Electronic circuit module and method for manufacturing the same

Abstract

To provide an electronic circuit module that effectively utilizes the shielding layer's function while enhancing reliability. [Solution] Module 1 comprises a main body 10, a plurality of conductor layers 50, an electronic component 21 mounted on the first surface 10A of the main body 10, a protective layer 30, and a shielding layer 40. The protective layer 30 includes a first covering portion 31 that covers the electronic component 21 and the first surface 10A, and a second covering portion that covers the sides 10E and 10F of the main body 10. The shielding layer 40 includes a first conductor portion 41 that covers the electronic component 21 and the first covering portion 31, and second conductor portions 44 and 45 that cover the main body 10 and the second covering portion. The plurality of conductor layers 50 include connecting electrodes 51 and 52 connected to the second conductor portions 44 and 45.

Description

Technical Field

[0001] The present technology relates to an electronic circuit module in which an electronic component mounted on a main body such as a circuit board is covered with a protective layer, and a method for manufacturing the same.

Background Art

[0002] In recent years, in electronic devices such as smartphones and personal computers, multifunctionalization and miniaturization have advanced, and along with this, the density of mounting of electronic circuit modules (hereinafter, also simply referred to as modules) has been increasing. As a result, in electronic devices, the interval between a plurality of modules mounted on a mounting board has been decreasing. In order to prevent malfunction due to noise, it is preferable to use a module provided with a shield on its surface.

[0003] Patent Document 1 discloses a circuit device in which a shield layer is provided on the upper surface of an insulating resin that covers a circuit element. In this circuit device, the shield layer is connected to an external electrode formed on the back surface side of the insulating resin via a metal film and a conductive pattern provided in a through hole formed in the insulating resin. The conductive pattern that is electrically connected to the shield layer is a conductive pattern having a ground potential.

[0004] Patent Document 2 discloses a semiconductor device in which a semiconductor chip is mounted on a substrate, the semiconductor chip is covered with a sealing resin layer, and the surface of the sealing resin layer and the side surface of the substrate are covered with a shield layer. In this semiconductor device, the shield layer is connected to an external connection terminal via a wiring layer provided on the substrate, and is grounded via the wiring layer and the external connection terminal.

[0005] Patent Document 3 discloses an electronic circuit module in which a semiconductor die is mounted on a substrate and the semiconductor die is covered with a first encapsulant. In this electronic circuit module, the substrate and the first encapsulant are covered with a non-conductive second encapsulant. A conductive layer extending in the vertical and horizontal directions is formed on the substrate.

Prior Art Documents

Patent Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2004-119863 [Patent Document 2] Japanese Patent Publication No. 2015-115549 [Patent Document 3] U.S. Patent No. 11,222,793 [Overview of the project] [Problems that the invention aims to solve]

[0007] To improve the reliability of modules and electronic devices, it is preferable to protect not only the electronic components but also the circuit board, as is the case with the electronic circuit module disclosed in Patent Document 3. Here, we consider providing a shielding layer to an electronic circuit module that is entirely covered with a encapsulating material, as is the case with the electronic circuit module disclosed in Patent Document 3. In order for the shielding layer to function effectively, it is preferable to connect the shielding layer to ground, as is the case with the technology disclosed in Patent Documents 1 and 2. However, when the entire module is covered with a encapsulating material, it is not possible to connect the shielding layer to ground.

[0008] Furthermore, if a conductive layer is provided for connecting the shield layer to ground, as disclosed in Patent Document 1, and this conductive layer penetrates the sealing material and the circuit board, problems arise such as increased costs due to the need for a process to form this conductive layer, and limitations on the design of the circuit board.

[0009] This technology was developed in view of the aforementioned problems, and its purpose is to provide an electronic circuit module and a method for manufacturing the same that can effectively perform the function of the shielding layer while improving reliability. [Means for solving the problem]

[0010] The electronic circuit module of this technology comprises a body having a first and second surface facing opposite directions and four sides connecting the first and second surfaces, a plurality of conductor layers provided inside the body, an electronic component mounted on the first surface of the body, a protective layer made of an insulating material, and a shielding layer made of a conductive material. The protective layer includes a first covering portion that covers the electronic component and the first surface, and a second covering portion that covers at least one of the four sides. The shielding layer includes a first conductor portion that covers the electronic component and the first covering portion, and a second conductor portion that covers the body and the second covering portion. The plurality of conductor layers include at least one connecting electrode connected to the second conductor portion.

[0011] The manufacturing method for the electronic circuit module of this technology includes the steps of forming a main body and multiple conductor layers, mounting electronic components on the main body, forming an initial protective layer so as to cover the main body and electronic components, removing a portion of the initial protective layer to form a protective layer so as to form a first covering portion and a second covering portion, and forming a shielding layer. [Effects of the Invention]

[0012] In the electronic circuit module and its manufacturing method of this technology, the second covering portion covers at least one of the four sides, and the second conductor portion covers the main body and the second covering portion. The multiple conductor layers include at least one connecting electrode connected to the second conductor portion. As a result, this technology makes it possible to realize an electronic circuit module that can effectively perform the function of a shielding layer while increasing reliability. [Brief explanation of the drawing]

[0013] [Figure 1] This is a cross-sectional view showing an electronic circuit module according to the first embodiment of this technology. [Figure 2] This is a cross-sectional view showing an electronic circuit module according to the first embodiment of this technology. [Figure 3]It is a plan view showing an electronic circuit module according to a first embodiment of the present technology. [Figure 4] It is a perspective view showing a main body and a protective layer in a first embodiment of the present technology. [Figure 5] It is a perspective view showing a main body and a protective layer in a first embodiment of the present technology. [Figure 6] It is a perspective view showing an electronic circuit module according to a first embodiment of the present technology. [Figure 7] It is a perspective view showing an electronic circuit module according to a first embodiment of the present technology. [Figure 8] It is a cross-sectional view showing a corner portion of a first coating portion and its vicinity in a first embodiment of the present technology. [Figure 9] It is a cross-sectional view showing an end portion of a second coating portion and its vicinity in a first embodiment of the present technology. [Figure 10] It is a cross-sectional view showing an end portion of a second conductor portion and its vicinity in a first embodiment of the present technology. [Figure 11] [ It is a flowchart showing a manufacturing method of an electronic circuit module according to a first embodiment of the present technology. [Figure 12] It is a perspective view showing a step in a manufacturing method of an electronic circuit module according to a first embodiment of the present technology. [Figure 13] It is a cross-sectional view showing the step shown in FIG. 12. [Figure 14] It is a cross-sectional view showing a step following the steps shown in FIGS. 12 and 13. <000009[ It is a cross-sectional view showing a step following the step shown in FIG. 14. [Figure 16] It is a plan view showing a step following the step shown in FIG. 15. [Figure 17] It is a cross-sectional view showing the step shown in FIG. 16. [Figure 18] It is a cross-sectional view showing the step shown in FIG. 16. [Figure 19] It is a plan view showing a step following the steps shown in FIGS. 16 to 18. [Figure 20]This is a cross-sectional view showing the process shown in Figure 19. [Figure 21] This is a cross-sectional view showing the process following the steps shown in Figures 19 and 20. [Figure 22] This is a cross-sectional view showing a first modified example of the end portion of the second covering portion in the first embodiment of the present technology. [Figure 23] This is a cross-sectional view showing a second modified example of the end portion of the second covering portion in the first embodiment of the present technology. [Figure 24] This is a cross-sectional view showing a third modified example of the end portion of the second covering portion in the first embodiment of this technology. [Figure 25] This is a cross-sectional view showing a fourth modified example of the end portion of the second covering portion in the first embodiment of the present technology. [Figure 26] This is a cross-sectional view showing a fifth modified example of the end portion of the second covering portion in the first embodiment of the present technology. [Figure 27] This is a cross-sectional view showing a sixth modified example of the end portion of the second covering portion in the first embodiment of the present technology. [Figure 28] This is a cross-sectional view showing an electronic circuit module according to a second embodiment of the present technology. [Figure 29] This is a plan view showing an electronic circuit module according to a second embodiment of this technology. [Figure 30] This is a cross-sectional view showing an electronic circuit module according to a third embodiment of the present technology. [Figure 31] This is a plan view showing an electronic circuit module according to a third embodiment of this technology. [Figure 32] This is a plan view showing an electronic circuit module according to the fourth embodiment of this technology. [Figure 33] This is a cross-sectional view showing an electronic circuit module according to a fifth embodiment of the present technology. [Figure 34] This is a cross-sectional view showing an electronic circuit module according to a fifth embodiment of the present technology. [Figure 35] This is a plan view showing an electronic circuit module according to the fifth embodiment of this technology. [Modes for carrying out the invention]

[0014] [First Embodiment] The embodiments of this technology will be described in detail below with reference to the drawings. First, the general structure of the electronic circuit module (hereinafter simply referred to as "module") 1 according to the first embodiment of this technology will be described with reference to Figures 1 to 3. Figures 1 and 2 are cross-sectional views showing module 1. Figure 3 is a plan view showing module 1.

[0015] Module 1 is used in electronic devices such as smartphones and personal computers. Module 1 may be an electronic circuit module that has the function of a filter, such as a bandpass filter, or an electronic circuit module that has the function of a demultiplexer, such as a diplexer or triplexer.

[0016] Module 1 comprises a main body 10 and electronic components 21 and 22 mounted on the main body 10. At least one of the electronic components 21 and 22 may be an active element such as a transistor or semiconductor IC, a passive element such as an inductor or capacitor, or a resonator or filter. Each of the electronic components 21 and 22 includes such an element or circuit and a plurality of terminals connected to the element or circuit. The number of electronic components mounted on the main body 10 is not limited to two; it may be one or three or more.

[0017] The main body 10 may be used as a circuit board for electronic components 21 and 22, and may include electronic circuits connected to the electronic components 21 and 22. The electronic circuits may also function as wiring. The electronic circuits may further function as, for example, filters, baluns, directional couplers, or demultiplexers.

[0018] Here, as shown in Figures 1 to 3, we define the X, Y, and Z directions. The X, Y, and Z directions are orthogonal to each other. Furthermore, the direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. In addition, the expression "when viewed from a predetermined direction (for example, the Z direction)" means viewing the object from a position at a distance in a predetermined direction or a direction parallel to the predetermined direction.

[0019] The main body 10 has a rectangular parallelepiped shape. The main body 10 has a first face 10A and a second face 10B facing opposite directions, and four side faces 10C to 10F connecting the first face 10A and the second face 10B. Side faces 10C and 10D face opposite directions, and side faces 10E and 10F also face opposite directions. Side faces 10C to 10F may be perpendicular to the first face 10A and the second face 10B.

[0020] As shown in Figures 1 and 2, the first surface 10A is located at the Z-direction end of the main body 10. The first surface 10A is also the top surface of the main body 10. The second surface 10B is located at the -Z-direction end of the main body 10. The second surface 10B is also the bottom surface of the main body 10. Figure 3 shows module 1 as viewed from the second surface 10B side.

[0021] Side 10C is located at the -X end of the main body 10. Side 10D is located at the X end of the main body 10. Side 10E is located at the -Y end of the main body 10. Side 10F is located at the Y end of the main body 10. Figure 1 shows a cross-section of module 1 parallel to sides 10E and 10F. Figure 2 shows a cross-section of module 1 parallel to sides 10C and 10D.

[0022] Electronic components 21 and 22 are mounted on the first surface 10A of the main body 10. The main body 10 includes a plurality of electrodes provided on the first surface 10A. The plurality of electrodes are electrically connected to the electronic circuit of the main body 10, and the plurality of terminals of electronic component 21 and electronic component 22 are connected to the plurality of electrodes directly or indirectly via a plurality of bumps. The main body 10 may also include a plurality of laminated insulating layers. The first surface 10A and the second surface 10B are located at opposite ends in the lamination direction of the plurality of insulating layers.

[0023] The main body 10 or the multiple insulating layers may be formed of a brittle material. Specifically, each of the multiple insulating layers may be formed of a ceramic material such as low-temperature co-fired ceramics (LTCC). Alternatively, the main body 10 or the multiple insulating layers may be formed of an organic insulating material, or of a composite material containing a ceramic material and an organic insulating material.

[0024] Module 1 further comprises a protective layer 30. The protective layer 30 covers the electronic components 21, 22 and the first surface 10A of the main body 10, and at least a portion of the four sides 10C to 10F. As the material of the protective layer 30, an insulating material including a resin material can be used. The resin material may be a thermosetting resin or a thermoplastic resin. Examples of resin materials include epoxy resin, silicone resin, polyimide resin, polyamide-imide resin, phenolic resin, acrylic resin, or urethane resin. The material of the protective layer 30 may also include materials other than the resin material; for example, it may include a filler in addition to the resin material. Examples of fillers include silicon oxide, aluminum oxide, magnesium oxide, silicon nitride, or composite materials thereof. When the material of the protective layer 30 includes both the resin material and a filler, the weight filling rate of the filler is preferably greater than 75 wt% and less than 93 wt%.

[0025] The protective layer 30 may be in contact with multiple terminals and multiple bumps of the electronic components 21 and 22. Alternatively, the protective layer 30 may include multiple insulating parts, each made of a different insulating material. In this case, one of the multiple insulating parts, the first insulating part, may be mainly positioned around multiple terminals and multiple bumps of the electronic components 21 and 22, while another of the multiple insulating parts, the second insulating part, may mainly cover the first surface 10A and the surfaces of the electronic components 21 and 22. The second insulating part may or may not be in contact with multiple terminals and multiple bumps of the electronic components 21 and 22.

[0026] Module 1 further comprises a shielding layer 40 made of a conductive material. The shielding layer 40 covers the main body 10, the electronic components 21 and 22, and the protective layer 30. The conductive material may be a pure metal consisting of one metallic element or an alloy consisting of multiple metallic elements. Examples of conductive materials include Cu, Ag, Au, Al, Ti, Cr, or stainless steel.

[0027] Next, the main body 10 will be described in more detail with reference to Figures 1 to 3. Module 1 further comprises a plurality of conductor layers 50 provided inside the main body 10. The plurality of conductor layers 50 constitute the electronic circuit of the main body 10. If the main body 10 includes a plurality of insulating layers, each of the plurality of conductor layers 50 is formed along the surface of the insulating layer. In this case, two adjacent conductor layers 50 that are spaced apart in a direction parallel to the Z direction can be connected using through holes that penetrate the insulating layer. For example, one of the two conductor layers 50 may be connected to the other of the two conductor layers 50 via a through hole, or the two conductor layers 50 may be connected via a conductor filled in the through hole.

[0028] The main body 10 includes a plurality of terminals provided on the second surface 10B of the main body 10. In the example shown in Figures 1 to 3, the main body 10 includes nine terminals 111, 112, 113, 114, 115, 116, 117, 118, and 119. Terminals 111, 112, and 113 are arranged in this order in the X direction at a position closer to side surface 10E than to side surface 10F. Terminals 115, 116, and 117 are arranged in this order in the -X direction at a position closer to side surface 10F than to side surface 10E.

[0029] Terminal 114 is located between terminals 113 and 115. Terminal 118 is located between terminals 111 and 117. Terminal 119 is located between terminals 112 and 116. Terminal 119 is also located approximately in the center of the second surface 10B.

[0030] Next, the protective layer 30 will be described in more detail with reference to Figures 1 to 5. Figures 4 and 5 are perspective views showing the main body 10 and the protective layer 30. The protective layer 30 includes a first covering portion 31 that covers the electronic components 21, 22 and the first surface 10A of the main body 10, and a second covering portion that covers at least one of the four sides of the main body 10. The first covering portion 31 is positioned ahead of the first surface 10A of the main body 10 in the Z direction.

[0031] The first covering portion 31 has an upper surface located at the Z-direction end of the first covering portion 31, a first side surface located at the -X-direction end of the first covering portion 31, a second side surface located at the X-direction end of the first covering portion 31, a third side surface located at the -Y-direction end of the first covering portion 31, and a fourth side surface located at the Y-direction end of the first covering portion 31.

[0032] The first covering portion 31 further has a plurality of corners located at the intersections of the upper surface of the first covering portion 31 and two or three of the first to fourth side surfaces. Each of the plurality of corners may or may not be chamfered. If each of the plurality of corners is chamfered, each of the plurality of corners may be rounded.

[0033] The first covering portion 31 includes a mark 36. At least a portion of the mark 36 may be recessed or protruding relative to its surroundings. The planar shape (shape as viewed from the Z direction) of the mark 36 may be any figure or any symbol, or at least one letter.

[0034] The second covering portion may cover all or almost all of at least one side, or it may cover a portion of at least one side. In this embodiment in particular, the second covering portion covers sides 10C and 10D, but does not cover sides 10E and 10F. Hereinafter, the portion of the second covering portion that covers side 10C will be referred to as the second covering portion 32, and the portion that covers side 10D will be referred to as the second covering portion 33. The second covering portion 32 covers all or almost all of side 10C. The second covering portion 33 covers all or almost all of side 10D. Furthermore, the second covering portions 32 and 33 are continuous with the first covering portion 31. In Figures 1, 4, and 5, the boundary between the first covering portion 31 and the second covering portions 32 and 33 is shown by a dotted line.

[0035] The dimensions of the main body 10 in the direction parallel to the X direction and the dimensions of the main body 10 in the direction parallel to the Y direction are, for example, within the range of 500 μm to 5000 μm. In this case, from the viewpoint of protecting the main body 10, the dimensions of the second covering portions 32 and 33 in the direction parallel to the X direction are preferably within the range of 5 μm to 300 μm, and more preferably within the range of 15 μm to 95 μm.

[0036] Next, the shield layer 40 will be described in detail with reference to Figures 1 to 3, 6 and 7. Figures 6 and 7 are perspective views showing module 1. The shield layer 40 includes a first conductive portion 41 that covers the electronic component 21 and the first covering portion 31. The first covering portion 31 is interposed between the electronic component 21 and the first conductive portion 41.

[0037] The first conductor portion 41 includes a mark 46. The mark 46 may have a shape corresponding to the mark 36. That is, at least a part of the mark 46 may be recessed or protruding from its surroundings. Also, the planar shape of the mark 46 (shape viewed from the Z direction) may be any figure or at least one letter. The mark 46 is used, for example, to identify the positions of terminals 111 to 119 of module 1.

[0038] The shield layer 40 further includes a second conductor portion that covers the main body 10 and the second covering portions 32 and 33. In this embodiment, the second conductor portion specifically covers the sides 10E and 10F of the main body 10 and the second covering portions 32 and 33. Hereinafter, the portion of the second conductor portion that covers the second covering portion 32 will be referred to as the second conductor portion 42, the portion that covers the second covering portion 33 will be referred to as the second conductor portion 43, the portion that covers the side 10E will be referred to as the second conductor portion 44, and the portion that covers the side 10F will be referred to as the second conductor portion 45. The second conductor portions 42 to 45 are continuous with the first conductor portion 41. In Figures 1, 2, 6, and 7, the boundary between the first conductor portion 41 and the second conductor portions 42 to 45 is shown by a dotted line.

[0039] The second conductor portion 42 covers all or almost all of the second covering portion 32. Furthermore, the second conductor portion 42 covers the side surface 10C of the main body 10 via the second covering portion 32.

[0040] The second conductor portion 43 covers all or almost all of the second covering portion 33. Furthermore, the second conductor portion 43 covers the side surface 10D of the main body 10 via the second covering portion 33.

[0041] The second conductor portion 44 directly covers all or almost all of the side surface 10E of the main body 10. The second conductor portion 45 directly covers all or almost all of the side surface 10F of the main body 10.

[0042] The shield layer 40 preferably includes a plurality of stacked metal layers. Here, with reference to Figure 8, the case in which the shield layer 40 includes a plurality of stacked metal layers will be described. Figure 8 is a cross-sectional view showing the corner of the first covering portion 31 and its vicinity.

[0043] In the example shown in Figure 8, the shield layer 40 includes three stacked metal layers 401, 402, and 403 as multiple metal layers. Each of the metal layers 401, 402, and 403 includes a first portion that constitutes the first covering portion 31 and a second portion that constitutes the second covering portion. The second portion is continuous with the first portion. Metal layer 401 covers the surface of the protective layer 30 and the sides 10E and 10F of the main body 10. Metal layer 402 covers all or almost all of metal layer 401. Metal layer 403 covers all or almost all of metal layer 402.

[0044] The metal layer 402 may be formed of Cu, Ag, Au, or Al. Each of the metal layers 401 and 403 may be formed of Cr, Ti, or stainless steel. The thickness of each of the metal layers 401 and 403 may be the same as or different from the thickness of the metal layer 402. In the latter case, it is preferable that the thickness of each of the metal layers 401 and 403 is thinner than that of the metal layer 402. In particular, it is more preferable that the thickness of the metal layer 401 be in the range of, for example, 50 nm to 200 nm.

[0045] Note that the configuration of the shield layer 40 is not limited to the example shown in Figure 8, and may be composed of a single metal layer.

[0046] Figure 8 shows the corner 31a of the first covering portion 31, located at the intersection of the upper surface and the second side surface of the first covering portion 31. In the example shown in Figure 8, the corner 31a is rounded. Therefore, the portion of the shield layer 40 that covers the corner 31a is also rounded. Although not shown, if the corners of the first covering portion 31 other than the corner 31a are rounded, the portion of the shield layer 40 that covers the corners of the first covering portion 31 other than the corner 31a is also rounded.

[0047] Next, the relationship between the shield layer 40 and the multiple conductor layers 50 will be described with reference to Figures 2, 4 to 7. The multiple conductor layers 50 include at least one connecting electrode connected to at least one of the second conductor portions 44, 45 of the shield layer 40. In this embodiment, it is particularly preferable that the multiple conductor layers 50 include at least one connecting electrode connected to the second conductor portion 44 covering the side surface 10E and at least one other connecting electrode connected to the second conductor portion 45 covering the side surface 10F. In the example shown in Figures 2, 4 to 7, the multiple conductor layers 50 include two connecting electrodes 51, 53 connected to the second conductor portion 44 and two connecting electrodes 52, 54 connected to the second conductor portion 45.

[0048] The connecting electrode 51 has an end face 51a that is exposed on the side surface 10E. The connecting electrode 53 has an end face 53a that is exposed on the side surface 10E. The end faces 51a and 53a are located between the first surface 10A and the second surface 10B of the main body 10 in a direction parallel to the Z direction. The end faces 51a and 53a may be in the same position in the direction parallel to the Z direction, or they may be in different positions in the direction parallel to the Z direction. The second conductor portion 44 is connected to the end faces 51a and 53a.

[0049] The distance between the end face 51a (end face 53a) and the second face 10B in the direction parallel to the Z direction (hereinafter referred to as the first distance) may be the same as, approximately the same as, or different from, the distance between the end face 51a (end face 53a) and the first face 10A in the direction parallel to the Z direction (hereinafter referred to as the second distance). In the latter case, the first distance may be smaller than the second distance.

[0050] The connecting electrode 52 has an end face 52a that is exposed on the side surface 10F. The end faces 52a and 54a are located between the first surface 10A and the second surface 10B of the main body 10 in a direction parallel to the Z direction. The connecting electrode 54 has an end face 54a that is exposed on the side surface 10F. The end faces 52a and 54a may be in the same position in a direction parallel to the Z direction, or they may be in different positions in a direction parallel to the Z direction. The second conductor portion 45 is connected to the end faces 52a and 54a.

[0051] The distance between the end face 52a (end face 54a) and the second face 10B in the direction parallel to the Z direction (hereinafter referred to as the third distance) may be the same as, approximately the same as, or different from, the distance between the end face 52a (end face 54a) and the first face 10A in the direction parallel to the Z direction (hereinafter referred to as the fourth distance). In the latter case, the third distance may be smaller than the fourth distance.

[0052] Each of the connecting electrodes 51 to 54 is an electrode connected to ground. Figure 2 shows an example in which connecting electrode 51 is connected to terminal 112 via several conductor layers 50, and connecting electrode 52 is connected to terminals 116 and 119 via several other conductor layers 50. In this example, terminals 112, 116 and 119 are connected to ground. Although not shown, each of the connecting electrodes 53 and 54 is also connected to at least one of the terminals 111 to 119 via multiple conductor layers 50. The at least one terminal to which each of the connecting electrodes 51 to 54 is connected is a ground terminal that is connected to ground. By connecting this at least one terminal to ground, the shield layer 40 is electrically connected to ground.

[0053] The dimensions of module 1 in the direction parallel to the Z direction are, for example, in the range of 300 μm to 1000 μm. In this case, from the viewpoint of effectively performing the function of the shielding layer 40, it is preferable that the distance between the second surface 10B of the main body 10 and each of the connecting electrodes 51 to 54 in the direction parallel to the Z direction is in the range of 40 μm to 180 μm.

[0054] Note that the number of connecting electrodes is not limited to the examples shown in Figures 2, 4 to 7. The number of connecting electrodes may be one or five or more. However, from the viewpoint of effectively utilizing the function of the shielding layer 40, it is preferable that the number of connecting electrodes be two or more. Also, from the viewpoint of effectively utilizing the function of the shielding layer 40, the total area of ​​the end faces of the connecting electrodes should be, for example, 300 μm². 2 It is preferable that it be larger than this.

[0055] Next, the ends of the second covering portions 32 and 33 of the protective layer 30 will be described. Here, with reference to Figure 9, the second covering portion 33 will be used as an example. Figure 9 is a cross-sectional view showing the end of the second covering portion 33 and its vicinity. The second covering portion 33 has an end 33a that is the end furthest from the first covering portion 31 and is located at the -Z end of the second covering portion 33. In the example shown in Figure 9, the position of the end 33a of the second covering portion 33 in the direction parallel to the Z direction is the same as or approximately the same as the position of the second surface 10B of the main body 10 in the direction parallel to the Z direction.

[0056] The above description of the second covering portion 33 also applies to the second covering portion 32. That is, the second covering portion 32 has an end that is the furthest end from the first covering portion 31 and is located at the -Z end of the second covering portion 32. The position of the end of the second covering portion 32 in the direction parallel to the Z direction is the same as or approximately the same as the position of the second surface 10B of the main body 10 in the direction parallel to the Z direction.

[0057] As shown in Figure 9, the corners at the intersection of the second surface 10B and the side surface 10D of the main body 10 may be rounded. The second covering portion 33 may cover these corners. Similarly, the corners at the intersection of the second surface 10B and the side surface 10C of the main body 10 may be rounded. The second covering portion 32 may cover these corners.

[0058] Figure 9 shows the end 43a of the second conductor portion 43 of the shield layer 40, which is the end furthest from the first conductor portion 41. The end 43a of the second conductor portion 43 is located at the -Z end of the second conductor portion 43. In the example shown in Figure 9, the position of the end 43a of the second conductor portion 43 in the direction parallel to the Z direction is the same as or approximately the same as the position of the second surface 10B of the main body 10 in the direction parallel to the Z direction.

[0059] The above description of the second conductor portion 43 also applies to the second conductor portion 42 of the shield layer 40. That is, the second conductor portion 42 has an end that is the furthest end from the first conductor portion 41 and is located at the -Z end of the second conductor portion 42. The position of the end of the second conductor portion 42 in the direction parallel to the Z direction is the same as or approximately the same as the position of the second surface 10B of the main body 10 in the direction parallel to the Z direction.

[0060] Next, with reference to Figure 10, the ends of the second conductor portions 44 and 45 of the shield layer 40 will be described. Here, with reference to Figure 10, the second conductor portion 45 will be used as an example. Figure 10 is a cross-sectional view showing the end of the second conductor portion 45 and its vicinity. The second conductor portion 45 has an end 45a that is the end furthest from the first conductor portion 41 and is located at the -Z end of the second conductor portion 45.

[0061] At least a portion of the end 45a of the second conductor portion 45 is inclined with respect to a direction perpendicular to the side surface 10F of the main body 10. The dimensions of the second conductor portion 45 in the direction perpendicular to the side surface 10F of the main body 10 (parallel to the T direction) may decrease as it approaches the second surface 10B of the main body 10. The dimensions of the second conductor portion 45 in the direction perpendicular to the second surface 10B of the main body 10 (parallel to the Z direction) decrease as it moves away from the side surface 10F of the main body 10.

[0062] The end 45a of the second conductor portion 45 may have a shape that protrudes away from the first surface 10A (see Figures 1 and 2) and the side surface 10F of the main body 10. The end 45a of the second conductor portion 45 may also be rounded.

[0063] The above description of the second conductor portion 45 also applies to the second conductor portion 44. That is, the second conductor portion 44 has an end that is the furthest end from the first conductor portion 41 and is located at the -Z end of the second conductor portion 42. At least a portion of the end of the second conductor portion 44 is inclined with respect to a direction perpendicular to the side surface 10E of the main body 10 (see Figures 2 to 4).

[0064] As shown in Figure 10, the corners at the intersection of the second surface 10B and the side surface 10F of the main body 10 may be rounded. The second conductor portion 45 may cover these corners. Similarly, the corners at the intersection of the second surface 10B and the side surface 10E of the main body 10 may be rounded. The second conductor portion 44 may cover these corners.

[0065] Next, a method for manufacturing module 1 will be described. The method for manufacturing module 1 includes the steps of forming a main body 10 and a plurality of conductor layers 50, mounting electronic components 21 and 22 on the main body 10, forming an initial protective layer so as to cover the main body 10 and the electronic components 21 and 22, removing a portion of the initial protective layer to form a protective layer 30 so as to form a first covering portion 31 and a second covering portion 32, and forming a shielding layer 40.

[0066] The following describes the process from forming the main body 10 and the multiple conductor layers 50 to forming the shield layer 40, with reference to Figures 11 to 21. Here, we describe a method for manufacturing multiple modules 1. Figure 11 is a flowchart of the method for manufacturing a module 1. The method for manufacturing a module 1 includes a preparation step S11, a mounting step S12, a sealing step S13, a first cutting step S14, a second cutting step S15, and a shield layer formation step S16.

[0067] Figures 12 and 13 show the preparation step S11. In this step, multiple main bodies 10 are fixed onto the substrate 60 using, for example, tape (not shown). Note that in Figure 13, terminals 111 to 119 of the main body 10 (see Figures 1 to 3) are omitted.

[0068] Multiple bodies 10 are arranged in a grid pattern along multiple dicing lines that extend in a grid pattern. Hereinafter, multiple dicing lines extending in a direction parallel to the X direction will be referred to as multiple first dicing lines, and multiple dicing lines extending in a direction parallel to the Y direction will be referred to as multiple second dicing lines. One body 10 is positioned between two first dicing lines that are spaced apart in the direction parallel to the Y direction, and between two second dicing lines that are spaced apart in the direction parallel to the X direction.

[0069] Figure 14 shows the next step, namely the mounting step S12. In this step, electronic components 21 and 22 (see Figure 1) are mounted on the first surface 10A of each of the multiple main bodies 10.

[0070] Figure 15 shows the next step, namely the sealing step S13. In this step, an initial protective layer 30P is formed to cover multiple structures, each including the main body 10 and electronic components 21 and 22, which will later become multiple protective layers 30.

[0071] Figures 16 to 18 show the next step, namely the first cutting step S14. In this step, a portion of the initial protective layer 30P is removed by cutting the initial protective layer 30P along each of the multiple first dicing lines.

[0072] In the first cutting step S14, the initial protective layer 30P may be cut so that each of the side surfaces 10E and 10F of the multiple bodies 10 is exposed. Alternatively, a portion of each of the multiple bodies 10 may be cut together with the initial protective layer 30P. In this case, the two cut surfaces of the body 10 become the side surfaces 10E and 10F, respectively. As a result of performing the first cutting step S14, the end surface 51a of the connecting electrode 51, the end surface 52a of the connecting electrode 52, the end surface 53a of the connecting electrode 53, and the end surface 54a of the connecting electrode 54 are exposed.

[0073] As shown in Figure 18, in this process, each side 10C, 10D of the multiple main bodies 10 remains covered by the initial protective layer 30P.

[0074] Figures 19 and 20 show the next step, namely the second cutting step S15. In this step, a portion of the initial protective layer 30P is removed by cutting along each of the multiple second dicing lines. In the second cutting step S15, the initial protective layer 30P is cut so that each of the sides 10C, 10D of the multiple bodies 10 are not exposed. The initial protective layer 30P remaining after the second cutting step S15 becomes multiple protective layers 30.

[0075] Figure 21 shows the next step, namely the shield layer formation step S16. In this step, a shield layer 40 is formed so as to cover each of the multiple main bodies 10 and each of the multiple protective layers 30.

[0076] In the manufacturing method of module 1, after the steps shown in Figure 21, a step is performed to separate the multiple main bodies 10, each with a protective layer 30 and a shielding layer 40 formed on them, from the substrate 60. This completes the manufacturing of multiple modules 1.

[0077] Next, the operation and effects of module 1 according to this embodiment will be described. In this embodiment, the second covering portions 32 and 33 of the protective layer 30 cover the sides 10C and 10D of the main body 10. As a result, according to this embodiment, damage to the main body 10 can be prevented, and the reliability of the main body 10 and module 1 can be increased. In particular, when the main body 10 is made of a brittle material, the second covering portions 32 and 33 can more effectively prevent damage to the main body 10.

[0078] Furthermore, in this embodiment, the second covering portions 32 and 33 are covered by the second conductor portions 42 and 43 of the shield layer 40. According to this embodiment, the second covering portions 32 and 33 can increase the distance between the second conductor portions 42 and 43 and the multiple conductor layers 50 provided inside the main body 10. As a result, according to this embodiment, it is possible to suppress the generation of stray capacitance between the second conductor portions 42 and 43 and the multiple conductor layers 50.

[0079] Here, we consider the case where a coil composed of multiple conductor layers 50 is provided inside the main body 10. When the coil is relatively far from the side 10C or side 10D, the second covering portions 32, 33 can reduce the stray capacitance between the coil and the second conductor portion 42 or second conductor portion 43 by up to approximately 4%. Furthermore, when the coil is relatively close to the side 10C or side 10D, the second covering portions 32, 33 can reduce the stray capacitance between the coil and the second conductor portion 42 or second conductor portion 43 by up to approximately 23%.

[0080] Furthermore, in this embodiment, the second covering portions 32 and 33 of the protective layer 30 do not cover the sides 10E and 10F of the main body 10. The sides 10E and 10F of the main body 10 are covered by the second conductor portions 44 and 45 of the shield layer 40. The second conductor portion 44 is connected to the connecting electrodes 51 and 53 provided inside the main body 10. The second conductor portion 45 is connected to the connecting electrodes 52 and 54 provided inside the main body 10. According to this embodiment, it becomes possible to connect the second conductor portions 44 and 45 to ground via the connecting electrodes 51 to 54. As a result, according to this embodiment, the function of the shield layer 40 can be effectively performed.

[0081] Based on the above, according to this embodiment, the shield layer 40 can be effectively utilized while increasing reliability.

[0082] Incidentally, one possible method for connecting the shield layer 40 to ground is to connect the first conductor portion 41 of the shield layer 40 to the ground terminal via a first conductor embedded in the first covering portion 31 of the protective layer 30 and a second conductor provided inside the main body 10. However, in this case, the first conductor must be positioned so as not to physically or characteristically interfere with the electronic components 21 and 22, and the second conductor must be positioned so as not to physically or characteristically interfere with the electronic circuit inside the main body 10. As a result, the area of ​​the first surface 10A of the main body 10 in which the electronic components 21 and 22 can be placed becomes smaller, and the volume of the area in which the electronic circuit can be placed inside the main body 10 becomes smaller. Consequently, there is a problem that significant constraints arise regarding the design of the main body 10 and the electronic components 21 and 22. In addition, there is a problem that the cost will increase because a process for forming the first conductor will be required.

[0083] In contrast, in this embodiment, the first conductor is unnecessary. Furthermore, in this embodiment, the length of the conductor for connecting the second conductor portions 44 and 45 to the ground terminal can be shortened compared to the second conductor. In addition, in this embodiment, the second conductor portions 44 and 45 can be connected to the connecting electrodes 51 and 54 by the series of steps S11 to S16 described above. As a result, this embodiment prevents constraints on the design of the main body 10 and electronic components 21 and 22, and also reduces costs.

[0084] Furthermore, in this embodiment, the end of the second covering portion 32 located at the -Z end does not need to be covered by the second conductor portion 42, and the end 33a of the second covering portion 33 located at the -Z end does not need to be covered by the second conductor portion 43. In this case, moisture and gas trapped inside the module 1 by the protective layer 30 can be released from these ends. This suppresses corrosion of the main body 10 and electronic components 21 and 22.

[0085] Furthermore, in this embodiment, the second conductor portion 42 covers the side surface 10C of the main body 10 via the second covering portion 32. As a result, according to this embodiment, the second conductor portion 42 can be kept away from the terminals 111, 117, and 118 provided on the second surface 10B of the main body 10. As a result, according to this embodiment, it is possible to prevent a short circuit between the second conductor portion 42 and the terminals 111, 117, and 118.

[0086] Similarly, the second conductor portion 43 covers the side surface 10D of the main body 10 via the second covering portion 33. This allows the second conductor portion 43 to be kept away from the terminals 113, 114, and 115 provided on the second surface 10B of the main body 10. This prevents a short circuit between the second conductor portion 43 and the terminals 113, 114, and 115.

[0087] Furthermore, if the protective layer 30 is formed of a resin material, the shape of the second conductor portions 42 and 43 can be made flat regardless of the shape of the sides 10C and 10D of the main body 10. For example, as shown in Figure 9, even if the corner located at the intersection of the second surface 10B and the side 10D of the main body 10 is rounded, the second covering portion 33 can be made flat, thereby making the second conductor portion 43 flat. The above description of the second covering portion 33 and the second conductor portion 43 also applies to the second covering portion 32 and the second conductor portion 42.

[0088] Furthermore, if the corners (31a) of the first covering portion 31 of the protective layer 30 are rounded, it is possible to suppress discontinuous changes in the thickness of the first covering portion 31 between the portion of the first conductor portion 41 of the shield layer 40 that covers the upper surface of the first covering portion 31 and the portions of the first conductor portion 41 of the shield layer 40 that cover the first to fourth sides of the first covering portion 31.

[0089] Furthermore, if the corner at the intersection of the second surface 10B and the side surface 10F of the main body 10 is rounded, it is possible to suppress discontinuous changes in the second conductor portion 45 near the end 45a of the second conductor portion 45. Similarly, if the corner at the intersection of the second surface 10B and the side surface 10E of the main body 10 is rounded, it is possible to suppress discontinuous changes in the second conductor portion 44 near the end of the second conductor portion 44.

[0090] [Differentiation] Next, the first to sixth modified examples of the ends of the second covering portions 32 and 33 of the protective layer 30 will be described. Here, the end portion 33a of the second covering portion 33 will be used as an example. The following description of the end portion 33a of the second covering portion 33 also applies to the end portion of the second covering portion 32.

[0091] First, a first modification will be described with reference to Figure 22. Figure 22 is a cross-sectional view showing the first modification of the end portion 33a of the second covering portion 33. In the first modification, the end portion 33a of the second covering portion 33 is located between the first surface 10A (see Figures 1 and 2) and the second surface 10B of the main body 10 in a direction parallel to the Z direction.

[0092] According to the first modification, the second conductor portion 43 of the shield layer 40 covering the second covering portion 33 (see Figures 1, 6, and 7) can be moved further away from the terminals 113, 114, and 115 (see Figure 7) provided on the second surface 10B of the main body 10. As a result, according to the second modification, a short circuit between the second conductor portion 43 and the terminals 113, 114, and 115 can be more effectively prevented.

[0093] The second conductor portion 43 may or may not cover the end portion 33a of the second covering portion 33.

[0094] Next, a second modification will be described with reference to Figure 23. Figure 23 is a cross-sectional view showing a second modification of the end portion 33a of the second covering portion 33. In the second modification, the shape of the end portion 33a of the second covering portion 33 differs from that of the first modification. As shown in Figure 23, in the second modification, at least a portion of the end portion 33a of the second covering portion 33 is inclined with respect to a direction perpendicular to the side surface 10D of the main body 10. Here, we assume a virtual plane parallel to the XY plane that includes the second surface 10B of the main body 10. In particular, in the example shown in Figure 23, the distance from the virtual plane to any position on the end portion 33a of the second covering portion 33 increases as the distance of the position from the side surface 10D of the main body 10 increases.

[0095] The dimensions of the second covering portion 33 in the direction perpendicular to the side surface 10D of the main body 10 (parallel to the X direction) decrease as it approaches the second surface 10B of the main body 10. The dimensions of the second covering portion 33 in the direction perpendicular to the second surface 10B of the main body 10 (parallel to the Z direction) decrease as it moves away from the side surface 10D of the main body 10.

[0096] In the second modification, the entire end portion 33a of the second covering portion 33 may be inclined with respect to a direction perpendicular to the side surface 10D of the main body 10. Furthermore, the end portion 33a of the second covering portion 33 may have a shape that protrudes away from the first surface 10A (see Figures 1 and 2) and the side surface 10D of the main body 10. Additionally, the end portion 33a of the second covering portion 33 may be rounded.

[0097] The second conductor portion 43 may or may not cover the end portion 33a of the second covering portion 33. Furthermore, the second conductor portion 43 may or may not cover the side portion 10D.

[0098] Next, a third modification will be described with reference to Figure 24. Figure 24 is a cross-sectional view showing a third modification of the end portion 33a of the second covering portion 33. In the third modification, the direction of the inclination of the end portion 33a of the second covering portion 33 is different from that of the second modification. In the example shown in Figure 24, the distance of any position on the end portion 33a of the second covering portion 33 from a virtual plane (a virtual plane including the second surface 10B of the main body 10) decreases as the arbitrary position moves away from the side surface 10D of the main body 10.

[0099] The dimensions of the second covering portion 33 in the direction perpendicular to the second surface 10B of the main body 10 (parallel to the Z direction) increase as it moves away from the side surface 10D of the main body 10.

[0100] Similar to the second modified example, the second conductor portion 43 may or may not cover the end 33a of the second covering portion 33. Also, the second conductor portion 43 may or may not cover the side surface 10D.

[0101] Next, a fourth modification will be described with reference to Figure 25. Figure 25 is a cross-sectional view showing the fourth modification of the end portion 33a of the second covering portion 33. In the fourth modification, the shape of the end portion 33a of the second covering portion 33 is different from that of the third modification. As shown in Figure 25, in the fourth modification, the second covering portion 33 includes a first portion and a second portion positioned between the first portion and the side surface 10D of the main body 10.

[0102] In the first part, the distance from a virtual plane (a virtual plane including the second surface 10B of the main body 10) at any position on the end 33a of the second covering portion 33 is constant or approximately constant, regardless of the distance from the side surface 10D of the main body 10. In the second part, the distance from a virtual plane at any position on the end 33a of the second covering portion 33 decreases as the arbitrary position moves away from the side surface 10D of the main body 10.

[0103] The first dimension of the second covering portion 33 in the direction perpendicular to the second surface 10B of the main body 10 (parallel to the Z direction) is constant or approximately constant regardless of the distance from the side surface 10D of the main body 10. The second dimension of the second part of the second covering portion 33 in the direction perpendicular to the second surface 10B of the main body 10 (parallel to the Z direction) increases as it moves away from the side surface 10D of the main body 10.

[0104] Similar to the third modified example, the second conductor portion 43 may or may not cover the end 33a of the second covering portion 33. Also, the second conductor portion 43 may or may not cover the side surface 10D.

[0105] Next, a fifth modification will be described with reference to Figure 26. Figure 26 is a cross-sectional view showing the fifth modification of the end portion 33a of the second covering portion 33. In the fifth modification, the shape of the end portion 33a of the second covering portion 33 is different from that of the second modification. As shown in Figure 26, in the fifth modification, the end portion 33a of the second covering portion 33 has a shape that is recessed in the Z direction. In the fifth modification, the end portion 33a of the second covering portion 33 may be rounded.

[0106] Similar to the second modified example, the second conductor portion 43 may or may not cover the end 33a of the second covering portion 33. Also, the second conductor portion 43 may or may not cover the side surface 10D.

[0107] Next, a sixth modification will be described with reference to Figure 27. Figure 27 is a cross-sectional view showing the sixth modification of the end 33a of the second covering portion 33. In the sixth modification, the shape of the end 33a of the second covering portion 33 differs from that of the fifth modification. As shown in Figure 27, in the sixth modification, the second covering portion 33 includes a first portion in which the dimensions of the second covering portion 33 in a direction perpendicular to the second surface 10B of the body 10 (parallel to the Z direction) decrease as it moves away from the side surface 10D of the body 10, and a second portion in which the dimensions of the second covering portion 33 in a direction perpendicular to the second surface 10B of the body 10 (parallel to the Z direction) increase as it moves away from the side surface 10D of the body 10. The first portion is located between the side surface 10D of the body 10 and the second portion. In the sixth modification, the end 33a of the second covering portion 33 may be rounded.

[0108] Similar to the fifth modified example, the second conductor portion 43 may or may not cover the end 33a of the second covering portion 33. Also, the second conductor portion 43 may or may not cover the side surface 10D.

[0109] [Second Embodiment] Next, a second embodiment of the present technology will be described with reference to Figures 28 and 29. Figure 28 is a cross-sectional view showing a module according to this embodiment. Figure 29 is a plan view showing a module according to this embodiment.

[0110] The configuration of module 1 according to this embodiment differs from the first embodiment in the following respects. In this embodiment, the second covering portion of the protective layer 30 covers side surface 10C, but does not cover side surfaces 10D, 10E, and 10F. That is, in this embodiment, the second covering portion 33 is not provided. The second conductive portion 43 of the shielding layer 40 directly covers all or almost all of side surface 10D of the main body 10.

[0111] The multiple conductor layers 50 may include at least one connecting electrode connected to the second conductor portion 43. Figure 28 shows a connecting electrode 55 connected to the second conductor portion 43. The connecting electrode 55 has an end face exposed on the side surface 10D. The second conductor portion 43 is connected to the end face of the connecting electrode 55. The distance between the end face of the connecting electrode 55 and the second surface 10B in a direction parallel to the Z direction (hereinafter referred to as the fifth distance) may be the same as, approximately the same as, or different from, the distance between the end face of the connecting electrode 55 and the first surface 10A in a direction parallel to the Z direction (hereinafter referred to as the sixth distance). In the latter case, the fifth distance may be smaller than the sixth distance.

[0112] The connecting electrode 55 is an electrode connected to ground. The connecting electrode 55 is connected to at least one of the terminals 111 to 119 via multiple conductor layers 50. The at least one terminal to which the connecting electrode 55 is connected is a ground terminal connected to ground.

[0113] Furthermore, if multiple conductor layers 50 include connecting electrodes 55, at least one of the connecting electrodes 51, 52, 53, 54 (see Figures 2, 4, and 5) does not need to be provided.

[0114] Next, the differences between the manufacturing method of module 1 according to this embodiment and the first embodiment will be described. In this embodiment, the second cutting step S15 (see Figures 11, 19, and 20) differs from that of the first embodiment. In the second cutting step S15 in this embodiment, the initial protective layer 30P is cut so that each side surface 10C of the multiple main bodies 10 is not exposed. In the second cutting step S15 in this embodiment, the initial protective layer 30P may be further cut so that each side surface 10D of the multiple main bodies 10 is exposed. Alternatively, a part of each of the multiple main bodies 10 may be cut together with the initial protective layer 30P. In this case, one of the cut surfaces of the main body 10 becomes the side surface 10D.

[0115] Other configurations, operations, and effects in this embodiment are the same as those in the first embodiment.

[0116] [Third Embodiment] Next, a third embodiment of the present technology will be described with reference to Figures 30 and 31. Figure 30 is a cross-sectional view showing a module according to this embodiment. Figure 31 is a plan view showing a module according to this embodiment.

[0117] The configuration of module 1 according to this embodiment differs from the second embodiment in the following respects. In this embodiment, the second covering portion of the protective layer 30 covers sides 10C and 10F, but does not cover sides 10D and 10E. Hereinafter, the portion of the second covering portion that covers side 10F will be referred to as the second covering portion 34. The second covering portion 34 covers the entire or almost the entire side 10F of the main body 10. Furthermore, the second covering portion 34 is continuous with the first covering portion 31 and the second covering portion 32. In Figure 30, the boundary between the first covering portion 31 and the second covering portion 34 is shown by a dotted line.

[0118] Furthermore, in this embodiment, the second conductor portion 45 of the shield layer 40 covers all or almost all of the second covering portion 34. The second conductor portion 45 covers the side surface 10F of the main body 10 via the second covering portion 34.

[0119] Furthermore, in this embodiment, the connecting electrodes 52 and 54 found in the second embodiment (first embodiment) are not provided.

[0120] Other configurations, operations, and effects in this embodiment are the same as those in the second embodiment.

[0121] [Fourth Embodiment] Next, a fourth embodiment of the present technology will be described with reference to Figure 32. Figure 32 is a plan view showing a module according to this embodiment.

[0122] The configuration of module 1 according to this embodiment differs from the third embodiment in the following respects. In this embodiment, the protective layer 30 covers sides 10C, 10D, and 10F, but not side 10E. Also, similar to the third embodiment, the connecting electrodes 52 and 54 in the first embodiment are not provided in this embodiment.

[0123] Other configurations, operations, and effects in this embodiment are the same as those in the third embodiment.

[0124] [Fifth Embodiment] Next, a fifth embodiment of the present technology will be described with reference to Figures 33 to 35. Figures 33 and 34 are cross-sectional views showing a module according to this embodiment. Figure 35 is a plan view showing a module according to this embodiment.

[0125] The configuration of module 1 according to this embodiment differs from the fourth embodiment in the following respects. In this embodiment, the protective layer 30 covers the sides 10C to 10F. Hereinafter, the portion of the second covering portion that covers the side 10E will be referred to as the second covering portion 35. The second covering portion 35 covers the entire or almost the entire side 10E of the main body 10. The second covering portion 35 is continuous with the first covering portion 31 and the second covering portions 32 and 33. In Figure 34, the boundary between the first covering portion 31 and the second covering portions 34 and 35 is shown by a dotted line.

[0126] Furthermore, in this embodiment, the second conductor portion 44 of the shield layer 40 covers all or almost all of the second covering portion 35. The second conductor portion 44 covers the side surface 10E of the main body 10 via the second covering portion 35.

[0127] Module 1 according to this embodiment further includes a conductor layer 71 connecting the connecting electrode 51 and the second conductor portion 44, and a conductor layer 72 connecting the connecting electrode 52 and the second conductor portion 45. Conductor layer 71 is embedded in the second covering portion 35. Conductor layer 72 is embedded in the second covering portion 34. Although not shown, module 1 may further include a conductor layer connecting the connecting electrode 53 (see Figure 4) and the second conductor portion 44 and embedded in the second covering portion 35, and a conductor layer connecting the connecting electrode 54 (see Figure 5) and the second conductor portion 45 and embedded in the second covering portion 34.

[0128] Module 1 further includes a conductor layer 73 that connects the connecting electrode 55 and the second conductor portion 43. The conductor layer 73 is embedded in the second covering portion 33.

[0129] The multiple conductor layers 50 may further include at least one connecting electrode connected to the second conductor portion 42. Figure 33 shows a connecting electrode 56 connected to the second conductor portion 42. The connecting electrode 56 has an end face exposed on the side surface 10C. Module 1 further includes a conductor layer 74 connecting the connecting electrode 56 to the second conductor portion 42. The conductor layer 74 is embedded in the second covering portion 32.

[0130] The distance between the end face of the connecting electrode 56 and the second surface 10B in the direction parallel to the Z direction (hereinafter referred to as the seventh distance) may be the same as, approximately the same as, or different from, the distance between the end face of the connecting electrode 56 and the first surface 10A in the direction parallel to the Z direction (hereinafter referred to as the eighth distance). In the latter case, the seventh distance may be smaller than the eighth distance.

[0131] The connecting electrode 56 is an electrode connected to ground. The connecting electrode 56 is connected to at least one of the terminals 111 to 119 via multiple conductor layers 50. At least one of the terminals to which the connecting electrode 56 is connected is a ground terminal connected to ground.

[0132] Other configurations, operations, and effects in this embodiment are the same as those in the fourth embodiment.

[0133] It should be noted that this technology is not limited to the embodiments described above, and various modifications are possible. For example, in the manufacturing method of module 1, the second cutting step S15 may be performed before the first cutting step S14.

[0134] Furthermore, the first covering portion 31 and the second covering portion of the protective layer 30 may be formed from different materials. Alternatively, the first covering portion 31 and the second covering portion of the protective layer 30 may be formed separately using the same material or different materials.

[0135] As described above, the electronic circuit module of this technology comprises a body having a first and second surface facing opposite directions and four sides connecting the first and second surfaces, a plurality of conductor layers provided inside the body, an electronic component mounted on the first surface of the body, a protective layer made of an insulating material, and a shielding layer made of a conductive material. The protective layer includes a first covering portion that covers the electronic component and the first surface, and a second covering portion that covers at least one of the four sides. The shielding layer includes a first conductor portion that covers the electronic component and the first covering portion, and a second conductor portion that covers the body and the second covering portion. The plurality of conductor layers include at least one connecting electrode connected to the second conductor portion.

[0136] In the electronic circuit module of this technology, the four sides may include a first side and a second side. The second covering portion may cover the first side but not the second side. The second conductor portion may cover the first side via the second covering portion and also cover the second side directly. At least one connecting electrode may have an end face exposed on the second side. The second conductor portion may be connected to the end face. The four sides may further include a third side and a fourth side. The second covering portion may cover the first side and the third side but not the second side and the fourth side. The second conductor portion may cover the first side and the third side via the second covering portion and also cover the second side and the fourth side directly. The first side and the third side may face opposite each other. The second side and the fourth side may face opposite each other. At least one connecting electrode may be a first connecting electrode and a second connecting electrode. The first connecting electrode may have a first end face exposed on a second side. The second connecting electrode may have a second end face exposed on a fourth side. The second conductor portion may be connected to the first end face and the second end face.

[0137] Furthermore, in the electronic circuit module of this technology, the main body may include a plurality of stacked insulating layers. The first and second surfaces may be located at both ends of the main body in the stacking direction of the plurality of insulating layers.

[0138] Furthermore, in the electronic circuit module of this technology, the main body may be made of a brittle material.

[0139] Furthermore, in the electronic circuit module of this technology, the protective layer may also contain a resin material.

[0140] Furthermore, in the electronic circuit module of this technology, the shielding layer may include multiple stacked metal layers.

[0141] Furthermore, the electronic circuit module of this technology may also include terminals located on a second surface. At least one connecting electrode may be electrically connected to the terminal. The terminal may be a ground terminal connected to ground.

[0142] Furthermore, in the electronic circuit module of this technology, the first covering portion may have rounded corners.

[0143] Furthermore, in the electronic circuit module of this technology, the second covering portion may have a rounded end at the end furthest from the first covering portion.

[0144] Furthermore, in the electronic circuit module of this technology, the second covering portion may have the end furthest from the first covering portion. The end may be located between the first surface and the second surface in a direction perpendicular to the first surface.

[0145] The manufacturing method for the electronic circuit module of this technology includes the steps of forming a main body and multiple conductor layers, mounting electronic components on the main body, forming an initial protective layer so as to cover the main body and electronic components, removing a portion of the initial protective layer to form a protective layer so as to form a first covering portion and a second covering portion, and forming a shielding layer. [Explanation of Symbols]

[0146] 1...Electronic circuit module, 10...Main body, 10A...First side, 10B...Second side, 10C~10F...Side, 21,22...Electronic components, 30...Protective layer, 31...First covering portion, 32,33...Second covering portion, 36...Mark, 40...Shielding layer, 41...First conductor portion, 42~45...Second conductor portion, 46...Mark, 50...Multiple conductor layers, 51~54...Connecting electrodes, 60...Substrate, 111~119...Terminals, 401~403...Metal layers.

Claims

1. A body having a first surface and a second surface facing opposite directions, and four sides connecting the first surface and the second surface, Multiple conductive layers provided inside the main body, The electronic component mounted on the first surface of the main body, A protective layer made of insulating material, It comprises a shielding layer made of a conductive material, The protective layer includes a first covering portion that covers the electronic component and the first surface, and a second covering portion that covers at least one of the four sides. The shield layer includes a first conductive portion that covers the electronic component and the first covering portion, and a second conductive portion that covers the main body and the second covering portion. An electronic circuit module in which the plurality of conductor layers include at least one connecting electrode connected to the second conductor portion.

2. The four sides include the first side and the second side, The second covering portion covers the first side surface without covering the second side surface. The electronic circuit module according to claim 1, wherein the second conductive portion covers the first side surface via the second covering portion and also directly covers the second side surface.

3. The at least one connecting electrode has an end face exposed on the second side, The electronic circuit module according to claim 2, wherein the second conductor portion is connected to the end face.

4. The aforementioned four aspects further include a third aspect and a fourth aspect, The second covering portion covers the first and third sides without covering the second and fourth sides. The electronic circuit module according to claim 2, wherein the second conductor portion covers the first side and the third side via the second covering portion and directly covers the second side and the fourth side.

5. The first side and the third side face opposite each other. The electronic circuit module according to claim 4, wherein the second and fourth sides face opposite each other.

6. The at least one connecting electrode is a first connecting electrode and a second connecting electrode. The first connecting electrode has a first end face that is exposed on the second side surface, The second connecting electrode has a second end face that is exposed on the fourth side surface, The electronic circuit module according to claim 4, wherein the second conductor portion is connected to the first end face and the second end face.

7. The main body includes a plurality of stacked insulating layers, The electronic circuit module according to claim 1, wherein the first surface and the second surface are located at both ends of the main body in the lamination direction of the plurality of insulating layers.

8. The electronic circuit module according to claim 1, wherein the main body is made of a brittle material.

9. The electronic circuit module according to claim 1, wherein the protective layer comprises a resin material.

10. The electronic circuit module according to claim 1, wherein the shielding layer includes a plurality of stacked metal layers.

11. Furthermore, it is equipped with terminals arranged on the second surface, The electronic circuit module according to claim 1, wherein the at least one connecting electrode is electrically connected to the terminal.

12. The electronic circuit module according to claim 11, wherein the terminal is a ground terminal connected to ground.

13. The electronic circuit module according to claim 1, wherein the first covering portion has rounded corners.

14. The electronic circuit module according to claim 1, wherein the second covering portion has a rounded end at the end furthest from the first covering portion.

15. The second covering portion has the end furthest from the first covering portion, The electronic circuit module according to claim 1, wherein the end portion is located between the first surface and the second surface in a direction perpendicular to the first surface.

16. A method for manufacturing an electronic circuit module according to any one of claims 1 to 15, The process of forming the main body and the plurality of conductive layers, A step of mounting the electronic components onto the main body, A step of forming an initial protective layer so as to cover the main body and the electronic components, A step of forming the protective layer by removing a part of the initial protective layer so that the first covering portion and the second covering portion are formed, The process of forming the shield layer, A method for manufacturing electronic circuit modules, including

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