and 8 were set separately, but in this embodiment, the time periods targeted by conditions 2 and 8 may be the same. For example, the time period targeted by condition 8 may be set based on the time period targeted by condition 2.

[0067] Furthermore, the statistical quantities set in the "Judgment Range" in Figure 6 are calculated using the statistical quantity calculation procedure described later. The specific calculation procedure will be described later.

[0068] Next, referring to Figure 7, we will explain the specific procedure for calculating the statistics to be set within the judgment range.

[0069] (Procedure for calculating statistics) As described above, in the substrate processing apparatus 1 of this embodiment, reproducibility is determined using statistical quantities for each item shown in Figures 4 to 6. Figure 7 shows a specific method for calculating the statistical quantities. The procedure shown in Figure 7 is executed when the CPU 102 reads the program stored in the memory unit 104.

[0070] First, in step S102, the CPU 102 reads the setting conditions. More specifically, as shown in Figure 4, the CPU 102 reads the calculation conditions for each judgment item shown in Figure 6, which have been selected by the user. Then the CPU proceeds to step S104.

[0071] Next, in step S104, the CPU 102 begins acquiring data (measured values) from various sensors. In other words, the CPU 102 begins measuring the state of each component of the substrate processing device 1 from the sensors. Then the CPU 102 proceeds to step S104.

[0072] Next, in step S106, the CPU 102 executes the board (batch) processing. More specifically, the CPU 102 executes the process of processing the board once by controlling each component of the board processing apparatus 1. As measurement is started in step S104, the CPU 102 measures various data related to the board (batch) processing while performing the board (batch) processing in step S106. Then the CPU 102 proceeds to step S108.

[0073] Next, in step S108, the CPU 102 terminates the acquisition of data from the various sensors. In other words, the CPU 102 terminates the measurement of the state of each component of the substrate processing device 1 from the sensors. Then the CPU 102 proceeds to step S110.

[0074] Next, in step S110, the CPU 102 stores the data from the rising edge of the measured sensor data in the RAM 103. More specifically, as shown in Figure 5, the CPU 102 stores in the RAM 103 data for a predetermined period, which is a specific section defined as rough tightening, from the start of the step of supplying processing gas to the processing chamber 29 in the substrate processing process. To rephrase the description of this embodiment, the CPU 102 receives user commands, including a monitoring start trigger and a monitoring end trigger. The length of the predetermined period can be set by the user, for example, in the judgment condition and learning condition setting screen 300 shown in Figure 4. Then the CPU 102 proceeds to step S112.

[0075] Next, in step S112, the CPU 102 determines whether the board (batch) processing has been executed a predetermined number of times. More specifically, if the number of times steps S104 to S110 have been executed is less than a predetermined number, that is, the number set in the learning requirement column 319 in Figure 4, the CPU 102 makes a negative determination in step S112; otherwise, it makes a positive determination. If the CPU 102 makes a negative determination in step S112, it proceeds to step S104. On the other hand, if the CPU 102 makes a positive determination in step S112, it proceeds to step S114.

[0076] Then, in step S114, the CPU 102 calculates the average value of the stabilization time of the processed gas. More specifically, the CPU 102 calculates the average value of the stabilization time of the flow rate of the processed gas based on the measurement data from step S110, which has been performed a predetermined number of times. In other words, as shown in condition 2 in Figures 5 to 6, the CPU 102 in this embodiment calculates the average value and standard deviation of the time required for the flow rate of the processed gas to stabilize. Similarly, as shown in condition 8 in Figures 5 to 6, the CPU 102 also calculates the average value and standard deviation of the time required for the pressure of the processed gas to stabilize. Note that "average value" and "standard deviation" are examples of "statistics" in this disclosure. Then, the CPU 102 proceeds to step S116.

[0077] Next, in step S116, the CPU 102 calculates the mean and standard deviation of the other items. More specifically, for example, for condition 3, the CPU 102 determines the period based on the mean value of condition 2 calculated in step S114. Then, for each measurement data, the CPU 102 calculates the total flow rate of the processed gas and its standard deviation during that period. In other words, for condition 3, the CPU 102 measures the mean and standard deviation based on the statistics of condition 2. The CPU 102 also measures the mean and standard deviation for conditions 4 through 7 and condition 9 based on the statistics of condition 2 or condition 8. For condition 1, the CPU 102 simply measures the mean and standard deviation based on the start time of the step. Then the CPU 102 moves on to step S118.

[0078] Next, in step S118, the CPU 102 stores the calculation results obtained in step S116 in the storage unit 104. In other words, in step S118, the CPU 102 stores the range shown in Figure 6, i.e., the statistical quantities, in the storage unit 104. To rephrase the description of this embodiment, the CPU 102 performs the task of determining the statistical quantities for each of the multiple judgment items during the monitoring period. After that, the CPU 102 completes the statistical quantity calculation procedure.

[0079] In this embodiment, the procedure for calculating the statistics is a procedure that is performed in advance of the reproducibility determination procedure described below. In other words, the procedure in step S106 of the procedure for calculating the statistics is substrate processing for the number of times set in the learning requirement column 319. The substrate processed in the procedure for calculating the statistics may be a substrate actually used in the manufacture of semiconductor devices, or it may be a substrate not actually used in the manufacture of semiconductor devices.

[0080] Next, referring to Figure 8, we will explain the specific decision procedure for determining the reproducibility of the processing steps based on the statistical quantities calculated in the statistical calculation procedure, which are set within the judgment range.

[0081] (Procedure for determining reproducibility) As described above, in the substrate processing apparatus 1 of this embodiment, reproducibility is determined using statistical quantities for each item shown in Figures 4 to 6. Figure 8 shows the procedure for determining the reproducibility of a specific processing step. The procedure shown in Figure 8 is executed when the CPU 102 reads the program stored in the memory unit 104.

[0082] First, in step S152, the CPU 102 obtains the judgment conditions. More specifically, as shown in Figures 4 to 6, the CPU 102 reads from the storage unit 104 the judgment items selected by the user for determining the restriction, and the statistical amounts stored in step S118. Then the CPU 102 proceeds to step S154.

[0083] Next, in step S154, the CPU 102 starts acquiring data from various sensors. In other words, the CPU 102 starts measuring the state of each component of the substrate processing device 1 from the sensors. Then the CPU 102 proceeds to step S154.

[0084] Next, in step S156, the CPU 102 executes batch processing. More specifically, the CPU 102 executes the process of processing the substrate by controlling each component of the substrate processing apparatus 1 once. As measurement is started in step S154, the CPU 102 measures various data related to the batch processing while performing batch processing in step S156. Then the CPU 102 proceeds to step S158.

[0085] Next, in step S158, the CPU 102 terminates the acquisition of data from the various sensors. In other words, the CPU 102 terminates the measurement of the state of each component of the substrate processing device 1 from the sensors. Then the CPU 102 proceeds to step S160.

[0086] Next, in step S160, the CPU 102 sets the judgment items. More specifically, the CPU 102 sets one of the conditions from "Condition 1" to "Condition 9" shown in Figures 5 to 6 as the item to be judged for reproducibility. Then the CPU 102 proceeds to step S162.

[0087] Next, in step S162, the CPU 102 determines whether the judgment item is within the judgment range. More specifically, for the judgment item set in step S160, the CPU 102 makes a positive judgment if the results measured in steps S154 to S158 fall within the judgment range shown in Figure 6, and a negative judgment otherwise.

[0088] More specifically, the CPU 102 determines that the flow rate stabilization time of the processed gas is stable when at least one of the following conditions is met: ±a% of the set value or ±b% of the maximum flow rate, as shown in condition 2 of Figure 6. Similarly, the CPU 102 determines that the pressure stabilization time of the processed gas is stable when it meets ±3σ of the mean value (σ is the standard deviation), as shown in condition 8 of Figure 6. Note that the values ​​a and b in Figure 6 and above are values ​​arbitrarily set by the user as the upper limit value column 313 and the lower limit value column 314 for stability judgment.

[0089] To rephrase the description of this embodiment, the CPU 102 determines the reproducibility of the substrate processing process for the processed substrate based on the state of the process during the monitoring period included in the substrate processing process performed on the processed substrate, and a number of statistical quantities. If the CPU 102 makes a positive determination in step S162, it proceeds to step S164. On the other hand, if the CPU 102 makes a negative determination in step S162, it proceeds to step S166.

[0090] Then, in step S164, the CPU 102 determines whether or not all judgment items have been judged. More specifically, as a condition for judging reproducibility, the CPU 102 makes an affirmative judgment if the judgment in step S162 has been performed for each item shown in Figures 4 to 6, and a negative judgment otherwise. If the CPU 102 made an affirmative judgment in step S164, it proceeds to step S166. On the other hand, if the CPU 102 made a negative judgment in step S164, it proceeds to step S158.

[0091] Next, in step S166, the CPU 102 notifies the user of the judgment result. More specifically, in step S162, the CPU 102 displays the result of the judgment for each judgment item on the display unit 204. After that, the CPU 102 terminates the reproducibility judgment procedure.

[0092] Incidentally, in step S162, the CPU 102 makes a negative determination if it determines that any of the judgment items are not within the judgment range. In other words, from step S162 to step S164, the CPU 102 determines that the board is reproducible if all of the measured values ​​obtained in the board processing are within the threshold range for each judgment item. In other words, the CPU 102 determines that the board is not reproducible if at least one of the measured values ​​obtained in the board processing is outside the threshold range for each judgment item.

[0093] Furthermore, Figure 9 shows an example of a display screen that the CPU 102 notifies the user of in step S166. The display unit 204 is capable of displaying the judgment result list screen 330 shown in Figure 9(A) and the judgment result details screen 340 shown in Figure 9(B).

[0094] The judgment result list screen 330 displays the judgment result 331, the details button 332, and the relearn button 333. The judgment result 331 shows the judgment items and their results determined in step S162. The judgment result 331 also displays the setting items that were determined not to be included in the setting range from among multiple setting items. In other words, the CPU 102 notifies the user of the items that were determined to be negative in step S162.

[0095] Furthermore, in the judgment result 331, the user can select the judgment item determined in step S162. When the user presses the details button 332, the judgment result details screen 340, which shows the details of the judgment result for the judgment item selected by the user, is displayed on the display unit 204.

[0096] The detailed judgment result screen 340 displays the judgment result 341, detailed information 342, and a close button 343. The judgment result 341 shows the judgment result 331 selected by the user on the judgment result list screen 330. The detailed information 342 displays, for example, the sensor name, judgment item name, and step name. The detailed information 342 also includes, for example, the judgment range related to the judgment item. When the user presses the close button 343, the display unit 204 displays the judgment result list screen 330 again.

[0097] Furthermore, in the substrate processing apparatus 1 of this embodiment, if the user presses the relearn button 333 on the judgment result list screen 330, the statistical calculation procedure is executed again. In other words, the user can execute the statistical calculation procedure at any time to redo the calculation of the statistical quantities. Examples of any arbitrary time include the time after periodic maintenance set for each predetermined number of uses of the substrate processing apparatus 1, or the time after the configuration of the substrate processing apparatus 1 has been changed.

[0098] Furthermore, although the above explanation describes the procedure for calculating statistics and the procedure for determining reproducibility consecutively, these procedures do not necessarily have to be performed consecutively. In other words, the procedure for calculating statistics and the procedure for determining reproducibility are performed by the user as separate procedures.

[0099] According to this disclosure, one or more of the following actions and effects can be obtained.

[0100] (Mechanism of Action and Effects) In the substrate processing apparatus 1 of this embodiment, the CPU 102 acquires measurement values ​​of multiple different judgment items that can determine whether or not the processing of the substrate is reproducible. As a result, the substrate processing apparatus 1 of this embodiment reduces the possibility of making a mistake in judging reproducibility compared to when the range in which measurement values ​​are acquired is fixed.

[0101] Furthermore, the substrate processing apparatus 1 in this embodiment can reduce the data acquisition load compared to the case where the measured values ​​of the measurement items are acquired and monitored throughout the entire processing step.

[0102] Furthermore, according to the substrate processing apparatus 1 in this embodiment, the CPU 102 notifies the user of the reproducibility of the substrate processing process. Therefore, with the substrate processing apparatus 1 according to this embodiment, the user can easily recognize that the reproducibility of the substrate processing apparatus 1 has been lost when the reproducibility of the substrate processing process is lost. In other words, the substrate processing apparatus 1 according to this embodiment can make the user aware that a malfunction has occurred in the substrate processing apparatus 1.

[0103] Furthermore, the substrate processing apparatus 1 in this embodiment includes a display unit 204 and an operation unit 203. Therefore, according to the substrate processing apparatus 1 in this embodiment, the user is made to clearly recognize the conditions for each judgment item by displaying the judgment condition and learning condition setting screen 300, so that the user can set the correct judgment conditions.

[0104] Furthermore, the substrate processing apparatus 1 in this embodiment displays a judgment result list screen 330 and a judgment result details screen 340. Therefore, with the substrate processing apparatus 1 according to this embodiment, the user can recognize which judgment item has an abnormality.

[0105] Furthermore, the substrate processing apparatus 1 in this embodiment displays a relearning button 333 on the judgment result list screen 330. Therefore, according to the substrate processing apparatus 1 in this embodiment, the user can easily perform the calculation of statistical quantities by executing the statistical quantity calculation procedure at any time.

[0106] Furthermore, according to the substrate processing apparatus 1 in this embodiment, the CPU 102 determines the reproducibility of the substrate processing process for each of the multiple determination items and notifies the user of the determination items for which reproducibility has been denied. Therefore, with the substrate processing apparatus 1 according to this embodiment, the user can easily recognize the configuration of the substrate processing apparatus 1 where a malfunction is occurring. In other words, the substrate processing apparatus 1 according to this embodiment makes it easier for the user to identify the location of the malfunction in the substrate processing apparatus 1 and to restore the substrate processing apparatus 1 to a state in which reproducibility can be obtained.

[0107] <Other Embodiments> In the above description, the substrate processing apparatus 1 was assumed to include a display unit 204. However, the configuration of the substrate processing apparatus 1 in this embodiment is not limited to this, as long as it has a function to notify the user. For example, instead of the display unit 204, a warning light or alarm may be used to notify the user visually or audibly. Alternatively, the apparatus may simply stop the substrate processing process without notifying the user.

[0108] Furthermore, in the above description, the determination was made based on multiple determination items, focusing on the point in time when the supply of processing gas is started during the substrate processing process. The configuration of the substrate processing apparatus 1 in this embodiment is not limited to this. For example, the CPU 102 may be configured to make determinations regarding the period during which the processing gas is supplied stably (i.e., the period after the flow rate of the processing gas has stabilized) and the timing of stopping the supply of the processing gas in order to determine the reproducibility of the substrate processing.

[0109] In the above description, a substrate processing apparatus according to the embodiment was used as an example, but the embodiment may also be in the form of a program that causes a computer to execute the functions of the substrate processing apparatus. The embodiment may also be in the form of a non-temporary recording medium that is readable by a computer that stores these programs.

[0110] Furthermore, the configuration of the substrate processing apparatus described in the above embodiment is merely an example, and may be modified as needed without departing from the main purpose.

[0111] Furthermore, the program processing flow described in the above embodiment is just one example, and unnecessary steps may be deleted, new steps added, or the processing order rearranged, as long as it does not deviate from the main purpose.

[0112] Furthermore, although the above embodiment describes a case in which the process according to the embodiment is realized by a software configuration using a computer by executing a program, the embodiment is not limited to this. The embodiment may also be realized by a hardware configuration or a combination of a hardware configuration and a software configuration.

[0113] In the above embodiments, an example of forming a film using a batch-type substrate processing apparatus that processes multiple substrates at once was described. This disclosure is not limited to the above embodiments and can be suitably applied, for example, when forming a film using a single-wafer substrate processing apparatus that processes one or several substrates at once. Furthermore, in the above embodiments, an example of forming a film using a substrate processing apparatus having a hot-wall type processing furnace was described. This disclosure is not limited to the above embodiments and can be suitably applied when forming a film using a substrate processing apparatus having a cold-wall type processing furnace.

[0114] Even when using these substrate processing devices, each process can be performed using the same processing procedures and conditions as in the above embodiment, and the same effects as in the above embodiment can be obtained. [Explanation of Symbols]

[0115] 1. Substrate processing apparatus 18 wafers (substrates) 106 Judgment section 108 Judgment Condition Setting Unit

Claims

1. A substrate processing unit for processing substrates, A gas supply unit supplies a gas for processing the substrate to the substrate processing unit, An acquisition unit that performs the processing of the substrate a predetermined number of times and acquires measurement values ​​in a predetermined specific interval during the processing of each substrate, A judgment condition setting unit sets threshold values ​​for each of a plurality of predetermined judgment items based on the measured values ​​acquired by the acquisition unit, In the processing of the substrate after setting the threshold, a determination unit determines whether the acquired measured value falls within the range of the threshold for each of the determination items, and determines whether the processing of the substrate is reproducible. A substrate processing apparatus equipped with the following:

2. The aforementioned multiple determination items include the starting flow rate at the time the gas inflow to the substrate processing unit begins, The substrate processing apparatus according to claim 1.

3. The aforementioned multiple determination items include the flow rate stabilization time from the start of gas inflow into the substrate processing unit until the flow rate stabilizes, The substrate processing apparatus according to claim 1.

4. The aforementioned multiple determination items include the total flow rate for stable flow, which is the total amount of gas flowing into the substrate processing unit from the start of the gas flow until the flow rate stabilizes. The substrate processing apparatus according to claim 1.

5. The aforementioned flow rate stabilization time is when at least one of the following conditions is met: a predetermined range condition for the gas flow rate set value, a maximum flow rate range condition, etc. The substrate processing apparatus according to claim 3.

6. The aforementioned multiple determination items include the total flow rate per unit time of the flow rate stabilization time from the start of gas inflow into the substrate processing unit until the flow rate stabilizes, The substrate processing apparatus according to claim 1.

7. The aforementioned multiple determination items include the pressure stabilization time from the start of gas inflow into the substrate processing unit until the gas pressure stabilizes, The substrate processing apparatus according to claim 1.

8. The aforementioned multiple determination items include the opening stabilization time from the start of gas inflow into the substrate processing unit until the opening of the gas discharge valve stabilizes. The substrate processing apparatus according to claim 1.

9. The determination unit determines that the processing of the substrate is reproducible when all of the measured values ​​obtained in the specific interval are within the threshold range for each of the determination items. The substrate processing apparatus according to claim 1.

10. The determination unit determines that the processing of the substrate is not reproducible if at least one of the acquired measured values ​​is outside the threshold range for each of the determination items. The substrate processing apparatus according to claim 1.

11. The determination unit further includes a notification unit that notifies the user if it determines that the processing of the substrate is not reproducible. A substrate processing apparatus according to claim 1.

12. The notification unit notifies the user of any of the multiple determination items that are not included within the threshold range. A substrate processing apparatus according to claim 11.

13. A display unit that displays a setting screen including at least the judgment conditions for the plurality of judgment items and the number of processing times for the board that sets the threshold, An operation unit for setting at least one of the judgment item, the judgment condition, and the number of processing cycles for the board displayed by the display unit, The substrate processing apparatus according to claim 1, further comprising:

14. The display unit displays a determination result display screen that includes at least one of the determination item, the determination condition, and the determination result of the determination unit. The substrate processing apparatus according to claim 13.

15. The judgment result display screen includes a relearning button for resetting the threshold, The acquisition unit acquires the measured values ​​in a predetermined specific interval from the measured values ​​reported during the processing of the board a predetermined number of times after the relearning button operation. The determination condition setting unit resets the threshold value based on the acquired measurement value. The substrate processing apparatus according to claim 14.

16. A step of supplying a gas for processing the substrate to the substrate processing unit and processing the substrate, The process of processing the substrate is performed a predetermined number of times, and the measurement values ​​are obtained in a predetermined specific interval during the processing of the substrate. The process involves setting threshold values ​​for each of a predefined set of judgment items from the acquired measurement values, In the processing of the substrate after setting the threshold, the process includes determining whether the acquired measurement value falls within the range of the threshold for each of the judgment items, and determining whether the processing of the substrate is reproducible. A determination method comprising the following:

17. The determination method described in claim 13 determines the reproducibility of the process for processing the substrate. A method for manufacturing a semiconductor device.

18. A procedure for supplying a gas to process the substrate to a substrate processing unit and processing the substrate, A procedure for performing the process of processing the substrate a predetermined number of times, and obtaining measurement values ​​in a predetermined specific interval during the processing of the substrate, A procedure for setting thresholds for each of a predefined set of judgment items from the acquired measurement values, In the processing of the substrate after setting the threshold, a procedure is performed to determine whether the acquired measurement value falls within the range of the threshold for each of the judgment items, and to determine whether the processing of the substrate is reproducible. A program that causes a circuit board processing unit to execute commands via a computer.

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